A power switch and a method for constructing a power switch

Abstract

Embodiments of the present disclosure relate to heat dissipation for a power switch. Systems, methods, techniques, and devices for a power switch are disclosed. An exemplary embodiment is a power switch, which includes: an outer housing; a power electronics board disposed within the housing and including a semiconductor switch, the semiconductor switch being configured to selectively conduct current between a first power terminal and a second power terminal; a first heat sink coupled to the power electronics board; a plurality of thermally conductive connectors; a second heat sink coupled to the plurality of thermally conductive connectors; a control electronics board configured to control the semiconductor switch, the control electronics board being located within the enclosure, the enclosure being formed by the second heat sink, the plurality of thermally conductive connectors, and the power electronics board.

Description

Technical Field

[0001] The present disclosure generally relates to heat dissipation in power switches. Many power systems include a power switch that is configured to protect power system components from fault currents. In addition to the need to dissipate the heat generated by opening the power switch, solid-state based power switches have an on-resistance that results in heat dissipation that is proportional to the current conducted by the power switch. The heat generated by the power switch must be dissipated before the internal temperature of the power switch exceeds the thermal rating of the power switch components. Existing power switches have several defects and disadvantages. There are still unmet needs, including reducing the thermal stress of the power switch and increasing the rated current of the power switch. For example, conventional power switch rated current and fault mitigation operations are limited by the rate at which the power switch can dissipate the generated heat. In view of these and other deficiencies in the art, there is a great need for the devices, methods, systems and techniques disclosed herein. Background Art

[0002] In order to clearly, concisely and accurately describe the non-limiting exemplary embodiments of the present disclosure, the manner and process of making and using the same, and to enable the practice, making and using of the same, reference is now made to certain exemplary embodiments, including the embodiments illustrated in the figures, and specific language is used to describe the embodiments. However, it should be understood that no limitation on the scope of the present disclosure is thereby created, and the present disclosure includes and protects such changes, modifications and other applications of the exemplary embodiments that may occur to those skilled in the art having the benefit of the present disclosure. Summary of the invention

[0003] Exemplary embodiments of the present disclosure include systems, methods, techniques and devices for heat dissipation in power switches. Other embodiments, forms, objects, features, advantages, aspects and benefits of the present disclosure will become apparent from the following description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a cross-sectional view illustrating an exemplary power switch.

[0005] Figure 2 An exemplary heat sink is illustrated.

[0006] FIG. 3A to FIG. 3B An exemplary outer housing of an exemplary power switch is illustrated.

[0007] Figure 4 is a cross-sectional view illustrating another exemplary power switch. DETAILED DESCRIPTION

[0008] refer to Figure 1 ,Should Figure 11 is a block diagram illustrating an exemplary power switch 100, which is configured to selectively conduct current between a power source and a load. In some embodiments, the power switch 100 is configured to interrupt current during a short circuit fault or other type of fault. It should be appreciated that the power switch 100 can take the form of a solid-state circuit breaker, a solid-state transfer switch, a solid-state disconnect switch, a solid-state tie switch, or another type of solid-state switch configured to conduct current between a power source and a load. It should also be appreciated that the power switch 100 can be implemented in a variety of applications, including low-voltage direct current (DC) systems, medium-voltage DC systems, low-voltage alternating current (AC) systems, medium-voltage AC current systems, data centers, vehicle power systems, or marine power systems, just to name a few examples. In some embodiments, low-voltage DC can include any voltage less than 1500V; medium-voltage DC can include any voltage between 1500V and 50kV; low-voltage AC can include any voltage less than 1000V; medium-voltage AC can include any voltage between 1000V and 72kV.

[0009] The power switch 100 includes a housing 110, and a power electronics board 120, a control electronics board 160, heat sinks 130 and 150, a plurality of pin connectors 170, and a plurality of heat-conducting connectors 140, all of which are arranged within the housing 110. The power terminals 111 and 113 of the housing 110 are configured to receive and output current conducted by the power switch 100. In some embodiments, the power switch 100 is configured to conduct bidirectional current, so that the power terminals 111 and 113 both receive and output current. The housing 110 also includes a communication terminal 115, which is configured to communicatively couple the control electronics board 160 with an external device such as a controller or a measuring device. In some embodiments, the housing 110 does not include the communication terminal 115.

[0010] The power electronic board 120 is configured to selectively conduct current between the power terminal 111 and the power terminal 113. The board 120 includes a substrate, semiconductor switches 127 and 129, and a plurality of connectors 128. In the illustrated embodiment, the substrate of the board 120 includes a direct bonded copper (DBC) substrate, which includes a copper layer 121, a ceramic layer 123, and an aluminum layer 125. In some embodiments, the ceramic layer 123 can be replaced by a dielectric layer, and the aluminum layer 125 can be replaced by another copper layer. In some embodiments, the substrate of the board 120 may alternatively include an active metal brazing substrate, an embedded substrate, an insulated metal substrate, or a printed circuit board, just to name a few examples.

[0011] The semiconductor switches 127 and 129 may include insulated gate bipolar transistors (IGBTs), bipolar junction transistors (BJTs), junction field effect transistors (JFETs), silicon controlled rectifiers (SCRs), metal oxide semiconductor field effect transistors (MOSFETs), gate turn-off thyristors (GTOs), MOS controlled thyristors (MCTs), integrated gate commutated thyristors (IGCTs), silicon carbide (SiC) switches, or gallium nitride (GaN) switches, to name a few examples. In some embodiments, the board 120 includes more or fewer semiconductor switches. In some embodiments, the board 120 includes semiconductor switches that are coupled in series, in parallel, in anti-parallel, or a combination thereof. For example, the board 120 may include an anti-parallel coupled thyristor coupled in parallel with a SiC JFET.

[0012] In the illustrated embodiment, a plurality of connectors 170 couple semiconductor switches 127 and 129 to each other and to the substrate. In other embodiments, board 120 may include more or fewer connectors or connectors arranged to connect different components of board 120.

[0013] The plurality of thermally conductive connectors 140 are configured to conduct heat between the substrate of the board 120 and the heat sink 150. The plurality of thermally conductive connectors 140 are constructed of a thermally conductive material such as a metal or a polymer, to name a few examples. Each thermally conductive connector includes a first end 141 coupled to the copper layer 121 of the substrate of the power electronic board 120 and a second end 143 coupled to the heat sink 150.

[0014] In some embodiments, each of the plurality of thermally conductive connectors 140 can be a single solid piece or a plurality of pillars arranged in a row, to name a few examples. The plurality of thermally conductive connectors 140 can each have a width in the range of 0.5 mm to 7 mm, a height in the range of 1 mm to 3 cm, and a length equal to or greater than the length of the copper layer 121, to name a few examples.

[0015] In some embodiments, the plurality of thermally conductive connectors 140 and the substrate of the power electronic board 120 are formed as a unit, so that no fasteners are required to couple the plurality of thermally conductive connectors 140 and the substrate of the power electronic board 120. In some embodiments, the plurality of thermally conductive connectors 140 are coupled to the substrate of the power electronic board 120 by solder film, glue, or screws, to name a few examples. In the illustrated embodiment, the second ends 143 of the plurality of thermally conductive connectors 140 are coupled to the heat sink 150 by fasteners 151, which may include one or more of the following: thermal grease, solder film, glue, or screws, to name a few examples.

[0016] The dimensions of the plurality of thermally conductive connectors 140 are designed so that the heat sink 150, the power electronics board 120, and the plurality of thermally conductive connectors 140 form an enclosure that is large enough so that the control electronics board 160 is placed within the enclosure without the components 161, thereby making direct contact with the heat sink 150. In some embodiments, the enclosure is large enough so that the control electronics board 160 does not make contact with the heat sink 150 or the plurality of thermally conductive connectors 140. In the illustrated embodiment, the control electronics board 160 is oriented parallel to the substrate of the power electronics board 120, the base 133 of the heat sink 130, and the base 153 of the heat sink 150. In other embodiments, the control electronics board 160 may be oriented differently relative to the power electronics board 120 within the enclosure. In the illustrated embodiment, the plurality of thermally conductive connectors 140 are each oriented perpendicular to the substrate of the power electronics board 120, the base 133 of the heat sink 130, the base 153 of the heat sink 150, and the control electronics board 160. In other embodiments, one or more of the plurality of thermally conductive connectors 140 are oriented differently relative to the power electronics board 120 .

[0017] The heat sink 130 is coupled to a first side of the power electronic board 120 opposite the semiconductor switches 127 and 129 by a thermal grease and preformed layer 137. The layer 137 is composed of a thermally conductive but electrically insulating material. The layer 137 is configured to eliminate air gaps or spaces from the interface area between the layer 125 of the power electronic board 120 and the heat sink 130. In some embodiments, the thermal grease and preformed layer can be used between the heat sink 150 and the second end 143 of the plurality of thermally conductive connectors 140. In some embodiments, the power switch 100 does not include the layer 137, but uses another type of fastener such as solder film, glue, or screws to couple the heat sink 130 and the power electronic board 120. In the illustrated embodiment, the heat sink 130 extends over the entire width of the layer 125. In other embodiments, the heat sink 130 extends over the entire width of the substrate of the power electronic board 120.

[0018] The heat sink 130 is configured to dissipate a portion of the heat generated by the power switch 100 from current conduction and semiconductor switching operation. However, due to the space and heat dissipation requirements of the power switch 100, the heat sink 130 cannot dissipate enough heat generated by the power electronics board 120 to maintain the internal temperature of the power switch 100 below a threshold temperature, above which the internal temperature of the power switch 100 exceeds the thermal rating of at least one component of the power switch 100. The heat sink 150 is configured to dissipate another portion of the heat generated by the power switch 100 from current conduction and semiconductor switching operation. In some forms, one or more of the heat sinks 130 and 150 may include multiple heat sinks coupled together to form one heat sink.

[0019] The heat sinks 130 and 150 are collectively configured to dissipate heat so that even during a fault current or repeated switching, the internal temperature of the power switch 100 does not exceed the thermal rating of any of the components of the power switch 100, such as the thermal rating of the semiconductor switches 127 and 129. As another example, the power electronics board 120 may repeatedly switch at a frequency greater than 0.5 Hz to control the electrical characteristics of the conducted current, such as the current amplitude. In response to determining that the power switch 100 is conducting a fault current, the control electronics board 160 may repeatedly switch the semiconductor switches 127 and 129 to generate an amount of heat that the first heat sink is not large enough to dissipate alone while maintaining an internal temperature of the power switch 100 below the thermal rating of the semiconductor switches 127 and 129.

[0020] It is important to note that if the power switch 100 includes only one of the heat sink 130 and the heat sink 150, the power switch 100 is not configured to conduct current up to the maximum rated current of the power switch 100. For example, the heat sink 130 may not be sufficiently sized to dissipate heat to maintain the internal temperature of the power switch 100 below the semiconductor switch thermal rating of the switch 127 or 129 while conducting a current equal to the maximum rated current without the heat sink 150.

[0021] The heat sinks 130 and 150 may be coupled within the power switch 100 by welding, sintering, gluing, or screwing into place, to name a few examples. The heat sinks 130 and 150 may be sized to cover the entire area of ​​the power electronics board 120 or only a portion thereof. For example, the heat sinks 130 and 150 may extend the entire distance across one dimension of the power electronics board 120 (e.g., its width), but fail to extend the entire distance across another dimension of the power electronics board 120 (e.g., its length).

[0022] The control electronics board 160 is configured to monitor the current conducted by the power switch 100, operate the semiconductor switches 127 and 129 to interrupt or regulate the current conducted by the power switch 100, and communicate with a measuring device of the power switch 100 or with another type of external device. Such monitoring and / or control may occur through the communication terminals 115 or a plurality of pin connectors 170, which may take any of a variety of forms, including but not limited to pins, leads, or other types of conducting devices, whether rigid or flexible (such as flexible connectors), that electrically connect the control electronics board 160 to the power electronics board 120, other locations of the power switch 100, or an external device.

[0023] The control electronics board 160 includes a plurality of components 161 coupled to a substrate 163. The plurality of components 161 may include digital circuitry, analog circuitry, or a combination thereof. For example, the plurality of components 161 may include one or more gate drivers configured to open and close semiconductor switches 127 and 129.

[0024] The substrate 163 is configured to mechanically support and interconnect the plurality of components 161. The substrate 163 may take the form of a printed circuit board, to name just one example. The substrate 163 may include a variety of arrangements, including a single-sided (one copper layer) arrangement, a double-sided (two copper layers on both sides of the substrate layer) arrangement, or a multi-layer arrangement, to name just a few non-limiting examples. The substrate 163 may be made of a variety of materials such as phenolic paper, woven fiberglass, polyimide foil, and polyimide-fluoropolymer composite foil.

[0025] In the illustrated embodiment, the control electronics board 160 is relatively flat, has a relatively thin thickness and extends in a planar manner. In some forms, the control electronics board 160 may include a variety of cross-sectional shapes as viewed in the thickness direction thereof, including square, rectangular or other polygonal shapes. For example, in Figure 1 In the schematic diagram shown, the shape of the control electronics board 160 is a rectangle having a width along its larger dimension and a thickness along its shorter dimension. It should be appreciated that the length extends to Figure 1 In some embodiments, the printed circuit board can be considered to extend along an elongated axis (e.g., along its length and / or width), where such an elongated axis lies within the plane of the planar substrate 163. Although the substrate 163 can extend along each of three separate axes, as shown in the side views of the figures, the elongated axis can be considered to be an elongated axis that includes a dimension that is greater than the dimension of another elongated axis.

[0026] In the context of the above description, it should be appreciated that each of the power electronics board 120 and the control electronics board 160 includes various extension axes, but it should be understood that some dimensions of the components include longer extension axes as indicated in the figures. The elongated extension axes as supported by the figures are considered to be oriented at various angles relative to each other. It can be seen that the elongated extension axis of the control electronics board 160 is mounted parallel to the elongated extension axis of the power electronics board 120. Although the control electronics board 160 is shown as being arranged above the power electronics board 120, in some forms, the control electronics board 160 can be located on the lateral side of the power electronics board 160. However, in all embodiments, the control electronics board 160 is not in direct contact with the heat sink 150 or the plurality of thermally conductive connectors 140.

[0027] One way to construct the power switch 100 of any of the embodiments disclosed herein includes: attaching a heat sink 130 to a first side power electronics board 120; communicatively coupling the power electronics board 120 to a control electronics board 160; attaching first ends of a plurality of thermally conductive connectors 140 to a second side of the power electronics board 120; and attaching second ends of the thermally conductive connectors 140 to a heat sink 150. It should be appreciated that any or all of the aforementioned features of the power switch 100 may also be present in other power switches disclosed herein.

[0028] refer to Figure 2 , illustrates an exemplary heat sink 200 of an exemplary power switch. Features of the heat sink 200 described herein include other heat sinks described herein (such as Figure 1 The heat sinks 130 and 150 of the power switch 100 and Figure 4 In the heat sinks 430 and 450 of the power switch 400).

[0029] The heat sink 200 is configured to conduct heat generated by the components of the power switch 100. The heat sink 200 can include a variety of materials using a variety of different manufacturing processes. For example, the heat sink 200 can be composed of metal or polymer, just to name a few examples. The heat sink 200 includes a base 201 from which a plurality of heat sink fins 202 extend. The heat sink 200 can be made by bonding the heat sink fins 202 to the base, folding the fins 202 into shape and bonding, brazing or welding to the base 201, stamping the fins 202 and encapsulating them using a die cast base 201, or shaving a plurality of fins 202 onto the base 201, just to name a few examples.

[0030] In the illustrated embodiment, the base 201 has a consistent thickness along the length and / or width of the heat sink 200, but not all embodiments of the heat sink 200 need include a base of constant thickness. Thus, the base 201 of the heat sink 200 can include an elongated extension axis, which can be its length or width. Although the heat sink 200 can extend along each of the three separate axes, the elongated axis can be considered to be an extension axis that includes a dimension greater than the dimension of another extension axis.

[0031] The plurality of fins 202 may take a variety of forms, such as pins, foils, and posts, to name a few examples. In this regard, the plurality of fins 202 may have a common cross-sectional shape along their respective lengths, but not all embodiments of the heat sink 200 require a common shape in all fins 202. Two or more different shapes of the fins 202 are also contemplated.

[0032] The plurality of fins 202 may extend to a vertical height above the base 201 of the heat sink 200. In some embodiments, all of the plurality of fins 202 may extend to a common height above the base 201, but in other forms, the plurality of fins 202 may extend to two or more different heights above the base 201.

[0033] In some forms, the plurality of fins 202 may be equally spaced along a dimension of the base 201 (e.g., along its length and / or width), but not all forms need include equally spaced fins. In some forms, the plurality of fins 202 may be equally spaced in a portion of the heat sink 200 while providing open space in another portion of the heat sink 200 not occupied by the fins. Further, embodiments of the heat sink 200 in an exemplary power switch need not be made of the same material and need not be made using the same manufacturing process. In short, embodiments of the heat sink 200 in an exemplary power switch may differ from one another.

[0034] refer to Figure 3A and Figure 3B , two exemplary outer shells 300, 310 for an exemplary power switch are illustrated. The outer shell 300 includes a plurality of power terminals 301. The shell 310 includes a plurality of power terminals 313 and a communication terminal 311.

[0035] The development of solid-state circuit breakers involves the challenge of designing a device with a miniaturized physical format and capable of operating at high currents in applications with specific requirements in terms of space and dimensions. The dimensions of the heat sink and thermally conductive connectors are such that the dimensions of the outer housing are minimized to reduce one or more dimensions of the outer housing or to reduce the volume of the outer housing. The package dimensions include the height, width, and depth defined by the outer housing.

[0036] like Figure 3A As shown, the outer shell 300 includes a length of 75 mm, a width of 45 mm, and a depth of 45 mm to 90 mm, with a total volume ranging from 151.875 cubic centimeters to 303.75 cubic centimeters. In some embodiments, the volume of the outer shells 300 and 310 is less than 300 cubic centimeters.

[0037] refer to Figure 4 ,Should Figure 4 is a cross-sectional view of an exemplary power switch 400 . It should be appreciated that any or all of the aforementioned features of the power switch 100 may also be present in the power switch 400 .

[0038] The power switch 400 includes an outer shell 410 including power terminals 411 and 413 and a communication terminal 415. The power switch 400 disposed in the outer shell 410 includes a power electronic board 420, a heat sink 430, a plurality of heat conductive connectors 440, a heat sink 450, and a control electronic board 460. The power electronic board 420 and the heat sink 430 are coupled together by thermal grease 431.

[0039] In addition to the above components, they are also Figure 1 The power switch 400 includes a second plurality of thermally conductive connectors 480, each of which includes a first end 481 coupled to the heat sink 430 and a second end 483 coupled to the heat sink 450. The second plurality of thermally conductive connectors 480 are configured to directly couple the heat sink 430 with the heat sink 450. It should be appreciated that Figure 1 The features described for the thermally conductive connector 140 in FIG. 4 also apply to the second plurality of thermally conductive connectors 480. It should be appreciated that any or all of the aforementioned features of the power switch 400 may also be present in other power switches disclosed herein.

[0040] Now, additional written descriptions of multiple exemplary embodiments are provided. One embodiment is a power switch, including an outer housing, the outer housing including a first power terminal and a second power terminal; a power electronic board, the power electronic board being arranged in the outer housing and including a semiconductor switch, the semiconductor switch being configured to selectively conduct current between the first power terminal and the second power terminal; a first heat sink, the first heat sink being coupled to a first side of the power electronic board; a plurality of thermally conductive connectors, each thermally conductive connector including a first end coupled to a second side of the power electronic board, the second side of the power electronic board being opposite to the first side of the power electronic board; a second heat sink, the second heat sink being coupled to a second end of each of the plurality of thermally conductive connectors; a control electronic board, the control electronic board being configured to control the semiconductor switch, the control electronic board being located in a housing, the housing being formed by the second heat sink, the plurality of thermally conductive connectors, and the power electronic board.

[0041] In some forms of the above-mentioned power switch, the power electronic board includes a directly bonded copper substrate, and the control electronic board includes a plurality of components coupled to the printed circuit board. In some forms, the control electronic board is not in direct contact with the second heat sink or a plurality of thermally conductive connectors. In some forms, the power electronic board includes a substrate, and the first end of each of the plurality of thermally conductive connectors is coupled to the substrate. In some forms, the control electronic board and the power electronic board are coupled by a plurality of pin connectors. In some forms, the volume of the outer shell is less than 300 cubic centimeters. In some forms, the power switch is constructed to repeatedly switch the semiconductor switch in response to determining that the power switch is conducting a fault current, and wherein the size of the first heat sink is not sufficient to maintain the internal temperature of the power switch below the semiconductor switch thermal rating while repeatedly switching the semiconductor switch. In some forms, the power switch includes a maximum rated current, and wherein the size of the first heat sink is not sufficient to maintain the internal temperature of the power switch below the semiconductor switch thermal rating while conducting a current equal to the maximum rated current without a second heat sink. In some forms, the power switch includes a second plurality of thermally conductive connectors, which are coupled between the first heat sink and the second heat sink. In some forms, the second end of each of the plurality of thermally conductive connectors is coupled to the second heat sink using solder film, glue, or screws.

[0042] Another exemplary embodiment is a method for constructing a power switch, comprising: attaching a first heat sink to a first side of a power electronic board, the power electronic board including a semiconductor switch, the semiconductor switch being constructed to selectively conduct current between a first power terminal and a second power terminal; communicatively coupling the power electronic board to a control electronic board; attaching a plurality of thermally conductive connectors to a second side of the power electronic board; attaching the thermally conductive connectors to a second heat sink so that the second heat sink, the power electronic board, and the plurality of thermally conductive connectors form a housing; and arranging the first heat sink, the power electronic board, the plurality of thermally conductive connectors, and the second heat sink in an outer housing, wherein the control electronic board is located within the housing.

[0043] In some forms of the foregoing method, the power electronic board includes a directly bonded copper substrate, and the control electronic board includes a plurality of components coupled to a printed circuit board. In some forms, the control electronic board is not in direct contact with the second heat sink or a plurality of thermally conductive connectors. In some forms, the power electronic board includes a substrate, and each of the plurality of thermally conductive connectors is attached to the substrate. In some forms, the control electronic board and the power electronic board are coupled by a plurality of pin connectors. In some forms, the volume of the outer shell is less than 300 cubic centimeters. In some forms, the method includes: determining that the power switch is conducting a fault current, repeatedly switching the semiconductor switch, wherein the size of the first heat sink is not sufficient to maintain the internal temperature of the power switch below the semiconductor switch thermal rating while repeatedly switching the semiconductor switch. In some forms, the power switch includes a maximum rated current, and wherein the size of the first heat sink is not sufficient to maintain the internal temperature of the power switch below the semiconductor switch thermal rating while conducting a current with a magnitude of the maximum rated current without a second heat sink. In some forms, the method includes a second plurality of thermally conductive connectors directly coupled between the first heat sink and the second heat sink. In some forms, attaching the plurality of thermally conductive members to the second heat sink includes using solder paste, glue, or screws.

[0044] Although the present disclosure has been described and described in detail in the drawings and the foregoing description, it is considered to be illustrative rather than restrictive in nature, and it should be understood that only certain exemplary embodiments have been shown and described, and it is desired to protect all changes and modifications that fall within the spirit of the present disclosure. It should be understood that although the use of words such as "preferable", "preferably", "preferred" or "more preferred" used in the above description indicates that the features described in this way may be more desirable, it may not be necessary, and embodiments lacking the same content can be conceived as being within the scope of the present disclosure, which is limited by the appended claims. When reading the claims, it is intended that when words such as "one", "one", "at least one" or "at least one part" are used, unless explicitly stated to the contrary in the claims, it is not intended to limit the claims to only one item. The term "of" may imply an association or connection with another item and an association belonging to another item or with another item, as the context in which it is used tells. Unless explicitly indicated to the contrary, the terms "coupled to", "coupled with...", etc. include indirect connections and couplings, and also include but do not require direct coupling or connection. When the language "at least a portion" and / or "a portion" is used, the item may include a portion and / or the entire item unless explicitly stated to the contrary.

Claims

1. A power switch, comprising: an outer housing including a first power terminal and a second power terminal; a power electronics board disposed within the housing and comprising a semiconductor switch configured to selectively conduct current between the first power terminal and the second power terminal; a first heat sink coupled to a first side of the power electronic board; a plurality of thermally conductive connectors, each including a first end coupled to a second side of the power electronic board, the second side of the power electronic board being opposite to the first side of the power electronic board; a second heat sink coupled to the second end of each of the plurality of thermally conductive connectors; as well as A control electronic board is configured to control the semiconductor switch, the control electronic board being located within a housing formed by the second heat sink, the plurality of thermally conductive connectors, and the power electronic board. 2 . The power switch of claim 1 , wherein the power electronics board comprises a direct bonded copper substrate and the control electronics board comprises a plurality of components coupled to a printed circuit board. 3 . The power switch of claim 1 , wherein the control electronics board is not in direct contact with the second heat sink or the plurality of thermally conductive connectors. 4 . The power switch of claim 1 , wherein the power electronics board comprises a substrate, and the first end of each of the plurality of thermally conductive connectors is coupled to the substrate. 5 . The power switch of claim 1 , wherein the control electronics board and the power electronics board are coupled through a plurality of pin connectors.

6. The power switch of claim 1, wherein the volume of the outer housing is less than 300 cubic centimeters.

7. The power switch of claim 6, wherein the power switch is configured to repeatedly switch the semiconductor switch in response to determining that the power switch is conducting a fault current, and wherein the first heat sink is not sufficiently sized to maintain an internal temperature of the semiconductor switch below a semiconductor switch thermal rating when the semiconductor switch is repeatedly switched.

8. The power switch of claim 6, wherein the power switch includes a maximum current rating, and wherein the first heat sink is insufficiently sized to maintain an internal temperature of the power switch below a semiconductor switch thermal rating when conducting a current equal to the maximum current rating in the absence of the second heat sink. 9 . The power switch of claim 1 , comprising a second plurality of thermally conductive connectors coupled between the first heat sink and the second heat sink. 10 . The power switch of claim 1 , wherein the second end of each of the plurality of thermally conductive connectors is coupled to the second heat sink using solder film, glue, or screws.

11. A method for constructing a power switch, comprising: attaching a first heat sink to a first side of a power electronic board, the power electronic board including a semiconductor switch configured to selectively conduct current between a first power terminal and a second power terminal included in a housing of the power switch; communicatively coupling the power electronics board to a control electronics board; attaching a plurality of thermally conductive connectors to a second side of the power electronic board; attaching the thermally conductive connector to a second heat sink such that the second heat sink, the power electronics board, and the plurality of thermally conductive connectors form an enclosure; as well as The first heat sink, the power electronic board, the plurality of heat conductive connectors, and the second heat sink are arranged in an outer shell, The control electronic board is located in the enclosure.

12. The method according to claim 11, comprising: determining that the power switch is conducting a fault current; as well as Repeatedly switching the semiconductor switch, The first heat sink is insufficiently sized to maintain an internal temperature of the power switch below a thermal rating of the semiconductor switch when the semiconductor switch is repeatedly switched.

13. The method of claim 11 , wherein attaching the plurality of thermally conductive connectors to the second heat sink comprises: Use solder mask, glue, or screws. 14 . The method according to claim 11 , wherein the constructed power switch is a power switch according to any one of claims 2 to 10.

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