Liquid cooling plate and electronic device

Abstract

The application relates to the technical field of heat dissipation devices, in particular to a liquid cooling plate and an electronic device. The liquid cooling plate comprises a cold plate main body, the inside of the cold plate main body is provided with a flow channel, the flow channel comprises at least two reflux channels which are communicated with each other, the cold plate main body is provided with a plurality of interfaces which are communicated with the flow channel, a part of the plurality of interfaces are liquid inlets, and another part of the plurality of interfaces are liquid outlets, each reflux channel comprises an inlet and an outlet, the inlet of each reflux channel is communicated with one of the liquid inlets, and the outlet of each reflux channel is communicated with one of the liquid outlets. The liquid cooling plate provided by the application can meet various liquid inlet and outlet modes by the same flow channel design, the flow resistance difference between various liquid inlet and outlet modes is small, one pump driving system can be shared, when a problem occurs in an individual interface and the individual interface cannot be used, the normal function of the liquid cooling plate is not affected, and the production cost and the maintenance cost of the liquid cooling plate are effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation equipment, in particular to a liquid cooling plate and electronic equipment. BACKGROUND

[0002] At present, with the increase of power of electronic devices, the heat flux density is increasing, and various types of electrical, electronic and power equipment with high power density are increasingly switching from forced air cooling to liquid cooling. However, the existing cold plate flow channel design has fixed inlet and outlet liquid modes. If the liquid inlet of the same product needs to be replaced, a separate flow channel with a different liquid inlet needs to be designed, and multiple sets of liquid cooling plates need to be processed respectively, which increases the production cost of the product. SUMMARY

[0003] The purpose of the present application is to provide a liquid cooling plate and electronic equipment to solve the technical problem of the existing cold plate inlet and outlet liquid mode being fixed and the entire cold plate needing to be replaced when the liquid inlet or outlet is damaged.

[0004] The present application provides a liquid cooling plate, comprising: a cold plate body, the inside of the cold plate body is provided with a flow channel; the flow channel comprises at least two reflux channels in communication with each other;

[0005] The cold plate body is provided with a plurality of interfaces in communication with the flow channel, a part of the plurality of interfaces is a liquid inlet, and another part of the plurality of interfaces is a liquid outlet;

[0006] Each reflux channel comprises an inlet and an outlet;

[0007] The inlet of each reflux channel is in communication with one of the liquid inlets, and the outlet of each reflux channel is in communication with one of the liquid outlets.

[0008] In the above technical solution, further, the cold plate body has a cuboid structure, the number of the interfaces is four, and the four interfaces are respectively arranged on two side edges of the cold plate body which are arranged in parallel to each other;

[0009] One or two of the interfaces are liquid inlets, and the other three or two of the interfaces are liquid outlets.

[0010] In any of the above technical solutions, further, the flow channel comprises a concentrated heat dissipation area, and each reflux channel is in communication with the concentrated heat dissipation area.

[0011] In any of the above technical solutions, further, the concentrated heat dissipation area comprises:

[0012] A heat collecting area, the heat collecting area comprises a plurality of fins, and the plurality of fins are arranged at intervals;

[0013] The first flow guide region is in communication with the heat collecting region, and the at least one return flow channel is in communication with the heat collecting region through the first flow guide region;

[0014] The second flow guide region is in communication with the heat collecting region, and the at least one return flow channel is in communication with the heat collecting region through the second flow guide region.

[0015] In any of the above technical solutions, further, the first flow guide region is provided with a plurality of first flow guide fins arranged at intervals along a first direction;

[0016] The second flow guide region is provided with a plurality of second flow guide fins arranged at intervals along a second direction different from the first direction.

[0017] In any of the above technical solutions, further, each return flow channel further comprises a branch interface in communication with the first flow guide region or the second flow guide region.

[0018] In any of the above technical solutions, further, the liquid cooling plate further comprises a heat conduction assembly, which comprises:

[0019] A first heat conduction plate in contact with a heat source;

[0020] A heat conduction pipe group, a part of which is arranged on the first heat conduction plate;

[0021] A second heat conduction plate arranged on an outer surface of the cold plate main body, and another part of the heat conduction pipe group is arranged on the second heat conduction plate.

[0022] In any of the above technical solutions, further, the first heat conduction plate is arranged at intervals with the cold plate main body;

[0023] The heat conduction pipe group comprises a first heat pipe group and a second heat pipe group arranged symmetrically;

[0024] The first heat pipe group and the second heat pipe group respectively span a gap between the first heat conduction plate and the cold plate main body.

[0025] In any of the above technical solutions, further, the liquid cooling plate further comprises a heat spreading member arranged on a part of the outer surface of the cold plate main body opposite to the heat collecting region, and the heat spreading member is in contact with another heat source.

[0026] The application also provides an electronic device comprising the liquid cooling plate of any of the above technical solutions, thus having all the beneficial technical effects of the liquid cooling plate, which will not be repeated here.

[0027] Compared with the prior art, the application has the following beneficial effects:

[0028] The liquid cooling plate provided in the application comprises a cooling plate body, and a flow channel is arranged in the cooling plate body; the flow channel comprises at least two reflux channels which are communicated with each other; the cooling plate body is provided with a plurality of interfaces which are communicated with the flow channel, a part of the plurality of interfaces are liquid inlets, and another part of the plurality of interfaces are liquid outlets; each reflux channel comprises an inlet and an outlet; the inlet of each reflux channel is communicated with one of the liquid inlets, and the outlet of each reflux channel is communicated with one of the liquid outlets.

[0029] The liquid cooling plate provided in the application can meet various liquid inlet and outlet modes by using one flow channel design, the flow resistance difference between the various liquid inlet and outlet modes is small, one pump driving system can be shared, when a problem occurs in an individual interface and the interface cannot be used, the normal function of the liquid cooling plate is not affected, and the production cost and maintenance cost of the liquid cooling plate are effectively reduced.

[0030] The electronic device provided in the application can be a server or a case, etc., and comprises the liquid cooling plate described above, so that the heat dissipation efficiency and heat dissipation effect of a chip or other components and devices which can release heat in the electronic device can be significantly improved by using the liquid cooling plate, and the electronic device can be ensured to operate normally, and local overheating of the electronic device is avoided to cause the electronic device to stop or even be damaged. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the specific embodiments of the application or the prior art, the drawings needed to be used in the specific embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0032] Figure 1 A structural schematic diagram of the liquid cooling plate provided in the embodiment of the application;

[0033] Figure 2 Another structural schematic diagram of the liquid cooling plate provided in the embodiment of the application;

[0034] Figure 3 Another perspective view of the liquid cooling plate provided in the embodiment of the application;

[0035] Figure 4 A structural schematic diagram of the liquid cooling plate provided in the embodiment of the application; Figure 3 A sectional view along A-A.

[0036] Reference signs:

[0037] 1 - cold plate body, 101 - first interface, 102 - second interface, 103 - third interface, 104 - fourth interface, 105 - convex part, 2 - first return flow channel, 201 - first branch interface, 3 - second return flow channel, 4 - heat collection area, 401 - fin, 5 - first flow guide area, 501 - first flow guide fin, 6 - second flow guide area, 601 - second flow guide fin, 7 - first heat conduction plate, 701 - groove, 8 - second heat conduction plate, 801 - groove part, 9 - first heat pipe, 901 - first straight pipe section, 902 - U-shaped pipe section, 10 - second heat pipe, 1001 - second straight pipe section, 1002 - third straight pipe section, 11 - heat spreading member. DETAILED DESCRIPTION

[0038] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all embodiments.

[0039] The components of the embodiments of the present application generally described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application.

[0040] Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.

[0041] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] The following will be described with reference to Figures 1 to 4The liquid cooling plate and the electronic device are described according to the embodiments of the present application.

[0044] Referring to Figures 1 to 4 As shown in the drawings, the embodiments of the present application provide a liquid cooling plate, which comprises a cooling plate body 1 and a heat conduction assembly, wherein the heat conduction assembly is connected with the heat source and the cooling plate body 1 at the same time, so as to transmit the heat generated by the heat source to the cooling plate body 1 through the heat conduction assembly.

[0045] Specifically, the cooling plate body 1 has a cuboid plate structure, including two upper and lower surfaces with large areas and four side surfaces connected in sequence, which are a first side surface, a second side surface, a third side surface and a fourth side surface, wherein the first side surface and the third side surface are parallel to each other and face each other, and the second side surface and the fourth side surface are parallel to each other and face each other. The cooling plate is provided with a convex part 105 at the four corners, the upper and lower surfaces of the convex part 105 are flush with the upper and lower surfaces of the cooling plate body 1, and the convex part 105 is provided with a connecting hole for passing a fastener such as a screw to fix the cooling plate body 1 to a specified position.

[0046] Further, the inside of the cooling plate body 1 is hollow, and a flow channel is formed in the inside of the cooling plate body 1, and a plurality of interfaces are further provided on the cooling plate body 1, which are used to inject liquid working medium into the cooling plate body 1 or make the liquid working medium in the cooling plate body 1 flow out. The plurality of interfaces are distributed on the four side surfaces of the main body member at intervals and are respectively communicated with the flow channel in the cooling plate body 1, a part of the plurality of interfaces are liquid inlet ports for injecting liquid working medium into the flow channel, and the liquid working medium can circulate in the flow channel; another part of the plurality of interfaces are liquid outlet ports for discharging the liquid working medium in the flow channel, preferably, the number of the liquid inlet ports and the liquid outlet ports is the same.

[0047] Further, the number of interfaces is preferably four, two of which are liquid inlet ports and the other two are liquid outlet ports. Further, the four interfaces are a first interface 101, a second interface 102, a third interface 103 and a fourth interface 104, two of which are arranged at intervals on the first side surface and the other two are arranged at intervals on the second side surface.

[0048] Preferably, the height or thickness of the first side surface and the second side surface is higher than the overall thickness of the cooling plate body 1, so that a certain buffer space is formed in the inside of the first side surface and the second side surface, which can buffer the liquid working medium when it flows into or out of the cooling plate body 1 through the interfaces on the first side surface and the second side surface, avoiding the leakage and overflow of the liquid working medium at the interfaces.

[0049] Further, the flow channel comprises at least two return flow channels which are connected to each other, each return flow channel comprises an inlet and an outlet, each inlet and each outlet is connected to one of the interfaces, so that the return flow channel into which the liquid flows through one of the interfaces can flow out through another interface, and the plurality of return flow channels are connected to each other, so that as long as one of the return flow channels can be normally put into use, the cooling and heat dissipation functions of the liquid cooling plate can be ensured.

[0050] Preferably, the number of return flow channels is two, which are a first return flow channel 2 and a second return flow channel 3, both of which extend in a meandering manner along the length direction of the cooling plate body 1, one end of the first return flow channel 2 is connected to the first interface 101, the other end of the first return flow channel 2 is connected to the third interface 103, one end of the second return flow channel 3 is connected to the second interface 102, the other end of the second return flow channel 3 is connected to the fourth interface 104, and the first return flow channel 2 and the second return flow channel 3 are connected through the concentrated heat dissipation area, so that the liquid working medium has multiple flow paths in the cooling plate body 1, at least including the following routes: (1) the liquid working medium flows into the concentrated heat dissipation area through the first interface 101 and then flows out through the third interface 103 or the fourth interface 104; (2) the liquid working medium flows into the concentrated heat dissipation area through the second interface 102 and then flows out through the third interface 103 or the first interface 101; (3) the liquid working medium flows into the concentrated heat dissipation area through the third interface 103 and then flows out through the second interface 102 or the fourth interface 104; (4) the liquid working medium flows into the concentrated heat dissipation area through the fourth interface 104 and then flows out through the first interface 101 or the third interface 103, in addition, there are two interfaces as liquid inlets and two interfaces as liquid outlets, which can be arranged in combination, and those skilled in the art can understand that the above flow modes can ensure the circulation of the liquid working medium in the cooling plate body 1, and the liquid working medium can flow through the entire flow channel, avoiding the formation of a cooling blind area, thereby ensuring that each heat generating device arranged on the cooling plate body 1 can be effectively cooled. Through such an arrangement, as long as two of the four interfaces of the liquid cooling plate provided by the embodiment of the application can be normally put into use, the heat dissipation and cooling functions of the liquid cooling plate can be ensured, and when one or two interfaces are damaged or broken, the normally used interfaces can be sealed or repaired, without affecting the normal functions of the liquid cooling plate, and without disassembling and repairing the entire cooling plate body 1 and the internal flow channel, thereby effectively reducing the production and repair costs.

[0051] Furthermore, the centralized heat dissipation area includes a heat collection area 4 and a first guide area 5 and a second guide area 6 respectively disposed on both sides of the heat collection area 4 and connected to the heat collection area 4. The first return channel 2 is provided with a first branch interface 201, which is connected to the first guide area. The second return channel 3 is provided with a second branch interface, which is connected to the second guide area. This ensures that the liquid working fluid flowing to the heat collection area 4 through whichever interface it enters will first pass through the first guide area or the second guide area before flowing into the heat collection area 4.

[0052] Furthermore, a plurality of first flow guiding fins 501 are spaced apart in the first heat-conducting part. The plurality of first flow guiding fins 501 are arranged in parallel and spaced apart. Each first flow guiding fin 501 extends along a first direction, wherein the first direction is the length direction of the cold plate body 1.

[0053] In such Figure 4 In the illustrated state, the first heat-conducting part is specifically a space with a certain volume planned within the main body of the cold plate 1. Along the bottom-up arrangement direction, the right side of the second or third first guide fin 501 is connected to the side wall of the first branch interface 201, while along the top-down arrangement direction, the left side of the second first guide fin 501 is connected to the side wall of the first guide zone 5. The left and right sides of the remaining first guide fins 501 do not contact the wall of the first guide zone 5. This arrangement limits the flow direction of the liquid working fluid in the first guide zone 5, so that the liquid working fluid flows along the guide of the first branch interface 201 to the first guide zone 5 and then flows from bottom to top through the channel between any two adjacent first guide fins 501 before flowing to the heat collection zone 4. This not only ensures the heat absorption effect of the first guide zone 5, but also reduces the impact of the liquid working fluid on the heat collection zone 4.

[0054] The second heat-conducting part is provided with a plurality of second flow guide fins 601 at intervals. The plurality of second flow guide fins 601 are arranged in parallel and at intervals. Each second flow guide fin 601 extends along a second direction, wherein the second direction is the width direction of the cold plate body 1.

[0055] The second heat-conducting section is specifically a space with a certain volume planned within the main body of the cold plate 1, in which multiple second heat-conducting fins 601 are staggered, as shown in... Figure 4In the shown state, the lower end (or upper end) of the first second flow guide fin 601 arranged from left to right is connected with one side wall of the second heat conduction part, and the upper end (or lower end) of the first second flow guide fin 601 is not in contact with the side wall of the second heat conduction part; in turn, the upper end (or lower end) of the second second flow guide fin 601 is in contact with the wall surface of the second heat conduction part, and the lower end (or upper end) of the second second flow guide fin 601 is not in contact with the wall surface of the second heat conduction part, and the remaining second flow guide fins 601 are arranged in this rule and are spaced apart, so that the flow path of the liquid working medium in the second heat conduction part is S-shaped, which can slow down the flow speed of the liquid working medium in the second flow guide area 6 and increase the flow rate in the second flow guide area 6, which can improve the heat absorption effect of the second flow guide area 6 on the one hand, and slow down the impact of the multi-flow liquid working medium on the heat collection area 4 on the other hand.

[0056] Preferably, one of the side walls of the second flow guide area 6 includes a plurality of continuously bent wall surfaces, or the wall surface is a curved surface, which has a flow disturbance effect and avoids excessive impact of the liquid working medium on the second flow guide area 6.

[0057] It should be noted that the extension directions of the second flow guide fins 601 of the first flow guide fins 501 are different, which can further improve the flow guide and flow disturbance effects of the first flow guide area 5 and the second flow guide area 6 on the entire flow channel.

[0058] Further, a plurality of ribs 401 are arranged in parallel and spaced apart in the heat collection area 4, and at least part of the plurality of ribs 401 are arranged in a staggered manner, so that the flow path of the liquid working medium in the heat collection area 4 is also S-shaped, which can be fully understood by those skilled in the art and will not be described here.

[0059] Preferably, the first flow guide fins 501, the second flow guide fins 601 and the ribs 401 all have a toothed structure, which further increases the heat exchange efficiency of the liquid working medium and fully utilizes the heat capacity of the cooling liquid.

[0060] Further, the heat conduction assembly includes a first heat conduction plate 7, a second heat conduction plate 8 and a heat conduction pipe group, wherein the heat conduction pipe group includes a first heat pipe group and a second heat pipe group, specifically, the first heat conduction plate 7 is arranged on one side of the cold plate body 1, preferably, the first heat conduction plate 7 is arranged in a spaced apart manner with the fourth side surface of the cold plate body 1, and a gap is formed between the two, the first heat conduction plate 7 is attached to the heat source, the second heat conduction plate 8 is attached to the upper surface (or lower surface) of the cold plate body 1, and the first heat pipe group and the second heat pipe 10 are connected with the first heat conduction plate 7 and the second heat conduction plate 8, so that the first heat conduction plate 7 can transmit the heat generated by the heat source to the second heat conduction plate 8 through the first heat pipe group and the second heat pipe group, and then the heat on the second heat conduction plate 8 is absorbed by the liquid working medium in the cold plate body 1, which circulates to achieve heat dissipation and cooling of the heat source.

[0061] Further, the first heat pipe group at least comprises the first heat pipe 9 and the second heat pipe 10, wherein the first heat pipe 9 comprises an integral first straight pipe segment 901 and a U-shaped pipe segment 902, the first straight pipe segment 901 is attached to the second heat-conducting plate 8, and the U-shaped pipe segment 902 is attached to the first heat-conducting plate 7, and the position where the first straight pipe segment 901 and the U-shaped pipe segment 902 are connected spans the gap between the first heat-conducting plate 7 and the cold plate body 1, so that the heat between the first heat-conducting plate 7 and the cold plate body 1 is transferred through the first heat pipe 9 (and other heat pipes described below), avoiding the local contact between the first heat-conducting plate 7 and the cold plate body 1 affecting the heat-conducting effect of the first heat-conducting plate 7 or the local temperature of the cold plate body 1 being higher than that of other parts affecting the heat dissipation and cooling effect of the cold plate body 1.

[0062] It should be noted that a groove 701 is formed on the first heat-conducting plate 7 and is adapted to the shape of the U-shaped pipe segment 902, so that the U-shaped pipe segment 902 can be limited in the groove 701, which can not only ensure the heat-conducting effect between the U-shaped pipe segment 902 and the first heat-conducting plate 7, but also ensure the stability between the U-shaped pipe segment 902 and the first heat-conducting plate 7. Moreover, the part of the first heat pipe 9 located on the first heat-conducting plate 7 is arranged in a U shape, which can increase the contact area between the first heat pipe 9 and the first heat-conducting plate 7, ensure the heat-conducting effect without increasing the volume of the cold plate body 1 and the first heat-conducting plate 7 and the second heat-conducting plate 8, and help the lightweight design of the liquid cooling plate and save production costs. In addition, the U-shaped pipe segment 902 can be replaced by an S-shaped pipe segment, but the number of bends of the S-shaped pipe segment should not be too many and the density should not be too high.

[0063] Preferably, the second heat-conducting plate 8 is formed with a plurality of groove portions 801, and the first straight pipe segment 901 is located in the groove portion 801, so that the lower surface and the left and right side surfaces of the first straight pipe segment 901 can contact the second heat-conducting plate 8, thereby increasing the contact area between the first straight pipe segment 901 and the second heat-conducting plate 8 and improving the heat-conducting efficiency therebetween.

[0064] Further, the second heat pipe 10 has an "L" shape structure, comprising a second straight pipe segment 1001 arranged in parallel with the first straight pipe segment 901 and a third straight pipe segment 1002 located in the "U-shaped structure" of the U-shaped pipe segment 902. Preferably, the second straight pipe segment 1001 and the third straight pipe segment 1002 have an integral structure and the junction between them spans the gap between the first heat-conducting plate 7 and the cold plate body 1.

[0065] The second heat pipe group also comprises two heat pipes, and the second heat pipe group and the first heat pipe group are arranged radially symmetrically. Those skilled in the art can fully understand this without further description.

[0066] Preferably, the number of heat conduction assemblies is at least two groups, and the at least two groups of heat conduction assemblies are arranged at intervals along the length direction of the cold plate body 1. Preferably, the number of heat conduction assemblies is two groups, one group of heat conduction assemblies is arranged opposite to the second heat conduction plate 8 of the first flow guide area 5, and the other group of heat conduction assemblies is arranged opposite to the second heat conduction plate 8 of the second flow guide area 6. The liquid working medium in the first flow guide area 5 and the second flow guide area 6 has a large flow and a relatively slow flow rate, so that the arrangement of the two second heat conduction plates 8 opposite to the first flow guide area 5 and the second flow guide area 6 can enable the liquid working medium in the two flow guide areas to fully and efficiently absorb the heat transferred to the cold plate body 1 by the heat conduction plates.

[0067] Further, the liquid cooling plate provided by the application further comprises a heat spreading member 11. Preferably, the side surface of the cold plate body 1 on which the second flow guide plate is arranged is defined as an upper surface, and the side surface of the cold plate body 1 opposite to the upper surface is defined as a lower surface. The heat spreading member 11 is arranged on the lower surface of the cold plate body 1, and the heat spreading member 11 is arranged opposite to the plate surface corresponding to the heat collection area 4. The heat spreading member 11 is attached to another heat source (for example, a chip of an electronic device). Preferably, the heat spreading member 11 has a block or sheet structure. More preferably, the area of the heat spreading member 11 for contacting the chip is greater than the area of the chip for contacting the heat spreading member 11, so that the heat generated by the chip can be spread to the cold plate body 1 through the heat spreading member 11, and the cold plate body 1, especially the heat collection area 4, can fully and quickly absorb the heat generated by the chip.

[0068] It should be noted that the heat spreading member 11 and the first heat conduction plate 7 and the second heat conduction plate 8 described above are all made of a material with good heat conductivity, which can be but is not limited to copper.

[0069] In summary, the liquid cooling plate provided by the application can meet various liquid inlet and outlet modes with the same flow channel design, and the flow resistance of various liquid inlet and outlet modes is not greatly different, so that one set of pump driving system can be shared. When a problem occurs in an individual interface and cannot be used, the normal function of the liquid cooling plate will not be affected, and the production cost and maintenance cost of the liquid cooling plate are effectively reduced.

[0070] In addition, the liquid cooling plate provided by the application can strengthen local heat exchange for local high heat flux density points, and heat pipes are used to transmit heat to the heat source concentration area. In the case of not increasing the volume of the cold plate, only the flow channel design can meet the heat dissipation condition, so that the problems of overheat exchange in some areas and insufficient heat exchange in some areas and waste of heat capacity of the cooling liquid are avoided.

[0071] Embodiments of the application also provide an electronic device comprising the liquid cooling plate described in any of the above embodiments, so that the electronic device has all the beneficial technical effects of the liquid cooling plate, which will not be described herein.

[0072] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid-cooled plate, characterized in that, include: The cold plate body has a flow channel inside; the flow channel includes at least two interconnected return channels; The cold plate body is provided with multiple interfaces communicating with the flow channel, some of which are liquid inlets and others are liquid outlets. Each return channel includes an inlet and an outlet; The inlet of each of the reflux channels is connected to one of the liquid inlets, and the outlet of each of the reflux channels is connected to one of the liquid outlets. The flow channel includes a centralized heat dissipation area, and each of the return channels is connected to the centralized heat dissipation area; The centralized heat dissipation area includes: The heat collection area includes multiple fins, which are spaced apart. A first flow guiding zone is connected to the heat collection zone; at least one of the return channels is connected to the heat collection zone through the first flow guiding zone; The second flow guiding zone is connected to the heat collection zone, and at least one of the return channels is connected to the heat collection zone through the second flow guiding zone.

2. The liquid cooling plate according to claim 1, characterized in that, The main body of the cold plate has a cuboid structure, and the number of interfaces is four. The four interfaces are respectively arranged on two parallel sides of the main body of the cold plate. One or two of the interfaces are liquid inlets, and the other three or two of the interfaces are liquid outlets.

3. The liquid cooling plate according to claim 1, characterized in that, The first flow guiding area is provided with a plurality of first flow guiding fins arranged at intervals along the first direction; The second flow guiding area is provided with a plurality of second flow guiding fins arranged at intervals along a second direction different from the first direction.

4. The liquid cooling plate according to claim 1, characterized in that, Each of the return channels further includes a branch interface, which is connected to the first guide zone or the second guide zone.

5. The liquid-cooled plate according to any one of claims 1 to 4, characterized in that, The liquid cooling plate further includes a heat-conducting component, which includes: The first heat-conducting plate is in contact with the heat source. A heat pipe assembly, a portion of which is disposed on the first heat-conducting plate; The second heat-conducting plate is disposed on the outer surface of the cold plate body, and another part of the heat-conducting pipe assembly is disposed on the second heat-conducting plate.

6. The liquid cooling plate according to claim 5, characterized in that, The first heat-conducting plate is spaced apart from the main body of the cold plate; The heat pipe assembly includes a first heat pipe assembly and a second heat pipe assembly arranged symmetrically. The first heat pipe assembly and the second heat pipe assembly respectively span the gap between the first heat-conducting plate and the cold plate body.

7. The liquid cooling plate according to claim 1, characterized in that, The liquid cooling plate also includes a heat expansion component, which is disposed on the outer surface of the main body of the cooling plate, facing the heat collection area, and the heat expansion component is in contact with another heat source.

8. An electronic device, characterized in that, Includes the liquid cooling plate according to any one of claims 1 to 7.

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