Optical module temperature testing equipment

Abstract

The present application discloses an optical module temperature testing device, including: a box, a material measuring component, a temperature regulating and controlling system, and a lifting and pressing component. The material measuring component is arranged on the surface of the box, and includes a first material measuring unit and a second material measuring unit, wherein the first material measuring unit includes: a first fixing seat, a thermal copper sheet, a TEC group, a water cooling head, and a second fixing seat arranged in sequence. The second material measuring unit has the same structure as the first material measuring unit and is symmetrically arranged with the first material measuring component. After the lifting and pressing component lifts and presses the first material measuring component, the optical module to be tested can be placed between the first material measuring component and the second material measuring component. The present application is based on the TEC sheet to achieve the effect of heating and cooling, replacing the general hot and cold stamping machine, reducing equipment costs and energy consumption. The temperature regulating and controlling system controls the temperature of the material measuring component, making it suitable for testing in different ambient temperatures.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module temperature testing device. Background Art

[0002] Global optical communications are experiencing rapid growth due to the increasing demand for bandwidth in fiber-optic communications. In the field of high-speed data communications, optical modules are often used to transmit and receive light of different wavelengths to ensure long-distance, high-speed data transmission.

[0003] Existing optical modules typically refer to integrated modules used for photoelectric conversion. For optical signal transmission, laser chips are typically used to convert electrical signals from a host computer into optical signals. The stability of optical modules directly affects communication quality, so safety testing of optical modules is essential, and temperature fluctuations are necessary during testing.

[0004] Currently, the optical module industry generally uses hot and cold shock machines for three-temperature testing of optical modules. They are expensive to purchase (about 170,000 yuan / unit), have high energy consumption (about 5 kW / unit), are large in size, require refrigerants, and also require additional compressed air (power consumption of about 5.8 kW / unit) for cooling and heating. Although the function is stable, the cost of use and maintenance is high. Summary of the Invention

[0005] The present application provides an optical module temperature testing device, to provide a temperature testing apparatus suitable for an optical module.

[0006] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0007] The embodiment of the present application discloses an optical module temperature testing device, comprising: a box;

[0008] The material measuring component is arranged on the surface of the box body and includes a first material measuring unit and a second material measuring unit, wherein:

[0009] The first material measuring unit includes: a first fixing seat, a thermally conductive copper sheet, a TEC group, a water cooling head, and a second fixing seat, which are arranged in sequence; one side of the TEC group is connected to the thermally conductive copper sheet, and the other side is connected to the water cooling head;

[0010] The second material measuring unit has the same structure as the first material measuring unit and is symmetrically arranged with the first material measuring component. An optical module to be tested can be placed between the first material measuring component and the second material measuring component.

[0011] A lifting and pressing assembly, used for lifting and pressing the first material measuring assembly;

[0012] The temperature regulation and control system is connected to the material measuring component and is used to regulate and control the temperature of the material measuring component.

[0013] Compared with the prior art, the present invention has the following advantages:

[0014] This application discloses an optical module temperature testing device, comprising: a housing, a material measurement assembly, and a temperature regulation and control system for a lifting and pressing assembly. The material measurement assembly is disposed on the surface of the housing and includes a first material measurement unit and a second material measurement unit. The first material measurement unit comprises, in sequence, a first fixing seat, a thermally conductive copper sheet, a TEC group, a water cooling head, and a second fixing seat; one side of the TEC group is connected to the thermally conductive copper sheet, and the other side is connected to the water cooling head. The second material measurement unit has the same structure as the first material measurement unit and is symmetrically arranged with the first material measurement assembly. The optical module to be tested can be placed between the first and second material measurement assemblies. The lifting and pressing assembly is used to lift and press the first material measurement assembly. The temperature regulation and control system is connected to the material measurement assembly and is used to regulate and control the temperature of the material measurement assembly. This application utilizes TEC sheets as a basis to achieve temperature regulation and control, replacing conventional hot and cold stamping machines, reducing equipment costs and energy consumption, thereby achieving cost reductions. Because semiconductor coolers have low thermal inertia, cooling and heating times are fast and energy consumption is low. The lifting and pressing assembly is used to lift and press the first material measuring assembly, and the temperature regulating and controlling system controls the temperature of the material measuring assembly to make it suitable for testing at different ambient temperatures.

[0015] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 A schematic diagram of the structure of an optical module temperature test device provided in the embodiment of the present application Figure 1 ;

[0018] Figure 2 An exploded view of the interior of a box provided in an embodiment of the present application;

[0019] Figure 3 Schematic diagram of an optical module temperature test device provided in the application embodiment Figure 2 ;

[0020] Figure 4A schematic structural diagram of a first material measuring unit provided in an embodiment of the present application;

[0021] Figure 5 A schematic structural diagram of a lifting and pressing assembly and a material measuring assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0023] The optical module temperature testing device provided in the embodiment of the present application is used to provide a temperature environment for the optical module to be tested. The single-channel optical module and multi-channel optical module mentioned in the article are divided according to the number of optical channels in the optical module. If the optical module to be tested has one optical channel, it is called a single-channel optical module; if the optical module to be tested has multiple optical channels, it is called a multi-channel optical module.

[0024] Figure 1 A schematic diagram of an optical module temperature testing device provided in an embodiment of the present application Figure 1 .like Figure 1 As shown, an embodiment of the present application provides an optical module temperature testing device, including:

[0025] The box body 100 is surrounded by six aluminum alloy plates, which are respectively called: upper panel 101 and lower panel 102, front panel 103 and rear panel 104, left panel 105 and right panel 106. Among them, the upper panel 101 and lower panel 102 are arranged opposite to each other, the front panel 103 and rear panel 104 are arranged opposite to each other, and the left panel 105 and right panel 106 are arranged opposite to each other. A plurality of heat dissipation holes are set on the left panel 105 and the front panel 103 to assist in the dissipation of heat inside the box body. A baffle 107 is set inside the box body to separate the box body into a first cavity and a second cavity. The baffle 107 is arranged parallel to the left panel 105 and the right panel 106, and the first cavity and the second cavity are isolated from each other. Figure 2 The figure shows an exploded view of a box provided in an embodiment of the present application.

[0026] The upper surface of the housing 100 is provided with a material measuring assembly 200, which is used to provide a temperature test environment for the optical module. The material measuring assembly 200 is composed of two material measuring units, an upper material measuring unit and a lower material measuring unit. In this embodiment, the upper material measuring unit is referred to as the first material measuring unit 201, and the lower material measuring unit is referred to as the second material measuring unit 202. Figure 3Schematic diagram of an optical module temperature test device provided in the application embodiment Figure 2 ; Figure 4 This is a schematic diagram of the structure of a first material measuring unit provided in an embodiment of the present application. Figure 2 、 Figure 3 and Figure 4 As shown, the first material measuring unit 201 comprises a first fixing base 2011 and a second fixing base 2012. Bolts 2013 connect the first and second fixing bases 2011 and 2012. To ensure connection stability, four bolts 2013 are provided, positioned at the four corners of the first and second fixing bases 2011 and 2012, or positioned as needed. A thermally conductive copper sheet 2014, a TEC assembly 2015, and a water cooling block 2016 are positioned above the first fixing base 2011 and between the second fixing base 2012.

[0027] Among them, the TEC group 2015 includes two TEC sheets. The TEC sheet is a semiconductor cooling sheet, also known as a thermoelectric cooling sheet. It has many small heat pumps arranged inside it. It is a couple composed of two or more pairs of semiconductor materials connected in series. When a low-voltage direct current is passed through, heat will be transferred from one side of the semiconductor cooling sheet to the other side, and one side will release heat while the other side will cool down, thus achieving cooling or heating. This utilizes the Peltier effect of semiconductor materials (the Peltier effect refers to the fact that when an electric current passes through a loop composed of different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release will occur at the joints of different conductors depending on the direction of the current). It is a refrigeration technology that produces negative thermal resistance. Its characteristics are that there are no moving parts and it is relatively reliable.

[0028] In this application, the working surface of the TEC sheet is connected to a thermally conductive copper sheet 2014. The other surface of the thermally conductive copper sheet 2014 is connected to the optical module under test, dissipating heat from the TEC sheet evenly to the optical module under test. The other surface of the TEC sheet is connected to a water cooling block 2016 to maintain the TEC sheet's operating efficiency. In this embodiment, the working surface of the TEC sheet is the cooling surface when a forward current is applied to the TEC sheet.

[0029] To strengthen the fixing strength between the first fixing base 2011 and the thermally conductive copper sheet 2014 and prevent the relative position of the first fixing base 2011 and the thermally conductive copper sheet 2014 from shifting during use due to temperature, vibration, and other factors, which could affect the thermal conductivity, the first fixing base 2011 is provided with a slot. The slot's dimensions match the thermally conductive copper sheet 2014 and are used to secure the thermally conductive copper sheet 2014 to the first fixing base 2011. Similarly, to strengthen the fixing strength between the second fixing base 2012 and the water-cooling head 2016 and prevent the relative position of the second fixing base 2012 and the TEC group 2015 from shifting during use due to temperature, vibration, and other factors, which could affect the cooling effect, the second fixing base 2012 is provided with a slot on the side that contacts the water-cooling head 2016. The slot's dimensions match the surface dimensions of the water-cooling head 2016.

[0030] A silicone pad is provided between the TEC group 2015 and the water cooling head 2016, and a silicone pad is also provided between the TEC group 2015 and the thermal copper sheet 2014. This ensures sufficient contact between the TEC group 2015 and the water cooling head 2016, as well as between the TEC group 2015 and the thermal copper sheet 2014, thereby solving the problem of poor thermal conductivity caused by insufficient contact, and preventing the TEC group 2015 from making hard contact with metal devices and causing damage.

[0031] like Figure 2 To achieve rapid cooling of the working surface of the TEC sheet, the heat generated by the TEC sheet must be effectively and quickly dissipated to avoid heat failure due to inadequate heat dissipation or damage to the TEC sheet due to excessive heat accumulation. Therefore, the other side of the TEC sheet is connected to a water-cooling head 2016. A cold water circulation line is provided within the water-cooling head 2016, which is then connected to the heat dissipation assembly 300 to remove the heat generated by the TEC sheet during cooling, thereby achieving cooling. The heat dissipation assembly 300 includes a water tank 301, a water pump 302, a water cooler 303, and a first fan 304. The fan head of the first fan 304 is positioned corresponding to the position of the water cooler 303 and is used to remove heat from the water in the water cooler 303 using air flow, thereby lowering the water temperature. The water tank 301 and the water-cooling head 2016 are connected by water pipes. The water pump 302 is connected to both the water tank 301 and the water cooler 303 by water pipes. The water cooler 303 is also connected to the water-cooling head 2016 by water pipes. The water cooling head 2016 , the water cooler 303 , the water pump 302 and the water tank 301 form a water circulation path.

[0032] Water from water-cooling head 2016 enters water tank 301 and is then pumped to water cooler 303 by water pump 302. The water in water cooler 303 is driven by air flow from the opposing first fan 304, lowering the temperature of water cooler 303. The cooled water is then pushed toward water-cooling head 2016, and so on, forming a circulation loop that cools the water inside water-cooling head 2016, further reducing the temperature on the other side of the TEC array and maintaining the efficiency of the TEC array. During operation, the water pump is powered on to pump water. Distilled water flows through the water path, removing heat generated by the TEC elements as it passes through the water-cooling head, and then flows back to the water tank. The water pump then pumps water from the water tank and brings it to the water cooler. The hot water disperses through the tortuous pipes within the water cooler, dispersing the heat. The fan extracts air, removing the heat, and the cooled water is pushed back toward the water-cooling head, repeating the cycle, effectively cooling the TEC array.

[0033] In order to improve the cooling effect of the first fan 304 on the water cooler 303, a first fan ventilation hole 1041 is set at a corresponding position of the rear panel 104 of the box 100 to facilitate air flow inside the box 100 and increase the cooling effect.

[0034] The first material measuring unit 201 and the second material measuring unit 202 are respectively disposed on the upper and lower sides of the optical module to be tested, and the second material measuring unit 202 is also connected to the heat dissipation assembly 300 .

[0035] In order to achieve simultaneous testing of multiple optical modules and improve the utilization efficiency of optical module temperature testing equipment, the TEC group can be set to multiple TEC pieces, and the specific values ​​can be set according to the test program.

[0036] The upper surface of the box 100 is also provided with a lifting and pressing assembly 400, including a fixing plate 401 fixedly connected to the first material measuring unit 201. Specifically, the fixing plate 401 is provided with a plurality of screw holes, and the second fixing seat 2012 is provided with a through hole for connecting and fixing with the fixing plate 401.

[0037] Figure 5This is a structural diagram of a lifting and pressing assembly and a material measuring assembly provided in an embodiment of the present application. In order to realize automatic control of the fixed plate 401, the lifting and pressing assembly 400 also includes: a shaft seat 402, which is fixedly arranged on the box body 100. A fixing ring 4031 is fixedly arranged at one end of the guide shaft 403, and the other end is connected to the shaft seat 402. In addition, the guide shaft 403 passes through the fixed plate 401 through a linear bearing 404 and is movably connected to the fixed plate 401. The spring is sleeved on the outside of the guide shaft 403 and is arranged between the fixing ring 4031 and the linear bearing 404. The linear bearing 404 is fixedly connected to the fixed plate 401, and the linear bearing 404 is arranged on the fixed plate 401, passing through the upper and lower surfaces of the fixed plate 401. The linear bearing 404 is slidably connected to the guide shaft 403. When the fixing plate 401 is subjected to an upward force (facing away from the surface of the box), the fixing plate 401 drives the linear bearing 404 thereon to move upward. Since the fixing plate 401 is fixedly connected to the first material measuring unit 201, it also drives the first material measuring unit 201 to move away from the box 100, thereby generating a space between the first material measuring unit 201 and the second material measuring unit 202. This space can be used to accommodate the optical module to be tested.

[0038] The electromagnetic push rod 406, with its fixed end fixedly connected to the upper surface of the housing 100 and its other end connected to the fixed plate 401, is used to push the fixed plate 401 up and down. When the first material measuring unit 201 needs to be raised to place the optical module to be tested between the first material measuring unit 201 and the second material measuring unit 202, the electromagnetic push rod 406 is activated, pushing the fixed plate 401 away from the housing 100. At this time, the fixed plate 401 drives the first material measuring unit 201 away from the housing 100, and the spring is compressed, creating a space between the first material measuring unit 201 and the second material measuring unit 202. This space can be used to accommodate the optical module to be tested. When the optical module is set between the first material measuring unit 201 and the second material measuring unit 202, the electromagnetic push rod 406 is closed, and the fixed plate 401 falls back under the action of the spring force and the gravity of the fixed plate 401 itself, and is pressed onto the top of the optical module to be tested, thereby realizing the lifting and pressing of the first material measuring unit 201 controlled by the lifting and pressing component 400.

[0039] To ensure balanced force on the fixed plate 401 and enable simultaneous measurement of multiple optical modules, the electromagnetic push rod 406 is positioned in the center of the fixed plate 401. A measuring assembly 200 is positioned on either side. One or more optical modules to be tested can be positioned between the first measuring unit 201 and the second measuring unit 202 of each measuring assembly 200. The specific measurement depends on the size of the optical module temperature tester. This setup is generally suitable for measuring multi-channel optical modules, as these modules utilize a single, separate test plate.

[0040] Usually, the test board of a single-channel optical module is configured with multiple detection channels arranged side by side. Therefore, to match this, an electromagnetic push rod 406 can be provided at each end of the fixed plate 401 , and one or more material measuring components 200 can be provided between the two electromagnetic push rods 406 .

[0041] Furthermore, to maintain the relative position of the optical module under test and the material measurement assembly 200, a limit block 600 is positioned between the first material measurement unit 201 and the second material measurement unit 202. This limit block 600 is positioned above the second material measurement unit 202 and includes a limit hole 601, which defines the position of the optical module under test and prevents movement during the test phase, which could cause temperature imbalances. An optical module test board is located on one side of the limit hole, which connects the optical module to the test board for functional testing of the optical module.

[0042] The temperature regulation and control system includes: multiple temperature sensing cables, multiple thermostats, and a remote controller. One end of the temperature sensing cable is connected to the thermally conductive copper sheet 2014, and the other end is connected to the thermostat. The temperature sensing cable senses the temperature of the thermally conductive copper sheet 2014 and transmits the temperature value to the thermostat. The thermostat is electrically connected to the TEC assembly and is also connected to the remote controller, which can be used to control the thermostat and adjust the temperature of the thermally conductive copper sheet. To ensure uniform heating of the optical module under test, the temperatures of the first and second measuring units 201 and 202 should typically be kept consistent. During operation, the thermostat transmits the actual temperature value of the thermally conductive copper sheet to the computer control program (remote controller) via the temperature sensing cable. The computer then outputs a corresponding temperature increase or decrease command based on the product's temperature test requirements, which is then returned to the thermostat. Upon receiving the command, the thermostat energizes the TEC assembly and continuously senses the temperature of the thermally conductive copper sheet. The test program also continuously provides feedback on the "DDMI temperature" of the optical film block. When the temperature reaches the target value, the temperature test begins, thus forming a temperature control loop.

[0043] The heat dissipation component 300 is arranged in the first cavity, and the electronic components in the optical module temperature testing equipment are arranged in the second cavity, so that the water path and the circuit are isolated and the safety performance of the circuit is improved. Specifically, the heat dissipation component 300 can be arranged in the first cavity, and the temperature controller in the temperature regulation and control system can be arranged in the second cavity. In order to facilitate the use of electricity for the water pump body, a power supply 305 is also provided in the second cavity and electrically connected to the water pump. In order to accelerate the dissipation of heat in the second cavity and avoid the temperature increase of the environment around the electronic components, a second fan 306 is also provided in the second cavity, and a second fan ventilation hole 1042 is provided at a corresponding position on the rear panel 104 of the box body 100 to facilitate the air flow inside the box body 100 and increase the cooling effect.

[0044] To facilitate the placement of the optical modules to be tested, a stainless steel swing plate 700 is provided on one side of the box body. The swing plate 700 is fixedly connected to the box body 100 via a swing plate bracket 800.

[0045] The working principle of the optical module temperature test equipment provided in this application is as follows:

[0046] First, the electromagnetic push rod 406 is activated, pushing the fixed plate 401 away from the housing 100. This causes the fixed plate 401 to move the first material measuring unit 201 away from the housing 100. The spring is compressed, creating a space between the first and second material measuring units 201, 202. This space can be used to accommodate the optical module to be tested. After the optical module to be tested is placed in a specific position, the electromagnetic push rod 406 is disconnected, and the fixed plate 401 falls back under the force of the spring and its own gravity, pressing against the optical module to be tested.

[0047] Next, the remote controller sets the desired ambient temperature for the test, here defined as the preset temperature. The thermostat uses a temperature sensor to measure the actual temperature of the thermally conductive copper sheet. Based on the comparison between the preset and actual temperatures, the remote controller outputs a temperature increase or decrease command. If the thermostat receives a temperature increase command, it reverses the power supply to the TEC assembly. This generates heat on the working surface of the TEC sheet, which then conducts the heat through the thermally conductive copper sheet and silicone sheet to the optical module under test. The other surface of the TEC sheet cools, coming into contact with the surface of the water-cooling block 2016. The water inside the water-cooling block 2016 is at a higher temperature than the cold surface. This flowing water effectively heats the TEC sheet, maintaining its power. The water then flows to the water tank 301, where it is pumped by a water pump 302 and carried to the water cooler 303. The hot water disperses through the tortuous pipes within the water cooler, dispersing the heat. The fan extracts the heat, and the cooled water is then pushed back to the water-cooling block, repeating the cycle to effectively dissipate heat from the TEC assembly. Set the program. At predetermined intervals, the thermostat will transmit the actual temperature value on the heat-conducting copper sheet through the temperature sensing wire. The remote controller will output a heating or cooling instruction based on the comparison result between the preset temperature and the actual temperature value.

[0048] If the actual temperature value is higher than the preset temperature, the remote controller outputs a cooling command, which then applies forward power to the TEC group. The working surface of the TEC plate cools, and the temperature of the working surface of the TEC plate is transferred to the optical module under test through the thermally conductive copper sheet and silicone sheet. The other side of the TEC plate heats up, coming into contact with the surface of the water-cooling head 2016. The water temperature inside the water-cooling head 2016 rises, and flows to the water tank 301. The water in the water tank 301 is then pumped by the water pump 302 and brought to the water cooler 303. The hot water disperses through the tortuous pipes inside the water cooler, dispersing the heat. The fan extracts air, and the cooled water is pushed back to the water-cooling head, repeating the cycle, effectively cooling the TEC group.

[0049] During this process, the heat sink assembly 300 remains operational, dissipating heat from the TEC sheet and maintaining its operating power. After the test is complete, the electromagnetic push rod 406 is activated, pushing the fixed plate 401 away from the housing 100. This forces the fixed plate 401 to move the first material measuring unit 201 away from the housing 100. The spring is compressed, creating a space between the first and second material measuring units 201, 202. After the tested optical module is removed, the next optical module to be tested is inserted into the space. The electromagnetic push rod 406 is disconnected, and the fixed plate 401 falls back due to the spring force and its own gravity.

[0050] Since the above embodiments are all described by reference in combination with other embodiments, different embodiments have the same parts, and the same and similar parts between the various embodiments in this specification can be referred to each other. No further detailed explanation is given here.

[0051] It should be noted that, in this specification, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such circuit structure, article or device. In the absence of further restrictions, the presence of an element defined by the phrase "includes a..." does not exclude the presence of other identical elements in the circuit structure, article or device comprising the element.

[0052] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the disclosure of the invention herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the claims.

[0053] The above-described embodiments of the present application do not constitute a limitation on the scope of protection of the present application.

Claims

1. An optical module temperature testing device, characterized in that: include: Box; Two material measuring components are arranged on the surface of the box, and the material measuring components include a first material measuring unit and a second material measuring unit, wherein: The first material measuring unit includes: a first fixing seat, a thermally conductive copper sheet, a TEC group, a water cooling head, and a second fixing seat, which are arranged in sequence; one side of the TEC group is connected to the thermally conductive copper sheet, and the other side is connected to the water cooling head; The second material measuring unit has the same structure as the first material measuring unit and is symmetrically arranged with the first material measuring unit. An optical module to be tested can be placed between the first material measuring unit and the second material measuring unit. A lifting and pressing assembly is used to lift and press the first material measuring unit, and the lifting and pressing assembly includes: an axle seat, fixedly connected to the box body; A guide shaft, one end of which is fixedly connected to the shaft seat and the other end of which is fixedly provided with a fixing ring; a linear bearing, fixedly connected to the first material measuring unit and slidably connected to the guide shaft; A spring, sleeved on the outside of the guide shaft, with one end connected to the fixing ring and the other end connected to the linear bearing; An electromagnetic push rod, one end of which is fixed to the box body and the other end is connected to the first material measuring unit. The lifting and pressing of the first material measuring unit are controlled by the extension and contraction of the electromagnetic push rod; two material measuring components are respectively located on both sides of the electromagnetic push rod; a temperature regulation and control system is connected to the material measuring component for regulating and controlling the temperature of the material measuring component.

2. The optical module temperature testing device according to claim 1, characterized in that: The first fixing seat and the second fixing seat are connected by bolts; And the following are arranged in sequence between the first fixing seat and the second fixing seat: a thermal conductive copper sheet, a TEC group, and a water cooling head.

3. The optical module temperature testing device according to claim 1, characterized in that: Also includes: The heat dissipation component is connected to the water cooling head pipeline and is used to water-cool the material measuring component.

4. The optical module temperature testing device according to claim 3, characterized in that: The heat dissipation assembly includes: a water tank connected to the water-cooling head pipeline; a water pump, one end of which is connected to the water tank pipeline and the other end of which is connected to the water cooler; The water cooler is also connected to the water cooling head pipeline.

5. The optical module temperature testing device according to claim 4, characterized in that: The heat dissipation component further includes: a first fan for air cooling the water cooler.

6. The optical module temperature testing device according to claim 3, characterized in that: The heat dissipation component is arranged inside the box.

7. The optical module temperature testing device according to claim 1, characterized in that: The lifting and pressing assembly further includes: an electromagnetic push rod, one end of which is fixedly connected to the box body, and the other end of which is connected to the first material measuring unit, for providing a driving force for the first material measuring unit.

8. The optical module temperature testing device according to claim 1, characterized in that: The temperature regulation and control system includes: a plurality of temperature sensing lines, a plurality of temperature controllers and a remote controller; One end of the temperature sensing wire is connected to the heat-conducting copper sheet, and the other end is connected to the thermostat; The thermostat is also electrically connected to the remote controller.

9. The optical module temperature testing device according to claim 1, characterized in that: Also includes: A limiting block is provided above the second material measuring unit and is used to limit the position of the optical module.

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