An optical module

Abstract

The application discloses an optical module, comprising a circuit board, an upper surface of which is provided with an optical receiving chip, and a lower surface of which is provided with a solder pad; a tube shell assembly, an upper surface of which comprises an optical receiving cavity and a slot which are respectively concave downward, and a convex part is arranged between the optical receiving cavity and the slot, the convex part comprises a light transmission hole to communicate the optical receiving cavity and the slot; a lower surface of the tube shell assembly comprises an optical emitting cavity which is concave upward; the other end of the optical emitting cavity is provided with a gap; an optical emitting assembly is located in the optical emitting cavity; one end of the circuit board extends into the optical emitting cavity through the gap; the solder pad is located in the optical emitting cavity and is connected with the optical emitting assembly through a wire; an optical assembly is located in the optical receiving cavity; a reflecting mirror is arranged at the slot and can reflect light from the optical assembly through the light transmission hole; the optical receiving chip is located between the reflecting mirror and the circuit board and outside the tube shell assembly, and can receive light from the reflecting mirror.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing.

[0003] To improve the transmission rate of optical modules, the number of transmission channels can be increased. For example, a traditional optical module consisting of one set of optical transmitting submodules (emitting light of one wavelength) and one set of optical receiving submodules (receiving light of one wavelength) can be improved to include two sets of optical transmitting submodules (each emitting light of one wavelength) and two sets of optical receiving submodules (each receiving light of one wavelength). However, this will continuously increase the volume occupied by the optical transmitting and receiving submodules in the optical module, which is detrimental to the further development of optical modules. Summary of the Invention

[0004] This application provides an optical module to solve the problem that the large volume occupied by the optical transmitting sub-module and the optical receiving sub-module in the optical module is not conducive to the miniaturization of the optical module.

[0005] To address the aforementioned technical problems, the embodiments of this application disclose the following technical solutions:

[0006] This application discloses an optical module, comprising: a circuit board with a light receiving chip on its upper surface and a pad on its lower surface; a housing assembly with a downwardly recessed light receiving cavity and a slot on its upper surface, a protrusion between the light receiving cavity and the slot, the protrusion including a light-transmitting hole to connect the light receiving cavity and the slot; a downwardly recessed light emitting cavity on its lower surface; a first fiber optic adapter at one end of the light receiving cavity; a third fiber optic adapter at one end of the light emitting cavity, and a notch at the other end; a light emitting component located in the light emitting cavity, capable of directing light toward the third fiber optic adapter; one end of the circuit board extending into the light emitting cavity through the notch; a pad located in the light emitting cavity and connected to the light emitting component via a wire; an optical component located in the light receiving cavity, capable of receiving light from the first fiber optic adapter; a reflector located at the slot, capable of reflecting light from the optical component through the light-transmitting hole; and a light receiving chip located between the reflector and the circuit board, and outside the housing assembly, capable of receiving light from the reflector.

[0007] In the optical module provided in this application, a light receiving chip is disposed on the upper surface of the circuit board, and a pad electrically connected to the light emitting component is disposed on the lower surface of the circuit board; the housing assembly has a downwardly recessed light receiving cavity and a slot on its upper surface, and an upwardly recessed light emitting cavity on its lower surface; the circuit board extends into the notch of the light emitting cavity. This arrangement allows the light emitting and light receiving components to be stacked on the upper and lower surfaces of the circuit board, respectively. The light-passing holes, fiber optic adapters, etc., realize the optical path. The optical module provided in this application embodiment utilizes the height space, and can integrate more devices while miniaturizing the optical module.

[0008] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0009] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the connection relationship between optical communication terminals;

[0011] Figure 2 This is a schematic diagram of an optical network terminal structure;

[0012] Figure 3 This is a schematic diagram of the structure of an optical module provided in an embodiment of this application;

[0013] Figure 4 An exploded view of an optical module provided in an embodiment of this application;

[0014] Figure 5 This is a schematic diagram illustrating the assembly of a circuit board and an optical sub-module in an optical module, provided as an embodiment of this application.

[0015] Figure 6 An exploded view of the circuit board and optical sub-module in an optical module provided in an embodiment of this application;

[0016] Figure 7 A partial structural diagram of an optical submodule in an optical module provided in an embodiment of this application;

[0017] Figure 8 A schematic diagram of the working principle of DeMUX provided in this application embodiment;

[0018] Figure 9 This is a schematic diagram of the structure of a housing assembly in an optical module provided in an embodiment of this application;

[0019] Figure 10This is a schematic diagram of another angle of the housing assembly in an optical module provided in an embodiment of this application;

[0020] Figure 11 A partial cross-sectional view of a housing assembly in an optical module provided in this application embodiment;

[0021] Figure 12 This is a schematic diagram of the structure of an optical receiving component in an optical module provided in an embodiment of this application;

[0022] Figure 13 This application provides an embodiment of an optical module's optical receiving component as an example of its optical path.

[0023] Figure 14 A cross-sectional view of an optical receiving component in an optical module within a housing assembly, provided as an embodiment of this application;

[0024] Figure 15 A cross-sectional view of the assembly of an optical receiving component and a circuit board in an optical module provided in an embodiment of this application;

[0025] Figure 16 This application provides a schematic diagram of another angle assembly of a circuit board and an optical submodule in an optical module, as shown in an embodiment of the present application.

[0026] Figure 17 This is a schematic diagram showing another angle assembly of a circuit board and an optical sub-module in an optical module, provided as an embodiment of this application.

[0027] Figure 18 This is an exploded view of the circuit board and optical sub-module in an optical module, provided as an embodiment of this application.

[0028] Figure 19 This is a partial structural diagram of an optical submodule in an optical module from another angle, provided in an embodiment of this application.

[0029] Figure 20 This is a schematic diagram of the structure of an optical emitting component in an optical module provided in an embodiment of this application;

[0030] Figure 21 This application provides an embodiment of an optical module and its optical path diagram of an optical emitting component.

[0031] Figure 22 This is a schematic diagram of another angle of the housing assembly in an optical module provided in an embodiment of this application;

[0032] Figure 23 This is an assembly cross-sectional view of the light emitting component and the housing component in an optical module provided in an embodiment of this application. Detailed Implementation

[0033] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0034] One of the core aspects of fiber optic communication is the conversion between optical and electrical signals. Fiber optic communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers / waveguides. The passive transmission characteristics of light in optical fibers / waveguides enable low-cost, low-loss information transmission. In contrast, information processing equipment such as computers uses electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers / waveguides and information processing equipment such as computers, it is necessary to achieve the conversion between electrical and optical signals.

[0035] In the field of fiber optic communication technology, optical modules realize the mutual conversion between optical and electrical signals, which is the core function of optical modules. Optical modules achieve electrical connection with external host computers through gold fingers on their internal circuit boards. The main electrical connections include power supply, I2C signals, data information, and grounding. The gold finger-based electrical connection method has become the mainstream connection method in the optical module industry. Based on this, the pin definitions on the gold fingers have formed various industry protocols / standards.

[0036] Figure 1 This is a schematic diagram illustrating the connection relationships between optical communication terminals. For example... Figure 1 As shown, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

[0037] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103. The connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0038] The optical port of the optical module 200 connects to the external optical fiber 101, establishing a bidirectional optical signal connection with the optical fiber 101. The electrical port of the optical module 200 connects to the external optical network terminal 100, establishing a bidirectional electrical signal connection with the optical network terminal 100. Internally, the optical module performs mutual conversion between optical and electrical signals, thereby establishing an information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, while the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and then input to the optical fiber.

[0039] The optical network terminal has an optical module interface 102 for connecting to the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200; the optical network terminal also has a network cable interface 104 for connecting to the network cable 103 and establishing a bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100. Specifically, the optical network terminal transmits signals from the optical module to the network cable and vice versa, acting as a host computer for the optical module to monitor its operation.

[0040] At this point, the remote server establishes a two-way signal transmission channel with the local information processing equipment via optical fiber, optical module, optical network terminal and network cable.

[0041] Common information processing equipment includes routers, switches, and computers; optical network terminals are the host computers of optical modules, providing data signals to and receiving data signals from optical modules. Other common host computers for optical modules include optical line terminals.

[0042] Figure 2 This is a schematic diagram of an optical network terminal structure. (Example:) Figure 2 As shown, the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for connecting to the electrical port of the optical module such as the gold finger; a heat sink 107 is provided on the cage 106, and the heat sink 107 has a first protrusion such as fins to increase the heat dissipation area.

[0043] The optical module 200 is inserted into the optical network terminal 100, specifically by inserting the electrical port of the optical module into the electrical connector inside the cage 106, and the optical port of the optical module being connected to the optical fiber 101.

[0044] The cage 106 is located on the circuit board and encloses the electrical connectors on the circuit board inside the cage, thus providing electrical connectors inside the cage; the optical module is inserted into the cage and fixed by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

[0045] Figure 3This is a schematic diagram of an optical module structure provided in an embodiment of this application. Figure 4 This is an exploded view of the optical module provided in an embodiment of this application. Figure 3 , Figure 4 As shown, the optical module 200 provided in this application embodiment includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, and an optical sub-module 400.

[0046] The upper shell 201 covers the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally square. Specifically, the lower shell 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper shell includes a cover plate, which covers the two side plates of the upper shell to form the wrapping cavity; the upper shell may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell 201 covers the lower shell 202.

[0047] The two openings can be two openings (204, 205) located at the same end of the optical module, or they can be two openings at different ends of the optical module. One of the openings is the electrical port 204, from which the gold fingers of the circuit board extend and are inserted into the host computer such as the optical network terminal. The other opening is the optical port 205, which is used for external fiber optic access to connect to the optical sub-module 400 inside the optical module. The circuit board 300, the optical sub-module 400, and other optoelectronic devices are located in the encapsulated cavity.

[0048] The assembly method using an upper and lower shell facilitates the installation of components such as the circuit board 300 and optical sub-module 400 into the shell. The upper and lower shells form the outermost protective enclosure of the module. The upper and lower shells are generally made of metal to achieve electromagnetic shielding and heat dissipation. The shell of the optical module is generally not made into a single component, as this would prevent the installation of positioning components, heat dissipation, and electromagnetic shielding components when assembling circuit boards and other components, and would also hinder production automation.

[0049] The unlocking component 203 is located on the outer wall of the enclosing cavity / lower tube shell 202 and is used to realize the fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0050] The unlocking component 203 has a locking component that matches the host computer cage; pulling the end of the unlocking component 203 allows the unlocking component 203 to move relative to the surface of the outer wall; the optical module is inserted into the host computer cage, and the locking component of the unlocking component 203 fixes the optical module in the host computer cage; by pulling the unlocking component 203, the locking component of the unlocking component 203 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module and the host computer, thereby allowing the optical module to be pulled out of the host computer cage.

[0051] The circuit board 300 is equipped with circuit traces, electronic components (such as capacitors, resistors, transistors, MOSFETs) and chips (such as MCUs, laser driver chips, limiting amplifier chips, clock data recovery CDRs, power management chips, and data processing chips DSPs).

[0052] Circuit board 300 is used to provide signal circuits for electrical connections, which can provide signals. Circuit board 300 connects the electrical components in the optical module together according to the circuit design through circuit traces to realize electrical functions such as power supply, electrical signal transmission and grounding.

[0053] Circuit boards are generally rigid circuit boards. Due to their relatively rigid material, rigid circuit boards can also perform load-bearing functions. For example, rigid circuit boards can stably support chips. When optical transceiver components are located on the circuit board, rigid circuit boards can also provide stable support. Rigid circuit boards can also be inserted into electrical connectors in the host computer cage. Specifically, metal pins / gold fingers are formed on one end surface of the rigid circuit board for connection with electrical connectors. These are things that flexible circuit boards cannot easily achieve.

[0054] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards, such as connecting rigid circuit boards to optical transceiver components using flexible circuit boards.

[0055] Optical transmitting submodules and optical receiving submodules can be collectively referred to as optical submodules, such as... Figure 4 As shown, the optical module provided in this embodiment includes an optical emitting sub-module and an optical receiving sub-module, which are integrated into an optical sub-module. That is, the optical sub-module 400 integrates an optical emitting component and an optical receiving component. Optionally, the optical emitting component is closer to the lower housing 202 than the optical receiving component, but this is not limited to this; the optical receiving component may also be closer to the lower housing 202 than the optical emitting component.

[0056] Optionally, the circuit board 300 can be directly inserted into the optical sub-module 400 and electrically connected to the light emitting component and light receiving component in the optical sub-module 400; alternatively, the optical sub-module 400 can be physically separated from the circuit board 300 and connected to the circuit board via a flexible circuit board.

[0057] When the light emitting component is closer to the lower housing 202 than the light receiving component, both the light emitting component and the light receiving component are integrated in the inner cavity of the optical sub-module 400, and the light emitting component and the light receiving component are separated by a partition. The optical sub-module 400 is set in the enclosed cavity formed by the upper housing 201 and the lower housing 202.

[0058] Figure 5 This is an assembly diagram of an optical submodule 400 and a circuit board 300 in an optical module according to an embodiment of this application. Figure 6 This is an exploded view of the optical submodule 400 and circuit board 300 in an optical module provided in an embodiment of this application. Figure 5 , Figure 6 As shown, the optical sub-module 400 includes a housing assembly 410. The upper surface of the housing assembly includes a downwardly recessed light receiving cavity and a slot. A protrusion is provided between the light receiving cavity and the slot. The protrusion includes a light-transmitting hole to connect the light receiving cavity and the slot. The lower surface of the housing assembly includes an upwardly recessed light emitting cavity. A partition is formed in the middle of the housing assembly.

[0059] The light emitting component is located in the light emitting cavity; the optical component is located in the light receiving cavity. Both the light emitting and receiving components are housed within the inner cavity of the housing assembly 410, stacked vertically. They are separated by a partition within the housing assembly 410, with the light receiving component positioned above the partition and the light emitting component below it. One end of the circuit board 300 is inserted into the housing assembly 410. The light emitting and receiving components are electrically connected to the circuit board, enabling the light emitting component to perform electro-optical conversion, emitting signal light, and the light receiving component to receive the signal light, thus achieving photoelectric conversion.

[0060] In this embodiment, "above" refers to the direction of the upper housing 201 relative to the circuit board 300, and "below" refers to the direction of the lower housing 202 relative to the circuit board 300. The inner cavity of the optical sub-module 400 is divided into a light-receiving cavity and a lower cavity by a partition. The light-receiving component is disposed in the light-receiving cavity, and the light-emitting component is disposed in the lower cavity. Multiple fiber optic adapters are disposed on the left side of the optical sub-module 400. The light-emitting component is connected to one fiber optic adapter, which transmits the signal light emitted by the light-emitting component to an external optical fiber, thus realizing the transmission of the signal light. The light-receiving component is connected to another fiber optic adapter, which transmits the signal light transmitted from the external optical fiber to the light-receiving component, thus realizing the reception of the signal light.

[0061] Because the overall size of the optical module must conform to the interface size of the host computer, which is restricted by industry standards, and the optical sub-module 400 is too large to be placed on the circuit board 300, one end of the circuit board 300 is inserted into the housing assembly 410 to achieve electrical connection between the optical sub-module 400 and the circuit board 300; alternatively, the circuit board 300 and the optical sub-module 400 can be separated, and electrical connection relay can be achieved through a flexible circuit board.

[0062] The upper part of the housing assembly 410 is provided with a light receiving cavity and a light receiving cover plate, with the cover plate closing onto the light receiving cavity from above. The light receiving cavity contains a third collimating lens, an optical multiplexing assembly, and other light receiving-related devices. A fiber optic adapter is located on the left side of the housing assembly 410. One end of the light receiving cavity is connected to the fiber optic adapter, which receives signal light from outside the optical module and transmits the received signal light to the light receiving chip via lenses and other optical devices within the light receiving cavity. A notch is provided on the side of the housing assembly 410 facing the circuit board 300, through which the circuit board 300 is inserted. The surface of the circuit board 300 contains an optical receiving chip, a transimpedance amplifier, and other electrical devices located outside the housing assembly. The light beam transmitted through the lenses within the light receiving cavity enters the light receiving chip on the circuit board 300, where photoelectric conversion is achieved.

[0063] In the optical module provided in this application embodiment, the optical receiving component within the optical sub-module 400 is used to receive signal light of various wavelengths. Signal light of different wavelengths is transmitted to the optical receiving cavity via an optical fiber adapter. Within the optical receiving cavity, optical devices such as a wavelength demultiplexing and multiplexing component (DeMUX) achieve wavelength-based beam splitting. The wavelength-splittered signal light is then transmitted to the photosensitive surface of the corresponding optical receiving chip, which receives the signal light through its photosensitive surface. Typically, one optical receiving chip is used to receive signal light of one wavelength. Therefore, the optical receiving component provided in this application embodiment includes multiple optical receiving chips to form a chip array. For example, when the optical receiving component is used to receive signal light of four different wavelengths, the optical receiving component includes four optical receiving chips to receive the corresponding four wavelengths; when the optical receiving component is used to receive signal light of eight different wavelengths, the optical receiving component includes eight optical receiving chips to receive the corresponding eight wavelengths.

[0064] Figure 7 This is a schematic diagram of the structure of an optical submodule 400 in an optical module provided in an embodiment of this application. Figure 7As shown, the optical sub-module 400 provided in this embodiment integrates two sets of light receiving components. The upper part of the housing assembly 410 is provided with a first light receiving cavity 4101 and a second light receiving cavity 4102. The first light receiving cavity 4101 and the second light receiving cavity 4102 are arranged side by side, that is, the first light receiving cavity 4101 and the second light receiving cavity 4102 are arranged front and back along the width direction of the housing assembly 410. The first light receiving cavity 4101 is located on the front side of the housing assembly 410, and the second light receiving cavity 4102 is located on the rear side of the housing assembly 410. The first optical receiving cavity 4101 is equipped with a first collimating lens and a first wave demultiplexing component 4201. A first fiber optic adapter 601 is located on the left side of the housing assembly 410. The signal light transmitted by the first fiber optic adapter 601 is converted into a collimated beam by the first collimating lens, and the collimated beam is transmitted to the first wave demultiplexing component 4201. The first wave demultiplexing component 4201 splits the collimated beam into multiple signal beams of different wavelengths. The second optical receiving cavity 4102 is equipped with a second collimating lens and a second wave demultiplexing component 4202. A second fiber optic adapter 602 is located on the left side of the housing assembly 410. The signal light transmitted by the second fiber optic adapter 602 is converted into a collimated beam by the second collimating lens, and the collimated beam is transmitted to the second wave demultiplexing component 4202. The second wave demultiplexing component 4202 splits the collimated beam into multiple signal beams of different wavelengths.

[0065] Figure 8 This application provides a schematic diagram of the working principle of a DeMUX for beam splitting of beams including four wavelengths (β1, β2, β3, and β4). The wave demultiplexing component includes an input port on the left for incident signal light of multiple wavelengths, and multiple output ports on the right for emitting signal light, each output port emitting signal light of one wavelength. Figure 8 As shown, signal light enters the DeMUX through its input port. Signal light β1 undergoes six different reflections at six different locations on the DeMUX before reaching its output port; signal light β2 undergoes four different reflections at four different locations on the DeMUX before reaching its output port; signal light β3 undergoes two different reflections at two different locations on the DeMUX before reaching its output port; and signal light β4 is directly transmitted to its output port after entering the DeMUX. Thus, the DeMUX enables signal light of different wavelengths to enter through the same input port and exit through different output ports, thereby achieving beam splitting of signal light of different wavelengths. In this embodiment, the DeMUX is not limited to beam splitting with four wavelengths; it can be selected according to actual needs.

[0066] Figure 9 This is a schematic diagram of the structure of the housing assembly 410 in an optical module provided in an embodiment of this application. Figure 10This is a schematic diagram of another angle of the housing assembly 410 in an optical module provided in an embodiment of this application. (See attached diagram.) Figure 9 , Figure 10 As shown, the left side wall of the housing assembly 410 is provided with a first through hole 4112 and a second through hole 4113. The first optical fiber adapter 601 is connected to the first optical receiving cavity 4101 through the first through hole 4112. The first collimating lens is disposed between the first through hole 4112 and the first wave demultiplexing assembly 4201. The second optical fiber adapter 602 is connected to the second optical receiving cavity 4102 through the second through hole 4113. The second collimating lens is disposed between the second through hole 4113 and the second wave demultiplexing assembly 4202.

[0067] The first optical receiving cavity 4101 includes a base plate and side plates surrounding the base plate. The base plate and side plates form a cavity structure for housing and accommodating the first collimating lens and the first wave demultiplexing assembly 4201. A first cover plate fixing groove 4101a is provided on the top of the side plate of the first optical receiving cavity 4101, allowing the first cover plate 401 to be fixedly connected to the first optical receiving cavity 4101 with adhesive. Optionally, the first cover plate fixing groove 4101a forms a closed-loop structure on the top of the side plate of the first optical receiving cavity 4101, thereby increasing the adhesive area of ​​the first cover plate 401 on the top of the side plate of the first optical receiving cavity 4101, and fully ensuring the sealing reliability of the first cover plate 401 and the top of the side plate of the first optical receiving cavity 4101. Furthermore, a first repair port 4101b is provided on the top of the side plate of the first optical receiving cavity 4101. The first repair port 4101b is located at the top edge of the side plate of the first optical receiving cavity 4101 and is connected to the first cover plate fixing groove 4101a. When the first cover plate 401 and the first optical receiving cavity 4101 are encapsulated and the internal components of the first optical receiving cavity 4101 need to be repaired, the first cover plate 401 can be removed from the first optical receiving cavity 4101 through the first repair port 4101b. This allows the first cover plate 401 to be removed without damaging the first cover plate 401 or the first optical receiving cavity 4101, reducing the difficulty and cost of repair.

[0068] Similarly, the second optical receiving cavity 4102 includes a base plate and side plates surrounding the base plate. The base plate and side plates together form a cavity structure for housing the second collimating lens and the second wave demultiplexing assembly 4202. A second cover plate fixing groove 4102a is provided on the top of the side plate of the second optical receiving cavity 4102, allowing the second cover plate 402 to be fixedly connected to the second optical receiving cavity 4102 with adhesive. Optionally, the second cover plate fixing groove 4102a forms a closed-loop structure on the top of the side plate of the second optical receiving cavity 4102, thereby increasing the adhesive area of ​​the second cover plate 402 on the top of the side plate of the second optical receiving cavity 4102, ensuring the reliable encapsulation of the second cover plate 402 and the top of the side plate of the second optical receiving cavity 4102. Furthermore, a second repair port 4102b is also provided on the top of the side plate of the second optical receiving cavity 4102. The second repair port 4102b is located at the top edge of the side plate of the second optical receiving cavity 4102 and is connected to the second cover plate fixing groove 4102a. When the second cover plate 402 and the second optical receiving cavity 4102 are encapsulated and the internal components of the second optical receiving cavity 4102 need to be repaired, the second cover plate 402 can be removed from the second optical receiving cavity 4102 through the second repair port 4102b. This allows the second cover plate 402 to be removed without damaging the second cover plate 402 or the second optical receiving cavity 4102, reducing the difficulty and cost of repair.

[0069] In some embodiments, a first DeMUX fixing adhesive tray 4108 is provided on the base plate of the first optical receiving cavity 4101. The first DeMUX fixing adhesive tray 4108 is used to hold adhesive. For example, when it is necessary to fix the first wave demultiplexing component 4201, adhesive is applied to the first DeMUX fixing adhesive tray 4108, and then the first wave demultiplexing component 4201 is installed on the first DeMUX fixing adhesive tray 4108. The adhesive solidifies to fix the first wave demultiplexing component 4201 on the base plate. Similarly, a second DeMUX fixing adhesive tray 4110 is provided on the base plate of the second optical receiving cavity 4102. The second DeMUX fixing adhesive tray 4110 is used to hold adhesive. For example, when it is necessary to fix the second wave decomposition and reuse component 4202, glue is applied to the second DeMUX fixing glue tank 4110, and then the second wave decomposition and reuse component 4202 is installed on the second DeMUX fixing glue tank 4110. The glue solidifies to fix the second wave decomposition and reuse component 4202 on the base plate.

[0070] The bottom surface of the optical receiving cavity forms an annular protrusion DeMUX fixing groove. Wavelength demultiplexing components are mounted on the annular protrusion, and adhesive is placed in the groove enclosed by the annular protrusion to bond the wavelength demultiplexing components.

[0071] In this embodiment of the application, the casing assembly 410 is provided with a first slot 4103 and a second slot 4104 on the side facing the circuit board 300. The first slot 4103 and the second slot 4104 are arranged back and forth along the width direction of the casing assembly 410. The first slot 4103 and the second slot 4104 are open at the top and right. The first slot 4103 and the second slot 4104 are separated by a partition plate 4111. A first light receiving component 430 is provided in the first slot 4103 and a second light receiving component 440 is provided in the second slot 4104. Taking the reception of eight wavelengths of light across two bands as an example, each band includes four wavelengths. The signal light transmitted by the first fiber optic adapter 601 is converted into a collimated beam by the first collimating lens. The collimated beam is then demultiplexed into four beams of different wavelengths by the first demultiplexing component 4201. The four beams of different wavelengths are transmitted to the first optical receiving component 430, where photoelectric conversion is achieved. Similarly, the signal light transmitted by the second fiber optic adapter 602 is converted into a collimated beam by the second collimating lens. The collimated beam is then demultiplexed into four beams of different wavelengths by the second demultiplexing component 4202. The four beams of different wavelengths are transmitted to the second optical receiving component 440, where photoelectric conversion is achieved.

[0072] Figure 11 This is a partial cross-sectional view of a housing assembly 410 in an optical module provided as an embodiment of this application. Figure 11 As shown, the first optical receiving cavity 4101 and the first slot 4103 are connected through light-transmitting holes 4109. Specifically, multiple light-transmitting holes 4109 are provided between the right side wall of the first optical receiving cavity 4101 and the left side wall of the first slot 4103. Multiple beams of different wavelengths demultiplexed by the first wave demultiplexing component 4201 within the first optical receiving cavity 4101 are transmitted to the first optical receiving component 430 through the corresponding light-transmitting holes 4109. Similarly, the second optical receiving cavity 4102 and the second slot 4104 are connected through light-transmitting holes. Specifically, multiple light-transmitting holes 4109 are provided between the right side wall of the second optical receiving cavity 4102 and the left side wall of the second slot 4104. Multiple beams of different wavelengths demultiplexed by the second wave demultiplexing component 4202 within the second optical receiving cavity 4102 are transmitted to the second optical receiving component 440 through the corresponding light-transmitting holes 4109.

[0073] In this embodiment, the first wave demultiplexing component 4201 is used to demultiplex a beam of light into four beams of different wavelengths. Therefore, four light-transmitting holes 4109 are provided between the first optical receiving cavity 4101 and the first slot 4103. The four light-transmitting holes 4109 are arranged sequentially along the width direction of the housing component 410. The four output optical ports of the first wave demultiplexing component 4201 are arranged in a one-to-one correspondence with the four light-transmitting holes 4109. Thus, the four beams of different wavelengths demultiplexed by the first wave demultiplexing component 4201 are transmitted to the first optical receiving component 430 through the corresponding light-transmitting holes 4109. Similarly, the second wave demultiplexing component 4202 is used to demultiplex a beam of light into four beams of different wavelengths. Therefore, four light-transmitting holes 4109 are provided between the second optical receiving cavity 4102 and the second slot 4104. These four light-transmitting holes 4109 are arranged sequentially along the width direction of the housing assembly 410. The four output optical ports of the second wave demultiplexing component 4202 are arranged in a one-to-one correspondence with the four light-transmitting holes 4109. In this way, the four beams of different wavelengths demultiplexed by the second wave demultiplexing component 4202 are transmitted to the second optical receiving component 440 through the corresponding light-transmitting holes 4109.

[0074] In this embodiment, the first optical receiving cavity 4101 and the first slot 4103 can also be directly connected to form an integrated cavity. A first collimating lens and a first wave demultiplexing component 4201 are provided on the side of the integrated cavity near the first optical fiber adapter 601, and a first optical receiving component 430 is provided on the side of the integrated cavity near the circuit board 300. In this way, the signal light transmitted by the first optical fiber adapter 601 is converted into a collimated beam by the first collimating lens, and the collimated beam is demultiplexed into four beams of different wavelengths by the first wave demultiplexing component 4201. The four beams of different wavelengths are directly transmitted to the first optical receiving component 430. Similarly, the second optical receiving cavity 4102 and the second slot 4104 can be directly connected to the integrated cavity. A second collimating lens and a second wave demultiplexing component 4202 are provided on the side of the integrated cavity near the second optical fiber adapter 602, and a second optical receiving component 440 is provided on the side of the integrated cavity near the circuit board 300. In this way, the signal light transmitted by the second optical fiber adapter 602 is converted into a collimated beam by the second collimating lens, and the collimated beam is demultiplexed into four beams of different wavelengths by the second wave demultiplexing component 4202. The four beams of different wavelengths are directly transmitted to the second optical receiving component 440.

[0075] Compared to connecting the first optical receiving cavity 4101 and the first slot 4103 into a single cavity, the method of connecting the first optical receiving cavity 4101 and the first slot 4103 through the light-transmitting hole 4109 can reduce the processing of the housing assembly 410, retain more of the structure of the housing assembly 410, and allow the heat generated by the optoelectronic devices of the optical receiving assembly and the optical emitting assembly to be conducted to the upper housing 201 and the lower housing 202 through the un-drilled area on the housing assembly 410, thereby increasing the heat dissipation efficiency of the optical sub-module 400.

[0076] Figure 12 This is a schematic diagram of the structure of an optical receiving component within an optical submodule 400 of an optical module, provided in an embodiment of this application. Figure 13 This is a schematic diagram of the optical path of an optical receiving component within an optical submodule 400 of an optical module, provided as an embodiment of this application. Figure 12 , Figure 13 As shown, the first optical receiving component 430 and the second optical receiving component 440 each include a plurality of optical receiving chips. These optical receiving chips are PDs (photodetectors), such as APDs (avalanche diodes), used to convert received signal light into photocurrent. Optionally, the optical receiving chips in the first optical receiving component 430 and the second optical receiving component 440 are respectively disposed on a metallized ceramic surface. A circuit pattern is formed on the metallized ceramic surface to supply power to the optical receiving chips. The metallized ceramic surface with the optical receiving chips is then mounted on a circuit board 300, or the optical receiving chips are mounted on a flexible circuit board, which is electrically connected to the circuit board 300.

[0077] In this embodiment, the first optical receiving component 430 and the second optical receiving component 440 further include transimpedance amplifiers. The transimpedance amplifiers are directly mounted on the circuit board 300 and connected to corresponding optical receiving chips. They receive current signals generated by the optical receiving chips and convert the received current signals into voltage signals. Optionally, the transimpedance amplifiers are connected to the corresponding optical receiving chips via wire bonding, such as through gold wire bonding.

[0078] Specifically, the first optical receiving component 430 includes a first ceramic substrate 4304 and a first transimpedance amplifier 4305. The first transimpedance amplifier 4305 is placed on one side of the first ceramic substrate 4304, that is, the first transimpedance amplifier 4305 is located on the right side of the first ceramic substrate 4304. Four first optical receiving chips 4303 are disposed on the first ceramic substrate 4304, and the first transimpedance amplifier 4305 is connected to the first ceramic substrate 4304 via wire bonding to achieve the connection between the first optical receiving chips 4303 and the first transimpedance amplifier 4305. The longer the wire bonding length, the greater the inductance generated by the wire bonding, and the greater the signal mismatch will be. Since the signal output by the first optical receiver chip 4303 is a small signal, it will cause a decrease in signal quality. Therefore, the first optical receiver chip 4303 and the first transimpedance amplifier 4305 should be as close as possible to reduce the wire bonding length and ensure signal transmission quality. Thus, the first transimpedance amplifier 4305 is placed on one side of the first ceramic substrate 4304, so that the first ceramic substrate 4304 and the first transimpedance amplifier 4305 are as close as possible.

[0079] In this embodiment, the first ceramic substrate 4304 is also used to elevate the first light receiver chip 4303, so that the electrodes of the first light receiver chip 4303 and the pins on the first transimpedance amplifier 4305 are on the same plane, ensuring that the bonding wire between the first light receiver chip 4303 and the first transimpedance amplifier 4305 is minimized.

[0080] Similarly, the second optical receiving component 440 includes a second ceramic substrate 4404 and a second transimpedance amplifier 4405. The second transimpedance amplifier 4405 is placed on one side of the second ceramic substrate 4404, that is, the second transimpedance amplifier 4405 is located on the right side of the second ceramic substrate 4404. Four second optical receiving chips 4403 are disposed on the second ceramic substrate 4404, and the second transimpedance amplifier 4405 is connected to the second ceramic substrate 4404 via wire bonding to achieve the connection between the second optical receiving chips 4403 and the second transimpedance amplifier 4405. The longer the wire bonding length, the greater the inductance generated by the wire bonding, and the greater the signal mismatch will be. Since the signal output by the second optical receiver chip 4403 is a small signal, it will cause a decrease in signal quality. Therefore, the second optical receiver chip 4403 and the second transimpedance amplifier 4405 should be as close as possible to reduce the wire bonding length and ensure signal transmission quality. Thus, the second transimpedance amplifier 4405 is placed on one side of the second ceramic substrate 4404, so that the second ceramic substrate 4404 and the second transimpedance amplifier 4405 are as close as possible.

[0081] In this embodiment, the second ceramic substrate 4404 is also used to elevate the second light receiver chip 4403, so that the electrodes of the second light receiver chip 4403 and the pins on the second transimpedance amplifier 4405 are on the same plane, ensuring that the bonding wire between the second light receiver chip 4403 and the second transimpedance amplifier 4405 is minimized.

[0082] In this embodiment, if there are enough pins for the transimpedance amplifier, the first transimpedance amplifier 4305 and the second transimpedance amplifier 4405 can be a single transimpedance amplifier chip. Furthermore, the four first optical receiver chips 4303 and the four second optical receiver chips 4403 can be disposed on a ceramic substrate.

[0083] To facilitate the optical receiving chip's reception of signal light, the first optical receiving component 430 further includes a first lens component 4301, which is used to adjust the optical path during the transmission of four different wavelength beams output from the first wave demultiplexing component 4201 to the first optical receiving component 430; the second optical receiving component 440 further includes a second lens component 4401, which is used to adjust the optical path during the transmission of four different wavelength beams output from the second wave demultiplexing component 4202 to the second optical receiving component 440.

[0084] In this embodiment, the optical axis of the first lens assembly 4301 is parallel to the bottom surface of the first slot 4103, and the photosensitive surface of the first light receiving chip 4303 is also parallel to the bottom surface of the first slot 4103. However, the first light receiving chip 4303 is disposed on the upper surface of the circuit board 300, and there is a height difference between the bottom surface of the first slot 4103 and the upper surface of the circuit board 300. Therefore, in order to ensure that the first light receiving chip 4303 can normally receive signal light, the first light receiving assembly 430 also includes a first reflector 4302. A reflector 4302 is disposed above the first ceramic substrate 4304, covering the four first light receiving chips 4303 disposed on the first ceramic substrate 4304. The reflective surface of the first reflector 4302 changes the optical axis direction of the signal light emitted by the first lens assembly 4301, so that the optical axis of the signal light emitted by the first lens assembly 4301 changes from being parallel to the bottom surface of the first slot 4103 to being perpendicular to the bottom surface of the first slot 4103, thereby making the signal light perpendicularly incident on the photosensitive surface of the corresponding first light receiving chip 4303.

[0085] The signal light transmitted to the first optical receiving cavity 4101 via the first optical fiber adapter 601 is converted into a collimated beam after passing through the first collimating lens. The collimated beam enters the first demultiplexing assembly 4201, and is demultiplexed into four beams of different wavelengths by the second demultiplexing assembly 4202. The four beams of different wavelengths are transmitted through corresponding light-transmitting holes 4109 to the corresponding lenses of the first lens assembly 4301 in the first slot 4103. After being focused by the corresponding lenses, they are transmitted to the first... A first reflector 4302 is used. When four beams of light of different wavelengths are transmitted to the reflective surface of the first reflector 4302, the transmission direction of the beams is changed from parallel to the bottom surface of the first slot 4103 to perpendicular to the bottom surface of the first slot 4103. The four beams of light after the change are transmitted to the corresponding first light receiving chip 4303 on the first ceramic substrate 4304 below the reflective surface of the first reflector 4302, and photoelectric conversion is realized through the first light receiving chip 4303.

[0086] Similarly, the optical axis of the second lens assembly 4401 is parallel to the bottom surface of the second slot 4104, and the photosensitive surface of the second light receiving chip 4401 is also parallel to the bottom surface of the second slot 4104. However, since the second light receiving chip 4401 is disposed on the upper surface of the circuit board 300, there is a height difference between the bottom surface of the second slot 4104 and the upper surface of the circuit board 300. Therefore, in order to ensure that the second light receiving chip 4401 can normally receive signal light, the second light receiving assembly 440 preferably includes a second reflector 4402. The mirror 4402 is disposed above the second ceramic substrate 4404, covering the four second light receiving chips 4403 disposed on the second ceramic substrate 4404. The reflective surface of the second mirror 4402 changes the optical axis direction of the signal light emitted from the second lens assembly 4401, so that the optical axis of the signal light emitted from the second lens assembly 4401 changes from being parallel to the bottom surface of the second slot 4104 to being perpendicular to the bottom surface of the second slot 4104, thereby making the signal light perpendicularly incident on the photosensitive surface of the corresponding second light receiving chip 4403.

[0087] Figure 14 This is a cross-sectional view of a second optical receiving component 440 in an optical module within a housing assembly 410, provided as an embodiment of this application. Figure 15 This is a cross-sectional view showing the assembly of a second optical receiving component 440, a housing component 410, and a circuit board 300 in an optical module provided in an embodiment of this application. Figure 14 , Figure 15As shown, the signal light transmitted to the second optical receiving cavity 4102 via the second fiber optic adapter 602 is converted into a collimated beam after passing through the first collimating lens. The collimated beam enters the second demultiplexing assembly 4202, where it is demultiplexed into four beams of different wavelengths. These four beams are then transmitted through corresponding light-transmitting holes 4109 to the corresponding lenses of the second lens assembly 4401 within the second slot 4104. After being focused by the respective lenses, the beams are transmitted to... When four beams of light of different wavelengths are transmitted to the reflective surface of the second reflector 4402, the transmission direction of the beams is changed from parallel to the bottom surface of the second slot 4104 to perpendicular to the bottom surface of the second slot 4104 after reflection by the reflective surface of the second reflector 4402. The four beams of light after the change of direction are transmitted to the corresponding second light receiving chip 4403 on the second ceramic substrate 4404 below the reflective surface of the second reflector 4402, and photoelectric conversion is realized by the second light receiving chip 4403.

[0088] In this embodiment, both the first reflector 4302 and the second reflector 4402 are 45° reflectors, meaning that each of the first reflector 4302 and the second reflector 4402 includes a 45° reflective surface. The 45° reflective surface of the first reflector 4302 covers the four first light receiving chips 4303 disposed on the first ceramic substrate 4304, and the 45° reflective surface of the second reflector 4402 covers the four second light receiving chips 4403 disposed on the second ceramic substrate 4404.

[0089] Since the first slot 4103 and the second slot 4104 are slots with openings at the top, in order to protect the first lens assembly 4301 and the first reflector 4302 in the first slot 4103 and the second lens assembly 4401 and the second reflector 4402 in the second slot 4104, a cover 500 is provided above the first slot 4103 and the second slot 4104. The left and lower sides of the cover 500 are open, its left side is connected to the protrusion of the tube shell assembly, and its lower side is connected to the circuit board.

[0090] After the first lens assembly 4301 and the first reflector 4302 are installed into the first slot 4103 according to the optical path of the first light receiving assembly 430, and the second lens assembly 4401 and the second reflector 4402 are installed into the second slot 4104 according to the optical path of the second light receiving assembly 440, the cover 500 is placed downwards to cover the first slot 4103, the second slot 4104 and the light receiving chip. The lower opening of the cover 500 is in contact with the upper surface of the circuit board 300. The upper surface, front side and rear side of the cover 500 are respectively located on the same plane as the upper surface, front side and rear side of the housing assembly 410, so that the first slot 4103, the second slot 4104 and the cover 500 form a cavity, thereby placing the first light receiving assembly 430 and the second light receiving assembly 440 in the cavity.

[0091] The casing assembly 410 has a first notch 4114 on the side near the circuit board 300. This first notch 4114 is located below the first slot 4103 and the second slot 4104, and the bottom surface of the first notch 4114 is parallel to the bottom surfaces of the first slot 4103 and the second slot 4104. Thus, when one end of the circuit board 300 is inserted into the first notch 4114, the surface of the circuit board 300 is parallel to the bottom surfaces of the first slot 4103 and the second slot 4104. The first ceramic substrate 4 is mounted on the circuit board 300. 304. The first transimpedance amplifier 4305, the second ceramic substrate 4404, and the second transimpedance amplifier 4405 are also parallel to the bottom surfaces of the first slot 4103 and the second slot 4104, so that the first reflector 4302 can reflect the light beam focused by the first lens assembly 4301 to the corresponding first light receiving chip 4303 on the first ceramic substrate 4304, and the second reflector 4402 can reflect the light beam focused by the second lens assembly 4401 to the corresponding second light receiving chip 4403 on the second ceramic substrate 4404.

[0092] A second notch is provided between the bottom surfaces of the first notch 4114 and the first slot 4103 and the second slot 4104. The lower side of the second notch is connected to the first notch 4114, and the right side of the second notch is open. An aluminum nitride ceramic substrate 800 is disposed inside the second notch. One side of the aluminum nitride ceramic substrate 800 contacts the inner wall of the second notch, and the other side contacts the upper surface of the circuit board 300. Specifically, the upper surface of the aluminum nitride ceramic substrate 800 contacts the upper sidewall of the second notch, and its lower surface contacts the upper surface of the circuit board 300. The gaps between the aluminum nitride ceramic substrate 800 and the housing assembly 410, and between the aluminum nitride ceramic substrate 800 and the circuit board 300, are filled with insulating high thermal conductivity adhesive. As shown in the heat conduction path, the heat generated by the first optical receiver chip 4303 is conducted to the circuit board 300 through the first ceramic substrate 4304. The heat generated by the first transimpedance amplifier 4305 is directly conducted to the circuit board 300. The heat generated by the second optical receiver chip 4403 is conducted to the circuit board 300 through the second ceramic substrate 4404. The heat generated by the second transimpedance amplifier 4405 is directly conducted to the circuit board 300. The heat conducted to the circuit board 300 is conducted to the housing assembly 410 through the copper-clad aluminum nitride ceramic substrate 800 on the circuit board 300. Then, it is conducted to the upper housing 201 and lower housing 202 of the optical module for heat dissipation, which improves the heat dissipation efficiency of the optical receiver component integrated in the optical submodule 400.

[0093] The first transimpedance amplifier 4305 and the second transimpedance amplifier 4405 can be mounted on the circuit board 300. Alternatively, the first transimpedance amplifier 4305 can be mounted on a heat sink, which is then mounted on the upper surface of the circuit board 300. In this way, the heat sink can not only conduct the heat generated by the first transimpedance amplifier 4305 to the circuit board 300, but also elevate the first transimpedance amplifier 4305 so that it is on the same plane as the first optical receiver chip 4303. Similarly, the second transimpedance amplifier 4405 can be mounted on a heat sink, which is then mounted on the upper surface of the circuit board 300. In this way, the heat sink can not only conduct the heat generated by the second transimpedance amplifier 4405 to the circuit board 300, but also elevate the second transimpedance amplifier 4405 so that it is on the same plane as the second optical receiver chip 4403.

[0094] In this embodiment, the optical sub-module 400 integrates both a light receiving component and a light emitting component. The light receiving component and the light emitting component are separated by a partition, with the light receiving component integrated above the partition and the light emitting component integrated below the partition.

[0095] Figure 16 This is a schematic diagram showing another angle of assembly between the circuit board 300 and the optical sub-module 400 in an optical module, provided as an embodiment of this application. Figure 17 This is a schematic diagram showing another angle of assembly between a circuit board 300 and an optical sub-module 400 in an optical module, provided as an embodiment of this application. Figure 18 This is a partially exploded view of a circuit board 300 and an optical sub-module 400 in an optical module provided as an embodiment of this application. Figure 16 , Figure 17 , Figure 18 As shown, the lower part of the housing assembly 410 is provided with a light emitting cavity and a third cover plate 403. The third cover plate 403 covers the light emitting cavity from below. The light emitting cavity is provided with a lens, a light emitting chip, and other optoelectronic devices related to light emission. The housing assembly 410 has a first notch 4114 on the side facing the circuit board 300. The circuit board 300 is inserted into the housing assembly 410 through the first notch 4114. The lower surface of the circuit board is provided with pads. The light emitting components are connected to the pads through wires. In this way, the light emitting chip and other electrical devices in the light emitting cavity are electrically connected to the circuit board 300 to drive the light emitting chip to achieve electro-optical conversion.

[0096] In the optical module provided in this application embodiment, the optical emitting component within the optical submodule 400 is used to emit signal light of multiple different wavelengths. The signal light of different wavelengths is combined by optical devices such as a wavelength division multiplexing component (MUX) within the optical emitting cavity. The combined beam is then transmitted to an external optical fiber via an optical fiber adapter to achieve signal light emission. Typically, one optical emitting chip is used to emit signal light of one wavelength. Therefore, the optical emitting component provided in this application embodiment includes multiple optical emitting chips to form a chip array. For example, when the optical emitting component is used to emit signal light of four different wavelengths, the optical emitting component includes four optical emitting chips to correspondingly emit the four different wavelengths of signal light; when the optical emitting component is used to emit signal light of eight different wavelengths, the optical emitting component includes eight optical emitting chips to correspondingly emit the eight different wavelengths of signal light.

[0097] Figure 19 This is another structural schematic diagram of the housing assembly 410 in an optical module provided in an embodiment of this application. (See attached diagram.) Figure 19 As shown, in the optical submodule 400, the optical emitting cavity 4115 includes optical devices such as a wavelength division multiplexing component 460. Multiple light beams of different wavelengths emitted by the optical emitting chip are transmitted to the wavelength division multiplexing component 460. The wavelength division multiplexing component 460 multiplexes the multiple light beams of different wavelengths into a composite beam. The composite beam is transmitted to an external optical fiber through an optical fiber adapter.

[0098] In this embodiment, the wavelength division multiplexing (WDM) component 460 includes four input ports on the right side for incident signal light of multiple wavelengths, and one output port on the left side for emitted light. Each input port is used for incident signal light of one wavelength. Specifically, multiple signal lights of different wavelengths enter the WDM component 460 through their respective input ports. One beam of signal light undergoes six different reflections at six different locations within the WDM component 460 to reach the output port; another beam of signal light undergoes four different reflections at four different locations within the WDM component to reach the output port; another beam of signal light undergoes two different reflections at two different locations within the WDM component to reach the output port; and yet another beam of signal light is directly transmitted to the output port after being incident on the WDM component 460. Thus, the WDM component enables signal light of different wavelengths to enter the WDM component through different input ports and exit through the same output port, thereby achieving beam combining of different wavelength signal lights. In this embodiment, the WDM component is not limited to combining four wavelength beams; it can be selected according to actual needs.

[0099] This application embodiment provides an optical submodule 400 integrating two sets of optical emitting components. A light emitting cavity 4115 is disposed at the lower part of the housing assembly 410. The light emitting cavity 4115 houses a converging lens, a wavelength division multiplexing (WDM) assembly 460, and the optical emitting components. An optical fiber adapter is disposed on the left side of the housing assembly 410, and this adapter is connected to the optical emitting cavity 4115. The WDM assembly 460 is disposed on the side of the optical emitting cavity 4115 near the optical fiber adapter, and the optical emitting components are disposed on the side of the optical emitting cavity 4115 near the circuit board 300. The converging lens is disposed between the optical fiber adapter and the WDM assembly 460. Thus, multiple different wavelengths of signal light emitted by the optical emitting components are transmitted to the WDM assembly 460, which multiplexes these beams into a single composite beam. This composite beam is then coupled to the optical fiber adapter via the converging lens, thereby achieving the emission of multiple different wavelengths of light.

[0100] Figure 20 This is a schematic diagram of the structure of a light emitting component within an optical submodule 400 of an optical module, provided in an embodiment of this application. Figure 21 This is a schematic diagram of the optical path of an optical emitting component in an optical module, provided as an embodiment of this application. Figure 20 , Figure 21As shown, the optical emitting cavity 4115 includes a base plate and a side plate surrounding the base plate. The base plate and the side plate form a cavity structure for accommodating the wavelength division multiplexing component 460 and the optical emitting component. The optical emitting component includes a first optical emitting component 470 and a second optical emitting component 480. The first optical emitting component 470 and the second optical emitting component 480 are located on the side of the optical emitting cavity 4115 close to the circuit board 300, and the first optical emitting component 470 and the second optical emitting component 480 are electrically connected to the circuit board 300 respectively. The wavelength division multiplexing (WDM) assembly 460 disposed within the optical emitting cavity 4115 includes a first WDM assembly 4601 and a second WDM assembly 4602. A third fiber optic adapter 603 and a fourth fiber optic adapter 604 are disposed on the left side of the housing assembly 410. The third fiber optic adapter 603 extends into the optical emitting cavity 4115, and a first converging lens 701 is disposed between the third fiber optic adapter 603 and the first WDM assembly 4601. A second converging lens 702 is disposed between the fourth fiber optic adapter 604 and the second WDM assembly 4602. Thus, four different wavelength signal beams emitted by the first optical emitting assembly 470 are transmitted to the first WDM assembly 4601, which multiplexes the four different wavelength signal beams into a single composite beam. This composite beam is then converged and coupled to the third fiber optic adapter 603 via the first converging lens 701. Similarly, the four different wavelength signal lights emitted by the second optical emitting component 480 are transmitted to the second wavelength division multiplexing component 4602, which multiplexes the four different wavelength signal lights into a composite beam. The composite beam is then converged and coupled to the fourth fiber optic adapter 604 via the second converging lens 702.

[0101] The first fiber optic adapter and the third fiber optic adapter have different heights.

[0102] In this embodiment, the first optical emitting component 470 and the second optical emitting component 480 each include a plurality of optical emitting chips, which are laser chips used to convert current signals into laser light for emission. Specifically, the first optical emitting component 470 includes a third lens component 4701 and a first laser component 4702. The first laser component 4702 is used to emit multiple beams of signal light of different wavelengths. The third lens component 4701 is disposed in the emission direction of the first laser component 4702 and is used to convert the beam emitted by the first laser component 4702 into a collimated beam. The first wavelength division multiplexing component 4601 is disposed in the emission direction of the third lens component 4701 and is used to multiplex multiple beams of different wavelengths into a composite beam. The first converging lens 701 is disposed in the emission direction of the first wavelength division multiplexing component 4601 and is used to converge and couple the composite beam emitted by the first wavelength division multiplexing component 4601 into the third fiber optic adapter 603 to realize light emission.

[0103] Similarly, the second optical emitting component 480 includes a fourth lens component 4801 and a second laser component 4802. The second laser component 4802 is used to emit multiple beams of signal light of different wavelengths. The fourth lens component 4801 is disposed in the output light direction of the second laser component 4802 and is used to convert the beam emitted by the second laser component 4802 into a collimated beam. The second wavelength division multiplexing component 4602 is disposed in the output light direction of the fourth lens component 4801 and is used to multiplex multiple beams of different wavelengths into a composite beam. The second converging lens 702 is disposed in the output light direction of the second wavelength division multiplexing component 4602 and is used to converge and couple the composite beam emitted by the second wavelength division multiplexing component 4602 into the fourth fiber optic adapter 604 to realize the emission of light.

[0104] In this embodiment, the first laser assembly 4702 may include four lasers, and the third lens assembly 4701 may include four collimating lenses. The four lasers and four collimating lenses are arranged in a one-to-one correspondence. Each of the four lasers emits four beams of different wavelengths, and each beam of different wavelength is transmitted to its corresponding collimating lens. Correspondingly, the second laser assembly 4802 may include four lasers, and the fourth lens assembly 4801 may include four collimating lenses. The four lasers and four collimating lenses are arranged in a one-to-one correspondence, and each of the four lasers emits four beams of different wavelengths, and each beam of different wavelength is transmitted to its corresponding collimating lens.

[0105] Both the first wavelength division multiplexing (WDM) component 4601 and the second WDM component 4602 include four input channels. The four collimated beams output from the four collimating lenses of the third lens component 4701 enter the four input channels of the first WDM component 4601, respectively. The first WDM component 4601 converts the four collimated beams into a single composite beam, which is then converged and coupled to the third fiber optic adapter 603 via the first converging lens 701, thus achieving the transmission of four-channel WDM multiplexed light. Similarly, the four collimated beams output from the four collimating lenses of the fourth lens component 4702 enter the four input channels of the second WDM component 4602, which converts the four collimated beams into a single composite beam. This composite beam is then converged and coupled to the fourth fiber optic adapter 604 via the second converging lens 702, thus achieving the transmission of four-channel WDM multiplexed light. Thus, this application uses two wavelength division multiplexing components to multiplex an 8-channel beam into two composite beams, and couples the two composite beams to two fiber optic adapters respectively, reducing the volume occupied by the optical transmitting components in the optical module and facilitating the miniaturization of the optical module.

[0106] In this embodiment of the application, in order to realize the transmission optical path of the above embodiment, it is necessary to provide a support and device coupling platform for the first optical transmission component 470, the first wavelength division multiplexing component 4601, the second optical transmission component 480 and the second wavelength division multiplexing component 4602 in the optical path structure, so as to realize the passive coupling of the first optical transmission component 470 and the first wavelength division multiplexing component 4601, and the passive coupling of the second optical transmission component 480 and the second wavelength division multiplexing component 4602, thereby reducing the coupling difficulty of the transmission optical path.

[0107] Figure 22 This is a schematic diagram of another angle of the housing assembly 410 in an optical module provided in an embodiment of this application. (See attached diagram.) Figure 22 As shown, the bottom plate of the light emitting cavity 4115 at the lower part of the housing assembly 410 includes a first bottom surface 4115c and a second bottom surface 4116. A stepped surface is formed between the first bottom surface 4115c and the second bottom surface 4116, that is, there is a height difference between the first bottom surface 4115c and the second bottom surface 4116, and the second bottom surface 4116 is recessed into the first bottom surface 4115c. A first MUX fixing groove 4117 and a second MUX fixing groove 4118 are provided on the first bottom surface 4115c; the bottom surface of the light emitting cavity forms an annular protrusion MUX fixing groove, and the wavelength division multiplexing component is disposed on the annular protrusion. Adhesive is disposed in the groove surrounded by the annular protrusion to bond the wavelength division multiplexing component. The first wave division multiplexing (WDM) component 4601 is fixed to the first bottom surface 4115c via the first MUX fixing adhesive tray 4117, and the second WDM component 4602 is fixed to the first bottom surface 4115c via the second MUX fixing adhesive tray 4118. Specifically, the first MUX fixing adhesive tray 4117 is used to hold adhesive. When it is necessary to fix the first WDM component 4601, adhesive is applied to the first MUX fixing adhesive tray 4117, and then the first WDM component 4601 is installed and placed on the first MUX fixing adhesive tray 4117. The adhesive solidifies to complete the fixation of the first WDM component 4601 on the first bottom surface 4115c. Similarly, the second MUX fixing adhesive tray 4118 is used to hold adhesive. When it is necessary to fix the second wave division multiplexing component 4602, adhesive is applied to the second MUX fixing adhesive tray 4118, and then the second wave division multiplexing component 4602 is installed on the second MUX fixing adhesive tray 4118. The adhesive solidifies to complete the fixation of the second wave division multiplexing component 4602 on the first bottom surface 4115c.

[0108] The second bottom surface 4116 is used to support the first optical emitting component 470 and the second optical emitting component 480. To ensure that the emission channel of the first optical emitting component 470 is at the same height as the input channel of the first wavelength division multiplexing component 4601, and the input channel of the second optical emitting component 480 is at the same height as the input channel of the second wavelength division multiplexing component 4602, a semiconductor cooler 490 is provided on the second bottom surface 4116. The bottom surface of the semiconductor cooler 490 is attached to the second bottom surface 4116, and the top surface of the semiconductor cooler 490 is used to support and fix the first optical emitting component 470 and the second optical emitting component 480. In this way, the heat generated by the first optical emitting component 470 and the second optical emitting component 480 can be transferred to the semiconductor cooler 490, effectively realizing the heat dissipation of the optical emitting components.

[0109] The stepped surface between the first bottom surface 4115c and the second bottom surface 4116 divides the height of the bottom surface of the light emitting cavity 4115. On the one hand, the stepped surface formed between the first bottom surface 4115c and the second bottom surface 4116 allows the second bottom surface 4116 to relatively reduce the height of the mounting surface of the semiconductor cooler 490, thereby reducing the height of the first light emitting component 470 and the second light emitting component 480, which facilitates the assembly of the first light emitting component 470, the first wavelength division multiplexing component 4601, the second light emitting component 480, and the second wavelength division multiplexing component 4602. On the other hand, the stepped surface can also be used to limit the position of the semiconductor cooler 490.

[0110] A notch 4114 on the side of the housing assembly 410 near the circuit board 300 wraps around the outside of the second bottom surface 4116. A third notch 310 is provided on the side of the circuit board 300 facing the housing assembly 410. When the circuit board 300 is inserted into the first notch 4114 of the housing assembly 410, the two side walls of the third notch 310 wrap around the second bottom surface 4116. This can shorten the distance between the light emitting assembly on the second bottom surface 4116 and the circuit board 300. When the first laser assembly 4702 and the second laser assembly 4802 are electrically connected to the circuit board 300 by wire bonding, the length of the wire bonding between the first laser assembly 4702, the second laser assembly 4802 and the circuit board 300 can be reduced.

[0111] Figure 23 This is an assembly cross-sectional view of the light emitting component and the housing assembly 410 in an optical module provided as an embodiment of this application. Figure 23As shown, the second bottom surface 4116 is located below the light-transmitting hole 4109 on the housing assembly 410. One side of the semiconductor cooler 490 is attached to the second bottom surface 4116, and the first light-emitting component 470 and the second light-emitting component 480 are both attached to the other side of the semiconductor cooler 490. The first light-emitting component 470 and the second light-emitting component 480 use a total of 8 lasers. The heat generated by the lasers is conducted to the semiconductor cooler 490. The heat from the semiconductor cooler 490 can bypass the light-transmitting hole 4109 and be conducted from the un-drilled area on the housing assembly 410 to the upper surface of the housing assembly 410, and then conducted to the optical module housing for heat dissipation through the thermally conductive material.

[0112] In this embodiment, the light emitting component is disposed on the bottom surface of the light emitting cavity of the tube housing assembly protrusion, and a light-transmitting hole 4109 is provided in the protrusion. The light emitting component can achieve heat conduction through the protrusion, which is the heat conduction path of the light emitting component. This makes the light receiving cavity and the slot in the light receiving part separate and connected by the protrusion. In order to realize the light path between the light receiving cavity and the slot, a light-transmitting hole is provided in the protrusion.

[0113] At the optical receiver, the light beam output from the wave demultiplexing component is transmitted to the lens assembly. Each light beam output from the wave demultiplexing component is transmitted to the corresponding collimating lens through a light aperture 4109.

[0114] To facilitate heat conduction of the light emitting component, the upper and lower parts of the housing component 410 are integrated after avoiding the light-transmitting hole 4109. In this way, the heat generated by the light emitting end can be conducted from the un-drilled part of the housing component 410 to the upper surface of the housing component, and then conducted to the optical module shell for heat dissipation through the thermally conductive material, as shown by the arrow, thus improving the heat dissipation efficiency of the light emitting end.

[0115] The housing assembly 410 has a third through hole 4119 and a fourth through hole 4120 on the side near the fiber optic adapter. Both the third through hole 4119 and the fourth through hole 4120 are connected to the light emitting cavity 4115. The third fiber optic adapter 603 is inserted into the light emitting cavity 4115 through the third through hole 4119 to receive a focused beam output by the first converging lens 701. The fourth fiber optic adapter 604 is inserted into the light emitting cavity 4115 through the fourth through hole 4120 to receive a focused beam output by the second converging lens 702.

[0116] In this embodiment, the light emitting cavity 4115 includes a base plate and side plates surrounding the base plate. The base plate and side plates form a cavity structure for housing the first light emitting component 470, the first wavelength division multiplexing component 4601, the first converging lens 701, the second light emitting component 480, the second wavelength division multiplexing component 4602, and the second converging lens 702. A third cover plate fixing groove 4115a is provided on the top of the side plate of the light emitting cavity 4115, so that the third cover plate 403 can be fixedly connected to the light emitting cavity 4115 with adhesive. Optionally, the third cover plate fixing groove 4115 forms a closed-loop structure on the top of the side plate of the light emitting cavity 4115, thereby increasing the adhesive area of ​​the third cover plate 403 on the top of the side plate of the light emitting cavity 4115, and fully ensuring the encapsulation reliability of the third cover plate 403 and the top of the side plate of the light emitting cavity 4115. Furthermore, a third repair port 4115b is provided on the top of the side plate of the light emitting cavity 4115. The third repair port 4115b is located at the top edge of the side plate of the light emitting cavity 4115 and is connected to the third cover plate fixing groove 4115a. When the third cover plate 403 and the light emitting cavity 4115 are packaged and the internal components of the light emitting cavity 4115 need to be repaired, the third cover plate 403 can be removed from the light emitting cavity 4115 through the third repair port 4115b. This allows the third cover plate 403 to be removed without damaging the third cover plate 403 or the light emitting cavity 4115, reducing the difficulty and cost of repair.

[0117] The optical module provided in this embodiment uses a common metal outer shell assembly. The shell assembly has openings on the top and bottom sides, where the optical emitting component and the optical receiving component are respectively arranged. The optical emitting and receiving components are arranged back-to-back, meaning they share a partition in the middle of the shell assembly. The optical receiving component is arranged on the upper side of the partition, and the optical emitting component is arranged on the lower side. One end of the circuit board is inserted into the shell assembly, and the high-frequency traces of the optical emitting and receiving components run on the top and bottom sides of the circuit board respectively, avoiding cross-interference. Using an integrated structure for the optical emitting and receiving components solves the problem of insufficient overall space in optical modules using discrete optical emitting and receiving components, which is beneficial for the miniaturization of optical modules.

[0118] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a circuit structure, article, or device. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the circuit structure, article, or device that includes that element.

[0119] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the content of the claims.

[0120] The above embodiments of this application do not constitute a limitation on the scope of protection of this application.

Claims

1. An optical module, characterized in that, It includes a circuit board, on the upper surface of which a light receiving chip is provided, and on the lower surface of which a solder pad is provided; The tube housing assembly has an upper surface including a downwardly recessed light receiving cavity and a slot, and a protrusion is provided between the light receiving cavity and the slot. The protrusion includes a light-transmitting hole to connect the light receiving cavity and the slot. Its lower surface includes an upwardly recessed light-emitting cavity; A first optical fiber adapter is provided at one end of the optical receiving cavity; A third fiber optic adapter is provided at one end of the optical emitting cavity, and a notch is provided at the other end; An optical emitting component, located within the optical emitting cavity, is disposed on the bottom surface of the optical emitting cavity where the protrusion is located, and is capable of directing light toward the third fiber optic adapter; one end of the circuit board extends into the optical emitting cavity through the notch; The pad is located in the light emitting cavity and is connected to the light emitting component via a wire; An optical component, located in the light receiving cavity, is capable of receiving light from the first fiber optic adapter; A reflector, disposed at the slot, is capable of reflecting light from the optical component through the light-transmitting hole; A light receiving chip, located between the reflector and the circuit board and outside the housing assembly, is capable of receiving light from the reflector.

2. The optical module as described in claim 1, characterized in that, It also includes a cover; the housing assembly also includes a first cover plate and a third cover plate; One end of the cover is connected to the protrusion, and the other end is connected to the circuit board, covering the slot and the light receiving chip. The first cover plate covers the light receiving cavity, and the third cover plate covers the light emitting cavity.

3. The optical module as described in claim 1, characterized in that, The first fiber optic adapter and the third fiber optic adapter have different heights.

4. The optical module as described in claim 1, characterized in that, It also includes a receiving lens array and a third collimating lens; The receiving lens array is located on the slot, between the light-transmitting hole and the reflecting mirror; The third collimating lens is located between the first fiber optic adapter and the optical component; The optical component is a wave decomposition and multiplexing component, and the receiving lens array is used to converge the multiple beams of light output by the wave decomposition and multiplexing component.

5. The optical module as described in claim 4, characterized in that, The light receiving chip is a chip array used to receive multiple beams of light reflected by the reflector.

6. The optical module as described in claim 1, characterized in that, It also includes a wavelength division multiplexing component and an optical emission chip array, which are located in the optical emission cavity, respectively. The wavelength division multiplexing component combines multiple beams of light from the optical emission chip array into one beam of light.

7. The optical module as described in claim 4, characterized in that, The bottom surface of the optical receiving cavity forms an annular protrusion DeMUX fixing groove, the wave demultiplexing component is disposed on the annular protrusion, and adhesive is disposed in the groove enclosed by the annular protrusion to bond the wave demultiplexing component.

8. The optical module as described in claim 6, characterized in that, The bottom surface of the light emitting cavity forms an annular protrusion MUX fixing groove, the wavelength division multiplexing component is disposed on the annular protrusion, and adhesive is disposed in the groove enclosed by the annular protrusion to bond the wavelength division multiplexing component.

9. The optical module as described in claim 1, characterized in that, It also includes a thermally conductive substrate located on the surface of the circuit board and in the notch, which is capable of conducting heat between the circuit board and the housing assembly.

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