A die bonding device for an electronic label encapsulation machine

Abstract

The present invention discloses a die bonding device for an electronic tag encapsulation machine, including a frame. A die bonding part is arranged in the middle of the frame. A dispensing part is arranged in the incoming material direction of the die bonding part, and a traction part is arranged in the outgoing material direction of the die bonding part. It is characterized in that: a dispensing roller is arranged in the dispensing part, and a dispensing head is arranged above the dispensing roller. The dispensing head is composed of two parts, namely a dispensing valve and a nozzle, which are interconnected. The length ratio between the dispensing valve and the nozzle is 105:15.5. A positioning camera and a lighting lamp are also arranged in the dispensing part. The focus of the positioning camera is located at the dispensing position directly below the dispensing head. The die bonding part includes a wafer adjustment platform, a vertical flipping mechanism, a horizontal flipping mechanism, and an antenna driving and adjusting mechanism, and also includes a chip jacking mechanism matching the wafer adjustment platform.

Description

Technical Field

[0001] The present invention relates to the field of automatic packaging of electronic tags, and in particular to a die bonding device for an electronic tag packaging machine. Background Art

[0002] In the process of automatic packaging of electronic tags, a die bonding device is required to bond the chips on the wafer to the strip antenna. The traditional die bonding device has a dispensing part and a die bonding part. The dispensing part can apply the bonding glue to the specified position of the strip antenna, and the die bonding part can bond the chips removed from the wafer to the position where the bonding glue is applied.

[0003] The traditional die bonding device mainly has the following two problems. First, the shooting position of the positioning camera in the dispensing part is the position before the dispensing station. When the specifications and types of the electronic tags to be packaged change, the distance between the detection position and the dispensing station may change. In this case, it is necessary to adjust the positioning camera to adapt to the switching between different products. Such an operation is relatively complex, and the machine change time is relatively long, which affects the working efficiency of the entire automatic packaging production line.

[0004] The second problem is that in the traditional die bonding structure, a structure combining flipping and linear translation is used to realize the transfer of the chips. Since there are a large number of reciprocating motions in this structure, its production capacity is relatively low. Another chip moving structure is to use an inverted wafer platform structure. The inverted wafer platform is arranged in the die bonding device and is combined with two sets of flipping mechanisms to realize the transfer of the chips. Although this structure can improve the production capacity to a certain extent compared with the previous method, the center of gravity of its main moving part, the wafer platform, is relatively high, and large vibrations will be generated during the working process, affecting the position accuracy of chip bonding.

[0005] At the same time, after the traditional die bonding structure works for a period of time, the strip antenna may have a certain position deviation, so it is necessary to stop the machine and manually adjust it, which seriously affects the production efficiency.

[0006] Therefore, there is a need for a method or device that can solve the above problems now. Summary of the Invention

[0007] The present invention is to solve the above-mentioned deficiencies existing in the prior art, and proposes a die bonding device for an electronic tag packaging machine with a simple structure, ingenious design, reasonable layout, and capable of achieving precise bonding on the premise of ensuring the die bonding efficiency.

[0008] The technical solution of the present invention is: a die bonding device for an electronic tag encapsulation machine, including a frame 1. A die bonding part 2 is arranged in the middle of the frame 1. A dispensing part 3 is arranged in the incoming material direction of the die bonding part 2, and a traction part 4 is arranged in the outgoing material direction of the die bonding part 2. It is characterized in that: a dispensing roller 5 is arranged in the dispensing part 3, and a dispensing head is arranged above the dispensing roller 5. The dispensing head is composed of two parts, a dispensing valve 6 and a nozzle 7 which are connected to each other, and the length ratio between the dispensing valve 6 and the nozzle 7 is 105:15.5. A positioning camera 8 and a lighting lamp 9 are also arranged in the dispensing part 3. The focus of the positioning camera 8 is located at the dispensing position directly below the dispensing head.

[0009] The die bonding part 2 includes a wafer adjustment platform, a vertical flipping mechanism, a horizontal flipping mechanism and an antenna driving and adjusting mechanism, and also includes a chip lifting mechanism matched with the wafer adjustment platform.

[0010] The wafer adjustment platform includes a bottom plate 10 fixedly arranged on the frame 1. The bottom plate 10 is slidably connected with a Y-axis support plate 12 through a pair of Y-axis slide rails 11. A Y-axis motor 13 is arranged at one end of the bottom plate 10, and a Y-axis lead screw 14 is arranged on the working end of the Y-axis motor 13. The Y-axis lead screw 14 is in threaded connection with a nut seat arranged on the bottom end face of the Y-axis support plate 12. The Y-axis support plate 12 is slidably connected with an X-axis support plate 16 through a pair of X-axis slide rails 15. An X-axis motor 17 is arranged at one end of the Y-axis support plate 12, and an X-axis lead screw 18 is arranged on the working end of the X-axis motor. The X-axis lead screw is in threaded connection with a nut seat arranged on the bottom end face of the X-axis support plate 16. A wafer clamp 19 is also arranged on the top end face of the X-axis support plate 16.

[0011] The described chip lifting mechanism is located below the wafer adjustment platform. It includes a lifting mechanism support bracket 20 directly connected to the frame 1. The bottom end surface of the lifting mechanism support bracket 20 is slidably connected to a lifting mechanism Y-axis support plate 22 through a pair of lifting mechanism Y-axis slide rails 21. A Y-axis adjustment screw 23 is rotatably supported on the lifting mechanism support bracket 20. The Y-axis adjustment screw 23 is in contact with the lifting mechanism Y-axis support plate 22. The bottom end surface of the lifting mechanism Y-axis support plate 22 is slidably connected to a lifting mechanism X-axis support plate 25 through a pair of lifting mechanism X-axis slide rails 24. An X-axis adjustment screw 26 is rotatably supported on the lifting mechanism Y-axis support plate 22. The X-axis adjustment screw 26 is in contact with the lifting mechanism X-axis support plate 25. Tension springs 27 are provided between the lifting mechanism support bracket 20 and the lifting mechanism Y-axis support plate 22, and between the lifting mechanism Y-axis support plate 22 and the lifting mechanism X-axis support plate 25. The lifting mechanism X-axis support plate 25 is also fixedly connected to a lifting motor support bracket 28. A lifting motor 29 is provided on the lifting motor support bracket 28. The working end of the lifting motor 29 is connected to a lifting lead screw 30. The lifting lead screw 30 is threadedly connected to a lifting rod support plate 31. A lifting rod 32 is provided on the lifting rod support plate 31.

[0012] The described vertical flipping mechanism includes a DD motor 33 fixedly supported on the frame 1. The working end of the DD motor 33 is connected to a vertical turntable 34. The rotating shaft of the vertical turntable 34 is horizontally distributed. Four first suction head slide rails 35 evenly distributed in the circumferential direction and arranged radially along the vertical turntable 34 are provided on the vertical turntable 34. A first suction head carriage 36 is slidably connected to the first suction head slide rails 35. A first suction head 37 and a first passive roller 38 are provided on the first suction head carriage 36. At the same time, a suction head return spring is provided between the vertical turntable 34 and the first suction head carriage 36. A vertical flipping cam mechanism matching the loading position A of the vertical flipping mechanism is also provided on the frame 1. The vertical flipping cam mechanism includes a first cam motor 40. A first cam 41 is provided on the working end of the first cam motor 40. A vertically distributed vertical flipping slide rail is provided on the frame 1. A follower block 42 is slidably connected to the vertical flipping slide rail. A groove 43 matching the first cam 41 is provided on the follower block 42. The bottom end of the follower block 42 is matched with the first passive roller 38 on the first suction head carriage 36 located at the loading position A.

[0013] The described horizontal flipping mechanism also includes a DD motor 33 fixedly supported on the frame 1. The working end of the DD motor 33 is connected to a horizontal turntable 44. The rotating shaft of the horizontal turntable 44 is longitudinally distributed. Four second suction head slide rails 45 that are evenly distributed in the circumferential direction and longitudinally distributed are provided on the horizontal turntable 44. A second suction head slide carriage 46 is slidably connected to the second suction head slide rail 45. A second suction head 47 and a second passive roller 48 are provided on the second suction head slide carriage 46. At the same time, a suction head return spring is also provided between the horizontal turntable 44 and the second suction head slide carriage 46. A pair of horizontal flipping cam mechanisms are also provided on the frame 1. The two horizontal flipping cam mechanisms respectively match the loading position B and the unloading position C of the horizontal flipping mechanism. The horizontal flipping cam mechanism includes a second cam motor 49. A second cam 50 is provided on the working end of the second cam motor 49. The second cam 50 is an end face cam, and the cam end face of the second cam 50 matches the second passive roller 48 on the second suction head slide carriage 46 located at the loading position B or the unloading position C.

[0014] The described antenna driving and adjusting mechanism includes an antenna base plate 51 connected to the frame 1. A length direction adjusting plate 52 is slidably connected to the antenna base plate 51. A length direction adjusting motor 53 is provided on the antenna base plate 51. The screw rod located on the working end of the length direction adjusting motor 53 is connected to the nut seat provided on the length direction adjusting plate 52. A width direction adjusting motor 54 and a traction motor 55 are provided on the length direction adjusting plate 52. At the same time, a width direction adjusting plate 56 is also slidably connected to the length direction adjusting plate 52. The screw rod located on the working end of the width direction adjusting motor 54 is connected to the nut seat provided on the width direction adjusting plate 56. A plurality of suction nozzles are provided on the width direction adjusting plate 56. A traction pressure roller 57 is provided on the working end of the traction motor 55. A passive roller rotatably supported on the antenna base plate 51 is provided below the traction pressure roller 57. The traction pressure roller 57 and the passive roller can drive the strip antenna 58 to move forward. The suction nozzles are located below the strip antenna 58. The antenna driving and adjusting mechanism also includes an industrial camera 59. The lens of the industrial camera 59 is aligned with the bonding station D of the strip antenna 58.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] The die bonding device for an electronic tag encapsulation machine with this structural form has a simple structure, ingenious design, and reasonable layout. It designs a special structure in response to various problems exposed by the traditional die bonding device during the working process.

[0017] First, through the improvement of the dispensing valve nozzle, the positioning camera can directly focus on the dispensing position. Thus, regardless of the encapsulation of electronic tags of any specification, it is not necessary to adjust the positioning camera to accurately detect the dispensing situation.

[0018] Secondly, in its die bonding part, there are vertical flipping mechanisms and horizontal flipping mechanisms with special structures. These two mechanisms cooperate to quickly and accurately transfer the chips on the wafer to the bonding position and achieve precise bonding. The entire operation process is smooth and reliable, and the working efficiency is high.

[0019] At the same time, after the traditional die bonding device works for a period of time, the strip antenna may have a certain position deviation. To solve this problem, this device is designed with a set of strip antenna adjustment mechanisms. This mechanism can automatically adjust the relative position of the strip antenna after detecting the position deviation, so as to ensure the bonding position accuracy without affecting the production efficiency.

[0020] In summary, it can be said that this die bonding device has multiple advantages, is particularly suitable for popularization and application in this field, and has a very broad market prospect. Brief Description of the Drawings

[0021] Figure 1 is the front view of the embodiment of the present invention.

[0022] Figure 2 is the three-dimensional structure schematic diagram of the dispensing part of the embodiment of the present invention.

[0023] Figure 3 is the three-dimensional structure schematic diagram of the die bonding part of the embodiment of the present invention.

[0024] Figure 4 is Figure 3 the partial enlarged view in

[0025] Figure 5 is the front view of the die bonding part of the embodiment of the present invention.

[0026] Figure 6 is the top view of the wafer adjustment platform of the embodiment of the present invention.

[0027] Figure 7 is the front view of the chip lifting mechanism of the embodiment of the present invention.

[0028] Figure 8 is the top view of the antenna driving adjustment mechanism of the embodiment of the present invention.

[0029] Figure 9 is the front view of the vertical flipping mechanism and the horizontal flipping mechanism of the embodiment of the present invention.

[0030] Figure 10It is a schematic structural diagram of the horizontal flipping mechanism in the embodiment of the present invention.

[0031] Figure 11 It is the front view of the vertical flipping cam mechanism part in the embodiment of the present invention. Specific embodiments

[0032] The following will describe the specific embodiments of the present invention in conjunction with the accompanying drawings. As Figures 1 to 11 shown: A die bonding device for an electronic tag encapsulation machine includes a frame 1 as a base. In the middle of the frame 1, a die bonding part 2 is provided. A dispensing part 3 is provided in the incoming material direction of the die bonding part 2, and a traction part 4 is provided in the outgoing material direction of the die bonding part 2. A dispensing roller 5 is provided in the dispensing part 3, and a dispensing head is provided above the dispensing roller 5. The dispensing head is composed of two parts, a dispensing valve 6 and a nozzle 7 that are connected to each other. The length ratio between the dispensing valve 6 and the nozzle 7 is 105:15.5. A positioning camera 8 and a lighting lamp 9 are also provided in the dispensing part 3. The focus of the positioning camera 8 is located at the dispensing position directly below the dispensing head.

[0033] The die bonding part 2 includes a wafer adjustment platform, a vertical flipping mechanism, a horizontal flipping mechanism, and an antenna driving and adjusting mechanism, and also includes a chip lifting mechanism that matches the wafer adjustment platform.

[0034] The wafer adjustment platform includes a bottom plate 10 fixedly arranged on the frame 1. The bottom plate 10 is slidably connected to a Y-axis support plate 12 through a pair of Y-axis slide rails 11. A Y-axis motor 13 is provided at one end of the bottom plate 10, and a Y-axis lead screw 14 is provided at the working end of the Y-axis motor 13. The Y-axis lead screw 14 is threadedly connected to a nut seat arranged on the bottom end surface of the Y-axis support plate 12. The Y-axis support plate 12 is slidably connected to an X-axis support plate 16 through a pair of X-axis slide rails 15. An X-axis motor 17 is provided at one end of the Y-axis support plate 12, and an X-axis lead screw 18 is provided at the working end of the X-axis motor. The X-axis lead screw is threadedly connected to a nut seat arranged on the bottom end surface of the X-axis support plate 16. A wafer fixture 19 is also provided on the top end surface of the X-axis support plate 16.

[0035] The described chip lifting mechanism is located below the wafer adjustment platform. It includes a lifting mechanism support bracket 20 directly connected to the frame 1. The bottom end surface of the lifting mechanism support bracket 20 is slidably connected to the lifting mechanism Y-axis support plate 22 through a pair of lifting mechanism Y-axis slide rails 21. A Y-axis adjustment screw 23 is rotatably supported on the lifting mechanism support bracket 20. The Y-axis adjustment screw 23 is in contact with the lifting mechanism Y-axis support plate 22. The bottom end surface of the lifting mechanism Y-axis support plate 22 is slidably connected to the lifting mechanism X-axis support plate 25 through a pair of lifting mechanism X-axis slide rails 24. An X-axis adjustment screw 26 is rotatably supported on the lifting mechanism Y-axis support plate 22. The X-axis adjustment screw 26 is in contact with the lifting mechanism X-axis support plate 25. Tension springs 27 are provided between the lifting mechanism support bracket 20 and the lifting mechanism Y-axis support plate 22, and between the lifting mechanism Y-axis support plate 22 and the lifting mechanism X-axis support plate 25. The lifting mechanism X-axis support plate 25 is also fixedly connected to a lifting motor support bracket 28. A lifting motor 29 is provided on the lifting motor support bracket 28. The working end of the lifting motor 29 is connected to a lifting lead screw 30. The lifting lead screw 30 is threadedly connected to a lifting rod support plate 31. A lifting rod 32 is provided on the lifting rod support plate 31.

[0036] The described vertical flipping mechanism includes a DD motor 33 fixedly supported on the frame 1. The working end of the DD motor 33 is connected to a vertical turntable 34. The rotating shaft of the vertical turntable 34 is horizontally distributed. Four first suction head slide rails 35 evenly distributed in the circumferential direction and arranged radially along the vertical turntable 34 are provided on the vertical turntable 34. A first suction head carriage 36 is slidably connected to the first suction head slide rails 35. A first suction head 37 and a first passive roller 38 are provided on the first suction head carriage 36. At the same time, a suction head return spring is provided between the vertical turntable 34 and the first suction head carriage 36. A vertical flipping cam mechanism matching the loading position A of the vertical flipping mechanism is also provided on the frame 1. The vertical flipping cam mechanism includes a first cam motor 40. A first cam 41 is provided on the working end of the first cam motor 40. A vertically distributed vertical flipping slide rail is provided on the frame 1. A follower block 42 is slidably connected to the vertical flipping slide rail. A groove 43 matching the first cam 41 is provided on the follower block 42. The bottom end of the follower block 42 is matched with the first passive roller 38 on the first suction head carriage 36 located at the loading position A.

[0037] The described horizontal flipping mechanism also includes a DD motor 33 fixedly supported on the frame 1. The working end of the DD motor 33 is connected to a horizontal turntable 44. The rotating shaft of the horizontal turntable 44 is longitudinally distributed. Four second suction head slide rails 45 that are evenly distributed in the circumferential direction and longitudinally distributed are provided on the horizontal turntable 44. A second suction head carriage 46 is slidably connected to the second suction head slide rail 45. A second suction head 47 and a second passive roller 48 are provided on the second suction head carriage 46. At the same time, a suction head return spring is also provided between the horizontal turntable 44 and the second suction head carriage 46. A pair of horizontal flipping cam mechanisms are also provided on the frame 1. The two horizontal flipping cam mechanisms respectively match the loading position B and the unloading position C of the horizontal flipping mechanism. The horizontal flipping cam mechanism includes a second cam motor 49. A second cam 50 is provided on the working end of the second cam motor 49. The second cam 50 is an end face cam, and the cam end face of the second cam 50 matches the second passive roller 48 on the second suction head carriage 46 located at the loading position B or the unloading position C.

[0038] The described antenna driving and adjusting mechanism includes an antenna base plate 51 connected to the frame 1. A length direction adjusting plate 52 is slidably connected to the antenna base plate 51. A length direction adjusting motor 53 is provided on the antenna base plate 51. The screw on the working end of the length direction adjusting motor 53 is connected to the nut seat provided on the length direction adjusting plate 52. A width direction adjusting motor 54 and a traction motor 55 are provided on the length direction adjusting plate 52. At the same time, a width direction adjusting plate 56 is also slidably connected to the length direction adjusting plate 52. The screw on the working end of the width direction adjusting motor 54 is connected to the nut seat provided on the width direction adjusting plate 56. A plurality of suction nozzles are provided on the width direction adjusting plate 56. A traction pressure roller 57 is provided on the working end of the traction motor 55. A passive roller rotatably supported on the antenna base plate 51 is provided below the traction pressure roller 57. The traction pressure roller 57 and the passive roller can drive the strip antenna 58 to move forward. The suction nozzles are located below the strip antenna 58. The antenna driving and adjusting mechanism also includes an industrial camera 59. The lens of the industrial camera 59 is aligned with the bonding station D of the strip antenna 58. Here, the bonding station D is directly below the unloading position C.

[0039] The working process of the die bonding device for the electronic tag encapsulation machine according to the embodiment of the present invention is as follows: The strip antenna 58 that needs to perform the chip bonding operation is connected to the traction part 4. Under the action of the traction part 4, the strip antenna 58 can move in the dispensing part 3 and the die bonding part 2.

[0040] The strip antenna 58 travels on the glue - applying roller 5. Every time it travels a unit distance, the traction part 4 stops working. At this time, the glue - applying head descends to apply the adhesive glue on the strip antenna 58. During this process, the positioning camera 8 can collect the image information of the glue - applying position. If it is found that the position of the adhesive glue on the strip antenna 58 is deviated, a signal will be sent to the control system to remind the operator to process it in time. Since the glue - applying valve 6 and the nozzle 7 in the glue - applying head have a special length ratio, and the length of the nozzle 7 is longer than that of the traditional glue - applying head, during the glue - applying process, the relatively thick glue - applying valve 6 will not block the line of sight of the positioning camera 8. Therefore, the focus of the positioning camera 8 can be directly aligned with the glue - applying position. Since the glue - applying position is fixed regardless of the specification of the electronic label, this glue - applying part does not need to adjust or switch the positioning camera 8 when packaging different - specification electronic labels, which can save a large amount of manual labor and avoid affecting the work efficiency.

[0041] When the die - bonding part 2 works, a wafer (with multiple chips distributed in an array on the wafer) is pre - clamped on the wafer fixture 19. The wafer adjustment platform will drive the wafer to move horizontally, so that the target chip moves to the loading position A in the vertical flipping mechanism. After moving into place, the control system will control the chip lifting mechanism to lift the current chip upward. At the same time, the vertical flipping cam mechanism works, driving the first suction - head carriage 36 that has moved to the loading position A to move downward. The upward lifting of the chip and the opposite - direction cooperation of the first suction head 37 will make the current chip contact the first suction head 37, and the chip is adsorbed on the first suction head 37.

[0042] After the first chip in the chip array is taken away, the wafer adjustment platform will drive the wafer to move horizontally again, driving the second chip to the loading position A, and so on until all the chips in a wafer are taken away. During the operation process, the video monitoring system supporting this device will always detect the number of remaining chips. After it is found that all the chips are taken away, the video monitoring system will send a signal to the control system, and the control system will remind the operator to replace the new wafer in time.

[0043] After the vertical flipping mechanism picks up the first chip, the vertical turntable 34 on it will rotate 90 degrees driven by the connected DD motor 33. When the next first suction head 37 picks up the second chip, the vertical turntable 34 will rotate 90 degrees again, that is, the vertical turntable 34 will rotate 90 degrees each time, gradually transporting the picked - up chips from the loading position A to the loading position B.

[0044] The horizontal flipping cam mechanism located at the loading position B operates, driving a second suction head carriage 46 in the horizontal flipping mechanism to move downward. The second suction head 47 on the second suction head carriage 46 will pick up the chip that has moved to the loading position B (the corresponding first suction head 37 stops the suction action). In this way, the chip is transferred from the vertical flipping mechanism to the horizontal flipping mechanism. After the above actions are completed, the horizontal turntable 44 rotates 90 degrees driven by the DD motor 33 connected to it. When the next second suction head 47 picks up the second chip, the horizontal turntable 44 will rotate 90 degrees again, that is, the horizontal turntable 44 rotates 90 degrees each time, gradually transporting the picked-up chips from the loading position B to the unloading position C. The horizontal flipping cam mechanism located at the unloading position C operates, driving the second suction head 47 that has adsorbed the chip at this position to move downward, and the chip moves downward from the unloading position C to the bonding station D directly below it.

[0045] After the chip contacts the strip antenna 58 at the bonding station D, the second suction head 47 stops the suction action. Since the strip antenna 58 at the bonding station D has been coated with adhesive at this time, the chip will be bonded to a specific position on the strip antenna 58.

[0046] The industrial camera 59 takes pictures of the bonded chip and sends the collected picture information to the control system. The control system automatically compares the collected picture with the picture of the standard bonding position. If it is found that the bonding position meets the accuracy requirements, the device works normally; otherwise, a warning message is sent.

[0047] Each actuator in this device cooperates to work according to the above steps, and finally realizes the working process of applying glue to a specific position on the strip antenna 58, transporting the chips on the wafer from the loading position A to the unloading position C one by one, and finally bonding the chips to the glue-applied position on the strip antenna 58.

[0048] Before each bonding operation, the industrial camera 59 takes pictures of the bonding position, that is, the control system performs calibration during each bonding operation. If it is found that there is a deviation in the bonding position, it will control the antenna drive mechanism to adjust the mechanism action to finely adjust the specific position of the strip antenna 58 in the plane space.

[0049] The nozzle located below the strip antenna 58 works to suck the strip antenna 58. Then, the length-direction adjustment motor 53 drives the screw to rotate, which can drive the length-direction adjustment plate 52 to displace along the length direction of the strip antenna 58. The width-direction adjustment motor 54 drives the screw to rotate, which can drive the width-direction adjustment plate 56 to displace along the width direction of the strip antenna 56. The traction pressure roller 57 and the passive roller that drive the strip antenna 58 to move will both displace on the X-axis and Y-axis during the above movement process. At the same time, the nozzle will also drive the strip antenna 58 to displace. In this way, the specific position of the strip antenna 58 can be adjusted to make it return to the standard position; after the bonding operation is completed, the air supply at the nozzle stops, the traction mechanism drives the strip antenna 58 to move a unit distance, the industrial camera 59 takes a picture of the bonding position at this time, and the control system judges it again. That is to say, each bonding operation must be judged by the control system before it can be carried out;

[0050] The working process of the wafer adjustment platform is as follows: When the Y-axis motor 13 works, the Y-axis lead screw 14 can drive the Y-axis support plate 12 to displace along the Y-axis direction. When the X-axis motor 17 works, the X-axis lead screw 18 can drive the X-axis support plate 16 to displace along the X-axis direction. In this way, the wafer fixture 19 connected to the X-axis support plate 16 will drive the wafer to make precise adjustments in the X-axis direction and Y-axis direction;

[0051] The working process of the chip lifting mechanism is as follows: First, the operator adjusts the Y-axis adjustment screw 23 and the X-axis adjustment screw 26. In this way, the specific positions of the X-axis support plate 25 and the lifting motor bracket 28 in space can be adjusted to ensure that the lifting rod 32 is directly below the loading position A. After the adjustment is completed, the control system can control the chip lifting mechanism to act in coordination with the actions of the wafer adjustment platform. The lifting motor 29 works to drive the lifting lead screw 30 to rotate, and then drives the lifting rod support plate 31 threadedly connected to the lifting lead screw 30 to move longitudinally, and finally realizes the longitudinal movement of the lifting rod 32 connected to the lifting rod support plate 31;

[0052] The working process of the vertical flipping mechanism is as follows: The DD motor 33 drives the vertical turntable 34 to rotate step by step (each rotation is 90 degrees). The vertical flipping cam mechanism located at the loading position A works. The first cam motor 40 drives the first cam 41 to rotate at a constant speed. During the rotation process, the first cam 41 will drive the follower block 42 to make reciprocating linear motion through the groove 43. The movement of the follower block 42 will drive the first suction head carriage 36 to move along the first suction head slide rail 35, and then realize the longitudinal movement of the first suction head 37. It should be noted that after the first suction head carriage 36 moves downward, when the cam part of the first cam 41 rotates away, under the action of the suction head return spring, the first suction head carriage 36 will return to the initial position again;

[0053] The working process of the horizontal flipping mechanism is similar to that of the vertical flipping mechanism. The difference is that the horizontal turntable 44 rotates in the horizontal plane direction, and there are two horizontal flipping cam mechanisms for driving the second suction head 47 to move longitudinally. These two horizontal flipping cam mechanisms are respectively matched with the loading position B and the unloading position C. The horizontal flipping cam mechanism can drive the second suction head carriage 46 that has moved to the above positions to move longitudinally. The second suction head 47 cooperates with other actuating mechanisms to realize the purpose of removing the chip from the vertical flipping mechanism, transporting it from the loading position B to the unloading position C, and finally bonding the chip to the strip antenna 58 at the bonding station D.

Claims

1. A die bonding device for an electronic label encapsulation machine, comprising a frame (1), a die bonding part (2) is arranged in the middle of the frame (1), a dispensing part (3) is arranged in the incoming material direction of the die bonding part (2), and a traction part (4) is arranged in the discharging direction of the die bonding part (2), characterized in that: The dispensing part (3) is provided with a dispensing roller (5), and a dispensing head is arranged above the dispensing roller (5). The dispensing head is composed of two parts, namely a dispensing valve (6) and a nozzle (7) which are communicated with each other. The length ratio between the dispensing valve (6) and the nozzle (7) is 105:15.

5. A positioning camera (8) and a lighting lamp (9) are also arranged in the dispensing part (3). The focus of the positioning camera (8) is located at the dispensing position directly below the dispensing head. The die bonding part (2) includes a wafer adjustment platform, a vertical flipping mechanism, a horizontal flipping mechanism, and an antenna driving and adjusting mechanism. It also includes a chip lifting mechanism that matches the wafer adjustment platform. The wafer adjustment platform includes a bottom plate (10) fixedly arranged on the frame (1). The bottom plate (10) is slidably connected to a Y-axis support plate (12) through a pair of Y-axis slide rails (11). A Y-axis motor (13) is arranged at one end of the bottom plate (10). A Y-axis lead screw (14) is arranged on the working end of the Y-axis motor (13). The Y-axis lead screw (14) is in threaded connection with a nut seat arranged on the bottom end surface of the Y-axis support plate (12). The Y-axis support plate (12) is slidably connected to an X-axis support plate (16) through a pair of X-axis slide rails (15). An X-axis motor (17) is arranged at one end of the Y-axis support plate (12). An X-axis lead screw (18) is arranged on the working end of the X-axis motor. The X-axis lead screw is in threaded connection with a nut seat arranged on the bottom end surface of the X-axis support plate (16). A wafer fixture (19) is also arranged on the top end surface of the X-axis support plate (16). The chip lifting mechanism is located below the wafer adjustment platform. It includes a lifting mechanism support bracket (20) directly connected to the frame (1). The bottom end surface of the lifting mechanism support bracket (20) is slidably connected to a lifting mechanism Y-axis support plate (22) through a pair of lifting mechanism Y-axis slide rails (21). A Y-axis adjustment screw (23) is rotatably supported on the lifting mechanism support bracket (20). The Y-axis adjustment screw (23) is in contact with the lifting mechanism Y-axis support plate (22). The bottom end surface of the lifting mechanism Y-axis support plate (22) is slidably connected to a lifting mechanism X-axis support plate (25) through a pair of lifting mechanism X-axis slide rails (24). An X-axis adjustment screw (26) is rotatably supported on the lifting mechanism Y-axis support plate (22). The X-axis adjustment screw (26) is in contact with the lifting mechanism X-axis support plate (25). Tension springs (27) are arranged between the lifting mechanism support bracket (20) and the lifting mechanism Y-axis support plate (22), and between the lifting mechanism Y-axis support plate (22) and the lifting mechanism X-axis support plate (25). The lifting mechanism X-axis support plate (25) is also fixedly connected to a lifting motor support bracket (28). A lifting motor (29) is arranged on the lifting motor support bracket (28). The working end of the lifting motor (29) is connected to a lifting lead screw (30). The lifting lead screw (30) is in threaded connection with a lifting rod support plate (31). A lifting rod (32) is arranged on the lifting rod support plate (31). The described vertical flipping mechanism includes a DD motor (33) fixedly supported on the frame (1). The working end of the DD motor (33) is connected to a vertical turntable (34). The rotating shaft of the vertical turntable (34) is horizontally distributed. Four first suction head slide rails (35) evenly distributed in the circumferential direction and arranged radially along the vertical turntable (34) are provided on the vertical turntable (34). A first suction head carriage (36) is slidably connected to the first suction head slide rail (35). A first suction head (37) and a first passive roller (38) are provided on the first suction head carriage (36). At the same time, a suction head return spring is also provided between the vertical turntable (34) and the first suction head carriage (36). A vertical flipping cam mechanism matching the loading position A of the vertical flipping mechanism is also provided on the frame (1). The vertical flipping cam mechanism includes a first cam motor (40). A first cam (41) is provided on the working end of the first cam motor (40). A vertically distributed vertical flipping slide rail is provided on the frame (1). A follower block (42) is slidably connected to the vertical flipping slide rail. A groove (43) matching the first cam (41) is provided on the follower block (42). The bottom end of the follower block (42) matches the first passive roller (38) on the first suction head carriage (36) at the loading position A. The described horizontal flipping mechanism also includes a DD motor (33) fixedly supported on the frame (1). The working end of the DD motor (33) is connected to a horizontal turntable (44). The rotating shaft of the horizontal turntable (44) is longitudinally distributed. Four second suction head slide rails (45) evenly distributed in the circumferential direction and longitudinally distributed are provided on the horizontal turntable (44). A second suction head carriage (46) is slidably connected to the second suction head slide rail (45). A second suction head (47) and a second passive roller (48) are provided on the second suction head carriage (46). At the same time, a suction head return spring is also provided between the horizontal turntable (44) and the second suction head carriage (46). A pair of horizontal flipping cam mechanisms are also provided on the frame (1). The two horizontal flipping cam mechanisms respectively match the loading position B and the discharging position C of the horizontal flipping mechanism. The horizontal flipping cam mechanism includes a second cam motor (49). A second cam (50) is provided on the working end of the second cam motor (49). The second cam (50) is an end face cam, and the cam end face of the second cam (50) matches the second passive roller (48) on the second suction head carriage (46) at the loading position B or the discharging position C. The described antenna driving and adjusting mechanism includes an antenna base plate (51) connected to the frame (1). A length-direction adjusting plate (52) is slidably connected to the antenna base plate (51). A length-direction adjusting motor (53) is provided on the antenna base plate (51). The screw on the working end of the length-direction adjusting motor (53) is connected to the nut seat provided on the length-direction adjusting plate (52). A width-direction adjusting motor (54) and a traction motor (55) are provided on the length-direction adjusting plate (52). At the same time, a width-direction adjusting plate (56) is also slidably connected to the length-direction adjusting plate (52). The screw on the working end of the width-direction adjusting motor (54) is connected to the nut seat provided on the width-direction adjusting plate (56). A plurality of suction nozzles are provided on the width-direction adjusting plate (56). A traction pressure roller (57) is provided on the working end of the traction motor (55). A passive roller rotatably supported on the antenna base plate (51) is provided below the traction pressure roller (57). The traction pressure roller (57) and the passive roller can drive the strip antenna (58) to move forward. The suction nozzles are located below the strip antenna (58). The antenna driving and adjusting mechanism further includes an industrial camera (59). The lens of the industrial camera (59) is aligned with the bonding station D of the strip antenna (58).

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