Substrate processing device equipped with heat vents

Abstract

The substrate processing device of the present invention includes: a disc portion, which is arranged inside a chamber equipped with a heating component; and a carrier plate portion, which is installed on one side of the disc portion and is used to place a substrate; a heat hole is formed on the mounting surface of the disc portion on which the carrier plate portion is installed, through which heat generated by the heating component can pass, or a gear hole is formed on the carrier plate gear facing the disc portion, through which heat from the heating component can pass.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for depositing a thin film on a substrate or for washing or etching the substrate. Background Art

[0002] In order to quickly process multiple substrates, multiple substrates can be arranged on one plate.

[0003] For a flat panel configured with multiple substrates, different processes such as thin film deposition and etching of the substrates can be performed on the multiple substrates in a chamber.

[0004] However, because the diffusion or distribution of the raw materials within the chamber and the temperature of the substrates are not uniform, uneven processing conditions can easily occur across the substrates placed on the platen. Because the raw materials are typically concentrated in the center of the platen, the film thickness in substrate areas adjacent to the center of the platen may be greater than that in areas adjacent to the edge of the platen.

[0005] Due to the non-uniformity of the film thickness as described above, the electrical characteristics of the devices manufactured on a single substrate will have greater variations, thereby causing a problem of reduced yield.

[0006] Korean Patent Registration No. 1150698 discloses a susceptor that can transfer a substrate while it is loaded on a plate. However, it is still difficult to solve the problem of uneven substrate processing.

[0007] Prior art literature

[0008] Patent Literature

[0009] (Patent Document) Korean Registered Patent No. 1150698 Summary of the Invention

[0010] Technical issues

[0011] An object of the present invention is to provide a substrate processing device that can uniformly process multiple substrates simultaneously.

[0012] The technical problems to be achieved by the present invention are not limited to the technical problems mentioned in the above content. Those having general knowledge in the technical field to which the present invention belongs will be able to further clearly understand other technical problems not mentioned through the following description.

[0013] Technical Solution

[0014] The substrate processing device of the present invention includes: a disc portion, which is arranged inside a chamber equipped with a heating component; and a carrier plate portion, which is installed on one side of the disc portion and is used to place a substrate; a heat hole is formed on the mounting surface of the disc portion on which the carrier plate portion is installed, through which heat generated by the heating component can pass, or a gear hole is formed on the carrier plate gear facing the disc portion, through which heat from the heating component can pass.

[0015] Effects of the Invention

[0016] According to the present invention, the heat holes formed in the disk portion can be used to improve the heat transfer efficiency of the carrier disk portion that receives heat generated by the heating component in the chamber and transfers it to the substrate.

[0017] The substrate processing apparatus to which the present invention is applied can control the heat transfer efficiency of the carrier plate portion to a desired direction by adjusting the opening area of ​​the heat hole using an end cap or a carrier plate gear.

[0018] In processes such as deposition and etching using plasma, it is necessary to electrically connect a carrier plate portion for placing a substrate to the outside of a chamber.

[0019] The present invention can rotate the carrier plate portion relative to the disk portion in order to perform uniform plasma treatment on the substrate surface, and can also provide a solution for electrically connecting the carrier plate portion rotating relative to the disk portion to a ground terminal outside the chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram illustrating the substrate processing apparatus of the present invention.

[0021] Figure 2 This is a perspective view illustrating the disk portion of the present invention.

[0022] Figure 3 This is a perspective view illustrating a disk portion of a comparative example.

[0023] Figures 4 to 6 This is a schematic diagram illustrating the heat vent of the present invention.

[0024] Figure 7 This is a schematic diagram illustrating a disk portion to which the carrier plate gear is mounted.

[0025] Figure 8 This is a perspective view illustrating the carrier plate gear of the present invention.

[0026] Figure 9 This is a schematic diagram illustrating the carrier plate gear of the present invention.

[0027] Figure 10This is another schematic diagram illustrating the substrate processing apparatus of the present invention.

[0028] Figure 11 It is a perspective view illustrating a first embodiment of the first electrical channel.

[0029] Figure 12 FIG. 1 is a plan view illustrating another first embodiment of the first electrical channel.

[0030] Figure 13 This is a schematic diagram illustrating the fixing parts.

[0031] Figure 14 It is a perspective view illustrating a second embodiment of the first electrical channel.

[0032] Figure 15 This is a plan view showing a state where the brush of the present invention is installed in a fixing groove.

[0033] Figure 16 It is a perspective view illustrating a third embodiment of the first electrical channel.

[0034] Figure 17 FIG. 1 is a plan view illustrating another third embodiment of the first electrical channel.

[0035] Figure 18 This is a schematic diagram illustrating the brush of the present invention.

[0036] Figure 19 This is an oblique view illustrating the bearing.

[0037] Figure 20 This is a cross-sectional view illustrating a bearing.

[0038] Figure 21 This is a cross-sectional view showing a state in which the coupling assembly and the carrier plate gear are mounted in the bearing.

[0039] Figure 22 It is an exploded oblique view of the bearing.

[0040] Figure 23 This is a schematic diagram illustrating a fourth embodiment of the first electrical channel.

[0041] Figure 24 Yes Figure 23 A schematic diagram illustrating the cutting surface of AA`.

[0042] Figure 25 This is a schematic diagram illustrating the bottom surface of the disk portion.

[0043] Figure 26 This is another schematic diagram illustrating the bottom surface of the disk portion.

[0044] Figure 27 as well as Figure 28 This is another schematic diagram illustrating the bottom surface of the disk portion. DETAILED DESCRIPTION

[0045] Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. During the description, the size and shape of the components illustrated in the drawings may be exaggerated for clarity and convenience. Furthermore, terms specifically defined based on the structure and function of the present invention may vary depending on the intentions or practices of the user or application. The definitions of the aforementioned terms should be based on the overall content of this specification.

[0046] Figure 1 This is a schematic diagram illustrating the substrate processing apparatus of the present invention.

[0047] Figure 1 The substrate processing apparatus shown in FIG. 1 may include a disk portion 130 and a carrier disk portion 150 .

[0048] The substrate processing apparatus of the present invention may include: a chamber 110; a disk portion 130 mounted on the bottom surface of the chamber 110 to support at least one substrate 10; and a chamber lid (not shown) for covering the upper portion of the chamber 110.

[0049] The chamber 110 can perform a substrate 10 processing process using, for example, plasma. As an example, the chamber 110 can provide a reaction space for performing an atomic layer deposition (ALD) process. In this case, a gas injection unit (not shown) can be provided that is installed in a chamber 110 cover (not shown) to inject source gas (SG), reaction gas (RG), and purge gas (PG) into different gas injection areas on the disc portion 130. Of course, the chamber 110 can also be applied to other substrate 10 processing methods in addition to atomic layer deposition (ALD), chemical vapor deposition (CVD), and etching.

[0050] The disk portion 130 may be fixedly or rotatably mounted on the inner bottom surface of the chamber 110 relative to the chamber 110 .

[0051] By rotating the disk portion 130, which is rotatably mounted relative to the chamber 110, the substrates placed on the disk portion 130 can be uniformly subjected to plasma treatment. As an example, after the entire space within the chamber 110 is filled with a single type of gas, the entire processing surface of a particular substrate 10 can be uniformly cleaned, deposited, and etched regardless of the processing location. In addition, by rotating the disk portion 130, the uniformity of processing (cleaning, deposition, and etching) among the multiple substrates 10 placed on the disk portion 130 can be improved. In order to uniformly perform processing of the substrates 10, such as cleaning, deposition, and etching, each substrate 10 needs to be uniformly heated to an appropriate temperature. In order to heat the substrates 10, the disk portion 130 can be disposed inside the chamber 110 equipped with a heating component 290, such as a heater.

[0052] When performing an atomic layer deposition (ALD) process, the substrate 10 can be moved in a set sequence and sequentially exposed to source gas, purge gas, and reactant gas by the rotation of the disk portion 130. Thus, the substrate 10 can be sequentially exposed to the source gas, purge gas, and reactant gas as the disk portion 130 rotates, thereby forming a single or multi-layer thin film on the substrate 10 through the ALD process.

[0053] In the atomic layer deposition (ALD) process, the source gas may be sprayed onto the substrate 10 facing the source gas region, the purge gas may be sprayed onto the substrate 10 facing the purge gas region, and the reaction gas may be sprayed onto the substrate 10 facing the reaction gas region.

[0054] In the atomic layer deposition (ALD) process, a specific substrate 10 can pass through the source gas area, the purge gas area and the reaction gas area in sequence as the disk part 130 rotates, thereby forming a single layer or multi-layer thin film through the atomic layer deposition (ALD) process.

[0055] The disk portion 130 may be disposed inside the chamber 110. The chamber 110 may include a storage space for storing the substrate 10 corresponding to an object to be processed.

[0056] Inside the chamber 110 , substrate 10 processing such as a thin film deposition process on the substrate 10 , a cleaning process on the substrate 10 , and an etching process on the substrate 10 may be performed.

[0057] In thin film deposition processes, chemical vapor deposition (CVD) and physical vapor deposition (PVD) methods may be used, both of which require thin film raw materials such as reaction gases and source gases.

[0058] To improve yield, it is desirable to deposit a thin film with a uniform thickness across all regions of a substrate 10, such as a wafer or printed circuit board (PCB), disposed within the chamber 110. Furthermore, when multiple substrates 10 are disposed within the chamber 110, it is desirable that the thickness of the thin film on a particular substrate 10 be uniform as that on the other substrates 10.

[0059] To uniformly process the substrate 10, including thin film deposition, the distribution of the raw materials diffused into the chamber 110 should also be uniform. However, in practice, it is difficult to maintain a uniform distribution of the raw materials within the chamber 110, as well as the distribution of the plasma used to provide the energy required for processing the substrate 10. Consequently, uneven distribution of the raw materials or plasma within the chamber 110 makes it difficult to uniformly clean, deposit, and etch the substrate 10.

[0060] For example, the raw material or plasma tends to concentrate in the center of chamber 110. Therefore, based on a substrate 10, the processing intensity in the area adjacent to the center of chamber 110 is greater than that in the area adjacent to the edge of chamber 110. Consequently, during thin film deposition, uneven deposition thickness may occur, with one side of the substrate 10 having a greater thickness than the other. This same issue can also occur during cleaning and etching processes of the substrate 10.

[0061] As another example, when the first substrate 10 and the second substrate 10 are simultaneously disposed in the chamber 110 , the film thickness of the first substrate 10 may be different from that of the second substrate 10 due to uneven distribution of raw materials or plasma.

[0062] The present invention aims to make the processing conditions of different regions of a single substrate 10 uniform regardless of the uneven distribution of raw materials or plasma. In addition, the present invention aims to make the processing conditions of a plurality of substrates 10 processed simultaneously uniform.

[0063] The substrate processing apparatus of the present invention may use the susceptor unit 150 to process a plurality of substrates 10 simultaneously.

[0064] The carrier plate portion 150 is mounted on one side of the circular disc portion 130 and may be formed in a plate-like shape for seating the substrate 10. A seating groove 138 for seating the substrate 10 may be formed on the side of the carrier plate portion 150 facing the substrate 10. To prevent damage to the substrate 10 and ensure reliable processing of the substrate 10, such as deposition, the seating groove 138 may be formed in the same shape as the seating portion of the substrate 10.

[0065] One or more supporting disc parts 150 may be installed in the disc part 130 .

[0066] In order to simultaneously process multiple substrates 10, the centers of the multiple carrier plates 150 formed in the disk portion 130 may be different from the center of the chamber 110 in a planar direction. Therefore, the carrier plates 150 and the substrates 10 placed thereon may be arranged adjacent to the center of the chamber 10 on one side, while the other side may be arranged adjacent to the edge of the chamber 110. In this case, a first rotating unit and a second rotating unit may be used to prevent uneven processing of the substrates 10.

[0067] The first rotating part can drive the carrier plate 150 to perform a first rotation. In this case, the carrier plate 150 is preferably formed in a circular shape on a plane in order to be suitable for the first rotation.

[0068] The first rotation of the carrier plate 150 refers to a rotation of the carrier plate 150 on a plane with the center of the carrier plate 150 as the rotation center, and will be referred to as the rotation of the carrier plate 150 in the following description. During the first rotation of the carrier plate 150, the carrier plate 150 can rotate more than 360 degrees relative to the chamber 150.

[0069] The second rotating portion can drive the carrying plate portion 150 to perform a second rotation.

[0070] Compared to the rotation of the carrier plate 150, the second rotation of the carrier plate 150 may refer to the rotation of the carrier plate 150 about an imaginary rotation axis located outside the carrier plate 150. In this case, the imaginary rotation axis is preferably located at the center of the chamber 110 or the center of the disk 130. In this case, the second rotation of the carrier plate 150 can be referred to as an orbital revolution about the imaginary rotation axis.

[0071] As an example, in order to drive the carrier plate portion 150 to revolve, the second rotating portion may drive the disk portion 130 on which the plurality of carrier plates 150 are mounted to rotate with the center of the disk portion 130 as the rotation center.

[0072] Thanks to the rotation of the carrier plate 150, the area of ​​the substrate 10 placed on the carrier plate 150 facing the center of the chamber 10 is not fixed but changes constantly, allowing uniform processing across all areas of the substrate 10. For example, the first rotating portion allows a film of uniform thickness to be deposited on both sides of the substrate 10, meaning that a film of a certain thickness can be deposited across all areas of the substrate 10. Furthermore, when performing cleaning or etching, the cleaning or etching can be performed at a uniform depth across all areas of the substrate 10.

[0073] Furthermore, when the first substrate 10 is positioned at a first position within the chamber 10 and the second substrate 10 is positioned at a second position, the raw material density or plasma density at the first position may differ from the raw material density or plasma density at the second position. Consequently, the thickness of the film deposited on the first substrate 10 may differ from the thickness of the film deposited on the second substrate 10. To ensure uniform thickness of the films deposited on the first and second substrates 10, the second rotating unit may rotate the disc unit 130 while idling the carrier disc unit 150.

[0074] As an example, by allowing the first substrate 10 and the second substrate 10 to alternately pass through the first position and the second position by means of the second rotating portion, the film thicknesses of the first substrate 10 and the second substrate 10 can be made uniform.

[0075] The present invention can improve the processing uniformity of a single substrate 10 by using the first rotating unit, and improve the processing uniformity among multiple substrates 10 by using the second rotating unit. As a result, the overall yield of substrates 10 can be significantly improved by the rotation and revolution of the carrier plate unit 150.

[0076] It is preferable that the first rotating unit and the second rotating unit are driven independently. This is because when the first rotating unit drives the carrier plate 150 to perform the first rotation at the first speed V1 and the second rotating unit drives the disc 130 to move at the second speed V2, it is preferable to independently adjust V1 and V2 to achieve uniform film thickness, etc.

[0077] The substrate processing apparatus of the present invention may be equipped with an adjustment unit for differentially controlling the first rotating unit and the second rotating unit. After confirming the processing results of the substrate 10, the user can use the adjustment unit to differentially adjust the first speed V1 of the first rotating unit and the second speed V2 of the second rotating unit.

[0078] As a comparative example, a case where the first rotating part and the second rotating part are linked to each other will be described. In this case, the first speed V1 of the carrier plate part 150 and the second speed V2 of the disk part 130 can be linked to each other.

[0079] If the first speed V1 is adjusted to a1 to improve processing uniformity for a single substrate 10, the second speed V2 is also forcibly set to b1. In this case, as long as processing uniformity is maintained across all substrates 10, no particular problems arise. However, even if processing uniformity cannot be achieved across all substrates 10, the second speed V2 can only be maintained at b1. Consequently, there is a risk that processing uniformity may be achieved for a single substrate 10 but not for multiple substrates 10.

[0080] On the other hand, if the second speed V2 is adjusted to b2 to improve the processing uniformity among multiple substrates 10, the second speed V1 will also be forcibly determined to be a2. In this case, although the processing uniformity among the substrates 10 can meet the design value, the processing uniformity of a single substrate 10 may not meet the design value.

[0081] In contrast, in the substrate processing apparatus of the present invention, because the first rotating unit and the second rotating unit can be driven independently of each other, the first speed V1 of the carrier plate unit 150 can be adjusted to a1 while the second speed V2 of the disk unit 130 can be adjusted to b2. Therefore, the present invention can meet the design value of processing uniformity for a single substrate 10 while also meeting the design value of processing uniformity across multiple substrates 10.

[0082] In addition, when the first rotating part that drives the supporting disk part 150 to rotate is in a state fixed to the chamber 110, the rotation of the disc part 130 and the revolution of the supporting disk part 150 driven by the rotation of the disc part 130 can be limited by means of the first rotating part.

[0083] In order to smoothly drive the disc portion 130 to move with the help of the second rotating portion, the first rotating portion may drive the supporting disc portion 150 to rotate while moving together with the disc portion 130 .

[0084] As an example, when the disk portion 130 performs linear reciprocating motion, the first rotating portion may also perform linear reciprocating motion together with the disk portion 130. When the disk portion 130 performs rotational motion, the first rotating portion may also perform rotational motion together with the disk portion 130. Specifically, the relative speed between the disk portion 130 and the first rotating portion may be close to zero.

[0085] The first rotating portion may be provided with a first motor for driving the carrier plate portion 150 to rotate and a link assembly for transmitting the rotational power of the first motor to the carrier plate portion 150 .

[0086] As an example, the linkage assembly may include a carrier plate gear 180 connected to the carrier plate portion 150, a main gear 170 connected to the carrier plate gear 180, a first rotational shaft 140, and a first motor that drives the main gear 170 to rotate. When the main gear 170 rotates together with the first rotational shaft 140, the first motor can also drive the first rotational shaft 140 to rotate. To improve the processing uniformity of a single substrate 10, it is preferable to form the first rotational shaft 140 at the center of the carrier plate portion 150.

[0087] When the first motor rotates, the first rotating shaft 140, which is connected to the motor shaft of the first motor, can rotate. As the first rotating shaft 140 rotates, the main gear 170 also rotates, and the carrier plate gear 180 connected to the main gear 170 can also rotate. When the carrier plate gear 180 rotates, the carrier plate portion 150 can rotate (first rotation).

[0088] When the motor shaft of the first motor rotates, the first rotating shaft 140 connected to the motor shaft of the first motor rotates regardless of the rotation of the disc portion 130 , thereby causing the carrier disc portion 150 to rotate relative to the disc portion 130 .

[0089] In order to drive the carrier plate 150 to rotate without restricting the idling of the carrier plate 150 , the first motor driving the carrier plate 150 to rotate may idly rotate together with the carrier plate 150 about the second rotation axis 120 .

[0090] When the first rotating shaft 140 and the second rotating shaft 120 are disposed on the same axis, the first motor can be fixed to a certain position.

[0091] As an example, the second rotating shaft 120 can be formed in a hollow tubular shape. In this case, the first rotating shaft 140 can be rotatably inserted into the central hole of the second rotating shaft 120. This allows only the second rotating shaft 120 to penetrate the chamber 110. Alternatively, the first rotating shaft 140 can be formed in a hollow tubular shape, with the second rotating shaft 120 inserted into the central hole of the first rotating shaft 140.

[0092] By means of the first motor and the second motor being controlled separately by the adjustment part, the carrier plate part 150 and the circular plate part 130 can rotate in different rotation directions and at different rotation speeds.

[0093] A lifter 151 may be provided in the center of the carrier plate 150 for driving the substrate 10 to move up and down. The substrate 10 may be spaced a certain distance from the seating groove 138 of the carrier plate 150 when the lifter 151 is raised, and may be placed on the seating groove 138 when the lifter 151 is lowered.

[0094] A thin film can be deposited on the substrate 10 positioned at the bottom of the placement groove 138. At this point, a portion of the thin film may also be deposited on the edge of the carrier plate portion 150, which has a larger diameter than the substrate 10. Consequently, the substrate 10 and the carrier plate portion 150 may become partially bonded due to the thin film, and this bond can be peeled off by the lifter portion 151. At this point, the pressure of the lifter applied to peel off the bond can easily damage the substrate 10. Furthermore, during the process of peeling off the bond by lifting and lowering the lifter portion 151, the substrate 10 may tilt and detach from the lifter portion 151.

[0095] In order to prevent the substrate 10 from being damaged, the lifter portion 151 of the present invention may adopt a special structure.

[0096] In order to disperse the pressure applied to the substrate 10 during the peeling and bonding process, the lifter portion 151 may be equipped with a plate portion extending parallel to the bottom surface of the seating groove 138 of the carrier plate portion 150. Since the plate portion is in surface contact with the substrate 10, the pressure applied to the substrate 10 can be evenly dispersed, and the substrate 10 can be reliably prevented from tilting during the lifting process.

[0097] To protect the substrate 10, the plate portion remains parallel to the bottom surface of the seating groove 138 of the supporting disc portion 150. To ensure that the disc portion is parallel to the bottom surface of the seating groove 138, the elevator portion 151 can be equipped with an extension portion extending downward from the center of the plate portion. The extension portion can extend in the same direction as the plate portion is raised and lowered. The extension portion can be installed through the first through hole 134 formed in the disc portion 130. In this case, the first through hole 134 can extend from the upper side of the disc portion 130 to the lower side.

[0098] The plate and extensions form the sides of the lifter portion 151 in a "T" shape. The extension can then slide up and down within the first through-hole 134 of the disc portion 130. The guidance provided by the first through-hole 134 prevents the extension from deviating from the lifting direction and tilting. The plate connected to the extension also maintains a constant parallelism with the bottom surface of the seating groove 138 of the carrier disc portion 150.

[0099] The chamber 10 may be equipped with an elevator driving portion 160 for pushing the extension portion upward or pulling the extension portion downward.

[0100] The first rotating portion can be positioned so as to face the bottom surface of the disk portion 130. In this case, the elevator drive unit 160 can maintain its downward position, separated from the first rotating portion, while the disk portion 130 or the carrier plate portion 150 moves. In this case, the elevator portion 151 can descend under its own weight. The elevator drive unit 160 can rise when the disk portion 130 and the carrier plate portion 150 are stationary, thereby physically pushing upward the extension of the elevator portion 151 exposed at the bottom surface of the disk portion 130.

[0101] The carrier plate portion 150 can be mounted so as to face the first through-hole 134 of the circular disc portion 130 and can be connected to the carrier plate gear 180 via the first through-hole 134 of the circular disc portion 130. In this case, a shaft portion 131 can be interposed between the carrier plate gear 180 and the first through-hole 134, or between the carrier plate portion 150 and the first through-hole 134, to allow the carrier plate gear 180 or the carrier plate portion 150 to rotate. The shaft portion 131 is a component connected to the receiving plate portion 150 and can be rotatably supported by the circular disc portion 130. As an example, the shaft portion 131 can form the first rotation axis 140, which serves as the rotation center of the receiving plate portion 150, and can include a bearing. The bearing can be rotatably supported by the circular disc portion 130.

[0102] The substrate processing apparatus may be equipped with a heating assembly 290. The heating assembly 290 is installed inside the chamber 110 and can heat the substrate 10 to a set temperature. The set temperature can be determined to be a temperature at which substrate 10 processing, such as thin film deposition, can be successfully performed. The heating assembly 290 can be installed between the disk portion 130 and the bottom surface of the chamber 110. When the receiving plate portion 150 is installed on one side of the disk portion 130, the heating assembly 290 can include a heater installed on the other side of the disk portion 130 inside the chamber 110.

[0103] The receiving pan portion 150 may receive heat from the heating assembly 290 installed at the lower side of the disc portion 130 and transfer the heat to the substrate 10 .

[0104] However, because the disc portion 130 is installed between the heating assembly 290 and the substrate 10, the heating assembly 290 can be shielded from the receiving pan portion 150. Because the first through-hole 134 formed in the disc portion 130 is used to mount the shaft portion 131 and the lifter portion 151, the disc portion 130 can be sealed after the shaft portion 131 and the lifter portion are installed. As a result, the heating assembly 290 can be completely shielded from the receiving pan portion 150 by the disc portion 130.

[0105] In order to allow the heat of the heating component 290 to be directly applied to the receiving pan portion 150 through the disc portion 130, a heat hole 139 for allowing the heat generated in the heating component 290 to pass through can be separately formed on the mounting surface of the disc portion 130 on which the receiving pan portion 150 is mounted. The heat generated in the heating component 290, such as a heater, can be directly transferred to the receiving pan portion 150 through the heat hole 139.

[0106] When the disk portion 130 is equipped with multiple receiving trays 150, the heat holes 139 can be formed at each position facing each receiving tray 150. In this case, the heating assembly 290 can be installed at a position facing the heat holes 139. In order to ensure that the multiple heat holes 139 alternately pass through positions facing specific positions of the heating assembly 290, the heating assembly 290 and the disk portion 130 can be formed so as to move relative to each other.

[0107] As an example, when the heating assembly 290 is fixed to the chamber 110, the heat hole 139 can revolve along with the bag portion 150. Even if different portions of the heating assembly 290 have different heat levels, the revolving heat hole 139 can uniformly heat the multiple receiving trays 150. To more reliably heat the multiple receiving trays 150 uniformly, the heating assembly 290 can rotate about the second rotation axis 120, which serves as the rotation center of the disk portion 130.

[0108] Figure 2 This is a perspective view illustrating the disk portion 130 of the present invention.

[0109] When a placement groove 138 for the receiving tray 150 is formed on one side of the disc 130, the heat hole 139 can be formed in the center of the bottom surface of the placement groove 138. In order to support the receiving tray 150, the diameter of the heat hole 139 can be smaller than the diameter of the receiving tray 150.

[0110] With the help of the diameter difference between the heat hole 139 and the receiving tray portion 150, the center of the receiving tray portion 150 placed in the seating groove 138 can face the heat hole 139, and the edge of the receiving tray portion 150 placed in the seating groove 138 can be supported by the bottom edge of the seating groove 138 in a rotatable manner.

[0111] When the receiving plate 150 is rotatably mounted on the disk 130, the shaft 131, such as a bearing, should be supported by the disk 130. However, since the diameter of the heat hole 139 is larger than the shaft 131, the shaft 131 may float in the center of the heat hole 139, which is an unrealistic state.

[0112] To mount the shaft 131 , the substrate processing apparatus of the present invention may include a mounting portion 133 formed in the center of the thermal hole 139 and a coupling portion 135 penetrating the thermal hole 139 and connecting the mounting portion 133 to the disk 130 .

[0113] The mounting portion 113 may be mounted with a shaft portion 131 serving as the rotation center for the receiving disc portion 150. As one example, the mounting portion 133 may be formed in an annular shape having a first through-hole 134 for receiving the shaft portion 131. The receiving disc portion 150 may be mounted on the disc portion 130 so as to be rotatable around the shaft portion 131.

[0114] In order to reliably support the mounting portion 133, a plurality of joints 135 may be provided. Each joint 135 may be provided at different angles with respect to the mounting portion 133. Preferably, each joint 135 may be provided at equal angles with respect to the mounting portion 133.

[0115] The heat vent 139 can be divided into multiple pieces by a plurality of joints 135. The joints 135 can function as shielding plates that shield the heat vent 139 from the receiving tray 150. Therefore, to minimize the area blocked by the joints 135 from the heat vent 139, each joint 135 can be formed in a rod-like shape. Because the joints 135 are formed in a rod-like shape, each of the divided heat vents 139 can be formed in a fan-shaped shape.

[0116] When a lifter portion 151 for lifting the substrate 10 is provided at the center of the receiving tray portion 150 , a lifter hole 132 through which a lifter driving portion 160 for pushing the lifter portion 151 upward or downward passes may be formed at the center of the shaft portion 131 .

[0117] When the disk portion 130 is installed in a rotatable manner relative to the chamber 110 , a second through hole 137 for installing the second rotating shaft 120 or the like may be formed at the center of the disk portion 130 .

[0118] The disk portion 130 can receive heat from the heating assembly 290 and transfer the received heat evenly to the substrate 10. A heat shielding film may be present at a small gap on the side of the disk portion 130, and the heat shielding film can minimize heat loss on the inner wall of the chamber.

[0119] Figure 3 This is a perspective view illustrating the disk portion 130 of a comparative example.

[0120] Figure 3The comparative embodiment is a state in which only the first through hole 134 for mounting the shaft portion 131 and the second through hole 137 for mounting the second rotating shaft 120 are formed, and the separate heat hole 139 is excluded.

[0121] As a result, the bottom surface of the seating groove 138 will completely block the heating element 290 , thereby causing a problem of increased heat loss of the heating element 290 relative to the substrate 10 .

[0122] Figures 4 to 6 This is a schematic diagram illustrating the heat vent 139 of the present invention. Figures 4 to 6 This is a state in which the other side surface of the disk portion 130 facing the bottom surface of the chamber 110 is viewed. In other words, this is a state in which the disk portion 130 is viewed from the bottom upward.

[0123] The processing result of the substrate 10 may vary depending on the heating state of the substrate 10 passing through the receiving tray 150. According to the processing result of the substrate 10, the heat transferred to the substrate 10 through the receiving tray 150 can be adjusted by adjusting the size and angle of the heat hole 139.

[0124] As an example, Figure 4 As shown, in the case where the substrate 10 is overheated due to the maximum size of the thermal aperture 139, as shown in FIG. Figure 5 As shown, the substrate 10 can be prevented from overheating by using the disk portion 130 having the heat hole 139 of a smaller size.

[0125] However, it may be difficult to replace the disc portion 130 formed with the heat hole 139 of different specifications each time the size of the heat hole 139 changes. In order to adjust the size of the heat hole 139 without replacing the disc portion 130, it is possible to equip Figure 6 An end cap 136 is shown.

[0126] An end cap 136 is mounted on the other side of the disk portion 130 and can be formed to cover at least a portion of the heat opening 139. The end cap 136 can adjust the open area of ​​the heat opening 139 exposed on the other side of the disk portion 130. As an example, the end cap 136 can be removably formed on the other side of the disk portion 130 and can be formed in a variety of different sizes.

[0127] By utilizing Figure 6 136 pairs of end caps Figure 4 By shielding the thermal aperture 139 in the Figure 5 The smaller size of the thermal aperture 139 is shown.

[0128] When reducing the size of the heat hole 139, it is preferable that the end cap 136 first covers the outer edge of the heat hole 139 and then gradually covers the central portion. In the comparative embodiment where the width of the joint 135 is increased to reduce the size of the heat hole 139, the temperature uniformity of the receiving tray 150 may be reduced.

[0129] Because the heat passing between the side of the disk portion 130 and the inner wall of the chamber 110 mainly heats the edge of the substrate 10, the edge of the substrate 10 is easily heated to a temperature higher than the center of the substrate 10. However, by first blocking the edge of the heat hole 139 in this embodiment, the center of the substrate 10 can be reliably heated by the receiving disk portion 150, thereby ensuring that all areas of the substrate 10 are heated evenly.

[0130] Figure 7 This is a schematic diagram illustrating the disc portion 130 to which the receiving plate gear 180 is mounted. Figure 8 This is a perspective view illustrating the receiving plate gear 180 of the present invention. Figure 7 as well as Figure 8 This is a state where the disc portion 130 or the receiving plate gear 180 is viewed from the bottom upward.

[0131] exist Figure 7 as well as Figure 8 The receiving plate gear 180 or the intermediate gear 190 disclosed in the embodiment may also be replaced with a belt or a pulley that can transmit the rotational force.

[0132] At the center of the disc portion 130 , a first connection component 141 connected to the first rotation shaft and a second connection component 121 connected to the second rotation shaft may be provided.

[0133] The substrate processing apparatus of the present invention may include a receiving plate gear 180 mounted on the other side of the disc portion 130 and connected to the receiving plate portion 150 , a linkage gear meshing with the receiving plate gear 180 , and a first driving portion driving the linkage gear to rotate.

[0134] The first driving portion may include a first motor.

[0135] The linkage gear may include a motor shaft gear mounted on the motor shaft of the first motor. Alternatively, the linkage gear may include an intermediate gear 190 between the motor shaft gear and the receiving plate gear 180 .

[0136] When the linkage gear rotates by the first driving unit, the receiving plate portion 150 can rotate together with the receiving plate gear 180 meshed with the linkage gear. The linkage gear can be arranged at a different position from the receiving plate gear 180 in a direction parallel to the disc portion 130.

[0137] When the receiving disc portion 150 is provided on one side of the disc portion 130 , the receiving disc gear 180 and the linkage gear formed on the other side of the disc portion 130 can shield the heat hole 139 relative to the heating component 290 .

[0138] In order to make the heat hole 139 exposed relative to the heating component 290, a gear hole 189 can be formed in the portion of the receiving plate gear 180 facing the heat hole 139, through which heat from the heating component 290 can pass. At this time, if a portion of the linkage gear faces the heat hole 139, it may cause the efficiency of heat passing through the gear hole 189 to decrease or it may be difficult to control the heat passing through the heat hole 139. In order to improve the heat passage efficiency and heat control effect, it is appropriate to configure the linkage gear at a position that is a certain distance away from the heat hole 139 on the plane. In other words, the linkage gear can be configured in a position away from the heat hole 139 and will not block the heat hole 139.

[0139] In order to keep a certain distance between the linkage gear and the heat hole 139 , the receiving plate gear 180 may be formed with a diameter or size that can cover the heat hole 139 .

[0140] The receiving plate gear 180 may be formed in a special structure having a gear hole 189 .

[0141] For example, the receiving plate gear 180 may include a ring portion 181 formed in an annular shape and having teeth that mesh with other gears, a center portion 183 that can be attached to and detached from the shaft portion 131, and a connecting portion 185 that passes through the gear hole 189 and connects the ring portion 181 and the center portion 183. In this case, the ring portion 181 may have a size or diameter that can cover the entire heat hole 139 formed at one receiving plate portion 150.

[0142] With the help of the connecting portion 185, the gear hole 189 can be divided into multiple parts, and each gear hole 189 can be formed in a shape such as a fan rib.

[0143] The receiving plate gear 180 of the present invention rotates together with the receiving plate portion 150 relative to the heat opening 139. The gear hole 189 formed in the receiving plate gear 180 can affect the temperature of the substrate 10. Furthermore, the gear hole 189 can reduce the overall load on the disc portion 130, thereby reducing the power required to rotate the disc portion 130 and preventing the edge of the disc portion 130 from sagging.

[0144] When the receiving plate gear 180 rotates, the connecting portion 185 can periodically block the heat hole 139 .

[0145] A plurality of types of receiving plate gears 180 may be provided, each of which has at least one of a formation position, a number, an area, and a shape of the connection portion 185 that is different from each other.

[0146] In order to adjust the amount of heat passing through the heat hole 139 , various types of receiving plate gears 180 may be replaced relative to the shaft portion 131 .

[0147] Figure 9 This is a schematic diagram illustrating the carrier plate gear 180 of the present invention.

[0148] By changing the connection portion 185 that periodically blocks the heat hole 139 during the rotation process, the amount of heat passing through the heat hole 139 can be adjusted.

[0149] As an example, Figure 9 As shown in (a) in FIG. 1 , by forming the gear holes 189 on the outer circumference and the inner circumference of the receiving pan gear 180 , different amounts of heat can be applied to the edge and the center of the receiving pan portion 150 .

[0150] like Figure 9 As shown in (b) to (e) in FIG. 1 , by increasing the number of connecting portions 185 connecting the central portion 183 and the ring portion 181 , the amount of heat passing through the heat hole 139 can be gradually reduced.

[0151] In the case where the heating assembly 290 is a radiant heat source, the receiving plate gear 180 is as follows: Figure 9 As shown in (f) in FIG. 1 , a transparent material such as quartz may be included. In order to reduce the overall load of the disk portion 130 , it is preferable to form the gear hole 189 even in the case of the receiving plate gear 180 made of a transparent material.

[0152] A through hole 182 through which the lifter portion 151 passes may be formed at the center of the central portion 183 .

[0153] A detachable hole 188 that can be detachably attached to the edge of the shaft portion 131 may be formed at the edge of the central portion 183 . Figure 8 This is a state where the detachable hole 188 is attached to the shaft portion 131 by screws.

[0154] To ensure that the lifter portion 151 or the lifter driving portion 160 can function properly through the lifter hole 132 formed in the mounting portion 133 and the through hole 182 formed in the center portion 183 , the lifter hole 132 and the through hole 182 may be formed on the same axis.

[0155] Figure 10 This is another schematic diagram illustrating the substrate processing apparatus of the present invention.

[0156] During processes such as cleaning, deposition, and etching, the receiving tray 150 on which the substrate 10 is placed needs to be electrically connected to the outside of the chamber 110 .

[0157] As an example, when processing substrate 10 using plasma, the upper side of chamber 110 is connected to a high-power high-frequency power source and may be equipped with an upper electrode 250 or antenna for applying high-frequency power. In this case, receiving tray 150, while connected to the high-frequency power source, also needs to be electrically connected to a lower electrode or ground terminal used to induce plasma generation within chamber 110. In some cases, direct current power may also be applied to receiving tray 150 to induce an electromagnetic force to attract substrate 10.

[0158] However, since the receiving disc portion 150 according to the present invention is rotatably mounted in the disc portion 130 , a separate electrical connection component is required to electrically connect the rotating body and the fixed body.

[0159] The receiving plate portion 150 may be grounded to the ground terminal through at least one of the electrically conductive first electrical path ①, the second electrical path ②, and the third electrical path ③.

[0160] The first electrical channel ① can be an electrical channel that electrically connects the receiving disc portion 150 to the disc portion 130 by using a brush 270 that is in physical contact with the receiving disc portion 150 and the disc portion 130 when the receiving disc portion 150 is equipped with a conductive receiving disc portion (including a disc portion 130 formed with a conductive pattern) that is electrically connected to the ground terminal.

[0161] The second electrical path ② may be an electrical path that electrically connects the receiving disc portion 150 to the disc portion 130 through a bearing or a sleeve equivalent to the shaft portion 131 when the conductive disc portion 130 electrically connected to the ground terminal is provided.

[0162] The third electrical path ③ may be an electrical path electrically connecting the receiving plate portion 150 to the receiving plate gear 180 through the bearing when the receiving plate gear 180 electrically connected to the ground terminal is provided.

[0163] Figure 11 It is a perspective view illustrating a first embodiment of the first electrical channel.

[0164] A coupling groove 234 may be formed on a side of the mounting portion 133 formed in the center of the heat hole 139 that faces the receiving tray portion 150, into which a coupling assembly 260 provided on the receiving tray portion 150 may be inserted. The coupling assembly 260 may be an element that rotates together with the receiving tray portion 150, and may be locked to the receiving tray portion 150 after being separately manufactured from the receiving tray portion 150, or may be formed integrally with the receiving tray portion 150. The coupling assembly 260 may include a rotating shaft that rotates together with the receiving tray portion, a receiving tray, and gears.

[0165] A first through hole 134 having a smaller diameter than the coupling groove 234 and into which the shaft portion 131 can be inserted may be formed at the center of the bottom surface of the coupling groove 234 .

[0166] The coupling assembly 260 inserted into the coupling groove 234 may be coupled to the shaft portion 131 to rotate together with the shaft portion 131 .

[0167] As an example, the bearing corresponding to shaft portion 131 may include an outer ring 310 and an inner ring 330 that rotate relative to each other. In this case, outer ring 310 may be fixed to first through-hole 134, while inner ring 330 may be fixed to coupling assembly 260. When inner ring 330 rotates relative to outer ring 310, receiving disc portion 150, on which coupling assembly 260 is formed, rotates relative to disc portion 130, on which first through-hole 134 is formed.

[0168] The diameter of the coupling groove 234 may be larger than the diameter of the coupling assembly 260. Due to the diameter difference, a gap may be formed between the inner wall of the coupling groove 234 and the side of the coupling assembly 260. The gap may be utilized to provide a brush 270 between the inner wall of the coupling groove 234 and the side of the coupling assembly 260.

[0169] The brush 270 may include an electrically conductive material.

[0170] One end of the brush 270 may be fixed to the conductive disc portion 130. The other end of the brush 270 may protrude from the inner wall of the coupling groove 234 toward the side of the coupling assembly 260 and bend in a direction opposite to the protruding direction, thereby being formed to slide in contact with the side of the rotating coupling assembly 260. Conversely, one end of the brush 270 may be fixed to the side of the coupling assembly 260 and rotate with the coupling assembly 260. In this case, the other end of the brush 270 may slide in contact with the conductive disc portion 130.

[0171] The spherical member 270 may be formed in various shapes based on a linear shape or a plate shape while maintaining elasticity.

[0172] If the brush 270 detaches from the disc portion 130 and moves freely between the coupling assembly 260 and the inner wall of the coupling groove 234 , the coupling assembly 260 or the receiving disc portion 150 may be damaged. Therefore, it is advisable to provide a solution that can reliably support the brush 270 .

[0173] As an example, a fixing groove 240 that is recessed in a radial direction from the shaft portion 131 may be formed in a portion of the inner wall of the coupling groove 234. In this case, a fixing component 280 that is installed in the fixing groove 240 may be provided in the substrate processing apparatus. An insertion groove 281 into which one end of the brush 270 can be inserted may be formed in the fixing component 280. The fixing component 280 may be locked into the fixing groove 240 by a locking component 241 such as a screw. The brush 270, one end of which is inserted into the insertion groove 281 of the fixing component 280, can finally achieve the same state as being fixed to the fixing groove 240 by means of screw locking, forced embedding, docking, welding, or the like through the fixing component 280.

[0174] Figure 12 FIG. 1 is a plan view illustrating another first embodiment of the first electrical channel.

[0175] In order to reliably fix the brush 270 in the fixing groove 240, one end of the brush 270 may be wound in a locking part 241 locked to the fixing groove 240. The brush 270 with one end wound in the locking part 241 may be formed in a shape similar to a torsion spring.

[0176] The brush 270 , one end of which is fixed to the insertion groove 281 of the fixing part 280 or the locking part 241 , may elastically contact the coupling assembly 260 .

[0177] The coupling assembly 260, which rotates together with the receiving disc 150, slides in contact with the other end of the brush 270 and can be electrically connected to the brush 270. The brush 270 can be electrically connected to the ground or the lower electrode through the disc 130.

[0178] Figure 13 This is a schematic diagram illustrating the fixing member 280 .

[0179] The fixing member 280 may include an insertion slot 281 into which one end of the brush 270 can be inserted, and a first locking hole 289 through which the locking member 241 can pass. In this case, the insertion slot 281 may be formed to surround the first locking hole 289 through which the locking member 241 can pass. When the fixing member 280 is inserted into the fixing slot 240, one end of the brush 270 is inserted into the insertion slot 281, and the locking member 241 is attached to the first locking hole 289, one end of the brush 270 can be brought into a position surrounding the locking member 241. At this point, because one end of the brush 270 is blocked by the locking member 241, the brush 270 can be reliably prevented from detaching from the fixing slot 240.

[0180] Figure 14 It is a perspective view illustrating a second embodiment of the first electrical channel.

[0181] The other end of the brush 270 in sliding contact with the coupling assembly 260 preferably extends along the rotation direction of the coupling assembly 260. As an example, when the coupling assembly 260 rotates in the positive direction corresponding to the clockwise direction, the other end of the brush 270 preferably extends in a direction tracking the positive direction.

[0182] However, in the above-described case, when the coupling assembly 260 rotates in the reverse direction corresponding to the counterclockwise direction, the other end of the brush 270 may be temporarily separated from the coupling assembly 260 due to a jumping phenomenon.

[0183] In order to ensure that the brush 270 can be securely attached to the coupling assembly 260 regardless of the rotation direction of the coupling assembly 260 , the brush 270 may include a first brush 270 extending in the forward direction and a second brush 270 extending in the reverse direction.

[0184] Furthermore, a solution excluding the separate fixing member 280 installed in the fixing groove 240 may also be provided.

[0185] Figure 18 This is a schematic diagram illustrating the brush 270 of the present invention.

[0186] A plate-shaped fixing portion 273 inserted into the fixing groove 240 may be provided at one end of the brush 270. The fixing portion 273 may be formed in the same shape and size as the fixing groove on a flat surface.

[0187] A second locking hole 275 for mounting the locking member 241 may be formed in the fixing portion 273 .

[0188] A main body portion 271 may be formed on one side of the fixing portion 273 to contact the coupling assembly 260. The main body portion 271 may extend from one side of the fixing portion 273 toward the coupling assembly 260. The main body portion 271 may be bent in a direction perpendicular to the fixing portion 273 so as to make line contact or surface contact with the side surface of the coupling assembly 260.

[0189] Figure 15 This is a plan view showing a state where the brush 270 of the present invention is installed in the fixing groove 240 .

[0190] When the fixing portion 273 is inserted into the fixing groove 240 and the locking member 241 is installed in the second coupling hole 275 , the fixing portion 273 corresponding to one end of the brush 270 may be locked into the fixing groove 240 .

[0191] The main body portion 271 protruding from the fixing groove 240 toward the coupling assembly 260 can be bent in a forward direction or a reverse direction and elastically adhered to the side surface of the coupling assembly 260 .

[0192] Figure 16It is a perspective view illustrating a third embodiment of the first electrical channel.

[0193] The other end of the brush 270 formed in sliding contact with the side surface of the coupling assembly 260 may be bent toward the inner wall of the coupling groove 234 and wound in a closed curve shape.

[0194] One side of the other end of the brush 270 wound in the closed curve shape may be in contact with the side surface of the coupling assembly 260 , and the other side may have an elastic force in contact with the inner wall of the coupling groove 234 .

[0195] At this time, the other end of the brush 270 wound in the closed curve shape may be extended in the forward direction and the reverse direction based on the fixing groove 240 .

[0196] Figure 17 FIG. 1 is a plan view illustrating another third embodiment of the first electrical channel.

[0197] The brush 270 having the other end in the closed curve shape can reliably contact the coupling assembly 260 regardless of the rotation direction of the coupling assembly 260 as long as it extends in either the forward direction or the reverse direction.

[0198] Brush 270, formed in a closed curve shape, can make surface contact with the side surface of coupling assembly 260 by virtue of elastic force, with one side and the other side simultaneously contacting the side surface of coupling assembly 260 and the inner wall of coupling groove 234. In order to maintain a stable surface contact at this time regardless of the rotation direction of coupling assembly 260, brush 270 can be formed as follows.

[0199] The brush 270 protruding from the fixing groove 240 may extend along the positive direction by a first length L1 and be closely attached to the side surface of the coupling assembly 270 .

[0200] The brush 270 extending by the first length L1 may be bent toward the inner wall of the coupling slot 234 and then extended by the second length L2 in the reverse direction to be closely attached to the inner wall of the coupling slot 234 .

[0201] The brush 270 extended by the second length L2 may be bent toward the coupling assembly 260 again and then extended by a third length L3 in the positive direction and attached to the coupling assembly 260 .

[0202] The brush 270 extended by the third length L3 may be bent toward the inner wall of the coupling slot 234 again and then extended in the reverse direction and adhered to the inner wall of the coupling slot 234 .

[0203] In this embodiment, because brush 270 is bent multiple times and overlapped, the elastic force of brush 270, which keeps it in contact with coupling assembly 260 and the inner wall of coupling groove 234, is strengthened. This strengthened elastic force allows brush 270 to maintain surface contact with coupling assembly 260 over a longer period. Furthermore, even when coupling assembly 260 rotates in the reverse direction, brush 270 remains wound in a closed curve, maintaining electrical connection between coupling assembly 260 and disc portion 130.

[0204] Figure 19 This is an oblique view illustrating the bearing. Figure 20 This is a cross-sectional view illustrating a bearing. Figure 21 This is a cross-sectional view showing a state in which the coupling assembly 260 and the carrier plate gear 180 are mounted in the bearing.

[0205] In the bearing corresponding to the shaft portion 131 , an outer ring 310 fixed to the first through hole 134 and an inner ring 330 rotatably installed in the outer ring 310 may be provided.

[0206] For sliding bearings, such as graphite bearings, that rotate the inner ring 330 relative to the outer ring 310 through sliding contact surfaces, a contact surface is inevitably formed between the outer ring 310 and the inner ring 330. In this case, if the outer ring 310 and the inner ring 330 are made of conductive materials, the bearing can electrically connect various components connected to the outer ring 310 with various components connected to the inner ring 330.

[0207] As an example, when the disc portion 130 is provided with a first through hole 134 for fixing the outer ring 310 , the outer ring 310 may be electrically connected to the first through hole 134 and the disc portion 130 .

[0208] The inner ring 330 may be connected to the carrier plate portion 150 or the carrier plate gear 180 via the coupling assembly 260 .

[0209] Because the receiving disc portion 150 connected to the inner ring 330 is electrically connected to the inner ring 330, it can ultimately be electrically connected to the disc portion 130 through the inner ring 330 and the outer ring 310. In this case, a second electrical path ② can be formed.

[0210] Alternatively, if the receiving pan 150 and the receiving pan gear 180 are both connected to the inner ring 330, the receiving pan 150 and the receiving pan gear 180 can be electrically connected to each other through the inner ring 330. In this case, a third electrical path ③ can be formed.

[0211] Figure 22 It is an exploded oblique view of the bearing.

[0212] A first sliding portion 313 having a groove shape into which a portion of the inner ring 330 can be inserted may be formed on the inner circumferential surface of the outer ring 310 .

[0213] In order to form the first sliding portion 313 continuously along the inner circumference, the outer ring 310 may include a first outer ring 311 and a second outer ring 312 coupled to each other.

[0214] An upper portion of the first sliding portion 313 may be formed in the first outer ring 311 , and a lower portion of the second sliding portion 333 may be formed in the second outer ring 312 .

[0215] A second sliding portion 333 having a protruding shape and inserted into the first sliding portion 313 may be formed on the outer circumferential surface 331 of the inner ring 330 .

[0216] The outer circumferential surface 331 of the inner ring 330 may be provided with an intaglio surface 332 corresponding to a groove at each set angle. The intaglio surface 332 can reduce the friction resistance between the inner ring 330 and the outer ring 310.

[0217] The engraved surface 332 may also be provided on an upper side surface of the second sliding portion 333 facing the first outer ring 311 or a lower side surface of the second sliding portion 333 facing the second outer ring 312 .

[0218] Figure 23 is a schematic diagram illustrating a fourth embodiment of the first electrical channel, Figure 24 Yes Figure 23 A schematic diagram illustrating the cutting surface of AA`.

[0219] The receiving pan portion 150 of the present invention can be rotatably mounted on the disc portion 130. In order to prevent the receiving pan portion 150 from being restricted in its rotation, the receiving pan portion 150 can be formed at a certain distance from the disc portion 130.

[0220] In order to prevent particles on the upper part of the receiving pan portion 150 from flowing into between the receiving pan portion 150 and the disc portion 130, a labyrinth seal can be formed on the bottom surface of the seating groove 138 of the disc portion 130 facing the receiving pan portion 150 or on the other side of the receiving pan portion 150 facing the seating groove 138.

[0221] A brush 270 may be installed in a small gap between the bottom surface of the receiving pan portion 150 and the upper side surface of the disc portion 130 .

[0222] One end of the brush 270 can be locked to one of the bottom surface of the receiving tray portion 150 or the upper side surface of the receiving tray portion 150, and the other end of the brush 270 can be formed in a sliding contact manner with the other one of the bottom surface of the receiving tray portion 150 or the upper side surface of the receiving tray portion 150.

[0223] For the convenience of maintenance, it is preferable to lock one end of the brush 270 to the receiving disc portion 150 which can be separated from the disc portion 130 .

[0224] Figure 25 This is a schematic diagram illustrating the bottom surface of the disk portion 130 .

[0225] The first rotating unit may further include an intermediate gear 190 interposed between the main gear 170 and the receiving plate gear 180. The main gear 170 and the intermediate gear 190 may function as interlocking gears for transmitting the power of the motor to the receiving plate gear 180.

[0226] By means of the intermediate gear 190 , the first main gear 170 , the receiving plate gear 180 , and the receiving plate portion 150 can rotate in the same direction.

[0227] As an example, in Figure 25 It is assumed that the main gear 170 rotates in the clockwise direction.

[0228] When the receiving plate gear 180 is directly meshed with the main gear 170 , the receiving plate gear 180 and the receiving plate portion 150 rotate in a counterclockwise direction opposite to the main gear 170 .

[0229] On the contrary, when the intermediate gear 190 is interposed, the receiving plate gear 180 and the receiving plate portion 150 also rotate in the clockwise direction.

[0230] Figure 26 This is another schematic diagram illustrating the bottom surface of the disk portion 130 .

[0231] like Figure 25 As shown, a plurality of intermediate gears 190 may be provided according to the number of the receiving plate gears 180. In this case, the number of the intermediate gears 190 required may be reduced by adjusting the diameter and the configuration position of the intermediate gears 190.

[0232] As an example, one intermediate gear 190 can be formed so as to mesh with two receiving plate gears 180 spaced a certain distance apart and the first rotating shaft 140. In this embodiment, it is preferable to install an odd number of receiving plate portions 150 in the circular disc portion 130, and the number of intermediate gears 190 can be half the number of receiving plate portions 150.

[0233] Figure 27 as well as Figure 28 This is another schematic diagram illustrating the bottom surface of the disk portion 130 .

[0234] A plurality of receiving plate gears 180 can be formed in a mode of meshing with each other. In the above-mentioned situation, as long as a receiving plate gear 180 is driven by a motor to rotate, all receiving plate gears 180 can be driven to rotate together.

[0235] The main gear 170 may be mounted on the same shaft as the second rotation shaft 120 which is the rotation center of the disk portion 130 or on a different shaft.

[0236] exist Figure 27 In the embodiment, the main gear 170 and the second rotating shaft 120 are formed at different positions, and Figure 28 In the embodiment, the main gear 170 and the second rotating shaft 120 are mounted on the same shaft.

[0237] While the above descriptions describe embodiments applicable to the present invention, these are merely exemplary. Those skilled in the art will readily appreciate that various modifications and equivalent embodiments are possible based on these descriptions. Therefore, the true technical scope of the present invention should be defined by the appended claims.

[0238] (Explanation of Symbols)

[0239] 10: Substrate, 110: Chamber, 120: Second rotating shaft, 130: Disc portion, 131: Shaft portion (bearing), 140: First rotating shaft, 150: Receiving plate portion, 151: Lifter portion, 160: Lifter driving portion, 170: Main gear, 180: Receiving plate gear, 190: Intermediate gear, 210: Adjusting portion, 230: Upper and lower portions, 250: Upper electrode, 260: Combining assembly, 270: Brush, 280: Fixing component, 290: Heating assembly.

Claims

1. A substrate processing device, characterized in that: include: a disc portion disposed inside a chamber equipped with a heating element; and The receiving disc portion is mounted on one side of the disc portion and is used to place the substrate. Wherein, on the mounting surface of the disc portion on which the receiving disc portion is mounted, a heat hole is formed at a position facing the receiving disc portion, through which heat generated by the heating component can pass.

2. The substrate processing apparatus according to claim 1, wherein: The disc portion rotates relative to the chamber, As the disk rotates, one substrate is exposed to at least one of a source gas, a purge gas, and a reaction gas. The receiving disk portion on which the substrate is placed rotates independently of the rotation of the circular disk portion.

3. The substrate processing apparatus according to claim 1, wherein: The heating assembly includes a heater mounted on the other side of the disc portion inside the chamber, The heat of the heater is transferred to the receiving pan through the heat hole.

4. The substrate processing apparatus according to claim 1, wherein: The receiving disc portion is provided with a plurality of disc portions in the disc portion. The heating assembly is installed at a position facing the heat hole. The heating component and the disc portion move relative to each other so that the plurality of heat holes alternately pass through positions facing specific positions of the heating component.

5. The substrate processing apparatus according to claim 1, wherein: A placement groove for placing the receiving disc portion is formed on one side of the disc portion. The heat hole is formed in the center of the bottom surface of the placement groove. The diameter of the heat hole is smaller than the diameter of the receiving disc. Due to the diameter difference between the heat hole and the receiving pan, the center of the receiving pan faces the heat hole, and the edge of the receiving pan is rotatably supported by the bottom edge of the seating groove.

6. The substrate processing apparatus according to claim 1, wherein: The heat dissipation device is provided with a mounting portion formed in the center of the heat dissipation hole and a joint portion penetrating the heat dissipation hole and connecting the mounting portion and the disk portion. A shaft portion serving as a rotation center of the receiving plate portion is mounted on the mounting portion. The receiving pan portion is mounted on the receiving pan portion so as to be rotatable about the shaft portion.

7. The substrate processing apparatus according to claim 1, wherein: The heat dissipation device is provided with a mounting portion formed in the center of the heat dissipation hole and a joint portion penetrating the heat dissipation hole and connecting the mounting portion and the disk portion. The joint is equipped with a plurality of Each engaging portion is formed in a rod-like shape and is arranged at different angles from each other with the mounting portion as the center. The thermal hole is divided into a plurality of parts by means of the plurality of joints. Each of the heat holes divided into a plurality of parts is formed in a fan-shaped shape.

8. The substrate processing apparatus according to claim 1, wherein: A lifter portion for lifting the substrate is provided at the center of the receiving tray portion. A lifter hole is formed through which a lifter driving portion for pushing the lifter portion upward or pulling the lifter portion downward passes.

9. The substrate processing apparatus according to claim 1, wherein: An end cover is provided which is installed on the other side of the disc portion and shields at least a portion of the heat hole.

10. The substrate processing apparatus according to claim 1, wherein: The receiving disc gear is installed on the other side of the disc part and connected to the receiving disc part, a linkage gear meshed with the receiving disc gear, and a first driving part that drives the linkage gear to rotate. When the linkage gear rotates by means of the first driving part, the receiving plate portion rotates together with the receiving plate gear engaged with the linkage gear. The interlocking gear is arranged at a position different from that of the receiving plate gear in a direction parallel to the disc portion.

11. The substrate processing apparatus according to claim 1, wherein: equipped with a shaft portion connected to the receiving disc portion and rotatably supported by the disc portion, The receiving plate gear connected to the receiving plate portion is provided with a center portion that can be detached from the shaft portion. A lifter portion for lifting the substrate is provided at the center of the receiving tray portion. A lifter hole is formed at the center of the shaft portion, through which a lifter driving portion for pushing the lifter portion upward or pulling the lifter portion downward passes. A through hole is formed in the center of the central portion so that the lifter portion can pass through. The lifter hole is formed on the same axis as the through hole.

12. The substrate processing apparatus according to claim 1, wherein: Equipped with a receiving plate gear facing the disc portion, A gear hole is formed in the receiving plate gear, through which heat from the heating component can pass.

13. The substrate processing apparatus according to claim 12, wherein: The receiving plate gear is formed to a size that can cover the heat hole. The gear hole is formed on the receiving plate gear facing the heat hole.

14. The substrate processing apparatus according to claim 1, wherein: The substrate processing device further includes: A high-frequency power supply for forming plasma; an upper electrode or antenna connected to one end of the high frequency power supply; and The lower electrode or ground terminal is connected to the other end of the high frequency power supply, wherein the receiving plate is connected to the lower electrode or the ground terminal, The receiving disc portion is rotatably mounted on the disc portion. An electrical connection assembly is provided for electrically connecting the lower electrode or the ground terminal as the fixed part and the receiving disc as the rotating part. The electrical connection assembly includes a brush, one end of which is fixed to the disc portion, and the other end of which is in elastic contact with the receiving disc portion.

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