Electronic equipment monitoring device and monitoring method thereof
By designing the electronic equipment monitoring devices of the reaction department, control department and monitoring department, the problem of difficult to know the internal state of the chassis is solved, intuitive temperature monitoring and position adjustment are realized, and the safety and normal use of the equipment are ensured.
Patent Information
- Application Number
- CN202210141894.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-02-16
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2042-02-16
AI Technical Summary
In the prior art, the internal state of the electronic equipment is difficult to be known by the user as soon as possible during operation, resulting in damage to the equipment and inconvenient position of the monitoring device, affecting the normal use of the computer.
An electronic equipment monitoring device is designed, including a reaction unit, a control unit and a monitoring unit. The temperature change is displayed intuitively through the reaction unit, the control unit reminds the temperature threshold, and the monitoring unit facilitates position adjustment, realizing intuitive monitoring and safety guarantee of the internal state of the chassis.
It realizes intuitive reaction of the internal state of the chassis and stable temperature monitoring, avoids equipment overheating and damage, ensures component safety and convenient position adjustment.
Smart Images
Figure CN114659638B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic equipment monitoring, and in particular to an electronic equipment monitoring device and a monitoring method thereof. Background Art
[0002] Electronic equipment refers to equipment composed of electronic components such as integrated circuits, transistors, and electron tubes, and which uses electronic technology (including) software to function. It includes electronic computers and robots controlled by electronic computers, numerical control or program control systems, etc.
[0003] The different data that electronic devices need to process during operation will also lead to different operating states of the electronic devices. Various states will be presented during the operation of the electronic devices. This state will be directly fed back to the background program of the computer, so that the user can understand it. However, since the user will mostly run the main program during use, the state inside the chassis cannot be fully known at the first time. Long-term operation will cause damage to the equipment inside the chassis, affecting the normal use of the computer. In addition, the monitoring device is installed inside the chassis, which is not convenient for adjusting the position of the monitoring device, which is relatively inconvenient. Summary of the Invention
[0004] (1) Technical problems solved
[0005] In response to the deficiencies of the prior art, the present invention provides an electronic equipment monitoring device and a monitoring method thereof, which have the advantages of being able to more intuitively reflect the status inside the chassis and being able to easily adjust the position of the monitoring device. It is used to solve the problem in the prior art that since users mostly run major programs during use, the status inside the chassis cannot be fully known at the first time, and long-term operation will cause damage to the equipment inside the chassis, affecting the normal use of the computer, and the monitoring device is installed inside the chassis, which makes it inconvenient to adjust the position of the monitoring device, which is relatively inconvenient.
[0006] (2) Technical solution
[0007] The present invention provides the following technical solution: an electronic device monitoring device, comprising: a mounting plate; a reaction unit, arranged on the outside of the mounting plate, for displaying the status of the electronic device; a control unit, arranged on the outside of the mounting plate, for controlling the status of the reaction unit; and a monitoring unit, installed on the outside of the control unit, for monitoring the internal status of the electronic device.
[0008] The present invention provides an electronic equipment monitoring device that can monitor electronic equipment. Compared with ordinary monitoring devices, the monitoring device provided by the present invention has the advantages of being able to more intuitively reflect the status inside the chassis and being able to easily adjust the position of the monitoring device. It is used to solve the problem in the prior art that since users mostly run major programs during use, the status inside the chassis cannot be fully known at the first time, and long-term operation will cause damage to the equipment inside the chassis, affecting the normal use of the computer. In addition, the monitoring device is installed inside the chassis, which makes it inconvenient to adjust the position of the monitoring device, which is relatively inconvenient.
[0009] In one possible embodiment, the reaction part includes: an auxiliary disk fixed to the outer surface of the mounting plate; a fixed disk arranged on the inner side of the mounting plate; an adjustment disk movably arranged on the inner side of the mounting plate; and a pressure plate fixed on the inner side of the adjustment disk for contacting the fixed disk.
[0010] In a possible implementation, the reaction unit further includes: a mounting frame fixed to the outer surface of the mounting plate; a reaction tube fixed inside the mounting frame; and an RGB lamp fixed inside the mounting frame.
[0011] In a possible implementation, the adjusting disk is movable relative to the mounting plate, the fixing disk is connected to the mounting frame, and the adjusting disk is capable of pressing the fixing disk.
[0012] By setting up a reaction part, the state of the internal temperature of the chassis can be intuitively reflected during use, thereby ensuring that during use, the user can more intuitively observe the temperature changes of the internal components, avoid the occurrence of internal components overheating and causing damage to the components, and further can stably monitor the components.
[0013] In one possible embodiment, the control unit includes: an auxiliary box fixed to the outer surface of the mounting bracket; a fluorescent liquid arranged inside the auxiliary box; a pump fixed to the outer surface of the auxiliary box for connecting to the auxiliary box; and a connecting pipe fixed to the output end of the pump for connecting to the reaction tube.
[0014] In a possible embodiment, the control unit also includes: a control element fixed to the outer surface of the auxiliary box, used to control the switch of the pump; a broadcast component fixed to the outer surface of the auxiliary box; and a feedback component fixed to the outer surface of the auxiliary box, electrically connecting the control element and the broadcast component.
[0015] By setting up a control unit, the state of the reaction unit can be controlled, which can make the monitored state more intuitive, and can facilitate reminders when the internal temperature reaches a certain threshold, thereby ensuring that the internal components are at a reasonable operating temperature, and further ensuring the safety of the internal components.
[0016] In one possible embodiment, the monitoring unit includes: a monitoring probe, which is arranged on the outside of the control element; an infrared temperature measuring probe, which is fixed to the outer surface of the monitoring probe; a connecting line, which connects the control element with the monitoring probe and the infrared temperature measuring probe; an adjusting wheel, which is fixed to the outer surface of the monitoring probe; and a suction cup, which is movably arranged on the outside of the adjusting disk.
[0017] In a possible implementation, the adjusting wheel can rotate relative to the suction cup, and the suction cup can be adsorbed into the chassis.
[0018] By setting up a monitoring unit, it is possible to facilitate the detection of the status of each part inside the chassis, thereby ensuring more stable temperature monitoring, and being able to monitor the temperature within a certain range after installation, thereby making the heat diffusion process of the components more intuitive, and further facilitating the monitoring of the internal temperature.
[0019] In one possible implementation, a monitoring method for an electronic device monitoring device includes the following steps:
[0020] S1. Fix the suction cup inside the chassis, and then adjust the angle position of the monitoring probe using the adjustment wheel;
[0021] S2. Fix the monitoring probe at the middle connecting line position to an important position of the chassis;
[0022] S3. The status detected by the monitoring probe and the infrared temperature measuring probe is fed back to the feedback component;
[0023] S4. Based on the status of the feedback component, the control element is used to control the pump to fill the fluorescent liquid into the reaction tube for reaction.
[0024] Compared with the prior art, the present invention provides an electronic equipment monitoring device and a monitoring method thereof, which have the following beneficial effects:
[0025] 1. The present invention is capable of intuitively responding to the state of the internal temperature of the chassis during use by providing a reaction unit, thereby ensuring that during use, the user can more intuitively observe the temperature changes of the internal components, avoiding the occurrence of internal components overheating and causing damage to the components, and further being able to stably monitor the components.
[0026] 2. The present invention can control the state of the reaction part by setting up a control part, thereby making the monitored state more intuitive, and can facilitate reminders when the internal temperature reaches a certain threshold, thereby ensuring that the internal components are at a reasonable operating temperature, and further ensuring the safety of the internal components.
[0027] 3. By setting up a monitoring unit, the present invention can facilitate the detection of the status of various parts inside the chassis, thereby ensuring more stable temperature monitoring, and can monitor the temperature within a certain range after installation, so that the heat diffusion process of the components can be made more intuitive, and further facilitate the monitoring of the internal temperature.
[0028] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 This is a schematic diagram of the overall structure of an electronic equipment monitoring device and a monitoring method thereof provided by the present invention;
[0030] Figure 2 A partial structural diagram of an electronic equipment monitoring device and a monitoring method thereof provided by the present invention;
[0031] Figure 3 A partial structural rear view of an electronic equipment monitoring device and a monitoring method thereof provided by the present invention;
[0032] Figure 4 A cross-sectional view of an installation plate of an electronic equipment monitoring device and a monitoring method thereof provided by the present invention;
[0033] Figure 5 This is a partially enlarged view of an electronic equipment monitoring device and a monitoring method thereof provided by the present invention.
[0034] Among them: 1 mounting plate, 21 fixing plate, 22 adjusting plate, 23 pressing plate, 24 auxiliary plate, 25 mounting frame, 26 reaction tube, 27 RGB light, 31 auxiliary box, 32 pump, 33 connecting pipe, 35 control element, 36 broadcast component, 37 feedback component, 41 connecting line, 42 monitoring probe, 43 infrared temperature probe, 44 suction cup, 45 adjusting wheel. DETAILED DESCRIPTION
[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0036] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention.
[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0038] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.
[0039] like Figure 1-5 As shown, the present invention provides an electronic device monitoring device, comprising: a mounting plate 1; a reaction portion, disposed on the outside of the mounting plate 1, for displaying the status of the electronic device; a control portion, disposed on the outside of the mounting plate 1, for controlling the status of the reaction portion; and a monitoring portion, mounted on the outside of the control portion, for monitoring the internal status of the electronic device.
[0040] The present invention provides an electronic equipment monitoring device that can monitor electronic equipment. Compared with ordinary monitoring devices, the monitoring device provided by the present invention has the advantages of being able to more intuitively reflect the status inside the chassis and being able to easily adjust the position of the monitoring device. It is used to solve the problem in the prior art that since users mostly run major programs during use, the status inside the chassis cannot be fully known at the first time, and long-term operation will cause damage to the equipment inside the chassis, affecting the normal use of the computer. In addition, the monitoring device is installed inside the chassis, which makes it inconvenient to adjust the position of the monitoring device, which is relatively inconvenient.
[0041] In one possible embodiment, the reaction part includes: an auxiliary disk 24, fixed to the outer surface of the mounting plate 1; a fixed disk 21, arranged on the inner side of the mounting plate 1; an adjustment disk 22, movably arranged on the inner side of the mounting plate 1; and a pressure plate 23, fixed on the inner side of the adjustment disk 22, for contacting the fixed disk 21.
[0042] In a possible embodiment, the reaction unit further includes: a mounting frame 25 fixed to the outer surface of the mounting plate 1 ; a reaction tube 26 fixed inside the mounting frame 25 ; and an RGB lamp 27 fixed inside the mounting frame 25 .
[0043] In a possible implementation, the adjusting disk 22 is movable relative to the mounting plate 1 , the fixing disk 21 is connected to the mounting bracket 25 , and the adjusting disk 22 is capable of pressing the fixing disk 21 .
[0044] By setting up a reaction part, the state of the internal temperature of the chassis can be intuitively reflected during use, thereby ensuring that during use, the user can more intuitively observe the temperature changes of the internal components, avoid the occurrence of internal components overheating and causing damage to the components, and further can stably monitor the components.
[0045] In one possible embodiment, the control unit includes: an auxiliary box 31, fixed to the outer surface of the mounting bracket 25; a fluorescent liquid, arranged inside the auxiliary box 31; a pump 32, fixed to the outer surface of the auxiliary box 31, for connecting to the auxiliary box 31; and a connecting pipe 33, fixed to the output end of the pump 32, for connecting to the reaction tube 26.
[0046] In one possible embodiment, the control unit also includes: a control element 35, fixed on the outer surface of the auxiliary box 31, for controlling the switch of the pump 32; a broadcast component 36, fixed on the outer surface of the auxiliary box 31; and a feedback component 37, fixed on the outer surface of the auxiliary box 31, electrically connecting the control element 35 and the broadcast component 36.
[0047] By setting up a control unit, the state of the reaction unit can be controlled, which can make the monitored state more intuitive, and can facilitate reminders when the internal temperature reaches a certain threshold, thereby ensuring that the internal components are at a reasonable operating temperature, and further ensuring the safety of the internal components.
[0048] In one possible embodiment, the monitoring unit includes: a monitoring probe 42, which is arranged on the outside of the control element 35; an infrared temperature measuring probe 43, which is fixed on the outer surface of the monitoring probe 42; a connecting line 41, which connects the control element 35 with the monitoring probe 42 and the infrared temperature measuring probe 43; an adjusting wheel 45, which is fixed on the outer surface of the monitoring probe 42; and a suction cup 44, which is movably arranged on the outside of the adjusting disk 22.
[0049] In a possible implementation, the adjusting wheel 45 can rotate relative to the suction cup 44 , and the suction cup 44 can be adsorbed into the chassis.
[0050] By setting up a monitoring unit, it is possible to facilitate the detection of the status of each part inside the chassis, thereby ensuring more stable temperature monitoring, and being able to monitor the temperature within a certain range after installation, thereby making the heat diffusion process of the components more intuitive, and further facilitating the monitoring of the internal temperature.
[0051] In one possible embodiment, a monitoring method for an electronic device monitoring device includes the following steps: fixing a suction cup 44 inside a chassis, then adjusting the angular position of the monitoring probe 42 by means of an adjusting wheel 45, fixing the monitoring probe 42 at the position of the middle connecting line 41 at an important position of the chassis, and feeding back the status monitored by the monitoring probe 42 and the infrared temperature measuring probe 43 to the feedback component 37, and according to the status of the feedback component 37, controlling the pump 32 by means of the control element 35 to fill the fluorescent liquid into the reaction tube 26 for reaction, and monitoring the temperature according to the amount of fluorescent liquid inside the reaction tube 26; when fixing, sucking the auxiliary plate 24 onto a desktop or other position, and then rotating the adjustment plate so that the fixing plate is pressurized and sucked into the fixed position.
[0052] In addition, the present invention also provides an electronic equipment monitoring device and a method for using the monitoring method thereof.
[0053] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is defined by the appended claims and their equivalents.
[0054] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.
[0055] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. The following description of at least one exemplary embodiment is merely illustrative and in no way limits the present invention, its application, or use. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
Claims
1. An electronic equipment monitoring device, characterized in that: include: Mounting plate (1); A reaction part is arranged on the outside of the mounting plate (1) and is used to display the status of the electronic device. The reaction part includes: An auxiliary plate (24) is fixed to the outer surface of the mounting plate (1); A fixing plate (21) is arranged inside the mounting plate (1); An adjusting disk (22) is movably arranged inside the mounting plate (1); A pressure plate (23) is fixed to the inner side of the regulating disk (22) and is used to contact the fixed disk (21). The reaction part also includes: A mounting frame (25) is fixed to the outer surface of the mounting plate (1); A reaction tube (26) is fixed inside the mounting frame (25); The RGB lamp (27) is fixed inside the mounting frame (25), the adjustment disk (22) is movable relative to the mounting plate (1), and the fixed disk (21) is connected to the mounting frame (25), and the adjustment disk (22) is capable of squeezing the fixed disk (21); A control unit, arranged outside the mounting plate (1), for controlling the state of the reaction unit; and A monitoring unit, installed outside the control unit, for monitoring the internal status of the electronic device; An auxiliary box (31) is fixed to the outer surface of the mounting frame (25); Fluorescent liquid is arranged inside the auxiliary box (31); A pump (32) is fixed to the outer surface of the auxiliary box (31) and is used to communicate with the auxiliary box (31); A connecting pipe (33) is fixed to the output end of the pump (32) and is used to connect to the reaction tube (26); A control element (35) is fixed to the outer surface of the auxiliary box (31) and is used to control the switch of the pump (32); A broadcasting component (36) is fixed to the outer surface of the auxiliary box (31); A feedback component (37) is fixed to the outer surface of the auxiliary box (31) and electrically connects the control element (35) and the broadcast component (36); A monitoring probe (42) is arranged outside the control element (35); An infrared temperature measuring probe (43) is fixed to the outer surface of the monitoring probe (42); A connecting line (41) connects the control element (35) with the monitoring probe (42) and the infrared temperature measuring probe (43); An adjusting wheel (45) is fixed to the outer surface of the monitoring probe (42); A suction cup (44) is movably arranged outside the adjustment disc (22).
2. The electronic equipment monitoring device according to claim 1, characterized in that: The regulating wheel (45) can rotate relative to the suction cup (44), and the suction cup (44) can be adsorbed in the chassis.
3. A monitoring method for an electronic device monitoring device according to claim 1, comprising the following steps: S1, fix the suction cup (44) inside the chassis, and then adjust the angle position of the monitoring probe (42) through the adjustment wheel (45); S2, fix the monitoring probe (42) at the position of the middle connecting line (41) to an important position of the chassis; The status detected by S3, the monitoring probe (42) and the infrared temperature measuring probe (43) is fed back to the feedback component (37); S4. Based on the status of the feedback component (37), the control element (35) is used to control the pump (32) to fill the fluorescent liquid into the reaction tube (26) for reaction.
Citation Information
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