Device integrity monitoring method and related device

Abstract

The application provides a device integrity monitoring method and related devices. The method comprises: setting a standard device structure identifier on the surface of a device structure; after the device structure is used, the standard device structure identifier is measured to obtain a measured device structure identifier; a first image corresponding to the standard device structure identifier is obtained; a second image corresponding to the measured device structure identifier is obtained; whether the first image and the second image match is analyzed; and in response to the first image and the second image not matching, alarm information of the device structure is broadcast. The device structure is monitored through the device structure identifier, which not only reduces the requirements for the resolution and installation position of the monitoring device, but also effectively improves the accuracy of the final monitoring result of the device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of equipment monitoring, and in particular to an equipment integrity monitoring method and related equipment. BACKGROUND

[0002] A prominent feature of some equipment in use is strong vibration, which causes the components installed on the equipment to be easily affected by vibration and fall off, resulting in deformation of the equipment structure or even loss of components. This will seriously affect the safety of equipment operators and people near the equipment. However, in the prior art, equipment is generally monitored manually. Accordingly, in order to meet the requirements of human eye monitoring, the monitoring equipment of the equipment structure needs to meet the requirement of high resolution, and similarly, the installation position of the monitoring equipment also needs to be fine. However, due to the performance of the monitoring equipment and the error of the human eye, slight deformation of the equipment structure cannot be monitored in time. SUMMARY

[0003] Therefore, the present application aims to provide an equipment integrity monitoring method and related equipment.

[0004] To achieve the above purpose, the present application provides an equipment integrity monitoring method, characterized in that it comprises:

[0005] a standard equipment structure mark is arranged on the surface of the equipment structure;

[0006] after the equipment structure is used, the standard equipment structure mark is measured to obtain a measured equipment structure mark;

[0007] a first image corresponding to the standard equipment structure mark is obtained;

[0008] a second image corresponding to the measured equipment structure mark is obtained;

[0009] whether the first image and the second image match is analyzed;

[0010] in response to the first image and the second image not matching, alarm information of the equipment structure is broadcasted.

[0011] Optionally, the standard equipment structure mark comprises at least three first mark points;

[0012] a first mark line is formed between every two first mark points;

[0013] the measured equipment structure mark comprises second mark points;

[0014] a second mark line is formed between every two second mark points.

[0015] Optionally, the first image comprises a first mark point image and a first mark line image.

[0016] The device structure identification standard comprises:

[0017] The first mark point image is obtained.

[0018] The first mark line image is obtained.

[0019] The second image comprises a second mark point image and a second mark line image.

[0020] The second image corresponding to the measured device structure identification is obtained, comprising:

[0021] The second mark point image is obtained.

[0022] The second mark line image is obtained.

[0023] Optionally, the analysis of whether the first image and the second image match comprises:

[0024] whether the number and position of the first mark points in the first mark point image match those of the second mark points in the second mark point image; and,

[0025] whether the length of the first mark lines in the first mark line image matches that of the second mark lines in the second mark line image; and,

[0026] whether the ratio of the length of each two first mark lines in the first mark line image matches that of each two second mark lines in the second mark line image.

[0027] Optionally, the first image and the second image do not match, comprising:

[0028] the first mark point image does not match the second mark point image;

[0029] or,

[0030] the first mark line image does not match the second mark line image;

[0031] or,

[0032] the ratio of the length of each two first mark lines in the first mark line image does not match that of each two second mark lines in the second mark line image.

[0033] Optionally, the at least three first mark points form a recognizable geometric shape.

[0034] The number of the second identification points is less than or equal to the number of the first identification points.

[0035] Optionally, in response to the number of the second identification points being less than or equal to 1, the second identification line is not configured;

[0036] In response to not configuring the second identification line, an alarm message of the equipment structure is broadcasted.

[0037] Based on the same inventive concept, the present application also provides an equipment integrity monitoring device, comprising:

[0038] a setting unit configured to set a standard device structure identifier on a surface of the device structure;

[0039] a measuring unit configured to measure the standard device structure identifier after the device structure is used to obtain a measured device structure identifier;

[0040] a camera configured to acquire a first image corresponding to the standard device structure identifier;

[0041] a camera configured to acquire a second image corresponding to the measured device structure identifier;

[0042] a video analysis host, configured to analyze whether the first image and the second image match;

[0043] The sound and light alarm unit is configured to broadcast an alarm message of the device structure in response to a mismatch between the first image and the second image.

[0044] Based on the same inventive concept, the present application also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and runnable on the processor, wherein when the processor executes the program, the device integrity monitoring method as described in any one of the above items is implemented.

[0045] Based on the same inventive concept, the present application also provides a non-transitory computer-readable storage medium, which stores computer instructions, and the computer instructions are used to enable a computer to execute any of the above-mentioned device integrity monitoring methods.

[0046] It can be seen from the above that the device integrity monitoring method and related device provided by the application, by setting a standard device structure identifier on the surface of the device structure; after the device structure is used, the standard device structure identifier is measured to obtain a measured device structure identifier; a first image corresponding to the standard device structure identifier is obtained; a second image corresponding to the measured device structure identifier is obtained; whether the first image and the second image match is analyzed; and in response to the first image and the second image not matching, alarm information of the device structure is broadcast. For the monitoring device, it can now identify whether the device structure has problems such as deformation and loss, liberating a large amount of manpower, and the deformation of the device structure is represented by the deformation of the device structure identifier, which greatly improves the monitoring accuracy compared with the human eye, and the installation position of the monitoring device does not need to be fine, and only the complete device structure identifier needs to be identified. While effectively reducing the labor, the monitoring accuracy is improved. BRIEF DESCRIPTION OF DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the application or related art, the drawings needed to be used in the embodiments or related art description will be briefly introduced. Obviously, the drawings in the following description are only embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0048] Figure 1 The device integrity monitoring method flowchart of the embodiments of the application;

[0049] Figure 2 The standard device structure identifier schematic diagram of the embodiments of the application;

[0050] Figure 3 The first image schematic diagram of the embodiments of the application;

[0051] Figure 4 The second image schematic diagram when the tamper hammer component is lost of the embodiments of the application;

[0052] Figure 5 The second image schematic diagram when the tamper hammer component is deformed of the embodiments of the application;

[0053] Figure 6 The device integrity monitoring device structure diagram of the embodiments of the application;

[0054] Figure 7 The electronic device structure of the embodiments of the application. DETAILED DESCRIPTION

[0055] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0056] It should be noted that, unless otherwise defined, technical terms or scientific terms used in the embodiments of the present application should be understood as their common meanings to those of ordinary skill in the art to which the present application belongs. The terms "first", "second" and similar terms used in the embodiments of the present application do not represent any order, number or importance, but are only used to distinguish different components. The terms "include" or "contain" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships can also change accordingly.

[0057] As described in the background section, the technical solution of monitoring the device structure by artificial in the related art is to monitor whether the device structure is deformed or lost by the human eye. However, the human eye has poor ability to observe detailed changes, so the resolution requirement of the monitoring device in the prior art is relatively high to facilitate better identification by the human eye. In addition, the installation position of the monitoring device also has high requirements, which needs to make the image of the device structure observed by the monitoring device be not deformed compared with the actual device structure.

[0058] In view of the above considerations, the present application proposes a device integrity monitoring method, which sets a standard device structure identifier on the surface of the device structure, and realizes the effect of automatically comparing and monitoring whether the first image corresponding to the standard device structure identifier obtained by the monitoring device and the second image corresponding to the measured device structure identifier match in the use process, that is, the monitoring of the device structure is realized. In addition, only the complete image corresponding to the device structure identifier needs to be obtained by the monitoring device during monitoring, and there is no other hard requirement for the resolution and installation position of the monitoring device. In addition, compared with the human eye monitoring in the prior art, the method in the present application also effectively improves the accuracy of monitoring. In summary, the present application effectively reduces the demand for manpower and the demand for monitoring devices while improving the accuracy of monitoring.

[0059] In the following, the technical solutions of the embodiments of the present application will be described in detail through specific embodiments.

[0060] Reference Figure 1 The device integrity monitoring method of the embodiments of the present application includes the following steps:

[0061] Step S101, setting standard equipment structure mark on the surface of the equipment structure.

[0062] In this step, when the equipment and components are in the complete state, the geometric shape formed by the marks establishes the "standard equipment structure mark" of the equipment and components. The standard equipment structure mark adopts the color mark method, i.e. pasting or spraying the pattern of the specified color on the equipment and components and the object fixing the equipment and components. The standard equipment structure mark is set according to the equipment structure to be monitored, so that the deformation of the equipment structure can be characterized to the maximum extent.

[0063] Step S102, after the equipment structure is used, the standard equipment structure mark is measured to obtain the measured equipment structure mark.

[0064] In this step, when the equipment and components are used, the geometric shape formed by the marks is the "measured equipment structure mark" of the equipment and components.

[0065] Optionally, the standard equipment structure mark includes at least three first mark points.

[0066] The line connecting each two first mark points is a first mark line.

[0067] The measured equipment structure mark includes second mark points.

[0068] The line connecting each two second mark points is a second mark line.

[0069] In this step, the first mark points and the first mark lines correspond to the standard equipment structure mark, and the second mark points and the second mark lines correspond to the measured equipment structure mark.

[0070] Optionally, the at least three first mark points form a recognizable geometric shape.

[0071] The recognizable geometric shape includes a triangle, a parallelogram, a pentagon, and a hexagon.

[0072] In this step, the shape of the first mark points is a round shape or a square shape, etc. It is noted that the limitation of the shape of the first mark points is only for the subsequent identification to be effectively identified by the monitoring equipment, as long as the shape is easy to be identified, and is not limited to the round shape and the square shape. In addition, there is no accurate requirement for the size and position of the first mark points, as long as they can be completely identified by the monitoring equipment. Moreover, the color of the first mark points needs to be set as a bright color, which can be obviously distinguished from the equipment structure, and it must also form a recognizable geometric shape, such as a triangle, a square, etc., to facilitate the subsequent monitoring to find the deformation of the equipment structure.

[0073] The material of the first identification point can be a luminescent material to adapt to night operation. The material of the first identification point in the application can be any material that can be applied by those skilled in the art. Here, it is only explained that the luminescent material can be selected to adapt to night operation, and it does not mean that only the luminescent material can be used.

[0074] In the embodiment, reference is made to Figure 2 , a schematic diagram of a standard equipment structure identification. In the standard equipment structure identification of the embodiment, the number of first identification points is 3, the color of the identification points is yellow, and the three first identification points form a recognizable geometric shape, i.e., a triangle. The material of the identification points is a luminescent material.

[0075] The number of second identification points is less than or equal to the number of first identification points.

[0076] In the step, in the actual use process, when the components are not lost, the number of second identification points is equal to the number of first identification points. However, the components can be lost during use, and therefore the number of second identification points can be less than the number of first identification points.

[0077] Step S103, acquiring a first image corresponding to the standard equipment structure identification.

[0078] Optionally, the first image includes a first identification point image and a first identification line image.

[0079] The acquiring of the first image corresponding to the standard equipment structure identification includes:

[0080] Acquiring the first identification point image corresponding to the first identification point.

[0081] Acquiring the first identification line image corresponding to the first identification line.

[0082] In the embodiment, reference is made to Figure 3 , a schematic diagram of a first image of the embodiment. At this time, the tamper hammer of the tamper stabilizer vehicle has not been used.

[0083] In the figure, B is a part of the tamper stabilizer vehicle, the tamper hammer P1 is fixed on the tamper device support P2 of the vehicle body through a fastener, and the standard equipment structure identification of the tamper hammer is as shown in Figure 3 . In the figure, the first identification points are: identification point 1, identification point 2, and identification point 3. The first identification line is: identification line a, identification line b, and identification line c.

[0084] Step S104, acquiring a second image corresponding to the measured equipment structure identification.

[0085] In this step, the second image includes a second identification point image and a second identification line image;

[0086] Obtaining the second image corresponding to the measured equipment structure identification includes:

[0087] Obtaining the second identification point image corresponding to the second identification point;

[0088] Obtaining the second identification line image corresponding to the second identification line.

[0089] Optionally, in response to the number of the second identification points being less than or equal to 1, the second identification line is not configured;

[0090] In response to the second identification line not being configured, the alarm information of the equipment structure is broadcasted.

[0091] In this embodiment, the tamper hammer of the DWL-48 tamper stabilizer vehicle is taken as an example, and reference is made to Figure 4 , which is a second image diagram when the tamper hammer part of the embodiment of the present application is lost. At this time, the image is obtained in the use process of the tamper hammer.

[0092] In the figure, B is a part of the tamper stabilizer vehicle, the tamper hammer P1 is missing, and only the tamper device support P2 is left. The embodiment of the present application is reflected on the measured equipment structure identification as: in Figure 3 , the second identification point is: identification point 2. There is no second identification line. At this time, the number of the second identification points is 1, so the second identification line is not configured, and the alarm information of the equipment structure is broadcasted.

[0093] In some optional embodiments, the tamper hammer of the DWL-48 tamper stabilizer vehicle is taken as an example, and reference is made to Figure 5 , which is a second image diagram when the tamper hammer part of the embodiment of the present application is deformed. At this time, the image is obtained in the use process of the tamper hammer.

[0094] In the figure, B is a part of the tamper stabilizer vehicle, the tamper hammer P1 is fixed on the tamper device support P2 of the vehicle body by a fastener, and the measured equipment structure identification of the tamper hammer is as shown in Figure 3 . Among them, the second identification point in the image is: identification point 1, identification point 2 and identification point 3. The second identification line is: identification line a1, identification line b1 and identification line c1.

[0095] Step S105, analyzing whether the first image and the second image match.

[0096] Optionally, the analysis of whether the first image and the second image match includes:

[0097] analyzing whether the size, number and position of the first mark points in the first mark point image match the second mark points in the second mark point image; and

[0098] analyzing whether the length and position of the first mark lines in the first mark line image match the second mark lines in the second mark line image; and

[0099] analyzing whether the ratio of the length of each two first mark lines in the first mark line image matches the ratio of the length of each two second mark lines in the second mark line image.

[0100] In this step, the monitored device structure may be deformed and lost, etc. In the case of deformation, there are also cases of structure deformation and two structure connection deformation. When the structure deformation occurs, the mark points and mark lines may be stretched or compressed, and the position will also change accordingly. When two structure connection deformation occurs, the position of the mark points will change, and the length and position of the mark lines will also change.

[0101] At the same time, the ratio of the length of each two first mark lines and the ratio of the length of each two second mark lines need to be calculated.

[0102] In this embodiment, referring to Figure 3 , the calculation results are: a / b = e, b / c = f, and c / a = g; referring to Figure 5 , the calculation results are: a1 / b1 = e1, b1 / c1 = f1, and c1 / a1 = g1.

[0103] By analyzing the first image Figure 3 and the second image Figure 5 of this embodiment, it can be found that the size and number of the first mark points in the first mark point image match the second mark points in the second mark point image, but the positions do not match. The length and position of the first mark lines in the first mark line image do not match the second mark lines in the second mark line image. The ratio of the length of each two first mark lines in the first mark line image does not match the ratio of the length of each two second mark lines in the second mark line image. As long as one of the above analysis results does not match, the first image and the second image do not match.

[0104] In some optional embodiments, by referring to the first image Figure 3 and the second image Figure 4 , it can be found that Figure 4 there is only one first mark point image in the second image. Obviously, the first image and the second image do not match.

[0105] Step S106, in response to the first image and the second image not matching, broadcasting the alarm information of the device structure.

[0106] Optionally, the first image and the second image not matching comprises:

[0107] The first identification point image and the second identification point image do not match;

[0108] Or,

[0109] The first identification line image and the second identification line image do not match;

[0110] Or,

[0111] The ratio of the length of each two first identification lines in the first identification line image and the ratio of the length of each two second identification lines in the second identification line image do not match.

[0112] In this step, as long as one of the above conditions is met, it is considered that the first image and the second image do not match, and the alarm information of the corresponding device structure is broadcasted.

[0113] As can be seen from the above embodiments, the device integrity monitoring method provided in the embodiments of the present application sets a standard device structure identifier on the surface of the device structure, measures the standard device structure identifier, obtains a first image corresponding to the standard device structure identifier, obtains a second image corresponding to the measured device structure identifier, analyzes whether the first image and the second image match, and broadcasts the alarm information of the device structure in response to the first image and the second image not matching. For the device structure, slight changes in the device structure during use can have a great impact on subsequent engineering, so it is necessary to finely monitor the device structure. The device structure identifier is used to represent the change or loss of the device structure in the present application. The subtle changes in the identifier are easier to identify than the changes in the device structure observed by the human eye in the prior art, effectively improving the accuracy of monitoring. In addition, compared with the manual monitoring in the prior art, the embodiments of the present application do not have strict requirements for the resolution and installation position of the monitoring device, and do not require human eye assistance for monitoring, effectively reducing the demand for manpower and the difficulty of monitoring.

[0114] In summary, the present application improves the accuracy of monitoring on the basis of reducing the demand for manpower and the difficulty of monitoring.

[0115] It should be noted that the method of the embodiments of the present application can be executed by a single device, for example, a computer or a server, etc. The method of the embodiments of the present application can also be applied to a distributed scenario, and be completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only execute one or more steps in the method of the embodiments of the present application, and the multiple devices can interact with each other to complete the method.

[0116] It should be noted that some embodiments of the present application have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order and still achieve desirable results. Additionally, the processes depicted in the figures do not necessarily require the particular order shown, or sequential order to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous.

[0117] Based on the same inventive concept, the present application also provides a device integrity monitoring apparatus corresponding to the method of any of the above embodiments.

[0118] Reference Figure 6 , the device integrity monitoring apparatus comprises:

[0119] A setting unit configured to set a standard device structure identifier on a surface of a device structure;

[0120] A measurement unit configured to measure the standard device structure identifier after the device structure is used, to obtain a measured device structure identifier;

[0121] A camera configured to obtain a first image corresponding to the standard device structure identifier;

[0122] A camera configured to obtain a second image corresponding to the measured device structure identifier;

[0123] A video analysis host configured to analyze whether the first image and the second image match;

[0124] An audible and visual alarm unit configured to broadcast alarm information of the device structure in response to the first image and the second image not matching.

[0125] For the convenience of description, the above apparatus is described in various modules according to functions. Of course, the functions of the modules can be implemented in one or more software and / or hardware in the implementation of the present application.

[0126] The apparatus of the above embodiments is used to implement the corresponding device integrity monitoring method of any of the preceding embodiments, and has the beneficial effects of the corresponding method embodiments, which are not repeated here.

[0127] Based on the same inventive concept, the present application also provides an electronic device corresponding to the method of any of the above embodiments, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the device integrity monitoring method of any of the above embodiments when executing the program.

[0128] Figure 7 A more specific hardware structure of an electronic device is shown in the present embodiment, which can include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 for communication within the device.

[0129] The processor 1010 can be implemented in the form of a general-purpose CPU (Central Processing Unit), a microprocessor, an ASIC (Application Specific Integrated Circuit), or one or more integrated circuits, etc., for executing related programs to implement the technical solutions provided by the embodiments of the present specification.

[0130] The memory 1020 can be implemented in the form of a ROM (Read Only Memory), a RAM (Random Access Memory), a static storage device, a dynamic storage device, etc. The memory 1020 can store an operating system and other application programs, and when the technical solutions provided by the embodiments of the present specification are implemented by software or firmware, the related program codes are stored in the memory 1020 and executed by the processor 1010.

[0131] The input / output interface 1030 is used to connect input / output modules to realize information input and output. The input / output modules can be configured as components in the device (not shown in the figure), or can be externally connected to the device to provide corresponding functions. The input device can include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device can include a display, a speaker, a vibrator, an indicator light, etc.

[0132] The communication interface 1040 is configured to connect a communication module (not shown in the figure) to realize the communication interaction between the device and other devices. The communication module can realize communication through wired mode (such as USB, network cable, etc.), or can realize communication through wireless mode (such as mobile network, WIFI, Bluetooth, etc.).

[0133] The bus 1050 includes a path for transmitting information between various components (such as the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040) of the device.

[0134] It should be noted that although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040, and the bus 1050, in the specific implementation process, the device can also include other components necessary for normal operation. In addition, those skilled in the art can understand that the above device can also only contain the components necessary for the implementation of the embodiments of the present application, and does not have to contain all the components shown in the figure.

[0135] The electronic device of the above embodiment is used to realize the device integrity monitoring method corresponding to any of the above embodiments, and has the beneficial effects of the corresponding method embodiments, which are not described here.

[0136] Based on the same inventive concept, corresponding to any of the above embodiment methods, the present application also provides a non-transitory computer readable storage medium, which stores computer instructions for causing the computer to execute the device integrity monitoring method of any of the above embodiments.

[0137] The computer readable medium of the present embodiment includes permanent and non-permanent, removable and non-removable media, which can be realized by any method or technology to store information. The information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassette, magnetic tape magnetic disk storage or other magnetic storage device, or any other non-transmission medium that can be used to store information accessible by a computing device.

[0138] The storage medium of the above embodiments stores computer instructions for causing the computer to perform the device integrity monitoring method as described in any of the above embodiments, and has the beneficial effects of the corresponding method embodiments, which are not repeated here.

[0139] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary, and is not intended to suggest that the scope of the application (including the claims) is limited to these examples; the above embodiments or technical features among different embodiments can also be combined, steps can be implemented in any order, and there are many other variations of the aspects of the embodiments of the application as described above, which are not provided in detail in order to be brief. They are within the scope of the application.

[0140] In addition, in order to simplify the description and discussion, and so as not to make the embodiments of the application difficult to understand, the well-known power / ground connections of integrated circuit (IC) chips and other components can or can not be shown in the provided drawings. In addition, the apparatus can be shown in the form of a block diagram in order to avoid making the embodiments of the application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform to be implemented in the embodiments of the application (i.e., these details should be fully within the understanding of those skilled in the art). Where specific details (e.g., circuitry) are set forth in order to describe an exemplary embodiment of the application, it will be apparent to those skilled in the art that the embodiments of the application can be practiced without these specific details or with variations on these specific details. Therefore, these descriptions should be considered as illustrative rather than limiting.

[0141] Although the application has been described in conjunction with the specific embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) can use the embodiments discussed.

[0142] The embodiments of the application are intended to cover all such alternatives, modifications and variations as falling within the broad scope of the appended claims. Accordingly, any and all such modifications, variations or equivalents that fall within the spirit and scope of the embodiments of the application are intended to be included within the scope of the application.

Claims

1. A method of equipment integrity monitoring, characterized by, The method comprises the following steps: a standard equipment structure mark is arranged on the surface of an equipment structure; the standard equipment structure mark comprises at least three first mark points; a first mark line is formed by connecting every two first mark points; after the equipment structure is used, the standard equipment structure mark is measured to obtain a measured equipment structure mark; the measured equipment structure mark comprises second mark points; a second mark line is formed by connecting every two second mark points; a first image corresponding to the standard equipment structure mark is obtained, which comprises: obtaining a first mark point image corresponding to the first mark points; and obtaining a first mark line image corresponding to the first mark line; the first image comprises the first mark point image and the first mark line image; a second image corresponding to the measured equipment structure mark is obtained, which comprises: obtaining a second mark point image corresponding to the second mark points; and obtaining a second mark line image corresponding to the second mark line; the second image comprises the second mark point image and the second mark line image; whether the first image and the second image match is analyzed, which comprises: analyzing whether the size, number and position of the first mark points in the first mark point image match the size, number and position of the second mark points in the second mark point image; analyzing whether the length and position of the first mark line in the first mark line image match the length and position of the second mark line in the second mark line image; and analyzing whether the ratio of the length of every two first mark lines in the first mark line image matches the ratio of the length of every two second mark lines in the second mark line image; in response to the first image and the second image not matching, alarm information of the equipment structure is broadcasted.

2. The method of claim 1, wherein, the first image and the second image not matching comprises: the first mark point image and the second mark point image not matching; or, the first mark line image and the second mark line image not matching; or, the ratio of the length of every two first mark lines in the first mark line image not matching the ratio of the length of every two second mark lines in the second mark line image.

3. The method of claim 1, wherein, the at least three first mark points form a recognizable geometric shape; the number of the second mark points is less than or equal to the number of the first mark points.

4. The method of claim 1, wherein, in response to the number of the second mark points being less than or equal to 1, the second mark line is not configured; in response to the second mark line not being configured, the alarm information of the equipment structure is broadcasted.

5. An apparatus integrity monitoring device, characterized by The method comprises the following steps: a setting unit is configured to arrange a standard equipment structure mark on the surface of an equipment structure; the standard equipment structure mark comprises at least three first mark points; a first mark line is formed by connecting every two first mark points; a measuring unit is configured to measure the standard equipment structure mark after the equipment structure is used to obtain a measured equipment structure mark; the measured equipment structure mark comprises second mark points; a second mark line is formed by connecting every two second mark points; The camera configured to acquire the first image corresponding to the standard equipment structure identification, comprises: acquiring the first mark point image corresponding to the first mark point; acquiring the first mark line image corresponding to the first mark line; the first image comprises the first mark point image and the first mark line image; The camera configured to acquire the second image corresponding to the measured equipment structure identification, comprises: acquiring the second mark point image corresponding to the second mark point; acquiring the second mark line image corresponding to the second mark line; the second image comprises the second mark point image and the second mark line image; The video analysis host configured to analyze whether the first image and the second image match, comprises: analyzing whether the size, number and position of the first mark point in the first mark point image and the second mark point in the second mark point image match; analyzing whether the length and position of the first mark line in the first mark line image and the second mark line in the second mark line image match; and analyzing whether the ratio of the length of each two first mark lines in the first mark line image and the ratio of the length of each two second mark lines in the second mark line image match; The sound and light alarm unit configured to broadcast the alarm information of the equipment structure in response to the first image and the second image not matching.

6. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the program to realize the method of any one of claims 1 to 4.

7. A non-transitory computer-readable storage medium storing computer instructions, wherein, The computer instructions are used to make the computer execute the method of any one of claims 1 to 4.

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