Chuck pin assembly, substrate support device and liquid handling device including the same

Abstract

An embodiment of the present invention provides a chuck pin assembly and a substrate support device and a liquid handling device including the same, which are used to reduce the wear of the chuck pin and improve its life. The chuck pin assembly for preventing the substrate from detaching according to an embodiment of the present invention includes: a main body component, which is configured to be arranged on the peripheral portion of a chuck supporting the substrate and is movable relative to the chuck; a handle component, which clamps the side of the substrate; and a rotating connection component, which combines the handle component with the main body component so that the handle component can rotate relative to the main body component. According to an embodiment of the present invention, the handle component that clamps the side of the substrate is configured to be rotatable, thereby preventing only a specific portion from contacting the substrate and being worn, thereby improving the life of the chuck pin.

Description

Technical Field

[0001] The invention relates to a chuck pin assembly and a substrate supporting device and a liquid processing device comprising the same. Background Art

[0002] Semiconductor (or display) manufacturing processes are processes for manufacturing semiconductor elements on substrates (e.g., wafers), including exposure, evaporation, etching, ion implantation, cleaning, etc. In particular, there are various organic and inorganic impurities on the substrate. Therefore, in order to improve manufacturing efficiency, it is very important to effectively remove impurities on the substrate.

[0003] In order to remove impurities, a cleaning process using a treatment liquid (cleaning liquid) is mainly used. The cleaning process can be performed by supplying the treatment liquid onto or behind the substrate while rotating a spin chuck supporting the substrate, and a rinsing process using a rinsing liquid and a drying process using a drying gas are performed after the cleaning process.

[0004] On the other hand, in the liquid treatment process, a technique is used to diffuse the liquid from the center to the periphery by rotating the substrate while supplying the liquid from above or below. For this purpose, support pins that support the bottom of the substrate and chuck pins that contact the side of the support substrate can be used. On the other hand, as the chuck pins that support the substrate on the side repeatedly perform the process, wear may occur. Summary of the invention

[0005] Therefore, embodiments of the present invention provide a chuck pin assembly for reducing wear of a chuck pin and improving its lifespan, and a substrate supporting apparatus and a liquid handling apparatus including the same.

[0006] The problems to be solved by the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand other problems to be solved that are not mentioned from the following description.

[0007] According to an embodiment of the present invention, a chuck pin assembly for preventing a substrate from detaching includes: a main body component, which is configured to be arranged on the peripheral portion of a chuck supporting the substrate and can move relative to the chuck; a handle component, which clamps the side of the substrate; and a rotating connecting component, which combines the handle component with the main body component so that the handle component can rotate relative to the main body component.

[0008] According to an embodiment of the present invention, the rotation connection component may be provided as a rotation bearing for enabling the handle component to rotate relative to the body component.

[0009] According to an embodiment of the present invention, the main body member may be configured to move linearly relative to a center portion of the chuck.

[0010] According to an embodiment of the present invention, the handle component may include: a rotating body portion coupled to the rotating connection component; and a multiple contact portion located above the rotating body portion and contacting a plurality of points on a side portion of the substrate.

[0011] According to an embodiment of the present invention, the multiple contact portion may include a first contact pin and a second contact pin, and the first contact pin and the second contact pin are configured to contact side surfaces of the substrate, respectively.

[0012] According to an embodiment of the present invention, the main body member may be configured to rotate relative to the chuck with a first rotation center axis as a reference, and the handle member may be configured to rotate with a second rotation center axis of the main body member as a reference.

[0013] According to an embodiment of the present invention, the rotation connection component may connect the main body component and the handle component so that the second rotation center axis of the handle component rotates with reference to the third rotation center axis.

[0014] The substrate support device according to an embodiment of the present invention comprises: a chuck configured to be rotatable; a support pin located above the chuck and supporting the bottom of the substrate; and a chuck pin assembly that supports the side of the substrate to prevent the substrate from detaching. The chuck pin assembly comprises: a main body component that is disposed at the peripheral portion of the chuck and configured to be movable relative to the chuck; a handle component that clamps the side of the substrate; and a rotating connection component that combines the handle component with the main body component so that the handle component can rotate relative to the main body component. .

[0015] The liquid processing device according to an embodiment of the present invention includes: a substrate supporting unit that supports a substrate; and a processing liquid supply unit that supplies a liquid to the substrate. The substrate supporting unit includes: a chuck that is configured to be rotatable; a supporting pin that is located above the chuck and supports the bottom of the substrate; and a chuck pin assembly that supports the side of the substrate to prevent the substrate from detaching. The chuck pin assembly includes: a main body component that is disposed on the peripheral portion of the chuck and is configured to be movable relative to the chuck; a handle component that clamps the side of the substrate; and a rotating connection component that combines the handle component with the main body component so that the handle component can rotate relative to the main body component.

[0016] According to the embodiment of the present invention, the gripping member that clamps the side portion of the substrate is rotatable, thereby preventing only a specific portion from being worn out by contact with the substrate, thereby improving the life of the chuck pin.

[0017] The effects of the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The schematic structure of a chuck for supporting a substrate in a liquid processing apparatus is shown.

[0019] Figure 2 An example of a case where eccentricity occurs in a linear movement type chuck pin is shown.

[0020] Figure 3 An outline configuration of a chuck pin assembly according to an embodiment of the present invention is shown.

[0021] Figure 4 The figure shows a situation where a linear movement type chuck pin assembly supports a substrate.

[0022] Figure 5 An example of a case where eccentricity occurs in a rotationally movable chuck pin is shown.

[0023] Figure 6 The following shows a state where a substrate is supported by a rotationally movable chuck pin assembly according to the present invention.

[0024] Figure 7 An example of a liquid handling device to which a chuck pin assembly according to an embodiment of the present invention is applied is shown.

[0025] Figure 8 The configuration of a substrate processing apparatus to which a chuck pin assembly according to an embodiment of the present invention is applied is shown. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways and is not limited to the embodiments described herein.

[0027] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the entire specification.

[0028] In addition, among the multiple embodiments, the same reference numerals are used for components having the same structure and only a representative embodiment is described, and in the remaining embodiments, only the structure different from the representative embodiment is described.

[0029] Throughout the specification, when it is stated that a part is "connected (or coupled)" to another part, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other components placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless otherwise stated, it means that other constituent elements may be included rather than excluded.

[0030] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meaning as that in the context of the relevant technology, and will not be ideally or excessively interpreted as formal meanings unless explicitly defined in this application.

[0031] Figure 1 The schematic structure of a chuck for supporting a substrate in a liquid processing apparatus is shown. Figure 1 A circular chuck 1000 is provided as a base for rotating while fixing the substrate W. The chuck 1000 has support pins 2000 for supporting the substrate W from below and chuck pins 3000 for contacting the side of the substrate W to fix the substrate W so that it does not come off.

[0032] like Figure 1 As shown, the support pins 2000 may be arranged at a certain interval on the outer periphery of the chuck 1000, and the chuck pins 3000 may be arranged at a certain interval on the outer periphery of the chuck 1000. Usually, the support pins 2000 and the chuck pins 3000 are fixed to the chuck 1000. The chuck pins 3000 may be located on the outer periphery side of the chuck 1000 than the support pins 2000.

[0033] The chuck pins 3000 can move linearly in the horizontal direction based on the center of the chuck 1000. When there is no substrate W, the chuck pins 3000 are located outside the side of the substrate W. If the substrate W is placed, the chuck pins 3000 are located at a contact position closer to the center to contact the side of the substrate W.

[0034] For example, if a substrate W to be subjected to liquid treatment is placed above the support pins 2000, the chuck pins 3000 move linearly from the non-contact position to the contact position and contact the side of the substrate W. The chuck pins 3000 support the substrate W so that the substrate W subjected to liquid treatment does not fall off. If the process for the substrate W is completed, the chuck pins 3000 move linearly from the contact position to the non-contact position and release the contact with the substrate W. On the other hand, the chuck pins 3000 may be configured to contact the substrate W not only by linear movement but also by rotational movement.

[0035] On the other hand, when a liquid treatment process (for example, cleaning, coating) is performed on the substrate W, the chuck pin 3000 may be worn due to the contact between the substrate W and the chuck pin 3000 as the substrate W is rotated. When the chuck pin 3000 becomes difficult to properly clamp the substrate W due to the wear of the chuck pin 3000 as the process is repeated, the operator needs to replace the chuck pin 3000.

[0036] Figure 2 This is an example showing the occurrence of eccentricity in a linear motion type chuck pin. Figure 2 When the substrate W is placed, the chuck pin 3000 moves linearly from the non-contact position to the contact position in order to contact the substrate W.

[0037] On the other hand, in order to improve the life of the chuck pin 3000, it is necessary to make the substrate W contact not only a specific portion but also various portions of the chuck pin 3000. Figure 2 As shown, when the linear movable chuck pin 3000 is fixed and the rotation center of the substrate W and the rotation center of the chuck pin 3000 formed by the two contact portions do not coincide, stress may be concentrated only on a specific portion of the chuck pin 3000. When stress is concentrated only on a specific portion of the chuck pin 3000, even if wear occurs only in that portion and there is slight wear, the entire chuck pin 3000 needs to be replaced.

[0038] Therefore, the embodiment of the present invention is configured such that the portion of the chuck pin 3000 that contacts the substrate W can rotate so that the rotation center of the chuck pin 3000 and the rotation center of the substrate W are aligned.

[0039] Figure 3 1 is a schematic diagram showing the structure of a chuck pin assembly according to an embodiment of the present invention. In this specification, the chuck pin assembly is a combination of a chuck pin 3000 and its related components for preventing the substrate W from detaching, and the chuck pin assembly and the chuck pin 3000 may be used as the same term.

[0040] The chuck pin assembly according to the embodiment of the present invention comprises: a main body part 3100, which is configured to be disposed on the peripheral portion of the chuck 1000 supporting the substrate W and is movable relative to the chuck 1000; a handle part 3300, which clamps the side of the substrate W; and a rotating connection part 3200, which combines the handle part 3300 with the main body part 3100 so that the handle part 3300 can rotate relative to the main body part 3100. According to the embodiment of the present invention, the handle part 3300 clamping the side of the substrate W is configured to be rotatable, so that the rotation center of the substrate W and the rotation center of the handle part 3300 can be consistent, thereby preventing the following problems: Figure 2 In this way, only a specific portion comes into contact with the substrate and is worn away.

[0041] According to an embodiment of the present invention, the rotating connection component 3200 may be provided as a rotating bearing for rotating the handle component 3300 relative to the main body component 3100. For example, the rotating connection component 3200 may be provided with an inner wheel and an outer wheel on the main body component 3100 and the handle component 3300, respectively. Moreover, a ball or roller wheel that can be flexibly rotated may be arranged between the inner wheel and the outer wheel.

[0042] According to an embodiment of the present invention, the main body 3100 may be configured to move linearly relative to the center of the chuck 1000. For example, the main body 3100 may be configured to move back and forth along a linear path at a certain distance from the center of the chuck 1000. Figure 2 as well as Figure 4 As shown, when a substrate W is placed, the main body part 3100 can move from an open (OPEN) position (non-contact position) to a closed (CLOSE) position (contact position), and when the substrate W is discharged, it can move from a closed (CLOSE) position (contact position) to an open (OPEN) position (non-contact position).

[0043] like Figure 3 As shown, the handle component 3300 according to the embodiment of the present invention includes: a rotating body part 3310, which is combined with the rotating connecting part 3200; and a multi-contact part 3320, which is located above the rotating body part 3310 and contacts with multiple points on the side of the substrate W. Here, the multi-contact part 3320 may include a first contact pin 3321 and a second contact pin 3322 configured to contact the side surface of the substrate W respectively.

[0044] Figure 4 FIG. 2 is a diagram showing a case where a linear movable chuck pin assembly supports a substrate. As described above, the handle member 3300 that is in contact with the substrate W is configured to be rotatable so that the rotation center of the substrate W and the rotation center of the handle member 3300 can be aligned. Figure 4 As shown, the first contact pin 3321 and the second contact pin 3322 of the handle member 3300 can all be in contact with the substrate W to disperse the stress.

[0045] Figure 5 The main body member 3100 may be configured to be rotatable relative to the chuck 1000 .

[0046] refer to Figure 5 The handle part 3300 is provided in the main body part 3100, and the main body part 3100 rotates around the first rotation center axis A. In addition, the handle part 3300 rotates around the second rotation center axis B fixed in the main body part 3100, thereby contacting the substrate W. For example, if Figure 5 When the substrate W is placed as shown, the chuck pin 3000 can be rotated and moved from the open (OPEN) position (non-contact position) to the closed (CLOSE) position (contact position) due to the rotating driving component, and can be rotated and moved from the closed (CLOSE) position (contact position) to the open (OPEN) position (non-contact position) when the substrate W is discharged.

[0047] like Figure 5As shown in FIG. 1 , if the rotation center of the second rotation center axis B of the handle member 3300 brought by the main body member 3100 is not consistent with the rotation center of the substrate W, stress may be concentrated only on a specific portion of the handle member 3300, causing wear. Therefore, the chuck pin assembly according to an embodiment of the present invention may be configured so that the second rotation center axis B can rotate, so that the rotation center of the second rotation center axis B of the handle member 3300 brought by the main body member 3100 can be consistent with the rotation center of the substrate W.

[0048] According to an embodiment of the present invention, the rotating connection component 3200 can combine the main body component 3100 and the handle component 3300 so that the second rotation center axis B of the handle component 3300 rotates with the third rotation center axis C as a reference.

[0049] More specifically, if Figure 6 As shown, the second rotation center axis B of the grip part 3300 of the main body part 3100 can be configured to rotate with the third rotation center axis C as a reference through the rotation connection part 3200. In this case, as Figure 6 As shown in FIG. 1 , the rotation center of the second rotation center axis B of the handle member 3300 relative to the main body member 3100 can be consistent with the rotation center of the substrate W. Therefore, it can be configured as follows Figure 5 As shown, stress is not only concentrated on a specific portion of the handle component 3330, but also can be concentrated on a specific portion of the handle component 3330. Figure 6 As shown, the line contact portion of the grip member 3330 is in contact with the substrate W at two or more locations (line contact).

[0050] The chuck pin assembly according to an embodiment of the present invention may be provided as Figure 1 The substrate support device according to the embodiment of the present invention includes: a chuck 1000 configured to be rotatable; a support pin 2000 located above the chuck 1000 and supporting the bottom of the substrate W; and a chuck pin assembly 3000 that supports the side of the substrate W to prevent the substrate W from detaching. The chuck pin assembly includes: a main body part 3100 configured to be disposed on the peripheral portion of the chuck 1000 and movable relative to the chuck 1000; a gripping part 3300 that clamps the side of the substrate W; and a rotating connecting part 3200 that is combined to be able to rotate the gripping part 3300 relative to the main body part 3100.

[0051] According to an embodiment of the present invention, the rotating connection part 3200 may be provided as a rotating bearing for rotating the handle part 3300 relative to the body part 3100 .

[0052] According to an embodiment of the present invention, the main body part 3100 may be configured to move linearly relative to the center portion of the chuck.

[0053] According to an embodiment of the present invention, the handle component 3300 includes: a rotating body 3310 coupled to the rotating connection component 3200; and a multiple contact portion 3320 located above the rotating body 3310 and contacting multiple points on the side of the substrate W.

[0054] According to an embodiment of the present invention, the multi-contact portion 3320 may include a first contact pin 3321 and a second contact pin 3322 , which are configured to contact side surfaces of the substrate W, respectively.

[0055] According to an embodiment of the present invention, the main body part 3100 can be configured to rotate relative to the chuck 1000 with the first rotation center axis A as a reference, and the handle part 3300 can be configured to rotate with the second rotation center axis B of the main body part 3100 as a reference.

[0056] According to an embodiment of the present invention, the rotating connection component 3200 can combine the main body component 3100 and the handle component 3300 so that the second rotation center axis B of the handle component 3300 rotates with the third rotation center axis C as a reference.

[0057] Figure 7 FIG. 2 is an example of a liquid handling device to which a chuck pin assembly according to an embodiment of the present invention is applied.

[0058] Reference Figure 7 The liquid treatment device 2600 provided in the liquid treatment chamber includes a treatment container 2620, a substrate support unit 2640, a lifting unit 2660, and a treatment liquid supply unit 2680. The liquid treatment device 2600 provided in the liquid treatment chamber can supply a treatment liquid to the substrate W. For example, the treatment liquid can be an etching liquid, a cleaning liquid, a rinse liquid, and an organic solvent. The etching liquid or the cleaning liquid can be an acidic or alkaline liquid, and can include sulfuric acid (H 2 SO 4 ), phosphoric acid (P 2 O 5 ), hydrofluoric acid (HF) and ammonium hydroxide (HN 4 OH). Alternatively, the treatment liquid can be a DSP (Diluted Sulfuric acid Peroxide) mixed liquid.

[0059] The flushing liquid can be pure water (H 2 O). The organic solvent may be isopropyl alcohol (IPA) which is a low surface tension fluid.

[0060] The processing container 2620 provides a processing space for processing the substrate inside. The processing container 2620 has a cylindrical shape with an upper opening. The processing container 2620 may have an outer recovery container 2626 (or a first recovery container) and an inner recovery container 2622 (or a second recovery container). Each recovery container 2622, 2626 recovers different processing liquids from the processing liquids used in the process. The inner recovery container 2622 is provided in an annular ring shape surrounding the substrate support unit 2640, and the outer recovery container 2626 is provided in an annular ring shape surrounding the inner recovery container 2622. The inner space of the inner recovery container 2622 functions as an inner inlet 2622a for the processing liquid to flow into the inner recovery container 2622. The space between the inner recovery container 2622 and the outer recovery container 2626 functions as an outer inlet 2626a for the processing liquid to flow into the outer recovery container 2626. Each inlet 2622a, 2626a may be located at different heights from each other. Recovery lines 2622b and 2626b are connected to the bottom of the recovery containers 2622 and 2626. The processing liquid flowing into the recovery containers 2622 and 2626 can be supplied to an external processing liquid regeneration system (not shown) through the recovery lines 2622b and 2626b for reuse.

[0061] The substrate support unit 2640 supports the substrate W in the processing space. The substrate support unit 2640 supports and rotates the substrate W during the process. The substrate support unit 2640 has a chuck 1000, a support pin 2000, a chuck pin 3000, and a rotation driving member. The chuck 1000 is provided in a substantially circular disk shape.

[0062] A plurality of support pins 2000 protrude upward from the chuck 1000 to support the rear surface of the substrate W.

[0063] The chuck pins 3000 protrude upward from the chuck 1000 and are provided in plurality to support the side of the substrate W. The chuck pins 3000 support the side of the substrate W so that the substrate W does not disengage from the fixed position to the side when the chuck 1000 rotates. The chuck pins 3000 are provided to be able to move linearly between the outer position and the inner position along the radial direction of the chuck 1000. When the substrate W is loaded or unloaded on the chuck 1000, the chuck pins 3000 are located at the outer position, and when the process is performed on the substrate W, the chuck pins 3000 are located at the inner position. The inner position (contact position) is a position where the chuck pins 3000 and the side of the substrate W are in contact with each other, and the outer position (non-contact position) is a position where the chuck pins 3000 and the substrate W are separated from each other.

[0064] The rotation driving component rotates the chuck 1000. The chuck 1000 can be rotated around the central axis by the rotation driving component. The rotation driving component includes a support shaft 2648 and a driving part 2649. The support shaft 2648 can have a cylindrical shape facing the third direction 16. The upper end of the support shaft 2648 can be fixedly coupled to the bottom surface of the chuck 1000. The driving part 2649 provides a driving force to rotate the support shaft 2648. It can be that the support shaft 2648 is rotated by the driving part 2649, and the chuck 1000 rotates together with the support shaft 2648.

[0065] The lifting unit 2660 moves the processing container 2620 linearly in the vertical direction. As the processing container 2620 moves up and down, the relative height of the processing container 2620 with respect to the chuck 1000 changes. When the substrate W is loaded or unloaded on the chuck 100, the lifting unit 2660 lowers the processing container 2620 so that the chuck 1000 protrudes above the processing container 2620. In addition, when performing a process, the height of the processing container 2620 is adjusted so that the processing liquid flows into the set recovery container 2622, 2626 according to the type of the processing liquid supplied to the substrate W. The lifting unit 2660 includes a bracket 2662, a moving shaft (shaft) 2664, and a driving unit 2666. The bracket 2662 may be fixedly provided on the outer wall of the processing container 2620, and the moving shaft 2664 that moves in the vertical direction through the driving unit 2666 is fixedly coupled to the bracket 2662. Selectively, the lifting unit 2660 may move the chuck 1000 in the vertical direction.

[0066] The processing liquid supply unit 2680 supplies the processing liquid to the substrate W. A plurality of processing liquid supply units 2680 may be provided, and the respective processing liquid supply units 2680 supply processing liquids of different kinds.

[0067] The processing liquid supply unit 2680 may include a moving part 2681 and a nozzle 2690 .

[0068] The moving member 2681 moves the nozzle 2690 to a process position and a standby position. Here, the process position is a position where the nozzle 2690 faces the substrate W supported by the substrate support unit 2640, and the standby position is a position where the nozzle 2690 is away from the process position.

[0069] The moving part 2681 may include a support shaft 2686, an arm 2682, and a driver 2688. The support shaft 2686 is located at one side of the processing container 2620. The support shaft 2686 may be in the shape of a rod extending in a third direction. The support shaft 2686 is provided to be rotatable by the driver 2688. The support shaft 2686 may be provided to be able to move up and down. The arm 2682 may be combined with the upper end of the support shaft 2686 and extend vertically from the support shaft 2686. The nozzle 2690 is fixedly combined at the end of the arm 2682. As the support shaft 2686 rotates, the nozzle 2690 may swing together with the arm 2682. The nozzle 2690 may be moved to the process position and the standby position by swinging. Optionally, the arm 2682 may be provided to be able to move forward and backward in the length direction thereof. When viewed from above, the path moved by the nozzle 2690 may be consistent with the central axis of the substrate W at the process position.

[0070] The chuck pin assembly according to an embodiment of the present invention may be provided as Figure 7 As a part of the substrate support unit 2640 in the liquid processing device of the present invention. The liquid processing device according to the embodiment of the present invention includes: a substrate support unit 2640 that supports the substrate W; and a processing liquid supply unit 2680 that supplies liquid to the substrate W. The substrate support unit 2640 includes: a chuck 1000 that is configured to be rotatable; a support pin 2000 that is located above the chuck 1000 and supports the bottom of the substrate W; and a chuck pin assembly 3000 that supports the side of the substrate W to prevent the substrate W from detaching. The chuck pin assembly includes: a main body part 3100 that is configured to be arranged on the peripheral part of the chuck 1000 and can move relative to the chuck 1000; a handle part 3300 that clamps the side of the substrate W; and a rotating connection part 3200 that is combined to be able to rotate the handle part 3300 relative to the main body part 3100.

[0071] Figure 8 The configuration of a substrate processing apparatus to which a chuck pin assembly according to an embodiment of the present invention is applied is shown.

[0072] Reference Figure 8 The substrate processing device 1 has an index module 10 and a process module 20, and the index module 10 has a loading port 120 and a transfer rack 140. The loading port 120, the transfer rack 140, and the process module 20 are arranged in a row. Hereinafter, the direction in which the loading port 120, the transfer rack 140, and the process module 20 are arranged is referred to as a first direction 12, and when viewed from above, the direction perpendicular to the first direction 12 is referred to as a second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0073] The carrier 18 storing the substrate W is placed in the load port 120 . A plurality of load ports 120 are provided, and the load ports 120 are arranged in a row along the second direction 14 . Figure 1 4 loading ports 120 are provided. However, the number of loading ports 120 may be increased or decreased according to the process efficiency and floor space of the process module 20. A slot (not shown) is formed in the carrier 18 to support the edge of the substrate. A plurality of slots are provided along the third direction 16, and the substrates are stacked in the carrier in a state of being spaced apart from each other along the third direction 16.

[0074] A front opening unified pod (FOUP) can be used as the carrier 18 .

[0075] The process module 20 includes a buffer unit 220, a transfer chamber 240, a process chamber 260, and an exhaust assembly. The transfer chamber 240 is configured such that its length direction is parallel to the first direction 12. The process chambers 260 are configured on both sides of the transfer chamber 240 along the second direction 14. The process chambers 260 can be provided symmetrically with respect to the transfer chamber 240. Each process chamber 260 may include Figure 8 The substrate processing apparatus shown. A portion of the process chambers 260 is arranged along the length direction of the transfer chamber 240. In addition, a portion of the process chambers 260 are arranged to be stacked on each other. That is, on both sides of the transfer chamber 240, the process chambers 260 are arranged in an A×B arrangement (A and B are each a natural number greater than 1). Here, A is the number of process chambers 260 provided in a row along the first direction 12, and B is the number of process chambers 260 provided in a row along the third direction 16. When 4 or 6 process chambers 260 are provided on both sides of the transfer chamber 240, respectively, the process chambers 260 can be arranged in a 2×2 or 3×2 arrangement. The number of process chambers 260 can also be increased or decreased.

[0076] Different from the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chamber 260 may be provided in a single layer on one side and the other side of the transfer chamber 240. In addition, the process chamber 260 may be provided in various configurations different from the above. In addition, a liquid treatment process may be performed on a substrate on one side of the transfer chamber 240 in the process chamber 260, and a process of drying the substrate after the liquid treatment process is performed may be performed on the other side. The drying process may be a supercritical treatment process.

[0077] The buffer unit 220 is disposed between the transfer rack 140 and the transfer chamber 240. The buffer unit 220 provides a space between the transfer chamber 240 and the transfer rack 140 for the substrate W to stay before being transported. The buffer unit 220 provides a slot (not shown) for placing the substrate W therein, and a plurality of slots (not shown) are provided in a manner that they are spaced apart from each other along the third direction 16. In the buffer unit 220, the surface facing the transfer rack 140 and the surface facing the transfer chamber 240 are open.

[0078] The transfer rack 140 transports the substrate W between the carrier 18 placed on the loading port 120 and the buffer unit 220. An index rail 142 and an index robot 144 are provided in the transfer rack 140. The index rail 142 is provided so that its length direction is parallel to the second direction 14. The index robot 144 is arranged on the index rail 142 and moves linearly in the second direction 14 along the index rail 142. The index robot 144 has a base 144a, a main body 144b, and an index arm 144c. The base 144a is provided so as to be movable along the index rail 142. The main body 144b is coupled to the base 144a. The main body 144b is provided so as to be movable along the third direction 16 on the base 144a. In addition, the main body 144b is provided so as to be rotatable on the base 144a. The index arm 144c is coupled to the main body 144b and is provided so as to be movable forward and backward relative to the main body 144b. A plurality of index arms 144c are provided and are provided so as to be independently driven. The index arms 144c are stacked and spaced apart from each other along the third direction 16. Some of the index arms 144c may be used when transferring the substrate W from the process module 20 to the carrier 18, and the other may be used when transferring the substrate W from the carrier 18 to the process module 20. This can prevent particles generated from the substrate W before the process from being attached to the substrate W after the process when the index robot 144 transfers the substrate W in and out.

[0079] The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260. A guide rail 242 and a main robot 244 are provided in the transfer chamber 240. The guide rail 242 is configured so that its length direction is parallel to the first direction 12. The main robot 244 is configured on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242.

[0080] The liquid processing apparatus according to the embodiment of the present invention may be implemented as a part of the process chamber 260 described above.

[0081] This embodiment and the drawings attached to this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that modifications and specific embodiments that can be easily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of rights of the present invention.

[0082] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, but rather to the appended claims. All concepts that are equivalent to or equivalently modified to the claims belong to the scope of the concept of the present invention.

Claims

1. A chuck pin assembly for preventing a substrate from detaching, wherein: The chuck pin assembly comprises: A main body member is provided at a peripheral portion of a chuck supporting the substrate and is configured to be movable relative to the chuck; a grip member including a line contact portion clamping a side portion of the substrate; and A rotating connecting component combines the handle component with the main body component so that the handle component can rotate relative to the main body component. The main body member is configured to rotate relative to the chuck with the first rotation center axis as a reference. The handle member is configured to rotate with the second rotation center axis of the main body member as a reference. The rotation connection member connects the main body member and the handle member so that the second rotation center axis of the handle member rotates with reference to a third rotation center axis that is spaced apart from the second rotation center axis.

2. The chuck pin assembly according to claim 1, characterized in that: The rotational connection member provides a rotational bearing for rotating the handle member relative to the body member.

3. A substrate support device, comprising: A chuck configured to be rotatable; A support pin is located above the chuck and supports the bottom of the substrate; as well as a chuck pin assembly, supporting the side of the substrate to prevent the substrate from being detached, The chuck pin assembly comprises: A main body member, disposed at the peripheral portion of the chuck and configured to be movable relative to the chuck; a grip member including a line contact portion clamping a side portion of the substrate; and A rotating connecting component combines the handle component with the main body component so that the handle component can rotate relative to the main body component. The main body member is configured to rotate relative to the chuck with the first rotation center axis as a reference. The handle member is configured to rotate with the second rotation center axis of the main body member as a reference. The rotation connection member connects the main body member and the handle member so that the second rotation center axis of the handle member rotates with reference to a third rotation center axis that is spaced apart from the second rotation center axis.

4. The substrate support device according to claim 3, characterized in that: The rotational connection member provides a rotational bearing for rotating the handle member relative to the body member.

5. A liquid processing device, comprising: A substrate supporting unit, supporting a substrate; as well as a processing liquid supply unit, supplying a chemical liquid to the substrate, The substrate supporting unit comprises: A chuck configured to be rotatable; A supporting pin is located above the chuck and supports a lower side of the substrate; and a chuck pin assembly, supporting the side of the substrate to prevent the substrate from being detached, The chuck pin assembly comprises: A main body member, disposed at the peripheral portion of the chuck and configured to be movable relative to the chuck; a grip member including a line contact portion clamping a side portion of the substrate; and A rotating connecting component combines the handle component with the main body component so that the handle component can rotate relative to the main body component. The main body member is configured to rotate relative to the chuck with the first rotation center axis as a reference. The handle member is configured to rotate with the second rotation center axis of the main body member as a reference. The rotation connection member connects the main body member and the handle member so that the second rotation center axis of the handle member rotates with reference to a third rotation center axis that is spaced apart from the second rotation center axis.

6. The liquid treatment device according to claim 5, wherein: The rotational connection member provides a rotational bearing for rotating the handle member relative to the body member.

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