Method and apparatus for improving the transfer speed of semiconductor devices by micro-adjustment

Abstract

The present invention discloses an apparatus for performing direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate transfer mechanism capable of moving on two axes. A micro-adjustment mechanism is coupled to the first substrate transfer mechanism and is configured to hold the first substrate and perform position adjustment, the scale of the position adjustment being smaller than the position adjustment caused by the first substrate transfer mechanism. The micro-adjustment mechanism includes: a micro-adjustment actuator having a distal end; and a first substrate holder frame capable of moving by contacting the distal end of the micro-adjustment actuator. A second frame is configured to fix the second substrate such that a transfer surface is set to face the semiconductor device die disposed on the surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

Description

[0001] Cross - reference to Related Patent Applications

[0002] This application claims the priority of U.S. Patent Application No. 16 / 147,456, titled "Method and Apparatus to Increase Transfer Speed of Semiconductor Devices with Micro - Adjustment", filed on October 1, 2018, and the entire text of this U.S. patent application is incorporated herein by reference. This application incorporates by reference the following patent applications: U.S. Patent Application No. 14 / 939,896, titled "Apparatus for Transfer of Semiconductor Devices", filed on November 12, 2014, which is now published as U.S. Patent No. 9,633,883; U.S. Patent Application No. 15 / 343,055, titled "Compliant Needle for Direct Transfer of Semiconductor Devices", filed on November 3, 2016; U.S. Patent Application No. 15 / 360,471, titled "Top - Side Laser for Direct Transfer of Semiconductor Devices", filed on November 23, 2016; U.S. Patent Application No. 15 / 360,645, titled "Pattern Array Direct Transfer Apparatus and Method Therefor", filed on November 23, 2016; U.S. Patent Application No. 15 / 409,409, titled "Flexible Support Substrate for Transfer of Semiconductor Devices", filed on January 18, 2017; and U.S. Patent Application No. 15 / 987,094, titled "Method and Apparatus for Multiple Direct Transfers of Semiconductor Devices", filed on May 12, 2018. Background Art

[0003] Semiconductor devices are electronic components that utilize semiconductor materials such as silicon, germanium, gallium arsenide, etc. Semiconductor devices are typically manufactured as individual discrete devices or integrated circuits (ICs). Examples of individual discrete devices include electrically actuatable elements such as light - emitting diodes (LEDs), diodes, transistors, resistors, capacitors, fuses, etc.

[0004] The manufacture of semiconductor devices generally involves complex manufacturing processes with a large number of steps. The final product of the manufacture is a "packaged" semiconductor device. The "packaged" modifier refers to the housing and the protected features built into the final product, as well as the interfaces that enable the devices in the package to be incorporated into the final circuit.

[0005] Conventional manufacturing processes for semiconductor devices begin with the processing of semiconductor wafers. The wafers are cut into many "unpackaged" semiconductor devices. The "unpackaged" modifier refers to unenclosed semiconductor devices without protected features. Here, the unpackaged semiconductor devices can be referred to as semiconductor device dies, or simply as "dies" for simplicity. A single semiconductor wafer can be diced into small pieces to produce dies of various sizes, so as to form more than 100,000 or even 1 million dies from a semiconductor wafer (depending on the initial size of the semiconductor), and each die has a certain quality. Then, the unpackaged dies are "packaged" via the conventional manufacturing processes briefly discussed below. The actions between wafer processing and packaging can be referred to as "die preparation".

[0006] In some cases, die preparation can include sorting the dies via a "pick and place process", whereby the diced dies are individually picked up and sorted into bins. The sorting can be based on the forward voltage capacity of the die, the average power of the die, and / or the wavelength of the die.

[0007] Generally, packaging involves mounting the die into a plastic or ceramic package (e.g., a mold or a housing). The packaging also includes connecting the die contacts to pins / wires for docking / interconnecting with the final circuit. The packaging of semiconductor devices is typically completed by sealing the die to protect the die from the environment (e.g., dust).

[0008] Then, the product manufacturer places the packaged semiconductor device in the product circuit. Due to the packaging, the device can be "inserted" into the circuit components of the product being manufactured at any time. In addition, although the packaging of the device can protect the device from elements that may deteriorate or damage the device, the packaged device is of course larger than the die present inside the package (e.g., in some cases, the thickness of the packaged device is approximately 10 times that of the die, the area is 10 times that of the die, and thus the volume is 100 times that of the die). Therefore, the resulting circuit component cannot be thinner than the packaging of the semiconductor device.

[0009] As described above, a single semiconductor wafer can be diced into small pieces to produce over 100,000 or even 1,000,000 die from the semiconductor wafer. Thus, when transferring thousands or even millions of die, the primary consideration is efficiency. When transferring these die, there are typically die transfer parameters that manufacturers may not be able to control for reasons of efficiency and / or speed. For example, if the die are transferred at a relatively high speed, the high-speed transfer process may cause vibrations to propagate throughout the semiconductor substrate. In other respects, even when configured to perform high-speed transfers, the transfer mechanism that starts and stops positioning the die for transfer may be expensive in terms of efficiency. Conventional transfer mechanisms and methods cannot control and / or improve these and other parameters without reducing the efficiency of the transfer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The detailed description is set forth with reference to the drawings. In the drawings, the left-most digit of a reference numeral identifies the drawing in which the reference numeral first appears. The same reference numerals are used in different drawings to indicate like or identical items. Additionally, the drawings can be considered to provide an approximate depiction of the relative dimensions of the various components in the respective drawings. However, the drawings are not drawn to scale, and the relative dimensions of the various components within each drawing and between different drawings may differ from those depicted. Specifically, for clarity, some drawings may depict components as a certain size or shape, while other drawings may depict the same components as a larger scale or different shape.

[0011] Figure 1 An isometric view of an embodiment of a direct transfer device is shown.

[0012] Figure 2A A schematic view of an embodiment of a direct transfer device in a pre-transfer position is shown.

[0013] Figure 2B A schematic view of an embodiment of a direct transfer device in a transfer position is shown.

[0014] Figure 3 An embodiment of the shape profile of the ejector tip of a direct transfer mechanism is shown.

[0015] Figure 4 An embodiment of the ejector actuation stroke curve is shown.

[0016] Figure 5 A plan view of an embodiment of a support substrate having circuit traces thereon is shown.

[0017] Figure 6 A schematic view of an embodiment of the elements of a direct die transfer system is shown.

[0018] Figure 7A schematic diagram showing an implementation of the circuit path between the machine hardware and the controller of a direct die transfer system.

[0019] Figure 8 A method of a direct die transfer process according to an implementation of the present application is shown.

[0020] Figure 9 A method of a direct die transfer operation according to an implementation of the present application is shown.

[0021] Figure 10 An implementation of a direct transfer device and process for implementing a conveyor system is shown.

[0022] Figure 11A A schematic diagram showing another implementation of the direct transfer device in a pre-transfer position.

[0023] Figure 11B Shows Figure 11A A schematic top view of the support substrate transfer mechanism after the transfer operation of the implementation in.

[0024] Figure 12 A schematic diagram showing another implementation of the direct transfer device in a pre-transfer position.

[0025] Figure 13 A schematic diagram showing another implementation of the direct transfer device in a pre-transfer position.

[0026] Figure 14 A schematic diagram showing an implementation of the direct transfer device in a pre-transfer position, the direct transfer device having a micro-adjustment component implemented according to an implementation of the present disclosure.

[0027] Figure 15A An isometric view of a micro-adjustment component according to an implementation of the present disclosure is shown.

[0028] Figure 15B Shows according to an implementation of the present disclosure Figure 15A A schematic cross-sectional view of the micro-adjustment component of.

[0029] Figure 15C Shows according to an implementation of the present disclosure Figure 15A Another schematic cross-sectional view of the micro-adjustment component of.

[0030] Figure 16 A bottom view of a micro-adjustment component having two micro-adjustment actuators according to an implementation of the present disclosure is shown.

[0031] Figure 17 A bottom view of a micro-adjustment component having four micro-adjustment actuators according to an implementation of the present disclosure is shown.

[0032] Figure 18 A method is shown for an exemplary process of actuating a direct transfer device according to an embodiment of the present disclosure.

[0033] Figure 19A An isometric view of a two-axis guideway micro-adjustment assembly having two micro-actuators according to an embodiment of the present disclosure is shown.

[0034] Figure 19B An embodiment according to the present disclosure is shown Figure 19A a side view of the two-axis guideway micro-adjustment assembly of.

[0035] Figure 19C An embodiment according to the present disclosure is shown Figure 19A a bottom view of the two-axis guideway micro-adjustment assembly of.

[0036] Figure 20 Another method is shown for an exemplary process of performing a direct transfer using a device having a micro-adjustment assembly according to an embodiment of the present disclosure.

[0037] Figure 21 A partial schematic view of a direct die transfer head having a plurality of ejector pins / thimble pins used in conjunction with a device having a micro-adjustment assembly according to an embodiment of the present disclosure is shown. Detailed Description

[0038] The present disclosure relates to a machine and a method for implementing the same for directly transferring and fixing a semiconductor device die onto a circuit, and to a circuit (as an output product) on which the die is fixed. In one embodiment, the function of the machine is to directly transfer an unpackaged die from a substrate such as a "wafer tape" to a support substrate such as a circuit substrate. Compared with similar products produced by traditional methods, directly transferring an unpackaged die can significantly reduce the thickness of the final product and reduce the time and / or cost of manufacturing the support substrate.

[0039] For the purpose of description, the term "substrate" refers to any material on which a process occurs or to which an action is performed. In addition, the term "product" refers to the desired output from a process or action, regardless of the completion state. Thus, a support substrate refers to any material on which a process occurs or to which an action is performed to produce a desired output.

[0040] For example, in one embodiment, the machine may fixedly support a substrate that is configured to receive "uncapped" die transferred from a wafer tape, such as LEDs. To reduce the size of the product using the die, the die is very small and thin. For example, the thickness of the die may be about 50 micrometers (μm). Due to the relatively small size of the die, the components included in the machine are capable of precisely aligning the wafer tape carrying the die and the substrate to ensure accurate placement and / or avoid waste of product material. In one embodiment, the components for aligning the substrate and the die on the wafer tape may include a set of frames in which the wafer tape and the substrate are respectively fixed and individually transported to an alignment position such that a specific die on the wafer is transferred to a specific site on the substrate.

[0041] The frame for transporting the substrate may travel in various directions, including horizontal, vertical, and / or rotational directions within the plane of each alignment axis, and even out-of-plane directions that may allow transfer to a curved surface. The frame for transporting the wafer tape may also travel in various directions. A system consisting of gears, tracks, motors, and / or other elements may be used to fix and transport the frames respectively carrying the substrate and the wafer tape to align the substrate with the wafer tape for placing the die in the correct position on the substrate. Each frame system may also be moved to an extraction position to facilitate removal of the wafer tape and the substrate after the transfer process is completed. It should also be understood that, based on a particular embodiment, any one or all of the first substrate, the second substrate, and the transfer mechanism may be movable relative to each other to facilitate the most effective alignment of the components.

[0042] In some aspects, the components for aligning the substrate and the die on the wafer tape include one or more adjustment mechanisms that transport the wafer tape by small distances (e.g., 5 micrometers to 50 micrometers, or 1 micrometer to 1000 micrometers, or 0.5 micrometer to 5000 micrometers, etc.) to finely adjust the desired transfer position from die transfer position to die transfer position. These small transports (hereinafter referred to as micro-adjustments) can cancel out the positional errors of the frame transporting the wafer tape caused by vibrations resulting from the frame starting and stopping transports rapidly in succession (coarse adjustment of the transport mechanism). The inertial vibration noise may vary according to speed, unit mass, deceleration, etc. The micro-adjustments occur rapidly (e.g., about 0.5 ms from the start to the end of the micro-adjustment) to cancel out the vibrations before die transfer. Additionally, after transporting the tape to the transfer position and transferring the die, subsequent micro-adjustments may be made to align another transfer position and transfer die before the next coarse adjustment.

[0043] In one embodiment, the machine further includes a transfer mechanism configured to transfer the die directly from the wafer tape to the support substrate without "encapsulating" the die. The transfer mechanism can be vertically disposed above the wafer tape such that it presses down on the die to exert pressure toward the support substrate via the wafer tape. This process of pressing down on the die may cause the die to peel away from the wafer tape starting from the side of the die until the die is separated from the wafer tape to be attached to the support substrate. That is, the die can be transferred by reducing the adhesion between the die and the wafer tape and by increasing the adhesion between the die and the support substrate.

[0044] In some embodiments, the transfer mechanism can include an elongate rod, such as a punch or a thimble, that can be periodically actuated against the wafer tape to push the wafer tape from the top side. Additionally and / or alternatively, the transfer mechanism can include a plurality of thimbles that can be individually actuated against the wafer tape. The size of one or more of the thimbles can be designed to be no wider than the width of the die being transferred. However, in other cases, the width of the thimble can be wider than the width of the die or any other dimension. When the end of the thimble contacts the wafer tape, the wafer tape may experience local flexure in the area between the die and the wafer tape. Since the flexure is highly local and rapid, the portion of the wafer tape that does not receive pressure from the thimble may start to bend away from the surface of the die. Thus, this partial separation may cause the die to lose sufficient contact with the wafer tape and thereby detach from the wafer tape. Additionally, in one embodiment, the flexure of the wafer tape can be extremely small to keep the entire surface area of the die in contact with the wafer tape while still allowing the opposing surface of the die to extend beyond the corresponding surface of the adjacent die to avoid accidental transfer of adjacent dies.

[0045] Alternatively or additionally, the machine can further include a fixing mechanism for fixing the separated "unencapsulated" die to the support substrate. In one embodiment, the support substrate can have circuit traces to which the die is transferred and fixed. The fixing mechanism can include an energy-emitting device such as a laser to melt / soften the material of the circuit traces on the support substrate. Additionally, in one embodiment, a laser can be used to activate / harden the material of the circuit traces. Thus, the fixing mechanism can be actuated before and / or after the die comes into contact with the material of the circuit traces. Thus, when the transfer mechanism is actuated to release the die onto the support substrate, the energy-emitting device can also be activated to prepare the trace material to receive the die. Activation of the energy-emitting device can further enhance the release and capture of the die from the wafer tape, thereby starting to form a semiconductor product on the support substrate.

[0046] In some embodiments, as the frame holding the wafer tape is transferred from one position to another, the transfer mechanism holding the wafer frame can move to the transfer position and perform a micro-adjustment after a sudden stop to fine-tune the transfer position and / or eliminate system vibrations. Then, the system transfers the die via the fixing mechanism as described above.

[0047] In other embodiments, the transfer mechanism may not come to a complete stop before transferring the die from the wafer tape to the support substrate. In some aspects, the system can change its speed as the transfer mechanism approaches the desired transfer position, while in other aspects, the transfer mechanism can maintain a constant speed as it passes the desired transfer position. At a computable moment, the system can actuate a micro-actuation mechanism at an angle of 180 degrees with respect to the direction of travel on one or more axes of travel relative to the transfer position. The speed of the micro-actuation matches the travel speed of the frame, such that the position of the die being transferred is stationary relative to the target position on the support. That is, due to the actuation of the micro-adjustment mechanism in the opposite direction, the relative speed of the transfer elements (e.g., the transfer mechanism and the pick-and-place mechanism) becomes zero. At the moment when the die is stationary relative to the target position, the pick-and-place mechanism pushes the die away from the wafer tape into the position on the substrate support, and the fixing mechanism fixes the die, as described herein. Since the transfer mechanism never comes to a complete stop, manufacturing efficiency can be increased by saving the time waiting for the system vibrations of the coarse transfer mechanism to settle at each transfer position.

[0048] First Exemplary Embodiment of the Direct Transfer Device

[0049] Figure 1 An embodiment of a device 100 is shown that can be used to directly transfer an unpackaged semiconductor component (or “die”) from a wafer tape to a support substrate. The wafer tape may also be referred to herein as a semiconductor device die substrate, or simply a die substrate. The device 100 can include a support substrate transfer mechanism 102 and a wafer tape transfer mechanism 104. Each of the support substrate transfer mechanism 102 and the wafer tape transfer mechanism 104 can include a frame system or other means to fix the respective substrates to be transferred to a desired alignment position relative to each other. The device 100 can further include a pick-and-place mechanism 106, which as shown can be vertically disposed above the wafer tape transfer mechanism 104. In one embodiment, the pick-and-place mechanism 106 can be positioned to almost contact the wafer tape. Additionally, the device 100 can include a fixing mechanism 108. The fixing mechanism 108 can be vertically disposed below the support substrate transfer mechanism 102 at the transfer position and aligned with the pick-and-place mechanism 106, and can place the die on the support substrate at the transfer position. As discussed below, Figure 2A and Figure 2B exemplary details of the device 100 are shown.

[0050] Since Figure 2A and Figure 2B depict different stages of the transfer operation, and although referring to the same elements and features of apparatus 200, the following discussion of specific features may be interchangeably referred to Figure 2A and Figure 2B either or both of. Specifically, Figure 2A and Figure 2B illustrate embodiments of apparatus 200 that include a support substrate transfer mechanism 202, a wafer tape transfer mechanism 204, a transfer mechanism 206, and a fixing mechanism 208. The support substrate transfer mechanism 202 may be arranged adjacent to the wafer tape transfer mechanism 204. For example, as shown, the support substrate transfer mechanism 202 may extend in a substantially horizontal direction and may be vertically disposed below the wafer tape transfer mechanism 204 to utilize any effects that gravity may have during the transfer process. Alternatively, the support substrate transfer mechanism 202 may be oriented to extend transversely to the horizontal plane.

[0051] During the transfer operation, the transfer mechanisms 202, 204 may be positioned such that the space between the surface of the support substrate carried by the support substrate transfer mechanism 202 and the surface of the wafer tape carried by the wafer tape transfer mechanism 204 may be greater than or less than 1 mm, depending on various other aspects of apparatus 200, including the amount of deflection caused by components during the transfer operation, as described below. In one embodiment, the respective opposing surfaces of the wafer tape and the support substrate may be the most prominent structures compared to the support structures of the transfer mechanisms 202, 204. That is, to avoid collisions between the components of the machine and the products thereon (which collisions may be caused by movable components (e.g., transfer mechanisms 202, 204)), the distance between the respective surfaces of the wafer tape and the support substrate may be less than the distance between either of these surfaces and any other opposing structural components.

[0052] As depicted and in one embodiment, the transfer mechanism 206 may be vertically disposed above the wafer tape transfer mechanism 204, and the fixing mechanism 208 may be vertically disposed below the support substrate transfer mechanism 202. It is contemplated that in some embodiments, one or both of the transfer mechanism 206 and the fixing mechanism 208 may be oriented in a position different from the position Figure 2A and Figure 2B shown. For example, the transfer mechanism 206 may be arranged to extend at an acute angle relative to the horizontal plane. In another embodiment, the fixing mechanism 208 may be oriented to emit energy from the same actuation direction as the transfer mechanism 206 during the transfer process or alternatively from any orientation and position at which the fixing mechanism 208 can participate in the transfer process.

[0053] The support substrate transfer mechanism 202 can be used to hold the support substrate 210. Herein, the term "support substrate" can include, but is not limited to: wafer tape (e.g., pre-sorting die and producing sorted die chips for future use); paper or polymer substrates formed into sheet or other non-planar shapes, where the polymer (semi-transparent or otherwise) can be selected from any suitable polymer, including but not limited to silicone, acrylic, polyester, polycarbonate, etc.; circuit boards (such as printed circuit boards (PCBs)); string or wire circuits, which can include a pair of conductive wire strands or "fine lines" extending in parallel; and cotton fabric, nylon, rayon, leather, etc. The choice of material for the support substrate can include durable materials, flexible materials, rigid materials, and other materials capable of successfully undergoing the transfer process and maintaining the suitability of the support substrate for its ultimate use. The support substrate 210 can be formed, either alone or at least in part, of a conductive material such that the support substrate 210 serves as a conductive circuit for forming a product. Potential types of support substrates can also include items such as glass bottles, vehicle windows, or glass sheets.

[0054] In the embodiments depicted in Figure 2A and Figure 2B the support substrate 210 can include circuit traces 212 disposed thereon. As depicted, the circuit traces 212 can include a pair of adjacent traces spaced apart by a trace spacing or gap to accommodate the distance between electrical contact terminals (not shown) on the die being transferred. Thus, the size of the trace spacing or gap between adjacent traces of the circuit traces 212 can be determined based on the size of the die being transferred to ensure proper connectivity and subsequent die activation. For example, the circuit traces 212 can have a trace pitch or gap that ranges from about 75 microns to 200 microns, from about 100 microns to 175 microns, or from about 125 microns to 150 microns.

[0055] The circuit traces 212 can be formed of a conductive ink that is disposed via screen printing, inkjet printing, laser printing, manual printing, or other printing methods. Additionally, the circuit traces 212 can be pre-cured and semi-dried or dried to provide additional stability while also being able to activate the circuit traces for die conductivity purposes. Wet conductive ink can also be used to form the circuit traces 212, or a combination of wet and dry ink can be used to form the circuit traces 212. Alternatively or additionally, the circuit traces 212 can be pre-formed as wire traces, or photo-etched, or formed from a molten material into a circuit pattern and then adhered, embedded, or otherwise fixed to the support substrate 210.

[0056] The material of the circuit trace 212 can include, but is not limited to, silver, copper, gold, carbon, conductive polymers, etc. In one embodiment, the circuit trace 212 can include copper particles coated with silver. The thickness of the circuit trace 212 can vary depending on the type of material used, the intended function, and the appropriate strength or flexibility, energy capacity, size of the LED, etc. to achieve that function. For example, the thickness of the circuit trace can range from about 5 microns to 20 microns, from about 7 microns to 15 microns, or from about 10 microns to 12 microns.

[0057] Thus, in a non-limiting example, the support substrate 210 can be a flexible, translucent polyester sheet on which a desired circuit pattern is screen-printed using a silver-based conductive ink material to form the circuit trace 212.

[0058] The support substrate transfer mechanism 202 can include a support substrate transfer frame 214 for fixing the support substrate holder frame 216. The structure of the support substrate holder frame 216 can vary significantly depending on the type and characteristics of the support substrate used (e.g., shape, size, elasticity, etc.). Since the support substrate 210 can be a flexible material, the support substrate 210 can be held in the support substrate holder frame 216 under tension to create a more rigid surface on which the transfer operations discussed below are performed. In the above example, the rigidity generated by the tension in the support substrate 210 can improve the placement accuracy when transferring components.

[0059] In one embodiment, using a durable or more rigid material for the support substrate 210 naturally provides a firm surface for component placement accuracy. On the contrary, when the support substrate 210 is allowed to relax, wrinkles and / or other discontinuities may form in the support substrate 210 and interfere with the preset pattern of the circuit trace 212 to such an extent that the transfer operation may not be successful.

[0060] Although the manner of holding the support substrate 210 can vary greatly, Figure 2A An embodiment of the support substrate holder frame 216 is shown, which includes a first part 216a having a concave shape and a second part 216b having a convex corresponding shape that corresponds to the concave shape in shape. In the depicted example, by inserting the outer periphery of the support substrate 210 between the first part 216a and the second part 216b, tension is generated for the support substrate 210, thereby firmly clamping the support substrate 210.

[0061] The support substrate conveyor frame 214 can be conveyed in at least three directions (two directions in the horizontal plane and the vertical direction). The conveyance can be accomplished via a system consisting of a motor, guide rails, and gears (all not shown). In this way, the support substrate holder frame 216 can be conveyed to and held in a specific position as directed and / or programmed and controlled by the user of the apparatus 200.

[0062] The wafer tape transfer mechanism 204 can be implemented to hold the wafer tape 218, which has die 220 (i.e., semiconductor device dies) thereon. The wafer tape 218 can be transferred in multiple directions via the wafer tape conveyor frame 222 to a specific transfer position for transfer operations. Similar to the support substrate conveyor frame 214, the wafer tape conveyor frame 222 can include a system consisting of a motor, guide rails, and gears (all not shown).

[0063] The unpackaged semiconductor dies 220 being transferred can be extremely small. In fact, the height of the die 220 can be in the range of 12.5 microns to 200 microns, or 25 microns to 100 microns, or 50 microns to 80 microns.

[0064] Due to the small size of the die, when the wafer tape 218 has been transferred to the appropriate transfer position, the gap spacing between the wafer tape 218 and the support substrate 210 can be in the range of, for example, approximately 0.25 mm to 1.50 mm, or approximately 0.50 mm to 1.25 mm, or approximately 0.75 mm to 1.00 mm. The minimum gap spacing can depend on factors including: the thickness of the die being transferred, the stiffness of the wafer tape involved, the amount of flexure of the wafer tape required to provide sufficient die capture and release, the proximity of adjacent dies, etc. As the distance between the wafer tape 218 and the support substrate 210 decreases, the speed of the transfer operation may also decrease due to a reduction in the cycle time of the transfer operation (discussed further herein). Thus, this reduction in the duration of the transfer operation can increase the die transfer rate. For example, the die transfer rate can be in the range of placing approximately 6 to 250 dies per second.

[0065] In addition, the wafer tape conveyor frame 222 can hold the wafer tape holder frame 224, which can stretch and hold the wafer tape 218 under tension. As Figure 2AAs shown, the wafer tape 218 can be fixed in the wafer tape holder frame 224 by clamping the periphery of the wafer tape 218 between adjacent components of the wafer tape holder frame 224. This clamping helps to maintain the tension and stretching characteristics of the wafer tape 218, thereby increasing the success rate of the transfer operation. Given the different characteristics of the available wafer tapes in terms of different types / brands / qualities, a specific wafer tape can be selected for use based on the ability to always maintain the desired tension during the transfer process. In one embodiment, the ejector actuation performance curve (discussed further below) can change according to the tension of the wafer tape 218.

[0066] The material for the wafer tape 218 can include, for example, materials having elastic properties such as rubber or silicone. Additionally, since the ambient temperature and the wafer tape 218 itself may potentially damage the wafer tape 218 during the transfer process, materials having properties resistant to temperature fluctuations may be advantageous. Additionally, in one embodiment, the wafer tape 218 can be slightly stretched to create a separation or gap between the individual die 220 to facilitate the transfer operation. The surface of the wafer tape 218 can include an adhesive substance through which the die 220 can be removably adhered to the wafer tape 218.

[0067] The die 220 on the wafer tape 218 can include die that are individually cut from a solid-state semiconductor wafer and then placed on the wafer tape 218 for die fixation. In this case, the die may have been pre-sorted and explicitly organized on the wafer tape 218 to, for example, facilitate the transfer operation. Specifically, the die 220 can be sequentially arranged in the order of the intended transfer to the support substrate 210. This pre-arrangement of the die 220 on the wafer tape 218 can reduce the travel that would otherwise occur between the support substrate transfer mechanism 202 and the wafer tape transfer mechanism 204. Additionally or alternatively, the die on the wafer tape 218 may have been pre-sorted to include only die having substantially equivalent performance characteristics. In this case, the efficiency of the supply chain can be increased, and thus the travel time of the wafer tape transfer mechanism 204 can be minimized.

[0068] In one embodiment, the materials for the die can include, but are not limited to, silicon carbide, gallium nitride, coated silicon oxide, etc. Additionally, sapphire or silicon can also be used as the die. Additionally, as described above, "die" can generally represent electro-actuable elements herein.

[0069] In some embodiments, the wafer tape 218 may include die that are not pre-sorted but are formed by cutting the semiconductor directly on the wafer tape only and then leaving the die on the wafer tape without sorting the die by "pick and place" according to the corresponding performance quality of the die. In such a case, the die on the wafer tape can be mapped to describe the exact relative positions of the different quality die. Thus, in one embodiment, it may not be necessary to use a wafer tape with pre-sorted die. In such a case, for each sequential transfer operation, the time and travel amount that the wafer tape transfer mechanism 204 moves between specific die may increase. This may be due in part to the different quality of the die scattered within the semiconductor region, meaning that the die of a specific quality for the next transfer operation may not be adjacent to the previously transferred die. Thus, the wafer tape transfer mechanism 204 may move the wafer tape 218 further to align the appropriate die of a specific quality for transfer, which would be necessary for a wafer tape 218 that contains die of substantially the same quality.

[0070] Further, with respect to the die 220 on the wafer tape 218, in one embodiment, a data map of the die 220 may be provided for the wafer tape 218. The data map may include a digital file that provides information describing the specific quality and position of each die on the wafer tape 218. The data map file may be input into a processing system that communicates with the apparatus 200, whereby the apparatus 200 can be controlled / programmed to locate the correct die 220 on the wafer tape 218 for transfer onto the support substrate 210.

[0071] The transfer operation is performed in part via the transfer mechanism 206, which is a die separation device for facilitating the separation of the die from the wafer tape 218. Actuation of the transfer mechanism 206 can cause one or more die 220 to be released from the wafer tape 218 and captured by the support substrate 210. In one embodiment, the transfer mechanism 206 may operate by pressing an elongate rod such as a punch or ejector pin 226 against the die 220 on the top surface of the wafer tape 218. The ejector pin 226 may be connected to an ejector pin actuator 228. The ejector pin actuator 228 may include a motor connected to the ejector pin 226 to drive the ejector pin 226 towards the wafer tape 218 at a pre-determined / programmed time.

[0072] Considering the function of the ejector pin 226, the ejector pin 226 can include a material durable enough to withstand repeated rapid micro-impacts while minimizing potential damage to the die 220 during the impact. For example, the ejector pin 226 can include metals, ceramics, plastics, etc. Additionally, the tip of the ejector pin 226 can have a specific shape profile, which can affect the ability of the ejector pin to work repeatedly without frequently damaging the tip or damaging the wafer tape 218 or the die 220. The profile shape of the ejector pin tip is discussed in more detail below with reference to Figure 3 and is discussed in more detail below.

[0073] During the transfer operation, the ejector pin 226 can be aligned with the die 220, as Figure 2A depicted, and the ejector pin actuator can move the ejector pin 226 to push a certain position on the adjacent sides of the wafer tape 218, and the die 220 is aligned with this position on the opposite side of the wafer tape 218, as Figure 2B depicted. The pressure from the ejector pin 226 can cause the wafer tape 218 to flex, so that the die 220 extends to a position closer to the support substrate 210 than the adjacent die 220 that is not being transferred. As described above, the amount of flexure can vary according to several factors, such as the thickness of the die and the circuit traces. For example, when the die 220 is about 50 microns thick and the circuit traces 212 are about 10 microns thick, the amount of flexure of the wafer tape 218 can be about 75 microns. Therefore, the die 220 can be pressed against the support substrate 210 via the ejector pin 226 to such an extent that the electrical contact terminals (not shown) of the die can be bonded to the circuit traces 212, at which point the transfer operation process is completed and the die 220 is released from the wafer tape 218.

[0074] To some extent, the transfer process can include a set of rapidly repeating steps, which include the periodic actuation of the ejector pin 226 pressing on the die 220. The method of this process is described in detail below with reference to Figure 8 In addition, the stroke curve of the actuation of the ejector pin 226 (within the context of the transfer process) is discussed in more detail below with reference to Figure 4 and is discussed in more detail below.

[0075] Returning to Figure 2A and Figure 2B, in one embodiment, the transfer mechanism 206 may further include a thimble retraction support 230 (also referred to as a pepper pot). In one embodiment, the support 230 may include a structure having a hollow space therein, where the thimble 226 may be received by entering the space through an opening 232 in the first end of the support 230. The support 230 may further include at least one opening 234 in the second opposite end of the support 230. Additionally, the support may include a plurality of perforations located near the opening 234. The size of the at least one opening 234 may be determined relative to the diameter of the thimble 226 to accommodate a passage through which the thimble 226 passes, such that the thimble presses against the wafer tape 218 during transfer.

[0076] Additionally, in one embodiment, the support 230 may be disposed adjacent to the upper surface of the wafer tape 218. Thus, when the thimble 226 retracts from pressing against the wafer tape 218 during a transfer operation, the bottom surface of the support 230 (which has the at least one opening 234) may contact the upper surface of the wafer tape 218, thereby preventing the wafer tape 218 from flexing upward. Such upward flexing may occur when the thimble 226 is at least partially inserted into the wafer tape 218 and the wafer tape adheres to the tip of the thimble 226 when retracted. Thus, the support 230 may reduce the time taken to move to the next die 220. The peripheral shape of the wall of the support 230 may be cylindrical or any other shape that can be accommodated in the device 200. Thus, the support 230 may be disposed between the thimble 226 and the upper surface of the wafer tape 218.

[0077] Regarding the effect of temperature on the integrity of the wafer tape 218, it is contemplated that the temperature of the support 230 may be adjusted to regulate the temperature of the thimble 226 and the wafer tape 218 at least in the vicinity of the transfer operation point. Thus, the temperature of the support 230 may be heated or cooled, and the material of the support 230 may be selected to maximize the thermal conductivity. For example, the support 230 may be formed of aluminum or another metal or similar material with a relatively high thermal conductivity, whereby the temperature may be adjusted to maintain consistent results for the transfer operation. In one embodiment, air may be circulated within the support 230 to assist in regulating the local temperature of the wafer tape 218. Additionally or alternatively, an optical cable 230a may be inserted into the thimble retraction support 230 and further against the thimble 226 to assist in regulating the temperature of the wafer tape 218 and / or the thimble 226.

[0078] As described above, the fixing mechanism 208 may assist in fixing the die 220 to the circuit traces 212 on the surface of the support substrate 210. Figure 2BIllustrates apparatus 200 in a transfer stage, where die 220 is pushed against circuit trace 212. In one embodiment, the fixing mechanism 208 may include an energy emitting device 236, which includes but is not limited to lasers, electromagnetic radiation, pressure vibrations, ultrasonic welding, etc. In one embodiment, using pressure vibrations for the energy emitting device 236 can be achieved by emitting vibration energy, which causes disruption of the molecules in the circuit trace against the electrical contact terminals, thereby forming a bond via vibration pressure. Additionally, in one embodiment, the fixing mechanism 208 can be completely omitted, and one or more dies can be transferred to the circuit substrate via other means including adhesion strength or binding potential.

[0079] In a non-limiting example, as Figure 2B depicted, a laser can be implemented as the energy emitting device 236. During the transfer operation, the laser 236 can be activated to emit light energy of a specific wavelength and intensity directed at the die 220 being transferred. The light wavelength of the laser 236 can be specifically selected based on the absorption of the light wavelength with respect to the material of the circuit trace 212 without significantly affecting the material of the support substrate 210. For example, a laser operating at a wavelength of 808 nm and a power of 5 W can be easily absorbed by silver but not by polyester. Thus, the laser beam can pass through the polyester substrate and strike the silver of the circuit trace. Alternatively, the wavelength of the laser can be matched to the absorption of the circuit trace and the material of the substrate. The size of the focused area of the laser 236 (indicated by the dashed line extending vertically from the laser 236 towards the support substrate 210) can be determined based on the size of the LED, for example, an area 300 microns wide. Figure 2B in

[0080] When activating the laser 236 for a pre-determined controlled pulse duration, the circuit trace 212 can start to cure (and / or melt or soften) to a certain extent such that a fusion bond can be formed between the material of the circuit trace 212 and the electrical contact terminals (not shown) on the die 220. This bond further helps to separate the unpackaged die 220 from the wafer tape 218 and at the same time fix the die 220 to the support substrate 210. Additionally, the laser 236 can cause some heat transfer on the wafer tape 218, thereby reducing the adhesion of the die 220 to the wafer tape 218 and thus facilitating the transfer operation.

[0081] In other cases, the die can be released and fixed to a support substrate in a number of ways, including using a laser or focused light with a predetermined wavelength (e.g., IR, UV, broadband / multi - spectral) to heat / activate circuit traces to cure epoxy or phase - change bonding materials, or a combination of de - activating / releasing the die from the wafer tape or initiating certain reactions. Additionally or alternatively, a laser or light of a specific wavelength can be used to pass through one layer of the system and interact with another layer. Further, a vacuum can be applied to pull the die off the wafer tape, and air pressure can be applied to push the die onto the support substrate, which may include a rotating head between the die wafer tape and the support substrate. In yet another example, ultrasonic vibrations can be combined with pressure to bond the die to the circuit traces.

[0082] Similar to the ejector retraction support 230, the fixing mechanism may also include a support substrate support 238, which can be disposed between the bottom surface of the laser 236 and the support substrate 210. The support 238 may include an opening 240 at its base end and an opening 242 at its upper end. For example, the support 238 can be formed as an annulus or a hollow cylinder. The support may also include structures for fixing a lens (not shown) to assist in guiding the laser. The laser 236 emits light through the openings 240, 242 to reach the support substrate 210. Additionally, the upper end of the side wall of the support 238 can be set to be in direct contact or in close proximity to the bottom surface of the support substrate 210. The support 238 positioned in this way can help prevent damage to the support substrate 210 during the stroke of the ejector pin 226 during the transfer operation. In one embodiment, during the transfer operation, the portion of the bottom surface of the support substrate 210 aligned with the support 238 can contact the support 238, which thus provides resistance to the entry movement of the die 220 being pressed by the ejector pin 226. Further, the support 238 can be movable in the vertical axis direction to be able to adjust its height, so as to raise and lower the support 238 as needed, including raising it to the height of the support substrate 210.

[0083] In addition to the above - described features, the apparatus 200 may further include a first sensor 244, from which the apparatus 200 receives information about the die 220 on the wafer tape 218. To determine which die to use in the transfer operation, the wafer tape 218 can have a barcode (not shown) or other identifier for reading or otherwise detecting. The identifier can provide die mapping data to the apparatus 200 via the first sensor 244.

[0084] As Figure 2A and Figure 2BAs shown, the first sensor 244 can be positioned near the transfer mechanism 206 (or more specifically, the ejector pin 226), spaced apart from the transfer mechanism 206 by a distance d, which can range from about 1 inch to 5 inches, in order to enhance the accuracy of position detection. In an alternative embodiment, the first sensor 244 can be arranged adjacent to the tip of the ejector pin 226 to sense the exact position of the die 220 in real time. During the transfer process, the wafer tape 218 can be pierced and / or further stretched over time, which can change the previously mapped and thus expected position of the die 220 on the wafer tape 218. Thus, small changes in the stretching of the wafer tape 218 can accumulate to cause significant alignment errors of the die 220 being transferred. Therefore, real-time sensing can be achieved to assist in precise die positioning.

[0085] In one embodiment, the first sensor 244 may be capable of identifying the exact position and type of the die 220 being sensed. This information can be used to provide instructions to the wafer tape conveyor frame 222 indicating the exact position to which the wafer tape 218 should be conveyed in order to perform the transfer operation. The sensor 244 can be one of many types of sensors, or a combination of sensor types to better perform multiple functions. The sensor 244 can include, but is not limited to, a laser rangefinder or an optical sensor, such as a non-limiting example of a high-definition optical camera with microphotography capabilities.

[0086] In addition, in one embodiment, a second sensor 246 can also be included in the device 200. The second sensor 246 can be arranged relative to the support substrate 210 to detect the exact position of the circuit traces 212 on the support substrate 210. Then, this information can be used to determine any position adjustments required to align the support substrate 210 between the transfer mechanism 206 and the fixing mechanism 208 so that the next transfer operation occurs at the correct position on the circuit traces 212. This information can be further relayed to the device 200 to coordinate the conveyance of the support substrate 210 to the correct position while sending instructions to the wafer tape conveyor frame 222. For the sensor 246 including an optical sensor, various sensors are also contemplated, such as a non-limiting example of a high-definition optical camera with microphotography capabilities.

[0087] Figure 2A and 2B It is further shown that the first sensor 244, the second sensor 246, and the laser 236 can be grounded. In one embodiment, the first sensor 244, the second sensor 246, and the laser 236 can all be grounded to the same ground (G) or alternatively grounded to different grounds (G).

[0088] Depending on the type of sensors for the first sensor 244 and the second sensor 246, the first sensor or the second sensor may also be able to test the functionality of the transferred die. Alternatively, additional tester sensors (not shown) can be incorporated into the structure of the device 200 to test individual dies before the support substrate 210 is removed from the device 200.

[0089] In addition, in some examples, multiple independently actuatable ejectors and / or lasers can be implemented in a machine to transfer and secure multiple dies at a given time. The multiple ejectors and / or lasers may be capable of independent movement within a three-dimensional space. Multiple die transfers can be synchronous (multiple ejectors descend simultaneously), or can occur simultaneously but not necessarily synchronously (e.g., one ejector descends while another ejector ascends, this arrangement can better balance components and minimize vibration). The control of the multiple ejectors and / or lasers can be coordinated to avoid collisions between the multiple components. Additionally, in other examples, the multiple ejectors and / or lasers can be arranged in fixed positions relative to each other.

[0090] Exemplary ejector tip profile

[0091] As described above, with reference to Figure 3 the profile shape of the ejector tip 300 was discussed, and the figure shows a schematic exemplary profile shape of the tip 300. In one embodiment, the tip 300 can be defined as the end of the ejector, including a sidewall 302 adjacent to a tapered portion 304, a corner 306, and a base end 308, which can extend transversely across opposite sides of the ejector. The specific dimensions and shape of the tip 300 can vary, for example, according to factors of the transfer process such as the size of the die 220 being transferred and the speed and impact force of the transfer operation. For example, the angle θ (measured between the longitudinal axis of the center of the ejector and the tapered portion 304) as seen in Figure 3 can be in the range of approximately 10° to 15°; the radius r of the corner 306 can be in the range of about 15 microns to 50+ microns; the width w of the base end 308 can be in the range of approximately 0 microns to 100+ microns, where w can be less than or equal to the width of the die 220 being transferred; the height h of the tapered portion 304 can be in the range of about 1 mm to 2 mm, where h can be greater than the distance the ejector travels during the stroke of the transfer operation; and the diameter d of the ejector 226 can be approximately 1 mm.

[0092] Depending on various factors associated with the transfer operation, other ejector tip profiles can be envisioned and they can have different advantages. For example, the ejector tip 300 can be more blunt to reflect the width of the die or more pointed to press into a smaller area of the wafer tape. In one embodiment, the transfer mechanism 206 can implement two or more ejectors. In such a case, the two or more ejectors can have substantially similar ejector profiles, or they can have substantially different ejector profiles. For example, the transfer mechanism 206 can include one or more ejectors 226 that have an ejector tip profile as described and shown with respect to Figure 3 The transfer mechanism can also include one or more ejectors 226 that have an ejector tip profile that is substantially different (i.e., wider or narrower than the ejector tip profile shown and described). In one embodiment, the ejector profile can not include any tapering towards a point such that the ejector 226 includes a constant width along the entire length of the ejector 226.

[0093] Exemplary ejector actuation performance curve

[0094] Figure 4 An embodiment showing the ejector actuation performance curve is shown. That is, Figure 4 An example of a travel pattern performed during the transfer operation by showing the height of the ejector tip over time relative to the plane of the wafer tape 218 is depicted. Accordingly, Figure 4 the "0" position in can be the upper surface of the wafer tape 218. Further, since the idle time of the ejector and the ready time of the ejector can vary depending on the programmed process or the different durations between transferring the first die and reaching the second die to be transferred, the dashed lines shown in the idle and ready phases of the travel pattern indicate that the time is approximate, but the duration can be longer or shorter. Additionally, it should be understood that the solid lines shown for the laser are exemplary times for the embodiments shown herein, however, the actual durations of the laser on and off times can vary depending on the materials used to form the circuit (such as the material selection for the circuit traces), the type of support substrate, the desired effect (pre-melted circuit traces, partial bonding, full bonding, etc.), the distance of the laser to the bonding point (i.e., the upper surface of the support substrate), the size of the die being transferred, and the power / intensity / wavelength of the laser, etc. Thus, the following description of the Figure 4 The curves shown in can be exemplary embodiments of the ejector profile.

[0095] In one embodiment, before the transfer operation, the fully retracted thimble tip may idle at approximately 2000 μm above the surface of the wafer tape. After different amounts of time, the thimble tip may rapidly descend and remain ready at approximately 750 μm above the surface of the wafer tape. After another indeterminate amount of time in the ready state, the thimble tip may descend again to contact the die, and the wafer tape along with the die may be depressed to a height of approximately -1000 μm, where the die is transferred to the support substrate. The dashed line at the start of the laser in the cross-section indicates that the laser may be turned on at some point between the start of the descent from the ready stage to the bottom of the thimble tip travel. For example, the laser may be turned on at approximately 50% of the descent stroke. In one embodiment, by turning on the laser earlier, such as before the thimble starts to descend, the circuit traces can start to soften before contacting the die to form a stronger bond, or alternatively, the die wafer may be shocked or prepared during this time. The stage when the laser is on may last approximately 20 ms ("milliseconds"). At the bottom of the travel, when the laser is on, this stage can be the bonding stage for bonding between the die and the support substrate. This bonding stage can allow the circuit traces to attach to the die contacts, and after the laser is turned off, the circuit traces rapidly harden. In this way, the die can be bonded to the support substrate. The bonding stage can last approximately 30 ms. Thereafter, the laser can be turned off, and the thimble can rapidly rise to the ready stage. Conversely, the laser can be turned off before the thimble starts to rise, or at some point during the rise of the thimble tip back to the ready stage. After the thimble tip rises to the ready stage, the height of the thimble tip may slightly float, overshoot, and bounce at the height of the ready stage. Although the float may be partially attributed to the speed at which the thimble tip rises to the ready stage, this speed and the float may be intentional to help retract the thimble tip from the surface of the wafer tape in case the thimble tip pierces the wafer tape and may get stuck therein.

[0096] As Figure 4 depicted, the time when the laser is off may be longer than the time when the laser is on. In this case, the slower descent speed may help prevent damage to the die, and as described above, the rapid rise speed may help more effectively withdraw the thimble tip from the wafer tape. However, as previously mentioned, Figure 4 the times shown, especially the times during the idle and ready periods, are approximate values. Therefore, the numerical values specified along Figure 4 the bottom edge are for reference only and should not be taken literally unless otherwise stated.

[0097] Exemplary support substrate

[0098] Figure 5An exemplary embodiment of the processed support substrate 500 is shown. The support substrate 502 may include a first portion 504A of a circuit trace that, when powered, can be used as a negative or positive power terminal. A second portion 504B of the circuit trace may extend adjacent to the first portion 504A of the circuit trace and, when powered, can be used as a corresponding positive or negative power terminal.

[0099] As similarly described above with respect to the wafer tape, in order to determine where to transfer the support substrate 502 to perform the transfer operation, the support substrate 502 may have a barcode (not shown) or other identifier for reading or otherwise detecting. The identifier may provide circuit trace data to the device. The support substrate 502 may further include fiducial points 506. The fiducial points 506 may be visual indicators for sensing by a support substrate sensor (e.g., the second sensor 246 in FIG. 2) to locate the first portion 504A and the second portion 504B of the circuit trace. Once the fiducial points 506 are sensed, the shape and relative position of the first portion 504A and the second portion 504B of the circuit trace relative to the fiducial points 506 can be determined based on pre-programmed information. By using the sensed information in combination with the pre-programmed information, the support substrate transfer mechanism can transfer the support substrate 502 to the appropriate alignment position for the transfer operation.

[0100] In addition, in Figure 5 FIG., the die 508 is depicted as spanning between the first portion 504A and the second portion 504B of the circuit trace. In this way, the electrical contact terminals (not shown) of the die 508 can be coupled to the support substrate 502 during the transfer operation. Thus, power can be applied to energize between the first portion 504A and the second portion 504B of the circuit trace to power the die 508. For example, the die may be an unpackaged LED that has been directly transferred from the wafer tape onto the circuit trace on the support substrate 502. Thereafter, the support substrate 502 can be processed to complete the support substrate 502 and used in a circuit or other end product. In addition, other components of the circuit can be added by the same or other transfer methods to produce a complete circuit, and control logic can be included to control the LEDs as one or more groups in some static or programmable or adaptive manner.

[0101] Simplified Exemplary Direct Transfer System

[0102] In Figure 6A simplified example of an embodiment of a direct transfer system 600 is shown. The transfer system 600 may include a personal computer (PC) 602 (or a server, a data input device, a user interface, etc.), a data storage device 604, a wafer tape mechanism 606, a support substrate mechanism 608, a transfer mechanism 610, and a fixing mechanism 612. Since the wafer tape mechanism 606, the support substrate mechanism 608, the transfer mechanism 610, and the fixing mechanism 612 have been described in more detail so far, the specific details of these mechanisms will not be repeated here. However, the following will briefly describe how the interactions between the wafer tape mechanism 606, the support substrate mechanism 608, the transfer mechanism 610, and the fixing mechanism 612 are related to the PC 602 and the data storage device 604.

[0103] In one embodiment, the PC 602 communicates with the data storage device 604 to receive information and data useful in the transfer process that uses the transfer mechanism 610 to directly transfer die from a wafer tape in the wafer tape mechanism 606 to a support substrate in the support substrate mechanism 608, where the die can be fixed to the support substrate at the support substrate mechanism via actuation of a laser or other energy emitting device located in the fixing mechanism 612. The PC 602 can also act as a receiver, compiler, organizer, and controller of data that is relayed to each of the wafer tape mechanism 606, the support substrate mechanism 608, the transfer mechanism 610, and the fixing mechanism 612. The PC 602 can further receive indication information from a user of the transfer system 600.

[0104] Note that although Figure 6 directional movement ability arrows adjacent to the wafer tape mechanism 606 and the support substrate mechanism 608 are depicted, these arrows only indicate the general direction of mobility. However, it is conceivable that both the wafer tape mechanism 606 and the support substrate mechanism 608 may be capable of moving in other directions, including rotating, pitching, rolling, and yawing in a plane.

[0105] The following references Figure 7 describe additional details of the interactions of the components of the transfer system 600.

[0106] Detailed Exemplary Direct Transfer System

[0107] A schematic diagram of the communication paths between the various elements of the transfer system 700 can be described as follows.

[0108] The direct transfer system can include a personal computer (PC) 702 (or a server, a data input device, a user interface, etc.), which can receive communications from and provide communications to a data storage device 704. The PC 702 can also communicate with a first cell manager 706 (shown as "Cell Manager 1") and a second cell manager 708 (shown as "Cell Manager 2"). Thus, the PC 702 can control and synchronize instructions between the first cell manager 706 and the second cell manager 708.

[0109] The PC 702 can include a processor and memory components, and instructions can be executed through the processor and memory to implement various functions regarding the first cell manager 706, the second cell manager 708, and the data storage device 704. In one embodiment, the PC 702 can include a project manager 710 and a thimble profile definer 712.

[0110] The project manager 710 can receive inputs from the first cell manager 706, the second cell manager 708, and the data storage device 704 to organize the direct transfer process and maintain a smooth function in terms of the orientation and alignment of the support substrate relative to the wafer tape and the die thereon.

[0111] The thimble profile definer 712 can contain data regarding the thimble stroke performance curve, which can be used to indicate a transfer mechanism involving a desired thimble stroke performance according to the pattern of the specific die on the loaded wafer tape and the circuit traces on the support substrate. Other details of the thimble profile definer 712 are further discussed below.

[0112] Returning to the data storage device 704, the data storage device 704 can include a memory containing data such as a die map 714 specific to the wafer tape loaded in the wafer tape mechanism. As previously mentioned, the die map can describe the relative positions of each die on the wafer tape and their quality to provide a pre-organized description of the specific die positions. In addition, the data storage device 704 can also include a memory containing circuit CAD files 716. The circuit CAD files 716 can contain data regarding the specific circuit trace pattern on the loaded support substrate.

[0113] The project manager 710 can receive the die map 714 and the circuit CAD files 716 from the data storage device 704, and can relay the corresponding information to the first cell manager 706 and the second cell manager 708 respectively.

[0114] In one embodiment, the first cell manager 706 may use the die map 714 from the data storage device 704 via the die manager 718. More specifically, the die manager 718 may compare the die map 714 with the information received by the sensor manager 720 and may provide instructions regarding the position of a particular die to the motion manager 722 based on this information. The sensor manager 720 may receive data regarding the actual position of the die on the wafer tape from the die detector 724. The sensor manager 720 may also instruct the die detector 724 to look for a particular die at a particular location according to the die map 714. The die detector 724 may include sensors such as Figure 2A and Figure 2B the second sensor 244 in

[0115] . Based on the received data regarding the actual position of the die on the wafer tape (confirmation or update regarding the position offset), the motion manager 722 may instruct the first robot 726 (shown as "Robot 1") to transfer the wafer tape to a position aligned with the top pins of the transfer mechanism.

[0116] Upon reaching the indicated position, the first robot 726 may communicate the completion of its motion to the top pin control board manager 728. Additionally, the top pin control board manager 728 may communicate directly with the PC 702 to coordinate the execution of the transfer operation. When executing the transfer operation, the PC 702 may instruct the top pin control board manager 728 to activate the top pin actuator / top pins 730 such that the top pins execute a stroke according to the top pin profile loaded in the top pin profiler 712. The top pin control board manager 728 may also activate the laser control / laser 732 such that the laser emits a beam towards the support substrate when the top pins press down on the die via the wafer tape to perform the transfer operation. As described above, the activation of the laser control / laser 732 may occur before, simultaneously with, during, or after the activation or full actuation of the top pin stroke.

[0117] Before performing the transfer operation, the project manager 710 may relay the data of the circuit CAD file 716 to the second cell manager 708. The second cell manager 708 may include a sensor manager 734 and a motion manager 736. The sensor manager 734 may use the circuit CAD file 716 to instruct the substrate alignment sensor 738 to find a reference point on the support substrate, thereby detecting and orienting the support substrate according to the position of the circuit traces on the support substrate. The sensor manager 734 may receive confirmation or updated position information of the circuit trace pattern on the support substrate. The sensor manager 734 may cooperate with the motion manager 736 to provide instructions to the second robot 740 (shown as "Robot 2") to transfer the support substrate to the alignment position (i.e., the transfer fixed position) to perform the transfer operation. Thus, the circuit CAD file 716 may assist the project manager 710 in aligning the support substrate relative to the wafer tape so that the die can be accurately transferred to the circuit traces on the support substrate.

[0118] Thus, the second cell manager 708 may go through multiple states, including determining the position to tell the second robot 740 to go to, telling the second robot 740 to go to the determined position, and resetting.

[0119] It should be understood that additional and alternative communication paths between all or less than all of the various components of the transfer system 700 described above are possible.

[0120] Exemplary direct transfer method

[0121] In Figure 8 a method 800 for performing a direct transfer process is shown, in which one or more dies are directly transferred from a wafer tape to a support substrate. The steps of the method 800 described herein may not be performed in any particular order and may thus be performed in any satisfactory order to achieve the desired product state. The method 800 may include a step 802 of loading transfer process data into a PC and / or a data storage device. The transfer process data may include data such as die mapping, circuit CAD file data, and ejector pin profile data.

[0122] The method 800 may also include a step 804 of loading the wafer tape into the wafer tape conveyor mechanism. Loading the wafer tape into the wafer tape conveyor mechanism may include controlling the wafer tape conveyor mechanism to move to a loading position, which is also referred to as an unloading position. The wafer tape may be fixed in the wafer tape conveyor mechanism at this loading position. The wafer tape may be loaded such that the semiconductor die faces downward toward the support substrate conveyor mechanism.

[0123] Method 800 may also include step 806 of preparing a support substrate for loading into a support substrate conveyor mechanism. The step of preparing the support substrate may include screen printing circuit traces on the support substrate according to the pattern of a CAD file being loaded into a PC or data storage device. Additionally, fiducial points may be printed onto the circuit substrate to assist with the transfer process. The support substrate conveyor mechanism may be controlled to move to a loading position, also referred to as an unload position, where the support substrate may be loaded into the support substrate conveyor mechanism. The support substrate may be loaded such that the circuit traces face the die on the wafer. For example, in one embodiment, the support substrate may be delivered and placed in the loading position by a conveyor (not shown) or other automated mechanism, such as in the form of an assembly line. Alternatively, the support substrate may be manually loaded by an operator.

[0124] Once the support substrate is correctly loaded into the support substrate conveyor mechanism within the wafer tape, a program for directly transferring the die from the wafer tape to the circuit traces of the support substrate may be executed via the PC to initiate direct transfer operation 808. Details of the direct transfer operation are described below.

[0125] Exemplary direct transfer operation method

[0126] Figure 9 Method 900 for the direct transfer operation is shown, which enables the die to be directly transferred from a wafer tape (or other substrate holding the die, Figure 9 also referred to as the "die substrate" in a simplified description) to a support substrate. The steps of method 900 described herein may not be executed in any particular order and may thus be executed in any satisfactory order to achieve the desired product state.

[0127] To determine which die to place on the support substrate and at which location on the support substrate to place the die, the PC may receive an input 902 regarding the identification of the support substrate and the identification of the die substrate containing the die to be transferred. This input may be manually entered by the user, or the PC may send a request to a cell manager that separately controls a support substrate alignment sensor and a die detector. The request may instruct the sensor to scan identification marks, such as barcodes or QR codes, on the loaded substrate, and / or the request may instruct the detector to scan identification marks, such as barcodes or QR codes, on the loaded die substrate.

[0128] The PC can use the support substrate identification to input query data storage devices or other memories to match the corresponding identification marks of the support substrate and the die substrate and retrieve the associated data file 904. Specifically, the PC can retrieve the circuit CAD file associated with the support substrate, which describes the pattern of the circuit traces on the support substrate. The circuit CAD file can also contain data such as the number, relative position, and corresponding quality requirements of the dies to be transferred to the circuit traces. Similarly, the PC can retrieve the die mapping data file associated with the die substrate, which provides a mapping of the relative positions of specific dies on the die substrate.

[0129] During the process of transferring the die to the support substrate, the PC can determine the initial orientations of the support substrate and the die substrate relative to the transfer mechanism and the fixing mechanism. Within step 906, the PC can instruct the substrate alignment sensor to locate the fiducial point on the support substrate. As described above, the fiducial point can be used as a reference mark for determining the relative position and orientation of the circuit traces on the support substrate. In addition, the PC can instruct the die detector to locate one or more reference points on the die substrate to determine the die layout.

[0130] Once the initial orientations of the support substrate and the die substrate are determined, the PC can instruct the corresponding support substrate and die substrate transfer mechanisms to orient the support substrate and the die substrate into positions aligned with the transfer mechanism and the fixing mechanism, respectively.

[0131] The alignment step 908 can include determining the position 910 of the portion of the circuit traces to which the die is to be transferred and the position 912 of that portion relative to the transfer fixed position. The transfer fixed position can be regarded as the alignment point between the transfer mechanism and the fixing mechanism. Based on the data determined in steps 910 and 912, the PC can instruct the support substrate transfer mechanism to transfer the support substrate so that the portion of the circuit traces to which the die is to be transferred is aligned with the transfer fixed position 914.

[0132] The alignment step 908 can also include determining which die on the die substrate is to be transferred 916 and where that die is located relative to the transfer fixed position 918. Based on the data determined in steps 916 and 918, the PC can instruct the wafer tape transfer mechanism to transfer the die substrate so that the die to be transferred is aligned with the transfer fixed position 920.

[0133] Once the die to be transferred from the die substrate and the portion of the circuit traces to which the die is to be transferred are aligned with the transfer mechanism and the fixing mechanism, the ejector pin and the fixing device (e.g., laser) 922 can be actuated to effect the transfer of the die from the die substrate to the support substrate.

[0134] After transferring the die, the PC can determine whether to transfer additional die 924. In the case of transferring another die, the PC can return to step 908 and realign the product and die substrate accordingly for subsequent transfer operations. In the case where there are no other die to transfer, the transfer process ends 926.

[0135] Exemplary direct transfer conveyor / assembly line system

[0136] In the embodiment regarding Figure 10 described, multiple components of the above direct transfer device can be implemented in the conveyor / assembly line system 1000 (hereinafter referred to as the "conveyor system"). Specifically, Figure 2A and Figure 2B depicts a support substrate 210 being held by a support substrate conveyor frame 214 and tensioned by a support substrate holder frame 216. As an alternative to fixing the support substrate conveyor frame 214 in a narrow area via a system of motors, guide rails, and gears described with respect to device 200, Figure 10 shows a support substrate conveyor frame 214 being conveyed through the conveyor system 1000, where the support substrate undergoes an assembly-line type process. As an actual conveyance method between operations performed on the support substrate to be conveyed, the conveyor system 1000 can include a series of tracks, rollers, and belts 1002 and / or other processing equipment to sequentially convey multiple support substrate conveyor frames 214, each of which holds a support substrate.

[0137] In one embodiment, the operating stations of the conveyor system 1000 can include one or more printing stations 1004. When a blank support substrate is conveyed to the printing station 1004, circuit traces can be printed thereon. In the case where there are multiple printing stations 1004, the multiple printing stations 1004 can be arranged serially and can be configured to each perform one or more printing operations to form complete circuit traces.

[0138] Additionally, in the conveyor system 1000, the support substrate conveyor frame 214 can be conveyed to one or more die transfer stations 1006. In the case where there are multiple die transfer stations 1006, the multiple die transfer stations 1006 can be arranged serially and can be configured to each perform one or more die transfers. At the one or more transfer stations, via transfer operations using one or more of the direct transfer device embodiments described herein, the support substrate can have one or more die transferred and fixed thereto. For example, each transfer station 1006 can include a wafer tape conveyance mechanism, a transfer mechanism, and a fixing mechanism. In one embodiment, circuit traces may have been pre-prepared on the support substrate, and thus the support substrate can be directly conveyed to the one or more transfer stations 1006.

[0139] In transfer station 1006, the wafer tape transfer mechanism, transfer mechanism, and fixing mechanism can be aligned relative to the support substrate transfer machine frame 214 being transferred at the time of entry. In this case, when the plurality of support substrates are transferred through conveyor system 1000, the components of transfer station 1006 can repeatedly perform the same transfer operation at the same relative position on each support substrate.

[0140] In addition, conveyor system 1000 can also include one or more finishing stations 1008 to which the support substrates can be transferred to perform final processing. The type, amount, and duration of the final processing may depend on the characteristics of the product and the properties of the materials used to manufacture the product. For example, the support substrates can obtain additional curing time, protective coatings, additional components, etc. at finishing station 1008.

[0141] Second Exemplary Embodiment of the Direct Transfer Device

[0142] Referring to Figure 11A and 11B , in another embodiment of the direct transfer device, a "light line" can be formed. Although many features of device 1100 can remain substantially similar to the features of device 200 of Figure 2A and Figure 2B , the support substrate transfer mechanism 1102 can be configured to transfer a support substrate 1104 different from support substrate 210, as depicted in Figure 11A and 11B . Specifically, in Figure 2A and Figure 2B , the support substrate transfer mechanism 202 includes a support substrate transfer machine frame 214 and a tensioner frame 216 that fixes the sheet-like support substrate 218 under tension. However, in the embodiment of Figure 11A and Figure 11B , the support substrate transfer mechanism 1102 can include a support substrate spool system.

[0143] The support substrate spool system can include one or two circuit trace spools 1106 wound with a "wire circuit" that can include a pair of adjacent wound conductive wires or wires as support substrate 1104. In the case of only one spool, spool 1106 can be positioned on the first side of the transfer position, and the pair of conductive wires (1104) can be wound on a single spool 1106. Alternatively, there can be two circuit trace spools 1106 positioned on the first side of the transfer position, where each spool 1106 contains a single string of wire circuits, and then these strings of wire circuits are gathered together and passed through the transfer position.

[0144] Whether one or two spools 1106 are implemented, the die transfer process for forming the wire circuit can be substantially similar in each case. Specifically, the conductive wires of the support substrate 1104 can be passed across the transfer position from the spool 1106 and fed into the finishing device 1108. In one embodiment, the finishing device 1108 can be: a coating device for receiving a protective coating such as a translucent or transparent plastic; or a curing device that can complete the curing of the wire circuit as part of the final processing of the product. Additionally or alternatively, the circuit string can be fed onto another spool that can wind up the wire circuit on the spool before the final processing of the wire circuit. When pulling the conductive wires of the support substrate 1104 through the transfer position, the transfer mechanism 206 can be actuated to perform the ejector stroke (as described above) to transfer the die 220 onto the conductive wires of the support substrate 1104, such that the electrical contact terminals of the die 220 are respectively placed on adjacent wires, and the fixing mechanism 208 can be actuated to fix the die 220 in place.

[0145] In addition, the apparatus 1100 can include a tension roller 1110 on which the conductive wires of the support substrate 1104 can be supported and further tensioned. Thus, the tension roller 1110 can help maintain the tension in the formed wire circuit to improve die transfer accuracy.

[0146] In Figure 11B the die 220 is depicted as having been transferred onto the conductive wires of the support substrate 1104, thereby (to some extent) bonding to the conductive wires of the support substrate 1104 and forming a wire circuit.

[0147] Third Exemplary Embodiment of the Direct Transfer Apparatus

[0148] In an additional embodiment of the direct transfer apparatus, referring to Figure 12 the apparatus 1200 can include a wafer tape transfer mechanism 1202. Specifically, instead of Figure 2A and Figure 2B the wafer tape transfer machine frame 222 and the wafer tape holder frame 224 shown in

[0149] In the case of using a single spool 1204, the transfer operation may include conveying the support substrate 210 via the support substrate conveying mechanism 202 using a motor, guide rails, and gears substantially as described above. However, the wafer tape conveying mechanism 1202 may include a substantially static mechanism because although the die substrates 1206 can be continuously fed through the transfer position by unwinding them from the spool 1204, the spool 1204 itself remains mainly in a fixed position. In one embodiment, for stability purposes, the tension of the die substrate 1206 can be maintained by a tension roller 1208 and / or a tension spool 1210, which can be disposed on the side of the device 1200 opposite to the spool 1204. After the die has been transferred, the tension spool 1210 can wind up the die substrate 1206. Alternatively, the tension can be maintained by any other suitable device to fix the die substrate 1206, thereby facilitating pulling the die substrate through the transfer position after each transfer operation to cycle the die 220 through.

[0150] In an embodiment using multiple spools 1204, each spool 1204 can be arranged to be laterally adjacent to the other spools 1204. Each spool 1204 can be paired with a specific transfer mechanism 206 and a specific fixing mechanism 208. In this case, each respective set of transfer and fixing mechanisms can be arranged relative to the support substrate 210 such that multiple dies can be placed at multiple positions on the same support substrate 210 simultaneously. For example, in one embodiment, the respective transfer positions (i.e., the alignment between the transfer mechanism and the corresponding fixing mechanism) can be in a straight line, offset, or staggered to accommodate various circuit trace patterns.

[0151] Whether implementing one spool 1204 or multiple spools 1204, the die transfer operation can be relatively similar to the transfer operation described above with respect to the first exemplary embodiment of the device 200. For example, the support substrate 210 can be conveyed to the transfer position (die fixing position) via the support substrate conveying mechanism 202 in the same manner as described above, the transfer mechanism 206 can perform a thimble stroke to transfer the die 220 from the die substrate 1206 to the support substrate 210, and the fixing mechanism 208 can be actuated to assist in fixing the die 220 to the support substrate 210.

[0152] Note that in an embodiment having multiple spools 1204, the circuit trace pattern can be such that not every transfer mechanism needs to be actuated simultaneously. Thus, when conveying the support substrate to various positions for transfer, multiple transfer mechanisms can be actuated intermittently.

[0153] Fourth Exemplary Embodiment of the Direct Transfer Device

[0154] Figure 13depicts an embodiment of the direct transfer device 1300. As Figure 2A and Figure 2B , the support substrate transfer mechanism 202 can be arranged adjacent to the wafer tape transfer mechanism 204. However, there is a space between the transfer mechanisms 202, 204, in which a transfer mechanism 1302 can be provided to effect the transfer of the die 220 from the wafer tape 218 to the support substrate 210.

[0155] The transfer mechanism 1302 can include a chuck 1304 that picks up one or more dies 220 from the wafer tape 218 at a time and rotates about an axis A extending through the arm 1306. For example, Figure 13 depicts the wafer tape 218 facing the support substrate 210 such that the chuck 1304 can pivot 180 degrees about a pivot point 1308 (see the directional pivot arrow) between the die-bearing surface of the wafer tape 218 and the transfer surface of the support substrate 210. That is, the extending direction of the chuck 1304 pivots in a plane orthogonal to the transfer surfaces or transfer planes of both the wafer tape 218 and the support substrate 210. Alternatively, in some embodiments, the arm structure of the chuck can be arranged to pivot between two parallel surfaces, and the arms of the chuck can pivot along parallel planes. Thus, when facing the wafer tape 218, the chuck 1304 can pick up the die 220 and then immediately pivot to the surface of the support substrate 210 to be in line with the fixing mechanism 208. Then, the chuck 1304 releases the die 220, thereby transferring the die 220 to fix it on the circuit traces 212 on the support substrate 210.

[0156] In one embodiment, the transfer mechanism 1302 can include two or more chucks (not shown) that extend from the arm in different directions. In such embodiments, whenever the chuck passes by the wafer tape 218, the chuck can rotate and index 360 degrees through the chuck stop position and pick up and transfer the die.

[0157] Alternatively, the one or more chucks 1304 can pick up and release the die 220 from the wafer tape using positive and negative vacuum pressures through the chuck 1304.

[0158] First exemplary embodiment of a direct transfer device having a micro-adjustment component

[0159] Figure 14 shows an embodiment of the direct transfer device 1400. In the depicted embodiment, the micro-adjustment mechanism 1402 is attached to the wafer tape transfer mechanism 1404, which can assist in directly transferring the semiconductor device die 220 from the wafer tape 218 to the support substrate 210. Although many features of the transfer device 1400 can be the same as Figure 2A and Figure 2BThe features of the apparatus 200 remain substantially similar, but some differences will be discussed below with reference to Figures 14 to 18 including the implementation of the fine adjustment mechanism 1402 that fine-adjusts the orientation and / or position of the wafer tape 218 and the die 220 during die transfer (e.g., 5 microns to 50 microns, or 1 micron to 1000 microns or 0.5 micron to 5000 microns, etc.).

[0160] As an overview, the transfer apparatus 1400 may include a support substrate transfer mechanism 202 (also referenced in Figure 2A and Figure 2B depicted) and a wafer tape transfer mechanism 1404. Since the wafer tape transfer mechanism 1404 includes a wafer tape transfer machine frame 1406 and a wafer tape holder frame 1408, this wafer tape transfer mechanism is functionally substantially similar to the wafer tape transfer mechanism 204. Generally, the support substrate transfer mechanism 202 and the wafer tape transfer mechanism 1404 may be regarded herein as mechanisms providing "coarse movement" because they typically move a relatively large amount of movement (relative to fine movement) between consecutive die transfer positions. However, as described above, Figure 14 the wafer tape transfer mechanism 1404 in the

[0161] embodiment includes the fine adjustment mechanism 1402 that will be discussed in detail below. Although the mechanisms providing coarse movement may also perform adjustments on a smaller scale (including microscale) between transfer positions as needed, it is generally considered that the coarse movement mechanisms are more suitable for larger macro movements (e.g., about 1 mm to 2 mm or greater). Thus, in many cases, it may be advantageous to implement the fine adjustment mechanism in combination with the coarse movement transfer mechanism. For example, when the coarse movement transfer mechanism exceeds the transfer position, fails to reach the transfer position, or oscillates near the transfer position due to stopping from the coarse movement, in addition to performing the coarse movement, fine adjustment can also be performed so that the transfer alignment is slightly off, e.g., off on a microscale. Figure 7 The fine adjustment mechanism 1402 in combination with the cell manager 706 (

[0162] For example, in one aspect, the micro-adjustment mechanism 1402 corrects for position errors caused by vibrations induced by the start and / or stop of the wafer tape conveyor frame 1406. The die transfer rate can range from placing approximately 6 to 450 or more die per second. Generally, as the transfer rate increases, the mechanical complexity and weight of the transfer device may also increase. When the moving masses are rapidly accelerated and then suddenly stopped, the increase in the speed of these masses and the increase in the transfer rate may together increase the vibration of the system components. The stabilization time required for the vibration to dissipate may result in time-related inefficiencies in die transfer. In one embodiment, the micro-adjustment of the wafer tape holder frame 1408 can reduce or eliminate the stabilization time of the wafer tape conveyor mechanism 1404 by counteracting the vibrations that affect the relative position of the die, thereby improving system efficiency.

[0163] In one embodiment, the micro-adjustment can be performed to improve system efficiency by allowing the wafer tape conveyor mechanism 1404 to maintain continuous movement while the wafer tape holder frame 1408 is still in motion and transferring the die 220 to the support substrate 210, without the wafer tape conveyor mechanism 1404 repeatedly starting and stopping as it travels from one transfer position to the next.

[0164] Considering the structure of the device, Figure 15A An isometric view of a micro-adjustment mechanism 1500 (hereinafter referred to as "micro-adjustment mechanism 1500") according to one embodiment is depicted. The micro-adjustment mechanism 1500 can include: an actuator 1502; an actuator flange 1504 having a support arm 1504A against which the actuator 1502 can be fixed; a wafer support block 1506 to which the wafer holder frame 1408 is fixed to hold the wafer tape 218; and one or more spring members 1508 that connect the wafer support block 1506 to the actuator flange 1504. In an embodiment not shown, the actuator flange 1504 can be directly or indirectly connected to the wafer tape holder frame 1408. The micro-adjustment mechanism 1500 can be firmly fastened to the wafer tape conveyor frame 1406 (as Figure 14 depicted), such that the micro-adjustment mechanism 1500 moves with the wafer tape conveyor frame 1406 and makes small independent adjustments to the position of the wafer tape 218.

[0165] According to one embodiment, the actuator 1502 may include an elongate rod that may be mounted on the actuator flange 1504 via an actuator bracket assembly 1510. The actuator bracket assembly 1510 may include one or more fastening means such as hex socket head cap screws, latches, clips, welding, etc. The micro-adjustment mechanism 1500 may include a plurality of through holes 1512 in the actuator flange 1504 for attaching the micro-adjustment mechanism 1500 to the wafer tape conveyor frame 1406 via suitable fasteners (not shown).

[0166] The actuator 1502 is disposed on the actuator flange 1504 such that the body of the actuator 1502 can slide in a single direction along the actuator flange 1504 relative to the surface during assembly. However, the actuator 1502 maintains a fixed orientation with respect to the distance from the actuator flange 1504 and the direction extending along the actuator flange. It should be understood that although depicted as a cylindrical body bolted to the actuator flange 1504 via hex socket head cap screws through the actuator bracket assembly 1510, the actuator 1502 may take many shapes other than Figure 15A the cylindrical shape shown and may be fastened to the actuator flange 1504 in any manner such that the actuator flange 1504 and the actuator 1502 operate as a single unit relative to each other.

[0167] The actuator 1502 may be a piezoelectric actuator. A piezoelectric actuator (also referred to as a piezoelectric transducer, converter, etc.) converts electrical energy into linear motion. Alternatively, the actuator 1502 may include a motion control actuator other than a piezoelectric actuator, which may be configured to make fast and precise movements. Exemplary alternative actuators include linear motors, servo motors, or stepper motors with ball screws, voice coils, etc. When a signal stimulus is applied via an electrical connector 1514 disposed at the second end of the actuator 1502, the actuator 1502 may apply a relatively large thrust (e.g., 1000+ N) at the first end where the actuator 1502 contacts the wafer support block 1506, for example, using a piezoelectric actuator.

[0168] The actuator 1502 may be connected to one or more system controllers via the electrical connector 1514. As previously referenced Figure 7 and discussed, a number of system control mechanisms may be configured to control the actuator 1502. The system controller may control the operational aspects of the actuator 1502 based on the signal stimulus, including the stroke distance of the first end of the actuator 1502. As shown in reference Figure 7 , an exemplary controller system may be, for example, the sensor manager 720, the motion manager 722, the sensor manager 734, and / or the motion manager 736.

[0169] Those skilled in the art of electromechanical control systems should understand that the response of an actuator can be conventionally controlled via a single-channel or multi-channel controller system in combination with one or more signal amplifiers. According to one embodiment, the actuator 1502 can be controlled such that the first end of the actuator 1502 moves the position of the wafer tape holder frame 1408 when actuated, thereby moving the wafer tape 218. The wafer tape holder frame 1408 may be able to move relative to the actuator flange 1504 via the one or more spring members 1508 (in embodiments having spring members). Alternatively, using other motion control actuators that can output force in more than one direction, the wafer tape holder frame 1408 may be able to move without spring members because the actuator itself can initiate motion in the return direction. Additionally, the actuator 1502 can be disposed at different positions depicted in the system configuration. That is, it is contemplated that the position of the actuator 1502 relative to the coarse movement transfer mechanism and the substrate or transfer mechanism being coarsely adjusted can be different. For example, the actuator 1502 can be in the same plane as the micro-adjustment member (i.e., regardless of which component in the coarse transfer mechanism or the transfer mechanism, or a combination thereof, has its position adjusted), can be stacked between the coarse movement transfer mechanism and the fine adjustment structural member, etc. Once the wafer tape holder frame 1408, the wafer tape 218, and the die 220 are co-displaced to the desired position (i.e., the alignment position), the transfer mechanism 206( Figure 14 ) can transfer the die 220 to the support substrate 210 with precise timing and positional accuracy. The alignment position is precise when the die is positioned at a pre-determined desired position, in which the actual position is within a pre-determined error range (i.e., the position is precise within a pre-determined tolerance). Examples of the pre-determined tolerance range can be, for example, between 10 microns and 50 microns. Other tolerances are contemplated.

[0170] As described above, in one embodiment, the spring member 1508 connects the wafer support block 1506 and the actuator flange 1504 such that the first end of the actuator 1502 can apply an actuating force (the direction of the force is indicated by the illustrated arrow 1502A). The actuating force 1502A displaces the wafer support block 1506, which translates into the wafer tape holder frame 1408 moving from a first (rest) position along the actuating axis (in Figure 15Ais depicted as the X-axis) to a second position. The displacement is a predetermined distance from a first position relative to the actuator flange 1504. The spring member 1508 can be slightly deformed by moving the wafer support block 1506 along the axis of the actuating force 1502A to allow displacement of the wafer tape holder frame 1408. By way of example, as used herein, the displacement of the wafer tape can be in the range of about 5 microns to about 200 microns. After the actuating force 1502A is applied, a return force can be applied by the restoring force of the spring member 1508 (the direction of the force is indicated by the illustrated arrow 1508A), such that the first end of the actuator 1502 (if not already returned to the rest position by other means) is forced back to the rest position relative to the actuator flange 1504. Thus, the spring member can serve as a return member.

[0171] The actuator flange 1504 (especially the spring member 1508) can be constructed of a suitable material having satisfactory elastic mechanical properties, which can depend on the particular spring design. For example, in the illustrated embodiment, materials such as alloy steel, carbon steel, cobalt nickel, copper-based alloys, nickel-based alloys, titanium alloys, aluminum, etc. can be satisfactory. Additionally and / or alternatively, plastics and other composite materials can be contemplated. It should be understood that the geometry and the construction material of the micro-adjustment mechanism 1500 can be different and are not limited to those described herein.

[0172] According to one embodiment, the actuator flange 1504 and the spring member 1508 (or a portion thereof) can be integral, in which case they are made of a single piece of material. In other respects, they can be manufactured as separate components and fastened together (e.g., via welding or other fastening techniques) to form an integral (single-piece) micro-adjustment mechanism 1500. For example, when manufactured from a single piece of material, a portion of the actuator flange 1504 can be removed (e.g., via machining, electrical discharge machining (EDM), etc.) (where the removed portion is as Figure 15A shown by the swirling cavity in) to form the plurality of spring members 1508. Although depicted as arcuate spring arms in Figures 15A to 17 , the spring member 1508 can be another suitable form or shape, such as a coil spring, for returning the wafer tape holder frame 1408 to the first (rest) position after the actuating force 1502A is removed.

[0173] One possible beneficial effect of the piezoelectric actuator is the variable and controllable actuation and available thrust of actuator 1502. The intensity of actuation combined with the speed and precision of actuation can provide the precision of positioning adjustment, enabling the die to be transferred to be positioned. Another beneficial effect is that the speed and precision of actuation can provide micro-adjustments to counteract vibrations. For example, with regard to counteracting vibration forces, the micro-adjustment mechanism 1500 can be configured to have a single actuator 1502 as shown, to assist the system in counteracting vibrations caused by the rapid acceleration and subsequent sudden deceleration (i.e., stop) of the mass associated with the support substrate conveyor frame 214, regardless of the direction of travel before stopping. In other words, when actuating the actuator to counteract vibrations caused by the rapid stop of the wafer tape conveyor mechanism 1404 connected to the micro-adjustment mechanism 1500, the direction of travel of the micro-adjustment mechanism 1500 and the wafer tape conveyor mechanism 1404 before stopping may be immaterial when considering the actuation direction of actuator 1502. At least some of any resulting vibrations caused by the stop can be counteracted by a single actuator.

[0174] The piezoelectric actuator can provide micro-adjustments by pushing (e.g., by applying a linear force in one direction), but may not have an equal pulling force (e.g., applying a linear force in the opposite direction). For example, in a system where the ability to move in two directions (e.g., the positive direction along the X-axis and the negative direction along the X-axis) is present, unidirectional actuation may be physically limited when used for precise actuation (e.g., position adjustment). Therefore, when using a piezoelectric actuator for actuator 1502, it may be advantageous to provide a micro-adjustment mechanism configured to actuate in more than one direction (discussed further herein with reference to Figures 16 to 17 ).

[0175] Figure 15B A schematic cross-sectional view of the wafer tape conveyor mechanism 1404 taken generally along the line XVB-XVB shown in Figure 15A is shown, including the micro-adjustment mechanism 1500. The ejector pins 226 and ejector pin retraction supports 230 for the orientation of the wafer tape conveyor mechanism 1404 are shown. For clarity, Figure 15A the micro-adjustment assembly 1500 is depicted in an orientation inverted from that shown in Figure 15B . As depicted in Figure 15B , the wafer tape holder frame 1408 is configured to hold the wafer tape 218, and the micro-adjustment assembly 1500 can micro-adjust the position of the wafer tape 218. The wafer tape conveyor frame 1406 is mechanically coupled to the actuator flange 1504. Additionally, Figure 15BDepicts the gap 1516 in the actuator flange 1504. The gap 1516 represents the portion from which material is removed (i.e., as discussed above in one embodiment, in which the actuator flange 1504 and the wafer support block 1506 are made from a single piece) to form the cavity space of the spring member 1508. Generally, the gap 1516 represents the maximum amount of space by which the position of the die 220 can be micro-adjusted. In an alternative embodiment (not shown), in addition to the components explicitly described and depicted herein, the actuator flange and the wafer support block can be two separate components that have been mechanically coupled by fasteners and springs, in which case the gap 1516 can still represent the space by which position adjustment can be made between the alternately coupled actuator flange and wafer support block.

[0176] Figure 15C Shows another cross-sectional view of the micro-adjustment assembly 1500 taken generally along the Figure 15A line XVC-XVC shown in. For clarity, the ejector pin and the retraction support are omitted in this view. Note that although the wafer tape conveyor frame 1406 is depicted as being slightly spaced apart from the actuator flange 1504 to clearly depict the distinction of the components, those skilled in the art should understand that in use, the wafer tape conveyor frame 1406 is mechanically coupled to the wafer tape holder frame 1408 via attachment to the actuator flange 1504. As Figure 15C depicted, the actuator 1502 can be mounted on or held tightly on the actuator flange 1504 by the actuator bracket assembly 1510, which can include bushings, shims, washers, brackets, etc. In one embodiment, for example, maintaining the offset between the actuator 1502 and the actuator flange 1504 can minimize friction during movement.

[0177] Second exemplary embodiment of a direct transfer device having a micro-adjustment assembly

[0178] Figure 16 Shows a bottom view of a micro-adjustment mechanism 1600 (hereinafter referred to as "micro-adjustment mechanism 1600") according to another embodiment of the present application, the micro-adjustment mechanism having a first actuator 1602 and a second actuator 1604 for micro-adjusting one or more components of the device. Although many features of the micro-adjustment mechanism 1600 can be substantially similar to the features of the micro-adjustment mechanism 1500 in Figure 15A some differences will be discussed hereinafter with respect to the second actuator 1604.

[0179] The micro-adjustment mechanism 1600 includes a first actuator 1602 having a distal end positioned to contact a first side of a wafer support block 1606 that is configured to secure a wafer tape holding frame for holding a wafer tape ( Figure 16 not shown in). Additionally, the micro-adjustment mechanism 1600 includes a second actuator 1604 having a distal end positioned to contact the distal end of the wafer support block 1606 at a position 180 degrees opposite to the distal end of the first actuator 1602. The approach of the respective distal ends of the first actuator 1602 and the second actuator 1604 to the wafer support block 1606 may include direct contact, indirect contact, adjacency, proximity, etc. The micro-adjustment mechanism 1600 may include an actuator flange 1608 to which the support block 1606 is fixed. Additionally, the actuator flange 1608 may include support arms 1608A and 1608B against which the first actuator 1602 and the second actuator 1604 are fixed. In embodiments where a spring-based return system may be further implemented, as Figure 16 shown, the micro-adjustment mechanism 1600 may further include a plurality of deformable spring members 1610 connecting the wafer support block 1606 to the actuator flange 1608. The micro-adjustment mechanism 1600 may be securely fastened to the wafer tape conveyor frame 1406 via holes 1612 (in a manner similar to the Figure 15B micro-adjustment mechanism 1500 depicted in) such that the micro-adjustment mechanism 1600 (when attached to the wafer tape conveyor frame) moves with the wafer tape conveyor frame and makes a micro-adjustment to the position of the wafer tape.

[0180] Thus, the spring members 1610 connect the wafer support block 1606 and the actuator flange 1608 such that the distal end of the first actuator 1602 can apply an actuating force 1602A that displaces the wafer support block 1606 along an actuating axis (depicted as the X-axis in Figure 16 ) from a first (rest) position to a second position. The displacement may be a variable, pre-determined distance from the first position relative to the actuator flange 1608. The spring members 1610 may be temporarily slightly deformed by moving the wafer support block 1606 along the axis of the actuating force 1602A to allow the wafer support block 1606 to shift. After the actuating force 1602A is applied, the spring members 1610 may apply a return spring force 1610A such that the distal end of the first actuator 1602 (if not already returned to the first position) is forced back to the first position relative to the actuator flange 1608.

[0181] Additionally and / or alternatively, the second actuator 1604 may apply an actuating force 1604A to assist in returning the wafer support block 1606 to the first position. In cases where the embodiment includes a spring-based return system, the return spring force 1610A may act on the wafer support block 1606 to return the wafer support block 1606 to the first position. Additionally, the actuating force 1604A may be greater than the return spring force 1610B and may provide additional control regarding the transfer speed, transfer acceleration relative to the actuator flange 1608, and other controllable factors indicative of an accurate return of the wafer support block 1606 to the first position relative to the actuator flange 1608. When the second actuator 1604 is performing a fine adjustment operation as described above, the return force 1610B may also return the wafer support block 1606 to the first position. That is, the first position is a common rest position, and when the second actuator 1604 pushes the wafer support block 1606 toward the first actuator 1602, the third position may be reached.

[0182] According to one embodiment, during die transfer, precise actuation control for fine adjustment of the wafer support block 1606 can provide better optimization capabilities for fine adjustment movement in two directions along a single axis. Each of the first actuator 1602 and the second actuator 1604 may be connected to a control system (not shown) via a respective one of the connectors 1614 and 1616, respectively. Thus, embodiments (such as the embodiments described with reference to Figure 16 provide alignment times in two travel directions along a single axis.

[0183] A third exemplary embodiment of a direct transfer device having a fine adjustment assembly

[0184] Additionally and / or alternatively, Figure 17 An underside view of an embodiment of a fine adjustment mechanism 1700 having four micro-actuators (a first actuator 1702, a second actuator 1704, a third actuator 1706, and a fourth actuator 1708) is shown. Many features of the fine adjustment mechanism 1700 may be respectively associated with FIGS. 15 and Figure 16The features of the micro-adjustment mechanisms 1500 and 1600 therein remain substantially similar. For example, as described with respect to the first actuator 1602 and the second actuator 1604, in the micro-adjustment mechanism 1700, the first actuator 1702 and the second actuator 1704 can be respectively disposed on the support arms 1710A and 1710B, against the actuator flange 1710. However, the actuator flange 1710 can have additional support arms 1710C and 1710D, and the third actuator 1706 and the fourth actuator 1708 can be respectively supported on the support arms 1710C and 1710D. As depicted, it is contemplated that the third actuator 1706 and the fourth actuator 1708 can be collinearly aligned relative to each other and positioned to contact the wafer support block 1712 at positions that are respectively rotated 90 degrees from the first actuator 1702 and the second actuator 1704. That is, the third actuator 1706 and the fourth actuator 1708 can be oriented perpendicular to the collinear alignment of the first actuator 1702 and the second actuator 1704 to adjust the position of the die in a direction perpendicular to the direction line in which the first actuator 1702 and the second actuator 1704 can perform adjustment. Note that the opposing actuators can be used as return members to reset the adjusted feature to an intermediate state.

[0185] First illustrative example of a method for performing direct transfer using a direct transfer device having a micro-adjustment assembly

[0186] In one embodiment, as the frame holding the wafer tape is transferred from one position to another, the transfer mechanism holding the wafer frame can move to the transfer position and can perform micro-adjustment to fine-tune the transfer position and / or eliminate system vibrations after a sudden stop or even a significant slowdown. Once the adjustment is made, the system will transfer the die. Figure 18 A method 1800 of a direct transfer operation of an embodiment of a direct transfer device having a micro-adjustment mechanism is depicted, in which the transfer mechanism can stop at each transfer alignment or can not completely stop but can only decelerate at each transfer alignment.

[0187] The steps of the method 1800 described herein can be performed in no particular order and can thus be performed in any satisfactory order to achieve the desired product state. For ease of illustration, the method 1800 is described as being at least partially performed by a direct transfer device having a micro-adjustment mechanism, such as Figures 14 to 17 those shown. Note that, for convenience, the steps of the method 1800 are described as if the micro-adjustment mechanism is provided together with the wafer substrate transfer mechanism. However, it is contemplated that the principles of the micro-adjustment mechanism can be adapted to be implemented on other coarse movement mechanisms as described above. Thus, it is also contemplated that the steps of the method 1800 may also be applicable to other than Figures 14 to 17An apparatus in which a fine adjustment mechanism is provided on a coarse movement mechanism outside the apparatus shown.

[0188] An exemplary method 1800 of a direct transfer operation (and each process described herein) is illustrated as a logic flow diagram, where each corresponding operation in the flow diagram can represent a sequence of operations that can be implemented by hardware, software, or a combination thereof. In some cases, one or more of these operations may be performed by one or more human users.

[0189] In the context of software, these operations can represent computer-executable instructions stored on one or more computer-readable media that, when executed by one or more processors, perform the operations. Generally, computer-executable instructions can include routines, programs, objects, components, data structures, etc. that perform specific functions or implement specific abstract data types.

[0190] The computer-readable media can include non-transitory computer-readable storage media, which can include a hard disk drive, a floppy disk, an optical disk, a CD-ROM, a DVD, a read-only memory (ROM), a random access memory (RAM), an EPROM, an EEPROM, a flash memory, a magnetic or optical card, a solid-state storage device, or other types of storage media suitable for storing electronic instructions. Additionally, in one embodiment, the computer-readable media can include transitory computer-readable signals (in compressed or uncompressed form). Examples of computer-readable signals (whether modulated using a carrier wave or not) include, but are not limited to, signals that a computer system hosting or running a computer program can be configured to access, including signals downloaded via the Internet or other networks. Finally, unless otherwise stated, the order of describing the operations is not intended to be limiting, and any number of the described operations can be combined in any order and / or in parallel to implement the process.

[0191] Now referring Figure 18 For a more detailed description, at 1802, the PC (referred to above Figure 7 described) can instruct the system to align a first substrate (e.g., a die-bearing substrate, such as a wafer tape on which a die is fixed), a second substrate (a transfer substrate to which the wafer is to be transferred, such as a circuit board or another die, etc.), and a transfer mechanism to an alignment position (discussed further herein). That is, in one embodiment, the PC can instruct any one or all of the first substrate transfer mechanism, the second substrate transfer mechanism, or the transfer mechanism to move to a transfer alignment position, in which the die is to be transferred from the first substrate to the transfer position on the second substrate. Note that it is contemplated that at least one of the first substrate transfer mechanism, the second substrate transfer mechanism, or the transfer mechanism has implemented a fine adjustment mechanism to minimize misalignment caused by coarse movement during the transfer process and / or other factors.

[0192] As used herein, an alignment position can be a position within a range of alignment distances between moving components. For example, when all three components (e.g., a transfer mechanism, a first substrate carrying a die to be transferred, and a second substrate having a target transfer position for the die) are aligned, an alignment position may occur such that any deviation (i.e., misalignment) in the alignment between these three components is in the range of 10 microns to 75 microns. In one embodiment, the alignment position can include a smaller range of allowable alignment errors, such as 10 microns to 20 microns. Other misalignment tolerance ranges can be envisioned, and thus these misalignment tolerance ranges are not limited to the ranges explicitly discussed herein.

[0193] Referring further to step 1802 above, in one embodiment, once the alignment position is reached, the system can align the substrate with the transfer mechanism by completely stopping the coarse movement of the system components in preparation for die transfer. When stopping, structural vibrations may occur. For example, due to the deceleration of the moving mass, the vibrations may cause an alignment shift of up to 30 microns to 50 microns.

[0194] Additionally and / or alternatively, in one embodiment, the system can align the substrate with the transfer mechanism in preparation for die transfer while one or more of the three components are in motion. For example, the transfer mechanism that conveys the first substrate can have instructions to maintain a cautious, slow, continuous movement; or the movement between coarse movements may be faster, and then when the moving component approaches the desired transfer position, the system can reduce the speed of the moving component. Thus, at a precise, determinable moment, the system can adjust the micro-adjustment mechanism in a direction, for example, 180 degrees opposite to the direction of travel of the component in coarse movement, on the axis of travel such that the die being transferred is stationary relative to the target position on the support. That is, the relative speed of the component being micro-adjusted becomes zero. At the moment when the die is most closely aligned with the target transfer position, the transfer mechanism is actuated to transfer the die out of the first substrate. A possible advantage of implementing the continuous movement embodiment can include manufacturing efficiency gained from the time saved compared to waiting for the system vibrations to stabilize at each transfer position.

[0195] In any embodiment, in order to determine the time of actuation and the control parameters to be used to actuate the actuator, the cell manager (referred to Figure 7 as discussed) can determine real-time operating factors, including speed, acceleration, position, alignment between moving components, time, and other factors. Thus, before each actuation, the sensor manager, the motion manager, and the die manager determine the timing and rate of actuation for operating the actuator.

[0196] At 1804, the transfer device makes one or more fine adjustments to the position of one or more components in the assembly as needed to improve the alignment position. The one or more fine adjustments can be performed by displacing the components via actuation of at least one fine adjustment actuator, thereby resolving any misalignment at the microscale. The displacement can include, for example, displacing a first substrate from a first position relative to an actuator flange to a second position relative to the actuator flange using a fine adjustment actuator. The displacement can be variably controlled and can thus be a predetermined distance that more precisely aligns the die to be transferred from the first substrate to the transfer position on the second substrate to ensure an effective placement. That is, despite the microscale movement due to vibrational movement or continuous movement, the alignment position described with reference to 1802 can be improved in real time by reducing and / or eliminating any die misalignment during the transfer process.

[0197] At 1806, the device transfers a semiconductor device die from a first substrate to a second substrate via actuation of a transfer mechanism (e.g., cycling a thimble / push pin / wire, pivoting a chuck, etc.).

[0198] At step 1808, the components that can be fine adjusted return to an intermediate position (rest). For example, in an embodiment using a spring member, a return force can occur automatically due to the nature of the spring member of the fine adjustment mechanism; or in a different embodiment, the return force can be generated by one or more of a second actuator, a third actuator, and / or a fourth actuator.

[0199] At 1810, the transfer device determines whether to transfer other semiconductor device dies. If there are no other dies to transfer, the process ends at 1812. However, if it is determined that more dies are to be transferred, the process can start again from 1802.

[0200] Fourth Exemplary Embodiment of a Direct Transfer Device with a Fine Adjustment Assembly

[0201] Figure 19A An isometric view of a two-axis rail fine adjustment assembly 1900 (hereinafter referred to as rail assembly 1900) according to an embodiment of the present application is shown. Here again, the fine adjustment mechanism is implemented by, for example, a wafer tape transfer mechanism. However, as described above, it is contemplated that a similar fine adjustment mechanism can be adapted to be implemented with a product substrate transfer mechanism. However, for convenience, Figures 19A to 19C relates to the rail assembly 1900, which is suitable for adjusting the relative position of a wafer tape carrying the die to be transferred.

[0202] In one embodiment, the guide rail assembly 1900 may include a sub-step member 1902 (e.g., a plate, a frame, a rigid support structure, etc.), to which a plurality of guide rail-guided sliders (e.g., a first-axis slider 1904 and a second-axis slider 1906) can be slidably attached in series. The guide rail-guided sliders 1904, 1906 can be used as supports to convey a wafer tape carrying semiconductor device dies along corresponding axes in response to actuation of one or more of the micro-adjustment actuators 1908, 1910, respectively. Additionally, the guide rail assembly 1900 may include a first set of guide rails 1912 attached to the sub-step member 1902. The first set of guide rails 1912 is positioned to engage a sliding mechanism 1914 attached to the side of the first-axis slider 1904 facing the sub-step member 1902. When actuated by the micro-adjustment actuator 1908, the first-axis slider 1904 can be configured to slide along a single axis in a direction parallel to the extension direction of the first set of guide rails 1912. Although the first set of guide rails 1912 is depicted as including two guide rails, it is contemplated that other configurations with more or fewer than two guide rails may exist.

[0203] A second set of guide rails 1916 may be attached to the side of the first-axis slider 1904 opposite to the side to which the sliding mechanism 1914 is attached. The second set of guide rails 1916 can engage a second set of sliding mechanisms 1918 attached to the side of the second-axis slider 1906 facing the first slider 1904. When actuated by the micro-adjustment actuator 1910, the second-axis slider 1906 can convey a wafer tape carrying semiconductor device dies along an axis parallel to the second set of guide rails 1916. Although Figures 19A to 19C the first set of guide rails 1912 and the second set of guide rails 1916 are depicted as being perpendicular to each other, it is contemplated that the first set of guide rails 1912 and the second set of guide rails 1916 can be oriented relative to each other in an orientation different from that shown in the figure.

[0204] The guide rail assembly 1900 may include a first stop block 1920 and a second stop block 1922 to provide stop points for the edges of the first-axis slider 1904 and the second-axis slider 1906, respectively. Additionally, the first stop block 1920 and the second stop block 1922 can respectively fix compression buffers 1922, 1924 in corresponding cavities, and the plurality of guide rail-guided sliders can abut against the compression buffers 1922, 1924 when displaced by the micro-adjustment actuators 1908, 1910 without being damaged. The compression buffers 1922, 1924 can be formed of a deformable elastic material, such as a rubberized polymer, a polymer, a rubber, or other suitable materials (e.g., soft silicone resin, sponge, foam, rubber, plastic, etc.). Thus, the compression buffers 1922, 1924 can be used as return members to reset the wafer holder or the substrate holder to an intermediate position.

[0205] Figure 19B shows a side view of the two-axis guideway micro-adjustment assembly 1900, and Figure 19C shows its bottom view.

[0206] A second illustrative example of a method for performing direct transfer using a direct transfer device having a micro-adjustment assembly

[0207] Figure 20 shows an embodiment of a method 2000 for transferring semiconductor device dies using a micro-adjustment mechanism. As described above, while the device for transferring dies can achieve coarse adjustment over a relatively large distance (e.g., 1 mm, 2 mm, etc.) for certain die transfers, a micro-adjustment mechanism can be advantageous for situations where misalignment may occur. Additionally, in some cases, a series of dies are to be transferred, and although coarse position adjustment can be used, due to the relative proximity of adjacent dies, coarse adjustment may not be practical. In such cases, a micro-adjustment mechanism can also be advantageous.

[0208] According to method 2000, the die transfer sequence can be as follows. In step 2002, the system can set the micro-adjustment mechanism to an intermediate position. In step 2004, the system can perform coarse adjustment by actuating one or more system components such as a transfer mechanism to place these components in a transfer alignment position. Assuming the coarse adjustment places the components satisfactorily in the transfer alignment position, method 2000 proceeds to step 2006 to transfer the die. In step 2008, the system determines whether there are any other dies to be transferred to an alignment position that can be achieved using micro-adjustment. The mechanism actuates the micro-adjustment mechanism to transfer one or more of the components to the next transfer alignment position. If the determination in step 2008 is affirmative, the system proceeds to step 2010 to actuate the micro-adjustment mechanism to place the components in the next alignment position. If the determination in step 2008 is negative, the system proceeds to step 2012 to determine whether there are any other dies to be transferred to an alignment position that can be achieved using coarse adjustment. If the determination in step 2012 is affirmative, the method returns to step 2004. If the determination in step 2012 is negative, the method ends at step 2014.

[0209] Note that at step 2006, the system may be required to transfer more than one die simultaneously and / or sequentially. In the case where the alignment position exceeds the available stroke length of one or more ejectors of the transfer mechanism, the micro-adjustment actuator may be actuated to allow the one or more transfers to occur simultaneously or very rapidly sequentially if possible, thereby avoiding coarse adjustment. Additionally, since the die transfer head may include a plurality of ejector pins configured as an array, the pitch between the plurality of ejector pins substantially matches the pitch between the non-transferred dies, so multiple dies may be transferred simultaneously by actuating two or more of the ejector pins on the die transfer head simultaneously (e.g., see Figure 21 ).

[0210] Figure 21 A die transfer head 2102 having a plurality of ejector pins 2104 is shown. In the example shown, the die transfer head 2102 includes 24 ejector pins 2104 arranged in two rows with a pitch of 0.275 mm, 12 ejector pins in each row. As described above, according to one or more embodiments of the present application, the ejector pins 2104 may be configured for transferring dies. As Figure 21 shown, circuit pads 2106 may be configured on the circuit substrate at a predetermined pitch (e.g., 2.23 mm). The configuration of a known pitch may allow the use of a head having an ejector pin pitch that is the same (or similar) to the predetermined die pitch for multi-ejector pin die transfer. For example, a single multi-ejector pin device die transfer head may transfer two or more device dies (transfer combinations #1 and #2, respectively) by using only micro-adjustment to displace the transfer head from position A to position B without performing coarse adjustment.

[0211] Exemplary clause

[0212] A: An apparatus for performing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising: a substrate transfer mechanism capable of moving on two axes to perform a primary position adjustment of the first substrate; a micro-adjustment mechanism coupled to the substrate transfer mechanism, the micro-adjustment mechanism being configured to hold the first substrate and perform a secondary position adjustment, the scale of the secondary position adjustment being less than the primary position adjustment caused by the substrate transfer mechanism, and the micro-adjustment mechanism including: a micro-adjustment actuator having a movable distal end and a substrate holder frame configured to fix the first substrate, and the substrate holder frame being movable via actuation of the distal end of the micro-adjustment actuator; a substrate frame configured to fix the second substrate such that a transfer surface of the second substrate is disposed to face the semiconductor device die disposed on the first substrate; and a transfer mechanism configured to press on the first substrate and transfer the semiconductor device die to the second substrate.

[0213] B: The apparatus according to paragraph A, wherein the micro-adjustment mechanism further comprises: a wafer support for fixing the substrate holder frame; and a return member for resetting the substrate holder frame to an intermediate position, and wherein the distal end of the micro-adjustment actuator is arranged to be adjacent to the wafer support.

[0214] C: The apparatus according to any one of paragraphs A to B, wherein the micro-adjustment actuator is a first micro-adjustment actuator, and wherein the micro-adjustment mechanism further comprises a second micro-adjustment actuator having a distal end positioned to adjust the position of the substrate holder frame, and wherein the distal end of the first micro-adjustment actuator is positioned to adjust the position of the substrate holder frame at a position displaced by approximately 90 degrees relative to the distal end of the second micro-adjustment actuator.

[0215] D: The apparatus according to any one of paragraphs A to C, wherein the micro-adjustment mechanism is a two-axis guide rail transfer mechanism.

[0216] E: The apparatus according to any one of paragraphs A to D, wherein the micro-adjustment mechanism further comprises a sub-stage attached to the substrate transfer mechanism.

[0217] F: The apparatus according to any one of paragraphs A to E, wherein the micro-adjustment mechanism further comprises: a first pair of parallel guide rails attached to the sub-stage and extending in a first direction; a first axis slide having a first side facing away from its second side, the first axis slide being indirectly connected to the sub-stage via the first pair of parallel guide rails located on the first side of the first axis slide; a second pair of parallel guide rails attached to the second side of the first axis slide and extending in a second direction transverse to the first direction; and a second axis slide indirectly connected to the first axis slide via the second pair of parallel guide rails, the second axis slide supporting the substrate holder frame.

[0218] G: The apparatus according to any one of paragraphs A to F, wherein the movable distal end of the micro-adjustment actuator is arranged to contact an edge of the first axis slide.

[0219] H: An apparatus for performing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising: a substrate transfer mechanism configured to perform a macro-position adjustment of the first substrate; and a micro-adjustment mechanism coupled to the substrate transfer mechanism, the micro-adjustment mechanism being configured to hold the first substrate and perform a micro-position adjustment of the first substrate, and the micro-adjustment mechanism comprising: a micro-adjustment actuator having a movable distal end and a substrate holder frame configured to fix the first substrate, and the substrate holder frame being fixed to a slide plate that is movable by contacting the distal end of the micro-adjustment actuator; a substrate frame configured to fix the second substrate such that a transfer surface of the second substrate is disposed to face the semiconductor device die disposed on the first substrate; and a transfer mechanism configured to press on the first substrate and transfer the semiconductor device die to the second substrate.

[0220] I: The apparatus according to paragraph H, wherein the micro-adjustment actuator is a first micro-adjustment actuator, wherein the slide plate is a first slide plate of the micro-adjustment mechanism and is adjustable in position in a first direction, and wherein the micro-adjustment mechanism further comprises: a second slide plate adjustable in position in a second direction transverse to the first direction, and a second micro-adjustment actuator having a movable distal end disposed to contact the second slide plate and adjust the position of the second slide plate.

[0221] J: The apparatus according to any one of paragraphs H to I, wherein the first slide plate and the second slide plate are interconnected by a pair of parallel guide rails such that the second slide plate is movable relative to the first slide plate in a linear direction.

[0222] K: The apparatus according to any one of paragraphs H to J, wherein the micro-adjustment mechanism further comprises: a first compression buffer disposed on a side of the first slide plate opposite to the first micro-adjustment actuator to stop the first slide plate after actuating the first micro-adjustment actuator, and a second compression buffer disposed on a side of the second slide plate opposite to the second micro-adjustment actuator to stop the second slide plate after actuating the second micro-adjustment actuator.

[0223] L: The apparatus according to any one of paragraphs H to K, wherein the substrate transfer mechanism is movable in at least two directions.

[0224] M: The device according to any one of paragraphs H to L, wherein the micro-adjustment actuator is configured to perform a position adjustment in a range between 0.5 micrometers and 5000 micrometers.

[0225] N: The device according to any one of paragraphs H to M, wherein the micro-adjustment actuator is configured to perform a position adjustment in a range between 1 micrometer and 1000 micrometers.

[0226] O: The device according to any one of paragraphs H to N, wherein the micro-adjustment actuator is configured to perform a position adjustment in a range between 5 micrometers and 50 micrometers.

[0227] P: A device for performing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the device comprising: a substrate transfer mechanism configured to move in one or more directions to transfer the first substrate in a macro position adjustment; a micro-adjustment mechanism coupled to the substrate transfer mechanism, the micro-adjustment mechanism being configured to further transfer the first substrate relative to the substrate transfer mechanism in a micro position adjustment, and the micro-adjustment mechanism including: one or more micro-adjustment actuators having a movable distal end and a substrate holder frame configured to hold the first substrate to be movable via actuation of the one or more micro-adjustment actuators; a substrate frame configured to hold the second substrate such that a transfer surface of the second substrate is disposed to face the semiconductor device die disposed on the first substrate; and a transfer member capable of being actuated to press on the first substrate and transfer the semiconductor device die to the second substrate.

[0228] Q: The device according to paragraph P, wherein the one or more micro-adjustment actuators are controlled to offset a position error of the macro position adjustment.

[0229] R: The device according to any one of paragraphs P to Q, wherein the micro-adjustment mechanism is configured to adjust the position of the first substrate relative to the substrate transfer mechanism while the substrate transfer mechanism is in motion.

[0230] S: The device according to any one of paragraphs P to R, wherein the motion of the substrate transfer mechanism is a vibratory motion generated when the substrate transfer mechanism stops after a macro position adjustment.

[0231] T: The device according to any one of paragraphs P to S, wherein the motion of the substrate transfer mechanism is a motion generated when the substrate transfer mechanism continuously moves inward during the macro position adjustment.

[0232] Conclusion

[0233] Although several embodiments specific to structural features and / or method acts have been described in language, it should be understood that the claims are not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the claimed subject matter. In addition, the term "may" is used herein to indicate the possibility of using certain features in one or more of the various embodiments, but not necessarily in all embodiments.

Claims

1. A method of transferring a semiconductor device die, comprising: Determining a transfer position for transferring a semiconductor device die disposed on a first substrate to a second substrate; Determining an alignment position of the first substrate and the second substrate at least in part based on the transfer position; Moving at least one of the first substrate or the second substrate a major distance via a first transfer mechanism at least in part based on the alignment position, the first transfer mechanism being configured to perform a major movement; Determining one or more micro-position adjustments associated with aligning the first substrate and the second substrate at the alignment position; Moving at least one of the first substrate or the second substrate to the alignment position via a second transfer mechanism at least in part based on the one or more micro-position adjustments, the second transfer mechanism being configured to perform a minor movement; And Transferring the semiconductor device die from the first substrate to the second substrate, Wherein the minor movement is a movement of a smaller scale than the major movement.

2. The method according to claim 1, further comprising, in a first case, determining an intermediate position of the second transfer mechanism, and Wherein determining the one or more micro-position adjustments is at least in part based on the intermediate position.

3. The method according to claim 2, further comprising, in a second case after the first case and at least in part based on transferring the semiconductor device die, moving the second transfer mechanism to the intermediate position.

4. The method according to claim 1, further comprising, at least in part based on moving at least one of the first substrate or the second substrate according to the one or more micro-position adjustments, determining that the first substrate and the second substrate are aligned, and Among them, Transferring the semiconductor device die from the first substrate to the second substrate is at least in part based on the first substrate and the second substrate being aligned.

5. The method according to claim 1, wherein Determining one or more micro-position adjustments includes: Determining a first micro-position adjustment along a first axis; and Determining a second micro-position adjustment along a second axis.

6. The method according to claim 1, wherein, The alignment position is a first alignment position; Wherein the one or more micro-position adjustments are one or more first micro-position adjustments; and Wherein the method further comprises: Determining a second transfer position for transferring a second semiconductor device die disposed on the first substrate to the second substrate, Determining a second alignment position of the first substrate and the second substrate at least in part based on the second transfer position, Determining that the second alignment position is within one or more second micro-position adjustments of the second transfer mechanism, Moving at least one of the first substrate or the second substrate to the second alignment position via the second transfer mechanism at least in part based on the one or more second micro-position adjustments; and Transferring the second semiconductor device die from the first substrate to the second substrate.

7. The method according to claim 1, wherein Transferring the semiconductor device die from the first substrate to the second substrate includes transferring the semiconductor device die from the first substrate to the second substrate during a major movement of at least one of the first substrate or the second substrate by the first transfer mechanism.

8. A method of transferring a semiconductor device die, comprising: Determining a transfer position associated with transferring a semiconductor device die from a first substrate to a second substrate; Determine an alignment position of the first substrate, the second substrate, and a transfer mechanism for transferring a semiconductor device die from the first substrate to the second substrate, at least partially based on the transfer position; Move at least one of the first substrate, the second substrate, or the transfer mechanism via a first mechanism, at least partially based on the alignment position, the first mechanism being configured to perform a primary movement; Determine one or more fine position adjustments to at least one of the first substrate, the second substrate, or the transfer mechanism, the one or more fine position adjustments being associated with aligning the first substrate, the second substrate, and the transfer mechanism to the alignment position; Move at least one of the first substrate, the second substrate, or the transfer mechanism via a second mechanism, at least partially based on the one or more fine position adjustments, the second mechanism being configured to perform a secondary movement that is less than the primary movement; And Transfer the semiconductor device die from the first substrate to the second substrate.

9. The method according to claim 8, wherein: Moving at least one of the first substrate, the second substrate, or the transfer mechanism via the first mechanism includes moving at least one of the first substrate, the second substrate, or the transfer mechanism by a first amount; And Moving at least one of the first substrate, the second substrate, or the transfer mechanism via the second mechanism includes moving at least one of the first substrate, the second substrate, or the transfer mechanism by a second amount that is less than the first amount.

10. The method according to claim 8, wherein, The one or more fine position adjustments range between 0.5 micrometers and 5000 micrometers.

11. The method according to claim 8, wherein, Transferring the semiconductor device die from the first substrate to the second substrate Includes transferring the semiconductor device die from the first substrate to the second substrate during a primary movement of at least one of the first substrate or the second substrate via the first mechanism.

12. The method according to claim 8, wherein, The alignment position is a first alignment position; Wherein, the one or more fine position adjustments include one or more first fine position adjustments; and Wherein, the method further includes: Determine a second transfer position associated with transferring a second semiconductor device die from the first substrate to the second substrate, Determine a second alignment position of the first substrate, the second substrate, and the transfer position, at least partially based on the second transfer position, Determine that the second alignment position can be achieved by one or more second fine position adjustments to at least one of the first substrate, the second substrate, or the transfer mechanism via the second mechanism, Move at least one of the first substrate, the second substrate, or the transfer mechanism via the second mechanism, at least partially based on the one or more second fine position adjustments; and Transfer the second semiconductor device die from the first substrate to the second substrate.

13. The method according to claim 8, wherein: The second mechanism includes a first actuator and a second actuator, The one or more fine position adjustments include: A first fine position adjustment along a first axis; and A second fine position adjustment along a second axis, and Moving at least one of the first substrate, the second substrate, or the transfer mechanism via the second mechanism includes: Moving at least one of the first substrate, the second substrate, or the transfer mechanism via the first actuator by the first fine position adjustment, and Moving at least one of the first substrate, the second substrate, or the transfer mechanism via the second actuator by the second fine position adjustment.

14. The method according to claim 8, wherein: the alignment position is associated with a series of alignment positions among the first substrate, the second substrate, and the transfer mechanism, and at least partially based on the one or more micro-position adjustments, moving at least one of the first substrate, the second substrate, or the transfer mechanism includes moving at least one of the first substrate, the second substrate, or the transfer mechanism within the series of alignment positions via the second mechanism.

15. A method of transferring a semiconductor device die, comprising: determining a transfer position associated with transferring a semiconductor device die from a first substrate to a second substrate; determining an alignment position of the first substrate and the second substrate at least partially based on the transfer position; moving at least one of the first substrate or the second substrate a first amount using one or more first actuators at least partially based on the alignment position; determining an adjustment associated with aligning the first substrate and the second substrate; moving at least one of the first substrate or the second substrate a second amount less than the first amount using one or more second actuators at least partially based on the adjustment; and transferring the semiconductor device die from the first substrate to the second substrate.

16. The method according to claim 15, wherein, Moving at least one of the first substrate or the second substrate a second amount using one or more second actuators occurs at least partially during moving at least one of the first substrate or the second substrate a first amount using one or more first actuators.

17. The method according to claim 15, further comprising moving the transfer mechanism to the alignment position, the transfer mechanism transferring the semiconductor device die from the first substrate to the second substrate.

18. The method according to claim 15, further comprising moving the one or more second actuators to an intermediate position at least partially based on transferring the semiconductor device die.

19. The method according to claim 15, wherein, The alignment position is a first alignment position, wherein the adjustment is a first adjustment, and wherein the method further comprises: determining a second transfer position associated with transferring a second semiconductor device die from the first substrate to the second substrate, determining a second alignment position of the first substrate and the second substrate at least partially based on the second transfer position, determining a second adjustment associated with aligning the first substrate and the second substrate; moving at least one of the first substrate or the second substrate a third amount less than the first amount using one or more second actuators at least partially based on the second adjustment; and transferring the second semiconductor device die from the first substrate to the second substrate.

20. The method according to claim 15, wherein, Moving at least one of the first substrate or the second substrate a second amount using one or more second actuators includes: moving at least one of the first substrate or the second substrate along a first axis; and moving at least one of the first substrate or the second substrate along a second axis.

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