Wafer pre-alignment device and wafer pre-alignment system

Abstract

This application relates to the field of semiconductor fabrication technology, and in particular to a wafer pre-alignment device and a wafer pre-alignment system. The wafer pre-alignment device includes a lifting mechanism, a moving mechanism, a rotating mechanism, a first adsorption mechanism, and a second adsorption mechanism. The lifting mechanism is connected to the first adsorption mechanism via the rotating mechanism and is used to drive the rotating mechanism and the first adsorption mechanism to move up and down along a first direction. The rotating mechanism is used to drive the first adsorption mechanism to rotate around the first direction. The second adsorption mechanism is disposed on the side of the first adsorption mechanism. The moving mechanism is connected to the second adsorption mechanism and is used to drive the second adsorption mechanism to move along a second direction perpendicular to the first direction. This device can correct and determine the geometric position error generated during wafer transport to the micrometer level, realizing the determination of the geometric position of the wafer in the overall equipment, meeting the requirements of the overall equipment for the geometric position coordinates of the wafer, and solving the problem of insufficient accuracy in traditional wafer transport solutions.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and in particular to a wafer pre-alignment device and a wafer pre-alignment system. Background Technology

[0002] Currently, most common wafer transfer solutions rely on robotic arms to transfer wafers from the equipment feeding end to the equipment application end. Existing robotic arm transfer solutions can only maintain transfer accuracy at the millimeter level, which does not meet the accuracy requirements of the equipment. Summary of the Invention

[0003] The purpose of this application is to provide a wafer pre-alignment device and a wafer pre-alignment system, which to a certain extent solves the technical problem that the existing robotic arm transmission scheme can only maintain the transmission accuracy at the millimeter level, which does not meet the accuracy requirements of the equipment.

[0004] This application provides a wafer pre-alignment device, including: a lifting mechanism, a moving mechanism, a rotating mechanism, a first adsorption mechanism, and a second adsorption mechanism;

[0005] The lifting mechanism is connected to the first adsorption mechanism via the rotating mechanism, and the lifting mechanism is used to drive the rotating mechanism together with the first adsorption mechanism to move up and down along a first direction, and the rotating mechanism is used to drive the first adsorption mechanism to rotate around the first direction.

[0006] The second adsorption mechanism is disposed on the side of the first adsorption mechanism; the moving mechanism is connected to the second adsorption mechanism and is used to drive the second adsorption mechanism to move along a second direction perpendicular to the first direction.

[0007] In the above technical solution, the lifting mechanism further includes a first driving device, a first transmission mechanism, a first swing member, and a first cam; wherein the first cam is disposed on the first swing member, and along the first direction, the first cam abuts against the bottom of the rotating mechanism;

[0008] The first driving device drives the first swing member to rotate around the second direction through the first transmission mechanism, so that the first cam pushes the rotating mechanism together with the first adsorption mechanism to rise and fall along the first direction.

[0009] In any of the above technical solutions, the rotating mechanism further includes a second driving device and a rotating shaft;

[0010] The second driving device includes a stator and a mover disposed inside the stator, and the rotating shaft is connected to the mover and the first adsorption mechanism respectively.

[0011] In any of the above technical solutions, the moving mechanism further includes a third driving device and a lead screw transmission assembly, wherein the third driving device is connected to the second adsorption mechanism through the lead screw transmission assembly.

[0012] In any of the above technical solutions, the first adsorption mechanism further includes a first support member connected to the rotating mechanism, and the first support member has a first air extraction hole; and / or

[0013] The second adsorption mechanism includes a second support member connected to the moving mechanism, and the second support member has a second air extraction hole.

[0014] This application also provides a wafer pre-alignment system, including the wafer pre-alignment device described in any of the above technical solutions, and thus has all the beneficial technical effects of the wafer pre-alignment device, which will not be repeated here.

[0015] In the above technical solution, the wafer pre-alignment system further includes a detection device, which is disposed on the side of the wafer pre-alignment device.

[0016] In any of the above technical solutions, the wafer pre-alignment system further includes a transfer device, which is disposed on the side of the wafer pre-alignment device and is used to receive intermediate products after the wafer pre-alignment device has adjusted their position and transport them to the next work station.

[0017] In any of the above technical solutions, the transfer device further includes a fourth driving device and a supporting member, and the fourth driving device is connected to the supporting member;

[0018] The load-bearing member forms multiple load-bearing sections that are angled to each other.

[0019] In any of the above technical solutions, the wafer pre-alignment system further includes a cache device for receiving and storing intermediate products transferred from the previous workstation.

[0020] In any of the above technical solutions, the buffer device further includes a lifting component and an adsorption component connected to the lifting component, wherein the lifting component is used to drive the adsorption component to move up and down along a first direction.

[0021] In any of the above technical solutions, the lifting assembly further includes a fifth driving device, a second transmission mechanism, a second swing member, a second cam, and a support shaft; wherein the second cam is disposed on the second swing member, and along the first direction, the second cam abuts against the bottom of the support shaft;

[0022] The fifth driving device drives the second swing member to rotate around the second direction through the second transmission mechanism, so that the second cam pushes the support shaft to rise and fall along the first direction;

[0023] The adsorption assembly includes a support member that abuts against the end of the support shaft that is away from the second cam; both the support member and the support shaft form a third air extraction channel that is interconnected with each other.

[0024] In any of the above technical solutions, the wafer pre-alignment system further includes a purging device for purging intermediate products placed within the wafer pre-alignment system.

[0025] In any of the above technical solutions, the purging device further includes a flow pipe and a spray head, and the spray head is connected to the flow pipe; the flow pipe includes a separate inner conveying channel and a cooling channel, and a cold pipe is provided in the cooling channel.

[0026] In any of the above technical solutions, the number of detection devices is two, one of which is used to detect the geometric position of the intermediate product, and the other of which is used to detect the surface pattern or geometric position of the pattern of the intermediate product.

[0027] Compared with the prior art, the beneficial effects of this application are as follows:

[0028] The wafer pre-alignment device provided in this application can correct and determine the geometric position error generated during wafer transfer to the micrometer level, realize the determination of the geometric position of the wafer in the whole equipment, meet the requirements of the whole equipment for the geometric position coordinates of the wafer, and solve the problem of insufficient accuracy of traditional wafer transfer schemes.

[0029] The wafer pre-alignment system provided in this application includes the aforementioned wafer pre-alignment device, which can continuously inspect and correct wafers to ensure the normal operation of subsequent process steps. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of the wafer pre-alignment device provided in the embodiments of this application;

[0032] Figure 2 A cross-sectional view of the wafer pre-alignment apparatus provided in an embodiment of this application;

[0033] Figure 3 A cross-sectional view of the rotating mechanism provided in an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the structure of the moving mechanism provided in the embodiments of this application;

[0035] Figure 5 This is a schematic diagram of the lifting mechanism provided in the embodiments of this application;

[0036] Figure 6 This is another structural schematic diagram of the lifting mechanism provided in the embodiments of this application;

[0037] Figure 7 This is a schematic diagram of the structure of the wafer pre-alignment system provided in the embodiments of this application;

[0038] Figure 8 Another schematic diagram of the wafer pre-alignment system provided in the embodiments of this application;

[0039] Figure 9 Another schematic diagram of the wafer pre-alignment system provided in the embodiments of this application;

[0040] Figure 10 This is a schematic diagram of the edge detection device provided in the embodiments of this application;

[0041] Figure 11 This is a schematic diagram of the structure of the marker detection device provided in the embodiments of this application;

[0042] Figure 12 This is a schematic diagram of the transfer device provided in the embodiments of this application;

[0043] Figure 13 A schematic diagram of the structure of the caching device provided in the embodiments of this application;

[0044] Figure 14 This is a schematic diagram of the purging device provided in an embodiment of this application.

[0045] Figure label:

[0046] 1-Lifting mechanism, 11-First driving device, 12-First transmission mechanism, 121-Transmission wheel, 122-Transmission belt, 13-First swing component, 131-Swing arm, 132-Pressure plate, 14-First cam, 15-Reducer;

[0047] 2-Moving mechanism, 21-Third drive device, 22-Screw transmission assembly;

[0048] 3-Rotating mechanism, 31-Stator, 32-Motor, 33-Rotating shaft, 34-Busket, 35-Pressure sleeve, 36-First leaf spring, 37-Second leaf spring, 38-Buffer spring, 39-Support body, 310-Top cover, 311-Bearing seat, 312-Bearing, 313-Connecting shaft;

[0049] 4-First adsorption mechanism, 41-First support member, 411-Groove, 412-Air extraction hole;

[0050] 5-Second adsorption mechanism, 51-Second support member, 511-First connecting plate, 512-Second connecting plate, 513-First support plate, 514-Adsorption groove;

[0051] 6-Main support base;

[0052] 10 - Wafer pre-alignment device;

[0053] 20-Edge detection device, 201-Light source assembly, 202-Mounting base, 203-CCD camera, 204-Lens assembly, 205-Vibration isolation block;

[0054] 30 - Marking detection device; 301 - Motor; 302 - Transmission assembly; 303 - Wafer appearance inspection instrument;

[0055] 40-Transfer device, 401-Fourth drive device, 402-Bearing component, 4021-Main body, 4022-Bearing part, 403-Mounting base;

[0056] 50-Buffer device, 501-Second cam, 502-Support shaft, 503-Supporting component, 504-Third leaf spring, 505-Fourth leaf spring;

[0057] 60 - Purge device; 601 - Flow fitting; 602 - Spray head;

[0058] 70 - Supporting components;

[0059] 100-Wafer Prealignment System. Detailed Implementation

[0060] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0061] The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application.

[0062] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0063] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0064] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0065] The following reference Figures 1 to 14 This application describes a wafer pre-alignment apparatus 10 and a wafer pre-alignment system 100 according to some embodiments thereof.

[0066] See Figures 1 to 6 As shown, an embodiment of this application provides a wafer pre-alignment device 10, which is mainly used to correct the geometric position coordinates of the wafer in the whole equipment to the micrometer level. This will be used as an example in the following text. However, it should be noted that this device is not limited to wafer production lines, but can also be applied to other fields and products.

[0067] The wafer pre-alignment device 10 includes: a lifting mechanism 1, a moving mechanism 2, a rotating mechanism 3, a first adsorption mechanism 4, and a second adsorption mechanism 5;

[0068] The lifting mechanism 1 is connected to the first adsorption mechanism 4 through the rotating mechanism 3, and the lifting mechanism 1 is used to drive the rotating mechanism 3 together with the first adsorption mechanism 4 to rise and fall along the first direction, i.e. direction a. The rotating mechanism 3 is used to drive the first adsorption mechanism 4 to rotate around the first direction.

[0069] The second adsorption mechanism 5 is disposed on the side of the first adsorption mechanism 4; the moving mechanism 2 is connected to the second adsorption mechanism 5 and is used to drive the second adsorption mechanism 5 to move along a second direction perpendicular to the first direction, i.e., direction b.

[0070] Based on the structure described above, the working principle of this wafer pre-alignment device 10 is as follows: In the initial state, the wafer is adsorbed on top of the first adsorption mechanism 4, and the first adsorption mechanism 4 is driven by the rotation mechanism 3 to rotate the wafer. During the rotation, the position of the wafer is detected by the detection device. If a deviation is found in the position of the wafer or the position of the pattern on the wafer, the first adsorption mechanism 4 is released, that is, it no longer adsorbs the wafer. Then, the lifting mechanism 1 is used to lower the first adsorption mechanism 4 so that it is detached from the wafer on top. Then, the moving mechanism 2 is used to drive the second adsorption mechanism 5 to move to below the wafer and adsorb the wafer. Then, the moving mechanism 2 is used to drive the second adsorption mechanism 5 and the wafer to move a preset distance to compensate for the positional deviation. Finally, the lifting mechanism 1 is used to raise the first adsorption mechanism 4 so that it is against the bottom of the wafer and adsorbs the wafer. Of course, the process is not limited to the above and can be adjusted according to actual needs.

[0071] As can be seen, this wafer pre-alignment device 10 can correct and determine the geometric position error generated during wafer transfer to the micrometer level, realize the determination of the geometric position of the wafer in the whole equipment, meet the requirements of the whole equipment for the geometric position coordinates of the wafer, and solve the problem of insufficient accuracy of traditional wafer transfer schemes.

[0072] In this embodiment, preferably, as follows: Figure 5 and Figure 6 As shown, the lifting mechanism 1 includes a first driving device 11, a first transmission mechanism 12, a first swing member 13, and a first cam 14; wherein, the first cam 14 is disposed on the first swing member 13, and along the first direction, the first cam 14 abuts against the bottom of the rotating mechanism 3;

[0073] The first driving device 11 drives the first swing member 13 to rotate around the second direction through the first transmission mechanism 12, so that the first cam 14 pushes the rotating mechanism 3 together with the first adsorption mechanism 4 to rise and fall along the first direction.

[0074] As can be seen from the structure described above, the first driving device 11 drives the first swinging component 13 to swing through the first transmission mechanism 12, thereby driving the first cam 14 to lift or lower in the vertical plane. The first cam 14 then lifts or lowers the rotating mechanism 3 together with the first adsorption mechanism 4, thus realizing the lifting and lowering of the first adsorption mechanism 4. The operation is simple, convenient, time-saving and labor-saving.

[0075] Further, preferably, the first transmission mechanism 12 is a pulley transmission structure, which may include a transmission wheel 121 and a transmission belt 122. The first drive device 11 is connected to the reducer 15. The output end of the reducer 15 is connected to the transmission wheel 121 through the transmission belt 122. One end of the transmission belt 122 extends to the first swing member 13 and is connected to the first swing member 13. Further, preferably, the first swing member 13 includes a swing arm 131 and a pressure plate 132. One end of the transmission belt 122 is clamped by one end of the swing arm 131 and the pressure plate 132. The swing arm 131 and the pressure plate 132 are connected by fastening components such as screws or bolts. The other end of the swing arm 131 is rotatably connected to the main support 6 through a rotating shaft.

[0076] The swing arm 131 has a mounting groove, and the first cam 14 is set in the mounting groove and connected to the swing arm 131. When the swing arm 131 rotates repeatedly in the vertical plane, the first cam 14 also rises or falls, so that the rotating mechanism 3 in contact with it can achieve the movement of lifting and lowering.

[0077] Furthermore, preferably, the wafer pre-alignment device 10 also includes a main support base 6, and the lifting mechanism 1, the moving mechanism 2 and the rotating mechanism 3 are all disposed on the main support base 6.

[0078] In this embodiment, preferably, as follows: Figure 2 and Figure 3 As shown, the rotating mechanism 3 includes a second driving device and a rotating shaft 33;

[0079] The second driving device includes a stator 31 and a mover 32 disposed inside the stator 31. The rotating shaft 33 is connected to the mover 32 and the first adsorption mechanism 4 respectively.

[0080] As can be seen from the structure described above, the stator 31 drives the mover 32 to rotate, thereby driving the rotating shaft 33 to rotate, which in turn drives the first adsorption mechanism 4 at the top of the rotating shaft 33 to rotate the wafer it adsorbs.

[0081] Furthermore, preferably, the main support 6 has mounting grooves and guide grooves arranged sequentially from top to bottom along the vertical direction, and the second drive device is disposed in this mounting groove, such as... Figure 2 and Figure 3 As shown, the rotating mechanism 3 also includes a support body 39, a top cover 310, a bushing 34, a pressure sleeve 35, a first leaf spring 36, a second leaf spring 37, a buffer spring 38, a connecting shaft 313, a bearing seat 311, and a bearing 312. The support body 39 is connected to the main support base 6, and the bearing seat 311 is connected to the support body 39. A bearing 312 is provided between the connecting shaft 313 and the bearing seat 311. The connecting shaft 313 is assembled into a single unit with the mover 32 and the pressure sleeve 35.

[0082] The support body 39 has a mounting cavity extending through its top and bottom, and this mounting cavity is connected to the mounting groove of the main support 6. The rotating shaft 33, the bushing 34, and the pressure sleeve 35 are all disposed in this mounting cavity. The bushing 34 is sleeved on the outside of the rotating shaft 33. One end of the bushing 34 has a first groove, in which the first leaf spring 36 is engaged. The other end of the bushing 34 has a second groove, in which the second leaf spring 37 is engaged. The pressure sleeve 35 is sleeved on the outside of the bushing 34, and both ends of the pressure sleeve 35 abut against and press against the first leaf spring 36 and the second leaf spring 37, respectively. The second leaf spring 37 is disposed in the guide groove and can move along the guide groove. Thus, the two leaf springs form a linear motion guide mechanism, avoiding the traditional contact linear guide mechanism, preventing the generation of particulate matter, providing a certain degree of flexibility during the connection process, avoiding rigid connection, and serving as a torque transmission mechanism to transmit the power of the motor 301 to the rotating shaft.

[0083] The top cover 310 is disposed on the top of the support body 39 and is detachably connected to the support body 39. The top cover 310 forms a guide cavity, and the first leaf spring 36 is movably disposed in the guide cavity.

[0084] The connecting shaft 313 has a limiting cavity, and the buffer spring 38 is confined within this limiting cavity. The buffer spring 38 is sleeved on the outside of the pressure sleeve 35. The mover 32 has an extension that extends from the bottom to the limiting cavity, and the extension is assembled together with the pressure sleeve 35 and the connecting shaft 313.

[0085] Furthermore, preferably, the rotating mechanism 3 also includes a digital detector, such as a circular grating, disposed on the support body 39, for real-time detection of the working status of the motor 301, such as real-time spatial position.

[0086] In this embodiment, preferably, as follows: Figure 4 As shown, the moving mechanism 2 includes a third driving device 21 and a lead screw transmission assembly 22. The third driving device 21 is connected to the second adsorption mechanism 5 through the lead screw transmission assembly 22.

[0087] As can be seen from the structure described above, the third drive device 21 drives the second adsorption mechanism 5 to move in the horizontal direction through the lead screw transmission assembly 22 to compensate for positional deviation.

[0088] Furthermore, preferably, the lead screw drive assembly 22 includes a lead screw, a nut seat, and a support seat. One end of the lead screw is axially connected to the third drive device 21, the other end of the lead screw is rotatably connected to the support seat, and the nut seat is rotatably connected to the lead screw via a thread.

[0089] In this embodiment, preferably, as follows: Figure 1As shown, the first adsorption mechanism 4 includes a first support member 41 connected to the rotating mechanism 3, and the first support member 41 forms a first air extraction hole, and note that the rotating shaft 33 forms a channel connected to the first air extraction hole.

[0090] As can be seen from the structure described above, the first adsorption mechanism 4 mainly uses the principle of negative pressure adsorption to adsorb and fix the wafer. The operation is simple and convenient, and it will not damage the wafer. In addition, the wafer can be quickly released according to actual needs, and the operation is equally simple and convenient.

[0091] Furthermore, preferably, the first support member 41 includes a circular block, and a groove 411 is provided in the middle of the circular block, extending through its opposite sides, so that it forms two arched support portions located on both sides of the groove 411. Each support portion is provided with an air extraction hole 412 for connecting an air source, and the bottom wall of the groove 411 is also provided with an air extraction hole 412 for connecting an air source.

[0092] In this embodiment, preferably, as follows: Figure 1 and Figure 4 As shown, the second adsorption mechanism 5 includes a second support member 51 connected to the moving mechanism 2, and the second support member 51 has a second air extraction hole.

[0093] As can be seen from the structure described above, the second adsorption mechanism 5 mainly uses the principle of negative pressure adsorption to adsorb and fix the wafer. The operation is simple and convenient, and it will not damage the wafer. In addition, the wafer can be quickly released according to actual needs, and the operation is equally simple and convenient.

[0094] Further, preferably, the second support member 51 includes a first connecting plate 511, a second connecting plate 512, and a first support plate 513. The first connecting plate 511 is connected to the nut seat of the lead screw transmission assembly 22 of the moving mechanism 2. The first connecting plate 511 is arranged in a vertical direction, the second connecting plate 512 is arranged in a horizontal direction, and the first support plate 513 is arranged above the second connecting plate 512. The first support plate 513 forms an arc-shaped adsorption groove 514. The first support plate 513 also has a first ventilation channel communicating with the adsorption groove 514, and the second connecting plate 512 has a second ventilation channel communicating with the first ventilation channel.

[0095] In addition, a steel ball is provided between the first connecting plate 511 of the second support member 51 and the nut seat. The two are rotatably connected in the vertical plane through the steel ball. The second support member 51 and the nut seat are also detachably connected by fastening members such as screws or bolts. That is, when the fastening members are loosened, the position of the second support member 51 can be rotated and adjusted. After the adjustment is completed, the fastening members can be tightened again.

[0096] Furthermore, preferably, in order to ensure that the nut seat moves smoothly along the lead screw, it can also be equipped with a cross roller guide and a slider. The slider is connected to the side of the nut seat and is slidably connected to the cross roller guide. The cross roller guide can be fixed on the main support 6.

[0097] Example 2

[0098] See Figures 7 to 9 As shown, Embodiment 2 of this application also provides a wafer pre-alignment system 100, which includes the wafer pre-alignment device 10 described in Embodiment 1 above. Therefore, it has all the beneficial technical effects of the wafer pre-alignment device 10. The same technical features and beneficial effects will not be repeated here.

[0099] In this embodiment, preferably, as follows: Figures 7 to 9 As shown, the wafer pre-alignment system 100 also includes a support frame and a detection device. Both the detection device and the wafer pre-alignment device 10 are disposed on the support frame, and the detection device is disposed on the side of the wafer pre-alignment device 10.

[0100] As can be seen from the structure described above, the wafer is placed on the wafer pre-alignment device 10 and rotated. When it passes through the detection device, the position of the wafer is detected. If the position of the wafer or the position of the pattern on the wafer is found to be deviated, the wafer pre-alignment device 10 will adjust the position of the wafer. For details of the adjustment process, please refer to Embodiment 1.

[0101] In this embodiment, preferably, as follows: Figures 7 to 9 As shown, the wafer pre-alignment system 100 also includes a transfer device 40 disposed on the support member 70, and the transfer device 40 is disposed on the side of the wafer pre-alignment device 10 and is used to receive intermediate products after the wafer pre-alignment device 10 has adjusted their position and transport them to the next work station.

[0102] As described above, after the wafer pre-alignment device 10 corrects deviations, the next step is to transfer it to a preset position via the transfer device 40 for subsequent processes, such as testing other wafer properties. After the next process is completed, the wafer can be transferred again via the transfer device 40 to the buffer device 50 for buffering, awaiting the next process. Note: A robotic arm is required to complete the process between adjacent devices.

[0103] Further, preferably, such as Figure 7 and Figure 8As shown, there are two detection devices. One of the detection devices, namely the edge detection device 20, is mainly used to detect the geometric position of intermediate products. Specifically, the edge detection device 20 scans the notch or flat edge of the rotating wafer and detects the brightness of the image to complete the position acquisition of the wafer's geometric center. The acquired position deviation is then output to the upper-level controller.

[0104] Another detection device, namely the mark detection device 30, is used to detect the surface pattern or geometric position of the pattern on the intermediate product. Of course, other detection devices can be set according to actual needs.

[0105] Furthermore, such as Figure 10 As shown, the edge detection device 20 includes a light source assembly 201, a mounting base 202 serving as a mounting reference, and a CCD camera 203 for acquiring images. The mounting base 202 has a U-shaped structure with an opening facing the side. The CCD camera 203 is mounted on top of the mounting base 202, and a vibration isolation block 205 is provided between the CCD camera 203 and the mounting base 202. The vibration isolation block 205 is used to isolate external vibrations and ensure that the test accuracy is not affected by external interference.

[0106] The lens assembly 204 of the CCD camera 203 extends through the mounting base 202 into the U-shaped cavity formed by the mounting base 202; the light source assembly 201 is disposed on the mounting base 202, located within the U-shaped cavity, and below the lens assembly 204 of the CCD camera 203. Both the light source assembly 201 and the CCD camera 203 are commonly used optical components in the prior art, and will not be described in detail here.

[0107] Furthermore, such as Figure 11 As shown, the marking detection device 30 includes a driving device such as a motor 301, a transmission assembly 302, and a wafer appearance inspection instrument 303. The driving device drives the wafer appearance inspection instrument 303 to move horizontally via the transmission assembly 302, thereby completing the detection of the surface pattern or the geometric position of the pattern on the wafer. The wafer appearance inspection instrument 303 is an existing device, which generally performs operations such as automatic focusing, and will not be described in detail here.

[0108] In this embodiment, preferably, as follows: Figure 12 As shown, the transfer device 40 includes a fourth driving device 401 and a supporting member 402, and the fourth driving device 401 is connected to the supporting member 402.

[0109] The support member 402 forms a plurality of support portions 4022 that are angled to each other. More preferably, the support member 402 forms three support portions 4022, with adjacent support portions 4022 at 120° to each other.

[0110] As can be seen from the structure described above, the three carrier units 4022 can simultaneously transfer wafers at three workstations, forming a continuous working mode.

[0111] Furthermore, preferably, the carrier portion 4022 has a channel for evacuating a vacuum to adsorb the wafer.

[0112] Furthermore, preferably, the transfer device 40 also includes a mounting base 403, and the fourth drive device 401 is disposed on the mounting base 403.

[0113] Furthermore, preferably, the supporting member 402 includes a main body 4021 and three supporting parts 4022; the three supporting parts 4022 are evenly distributed along the circumference of the main body 4021, and the main body 4021 is connected to the fourth driving device 401.

[0114] Furthermore, preferably, the fourth drive device 401 is a brushless motor 301 equipped with an encoding detector.

[0115] In this embodiment, preferably, as follows: Figure 7 As shown, the wafer pre-alignment system 100 also includes a buffer device 50 disposed on the support member 70, which is used to receive and store intermediate products transferred from the previous station.

[0116] Based on this, preferably, such as Figure 13 As shown, the buffer device 50 includes a lifting assembly and an adsorption assembly connected to the lifting assembly. The lifting assembly is used to drive the adsorption assembly to move up and down along a first direction.

[0117] Further, preferably, such as Figure 13 As shown, the lifting assembly includes a fifth driving device, a second transmission mechanism, a second swing member, and a second cam 501 adsorption assembly; wherein, the second cam 501 is disposed on the second swing member, and along the first direction, the second cam 501 abuts against the bottom of the adsorption assembly;

[0118] The fifth drive device drives the second swing component to rotate around the second direction through the second transmission mechanism, so that the second cam 501 pushes the adsorption component up and down along the first direction.

[0119] Further, preferably, such as Figure 13 As shown, the adsorption assembly includes a support member 503, which abuts against the end of the support shaft 502 away from the second cam 501; both the support member 503 and the support shaft 502 form a third air extraction channel that is interconnected with each other.

[0120] As described above, the fifth driving device drives the second swinging component to swing via the second transmission mechanism, thereby driving the second cam 501 to lift or lower in the vertical plane. The second cam 501 then lifts or lowers the adsorption assembly, thus realizing the lifting and lowering of the adsorption assembly. The operation is simple, convenient, time-saving, and labor-saving. For details, please refer to the structure of the lifting mechanism 1 in Embodiment 1. In addition, the lifting assembly also includes a third leaf spring 504 and a fourth leaf spring 505, which are respectively disposed at both ends of the support shaft 502. The corresponding guide structure here can be seen from the guide structure of the first leaf spring 36 and the second leaf spring 37 in Embodiment 1.

[0121] The structure of the supporting member 503 can be referred to the structure of the first supporting member 41 described in Embodiment 1.

[0122] In this embodiment, preferably, as follows: Figure 8 As shown, the wafer pre-alignment system 100 also includes a purging device 60 disposed on the support member 70, which is used to purge intermediate products placed in the wafer pre-alignment system 100, thereby cleaning the wafer.

[0123] Further, preferably, such as Figure 14 As shown, the purging device 60 includes a flow pipe 601 and a spray head 602, with the spray head 602 connected to the flow pipe 601. The flow pipe 601 includes a separated inner conveying channel and a cooling channel, with a cooling pipe fitting installed inside the cooling channel. Based on the structure described above, it can be seen that clean gas, such as clean air, is conveyed through the conveying pipe, and cooling water is conveyed through the cooling pipe fitting to cool the purging device 60. The spray head 602 is a hollow circular nozzle with multiple spray holes.

[0124] In summary, the working principle of this wafer pre-alignment system 100 is as follows:

[0125] The wafer is placed on the wafer pre-alignment device 10 and rotated. When it passes through the detection device, the position or pattern position of the wafer is detected. If the position or pattern position of the wafer is found to be deviated, the wafer pre-alignment device 10 adjusts the position of the wafer. For details of the adjustment process, please refer to Embodiment 1.

[0126] After the wafer is corrected for deviations by the wafer pre-alignment device 10, it needs to be transferred to a preset position by the transfer device 40 to facilitate the next process, such as testing other performance aspects of the wafer. After the next process is completed, it can be transferred again by the transfer device 40 to the buffer device 50 for buffering, awaiting the next process. Note: A robotic arm is required to complete the process between adjacent devices.

[0127] It is evident that by adding a wafer pre-alignment system 100, the geometric position coordinates of the wafer within the entire equipment can be corrected and determined to the micrometer level, ensuring production continuity and improving work efficiency.

[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wafer pre-alignment device, characterized by, The application relates to a wafer pre-alignment device. The device comprises a lifting mechanism, a moving mechanism, a rotating mechanism, a first adsorption mechanism and a second adsorption mechanism. The lifting mechanism is connected with the rotating mechanism through the first adsorption mechanism, and is used for driving the rotating mechanism and the first adsorption mechanism to lift along a first direction. The rotating mechanism is used for driving the first adsorption mechanism to rotate around the first direction. The second adsorption mechanism is arranged on the side of the first adsorption mechanism. The moving mechanism is connected with the second adsorption mechanism, and is used for driving the second adsorption mechanism to move along a second direction which is perpendicular to the first direction. The lifting mechanism comprises a first driving device, a first transmission mechanism, a first swing member and a first cam. The first cam is arranged on the first swing member, and abuts against the bottom of the rotating mechanism along the first direction. The first driving device drives the first swing member to rotate around the second direction through the first transmission mechanism, so that the first cam pushes the rotating mechanism and the first adsorption mechanism to lift along the first direction. The rotating mechanism comprises a second driving device and a rotating shaft. The second driving device comprises a stator and a rotor arranged inside the stator. The rotating shaft is connected with the rotor and the first adsorption mechanism respectively. The wafer pre-alignment device further comprises a general support base. The general support base is formed with a mounting groove and a guide groove arranged in sequence along a vertical direction from top to bottom. The second driving device is arranged in the mounting groove. The rotating mechanism further comprises a support body, a top cover, a shaft sleeve, a pressing sleeve, a first leaf spring, a second leaf spring, a buffer spring, a connecting shaft, a bearing seat and a bearing. The support body is connected with the general support base. The bearing seat is connected with the support body. The connecting shaft is assembled with the bearing seat and the rotor and the pressing sleeve integrally. The support body is formed with a mounting cavity penetrating through the top and the bottom thereof. The mounting cavity is communicated with the mounting groove of the general support base. The rotating shaft, the shaft sleeve and the pressing sleeve are arranged in the mounting cavity. The shaft sleeve is sleeved on the outside of the rotating shaft. One end of the shaft sleeve is formed with a first clamping groove. The first leaf spring is clamped in the first clamping groove. The other end of the shaft sleeve is formed with a second clamping groove. The second leaf spring is clamped in the second clamping groove. The pressing sleeve is sleeved on the outside of the shaft sleeve. The two ends of the pressing sleeve abut against and press the first leaf spring and the second leaf spring respectively. The second leaf spring is arranged in the guide groove and can move along the guide groove. The top cover is arranged on the top of the support body and is detachably connected with the support body. The top cover is formed with a guide cavity. The first leaf spring is movably arranged in the guide cavity. The connecting shaft is provided with a limiting cavity, the buffer spring is limited in the limiting cavity, and the buffer spring is sleeved outside the pressing sleeve; the mover is formed with an extension part, the extension part extends from the bottom to the limiting cavity, and the extension part is assembled with the pressing sleeve and the connecting shaft.

2. The wafer pre-alignment device of claim 1, wherein The moving mechanism comprises a third driving device and a lead screw transmission assembly, and the third driving device is connected with the second adsorption mechanism through the lead screw transmission assembly.

3. The wafer pre-alignment device of claim 1, wherein, The first adsorption mechanism comprises a first support member connected with the rotating mechanism, and the first support member is formed with a first air extraction hole; and / or The second adsorption mechanism comprises a second support member connected with the moving mechanism, and the second support member is formed with a second air extraction hole.

4. A wafer pre-alignment system, characterized by, The wafer pre-alignment system further comprises a transfer device arranged at the side of the wafer pre-alignment device and used for receiving the intermediate product after the position adjustment of the wafer pre-alignment device and conveying the intermediate product to the next station.

5. The wafer pre-alignment system of claim 4, wherein, The transfer device comprises a fourth driving device and a bearing member, and the fourth driving device is connected with the bearing member.

6. The wafer pre-alignment system of claim 5, wherein, The bearing member is formed with a plurality of bearing parts arranged at an angle with each other. The wafer pre-alignment system further comprises a buffer device used for receiving and storing the intermediate product conveyed from the previous station.

7. The wafer pre-alignment system of claim 4, wherein, The buffer device comprises a lifting assembly and an adsorption assembly connected with the lifting assembly, and the lifting assembly is used for driving the adsorption assembly to lift along a first direction.

8. The wafer pre-alignment system of claim 7, wherein, The lifting assembly comprises a fifth driving device, a second transmission mechanism, a second swing member, a second cam, and a support shaft; the second cam is arranged on the second swing member, and the second cam abuts against the bottom of the support shaft along the first direction; 9. The wafer pre-alignment system of claim 8, wherein, The fifth driving device drives the second swing member to rotate around the second direction through the second transmission mechanism, so that the second cam drives the support shaft to lift along the first direction; The adsorption assembly comprises a supporting member abutting against one end of the support shaft away from the second cam; the supporting member and the support shaft are both formed with a third air extraction channel in communication with each other. The wafer pre-alignment system further comprises a blowing device used for blowing the intermediate product arranged in the wafer pre-alignment system.

10. The wafer pre-alignment system of claim 4, wherein, The blowing device comprises a flow pipe and a spraying head in communication with the flow pipe; the flow pipe comprises an inner conveying channel and a cooling channel separated by a partition, and a cold pipe is arranged in the cooling channel.

11. The wafer pre-alignment system of claim 10, wherein, The number of the detection devices is two, one of which is used for detecting the geometric position of the intermediate product, and the other of which is used for detecting the surface pattern or the geometric position of the pattern of the intermediate product.

12. The wafer pre-alignment system of claim 4, wherein, ​

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