Wafer correction system and semiconductor process equipment

Abstract

The application provides a wafer correction system and a semiconductor process equipment, wherein the wafer correction system comprises: a wafer correction device, which comprises a bearing structure and a center correction mechanism, wherein the bearing structure is used for bearing a wafer, and the center correction mechanism is matched with the bearing structure to drive the bearing structure to move in a horizontal plane; a position detection device, which is used for detecting a first current position of the center of the wafer; and a controller, which is in communication connection with the position detection device and the center correction mechanism, has a first preset target position in the horizontal plane, and is used for controlling the center correction mechanism to act according to the first current position and the first preset target position, so as to drive the bearing structure to move to the center of the wafer coinciding with the first preset target position. The wafer correction system can at least correct the center position of the wafer, and can ensure that the center position of the wafer is uniquely determined after correction, so as to facilitate the positioning and grabbing of a subsequent mechanical hand and be beneficial to reducing the broken piece rate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically, to a wafer calibration system and semiconductor process equipment. Background Technology

[0002] In some semiconductor processes, robotic arms are used to pick up and transfer single wafers. This process often requires two robotic arms to work together. To facilitate the transfer between the two arms, a wafer storage device is used to temporarily store the wafer. Taking the process of a wafer entering semiconductor processing equipment (such as a single-wafer wafer cleaner) as an example, one robotic arm first transfers the wafer to be processed from the wafer loading device to the wafer storage device, and then the other robotic arm transfers the wafer from the storage device to the process chamber for the specific processing.

[0003] However, existing wafer storage devices can only adjust the level of the wafer and cannot correct other positions of the wafer. When a robot places the wafer on the wafer loading device, the center position of the wafer is not unique. This makes it easy for another robot to damage the wafer due to inaccurate positioning or to be unable to hold the wafer stably when picking it up, thereby increasing the breakage rate. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer correction system and semiconductor process equipment.

[0005] In a first aspect, the present invention provides a wafer calibration system, comprising: a wafer calibration device including a support structure and a center calibration mechanism, wherein the support structure is used to support the wafer, and the center calibration mechanism cooperates with the support structure to drive the support structure to move in a horizontal plane; a position detection device for detecting a first current position of the center of the wafer; and a controller communicatively connected to the position detection device and the center calibration mechanism, having a first preset target position in the horizontal plane, the controller controlling the operation of the center calibration mechanism according to the first current position and the first preset target position to drive the support structure to move until the center of the wafer coincides with the first preset target position.

[0006] Furthermore, the central correction mechanism includes: a first mounting plate located below the load-bearing structure; and multiple power support components arranged circumferentially along the first mounting plate. Each power support component includes a power source and a support structure. The power source is mounted on the first mounting plate, and the support structure is driven and connected to the power source. Among the multiple power support components, the multiple support structures jointly support the load-bearing structure, and the multiple power sources are all communicatively connected to a controller. The controller can control the multiple power sources to drive the multiple support structures to move simultaneously, thereby causing the load-bearing structure to move.

[0007] Furthermore, the load-bearing structure includes a load-bearing tray. In the multiple power support components, each support structure has a receiving groove that opens in the horizontal direction. A portion of the edge of the load-bearing tray is always located within the receiving groove, so that the multiple support structures jointly support the load-bearing structure through the bottom wall of their respective receiving grooves. The portion of the edge of the load-bearing tray located within the receiving groove is always in contact with the bottom of the receiving groove, so that when the multiple support structures move simultaneously, they can drive the load-bearing structure to move in either of two mutually perpendicular directions in the horizontal plane.

[0008] Furthermore, each power source is a first rotary motor, the output shaft of the first rotary motor extends in the vertical direction, and each power support assembly also includes a swing arm structure, the two ends of which are connected to the output shaft and the support structure respectively, so that the first rotary motor can drive the support structure to swing around the output shaft through the swing arm structure.

[0009] Furthermore, each support structure is a support wheel, which can rotate freely relative to the swing arm structure around a first rotation axis. The first rotation axis extends in the vertical direction, and the receiving groove is located on the outer wall of the support wheel and extends around the circumference of the support wheel.

[0010] Furthermore, the edge of the carrying tray includes three straight edge segments distributed sequentially along its circumference. The extensions of the three straight edge segments intersect each other to form a triangle. There are three power support components, and the three power support components are matched one-to-one with the three straight edge segments.

[0011] Furthermore, the wafer correction device also includes a notch correction mechanism, which cooperates with the center correction mechanism to drive the center correction mechanism and the supporting structure to rotate as a whole around a second rotation axis. The second rotation axis extends vertically, and the first preset target position is located on the extension line of the second rotation axis. The position detection device is also used to detect the second current position of the edge notch of the wafer after the center of the wafer coincides with the first preset target position. The controller is communicatively connected to the notch correction mechanism and has a second preset target position in the horizontal plane. The controller is also used to control the notch correction mechanism to operate according to the second current position and the second preset target position, so as to drive the center correction mechanism and the supporting structure to rotate as a whole until the edge notch of the wafer coincides with the second preset target position.

[0012] Furthermore, the load-bearing structure, the center correction mechanism, and the notch correction mechanism are arranged sequentially from top to bottom. The notch correction mechanism includes a second mounting plate and a rotating power structure mounted on the second mounting plate. The rotating power structure includes a second rotating motor and a reducer. The reducer is connected to the second rotating motor in a transmission manner. The rotation output part of the reducer rotates around the second rotation axis, and the rotation output part is connected to the center correction mechanism.

[0013] Furthermore, the wafer alignment device also includes a mounting base and a leveling assembly. The support structure, the center alignment mechanism, the notch alignment mechanism, and the mounting base are arranged sequentially from top to bottom. The mounting base is used to fix the wafer on the frame of the semiconductor process equipment. The leveling assembly is located between the notch alignment mechanism and the mounting base to adjust the levelness of the wafer supported by the support structure.

[0014] Furthermore, the position detection device includes an industrial camera located above the wafer calibration device, and a first preset target position located on the extension line of the centerline of the industrial camera. There is a preset height distance between the industrial camera and the support structure, and the preset height distance is configured to enable the wafer carried by the support structure to be within the full field of view of the industrial camera.

[0015] Secondly, the present invention also provides a semiconductor process apparatus, including a rack and a process chamber disposed on the rack, a wafer loading device, a first robot arm, a second robot arm, and the aforementioned wafer calibration system, wherein the wafer calibration system is used to perform at least center position calibration on a wafer to be processed or a processed wafer placed on a support structure; the first robot arm is used to transfer a wafer to be processed from the wafer loading device to the support structure for calibration, and to transfer a calibrated processed wafer from the support structure to the wafer loading device; the second robot arm is used to transfer a calibrated wafer to be processed from the support structure to the process chamber, and to transfer a processed wafer from the process chamber to the support structure for calibration.

[0016] The present invention has the following beneficial effects:

[0017] The wafer calibration system provided by this invention, through the cooperation of the center calibration mechanism, position detection device, and controller of the wafer calibration device, can at least calibrate the position of the center of the wafer placed on the support structure, thereby aligning the center of the wafer with a first preset target position. Therefore, after each wafer is placed on the support structure, calibration ensures that the center position of the wafer is uniquely determined, facilitating subsequent positioning and gripping by the robotic arm, reducing or avoiding the risk of damage to the wafer during gripping, and enabling the robotic arm to grip the wafer more stably during wafer transfer, thus helping to reduce the breakage rate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a wafer temporary storage device in the prior art.

[0019] Figure 2 for Figure 1 A schematic diagram of the wafer storage device after the wafer is placed;

[0020] Figure 3 for Figure 1A schematic diagram of the wafer storage device from another angle after the wafer is placed;

[0021] Figure 4 This is a schematic diagram of a wafer calibration system according to an embodiment of the present invention;

[0022] Figure 5 for Figure 4 A schematic diagram of the wafer correction system from another angle;

[0023] Figure 6 for Figure 4 A schematic diagram of the wafer alignment system after the wafer has been placed.

[0024] Figure 7 for Figure 4 A schematic diagram of the structure of the wafer correction device in the wafer correction system;

[0025] Figure 8 for Figure 7 An exploded view of the wafer correction device;

[0026] Figure 9 for Figure 7 A schematic diagram of the support structure of the wafer correction device;

[0027] Figure 10 for Figure 9 A schematic diagram of the exploded structure of the load-bearing structure;

[0028] Figure 11 for Figure 7 A schematic diagram of the central calibration mechanism of the wafer calibration device;

[0029] Figure 12 for Figure 11 A schematic diagram of the exploded structure of the central correction mechanism;

[0030] Figure 13 for Figure 11 A schematic diagram of the power support assembly of the central correction mechanism;

[0031] Figure 14 for Figure 13 A schematic diagram of the exploded structure of the power support component;

[0032] Figure 15 for Figure 13 A cross-sectional schematic diagram of the power support component;

[0033] Figure 16 for Figure 15 A partially enlarged schematic diagram of the power support component;

[0034] Figure 17 for Figure 7A schematic diagram of the notch correction mechanism in a wafer correction device;

[0035] Figure 18 for Figure 17 A schematic diagram of the exploded structure of the notch correction mechanism;

[0036] Figure 19 for Figure 7 A schematic diagram of the leveling component of a wafer calibration device;

[0037] Figure 20 for Figure 19 A cross-sectional schematic diagram of the leveling components;

[0038] Figure 21 This is a schematic diagram showing the positional relationship of a wafer loading device, a first robotic arm, a second robotic arm, and a wafer alignment system in a semiconductor process apparatus according to an embodiment of the present invention.

[0039] Figure 22 for Figure 21 A schematic diagram showing the positional relationship of the wafer loading device, the first robotic arm, the second robotic arm, and the wafer calibration system from another angle. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solutions of the present invention, the wafer calibration system and semiconductor process equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0041] like Figures 1 to 3 As shown, the existing wafer temporary storage device includes a base plate 1, a carrier tray 2, and multiple leveling components 3. The base plate 1 is used to fix it on the rack of the semiconductor process equipment. The multiple leveling components 3 are distributed circumferentially along the carrier tray 2, and the carrier tray 2 is mounted on the base plate 1 through the multiple leveling components 3. The carrier tray 2 is provided with multiple support blocks 2-1 distributed circumferentially, and the wafer 4 is placed on the multiple support blocks 2-1. Among them, the leveling components 3 include leveling screws and locking nuts. The levelness of the carrier tray 2 is adjusted by the leveling screws of the multiple leveling components 3, and after adjustment, it is locked by the corresponding locking nuts, thereby realizing the adjustment of the levelness of the wafer 4.

[0042] However, the existing wafer storage device described above can only adjust the level of wafer 4 and cannot correct other positions of wafer 4. Since the support block 2-1 does not have a structure that can accurately position wafer 4, when a robot places wafer 4 on multiple support blocks 2-1 each time, the center position of wafer 4 is not unique. This makes it easy for another robot to damage wafer 4 due to inaccurate positioning when grasping wafer 4, or to be unable to hold wafer 4 stably, thereby increasing the breakage rate.

[0043] To address the aforementioned problems, this invention provides a wafer calibration system. For example... Figures 4 to 6 as well as Figures 21 to 22 As shown, in some embodiments, the wafer calibration system includes a wafer calibration device 10, a position detection device 20, and a controller (not shown). The wafer calibration device 10 includes a support structure 11 and a center calibration mechanism 12. The support structure 11 supports the wafer 70; the center calibration mechanism 12 cooperates with the support structure 11 to drive the support structure 11 to move in a horizontal plane, thereby moving the wafer 70 it supports within that horizontal plane. After the wafer 70 is placed on the support structure 11, the position detection device 20 detects the first current position of the center of the wafer 70. The controller is communicatively connected to the position detection device 20 and the center calibration mechanism 12. A first preset target position is located within the horizontal plane for the support structure 11 to move. The controller controls the center calibration mechanism 12 to operate according to the first current position and the first preset target position, driving the support structure 11 to move within the horizontal plane, ultimately causing the support structure 11 to move until the center of the wafer 70 coincides with the first preset target position. It should be noted that since the wafer 70 is placed on the support structure 11, the wafer 70 and the support structure 11 can be considered to be located in the same plane, that is, both are located in the aforementioned horizontal plane.

[0044] In the aforementioned wafer calibration system, through the cooperation of the center calibration mechanism 12, the position detection device 20, and the controller of the wafer calibration device 10, the position of the center of the wafer 70 placed on the support structure 11 can be calibrated, thereby aligning the center of the wafer 70 with the first preset target position. Therefore, after each placement of the wafer 70 on the support structure 11, the calibration ensures that the center position of the wafer 70 is uniquely determined, facilitating subsequent positioning and gripping by the robotic arm, reducing or avoiding the risk of damage to the wafer 70 during gripping, and enabling the robotic arm to grip the wafer 70 more stably during wafer transfer, thus helping to reduce the breakage rate.

[0045] like Figures 6 to 10 As shown, in some embodiments, the support structure 11 includes a support tray 111 and a plurality of support blocks 112 disposed on the support tray 111, the plurality of support blocks 112 being arranged at circumferential intervals along the support tray 111. Each support block 112 has a tapered foot for directly supporting the wafer 70, and the wafer 70 is simultaneously placed on the tapered feet of the plurality of support blocks 112. The support of the plurality of support blocks 112 allows a certain gap to be formed between the wafer 70 and the support tray 111, thereby facilitating contact and engagement between the robotic arm and the edge of the wafer 70, and thus facilitating the robotic arm's gripping of the wafer 70.

[0046] Furthermore, there are three support blocks 112, which are non-uniformly distributed circumferentially on the carrier tray 111. For example, the line connecting the three support blocks 112 forms an isosceles triangle with a base shorter than its hypotenuse. This prevents interference between the robotic arm and the support blocks 112 when the robotic arm grasps the wafer 70. Additionally, the carrier tray 111 has positioning slots 1112, the same number as the support blocks 112, for precise installation and positioning of the support blocks 112. After the bottom of the support block 112 is placed in the corresponding positioning slot 1112, the support block 112 is then connected and fixed to the carrier tray 111 by the first screw.

[0047] Furthermore, in the specific embodiment shown in the figure, the central part of the support tray 111 is hollow, that is, the central part of the support tray 111 has a large circular through hole. This design can reduce the weight of the support tray 111 to a certain extent, thereby facilitating the driving of the support tray 111 by the centering mechanism 12. It should be noted that the support tray 111 is not limited to the above structure. In other embodiments not shown in the figure, the support tray 111 can also adopt other structures, as long as it can serve to support the wafer 70 and is easy to be driven to rotate by the centering mechanism 12.

[0048] like Figure 7 , Figure 8 as well as Figures 11 to 16 As shown, in some embodiments, the centering mechanism 12 includes a first mounting plate 121 and a plurality of power support components 122. The first mounting plate 121 is located below the supporting structure 11, and the plurality of power support components 122 are disposed on the first mounting plate 121 and distributed circumferentially along the first mounting plate 121. The plurality of power support components 122 together provide support and fixation for the supporting structure 11, and can also drive the supporting structure 11 to move in the horizontal plane. The power support components 122 achieve both functions, facilitating the simplification of the overall structure. Preferably, the plurality of power support components 122 are evenly distributed circumferentially along the first mounting plate 121; however, it is understood that in other embodiments, the plurality of power support components 122 may also be non-uniformly distributed.

[0049] Specifically, each power support assembly 122 includes a power source 1221 and a support structure 1222. The power source 1221 is mounted on the first mounting plate 121, and the support structure 1222 is driven by the power source 1221. In the multiple power support assemblies 122, multiple support structures 1222 collectively support the load-bearing structure 11. Each power source 1221 is communicatively connected to a controller, which can control the multiple power sources 1221 to drive the multiple support structures 1222 to move simultaneously, thereby causing the load-bearing structure 11 to move in the horizontal plane. It should be noted that during the movement of the multiple support structures 1222, each support structure 1222 must always be in an effective supporting state for the load-bearing structure 11. Therefore, when driving the load-bearing structure 11 to move, multiple support structures 1222 need to move simultaneously to ensure that each support structure 1222 can always effectively support the load-bearing structure 11, thus preventing the wafer 70 from falling or being damaged due to unstable support of the load-bearing structure 11.

[0050] It should be noted that the specific structure of the center correction mechanism 12 is not limited to this. In other embodiments not shown in the figure, the center correction mechanism 12 can also be other structures capable of driving the support structure 11 to move. For example, the center correction mechanism 12 includes a drive source directly connected to the support structure 11, which drives the support structure 11 to move in the horizontal plane. The support of the support structure 11 is achieved by rolling support parts such as rollers and slider guides provided on the bottom surface of the support structure 11.

[0051] Furthermore, the specific type of the power source 1221, the specific structure of the support structure 1222, and the way the support structure 1222 and the load-bearing structure 11 are not limited; they can be any structure capable of achieving the corresponding function. For example, such as... Figure 7 , Figure 8 as well as Figures 11 to 16 As shown, in some embodiments, in the plurality of power support assemblies 122, each support structure 1222 has a receiving groove 1223 with a horizontal opening. A portion of the edge of the support tray 111 is always located within the receiving groove 1223, so that the plurality of support structures 1222 jointly support the support structure 11 through the bottom groove wall of their respective receiving grooves 1223. That is, even when the plurality of support structures 1222 move simultaneously, a portion of the edge of the support tray 111 is always located within the receiving groove 1223 and supported by the bottom groove wall of the receiving groove 1223, while the top groove wall of the receiving groove 1223 prevents the support tray 111 from detaching upwards. It should be noted that the portion of the edge of the support tray 111 located within the receiving groove 1223 changes as each support structure 1222 moves.

[0052] Furthermore, the edge of the carrying tray 111 enters the receiving groove 1223 through the opening of the receiving groove 1223, and the bottom of the receiving groove 1223 is positioned opposite to the opening of the receiving groove 1223. During the simultaneous movement of multiple support structures 1222, the portion of the edge of the carrying tray 111 located within the receiving groove 1223 always abuts against the bottom of the receiving groove 1223. This allows multiple support structures 1222 to jointly hold the carrying tray 111 through the receiving groove 1223, meaning that multiple support structures 1222 always apply a force towards the center of the carrying tray 111, thereby further ensuring stable support for the carrying structure 11.

[0053] When multiple support structures 1222 move, at least one support structure 1222 can push the carrying tray 111 in a certain direction through the abutting engagement between the bottom of the receiving groove 1223 and the edge of the carrying tray 111. Simultaneously, the movement trajectories of the remaining support structures 1222 should follow the movement trajectory of the carrying tray 111, thereby ensuring that the bottom of the receiving groove 1223 of the remaining support structures 1222 always abuts against the edge of the carrying tray 111. Therefore, it is necessary to use a controller to reasonably calculate the movement mode of the multiple support structures 1222.

[0054] Furthermore, when calibrating the center position of wafer 70, wafer 70 must be able to translate in at least two degrees of freedom (front, back, left, and right) in the horizontal plane. This is necessary to better accommodate the different positions of wafer 70 when it is placed on the support structure 11. Therefore, the specific number of support structures 1222 and their distribution also need to be rationally designed to ensure that when multiple support structures 1222 move simultaneously, they can drive the support structure 11 to move in either of two mutually perpendicular directions (e.g., front-back and left-right) in the horizontal plane.

[0055] Preferably, such as Figure 7 and Figure 16As shown, the edge of the carrying tray 111 includes three straight edge segments 1111 distributed sequentially along its circumference. The extensions of the three straight edge segments 1111 intersect each other to form a triangle. There are three power support components 122, which correspond one-to-one with the three straight edge segments 1111. The support structure 1222 in each power support component 122 cooperates with the corresponding straight edge segment 1111. The line connecting the three support structures 1222 also forms a triangle, and the bottom of the receiving groove 1223 of each support structure 1222 always abuts against the straight edge segment 1111. During the movement of the carrying structure 11, the three support structures 1222 move simultaneously, which can be considered similar to a three-axis parallel structure. Through the three support structures 1222, the carrying structure 11 can be moved in either of two mutually perpendicular directions in the horizontal plane, that is, it can translate in the front, back, left, and right directions in the horizontal plane.

[0056] Of course, it is understandable that the specific number of support structures 1222 and the specific distribution of multiple support structures 1222 are not limited to this. For example, in other embodiments not shown in the figure, the carrying tray 111 may also be a parallelogram, with an acute or obtuse angle between two adjacent sides. There are two power support components 122, and the support structures 1222 of the two power support components 122 cooperate with the opposite two sides respectively. In this way, when the two support structures 1222 move at the same time, the carrying structure 11 can also be driven to translate in the horizontal plane in the front, back, left and right directions. Alternatively, the carrying tray 111 may also be rectangular, and there are four power support components 122, with the support structures 1222 of the four power support components 122 cooperating with the four sides respectively. In this way, when the four support structures 1222 move at the same time, the carrying structure 11 can also be driven to translate in the horizontal plane in the front, back, left and right directions.

[0057] Furthermore, such as Figure 8 as well as Figures 11 to 15 As shown, in some embodiments, each power source 1221 is a first rotary motor, and the output shaft of the first rotary motor extends vertically. Each power support assembly 122 also includes a swing arm structure 1224, the two ends of which are connected to the output shaft and the support structure 1222, respectively, so that the first rotary motor can drive the support structure 1222 to swing around the output shaft through the swing arm structure 1224. During the swinging process of the support structure 1222, the bottom of the receiving groove 1223 always abuts against the edge of the support tray 111. The rotation output by the first rotary motor can be converted into the swinging of the support structure 1222 through the swing arm structure 1224, and the swinging of at least one support structure 1222 can push the support tray 111 to move in a certain direction.

[0058] The controller is communicatively connected to each of the first rotary motors of the multiple power support components 122. After the wafer 70 is placed on the support structure 11, the position detection device 20 detects the position information (e.g., the coordinates of the first current position) of the center of the wafer 70 and sends it to the controller. The controller calculates the difference between the position information of the first current position and the position information of the first preset target position (e.g., the coordinates of the first preset target position), and then processes and calculates the difference to convert it into the deflection angle value of the multiple first rotary motors. The controller sends the deflection angle value to each of the corresponding first rotary motors to control each first rotary motor to rotate by the corresponding angle, thereby driving the support structure 1222 connected to it to swing in a predetermined manner.

[0059] It should be noted that the method by which the power source 1221 is connected to the support structure 1222 to drive the support structure 1222 to move is not limited to this. In other embodiments not shown in the figure, other methods that can drive the support structure 1222 to move can also be used. For example, the power source 1221 can be a linear motor, with the output shaft of the linear motor extending radially along the bearing structure 11, and the support structure 1222 fixed to the end of the output shaft. The linear motor drives the support structure 1222 to move radially along the bearing structure 11. In addition, the support structure 1222 is not limited to abutting against the edge of the bearing tray 111. In other embodiments not shown in the figure, the support structure 1222 can also be directly fixedly connected to the bottom surface of the bearing tray 111, and the power source 1221 drives the support structure 1222 to move in the horizontal plane, thereby driving the bearing tray 111 to move.

[0060] In particular, such as Figures 13 to 16 As shown, in some embodiments, each support structure 1222 is a support wheel, which can rotate freely relative to the swing arm structure 1224 about a first rotation axis. The first rotation axis extends vertically. A receiving groove 1223 is located on the outer wall of the support wheel and extends circumferentially around the support wheel. When the power source 1221 drives the support wheel to swing, since the edge of the carrying tray 111 is always in contact with the bottom of the receiving groove 1223 (i.e., the circle formed by the bottom of the receiving groove 1223 is always tangent to the edge of the carrying tray 111), and the support wheel can rotate freely relative to the swing arm structure 1224 about the first rotation axis, the support wheel and the edge of the carrying tray 111 are in a rolling fit, which reduces friction between them.

[0061] Of course, it is understandable that in other embodiments not shown in the figure, the support structure 1222 and the swing arm structure 1224 may also be fixedly connected, and there is no relative movement between them. In this case, the support structure 1222 and the edge of the bearing tray 111 are in sliding fit. Compared with the rolling fit between the support wheel and the edge of the bearing tray 111, the friction between the support structure 1222 and the bearing tray 111 will be greater, but the corresponding function can still be achieved.

[0062] exist Figures 11 to 16 In the specific embodiment shown, the first mounting plate 121 has a through hole 1211. The first rotary motor is fixedly connected to the bottom surface of the first mounting plate 121 by a third screw, and the output shaft of the first rotary motor extends upward through the through hole 1211. The swing arm structure 1224 is connected to the output shaft of the first rotary motor above the first mounting plate 121. One end of the swing arm structure 1224 has a blind hole opened from bottom to top and a lateral through hole opened from the side, the lateral through hole communicating with the blind hole. The output shaft of the first rotary motor extends into the blind hole, and a set screw is used to connect to the lateral through hole screw to finally press the output shaft, thereby fixing the output shaft to the swing arm structure 1224. The other end of the swing arm structure 1224 has an upwardly extending protruding shaft, and a bearing 1225 and a retaining ring 1226 are sequentially sleeved on the protruding shaft from top to bottom. The support roller has a central through hole with a downward-facing annular step on its wall. A protruding shaft, a bearing 1225, and a retaining ring 1226 are inserted into this central through hole from bottom to top. The upper and lower end faces of the bearing 1225 are respectively limited by the annular step and the retaining ring 1226. Finally, a fourth screw is inserted from top to bottom into the central through hole of the support roller and connected to the threaded hole of the protruding shaft. The nut of the fourth screw abuts against the top surface of the bearing 1225, thereby mounting the support roller onto the protruding shaft, allowing the support roller to rotate freely around the protruding shaft.

[0063] In existing wafer temporary storage devices, under normal circumstances, during the transfer of wafer 4 after the robotic arm grasps it, the orientation and posture of wafer 4 in space should remain constant. When a robotic arm places wafer 4 onto multiple support blocks 2-1 each time, the edge notch 4-1 of wafer 4 (e.g., Figure 3The position of the notch 4-1 on wafer 4 (as shown) is not unique, which means that the relative position of the edge notch 4-1 of wafer 4 is uncertain after another robotic arm grasps it. After wafer 4 enters the process chamber for specific processes, it is often necessary to perform process defect analysis at certain specific stations within the process chamber. The accuracy of wafer 4's positioning is crucial during process defect analysis, directly affecting the accuracy and efficiency of the analysis. Typically, wafer 4 relies on its edge notch 4-1 for positioning. Therefore, if the position of the edge notch 4-1 on wafer 4 is uncertain after entering the process chamber, it will lead to inaccurate positioning of wafer 4 during process defect analysis.

[0064] To solve the above problems, such as Figures 4 to 8 as well as Figure 17 and Figure 18 As shown, in some embodiments, the wafer correction device 10 further includes a notch correction mechanism 13, which can correct the position of the edge notch 71 of the wafer 70. Specifically, the notch correction mechanism 13 cooperates with the center correction mechanism 12 to drive the center correction mechanism 12 and the support structure 11 to rotate as a whole around a second rotation axis. The second rotation axis extends vertically, and the first preset target position is located on the extension line of the second rotation axis. That is, after the center of the wafer 70 has completed the position correction, no matter what angle the center correction mechanism 12 and the support structure 11 rotate around the second rotation axis, it will not affect the position of the center of the wafer 70, and the center of the wafer 70 and the first preset target position will always coincide. The position detection device 20 is also used to detect the second current position of the edge notch 71 of the wafer 70 after the center of the wafer 70 coincides with the first preset target position. The controller is communicatively connected to the notch correction mechanism 13. The plane where the support structure 11 is located (i.e., the horizontal plane in which the support structure 11 moves) also has a second preset target position. The controller is also used to control the notch correction mechanism 13 to operate according to the second current position and the second preset target position, so as to drive the center correction mechanism 12 and the bearing structure 11 to rotate as a whole in the above-mentioned horizontal plane, and finally make the edge notch 71 of the wafer 70 coincide with the second preset target position.

[0065] In the above-mentioned wafer calibration system, through the cooperation of the notch correction mechanism 13, the position detection device 20 and the controller of the wafer calibration device 10, the position of the edge notch 71 of the wafer 70 that has completed the center position correction can also be corrected, so that the edge notch 71 of the wafer 70 coincides with the second preset target position, thereby making the position of the edge notch 71 of the wafer 70 uniquely determined.

[0066] After the edge notch 71 of wafer 70 is positioned correctly, the robot arm transfers wafer 70 from the support structure 11 into the process chamber. During this process, it is crucial to ensure that the orientation of wafer 70 in space remains unchanged. If the robot arm does not rotate during its movement, the orientation of wafer 70 can be maintained by keeping the relative position of wafer 70 and the robot arm constant. Therefore, since the corrected position of the edge notch 71 of wafer 70 is uniquely determined, the specific orientation of the edge notch 71 on wafer 70 is also uniquely determined. When wafer 70 is used for process defect analysis at certain specific stations within the process chamber, it can be quickly and accurately positioned using the edge notch 71, which helps ensure the accuracy and efficiency of process defect analysis. Taking the analysis of process defects after the wafer 70 is cleaned in the process chamber as an example, after the wafer 70 is quickly and accurately positioned by the edge notch 71, the position of the particles that were not cleaned or newly generated during the cleaning process can be quickly determined in the process chamber relative to other components (such as the chuck used to fix the wafer 70 during the cleaning process). This is helpful in checking whether the particle generation is caused by certain components in the process chamber and helps in the analysis of process defect location.

[0067] like Figures 4 to 8 , Figure 11 , Figure 12 , Figure 17 as well as Figure 18 As shown, in some embodiments, the supporting structure 11, the center correction mechanism 12, and the notch correction mechanism 13 are arranged sequentially from top to bottom. The notch correction mechanism 13 includes a second mounting plate 131 and a rotating power structure disposed on the second mounting plate 131. The rotating power structure includes a second rotary motor 132 and a reducer 133. The reducer 133 is drivenly connected to the second rotary motor 132. The rotation output portion 1331 of the reducer 133 rotates around a second rotation axis, and this rotation output portion 1331 is connected to the center correction mechanism 12. The rotation axis of the rotation output portion 1331 of the reducer 133 coincides with the second rotation axis. The rotation output by the rotation output portion 1331 can drive the center correction mechanism 12 and the supporting structure 11 to rotate as a whole around the second rotation axis. Compared to directly connecting the output shaft of the second rotary motor 132 to the center correction mechanism 12, by setting a reducer 133 between the second rotary motor 132 and the center correction mechanism 12, the output shaft of the second rotary motor 132 can extend horizontally, and the second rotary motor 132 can be directly installed on the top surface of the second mounting plate 131, which is more convenient for assembly. In addition, the rotational power output by the cooperation of the second rotary motor 132 and the reducer 133 is more conducive to precise rotational control of the center correction mechanism 12.

[0068] In the specific embodiment shown in the figure, the first mounting plate 121 is fixedly connected to the rotation output portion 1331 of the reducer 133 by a second screw, the reducer 133 is fixedly connected to the second mounting plate 131 by a fifth screw, and the second rotary motor 132 is connected to the reducer 133 by a seventh screw (not shown in the figure). Preferably, the centers of the first mounting plate 121 and the support tray 111 are both located on the second rotation axis.

[0069] The controller is communicatively connected to the second rotary motor 132. After the center position of the wafer 70 is aligned with the first preset target position, the position detection device 20 detects the position information (e.g., the coordinates of the second current position) of the edge notch 71 of the wafer 70 and sends it to the controller. The controller calculates the difference between the second current position and the position information of the second preset target position (e.g., the coordinates of the second preset target position) and processes the difference to convert it into the deflection angle value of the second rotary motor 132. The controller sends the deflection angle value to the second rotary motor 132 to control the second rotary motor 132 to rotate by the corresponding angle, thereby driving the center alignment mechanism 12 to rotate by the required angle and ultimately making the edge notch 71 of the wafer 70 coincide with the second preset target position.

[0070] like Figure 7 , Figure 8 , Figure 17 as well as Figure 20 As shown, in some embodiments, the wafer calibration device 10 further includes a mounting base 14 and a leveling assembly 15. The support structure 11, the center calibration mechanism 12, the notch calibration mechanism 13, and the mounting base 14 are arranged sequentially from top to bottom. The mounting base 14 is used to fix the device on the frame 30 of the semiconductor process equipment (for example, the mounting base 14 is fixedly connected to the frame 30 by a plurality of sixth screws evenly distributed along the circumference). The leveling assembly 15 is disposed between the notch calibration mechanism 13 and the mounting base 14 to directly adjust the levelness of the notch calibration mechanism 13, thereby indirectly adjusting the levelness of the wafer 70 supported by the support structure 11.

[0071] The specific structure of the leveling component 15 is not limited; it can be any structure capable of performing the leveling function. For example, in Figures 18 to 20As shown, in some embodiments, there are multiple leveling components 15, which are evenly distributed along the circumference of the second mounting plate 131. The second mounting plate 131 has a first threaded hole 1311, and the mounting base 14 has a second threaded hole 141. The first threaded hole 1311 and the second threaded hole 141 correspond one-to-one, and their number is consistent with the number of leveling components 15. Each leveling component 15 includes a leveling screw 151, a locking nut 152, and a locking screw 153. The leveling screw 151 passes through the first threaded hole 1311 and is threadedly connected to the first threaded hole 1311. The locking nut 152 is sleeved on the portion of the leveling screw 151 that extends upward out of the first threaded hole 1311. The bottom end of the leveling screw 151 abuts against the top surface of the mounting base 14. By rotating the leveling screw 151, the distance between the second mounting plate 131 and the mounting base 14 can be adjusted. After adjustment, the locking nut 152 is screwed until it contacts the top surface of the second mounting plate 131. The friction between the two prevents the leveling screw 151 from locking and rotating. Finally, the locking screw 153 passes through the center hole of the leveling screw 151 from top to bottom and connects to the second threaded hole 141 of the mounting base 14, thereby fixing the leveling assembly 15 to the mounting base 14. The above operation is performed on multiple leveling assemblies 15 to ultimately achieve the leveling of the second mounting plate 131, and thus the leveling of the wafer 70.

[0072] like Figures 4 to 6 As shown, in some embodiments, the position detection device 20 includes an industrial camera located above the wafer calibration device 10, with the first preset target position located on the extension line of the centerline of the industrial camera. A preset height distance exists between the industrial camera and the support structure 11, configured to ensure that the wafer 70 supported by the support structure 11 is within the full field of view of the industrial camera. After the wafer 70 is placed on the support structure 11, the industrial camera takes a picture of the wafer 70 to obtain the position information (e.g., first current position coordinates) of the first current position of the center of the wafer 70. When the center position of the wafer 70 is corrected to coincide with the first preset target position, the industrial camera takes another picture of the wafer 70 to obtain the position information (e.g., second current position coordinates) of the second current position of the edge notch 71 of the wafer 70. It should be noted that the first and second preset target positions are usually determined manually; for example, the first and second preset target position coordinates can be manually input into the controller beforehand.

[0073] The present invention also provides a semiconductor process equipment. The specific type of semiconductor process equipment is not limited and can be any equipment that requires a robotic arm to perform single-wafer transfer operations on the wafer 70, such as a single-wafer cleaning machine.

[0074] like Figure 21 and Figure 22 As shown, in some embodiments, the semiconductor process equipment includes a rack 30 and a process chamber disposed on the rack 30, a wafer loading device 40, a first robot arm 50, a second robot arm 60, and the aforementioned wafer calibration system. The wafer calibration system is used to perform at least center position calibration on the wafer 70 to be processed or the processed wafer 70 placed on the support structure 11; the first robot arm 50 is used to transfer the wafer 70 to be processed from the wafer loading device 40 to the support structure 11 for calibration, and to transfer the calibrated processed wafer 70 from the support structure 11 to the wafer loading device 40; the second robot arm 60 is used to transfer the calibrated wafer 70 to be processed from the support structure 11 to the process chamber, and to transfer the processed wafer 70 in the process chamber to the support structure 11 for calibration.

[0075] Specifically, the wafer loading device 40, the first robot arm 50, the second robot arm 60, the wafer calibration device 10 of the wafer calibration system, and the position detection device 20 of the wafer calibration system can all be mounted on the rack 30 with screws. The process of the wafer to be processed 70 entering the process chamber from the wafer loading device 40 is as follows: the first robot arm 50 (front robot arm) transfers the wafer to be processed 70 on the wafer loading device 40 to the support structure 11 of the wafer calibration device 10. The wafer calibration device 10 and the position detection device 20 correct the center position and the edge notch 71 position of the wafer to be processed. After that, the second robot arm 60 (rear robot arm) transfers the corrected wafer to be processed 70 on the support structure 11 to the process chamber for specific processing. The process of retrieving the processed wafer 70 from the process chamber to the wafer loading device 40 is as follows: the second robot 60 (rear robot) transfers the processed wafer 70 from the process chamber to the support structure 11 of the wafer calibration device 10. The wafer calibration device 10 and the position detection device 20 at least correct the center position of the wafer 70 to be processed. After that, the first robot 50 (front robot) transfers the calibrated processed wafer 70 on the support structure 11 to the wafer loading device 40.

[0076] In the aforementioned semiconductor process equipment, the wafer calibration system can at least calibrate the position of the center of the wafer 70 (to be processed or already processed) placed on the support structure 11, thereby aligning the center of the wafer 70 with the first preset target position. Therefore, after each placement of the wafer 70 on the support structure 11, calibration ensures that the center position of the wafer 70 is uniquely determined, facilitating subsequent positioning and gripping by the robotic arm (first robotic arm 50 or second robotic arm 60), reducing or avoiding the risk of damage to the wafer 70 during gripping, and enabling the robotic arm to grip the wafer 70 more stably during wafer transfer, thus helping to reduce the breakage rate.

[0077] Furthermore, the wafer 70 to be processed can have its edge notch 71 position corrected by the wafer calibration system. During the process of the second robotic arm 60 transferring the wafer 70 into the process chamber, the orientation and posture of the wafer 70 in space should remain unchanged. Based on this, since the corrected position of the edge notch 71 of the wafer 70 is uniquely determined, the specific orientation of the edge notch 71 on the wafer 70 is also uniquely determined. When the wafer 70 is used for process defect analysis at certain specific stations within the process chamber, it can be quickly and accurately positioned using the edge notch 71, which helps ensure the accuracy and efficiency of the process defect analysis. Taking the process defect analysis of the wafer 70 after cleaning in the process chamber as an example, after quickly and accurately positioning the wafer 70 using the edge notch 71, the position of particles that were not cleaned or newly generated during the cleaning process can be quickly determined relative to other components (such as the chuck used to fix the wafer 70 during cleaning) within the process chamber. This helps to investigate whether the particle generation is caused by certain components in the process chamber, and aids in the process defect localization analysis.

[0078] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer calibration system, characterized in that, include: A wafer calibration apparatus includes a support structure and a central calibration mechanism, wherein the support structure is used to support the wafer, and the central calibration mechanism cooperates with the support structure to drive the support structure to move in a horizontal plane; A position detection device is used to detect the first current position of the center of the wafer; A controller, communicatively connected to the position detection device and the centering mechanism, has a first preset target position within the horizontal plane. The controller controls the centering mechanism to operate based on the first current position and the first preset target position, thereby driving the support structure to move within the horizontal plane until the center of the wafer coincides with the first preset target position. The central calibration mechanism includes: The first mounting plate is located below the supporting structure; Multiple power support assemblies are arranged circumferentially along the first mounting plate, and each power support assembly includes a support structure; The supporting structure includes a supporting tray. In the plurality of power support components, each support structure has a receiving groove that opens in the horizontal direction. A portion of the edge of the supporting tray is always located within the receiving groove, so that the plurality of support structures jointly support the supporting structure through the bottom wall of their respective receiving grooves. The portion of the edge of the supporting tray located within the receiving groove is always in contact with the bottom of the receiving groove, so that when the plurality of support structures move simultaneously, they can drive the supporting structure to move in either of two mutually perpendicular directions within the horizontal plane.

2. The wafer calibration system according to claim 1, characterized in that, Each of the power support components further includes a power source, wherein the power source is disposed on the first mounting plate, and the support structure is drivenly connected to the power source. In the plurality of power support components, the plurality of support structures jointly support the load-bearing structure, and the plurality of power sources are all communicatively connected to the controller. The controller is able to control the plurality of power sources to drive the plurality of support structures to move simultaneously, thereby driving the load-bearing structure to move.

3. The wafer calibration system according to claim 2, characterized in that, Each of the power sources is a first rotary motor, the output shaft of the first rotary motor extends in a vertical direction, and each of the power support components further includes a swing arm structure, the two ends of the swing arm structure being connected to the output shaft and the support structure respectively, so that the first rotary motor can drive the support structure to swing around the output shaft through the swing arm structure.

4. The wafer calibration system according to claim 3, characterized in that, Each of the support structures is a support wheel, which is able to rotate freely relative to the swing arm structure about a first rotation axis, which extends in the vertical direction. The receiving groove is located on the outer wall of the support wheel and extends around the circumference of the support wheel.

5. The wafer calibration system according to any one of claims 1 to 4, characterized in that, The edge of the support tray includes three straight edge segments distributed sequentially along its circumference. The extensions of the three straight edge segments intersect each other to form a triangle. There are three power support components, and the three power support components are matched one-to-one with the three straight edge segments.

6. The wafer calibration system according to claim 1, characterized in that, The wafer correction device further includes a notch correction mechanism, which cooperates with the center correction mechanism to drive the center correction mechanism and the supporting structure to rotate as a whole around a second rotation axis, wherein the second rotation axis extends in the vertical direction and the first preset target position is located on the extension line of the second rotation axis; The position detection device is also used to detect the second current position of the edge notch of the wafer after the center of the wafer coincides with the first preset target position; The controller is communicatively connected to the notch correction mechanism. The horizontal plane has a second preset target position. The controller is also used to control the notch correction mechanism to operate according to the second current position and the second preset target position, so as to drive the central correction mechanism and the supporting structure to rotate as a whole until the edge notch of the wafer coincides with the second preset target position.

7. The wafer calibration system according to claim 6, characterized in that, The bearing structure, the center correction mechanism, and the notch correction mechanism are arranged sequentially from top to bottom. The notch correction mechanism includes a second mounting plate and a rotating power structure disposed on the second mounting plate. The rotating power structure includes a second rotating motor and a reducer. The reducer is drivenly connected to the second rotating motor. The rotation output part of the reducer rotates around the second rotation axis and is connected to the center correction mechanism.

8. The wafer calibration system according to claim 6, characterized in that, The wafer alignment device further includes a mounting base and a leveling assembly. The support structure, the center alignment mechanism, the notch alignment mechanism, and the mounting base are arranged sequentially from top to bottom. The mounting base is used to be fixedly mounted on the frame of the semiconductor process equipment. The leveling assembly is disposed between the notch alignment mechanism and the mounting base to adjust the levelness of the wafer supported by the support structure.

9. The wafer calibration system according to claim 1, characterized in that, The position detection device includes an industrial camera located above the wafer calibration device, and the first preset target position is located on the extension line of the center line of the industrial camera. The industrial camera and the support structure have a preset height distance, which is configured to allow the wafer carried by the support structure to be within the full field of view of the industrial camera.

10. A semiconductor process apparatus, characterized in that, The system includes a rack and a process chamber mounted on the rack, a wafer loading device, a first robotic arm, a second robotic arm, and a wafer calibration system as described in any one of claims 1 to 9, wherein... The wafer alignment system is used to align at least the center position of the wafer to be processed or the processed wafer placed on the support structure. The first robotic arm is used to transfer the wafer to be processed on the wafer loading device to the support structure for correction, and to transfer the corrected processed wafer on the support structure to the wafer loading device; The second robotic arm is used to transfer the calibrated wafer to be processed on the support structure to the process chamber, and to transfer the processed wafer in the process chamber to the support structure for calibration.

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