Chip automatic arrangement device

Abstract

The present invention belongs to the field of semiconductor processing technology, and specifically relates to an automatic chip arrangement device, including a machine base; a film module, which is arranged on the machine base and is used to place the chip to be transferred; an image module, which is arranged on the machine base and includes a camera, which is used to scan and identify the chip to be transferred on the film module; a needle module, which includes a pin, and the chip to be transferred on the film module is moved to the top of the pin module and after being scanned and identified by the image module, the chip is transferred to the crystal module by hitting the chip through the pin; the crystal module is arranged on the machine base, receives the chip from the film module, arranges it, and then transfers it to the next process. Compared with the prior art, the arrangement device of the present invention facilitates the rapid and accurate transfer of the chip to the chip carrier glass, and can prevent the chip from turning over, tilting or missing in the process; at the same time, the automatic arrangement device is small in size, and multiple sets of arrangement devices can be installed on the same machine base, which can not only improve the processing efficiency, but also save installation space.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a device which can quickly arrange a plurality of chips according to a certain rule and fix them on a chip carrier. Background Art

[0002] The existing technology for mass transfer of chips is to bump the chip from the raw material carrier film to the highest point, and then the chip is sucked by the suction nozzle and sent to the pre-arranged carrier plate. Various methods for transferring chips to the substrate have appeared in this field, and the more common one is the suction nozzle swing arm structure. The stability during the transfer process determines the actual operational feasibility of the production capacity. The stability of the transfer refers to the probability of accurate placement, skewness, flipping, and missing of the chip under high-speed operation. Whether these occur or not will directly affect the success or failure of the transfer. Therefore, the operating speed is limited under the supervision of the yield rate and cannot be changed through slight adjustments. The existing technology cannot maintain stability and improve the yield rate during high-speed chip transfer. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, the present invention aims to provide a chip automatic arrangement device, which aims to solve the problem that the prior art is difficult to achieve both stability and improve yield during high-speed chip transfer.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an automatic chip arrangement device, comprising a machine base;

[0005] A membrane module, which is arranged on a machine base and is used to place the chip to be transferred;

[0006] An imaging module, which is disposed on the base and includes a camera for scanning and identifying the chip to be transferred on the film module;

[0007] The pin module includes a ejector pin. The chip to be transferred from the film module is moved above the pin module and after being scanned and identified by the image module, the ejector pin hits the chip to transfer it to the crystal module.

[0008] The crystal module group is arranged on the machine base, receives the chips from the membrane module group, arranges them and transfers them to the next process; here, a chip carrier glass is provided on the crystal module group, and a sticky transfer film is provided on the chip carrier glass. The chip hit by the ejector pin is adhered to the chip carrier glass through the transfer film.

[0009] Preferably, the needle module is located inside the membrane module; the crystal module includes a negative pressure suction component located above the membrane module.

[0010] Preferably, the imaging module comprises a bracket, an XY-moving member arranged on the bracket, a Z-moving component arranged on the XY-moving member, and a camera component arranged on the Z-moving component.

[0011] Preferably, the bracket includes a vertical frame, an oblique bracket whose upper end is fixedly connected to the upper end of the vertical frame, a horizontal plate fixedly connected to the oblique bracket and the upper end of the vertical frame, and two reinforcing plates respectively arranged at the lower ends of the oblique bracket and the vertical frame.

[0012] Preferably, the XY-moving member is an XY-axis manual slide, which is fixedly mounted on the upper surface of the transverse plate.

[0013] Preferably, the Z-axis moving component includes a mounting plate fixedly mounted on the XY-axis moving part, a Z-axis slide movably mounted on the mounting plate, a Z-axis screw rod movably connected to the Z-axis slide at the upper end, a Z-axis motor and a Z-axis bearing seat arranged on the mounting plate, and a Z-axis coupling connected to the output shaft of the Z-axis motor; the lower end of the Z-axis screw rod passes through the Z-axis bearing seat and is connected to the Z-axis coupling; the Z-axis slide is connected to the mounting plate via a Z-axis cross ball guide rail connected to the back of the Z-axis slide.

[0014] Preferably, the camera assembly includes a camera base fixedly connected to the Z-axis slide, a light source bracket connected to the camera base, a lens and a light source arranged on the light source bracket, and a camera arranged on the camera base and connected to the upper end of the lens; the light source is located below the lens.

[0015] Preferably, the membrane module comprises a frame, a Y-axis moving component arranged on the frame, an X-axis moving component arranged on the Y-axis moving component, and an R-axis rotating component arranged on the X-axis moving component.

[0016] Preferably, the rack includes a rack bottom plate and two rack vertical plates which are parallel to each other and are arranged on the rack bottom plate.

[0017] Preferably, the Y-axis moving component includes a Y-axis base plate provided on the upper surfaces of two frame vertical plates and fixedly connected to the two, two Y-axis slide rails provided on the Y-axis base plate and parallel to each other, a Y-axis slider provided on each Y-axis slide rail, a Y-axis linear motor stator provided on one side surface of the frame, a Y-axis linear motor mover movably connected to the Y-axis linear motor stator, and an XY-axis plate connected to the Y-axis slider and the Y-axis linear motor mover; the XY-axis plate moves linearly in the Y-axis on the Y-axis slide rail driven by the Y-axis linear motor mover.

[0018] Preferably, the X-axis moving component includes two groups of X-axis sliders arranged on the upper surface of the XY-axis plate, two X-axis slide rails that are parallel to each other and respectively movably connected to the two groups of X-axis sliders, a rotating component fixed plate connected to the two X-axis slide rails and located above the two X-axis slide rails, an X-axis linear motor fixed frame arranged on one side surface of the XY-axis plate, an X-axis linear motor stator arranged on the upper surface of the X-axis linear motor fixed frame, and an X-axis linear motor mover movably connected to the X-axis linear motor stator; the X-axis linear motor mover is connected to one side surface of the rotating component fixed plate.

[0019] Preferably, the R-direction rotating component includes a rotating group base arranged on the upper surface of the rotating group fixing plate, a bearing movably arranged on the rotating group base, a bearing inner ring arranged in the bearing and fixedly connected to the rotating group base, a rotating group pulley sleeved on the bearing and linked with the rotating group pulley, a rotating group ring seat arranged above the rotating group pulley and fixedly connected with the rotating group pulley, and a linear component arranged on the outer side of the rotating group pulley and used to drive it to rotate relative to the rotating group base; a blue film chip disk for placing chips is placed on the upper surface of the rotating group ring seat.

[0020] Preferably, the linear component includes a linear module arranged on a fixed plate of a rotating component, a stepper motor arranged at one end of the linear module, a linear slider movably arranged in the linear module, an axis arranged on the linear slider, and a rotating shaft rotatably connected to the axis; the rotating shaft is connected to a transverse rod arranged on the circumferential surface of a rotating component pulley.

[0021] Preferably, the rotating shaft is formed by a transverse connecting plate connected to the transverse rod and a cylinder perpendicular to a surface of the transverse connecting plate; the axis is formed by a first transverse plate fixedly connected to the linear slider and a second transverse plate rotatably connected to the cylinder, a circular socket is provided in the second transverse plate, and the cylinder is inserted in the circular socket.

[0022] Preferably, the Y-axis linear motor stator is fixed to one side surface of the frame through a Y-axis fixed plate; a grating scale located on the inner side of the Y-axis linear motor stator is provided on the Y-axis fixed plate, and an optical reader A located on the inner side of the Y-axis linear motor stator is provided on the side of the XY-axis plate; a grating scale located on the inner side of the X-axis linear motor stator is provided on the upper surface of the XY-axis plate; and an optical reader B located on the inner side of the X-axis linear motor stator is provided on one side of the rotating component fixed plate.

[0023] Preferably, a protruding arc segment is provided on the circumferential surface of the rotating assembly pulley, and an optical scale is provided on the side of the arc segment; an optical reader C located outside the optical scale is provided on the fixed plate of the rotating assembly.

[0024] Preferably, the needle module includes an adjustable base, a motor fixing frame arranged thereon, a voice coil motor arranged in the motor fixing frame, a needle clamping column axially connected to the voice coil motor, an ejector pin arranged at the upper end of the needle clamping column, a ball bushing guide assembly axially sleeved outside the needle clamping column, a needle slide seat installed above the motor fixing frame and axially sleeved outside the ball bushing guide assembly, a needle clamping cap axially sleeved outside the ejector pin and fixedly connected to the upper end of the needle clamping column, and a vacuum cover sleeved outside the needle clamping cap; a vacuum seat located above the needle slide seat and sleeved outside the needle slide seat; the vacuum cover is arranged outside the opening of the upper end of the vacuum seat, and the lower end of the needle clamping cap is arranged inside the opening of the upper end of the vacuum seat; the needle clamping cap and the vacuum cover are both provided with an axial hole for the upper end of the ejector pin to extend upward along the axial directions of the two.

[0025] Preferably, a sealing ring is provided inside the upper surface of the bottom disc of the needle slide seat, and the sealing ring is in contact with the bottom surface of the vacuum seat.

[0026] Preferably, the adjustable base comprises a needle adjusting platform seat, and a needle adjusting platform disposed thereon and having an adjustable mounting height; the motor is fixedly mounted on the upper surface of the needle adjusting platform.

[0027] Preferably, the crystal mold assembly includes a body support, a negative pressure suction component movably arranged on the body support, an X-axis transmission component, and a Z-axis lifting component arranged below the X-axis transmission component and connected thereto.

[0028] Preferably, the fuselage bracket is a square frame formed by an upper square frame, two side vertical plates and a fuselage bottom plate; the negative pressure suction component includes two longitudinal guide rails respectively arranged on the inner surfaces of the two side vertical plates, longitudinal sliders respectively arranged on the two longitudinal guide rails, two movable plates respectively connected to the longitudinal sliders on the two longitudinal guide rails, glass carrier plates fixedly connected to the two movable plates on both sides, a glass suction plate embedded in the glass carrier plate for placing chip carrier glass, a first linear motor stator arranged on the outer surface of one of the side vertical plates, and a first linear motor mover movably arranged on the first linear motor stator; the first linear motor mover is fixedly connected to one of the movable plates.

[0029] Preferably, the X-axis transmission assembly includes a lifting base, two groups of X-axis transmission sliders arranged on its upper surface, two X-axis transmission guide rails parallel to each other and respectively movably connected to the two groups of X-axis transmission sliders, a second linear motor stator arranged on one side of the lifting base, and a second linear motor mover movably arranged on the second linear motor stator; the fuselage bottom plate is connected to the two X-axis transmission guide rails and the second linear motor mover.

[0030] Preferably, the Z-axis lifting component includes: a mounting base fixedly arranged on the machine base, a Z-axis bottom plate arranged on the upper surface of the mounting base, two groups of horizontal cross roller slides in horizontal directions arranged on the upper surface of the Z-axis bottom plate, a horizontal slide provided with a supporting inclined surface arranged on the two groups of horizontal cross roller slides, a Z-axis slide movably arranged on the horizontal slide and provided with a Z-axis inclined surface that fits with the supporting inclined surface; a horizontal power component arranged on the Z-axis bottom plate and connected to the horizontal slide for driving the horizontal slide to reciprocate linearly on the Z-axis bottom plate; a Z-axis auxiliary slide arranged on the upper surface of one end of the Z-axis bottom plate; one end of the Z-axis slide is movably connected to a Z-guide rail in one side surface of the Z-axis auxiliary slide through two groups of Z-axis cross roller slides; when the horizontal slide reciprocates linearly on the Z-axis bottom plate, the Z-axis slide rises and falls relative to the Z-axis auxiliary slide.

[0031] Preferably, the horizontal power assembly includes a horizontal motor installed on the outer surface of the Z-axis auxiliary slide, a horizontal coupling arranged in the Z-axis auxiliary slide and connected to the output shaft of the horizontal motor, a horizontal bearing seat installed on the Z-axis auxiliary slide, and a horizontal lead screw at one end of which passes through the horizontal bearing seat and is connected to the horizontal coupling; the other end of the horizontal lead screw is movably connected to the horizontal slide.

[0032] Preferably, a group of oblique cross roller slides are respectively provided on both sides of the supporting inclined surface, and the Z-direction inclined surface is connected to the oblique cross roller slides.

[0033] Preferably, an X-axis reader is provided on the bottom plate of the fuselage, and a grating ruler is provided on one side surface of the lifting base; a Y-axis reader is provided on the movable plate connected to the mover of the first linear motor, and a grating ruler is provided on the side vertical plate where the stator of the first linear motor is set.

[0034] Beneficial technical effect: The automatic arrangement device of the present invention is adopted, and several sets of chip automatic arrangement devices are arranged on the machine base, and several chips to be transferred are placed on the blue film chip disk of the film module, and the needle module is located below the blue film chip disk. After the camera on the imaging module scans and identifies the chip on the blue film chip disk, the voice coil motor of the needle module is started, driving the ejector pin to hit the chip placed on the blue film chip disk upward, and the chip is quickly transferred to the transfer film on the chip carrier glass provided on the crystal module and the chips are arranged according to a certain pattern. At this time, the chip carrier glass is located above the blue film chip disk; compared with the prior art, the arrangement device of the present invention facilitates the rapid and accurate transfer of chips to the chip carrier glass, and can prevent the chips from turning over, skewing or missing in the process; at the same time, the automatic arrangement device is small in size, and multiple sets of arrangement devices can be installed on the same machine base, which can not only improve the processing efficiency but also save installation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A three-dimensional diagram of an embodiment of the present invention;

[0036] Figure 2 It is a stereoscopic diagram from another perspective of an embodiment of the present invention;

[0037] Figure 3 An exploded view of an embodiment of the present invention;

[0038] Figure 4 A stereogram of an image module according to an embodiment of the present invention;

[0039] Figure 5 A stereoscopic diagram of the image module of an embodiment of the present invention from another viewing angle;

[0040] Figure 6 A stereoscopic diagram of the image module of an embodiment of the present invention from another viewing angle;

[0041] Figure 7 An exploded view of an image module according to an embodiment of the present invention;

[0042] Figure 8 A three-dimensional diagram of a membrane module according to an embodiment of the present invention;

[0043] Fig. 9 A three-dimensional view of a membrane module according to an embodiment of the present invention from another perspective;

[0044] Fig.10 An exploded view of a membrane module according to an embodiment of the present invention;

[0045] Fig.10a A partial structural cross-sectional view of a membrane module according to an embodiment of the present invention;

[0046] Fig.10b for Fig.10 A partial enlarged view of

[0047] Fig.11 A three-dimensional diagram of a needle module according to an embodiment of the present invention;

[0048] Fig.12 A three-dimensional view of the needle module of an embodiment of the present invention from another perspective;

[0049] Fig.13 An exploded view of a needle module according to an embodiment of the present invention;

[0050] Fig.13a A partial structural cross-sectional view of a needle module according to an embodiment of the present invention;

[0051] Fig.14 A three-dimensional diagram of a crystal module according to an embodiment of the present invention;

[0052] Fig.15 A three-dimensional view of a crystal mold assembly according to an embodiment of the present invention from another perspective;

[0053] Fig.16 A three-dimensional view of a crystal mold assembly according to an embodiment of the present invention from another perspective;

[0054] Fig.17 2 is an exploded view of a crystal module assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0055] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation modes.

[0056] like Figure 1-3As shown, an embodiment of the present invention provides an automatic chip arrangement device, including a machine base 100, which is provided with a mounting panel 101 made of marble; a membrane module 200, which is arranged on the mounting panel 101 of the machine base 100 and is used to place the chip to be transferred; an imaging module 300, which is arranged on the mounting panel 101 of the machine base 100 and includes a camera for scanning and identifying the chip to be transferred on the membrane module, and the camera is located above the membrane module 200; a needle module 400, including a ejector pin, the chip to be transferred on the membrane module is moved to the top of the needle module and after being scanned and identified by the imaging module 300, the ejector pin hits the chip to transfer the chip to the crystal module; the crystal module 500, which is arranged on the machine base 100, receives the chip from the membrane module, arranges it, and then transfers it to the next process.

[0057] Specifically, the needle module 400 is located in the film module 200, and the ejector pin is located below the blue film chip disk provided in the film module; the crystal module 500 includes a negative pressure suction component located above the film module.

[0058] like Figure 4-7 As shown, in this embodiment, the imaging module 300 includes a bracket 301, an XY moving member 302 disposed on the bracket, a Z moving component disposed on the XY moving component, and a camera component disposed on the Z moving component.

[0059] Here, the bracket 301 includes a vertical frame 301a, an oblique bracket 301b fixedly connected to the upper end of the vertical frame, a horizontal plate 301c fixedly connected to the oblique bracket and the upper end of the vertical frame, and two reinforcing plates 301d respectively arranged at the lower ends of the oblique bracket and the vertical frame. Figure 5 shown.

[0060] The XY moving part 302 is an XY manual slide, which is fixedly mounted on the upper surface of the horizontal plate 301c; the XY moving part 302 is a commercially available standard part, such as the XY manual slide produced by MISUMI. Through this component, the structure installed on the component can be moved a certain distance in the XY direction to achieve adjustment in the XY direction.

[0061] The Z-axis moving component includes a mounting plate 303 fixedly mounted on the XY-axis moving part 302, a Z-axis slide 304 movably mounted on the mounting plate, a Z-axis screw rod 305 movably connected to the Z-axis slide 304 at the upper end, a Z-axis motor 306 and a Z-axis bearing seat 307 mounted on the mounting plate 303, and a Z-axis coupling 308 connected to the output shaft of the Z-axis motor 306; the lower end of the Z-axis screw rod 305 passes through the Z-axis bearing seat 307 and is connected to the Z-axis coupling 308; the Z-axis slide 304 is connected to the mounting plate 303 via a Z-axis cross ball guide rail 309 connected to the back of the Z-axis slide.

[0062] The camera assembly includes a camera base 310 fixedly connected to the Z-axis slide 304, a light source bracket 311 connected to the camera base, a lens 312 and a light source 313 arranged on the light source bracket 311, and a camera 314 arranged on the camera base 310 and connected to the upper end of the lens; the light source 313 is located below the lens 312.

[0063] Here, the Z-axis slide 304 is fixedly connected to the camera base 310 via a fixed bracket 316 ; the XY-axis moving member 302 is fixedly connected to the mounting plate 303 via an L-shaped mounting plate 317 .

[0064] In this module, the Z-axis motor 306 controls the rotation of the Z-axis screw 305 to move the camera 314 in the Z-axis direction, thereby achieving adjustable focal length of the camera 314; to ensure that the x and y coordinates of the focus of the camera 314 coincide with the x and y coordinates of the center point of the ejector pin on the needle module, a commercially available XY moving part 302 is used to achieve manual fine-tuning of the camera 314 in the xy direction; the functions of this module are chip identification, search, and positioning.

[0065] like Figure 8-10 and Fig.10a As shown, the membrane module 200 includes a frame 201, a Y-direction moving component arranged on the frame 201, an X-direction moving component arranged on the Y-direction moving component, and an R-direction rotating component arranged on the X-direction moving component.

[0066] Specifically, the rack 201 includes a rack bottom plate 201a and two rack vertical plates 201b arranged on the rack bottom plate and parallel to each other.

[0067] Specifically, the Y-axis moving component includes a Y-axis bottom plate 202 arranged on the upper surfaces of two frame uprights 201b and fixedly connected to the two, two Y-axis slide rails 203 arranged on the Y-axis bottom plate and parallel to each other, a Y-axis slider 204 arranged on each Y-axis slide rail 203, a Y-axis linear motor stator 205 arranged on one side of the frame 201, a Y-axis linear motor mover 206 movably connected to the Y-axis linear motor stator, and an XY-axis plate 207 connected to the Y-axis slider 204 and the Y-axis linear motor mover 206; the XY-axis plate 207 moves linearly along the Y-axis on the Y-axis slide rail 203 driven by the Y-axis linear motor mover 206; here, there are two Y-axis sliders 204 arranged on each Y-axis slide rail 203.

[0068] The X-axis moving component includes two groups of X-axis sliders 208 arranged on the upper surface of the XY axis plate 207, two X-axis slide rails 209 parallel to each other and movably connected to the two groups of X-axis sliders 208, a rotating component fixed plate 210 connected to the two X-axis slide rails and located above the two, an X-axis linear motor fixed frame 211 arranged on one side of the XY axis plate 207, an X-axis linear motor stator 212 arranged on the upper surface of the X-axis linear motor fixed frame 211, and an X-axis linear motor mover 213 movably connected to the X-axis linear motor stator; the X-axis linear motor mover 213 is connected to one side of the rotating component fixed plate 210, that is, the X-axis linear motor mover 213 can drive the rotating component fixed plate 210 to move linearly in the X direction; here, each group of X-axis sliders 208 includes two X-axis sliders.

[0069] The R-axis rotating component includes a rotating group base 214 arranged on the upper surface of the rotating group fixing plate 210, a bearing 215 movably arranged on the rotating group base 214, a bearing inner ring 216 arranged in the bearing and fixedly connected to the rotating group base, a rotating group pulley 217 sleeved on the bearing 215 and linked thereto, a rotating group ring seat 218 arranged above the rotating group pulley 217 and fixedly connected thereto, and a linear component arranged on the outer side of the rotating group pulley and used to drive it to rotate relative to the rotating group base; a blue film chip disk 219 for placing chips is placed on the upper surface of the rotating group ring seat 218.

[0070] The linear assembly includes a linear module 220 disposed on a rotating assembly fixed plate 210, a stepper motor 221 disposed at one end of the linear module and connected thereto, a linear slider 222 movably disposed in the linear module 220, an axis 223 disposed on the linear slider, and a rotating shaft 224 rotatably connected to the axis; the rotating shaft is connected to a transverse rod 225 disposed on the circumferential surface of the rotating assembly pulley. Here, the linear module 220 is a commercially available standard part, the stepper motor 221 is used to drive the linear module 220; the transverse rod 225 and the rotating assembly pulley 217 are integrally formed.

[0071] Specifically, the rotating shaft 224 is formed by a horizontal connecting plate 224a connected to the horizontal rod 225 and a cylinder 224b perpendicular to a surface of the horizontal connecting plate; the axis 223 is formed by a first horizontal plate 223a fixedly connected to the linear slider 222 and a second horizontal plate 223b rotatably connected to the cylinder 224b, and a circular plug hole 223c is provided in the second horizontal plate 223b, and the cylinder 224b is inserted into the circular plug hole. Fig.10b shown.

[0072] With this structure, after the stepper motor 221 is started, it drives the built-in screw in the linear module 220 to rotate, and the linear slider 222 mounted on the built-in screw moves linearly along the built-in screw, thereby driving the axis 223 to move linearly. The end of the rotating shaft 224 connected to the axis 223 and the transverse rod 225 respectively moves linearly along the axis 223, and rotates relative to the axis 223, and pushes the transverse rod 225 to rotate, thereby driving the rotating assembly pulley 217 to rotate left and right a certain angle relative to the rotating assembly fixed plate 210, and the left and right rotation angle is less than 90 degrees.

[0073] Specifically, the Y-axis linear motor stator 205 is fixed on one side surface of the frame 201 through a Y-axis fixed plate 226; a grating scale 227 located on the inner side of the Y-axis linear motor stator 205 is provided on the Y-axis fixed plate 226, and an optical reader A 228 located on the inner side of the Y-axis linear motor stator 205 is provided on the side of the XY axis plate 207; a grating scale 227 located on the inner side of the X-axis linear motor stator is provided on the upper surface of the XY axis plate; and an optical reader B 229 located on the inner side of the X-axis linear motor stator 212 is provided on one side of the rotating component fixed plate 210.

[0074] Furthermore, a protruding arc segment 217a is provided on the circumferential surface of the rotating assembly pulley 217 and is integrally formed with the rotating assembly pulley 217, and an optical scale 230 is provided on the side of the arc segment; an optical reader C 231 located outside the optical scale is provided on the rotating component fixing plate 210.

[0075] Here, the rotating assembly base 214, the rotating assembly pulley 217, and the rotating assembly ring seat 218 are all circular in shape, and the three are coaxial with the bearing 215 and the bearing inner ring 216. A circular through hole coaxial with the bearing 215 and the bearing inner ring 216 is provided in the rotating assembly fixed plate 210; square through holes are provided in the Y-axis bottom plate 202 and the XY axis plate 207; the needle module 400 is located in the membrane module 200. The above structure makes it easier for the ejector pin on the needle module 400 to hit the chip on the blue film chip disk located on the rotating assembly ring seat 218.

[0076] In this module, a Y-direction linear motor (composed of a Y-direction linear motor stator and a Y-direction linear motor mover) is used to control the XY axis plate 207 of the module to move linearly along the Y direction on the Y-direction slide rail 203, and an X-direction linear motor (composed of an X-direction linear motor stator and an X-direction linear motor mover) is used to control the rotating assembly fixed plate 210 of the module to move linearly along the X direction on the XY axis plate 207; the linear module 220 and the stepper motor 221 drive the rotating assembly pulley 217 arranged on the rotating assembly fixed plate 210 to rotate a certain angle relative to the rotating assembly fixed plate 210, so that the module can realize movement and rotation in the XY direction. The main function of this module is to quickly and accurately move the blue film chip disk 219 (commercially purchased raw materials) placed on the module to the specified position, and then wait for the ejector pin on the needle module 400 to hit the chip on the blue film chip disk 219.

[0077] like Figure 11-13 and Fig.13a As shown, the needle module 400 includes an adjustable base 401, a motor fixing frame 402 arranged thereon, a voice coil motor 403 arranged in the motor fixing frame, a needle clamping column 404 axially connected to the voice coil motor, an ejector pin 405 arranged at the upper end of the needle clamping column, a ball bushing guide assembly 406 axially sleeved outside the needle clamping column 404, a needle slide rail seat 407 installed above the motor fixing frame 402 and axially sleeved outside the ball bushing guide assembly, and an ejector pin 405 axially sleeved outside the ejector pin 405. A needle cap 408 is fixedly connected to the upper end of the needle column 404, and a vacuum cover 409 is sleeved on the outside of the needle cap 408; a vacuum seat 410 is located above the needle slide seat 407 and sleeved thereon; the vacuum cover 409 is covered on the outside of the upper opening 410a of the vacuum seat, and the lower end of the needle cap 408 is arranged in the upper opening of the vacuum seat; the needle cap 408 and the vacuum cover 409 are both provided with an axial hole 4a for the upper end of the ejector pin to extend upward along the axial direction of the two, so as to facilitate the ejector pin 405 to extend upward when working.

[0078] Here, in order to install the needle slide seat 407, a top mounting plate 411 is provided on the upper surface of the motor fixing frame 402, and the needle slide seat 407 is fixed on the upper surface thereof.

[0079] A sealing ring 412 is provided on the upper surface of the bottom disc 407 a of the needle slide seat 407 . The sealing ring contacts the bottom surface of the vacuum seat 410 and is used to seal the surface where the needle slide seat 407 and the vacuum seat 410 are combined.

[0080] The adjustable base 401 includes a needle adjustment base 401a fixedly mounted on the mounting panel 101, and a needle adjustment platform 401b arranged thereon and having an adjustable mounting height; the motor fixing frame 402 is arranged on the upper surface of the needle adjustment platform. That is, the mounting height of the needle adjustment platform 401b on the needle adjustment base 401a is adjustable. After the adjustment is completed, the needle adjustment platform 401b can be locked on the needle adjustment base 401a with screws.

[0081] This module uses a voice coil motor 403 to drive the ejector pin 405 to impact the chip on the blue film chip disk 219. The voice coil motor 403 has the advantages of simple structure, small size, light weight, high speed, high acceleration, high precision (direct drive), rapid response, precise force control, long life, and high movement frequency. It can achieve a precise impact action of 200k / UPH to impact the chip on the blue film chip disk 219 onto the chip carrier glass of the crystal module 500.

[0082] like Figure 14-17 As shown, the crystal module 500 includes a body support 501, a negative pressure suction component movably arranged on the body support 501, an X-axis transmission component, and a Z-axis lifting component arranged below the X-axis transmission component and connected thereto.

[0083] Specifically, the fuselage bracket 501 is a square frame formed by an upper square frame 501a, two side vertical panels 501b and a fuselage bottom panel 501c; the negative pressure suction component includes two longitudinal guide rails 502 respectively arranged on the inner surfaces of the two side vertical panels 501b, longitudinal sliders 503 respectively arranged on the two longitudinal guide rails 502, two movable panels 504 respectively connected to the longitudinal sliders 503 on the two longitudinal guide rails 502, glass carrier panels 505 respectively fixedly connected to the two movable panels 504 on both sides, and a chip carrier glass 506 embedded in the glass carrier panel for placing A glass suction plate 507, a first linear motor stator 508 arranged on the outer surface of one of the side vertical plates 501b, and a first linear motor mover 509 movably arranged on the first linear motor stator; the first linear motor mover 509 is fixedly connected to one of the movable plates 504; here, there are two longitudinal sliders 503 on each longitudinal guide rail 502; the first linear motor mover 509 is connected to one of the movable plates 504 through a fixing piece 510 with an L-shaped cross-section; the two movable plates 504 and the glass suction plate 507, and the chip carrier glass 506 can move linearly in the Y direction along the longitudinal guide rail 502.

[0084] Specifically, the X-axis transmission assembly includes a lifting base 511, two groups of X-axis transmission sliders 512 arranged on the upper surface thereof, two X-axis transmission guide rails 513 that are parallel to each other and respectively movably connected to the two groups of X-axis transmission sliders, a second linear motor stator 514 arranged on one side of the lifting base 511, and a second linear motor mover 515 movably arranged on the second linear motor stator; the fuselage base plate 501c is connected to the two X-axis transmission guide rails 513 and the second linear motor mover 515, that is, when the second linear motor mover 515 moves, it drives the fuselage base plate 501c and the fuselage bracket 501 to move linearly along the X-axis on the lifting base 511; here, each group of X-axis transmission sliders 512 includes two sliders.

[0085] The Z-direction lifting assembly includes a mounting base 516 fixedly mounted on the machine base 100, specifically, the mounting base 516 is fixedly mounted on the mounting panel 101, a Z-direction bottom plate 517 disposed on the upper surface of the mounting base 516, two sets of horizontal cross roller guide rails 518 disposed on the upper surface of the Z-direction bottom plate in the horizontal direction, a horizontal slide 519 provided with a supporting inclined surface 519a disposed on the two sets of horizontal cross roller guide rails, and a Z-direction slide 520a movably disposed on the horizontal slide 519 and provided with a Z-direction inclined surface 520a in contact with the supporting inclined surface 519a. 0; a horizontal power component disposed on the Z-direction bottom plate 517 and connected to the horizontal slide 519 for driving the horizontal slide to perform reciprocating linear motion on the Z-direction bottom plate 517; a Z-direction auxiliary slide 521 disposed on the upper surface of one end portion of the Z-direction bottom plate; one end of the Z-direction slide 520 is movably connected to a Z-direction guide rail 521a in one side surface of the Z-direction auxiliary slide 521 through two sets of Z-direction cross roller slides 522; when the horizontal slide 519 performs reciprocating linear motion on the Z-direction bottom plate 517, the Z-direction slide 520 rises and falls relative to the Z-direction auxiliary slide 521.

[0086] Specifically, the horizontal power assembly includes a horizontal motor 523 installed on the outer surface of the Z-axis auxiliary slide 521, a horizontal coupling 524 arranged in the Z-axis auxiliary slide and connected to the output shaft of the horizontal motor, a horizontal bearing seat 525 installed on the Z-axis auxiliary slide, and a horizontal lead screw 526 at one end of which passes through the horizontal bearing seat 525 and is connected to the horizontal coupling; the other end of the horizontal lead screw is movably connected to the horizontal slide 519.

[0087] A group of oblique cross roller guide rails 527 are respectively provided on both sides of the supporting inclined surface 519 a , and the Z-direction inclined surface 520 a is connected to the oblique cross roller guide rails 527 .

[0088] Furthermore, an X-axis reader 528 is provided on the fuselage bottom plate 501c, and a grating ruler 529 is provided on one side surface of the lifting base 511; a Y-axis reader 530 is provided on the movable plate 504 connected to the first linear motor mover 509, and a grating ruler 529 is provided on the side plate 501b where the first linear motor stator 508 is set.

[0089] The module is fixed on the mounting panel 101 of the machine base 100 through the mounting base 516, and a first linear motor (composed of a first linear motor stator and a first linear motor mover) is used to control the glass suction plate 507 of the module for placing the chip carrier glass 506 to move linearly along the Y direction on the longitudinal guide rail 502. A second linear motor (composed of a second linear motor stator and a second linear motor mover) is used to control the body support 501 of the module to move linearly along the X direction on the lifting base 511 as a whole, and a Z-direction lifting component is used to control the lifting and lowering of the platform lifting base 511, the body support 501 and the structure on the body support 501 in the Z-axis direction; the main function of the module is to quickly and accurately move the chip carrier glass placed on the module to the specified position, waiting for the chip to be arranged on the chip carrier glass.

[0090] Here, a transfer film with adhesiveness is provided on the chip carrier glass 506, and the chip struck by the ejector pin 405 is adhered to the chip carrier glass 506 through the transfer film; the transfer film can be made of double-sided adhesive.

[0091] It should be noted that in this article, although different names are used for the readers installed in different positions, such as optical reader A, optical reader B, optical reader C and X-axis reader, the purpose is to facilitate distinction. In fact, the readers, optical rulers and grating rulers used in this device are all used to position the movers of the linear motors. Among them, the positioning accuracy of the optical rulers and grating rulers can reach 0.05nm.

[0092] In summary, compared with the prior art, the arrangement device of the present invention facilitates the rapid and accurate transfer of chips to the chip carrier glass 506, and can prevent the chips from flipping over, tilting or missing during the process; at the same time, the automatic arrangement device is small in size, and multiple sets of arrangement devices can be installed on the same machine base 100, which can not only improve processing efficiency but also save installation space.

[0093] In the above description, it should be noted that the terms "installed", "connected", "connected" and other corresponding terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two components.

[0094] Obviously, the embodiments described above are only some embodiments of the present invention, not all embodiments. The preferred embodiments of the present invention are given in the drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Any equivalent structure made by using the contents of the present invention specification and drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A chip automatic arrangement device, characterized in that: Including, base; A membrane module, which is arranged on a machine base and is used to place the chip to be transferred; An imaging module, which is disposed on the base and includes a camera for scanning and identifying the chip to be transferred on the film module; The pin module includes a ejector pin. The chip to be transferred from the film module is moved above the pin module and after being scanned and identified by the image module, the ejector pin hits the chip to transfer it to the crystal module. The crystal module is placed on the machine base, receives the chips from the film module, arranges them, and then transfers them to the next process; The needle module is located inside the membrane module; The crystal module includes a negative pressure suction assembly located above the membrane module; The crystal mold assembly includes a body support, a negative pressure suction component movably arranged on the body support, an X-axis transmission component, and a Z-axis lifting component arranged below the X-axis transmission component and connected thereto; The fuselage support is a square frame formed by an upper square frame, two side vertical plates and a fuselage bottom plate; the negative pressure suction component includes two longitudinal guide rails respectively arranged on the inner surfaces of the two side vertical plates, longitudinal sliders respectively arranged on the two longitudinal guide rails, two movable plates respectively connected to the longitudinal sliders on the two longitudinal guide rails, glass carrier plates respectively fixedly connected to the two movable plates on both sides, a glass suction plate embedded in the glass carrier plate for placing chip carrier glass, a first linear motor stator arranged on the outer surface of one of the side vertical plates, and a first linear motor mover movably arranged on the first linear motor stator; the first linear motor mover is fixedly connected to one of the movable plates; The X-axis transmission assembly includes a lifting base, two groups of X-axis transmission slide blocks arranged on the upper surface thereof, two X-axis transmission guide rails parallel to each other and movably connected to the two groups of X-axis transmission slide blocks, a second linear motor stator arranged on one side of the lifting base, and a second linear motor mover movably arranged on the second linear motor stator; the fuselage bottom plate is connected to the two X-axis transmission guide rails and the second linear motor mover; The Z-axis lifting component includes a mounting base fixed on the machine base, a Z-axis bottom plate arranged on the upper surface of the mounting base, two groups of horizontal cross roller slides in horizontal directions arranged on the upper surface of the Z-axis bottom plate, a horizontal slide provided with a supporting inclined surface arranged on the two groups of horizontal cross roller slides, a Z-axis slide movably arranged on the horizontal slide and provided with a Z-axis inclined surface that fits the supporting inclined surface; a horizontal power component arranged on the Z-axis bottom plate and connected to the horizontal slide for driving the horizontal slide to reciprocate linearly on the Z-axis bottom plate; a Z-axis auxiliary slide arranged on the upper surface of one end of the Z-axis bottom plate; one end of the Z-axis slide is movably connected to the Z guide rail in one side surface of the Z-axis auxiliary slide through two groups of Z-axis cross roller slides; when the horizontal slide reciprocates linearly on the Z-axis bottom plate, the Z-axis slide rises and falls relative to the Z-axis auxiliary slide.

2. The chip automatic arrangement device according to claim 1, characterized in that: The image module comprises a bracket, an XY-direction moving part arranged on the bracket, a Z-direction moving component arranged on the XY-direction moving part, and a camera component arranged on the Z-direction moving component.

3. The chip automatic arrangement device according to claim 2, characterized in that: The bracket includes a vertical frame, an oblique bracket whose upper end is fixedly connected to the upper end of the vertical frame, a horizontal plate fixedly connected to the oblique bracket and the upper end of the vertical frame, and two reinforcing plates respectively arranged at the lower ends of the oblique bracket and the vertical frame.

4. The chip automatic arrangement device according to claim 3, characterized in that: The XY moving part is an XY axis manual slide, which is fixedly mounted on the upper surface of the horizontal plate.

5. The chip automatic arrangement device according to claim 4, characterized in that: The Z-axis moving component includes a mounting plate fixedly mounted on an XY-axis moving part, a Z-axis slide movably mounted on the mounting plate, a Z-axis screw rod movably connected to the Z-axis slide rod at the upper end, a Z-axis motor and a Z-axis bearing seat mounted on the mounting plate, and a Z-axis coupling connected to the output shaft of the Z-axis motor; the lower end of the Z-axis screw rod passes through the Z-axis bearing seat and is connected to the Z-axis coupling; the Z-axis slide rod is connected to the mounting plate via a Z-axis cross ball guide rail connected to the back of the Z-axis slide rod.

6. The chip automatic arrangement device according to claim 5, characterized in that: The camera assembly includes a camera base fixedly connected to the Z-axis slide, a light source bracket connected to the camera base, a lens and a light source arranged on the light source bracket, and a camera arranged on the camera base and connected to the upper end of the lens; the light source is located below the lens.

7. The chip automatic arrangement device according to claim 1, characterized in that: The membrane module comprises a frame, a Y-direction moving component arranged on the frame, an X-direction moving component arranged on the Y-direction moving component, and an R-direction rotating component arranged on the X-direction moving component.

8. The chip automatic arrangement device according to claim 7, characterized in that: The frame comprises a frame bottom plate and two frame vertical plates which are parallel to each other and are arranged on the frame bottom plate.

9. The chip automatic arrangement device according to claim 8, characterized in that: The Y-axis moving component includes a Y-axis bottom plate arranged on the upper surfaces of two frame vertical plates and fixedly connected to the two, two Y-axis slide rails arranged on the Y-axis bottom plate and parallel to each other, a Y-axis slider arranged on each Y-axis slide rail, a Y-axis linear motor stator arranged on one side of the frame, a Y-axis linear motor mover movably connected to the Y-axis linear motor stator, and an XY-axis plate connected to the Y-axis slider and the Y-axis linear motor mover; the XY-axis plate moves linearly along the Y-axis on the Y-axis slide rail driven by the Y-axis linear motor mover.

10. The chip automatic arrangement device according to claim 9, characterized in that: The X-axis moving component includes two groups of X-axis sliders arranged on the upper surface of the XY-axis plate, two X-axis slide rails that are parallel to each other and movably connected to the two groups of X-axis sliders, a rotating component fixed plate connected to the two X-axis slide rails and located above the two, an X-axis linear motor fixed frame arranged on one side of the XY-axis plate, an X-axis linear motor stator arranged on the upper surface of the X-axis linear motor fixed frame, and an X-axis linear motor mover movably connected to the X-axis linear motor stator; the X-axis linear motor mover is connected to one side of the rotating component fixed plate.

11. The chip automatic arrangement device according to claim 10, characterized in that: The R-direction rotating component includes a rotating group base arranged on the upper surface of the rotating group fixing plate, a bearing movably arranged on the rotating group base, a bearing inner ring arranged in the bearing and fixedly connected to the rotating group base, a rotating group pulley sleeved on the bearing and linked with the bearing, a rotating group ring seat arranged above the rotating group pulley and fixedly connected with the rotating group pulley, and a linear component arranged on the outer side of the rotating group pulley and used to drive it to rotate relative to the rotating group base; a blue film chip disk for placing chips is placed on the upper surface of the rotating group ring seat.

12. The chip automatic arrangement device according to claim 11, characterized in that: The linear assembly includes a linear module arranged on a fixed plate of a rotating assembly, a stepper motor arranged at one end of the linear module, a linear slider movably arranged in the linear module, an axis arranged on the linear slider, and a rotating shaft rotatably connected to the axis; the rotating shaft is connected to a transverse rod arranged on the circumferential surface of a rotating assembly pulley.

13. The chip automatic arrangement device according to claim 12, characterized in that: The rotating shaft is formed by a horizontal connecting plate connected to the horizontal rod and a cylinder perpendicular to a surface of the horizontal connecting plate; the axis is formed by a first horizontal plate fixedly connected to the linear slider and a second horizontal plate rotatably connected to the cylinder, and a circular socket is provided in the second horizontal plate, and the cylinder is inserted in the circular socket.

14. The chip automatic arrangement device according to claim 10, characterized in that: The stator of the Y-axis linear motor is fixed on one side surface of the frame through a Y-axis fixed plate; a grating scale located on the inner side of the stator of the Y-axis linear motor is provided on the Y-axis fixed plate, and an optical reader A located on the inner side of the stator of the Y-axis linear motor is provided on the side surface of the XY-axis plate; a grating scale located on the inner side of the stator of the X-axis linear motor is provided on the upper surface of the XY-axis plate; an optical reader B located on the inner side of the stator of the X-axis linear motor is provided on one side surface of the rotating component fixed plate.

15. The chip automatic arrangement device according to claim 11, characterized in that: A protruding arc section is provided on the circumferential surface of the rotating assembly pulley, and an optical scale is provided on the side of the arc section; an optical reader C located outside the optical scale is provided on the fixed plate of the rotating assembly.

16. The chip automatic arrangement device according to claim 1, characterized in that: The needle module includes an adjustable base, a motor fixing frame arranged on it, a voice coil motor arranged in the motor fixing frame, a needle clamping column axially connected to the voice coil motor, an ejector arranged at the upper end of the needle clamping column, a ball bushing guide assembly axially sleeved on the outside of the needle clamping column, a needle slide seat installed above the motor fixing frame and axially sleeved on the outside of the ball bushing guide assembly, a needle clamping cap axially sleeved on the outside of the ejector and fixedly connected to the upper end of the needle clamping column, and a vacuum cover sleeved on the outside of the needle clamping cap; a vacuum seat located above the needle slide seat and sleeved on the outside; the vacuum cover is arranged outside the opening of the upper end of the vacuum seat, and the lower end of the needle clamping cap is arranged in the opening of the upper end of the vacuum seat; the needle clamping cap and the vacuum cover are both provided with an axial hole for the upper end of the ejector to extend upward along the axial direction of the two.

17. The chip automatic arrangement device according to claim 16, characterized in that: A sealing ring is arranged inside the upper surface of the bottom disc of the needle slide rail seat, and the sealing ring contacts the bottom surface of the vacuum seat.

18. The chip automatic arrangement device according to claim 16, characterized in that: The adjustable base comprises a needle adjusting platform seat and a needle adjusting platform which is arranged on the base and can adjust the installation height; the motor is fixedly mounted on the upper surface of the needle adjusting platform.

19. The chip automatic arrangement device according to claim 1, characterized in that: The horizontal power assembly includes a horizontal motor installed on the outer side surface of the Z-axis auxiliary slide, a horizontal coupling arranged in the Z-axis auxiliary slide and connected to the output shaft of the horizontal motor, a horizontal bearing seat installed on the Z-axis auxiliary slide, and a horizontal lead screw with one end passing through the horizontal bearing seat and connected to the horizontal coupling; the other end of the horizontal lead screw is movably connected to the horizontal slide.

20. The chip automatic arrangement device according to claim 1, characterized in that: A group of oblique cross roller slide rails are respectively arranged on both sides of the supporting inclined surface, and the Z-direction inclined surface is connected to the oblique cross roller slide rails.

21. The chip automatic arrangement device according to claim 1, characterized in that: An X-axis reader is provided on the bottom plate of the fuselage, and a grating ruler is provided on one side surface of the lifting base; a Y-axis reader is provided on the movable plate connected to the mover of the first linear motor, and a grating ruler is provided on the side vertical plate where the stator of the first linear motor is set.

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