Apparatus for processing a substrate

Abstract

An apparatus for processing a substrate is provided. In an exemplary embodiment, the apparatus for processing a substrate includes a processing chamber configured to have a first body and a second body combined with each other to have a processing space in which a substrate is processed, and an anti-friction member placed on a contact surface between the first body and the second body, wherein the anti-friction member has a groove formed on a surface corresponding to the contact surface, an adhesive for being adhered between the anti-friction member and the first body or between the anti-friction member and the second body can be provided in the groove, and the groove can form an open pattern.

Description

TECHNICAL FIELD

[0001] The present invention relates to an apparatus for processing a substrate, which includes an anti-friction member for preventing friction between processing chambers. BACKGROUND

[0002] Generally, a semiconductor device is manufactured from a substrate such as a wafer. Specifically, the semiconductor device is manufactured by forming a fine circuit pattern on an upper surface of the substrate through a deposition process, a photolithography process, a cleaning process, a dry process, an etching process, etc.

[0003] Generally, the cleaning process includes a chemical treatment of supplying a chemical to the substrate to remove foreign substances on the substrate, a rinsing treatment of supplying pure water to the substrate to remove the chemical remaining on the substrate, and a dry treatment of removing the pure water remaining on the substrate.

[0004] A supercritical fluid is used for a dry treatment of the substrate. According to an exemplary embodiment, the pure water on the substrate is replaced with an organic solvent, and then in a chamber, a supercritical fluid is supplied to an upper surface of the substrate to dissolve and remove the organic solvent remaining on the substrate from the substrate. When isopropyl alcohol (hereinafter, IPA) is used as the organic solvent, carbon dioxide (CO2) having a lower critical temperature and critical pressure and dissolving the IPA well is used as the supercritical fluid.

[0005] The treatment of the substrate using the supercritical fluid is as follows. When the substrate is transported into the chamber, carbon dioxide in a supercritical state is supplied into the chamber to pressurize the inside of the chamber, and then the substrate is treated with the supercritical fluid while repeating the supply of the supercritical fluid and the exhaust in the chamber. Further, when the treatment of the substrate is completed, the inside of the chamber is exhausted and depressurized. After the chamber is exhausted, the chamber is opened to take out the substrate and restore the chamber.

[0006] Generally, the chambers are combined with each other to provide two independent bodies for providing a processing space in which the substrate is processed. Each body is made of a metal material. However, when the bodies are driven, collision and friction occur between the bodies. Therefore, an anti-friction layer for reducing the occurrence of the collision and the friction is provided on a contact surface between the bodies. The anti-friction layer is fixed to the contact surface using an adhesive.

[0007] When the bodies are driven, the anti-friction layer is damaged due to the impact with the bodies. As a result, particles are generated to cause a process defect. Further, there is a problem that vacuum pressure is applied between the anti-friction layer and the body to prevent the anti-friction layer and the body from being separated due to the high pressure of the processing space. SUMMARY

[0008] An object of the present invention is to prevent damage to an anti-friction member provided in a processing chamber for processing a substrate while maintaining a processing space in the processing chamber at a high pressure.

[0009] Further, it is an object of the present application to prevent vacuum pressure from being generated in an anti-friction member provided in a processing chamber that processes a substrate while maintaining a processing space in the processing chamber at a high pressure.

[0010] Other objects of the present application, which are not mentioned above, will be apparent to those skilled in the art from the following description.

[0011] An exemplary embodiment of the present application provides an apparatus for processing a substrate. In an exemplary embodiment, the apparatus for processing a substrate includes a processing chamber configured to have a first body and a second body combined with each other to have a processing space in which a substrate is processed, and an anti-friction member placed on a contact surface between the first body and the second body, wherein the anti-friction member can have a groove formed on a surface corresponding to the contact surface, wherein an adhesive for adhering between the anti-friction member and the first body or between the anti-friction member and the second body can be provided in the groove, and wherein the groove can form an open pattern.

[0012] In an exemplary embodiment, the anti-friction member can have a through-hole formed in an area in which the groove is not provided.

[0013] In an exemplary embodiment, the pattern can form a closed area between one end and the other end.

[0014] In an exemplary embodiment, the closed area can be formed with a through-hole passing through the anti-friction member.

[0015] In an exemplary embodiment, the anti-friction member can be processed to have a surface roughness corresponding to the contact surface.

[0016] In an exemplary embodiment, a material of the anti-friction member can be provided such that a compressive stress of the anti-friction member is greater than a force received by the anti-friction member.

[0017] In an exemplary embodiment, an adhesive force between the adhesive and the anti-friction member can be provided to be greater than an adhesive force between the adhesive and the contact surface.

[0018] An exemplary embodiment of the present application provides an apparatus for processing a substrate, including: a processing chamber configured to have a first body and a second body combined with each other to have a high-pressure processing space in which the substrate is processed; a driver configured to move the processing chamber to an open position or a closed position; a support unit configured to support the substrate in the processing space; a fluid supply unit configured to supply a fluid to the processing space; and an anti-friction member disposed on one surface of the processing chamber, wherein the one surface includes a contact surface between the first body and the second body, the anti-friction member has a groove formed on a surface corresponding to the contact surface, an adhesive for being adhered between the anti-friction member and the first body or between the anti-friction member and the second body is disposed in the groove, and the groove forms an open pattern.

[0019] In an exemplary embodiment, the pattern can form a closed area between one end and the other end.

[0020] In an exemplary embodiment, the closed area can be formed with a through-hole passing through the anti-friction member.

[0021] In an exemplary embodiment, the anti-friction member can have a through-hole formed in a region in which the groove is not disposed.

[0022] In an exemplary embodiment, the anti-friction member can be disposed in an arc shape.

[0023] In an exemplary embodiment, the driver can be provided with a cylinder passing through the first body and the second body and lifting either one of the first body and the second body, and the anti-friction member can be disposed to cover the cylinder.

[0024] In an exemplary embodiment, the anti-friction member can be processed to have a surface roughness corresponding to the one surface.

[0025] In an exemplary embodiment, the processing chamber can be provided as a metal material.

[0026] In an exemplary embodiment, a material of the anti-friction member can be provided such that a compressive stress of the anti-friction member is greater than a force received by the anti-friction member.

[0027] In an exemplary embodiment, an adhesive force between the adhesive and the anti-friction member can be provided to be greater than an adhesive force between the adhesive and the one surface.

[0028] In an exemplary embodiment, the apparatus for processing a substrate can further include a clamping member configured to clamp the first body and the second body in a closed position, wherein the anti-friction member can be disposed between the first body and the clamping member and between the second body and the clamping member, and wherein the one surface can include a contact surface between the first body and the clamping member and a contact surface between the second body and the clamping member.

[0029] In an exemplary embodiment, the anti-friction member can be disposed as a ring shape.

[0030] In an exemplary embodiment, the processing of the substrate can be drying the substrate using a supercritical fluid in a processing space.

[0031] According to an exemplary embodiment of the present application, damage to an anti-friction member disposed in a processing chamber for processing a substrate can be prevented while maintaining a processing space at a high pressure.

[0032] Further, a vacuum pressure can be prevented from being generated in an anti-friction member disposed in a processing chamber for processing a substrate while maintaining a processing space at a high pressure.

[0033] Effects of the present application are not limited to the above-mentioned effects, and it will be apparent to those skilled in the art that other effects not mentioned herein will be clearly understood from the present description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present application.

[0035] Figure 2 is a cross-sectional view schematically showing an example of a liquid processing apparatus of Figure 1

[0036] Figure 3 and Figure 4 are cross-sectional views schematically showing examples of a supercritical apparatus of Figure 1

[0037] Figure 5 is a plan view schematically showing a state in which an anti-friction member is placed on a second body according to an exemplary embodiment of the present application.

[0038] Figure 6 is a perspective view schematically showing an external appearance of an anti-friction member according to an exemplary embodiment of the present application.

[0039] Figure 7 and Figure 8 ​​is a plan view schematically showing an appearance of the anti-friction member of

[0040] Figure 9 is a cross-sectional view schematically showing an appearance of a supercritical device according to another exemplary embodiment of the present application.

[0041] Figure 10 is a plan view schematically showing an appearance of the anti-friction member of Figure 9 DETAILED DESCRIPTION

[0042] Hereinafter, exemplary embodiments of the present application will be described in greater detail with reference to the accompanying drawings. Exemplary embodiments of the present application can be modified in various forms, and the scope of the present application should not be construed as being limited to the exemplary embodiments described below. Exemplary embodiments will be provided to describe the present application more completely to those skilled in the art. Accordingly, the shape of components in the drawings and the like will be exaggerated to emphasize a clearer description.

[0043] Figure 1 is a plan view schematically showing a substrate processing device according to an exemplary embodiment of the present application. Referring to Figure 1 , the substrate processing system includes an indexing module 10, a processing module 20, and a controller (not shown). According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is defined as a first direction 92, a direction perpendicular to the first direction 92 when viewed from above is defined as a second direction 94, and a direction perpendicular to the first direction 92 and the second direction 94 is defined as a third direction 96.

[0044] The indexing module 10 transfers the substrate W from a container 80 receiving the substrate W to the processing module 20, and receives the substrate W processed in the processing module 20 in the container 80. A longitudinal direction of the indexing module 10 is provided to be along the second direction 94. The indexing module 10 has a load port 12 and an indexing frame 14. The load port 12 is positioned on opposite sides of the processing module 20 based on the indexing frame 14. The container 80 in which the substrate W is received is placed on the load port 12. A plurality of load ports 12 can be provided, and the plurality of load ports 12 can be arranged along the second direction 94.

[0045] As the container 80, a closed container such as a front opening unified pod (FOUP) can be used. The container 80 can be placed on a transfer device (not shown), for example, an overhead conveyor, an overhead transport, or an automated guided vehicle, or placed on the load port 12 by an operator.

[0046] ​A transfer robot 120 is provided in the indexing frame 14. In the indexing frame 14, a guide rail 140 is provided, the longitudinal direction of which is set to the second direction 94, and the transfer robot 120 can be provided to be movable on the guide rail 140. The transfer robot 120 includes a hand 122 on which the substrate W is placed, the hand 122 can be provided to move forward and backward, to rotate around an axis of the third direction 96, and to move along the third direction 96. A plurality of hands 122 are provided to be spaced apart from each other in the vertical direction, and the hands 122 can move forward and backward independently of each other.

[0047] The processing module 20 includes a buffer unit 200, a transfer device 300, a liquid processing device 400, and a supercritical device 500. The buffer unit 200 provides a space for the substrate W to be temporarily stayed for being carried into the processing module 20 and carried out of the processing module 20. The liquid processing device 400 performs a liquid processing process of supplying a liquid onto the substrate W to perform liquid processing on the substrate W. The supercritical device 500 performs a drying process of removing a residual liquid on the substrate W. The transfer device 300 transfers the substrate W between the buffer unit 200, the liquid processing device 400, and the supercritical device 500.

[0048] The longitudinal direction of the transfer device 300 can be set to the first direction 92. The buffer unit 200 can be provided between the indexing module 10 and the transfer device 300. The liquid processing device 400 and the supercritical device 500 can be provided at the side of the transfer device 300. The liquid processing device 400 and the transfer device 300 can be set along the second direction 94. The supercritical device 500 and the transfer device 300 can be set along the second direction 94. The buffer unit 200 can be located at one end of the transfer device 300.

[0049] According to an exemplary embodiment, the liquid processing device 400 is provided on both sides of the transfer device 300, the supercritical device 500 is provided on both sides of the transfer device 300, and the liquid processing device 400 can be provided closer to the buffer unit 200 than the supercritical device 500. On one side of the transfer device 300, the liquid processing device 400 can be provided in an A x B array (A and B are each a natural number of 1 or more) along the first direction 92 and the third direction 96, respectively. On one side of the transfer device 300, the supercritical device 500 can be provided in a C x D array (C and D are each a natural number of 1 or more) along the first direction 92 and the third direction 96, respectively. Unlike this, only the liquid processing device 400 can be provided on one side of the transfer device 300, and only the supercritical device 500 can be provided on the other side of the transfer device 300.

[0050] The transfer device 300 has a transfer robot 320. In the transfer device 300, a guide rail 340 is provided which is disposed in the first direction 92, and the transfer robot 320 is provided so as to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 is provided so as to be movable forward and backward, rotatable about an axis of the third direction 96, and movable in the third direction 96. A plurality of hands 322 are provided so as to be spaced apart from each other in the vertical direction, and the hands 322 can be independently movable forward and backward from each other.

[0051] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 can be provided so as to be spaced apart from each other in the third direction 96. The buffer unit 200 is open in the front and the back. The front is a face facing the indexing module 10, and the back is a face facing the transfer device 300. The indexing robot 120 reaches the buffer unit 200 through the front, and the transfer robot 320 can reach the buffer unit 200 through the back.

[0052] Figure 2 is schematically illustrated Figure 1 An example of a liquid processing device 400. Referring to Figure 2 , the liquid processing device 400 has a housing 410, a cup portion 420, a support unit 440, a liquid supply unit 460, a lifting unit 480, and a controller 40. The controller 40 controls the operations of the liquid supply unit 460, the support unit 440, and the lifting unit 480. The housing 410 is provided in a substantially rectangular parallelepiped shape. The cup portion 420, the support unit 440, and the liquid supply unit 460 are provided in the housing 410.

[0053] The cup portion 420 has a processing space which is open in the upper portion, and in which the substrate W is subjected to liquid processing. The support unit 440 can support the substrate W in the processing space. The liquid supply unit 460 supplies a liquid onto the substrate W supported by the support unit 440. A plurality of types of liquids are provided and can be supplied onto the substrate W in sequence. The lifting unit 480 controls the relative height between the cup portion 420 and the support unit 440.

[0054] According to an exemplary embodiment, the cup portion 420 has a plurality of recovery tanks 422, 424, and 426. The recovery tanks 422, 424, and 426 each have a recovery space that recovers a liquid used for substrate processing. Each of the recovery tanks 422, 424, and 426 is disposed in an annular shape that covers the support unit 440. When a liquid processing process is performed, a pre-treatment liquid scattered by rotation of the substrate W is introduced into the recovery space through the inlets 422a, 424a, and 426a of the recovery tanks 422, 424, and 426. According to an exemplary embodiment, the cup portion 420 has a first recovery tank 422, a second recovery tank 424, and a third recovery tank 426. The first recovery tank 422 is disposed to cover the support unit 440, the second recovery tank 424 is disposed to cover the first recovery tank 422, and the third recovery tank 426 is disposed to cover the second recovery tank 424. A second inlet 424a through which a liquid is introduced into the second recovery tank 424 can be positioned above a first inlet 422a through which a liquid is introduced into the first recovery tank 422, and a third inlet 426a through which a liquid is introduced into the third recovery tank 426 can be positioned above the second inlet 424a.

[0055] The support unit 440 has a support plate 442 and a driving shaft 444. An upper surface of the support plate 442 is disposed in a substantially circular shape and can have a diameter greater than that of the substrate W. In a central portion of the support plate 442, a support pin 442a that supports a rear surface of the substrate W is disposed, and an upper end of the support pin 442a is disposed to protrude from the support plate 442 such that the substrate W is spaced apart from the support plate 442 by a predetermined distance. A chuck pin 442b is disposed in an edge portion of the support plate 442.

[0056] The chuck pin 442b is disposed to protrude upward from the support plate 442 and support a side portion of the substrate W such that the substrate W does not deviate from the support unit 440 when the substrate W is rotated. The driving shaft 444 is driven by a driving member 446 and connected to a center of the substrate W, and rotates the support plate 442 based on a central axis thereof.

[0057] According to an exemplary embodiment, the liquid supply unit 460 has a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 supplies a first liquid onto the substrate W. The first liquid can be a liquid that is used to remove a thin film or a foreign substance remaining on the substrate W. The second nozzle 464 supplies a second liquid onto the substrate W. The second solution can be a liquid that is well dissolved in a third liquid. For example, the second liquid can be a liquid that is more well dissolved in the third solution than the first liquid. The second liquid can be a liquid that neutralizes the first liquid supplied onto the substrate W. In addition, the second liquid can be a liquid that neutralizes the first liquid and is more well dissolved in the third solution than the first liquid.

[0058] According to an exemplary embodiment, the second liquid may be water. The third nozzle 466 supplies the third liquid onto the substrate W. The third liquid may be a liquid that dissolves well in the supercritical fluid used in the supercritical device 500. For example, the third liquid may dissolve better than the second liquid in the supercritical fluid used in the supercritical device 500. According to an exemplary embodiment, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol (IPA). According to an exemplary embodiment, the supercritical fluid may be carbon dioxide.

[0059] The first nozzle 462, the second nozzle 464, and the third nozzle 466 are supported by different arms 461, and these arms 461 can move independently. Alternatively, the first nozzle 462, the second nozzle 464, and the third nozzle 466 can be mounted on the same arm and can move simultaneously.

[0060] The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate W changes due to the vertical movement of the cup 420. Therefore, since the recovery tanks 422, 424, and 426 for recovering the pretreatment liquid change according to the type of liquid supplied to the substrate W, the liquid can be recovered separately. Unlike the above, the cup 420 is fixed and the lifting unit 480 can move the support unit 440 in the vertical direction.

[0061] Figure 3 and Figure 4 They are schematically shown Figure 1 FIG2 is a cross-sectional view of an example of a supercritical device 500. According to an exemplary embodiment, the supercritical device 500 uses a supercritical fluid to remove liquid from a substrate W. According to an exemplary embodiment, the liquid on the substrate W is isopropyl alcohol (IPA). The supercritical device 500 supplies the supercritical fluid to the substrate to dissolve the IPA on the substrate W in the supercritical fluid and remove the IPA from the substrate W.

[0062] refer to Figure 3 and Figure 4 The supercritical device 500 includes a processing chamber 520 , a fluid supply line 540 , a support unit 580 , a driving member 590 , and an exhaust unit 550 .

[0063] The processing chamber 520 has a processing space 502 in which a supercritical process is performed. In an exemplary embodiment, the processing chamber 520 can be provided in a cylindrical shape. Alternatively, unlike this, the processing chamber 520 can be provided in a cuboid shape. The processing chamber 520 has a first body 522 and a second body 524. The first body 522 and the second body 524 are combined with each other to provide the above-described processing space 502. In an exemplary embodiment, the first body 522 is provided in a circular shape when viewed from above. Similarly, the second body 524 is provided in a circular shape when viewed from above. In an exemplary embodiment, the first body 522 is provided on the second body 524. Alternatively, the first body 522 and the second body 524 can be provided at the same height, and the first body 522 and the second body 524 can be opened and closed to the left and right.

[0064] When the first body 522 and the second body 524 are spaced apart, the processing space 502 is opened, at which time the substrate W is transported in or out. The driving member 590 lifts the first body 522 or the second body 524 so that the processing chamber 520 moves to an open position or a closed position.

[0065] In an exemplary embodiment, the driving member 590 can be provided as a gas cylinder 595 that drives the first body 522 or the second body 524 to be lifted. For example, the driving member 590 can be provided as a gas cylinder 595 that lifts the second body 524. Here, the open position is a position in which the first body 522 and the second body 524 are spaced apart from each other, and the closed position is a position in which the facing surfaces of the first body 522 and the second body 524 contact each other. That is, in the open position, the processing space 502 is opened from the outside, and in the closed position, the processing space 502 is closed.

[0066] In an exemplary embodiment, a first injection hole 525 connected to the first supply line 542 can be formed in the first body 522. Fluid can be supplied to the processing space 502 through the first injection hole 525. In an exemplary embodiment, in the second body 524, a second injection hole 526 connected to the second supply line 562 and an exhaust hole 527 connected to the exhaust line 552 can be formed. Alternatively, only one of the first injection hole 525 and the second injection hole 526 can be provided in the processing chamber 520. In an exemplary embodiment, a heater 570 is provided in a wall of the processing chamber 520. The heater 570 heats the space 502 of the processing chamber 520 to maintain fluid supplied to the inner space of the processing chamber 520 in a supercritical state. An atmosphere of a supercritical fluid is formed in the processing space 502.

[0067] The support unit 580 can support the substrate W in the processing space 502 of the processing chamber 520. The substrate W transported into the processing space 502 of the processing chamber 520 is placed on the support unit 580. According to an exemplary embodiment, the substrate W is supported by the support unit 580 so that the pattern surface faces the top. In an exemplary embodiment, the support unit 580 supports the substrate W above the second exhaust hole 526. In an exemplary embodiment, the support unit 580 can be coupled to the first body 522. Alternatively, the support unit 580 can be coupled to the second body 524.

[0068] Further, the exhaust unit 550 is connected to the second body 524. The supercritical fluid in the processing space 502 of the processing chamber 520 is exhausted to the outside of the processing chamber 520 through the exhaust unit 550. The exhaust unit 550 includes an exhaust line 552 and an exhaust valve 5521. The exhaust valve 5521 is provided on the exhaust line 552 to regulate the exhaust of the processing space 502 and the exhaust flow rate.

[0069] When the process is performed, the first body 522 and the second body 524 are in contact with each other to close the processing space 502 from the outside.

[0070] In an exemplary embodiment, the first body 522 and the second body 524 are provided as a metal material. For example, the first body 522 and the second body 524 can be provided as stainless steel. When the first body 522 and the second body 524 are in contact with each other, impact and vibration are generated on the contact surface between the first body 522 and the second body 524. Accordingly, the anti-friction layer 510 is provided to reduce the impact and vibration generated on the contact surface between the first body 522 and the second body 524.

[0071] Hereinafter, the anti-friction member 510 of the present application will be described with reference to Figures 5 to 6 FIG. 1 is a perspective view schematically showing the appearance of the anti-friction member 510 according to an exemplary embodiment of the present application. Figure 5 FIG. 2 is a plan view schematically showing a state in which the anti-friction member 510 is placed on the second body 524 according to an exemplary embodiment of the present application. Figure 6 FIG. 3 is a perspective view schematically showing the appearance of the anti-friction member 510 according to an exemplary embodiment of the present application.

[0072] In an exemplary embodiment, the anti-friction layer 510 is provided on the contact surface between the first body 522 and the second body 524. In an exemplary embodiment, the anti-friction layer 510 is placed on the second body 524, as shown in Figure 5 FIG. 2.

[0073] The friction prevention layer 510 prevents the first body 522 and the second body 524 from colliding with each other directly. Accordingly, the friction prevention layer 510 prevents generation of particles due to collision of the first body 522 and the second body 524. In an exemplary embodiment, the friction prevention layer 510 is provided as a material stable to a process fluid supplied to the process space 502. In an exemplary embodiment, carbon dioxide in a supercritical state is supplied to the process space 502 to dry a substrate, and the friction prevention layer 510 is provided as any one of polyimide (PI), polyether ether ketone (PEEK), polyethylene terephthalate (PET), zirconia, silicon carbide (SiC), silicon nitride (SiN), and aluminum oxide (alumina). In an exemplary embodiment, the friction prevention layer 510 has a thickness of 0.5 mm to 3 mm.

[0074] The cylinder 595 lifts the process chamber 520, in which collision between the process chamber 520 and the cylinder 595 frequently occurs near the cylinder 595. Accordingly, the friction prevention member 510 can be disposed near the cylinder 595. In an exemplary embodiment, the friction prevention member 510 can be disposed to cover the cylinder 595. For example, the friction prevention member 510 can be disposed in a ring shape. The friction prevention member 510 has a hollow portion 512 and is provided with an opening 513, so that a region in which the hollow portion 512 is disposed can be fitted to the cylinder 595 through the opening 513.

[0075] In an exemplary embodiment, the friction prevention member 510 can be formed with grooves 514 on a surface corresponding to a contact surface, as shown in Figure 6 The grooves 514 are provided with an adhesive, which is used to bond between the friction prevention member 510 and the first body 522 or between the friction prevention member 510 and the second body 524. In an exemplary embodiment, the adhesive is provided as a material that enhances contact force of the process chamber 520 provided as a metal and the friction prevention member 510. In an exemplary embodiment, the adhesive is provided as a material having high contact with a metal material. In an exemplary embodiment, the adhesive can be provided as a material having high contact with a metal material and having excellent high-temperature properties. For example, the adhesive can be provided as an acrylic material. In an exemplary embodiment, the adhesive can be provided in the form of a double-sided tape, for example. Alternatively, the adhesive can be provided as a liquid coated in the grooves 514. In an exemplary embodiment, the adhesive is adhered between the grooves 514 and the first body 522. Alternatively, the adhesive is adhered between the grooves 514 and the second body 524. The grooves 514 are formed in a predetermined pattern in the friction prevention member 510. In an exemplary embodiment, the grooves 514 form an open pattern. For example, as shown in Figure 6As shown, the pattern forming the grooves 514 is open in the area A. Thus, the area 516 where no groove 514 is provided is isolated from the grooves 514 to prevent vacuum pressure from being generated. Thus, if necessary, the grooves 514 prevent the processing chamber 520 and the friction prevention member 510 from being separated by vacuum pressure.

[0076] In an exemplary embodiment, the friction prevention member 510 can be formed with a through-hole in the area 516 where no groove 514 is provided. Thus, the friction prevention member 510 prevents vacuum pressure from being generated in the area 516 where no groove 514 is provided. In an exemplary embodiment, the pattern can form a closed area between one end and the other end. A plurality of closed areas can be formed. The through-hole can be formed in an area surrounded by the closed area.

[0077] In an exemplary embodiment, the friction prevention member 510 can be processed to have a surface roughness corresponding to the contact surface. For example, the roughness of the upper surface and the lower surface of the friction prevention member 510 can be processed. The roughness of the upper surface and the lower surface of the friction prevention member 510 can be processed to have a roughness such that vacuum pressure is not generated between the friction prevention member 510 and the processing chamber 520.

[0078] In an exemplary embodiment, the material of the friction prevention member 510 can be provided such that the compressive stress of the friction prevention member 510 is greater than the force received by the friction prevention member 510. In an exemplary embodiment, the compressive stress of the friction prevention member 510 can be greater than a value obtained by multiplying the area of the friction prevention member 510, the number of the friction prevention member 510, and the force generated in the processing space 502. For example, the area of the friction prevention member 510, the number of the friction prevention member 510, and the material of the friction prevention member 510 can be determined according to the above conditions.

[0079] In an exemplary embodiment, the adhesion between the adhesive and the friction prevention member 510 can be provided to be greater than the adhesion between the adhesive and the contact surface. For example, the adhesive is provided as a double layer, and the adhesion of the surface in contact with the friction prevention member 510 can be provided to be greater than the adhesion of the surface in contact with the processing chamber 520. Alternatively, the adhesive is provided as a single layer, and the material of the adhesive can be selected such that the adhesion between the adhesive and the friction prevention member 510 is greater than the adhesion between the adhesive and the processing chamber.

[0080] In an exemplary embodiment, it has been described that the friction prevention member 510 is provided in a ring shape in the vicinity of the cylinder 595. However, unlike this, the friction prevention member 510 can be provided in an arc shape, as shown in Figure 7 and 8 .

[0081] In the exemplary embodiment, it has been described that the friction prevention member 510 is disposed between the first body 522 and the second body 524. However, unlike this, the friction prevention member 510 can be disposed between the clamping member 5000 clamping the process chamber and the process chamber 520.

[0082] Figure 9 Another exemplary embodiment of the substrate processing apparatus of the present application is illustrated.

[0083] Reference Figure 9 In the exemplary embodiment, the substrate processing apparatus 4000 includes a housing 4020, a process chamber 4100, a substrate support unit 4400, a lifting member 4500, a heating member 4600, a blocking member 4800, an exhaust unit 4700, a fluid supply unit 4900, a clamping member 5000, and a moving member 5500. In the exemplary embodiment, the process chamber 4100 can be disposed to be inserted into the housing 4020. Figure 3 The process chamber 520 is illustrated.

[0084] The housing 4020 includes a body 4040 and an intermediate plate 4060. The body 4040 is disposed to be cylindrical, in which a space is formed. For example, the body 4040 can be disposed to be a cuboid shape. A slit-shaped through hole 4050 is formed in an upper surface of the body 4040. The through hole 4050 is disposed to have the same longitudinal direction as each other at different positions from each other. The intermediate plate 4060 is located in the body 4040. The intermediate plate 4060 divides the inside of the body 4040 into an upper space 4080a and a lower space 4080b. The intermediate plate 4060 is disposed to be a plate shape having a hollow portion 4040a. The second body 4200 is disposed to be insertable into the hollow portion 4040a. The hollow portion 4040a can be disposed to have a diameter greater than the lower end of the second body 4200. The process chamber 4100 and the clamping member 5000 can be positioned in the upper space 4080a, and the lifting member 4500 can be positioned in the lower space 4080b. The moving member 5500 can be located on the outer wall of the housing 4020.

[0085] The processing chamber 4100 has a processing space 4120 for processing a substrate W therein. The processing chamber 4100 is closed from the outside with respect to the processing space 4120 when processing the substrate W. The processing chamber 4100 includes a second body 4200, a first body 4300, and a sealing member 4140. A lower surface of the second body 4200 is provided in a stepped shape. The second body 4200 is provided in a shape in which a central portion of the lower surface is lower than an edge portion thereof. For example, the second body 4200 can be provided in a substantially cylindrical shape. The second body 4200 can be raised and lowered by a lifting member 4500 to an upper space 4080a and a lower space 4080b of the body 4040. A lower supply port 4220 and an exhaust port 4260 are formed on a lower surface of the second body 4200. The lower supply port 4220 can be located outside a central axis of the second body 4200 when viewed from above. The lower supply port 4220 serves as a flow passage for supplying a supercritical fluid to the processing space 4120.

[0086] The first body 4300 is combined with the second body 4200 to form the processing space 4120 therein. The first body 4300 is located on the second body 4200. The first body 4300 is located in the upper space 4080a of the housing 4020. The first body 4300 is coupled to a top surface of the body 4040 by a buffer member 4350. For example, the buffer member 4350 can be a spring. An upper supply port 4320 is formed in the first body 4300. The upper supply port 4320 serves as a flow passage for supplying a supercritical fluid to the processing space 4120. The upper supply port 4320 can be positioned in line with a center of the first body 4300. According to an exemplary embodiment, each of the first body 4300 and the second body 4200 can be provided in a metal material.

[0087] The sealing member 4140 seals a gap between the first body 4300 and the second body 4200. The sealing member 4140 is located between the first body 4300 and the second body 4200. A substrate support unit 4400 can support a substrate W in the processing space 4120.

[0088] The lifting member 4500 adjusts the relative position between the first body 4300 and the second body 4200. The lifting member 4500 lifts any one of the first body 4300 and the second body 4200 apart from or into contact with the other. The lifting member 4500 lifts the first body 4300 or the second body 4200 so that the processing chamber 4100 moves to the open position or the closed position. The lifting member 4500 includes a support plate 4520, a lifting shaft 4540, and a driver 4560. The support plate 4520 supports the second body 4200 in the lower space 4080b. The lifting shaft 4540 supports the lower surface of the support plate 4520 in the lower space 4080b. The lifting shaft 4540 is fixedly coupled to the support plate 4520. The driver 4560 lifts the lifting shaft 4540. When a driving force is provided to the driver 4560, the second body 4200 and the lifting shaft 4540 are lifted, and the first body 4300 the second body 4200 moves to the closed position that seals the processing space. When the driving force of the driver 4560 is released in the closed position, the first body 4300 and the second body 4200 can maintain the closed position.

[0089] The blocking member 4800 prevents the supercritical fluid supplied from the lower supply port 4220 from being directly supplied to the untreated surface of the substrate W. The blocking member 4800 includes a blocking plate 4820 and a support portion 4840. The blocking plate 4820 is positioned between the lower supply port 4220 and the substrate support unit 4400. The support portion 4840 supports the blocking plate 4820.

[0090] The exhaust unit 4700 can exhaust the atmosphere of the processing space 4120. The process byproducts generated in the processing space 4120 are discharged through the exhaust unit 4700. The exhaust can be natural exhaust or forced exhaust. In addition, the exhaust unit 4700 can also adjust the pressure of the processing space 4120 when discharging the process byproducts. The exhaust unit 4700 includes an exhaust line 4720 and a pressure measuring member 4740. The exhaust line 4720 is connected with the exhaust port 4260. The exhaust valve 4760 provided in the exhaust line 4720 can adjust the amount of exhaust of the processing space 4120. The pressure measuring member 4740 is provided on the exhaust line 4720 and measures the pressure of the exhaust line 4720. The pressure measuring member 4740 is located upstream of the exhaust valve 4760 in the exhaust direction. The processing space 4120 can be depressurized to atmospheric pressure or a pressure corresponding to the outside of the processing chamber 4100 by the exhaust unit 4700.

[0091] The first clamp 5100 and the second clamp 5200 are positioned on the side of the process chamber 4100. According to an exemplary embodiment, the first clamp 5100 and the second clamp 5200 are positioned to face each other with the process chamber 4100 therebetween. Each of the first clamp 5100 and the second clamp 5200 is provided in a shape covering the process chamber 4100.

[0092] Each of the first clamp 5100 and the second clamp 5200 has a clamp groove 5120 formed on an inner surface facing the process chamber 4100. In a closed position, the clamp groove 5120 is available for insertion of the edge portion of the first body 4300 and the edge portion of the second body 4200. The clamping member 5000 is movable to a locked position or a release position. Here, the locked position is defined as a position in which the first clamp 5100 and the second clamp 5200 are close to each other to clamp the first body 4300 and the second body 4200, and the release position is defined as a position in which the first clamp 5100 and the second clamp 5200 are spaced apart from the first body 4300 and the second body 4200. The first clamp 5100 and the second clamp 5200 are combined with each other in the locked position to have a ring hole shape.

[0093] A friction prevention member 510b can be provided between the first clamp 5100 and the second clamp 5200 and the process chamber 5200. For example, as shown in FIG. 5B, the friction prevention member 510b can be provided on the upper surface and the lower surface in contact with the first clamp 5100 and the second clamp 5200. In an exemplary embodiment, the friction prevention member 510b can be provided in a ring shape as shown in FIG. 5C. In an exemplary embodiment, the friction prevention member 510b can be provided in an open shape. Figure 9 Figure 10

[0094] The foregoing detailed description has shown, by way of illustration, exemplary embodiments of this application. Additionally, the description given above concerning the examples is not exhaustive and can largely contain standard or widely applied components. Such embodiments and examples do not purport to be exhaustive or to limit the application to a single or particular field of use. As will be realized, other embodiments and examples will occur to those with an ordinary skill in the art and are encompassed within the spirit and scope of the subject application. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive. Like reference numerals can denote like elements throughout the specification.​​

Claims

1. A device for processing a substrate, comprising: a processing chamber configured to have a first body and a second body combined with each other to have a processing space in which a substrate is processed; and an anti-friction member placed on a contact surface between the first body and the second body, wherein the anti-friction member has a groove formed on a surface corresponding to the contact surface, wherein an adhesive for adhering between the anti-friction member and the first body or between the anti-friction member and the second body is provided in the groove, and wherein the groove forms an open pattern. 2.The device for processing a substrate according to claim 1, wherein the anti-friction member has a through hole formed in an area where the groove is not provided. 3.The device for processing a substrate according to claim 1, wherein the pattern forms a closed area between one end and the other end, and wherein the closed area is formed with a through hole penetrating the anti-friction member. 4.The device for processing a substrate according to claim 1, wherein the anti-friction member is processed to have a surface roughness corresponding to the contact surface. 5.The device for processing a substrate according to claim 1, wherein an adhesive force between the adhesive and the anti-friction member is greater than an adhesive force between the adhesive and the contact surface. 6.A device for processing a substrate, comprising: a processing chamber configured to have a first body and a second body combined with each other to have a high-pressure processing space in which a substrate is processed; a driver configured to move the processing chamber to an open position or a closed position; a support unit configured to support the substrate in the processing space; a fluid supply unit configured to supply a fluid to the processing space; and an anti-friction member provided on one surface of the processing chamber, wherein the one surface includes a contact surface between the first body and the second body, wherein the anti-friction member has a groove formed on a surface corresponding to the contact surface, wherein an adhesive for adhering between the anti-friction member and the first body or between the anti-friction member and the second body is provided in the groove, and wherein the groove forms an open pattern. 7.The device for processing a substrate according to claim 6, wherein the pattern forms a closed area between one end and the other end, and wherein the closed area is formed with a through hole penetrating the anti-friction member. 8.The device for processing a substrate according to claim 6, wherein the anti-friction member has a through hole formed in an area where the groove is not provided. 9.The device for processing a substrate according to claim 6, wherein the anti-friction member is provided in an arc shape. ​ 10. The apparatus for processing a substrate according to claim 6, wherein the driver is provided with a cylinder which penetrates through the first body and the second body and lifts either of the first body and the second body, and wherein the anti-friction member is provided to cover the cylinder.

11. The apparatus for processing a substrate according to claim 6, wherein the anti-friction member is processed to have a surface roughness corresponding to the one surface.

12. The apparatus for processing a substrate according to claim 6, wherein the processing chamber is provided as a metal material.

13. The apparatus for processing a substrate according to claim 6, wherein an adhesion between the adhesive and the anti-friction member is greater than an adhesion between the adhesive and the one surface.

14. The apparatus for processing a substrate according to claim 6, further comprising: a clamping member configured to clamp the first body and the second body placed in the closed position, wherein the anti-friction member is provided between the first body and the clamping member and between the second body and the clamping member, and wherein the one surface includes a contact surface between the first body and the clamping member and a contact surface between the second body and the clamping member.

15. The apparatus for processing a substrate according to claim 6, wherein the anti-friction member is provided as a ring shape.

16. The apparatus for processing a substrate according to claim 6, wherein the processing of the substrate is drying the substrate using a supercritical fluid in the processing space.

17. An apparatus for processing a substrate, comprising: a processing chamber configured to have a first body and a second body which are combined with each other to define a processing space in which the substrate is processed; a driver configured to move the processing chamber to an open position and a closed position; a clamping member configured to clamp the first body and the second body in the closed position; and an anti-friction member provided on a contact surface between the processing chamber and the clamping member, wherein the anti-friction member has a groove formed on a surface corresponding to the contact surface, wherein an adhesive for adhering the anti-friction member to the processing chamber or to the clamping member is provided in the groove, and wherein the groove forms an open end pattern.

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