Flexible substrate, chip-on-film (COF) and display

Abstract

Embodiments of the present application provide a flexible substrate, a chip-on-film (COF) and a display screen, and relate to the technical field of display. The chip-on-film is used for a display panel with multiple pins. The chip-on-film includes a first flexible substrate, a first chip disposed on the first flexible substrate, and the first flexible substrate includes at least two groups of first connection terminals. Terminals on the first connection terminals are electrically connected to pins of the first chip through lines on the first flexible substrate, and terminals of fan-out lines of a display panel or a touch panel are bonded to the terminals on the first connection terminals.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a flexible substrate, a COF (Crystal-on-Foil) thin film, and a display screen. Background Technology

[0002] In flexible display technology, electronic device displays are lighter, thinner, and rollable, and their application in mobile phones, tablets, wearables, and other fields is becoming increasingly common. Figure 1 As shown, in the display panel of a flexible display, the driving lines (such as scan lines, data lines, etc.) of the active area (AA) are fanned out through fan-out lines on the bezel to the bonding pad (also called the bonding end, referring to the pin area of ​​the bezel). In this way, through pad bending technology, the bonding pad is bent to the back of the display panel, thereby bonding the pins (or terminals) of the bonding pad to the chin-on-film (COF, i.e., a flexible circuit film with a chip, also known as a chip-on-film film). Because the bonding pad is bent to the back of the display panel, it does not occupy the area of ​​the display area, thus achieving an extremely narrow bezel and a high screen-to-body ratio (the proportion of the display area on the display panel). However, as the pixels per inch (PPI) and resolution of display panels increase, the number of driving lines and the number of pins on the bonding pad also increase. Influenced by the size of the bonding pad, the bezel size (e.g., ...) becomes increasingly limited. Figure 1 As shown, taking a circular display screen as an example, the border dimensions 1 and 2 of the display area and the border of the display panel, and the width border dimension 3 of the connecting end, especially the bottom border of the circular screen (such as... Figure 1 As shown, the frame size (the frame size 2 of the display area and the frame size 3 of the display panel, and the width of the connection end) is further narrowed, severely limiting its functionality. Therefore, display panels with multiple pin outputs have emerged, for example... Figure 2As shown, the display panel has multiple connection terminals (connection terminal 1, connection terminal 2, and connection terminal 3). This allows the driving circuitry of the display area AA to be connected to pins in different connection terminals via fan-out lines. By evenly distributing pins in each connection terminal, the width of the connection terminal (bezel size 3) can be reduced, further minimizing the bezel size and increasing the screen-to-body ratio. Furthermore, reducing bezel size 3 also helps to reduce the maximum outer diameter of the display panel, saving installation space in the electronic device. For the aforementioned multi-pin-out display panel, a new type of die-attached thin film (COF) needs to be designed to bond with the connection terminals of the display panel, either for input signals to the driving circuitry or for receiving signals output from the driving circuitry. Summary of the Invention

[0003] This application provides a flexible substrate, a crystal-coated thin film COF, and a display screen, and provides a novel COF to cope with the signal input or output of the driving circuit of a display panel with multiple pins.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] Firstly, a touch panel is provided. The touch panel includes: a touch sensor array; wherein, a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of second connection terminals, each second connection terminal including terminals of multiple fan-out lines of the touch panel. Currently, single-ended pin touch panels typically only have one set of connection terminals on the bezel of the touch panel, and all driving lines of the touch panel are connected to different terminals in this connection terminal through fan-out lines. As touch accuracy continues to improve, the number of driving lines and terminals in the touch panel increases, and the size of the connection terminal also increases, thus affecting the bezel size of the touch panel and severely limiting the narrowing of the touch panel. The touch panel provided in the embodiments of this application is provided with at least two sets of second connection terminals. This allows the driving circuit of the touch panel to be connected to the terminals in different second connection terminals through fan-out circuits. By uniformly setting the terminals in each second connection terminal, the width of the connection terminal can be reduced, thereby further reducing the bezel size of the touch panel and increasing the screen ratio. In addition, the reduction in bezel size also helps to reduce the maximum outer circle of the touch panel, saving installation space of the entire electronic device.

[0006] Secondly, a first die-attached thin film COF is provided. The first COF includes: a first flexible substrate; a first chip disposed on the first flexible substrate; the first flexible substrate includes at least two sets of first connection terminals, wherein terminals on the first connection terminals are electrically connected to pins of the first chip via lines on the first flexible substrate, and terminals of fan-out lines of a display panel or touch panel are bonded to terminals on the first connection terminals. Wherein, the first COF includes at least two sets of first connection terminals, and when a multi-pin display panel or touch panel includes at least two sets of second connection terminals corresponding one-to-one with the positions of the at least two sets of first connection terminals on the first COF, the first COF is used to input signals to the driving lines of the multi-pin display panel or touch panel or to receive signals output by the driving lines.

[0007] In one possible implementation, the display area of ​​the display panel includes a pixel array, wherein a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel; the display panel is provided with at least two sets of second connection terminals, each second connection terminal including terminals of multiple fan-out lines of the display panel; a first flexible substrate is disposed on the back side of the display panel, and one set of second connection terminals is bent to the back side of the display panel and correspondingly connected to a set of first connection terminals. Optionally, the pixel unit includes a pixel circuit, and the driving line includes scan lines and data lines connected to the pixel circuit. In this example, since the display panel only contains a pixel array, the display panel only has a display function. A first COF is used to connect the display panel, and the first chip can be a display driver integrated circuit (DDIC).

[0008] In one possible implementation, the pixel unit further includes a touch sensor, and the driving circuitry includes input channel traces and output channel traces connected to the touch sensor. In this example, the display panel can simultaneously have touch functionality, with the touch sensor integrated into the pixel unit of the display panel, enabling the display panel to connect to the on-cell TP (touch panel, i.e., the touch sensor of the touch panel is integrated into the pixel unit of the display panel). When the first COF is used to connect to the display panel, the first chip can be a touch and display driver integration IC (TDDI IC) integrating a DDIC and a TPIC.

[0009] In one possible implementation, the touch panel includes a touch sensor array, wherein a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of second connection terminals, each second connection terminal including terminals of a plurality of fan-out lines of the touch panel; wherein the first flexible substrate is disposed on the back side of the touch panel, and one set of the second connection terminals is bent to the back side of the touch panel and correspondingly connected to one set of the first connection terminals. In this example, the first COF is used to connect to the touch panel, and the first chip can be a touch panel integrated circuit (TPIC).

[0010] In one possible implementation, the drive circuitry includes input channel traces and output channel traces connected to the touch sensors. Typically, the touch sensors are positioned at the intersection of the input channel trace Rx and the output channel trace Tx, and a group of touch sensors is connected to one Rx and one Tx.

[0011] In one possible implementation, the first flexible substrate includes a third connection terminal, wherein terminals on the third connection terminal are electrically connected to pins of the first chip via lines on the first flexible substrate. The terminals of the third connection terminal are bonded to terminals on a second flexible substrate, and the terminals of the second flexible substrate are electrically connected to a driving circuit board. Specifically, the terminals of the third connection terminal are bonded to the terminals of the second flexible substrate. The second flexible substrate is primarily used to connect the first chip (COF) to the driving circuit board, realizing the connection between the first chip and the driving circuit board, such as a printed circuit board (PCB). One set of terminals on the second flexible substrate is bonded to the terminals of the third connection terminal, and another set of terminals on the second flexible substrate is connected to the PCB via connectors. An application processor (AP) (e.g., CPU), a power management chip (power IC), etc., are mounted on the PCB. In this way, the AP provides display data to the DDIC and the display panel to display actual image information; the power IC provides operating voltage to the DDIC and the display panel. The second flexible substrate provides a signal transmission connection path between the PCB and the DDIC. The DDIC is responsible for receiving signals transmitted from the PCB and transmitting the signals to the display panel according to a specific timing control. For example, the display data output by the AP is converted into a scan signal and data voltage Vdata after passing through the DDIC and transmitted to the pixel units coupled to each driving line to drive the pixel units to emit light. Alternatively, the AP provides an initial signal to the touch sensor through the TPIC (e.g., transmitting the initial signal to the touch sensor via Rx), and when a touch event occurs at the touch sensor, the AP detects the touch signal generated by the corresponding touch sensor through the TPIC (e.g., the touch sensor transmits the touch signal via Tx). The second flexible substrate provides a signal transmission connection path between the PCB and the TPIC. The TPIC is responsible for receiving the signals transmitted by the PCB and transmitting the signals to the touch sensor of the touch panel according to a specific timing control, and for receiving the touch signals generated by the touch sensor.

[0012] Thirdly, a second flexible substrate is provided, the second flexible substrate including at least two sets of fourth connection terminals, a set of fifth connection terminals, and a set of sixth connection terminals; wherein, the terminals on the fourth connection terminals are connected to the terminals on the fifth connection terminals through lines on the second flexible substrate, and the terminals on the fourth connection terminals are bonded to the terminals of the fan-out lines of a touch panel; the terminals on the fifth connection terminals are connected to a first COF, wherein the first COF includes a first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate includes at least one set of first connection terminals and a set of third connection terminals, wherein the terminals on the first connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, the terminals of the fan-out lines of the display panel are bonded to the terminals on the first connection terminals, the terminals on the third connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, and the terminals on the third connection terminals are bonded to the terminals of the fifth connection terminals; the terminals on the sixth connection terminals are connected to the terminals on the fifth connection terminals through lines on the second flexible substrate, and the terminals on the sixth connection terminals are electrically connected to a driving circuit board. In this design, the display panel only has a display function, and the touch panel is externally mounted on the display panel. The second flexible substrate connects the first COF to the driving circuit board, and the structure of the first COF can refer to the first COF described in the first aspect above. Furthermore, the terminals of the fan-out lines of the touch sensor's driving circuit in the touch panel are bonded to the terminals on the fourth connection terminal on the second flexible substrate, and the terminals on the fourth connection terminal are connected to the terminals of the fifth connection terminal through the lines on the second flexible substrate. The terminals of the third connection terminal on the first COF are bonded to the terminals of the fifth connection terminal on the second flexible substrate, thus connecting the fan-out lines of the touch sensor's driving circuit in the touch panel to the first chip. Moreover, this first chip connects both the touch panel and the display panel, and therefore can be a TDDI IC. The terminals on the sixth connection terminal are connected to the terminals on the fifth connection terminal through the lines on the second flexible substrate, and the terminals on the sixth connection terminal are electrically connected to the driving circuit board, thereby realizing the connection between the first chip and the driving circuit board.

[0013] In one possible implementation, a touch panel is disposed on the back of the display panel, and the display area of ​​the display panel includes a pixel array, wherein a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel; at least one set of second connection terminals is disposed on the display panel, the second connection terminals including terminals of multiple fan-out lines of the display panel, wherein a first flexible substrate is disposed on the back of the touch panel, and a set of second connection terminals is bent to the back of the touch panel and correspondingly connected to a set of first connection terminals.

[0014] In one possible implementation, the pixel unit includes a pixel circuit, and the driving lines of the pixel unit include scan lines and data lines connected to the pixel circuit.

[0015] In one possible implementation, the touch panel includes a touch sensor array, wherein a drive line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of seventh connection terminals, each seventh connection terminal including terminals of a plurality of fan-out lines of the touch panel, wherein the second flexible substrate is disposed on the back side of the touch panel, and one set of the seventh connection terminals is bent to the back side of the touch panel and correspondingly connected to a set of the fourth connection terminals.

[0016] In one possible implementation, the driving circuitry for the touch sensor includes input channel traces and output channel traces connected to the touch sensor.

[0017] Fourthly, a second flexible substrate is provided, on which a second chip is disposed. The second flexible substrate includes at least two sets of fourth connection terminals and one set of sixth connection terminals. The terminals on the fourth connection terminals are electrically connected to the pins of the second chip via lines on the second flexible substrate, and the terminals on the fourth connection terminals are bonded to the terminals of the fan-out lines of a touch panel. The terminals on the sixth connection terminals are electrically connected to the pins of the second chip via lines on the second flexible substrate, and the terminals on the sixth connection terminals are electrically connected to a driving circuit board. In this solution, since the touch panel is externally mounted on the display panel, no touch sensor is disposed on the display panel. The terminals of the fan-out lines of the driving circuit of the touch sensor in the touch panel are bonded to the terminals in the fourth connection terminals on the second flexible substrate, and connected to the second chip on the second flexible substrate via lines on the second flexible substrate. For example, the second chip can be a TPIC. Furthermore, the terminals on the sixth connection terminals are electrically connected to the pins of the second chip via lines on the second flexible substrate, and the terminals on the sixth connection terminals are electrically connected to the driving circuit board, thus realizing the connection between the second chip and the driving circuit board. In this solution, a multi-pin touch panel is connected to a driving circuit board via a second flexible substrate. The TPIC is set on the second flexible substrate. Since the structure of the touch panel (compared to the display panel) is relatively simple, the number of driving lines is relatively small, and the processing logic of the TPIC is relatively simple, the TPIC can be directly fabricated on an FPC with lower process precision requirements (compared to COF).

[0018] In one possible implementation, the second flexible substrate further includes a set of fifth connection terminals; the terminals of the fifth connection terminals are connected to the first COF, wherein the first COF includes the first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate includes at least a set of first connection terminals and a set of third connection terminals, wherein the terminals on the first connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, the terminals of the fan-out lines of the display panel are bonded to the terminals on the first connection terminals, the terminals on the third connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, and the terminals on the third connection terminals are bonded to the terminals of the fifth connection terminals; the terminals on the sixth connection terminals are electrically connected to the pins of the second chip through lines on the second flexible substrate, or the terminals on the sixth connection terminals are electrically connected to the terminals of the fifth connection terminals through lines on the second flexible substrate. In this solution, it should be noted that the specific structure of the first COF can be referred to the relevant description in the second aspect. In this solution, the first COF connected to the display panel and the touch panel share the second flexible substrate connected to the driving circuit board.

[0019] In one possible implementation, the touch panel is disposed on the back of the display panel, the display area of ​​the display panel includes a pixel array, wherein a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel; the display panel is provided with at least one set of second connection terminals, the second connection terminals including terminals of multiple fan-out lines of the display panel, wherein the first flexible substrate is disposed on the back of the touch panel, and a set of second connection terminals is bent to the back of the touch panel and correspondingly connected to a set of first connection terminals.

[0020] In one possible implementation, the pixel unit includes a pixel circuit, and the driving lines of the pixel unit include scan lines and data lines connected to the pixel circuit.

[0021] In one possible implementation, the touch panel includes a touch sensor array, wherein a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of seventh connection terminals, each seventh connection terminal including terminals of a plurality of fan-out lines of the touch panel, wherein the second flexible substrate is disposed on the back side of the touch panel, and one set of the seventh connection terminals is bent to the back side of the touch panel and correspondingly connected to a set of the fourth connection terminals.

[0022] In one possible implementation, the driving circuitry of the touch sensor includes input channel traces and output channel traces connected to the touch sensor.

[0023] Fifthly, a display screen is provided, including a display panel and the first crystalline thin film COF as described in the second aspect.

[0024] A sixth aspect provides a display screen including a touch panel provided in the first aspect and a second flexible substrate as provided in the third or fourth aspect.

[0025] In a seventh aspect, a display screen is provided, including a touch panel and a first crystalline thin film COF provided in a second aspect.

[0026] Eighthly, an electronic device is provided, including any of the displays and driving circuit boards provided in the fifth to seventh aspects, wherein the displays are connected to the driving circuit boards.

[0027] The fifth, sixth, seventh, and eighth aspects have the same technical effects as the first crystalline thin film COF or the second flexible substrate provided in the foregoing embodiments, and will not be described again here. Attached Figure Description

[0028] Figure 1 A schematic diagram of the structure of a display panel provided for an embodiment of this application;

[0029] Figure 2 A schematic diagram of the structure of a display panel is provided for another embodiment of this application;

[0030] Figure 3 A schematic diagram of the structure of an electronic device provided for an embodiment of this application;

[0031] Figure 4 A schematic diagram of the external structure of a smartwatch provided for an embodiment of this application;

[0032] Figure 5 A schematic diagram of the structure of a display screen provided for an embodiment of this application;

[0033] Figure 6 A schematic cross-sectional view of a display screen provided for an embodiment of this application;

[0034] Figure 7 A schematic diagram illustrating a connection method for a connector provided in an embodiment of this application;

[0035] Figure 8 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0036] Figure 9 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0037] Figure 10A schematic diagram of a COF structure provided for an embodiment of this application;

[0038] Figure 11 A schematic diagram of a cross-sectional structure of a display screen is provided for another embodiment of this application;

[0039] Figure 12 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0040] Figure 13 A schematic cross-sectional view of a display screen is provided as another embodiment of this application;

[0041] Figure 14 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0042] Figure 15 A schematic diagram of the structure of a touch panel provided for an embodiment of this application;

[0043] Figure 16 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0044] Figure 17 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0045] Figure 18 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0046] Figure 19 A schematic diagram of a cross-sectional structure of a display screen is provided for another embodiment of this application;

[0047] Figure 20 A schematic diagram of an FPC structure provided for an embodiment of this application;

[0048] Figure 21 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0049] Figure 22 A schematic cross-sectional view of a display screen is provided as another embodiment of this application;

[0050] Figure 23 A schematic diagram of an FPC structure is provided for another embodiment of this application;

[0051] Figure 24 A schematic diagram of the structure of a display screen is provided for another embodiment of this application;

[0052] Figure 25 A schematic diagram of the structure of a display panel is provided for another embodiment of this application;

[0053] Figure 26 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0054] Figure 27 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0055] Figure 28 A schematic diagram of the structure of a display panel is provided for another embodiment of this application;

[0056] Figure 29 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0057] Figure 30 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0058] Figure 31 A schematic diagram of the structure of a display panel is provided for another embodiment of this application;

[0059] Figure 32 A schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0060] Figure 33 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application. Detailed Implementation

[0061] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0062] In the following description, the terms "first," "second," etc., are used for descriptive convenience only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "at least one" means one or more, and "more than" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0063] Furthermore, in the embodiments of this application, "upper," "lower," "left," and "right" are not limited to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0064] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "electrical connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium.

[0065] The implementation of this embodiment will now be described in detail with reference to the accompanying drawings.

[0066] The flexible substrate, crystalline thin film COF, and display screen provided in this application embodiment can be applied to electronic devices such as mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, netbooks, personal digital assistants (PDAs), wearable electronic devices, and virtual reality devices. This application embodiment does not impose any limitations on these applications, but is particularly applicable to smartwatches, advertising display devices, vehicle display devices, etc., with circular, curved, or other irregularly shaped display interfaces.

[0067] For example, Figure 3 A schematic diagram of the structure of the electronic device 100 is shown.

[0068] Electronic device 100 may include processor 110, external memory interface 120, internal memory 121, universal serial bus (USB) interface 130, charging management module 140, power management module 141, battery 142, antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, sensor module 180, camera 193, and display screen 194, etc.

[0069] It is understood that the structures illustrated in the embodiments of the present invention do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0070] Processor 110 may include one or more processing units, such as application processors (APs), modem processors, graphics processing units (GPUs), image signal processors (ISPs), controllers, video codecs, digital signal processors (DSPs), baseband processors, and / or neural network processing units (NPUs). These different processing units may be independent devices or integrated into one or more processors.

[0071] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0072] In some embodiments, the processor 110 may include one or more interfaces. Interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0073] The charging management module 140 receives charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 receives charging input from the wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 receives wireless charging input via the wireless charging coil of the electronic device 100. While charging the battery 142, the charging management module 140 can also supply power to the electronic device via the power management module 141.

[0074] The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, providing power to the processor 110, internal memory 121, display screen 194, camera 193, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). In some other embodiments, the power management module 141 may also be located within the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may be located in the same device.

[0075] The wireless communication function of electronic device 100 can be realized through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor and baseband processor, etc.

[0076] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover one or more communication frequency bands. Different antennas can also be multiplexed to improve antenna utilization. For example, antenna 1 can be multiplexed as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with tuning switches.

[0077] The mobile communication module 150 can provide solutions for wireless communication, including 2G / 3G / 4G / 5G, applied to the electronic device 100. The mobile communication module 150 may include one or more filters, switches, power amplifiers, low-noise amplifiers (LNAs), etc. The mobile communication module 150 can receive electromagnetic waves via the antenna 1, and perform filtering, amplification, and other processing on the received electromagnetic waves before transmitting them to the modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via the antenna 1. In some embodiments, at least some functional modules of the mobile communication module 150 may be housed in the processor 110. In some embodiments, at least some functional modules of the mobile communication module 150 and at least some modules of the processor 110 may be housed in the same device.

[0078] The modem processor may include a modulator and a demodulator. The modulator modulates the low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through an audio device (not limited to speaker 170A, receiver 170B, etc.) or displays images or videos through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0079] The wireless communication module 160 can provide solutions for wireless communication applications on the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating one or more communication processing modules. The wireless communication module 160 receives electromagnetic waves via antenna 2, performs frequency modulation and filtering of the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, perform frequency modulation and amplification, and convert them into electromagnetic waves for radiation via antenna 2.

[0080] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, enabling electronic device 100 to communicate with networks and other devices via wireless communication technology. The wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies, etc. The GNSS may include the Global Positioning System (GPS), the Global Navigation Satellite System (GLONASS), the BeiDou Navigation Satellite System (BDS), the Quasi-Zenith Satellite System (QZSS), and / or satellite-based augmentation systems (SBAS).

[0081] Electronic device 100 implements display functions through a GPU, a display screen 194, and an application processor. The GPU is a microprocessor for image processing, connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. Processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0082] Display screen 194 is used to display images, videos, etc. Display screen 194 includes a display panel. The display panel may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a miniature LED, a microLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, electronic device 100 may include one or N displays 194, where N is a positive integer greater than 1. In the embodiments of this application, the display panel can be a flexible panel. The display panel provided in the embodiments of this application is not limited to display panels based on low temperature poly-silicon (LTPS, where poly-silicon is abbreviated as p-Si) technology, but is also applicable to display panels based on low temperature polycrystalline oxide (LTPO) technology. Since the pixel unit based on LTPO integrates two types of thin film transistor (TFT) devices, LTPS and Oxide, where Oxide TFT is an NMOS structure and LTPS TFT is a PMOS structure, the gates of both need to be connected to their respective independent scan lines for control. Therefore, the pixel unit of LTPO will be connected to more scan lines (compared to the pixel unit of LTPS technology), thus requiring a narrower bezel.

[0083] Electronic device 100 can perform shooting functions through ISP, camera 193, video codec, GPU, display 194 and application processor.

[0084] The ISP (Image Signal Processor) is used to process data fed back from the camera 193. For example, when taking a picture, the shutter is opened, and light is transmitted through the lens to the camera's photosensitive element. The light signal is converted into an electrical signal, and the camera's photosensitive element transmits the electrical signal to the ISP for processing, transforming it into an image visible to the naked eye. The ISP can also perform algorithmic optimization of image noise, brightness, and skin tone. The ISP can also optimize parameters such as exposure and color temperature of the shooting scene. In some embodiments, the ISP can be set in the camera 193.

[0085] Camera 193 is used to capture still images or videos. An object is projected onto a photosensitive element by generating an optical image through the lens. The photosensitive element can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then passed to an ISP for conversion into a digital image signal. The ISP outputs the digital image signal to a DSP for processing. The DSP converts the digital image signal into image signals in standard RGB, YUV, or other formats. In some embodiments, the electronic device 100 may include one or N cameras 193, where N is a positive integer greater than 1.

[0086] The external storage interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, music, video, and other files can be saved on the external memory card.

[0087] Internal memory 121 can be used to store one or more computer programs, which include instructions. Processor 110 can execute the instructions stored in internal memory 121, thereby causing electronic device 100 to perform the methods provided in some embodiments of this application, as well as various functional applications and data processing. Internal memory 121 may include a program storage area and a data storage area. The program storage area may store the operating system; it may also store one or more applications (such as a gallery, contacts, etc.). The data storage area may store data created during the use of electronic device 101 (such as photos, contacts, etc.). Furthermore, internal memory 121 may include high-speed random access memory and non-volatile memory, such as one or more disk storage devices, flash memory devices, universal flash storage (UFS), etc. In other embodiments, processor 110 executes instructions stored in internal memory 121 and / or instructions stored in memory disposed within the processor, causing electronic device 100 to perform the methods provided in embodiments of this application, as well as various functional applications and data processing.

[0088] Electronic device 100 can implement audio functions, such as music playback and recording, through audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, and application processor.

[0089] The audio module 170 is used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. The audio module 170 can also be used for encoding and decoding audio signals. In some embodiments, the audio module 170 may be located in the processor 110, or some functional modules of the audio module 170 may be located in the processor 110.

[0090] The speaker 170A, also known as a "loudspeaker," is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music or make hands-free calls through the speaker 170A.

[0091] The receiver 170B, also known as the "earpiece," is used to convert audio electrical signals into sound signals. When the electronic device 100 answers a telephone call or voice message, the receiver 170B can be brought close to the ear to listen to the voice.

[0092] Microphone 170C, also known as a "microphone" or "voice transducer," is used to convert sound signals into electrical signals. When making a phone call or sending a voice message, the user can speak by bringing their mouth close to microphone 170C, inputting the sound signal into microphone 170C. Electronic device 100 may have one or more microphones 170C. In some embodiments, electronic device 100 may have two microphones 170C, which, in addition to collecting sound signals, can also perform noise reduction. In other embodiments, electronic device 100 may have three, four, or more microphones 170C, which can collect sound signals, reduce noise, identify the sound source, and perform directional recording, etc.

[0093] The 170D headphone jack is used to connect wired headphones. The 170D headphone jack can be a USB 130 interface or a 3.5mm Open Mobile Terminal Platform (OMTP) standard interface, a CTIA (Cellular Telecommunications Industry Association of the USA) standard interface.

[0094] The sensor module 180 may include pressure sensors, gyroscope sensors, barometric pressure sensors, magnetic sensors, accelerometers, distance sensors, proximity sensors, fingerprint sensors, temperature sensors, touch sensors, ambient light sensors, bone conduction sensors, etc.

[0095] In the embodiments of this application, a touch sensor, also referred to as a "touch device," is used. The touch sensor can be disposed on the display screen 194, and the touch sensor and the display screen 194 together form a touch screen, also referred to as a "touchscreen." The touch sensor is used to detect touch operations applied to or near it. The touch sensor can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through the display screen. In other embodiments, a touch panel with a touch sensor array formed by multiple touch sensors can be disposed externally on the surface of the display panel. In other embodiments, the touch sensor may be located in a different position from the display screen 194. The form of the touch sensor is not limited in the embodiments of this application; for example, it can be a capacitor or a varistor.

[0096] In addition, the aforementioned electronic device may also include one or more components such as buttons, motors, indicators, and a subscriber identification module (SIM) card interface; this application embodiment does not impose any limitations on this.

[0097] Reference Figure 4 As shown, taking a round smartwatch display as an example, the display 194 is typically located between the outer frame 41 and the bottom cover of the watch. Figure 4 (not shown in the image) between. Figure 5 , Figure 6 As shown, the display screen includes a display panel 51, which includes a display area (AA) and a non-display area (bezel) surrounding the display area AA. The display area AA includes a pixel array consisting of multiple pixel units arranged in an array. Furthermore, the display area AA includes crisscrossing drive lines, including scan lines (SCAN) and data lines (DATA). Pixel units are located at the intersection of scan lines (SCAN) and data lines (DATA), and each pixel unit is connected to one data line (DATA) and at least one scan line (SCAN). The display screen also includes a COF 52 and a flexible printed circuit (FPC) 53.

[0098] In this configuration, a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel 51. The display panel 51 is provided with a connection terminal 511, which includes terminals (pins) of multiple fan-out lines of the display panel 51. COF 52 and FPC 53 are located on the back of the display panel 51, and the connection terminal 511 of the display panel 51 is bent to the back of the display panel 51 and connected to the connection terminal 521 of COF 52. For example... Figure 7The diagram illustrates the connection method between the connection terminal 511 of the display panel 51 and the connection terminal 521 of the COF 52. FOF (film-on-film) technology can be used to bond the terminals of connection terminal 511 and connection terminal 521 one-to-one. For example, terminals 5111 and 5211 are bonded together, and the other terminals of connection terminal 511 and connection terminal 521 are sequentially bonded together in a one-to-one manner, thereby achieving anisotropic conductive film bonding between the connection terminal 511 of the display panel 51 and the connection terminal 521 of the COF 52. Unless otherwise specified, the connection method mentioned in the following scheme refers to the bonding connection where the terminals of two interconnected connection terminals are bonded together.

[0099] In addition, a display driver circuit 522 is provided on the COF52, which can be a display driver integrated circuit (DDIC). In this case, the terminals of the connection terminal 521 of the COF52 are electrically connected to the pins of the DDIC through the lines on the COF52. The connection terminal 523 of the COF52 is bonded to the connection terminal 531 of the FPC53, and the terminals of the connection terminal 523 of the COF52 are electrically connected to the pins of the DDIC. Another set of connection terminals 532 of the FPC53 is connected to the printed circuit board (PCB) through a connector, and the terminals of the connection terminal 531 of the FPC53 are connected to the terminals of the other set of connection terminals 532 through the lines on the FPC53. The printed circuit board (PCB) (or driver circuit board, driver system board) is equipped with an application processor (AP) (e.g., CPU), a power management chip (power IC), etc. The printed circuit board, COF52, and FPC52 are all located between the outer frame 41 of the watch and the bottom cover on the back of the display panel.

[0100] In this way, the AP provides display data to the DDIC and display panel 51 to display actual image information; the power IC provides operating voltage to the DDIC and display panel 51. The FPC 53 provides a signal transmission connection path between the PCB and the DDIC. The DDIC is responsible for receiving signals transmitted from the PCB and delivering them to the display panel 51 according to a specific timing control. For example, the display data output by the AP, after passing through the DDIC, is converted into a scan signal and data voltage Vdata and transmitted to the pixel units coupled to each drive line to drive the pixel units to emit light.

[0101] The above Figure 5This paper mainly introduces the working principle of a single-ended pin display panel 51 (i.e., a display panel with only one set of connection terminals 511). Such a display panel 51 suffers from the problems mentioned in the background art, where the size of the bottom bezel of the screen is severely limited. In another embodiment of this application, as... Figure 8 As shown, a multi-pin display panel 81 is provided. The display area AA of the display panel 81 includes a pixel array, wherein a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel 81; the display panel 81 is provided with at least two sets of connection terminals. Figure 8 Taking three sets of connection terminals as an example, connection terminals 811, 812, and 813 are specifically shown; the connection terminals (811, 812, and 813) include terminals for multiple fan-out lines of the display panel 81. Based on the above description, when the display panel 81 does not have touch functionality, the pixel unit includes a pixel circuit, and the driving circuit includes a scan line (SCAN) and a data line (DATA) connected to the pixel circuit.

[0102] In order to provide the display panel 81 with signals such as display data and operating voltage, embodiments of this application provide a COF91, referring to... Figure 9 , Figure 10 as well as Figure 11 ( Figure 11 for Figure 9 As shown in the structural schematic diagram at section B-B', COF91 includes: a flexible substrate FPC916; a chip 914 disposed on the flexible substrate FPC916; the flexible substrate FPC916 includes at least two sets of connection terminals, wherein... Figure 9 , Figure 10 as well as Figure 11 The diagram shows three sets of connection terminals (911, 912, 913); the terminals on the connection terminals (911, 912, 913) are electrically connected to the pins of the chip 914 through the lines on the flexible substrate FPC916, and the terminals of the fan-out lines of the display panel 81 are bonded to the terminals on the connection terminals (911, 912, 913) of the COF91.

[0103] As described above, the connection terminals (811, 812, and 813) of the display panel 81 are connected one-to-one with the connection terminals (911, 912, and 913) of the COF91. The flexible substrate 916 of the COF91 also includes a connection terminal 915, wherein the terminals on the connection terminal 915 are electrically connected to the pins of the chip 914 through lines on the flexible substrate 916. The terminals of the connection terminal 915 are bonded to the terminals of the flexible substrate FPC92, and the terminals of the flexible substrate FPC92 are electrically connected to the driving circuit board. The connection method between the driving circuit board and the COF91 can be referred to the above description. Figure 5The connection method between the PCB and the COF52 will not be elaborated here. (As mentioned above...) Figure 8 , Figure 9 , Figure 10 as well as Figure 11 In the example shown, since the display panel 81 only has a display function, the chip 914 can be used to implement the display driving function of the display panel, for example, the chip 914 adopts DDIC.

[0104] In another example, the display panel can also have touch functionality; for example, the touch sensor can be integrated into the pixel unit of the display panel, so that the pixel unit also includes the touch sensor, such as... Figure 12 The display panel 81-a shown has driving circuitry including input channel trace Rx and output channel trace Tx connected to the touch sensor. For example... Figure 13 As shown, this allows for the integration of a display panel with an on-cell TP (touch panel, where the touch sensor is integrated into the pixel unit of the display panel). In this example, one or all of the connection terminals (811, 812, and 813) of the display panel 81-a contain terminals for fan-out lines connected to Rx or Tx; some or all of the connection terminals (911, 912, and 913) of the COF91 contain terminals bonded to the terminals of the fan-out lines of Rx or Tx. When using... Figure 12 When displaying the display panel, chip 914 needs to have the functions of display driving and touch control of the display panel. At this time, chip 914 can be a touch and display driver integration IC (TDDI IC) that integrates DDIC and TP IC.

[0105] In another example, the touch panel can be externally mounted on the back of the display panel. To work with the display panel, the effective touch area of ​​the touch panel typically overlaps with the display area AA of the display panel. The touch panel 21 includes a touch sensor array consisting of multiple touch sensors arranged in an array, see reference... Figure 14 As shown, the touch panel 21 of the display screen also includes crisscrossing drive lines, which include input channel traces Rx and output channel traces Tx connected to the touch sensor. The touch sensor is located at the intersection of Rx and Tx, and one touch sensor is connected to one Rx and one Tx. The display screen also includes COF 22 and flexible substrate FPC 23.

[0106] like Figure 14As shown, a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel 21. The touch panel 21 has a connection terminal 211, which includes terminals of multiple fan-out lines. The COF 22 and flexible substrate FPC 23 are disposed on the back of the touch panel 21, and the connection terminal 211 is bent to the back of the touch panel 21 and connected to the connection terminal 221 of the COF 22. The connection method between the connection terminal 211 of the touch panel 21 and the connection terminal 221 of the COF 22 can be referred to... Figure 7 The connection method between the connection terminal 511 of the display panel 51 and the connection terminal 521 of the COF 52 will not be described here.

[0107] In addition, a touch driver circuit 222 is provided on the COF22, which can be a touch panel integrated circuit (TPIC). In this case, the terminals in the connection terminal 221 of the COF22 are electrically connected to the pins of the TPIC through the lines on the COF22. The connection terminal 223 of the COF22 is bonded to the connection terminal 231 of the FPC23, and the terminals of the connection terminal 223 of the COF22 are electrically connected to the pins of the TPIC. Another set of connection terminals 232 of the FPC23 is connected to the printed circuit board (PCB) through a connector, and the terminals of the connection terminal 231 of the FPC23 are connected to the terminals of the other set of connection terminals 232 through the lines on the FPC23. An application processor (AP) (such as a CPU) is mounted on the PCB (or driver circuit board, driver system board). The PCB, COF22, and FPC22 are all located between the outer frame 41 and the bottom cover of the watch on the back of the touch panel 21.

[0108] In this way, the AP provides an initial signal to the touch sensor of the touch panel 21 via the TPIC (e.g., transmitting the initial signal to the touch sensor via Rx), and when a touch event occurs at the touch sensor, it detects the touch signal generated by the corresponding touch sensor via the TPIC (e.g., the touch sensor transmits the touch signal via Tx). The FPC 23 provides a signal transmission connection path between the PCB and the TPIC. The TPIC is responsible for receiving the signals transmitted by the PCB and transmitting the signals to the touch sensor of the touch panel 21 according to a specific timing control, and for receiving the touch signals generated by the touch sensor.

[0109] The above Figure 14 This paper mainly introduces the working principle of a single-ended pin-type touch panel (i.e., a touch panel with only one set of connection terminals 211). Such a touch panel suffers from a severe limitation in the narrowing of the bottom bezel of the screen (where the connection terminals 211 are located). In another embodiment of this application, as... Figure 15 As shown, a multi-pin touch panel 31 is provided. The touch panel 31 includes a touch sensor array, wherein one driving line of any touch sensor in the touch sensor array is connected to one fan-out line of the touch panel 31; the touch panel 31 is provided with at least two sets of connection terminals. Figure 16 The diagram illustrates connection terminals 311 and 312 as examples. Connection terminals (311, 312) include terminals for multiple fan-out lines of the touch panel 31. Based on the above description, the driving circuitry of the touch panel 31 includes input channel traces Rx and output channel traces Tx connected to the touch sensor. Multiple connection terminals (311, 312) are provided on the touch panel 31. This allows the driving circuitry of the touch panel to be connected to terminals in different connection terminals via fan-out lines. By evenly distributing terminals in each connection terminal, the width of the connection terminals can be reduced, thereby further reducing the bezel size and increasing the screen-to-body ratio. Furthermore, the reduced bezel size also helps to decrease the maximum outer diameter of the touch panel, saving installation space in the entire electronic device.

[0110] In order to provide an initial signal to the touch panel 31 and receive touch signals from the touch panel 31, embodiments of this application provide a COF 32, referring to... Figure 16 As shown, COF32 includes: a flexible substrate FPC324; a chip 323 disposed on the flexible substrate FPC324; the flexible substrate FPC324 includes at least two sets of connection terminals, wherein... Figure 16 Two sets of connection terminals (321, 322) are shown in the figure; the terminals on the connection terminals (321, 322) are electrically connected to the pins of the chip 323 through the lines on the flexible substrate FPC324, and the terminals of the fan-out lines of the touch panel 31 are bonded to the terminals on the connection terminals (321, 322).

[0111] Specifically, the connection terminals (311, 312) of the touch panel 31 are connected one-to-one with the connection terminals (321, 322) of the COF 32. The flexible substrate FPC 324 of the COF 32 also includes another connection terminal 325, wherein the terminals on this other connection terminal 325 are electrically connected to the pins of the chip 323 via lines on the flexible substrate FPC 324. The terminals of the other connection terminal 325 are bonded to the terminals of the flexible substrate FPC 33, and the terminals of the flexible substrate 33 are electrically connected to the driver circuit board. The connection method between the driver circuit board and the COF 32 can be referred to the above. Figure 14 The connection method between the drive circuit board and COF22 will not be described here.

[0112] Reference Figure 17 As shown, a display screen is provided, which includes a display panel 81 and a touch panel externally mounted on the back of the display panel. Figure 17(not shown in the image), in this scheme, it can be directly... Figure 9 The provided solution includes display panel 81, COF91, and PCB92, and Figure 16 The provided solution integrates a touch panel 31, a COF 32, and an FPC 33, combining the touch panel ( Figure 17 (Not shown) is attached to the back of the display panel 81, and COF91, PCB92, COF32 and FPC33 are disposed on the back of the touch panel.

[0113] In addition, in another implementation, refer to Figure 18 , Figure 19 (in Figure 19 yes Figure 18 (Structural diagram at section B-B') Figure 20 As shown, a display screen is provided, which includes a display panel 81 and a touch panel 31 externally attached to the back of the display panel 81. In this solution, the connection terminals (311, 312) of the touch panel 31 can be directly bound to the FPC 92.

[0114] like Figure 18 As shown, a flexible substrate FPC92 is provided, including at least two sets of connection terminals (923, 924) connected to the connection terminals (311, 312) of the touch panel 31, a set of connection terminals 921 connected to the COF91, and a set of connection terminals (such as...) connected to the driver circuit board. Figure 20 The connection terminal 922 is shown. Figure 20 As shown, the terminals on the connection ends (923, 924) of the flexible substrate FPC92 are connected to the terminals on the connection end 921 via lines on the flexible substrate FPC92. Figure 18 As shown, the terminals on the connecting ends (923, 924) are... Figure 15 The terminal bonding of the fan-out lines of the touch panel 31 is shown; the connection terminal 921 of the flexible substrate FPC 92 is connected to the connection terminal 915 of the COF 91 (the connection method between the connection terminal 921 and the connection terminal 915 can be referred to the above). Figure 5 The connection method between connector 523 and connector 531 will not be described here. It should be noted that the specific structure of COF91 can be found in [reference needed]. Figure 9 Description of related embodiments, wherein the scheme is related to Figure 9 The difference is that, Figure 9In the example shown, the fan-out terminals of the drive circuit of the touch sensor in the touch panel 31 are directly bonded to the terminals (911, 912, 913) of the COF91 connection terminal, thereby realizing the connection between the touch sensor and the chip 914 (TDDI). In this solution, the fan-out terminals of the drive circuit of the touch sensor in the touch panel 31 are bonded to the terminals (923, 924) on the flexible substrate FPC92, and connected to the terminals of the COF91 connection terminal 915 through the circuit on the flexible substrate FPC92, thereby realizing the connection between the touch sensor and the chip 914 (TDDI) through the connection terminal 915 of the COF91 connection terminal.

[0115] In another implementation, refer to Figure 21 As shown, a display screen is provided, which includes a display panel 81 and a touch panel 31 externally attached to the back of the display panel 81. In this solution, the connection end of the touch panel 31 can be directly bonded to the flexible substrate FPC 92.

[0116] like Figure 21 , Figure 22 ( Figure 22 for Figure 21 (Structural diagram of the cross-section at C-C') Figure 23 As shown, an FPC92 is provided, on which a chip 925 is disposed; the FPC92 includes at least two sets of connection terminals (923, 924) connected to the connection terminals (311, 312) of the touch panel 31, a set of connection terminals 921 connected to the COF91, and a set of connection terminals (e.g., ...) connected to the driver circuit board. Figure 23 (See connection terminal 922). The terminals on connection terminals (923, 924) are electrically connected to the pins of chip 925 via lines on FPC92, such as... Figure 21 As shown, the terminals on the connecting ends (923, 924) are... Figure 15 The terminal bonding of the fan-out lines of the touch panel 31 is shown; the connection terminal 921 of the flexible substrate FPC 92 is connected to the connection terminal 915 of the COF 91 (the connection method between the connection terminal 921 and the connection terminal 915 can be referred to the above). Figure 5 The connection method between connector 523 and connector 531 will not be described here. The terminals on connector 922 are electrically connected to the pins of chip 925 via lines on FPC92, or the terminals on connector 922 are connected via lines on FPC92 (where this part of the line directly connects to...). Figure 23 The portion of the chip 925 shown (passing underneath but not electrically connected to the chip 925) is electrically connected to the terminal of connection 921; the terminal on connection 922 is electrically connected to the drive circuit board. It should be noted that the specific structure of COF91 can be found in [reference needed]. Figure 9 Description of related embodiments, wherein the scheme is related to Figure 9 The difference is that, Figure 9 In the example shown, the fan-out terminals of the drive circuit of the touch sensor in the touch panel 31 are directly bonded to the terminals (911, 912, 913) of the COF91, thereby realizing the connection between the touch sensor and the chip 914 (TDDI). In this solution, since the touch panel 31 is externally mounted on the display panel, no touch sensor is set on the display panel. The chip 914 on the COF91 is a DDIC. The terminals of the fan-out terminals of the drive circuit of the touch sensor in the touch panel 31 are bonded to the terminals (923, 924) of the flexible substrate FPC92, and connected to the chip 925 on the FPC92 through the lines on the flexible substrate FPC92. The chip 925 can be a TPIC.

[0117] like Figure 24 As shown, an FPC 41 is provided, on which a chip 413 is disposed; the FPC 41 includes at least two sets of connection terminals (411, 412) connected to the connection terminals (311, 312) of the touch panel 31, and a set of connection terminals connected to the driver circuit board. Figure 24 (Not shown). The terminals on the connection points (411, 412) are electrically connected to the pins of chip 413 via lines on FPC41, such as... Figure 24 As shown, the terminals on the connecting ends (411, 412) are... Figure 15 The terminals of the fan-out circuit of the touch panel 31 shown are bonded; the terminals on the connection terminal connected to the driver circuit board are electrically connected to the pins of the chip 413 through the lines on the FPC 41. In this solution, since the touch panel 31 is externally mounted on the display panel, no touch sensor is provided on the display panel. The terminals of the fan-out circuit of the drive circuit of the touch sensor in the touch panel 31 are bonded to the terminals in the connection terminals (411, 412) on the flexible substrate FPC 41, and connected to the chip 413 on the FPC 41 through the lines on the flexible substrate FPC 41. The chip 413 can be a TPIC. Figure 24 As shown, the display screen using the FPC41 and touch panel 31 may also include display panel 81, COF91, and FPC91. The specific structure of COF91 can be found in [reference needed]. Figure 9 In the description of the relevant embodiments, the chip 914 on the COF91 is a DDIC, and the connection terminal 921 of the flexible substrate FPC91 is connected to the connection terminal 915 of the COF91 (the connection method between the connection terminal 921 and the connection terminal 915 can be referred to the above). Figure 5 The connection method between connector 523 and connector 531 will not be described in detail here. Figure 21The difference in the embodiments is that the COF91 and the touch panel 31 can be connected to the driver circuit board through their respective FPCs. In this solution, a multi-pin touch panel is provided to be directly connected to the driver circuit board through the FPC41, where the TPIC is set on the FPC41. Since the structure of the touch panel is relatively simple (compared to the display panel), the number of drive lines of the touch panel (compared to the display panel) is relatively small, and the processing logic of the TPIC is relatively simple, the precision requirements of the manufacturing process of the TPIC are relatively low compared to DDIC (or TDDI IC), and the TPIC can be directly manufactured on the FPC with lower process precision requirements (compared to COF).

[0118] Furthermore, based on the aforementioned multi-pin display panel, since the display panel includes multiple connection terminals, the number of these connection terminals can be designed according to the principle of minimizing the bezel, or they can be placed at any position on the display panel. For example, for a circular display panel, in order to improve the symmetry of the display area and installation space, multiple connection terminals can be evenly arranged around the display panel.

[0119] Currently, when a regular flat panel display is installed on the front casing of a smartwatch, its cross-sectional view is as follows: Figure 25 As shown, the arc-shaped portion raised at the edge of the front shell ( Figure 25 The portion within the dashed box (where images are typically not displayed) is used to maximize the display area by utilizing the space of the curved raised portion within the dashed box. Figure 26 As shown, the display panel can typically extend to the curved portion. For circular curved screens, the display panel is as follows... Figure 26 , Figure 27 As shown, the display screen has a curved structure at the bezel to display images. If the display panel has a regular shape, such as a circle, ... Figure 28 As shown. During the installation process of assembling the display panel into the electronic device, the bezel needs to be bent at a certain angle towards the back of the display panel to form a corresponding... Figure 27 The curved structure of the display panel causes wrinkles at the edges, affecting the display effect. Therefore, the unfolded shape of the display panel is usually designed as follows: Figure 29 As shown, protruding display blocks surround the display panel, each containing an effective display area. These display blocks are typically not directly connected to each other, as required by the curved screen design. The display blocks can be trapezoidal, triangular, or semi-circular, etc. Figure 29 Taking a semi-circle as an example, this is how the display area is bent at a certain angle towards the back of the display panel to cover the bezel area of ​​the curved screen, forming a shape like... Figure 31The display shown allows adjacent display blocks to be connected together after the display area is bent, or the distance between adjacent display blocks becomes smaller relative to the unfolded shape of the display panel. This ensures a high screen-to-body ratio for the curved screen while preventing wrinkles from appearing at the edges of the display panel. However, for display panels with single-ended pins, such as... Figure 29 As shown, it typically contains only one set of connectors. Therefore, when the connector is large, and when it is folded behind the display panel to connect to the COF, the distance between adjacent display blocks on both sides of the connector is relatively large. Figure 30 As shown, when this display panel is assembled into a display screen, the display blocks are not evenly distributed on the display screen (e.g., Figure 31 As shown, a large display gap appears at the corresponding position of the connection end, affecting the display effect. However, when using the multi-pin output display panel provided in the embodiments of this application, as... Figure 32 As shown, taking five connection terminals as an example, since a multi-pin display panel can reduce the size of the connection terminals, the connection terminals can be evenly distributed among the various display blocks. This is how... Figure 33 As shown, when this display panel is assembled into a display screen, the display blocks are evenly distributed on the display screen, resulting in a good display effect.

[0120] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A second flexible substrate, characterized in that, The second flexible substrate includes at least two sets of fourth connection terminals, one set of fifth connection terminals, and one set of sixth connection terminals; The terminal on the fourth connection end is connected to the terminal on the fifth connection end through the lines on the second flexible substrate, and the terminal on the fourth connection end is bonded to the terminal of the fan-out line of the touch panel. The fifth connection terminal is connected to the first COF, wherein the first COF includes a first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate includes at least one set of first connection terminals and one set of third connection terminals, wherein the terminals on the first connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, the terminals of the fan-out lines of the display panel are bonded to the terminals on the first connection terminals, the terminals on the third connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, and the terminals on the third connection terminals are bonded to the terminals of the fifth connection terminal; The terminal on the sixth connection end is connected to the terminal on the fifth connection end through the lines on the second flexible substrate, and the terminal on the sixth connection end is electrically connected to the drive circuit board.

2. The second flexible substrate according to claim 1, characterized in that, The touch panel is disposed on the back of the display panel, and the display area of ​​the display panel includes a pixel array, wherein a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel; the display panel is provided with at least one set of second connection terminals, the second connection terminals including terminals of multiple fan-out lines of the display panel, wherein the first flexible substrate is disposed on the back of the touch panel, and a set of second connection terminals is bent to the back of the touch panel and correspondingly connected to a set of first connection terminals.

3. The second flexible substrate according to claim 2, characterized in that, The pixel unit includes a pixel circuit, and the driving lines of the pixel unit include scan lines and data lines connected to the pixel circuit.

4. The second flexible substrate according to any one of claims 1-3, characterized in that, The touch panel includes a touch sensor array, wherein a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of seventh connection terminals, each seventh connection terminal including terminals of a plurality of fan-out lines of the touch panel, wherein the second flexible substrate is disposed on the back side of the touch panel, and one set of the seventh connection terminals is bent to the back side of the touch panel and correspondingly connected to one set of the fourth connection terminals.

5. The second flexible substrate according to claim 4, characterized in that, The driving circuit of the touch sensor includes input channel traces and output channel traces connected to the touch sensor.

6. A second flexible substrate, characterized in that, A second chip is disposed on the second flexible substrate; The second flexible substrate includes at least two sets of fourth connection terminals and one set of sixth connection terminals; The terminals on the fourth connection end are electrically connected to the pins of the second chip through the lines on the second flexible substrate, and the terminals on the fourth connection end are bonded to the terminals of the fan-out lines of the touch panel. The terminal on the sixth connection end is electrically connected to the pin of the second chip through the line on the second flexible substrate, and the terminal on the sixth connection end is electrically connected to the driving circuit board. The second flexible substrate also includes a set of fifth connection terminals; The fifth connection terminal is connected to the first COF, wherein the first COF includes a first flexible substrate and a first chip disposed on the first flexible substrate; the first flexible substrate includes at least one set of first connection terminals and one set of third connection terminals, wherein the terminals on the first connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, the terminals of the fan-out lines of the display panel are bonded to the terminals on the first connection terminals, the terminals on the third connection terminals are electrically connected to the pins of the first chip through lines on the first flexible substrate, and the terminals on the third connection terminals are bonded to the terminals of the fifth connection terminal; The terminal on the sixth connection terminal is electrically connected to the pin of the second chip through the lines on the second flexible substrate, or the terminal on the sixth connection terminal is electrically connected to the terminal of the fifth connection terminal through the lines on the second flexible substrate.

7. The second flexible substrate according to claim 6, characterized in that, The touch panel is disposed on the back of the display panel, and the display area of ​​the display panel includes a pixel array, wherein a driving line of any pixel unit in the pixel array is connected to a fan-out line of the display panel; the display panel is provided with at least one set of second connection terminals, the second connection terminals including terminals of multiple fan-out lines of the display panel, wherein the first flexible substrate is disposed on the back of the touch panel, and a set of second connection terminals is bent to the back of the touch panel and correspondingly connected to a set of first connection terminals.

8. The second flexible substrate according to claim 7, characterized in that, The pixel unit includes a pixel circuit, and the driving lines of the pixel unit include scan lines and data lines connected to the pixel circuit.

9. The second flexible substrate according to any one of claims 6-8, characterized in that, The touch panel includes a touch sensor array, wherein a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of seventh connection terminals, each seventh connection terminal including terminals of a plurality of fan-out lines of the touch panel, wherein the second flexible substrate is disposed on the back side of the touch panel, and one set of the seventh connection terminals is bent to the back side of the touch panel and correspondingly connected to one set of the fourth connection terminals.

10. The second flexible substrate according to claim 9, characterized in that, The driving circuit of the touch sensor includes input channel traces and output channel traces connected to the touch sensor.

11. A display screen, characterized in that, It includes a touch panel and a second flexible substrate as described in any one of claims 1-5 or as described in any one of claims 6-10.

12. The display screen according to claim 11, characterized in that, The touch panel includes a touch sensor array, and a driving line of any touch sensor in the touch sensor array is connected to a fan-out line of the touch panel; the touch panel is provided with at least two sets of second connection terminals, and the second connection terminals include terminals of multiple fan-out lines of the touch panel.

Images