A method for preparing an LED light board and an LED light board

Abstract

The present invention discloses a method for preparing an LED light board and an LED light board, wherein the preparation method comprises: bonding a temporary substrate on the light-emitting surface of an LED chip to obtain a double-layer substrate chip; welding a plurality of the double-layer substrate chips to a circuit board to obtain a light board to be processed; setting a light-isolating layer on the side walls around the double-layer substrate chip on the light board to be processed to obtain a processed light board; removing the temporary substrate on the processed light board to obtain an LED light board. When the LED light board of the present application is used, due to the obstruction of the light-isolating layer, the light generated by each LED chip can only be emitted from the front, and no side view light leakage will occur.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a method for preparing an LED light board and the LED light board. Background Art

[0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electrical energy into light and is a green energy source. With the continuous improvement of science and technology and people's living standards, the application of LED display screens has become more and more extensive. With the development of display technologies such as OLED, Mini LED, and Micro LED, LED display screens have begun to develop in the direction of multi-screen splicing.

[0003] However, most of the existing LED light panels are large-angle, all-around luminous light panels, and there is a problem of light leakage when viewed from the side after sealing. When multiple LED light panels are spliced ​​together, it will affect the integration effect, causing visual segmentation in the presented image, reducing the visual effect.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a method for preparing an LED light board and an LED light board, aiming to solve the problem of light leakage when viewed from the side when the LED light board is emitting light.

[0006] The technical solution of the present invention is as follows:

[0007] A method for preparing an LED light panel, wherein the method comprises the steps of:

[0008] Bonding a temporary substrate on the light-emitting surface of the LED chip to obtain a double-layer substrate chip;

[0009] Soldering a plurality of the double-layer substrate chips onto a circuit board to obtain a lamp board to be processed;

[0010] A light-isolating layer is arranged on the side walls around the double-layer substrate chip on the lamp board to be processed to obtain a processed lamp board;

[0011] The temporary substrate on the processed lamp board is removed to obtain an LED lamp board.

[0012] The method for preparing the LED light board, wherein the step of bonding a temporary substrate on the light-emitting surface of the LED chip to obtain a double-layer substrate chip comprises:

[0013] Providing an LED wafer with solder bumps;

[0014] Bonding a temporary substrate on a side of the LED wafer away from the soldering block to obtain a wafer to be cut;

[0015] The wafer to be cut is cut into a plurality of double-layer substrate chips.

[0016] The method for preparing the LED light board, wherein the LED wafer comprises a solder block, a light-emitting layer and a substrate stacked in sequence; the step of bonding a temporary substrate on a side of the LED wafer away from the solder block to obtain a wafer to be cut comprises:

[0017] A debonding tape is arranged on the side of the substrate facing away from the light-emitting layer, and then the temporary substrate is pasted on the debonding tape to obtain a wafer to be cut.

[0018] The method for preparing the LED light board, wherein the step of removing the temporary substrate on the treated light board to obtain the LED light board comprises:

[0019] Penetrating the temporary substrate with a laser to irradiate the adhesion-reducing tape;

[0020] Pasting a strong adhesive tape on the temporary substrate at a side away from the base;

[0021] The strong adhesive tape and the temporary substrate are peeled off simultaneously to obtain an LED light panel.

[0022] The method for preparing the LED light panel, wherein the substrate is a sapphire substrate; and / or the temporary substrate is a sapphire substrate.

[0023] The method for preparing the LED light board, wherein the light-isolating layer is arranged on the side walls around the double-layer substrate chip on the light board to be processed, and the steps of obtaining the processed light board include:

[0024] Sealing is performed on one side of the double-layer substrate chip welded on the lamp board to be processed to form a light-isolating adhesive layer covering the double-layer substrate chip;

[0025] The portion of the light-isolating adhesive layer that is higher than the top surface of the double-layer substrate chip is removed to form a light-isolating layer, thereby obtaining a processed light board.

[0026] In the method for preparing the LED light board, the top surface of the light-isolating adhesive layer is 40-60 microns higher than the top surface of the double-layer substrate chip.

[0027] The method for preparing the LED light board, wherein the light-isolating layer is a black plastic light-isolating layer; and / or,

[0028] The thickness of the temporary substrate is 150-250 microns; and / or,

[0029] The height difference between the light-isolating layer and the double-layer substrate chip is less than 50 microns.

[0030] The present application also discloses an LED light board, wherein the LED light board is manufactured by any of the above-described methods for manufacturing an LED light board.

[0031] The LED light board, wherein the LED light board includes a circuit board, an LED chip and a light-isolating layer, a plurality of the LED chips are provided, a plurality of the light-isolating layers are also provided, a plurality of the LED chips and a plurality of the light-isolating layers are alternately arranged on the circuit board, and the side walls around each of the LED chips are in contact with the light-isolating layers.

[0032] The LED light board, wherein the height of the light-isolating layer is greater than the height of the LED chip; and / or,

[0033] The LED chip comprises a soldering block, a light-emitting layer and a substrate, the soldering block is connected to the circuit board, and the light-emitting layer and the substrate are sequentially stacked on the soldering block.

[0034] Compared with the prior art, the embodiments of the present invention have the following advantages:

[0035] The LED light board of the present application sets a light-isolating layer between adjacent double-layer substrate chips during the preparation process, and the height of the light-isolating layer is equal to the sum of the height of the LED chip and the height of the temporary substrate. When the temporary substrate is removed from the processed light board, each LED chip is surrounded by the light-isolating layer on all sides, and the light-isolating layer extends to the upper side of the LED chip. When the LED light board is working, the lateral light emission of a single LED chip is blocked, and the light emitted from the upper side of the light emitting surface is also blocked. Only the light emitted upward can be emitted smoothly. Therefore, not only can a single LED chip only emit light from the front, but the light emitted between adjacent LED chips will hardly mix, thereby solving the problem of light leakage when viewed from the side of the LED light board and improving the overall visual effect when the LED light board is spliced ​​and used. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 It is a flow chart of the method for preparing the LED light board in the present invention;

[0038] Figure 2It is a schematic diagram of the intermediate process of the preparation process of the LED light board in the present invention;

[0039] in, Figure 2 Figure (a) is a schematic diagram of the structure of an LED wafer during the LED manufacturing process;

[0040] Figure 2 Figure (b) is a schematic diagram of the structure of bonding a temporary substrate on an LED wafer during the preparation process of an LED;

[0041] Figure 2 Figure (c) is a schematic diagram of the structure of a double-layer substrate chip during the preparation process of an LED;

[0042] Figure 2 Figure (d) is a schematic diagram of the structure of the lamp board to be processed during the preparation process of LED;

[0043] Figure 2 Figure (e) is a schematic diagram of the structure of applying glue on the lamp board to be processed during the preparation process of LED;

[0044] Figure 2 Figure (f) is a schematic diagram of the structure of the light board after processing during the preparation process of the LED;

[0045] Figure 2 Figure (g) is a schematic diagram of the structure of the laser irradiation debonding tape during the preparation of LED;

[0046] Figure 2 Figure (h) is a schematic diagram of the structure of the LED light board during the LED preparation process.

[0047] Among them, 1. solder block; 2. light-emitting layer; 3. substrate; 4. anti-adhesion tape; 5. temporary substrate; 6. circuit board; 7. light-isolating adhesive layer; 8. light-isolating layer. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] LED is a semiconductor device that uses energy released when carriers recombine to generate light. LED chips have many advantages, such as low power consumption, pure color, long life, small size, fast response time, energy saving and environmental protection, so they have broad application prospects in today's display screens. In the semiconductor industry, LED display technology has been continuously improving. With the rapid development of Mini LED display technology and Micro LED display technology, related display products have begun to be used in ultra-large screen high-definition displays, such as monitoring and command, high-definition broadcasting, high-end cinemas, medical diagnosis, advertising display, conferences and exhibitions, office display, virtual reality and other commercial fields; however, due to the inconvenience of transportation and installation, easy damage and other problems, the mode of splicing multiple LED light panels is now mostly used.

[0050] However, after the existing LED light panels are sealed with glue, the light field distribution at the edge of the light panel is different from that at other parts, so there is a problem of light leakage at the side edge. Because of this problem, at the splicing of the light panels, the side light leakage affects the integration effect of the LED display screen, making the image displayed on the spliced ​​display screen visually segmented, and the visual effect is not ideal.

[0051] It should be noted that the preparation method of the LED light board involved in this application is applicable to display devices such as traditional LED display screens, OLED display screens, mini LED display screens, and Micro LED display screens. The circuit board 6 of the LED light board involved in this application is a printed circuit board.

[0052] See also Figure 1 and Figure 2 In one embodiment of the present invention, a method for preparing an LED light board is disclosed, wherein the preparation method comprises the steps of:

[0053] S100, bonding a temporary substrate 5 on the light-emitting surface of the LED chip to obtain a double-layer substrate chip;

[0054] S200, welding a plurality of the double-layer substrate chips onto a circuit board 6 to obtain a lamp board to be processed;

[0055] S300, setting a light-isolating layer 8 on the side walls around the double-layer substrate chip on the lamp board to be processed to obtain a processed lamp board;

[0056] S400, removing the temporary substrate 5 on the processed lamp board to obtain an LED lamp board.

[0057] The LED light board of the present application sets a light isolation layer 8 between adjacent double-layer substrate chips during the preparation process, and the height of the light isolation layer 8 is equal to the sum of the height of the LED chip and the height of the temporary substrate 5. After the temporary substrate 5 is removed from the processed light board, each LED chip is surrounded by the light isolation layer 8 on all sides, and the light isolation layer 8 extends to the upper side of the LED chip. When the LED light board is working, the lateral light emission of a single LED chip is blocked, and the light emitted from the upper side of the light emitting surface is also blocked. Only the light emitted upward can be emitted smoothly. Therefore, not only can a single LED chip only emit light from the front, but the light emitted between adjacent LED chips will hardly mix, thereby solving the problem of light leakage when viewed from the side of the LED light board and improving the overall visual effect when the LED light board is spliced ​​and used.

[0058] Furthermore, as an implementation method of this embodiment, it is disclosed that the height difference between the light-isolating layer 8 and the double-layer substrate chip is less than 50 microns. The height of the light-isolating layer 8 affects the light-emitting effect of the LED chip on the final LED light board. It is best to set the height of the light-isolating layer 8 to be equal to that of the double-layer substrate chip, with an error range of 0-50 microns. If the light-isolating layer 8 is too low, the blocking effect of the light emitted laterally by the LED chip is not good, and it is still easy to cause the problem of side light leakage; if the light-isolating layer 8 is too high, after removing the temporary substrate 5, it is not easy to maintain the shape of the light-isolating layer 8, and the light-isolating layer 8 is easy to tilt and block the forward light emitting effect of the LED chip.

[0059] like Figure 2 As shown in Figures (a) to (c), as an implementation of this embodiment, step S100 is disclosed to specifically include:

[0060] S101, providing an LED wafer with a solder bump 1;

[0061] S102, bonding a temporary substrate 5 on a side of the LED wafer away from the solder block 1 to obtain a wafer to be cut;

[0062] S103, cutting the wafer to be cut into a plurality of double-layer substrate chips.

[0063] In the current mini LED display technology and Micro LED display technology, in order to enable the display screen to obtain high-resolution and high-definition display effects, very small LED chips are used. Therefore, it is inconvenient to set a temporary substrate 5 on a single LED chip, and it has high requirements for the processing technology. Before the LED wafer is split and cut into LED chips, the temporary substrate 5 is directly pasted on the wafer. Because the size of the LED wafer is relatively large, the temporary substrate 5 of the same size as the LED wafer is bonded to the LED wafer, which is easy to achieve accurate alignment, achieve a stable connection, and improve the processing yield; then the LED wafer is cut longitudinally and divided into double-layer substrate chips one by one. The temporary substrate 5 on the double-layer substrate chip made in this way completely covers the light-emitting surface of the LED chip, and there is no need to design the shape of the temporary substrate 5 separately, and there is no need to align the temporary substrate 5 and the LED chip. The edge of the temporary substrate 5 is also firmly connected to the LED chip to avoid the defect of edge warping; and each double-layer substrate chip is composed of an LED chip and a temporary substrate 5 bonded to the light-emitting surface of the LED chip, which is convenient for obtaining multiple LED chips with the temporary substrate 5 bonded at the same time, and reduces the steps of repeatedly pasting the temporary substrate 5, thereby improving the production speed.

[0064] See also Figure 2 FIG. (a) in the middle, as another implementation of this embodiment, discloses that the LED wafer includes a solder block 1, a light-emitting layer 2 and a substrate 3 stacked in sequence; the step S102 specifically includes:

[0065] A debonding tape 4 is provided on the side of the substrate 3 facing away from the light-emitting layer 2 , and then the temporary substrate 5 is pasted on the debonding tape 4 to obtain a wafer to be cut.

[0066] In addition, it is disclosed that the step 400 specifically includes:

[0067] Penetrate the temporary substrate with a laser to irradiate the adhesion-reducing tape 4;

[0068] A strong adhesive tape is pasted on the temporary substrate 5 on the side away from the base 3;

[0069] The strong adhesive tape and the temporary substrate 5 are peeled off simultaneously to obtain an LED light board.

[0070] In this embodiment, the temporary substrate 5 is only temporarily fixed on the LED chip. In the last step of manufacturing the LED light board, the temporary substrate 5 needs to be removed from the LED chip. Therefore, it is best to fix the temporary substrate 5 on the LED chip by bonding. The connection between the two is firm, and it is also convenient to release this connection relationship and achieve separation. Preferably, a debonding tape 4, such as a UV debonding tape 4, is provided on the base 3 of the LED chip. The debonding tape 4 has a good bonding effect, which is conducive to the stable connection between the LED wafer and the temporary substrate 5, so that the bonded temporary substrate 5 Relative displacement is not easy to occur, and when cutting the LED wafer, the temporary substrate 5 and the LED chip are cut at the same time, and relative slip will not occur. The cutting effect is good, and it is convenient to obtain a double-layer substrate chip with a regular shape; in particular, the anti-sticking tape 4 absorbs heat after being irradiated by the laser, and the bonding force decreases significantly after heating, and it is easy to tear off without residual glue. Therefore, after setting the light-isolating layer 8 on the LED light board, you only need to use a strong tape to stick the top surface of the temporary substrate 5 to quickly remove the temporary substrate 5, and at the same time take out the anti-sticking tape 4 to avoid residual glue on the light-emitting surface of the LED chip. Of course, if there is no strong tape, you can also use a tool to insert it into the side of the temporary substrate 5 and shovel off the temporary substrate 5 with external force.

[0071] It should be noted that the substrate 3 used in this embodiment is a sapphire substrate 3; the temporary substrate 5 is a sapphire substrate. Sapphire has stable chemical properties and high hardness, and is a good material for carrying the light-emitting layer 2. When the laser is used to heat the adhesive tape 4, it is necessary to penetrate the temporary substrate 5. The sapphire substrate has good heat resistance and stable chemical properties, so it will not have adverse effects. In addition, both the temporary substrate 5 and the substrate 3 are made of sapphire material, which reduces the types of raw materials for preparation and facilitates the purchase of raw materials.

[0072] In addition, in the present embodiment, the thickness of the temporary substrate 5 is 150-250 microns. In the present application, the thickness of the light-isolating layer 8 is equal to the sum of the thickness of the LED chip and the thickness of the temporary substrate 5, so the thickness of the part of the light-isolating layer 8 that is higher than the LED chip after the temporary substrate 5 is peeled off is the thickness of the temporary substrate 5, so if the thickness of the temporary substrate 5 is less than 150 microns, the light-isolating layer 8 finally made has a significantly weakened blocking effect on the light emitted from the LED chip to the side and above, and cannot avoid the mixing of light between adjacent LED chips, which easily causes uneven light emission on the LED lamp board and affects the visual effect of the final image; if the thickness of the temporary substrate 5 is greater than 250 microns, although the lateral light emission of the LED chip is well restricted, it wastes materials and increases the manufacturing cost of the LED lamp board, so the thickness of the temporary substrate 5 is set to 150-250 microns, preferably 200 microns is the best.

[0073] Specifically, as another implementation of this embodiment, step S300 is disclosed to specifically include:

[0074] Sealing is performed on one side of the double-layer substrate chip welded on the lamp board to be processed to form a light-isolating adhesive layer 7 covering the double-layer substrate chip;

[0075] The portion of the light-isolating adhesive layer 7 that is higher than the top surface of the double-layer substrate chip is removed to form a light-isolating layer 8, thereby obtaining a processed light board.

[0076] In the present embodiment, glue is applied when the lamp board to be processed is sealed. The preferred glue is black glue, so that the finally formed light-isolating layer 8 is a black glue light-isolating layer. Black glue has good light-blocking and light-absorbing properties, preventing the LED chip from breaking through the light-isolating layer 8 during the light-emitting process, and avoiding the light-isolating layer 8 from failing and causing side light leakage, which affects the display effect of the LED lamp board. In addition, more glue is applied to allow the glue to fully penetrate between adjacent double-layer substrate chips, forming a complete barrier between adjacent double-layer substrate chips until the glue overflows from the gap between the two double-layer substrate chips to the top surface of the double-layer substrate chip. In the present embodiment, it is required to set a viscosity-reducing tape 4 or other adhesive layer on the entire light-emitting surface of the LED chip, so that there is no gap between the temporary substrate 5 and the LED chip after the two are attached, achieving complete attachment, and preventing the glue from infiltrating into the light-emitting surface of the LED chip when applying the glue. , to avoid blocking the forward light output of the LED chip; preferably, apply enough glue to make the top surface of the formed light-isolating glue layer 7 higher than the top surface of the double-layer substrate chip by 40-60 microns, preferably 50 microns, to ensure that the adjacent double-layer substrate chips are completely separated and to prevent waste of materials; then remove the colloid that is higher than the top surface of the double-layer substrate chip, and the removal method can be to use a grinding device to gradually grind it off, repeatedly rub the top surface of the opaque colloid, grind off the colloid little by little, avoid one-time removal, and prevent damage to the temporary substrate 5; finally, only the colloid between the adjacent double-layer substrate chips is left to form a light-isolating layer 8, so as to retain the blocking effect on the side light output and mixed light of the LED chip, and at the same time eliminate the limit on the top surface of the temporary substrate 5, so as to facilitate the subsequent steps of injecting laser from above to irradiate the anti-viscosity tape 4 and stick and tear off the temporary substrate 5 upward.

[0077] As another embodiment of the present application, a process flow for preparing an LED light board from a mini LED wafer is specifically disclosed as follows:

[0078] Before the mini LED wafer is split, a thin sapphire sheet (temporary substrate 5) is attached using a thin-film adhesive tape 4. After the attachment, the mini LED wafer is split and cut into mini LED chips with double-layer sapphire glass.

[0079] Solder the mini LED chip to the light board and then seal it with glue; then polish the sealant until the thin sapphire on the top of the LED chip is exposed;

[0080] The top sapphire is peeled off using a laser.

[0081] Now, let's take a partial LED wafer with two LED chips as an example. Figure 2 As shown in Figure (a), the traditional LED wafer has a three-layer structure of a sapphire substrate, a light-emitting layer 2, and a solder pad. The sapphire substrate is glued with adhesive, and then a thin sapphire sheet is attached to obtain Figure 2 As shown in Figure (b); then cut the split pieces to obtain Figure 2 The double-layer substrate chip with the structure shown in Figure (c) has an LED chip and a thin sapphire sheet. Figure 2 As shown in Figure (d), the double-layer substrate chip is then attached to the circuit board 6; then the lamp board to be processed is sealed with black glue to cover the temporary substrate 5 and the LED chip. Figure 2 As shown in Figure (e); Figure 2 As shown in Figure (f), a grinding device is used to grind off some of the sealant on the top of the lamp board to be processed until the temporary substrate 5 is exposed; Figure 2 As shown in Figure (g), laser is then used to irradiate the adhesive bonding the sapphire substrate and the temporary substrate 5, heating the adhesive to reduce the viscosity of the adhesive; finally, a strong adhesive tape is used to bond the temporary substrate 5, and the temporary substrate 5 is peeled off from the top, taking out the adhesive; thus, a Figure 2 The middle (h) figure shows an LED light board with no side light leakage. The thickness and height of the black glue between each LED chip are the same, and the light is limited to the side, and can only be emitted from the front. At the same time, there is no black glue on the front, and there will be no brightness uniformity problems due to different black glue uniformity or thickness.

[0082] As another embodiment of the present application, an LED light board is disclosed, wherein the LED light board is manufactured by any of the above-described methods for preparing an LED light board.

[0083] Specifically, as another implementation of the present embodiment, the LED light board is disclosed to include a circuit board 6, an LED chip and a light-isolating layer 8, wherein a plurality of LED chips are provided, and a plurality of light-isolating layers 8 are also provided, and a plurality of LED chips and a plurality of light-isolating layers 8 are alternately provided on the circuit board 6, and the side walls of each LED chip are in contact with the light-isolating layer 8. By providing the light-isolating layer 8 around the LED chip, the lateral light emission of the LED chip is limited, so that there will be no problem of light leakage when the LED light board is displayed, and there will be no problem of visual segmentation at the joint when multiple LED light boards are spliced, thereby improving the visual effect of the LED light board.

[0084] Specifically, as another implementation of this embodiment, the height of the light-isolating layer 8 is greater than the height of the LED chip. The portion of the light-isolating layer 8 that is higher than the LED chip can block the light emitted by the LED chip to the side and above, prevent light mixing with adjacent LED chips, and avoid the problem of uneven display on the LED light board.

[0085] Specifically, as another implementation of this embodiment, the LED chip includes a solder block 1, a light-emitting layer 2 and a substrate 3, wherein the solder block 1 is connected to the circuit board 6, and the light-emitting layer 2 and the substrate 3 are sequentially stacked on the solder block 1. When the LED chip is working, an electrical signal is conducted through the circuit board 6, and after the solder block 1 is energized, the light-emitting layer 2 is stimulated to emit light, and the light is emitted upward through the substrate 3, and multiple LED chips work simultaneously to realize the display of the LED light board.

[0086] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing an LED light board, characterized in that: The preparation method comprises: Bonding a temporary substrate on the light-emitting surface of the LED chip to obtain a double-layer substrate chip; Soldering a plurality of the double-layer substrate chips onto a circuit board to obtain a lamp board to be processed; A light-isolating layer is arranged on the side walls around the double-layer substrate chip on the lamp board to be processed to obtain a processed lamp board; Removing the temporary substrate from the processed light board to obtain an LED light board; The step of bonding a temporary substrate on the light-emitting surface of the LED chip to obtain a double-layer substrate chip includes: Providing an LED wafer with a solder bump; the LED wafer comprises a solder bump, a light-emitting layer and a substrate stacked in sequence; Disposing a debonding tape on the side of the substrate facing away from the light-emitting layer, and then pasting the temporary substrate on the debonding tape to obtain a wafer to be cut; Cutting the wafer to be cut into a plurality of double-layer substrate chips; Wherein, the height difference between the light-isolating layer and the double-layer substrate chip is less than 50 microns; The step of providing a light-isolating layer on the side walls around the double-layer substrate chip on the lamp board to be processed to obtain the processed lamp board comprises: Sealing is performed on one side of the double-layer substrate chip welded on the lamp board to be processed to form a light-isolating adhesive layer covering the double-layer substrate chip; The portion of the light-isolating adhesive layer that is higher than the top surface of the double-layer substrate chip is removed to form a light-isolating layer, thereby obtaining a processed light board.

2. The method for preparing the LED light board according to claim 1, characterized in that: The step of removing the temporary substrate on the processed light board to obtain the LED light board comprises: Penetrating the temporary substrate with a laser to irradiate the adhesion-reducing tape; Pasting a strong adhesive tape on the temporary substrate at a side away from the base; The strong adhesive tape and the temporary substrate are peeled off simultaneously to obtain an LED light panel.

3. The method for preparing the LED light board according to claim 1, characterized in that: The substrate is a sapphire substrate; and / or, The temporary substrate is a sapphire substrate.

4. The method for preparing the LED light board according to claim 1, characterized in that: The top surface of the light-isolating adhesive layer is 40-60 microns higher than the top surface of the double-layer substrate chip.

5. The method for preparing the LED light board according to any one of claims 1 to 4, characterized in that: The light-isolating layer is a black plastic light-isolating layer; and / or, The thickness of the temporary substrate is 150-250 microns.

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