Display module, preparation method thereof, and mask plate assembly
By adopting the stacked first marking group layer and second marking group layer structure in the display module, the problem of difficult to identify the thickness of the test mark is solved, the recognition accuracy of the optical mark and the network accuracy of the mask plate assembly are improved, and the yield rate of the display module is improved.
Patent Information
- Application Number
- CN202210343650.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-31
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2042-03-31
AI Technical Summary
In the prior art, the test marks formed during the evaporation process are thinner, making it difficult to identify, affecting the network accuracy and yield of the display module.
Using a stacked first marking layer and second marking layer structure, the first marking layer is used to raise the second marking layer, shorten its distance from the alignment device, and improve contrast, thereby enhancing identification accuracy.
The stacked structure improves the recognition accuracy of optical marks, enhances the network accuracy of the mask plate assembly, and improves the yield rate of the display module.
Smart Images

Figure CN114709192B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of display modules. Specifically, the present application relates to a display module, a preparation method thereof, and a mask plate assembly. Background Art
[0002] An evaporation mask plate assembly is usually assembled from a frame, a shielding mask plate, a fine mask plate, etc. The shielding mask plate and the fine mask plate are both welded and fixed to the frame, and the shielding mask plate needs to be placed below the fine mask plate to support the fine mask plate and the substrate, and to shield the organic materials in the non-light-emitting area. Since the fine mask plate is very thin and has high precision requirements, it is easy to deform in a high-temperature evaporation chamber. Therefore, a mesh tensioning operation needs to be performed on the fine mask plate to improve the precision of the fine mask plate, so that the light-emitting material passes through the pixel openings of the fine mask plate and lands on the corresponding positions of the substrate.
[0003] During the mesh tensioning process, due to production deviations and other reasons, it is impossible to completely ensure that all the light-emitting materials pass through the openings and land on the corresponding positions of the substrate. Therefore, a test mark (Pattern Position Accuracy Teg, PPA Teg) is mostly used to show the gap between the actual evaporation position and the ideal evaporation position, and then the tension, reaction force or compensation value of the fine mask plate welding is readjusted through the gap.
[0004] The test mark is obtained by depositing the light-emitting material through the mark openings opened on the fine mask plate during the evaporation process. However, with the continuous technological upgrade of the display technology, the test mark formed by the evaporated light-emitting material has the defect of being difficult to identify due to its thin thickness. Summary of the Invention
[0005] In view of the shortcomings of the existing methods, the present application provides a display module, a preparation method thereof, and a mask plate assembly, so as to solve the technical problem that the test mark in the existing technology has a thin thickness and is difficult to identify.
[0006] In a first aspect, an embodiment of the present application provides a display module, including: a substrate, and a first mark group layer and a second mark group layer stacked thereon;
[0007] The first mark group layer is disposed on one side of the substrate, the second mark group layer is used to face the alignment device and has a first recognition distance from the alignment device, and the stacked first mark group layer and second mark group layer are used for the alignment device to identify and align.
[0008] Optionally, the first mark group layer includes: a first optical mark group layer; the second mark group layer includes: a second optical mark group layer;
[0009] The orthographic projection on the substrate of the smaller one of the first optical mark group layer and the second optical mark group layer falls within the orthographic projection range on the substrate of the larger one of the first optical mark group layer and the second optical mark group layer.
[0010] Optionally, the material of the first optical mark group layer is the same as that of the second optical mark group layer.
[0011] Optionally, the first optical mark group layer includes: a first first-layer optical mark and a first second-layer optical mark arranged on the same layer; the second optical mark group layer includes: a second first-layer optical mark and a second second-layer optical mark arranged on the same layer;
[0012] The size of the first first-layer optical mark is smaller than that of the first second-layer optical mark; the size of the second second-layer optical mark is smaller than that of the second first-layer optical mark;
[0013] The orthographic projection of the first first-layer optical mark on the second first-layer optical mark falls within the range of the second first-layer optical mark;
[0014] The orthographic projection of the second second-layer optical mark on the first second-layer optical mark falls within the range of the first second-layer optical mark.
[0015] Optionally, the display module further includes: a third optical mark group layer; the first optical mark group layer further includes: a first third-layer optical mark; the third optical mark group layer includes: a third third-layer optical mark;
[0016] The size of the first first-layer optical mark is smaller than that of the other optical marks of the first layer; the size of the second second-layer optical mark is smaller than that of the other optical marks of the second layer; the size of the third third-layer optical mark is smaller than that of the first third-layer optical mark.
[0017] Optionally, the second optical mark group layer further includes: a second third-layer optical mark; the third optical mark group layer further includes: a third first-layer optical mark and a third second-layer optical mark;
[0018] The size of the third third-layer optical mark is smaller than that of the other optical marks of the third layer.
[0019] Optionally, the sizes of the respective optical marks of each layer are all different.
[0020] Optionally, the materials of the first optical mark group layer and the second optical mark group layer are two of the first color light-emitting material, the second color light-emitting material, and the third color light-emitting material.
[0021] Optionally, the first mark group layer includes: a cushion layer; the second mark group layer includes: at least one optical mark arranged on the same layer;
[0022] The orthographic projection of the optical mark on the cushion layer all falls within the range of the cushion layer.
[0023] Optionally, the first mark group layer includes: at least one electrode mark arranged on the same layer; the second mark group layer includes: at least one optical mark arranged on the same layer;
[0024] The electrode mark is located between the middle area of the optical mark and the substrate; the edge area of the optical mark is connected to the substrate.
[0025] In a second aspect, an embodiment of the present application provides a mask plate assembly for manufacturing the display module provided in the first aspect above, including: a first layer mask plate and a second layer mask plate;
[0026] The first layer mask plate and the second layer mask plate have corresponding pixel openings with the same size.
[0027] The first layer mask plate further has a first layer first optical mark opening and a first layer second optical mark opening; the size of the first layer first optical mark opening is smaller than the size of the first layer second optical mark opening.
[0028] The second layer mask plate further has a second layer first optical mark opening and a second layer second optical mark opening; the size of the second layer second optical mark opening is smaller than the size of the second layer first optical mark opening.
[0029] Optionally, the mask plate assembly further includes: a third layer mask plate;
[0030] The third layer mask plate has a pixel opening corresponding to and with the same size as the pixel opening of the first layer mask plate.
[0031] The first layer mask plate further has a first layer third optical mark opening; the size of the first layer first optical mark opening is smaller than the size of other optical mark openings on the first layer mask plate.
[0032] The third layer mask plate further has a third layer third optical mark opening; the size of the third layer third optical mark opening is smaller than the size of the first layer third optical mark opening.
[0033] In a third aspect, an embodiment of the present application further provides a method for manufacturing a display module, including:
[0034] Evaporating and plating the substrate based on the first layer mask plate to obtain a first layer first optical mark and a first layer second optical mark arranged on one side of the substrate; the mask plate assembly includes a first layer mask plate and a second layer mask plate;
[0035] Vapor deposition is performed on the substrate based on the second mask plate to obtain a second first optical mark and a second second optical mark; the orthographic projection of the first first optical mark on the second first optical mark falls within the range of the second first optical mark; the orthographic projection of the second second optical mark on the first second optical mark falls within the range of the first second optical mark.
[0036] Optionally, vapor deposition is performed on the substrate based on the first mask plate to obtain a first first optical mark and a first second optical mark disposed on one side of the substrate, including:
[0037] Vapor deposition is performed on the substrate based on the first mask plate to obtain a first first optical mark, a first second optical mark, and a first third optical mark disposed on one side of the substrate;
[0038] And, vapor deposition is performed on the substrate based on the second mask plate to obtain a second first optical mark and a second second optical mark, including:
[0039] Vapor deposition is performed on the substrate based on the second mask plate to obtain a second first optical mark, a second second optical mark, and a second third optical mark;
[0040] After vapor deposition is performed on the substrate based on the second mask plate to obtain a second first optical mark and a second second optical mark, it further includes:
[0041] Vapor deposition is performed on the substrate based on the third mask plate to obtain a third first optical mark, a third second optical mark, and a third third optical mark; the mask plate assembly further includes: a third mask plate; the size of the first first optical mark is smaller than the sizes of the other optical marks of the first layer; the size of the second second optical mark is smaller than the sizes of the other optical marks of the second layer; the size of the third third optical mark is smaller than the sizes of the other optical marks of the third layer; the orthographic projection of the third third optical mark on the first third optical mark or the second third optical mark falls within the range of the first third optical mark or the second third optical mark.
[0042] The beneficial technical effects brought by the technical solution provided by the embodiments of the present application include:
[0043] The display module provided by the embodiment of the present application includes: a substrate, and a first marker group layer and a second marker group layer stacked thereon; the first marker group layer is disposed on one side of the substrate, the second marker group layer is used to face the alignment device and has a first recognition distance from the alignment device, and the stacked first marker group layer and second marker group layer are used for the alignment device to recognize and align. In the embodiment of the present application, the first marker group layer and the second marker group layer are stacked. When the second marker group layer is relatively thin, the first marker group layer can play a role in raising (or thickening) the second marker group layer, can shorten the distance between the second marker group layer and the alignment device, is beneficial to improving the contrast of the second marker group layer, and further is beneficial to improving the recognition accuracy of the second marker group layer, improving the mesh stretching accuracy of the mask plate assembly, and improving the yield of the display module.
[0044] Additional aspects and advantages of the present application will be given in part in the following description, and these will become obvious from the following description, or can be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the following description of the embodiments in conjunction with the drawings, where:
[0046] Figure 1 is a schematic structural diagram of a display module and an alignment device provided by an embodiment of the present application;
[0047] Figure 2 is a schematic corresponding structural diagram of a first optical marker group layer and a second optical marker group layer provided by an embodiment of the present application;
[0048] Figure 3 is another schematic corresponding structural diagram of a first optical marker group layer and a second optical marker group layer provided by an embodiment of the present application;
[0049] Figure 4 is still another schematic corresponding structural diagram of a first optical marker group layer and a second optical marker group layer provided by an embodiment of the present application;
[0050] Figure 5 is yet another schematic corresponding structural diagram of a first optical marker group layer and a second optical marker group layer provided by an embodiment of the present application;
[0051] Figure 6 is a schematic cross-sectional view of the structure of a display module provided by an embodiment of the present application;
[0052] Figure 7 is another schematic cross-sectional view of the structure of a display module provided by an embodiment of the present application;
[0053] Figure 8 is a schematic top view of the structure of still another display module provided by an embodiment of the present application;
[0054] Figure 9 It is a top view schematic diagram of the structure of another display module provided by an embodiment of the present application;
[0055] Figure 10 It is a top view schematic diagram of the structure of yet another display module provided by an embodiment of the present application;
[0056] Figure 11 It is Figure 10 a cross-sectional schematic diagram at the straight line B in;
[0057] Figure 12 It is a schematic diagram of the structure of a first mask layer provided by an embodiment of the present application;
[0058] Figure 13 It is a schematic diagram of the structure of a second mask layer provided by an embodiment of the present application;
[0059] Figure 14 It is a schematic diagram of the structure of a third mask layer provided by an embodiment of the present application;
[0060] Figure 15 It is a flowchart of a method for manufacturing a display module provided by an embodiment of the present application;
[0061] Figure 16 It is a flowchart of another method for manufacturing a display module provided by an embodiment of the present application.
[0062] Reference numerals:
[0063] 100 - Display module;
[0064] 101 - Substrate;
[0065] 110 - First marker group layer;
[0066] 111 - First optical marker group layer;
[0067] 1111 - First optical marker of the first layer; 1111a - First sub - marker of the first color of the first layer; 1111b - First sub - marker of the second color of the first layer; 1111c - First sub - marker of the third color of the first layer;
[0068] 1112 - Second optical marker of the first layer; 1112a - First sub - marker of the first color of the first layer; 1112b - First sub - marker of the second color of the first layer; 1111c - First sub - marker of the third color of the second layer;
[0069] 1113 - Third optical marker of the first layer;
[0070] 112 - Cushion layer; 113 - Electrode marker;
[0071] 120 - Second marker group layer;
[0072] 121 - Second optical marker group layer;
[0073] 1211 - First optical marker of the second layer; 1211a - First color first sub - marker of the second layer; 1211b - Second color first sub - marker of the second layer; 1211c - Third color first sub - marker of the second layer;
[0074] 1212 - Second optical marker of the second layer; 1212a - First color second sub - marker of the second layer; 1212b - Second color second sub - marker of the second layer; 1212c - Third color second sub - marker of the second layer;
[0075] 1213 - Third optical marker of the second layer;
[0076] 122 - Optical marker;
[0077] 131 - Third optical marker group layer; 1311 - First optical marker of the third layer; 1312 - Second optical marker of the third layer; 1313 - Third optical marker of the third layer;
[0078] 140 - Reference marker;
[0079] 102 - First light - emitting layer; 103 - Second light - emitting layer; 104 - First hole - transporting layer; 105 - Second hole - transporting layer; 106 - Anode layer; 107 - Cathode layer;
[0080] 200 - Alignment device;
[0081] 310 - First mask plate; 311 - First optical marker opening of the first layer; 312 - Second optical marker opening of the first layer; 313 - Third optical marker opening of the first layer; 320 - Second mask plate; 321 - First optical marker opening of the second layer; 322 - Second optical marker opening of the second layer; 330 - Third mask plate; 331 - Third optical marker opening of the third layer; 301 - Pixel opening;
[0082] A - First recognition distance. Detailed implementation mode
[0083] The embodiments of the present application will be described below with reference to the drawings in the present application. It should be understood that the embodiments described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not constitute limitations on the technical solutions of the embodiments of the present application.
[0084] Those skilled in the art can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the" and "said" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application means the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence of other features, information, data, steps, operations, elements, components and / or combinations thereof supported by the technical field of the present application. It should be understood that when we say an element is "connected" or "coupled" to another element, the one element can be directly connected or coupled to the other element, or it can mean that the one element and the other element establish a connection relationship through an intermediate element. The term "and / or" used herein means at least one of the items defined by the term, for example, "A and / or B" can be implemented as "A", or implemented as "B", or implemented as "A and B".
[0085] To make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.
[0086] The R & D idea of the present application includes: with the continuous upgrading of display technology, the stacked structure of the light-emitting layer in the display module has changed. In the tandem device structure, the light-emitting layer of the display module is evaporated in two or more layers to obtain a tandem device structure with at least two light-emitting layers. And each light-emitting layer in the tandem device structure is thinner than the light-emitting layer in the traditional single-layer device structure, resulting in a low contrast of the test marks prepared on the same layer as each light-emitting layer, which is difficult to be recognized by the alignment device, thus affecting the process of compensating for the mesh stretching of the fine mask plate.
[0087] The display module, its manufacturing method and mask plate assembly provided by the present application aim to solve the above technical problems in the prior art.
[0088] The technical solutions of the present application and how the technical solutions of the present application solve the above technical problems will be described in detail below with specific embodiments. It should be noted that the following embodiments can be referred to, learned from or combined with each other. For the same terms, similar features and similar implementation steps in different embodiments, they will not be described repeatedly.
[0089] An embodiment of the present application provides a display module 100. Please refer to Figure 1 , the display module 100 includes: a substrate 101, and a stacked first marker group layer 110 and a second marker group layer 120.
[0090] The first marker group layer 110 is disposed on one side of the substrate 101. The second marker group layer 120 is for facing the alignment device 200 and has a first recognition distance A from the alignment device 200. The stacked first marker group layer 110 and second marker group layer 120 are for the alignment device 200 to recognize and align.
[0091] In this embodiment, the first marker group layer 110 is disposed on one side of the substrate 101. The second marker group layer 120 faces the alignment device 200 and has a first recognition distance A from the alignment device 200. The stacked first marker group layer 110 and second marker group layer 120 are for the alignment device 200 to recognize and align. When the second marker group layer 120 is relatively thin, the first marker group layer 110 can play a role in raising (or thickening) the second marker group layer 120, can shorten the distance between the second marker group layer 120 and the alignment device 200, is beneficial to improving the contrast of the second marker group layer 120, and further is beneficial to improving the recognition accuracy of the second marker group layer 120, improving the mesh stretching accuracy of the mask plate assembly, and improving the yield of the display module.
[0092] In some possible implementation manners, please refer to Figure 2 , the first marker group layer 110 includes: the first optical marker group layer 111. The second marker group layer 120 includes: the second optical marker group layer 121.
[0093] The orthographic projection of the smaller one of the first optical marker group layer 111 and the second optical marker group layer 121 on the substrate 101 falls within the orthographic projection range of the larger one of the first optical marker group layer 111 and the second optical marker group layer 121 on the substrate 101.
[0094] In this embodiment, the display module 100 includes two light-emitting layers stacked on one side of the substrate 101. The first optical marker group layer 111 is obtained when preparing the first light-emitting layer 102, and the second optical marker group layer 121 is obtained when preparing the second light-emitting layer 103. The sizes of the first optical marker group layer 111 and the second optical marker group layer 121 are inconsistent. When two relatively thin optical marker group layers are stacked, the first optical marker group layer 111 and the second optical marker group layer 121 have a conventional effective recognition thickness and are easy to recognize. In other words, the relatively thin optical marker group layer has a lighter color and is difficult to recognize. After the two optical marker group layers are stacked, the color is darker and it is convenient to recognize.
[0095] Optionally, the material of the first optical marker group layer 111 is the same as the material of the second optical marker group layer 121.
[0096] In this embodiment, the first optical marker group layer 111 is prepared simultaneously through the same mask plate when preparing the first-color light-emitting pixels of the first light-emitting layer 102, and the second optical marker group layer 121 is prepared simultaneously through the same mask plate when preparing the first-color light-emitting pixels of the second light-emitting layer 103. Since the first-color pixels are prepared in both cases, the same light-emitting material, i.e., the first-color light-emitting material, is used, which simplifies the preparation process of the markers and eliminates the need for other complex steps.
[0097] Optionally, the first-color pixels can be red pixels, green pixels, or blue pixels.
[0098] It can be understood that in the prior art, when preparing the display module 100 with two light-emitting layers, only one optical marker is prepared and left simultaneously when preparing the first color of each light-emitting layer. Since the first color is relatively thin, correspondingly, the optical marker is also relatively thin and difficult to identify. In some possible implementation manners, please refer to Figure 2 , the first optical marker group layer 111 includes: the first first optical marker 1111 and the first second optical marker 1112 arranged in the same layer. The second optical marker group layer 121 includes: the second first optical marker 1211 and the second second optical marker 1212 arranged in the same layer.
[0099] The size of the first first optical marker 1111 is smaller than that of the first second optical marker 1112. The size of the second second optical marker 1212 is smaller than that of the second first optical marker 1211.
[0100] The orthographic projection of the first first optical marker 1111 on the second first optical marker 1211 falls within the range of the second first optical marker 1211.
[0101] The orthographic projection of the second second optical marker 1212 on the first second optical marker 1112 falls within the range of the first second optical marker 1112.
[0102] In this embodiment, please refer to Figure 6 , when preparing the first light-emitting layer 102, the first first optical marker 1111 and the first second optical marker 1112 are prepared simultaneously. When preparing the second light-emitting layer 103, the second first optical marker 1211 and the second second optical marker 1212 are prepared simultaneously. The first first optical marker 1111 and the second first optical marker 1211 are stacked. In the area where the first first optical marker 1111 with a smaller size is located, the colors have a superimposed effect and are darker, making it easy to be identified. In the area where the second first optical marker 1211 with a larger size is located and not superimposed with the first first optical marker 1111, the color is lighter and difficult to identify.
[0103] Similarly, the second optical mark 1112 of the first layer and the second optical mark 1212 of the second layer are stacked. The area corresponding to the second optical mark 1212 with a darker color is easily recognizable, while the area of the second optical mark 1112 of the first layer that is not superimposed with the second optical mark 1212 of the second layer and has a lighter color is not easily recognizable.
[0104] Therefore, among the first optical marks 1111 of the first layer and the second optical marks 1212 of the second layer that can be recognized, the layer number is consistent with the ordinal number of the optical marks, ensuring that the position information of the optical marks does not change and guaranteeing the accuracy of optical mark recognition.
[0105] Optionally, please refer to Figure 8 , the first optical mark 1111 of the first layer includes: the first color first sub-mark 1111a of the first layer, the second color first sub-mark 1111b of the first layer, and the third color first sub-mark 1111c of the first layer. The second optical mark 1112 of the first layer includes: the first color second sub-mark 1112a of the first layer, the second color second sub-mark 1112b of the first layer, and the third color second sub-mark 1112c of the first layer. The first optical mark 1211 of the second layer includes: the first color first sub-mark 1211a of the second layer, the second color first sub-mark 1211b of the second layer, and the third color first sub-mark 1211c of the second layer. The second optical mark 1212 of the second layer includes: the first color second sub-mark 1212a of the second layer, the second color second sub-mark 1212b of the second layer, and the third color second sub-mark 1212c of the second layer. The display module 100 further includes a reference mark 140. In this application, the alignment device 200 is used to identify the offset between the reference mark 140 and each optical mark, and estimate the offset of the mask plate assembly. The color or shape of the reference mark 140 is not limited herein as long as it is convenient for comparing the offset with the optical mark.
[0106] Optionally, the reference mark 140 is an anode mark prepared together with the anode layer 106.
[0107] The first color first sub-mark 1111a of the first layer and the first color first sub-mark 1211a of the second layer are stacked and corresponding. The size of the first color first sub-mark 1111a of the first layer is smaller than that of the first color first sub-mark 1211a of the second layer. Therefore, the area corresponding to the first color first sub-mark 1111a of the first layer has a darker color and is convenient for recognition. And the layer number is consistent with the ordinal number of the optical mark, which will not affect the position information of each mark.
[0108] The markings of the second color and the third color are similar to those of the first color. The first-layer second-color first sub-marking 1111b and the second-layer second-color first sub-marking 1211b are stacked and corresponding. The color corresponding to the first-layer second-color first sub-marking 1111b is darker, which is convenient for identification. The first-layer third-color first sub-marking 1111c and the second-layer third-color first sub-marking 1211c are stacked and corresponding. The color of the first-layer third-color first sub-marking 1111c is darker, which is convenient for identification.
[0109] Similarly, according to the principle that the number of layers is consistent with the ordinal number of the optical markings, the first-layer first-color second sub-marking 1112a and the second-layer first-color second sub-marking 1212a are stacked and corresponding. The second-layer first-color second sub-marking 1212a is smaller in size, and the corresponding area has a darker color, which is convenient for identification. The sub-markings of the second color and the third color in the second layer are the same, and will not be elaborated here.
[0110] Optionally, please refer to Figure 7 , the display module 100 further includes: a first-layer hole transport layer 104 marking and a second-layer hole transport layer 105 marking; the first-layer hole transport layer 104 marking is located between the substrate 101 and the first-layer first-color first sub-marking 1111a, and the second-layer hole transport layer 105 marking is located between the first-layer first-color first sub-marking 1111a and the second-layer first-color first sub-marking 1211a. Correspondingly, the display module 100 further includes a first-layer hole transport layer 104 located between the substrate 101 and the first-layer light-emitting layer 102, and a second-layer hole transport layer 105 located between the first-layer light-emitting layer 102 and the second-layer light-emitting layer 103.
[0111] When the display module 100 has three layers of light-emitting layers, three layers of optical markings can be prepared along with the three layers of light-emitting layers. Please refer to Figure 3 , in some possible implementation manners, the display module 100 further includes: a third optical marking group layer 131. The first optical marking group layer 111 further includes: a first-layer third optical marking 1113. The third optical marking group layer 131 includes: a third-layer third optical marking 1313.
[0112] The size of the first-layer first optical marking 1111 is smaller than the sizes of the other optical markings in the first layer. The size of the second-layer second optical marking 1212 is smaller than the sizes of the other optical markings in the second layer. The size of the third-layer third optical marking 1313 is smaller than the size of the first-layer third optical marking 1113.
[0113] In this embodiment, the second optical marker group layer 121 only needs to include the second-layer first optical marker 1211 and the second-layer second optical marker 1212. The second-layer second optical marker 1212 with the layer number consistent with the marker ordinal number has the smallest size in the second layer, and the corresponding area has the darkest color, which is convenient for identification. The third optical marker group layer 131 only needs to include the third-layer third optical marker 1313. Moreover, the size of the third-layer third optical marker 1313 is smaller than that of the first-layer third optical marker 1113. During the preparation of the first optical marker group layer 111, the first-layer third optical marker 1113 is formed on the substrate 101. Then, during the preparation of the third optical marker group layer 131, the third-layer third optical marker 1313 is formed on the first-layer third optical marker 1113. The area where the third-layer third optical marker 1313 and the first-layer third optical marker 1113 overlap corresponds to a darker color, which is convenient for identification.
[0114] In some possible implementation manners, please refer to Figure 4 , the second optical marker group layer 121 further includes: the second-layer third optical marker 1213. The third optical marker group layer 131 further includes: the third-layer first optical marker 1311 and the third-layer second optical marker 1312.
[0115] The size of the third-layer third optical marker 1313 is smaller than that of the other optical markers in the third layer.
[0116] The difference between this embodiment and the previous embodiment is that each layer of marker group layer provided in this embodiment has three optical markers. Among the three optical markers of each layer, the optical marker with the layer number consistent with the marker ordinal number has the smallest size, which can be called the first size. The sizes of the other two optical markers are not limited, as long as they are larger than the first size. In the finally obtained stacked test markers, the area corresponding to the optical marker with the first size has the darkest color and is the easiest to identify.
[0117] Optionally, each optical marker in the third layer can include optical markers of three colors, and finally a first optical marker group layer 111 with nine optical markers is formed. Each color of optical marker has three. For example, the first-layer first-color first sub-marker 1111a, the first-layer first-color second sub-marker 1112a, the first-layer first-color third sub-marker, the first-layer second-color first sub-marker 1111b, the first-layer second-color second sub-marker 1112b, the first-layer second-color third sub-marker, the first-layer third-color first sub-marker 1111c, the first-layer third-color second sub-marker 1112c, and the first-layer third-color third sub-marker, a total of nine optical markers. Similarly, the second layer also has nine optical markers corresponding one by one to the nine optical markers in the first layer, and the third layer also has nine optical markers corresponding one by one to the optical markers in the previous two layers.
[0118] Optionally, please refer to Figure 5 and the sizes of the respective optical marks of each layer are different.
[0119] In this embodiment, the first optical mark 1111 of the first layer is of the first size, the first optical mark 1211 of the second layer is of the second size, and the first optical mark 1311 of the third layer is of the third size. The first size, the second size, and the third size increase in sequence. Finally, in the stacked test marks obtained, the area where the first optical mark 1111 of the first layer is located has the darkest color, that is, the area with the darkest color is of the first size, corresponding to the layer number of the first optical mark (i.e., the first layer), and can be used as a mark for the first layer for identification and alignment.
[0120] Similarly, the first optical mark 1112 of the first layer is of the third size, the third optical mark 1213 of the second layer is of the second size. The first optical mark 1311 of the third layer is of the second size, and the second optical mark 1312 of the third layer is of the third size. In the finally obtained stacked test marks, the areas corresponding to the second optical mark 1212 of the second layer and the third optical mark 1313 of the third layer have the darkest colors in their respective stacked structures, which is convenient for identification.
[0121] Optionally, the materials of the first optical mark group layer 111 and the second optical mark group layer 121 are two of the first color luminescent material, the second color luminescent material, and the third color luminescent material.
[0122] In this embodiment, the stacked luminescent marks can also be composed of different color luminescent materials. For example, the first optical mark 1111 of the first layer of the first size is red, the first optical mark 1211 of the second layer of the second size is blue, and the first optical mark 1311 of the third layer of the third size is green. Finally, a mark component with three color shades is obtained, and the area corresponding to the red of the first size has the darkest color and is easy to identify.
[0123] The sizes or shapes of the optical marks of the present application can be freely combined, not limited to the cases listed in the above embodiments or the drawings of the present application.
[0124] In some possible implementation manners, please refer to Figure 9 , the first mark group layer 110 includes: a cushion layer 112. The second mark group layer 120 includes: at least one optical mark 122 arranged on the same layer.
[0125] The orthographic projections of the optical marks 122 on the cushion layer 112 all fall within the range of the cushion layer 112.
[0126] In this embodiment, a cushion layer 112 is prepared on the substrate 101 in advance, and at least one optical mark 122 is deposited on the cushion layer 112 by a conventional evaporation technique. The cushion layer 112 raises the relatively thin optical mark 122, reduces the distance between the optical mark 122 and the alignment device 200, increases the contrast of the optical mark 122, and improves the recognition rate of the optical mark 122. Figure 9 There are 8 optical marks 122 in it. The present application provides an implementation manner. The optical marks 122 corresponding to the first cushion layer 112 can be the first layer of red optical mark 122, the first layer of blue optical mark 122, and the first layer of green optical mark 122 respectively. The two optical marks 122 corresponding to the second cushion layer 112 are the first layer of hole transport layer 104 mark and the second layer of green optical mark 122 respectively. The two optical marks 122 corresponding to the third cushion layer 112 are the second layer of red optical mark 122 and the second layer of blue optical mark 122 respectively. The last cushion layer 112 corresponds to the second layer of hole transport layer 105 mark.
[0127] Optionally, the first layer of hole transport layer 104 mark is located between the first layer of red sub-pixel and the substrate 101, and the second layer of hole transport layer 105 mark is located between the second layer of red sub-pixel and the first layer of red sub-pixel. The blue and green sub-pixels do not need to have corresponding hole transport layers.
[0128] It can be understood that general test marks include marks formed by light-emitting materials and marks formed by electrode materials. The marks formed by electrode materials are obtained during the process of preparing the anode layer 106 or the cathode layer 107 on the substrate 101 before preparing the light-emitting layer. Generally, the marks formed by electrode materials are used as the standard positions. By comparing the deviation between the marks formed by light-emitting materials and the marks formed by electrode materials, the offset of the fine mask plate is estimated, and then the fine mask plate is stretched and compensated. In some possible implementation manners, please refer to Figure 10 and Figure 11 , the first mark group layer 110 includes: at least one electrode mark 113 arranged on the same layer. The second mark group layer 120 includes: at least one optical mark 122 arranged on the same layer.
[0129] The electrode mark 113 is located between the middle area of the optical mark 122 and the substrate 101. The edge area of the optical mark 122 is connected to the substrate 101.
[0130] In this embodiment, an optical mark 122 formed of a light-emitting material is prepared on an electrode mark 113 formed of an electrode material. While the electrode mark 113 can play a role in estimating the alignment deviation, it raises the optical mark 122 and shortens the distance between the optical mark 122 and the alignment device 200. Moreover, the optical mark 122 covers the electrode mark 113, which can prevent the leakage of the electrode material.
[0131] Based on the same inventive concept, an embodiment of the present application further provides a mask plate assembly for manufacturing the display module 100 provided in the above embodiment, including: a first-layer mask plate 310 and a second-layer mask plate 320.
[0132] The first-layer mask plate 310 and the second-layer mask plate 320 have corresponding pixel openings 301 with the same size.
[0133] The first-layer mask plate 310 further has a first-layer first optical mark opening 311 and a first-layer second optical mark opening 312. The size of the first-layer first optical mark opening 311 is smaller than the size of the first-layer second optical mark opening 312.
[0134] The second-layer mask plate 320 further has a second-layer first optical mark opening 321 and a second-layer second optical mark opening 322. The size of the second-layer second optical mark opening 322 is smaller than the size of the second-layer first optical mark opening 321.
[0135] Please refer to Figure 12 and Figure 13, in this embodiment, the first mask plate 310 is used to prepare the first light-emitting layer 102. Compared with the prior art, the first mask plate 310 has a first first optical mark opening 311 and a first second optical mark opening 312 with inconsistent sizes. Moreover, during the process of preparing the first light-emitting layer 102, the first second optical mark opening 312 is not blocked, so that the first first optical mark 1111 and the first second optical mark 1112 are evaporated and deposited simultaneously with the first light-emitting layer 102. The second mask plate 320 is used to prepare the second light-emitting layer 103. Compared with the prior art, the second mask plate 320 has a second first optical mark opening 321 and a second second optical mark opening 322 with inconsistent sizes. Moreover, during the process of preparing the second light-emitting layer 103, the second first optical mark opening 321 is not blocked, so that the second first optical mark 1211 and the second second optical mark 1212 are evaporated and deposited simultaneously with the second light-emitting layer 103. Finally, a display module 100 with two light-emitting layers and two optical mark group layers is formed on the substrate 101. In this application, there is no need to re-prepare the mask plate for preparing the optical mark group layer. Only in the existing mask plate, the opening corresponding to the optical mark with inconsistent layer number and optical mark ordinal number (such as the first second optical mark 1112) is enlarged, and the thickness of the deposited optical mark group layer is increased, which is convenient for the alignment device 200 to identify.
[0136] Optionally, please refer to Figure 14 , the mask plate assembly further includes: a third mask plate 330.
[0137] The third mask plate 330 has a pixel opening 301 corresponding to and having the same size as the pixel opening 301 of the first mask plate 310.
[0138] The first mask plate 310 further has a first third optical mark opening 313. The size of the first first optical mark opening 311 is smaller than the sizes of other optical mark openings on the first mask plate 310.
[0139] The third mask plate 330 further has a third third optical mark opening 331. The size of the third third optical mark opening 331 is smaller than the size of the first third optical mark opening 313.
[0140] This embodiment corresponds to a display module 100 with three light-emitting layers. The substrate 101 is evaporated and deposited through the first mask plate 310, the second mask plate 320, and the third mask plate 330 respectively to obtain a display module 100 with three light-emitting layers and three optical mark group layers.
[0141] Optionally, the second layer mask plate 320 further has a second layer third optical mark opening, corresponding to vapor deposition to obtain a second layer third optical mark. The third layer mask plate 330 further has a third layer first optical mark opening and a third layer second optical mark opening, corresponding to vapor deposition to obtain a third layer first optical mark 1311 and a third layer second optical mark 1312 respectively.
[0142] Optionally, the first layer mask plate 310, the second layer mask plate 320, or the third layer mask plate 330 can all be fine metal mask plates for preparing sub-pixels of the same color. Therefore, the pixel openings are consistent, and the only difference lies in whether the first layer light-emitting layer, the second layer light-emitting layer, or the third layer light-emitting layer is fabricated.
[0143] Optionally, the mask plate assembly further includes: a shielding mask plate. The shielding mask plate can shield other openings on the fine metal mask plate during the vapor deposition process, or shield areas that cannot be shielded by the fine metal mask plate, so that the vapor deposition material is deposited on the substrate 101 through the openings on the fine metal mask plate to obtain the required pattern.
[0144] Based on the same inventive concept, please refer to Figure 15 , the embodiment of the present application further provides a method for manufacturing a display module 100, including:
[0145] S101: Vapor deposit on the substrate 101 based on the first layer mask plate 310 to obtain a first layer first optical mark 1111 and a first layer second optical mark 1112 disposed on one side of the substrate 101. As described in the foregoing embodiment, the mask plate assembly includes a first layer mask plate 310 and a second layer mask plate 320.
[0146] In this embodiment, the first layer first optical mark 1111 and the first layer second optical mark 1112 are respectively deposited through the first layer first optical mark opening 311 and the first layer second optical mark opening 312. S102: Vapor deposit on the substrate 101 based on the second layer mask plate 320 to obtain a second layer first optical mark 1211 and a second layer second optical mark 1212. The orthographic projection of the first layer first optical mark 1111 on the second layer first optical mark 1211 falls within the range of the second layer first optical mark 1211. The orthographic projection of the second layer second optical mark 1212 on the first layer second optical mark 1112 falls within the range of the first layer second optical mark 1112.
[0147] In this embodiment, the second layer first optical mark 1211 and the second layer second optical mark 1212 are respectively deposited through the second layer first optical mark opening 321 and the second layer second optical mark opening 322.
[0148] Based on the same inventive concept, please refer to Figure 16The flowchart of the method. An embodiment of the present application also provides a method for manufacturing a display module 100, including:
[0149] S201: Evaporate and deposit on the substrate 101 based on the first mask plate 310 to obtain a first layer of first optical mark 1111, a first layer of second optical mark 1112, and a first layer of third optical mark 1113 disposed on one side of the substrate 101.
[0150] S202: Evaporate and deposit on the substrate 101 based on the second mask plate 320 to obtain a second layer of first optical mark 1211, a second layer of second optical mark 1212, and a second layer of third optical mark 1213.
[0151] S203: Evaporate and deposit on the substrate based on the third mask plate 310 to obtain a third layer of first optical mark 1311, a third layer of second optical mark 1312, and a third layer of third optical mark 1313; the mask plate assembly further includes a third mask plate 310; the size of the first layer of first optical mark 1111 is smaller than the sizes of other optical marks in the first layer; the size of the second layer of second optical mark 1212 is smaller than the sizes of other optical marks in the second layer; the size of the third layer of third optical mark 1313 is smaller than the sizes of other optical marks in the third layer; the orthographic projection of the third layer of third optical mark 1313 on the first layer of third optical mark 1113 or the second layer of third optical mark 1213 falls within the range of the first layer of third optical mark 1113 or the second layer of third optical mark 1213.
[0152] In this embodiment, after obtaining the first optical mark group layer 111 and the second optical mark group layer 121, continue to evaporate and deposit on the substrate 101 to obtain a display module 100 with three layers of light-emitting layers and three layers of optical mark group layers stacked with test marks. Among them, the area corresponding to the optical mark with the smallest size in each layer of optical mark group layer has the darkest color and is the easiest to identify.
[0153] This embodiment adopts the mask plate assembly in the foregoing embodiment. The mask plate assembly has been explained in detail in the foregoing embodiment and will not be elaborated here.
[0154] Applying the embodiment of the present application can at least achieve the following beneficial effects:
[0155] 1. In the embodiment of the present application, the first marker group layer 110 is disposed on one side of the substrate 101, the second marker group layer 120 faces the alignment device 200 and has a first recognition distance A from the alignment device 200. The stacked first marker group layer 110 and second marker group layer 120 are used for the alignment device 200 to recognize and align. When the second marker group layer 120 is relatively thin, the first marker group layer 110 can play a role in raising the second marker group layer 120, shortening the distance between the second marker group layer 120 and the alignment device 200, improving the contrast of the second marker group layer 120, and thus improving the recognition accuracy of the second marker group layer 120.
[0156] 2. The sizes of the first optical marker group layer 111 and the second optical marker group layer 121 are inconsistent. When two relatively thin optical marker group layers are stacked, the first optical marker group layer 111 and the second optical marker group layer 121 have a conventional effective recognition thickness and are easy to recognize. In other words, the relatively thin optical marker group layer has a lighter color and is difficult to recognize. After the two optical marker group layers are stacked, the color is darker and it is convenient to recognize.
[0157] 3. When preparing the first light-emitting layer 102, the first first optical marker 1111 and the first second optical marker 1112 of the first layer are prepared simultaneously. When preparing the second light-emitting layer 103, the second first optical marker 1211 and the second second optical marker 1212 of the second layer are prepared simultaneously. The first first optical marker 1111 of the first layer and the first first optical marker 1211 of the second layer are stacked. The area where the first first optical marker 1111 with a smaller size is located has a superimposed effect on the color, and the color is darker and is easy to be recognized. In the area where the larger-sized second first optical marker 1211 of the second layer is not superimposed with the first first optical marker 1111 of the first layer, the color is lighter and it is difficult to recognize.
[0158] 4. The second optical marker group layer 121 only needs to include the second first optical marker 1211 and the second second optical marker 1212 of the second layer. The size of the second second optical marker 1212 with the same number of layers as the marker ordinal number is the smallest in the second layer, and the corresponding area has the darkest color and is convenient to recognize. The third optical marker group layer 131 only needs to include the third third optical marker 1313 of the third layer. Moreover, the size of the third third optical marker 1313 of the third layer is smaller than the size of the first third optical marker 1113 of the first layer. During the process of preparing the first optical marker group layer 111, the first third optical marker 1113 of the first layer is formed on the substrate 101. Then, during the process of preparing the third optical marker group layer 131, the third third optical marker 1313 of the third layer is formed on the first third optical marker 1113 of the first layer. The area where the third third optical marker 1313 of the third layer and the first third optical marker 1113 of the first layer correspond and overlap has a darker color and is convenient to recognize.
[0159] 5. An optical mark formed of a luminescent material is prepared on an electrode mark 113 formed of an electrode material. While the electrode mark 113 can play a role in estimating the alignment deviation, it raises the optical mark and shortens the distance between the optical mark and the alignment device 200. Moreover, the optical mark covers the electrode mark 113, which can prevent the leakage of the electrode material.
[0160] Those skilled in the art of the present technology can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in this application can be alternated, changed, combined, or deleted. Further, other steps, measures, and solutions in the various operations, methods, and processes discussed in this application can also be alternated, changed, rearranged, decomposed, combined, or deleted. Further, those in the prior art having steps, measures, and solutions in the various operations, methods, and processes disclosed in this application can also be alternated, changed, rearranged, decomposed, combined, or deleted.
[0161] In the description of this application, the directions or positional relationships indicated by the words "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are the exemplary directions or positional relationships based on the drawings, which are for the convenience of describing or simplifying the embodiments of this application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to this application.
[0162] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise stated, the meaning of "a plurality" is two or more.
[0163] In the description of this application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0164] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.
[0165] It should be understood that although the steps in the flowcharts of the accompanying drawings are sequentially shown as indicated by the arrows, the execution order of these steps is not limited to the order indicated by the arrows. Unless otherwise clearly stated in this document, in some implementation scenarios of the embodiments of this application, the steps in each process can be executed in other orders according to requirements. Moreover, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on the actual implementation scenarios. Some or all of these sub-steps or stages can be executed at the same time or at different times. In scenarios where the execution times are different, the execution order of these sub-steps or stages can be flexibly configured according to requirements, and the embodiments of this application do not limit this.
[0166] The above are only some implementation manners of this application. It should be noted that for those of ordinary skill in the art, without departing from the technical concept of the solution of this application, adopting other similar implementation means based on the technical idea of this application also belongs to the protection scope of the embodiments of this application.
Claims
1. A display module, characterized in that, Comprising: a substrate, and a stacked first marker group layer and second marker group layer; the first marker group layer is disposed on one side of the substrate, the second marker group layer is for facing a alignment device and has a first recognition distance from the alignment device, and the stacked first marker group layer and second marker group layer are for the alignment device to recognize and align; the first marker group layer includes: a first optical marker group layer; the second marker group layer includes: a second optical marker group layer; the orthographic projection on the substrate of the smaller one of the first optical marker group layer and the second optical marker group layer falls within the orthographic projection range on the substrate of the larger one of the first optical marker group layer and the second optical marker group layer; the first optical marker group layer includes: a first layer of first optical markers and a first layer of second optical markers arranged on the same layer; the second optical marker group layer includes: a second layer of first optical markers and a second layer of second optical markers arranged on the same layer; the size of the first layer of first optical markers is smaller than the size of the first layer of second optical markers; the size of the second layer of second optical markers is smaller than the size of the second layer of first optical markers; the orthographic projection of the first layer of first optical markers on the second layer of first optical markers falls within the range of the second layer of first optical markers; the orthographic projection of the second layer of second optical markers on the first layer of second optical markers falls within the range of the first layer of second optical markers.
2. The display module according to claim 1, wherein The material of the first optical marker group layer is the same as the material of the second optical marker group layer.
3. The display module according to claim 2, wherein The display module further includes: a third optical marker group layer; the first optical marker group layer further includes: a first layer of third optical markers; the third optical marker group layer includes: a third layer of third optical markers; the size of the first layer of first optical markers is smaller than the size of other optical markers in the first layer; the size of the second layer of second optical markers is smaller than the size of other optical markers in the second layer; the size of the third layer of third optical markers is smaller than the size of the first layer of third optical markers.
4. The display module according to claim 3, wherein The second optical marker group layer further includes: a second layer of third optical markers; the third optical marker group layer further includes: a third layer of first optical markers and a third layer of second optical markers; the size of the third layer of third optical markers is smaller than the size of other optical markers in the third layer.
5. The display module according to claim 4, wherein, The sizes of the respective optical markers in each layer are all different.
6. The display module according to claim 1, wherein The material of the first optical marker group layer and the material of the second optical marker group layer are two of a first color light-emitting material, a second color light-emitting material, and a third color light-emitting material.
7. The display module according to claim 1, wherein The first marker group layer includes: a cushion layer; the second marker group layer includes: at least one optical marker arranged on the same layer; The orthographic projection of the optical marker on the cushion layer all falls within the range of the cushion layer.
8. The display module according to claim 1, wherein The first marker group layer includes: at least one electrode marker arranged on the same layer; the second marker group layer includes: at least one optical marker arranged on the same layer; The electrode marker is located between the middle region of the optical marker and the substrate; the edge region of the optical marker is connected to the substrate.
9. A mask plate assembly for manufacturing the display module according to any one of claims 1-4, characterized in that, Comprising: a first layer mask plate and a second layer mask plate; The first layer mask plate and the second layer mask plate have corresponding pixel openings with the same size; The first layer mask plate further has a first optical mark opening and a second optical mark opening on the first layer; The size of the first optical mark opening on the first layer is smaller than the size of the second optical mark opening on the first layer; The second layer mask plate further has a first optical mark opening and a second optical mark opening on the second layer; The size of the second optical mark opening on the second layer is smaller than the size of the first optical mark opening on the second layer.
10. The mask plate assembly according to claim 9, wherein, It further includes: A third layer mask plate; The third layer mask plate has pixel openings corresponding to and with the same size as the pixel openings of the first layer mask plate; The first layer mask plate further has a third optical mark opening on the first layer; the size of the first optical mark opening on the first layer is smaller than the size of other optical mark openings on the first layer mask plate; The third layer mask plate further has a third optical mark opening on the third layer; the size of the third optical mark opening on the third layer is smaller than the size of the third optical mark opening on the first layer.
11. A method for preparing a display module according to any one of claims 1-4, characterized in that, It includes: Evaporating the substrate based on the first layer mask plate to obtain a first optical mark and a second optical mark on the first layer disposed on one side of the substrate ; The mask plate assembly according to any one of claims 9-10 includes the first layer mask plate and the second layer mask plate; Evaporating the substrate based on the second layer mask plate to obtain a first optical mark and a second optical mark on the second layer; the orthographic projection of the first optical mark on the first layer on the first optical mark on the second layer falls within the range of the first optical mark on the second layer; the orthographic projection of the second optical mark on the second layer on the second optical mark on the first layer falls within the range of the second optical mark on the first layer.
12. The preparation method according to claim 11, wherein Evaporating the substrate based on the first layer mask plate to obtain a first optical mark and a second optical mark on the first layer disposed on one side of the substrate, including: Evaporating the substrate based on the first layer mask plate to obtain a first optical mark, a second optical mark, and a third optical mark on the first layer disposed on one side of the substrate; And, evaporating the substrate based on the second layer mask plate to obtain a first optical mark and a second optical mark on the second layer, including: Evaporating the substrate based on the second layer mask plate to obtain a first optical mark, a second optical mark, and a third optical mark on the second layer; And, after evaporating the substrate based on the second layer mask plate to obtain a first optical mark and a second optical mark on the second layer, it further includes: Performing evaporation coating on the substrate based on the third-layer mask plate to obtain a third-layer first optical mark, a third-layer second optical mark, and a third-layer third optical mark; the mask plate assembly further includes: a third-layer mask plate; the size of the first optical mark in the first layer is smaller than the sizes of other optical marks in the first layer; the size of the second optical mark in the second layer is smaller than the sizes of other optical marks in the second layer; the size of the third optical mark in the third layer is smaller than the sizes of other optical marks in the third layer; the orthographic projection of the third optical mark in the third layer on the third optical mark in the first layer or the third optical mark in the second layer falls within the range of the third optical mark in the first layer or the third optical mark in the second layer.
Citation Information
Patent Citations
Polarizer attaching and cutting integrated method and equipment for liquid crystal display panel
CN108845439A
Display module and electronic equipment
CN214705933U