A light-emitting structural member and a vehicle

Abstract

The present invention provides a light-emitting structural member and a vehicle. The light-emitting structural member includes a substrate and a light-emitting film layer disposed on the substrate. The light-emitting film layer includes a first conductive layer, a light-emitting layer, a second conductive layer, and a first insulating layer. The first insulating layer is disposed on the first conductive layer. The light-emitting layer and the second conductive layer are located on a side of the first insulating layer facing away from the first conductive layer, and the light-emitting layer is located between the first conductive layer and the second conductive layer. The first conductive layer has a first connection port for electrical connection, and the second conductive layer has a second connection port for electrical connection. It further includes a superconducting layer. The superconducting layer is located on a side of the first insulating layer facing away from the first conductive layer, and the superconducting layer, the light-emitting layer, and the second conductive layer are electrically connected. The light-emitting film layer has a relatively thin thickness, requires less space, and has a high structural freedom, with little influence on the structure and size changes of the substrate itself, which can effectively reduce the overall size of the light-emitting structural member, thereby effectively improving the rational layout of the structural members in the vehicle.

Description

Technical Field

[0001] The present invention relates to the technical field of light-emitting devices, and particularly to a light-emitting structural member and a vehicle. Background Art

[0002] With the continuous development and update of vehicle technologies, people's demands for vehicles are no longer limited to driving functions, but also have higher pursuits for the appearance and color of vehicles. For example, a light-emitting vehicle body, logo, and exterior body trim can enable a vehicle to achieve more personalized settings, improve the aesthetics of the vehicle, and effectively enhance the user experience.

[0003] Currently, the lighting of exterior body trim is mostly achieved through light sources. Taking a light-emitting vehicle logo as an example, usually, a light-emitting device is provided on the vehicle logo. For example, a light-emitting diode (LED). Through the light emitted by the light-emitting diode, the vehicle logo can be made to emit light.

[0004] However, the above-mentioned light-emitting device occupies a large space, increasing the overall structure of the light-emitting vehicle logo and being unfavorable for the space layout of the vehicle. Summary of the Invention

[0005] The present invention provides a light-emitting structural member and a vehicle to solve the problem that in the existing light-emitting vehicle logo, the light-emitting device emits light, the light-emitting device occupies a large space, increasing the overall size of the light-emitting vehicle logo and being unfavorable for the space layout of the vehicle.

[0006] The first aspect of the present application provides a light-emitting structural member, including a substrate and a light-emitting film layer provided on the substrate. The light-emitting film layer includes: a first conductive layer, a light-emitting layer, a second conductive layer, and a first insulating layer;

[0007] The first insulating layer is provided on the first conductive layer. The light-emitting layer and the second conductive layer are located on a side of the first insulating layer facing away from the first conductive layer, and the light-emitting layer is located between the first conductive layer and the second conductive layer. The first conductive layer has a first connection port for electrical connection, and the second conductive layer has a second connection port for electrical connection;

[0008] It further includes a superconducting layer. The superconducting layer is located on a side of the first insulating layer facing away from the first conductive layer, and the superconducting layer, the light-emitting layer, and the second conductive layer are electrically connected.

[0009] That is, by forming a light-emitting film layer on the base material of the light-emitting structural member, the light-emitting effect of the light-emitting structural member can be achieved, and a good light-emitting effect can also be obtained. That is to say, only by providing a light-emitting film layer on the light-emitting structural member and connecting the light-emitting film layer to a power source can the light-emitting structural member emit light. The thickness of the light-emitting film layer is usually relatively thin, requiring less space, and having a high degree of structural freedom, with less impact on the structure and size of the base material itself. In this way, the overall size of the light-emitting structural member can be effectively reduced, thereby effectively improving the reasonable layout of the structural members in the vehicle.

[0010] In a possible implementation manner, the first conductive layer, the first insulating layer, the light-emitting layer, the second conductive layer, and the superconducting layer are sequentially stacked.

[0011] In a possible implementation manner, the base material at least includes an appearance surface and an inner side surface opposite to the appearance surface;

[0012] The base material is a light-transmitting base material, and the light-emitting film layer is provided on the inner side surface;

[0013] Alternatively, the light-emitting film layer is provided on the appearance surface.

[0014] In a possible implementation manner, the first conductive layer is located at one end of the light-emitting film layer facing the base material;

[0015] Alternatively, the first conductive layer is located at one end of the light-emitting film layer facing away from the base material.

[0016] In a possible implementation manner, a second insulating layer is further included, and the second insulating layer is located on a side of the light-emitting film layer facing away from the base material.

[0017] In a possible implementation manner, a color layer is further included; when the light-emitting film layer is located on the inner side surface, the color layer is located between the light-emitting film layer and the base material.

[0018] In a possible implementation manner, a color layer is further included;

[0019] When the light-emitting film layer is located on the appearance surface, the color layer is located on a side of the light-emitting film layer facing away from the base material.

[0020] In a possible implementation manner, the color layer includes a color display layer and a protective layer, and the color display layer is located between the second insulating layer and the protective layer.

[0021] In a possible implementation manner, the forming material of the superconducting layer at least includes a superconducting material, an acrylic resin, a polyester resin, a solvent, and an additive;

[0022] The mass percentage of the superconducting material is 5% - 7%, the mass percentage of the acrylic resin is 45% - 55%, the mass percentage of the polyester resin is 12% - 18%, the mass percentage of the solvent is 20% - 25%, and the mass percentage of the additive is 1% - 5%.

[0023] The second aspect of the present application provides a vehicle, including any one of the above-mentioned light-emitting structural members. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of a light-emitting structural member provided by an embodiment of the present application;

[0026] Figure 2 It is a schematic structural diagram of another light-emitting structural member provided by an embodiment of the present application;

[0027] Figure 3 It is a schematic structural diagram of yet another light-emitting structural member provided by an embodiment of the present application;

[0028] Figure 4 It is a schematic structural diagram of still another light-emitting structural member provided by an embodiment of the present application;

[0029] Figure 5 It is a schematic structural diagram of a light-emitting structural member with a color layer provided by an embodiment of the present application;

[0030] Figure 6 It is a schematic structural diagram of another light-emitting structural member with a color layer provided by an embodiment of the present application;

[0031] Figure 7 It is a preparation flow chart of a light-emitting structural member provided by an embodiment of the present application;

[0032] Figure 8 It is a preparation flow chart of another light-emitting structural member provided by an embodiment of the present application.

[0033] Description of the Reference Numerals:

[0034] 100 - light-emitting structural member; 10 - base material; 11 - appearance surface;

[0035] 12 - inner side surface; 20 - light-emitting film layer; 21 - first conductive layer;

[0036] 22 - The first insulating layer; 23 - The light - emitting layer; 24 - The second conductive layer;

[0037] 25 - The superconducting layer; 26 - The second insulating layer; 27 - The color layer;

[0038] 271 - The color - rendering layer; 272 - The protective layer. Detailed implementation manners

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0040] The embodiments of the present application provide a light - emitting structural member and a vehicle including the light - emitting structural member. Among them, the vehicle can be any vehicle that requires a light - emitting function, such as an automobile, a bus, a small truck, a large truck, a train, a locomotive, etc.

[0041] The following takes the vehicle as an automobile for illustration.

[0042] The vehicle may include a vehicle body and a light - emitting structural member. The light - emitting structural member can be a light - emitting vehicle logo, a light - emitting grille, a light - emitting vehicle body, etc. Or, it can also be other structural members in the vehicle that need to emit light.

[0043] Among them, the vehicle may further include a steering wheel, an engine, a brake, an accelerator, etc. to realize the normal driving of the vehicle. Of course, in some examples, the vehicle may further include other structural members for realizing its functions, such as a vehicle shell, a vehicle frame, a car door, a wheel, a car seat, etc., which are not limited in the embodiments of the present application.

[0044] Taking the light - emitting vehicle logo as an example, generally, in order to make the vehicle logo emit light, in the related art, a light - emitting device, such as an LED lamp, is arranged on the vehicle logo, and the light emitted by the LED lamp is used to realize the light emission of the vehicle logo. However, the above - mentioned light - emitting device usually occupies a large space, and its arrangement on the vehicle logo will increase the overall size of the vehicle logo, which is not conducive to the spatial layout of each structural member on the vehicle. Moreover, the light emission of the vehicle logo needs to be realized by means of a light source (i.e., the light - emitting device). When designing the vehicle logo, the installation of the light - emitting device and other issues also need to be considered, thus increasing the overall design difficulty of the vehicle logo and increasing the workload. In addition, when realizing the light emission of the vehicle logo through the light - emitting device, the flexibility is relatively low, and it is difficult to realize the setting of personalized patterns on the vehicle logo.

[0045] Based on the above problems, a light-emitting structural member provided by the present application can effectively reduce the overall size of the light-emitting structural member and reduce the required installation space thereof, thereby effectively improving the reasonable layout of each structural member in the vehicle.

[0046] Figure 1 It is a schematic structural diagram of a light-emitting structural member provided by an embodiment of the present application.

[0047] An embodiment of the present application provides a light-emitting structural member 100. Refer to Figure 1 As shown, it includes a base material 10 and a light-emitting film layer 20 provided on the base material 10. Among them, the base material 10 can be a vehicle logo, a grille, or any other structural member that needs to emit light.

[0048] Among them, the light-emitting film layer 20 functions to emit light to achieve the overall light emission of the light-emitting structural member 100. The light-emitting film layer 20 can be composed of multiple film layers. The multiple film layers can be stacked, and each film layer can be a film layer formed by paint, coating, etc.

[0049] The formation method of the light-emitting film layer 20 on the base material 10 can be various. For example, each film layer can be first formed and then sequentially stacked on the base material 10 to form the light-emitting film layer 20 on the base material 10. Or, each film layer can also be sequentially formed on the base material 10 by spraying or other methods to form the light-emitting film layer 20 on the base material 10.

[0050] In the embodiment of the present application, taking the example of sequentially spraying to form the light-emitting film layer 20 on the base material 10 for illustration. Specifically, refer to Figure 1 As shown, the light-emitting film layer 20 can include a first conductive layer 21, a first insulating layer 22, a light-emitting layer 23, and a second conductive layer 24.

[0051] Among them, the first insulating layer 22 can be provided on the first conductive layer 21. The light-emitting layer 23 and the second conductive layer 24 are both located on the side of the first insulating layer 22 facing away from the first conductive layer 21, and the light-emitting layer 23 is located between the first conductive layer 21 and the second conductive layer 24. And the light-emitting layer 23 is electrically connected to the second conductive layer 24. Specifically, the light-emitting layer 23 and the second conductive layer 24 can be formed of materials with conductive functions, and the light-emitting layer 23 and the second conductive layer 24 can be in contact and conduct to achieve the electrical connection between the two.

[0052] Among them, power supply electrodes can be respectively connected to the first conductive layer 21 and the second conductive layer 24, and the first insulating layer 22 can isolate the first conductive layer 21 and the second conductive layer 24 to prevent the first conductive layer 21 from coming into contact with the second conductive layer 24 and causing a short-circuit phenomenon in the light-emitting film layer 20.

[0053] Specifically, a first connection port for electrical connection (not shown in the figure) is provided on the first conductive layer 21, and a second connection port for electrical connection (not shown in the figure) is provided on the second conductive layer 24. The first connection port and the second connection port can be respectively connected to the electrodes of the power supply, which enables the first conductive layer 21 and the second conductive layer 24 to be respectively connected to the electrodes of the power supply, so that the light-emitting film layer 20 can be connected to the power supply.

[0054] For example, the first connection port can be connected to the positive electrode of the power supply, and the second connection port can be connected to the negative electrode of the power supply. Alternatively, it can also be that the first connection port is connected to the negative electrode of the power supply, and the second connection port is connected to the positive electrode of the power supply. In the embodiments of the present application, the case where the first connection port is connected to the positive electrode of the power supply and the second connection port is connected to the negative electrode of the power supply will be taken as an example for description.

[0055] That is, the first conductive layer 21 is connected to the positive electrode of the power supply, and the second conductive layer 24 is connected to the negative electrode of the power supply, while the first insulating layer 22 isolates the first conductive layer 21 from the second conductive layer 24. In this way, an electric field will be generated between the first conductive layer 21 and the second conductive layer 24, and the light-emitting layer 23 is located between the first conductive layer 21 and the second conductive layer 24. The light-emitting layer 23 can emit light under the action of the electric field, so that the light-emitting film layer 20 can emit light, and thus the light-emitting structural member 100 can emit light.

[0056] For example, the light-emitting layer 23 may include rare earth elements. Rare earth elements are the general term for seventeen metal elements including lanthanide elements, scandium, and yttrium in the periodic table of elements. Rare earth elements have rich electronic energy levels. Under the action of an electric field, the electrons in the rare earth will undergo phenomena such as transition, change, and recombination to generate light. That is, the light-emitting layer 23 can emit light under the action of the electric field generated between the first conductive layer 21 and the second conductive layer 24.

[0057] The light-emitting film layer 20 further includes a superconducting layer 25. The superconducting layer 25 can be a film layer formed of a superconducting material. The superconducting layer 25 can be located on the side of the first insulating layer 22 facing away from the first conductive layer 21, and the superconducting layer 25 is electrically connected to the light-emitting layer 23 and the second conductive layer 24. The superconducting layer 25, the light-emitting layer 23, and the second conductive layer 24 can be electrically connected to each other in a pairwise contact manner. For example, the superconducting layer 25, the second conductive layer 24, and the light-emitting layer 23 can be sequentially stacked, so that the three can be electrically connected to each other through contact, thereby realizing their electrical connection.

[0058] The superconducting layer can improve the light-emitting performance of the light-emitting layer. Specifically, the light emitted by the light-emitting layer 23 in an electric field can be formed by multiple light-emitting points, and the superconducting layer 25 can make the arrangement of the light-emitting points more uniform and regular. The superconducting layer 25 can also increase the light-emitting intensity and area of the light-emitting points, effectively improving the brightness between two adjacent light-emitting points, making the light emitted by the light-emitting layer 23 more uniform, and effectively improving the light efficiency of the light-emitting film layer 20.

[0059] That is, in the embodiment of the present application, the light-emitting structure 100 can emit light by forming the light-emitting film layer 20 on the substrate 10 of the light-emitting structure 100, and can also have a good light-emitting effect. Compared with the method of setting light-emitting devices in the related art, only by setting the light-emitting film layer 20 on the substrate of the light-emitting structure 100 and connecting the light-emitting film layer 20 to a power source, the light-emitting structure 100 can emit light. The light-emitting film layer 20 is relatively thin, requires less space, and has a high degree of structural freedom, having little impact on the structure and size of the substrate 10 itself. This can effectively reduce the overall size of the light-emitting structure 100, thereby effectively improving the reasonable layout of the structural components in the vehicle.

[0060] At the same time, by realizing the light emission of the light-emitting structure 100 through the light-emitting film layer 20 without relying on light source devices such as LEDs, there is no need to consider issues such as the fixed installation of such devices, which can further reduce the design difficulty of the light-emitting structure 100 and reduce the workload.

[0061] Moreover, the light-emitting film layer 20 has a high degree of structural freedom, and patterns of any shape can be formed on the light-emitting structure 100. When the light-emitting film layer 20 is connected to a power source, light-emitting patterns of any shape can be formed on the light-emitting structure 100, effectively meeting the design requirements for personalized light-emitting patterns of the vehicle and improving the aesthetics of the vehicle.

[0062] At the same time, the superconducting layer 25 can make the light-emitting layer 23 emit more uniform light, thereby effectively improving the light efficiency of the light-emitting film layer 20 and further improving the light-emitting performance of the light-emitting structure 100. In addition, the superconducting layer 25 also has good thermal conductivity, which helps to dissipate heat from the light-emitting film layer 20, effectively reducing or avoiding the normal light emission of the light-emitting film layer 20 being affected by excessive temperature, thereby effectively improving the stability and reliability of the light-emitting structure 100.

[0063] Continue to refer to Figure 1 As shown, the first conductive layer 21, the first insulating layer 22, the light-emitting layer 23, the second conductive layer 24, and the superconducting layer 25 can be stacked, that is, among the above-mentioned film layers forming the light-emitting film layer 20, they can be arranged in sequence in the manner of the first conductive layer 21, the first insulating layer 22, the light-emitting layer 23, the second conductive layer 24, and the superconducting layer 25.

[0064] Of course, in some examples, the above-mentioned film layers may also be arranged in sequence in the order of the first conductive layer 21, the first insulating layer 22, the light-emitting layer 23, the superconducting layer 25, and the second conductive layer 24.

[0065] Alternatively, the above-mentioned film layers may also be arranged in the order of the first conductive layer 21, the first insulating layer 22, the superconducting layer 25, the light-emitting layer 23, and the second conductive layer 24.

[0066] Hereinafter, the arrangement order of the above-mentioned film layers in the order of the first conductive layer 21, the first insulating layer 22, the light-emitting layer 23, the second conductive layer 24, and the superconducting layer 25 will be taken as an example for illustration.

[0067] Figure 2 It is a schematic structural diagram of another light-emitting structural member provided by an embodiment of the present application.

[0068] In the embodiment of the present application, referring to Figure 1 and Figure 2 as shown, the substrate 10 may include an appearance surface 11 and an inner side surface 12 opposite to the appearance surface 11. Among them, the appearance surface 11 may be the viewing surface of the substrate 10, and the inner side surface 12 is the surface of the substrate 10 opposite to the viewing surface.

[0069] Among them, the substrate 10 may be a transparent substrate, that is, the substrate 10 may be a structural member made of a transparent material. Referring to Figure 1 as shown, the light-emitting film layer 20 may be disposed on the inner side surface 12 of the substrate 10 (that is, on the surface opposite to the Figure 1 appearance surface 11). The light emitted by the light-emitting film layer 20 can pass through the transparent substrate 10, so that the light-emitting structural member 100 can emit light. The substrate 10 can play a certain protective role for the light-emitting film layer 20, and can reduce or avoid the light-emitting film layer 20 from being damaged or scratched, thereby effectively improving the light efficiency of the light-emitting film layer 20.

[0070] Alternatively, referring to Figure 2 as shown, the light-emitting film layer 20 may also be disposed on the appearance surface 11 of the substrate 10 (that is, on the surface opposite to the Figure 2 inner side surface 12). The light emitted by the light-emitting film layer 20 can be directly displayed without passing through the substrate 10. This can avoid the substrate 10 from blocking the light-emitting film layer 20, reduce or avoid the situation of poor light efficiency caused by the substrate 10 blocking the light-emitting film layer 20, and can effectively improve the light-emitting effect of the light-emitting structural member 100 and enhance the aesthetics of the light-emitting structural member 100.

[0071] It should be understood that when the light-emitting film layer 20 is disposed on the appearance surface 11 of the substrate 10, the substrate 10 may be a transparent substrate. Or, it may also be a non-transparent substrate. Specifically, the material of the substrate 10 can be selected and set according to specific scenario requirements.

[0072] Figure 3 This is a schematic structural diagram of another light-emitting structural member provided by an embodiment of the present application. Figure 4 This is a schematic structural diagram of yet another light-emitting structural member provided by an embodiment of the present application.

[0073] See Figure 3 As shown, in the light-emitting structural member 100, a second insulating layer 26 may further be included, and the second insulating layer 26 may be located at one end of the light-emitting film layer 20 facing away from the substrate 10.

[0074] The second insulating layer 26 has good insulation properties, can effectively block the current, avoid safety accidents such as electric shock, thereby effectively protecting the personal safety of the staff and improving the safety of the light-emitting structural member 100.

[0075] See Figure 3 As shown, for the setting manner of the light-emitting film layer 20 on the substrate 10, the first conductive layer 21 may be located at one end of the light-emitting film layer 20 facing the substrate 10, that is, the first conductive layer 21 is disposed close to the substrate 10. That is to say, when forming the light-emitting film layer 20 on the substrate 10, the first conductive layer 21 may be first coated on the substrate 10, and then the first insulating layer 22, the light-emitting layer 23, the second conductive layer 24, and the superconducting layer 25 are sequentially coated.

[0076] The second insulating layer 26 may be disposed on the side of the superconducting layer 25 facing away from the second conductive layer 24.

[0077] Or, see Figure 4 As shown, for the setting manner of the light-emitting film layer 20 on the substrate 10, the first conductive layer 21 is located at one end of the light-emitting film layer 20 facing away from the substrate 10, that is, the superconducting layer 25 is located at one end of the light-emitting film layer 20 facing the substrate 10, and the superconducting layer 25 is adjacent to the substrate. That is to say, when forming the light-emitting film layer 20 on the substrate, the superconducting layer 25 may be first coated on the substrate 10, and then the second conductive layer 24, the light-emitting layer 23, the first insulating layer 22, and the first conductive layer 21 are sequentially coated.

[0078] The second insulating layer 26 may be disposed on the side of the first conductive layer 21 facing away from the first insulating layer 22.

[0079] Among them, the second insulating layer 26 may be a film layer formed by paint, coating, etc. having insulating properties. The second insulating layer 26 may be first formed and then stacked on the superconducting layer 25 or the first conductive layer 21. Or, the second insulating layer 26 may also be coated on the superconducting layer 25 or the first conductive layer 21 by spraying or the like to form a film layer, and after the film layer is dried, the second insulating layer 26 can be formed.

[0080] Figure 5Schematic diagram of a light-emitting structural member with a color layer provided by an embodiment of the present application Figure 6 Schematic diagram of another light-emitting structural member with a color layer provided by an embodiment of the present application

[0081] See Figure 5 As shown, in the embodiment of the present application, the light-emitting film layer 20 may further include a color layer 27. The color layer 27 may be a film layer with a color. The light emitted by the light-emitting film layer 20 can be irradiated after passing through the color layer 27, so that the light-emitting structural member 100 can emit light of different colors, further improving the personalized design of the light-emitting structural member 100 and enhancing the aesthetics of the light-emitting structural member 100.

[0082] Among them, when the light-emitting film layer 20 is disposed on the inner side surface 12 of the transparent substrate 10, see Figure 5 As shown, the color layer 27 may be located between the light-emitting film layer 20 and the substrate 10. That is, when the light-emitting film layer 20 is coated on the inner side surface 12 of the substrate 10, the color layer 27 may be first coated on the inner side surface 12 of the substrate 10 (i.e., the side opposite to the appearance surface 11 in the figure), and then other film layers are coated. In this way, after the light emitted by the light-emitting layer 23 passes through the color layer 27, the light-emitting film layer 20 can emit colored light, effectively meeting the different color requirements of the light-emitting structural member 100.

[0083] When the light-emitting film layer 20 is located on the appearance surface 11 of the substrate 10, see Figure 6 As shown, the color layer 27 may be located on the side of the light-emitting film layer 20 facing away from the substrate 10. That is, when the light-emitting film layer 20 is disposed on the appearance surface 11 of the substrate 10, the superconducting layer 25, the second conductive layer 24, the light-emitting layer 23, the first insulating layer 22, the first conductive layer 21, and the second insulating layer 26 may be sequentially coated first, and finally the color layer 27 is disposed on the second insulating layer 26. In this way, the light emitted by the light-emitting layer 23 can also pass through the color layer 27, making the light-emitting film layer 20 emit colored light, thereby effectively meeting the color requirements of the light-emitting structural member 100.

[0084] Among them, the color layer 27 may be a film layer formed by paint, coating, etc. The color layer 27 may be first formed, and then the formed color layer 27 is disposed in the light-emitting structural member 100. Alternatively, it may also be a colored film layer coated and formed on the substrate 10 or the second insulating layer 26 by spraying or other means, and the color layer 27 can be formed after the film layer is dried.

[0085] The color layer may be a single color, or the color layer may also be composed of multiple colors. Specifically, the color of the color layer 27 may include red, yellow, green, blue, purple, etc., or it may also be any other color. The color of the color layer 27 can be selected and set according to the design requirements of the light-emitting structural member 100 and the specific scenario requirements.

[0086] It should be noted that when the light-emitting film layer 20 is disposed on the inner side surface 12 of the transparent substrate 10 and the color layer 27 is located between the light-emitting film layer 20 and the substrate 10, the substrate 10 can play a certain protective role for the color layer 27. Therefore, the color layer 27 may only include a color display layer. The color display layer may be a film layer with a color, and the color display layer can display colors, enabling the light-emitting film layer 20 to emit colored light.

[0087] When the light-emitting film layer 20 is located on the outer surface 11 of the substrate 10 and the color layer 27 is located on the side of the light-emitting film layer 20 facing away from the substrate 10, as shown in Figure 6 shown, the color layer 27 may include a color display layer 271 and a protective layer 272. The color display layer 271 may be located between the second insulating layer 26 and the protective layer 272. The protective layer 272 may be a transparent film layer, and the protective layer 272 can provide protection for the color display layer 271, preventing the color display layer 271 from being scratched or bumped, and avoiding the color display layer 271 from being damaged due to scratching or bumping, thereby affecting the color effect of the light-emitting film layer 20, effectively improving the light efficiency of the light-emitting structural member 100, and enhancing the aesthetics.

[0088] Among them, the color display layer 271 may be a film layer formed by paint, coating, etc. The color display layer 271 may be first formed, and then the formed color display layer 271 is disposed in the light-emitting structural member 100. Alternatively, a colored film layer may also be coated and formed on the substrate 10 or the second insulating layer 26 by spraying or other means, and the color display layer 271 can be formed after the film layer is dried.

[0089] The protective layer 272 may be a film layer formed by transparent paint, coating, etc. For example, the protective layer 272 may be a film layer formed by varnish. The protective layer may be first formed, and then the formed protective layer 272 is disposed on the color display layer 271. Alternatively, a protective film layer may also be coated and formed on the color display layer 271 by spraying or other means, and the protective layer 272 can be formed after the film layer is dried.

[0090] In the embodiment of the present application, the composition of the superconducting layer 25 at least includes a superconducting material, an acrylic resin, a polyester resin, a solvent, and an auxiliary agent. That is, the superconducting layer 25 is a film layer formed by a mixture of a superconducting material, an acrylic resin, a polyester resin, a solvent, and an auxiliary agent.

[0091] Among them, the superconducting material refers to a material that exhibits zero resistance and repels magnetic field lines under certain low-temperature conditions, and it is an important component material in the superconducting layer 25. When the superconducting layer 25 is electrically connected to the light-emitting layer 23, it can enable the light-emitting layer 23 to emit uniform light and improve the light efficiency of the light-emitting structural member 100.

[0092] Among them, the acrylic resin and the polyester resin can provide a certain adhesiveness for the superconducting layer 25, which can improve the adhesiveness between the superconducting layer 25 and the substrate 10 and other film layers, and enhance the overall structural stability and reliability of the light-emitting film layer 20. Or, other resins can also be included in the superconducting layer 25 to further improve the comprehensive performance of the superconducting layer 25.

[0093] The solvent can dissolve materials such as the superconducting material, acrylic resin, and polyester resin, so that the above materials are evenly fused together to form the superconducting layer 25. The auxiliary agent can be an auxiliary material used to improve other properties of the superconducting layer 25, so that the superconducting layer 25 has better comprehensive performance.

[0094] Among them, the superconducting material can be a copper-oxide superconductor, an iron-based superconductor, a magnesium boride superconductor, etc. Or, it can also be other types of superconducting materials. Specifically, the forming material of the superconducting material can be selected and set according to specific scenario requirements.

[0095] The solvent can be a lipid solvent. For example, butyl acetate, ethyl acetate, ethyl acetate, amyl acetate, etc. Or, it can also be a ketone solvent. For example, methyl ethyl ketone, acetone, cyclohexanone, etc. Or, the solvent can also be other types of solvents that can uniformly dissolve the above materials.

[0096] Among them, the mass percentage of the superconducting material in the superconducting layer 25 can be 5% - 7%, the mass percentage of the acrylic resin can be 45% - 55%, the mass percentage of the polyester resin can be 12% - 18%, the mass percentage of the solvent can be 20% - 25%, the mass percentage of the auxiliary agent can be 1% - 5%, and the mass percentage of other resins can be less than 5%. This can effectively improve the rationality of the ratio between the components in the superconducting layer 25, thereby effectively improving the comprehensive performance of the superconducting layer 25.

[0097] Specifically, the mass percentage of the acrylic resin can be 49%, the mass percentage of the polyester resin can be 15%, the mass percentage of the solvent can be 22.49%, and the mass percentage of the auxiliary agent can be 2.11%. This can further improve the rationality of the content of the acrylic resin, polyester resin, solvent, and auxiliary agent in the superconducting layer 25, thereby further improving the comprehensive performance of the superconducting layer 25.

[0098] Among them, the components of the light-emitting layer 23 can include rare earths, acrylic resin, polyester resin, solvent, and auxiliary agent. That is, the light-emitting layer 23 is a film layer formed by a mixture of rare earths, acrylic resin, polyester resin, solvent, and auxiliary agent.

[0099] Among them, the functions of the acrylic resin, polyester resin, solvent, and additives in the light-emitting layer 23 are the same as those of the above-mentioned materials in the superconducting layer 25, and will not be elaborated here. Of course, other resin materials can also be included in the light-emitting layer 23 to further achieve other properties of the light-emitting layer 23.

[0100] Among them, the solvent type in the light-emitting layer 23 can be the same as or different from the solvent type in the superconducting layer 25. Specifically, the solvent type in the light-emitting layer 23 can be selected and set according to specific scenario requirements, which will not be elaborated here either.

[0101] Among them, the mass percentage of rare earth in the light-emitting layer 23 can be 1% - 5%, the mass percentage of acrylic resin can be 45% - 50%, the mass percentage of polyester resin can be 12% - 18%, the mass percentage of solvent can be 15% - 25%, the mass percentage of additives can be 1% - 5%, and the mass percentage of other resins can be 5% - 10%. This can effectively improve the rationality of the ratio between various components in the light-emitting layer 23, thereby effectively improving the comprehensive performance of the light-emitting layer 23.

[0102] Specifically, the mass percentage of acrylic resin can be 47%, the mass percentage of polyester resin can be 14%, the mass percentage of solvent can be 19.75%, and the mass percentage of additives can be 3%. This can further improve the rationality of the content of acrylic resin, polyester resin, solvent, and additives in the light-emitting layer 23, thereby further improving the comprehensive performance of the light-emitting layer 23.

[0103] In the embodiments of the present application, the components of the first conductive layer 21 and the second conductive layer 24 can include a conductive material, acrylic resin, polyester resin, solvent, and additives. That is, the first conductive layer 21 and the second conductive layer 24 can be film layers formed by a mixture of a conductive material, acrylic resin, polyester resin, solvent, and additives, etc.

[0104] Among them, the conductive material refers to a material with conductive properties, which can endow the first conductive layer 21 and the second conductive layer 24 with conductive properties, so that an electric field can be generated after the first conductive layer 21 and the second conductive layer 24 are connected to the electrodes, thereby causing the light-emitting layer 23 to emit light, and enabling the light-emitting structural member 100 to emit light.

[0105] Among them, the conductive material can be a metal material, for example, it can be copper, aluminum, etc. Or, the conductive material can also be a non-metal material, for example, graphite. Among them, the above materials can be in powder form, for example, it can be copper powder, aluminum powder, graphite powder, etc., to facilitate the solvent to dissolve it.

[0106] Among them, the functions of the acrylic resin, polyester resin, solvent, and additives in the first conductive layer 21 and the second conductive layer 24 are the same as those of the above materials in the superconducting layer 25, and will not be elaborated here. Of course, other resin materials may also be included in the first conductive layer 21 and the second conductive layer 24 to further achieve other properties of the first conductive layer 21 and the second conductive layer 24.

[0107] The solvent type in the first conductive layer 21 and the second conductive layer 24 may be the same as that in the superconducting layer 25, or may be different.

[0108] The mass percentage of the conductive material in the first conductive layer 21 and the second conductive layer 24 may be 4% - 7%, the mass percentage of the acrylic resin may be 40% - 50%, the mass percentage of the polyester resin may be 15% - 20%, the mass percentage of the solvent may be 20% - 28%, the mass percentage of the additive may be 0.2% - 2%, and the mass percentage of other resins may be less than 10%. This can effectively improve the rationality of the ratio between the components in the first conductive layer 21 and the second conductive layer 24, thereby effectively improving the comprehensive performance of the first conductive layer 21 and the second conductive layer 24.

[0109] Specifically, the mass percentage of the acrylic resin may be 46.23%, the mass percentage of the polyester resin may be 17%, the mass percentage of the solvent may be 23.95%, and the mass percentage of the additive may be 0.82%. This can further improve the rationality of the content of the acrylic resin, polyester resin, solvent, and additive in the first conductive layer 21 and the second conductive layer 24, thereby further improving the comprehensive performance of the first conductive layer 21 and the second conductive layer 24.

[0110] It should be noted that the content of each forming material in the first conductive layer 21 and the second conductive layer 24 may be the same, or may be different, and this application does not make any restrictions.

[0111] The components of the first insulating layer 22 and the second insulating layer 26 may include insulating materials, acrylic resin, polyester resin, solvent, and additives. That is, the first insulating layer 22 and the second insulating layer 26 may be film layers respectively formed by a mixture of insulating materials, acrylic resin, polyester resin, solvent, and additives.

[0112] Among them, the insulating material is the key factor for the first insulating layer 22 and the second insulating layer 26 to achieve the insulating effect. By adding insulating materials to the first insulating layer 22 and the second insulating layer 26, the first insulating layer 22 can effectively isolate the first conductive layer 21 and the second conductive layer 24, improving the light efficiency of the light-emitting layer 23. At the same time, it can also enable the second insulating layer 26 to play a better role in preventing electric shock and improve the safety of the light-emitting structural member 100.

[0113] Among them, the insulating material can be titanium dioxide, putty powder, or other insulating materials. Specifically, the material of the insulating material can be selected and set according to specific scenario requirements.

[0114] Among them, the functions of acrylic resin, polyester resin, solvent, and additives in the first insulating layer 22 and the second insulating layer 26 are the same as those of the above materials in the superconducting layer 25, and will not be elaborated here. In addition, other resins may also be included in the first insulating layer 22 and the second insulating layer 26 to further achieve other properties of the first insulating layer 22 and the second insulating layer 26.

[0115] The type of solvent in the first insulating layer 22 and the second insulating layer 26 can be the same as that in the superconducting layer 25, or different.

[0116] The mass percentage of the insulating material in the first insulating layer 22 and the second insulating layer 26 can be 1% - 5%, the mass percentage of acrylic resin can be 45% - 55%, the mass percentage of polyester resin can be 8% - 15%, the mass percentage of solvent can be 15% - 25%, the mass percentage of additives can be 1% - 5%, and the mass percentage of other resins can be less than 15%. This can effectively improve the rationality of the ratio between the components in the first insulating layer 22 and the second insulating layer 26, thereby effectively improving the comprehensive performance of the first insulating layer 22 and the second insulating layer 26.

[0117] Specifically, the mass percentage of acrylic resin can be 51%, the mass percentage of polyester resin can be 12%, the mass percentage of solvent can be 19.57%, and the mass percentage of additives can be 2.83%. This can further improve the rationality of the content of acrylic resin, polyester resin, solvent, and additives in the first insulating layer 22 and the second insulating layer 26, thereby further improving the comprehensive performance of the first insulating layer 22 and the second insulating layer 26.

[0118] Figure 7 This is a flowchart for preparing a light-emitting structural member provided by an embodiment of the present application.

[0119] In a possible implementation manner, taking the light-emitting film layer 20 being located on the inner side 12 of the substrate 10, and the first conductive layer 21 being located at one end of the light-emitting film layer 20 facing away from the substrate 10, and the superconducting layer 25 being disposed adjacent to the substrate 10 as an example, the forming process of the light-emitting structural member 100 may include:

[0120] S101: Prepare the substrate;

[0121] Among them, the substrate 10 can be a transparent substrate 10, for example, it can be a transparent plastic part, and the transparent substrate 10 can be formed by injection molding.

[0122] Two ports can extend outward from the substrate 10. For example, a first port and a second port, so that the first conductive layer 21 and the second conductive layer 24 can extend to the two ports respectively to form a first connection port and a second connection port.

[0123] S102: Pretreatment;

[0124] Before coating the light-emitting film layer 20, the substrate 10 can be pre-treated, for example, cleaning, deburring, etc., so that the light-emitting film layer 20 can be better connected to the substrate 10, improving the stability and reliability of the light-emitting structure 100.

[0125] S103: Coat the superconducting layer;

[0126] The superconducting layer 25 can be set on the substrate 10 by spraying, brushing, etc., or can also be set on the substrate 10 by other means.

[0127] S104: Dry the superconducting layer;

[0128] The drying method of the superconducting layer can include baking, natural air drying, microwave drying, etc. For example, the drying of the superconducting layer 25 can be achieved by baking. Specifically, the substrate 10 coated with the superconducting layer 25 can be placed in an oven for baking and drying, so that the superconducting layer 25 is dried.

[0129] It should be noted that before drying the superconducting layer 25, the cleanliness of the superconducting layer 25 should be ensured to prevent impurities from falling into the superconducting layer 25 and affecting the normal light emission of the light-emitting film layer 20. If there are impurities, the impurities can be removed by wiping and other methods, and then dried to ensure the cleanliness of the superconducting layer 25.

[0130] S105: Coat the second conductive layer;

[0131] The second conductive layer 24 can be coated on the dried superconducting layer 25. The coating method of the second conductive layer 24 can refer to the coating method of the superconducting layer 25, which will not be elaborated here. Among them, when coating the second conductive layer 24, part of the second conductive layer 24 can be extended in the direction of the second port and cover the second port, so as to form a second connection port for the second conductive layer 24 to connect the electrode.

[0132] S106: Dry the second conductive layer;

[0133] Among them, the drying method of the second conductive layer 24 and the cleaning operation before drying can refer to the drying method and cleaning method of the superconducting layer 25, which will not be elaborated here.

[0134] S107: Coat the light-emitting layer;

[0135] S108: Dry the light-emitting layer;

[0136] The light-emitting layer 23 can be coated on the dried second conductive layer 24. The coating method and drying method of the light-emitting layer 23 can also refer to the coating method and drying method of the superconducting layer 25.

[0137] S109: Coat the first insulating layer;

[0138] S1010: Dry the first insulating layer;

[0139] The first insulating layer 22 can be coated on the dried light-emitting layer 23. The coating method and drying method of the first insulating layer 22 can also refer to the coating method and drying method of the superconducting layer 25.

[0140] S1011: Coat the first conductive layer;

[0141] S1012: Dry the first conductive layer;

[0142] The coating method and drying method of the first conductive layer 21 can also refer to the coating method and drying method of the superconducting layer 25, which will not be elaborated here.

[0143] Among them, the first conductive layer 21 can be coated on the dried first insulating layer 22 so that the first insulating layer 22 can isolate the first conductive layer 21 and the light-emitting layer 23, that is, isolate the first conductive layer 21 and the second conductive layer 24. At the same time, during the coating process of the first conductive layer 21, part of the first conductive layer 21 can extend towards the direction of the first port and cover the first port, thereby forming a first connection port for connecting the first conductive layer 21 to the electrode.

[0144] S1013: Coat the second insulating layer;

[0145] S1014: Dry the second insulating layer.

[0146] Among them, the coating and drying methods of the second insulating layer 26 can also refer to the coating and drying methods of the superconducting layer 25, which will not be elaborated here either.

[0147] The second insulating layer 26 can be coated on the dried first conductive layer 21 to isolate the light-emitting film layer 20 from the outside world and prevent safety accidents such as electric shock, thereby effectively improving the safety of the light-emitting structure 100.

[0148] Among them, according to the design requirements of the light-emitting structure 100, before coating the superconducting layer 25, that is, between steps S102 and S103, a color layer 27 can be first provided on the substrate 10. For example, colored paint or coating can be coated to form the color layer 27, or alternatively, a colored film can be pasted on the substrate in the form of a film, so that the light-emitting structure 100 can emit colored light.

[0149] Figure 8 This is a flowchart for preparing another light-emitting structural member provided by an embodiment of the present application.

[0150] In another possible implementation manner, taking the light-emitting film layer 20 being located on the appearance surface 11 of the substrate 10 and the first conductive layer 21 being located at one end of the light-emitting film layer 20 facing the substrate 10 as an example for illustration. The forming process of the light-emitting structural member 100 may include:

[0151] S201: Prepare the substrate;

[0152] S202: Pretreatment;

[0153] S203: Coat the first conductive layer;

[0154] S204: Dry the first conductive layer;

[0155] S205: Coat the first insulating layer;

[0156] S206: Dry the first insulating layer;

[0157] S207: Coat the light-emitting layer;

[0158] S208: Dry the light-emitting layer;

[0159] S209: Coat the second conductive layer;

[0160] S2010: Dry the second conductive layer;

[0161] S2011: Coat the superconducting layer;

[0162] S2012: Dry the superconducting layer;

[0163] S2013: Coat the second insulating layer;

[0164] S2014: Dry the second insulating layer;

[0165] S2015: Set the color layer.

[0166] The coating method and drying method of each of the above-mentioned film layers can be referred to the coating method and drying method of each film layer in the previous embodiment, and will not be elaborated here.

[0167] Wherein, when the light-emitting film layer 20 is arranged on the appearance surface 11 of the substrate 10, the substrate 10 may be a transparent substrate 10 or a non-transparent substrate 10, and the present application does not make any restrictions.

[0168] In addition, according to the design requirements of the light-emitting structural member 100, a color layer 27 can be provided on the second insulating layer 26. For example, colored paint or coating can be applied to form the color layer 27, or alternatively, a colored film can be adhered to the second insulating layer 26 in the form of film pasting.

[0169] Taking the spraying of colored coating as an example, specifically, a color-developing layer 271 can be first applied on the second insulating layer 26 so that the light-emitting structural member 100 can emit colored light. Then, a protective layer 272 can be applied on the color-developing layer 271 so that the protective layer 272 can provide protection for the color-developing layer 271, reducing or avoiding the damage of the color-developing layer 271 due to bumping or scratching, thereby effectively improving the light efficiency of the light-emitting film layer 20 and enhancing the aesthetics of the light-emitting structural member 100.

[0170] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0171] In the description of the present invention, it should be understood that the terms "including" and "having" used herein and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0172] Unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0173] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A light-emitting structural member, characterized in that, It includes a substrate and a light-emitting film layer disposed on the substrate. The light-emitting film layer includes: a first conductive layer, a light-emitting layer, a second conductive layer, and a first insulating layer; The first insulating layer is disposed on the first conductive layer. The light-emitting layer and the second conductive layer are located on a side of the first insulating layer facing away from the first conductive layer, and the light-emitting layer is located between the first conductive layer and the second conductive layer. The first conductive layer has a first connection port for electrical connection, and the second conductive layer has a second connection port for electrical connection. The first connection port and the second connection port are respectively connected to electrodes of a power source; It further includes a superconducting layer. The superconducting layer is located on a side of the first insulating layer facing away from the first conductive layer, and the superconducting layer, the light-emitting layer, and the second conductive layer are electrically connected by means of pairwise contact; The first conductive layer, the first insulating layer, the light-emitting layer, the second conductive layer, and the superconducting layer are sequentially stacked; The forming material of the superconducting layer at least includes a superconducting material, an acrylic resin, a polyester resin, a solvent, and an additive; The mass percentage of the superconducting material is 5% - 7%, the mass percentage of the acrylic resin is 45% - 55%, the mass percentage of the polyester resin is 12% - 18%, the mass percentage of the solvent is 20% - 25%, and the mass percentage of the additive is 1% - 5%.

2. The light-emitting structural member according to claim 1, wherein The substrate at least includes an outer surface and an inner side surface opposite to the outer surface; The substrate is a light-transmitting substrate, and the light-emitting film layer is disposed on the inner side surface; Alternatively, the light-emitting film layer is disposed on the outer surface.

3. The light-emitting structural member according to claim 2, characterized in that, The first conductive layer is located at an end of the light-emitting film layer facing the substrate; Alternatively, the first conductive layer is located at an end of the light-emitting film layer facing away from the substrate.

4. The light-emitting structural member according to claim 2, wherein, It further includes a second insulating layer. The second insulating layer is located on a side of the light-emitting film layer facing away from the substrate.

5. The light-emitting structural member according to claim 2, wherein It further includes a color layer; when the light-emitting film layer is located on the inner side surface, the color layer is located between the light-emitting film layer and the substrate.

6. The light-emitting structural member according to claim 4, wherein, It further includes a color layer; When the light-emitting film layer is located on the outer surface, the color layer is located on a side of the light-emitting film layer facing away from the substrate.

7. The light-emitting structural member according to claim 6, wherein, The color layer includes a color display layer and a protective layer, and the color display layer is located between the second insulating layer and the protective layer.

8. A vehicle, characterized in that, It includes the light-emitting structural member according to any one of claims 1 - 7 above.

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