Laser processing heat dissipation structure

Abstract

A laser processing heat dissipation structure includes: a metal shell with an installation cavity; the metal shell includes a base, a laser module, which is arranged on the base and located in the installation cavity; there are multiple laser modules, and the multiple laser modules are arranged on the base at intervals; a temperature equalizer is embedded in the base; and a water-cooled heat sink is attached to the side of the base away from the laser module. By embedding the temperature equalizer in the base, the temperature equalizer and the metal shell are in full contact, and the heat generated by the laser module is transferred to the temperature equalizer through the base. The temperature equalizer dissipates the heat quickly and efficiently, and the water-cooled heat sink takes away the dissipated heat. Compared with the structure in which the temperature equalizer is externally placed on the base, the structure in which the temperature equalizer is embedded in the base has a better heat dissipation effect, thereby increasing the service life of the laser module.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser processing heat dissipation structure. Background Art

[0002] Compared with traditional machining processes, laser processing has the characteristics of high efficiency and high precision. For laser cutting, cladding, and welding systems, a stable and reliable laser light source is essential, and one of the necessary conditions for the reliable operation of the laser light source is good thermal management. The current common laser thermal management method is to remove the heat from the various components inside the laser through water cooling. This heat dissipation method cannot meet the heat dissipation requirements for high-power lasers. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a laser processing heat dissipation structure, aiming to improve the heat dissipation efficiency of the existing laser processing structure.

[0004] To achieve the above purpose, the technical solution adopted in this application is to provide a laser processing heat dissipation structure, including:

[0005] The metal shell has a mounting cavity; the metal shell includes a base,

[0006] A laser module is disposed on the base and located in the mounting cavity; there are a plurality of laser modules, and the plurality of laser modules are arranged on the base at intervals;

[0007] A temperature homogenizing plate, embedded in the base; and

[0008] A water-cooled heat sink is attached to the side of the base facing away from the laser module;

[0009] The water-cooled heat sink comprises a plate body, a first water pipe and a second water pipe;

[0010] The first water pipe is disposed on the plate body and is close to the metal shell; the second water pipe is disposed on the plate body and is located beside the first water pipe, and the water flow direction in the first water pipe is opposite to the water flow direction in the second water pipe;

[0011] The first water pipe has a first water inlet located at one end of the plate body and a first water outlet located at the other end of the plate body; the first water pipe includes a plurality of first straight segments and a plurality of first curved segments; the plurality of first straight segments are arranged in the plate body at intervals on the left and right; the first curved segment conducts two adjacent first straight segments; the first water inlet is located on the first straight segment at the water inlet end; the first water outlet is located on the first straight segment at the water outlet end;

[0012] The second water pipe has a second water inlet and a second water outlet, the second water inlet and the first water outlet are located at the same end; the second water outlet and the first water inlet are located at the same end;

[0013] The second water pipe includes multiple second straight segments and multiple second curved segments; the multiple second straight segments are arranged at intervals on the left and right inside the plate body, and each second straight segment is located between two adjacent first straight segments; the second curved segment connects two adjacent second straight segments; the second water inlet is located on the second straight segment at the water inlet end; the second water outlet is located on the second straight segment at the water outlet end.

[0014] In one embodiment, the inner diameter of the second water pipe is larger than the inner diameter of the first water pipe.

[0015] In one embodiment, the second water pipe is connected to the first water pipe via a connecting piece so that the second water pipe and the first water pipe are positioned relative to each other.

[0016] In one embodiment, a mounting plate is provided in the mounting cavity along the length direction of the base, and the mounting plate is close to the side wall of the mounting cavity; a plurality of laser modules are spaced apart on the mounting plate so that a height difference is formed between the laser modules and the surface of the base.

[0017] In one embodiment, each of the laser modules includes a heat sink and a laser; the heat sink is bonded to the mounting plate via a first layer of thermal conductive paste; and the laser is mounted on the heat sink.

[0018] In one embodiment, the laser is bonded to the heat sink via a second layer of thermal conductive paste.

[0019] In one embodiment, the outer surface of the base close to the laser module is coated with a first heat dissipation adhesive layer and a second heat dissipation adhesive layer in sequence from the base to the laser module, and the first heat dissipation adhesive layer and the second heat dissipation adhesive layer both contain heat dissipation particles, and the diameter of the heat dissipation particles in the second heat dissipation adhesive layer is smaller than the diameter of the heat dissipation particles in the first heat dissipation adhesive layer.

[0020] The beneficial effect of the present application is that by embedding the temperature averaging plate in the base, the temperature averaging plate is in full contact with the metal shell, and the heat generated by the laser module is transferred to the temperature averaging plate through the base, and the temperature averaging plate dissipates the heat quickly and efficiently, and the water-cooled heat sink takes away the dissipated heat. Compared with the structure in which the temperature averaging plate is placed on the base, the structure in which the temperature averaging plate is embedded in the base has a better heat dissipation effect, thereby increasing the service life of the laser module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A three-dimensional diagram of a laser processing heat dissipation structure provided in an embodiment of the present application;

[0023] Figure 2 A cross-sectional view of a laser processed heat dissipation structure provided in an embodiment of the present application;

[0024] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0025] Figure 4 A schematic diagram of the structure of a first heat dissipation adhesive layer and a second heat dissipation adhesive layer provided in an embodiment of the present application;

[0026] Figure 5 A schematic diagram of the structure of a water-cooled heat sink provided in an embodiment of the present application;

[0027] Figure 6 A schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application;

[0028] Figure 7 It is the simulated temperature cloud diagram of Comparative Example 2;

[0029] Figure 8 This is a simulated temperature cloud diagram of an embodiment of the present application.

[0030] Among them, the reference numerals in the figure are:

[0031] 10. Metal shell 11. Base

[0032] 12. Mounting plate 20. Laser module

[0033] 21. Heat sink 22. Laser

[0034] 30. Temperature balancing plate 31. First metal plate

[0035] 32. Second metal plate 33. Capillary structure

[0036] 301, cavity 40, water cooling radiator

[0037] 41. Plate body 42. First water pipe

[0038] 421, first straight line segment 422, first curved segment

[0039] 401, first water inlet 402, first water outlet

[0040] 43. Second water pipe 431. Second straight line segment

[0041] 432, second curved section 403, second water inlet

[0042] 404, second water outlet 60, first heat dissipation adhesive layer 61, heat dissipation example

[0043] 70. Second heat dissipation adhesive layer. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] See also Figures 1 to 8 , the embodiment of the present application provides a laser processing heat dissipation structure, including:

[0049] The metal housing 10 is provided with a mounting cavity 101; the metal housing 10 includes a base 11,

[0050] The laser module 20 is disposed on the base 11 and is located in the mounting cavity 101; there are multiple laser modules 20, and the multiple laser modules 20 are arranged on the base 11 at intervals;

[0051] A temperature homogenizing plate 30 is embedded in the base 11; and

[0052] The water-cooling heat sink 40 is attached to the side of the base 11 away from the laser module 20 .

[0053] By embedding the temperature averaging plate 30 in the base 11, the temperature averaging plate 30 is in full contact with the metal housing 10. The heat generated by the laser module 20 is transferred to the temperature averaging plate 30 through the base 11. The temperature averaging plate 30 dissipates the heat quickly and efficiently, and the water-cooled heat sink 40 takes away the dissipated heat. Compared with the structure in which the temperature averaging plate is placed on the base, the structure in which the temperature averaging plate 30 is embedded in the base 11 has a better heat dissipation effect, thereby increasing the service life of the laser module.

[0054] like Figure 6 As shown, illustratively, the temperature-averaging plate 30 includes a first metal plate 31 and a second metal plate 32. The second metal plate 32 covers the first metal plate 31 and is solidified by diffusion welding. The sealing and bonding properties of the two are greatly improved by diffusion welding. A cavity 301 is formed inside the first metal plate 31 and the second metal plate 32. The cavity 301 is filled with a working medium. Optionally, the working medium is water, acetone, alcohol, etc. The first metal plate 31 is formed with a capillary structure 33 located in the cavity 301. After the heat reaches the capillary structure 33, the temperature of the capillary structure 33 reaches a certain value, causing the working medium to boil, so that the working medium heat evaporates and gasifies and flows around, and the steam is conducted to the second metal plate 32, thereby conducting the heat out through the second metal plate 32.

[0055] Exemplarily, the first metal plate 31 and the second metal plate 32 are both stamped, which makes the production and processing efficiency faster. And the first metal plate 31 and the second metal plate 32 are both the same composite structure. Optionally, the composite structure includes a first copper layer, a stainless steel layer and a second copper layer stacked in sequence from top to bottom. In order to ensure the structural strength of the product, stainless steel materials need to be used. However, a chemical reaction will occur when the working fluid contacts the stainless steel material, so copper material is used to separate them, which ensures the structural strength of the product while avoiding chemical reactions, and the copper material has a good heat dissipation effect.

[0056] Exemplarily, the metal housing 10 is made of copper, aluminum, alloy or other heat dissipating metal, and the metal housing 10 plays a role in heat dissipation.

[0057] The water-cooled heat sink 40 includes a plate body 41, a first water pipe 42 and a second water pipe 43; the first water pipe 42 is arranged on the plate body 41 and is close to the metal shell 10; the second water pipe 43 is arranged on the plate body 41 and is located beside the first water pipe 42, and the water flow direction in the first water pipe 42 is opposite to the water flow direction in the second water pipe 43. When the water flows from one end to the other end, as more and more heat is taken away, the water temperature becomes higher towards the back, and the heat dissipation effect will also decrease. By setting two water flows in opposite directions, even if the water temperature of one water flow increases towards the back, the water flow setting in the other direction can take away part of the heat, thereby ensuring uniformity and high efficiency of heat dissipation.

[0058] like Figure 5 As shown, exemplarily, the first water pipe 42 has a first water inlet 401 located at one end of the plate body 41 and a first water outlet 402 located at the other end of the plate body 41; the first water pipe 42 includes a plurality of first straight segments 421 and a plurality of first curved segments 422; the plurality of first straight segments 421 are arranged at intervals on the left and right inside the plate body 41; the first curved segment 422 connects two adjacent first straight segments 421; the first water inlet 401 is located on the first straight segment 421 at the water inlet end; the first water outlet 402 is located on the first straight segment 421 at the water outlet end.

[0059] The second water pipe 43 has a second water inlet 403 and a second water outlet 404. The second water inlet 403 and the first water outlet 402 are located at the same end; the second water outlet 404 and the first water inlet 401 are located at the same end; that is, the water flow directions of the first water pipe 42 and the second water pipe 43 are opposite.

[0060] The second water pipe 43 includes a plurality of second straight segments 431 and a plurality of second curved segments 432; the plurality of second straight segments 431 are arranged in the plate body 41 at intervals, and each second straight segment 431 is located between two adjacent first straight segments 421, that is, the first water pipe 42 and the second water pipe 43 basically cover the entire plate body 41, thereby dissipating heat comprehensively and greatly improving the heat dissipation effect. The second curved segment 432 conducts two adjacent second straight segments 431; the second water inlet 403 is located on the second straight segment 431 at the water inlet end; the second water outlet 404 is located on the second straight segment 431 at the water outlet end.

[0061] The inner diameter of the second water pipe 43 is larger than that of the first water pipe 42. That is, the water flow in the second water pipe 43 is larger than that in the first water pipe 42. Since the second water pipe 43 is relatively far from the heat source, the heat dissipation effect can be enhanced by increasing the water flow.

[0062] The second water pipe 43 is connected to the first water pipe 42 via a connector 44, so that the second water pipe 43 and the first water pipe 42 are positioned relative to each other. Exemplarily, the connector 44 is welded between the second water pipe 43 and the first water pipe 42, and the connector 44 enables the second water pipe 43 and the first water pipe 42 to form a whole relative to each other, so that the second water pipe 43 and the first water pipe 42 can be synchronously arranged in the plate body 41, avoiding deviation between the second water pipe 43 and the first water pipe 42 when the plate body 41 is installed.

[0063] A mounting plate 12 is provided in the mounting cavity 101 along the length direction of the base 11 , and the mounting plate 12 is close to the side wall of the mounting cavity 101 ; a plurality of laser modules 20 are spaced apart on the mounting plate 12 so that a height difference is formed between the laser modules 20 and the surface of the base 11 .

[0064] Each laser module 20 includes a heat sink 21 and a laser 22; the heat sink 21 is bonded to the mounting plate 12 through a first layer of thermal conductive paste; and the laser 22 is mounted on the heat sink 21. Optionally, the laser 22 is bonded to the heat sink 21 through a second layer of thermal conductive paste.

[0065] Optionally, the first layer of thermal conductive paste and the second layer of thermal conductive paste are both tin pastes, and have a thickness of 0.05 mm. The heat sink 21 is an aluminum nitride heat sink.

[0066] like Figure 3 and Figure 4 As shown, the outer surface of the base 11 near the laser module 20 is coated with a first heat dissipation adhesive layer 60 and a second heat dissipation adhesive layer 70 in sequence from the base 11 to the laser module 20. The first heat dissipation adhesive layer 60 and the second heat dissipation adhesive layer 70 both have heat dissipation particles 61. The diameter of the heat dissipation particles 61 in the second heat dissipation adhesive layer 70 is smaller than that of the heat dissipation particles 61 in the first heat dissipation adhesive layer 60. The heat dissipation particles 61 with smaller diameters can provide higher thermal conductivity. In other words, heat dissipation particles 61 with smaller particle sizes are filled near the laser module 20 to maximize the overall heat transfer through the product.

[0067] Exemplarily, the first heat dissipation adhesive layer 60 and the second heat dissipation adhesive layer 70 are both thermosetting materials or thermoplastic materials, and more preferably, thermoplastic materials are selected. For example, the first heat dissipation adhesive layer 60 and the second heat dissipation adhesive layer 70 can be, but are not limited to, epoxy, silicone, PPSU, PPS or a combination thereof.

[0068] Optionally, the weight of the heat dissipation particles 61 accounts for 10% or 20% of the weight of the first heat dissipation adhesive layer 60 or the second heat dissipation adhesive layer 70. And the particle diameter of the heat dissipation particles 61 is smaller than the thickness of the first heat dissipation adhesive layer 60 or the second heat dissipation adhesive layer 70. The material of the heat dissipation particles 61 can be but not limited to talc, silicon dioxide, titanium dioxide, boron nitride or aluminum oxide or a mixture thereof.

[0069] In order to better understand the heat dissipation performance of this product, several examples are compared.

[0070] Comparative Example 1:

[0071] Compared with the embodiment of the present application, Comparative Example 1 is not provided with a temperature equalizing plate, and the temperature of the laser modules at different positions is tested. The data are shown in Table 1:

[0072]

[0073] Table 1

[0074] Comparative Example 2:

[0075] Comparative Example 2 is a method for placing a temperature equalizing plate on the back of the base 11, and performing temperature tests on the laser modules at different positions. The data are shown in FIG. Figure 7 The simulated temperature cloud and Table 2:

[0076]

[0077] Table 2

[0078] Embodiments of the present application:

[0079] The temperature of the laser module at different positions is tested, and the data are as follows: Figure 8 The simulation temperature cloud and Table 3:

[0080]

[0081] Table 3

[0082] Comparing Comparative Example 1, Comparative Example 2 and the embodiment of the present application, it is found that the average temperature difference of the embodiment of the present application is the lowest, the maximum temperature difference is also relatively small, and the temperature equalization effect is good.

[0083] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A laser processing heat dissipation structure, characterized in that: include: The metal shell has a mounting cavity; the metal shell includes a base, A laser module is disposed on the base and located in the mounting cavity; There are multiple laser modules, and the multiple laser modules are arranged on the base at intervals; A temperature averaging plate, embedded in the base; as well as A water-cooled heat sink is attached to the side of the base facing away from the laser module; The water-cooled heat sink comprises a plate body, a first water pipe and a second water pipe; The first water pipe is disposed on the plate body and is close to the metal shell; the second water pipe is disposed on the plate body and is located beside the first water pipe, and the water flow direction in the first water pipe is opposite to the water flow direction in the second water pipe; The first water pipe has a first water inlet located at one end of the plate body and a first water outlet located at the other end of the plate body; the first water pipe includes a plurality of first straight segments and a plurality of first curved segments; the plurality of first straight segments are arranged in the plate body at intervals on the left and right; the first curved segment conducts two adjacent first straight segments; the first water inlet is located on the first straight segment at the water inlet end; the first water outlet is located on the first straight segment at the water outlet end; The second water pipe has a second water inlet and a second water outlet, the second water inlet and the first water outlet are located at the same end; the second water outlet and the first water inlet are located at the same end; The second water pipe includes multiple second straight segments and multiple second curved segments; the multiple second straight segments are arranged at intervals on the left and right inside the plate body, and each second straight segment is located between two adjacent first straight segments; the second curved segment connects two adjacent second straight segments; the second water inlet is located on the second straight segment at the water inlet end; the second water outlet is located on the second straight segment at the water outlet end.

2. The laser processing heat dissipation structure according to claim 1, characterized in that: The inner diameter of the second water pipe is larger than the inner diameter of the first water pipe.

3. The laser processing heat dissipation structure according to claim 1, characterized in that: The second water pipe is connected to the first water pipe via a connecting piece so that the second water pipe and the first water pipe are positioned relative to each other.

4. The laser processing heat dissipation structure according to claim 1, characterized in that: A mounting plate is provided in the mounting cavity along the length direction of the base, and the mounting plate is close to the side wall of the mounting cavity; a plurality of laser modules are arranged on the mounting plate at intervals so that a height difference is formed between the laser modules and the surface of the base.

5. The laser processing heat dissipation structure according to claim 4, characterized in that: Each of the laser modules comprises a heat sink and a laser; the heat sink is bonded to the mounting plate via a first layer of thermal conductive paste; and the laser is mounted on the heat sink.

6. The laser processing heat dissipation structure according to claim 5, characterized in that: The laser is bonded to the heat sink via a second layer of thermal conductive paste.

7. The laser processing heat dissipation structure according to any one of claims 1 to 6, characterized in that: The outer surface of the base close to the laser module is coated with a first heat dissipation adhesive layer and a second heat dissipation adhesive layer in sequence from the base to the laser module. Both the first heat dissipation adhesive layer and the second heat dissipation adhesive layer contain heat dissipation particles, and the diameter of the heat dissipation particles in the second heat dissipation adhesive layer is smaller than the diameter of the heat dissipation particles in the first heat dissipation adhesive layer.

Images