Preparation Method of Membrane Roll Assembly and Connector

Abstract

A film package is provided that can release an adhesive film exhibiting excellent adhesion even when subjected to short-term thermocompression bonding at low temperatures, and that can suppress the occurrence of blocking even when the adhesive film is wound over a long length. Specifically, a film package is provided that is formed by winding an adhesive film comprising a release substrate and an adhesive layer disposed on the release substrate onto a core, wherein the adhesive layer comprises (A) a radically polymerizable (meth)acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent, wherein the component (B) comprises an epoxy resin that is solid at room temperature, and the component (C) comprises an epoxy resin curing agent that is solid at room temperature.

Description

Technical Field

[0001] The present invention relates to a film package and a method for producing a connected body using the film package. Background Art

[0002] Adhesive films such as anisotropic conductive film (ACF) are widely used as a means of bonding electronic components to circuit boards. For example, in FPD modules, ACF is typically used to bond and electrically connect terminals on flexible printed circuits (FPCs) and rigid boards (FOBs), for example.

[0003] As such an adhesive film, an adhesive film containing an epoxy resin as an insulating binder resin has been conventionally used in view of its excellent adhesiveness and good connection reliability (for example, Patent Document 1).

[0004] In recent years, in order to reduce thermal stress on the terminal portion of a rigid substrate, etc., it has been required to reduce the temperature during thermocompression bonding using adhesive films. In addition, in order to not only reduce thermal stress but also improve production efficiency, it is also required to shorten the bonding time. From this perspective, adhesive films have been proposed that use free radical polymerizable (meth) acrylic compounds that can cure at low temperatures and in a short time as insulating binder resins, instead of epoxy resins that generally require high temperatures and long periods of thermocompression bonding (e.g., Patent Documents 2 and 3). Regarding adhesive films using free radical polymerizable (meth) acrylic compounds, there is room for improvement in adhesion. Adhesive films that use such free radical polymerizable (meth) acrylic compounds in combination with epoxy resins with excellent adhesion as insulating binder resins have also been proposed (e.g., Patent Documents 4 and 5).

[0005] On the other hand, adhesive films such as anisotropic conductive films are generally prepared in the form of a laminated film having a release substrate such as a PET film and an adhesive layer containing an insulating binder resin provided on the release substrate (layer structure: adhesive layer / release substrate). Figure 1 As shown, such an adhesive film (adhesive layer 2 / release substrate 3) is cut to a predetermined width and then stored and shipped as a film roll 1 wound around a core 5 on a reel 4. In the case of an adhesive film having a narrow width (e.g., less than 10 mm; in the present invention, the film is typically wound around a core 5 equipped with side plates (flanges) 6. During use, the adhesive films 2 and 3 are pulled out of the film roll 1, cut to the desired length, and then used to bond electronic components, etc.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 62-141083,

[0009] Patent Document 2: Japanese Patent Application Laid-Open No. 2011-202173,

[0010] Patent Document 3: Japanese Patent Application Laid-Open No. 2018-110120,

[0011] Patent Document 4: Japanese Patent Application Laid-Open No. 2013-138013,

[0012] Patent Document 5: Japanese Patent Application Laid-Open No. 2007-224228. Summary of the Invention

[0013] Problems to be solved by the invention

[0014] The adhesive films described in Patent Documents 4 and 5, which combine a radically polymerizable (meth)acrylic compound and an epoxy resin, are expected to exhibit excellent adhesion through low-temperature, short-time thermocompression bonding. Therefore, the present inventors, considering the use of bisphenol F-type epoxy resin as the epoxy resin, which is considered particularly preferred among the techniques described in Patent Documents 4 and 5, prepared film packages based on their practical application and attempted to use them for bonding electronic components, etc.

[0015] The results showed that in the prepared film roll, the adhesive layer overflowed from the exposed side of the adhesive film, and the adhesive layers adhered to each other across the peeling substrate, resulting in a problem of poor pull-out performance of the adhesive film from the film roll (hereinafter also referred to as "blocking"). The longer the wound adhesive film, the more significant this blocking is. In particular, in the case of a narrow width adhesive film, the adhesive layer overflowing from the exposed side of the adhesive film also comes into contact with the side plate (flange) of the reel and easily sticks, so the blocking is more serious. Although the sticking can be reduced by shortening the length of the adhesive film, in this case, the frequency of replacement of the film roll increases, and the production line needs to be stopped each time, which cannot avoid a decrease in production efficiency (from the perspective of productivity, the preparation of the connector (the use of the adhesive film) requires the adhesive film to be long).

[0016] An object of the present invention is to provide a film package that can release an adhesive film exhibiting excellent adhesiveness even when subjected to thermocompression bonding at low temperatures and for a short period of time, and that can suppress the occurrence of blocking even when the adhesive film is wound long.

[0017] Means of solving problems

[0018] The present inventors have conducted intensive studies on the above-mentioned problems and, as a result, have found that the above-mentioned problems can be solved by a film package having the following structure, thereby completing the present invention.

[0019] That is, the present invention includes the following contents.

[0020] [1] A film package comprising an adhesive film comprising a release substrate and an adhesive layer provided on the release substrate, wound around a core, wherein:

[0021] The adhesive layer contains (A) a radically polymerizable (meth)acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent.

[0022] The component (B) contains an epoxy resin that is solid at room temperature.

[0023] The component (C) contains an epoxy resin curing agent that is solid at room temperature.

[0024] [2] The film package according to [1], wherein the total amount of the epoxy resin that is solid at room temperature and the epoxy resin curing agent that is solid at room temperature is 2% by volume or more, when the total amount of the non-volatile components of the adhesive layer is 100% by volume.

[0025] [3] The film package according to [1] or [2], wherein the adhesive layer further contains a radical polymerization initiator.

[0026] [4] The film package according to any one of [1] to [3], wherein the radical polymerization initiator contains a radical polymerization initiator that is solid at room temperature.

[0027] [5] The film package according to any one of [1] to [4], wherein the length of the adhesive film is 5 m or longer.

[0028] [6] The film package according to any one of [1] to [5], wherein the width of the adhesive film is 5 mm or less.

[0029] [7] The film package according to any one of [1] to [6], wherein the adhesive film is wound around a core having side plates.

[0030] [8] The film package according to any one of [1] to [7], wherein the adhesive layer further contains conductive particles.

[0031] [9] A method for preparing a connector, comprising the steps of sandwiching the film package according to any one of [1] to [8] between a first electronic component and a second electronic component, and crimping the first electronic component and the second electronic component.

[0032] Effects of the Invention

[0033] According to the present invention, a film package can be provided that can release an adhesive film exhibiting excellent adhesiveness even by thermocompression bonding at low temperatures and for a short time, and can suppress the occurrence of blocking even when the adhesive film is wound long. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] [ Figure 1 ] Figure 1 Schematic diagram showing an example of a film package.

[0035] [ Figure 2 ] Figure 2 It is a schematic diagram which shows the overflow test of a film package. DETAILED DESCRIPTION

[0036] The present invention will be described in detail below based on preferred embodiments thereof. While reference may be made to the accompanying drawings during the description, each drawing merely schematically illustrates the shapes, sizes, and arrangements of the components to facilitate understanding of the invention. The present invention is not limited to the following description, and the components may be modified as appropriate without departing from the spirit of the present invention.

[0037] [Film package]

[0038] The film package of the present invention is a film package obtained by winding an adhesive film including a release substrate and an adhesive layer provided on the release substrate around a core, and is characterized in that:

[0039] The adhesive layer contains (A) a radically polymerizable (meth)acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent.

[0040] Component (B) contains an epoxy resin that is solid at room temperature.

[0041] Component (C) contains an epoxy resin curing agent that is solid at room temperature.

[0042] According to the adhesive film using a free radical polymerizable (meth) acrylic compound and an epoxy resin, it is expected that good adhesion will be achieved through low-temperature, short-time hot pressing, which will help improve the production efficiency and quality of target products represented by FPD modules. However, for such an adhesive film, when a film roll is prepared based on the actual use, and it is attempted to be used for bonding electronic components, etc., it is found that in the prepared film roll, the adhesive layer sometimes overflows from the exposed side of the adhesive film, and the adhesive layers stick to each other across the peeling substrate, thereby causing adhesion. The replacement frequency of the adhesive film is directly related to the productivity of the connection process because it will stop the production line. If it is a long size, the replacement frequency is less, so it is ideal, but the risk of adhesion will increase. In contrast, the present invention has discovered that, in a resin system combining a radically polymerizable (meth)acrylic compound and an epoxy resin, the combined use of an epoxy resin that is solid at room temperature and an epoxy resin curing agent that is solid at room temperature allows for the advantages of combining a radically polymerizable (meth)acrylic compound and an epoxy resin, such as excellent adhesion through low-temperature, short-time thermocompression bonding, while also achieving a significant effect of suppressing the occurrence of blocking, even when the adhesive film is wound over a long length (particularly when a narrow adhesive film, which is susceptible to severe blocking and handling, is wound over a long length). The film roll of the present invention significantly contributes to improving the production efficiency and quality of target products, such as FPD modules.

[0043] Figure 1 : is a schematic diagram showing an example of a film package. Figure 1 In the embodiment, the film roll 1 is formed by winding the adhesive films 2 and 3 around the core 5 of the reel 4. The reel 4 includes at least the core 5 for winding the adhesive film, and the core 5 has an axial hole for inserting a rotating shaft for rotating the reel 4. When winding an adhesive film with a narrow width (for example, less than 10 mm), the reel 4 usually includes side plates (flanges) 6 provided at both ends of the core 5 (at the Figure 1 1 and 2. A reel 4 is shown with side panels 6. Thus, in one embodiment, the adhesive film is wound onto a core with side panels.

[0044] One end of the adhesive film in the longitudinal direction is fixed to the core 5 (such a fixed portion is also referred to as a "joining portion"), and the adhesive film is wound. The adhesive film is wound on the core 5 of the reel 4 in the form of a laminated film (adhesive layer 2 / peeling substrate 3) containing a release substrate 3 and an adhesive layer 2 provided on the release substrate. The adhesive film can be wound in a manner such that the adhesive layer 2 is on the inner circumference side, or it can be wound in a manner such that the release substrate 3 is on the inner circumference side. In order to prevent contamination of the adhesive layer 2, a release substrate (so-called cover film) can also be provided on both sides.

[0045] The shape and size of the reel 4 (core 5, side plates 6) are not particularly limited as long as they can wind an adhesive film of the desired width and length, and may be any conventionally known shape and size. The width of the adhesive film and the effective width of the reel 4 (the distance between the side plates) can be adjusted based on adhesion and ease of film pullout.

[0046] <Adhesive Film>

[0047] Hereinafter, the adhesive film constituting the film package of the present invention will be described in detail.

[0048] In the present invention, the adhesive film includes a release substrate and an adhesive layer provided on the release substrate.

[0049] (Peeling substrate)

[0050] The release substrate is not particularly limited as long as it is a film-like material that can support the adhesive layer and can be peeled from the adhesive layer at a desired time. Examples of materials for the release substrate include polyesters such as polyethylene terephthalate (PET), polyolefins such as polypropylene (PP), poly-4-methyl-1-pentene (PMP), and plastic materials such as polytetrafluoroethylene (PTFE). Alternatively, the release substrate may include a release layer on the surface of the adhesive layer. The release layer may contain a release agent such as a silicone resin or a polyolefin resin.

[0051] The thickness of the release substrate is not particularly limited; however, from the perspective of enabling efficient formation of a long film roll, it is preferably 100 μm or less, more preferably 80 μm or less, even more preferably 60 μm or less, and even more preferably 50 μm or less. The lower limit of the thickness of the release substrate is not particularly limited; however, from the perspective of ease of handling during adhesive film preparation, slitting, and winding onto a core, it is preferably 8 μm or greater.

[0052] (Adhesive layer)

[0053] In the film package of the present invention, the adhesive layer is characterized in that it contains (A) a free radical polymerizable (meth) acrylic compound, (B) an epoxy resin and (C) an epoxy resin curing agent, component (B) contains an epoxy resin that is solid at room temperature, and component (C) contains an epoxy resin curing agent that is solid at room temperature.

[0054] -(A) Radically polymerizable (meth)acrylic compound-

[0055] The adhesive layer contains a free-radical polymerizable (meth)acrylic compound as an insulating binder resin. This allows for adhesion even during short-term thermocompression bonding at low temperatures. It should be noted that the term "(meth)acrylic compound" refers to both acrylic and methacrylic compounds. The same applies to "(meth)acryloyl" and "(meth)acrylate."

[0056] The radically polymerizable (meth)acrylic compound is not particularly limited as long as it has a (meth)acryloyl group in the molecule and is capable of radical polymerization. The compound may be used in the form of a monomer or an oligomer, or in combination.

[0057] Examples of the radical polymerizable (meth)acrylic acid compound include methyl (meth)acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, phosphate-type (meth)acrylate, bisphenoxyethanol fluorene di(meth)acrylate, 2-(meth)acryloyloxyethylsuccinic acid, isobornyl (meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, Tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, tetrahydrofurfuryl(meth)acrylate, diglycidyl phthalate(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, 2-hydroxy-1,3-di(meth)acryloyloxypropane, 2,2-bis[4-((meth)acryloyloxymethoxy)phenyl]propane, 2,2-bis[4-((meth)acryloyloxypolyethoxy)phenyl]propane, dicyclopentenyl(meth)acrylate, tricyclodecanyl(meth)acrylate, tris((meth)acryloyloxyethyl)isocyanurate, and urethane(meth)acrylate. Furthermore, as long as free radical polymerization is possible, one or more hydrogen atoms in the molecule may be replaced with a substituent such as a hydroxyl group or a carboxyl group. These may be used alone or in combination of two or more.

[0058] From the perspective of achieving adhesion even during low-temperature, short-time thermocompression bonding, the content of the polymerizable (meth)acrylic compound in the adhesive layer is preferably 5% by volume or greater, more preferably 10% by volume or greater, and even more preferably 15% by volume or greater. The upper limit of this content is not particularly limited, but is preferably 60% by volume or less, more preferably 55% by volume or less, even more preferably 50% by volume or less, even more preferably 45% by volume or less, and particularly preferably 40% by volume or less.

[0059] In the present invention, unless otherwise specified, the content of each component in the adhesive layer is a value when the total of the non-volatile components in the adhesive layer is taken as 100% by volume.

[0060] -(B) Epoxy resin-

[0061] The adhesive layer contains an epoxy resin as an insulating binder resin. By incorporating the epoxy resin in combination with the radically polymerizable (meth)acrylic compound, not only is adhesion demonstrated even during short-term thermocompression bonding at low temperatures, but high adhesion is also achieved immediately after thermocompression bonding and after prolonged exposure to high temperature and high humidity.

[0062] As epoxy resin, as long as there is epoxy group in molecule and can be heat-cured, there is no particular limitation, but from the viewpoint that good heat resistance, adhesion can be achieved, preferably contain the epoxy resin with more than 2 epoxy groups in 1 molecule. When the non-volatile component of epoxy resin is made into 100 volume %, the content of the epoxy resin with more than 2 epoxy groups in 1 molecule is preferably more than 50 volume %, more preferably more than 60 volume %, further preferably more than 70 volume %, more further preferably more than 80 volume %. The upper limit of this content is not particularly limited and can be 100 volume %.

[0063] In the present invention, it is important that the epoxy resin contains an epoxy resin that is solid at room temperature (hereinafter referred to as a "solid epoxy resin"). By using the solid epoxy resin in combination with a cured epoxy resin that is solid at room temperature, described later, it is possible to suppress the occurrence of blocking even when the adhesive film is wound over a long length (particularly when a narrow adhesive film, which is susceptible to severe blocking and handling, is wound over a long length). Here, room temperature refers to the temperature range of 5 to 35°C specified in JIS Z 8703, which governs standard conditions for test sites (the same shall apply hereinafter).

[0064] As a solid epoxy resin, there is no particular limitation as long as it is solid at room temperature. For example, bisphenol A epoxy resin, naphthalene epoxy resin, dicyclopentadiene epoxy resin, phenol novolac epoxy resin, biphenyl epoxy resin, trisphenol epoxy resin, naphthol epoxy resin, naphthylene ether epoxy resin, anthracene epoxy resin, tetraphenylethane epoxy resin, etc. can be mentioned. These can be used alone or in combination of two or more. Among them, epoxy resins having a softening point or melting point are preferred. For example, epoxy resins having a softening point (ring and ball method) or a melting point of preferably 40°C or more, more preferably 50°C or more, further preferably 60°C or more, further preferably 70°C or more, and particularly preferably 80°C or more are suitable. The upper limit of the softening point and the melting point is not particularly limited, but is preferably 150°C or less, more preferably 145°C or less, and further preferably 140°C or less.

[0065] Specific examples of commercially available solid epoxy resins include "jER1001," "jER1003," and "jER1007" manufactured by Mitsubishi Chemical Corporation.

[0066] When the total non-volatile components of the epoxy resin are set to 100% by volume, the content of the solid epoxy resin in the epoxy resin is preferably 70% by volume or more, more preferably 75% by volume or more, further preferably 80% by volume or more, further preferably 85% by volume or more, and particularly preferably 90% by volume or more. The upper limit of this content is not particularly limited and can be 100% by volume.

[0067] As long as the epoxy resin contains a solid epoxy resin, it may also contain an epoxy resin that is liquid at room temperature (hereinafter also referred to as "liquid epoxy resin"). As the liquid epoxy resin, there is no particular limitation as long as it is liquid at room temperature, and examples thereof include bisphenol F epoxy resin, bisphenol A epoxy resin, phenol novolac epoxy resin, naphthalene epoxy resin, etc. Specific examples of liquid epoxy resins available on the market include "jER806" and "jER807" manufactured by Mitsubishi Chemical Corporation. From the viewpoint of being able to significantly suppress adhesion, the epoxy resin preferably contains only solid epoxy resin.

[0068] The epoxy equivalent of the epoxy resin is preferably 2500 or less, more preferably 2200 or less, even more preferably 2000 or less, even more preferably 1800 or less, particularly preferably 1600 or less, and most preferably 1500 or less. The lower limit of the epoxy equivalent is preferably 100 or more, more preferably 200 or more, and even more preferably 300 or more. The epoxy equivalent can be measured in accordance with JIS K7236.

[0069] From the viewpoint of being able to exhibit high adhesion even in low-temperature, short-time thermocompression bonding, the content of the epoxy resin in the adhesive layer is preferably 2% by volume or more, more preferably 4% by volume or more, and even more preferably 5% by volume or more. The upper limit of this content is not particularly limited, but is preferably 40% by volume or less, more preferably 30% by volume or less, even more preferably 25% by volume or less, even more preferably 20% by volume or less, and particularly preferably 15% by volume or less.

[0070] -(C) Epoxy resin curing agent-

[0071] The adhesive layer contains an epoxy resin curing agent, so that the epoxy resin can be cured smoothly during thermocompression bonding.

[0072] In the present invention, the epoxy resin curing agent is a latent curing agent that does not react at room temperature but reacts within a short period of time (e.g., several seconds) at the heat-compression bonding temperature during installation. This allows the curing reaction to proceed and complete during storage and transportation of the film roll, while achieving the desired adhesion when used for bonding electronic components, etc. Latent curing agents that, when heated at a rate of 10°C / minute in differential scanning calorimetry (DSC), produce an exothermic peak within a range of 80°C or higher and below the heat-compression bonding temperature during installation are preferably used.

[0073] In the present invention, it is important that the epoxy resin curing agent contains an epoxy resin curing agent that is solid at room temperature (hereinafter referred to as a "solid epoxy curing agent"). By using the solid epoxy curing agent in combination with the solid epoxy resin, the occurrence of blocking can be suppressed even when the adhesive film is wound over a long length (especially when a narrow adhesive film, which is susceptible to severe blocking and handling, is wound over a long length).

[0074] The solid epoxy curing agent is not particularly limited as long as it is solid at room temperature, and examples thereof include amine-based, imidazole-based, hydrazide-based, boron trifluoride-amine complexes, sulfonium salts, aminated imides, dicyandiamide salts, and modified products thereof. These can be used alone or in combination of two or more.

[0075] Specific examples of commercially available solid epoxy curing agents include diaminodiphenylmethane (DDM), metaphenylenediamine (MPD), and diaminodiphenylsulfone (DDS), all of which are available from Tokyo Chemical Industry Co., Ltd. and the like.

[0076] When the total non-volatile components of the epoxy resin curing agent are set to 100% by volume, the content of the solid epoxy curing agent in the epoxy resin curing agent is preferably 70% by volume or more, more preferably 75% by volume or more, further preferably 80% by volume or more, further preferably 85% by volume or more, and particularly preferably 90% by volume or more. The upper limit of this content is not particularly limited and can be 100% by volume.

[0077] As long as the epoxy resin curing agent contains a solid epoxy curing agent, it may also contain an epoxy resin curing agent that is liquid at room temperature (hereinafter also referred to as "liquid epoxy curing agent"). As the liquid epoxy curing agent, there is no particular limitation as long as it is liquid at room temperature, and examples thereof include amine-based and imidazole-based epoxy curing agents. As specific examples of liquid epoxy resins that can be obtained on the market, 2-ethyl-4-methylimidazole (2E4MZ) that can be obtained from Shikoku Chemical Industries, Ltd. and the like can be cited. From the viewpoint of being able to significantly suppress adhesion, the epoxy resin curing agent preferably contains only a solid epoxy curing agent.

[0078] The content of the epoxy resin curing agent in the adhesive layer is not particularly limited. From the perspective of being able to exhibit high adhesion even in low-temperature, short-time thermocompression bonding, the content is preferably 0.5% by volume or more, more preferably 0.8% by volume or more, and even more preferably 1% by volume or more. The upper limit of the content is not particularly limited, but is preferably 5% by volume or less, more preferably 4% by volume or less, even more preferably 3% by volume or less, and even more preferably 2% by volume or less.

[0079] From the perspective of significantly suppressing the occurrence of adhesion even when the adhesive film is wrapped very long (especially when a narrow adhesive film, which is prone to adhesion or handling, is wrapped very long), the total content of the solid epoxy resin and the solid epoxy curing agent in the adhesive layer is preferably 2% by volume or more, more preferably 3% by volume or more, and even more preferably 4% by volume or more. Although, as described above, by combining a free radical polymerizable (meth) acrylic compound and an epoxy resin, good adhesion can be achieved even with low-temperature, short-term thermocompression bonding, the present inventors have discovered that if the total content of the solid epoxy resin and the solid epoxy curing agent in the adhesive layer is 4% by volume or more, particularly excellent adhesion can be achieved immediately after thermocompression bonding and after prolonged exposure to high temperature and high humidity. This total content is further preferably 5% by volume or more, even more preferably 6% by volume or more, particularly preferably 8% by volume or more, and most preferably 10% by volume or more. The upper limit of the total content is not particularly limited, but is preferably 45% by volume or less, more preferably 40% by volume or less, further preferably 35% by volume or less, even more preferably 30% by volume or less, particularly preferably 25% by volume or less, and most preferably 20% by volume or less. From the perspective of achieving particularly excellent adhesion, the upper limit of the total content is preferably 30% by volume or less.

[0080] In the film package of the present invention, the adhesive layer of the adhesive film may further contain a radical polymerization initiator, a film-forming resin, conductive particles, and the like.

[0081] -Free radical polymerization initiator-

[0082] The adhesive layer may contain a radical polymerization initiator. The radical polymerization initiator is not particularly limited as long as it can generate free radicals at the thermal compression bonding temperature during installation to cause the polymerization reaction of the radical polymerizable (meth) acrylic compound to proceed. The initiator can be appropriately selected taking into account the thermal compression bonding temperature and time during the thermal compression bonding.

[0083] Examples of free radical polymerization initiators include peroxide compounds and azo compounds. Preferred peroxide compounds include organic peroxides, such as lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide. These may be used alone or in combination of two or more.

[0084] From the viewpoint of the generation that can significantly suppress adhesion, free radical polymerization initiator preferably contains the free radical polymerization initiator (hereinafter also referred to as " solid free radical polymerization initiator ") that is solid under normal temperature.When the total of the non-volatile component of free radical polymerization initiator is made as 100 volume %, the content of solid free radical polymerization initiator is preferably more than 70 volume %, more preferably more than 75 volume %, further preferably more than 80 volume %, further preferably more than 85 volume %, particularly preferably more than 90 volume %.The upper limit of this content is not particularly limited and can be 100 volume %.From the viewpoint that can significantly suppress adhesion, free radical polymerization initiator preferably only contains solid free radical polymerization initiator.

[0085] The content of the radical polymerization initiator in the adhesive layer is not particularly limited. From the perspective of being able to exhibit adhesion even in low-temperature, short-time thermocompression bonding, it is preferably 1% by volume or more, more preferably 2% by volume or more, 3% by volume or more, or 5% by volume or more. The upper limit of this content is not particularly limited, but is preferably 15% by volume or less, more preferably 10% by volume or less, and even more preferably 8% by volume or less.

[0086] -Film-forming resin-

[0087] The adhesive layer may contain a film-forming resin. The film-forming resin is not particularly limited and can be appropriately selected depending on the intended purpose. Examples thereof include phenoxy resins, unsaturated polyester resins, saturated polyester resins, polyurethane resins, butadiene resins, polyimide resins, polyamide resins, and polyolefin resins. These resins may be used alone or in combination of two or more.

[0088] From the perspective of film-forming properties, the polystyrene-equivalent number average molecular weight (Mn) of the film-forming resin is preferably 10,000 or more, more preferably 15,000 or more, and even more preferably 20,000 or more. The upper limit of this Mn is not particularly limited, but is preferably 80,000 or less, more preferably 70,000 or less, and may be 60,000 or less. It can be appropriately selected depending on other blends or the intended use. The polystyrene-equivalent Mn of the film-forming resin can be measured by gel permeation chromatography (GPC) and calculated using a standard polystyrene calibration curve.

[0089] The content of the film-forming resin in the adhesive layer is not particularly limited and can be appropriately determined depending on the intended purpose. It is preferably 10% by volume or greater, more preferably 20% by volume or greater, even more preferably 25% by volume or greater, and even more preferably 30% by volume or greater. The upper limit of this content is not particularly limited, but is preferably 60% by volume or less, and more preferably 50% by volume or less.

[0090] -Conductive particles-

[0091] The adhesive layer may contain conductive particles. By containing conductive particles, the adhesive film can be used as a conductive film or an anisotropic conductive film (ACF).

[0092] As conductive particles, known conductive particles that can be used in anisotropic conductive films can be used. As conductive particles, for example, metal particles such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold can be listed, alloy particles of these metals, coated particles of metal on the surface of particles such as metal oxides, carbon, graphite, glass, ceramics, and resins, etc. In the case of metal-coated resin particles in which the surface of resin particles is coated with metal, as the material of the resin particles, for example, epoxy resins, phenolic resins, acrylic resins, acrylonitrile-styrene (AS) resins, benzoguanamine resins, divinylbenzene resins, styrene resins, etc. can be listed. It should be noted that, with respect to conductive particles, as long as the conductive performance after connection is not hindered, in order to avoid the risk of short circuit between terminals, particles further coated with insulating film on the surface of the above-mentioned particles or particles with insulating particles attached to the surface can be particles subjected to insulation treatment. These conductive particles can be used alone or in combination of two or more.

[0093] The average particle size of the conductive particles is not particularly limited and can be appropriately determined according to the purpose. It is preferably 40 μm or less, more preferably 30 μm or less, further preferably 25 μm or less, and further preferably 20 μm or less. The lower limit of the average particle size is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, and further preferably 3 μm or more. Regarding the average particle size of the conductive particles, for example, by scanning electron microscopy (SEM), the particle size of a plurality of (n ≥ 10) conductive particles is measured, and the average value thereof is calculated. Alternatively, it can be a measured value (N = 1000 or more) measured using an image-type particle size distribution measuring device (e.g., FPIA-3000 (Malvern)).

[0094] When conductive particles are used, the content of the conductive particles in the adhesive layer is not particularly limited and can be appropriately determined depending on the intended purpose. It is preferably 1% by volume or more, more preferably 1.5% by volume or more, and even more preferably 2% by volume or more. From the perspective of achieving desired anisotropic conductivity, the upper limit of this content is preferably 40% by volume or less, more preferably 30% by volume or less, even more preferably 25% by volume or less, and even more preferably 20% by volume or less.

[0095] In the film package of the present invention, the adhesive layer of the adhesive film may further contain other components as needed. Examples of such components include fillers that do not hinder conductivity, such as insulating inorganic fillers (e.g., silica fillers), surface modifiers, flame retardants, coupling agents, colorants, and other known additives that can be used in the preparation of adhesive films (adhesives).

[0096] The thickness of the adhesive layer is not particularly limited and can be appropriately determined depending on the intended purpose, but is preferably 1 μm or greater, more preferably 3 μm or greater, and even more preferably 5 μm or greater. The upper limit of the thickness of the adhesive layer is not particularly limited, but is preferably 100 μm or less, more preferably 80 μm or less, even more preferably 60 μm or less, and even more preferably 50 μm or less.

[0097] The film package of the present invention can be produced by any method as long as a film package comprising an adhesive film having the above-specified adhesive layer composition wound around a reel can be obtained. For example, a film package can be produced by preparing an adhesive film, slitting it, and then winding it around a reel. An example of a film package production method is described below.

[0098] For example, the adhesive film can be prepared by mixing the components headed by the above-mentioned components (A) to (C) with an organic solvent as needed, modulating a uniformly mixed resin composition (adhesive composition), applying the resin composition to a peeling substrate, and then drying it to form an adhesive layer. The coating of the resin composition can be implemented using a coating device such as a scraper coater. A known coating method for the adhesive film can be used, such as a scraper method.

[0099] Next, the adhesive film is cut to a desired width. During the cutting process, a covering film may be provided on the exposed surface of the adhesive layer to prevent the adhesive layer from being contaminated by cutting chips or the like. The covering film may be a known film that can be used during the cutting process of the adhesive film. In the present invention, in which a solid epoxy resin and a solid epoxy curing agent are used in combination in a resin system comprising a free radical polymerizable (meth) acrylic compound and an epoxy resin, the adhesive layer can be significantly prevented from adhering to the cutting blade during the cutting process, and the adhesive layer can be smoothly cut to the desired width.

[0100] After the slitting process, the adhesive film having a desired width is wound around a reel to obtain a film roll.

[0101] In the film package of the present invention, the width of the adhesive film is not particularly limited and can be appropriately determined according to the purpose. As described above, in the present invention, even when a narrow width adhesive film is wound very long, it is possible to significantly suppress adhesion. In a preferred embodiment, the width of the adhesive film can be less than 10 mm and can be made to be less than 5 mm. The width of the adhesive film can be reduced to, for example, less than 4 mm, less than 3 mm, or less than 2 mm. The lower limit of the width of the adhesive film is not particularly limited and can be 0.1 mm or more, preferably 0.3 mm or more, and more preferably 0.5 mm or more.

[0102] In a preferred embodiment, the length of the adhesive film (wrap length) is 5 m or longer. In the present invention, since blocking can be significantly suppressed even when the film is wrapped for a long time, the length of the adhesive film can be, for example, 10 m or longer, 20 m or longer, 30 m or longer, 50 m or longer, or 100 m or longer, and the upper limit can be, for example, 500 m or shorter, 400 m or shorter, or 300 m or shorter.

[0103] The film package of the present invention can release an adhesive film that has excellent adhesion even when subjected to low-temperature, short-time thermocompression bonding, and can be suitably used as a means for bonding electronic components and the like. In addition, when the adhesive layer contains conductive particles, it can be used as an anisotropic conductive film (ACF), and as described below, it can be suitably used as a means for anisotropically conductively connecting a first electronic component to a second electronic component. In the present invention, in which a solid epoxy resin and a solid epoxy curing agent are used in combination in a resin system comprising a free-radical polymerizable (meth) acrylic compound and an epoxy resin, since curing shrinkage (shrink) caused by thermocompression bonding can also be advantageously reduced, the occurrence of substrate warping can be significantly reduced even when a plurality of electronic components are installed at the same time.

[0104] [Method for preparing a linker]

[0105] The film package of the present invention can be used to prepare a connected body in which electronic components are bonded together.

[0106] The method for producing a connected body of the present invention includes the step of sandwiching the adhesive layer of the adhesive film drawn out from the film package of the present invention between a first electronic component and a second electronic component and performing pressure bonding.

[0107] The first electronic component may be, for example, a general printed wiring board (PWB), including rigid substrates, glass substrates, ceramic substrates, plastic substrates, and FPCs. The second electronic component may be an FPC, an IC chip, etc. The method of the present invention can be used to produce versatile connectors such as FOBs (Film On Boards), FOGs (Film On Grass), FOFs (Film On Films), and COGs (Chip On Grass).

[0108] In the method for producing a connected structure of the present invention, an adhesive film is first pulled out from a film roll, cut into a predetermined length, and then temporarily adhered (laminated) to a first electronic component. Temperatures and pressures below those used for temporary pressure bonding, described below, may be applied. By using the film roll of the present invention, the adhesive film can be pulled out smoothly without causing any sticking.

[0109] After temporary pasting, the base material is peeled off to expose the adhesive layer. Next, the electrodes (arrangement) of the first electronic component are aligned with the electrodes (arrangement) of the second electronic component, and the second electronic component is mounted. Here, it is preferred to perform temporary crimping with a crimping tool from the side of the second electronic component. The temperature, pressure and time during temporary crimping can be appropriately determined according to the specific design, for example, they can be set to 60~80℃, 0.5~2MPa, and 0.5~2 seconds. Before performing the formal crimping described later, by performing such temporary crimping, the electronic components (the conductive parts of each component) can be more accurately aligned and connected to each other, so it is preferred. By performing temporary crimping, it is expected that positional deviation during formal crimping with higher pressure can be suppressed.

[0110] After temporary crimping, formal crimping is performed from the side of the second electronic component using a crimping tool. The temperature, pressure and time during formal crimping can be set to any known conditions that can be used when bonding electronic components using an adhesive film, and can be appropriately determined according to the specific design. In addition, crimping can be performed using a known device that can be used when bonding electronic components using an adhesive film. As described above, by using the film package of the present invention that combines a solid epoxy resin and a solid epoxy curing agent in a resin system that uses a free radical polymerizable (meth) acrylic compound and an epoxy resin, the first electronic component and the second electronic component can be well bonded even by crimping at low temperatures (e.g., below 200°C, below 180°C, below 160°C) and for a short time (e.g., below 10 seconds, below 8 seconds, below 6 seconds).

[0111] It should be noted that, for both temporary and final crimping, a cushioning material (e.g., a cushioning sheet) can be placed between the second electronic component and the crimping tool. The use of the cushioning material, including whether or not to use it, can be appropriately adjusted and determined based on the combination of electronic components.

[0112] While enjoying the advantage of good adhesion based on low-temperature and short-time hot pressing, the present invention can also have the significant effect of suppressing the occurrence of adhesion even when the adhesive film is wound very long (especially when a narrow-width adhesive film that is prone to adhesion or handling is wound very long), which significantly helps to improve the production efficiency and quality of target products represented by FPD modules. Example

[0113] Hereinafter, the present invention will be described in detail with reference to the following examples. However, the present invention is not limited to the following examples. In the following description, unless otherwise indicated, "parts" and "%" indicating amounts refer to "parts by volume" and "volume %", respectively.

[0114] [Example 1]

[0115] -Preparation of Adhesive Composition-

[0116] 30 parts of urethane acrylate (trade name: U-2PPA, manufactured by Shin-Nakamura Chemical Co., Ltd.), 50 parts of acrylic monomer (trade name: A-200, manufactured by Shin-Nakamura Chemical Co., Ltd.), 20 parts of solid epoxy resin (trade name: jER1007, manufactured by Mitsubishi Chemical Corporation), 3 parts of solid epoxy curing agent (diaminodiphenylmethane (DDM), manufactured by Tokyo Chemical Industry Co., Ltd.), 12 parts of organic peroxide (trade name: PEROYL L, manufactured by NOF Corporation, dilauroyl peroxide), 50 parts of phenoxy resin (trade name: YP-50, manufactured by NIPPON STEEL Chemical & Material Co., Ltd.), 50 parts of phenoxy resin (trade name: YD-019, manufactured by NIPPON STEEL Chemical & Material Co., Ltd.) Ltd.) and 5 parts of conductive particles (Ni particles, average particle size: 5 μm) were added to 150 parts of a solvent and uniformly mixed to obtain an adhesive composition.

[0117] -Adhesive film production-

[0118] A PET film (50 μm thick) was prepared as a release substrate. The adhesive composition was evenly applied to the release substrate so that the thickness of the adhesive layer after drying reached 35 μm. The film was then dried at 60°C for 5 minutes to form an adhesive layer on the release substrate, thereby obtaining an adhesive film.

[0119] -Production of film rolls-

[0120] A cover film was attached to the exposed adhesive layer surface of the resulting adhesive film, which was then slit to a width of 2.0 mm and then peeled off. Next, 300 m of the adhesive film was wound around a core (100 mm in diameter) equipped with side plates, with the adhesive layer positioned on the inner circumference, to obtain a film package.

[0121] [Example 2]

[0122] An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in Example 1, except that (i) the blending amount of the solid epoxy resin (trade name: jER1007, manufactured by Mitsubishi Chemical Corporation) was changed from 20 parts to 5 parts, and (ii) the blending amount of the acrylic monomer (trade name: A-200, manufactured by Shin-Nakamura Chemical Co., Ltd.) was changed from 50 parts to 65 parts.

[0123] [Example 3]

[0124] An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in Example 1, except that (i) the blending amount of the solid epoxy resin (trade name: jER1007, manufactured by Mitsubishi Chemical Corporation) was changed from 20 parts to 65 parts, and (ii) the blending amount of the acrylic monomer (trade name: A-200, manufactured by Shin-Nakamura Chemical Co., Ltd.) was changed from 50 parts to 5 parts.

[0125] [Comparative Example 1]

[0126] An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in Example 1, except that (i) 5 parts of a liquid epoxy resin (trade name: jER828, manufactured by Mitsubishi Chemical Corporation) were used instead of 20 parts of a solid epoxy resin (trade name: jER1007, manufactured by Mitsubishi Chemical Corporation) and (ii) the blending amount of an acrylic monomer (trade name: A-200, manufactured by Shin-Nakamura Chemical Co., Ltd.) was changed from 50 parts to 65 parts.

[0127] [Comparative Example 2]

[0128] An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in Example 1, except that (i) no epoxy resin was added and (ii) the amount of the acrylic monomer (trade name: A-200, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) was changed from 50 parts to 70 parts.

[0129] [Comparative Example 3]

[0130] An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in Example 2, except that 3 parts of a liquid epoxy curing agent (2-ethyl-4-methylimidazole (2E4MZ), manufactured by Shikoku Chemical Industry Co., Ltd.) were used instead of 3 parts of a solid epoxy curing agent (DDM, manufactured by Tokyo Chemical Industry Co., Ltd.).

[0131] The test and evaluation methods are described below. If all evaluations are B or higher, there is no problem in practical use.

[0132] <Overflow test>

[0133] The film packages produced in Examples and Comparative Examples were evaluated for their overflow quality based on the amount of adhesive layer overflow from the exposed side surface of the adhesive film. This evaluation was performed using the following overflow test.

[0134] That is, Figure 2 As shown, the reel 4 of the film packages produced in the Examples and Comparative Examples was mounted on the fixed rod 10 of the overflow test jig. While the core was fixed to prevent rotation, a weight 20 was attached to the end of the adhesive film pulled out of the film package to apply a static load. (For details of the overflow test jig and the test procedure using it, see Japanese Patent Application Laid-Open No. 2017-137188.) In this test, the reel 4 was fixed so that the engagement angle α (see the aforementioned publication) was within the range of 90 to 180°. The static load was applied for 6 hours under the following conditions: the length of the adhesive film pulled out of the film package was 30 cm, the weight 20 weighed 30 g, and the ambient temperature was 30°C.

[0135] After applying a static load for 6 hours, the radial side appearance of the film package was observed at a magnification of 175x using a digital microscope from the joint portion of the film package's core periphery. A case where the adhesive layer adhered (bonded) to the adhesive layer above the peeling substrate by sandwiching the peeling substrate was recorded as "one layer of overhang," and a case where the adhesive layer adhered to two layers above was recorded as "two layers of overhang." The number of overhang layers was calculated to the first decimal place based on the state of the adhesive component sandwiching the peeling substrate. The overhang of the film package was evaluated based on the number of overhang layers obtained, according to the following criteria.

[0136] (Evaluation Criteria)

[0137] A: The number of overflow layers is less than 1 layer.

[0138] B: The number of overflow layers is less than 2 layers,

[0139] C: The number of overflow layers is 2 or more.

[0140] <Evaluation of Adhesion>

[0141] After the overflow test, the adhesive film is pulled out from the film package and observed for adhesion. In this test, adhesion is determined to have occurred when the adhesive layer peels off from the peeling substrate or floats when the adhesive film is pulled out. In addition, in this test, the adhesive film is pulled out from the film package in the following two ways: (1) in a direction parallel to the reel side plate (MD direction: the angle between the film pulling direction and the extension direction of the reel side plate is 0°), (2) in a direction inclined to the reel side plate (30° relative to the MD direction: the angle between the film pulling direction and the extension direction of the reel side plate is 30°). Then, the adhesion of the film package is evaluated according to the following standards.

[0142] (Evaluation Criteria)

[0143] A: No sticking occurs regardless of the pulling direction.

[0144] B: No sticking occurs when pulling out in a direction parallel to the reel side plate, but sticking occurs when pulling out in a direction oblique to the reel side plate.

[0145] C: Blocking occurs regardless of the pulling direction.

[0146] <Evaluation of Adhesive Strength>

[0147] - Fabrication of connectors -

[0148] The adhesive film was pulled out from the film rolls produced in the Examples and Comparative Examples, and the adhesive layer, with the release substrate removed, was sandwiched between a flexible printed circuit board (FPC) and a rigid substrate. The FPC and rigid substrate were then thermocompressed, with all opposing conductive portions of the FPC and rigid substrate bonded via the cured adhesive layer. This resulted in an anisotropically connected structure. The specifications of the FPC and rigid substrate used in this experiment, as well as the thermocompression bonding conditions, are shown below.

[0149] FPC specifications: polyimide film thickness is 38μm, copper circuit thickness is 8μm, copper circuit line width is 200μm (spacing is 400μm, L / S=1 / 1);

[0150] Rigid substrate specifications: Glass epoxy substrate thickness is 1.0mm, copper circuit thickness is 35μm, copper circuit line width is 200μm (spacing is 400μm, L / S=1 / 1);

[0151] Thermal compression bonding conditions: 160°C / 4 MPa / 5 seconds.

[0152] -Measurement and evaluation of bonding strength-

[0153] The resulting connector was kept at high temperature and humidity conditions of 85°C and 85% RH for 500 hours immediately after bonding, and then the bonding strength was measured by a 90-degree peel test. Specifically, the FPC and the cured product were cut into 10 mm lengths, and the 10 mm length of the FPC was clamped with a fixture. The load (N / cm) was measured at room temperature (25°C) at a speed of 50 mm / min in the vertical direction until the FPC was peeled off from the rigid substrate, and the bonding strength was evaluated according to the following standards. It should be noted that a TENSILON tester (STA-1150 manufactured by OrionTech Co., Ltd.) was used in the measurement.

[0154] (Evaluation Criteria)

[0155] A: 10N / cm or more,

[0156] B: 5N / cm or more and less than 10N / cm,

[0157] C: less than 5 N / cm.

[0158] <Evaluation of On-Resistance>

[0159] The same procedure as described in the "Evaluation of Adhesive Strength" was followed to obtain a connector. The resulting connector was then tested for on-resistance and evaluated according to the following criteria. It should be noted that the on-resistance was practically satisfactory both initially and after the reliability test. All connectors were rated "good" (A).

[0160] Initial stage (evaluation criteria)

[0161] A: less than 5Ω,

[0162] B: 5Ω or more and less than 10Ω,

[0163] C: 10Ω or more.

[0164] After reliability test (evaluation criteria)

[0165] A: less than 10Ω,

[0166] B: 10Ω or more and less than 15Ω,

[0167] C: 15Ω or more.

[0168] Table 1 shows the evaluation results of Examples and Comparative Examples.

[0169] [Table 1]

[0170]

[0171] Examples 1-3 confirmed that the film rolls of the present invention can produce adhesive films exhibiting excellent adhesion even under low-temperature, short-term thermocompression bonding, and can suppress blocking even when the adhesive films are wound over long lengths. Furthermore, similar results to those of the aforementioned Examples were obtained when other film-forming components such as polyester resins, polyurethane resins, and butadiene resins were used in place of or in addition to the phenoxy resins; when other polymerizable (meth)acrylic compounds were used in place of or in addition to the specific urethane acrylates and acrylic monomers listed in Table 1; and when other solid epoxy resins and solid epoxy curing agents were used in place of or in addition to the specific solid epoxy resins and solid epoxy curing agents listed in Table 1. The results differed somewhat, but the results were similar to those of the aforementioned Examples.

[0172] On the other hand, the film packages of Comparative Examples 1 and 3, which used a polymerizable (meth)acrylic compound and an epoxy resin, showed good adhesion results. However, since they did not contain a solid epoxy resin (Comparative Example 1) or a solid epoxy curing agent (Comparative Example 3), their bleed-through properties were poor, resulting in blocking. Furthermore, the film package of Comparative Example 2, which contained a polymerizable (meth)acrylic compound but no epoxy resin, showed poor results in terms of adhesion, bleed-through properties, and blocking.

[0173] Explanation of symbols

[0174] 1 film package,

[0175] 2 adhesive layer,

[0176] 3. Peel off the substrate.

[0177] 4 scrolls,

[0178] 5 cores,

[0179] 6 side panels (flanges),

[0180] 10 fixing rods,

[0181] 20 weights.

Claims

1. A film package comprising an adhesive film comprising a release substrate and an adhesive layer provided on the release substrate, wound around a core, wherein: The adhesive layer contains (A) a radically polymerizable (meth)acrylic compound, (B) an epoxy resin, (C) an epoxy resin curing agent, and (D) a radical polymerization initiator. The component (B) contains an epoxy resin that is solid at room temperature. The component (C) contains an epoxy resin curing agent that is solid at room temperature. The component (D) contains a radical polymerization initiator that is solid at room temperature.

2. A film package comprising an adhesive film comprising a release substrate and an adhesive layer uniformly provided on the release substrate, wound around a core, wherein: The adhesive layer has a side surface exposed from the adhesive film, The adhesive layer contains (A) a radically polymerizable (meth)acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent, wherein the component (B) contains an epoxy resin that is solid at room temperature. The component (C) contains an epoxy resin curing agent that is solid at room temperature. When the total nonvolatile content of the adhesive layer is 100% by volume, the total content of the epoxy resin that is solid at room temperature and the epoxy resin curing agent that is solid at room temperature is 4% to 30% by volume.

3. The film package according to claim 1, wherein The adhesive layer is uniformly provided on the release substrate so as to have a side surface exposed from the adhesive film.

4. The film package according to claim 1 or 2, wherein When the total amount of nonvolatile components in the adhesive layer is 100% by volume, the content of the radically polymerizable (meth)acrylic compound is 5% by volume or more and 60% by volume or less. The film package according to claim 2 , wherein: The adhesive layer contains a radical polymerization initiator that is solid at room temperature. The film package according to claim 1 or 2, wherein The length of the adhesive film is 5 m or more.

7. The film package according to claim 1 or 2, wherein The width of the adhesive film is 5 mm or less.

8. The film package according to claim 1 or 2, wherein The adhesive film is wound around a core having side plates.

9. The film package according to any one of claims 1 to 8, wherein The adhesive layer further contains conductive particles.

10. A method for producing a connected body, comprising the steps of sandwiching an adhesive layer of an adhesive film drawn out from the film roll according to any one of claims 1 to 9 between a first electronic component and a second electronic component, and press-bonding the first electronic component and the second electronic component.

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