Device testing apparatus with fine pitch and method thereof

Abstract

The steps of sequentially loading devices on a base plate having a plurality of vacuum holes; in a state where the devices are loaded on the base plate, as vacuum pressure is applied, the loaded devices are attracted by slightly movable vacuum pressure; a step of moving an alignment vision component located on an upper portion of the base plate toward the upper portion of the device to be aligned and then descending; in a state where the alignment area surrounds the device, visually confirming the position of the device through the through holes and the opening, and then transmitting the coordinate value to the control unit; a step of slightly moving the base plate in the X-Y-θ direction according to the coordinate value of the device, and guiding the device to the two-sided alignment of the opening; each time a device is loaded on the base plate, the base plate is moved in the X-Y axis direction at each interval to align the device.

Description

Technical Field

[0001] The present invention relates to an apparatus and method for aligning devices with fine pitches, specifically, an apparatus and method for automatically and accurately aligning multiple devices with fine pitches, such as BGAs (Ball Grid Arrays) and TSOPs (Thin Small Outline Packages) with small bumps and narrow pitches, after production, to facilitate performance testing in a handler. Background Art

[0002] Typically, semiconductor devices such as ICs (electronic components) are tested for their electrical characteristics during their manufacturing process to determine if they are defective. This electrical characteristic test involves electrically connecting the contacts of a test board, including the semiconductor device's ball terminals, to a printed circuit board (PCB). The test is then performed at a set time interval, with qualified products shipped and unqualified ones retested or discarded.

[0003] Conventionally, devices to be tested are inserted into a carrier and individually transported to a tester, where their electrical characteristics are tested.

[0004] Furthermore, the electrical testing of the device is performed by electrical contact between the device ball terminal mounted in the carrier and the probe supported by the socket assembly. At this time, the configuration intervals of the extremely small ball terminal and the probe are extremely small, and the alignment precision requirements during testing are extremely high. However, the arrangement of the ball terminal and the probe is formed by the mutual arrangement of the alignment holes of the carrier and the alignment pins of the socket guide rail.

[0005] Prior art literature

[0006] (Patent Document 0001) Korean Registered Patent Gazette No. 10-146990 (registered on January 19, 2014);

[0007] (Patent Document 0002) Korean Registered Patent No. 10-1779172 (registered on September 11, 2017). Summary of the Invention

[0008] Technical issues

[0009] However, the existing alignment device has the following problems.

[0010] First, the loading sorter absorbs the devices located in the loading part and loads them into the carrier, which is then transferred to the tester side in sequence. After the test is carried out at the set time, the carrier with the tested devices is transferred to the unloading part. Based on the test results, the unloading sorter selects the devices into qualified and unqualified products and unloads them. Therefore, it is impossible to achieve compactness and simplicity of the equipment.

[0011] Second, during testing, the carrier and the socket guide need to be repeatedly engaged and separated, which increases the idleness of the alignment pins and alignment holes due to repeated engagement and separation, resulting in mismatch or offset between the ball terminal and the probe.

[0012] Third, when conducting conductive testing on thousands or more devices, expensive devices are easily damaged due to the collision between the devices and the probes. In addition, if damaged device ball terminals remain in the equipment, the conductive testing must be suspended for replacement or repair, which reduces the operating rate of the expensive equipment.

[0013] The present invention is created to solve the problems mentioned above. Its purpose is to load the device to be tested onto a substrate with vacuum pressure applied, visually identify the coordinates of the loaded device, transmit them to the control unit, and then move it in the XY-θ axis direction while the alignment area surrounds the device and automatically aligns the position of the device.

[0014] Another object of the present invention is to align the positions of multiple devices, adsorb them to a base plate by vacuum pressure, move the base plate toward the tester, connect the ball terminals of the multiple devices adsorbed on the base plate to the terminals of the tester, and then perform electrical testing.

[0015] Technical Solution

[0016] To achieve the above objectives, according to an embodiment of the present invention, there is provided a device for aligning devices with fine pitches, preferably comprising: a base having a vertical column; a Y-axis plate movable on the base along the Y-axis direction at each pitch; a base plate disposed on the Y-axis plate, with vacuum holes formed at respective locations where devices are placed, so that when devices are loaded, the loaded devices are attracted by the slightly movable vacuum pressure as vacuum pressure is applied; a base plate position adjustment device disposed on the Y-axis plate, which slightly moves the base plate in the XY-θ direction according to the position of the device loaded on the base plate; an X-axis plate disposed on the vertical column of the base, which moves horizontally along the X-axis direction at each pitch; The Z-axis plate is arranged on the X-axis plate and rises and falls along the Z-axis; the visual area is arranged on the Z-axis plate and is provided with a through hole; the alignment area is arranged at the lower part of the visual area and is provided with an opening portion, which can cover the device attracted to the base plate; the vision is arranged at the upper part of the Z axis, and after confirming the position of the device attracted to the base plate through the through hole and opening portion of the visual area, the coordinate value is transmitted to the control part; the alignment area descends according to the coordinate value of the device attracted to the base plate, and when the device is covered, the base plate is slightly moved in the XY-θ direction by the base plate position adjustment device to align the device.

[0017] According to another embodiment of the present invention, a method for aligning devices with a fine pitch is provided, preferably comprising: a step of sequentially loading devices onto a base plate having a plurality of vacuum holes; a step of attracting the loaded devices with slightly movable vacuum pressure as vacuum pressure is applied while the devices are loaded onto the base plate; a step of lowering an alignment vision component located on an upper portion of the base plate after moving toward the upper portion of the device to be aligned; a step of visually confirming the position of the device through through holes and openings while the alignment area surrounds the device, and then transmitting the coordinate value to a control unit; a step of slightly moving the base plate in the XY-θ direction according to the coordinate value of the device, and guiding the device to the two-sided alignment of the opening; and a step of aligning the device while moving the base plate in the XY axis direction at each pitch each time the device is loaded onto the base plate.

[0018] Beneficial effects

[0019] Compared with the existing ones, the present invention has the following advantages:

[0020] First, after loading the components onto the base plate in sequence, the position of the components loaded on the base plate is visually confirmed while being attracted by a slightly movable vacuum pressure. After the coordinate values are transmitted to the control unit, the components are aligned using the base plate position adjustment device while being wrapped with the alignment area, thereby achieving compact and simple equipment.

[0021] Second, multiple devices can be electrically connected to the tester simultaneously for testing without using other carriers, thus preventing mismatch or offset between the device's ball terminals and the probes, and maximizing the test efficiency of high-priced equipment.

[0022] Third, the height positioning force and friction of the base plate position adjustment device are reduced, thereby maximizing the precision of alignment. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a perspective view showing the structure of the present invention;

[0024] Figure 2 and Figure 3 yes Figure 1 Front and side views;

[0025] Figure 4 is a perspective view showing an embodiment of a substrate position adjustment device of the present invention;

[0026] Figure 5a and Figure 5b yes Figure 4 Floor plan;

[0027] Figure 6a is a plan view of a state where an alignment area of the present invention surrounds a device;

[0028] Figure 6b This is a diagram showing a state where two sides of a device are connected to the inner peripheral surface of the alignment area of the present invention to correct the position of the device;

[0029] Figure 7 is a flow chart illustrating the alignment method of the present invention. DETAILED DESCRIPTION

[0030] The following, in conjunction with the accompanying drawings, clearly and completely describes the technical solutions in the preferred embodiments of the present invention, so that those skilled in the art can easily implement them based on the embodiments of the present invention. However, the embodiments described are only part of the embodiments of the present invention, not all of them. The illustrations in the drawings are simplified and not to scale. The relative sizes and ratios of some parts in the drawings are exaggerated or reduced for clarity and convenience in the drawings. Any size is only an example and is not limiting. The same structure, element or accessory that appears in two or more drawings uses the same reference symbol because of their similar features.

[0031] Figure 1 is a perspective view showing the structure of the present invention, Figure 2 and Figure 3 yes Figure 1The front view and side view of the present invention, according to the present invention, a Y-axis plate 20 is provided on the top of the base 10 having a vertical column 11, which can be moved along the Y-axis direction at each interval (the interval between the devices loaded on the base plate), and vacuum holes are formed on the top of the Y-axis plate 20 at the placement locations of the devices 30. When the device 30 is loaded, as the vacuum pressure is applied, the loaded device 30 is attracted by the base plate 40 with a slightly movable vacuum pressure (about 5~50mmHg).

[0032] According to an embodiment of the present invention, the base plate 40 is square, but various shapes such as rectangular or circular can also be used according to needs.

[0033] A heater and a cooling tube (not shown) are provided inside the base plate 40 . Before loading the device 30 onto the base plate 40 , the temperature is maintained at room temperature, heated to approximately 50° C. to 170° C., or cooled to approximately 0° C. to -55° C., depending on the test conditions of the device 30 .

[0034] Even if the base plate 40 is made of a material with the smallest coefficient of expansion (for example, ceramic), assuming that one side of the base plate 40 is 300 mm, it will expand or contract within a range of approximately 0.3 mm as it is heated and cooled. Therefore, before loading the device 30 on the base plate 40, the temperature of the base plate 40 is adjusted according to the test conditions to minimize the error caused by the expansion or contraction of the base plate 40.

[0035] A base plate position adjustment device 50 is provided on the upper surface of the Y-axis plate 20 for slightly moving the base plate 40 along the XY-θ direction according to the position of the device 30 mounted on the base plate 40 .

[0036] In one embodiment of the present invention, the base plate position adjustment device 50 is as follows: Figure 5a and Figure 5b As shown, the structure includes: a setting plate 51 fixed on the Y-axis plate 20; a pair of X-axis motors 52a, 52b arranged facing the setting plate 51; a Y-axis motor 53 arranged on the setting plate 51 at right angles to the X-axis motor; a movable plate 54 arranged to be slightly moved along the XY-θ direction by the X-axis motors 52a, 52b and the Y-axis motor 53; four cross rollers 55 arranged between the setting plate 51 and the movable plate 54 to move the movable plate 54 in the XY axis direction; and a shaft 56 that rotatably connects the movable plate 54 to each cross roller 55.

[0037] The cross roller 55 is composed of an X-axis, a Y-axis, and a multi-stage plate having an LM guide (not shown).

[0038] However, the base plate position adjustment device 50 shown as an embodiment of the present invention is a well-known finished product produced by MISUMI Corporation (model: AA-300-3S).

[0039] Those skilled in the art should understand that the base plate position adjustment device 50 can still be modified into various forms for use.

[0040] An X-axis plate 60 is provided on the vertical column 11 of the base 10, which moves horizontally along the X-axis direction at each interval. The X-axis plate 60 is provided with an alignment visual component 70 that reads the coordinate value of the device 30 loaded on the base plate 40 and transmits it to the control unit (omitted from the figure) while aligning the device 30.

[0041] According to the structure of the alignment vision component 70, the Z-axis plate 71 is arranged on the X-axis plate 60 so as to be liftable along the Z-axis, and the Z-axis plate 71 is provided with a visual area 72 having a through hole 72a, and the lower part of the visual area 72 is provided with an alignment area 73 that wraps the device 30 that will be attracted to the base plate 40.

[0042] At this time, the alignment area 73 is as shown in FIG. Figure 6a As shown, an opening portion 73 a larger than the device 30 is provided, and when the alignment area 73 descends to the bottom dead point, the device 30 is kept accommodated in the opening portion 73 a of the alignment area 73 .

[0043] The Y-axis plate 20 and the X-axis plate 60 are respectively guided to the LM guide rails 20a and 60a for linear motion, which can reduce friction when the Y-axis plate 20 and the X-axis plate 60 move. This has the advantage of maximizing alignment accuracy.

[0044] The upper part of the Z-axis plate 71 is provided with a through hole 72a of the visual area 72, and the coordinate value is transmitted to the vision 74 of the control part after confirming the position of the device 30 attracted to the base plate 40. When the vision 74 transmits the coordinate value of the device 30 attracted to the base plate 40 to the control part through the through hole 72a and the opening 73a, the base plate 40 is slightly moved along the XY-θ direction through the base plate position adjustment device 50 when the alignment area 73 wraps the device 30, thereby aligning the device 30.

[0045] The effects of the present invention will be described below.

[0046] First, before the device 30 to be tested is loaded onto the base plate 40 , it is kept at room temperature, heated to about 50-170° C., or cooled to about 0-55° C., depending on the test conditions of the device 30 .

[0047] As described above, after a device 30 is sorted and placed in a vacuum hole of the base plate 40 while maintaining the base plate 40 at an appropriate temperature according to the test conditions of the device 30, a vacuum device (not shown) connected to the vacuum hole is used to suck the device 30 with a slightly movable vacuum pressure of about 5 to 50 mmHg (steps S100 and S200).

[0048] The device 30 is loaded on a vacuum hole formed on the base plate 40 and then attracted by the vacuum pressure that allows the device to move slightly. The X-axis plate 60 is moved along the LM guide rail 60a, and then the alignment vision component 70 located on the upper part of the base plate 40 is located directly above the device 30 to be aligned (step S300).

[0049] In this state, the Z-axis plate 71 of the alignment vision assembly 70 is lowered, and the device 30 is aligned with the alignment area 73. Figure 6a After wrapping as shown, the vision 74 confirms the position of the device 30 through the through hole 72a formed on the vision area 72 and the opening 73a of the alignment area 73, and transmits the coordinate value to the control part (omitted from the figure) (step S400).

[0050] As described above, the vision 74 provided on the upper part of the Z-axis plate 71 recognizes the position of the device 30 and transmits it to the control unit. Since an opening 73a is provided on the alignment area 73, the position of the device 30 attracted to the base plate 40 is identified through the through hole 72a and the opening 73a of the vision area 72.

[0051] The coordinate value of the device 30 is transmitted to the control unit. According to the coordinate value of the device 30 attracted to the vacuum hole, the two X-axis motors 52a and 52b as the base plate position adjustment device 50 are driven in the same direction, and the movable plate 54 moves along the X-axis direction. After the Y-axis motor 53 is driven forward and reverse, the movable plate 54 moves along the Y-axis direction. Then, the two X-axis motors 52a and 52b are driven in opposite directions to each other, and then the movable plate 54 moves slightly along the θ direction, and then the alignment area 73 is aligned as shown in FIG. Figure 6b As shown, the device 30 is pushed to correct the alignment (step S500 ).

[0052] This is because the movable plate 54 is slightly moved in the XY directions by the cross roller 55 and is simultaneously slightly rotated in the θ direction by the shaft 56 .

[0053] As described above, when the device 30 is slightly moved and aligned along the XY-θ direction by the base plate position adjustment device 50 , it is further preferred that the position of the device 30 be corrected when the bottom surface of the alignment area 73 is separated from the top surface of the base plate 40 .

[0054] Since the bottom surface of the alignment area 73 is moved in a state of being connected to the top surface of the base plate 40 and the position of the device 30 is aligned, generation of particles due to friction can be prevented in advance.

[0055] Through the actions described above, the alignment area 73 moves slightly along the XY-θ direction while wrapping the device 30. After completing the alignment of the device 30 attracted to the base plate 40, before the Z-axis plate 71 returns to the initial position, the position of the device 30 aligned through the through hole 72a of the visual area 72 and the opening 73a of the alignment area 73 is reconfirmed by the vision 74 and transmitted to the control unit. After correct alignment, the inner surface of the opening 73a of the alignment area 73 is separated from the device 30, and then the Z-axis plate 71 rises and returns to the initial position. If alignment fails, the device 30 is re-aligned with the above-mentioned actions (steps S600 and S700).

[0056] It is easy to understand that the alignment operation of the device 30 described above is achieved by moving the Y-axis plate 20 and the X-axis plate 60 by one pitch each time the device 30 is loaded onto the base plate 40 .

[0057] Through the above-described action, after the position of the device 30 sucked into all the vacuum holes of the base plate 40 is corrected and aligned, when it is moved toward the tester (not shown), it is preferably sucked with a vacuum pressure of about 50~100mmHg to prevent the position of the device 30 from changing due to vibration, etc.

[0058] In order to prevent the device 30 on the base plate 40 from moving, the device is sucked with a vacuum pressure of about 50~100mmHg and then moved toward the tester side. Then, the ball terminals of the device 30 sucked to the base plate 40 are simultaneously connected to the terminals of the tester to implement electrical testing.

[0059] Although the present invention has been described in detail with reference to the accompanying drawings, those skilled in the art should understand that they can still modify the technical solutions or essential features described in the aforementioned embodiments, and these modifications do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions described in the embodiments of the present invention.

[0060] Therefore, the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the same. The protection scope of the present invention should be interpreted according to the following claims, and any changes or modifications within the equivalent scope should fall within the scope of the claims of the present invention.

[0061] Explanation of symbols

[0062] 10: base plate; 11: vertical column;

[0063] 20: Y-axis board; 30: device;

[0064] 40: base plate; 50: base plate position adjustment device;

[0065] 51: Setting plate; 52a, 52b: X-axis motor;

[0066] 53: Y-axis motor; 54: movable plate;

[0067] 55: cross roller; 56: shaft;

[0068] 60: X-axis plate; 70: Alignment vision component;

[0069] 71: Z-axis plate; 72: visual area;

[0070] 72a: through hole; 73: alignment area;

[0071] 73a: opening; 74: vision.

Claims

1. A device alignment apparatus with a fine pitch, characterized in that: The structure includes: A base (10) having a vertical column (11); a Y-axis plate (20) on the base (10) that can move at each interval along the Y-axis direction; a base plate (40) arranged on the Y-axis plate (20), with vacuum holes formed at the locations where the device (30) is placed, and when the device (30) is loaded, as the vacuum pressure is applied, the loaded device (30) is attracted by the slightly movable vacuum pressure; a base plate position adjustment device (50) arranged on the Y-axis plate (20), according to the device (30) loaded on the base plate (40) 0), so that the base plate (40) moves slightly in the XY-θ direction; an X-axis plate (60), which is arranged on the vertical column (11) of the base (10) and moves horizontally at each interval along the X-axis direction; a Z-axis plate (71), which is arranged on the X-axis plate (60) and rises and falls along the Z-axis; a visual area (72), which is arranged on the Z-axis plate (71) and has a through hole (72a); an alignment area (73), which is arranged at the lower part of the visual area (72) and has an opening (73a) that can cover the device (30) attracted to the base plate (40); The vision (74) is arranged on the upper part of the Z-axis plate (71), and after confirming the position of the device (30) attracted to the base plate (40) through the through hole (72a) and the opening (73a) of the vision area (72), the coordinate value is transmitted to the control unit; the alignment area (73) descends according to the coordinate value of the device (30) attracted to the base plate (40), and in a state of enclosing the device (30), the base plate (40) is slightly moved in the XY-θ direction through the base plate position adjustment device (50), thereby aligning the device (30).

2. The device alignment apparatus with a fine pitch according to claim 1, wherein: The structure of the base plate position adjustment device (50) includes: a setting plate (51) fixed on the Y-axis plate (20); a pair of X-axis motors (52a, 52b) arranged facing the setting plate (51); a Y-axis motor (53) arranged on the setting plate (51) and intersecting the X-axis motor at a right angle; a movable plate (54) arranged to be slightly movable along the XY-θ direction by the X-axis motors (52a, 52b) and the Y-axis motor (53); four cross rollers (55) arranged between the setting plate (51) and the movable plate (54) to move the movable plate (54) in the XY axis direction; and a shaft (56) on each cross roller (55) to enable the movable plate (54) to be rotatably coupled.

3. The device alignment apparatus with a fine pitch according to claim 1, wherein: The Y-axis plate (20) and the X-axis plate (60) are guided by LM guide rails (20a, 60a) to perform linear motion.

4. The device alignment apparatus with a fine pitch according to claim 1, wherein: A heater and a cooling pipe are provided inside the base plate (40).

5. A method for aligning devices with fine pitch, characterized in that: The invention comprises the steps of sequentially loading devices on a base plate (40) having a plurality of vacuum holes; when the device (30) is loaded on the base plate (40), as vacuum pressure is applied, sucking the loaded device (30) with a slightly movable vacuum pressure; a step of moving an alignment visual component (70) located on the upper part of the base plate (40) toward the upper part of the device (30) to be aligned and then descending; a step of confirming the position of the device (30) through the through hole (72a) and the opening (73a) with vision (74) when the alignment area (73) covers the device (30), and transmitting the coordinate value to the control unit; a step of slightly moving the base plate (40) in the XY-θ direction according to the coordinate value of the device (30), guiding the device (30) to the two sides of the opening (73a) for alignment, and correcting the position of the device (30) by the alignment area (73); Each time a device (30) is loaded onto the base plate (40), the base plate (40) is moved in the XY axis direction at each interval and the device is aligned.

6. The method for aligning devices with a fine pitch according to claim 5, wherein: The device (30) is attracted by a pressure of 5 to 50 mmHg, and the position of the device (30) is corrected by the alignment area (73).

7. The method for aligning devices with a fine pitch according to claim 5, wherein: After the alignment of the device (30) is completed, the method further includes the step of preventing the device (30) from moving by attracting with a secondary pressure.

8. The method for aligning devices with a fine pitch according to claim 7, wherein: The secondary pressure is 50-100 mmHg.

9. The method for aligning devices with a fine pitch according to claim 5, wherein: After the alignment section (73) corrects the position of the device (30) and completes the alignment, the inner surface of the opening (73a) is moved away from the device (30), and then the alignment section (73) rises.

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