Substrate conveying device and substrate processing system

Abstract

A substrate conveying device for conveying a substrate is provided. The substrate conveying device includes: a first planar motor, which is provided in a first chamber and has arranged coils; a second planar motor, which is provided in a second chamber connected to the first chamber and has arranged coils; a pair of conveying units, which move on the first planar motor and / or the second planar motor and can convey the substrate; and a control unit, which controls the energization of the coils of the first planar motor and the second planar motor.

Description

Technical Field

[0001] The present disclosure relates to a substrate conveying device and a substrate processing system. Background Art

[0002] For example, there is known a substrate processing system including a plurality of processing chambers and a vacuum transfer chamber connected to the processing chambers. A substrate transfer device for transferring a substrate is provided in the vacuum transfer chamber.

[0003] Patent Document 1 discloses a processing station including a plurality of processing modules and a conveying module. The conveying module is provided with a wafer conveying mechanism including a multi-jointed arm.

[0004] Furthermore, Patent Document 2 discloses a semiconductor processing apparatus that uses a planar motor to transport a substrate.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2017-168866

[0008] Patent Document 2: Japanese Patent Application No. 2018-504784 Summary of the invention

[0009] Problem that the invention aims to solve

[0010] In the processing station disclosed in Patent Document 1, a plurality of multi-joint arms are provided in a conveying module that forms a vacuum atmosphere, so as to convey substrates to a plurality of processing modules. A motor that may become a dust source is arranged outside the conveying module, and the rotating shaft of the multi-joint arm is arranged to penetrate the bottom surface of the conveying module, and the bottom surface and the rotating shaft are sealed by a magnetic seal. Therefore, there is a problem that it is difficult to maintain a high vacuum in the conveying module. In addition, in the system disclosed in Patent Document 2, there is a problem that the operability is poor and the opening of the chamber needs to be enlarged.

[0011] A technical solution of the present disclosure provides a substrate conveying device for conveying a substrate.

[0012] Solutions for solving problems

[0013] A substrate conveying device of a technical solution disclosed in the present invention includes: a first planar motor, which is arranged in a first chamber and has arranged coils; a second planar motor, which is arranged in a second chamber connected to the first chamber and has arranged coils; a pair of conveying units, which move on the first planar motor and / or the second planar motor and can convey the substrate; and a control unit, which controls the energization of the coils of the first planar motor and the second planar motor.

[0014] Effects of the Invention

[0015] According to a technical solution of the present disclosure, a substrate conveying device for conveying a substrate is provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a plan view showing the structure of an example of a substrate processing system according to one embodiment.

[0017] Figure 2 It is a perspective view for explaining the driving principle of the substrate transport mechanism.

[0018] Figure 3A It is a top view showing an example of a transport unit according to an embodiment.

[0019] Figure 3B It is an AA cross-sectional view which shows an example of the conveyance unit which concerns on one Embodiment.

[0020] Figure 4A The diagram is a schematic diagram for explaining a procedure of placing a wafer from a transfer unit onto a mounting table in a processing chamber.

[0021] Figure 4B The diagram is a schematic diagram for explaining a procedure of placing a wafer from a transfer unit onto a mounting table in a processing chamber.

[0022] Figure 4C The diagram is a schematic diagram for explaining a procedure of placing a wafer from a transfer unit onto a mounting table in a processing chamber.

[0023] Figure 5A It is a schematic diagram explaining the steps of transferring a wafer from a conveying unit to another conveying unit.

[0024] Figure 5B It is a schematic diagram explaining the steps of transferring a wafer from a conveying unit to another conveying unit.

[0025] Figure 5C It is a schematic diagram explaining the steps of transferring a wafer from a conveying unit to another conveying unit.

[0026] Fig. 6A It is a schematic diagram for explaining the operation of the transfer unit when it moves from the vacuum transfer chamber to the processing chamber.

[0027] Figure 6B It is a schematic diagram for explaining the operation of the transfer unit when it moves from the vacuum transfer chamber to the processing chamber.

[0028] Figure 6C It is a schematic diagram for explaining the operation of the transfer unit when it moves from the vacuum transfer chamber to the processing chamber. DETAILED DESCRIPTION

[0029] Hereinafter, the mode for implementing the present disclosure will be described with reference to the drawings. In each of the drawings, the same reference numerals are attached to the same components, and duplicate descriptions may be omitted.

[0030] <Substrate processing system 100>

[0031] use Figure 1 An example of the overall configuration of the substrate processing system 100 according to one embodiment will be described. Figure 1 FIG. 1 is a top view showing a structure of an example of a substrate processing system 100 according to an embodiment. Figure 1 In the figure, the wafer W is illustrated with dotted shadows.

[0032] Figure 1 The substrate processing system 100 shown is a cluster structure (multi-chamber type) system and includes a plurality of processing chambers 110 , a vacuum transfer chamber 120 , a load lock chamber 130 , an atmospheric transfer chamber 140 , and a control unit 150 .

[0033] The processing chamber 110 is decompressed to a predetermined vacuum atmosphere, and the desired processing (etching processing, film forming processing, cleaning processing, ashing processing, etc.) is performed on the semiconductor wafer W (hereinafter, also referred to as "wafer W") inside the processing chamber 110. The processing chamber 110 is arranged adjacent to the vacuum conveying chamber 120. The processing chamber 110 and the vacuum conveying chamber 120 are connected by the opening and closing of the gate valve 112. The processing chamber 110 has a mounting table 111 on which the wafer W is mounted. In addition, a planar motor 11 of a substrate conveying device 125 for conveying the wafer W is provided inside the processing chamber 110. In addition, the operation of each part used for processing in the processing chamber 110 is controlled by the control unit 150.

[0034] The vacuum transfer chamber 120 is depressurized to a predetermined vacuum atmosphere. In addition, a planar motor 10 of a substrate transfer device 125 for transferring wafer W is provided inside the vacuum transfer chamber 120. The substrate transfer device 125 has a transfer unit 20 for holding wafer W. The substrate transfer device 125 transfers wafer W between the processing chamber 110 and the vacuum transfer chamber 120 according to the opening and closing of the gate valve 112. In addition, the substrate transfer device 125 transfers wafer W between the load interlock chamber 130 and the vacuum transfer chamber 120 according to the opening and closing of the gate valve 132. In addition, the operation of the substrate transfer device 125 and the opening and closing of the gate valve 112 are controlled by the control unit 150. In addition, regarding the substrate transfer device 125, use Figure 2 and Figure 3A to Figure 3B Then the narrative follows.

[0035] The load lock chamber 130 is provided between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140. The load lock chamber 130 has a stage 131 on which a wafer W is placed. In addition, a planar motor 13 of a substrate transfer device 125 for transferring wafer W is provided inside the load lock chamber 130. The load lock chamber 130 can switch between atmospheric atmosphere and vacuum atmosphere. The load lock chamber 130 and the vacuum transfer chamber 120 of the vacuum atmosphere are connected by opening and closing a gate valve 132. The load lock chamber 130 and the atmospheric transfer chamber 140 of the atmospheric atmosphere are connected by opening and closing a gate valve 133. In addition, the switching between the vacuum atmosphere and the atmospheric atmosphere in the load lock chamber 130 is controlled by a control unit 150.

[0036] The atmospheric transfer chamber 140 is an atmospheric atmosphere, for example, a downflow of clean air is formed. In addition, a conveying device (not shown) for conveying wafers W is provided inside the atmospheric transfer chamber 140. The conveying device (not shown) carries out the transfer of wafers W between the load lock chamber 130 and the atmospheric transfer chamber 140 according to the opening and closing of the gate valve 133. In addition, the operation of the conveying device (not shown) and the opening and closing of the gate valve 133 are controlled by the control unit 150.

[0037] A loading port (not shown) is provided on the wall of the atmospheric transfer chamber 140. A carrier (not shown) containing wafers W or an empty carrier is mounted on the loading port. As the carrier, for example, a FOUP (Front Opening Unified Pod) or the like can be used.

[0038] The transfer device (not shown) can take out the wafer W accommodated in the load port and place it on the mounting table 131 of the load lock chamber 130. In addition, the transfer device (not shown) can take out the wafer W placed on the mounting table 131 of the load lock chamber 130 and place it in the load port.

[0039] The control unit 150 has a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a HDD (Hard Disk Drive). The control unit 150 is not limited to having a HDD, and may also have other storage areas such as an SSD (Solid State Drive). The storage areas such as the HDD and RAM store the recipes for setting the processing steps, processing conditions, and transport conditions.

[0040] The CPU controls the processing of the wafers W in each processing chamber 110 according to the process and controls the conveyance of the wafers W. The HDD or RAM may store a program for executing the processing of the wafers W in each processing chamber 110 and the conveyance of the wafers W. The program may be provided by being stored in a storage medium or provided from an external device via a network.

[0041] Next, an example of the operation of the substrate processing system 100 is described. Here, as an example of the operation of the substrate processing system 100, the following operation is described: the wafer W accommodated in the carrier installed in the load port is processed in the processing chamber 110, and the wafer W is accommodated in the empty carrier installed in the load port. In addition, at the start of the operation, the gate valves 112, 132, and 133 are closed, and the load lock chamber 130 is in the air atmosphere.

[0042] The control unit 150 opens the gate valve 133. The control unit 150 controls the transfer device in the atmospheric transfer chamber 140 to take out the wafer W from the carrier of the load port and place it on the mounting table 131 of the load lock chamber 130. When the wafer W is placed on the mounting table 131 of the load lock chamber 130 and the transfer device retreats from the load lock chamber 130, the control unit 150 closes the gate valve 133.

[0043] The control unit 150 controls an exhaust device (not shown) of the load lock chamber 130 to exhaust the air in the chamber, thereby switching the load lock chamber 130 from an air atmosphere to a vacuum atmosphere.

[0044] Next, the wafer W placed on the stage 131 of the load lock chamber 130 is transported to the processing chamber 110 and placed on the stage 111. Specifically, the control unit 150 opens the gate valve 132. The control unit 150 controls the substrate transport device 125 described later to insert the transport unit 20 into the load lock chamber 130 to a preset teaching point, holds the wafer W placed on the stage 131 of the load lock chamber 130, and transports it to the vacuum transport chamber 120. When the transport unit 20 retreats from the load lock chamber 130, the control unit 150 closes the gate valve 132.

[0045] The control unit 150 opens the gate valve 112 of the processing chamber 110 of the transfer destination. The control unit 150 controls the substrate transfer device 125 to insert the transfer unit 20 into the processing chamber 110 to a preset teaching point, and places the held wafer W on the mounting table 111 of the processing chamber 110. When the transfer unit 20 retreats from the processing chamber 110, the control unit 150 closes the gate valve 112.

[0046] The control unit 150 controls the processing chamber 110 to perform a desired process on the wafer W.

[0047] When the processing of the wafer W is completed, the wafer W placed on the stage 111 of the processing chamber 110 is transported to the load lock chamber 130 and placed on the stage 131. Specifically, the control unit 150 opens the gate valve 112. The control unit 150 controls the substrate conveying device 125 to insert the conveying unit 20 into the processing chamber 110 to a preset teaching point, holds the wafer W placed on the stage 111 of the processing chamber 110, and conveys it to the vacuum conveying chamber 120. When the conveying unit 20 retreats from the processing chamber 110, the control unit 150 closes the gate valve 112.

[0048] The control unit 150 opens the gate valve 132. The control unit 150 controls the substrate conveying device 125 to insert the conveying unit 20 into the load lock chamber 130 to a preset teaching point, and places the held wafer W on the mounting table 131 of the load lock chamber 130. When the conveying unit 20 retreats from the load lock chamber 130, the control unit 150 closes the gate valve 132.

[0049] The control unit 150 controls an air suction device (not shown) of the load lock chamber 130 to supply, for example, clean air into the chamber, thereby switching the load lock chamber 130 from a vacuum atmosphere to an air atmosphere.

[0050] The control unit 150 opens the gate valve 133. The control unit 150 controls the transfer device (not shown) to take out the wafer W placed on the stage 131 of the load lock chamber 130 and store it in the carrier of the load port. When the wafer W is taken out from the stage 131 of the load lock chamber 130 and the transfer device (not shown) retreats from the load lock chamber 130, the control unit 150 closes the gate valve 133.

[0051] In addition, in the substrate processing system 100, the substrate conveying device 125 is described as follows: the wafer W placed on the stage 131 of the load lock chamber 130 is conveyed to the stage 111 of the processing chamber 110, and the processed wafer W is conveyed from the stage 111 of the processing chamber 110 to the stage 131 of the load lock chamber 130, but the present invention is not limited thereto. The substrate conveying device 125 may also be a structure that conveys the wafer W placed on the stage 111 of one processing chamber 110 to the stage 111 of another processing chamber 110.

[0052] <Substrate conveying device 125>

[0053] Next, the substrate conveying device 125 is further described. The substrate conveying device 125 includes a planar motor (linear unit) 10 disposed in the vacuum conveying chamber 120, a planar motor 11 disposed in the processing chamber 110, a planar motor 13 disposed in the load lock chamber 130, and a pair of conveying units 20A and 20B that can move on the planar motors 10, 11, and 13. The pair of conveying units 20A and 20B respectively include bases 31 and 32. In addition, a plurality of conveying units 20 may be provided.

[0054] use Figure 2 , further illustrating the planar motors 10 , 11 , 13 and the bases 31 , 32 of the conveying unit 20 . Figure 2 It is a perspective view for explaining the driving principle of the substrate transfer device 125 .

[0055] The planar motors 10, 11, and 13 are provided with a plurality of coils 15. The coils 15 generate magnetic fields when current is supplied thereto. Figure 1 ) is configured to be able to individually control the current value supplied to each coil 15.

[0056] A plurality of permanent magnets 35 are arranged on the bases 31 and 32. The bases 31 and 32 are magnetically suspended on the planar motor 10 by the magnetic field generated by the coil 15. In addition, the permanent magnets 35 are attracted or repelled by the magnetic field generated by the coil 15, so that the bases 31 and 32 move on the planar motors 10, 11, and 13.

[0057] According to such a structure, the control unit 150 (see Figure 1 ) is configured to control the position, orientation, and suspension amount of the bases 31 and 32 by controlling the current values ​​of the coils 15 of the planar motors 10, 11, and 13.

[0058] Figure 3A and Figure 3B This is a diagram showing an example of the transport unit 20 according to one embodiment. Figure 3A It is a plan view showing an example of the transport unit 20 . Figure 3B It is an AA cross-sectional view which shows an example of the conveying unit 20 .

[0059] The substrate transfer device 125 uses a pair of transfer units 20A and 20B to transfer the wafer W. One transfer unit 20A includes a susceptor 31 , a support 41 , and a substrate support 51 . The other transfer unit 20B includes a susceptor 32 , a support 42 , and a substrate support 52 .

[0060] The support portion 41 of the conveying unit 20A is vertically arranged from the center of the base 31. The substrate support portion 51 is formed on the support portion 41. Figure 3A and Figure 3BAs shown in the figure, the support part 41 and the substrate support part 51 are formed in the center in the longitudinal direction of the base 31, but the present invention is not limited to this. They may also be arranged offset to one side.

[0061] In addition, one conveying unit 20A and another conveying unit 20B may have the same shape, may have mirror-image symmetrical shapes, or may have different shapes.

[0062] The control unit 150 can control the distance between the substrate supports 51 and 52 by controlling the distance between the susceptors 31 and 32. The control unit 150 can also transfer the wafer W by moving the susceptors 31 and 32 while maintaining the relative positional relationship between the susceptors 31 and 32.

[0063] <Transferring the wafer to the stage>

[0064] Next, use Figure 4A to Figure 4C The transfer of the wafer W between the transport unit 20 and the mounting table 111 ( 131 ) will be described. Figure 4A to Figure 4C 1 is a schematic diagram for explaining a procedure of placing the wafer W from the transfer unit 20 onto the mounting table 111 of the processing chamber 110 .

[0065] like Figure 3A As shown, the susceptors 31 and 32 of the transport unit 20 are separated by a predetermined interval, and the transport unit 20 supports the wafer W using the substrate supports 51 and 52. The transport unit 20 moves by magnetic levitation on the planar motors 10, 11, and 13 while maintaining the interval between the susceptors 31 and 32.

[0066] like Figure 4A As shown, the susceptors 31 and 32 magnetically suspended on the planar motor 11 move, thereby moving the wafer W above the mounting table 111 .

[0067] like Figure 4B As shown, the control unit 150 raises the lift pins 113 provided on the mounting table 111 . As a result, the wafer W is lifted by the lift pins 113 . Then, the transfer unit 20 leaves the mounting table 111 and returns to the vacuum transfer chamber 120 .

[0068] like Figure 4C As shown in FIG. 1 , the control unit 150 lowers the lift pins 113 provided on the mounting table 111 , thereby mounting the wafer W supported by the lift pins 113 on the mounting table 111 .

[0069] In addition, the case where the wafer W is transferred from the conveying unit 20 to the mounting table 111 is described as an example. However, in the case where the wafer W is transferred from the mounting table 111 to the conveying unit 20, as long as the Figure 4A to Figure 4CIn addition, the mounting table 111 of the processing chamber 110 is described as an example, but the mounting table 131 of the load lock chamber 130 is also the same, and the repeated description is omitted.

[0070] <Transfer of wafers between transport units>

[0071] Next, use Figure 5A to Figure 5C , illustrating the transfer of wafers W between a pair of conveying units 20A, 20B and another pair of conveying units 20C, 20D. Figure 5A to Figure 5C 1 and 2 are schematic diagrams for explaining a procedure of transferring the wafer W from a pair of transfer units 20A and 20B to another pair of transfer units 20C and 20D.

[0072] like Figure 5A As shown, at the start of processing, the wafer W is supported by a pair of conveying units 20A and 20B.

[0073] like Figure 5B As shown, the control unit 150 controls the current of each coil 15 to move the transport units 20C and 20D to the collection position. Figure 5B In the example, the conveying units 20C and 20D are moved in such a way that the straight line connecting the conveying units 20A and 20B is orthogonal to the straight line connecting the conveying units 20C and 20D. At this time, the magnetic levitation amount of the conveying units 20A and 20B is higher than the magnetic levitation amount of the conveying units 20C and 20D. Therefore, the wafer W is supported by the substrate support parts 51 and 52 of the conveying units 20A and 20B. In addition, the substrate support parts 51 and 52 of the conveying units 20C and 20D can move under the wafer W without contacting the wafer W.

[0074] The control unit 150 controls the current of each coil 15 so that the magnetic levitation amount of the transport units 20C and 20D is relatively higher than that of the transport units 20A and 20B. Thus, the wafer W is transferred from the transport units 20A and 20B to the transport units 20C and 20D.

[0075] like Figure 5C As shown, the control unit 150 controls the current of each coil 15 to retract the transport units 20A and 20B from under the wafer W. Thus, the wafer W supported by the pair of transport units 20A and 20B can be transferred to the other pair of transport units 20C and 20D.

[0076] In addition, the interval between the conveying units 20A and 20B may be different from the interval between the conveying units 20C and 20D. For example, the conveying units 20A and 20B that receive the wafer W from the stage 131 of the load lock chamber 130 are set at an interval based on the width of the stage 131. The conveying units 20C and 20D that deliver the wafer W to the stage 111 of the processing chamber 110 are set at an interval based on the width of the stage 111. In this way, even if the widths of the stages 111 and 131 are different, the wafer W can be delivered between the conveying units 20A and 20B and the conveying units 20C and 20D, thereby changing the interval of the conveying units 20 that hold the wafer W.

[0077] <Moving between rooms>

[0078] Next, use Figure 6A to Figure 6C , describing the process of moving a transport unit 20A, 20B between two chambers connected by a passage. Figure 6A to Figure 6C 1 is a schematic diagram for explaining the operation of the transfer unit 20 when it moves from the vacuum transfer chamber 120 to the processing chamber 110 .

[0079] like Figure 6A to Figure 6C As shown, the planar motor 10 is arranged in the vacuum transfer chamber 120, and the planar motor 11 is arranged in the processing chamber 110. In addition, a gate valve 112 is provided as a passage between the vacuum transfer chamber 120 and the processing chamber 110. Here, the gate valve 112 is not provided with the planar motor, that is, it becomes a region where the coil 15 is not arranged.

[0080] like Figure 6A to Figure 6C As shown in FIG. 1 , the length of the bases 31 and 32 in the direction of travel is formed longer than the length of the gate valve 112 in the direction of travel. Figure 6A to Figure 6C As shown, when the pedestals 31 and 32 cross the gate valve 112, at least one of the permanent magnets 35 is disposed on the planar motors 10 and 11. Thus, when the pedestals 31 and 32 cross the gate valve 112, they can receive the magnetic field from the planar motors 10 and 11 and drive the pedestals 31 and 32.

[0081] Furthermore, when one side of the base 31, 32 reaches the gate valve 112, the magnetic field generated by the planar motor 10 is controlled so as to maintain the base 31, 32 in parallel. Specifically, the magnetic field is formed so as to increase the repulsive force on the side of the gate valve 112. Thus, when the base 31, 32 crosses the gate valve 112, the front end side of the base 31, 32 can be prevented from falling down.

[0082] In addition, the operation of the transfer unit 20 when crossing the gate valve 112 between the processing chamber 110 and the vacuum transfer chamber 120 has been described, but the operation of the transfer unit 20 when crossing the gate valve 132 between the load lock chamber 130 and the vacuum transfer chamber 120 can also be performed in the same manner.

[0083] As described above, according to the substrate transfer device 125 , the control unit 150 can control the position, orientation, and floating amount of the susceptors 31 and 32 by controlling the energization of the coils 15 of the planar motor 10 . Thus, the position, orientation, and floating amount of the transfer unit 20 can be controlled.

[0084] Here, when a multi-joint arm is used as the substrate conveying device, a through-portion and a sealing portion through which the rotating shaft of the multi-joint arm passes are formed in the vacuum conveying chamber 120. In contrast, according to the substrate conveying device 125, a through-portion and a sealing portion that pass through the vacuum conveying chamber 120 are not required, so the vacuum degree of the vacuum conveying chamber 120 can be improved. In addition, the conveying unit 20 moves in a magnetically suspended manner on the planar motor 10, so that dust generation can be suppressed.

[0085] Furthermore, according to the substrate transfer device 125 , the wafer W can be freely transferred. This improves the degree of freedom in designing the substrate processing system 100 . For example, the space between adjacent processing chambers 110 can be reduced.

[0086] As mentioned above, although the substrate processing system 100 and 100B were demonstrated, this disclosure is not limited to the said embodiment etc., Various deformation|transformation and improvement are possible within the scope of the summary of this disclosure described in a claim.

[0087] Although the substrate transfer apparatuses 125 and 125B are described as being provided in the vacuum transfer chamber 120 of the vacuum atmosphere, the present invention is not limited thereto and the substrate transfer apparatuses 125 and 125B can also be applied to a transfer chamber of the air atmosphere.

[0088] In addition, the present application claims priority based on Japanese Patent Application No. 2019-217077 filed on November 29, 2019, the entire contents of which are incorporated herein by reference.

[0089] Description of Reference Numerals

[0090] W, wafer; 100, 100B, substrate processing system; 110, processing chamber (chamber 2); 111, mounting table; 112, 132, gate valve (passage); 120, vacuum transfer chamber (chamber 1); 125, substrate transfer device; 130, load interlock chamber (chamber 2); 150, control unit; 10, planar motor; 15, coil; 20, 20A~20D, transfer unit; 31, 32, base; 35, permanent magnet; 41, 42, support part; 51, 52, substrate support part (substrate support member).

Claims

1. A substrate conveying device, wherein: The substrate conveying device comprises: A first planar motor is disposed in the first chamber and has arranged coils; a second planar motor provided in a second chamber connected to the first chamber and having arranged coils; a pair of conveying units, which move on the first planar motor and / or the second planar motor and are capable of conveying the substrate, wherein the pair of conveying units are used to jointly support a single substrate; and a control unit that controls energization of the coils of the first planar motor and the second planar motor, wherein the control unit moves the pair of conveying units while maintaining the relative positional relationship between the pair of conveying units to convey the single substrate, Among them, the first chamber and the second chamber are connected by means of a gate valve, and the gate valve becomes an area where the coil is not configured. When the pair of conveying units cross the gate valve from the first chamber to the second chamber, the control unit controls the magnetic field generated by the first planar motor in a manner that increases the repulsive force on the gate valve side.

2. The substrate conveying device according to claim 1, wherein: The conveying unit comprises: a base having arranged magnets and magnetically suspended on the first planar motor and / or the second planar motor; and The substrate supporting member is arranged on the base and is used for supporting the substrate.

3. The substrate conveying device according to claim 1 or 2, wherein: The first chamber is a transport chamber, The second chamber has a mounting table on which the substrate is mounted.

4. The substrate conveying device according to claim 3, wherein: The second chamber is a processing chamber and / or a load lock chamber.

5. A substrate processing system, wherein: The substrate processing system comprises: The first chamber according to any one of claims 1 to 4; The second chamber according to any one of claims 1 to 4; and The substrate transport device according to any one of claims 1 to 4.

6. The substrate processing system according to claim 5, wherein: The first chamber is a vacuum transfer chamber with a vacuum atmosphere.

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