Installation system and installation method

Abstract

The subject of the present disclosure is to improve the installation quality of the first object. The installation system (10) involved in the present disclosure comprises a mounting head (1), a camera device (2) and a control device (3). The mounting head (1) has a capturing portion (11) for capturing the first object. The mounting head (1) maintains the capturing portion (11) so as to be movable toward the second object. The camera device (2) is provided on the mounting head (1). The camera device (2) contains a specific area containing a specific object in the camera field of view. The control device (3) controls the movement of the capturing portion (11) so that the capturing portion (11) moves toward the second object.

Description

Technical Field

[0001] The present disclosure generally relates to a mounting system and a mounting method. More specifically, the present disclosure relates to a mounting system and a mounting method including a capturing unit for capturing a first object. Background Art

[0002] Patent Document 1 describes a component mounting device for mounting components at predetermined positions on a substrate.

[0003] In the component mounting device described in Patent Document 1, the warpage amount of the substrate is detected by a warpage detector, and the component is mounted at a component mounting height set according to the warpage amount.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2004-71641 Summary of the invention

[0007] In the component mounting device described in Patent Document 1, since the warpage of the entire substrate is estimated based on the detection data of the warpage amount at several points on the substrate, it is difficult to detect the actual mounting height of each mounting position. Therefore, for example, when the substrate is warped in its thickness direction, there is a possibility that the component (first object) may be poorly mounted.

[0008] An object of the present disclosure is to provide a mounting system and a mounting method capable of improving the mounting quality of a first object.

[0009] The mounting system involved in one embodiment of the present disclosure includes a mounting head, a camera device, and a control device. The mounting head has a capture unit for capturing a first object. The mounting head holds the capture unit so that it can move toward a second object. The camera device is provided on the mounting head. The camera device includes a specific area containing a specific object in the camera field of view. The control device controls the movement of the capture unit based on information related to the specific object contained in the output of the camera device, so that the capture unit moves toward the second object.

[0010] The mounting method involved in one embodiment of the present disclosure is a mounting method used in a mounting system having a mounting head and a camera device. The mounting head has a capturing portion for capturing a first object. The mounting head holds the capturing portion so as to be movable toward a second object. The camera device is disposed on the mounting head. The camera device includes a specific area including a specific object in a camera field of view. The mounting method includes a step of moving the capturing portion by a control device. The control device moves the capturing portion based on information related to the specific object contained in the output of the camera device so that the capturing portion moves toward the second object. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic three-dimensional diagram of the mounting system involved in Embodiment 1.

[0012] Figure 2 It is a block diagram of the installation system as above.

[0013] Figure 3 A~ Figure 3 D is an illustration for explaining the operation of the same installation system as above.

[0014] Figure 4 It is a flowchart used to illustrate the operation of the same installation system as above.

[0015] Figure 5 This is a block diagram of the installation system involved in Implementation Example 2.

[0016] Figure 6 A~ Figure 6 D is an illustration for explaining the operation of the same installation system as above.

[0017] Figure 7 It is a flowchart used to illustrate the operation of the same installation system as above.

[0018] Figure 8 A~ Figure 8 C is an explanatory diagram for explaining the operation of the mounting system according to variant example 1 of implementation example 2.

[0019] Fig. 9 It is a flowchart used to illustrate the operation of the same installation system as above.

[0020] Fig.10 This is a schematic side view of the main parts of the mounting system involved in the modified example 2 of the second embodiment. DETAILED DESCRIPTION

[0021] (Implementation Method 1)

[0022] The following references Figure 1 to Figure 4The mounting system 10 and the mounting method according to the present embodiment will be described.

[0023] (1) Summary

[0024] The installation system 10 involved in this embodiment is as follows Figure 1 As shown, it is a mounting device (mounting machine) for mounting the first object T1 captured by the capturing unit 11 on the second object T2. The mounting system 10 is used in facilities such as factories, research institutes, offices, and educational facilities for manufacturing various products such as electronic equipment, automobiles, clothing, food, medicines, and industrial products.

[0025] In the present embodiment, the case where the mounting system 10 is used in the manufacture of electronic equipment in a factory is described. General electronic equipment has various circuit blocks such as a power supply circuit and a control circuit. When manufacturing these circuit blocks, as an example, they are carried out in the order of a solder coating process, a mounting process, and a soldering process. In the solder coating process, paste solder is coated (or printed) on a substrate (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the substrate. In the soldering process, for example, the substrate with the components mounted is heated in a reflow oven to melt the paste solder and perform soldering. In the mounting process, the mounting system 10 performs an operation of mounting a component 100 as a first object T1 on a substrate 200 as a second object T2. That is, in the mounting system 10 involved in the present embodiment, the first object T1 is the component 100, and the second object T2 is the substrate 200 on which the component 100 is mounted.

[0026] In this way, the mounting system 10 used for mounting the first object T1 (component 100) on the second object T2 (substrate 200) is as follows. Figure 1 As shown in the figure, the mounting head 1 is provided with a capture part 11 for capturing the first object T1. The capture part 11 is constituted by a suction nozzle as an example, and captures (holds) the component 100 as the first object T1 in a releasable (i.e., released) state. The mounting system 10 lowers the capture part 11 to approach the second object T2 while the first object T1 is captured by the capture part 11, and mounts the first object T1 on the mounting surface T21 of the second object T2.

[0027] In such a mounting system 10, when the first object T1 is mounted on the mounting surface T21 of the second object T2, a specific area R1 (reference Figure 3 A~ Figure 3 For the purpose of identification of D), it is desired to photograph the specific area R1. To this end, the mounting system 10 involved in this embodiment includes, in addition to the mounting head 1, Figure 3 As shown in A of FIG. 1 , the mounting system 10 is provided with an imaging device 2. Thus, the mounting system 10 uses the imaging device 2 to capture an image of a specific region R1 of the mounting surface T21, and can, for example, confirm a specific object TA (see FIG. 1 ) contained in the specific region R1 in the image during mounting of the first object T1 by the mounting head 1. Figure 3 A). For this reason, in the present embodiment, the imaging device 2 is configured to be able to image at least the area directly below the capture portion 11 in the mounting surface T21. In the present embodiment, the specific object TA is a contact member 9 that contacts both the component 100 and the substrate 200. In addition, in the present embodiment, the contact member 9 is a bonding member 91 that bonds the component 100 and the substrate 200, such as solder.

[0028] That is, the mounting system 10 according to the present embodiment includes a mounting head 1, an imaging device 2 (see Figure 3 A) and control device 3 (reference Figure 2 The mounting head 1 has a capture unit 11 for capturing the first object T1. The mounting head 1 holds the capture unit 11 so as to be movable toward the second object T2. The imaging device 2 is provided in the mounting head 1. The imaging device 2 has an imaging field of view R10 (reference Figure 3 A) contains a specific object TA (reference Figure 3 A) specific area R1 (reference Figure 3 A). The control device 3 controls the movement of the capture unit 11 based on the information related to the specific object TA included in the output of the imaging device 2 so that the capture unit 11 moves toward the second object T2.

[0029] In the mounting system 10 according to the present embodiment, the camera device 2 includes a specific area R1 including a specific object TA in the camera field of view R10. In addition, in the mounting system 10, the control device 3 controls the movement of the capture unit 11 based on the information related to the specific object TA included in the output of the camera device 2. For this purpose, the control device 3 can, for example, determine the mounting state of the first object T1 on the second object T2 based on the state of the specific object TA. Therefore, according to the mounting system 10 according to the present embodiment, the mounting quality of the first object T1 can be improved.

[0030] (2) Details

[0031] The following describes in detail the mounting system 10 and the mounting method according to the present embodiment.

[0032] (2.1) Prerequisites

[0033] In the present embodiment, as an example, a case where the mounting system 10 is used in the mounting of a component (first object T1) based on the surface mounting technology (SMT: Surface Mount Technology) is described. That is, the component 100 as the first object T1 is a surface mounting component (SMD: Surface Mount Device), and is mounted by being arranged on the surface (mounting surface T21) of the substrate 200 as the second object T2. However, this example is not limited to the above, and the mounting system 10 may also be used in the mounting of a component (first object T1) based on the insertion mounting technology (IMT: Insertion Mount Technology). In this case, the component 100 as the first object T1 is an insertion mounting component having a lead terminal, and is mounted on the surface (mounting surface T21) of the substrate (second object T2) by inserting the lead terminal into the hole of the substrate 200 as the second object T2.

[0034] In addition, the "imaging optical axis" referred to in the present disclosure is the optical axis of the image captured by the imaging device 2, and is the optical axis of the image captured by the imaging element 21 (see Figure 2 ) and the optical system 22 (reference Figure 2 That is, the optical path along which the light from the center of the image captured by the imaging device 2 passes becomes the imaging optical axis Ax1 of the imaging device 2 (reference Figure 3 Specifically, a straight line connecting the center of the light receiving surface of the imaging element 21 and a portion of the object that passes through the optical system 22 and forms an image at the center of the light receiving surface of the imaging element 21 becomes the imaging optical axis Ax1 of the imaging device 2.

[0035] In addition, the "image" referred to in the present disclosure is an image captured by the camera device 2, including a still image (still image) and a dynamic image (dynamic image). Furthermore, the "dynamic image" includes an image composed of a plurality of still images obtained by frame-by-frame shooting. The image may not be the data itself output from the camera device 2. For example, the image may be processed by compression of appropriate data, conversion to other data formats, or processing such as cutting out a portion of the image captured by the camera device 2, focusing adjustment, brightness adjustment, or contrast adjustment, etc. In the present embodiment, as an example, the image is a full-color dynamic image.

[0036] Below, as an example, three axes, namely, the X-axis, the Y-axis, and the Z-axis, which are orthogonal to each other, are set, and the axes parallel to the surface (mounting surface T21) of the substrate 200 as the second object T2 are set as the "X-axis" and the "Y-axis", and the axis parallel to the thickness direction of the substrate 200 is set as the "Z" axis. Furthermore, the side of the capture portion 11 viewed from the substrate 200 as the second object T2 is defined as the positive direction of the Z-axis (also referred to as "above"). In addition, the state viewed from the positive direction (above) of the Z-axis will be referred to as "top view" below. The X-axis, the Y-axis, and the Z-axis are all virtual axes, and the arrows indicating "X", "Y", and "Z" in the accompanying drawings are only marked for explanation and are not accompanied by entities. In addition, these directions are not intended to limit the directions when the mounting system 10 is used.

[0037] Furthermore, the mounting system 10 is connected to a pipe for circulating cooling water, a cable for supplying electric power, a pipe for supplying air pressure (including positive pressure and vacuum), etc. However, in the present embodiment, these are omitted from the drawings as appropriate.

[0038] (2.2) Overall structure

[0039] Next, refer to Figure 1 as well as Figure 2 The overall structure of the mounting system 10 according to the present embodiment will be described.

[0040] The installation system 10 involved in this embodiment is as follows Figure 1 as well as Figure 2 As shown in FIG. 1 , the mounting system 10 includes a mounting head 1, an imaging device 2, and a control device 3. Figure 2 As shown in the figure, in addition to the mounting head 1, the camera device 2 and the control device 3, it also includes a driving device 4, a component supply device 5, a conveying device 6, a support device 7 and a lighting device 8. Among them, the driving device 4, the component supply device 5, the conveying device 6, the support device 7 and the lighting device 8 are not necessary structures of the mounting system 10. That is, at least one of the driving device 4, the component supply device 5, the conveying device 6, the support device 7 and the lighting device 8 may not be included in the components of the mounting system 10. In addition, in Figure 1 In FIG. 1 , only the mounting head 1 and the driving device 4 are shown, and the other structures of the mounting system 10 are omitted as appropriate.

[0041] The mounting head 1 has at least one capture part 11. In the present embodiment, the mounting head 1 has one capture part 11. The mounting head 1 moves the capture part 11 while capturing the first object T1 (component 100) with the capture part 11 so as to bring it close to the second object T2 (substrate 200), and mounts the first object T1 on the mounting surface T21 of the second object T2. In other words, the mounting head 1 holds the capture part 11 so as to be movable between a first position close to the second object T2 and a second position farther from the second object T2 than the first position. That is, the mounting head 1 holds the capture part 11 so as to be movable toward the second object T2.

[0042] The imaging device 2 is fixed to the mounting head 1. In this embodiment, the mounting system 10 has one imaging device 2. The imaging device 2 has an imaging element 21 and an optical system 22. The imaging device 2 is, for example, a video camera that captures dynamic images. Figure 3 As shown in A of FIG. 1 , the imaging field of view R10 includes a specific region R1 including the specific object TA in the mounting surface T21 of the second object T2 (substrate 200 ).

[0043] The control device 3 controls each part of the installation system 10. The control device 3 uses a microcontroller having one or more processors and one or more memories as a main structure. That is, the functions of the control device 3 are realized by executing the program recorded in the memory of the microcontroller through the processor of the microcontroller. The program can be recorded in the memory in advance, or provided through an electrical communication line such as the Internet, or recorded in a non-temporary recording medium such as a memory card.

[0044] The control device 3 is electrically connected to, for example, the mounting head 1, the imaging device 2, the driving device 4, the component supply device 5, the conveying device 6, the supporting device 7, and the lighting device 8. The control device 3 outputs a control signal to the mounting head 1 and the driving device 4, and controls the mounting head 1 and the driving device 4 so that at least the first object T1 captured by the capturing unit 11 is mounted on the mounting surface T21 of the second object T2. In addition, the control device 3 outputs a control signal to the imaging device 2 and the lighting device 8, and controls the imaging device 2 and the lighting device 8, and obtains an image captured by the imaging device 2 from the imaging device 2.

[0045] The drive device 4 is a device that moves the mounting head 1. In the present embodiment, the drive device 4 moves the mounting head 1 in the XY plane. The "XY plane" mentioned here is a plane including the X-axis and the Y-axis, and is a plane orthogonal to the Z-axis. In other words, the drive device 4 moves the mounting head 1 in the X-axis direction and the Y-axis direction. In the present embodiment, since the camera device 2 is fixed to the mounting head 1, the drive device 4 also moves the camera device 2 and the mounting head 1 together. In other words, the drive device 4 moves the mounting head 1 and the camera device 2 in the XY plane.

[0046] Specifically, the driving device 4 is as follows Figure 1 As shown in the figure, there is an X-axis drive unit 41 and a Y-axis drive unit 42. The X-axis drive unit 41 moves the mounting head 1 linearly in the X-axis direction. The Y-axis drive unit 42 moves the mounting head 1 linearly in the Y-axis direction. The Y-axis drive unit 42 moves the mounting head 1 linearly in the Y-axis direction by moving the mounting head 1 along the Y-axis together with the X-axis drive unit 41. In this embodiment, as an example, the X-axis drive unit 41 and the Y-axis drive unit 42 each include a linear motor, and the mounting head 1 is moved by the driving force generated by the linear motor by receiving power supply.

[0047] The component supply device 5 supplies the component 100 as the first object T1 captured by the capture unit 11 of the mounting head 1. The component supply device 5 has, as an example, a tape feeder that supplies the component 100 stored in a carrier tape. Alternatively, the component supply device 5 may also have a tray on which a plurality of components 100 are placed. The mounting head 1 captures the first object T1 (component 100) from such a component supply device 5 with the capture unit 11.

[0048] The conveying device 6 is a device for conveying the substrate 200 as the second object T2. The conveying device 6 is implemented, for example, by a belt conveyor or the like. The conveying device 6 conveys the second object T2 (substrate 200) along, for example, the X-axis. The conveying device 6 conveys the second object T2 to at least the installation space below the mounting head 1, that is, opposite to the capture portion 11 in the Z-axis direction. Then, the conveying device 6 stops the second object T2 in the installation space until the installation of the first object T1 (component 100) to the second object T2 (substrate 200) by the mounting head 1 is completed.

[0049] The support device 7 supports the substrate 200 as the second object T2 transported to the mounting space by the transport device 6. That is, the second object T2 (substrate 200) transported to the mounting space by the transport device 6 is held in the mounting space by the support device 7. The support device 7 supports the second object T2 in the mounting space at least until the mounting of the first object T1 (component 100) to the second object T2 (substrate 200) by the mounting head 1 is completed.

[0050] The lighting device 8 illuminates the imaging field R10 of the imaging device 2. The lighting device 8 only needs to illuminate the imaging field R10 at least at the timing when the imaging device 2 performs imaging, for example, by emitting light in coordination with the imaging timing of the imaging device 2. In the present embodiment, since the image captured by the imaging device 2 is a full-color dynamic image, the lighting device 8 outputs light in a wavelength band of the visible light region such as white light. In the present embodiment, as an example, the lighting device 8 has a plurality of light sources such as LEDs (Light Emitting Diodes). The lighting device 8 illuminates the imaging field R10 of the imaging device 2 by causing these plurality of light sources to emit light. The lighting device 8 is implemented, for example, by an appropriate lighting method such as annular lighting or coaxial epi-illumination. The lighting device 8 is fixed to the mounting head 1 together with the imaging device 2, for example.

[0051] In addition to the above-mentioned configuration, the mounting system 10 includes, for example, a communication unit, etc. The communication unit is configured to communicate with the upper system directly or indirectly via a network or a repeater, etc. Thus, the mounting system 10 can exchange data with the upper system.

[0052] (2.3) Mounting head

[0053] Next, refer to Figure 1 to Figure 3 D is used to illustrate the more detailed structure of the mounting head 1.

[0054] In this embodiment, the mounting head 1 has, in addition to the capture portion 11, an actuator 12 for moving the capture portion 11 (see Figure 2 ); and a head body 13 that holds the capture portion 11 and the actuator 12. In the mounting system 10 according to the present embodiment, one capture portion 11 and one actuator 12 are each held in one head body 13. Thus, in the mounting head 1, one first object T1 (component 100) can be captured.

[0055] The capture unit 11 is, for example, a suction nozzle. The capture unit 11 is controlled by the control device 3 and can switch between a capture state of capturing (holding) the first object T1 and a release state of releasing (releasing) the first object T1. The capture unit 11 is not limited to a suction nozzle, and can be, for example, a structure that captures (holds) the first object T1 by clamping (pinching) it, like a robot.

[0056] The mounting head 1 is operated by receiving the supply of air pressure (vacuum) as a power to capture the first object T1 by the capture unit 11. That is, the mounting head 1 switches the capture state and the release state of the capture unit 11 by opening and closing the valve on the air pressure (vacuum) supply path connected to the capture unit 11.

[0057] The actuator 12 causes the capture portion 11 to move linearly in the Z-axis direction. Furthermore, the actuator 12 causes the capture portion 11 to rotate and move in a rotation direction (hereinafter referred to as "θ direction") centered on an axis along the Z-axis direction. In the present embodiment, as an example, regarding the movement of the capture portion 11 in the Z-axis direction, the actuator 12 is driven by a driving force generated by a linear motor. Regarding the movement of the capture portion 11 in the θ direction, the actuator 12 is driven by a driving force generated by a rotary motor. On the other hand, as described above, the mounting head 1 moves linearly in the X-axis direction and the Y-axis direction through the drive device 4. As a result, the capture portion 11 contained in the mounting head 1 can move in the X-axis direction, the Y-axis direction, the Z-axis direction and the θ direction through the drive device 4 and the actuator 12.

[0058] The head body 13 is made of metal, for example, and is formed into a rectangular parallelepiped. The capture part 11 and the actuator 12 are assembled to the head body 13, so that the head body 13 holds the capture part 11 and the actuator 12. In the present embodiment, the capture part 11 is indirectly held by the head body 13 via the actuator 12 in a state where it can move in the Z-axis direction and the θ direction. The head body 13 is moved in the XY plane by the drive device 4, so that the mounting head 1 moves in the XY plane.

[0059] According to the above-mentioned structure, the mounting head 1 can move the capturing part 11 in a state where the first object T1 (component 100) is captured by the capturing part 11 so as to approach the second object T2 (substrate 200), and mount the first object T1 on the mounting surface T21 of the second object T2. That is, the mounting head 1 moves the capturing part 11 at least between a first position close to the second object T2 and a second position farther from the second object T2 than the first position. In short, the mounting head 1 mounts the first object T1 on the mounting surface T21 of the second object T2 by moving the capturing part 11 in a state where the first object T1 is captured from the second position to the first position.

[0060] In this embodiment, Figure 3 The position of the capture portion 11 shown in C is the first position, Figure 3 The position of the capture part 11 shown in A is the second position. In other words, the first position is the lower dead point of the capture part 11, and the second position is the upper dead point of the capture part 11. The so-called "lower dead point" mentioned in the present disclosure does not refer to the lower limit position in the movable range of the capture part 11, but refers to the lower limit position of the capture part 11 when the first object T1 is mounted on the mounting surface T21 of the second object T2.

[0061] (2.4) Camera device

[0062] Next, refer to Figure 2-3D is used to illustrate the more detailed structure of the camera device 2.

[0063] In this embodiment, the camera device 2 is as follows: Figure 2 As shown, the imaging element 21 and the optical system 22 are provided. The optical system 22 forms an image of an imaging field R10 including a specific region R1 on the imaging element 21.

[0064] The imaging element 21 is, for example, an image sensor such as a CCD (Charge Coupled Devices) or a CMOS (Complementary Metal-Oxide Semiconductor) and converts an image formed on a light receiving surface into an electrical signal and outputs the signal.

[0065] The optical system 22 includes one or more lenses and a reflector. In the present embodiment, as an example, the optical system 22 is implemented by a combination of a plurality of lenses (lens group). Figure 3 The light from the imaging field R10 as shown in A is imaged on the light receiving surface of the imaging element 21. In this embodiment, the optical system 22 of the imaging device 2 is a telecentric optical system. That is, in the entire optical system, the main light is parallel to the optical axis (imaging optical axis Ax1). In addition, the optical system 22 is not limited to the above-mentioned structure.

[0066] The camera device 2 is as follows Figure 3 As shown in A, the imaging field of view R10 includes a specific area R1 that is opposite to the capture unit 11 in the direction perpendicular to the mounting surface T21 (Z-axis direction) among the mounting surface T21 of the second object T2 (substrate 200). In other words, when the capture unit 11 is located on the mounting surface T21 of the second object T2, the imaging device 2 includes, in the imaging field of view R10, an area directly below the capture unit 11 in the mounting surface T21 as the specific area R1. In other words, when the capture unit 11 is located on the mounting surface T21 of the second object T2, the specific area R1 is an area that includes the specific object TA located directly below the capture unit 11. For this reason, in the imaging device 2, it is possible to capture an image of the area directly below the capture unit 11.

[0067] Specifically, the imaging device 2 is fixed to the mounting head 1 by being held on the head body 13 of the mounting head 1. Although the imaging device 2 is not shown in the figure, it is held on the head body 13 by being fixed to the side surface of the head body 13. Since the capture part 11 is arranged on the lower surface of the head body 13, the imaging device 2 is arranged on the side of the capture part 11 in a plan view.

[0068] Here, the camera device 2 is as follows Figure 3As shown in A of FIG. 1 , the imaging device 2 has an imaging optical axis Ax1 that is inclined relative to the perpendicular line of the mounting surface T21 of the second object T2. That is, the imaging device 2 is fixed to the mounting head 1 in such a posture that the imaging optical axis Ax1 is inclined relative to the perpendicular line of the mounting surface T21. In other words, the imaging optical axis Ax1 of the imaging device 2 is inclined relative to the Z axis. In this way, the imaging device 2 is arranged on the side of the capture unit 11, and the imaging optical axis Ax1 is inclined relative to the Z axis, so that the specific area R1 directly below the capture unit 11 can be photographed.

[0069] (2.5) Control device

[0070] Next, refer to Figure 2-3 D is used to illustrate the more detailed structure of the control device 3.

[0071] As described above, the control device 3 controls the mounting head 1 by outputting a control signal to the mounting head 1. Specifically, the control device 3 controls the mounting head 1 to move the capture unit 11 straightly forward in the Z-axis direction until the capture unit 11 located at the second position reaches the first position. In other words, the control device 3 moves the capture unit 11 until the state of the specific object TA included in the imaging field R10 of the imaging device 2 reaches a given state. In addition, after the control device 3 controls the mounting head 1 to move the capture unit 11 to the first position, the capture unit 11 is released from the capture of the first object T1, or the capture unit 11 is used to capture the first object T1. In other words, after the control device 3 moves the capture unit 11 until the state of the specific object TA included in the imaging field R10 of the imaging device 2 reaches a given state, the capture unit 11 is released from the capture of the first object T1, or the capture unit 11 is used to capture the first object T1. In the present embodiment, a mounting process of mounting the first object T1 captured by the capturing unit 11 on the mounting surface T21 of the second object T2 is exemplified, and the control device 3 controls the mounting head 1 to release the capturing of the first object T1 by the capturing unit 11 .

[0072] In addition, in the present embodiment, the control device 3 determines whether the first object T1 is mounted (equipped) on the second object T2 based on the change in the shape of the specific object TA. Here, in the present embodiment, the specific object TA is a contact member 9 that makes the first object T1 and the second object T2 contact. In other words, the specific region R1 contains a contact member 9 that is in contact with both the first object T1 and the second object T2. Furthermore, in the present embodiment, the contact member 9 is a joining member 91 that joins the first object T1 and the second object T2, such as solder. The control device 3 determines whether the first object T1 is mounted (equipped) on the second object T2 based on the change in the shape of the contact member 9 as the specific object TA when viewed from above. In other words, the control device 3 controls the movement of the capture portion 11 toward the second object T2 side based on the change in the shape of the contact member 9. Specifically, if the length dimension L1 of the specific object TA in the X-axis direction changes, for example, from L11 (reference Figure 3 B) changes to L12 (reference Figure 3 C), the control device 3 determines that the first object T1 is mounted (equipped) on the second object T2. Here, in this embodiment, the length dimension L1 of the specific object TA in the X-axis direction is as follows: Figure 3 B and Figure 3 As shown in C, it is the length from the end surface of the first object T1 in the X-axis direction to the end portion of the specific object TA on the opposite side to the end surface.

[0073] In the present embodiment, the "information related to the specific object TA" is the change in the length dimension L1 of the specific object TA in the X-axis direction. In addition, in the present embodiment, "the state of the specific object TA reaches a given state" means that the change in the length dimension L1 of the specific object TA reaches (L12-L11).

[0074] In the mounting system 10 according to the present embodiment, the control device 3 can detect a short circuit (bridge) of a plurality of (two in the example shown) joining members 91 that join the first object T1 and the second object T2, based on the length dimension L1 of the specific object TA in the X-axis direction. For example, if the length dimension L1 of each joining member 91 in the X-axis direction becomes longer than L12, the control device 3 determines that the plurality of joining members 91 are short-circuited.

[0075] (3) Installation method

[0076] Next, refer to Figure 3 A~ Figure 3 D and Figure 4 The installation method involved in this embodiment is described.

[0077] The mounting method involved in the present embodiment is a mounting method used in a mounting system 10 having a mounting head 1 and a camera device 2. The mounting head 1 has a capturing unit 11 that captures a first object T1. The mounting head 1 holds the capturing unit 11 so that it can move toward a second object T2. The camera device 2 is provided in the mounting head 1. The camera device 2 includes a specific area R1 containing a specific object TA in a camera field of view R10. The above-mentioned mounting method has a step of moving the capturing unit 11 by the control device 3. The control device 3 moves the capturing unit 11 based on information related to the specific object TA contained in the output of the camera device 2, so that the capturing unit 11 moves toward the second object T2.

[0078] That is, the mounting method involved in the present embodiment is a method of moving the capture unit 11 using the mounting system 10 involved in the present embodiment. In this mounting method, the capture unit 11 is moved toward the second object T2 based on the information related to the specific object TA contained in the output of the imaging device 2. Therefore, for example, even if the substrate 200 as the second object T2 is warped in the Z-axis direction, the first object T1 can be reliably mounted (equipped) to the second object T2 based on the state of the specific object TA.

[0079] Figure 3 A~ Figure 3 D is a schematic diagram representing the overall operation of the installation system 10 including the installation method involved in this embodiment. Figure 4 This is a flowchart representing the overall operation of the mounting system 10 including the mounting method according to the present embodiment.

[0080] The control device 3 moves the mounting head 1 in the X-axis direction and the Y-axis direction by controlling the driving device 4 (step S11). Specifically, the control device 3 moves the mounting head 1 in a straight line in the X-axis direction through the X-axis driving unit 41, and moves the mounting head 1 in a straight line in the Y-axis direction through the Y-axis driving unit 42. At this time, the control device 3 moves the mounting head 1 in the X-axis direction and the Y-axis direction so that the XY coordinates of the capturing unit 11 that captures the first object T1 and the XY coordinates of the mounting position (equipment position) of the first object T1 in the mounting surface T21 of the second object T2 are consistent. Figure 3 As shown in A of FIG. 1 , when the mounting head 1 reaches a position where the XY coordinates of the capture unit 11 coincide with the XY coordinates of the mounting position of the first object T1, the control device 3 activates the imaging device 2 to start imaging of the specific area R1. Figure 3 As shown in A of FIG. 1 , the specific region R1 includes a joining member 91 as a specific object TA for joining the first object T1 and the second object T2.

[0081] Control device 3 as Figure 3 As shown in A, from the state where the XY coordinates of the capture unit 11 and the XY coordinates of the mounting position of the first object T1 are consistent, the capture unit 11 is moved straight forward (descended) in the Z-axis direction by controlling the actuator 12 (step S12). As a result, the first object T1 captured by the capture unit 11 moves closer to the second object T2 and contacts the specific object TA arranged on the mounting surface T21 of the second object T2.

[0082] Here, the control device 3 adjusts the movement amount of the capture unit 11 based on the change in the shape of the specific object TA caused by the contact between the first object T1 and the specific object TA. In other words, the control device 3 adjusts the movement amount of the capture unit 11 so that the amount of pressure after the first object T1 contacts the specific object TA becomes a predetermined amount (step S13). Specifically, the control device 3 moves the capture unit 11 forward in a straight line in the Z-axis direction until the change in the length dimension L1 of the specific object TA in the X-axis direction becomes (L12-L11).

[0083] That is, if the amount of change in the length dimension L1 of the specific object TA in the X-axis direction is smaller than (L12-L11) (step S13 "No"), the control device 3 causes the capture unit 11 to continue to move straight forward in the Z-axis direction. Then, if the amount of change in the length dimension L1 of the specific object TA in the X-axis direction reaches (L12-L11) (step S13 "Yes"), the control device 3 stops the movement of the capture unit 11 and releases the capture of the first object T1 by the capture unit 11 (step S14).

[0084] Then, the control device 3 is as follows Figure 3 As shown in D of FIG. 1 , the capture unit 11 is moved forward in a straight line in the Z-axis direction (raised) by controlling the actuator 12 (step S15). When the capture unit 11 reaches the second position, the control device 3 stops the imaging device 2 to end the imaging of the specific area R1. In addition, the control device 3 may stop the imaging device 2 at the timing when the capture unit 11 releases the capture of the first object T1.

[0085] The first object T1 can be reliably mounted (installed) on the second object T2 by executing the above-mentioned mounting method by the control device 3 of the mounting system 10. That is, according to the mounting method according to the present embodiment, the mounting quality of the first object T1 can be improved.

[0086] In the above-mentioned installation method, after the installation head 1 is moved in the X-axis direction and the Y-axis direction, the actuator 12 is moved in the Z-axis direction, but the installation head 1 can also be moved in the X-axis direction and the Y-axis direction (step S11) and the actuator 12 can be moved in the Z-axis direction (step S12) at the same time.

[0087] (4) Modification

[0088] Implementation 1 is only one of various implementations of the present disclosure. Implementation 1 can be modified in various ways corresponding to the design, etc. as long as the purpose of the present disclosure can be achieved. In addition, the drawings referenced in the present disclosure are all schematic drawings, and the size of each component and the ratio of the thickness thereof do not necessarily reflect the actual size ratio. In addition, the same function as the installation method involved in Implementation 1 can be concretized by the installation system 10, a (computer) program, or a non-temporary recording medium recording the program, etc. The program involved in one embodiment is a program for causing one or more processors to execute the installation method involved in Implementation 1.

[0089] The following lists modifications of Embodiment 1. The modifications described below can be used in combination as appropriate.

[0090] The installation system 10 in the present disclosure includes a computer system, for example, in the control device 3, etc. The computer system is mainly composed of a processor and a memory as hardware. The function of the installation system 10 in the present disclosure is realized by executing the program recorded in the memory of the computer system by the processor. The program can be pre-recorded in the memory of the computer system, or provided through an electrical communication line, or recorded in a non-temporary recording medium such as a memory card, an optical disk, a hard disk drive, etc. that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits such as IC or LSI mentioned here are called differently according to the degree of integration, including integrated circuits called system LSI, VLSI (Very Large Scale Integration) or ULSI (Ultra Large Scale Integration). Furthermore, FPGA (Field-Programmable Gate Array) programmed after the manufacture of LSI, or a logic device that can reconstruct the bonding relationship inside LSI or the circuit division inside LSI can also be used as a processor. Multiple electronic circuits can be integrated into one chip or dispersed into multiple chips. Multiple chips can be integrated into one device or dispersed into multiple devices. The computer system mentioned here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is composed of one or more electronic circuits including semiconductor integrated circuits or large-scale integrated circuits.

[0091] In addition, the fact that multiple functions in the installation system 10 are integrated into one housing is not necessarily a structure of the installation system 10. The components of the installation system 10 may also be dispersed in multiple housings. Furthermore, at least a part of the functions of the installation system 10, such as the functions of the control device 3, may also be implemented through the cloud (cloud computing) or the like.

[0092] On the contrary, in Embodiment 1, at least a part of the functions of the mounting system 10 distributed in a plurality of devices may be integrated in one housing. For example, a part of the functions distributed in the mounting head 1 and the control device 3 may be integrated in the mounting head 1.

[0093] Furthermore, the use of the mounting system 10 is not limited to the manufacture of electronic equipment in a factory. For example, when the mounting system 10 is used to mount a mechanical component on a glass plate, the mounting system 10 mounts the mechanical component as the first object T1 on the glass plate as the second object T2.

[0094] In addition, the number of capturing parts 11 and the number of imaging devices 2 provided in the mounting head 1 are not limited to the numbers described in Embodiment 1. For example, the number of capturing parts 11 and the number of imaging devices 2 may be more than two. In addition, the number of capturing parts 11 and the number of imaging devices 2 may be the same or different. As an example, when the number of imaging devices 2 is less than the number of capturing parts 11, it is sufficient to configure such that one imaging device 2 can capture images of a plurality of capturing parts 11.

[0095] Furthermore, the imaging device 2 is not limited to a video camera capable of capturing full-color dynamic images, and may be, for example, a camera capable of capturing monochrome images, a static camera capable of capturing still images, or a linear sensor.

[0096] In addition, the control device 3 can determine whether the first object T1 is mounted (equipped) on the second object T2 based on the shape of the specific object TA. In other words, the control device 3 can control the movement of the capture portion 11 toward the second object T2 based on the shape of the specific object TA (contact member 9). Figure 3 As shown in C, when the length L1 of the specific object TA in the X-axis direction reaches L12, the control device 3 determines that the first object T1 is mounted (equipped) on the second object T2. Figure 3The position shown in C of becomes the first position. On the other hand, if the length dimension L1 of the specific object TA in the X-axis direction does not reach L12, the control device 3 moves the capture unit 11 to the first position (second object T2) until the length dimension L1 of the specific object TA in the X-axis direction reaches L12. Furthermore, the control device 3 can also combine the change in the shape of the specific object TA and the shape of the specific object TA to determine whether the first object T1 is installed (equipped) to the second object T2. For example, in Figure 3 A~ Figure 3 In the example shown in D, if the change in the length dimension L1 of the specific object TA in the X-axis direction is (L12-L11) and the length dimension L1 of the specific object TA in the X-axis direction reaches L12, the control device 3 determines that the first object T1 is installed (equipped) to the second object T2.

[0097] In addition, the change in the shape of the specific object TA is not limited to the length dimension L1 in the X-axis direction, and may be, for example, the height dimension of the specific object TA in the Z-axis direction. In other words, the change in the shape of the specific object TA may be a change in the amount of the specific object TA that rises along the side surface of the first object T1. For example, Figure 3 As shown in B of FIG. 1 , when the first object T1 is not in contact with the specific object TA, the climbing amount of the specific object TA is zero. Figure 3 As shown in C, when the capture unit 11 reaches the first position, the climbing amount of the specific object TA reaches a given value. Therefore, since the change in the climbing amount of the specific object TA reaches a given value, the control device 3 determines that the first object T1 is installed (equipped) on the second object T2. In this case, by pressing the capture unit 11 until the change in the climbing amount of the specific object TA reaches a given value, the first object T1 can be reliably installed (equipped) on the second object T2, and the installation quality of the first object T1 can be improved. In addition, in this case, the control device 3 may determine whether the first object T1 is installed on the second object T2 based on the climbing amount (shape) of the specific object TA rather than the change in the climbing amount (shape) of the specific object TA.

[0098] The bonding member 91 is not limited to solder, and may be, for example, a conductive paste or an adhesive. In addition, the contact member 9 is not limited to the bonding member 91 such as solder, and may be, for example, a heat dissipation grease such as silicone grease.

[0099] In the above-mentioned embodiment, the control device 3 determines whether the first object T1 is mounted (equipped) on the second object T2 based on the change amount of the length dimension L1 of the specific object TA. In contrast, the control device 3 may determine whether the first object T1 is mounted (equipped) on the second object T2 based on the change amount of the end of the specific object TA, for example.

[0100] (Implementation Method 2)

[0101] In the installation system 10A according to the present embodiment, Figure 5 As shown, the control device 3A is different from the mounting system 10 according to the first embodiment in that it includes a detection unit 31 and a determination unit 32. Hereinafter, the same components as those of the first embodiment are denoted by the same reference numerals and the description thereof is appropriately omitted.

[0102] (1) Overall structure

[0103] The mounting system 10A involved in this embodiment includes a mounting head 1, a camera device 2, and a control device 3A. The mounting head 1 has a capture unit 11 that captures a first object T1. The mounting head 1 holds the capture unit 11 so that it can move toward a second object T2. The camera device 2 includes a specific area R1 containing a specific object TA in a camera field of view R10. The control device 3A controls the movement of the capture unit 11 based on information related to the specific object TA contained in the output of the camera device 2, so that the capture unit 11 moves toward the second object T2.

[0104] The mounting system 10A according to this embodiment is as follows: Figure 5 As shown, in addition to the mounting head 1, the imaging device 2, and the control device 3A, a driving device 4, a component supply device 5, a conveying device 6, a supporting device 7, and a lighting device 8 are provided.

[0105] The camera device 2 is as follows Figure 6 A~ Figure 6 As shown in D, the imaging field of view R10 includes a specific area R1 including the contact member 9. Figure 6 A~ Figure 6 As shown in D of FIG. 1 , the capturing unit 11 and the first object T1 captured by the capturing unit 11 are included in the imaging field of view R10. In the present embodiment, the capturing unit 11 and the first object T1 (substrate 200) are the specific object TA. In addition, in the present embodiment, the first object T1 is the component 100, and the second object T2 is the substrate 200 on which the component 100 is mounted.

[0106] Control device 3A Figure 5 As shown, a detection unit 31 and a determination unit 32 are provided.

[0107] The detection unit 31 detects that the third object T3 and the fourth object T4 are grounded based on the output of the camera device 2. The "grounding" mentioned in the present disclosure means that the third object T3 and the fourth object T4 are in contact. In addition, the "contact" mentioned in the present disclosure can be point contact, line contact, or surface contact. In the present embodiment, the contact between the third object T3 and the fourth object T4 is surface contact.

[0108] In the present embodiment, the third object T3 is the first object T1 (component 100) mounted (equipped) on the mounting surface T21 of the second object T2 (substrate 200). The fourth object T4 is a contact member 9 that is arranged on the mounting surface T21 of the second object T2 and brings the first object T1 and the second object T2 into contact. In addition, in the present embodiment, the contact member 9 is a joining member 91 that joins the first object T1 and the second object T2. The joining member 91 is, for example, solder.

[0109] As an example, the detection unit 31 detects that the third object T3 and the fourth object T4 are grounded based on the change in the amount of movement of the capture unit 11. In other words, the detection unit 31 detects that the third object T3 and the fourth object T4 are grounded by the state of the specific object TA (capture unit 11) reaching a given state. If the third object T3 and the fourth object T4 come into contact, the amount of movement of the capture unit 11 decreases due to the reaction force from the fourth object T4. Therefore, the detection unit 31 detects that the third object T3 and the fourth object T4 are grounded based on the change (decrease) in the amount of movement of the capture unit 11. In the present embodiment, the so-called "the state of the specific object TA reaches a given state" refers to the change (decrease) in the amount of movement of the capture unit 11.

[0110] The determination unit 32 determines whether to execute the second process after executing the first process. In other words, the determination unit 32 determines whether to further move the capture unit 11 to the second object T2 side after the third object T3 and the fourth object T4 are grounded. The first process is a process of moving the capture unit 11 to the first position (second object T2) side until the third object T3 and the fourth object T4 are grounded. In the present embodiment, the control device 3A moves the capture unit 11 to the second object T2 side based on the movement amount of the capture unit 11 in the first process. The second process is a process of further moving the capture unit 11 to the second object T2 side after the third object T3 and the fourth object T4 are grounded (hereinafter referred to as "pressing process"). In the present embodiment, the control device 3A moves the capture unit 11 to the second object T2 side after the third object T3 and the fourth object T4 are grounded in the second process. As an example, the determination unit 32 determines whether to perform the second process based on the length dimension of the contact member 9 in the X-axis direction contained in the image captured by the camera 2. Specifically, if the length dimension of the contact member 9 in the X-axis direction reaches a given length when the detection unit 31 detects the grounding of the third object T3, the determination unit 32 determines that the second process is not required. On the other hand, if the length dimension of the contact member 9 in the X-axis direction does not reach a given length when the detection unit 31 detects the grounding of the third object T3, the determination unit 32 determines that the second process is required. That is, the control device 3A is configured to determine whether to move the capture unit 11 toward the second object T2 side when the third object T3 is grounded.

[0111] In short, the control device 3A determines whether the press-in process is required at the timing when the third object T3 and the fourth object T4 are grounded. In other words, the control device 3A determines whether the mounting head 1 performs the second process at the timing when the third object T3 and the fourth object T4 are grounded by causing the mounting head 1 to perform the first process.

[0112] When the determination unit 32 determines that the second process is to be executed, the control device 3A executes the second process after executing the first process. When the determination unit 32 determines that the second process is not to be executed, the control device 3A executes only the first process.

[0113] As described above, the control device 3A is configured to control the movement of the capture unit 11 based on the output of the camera device 2. Specifically, in the first process, the control device 3A controls the movement of the capture unit 11 based on the image captured by the camera device 2 so that the capture unit 11 moves toward the second object T2 until the third object T3 and the fourth object T4 are grounded. On the other hand, in the second process, the control device 3A controls the movement of the capture unit 11 so that the capture unit 11 moves by a predetermined amount toward the second object T2. In other words, the control device 3 moves the capture unit 11 further by a predetermined amount toward the second object T2 after the third object T3 and the fourth object T4 are grounded. That is, in the mounting system 10A involved in the present embodiment, at the timing of the grounding of the third object T3, the feedback control of moving the capture unit 11 based on the image captured by the camera device 2 is switched to the timing control of moving the capture unit 11 by a predetermined amount.

[0114] (2) Installation method

[0115] Next, refer to Figure 6 A~ Figure 6 D and Figure 7 The installation method involved in this embodiment is described.

[0116] The mounting method involved in the present embodiment is a mounting method used in a mounting system 10A having a mounting head 1 and a camera device 2. The mounting head 1 has a capturing unit 11 that captures a first object T1. The mounting head 1 holds the capturing unit 11 so that it can move toward a second object T2. The camera device 2 is provided at the mounting head 1. The camera device 2 includes a specific area R1 containing a specific object TA in a camera field of view R10. The above-mentioned mounting method has a step of moving the capturing unit 11 by the control device 3A. The control device 3A moves the capturing unit 11 toward the second object T2 based on information related to the specific object TA contained in the output of the camera device 2.

[0117] That is, the installation method involved in the present embodiment is a method of moving the capture unit 11 using the installation system 10A involved in the present embodiment. In this installation method, the capture unit 11 is moved toward the second object T2 based on the information related to the specific object TA contained in the output of the camera device 2. Therefore, for example, even if the substrate 200 as the second object T2 is warped in the Z-axis direction, the first object T1 can be reliably mounted (equipped) to the second object T2 based on the state of the specific object TA. In the present embodiment, the so-called "information related to the specific object TA" is the movement amount of the capture unit 11 as the specific object TA.

[0118] Figure 6 A~ Figure 6D is a schematic diagram representing the overall operation of the installation system 10A including the installation method involved in this embodiment. Figure 7 This is a flowchart representing the overall operation of the mounting system 10A including the mounting method according to the present embodiment.

[0119] The control device 3A controls the driving device 4 to move the mounting head 1 in the X-axis direction and the Y-axis direction (step S21). Specifically, the control device 3A moves the mounting head 1 in a straight line in the X-axis direction through the X-axis driving unit 41, and moves the mounting head 1 in a straight line in the Y-axis direction through the Y-axis driving unit 42. At this time, the control device 3A moves the mounting head 1 in the X-axis direction and the Y-axis direction so that the XY coordinates of the capturing unit 11 that captures the first object T1 and the XY coordinates of the mounting position (equipment position) of the first object T1 in the mounting surface T21 of the second object T2 are consistent. Figure 6 As shown in A of FIG. 1 , when the mounting head 1 reaches a position where the XY coordinates of the capture unit 11 coincide with the XY coordinates of the mounting position of the first object T1, the control device 3A activates the imaging device 2 to start imaging of the specific area R1. Figure 6 As shown in A, the specific region R1 includes the contact member 9 disposed on the mounting surface T21 of the second object T2. In addition, in the present embodiment, the capturing section 11 and the first object T1 captured by the capturing section 11 are included in the imaging field R10 of the imaging device 2.

[0120] The control device 3A uses Figure 6 As shown in A of FIG. 1 , the actuator 12 is controlled to make the capture part 11 move straight forward (descend) in the Z-axis direction when the XY coordinates of the capture part 11 and the XY coordinates of the mounting position of the first object T1 are consistent (step S22). As a result, the first object T1 captured by the capture part 11 moves close to the second object T2 and contacts the contact member 9 arranged on the mounting surface T21 of the second object T2. The detection unit 31 of the control device 3A detects that the first object T1 as the third object T3 and the contact member 9 as the fourth object T4 are grounded according to the change (decrease) in the movement amount of the capture part 11 (step S23).

[0121] If the detection unit 31 detects the grounding of the third object T3, the determination unit 32 of the control device 3A determines whether the second process as the press-in process is required (step S24). When the determination unit 32 determines that the second process is to be performed (step S24 "Yes"), the control device 3A controls the actuator 12 to move (lower) the capture unit 11 in the Z-axis direction by a predetermined amount of movement (step S25). Then, after stopping the movement of the capture unit 11 in the Z-axis direction, the control device 3A releases the capture of the first object T1 by the capture unit 11 (step S26). On the other hand, when the determination unit 32 determines that the second process is not to be performed (step S24 "No"), the control device 3A releases the capture of the first object T1 by the capture unit 11 after stopping the movement of the capture unit 11 in the Z-axis direction (step S26).

[0122] Then, the control device 3A Figure 6 As shown in D of FIG. 1 , the capture unit 11 is moved forward in a straight line in the Z-axis direction (raised) by controlling the actuator 12 (step S27). When the capture unit 11 reaches the second position, the control device 3A stops the imaging device 2, and the imaging of the specific area R1 ends. In addition, the control device 3A may stop the imaging device 2 at the timing when the capture unit 11 releases the capture of the first object T1.

[0123] By executing the above-described mounting method by the control device 3A of the mounting system 10A, the first object T1 can be reliably mounted (installed) on the second object T2. That is, according to the mounting method according to the present embodiment, the mounting quality of the first object T1 can be improved.

[0124] In the above-mentioned installation method, after the installation head 1 is moved in the X-axis direction and the Y-axis direction, the actuator 12 is moved in the Z-axis direction, but the installation head 1 can also be moved in the X-axis direction and the Y-axis direction (step S21) and the actuator 12 can be moved in the Z-axis direction (step S22) at the same time.

[0125] (3) Modification

[0126] The following lists modifications of Embodiment 2. The modifications described below can be used in combination as appropriate.

[0127] (3.1) Modification 1

[0128] like Figure 8 A~ Figure 8As shown in C, the second object T2 may be a container 300 that accommodates the component 100 that is the first object T1. That is, the mounting system 10A involved in Modification Example 1 can also be used in an adsorption process for adsorbing the component 100 that is the first object T1 accommodated in the container 300 that is the second object T2. The container 300 that is the second object T2 is a carrier tape or a tray, etc. In the present embodiment, the container 300 is a carrier tape. In short, the first object T1 is the component 100, and the second object T2 is the container 300 that accommodates the component 100. In addition, in Modification Example 1, the specific object TA is the capture portion 11. The second object T2 that is the container 300 is as shown in Figure 8 A~ Figure 8 As shown in C, the housing portion T22 for housing the component 100 as the first object T1 is provided.

[0129] Next, refer to Figure 8 A~ Figure 8 C and Fig. 9 The mounting method according to Modification 1 will be described.

[0130] The control device 3A controls the driving device 4 to move the mounting head 1 in the X-axis direction and the Y-axis direction (step S31). Specifically, the control device 3A moves the mounting head 1 in a straight line in the X-axis direction through the X-axis driving unit 41, and moves the mounting head 1 in a straight line in the Y-axis direction through the Y-axis driving unit 42. At this time, the control device 3A moves the mounting head 1 in the X-axis direction and the Y-axis direction so that the XY coordinates of the capture unit 11 are consistent with the XY coordinates of the first object T1 in the storage unit T22 of the second object T2. If Figure 8 As shown in A of FIG. 1 , when the mounting head 1 reaches a position where the XY coordinates of the capture portion 11 coincide with the XY coordinates of the first object T1, the control device 3A activates the imaging device 2 to start imaging of the specific area R1. Figure 8 As shown in A of FIG. 1 , the first object T1 captured by the capturing unit 11 is included in the specific region R1 .

[0131] The control device 3A performs the following operations: Figure 8As shown in A of FIG. 1 , the actuator 12 is controlled to make the capture unit 11 move straight forward (descend) in the Z-axis direction so that the capture unit 11 is in a state where the XY coordinates of the capture unit 11 and the XY coordinates of the first object T1 are consistent (step S32). As a result, the capture unit 11 moves close to the first object T1 accommodated in the accommodation unit T22 of the second object T2, and contacts the surface (upper surface) of the first object T1. The detection unit 31 of the control device 3A detects that the capture unit 11 as the third object T3 and the first object T1 (component 100) as the fourth object T4 are grounded based on the change (decrease) in the movement amount of the capture unit 11 due to the contact between the capture unit 11 and the first object T1 (step S33). In addition, when the size of the component 100 is smaller than the size of the capturing portion 11 in the X-axis direction, the detecting portion 31 detects the grounding of the capturing portion 11 as the third object T3 and the second object T2 (storage container 300) as the fourth object T4 based on the change (decrease) in the movement amount of the capturing portion 11 due to the contact between the capturing portion 11 and the second object T2.

[0132] If the detection unit 31 detects the grounding of the third object T3 (capturing unit 11), the determination unit 32 of the control device 3A determines whether the second process as the pressing process is necessary (step S34). As an example, if the deflection amount in the Z-axis direction of the second object T2 accommodating the first object T1 as the fourth object T4 does not reach a given value, the determination unit 32 of the control device 3A determines to execute the second process.

[0133] When the determination unit 32 determines that the second process is to be executed (step S34 "Yes"), the control device 3A controls the actuator 12 to move (lower) the capture unit 11 in the Z-axis direction by a preset movement amount (step S35). Then, after the control device 3A stops the movement of the capture unit 11 in the Z-axis direction, the capture unit 11 captures the first object T1 (step S36). On the other hand, when the determination unit 32 determines that the second process is not to be executed (step S34 "No"), the control device 3A stops the movement of the capture unit 11 in the Z-axis direction and captures the first object T1 (step S36).

[0134] Then, the control device 3A Figure 8 As shown in FIG. 3C , the capture unit 11 that captures the first object T1 moves forward in a straight line in the Z-axis direction (rises) by controlling the actuator 12 (step S37). When the capture unit 11 reaches the second position, the control device 3A stops the imaging device 2 to end the imaging of the specific area R1. In addition, the control device 3A may stop the imaging device 2 at the timing when the capture unit 11 releases the capture of the first object T1.

[0135] By executing the above-described mounting method (adsorption method) by the control device 3A of the mounting system 10A, the first object T1 can be reliably adsorbed by the capture unit 11. That is, the mounting method according to the first modification includes not only the mounting process of mounting the first object T1 (component 100) captured by the capture unit 11 on the mounting surface T21 of the second object T2 (substrate 200), but also the adsorption process of adsorbing the first object T1 (component 100) by the capture unit 11.

[0136] In the above-mentioned installation method, after the installation head 1 is moved in the X-axis direction and the Y-axis direction, the actuator 12 is moved in the Z-axis direction, but the installation head 1 can also be moved in the X-axis direction and the Y-axis direction (step S31) and the actuator 12 can be moved in the Z-axis direction (step S32) at the same time.

[0137] (3.2) Modification 2

[0138] The specific object TA can be Fig.10 As shown, the actuator 12 is included. The actuator 12 includes a nozzle holder 121 for holding a suction nozzle as the capture unit 11 and a shaft 122 connected to the upper end of the nozzle holder 121.

[0139] The nozzle holder 121 includes a spring body 14. The spring body 14 is configured so that its expansion and contraction direction becomes the Z-axis direction, and a downward spring force acts on the capture portion 11. The capture portion 11 resists the spring force from the spring body 14 and is held on the nozzle holder 121 in a state where it can move relative to the nozzle holder 121 in the Z-axis direction.

[0140] The shaft 122 is configured to be movable in the Z-axis direction by a driving force generated by a linear motor. Therefore, by moving the shaft 122 in the Z-axis direction, the capture portion 11 can be moved between the first position and the second position. That is, the actuator 12 composed of the nozzle holder 121 and the shaft 122 functions as a holding member that can hold the capture portion 11 movably between the first position and the second position. In variant example 2, the specific object TA includes a holding member (actuator 12) that can hold the capture portion 11 movably between the first position and the second position. In addition, a measuring point (specific point) P1 is provided on the outer peripheral surface of the shaft 122.

[0141] like Fig.10 As shown in FIG. 1 , the imaging device 2 includes a specific area R1 including the actuator 12 as the specific object TA in the imaging field of view R10. The imaging device 2 is aligned with the actuator 12 as the specific object TA in the X-axis direction. That is, the imaging device 2 is arranged on the side of the specific object TA. Thus, the imaging device 2 can capture the measurement point P1 of the shaft 122 provided in the actuator 12 as the specific object TA when the capture unit 11 moves from the second position to the first position.

[0142] In the mounting system 10A according to the second modification, the control device 3A controls the movement of the capture unit 11 toward the second object T2 based on the movement amount of the measurement point P1 included in the imaging field R10 of the imaging device 2 in the first process until the third object T3 and the fourth object T4 are grounded. In addition, in the mounting system 10A, the control device 3A also controls the movement of the capture unit 11 toward the second object T2 based on the movement amount of the measurement point P1 included in the imaging field R10 of the imaging device 2 in the second process. Here, in the second process, since the capture unit 11 is in contact with the first object T1, the movement of the capture unit 11 toward the second object T2 is constrained, and the spring body 14 provided in the nozzle holder 121 is compressed, so that the shaft 122 can move toward the second object T2. Therefore, in the second process, the control device 3A can control the movement of the capture unit 11 to the second object T2 side based on the movement amount of the measurement point P1 provided on the shaft 122 .

[0143] (3.3) Other variations

[0144] The detection unit 31 can also detect that the third object T3 and the fourth object T4 are grounded based on the shape of the contact member 9. The contact member 9 as the fourth object T4 is deformed at least in the X-axis direction due to the contact with the first object T1 as the third object T3. Therefore, the detection unit 31 detects that the third object T3 and the fourth object T4 are grounded based on the change in the length dimension of the contact member 9 in the X-axis direction contained in the image captured by the camera device 2.

[0145] The specific object TA may include at least one of the first object T1 (component 100), the capture unit 11, and the actuator 12 as a holding member. Therefore, the specific object TA may include any one of the first object T1, the capture unit 11, and the actuator 12, or may include two or more of them.

[0146] In addition, when the second object T2 is the container 300, the determination unit 32 of the control device 3A can determine whether the capture unit 11 has reached the first position based on the movement amount of the capture unit 11 (adsorption nozzle) relative to the nozzle holder 121. For example, suppose that the spring body 14 (refer to Fig.10) is smaller than the reaction force from the container 300 when the capture unit 11 is in contact with the first object T1. In this case, after the capture unit 11 contacts the first object T1, the capture unit 11 moves upward relative to the nozzle holder 121 by moving the shaft 122 downward. Therefore, the determination unit 32 of the control device 3A can determine whether the capture unit 11 has reached the first position based on the amount of movement of the capture unit 11 relative to the nozzle holder 121 contained in the image captured by the camera device 2.

[0147] Furthermore, in this case, the length dimension (dimension in the Z-axis direction) of the nozzle holder 121 photographed by the camera 2 becomes smaller by the movement of the capture unit 11 relative to the nozzle holder 121. Therefore, the determination unit 32 can also determine whether the capture unit 11 has reached the first position by comparing the length dimension of the nozzle holder 121 with a given threshold value.

[0148] In addition, the specific object TA may be the contact member 9 as in the first embodiment. In this case, the control device 3A may further move the capture portion 11 toward the second object T2 after the third object T3 and the fourth object T4 are grounded until the state of the specific object TA reaches a given state. The control device 3A, for example, further moves the capture portion 11 toward the second object T2 after the third object T3 and the fourth object T4 are grounded until the length dimension of the contact member 9 in the X-axis direction reaches a given length. That is, the so-called "the state of the specific object TA reaches a given state" means that the length dimension of the contact member 9 in the X-axis direction as the specific object TA becomes a given length.

[0149] The configuration described in the above-mentioned second embodiment (including modified examples) can be used in combination with the configuration described in the first embodiment (including modified examples) as appropriate.

[0150] (Summary)

[0151] As described above, the mounting system (10; 10A) involved in the first embodiment includes a mounting head (1), a camera device (2) and a control device (3; 3A). The mounting head (1) has a capturing portion (11) for capturing a first object (T1). The mounting head (1) holds the capturing portion (11) so as to be movable toward a second object (T2). The camera device (2) is provided on the mounting head (1). The camera device (2) includes a specific area (R1) containing a specific object (TA) in a camera field of view (R10). The control device (3; 3A) controls the movement of the capturing portion (11) based on information related to the specific object (TA) contained in the output of the camera device (2) so that the capturing portion (11) moves toward the second object (T2).

[0152] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0153] In the mounting system (10; 10A) according to the second aspect, in addition to the first aspect, the control device (3; 3A) moves the capture unit (11) until the state of the specific object (TA) reaches a given state.

[0154] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0155] The mounting system (10; 10A) according to the third aspect is further provided with a detection unit (31) in addition to the second aspect. The detection unit (31) detects that the third object (T3) and the fourth object (T4) are grounded based on the output of the imaging device (2). The detection unit (31) detects that the third object (T3) and the fourth object (T4) are grounded when the state of the specific object (TA) reaches a given state.

[0156] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0157] In the mounting system (10; 10A) involved in the fourth aspect, based on the third aspect, the control device (3; 3A) moves the capture part (11) further toward the second object (T2) side after the third object (T3) and the fourth object (T4) are grounded.

[0158] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0159] The mounting system (10; 10A) according to the fifth aspect is further provided with a determination unit (32) in addition to the third or fourth aspect. The determination unit (32) determines whether the capture unit (11) is further moved toward the second object (T2) after the third object (T3) and the fourth object (T4) are grounded.

[0160] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0161] In the mounting system (10; 10A) according to the sixth aspect, in any one of the first to fifth aspects, the specific object (TA) includes at least one of a first object (T1), a capture portion (11), and a holding member (12). The holding member (12) holds the capture portion (11) movably.

[0162] According to this aspect, the movement amount of the capture unit (11) can be determined based on the specific object (TA) included in the specific region (R1).

[0163] In the mounting system (10; 10A) involved in the seventh embodiment, based on the sixth embodiment, the camera device (2) is arranged on the side of the specific object (TA) so that when the capture unit (11) moves, a specific point (P1) in the specific object (TA) can be photographed.

[0164] According to this method, the movement amount of the capture unit (11) can be determined based on the specific point (P1) photographed by the imaging device (2).

[0165] In the mounting system (10; 10A) involved in the eighth aspect, based on the sixth or seventh aspect, the control device (3; 3A) moves the capture part (11) to the second object (T2) side based on the movement amount of the specific object (TA).

[0166] According to this embodiment, the movement of the capturing portion (11) toward the second object (T2) can be controlled based on the amount of movement of the capturing portion (11) or the component (100).

[0167] In the mounting system (10; 10A) according to a ninth aspect, in addition to any one of the first to fifth aspects, the specific object (TA) is a contact member (9) that contacts both the first object (T1) and the second object (T2).

[0168] According to this embodiment, the first object (T1) and the second object (T2) can be brought into contact with each other via the contact member (9).

[0169] In the mounting system (10; 10A) according to the tenth aspect, in addition to the ninth aspect, the contact member (9) is a joining member (91) for joining the first object (T1) and the second object (T2).

[0170] According to this aspect, the first object (T1) and the second object (T2) can be joined via the joining member (91).

[0171] In the mounting system (10; 10A) involved in the eleventh aspect, based on the ninth or tenth aspect, the control device (3; 3A) moves the capture portion (11) toward the second object (T2) based on the shape of the contact member (9).

[0172] According to this embodiment, the movement of the capture portion (11) toward the second object (T2) can be controlled based on the shape of the contact member (9).

[0173] In the mounting system (10; 10A) involved in the twelfth embodiment, based on the ninth or tenth embodiment, the control device (3; 3A) moves the capture portion (11) toward the second object (T2) side based on a change in the shape of the contact member (9).

[0174] According to this embodiment, the movement of the capture portion (11) toward the second object (T2) can be controlled based on the change in the shape of the contact member (9).

[0175] In a mounting system (10; 10A) according to a thirteenth aspect, in addition to any one of the first to twelfth aspects, the first object (T1) is a component (100) and the second object (T2) is a substrate (200) on which the component (100) is mounted.

[0176] According to this method, the mounting quality of the component (100) on the substrate (200) can be improved.

[0177] In the mounting system (10; 10A) according to a fourteenth aspect, in any one of the first to twelfth aspects, the first object (T1) is a component (100) and the second object (T2) is a container (300) for accommodating the component (100).

[0178] According to this embodiment, the component (100) can be reliably adsorbed by the capturing portion (11).

[0179] In the installation system (10; 10A) involved in the 15th method, based on the second method, the control device (3; 3A) releases the capture of the first object (T1) by the capture part (11) after moving the capture part (11) until the state of the specific object (TA) reaches a given state, or captures the first object (T1) by the capture part (11).

[0180] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0181] The mounting method involved in the 16th mode is a mounting method used in a mounting system (10; 10A) having a mounting head (1) and a camera device (2). The mounting head (1) has a capturing portion (11) for capturing a first object (T1). The mounting head (1) holds the capturing portion (11) so as to be movable toward a second object (T2). The camera device (2) is provided on the mounting head (1). The camera device (2) includes a specific area (R1) containing a specific object (TA) in a camera field of view (R10). The mounting method includes a step of moving the capturing portion (11) by a control device (3; 3A). The control device (3; 3A) moves the capturing portion (11) based on information related to the specific object (TA) contained in the output of the camera device (2) so that the capturing portion (11) moves toward the second object (T2).

[0182] According to this aspect, the mounting quality of the first object (T1) can be improved.

[0183] The structures involved in the second to fifteenth aspects are not essential structures for the mounting system (10; 10A) and can be omitted as appropriate.

[0184] Description of Reference Numerals

[0185] 1 Mounting head

[0186] 2 Camera device

[0187] 3. 3A control device

[0188] 9 Contact components

[0189] 10.10A Installation System

[0190] 11 Capture Department

[0191] 12 Actuator (holding member)

[0192] 31. Inspection Department

[0193] 32 Judgment Department

[0194] 91 Jointing components

[0195] 100 parts

[0196] 200 substrates

[0197] 300 Storage Container

[0198] R1 Specific Area

[0199] TA Specific object

[0200] T1 1st object

[0201] T2 Second object

[0202] T3 The third object

[0203] T4 The fourth object.

Claims

1. A mounting system comprising: A mounting head having a capturing portion for capturing a component as a first object, wherein the capturing portion is held so as to be movable toward a substrate as a second object; An imaging device, which is provided in the mounting head and includes a specific area including a specific object in an imaging field of view; and a control device for controlling the movement of the capturing portion so that the capturing portion moves toward the substrate, The control device includes a detection unit configured to detect, based on an output of the imaging device, that the component as the third object is in contact with a bonding member as a fourth object provided on the substrate. The detection unit detects that the third object is in contact with the fourth object based on a decrease in the amount of movement of the capture unit as the specific object. The control device executes the first process as a process of moving the capture unit until the third object comes into contact with the fourth object.

2. The mounting system of claim 1, wherein: The control device executes a second process of moving the capture unit by a preset movement amount toward the second object after the third object comes into contact with the fourth object.

3. The mounting system of claim 2, wherein: The control device also has: A determination unit determines whether to execute the second process based on a shape of the bonding member included in an image captured by the imaging device after the first process is executed.

4. The mounting system according to claim 1 or 2, wherein: The specific object includes a holding member that holds the capture unit movably.

5. The mounting system of claim 4, wherein: The imaging device is disposed on the side of the specific object so as to be able to capture an image of a specific point in the specific object when the capturing unit moves.

6. The mounting system of claim 4, wherein: The control device moves the capturing portion toward the second object based on the amount of movement of the holding member as the specific object.

7. An installation method is an installation method used in an installation system, wherein the installation system comprises: A mounting head having a capturing portion for capturing a component as a first object, wherein the capturing portion is held so as to be movable toward a substrate as a second object; and An imaging device is provided on the mounting head, and includes a specific area including a specific object in the imaging field of view. The mounting method includes a detection step of detecting, based on the output of the imaging device, that the component as the third object is in contact with a bonding member as a fourth object provided on the substrate, In the detection step, the contact between the third object and the fourth object is detected based on the decrease in the amount of movement of the capture portion as the specific object. The mounting method further includes a control step of executing a first process as a process of moving the capture unit until the third object comes into contact with the fourth object.

8. A mounting system comprising: A mounting head having a capturing portion for capturing a component as a first object, wherein the capturing portion is held so as to be movable toward a container as a second object; An imaging device, which is provided on the mounting head and includes a specific area including a specific object in the imaging field of view; a control device for controlling the movement of the capturing portion so that the capturing portion moves toward the receiving container; a detection unit that detects contact between the capture unit as a third object and the surface of the component as a fourth object based on an output of the imaging device; and a determination unit that determines whether to further move the capture unit toward the second object after the third object comes into contact with the fourth object, The container accommodates the component. The control device moves the capturing unit until the state of the specific object reaches a given state. The detection unit detects that the third object and the fourth object are in contact with each other based on the state of the specific object reaching the given state. When the deflection amount of the container when the contact of the third object is detected does not reach a given value, the determination unit determines to further move the capture unit to the second object side, The specific object is a contact member that brings the first object and the second object into contact with each other.

9. A mounting system comprising: A mounting head having a capturing portion for capturing a first object, wherein the capturing portion is held so as to be movable toward a second object; An imaging device, which is provided in the mounting head and includes a specific area including a specific object in an imaging field of view; and a control device that controls the movement of the capture unit so that the capture unit moves toward the second object, The specific object includes at least one of the first object, the capture unit, and a holding member that holds the capture unit movably. The imaging device is disposed on the side of the specific object so as to be able to capture an image of a specific point provided in the holding member as the specific object when the capturing unit moves toward the second object.

10. A mounting system comprising: A mounting head having a capturing portion for capturing a component as a first object, wherein the capturing portion is held so as to be movable toward a container as a second object; An imaging device, which is provided in the mounting head and includes a specific area including a specific object in an imaging field of view; and a control device for controlling the movement of the capturing portion so that the capturing portion moves toward the receiving container, The container accommodates the component. The control device moves the capturing unit until the state of the specific object reaches a given state. The predetermined state is a state in which the movement amount of the holding member as the specific object becomes smaller.

11. An installation method is an installation method used in an installation system, wherein the installation system comprises: A mounting head having a capturing portion for capturing a member as a first object, wherein the capturing portion is held so as to be movable toward a container as a second object; and An imaging device is provided on the mounting head, and includes a specific area including a specific object in the imaging field of view. The installation method has: a detection step of detecting contact between the capture portion as a third object and the surface of the component as a fourth object based on an output of the imaging device; a determination step of determining whether the capturing portion is further moved toward the second object after the third object contacts the fourth object; and a control step of moving the capture unit until the state of the specific object reaches a given state, The container accommodates the component. In the detection step, the contact between the third object and the fourth object is detected based on the state of the specific object reaching the given state. In the determination step, when the deflection amount of the container when the contact of the third object is detected does not reach a given value, it is determined that the capture portion is further moved toward the second object. The specific object is a contact member that brings the first object and the second object into contact with each other.

12. An installation method is an installation method used in an installation system, wherein the installation system comprises: A mounting head having a capturing portion for capturing a first object, wherein the capturing portion is held so as to be movable toward a second object; and An imaging device is provided on the mounting head, and includes a specific area including a specific object in the imaging field of view. The mounting method includes a control step of controlling the movement of the capture portion so that the capture portion moves toward the second object. The specific object includes at least one of the first object, the capture unit, and a holding member that holds the capture unit movably. The imaging device is disposed on the side of the specific object so as to be able to capture an image of a specific point provided in the holding member as the specific object when the capturing unit moves toward the second object.

13. An installation method is an installation method used in an installation system, the installation system comprising: A mounting head having a capturing portion for capturing a member as a first object, wherein the capturing portion is held so as to be movable toward a container as a second object; and An imaging device is provided on the mounting head, and includes a specific area including a specific object in the imaging field of view. The mounting method includes a control step of moving the capture unit until the state of the specific object reaches a given state. The container accommodates the component. The predetermined state is a state in which the movement amount of the holding member as the specific object becomes smaller.

Images