An energy-saving and environmentally friendly semiconductor wafer cleaning device

Abstract

The present invention discloses an energy-saving and environmentally friendly semiconductor wafer cleaning device, comprising: a support base, a rotating storage mechanism, a cleaning mechanism, and a lifting and adjusting mechanism; a fixed frame is provided on the support base; the rotating storage mechanism is disposed between the fixed frame and the support base, and the rotating storage mechanism includes a supporting circular plate, on which a plurality of storage tubes are mounted, each having a plurality of evenly distributed holes; and a cleaning mechanism is disposed above the support base, and the cleaning mechanism includes a lifting cylinder, within which a plurality of liquid storage cylinders matching the storage tubes are disposed. By configuring the corresponding mechanisms of the semiconductor wafer cleaning device, the present invention reduces the consumption of various cleaning fluids during the cleaning process, removes organic matter and oxide layers from the surface of the semiconductor wafer during the cleaning process, improves the cleaning effect, and creates hydrophilicity on the wafer surface, thereby preventing further metal contamination and thereby extending the service life of the semiconductor wafer.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor cleaning, and in particular relates to an energy-saving and environment-friendly semiconductor wafer cleaning device. Background Art

[0002] Semiconductors are materials with electrical conductivity between insulators and conductors. Their conductivity is easily controlled, making them useful as components for information processing. From a technological and economic perspective, semiconductors are crucial. However, traditional semiconductor wafer cleaning methods often require large amounts of cleaning fluid, resulting in a waste of resources and less than ideal results. Furthermore, after cleaning, the surface of the semiconductor wafer is not hydrophilic, making it susceptible to recurring metal contamination. This shortens the wafer's lifespan and causes unnecessary financial losses for users.

[0003] Therefore, in view of the above technical problems, it is necessary to provide an energy-saving and environment-friendly semiconductor wafer cleaning device. Summary of the Invention

[0004] The object of the present invention is to provide an energy-saving and environment-friendly semiconductor wafer cleaning device to solve the problem of poor cleaning effect of the existing semiconductor wafers.

[0005] In order to achieve the above objectives, an embodiment of the present invention provides the following technical solutions:

[0006] An energy-saving and environment-friendly semiconductor wafer cleaning device comprises: a supporting base, a rotating storage mechanism, a cleaning mechanism and a lifting and adjusting mechanism;

[0007] A fixing frame is provided on the support base, and a rotation driving device is installed on the fixing frame;

[0008] The rotating storage mechanism is arranged between the fixing frame and the supporting base, and the rotating storage mechanism includes a supporting circular plate, a plurality of storage tubes are installed on the supporting circular plate, and a plurality of evenly distributed holes are drilled on the storage tubes;

[0009] The cleaning mechanism is arranged above the supporting base, and the cleaning mechanism includes a lifting cylinder, wherein a plurality of liquid storage cylinders matching with the storage tubes are arranged in the lifting cylinder;

[0010] The lifting adjustment mechanism is arranged between the supporting circular plate and the lifting cylinder, and is used to drive the lifting cylinder to rise and fall.

[0011] Furthermore, the rotation starting device includes a motor for driving the transmission support shaft to rotate and providing power for the semiconductor wafer to enter the next cleaning liquid. The motor is connected to a transmission support shaft for supporting the support circular plate and driving the support circular plate to rotate. The other end of the transmission support shaft is fixedly connected to the support circular plate.

[0012] A fixed bearing is connected between the transmission support shaft and the fixing frame, which is used to fix the transmission support shaft so that the transmission support shaft will not tilt, improve the stability of the transmission support shaft, and enable the transmission support shaft to rotate freely without being affected by the fixing frame.

[0013] Furthermore, a control box is provided on one side of the motor, and the control box is fixed on the fixed frame. The control box is electrically connected to the motor, so that the control box can control the start and stop of the motor, thereby facilitating the control of the rotation and movement of multiple storage tubes, and can control the time of each start-up of the motor to be consistent, so that the distance of each rotation and movement of the storage tube is the same, thereby avoiding the situation where multiple storage tubes do not correspond to the liquid storage cylinder.

[0014] Furthermore, a widening plate is installed on the storage tube, which is used to fit on the inner wall of the lifting cylinder, so as to prevent the semiconductor wafers from falling during the cleaning process, and can also play a role in blocking gas leakage, so that the gas used to dry the semiconductor wafers can pass into the exhaust groove. The side of the widening plate away from the storage tube fits on the inner wall of the lifting cylinder.

[0015] Furthermore, an air pump is installed below the lifting cylinder for filling gas into the supporting air pipe to provide a gas source for drying semiconductor wafers. The air pump is connected to the supporting air pipe for conveying gas so that the gas can enter the dispersion pipe and has the function of supporting the dispersion pipe to prevent the dispersion pipe from moving or falling off.

[0016] The other end of the supporting air pipe is connected to a dispersion pipe for dispersing and delivering the gas into a plurality of delivery pipes, thereby delivering the gas into a plurality of liquid storage cylinders.

[0017] Furthermore, the dispersion pipe is connected to a plurality of delivery pipes for delivering gas to the liquid storage cylinder. The other end of the delivery pipe passes through the lifting cylinder and is connected to the liquid storage cylinder to facilitate the delivery of gas. The lifting cylinder is provided with a plurality of exhaust grooves, and the gas used to dry the semiconductor wafers can be delivered to the adjacent liquid storage cylinder through the exhaust grooves after use, thereby stirring the cleaning liquid in the liquid storage cylinder and improving the cleaning effect of the semiconductor wafers.

[0018] Furthermore, the support base is provided with a plurality of fixed shrink sleeves, which provide space for the shrinkage of the limit connecting column and have the function of fixing the limit connecting column to prevent the limit connecting column from rotating. A lifting support slide is provided in the fixed shrink sleeve to limit the limit connecting column so that the limit connecting column will not fall off.

[0019] The lifting support slide is connected to a limited connection column, and the other end of the limited connection column is fixedly connected to the lifting cylinder, so that the lifting cylinder does not rotate, thereby preventing the positions of the multiple liquid storage cylinders from changing, and further, the cleaning liquid immersed in the semiconductor wafer can be changed by rotating the storage tube;

[0020] A tightening spring is connected between the lifting support slide and the fixed shrinkage sleeve, which is used to tighten the lifting support slide, thereby pulling the limiting connecting column through the lifting support slide, thereby achieving a certain pulling force on the lifting cylinder, avoiding shaking of the lifting cylinder, and improving the stability of the lifting cylinder.

[0021] Furthermore, the lifting and adjusting mechanism includes an adjusting cylinder for controlling the extension and retraction of the piston support rod. The adjusting cylinder is electrically connected to the control box, so that the staff can control the activation of the adjusting cylinder through the control box, thereby controlling the extension and retraction of the piston support rod.

[0022] The regulating cylinder is connected to a piston support rod for supporting a limit block and driving the limit block to rotate. The other end of the piston support rod is connected to a limit block for being stuck in a limit groove on the fixed connection block, so that the piston support rod can drive the fixed connection block to rise and fall when it moves telescopically, thereby pulling the lifting cylinder and multiple liquid storage cylinders to rise and fall.

[0023] Furthermore, a fixed connecting block is provided in the lifting cylinder, and the fixed connecting block is fixedly connected to the lifting cylinder, so that the piston support rod can drive the lifting cylinder to move up and down. A limiting groove is dug in the fixed connecting block, and the limiting block is arranged in the limiting groove to prevent the limiting block from falling off.

[0024] Furthermore, a first connecting bearing is connected between the piston support rod and the fixed connecting block, and a second connecting bearing is connected between the limit block and the fixed connecting block, so that the rotation of the piston support rod and the limit block will not drive the fixed connecting block to rotate, thereby preventing the lifting cylinder from rotating.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] The present invention reduces the consumption of various cleaning fluids during the cleaning process by setting up corresponding mechanisms of the semiconductor wafer cleaning device, and cleans the organic matter and oxide layer on the surface of the semiconductor wafer during the cleaning process, thereby improving the cleaning effect. In addition, hydrophilicity is generated on the wafer surface, which can avoid the recurrence of metal contamination, thereby increasing the service life of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 A side cross-sectional view of an energy-saving and environment-friendly semiconductor wafer cleaning device according to an embodiment of the present invention;

[0029] Figure 2 for Figure 1 Schematic diagram of the structure at A in the middle;

[0030] Figure 3 for Figure 1 Schematic diagram of the structure at B in the middle;

[0031] Figure 4 for Figure 1 Schematic diagram of the structure at C in the middle;

[0032] Figure 5 A perspective view of an energy-saving and environment-friendly semiconductor wafer cleaning device according to an embodiment of the present invention;

[0033] Figure 6 This is a diagram showing the use of an energy-saving and environment-friendly semiconductor wafer cleaning device according to one embodiment of the present invention;

[0034] Figure 7 It is a front cross-sectional view of an energy-saving and environment-friendly semiconductor wafer cleaning device according to one embodiment of the present invention;

[0035] Figure 8 for Figure 7 Schematic diagram of the structure at D in the middle;

[0036] Figure 9 for Figure 7 Schematic diagram of the structure at E in the middle;

[0037] Figure 10 This is a schematic structural diagram of a storage tube in one embodiment of the present invention;

[0038] Figure 11 Schematic diagram of the structure of a lifting cylinder in one embodiment of the present invention.

[0039] In the figure: 1. Support base, 101. Fixed frame, 102. Motor, 103. Transmission support shaft, 104. Fixed bearing, 105. Control box, 2. Rotating storage mechanism, 201. Support circular plate, 202. Storage tube, 203. Hole, 204. Widening plate, 3. Cleaning mechanism, 301. Lifting cylinder, 302. Liquid storage cylinder, 303. Air pump, 304. Support air pipe, 305. Dispersion pipe, 306. Delivery pipe, 307. Exhaust groove, 308. Fixed shrink sleeve, 309. Lifting support slide, 310. Limit connecting column, 311. Tightening spring, 4. Lifting adjustment mechanism, 401. Adjusting cylinder, 402. Piston support rod, 403. Limit block, 404. Fixed connecting block, 405. First connecting bearing, 406. Second connecting bearing. DETAILED DESCRIPTION

[0040] The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional modifications made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0041] The present invention discloses an energy-saving and environmentally friendly semiconductor wafer cleaning device. Figures 1-11 As shown, it includes: a supporting base 1, a rotating storage mechanism 2, a cleaning mechanism 3 and a lifting and adjusting mechanism 4.

[0042] refer to Figure 1-Figure 7 As shown, a fixing frame 101 is provided on the support base 1 for supporting the driving device so that the motor 102 does not shake, thereby improving the operating stability of the device. A rotation driving device is installed on the fixing frame 101. The rotation starting device includes a motor 102 for driving the transmission support shaft 103 to rotate, thereby providing power for the semiconductor wafer to enter the next cleaning liquid. The motor 102 is connected to a transmission support shaft 103 for supporting the support circular plate 201 and has the function of driving the support circular plate 201 to rotate. The other end of the transmission support shaft 103 is fixedly connected to the support circular plate 201.

[0043] refer to Figure 1-Figure 2 As shown, a fixed bearing 104 is connected between the transmission support shaft 103 and the fixed frame 101, which is used to fix the transmission support shaft 103 so that the transmission support shaft 103 will not tilt, improve the stability of the transmission support shaft 103, and enable the transmission support shaft 103 to rotate freely without being affected by the fixed frame 101.

[0044] Specifically, a control box 105 is provided on one side of the motor 102, and the control box 105 is fixed on the fixed frame 101. The control box 105 is electrically connected to the motor 102, so that the control box 105 can control the start and stop of the motor 102, thereby facilitating the control of the rotation and movement of multiple storage tubes 202, and can control the time of each start-up operation of the motor 102 to be consistent, so that the distance of rotation and movement of the storage tube 202 each time is the same, thereby avoiding the situation where multiple storage tubes 202 do not correspond to the liquid storage cylinder 302.

[0045] refer to Figure 1-Figure 7 As shown, the rotating storage mechanism 2 is arranged between the fixed frame 101 and the support base 1. The rotating storage mechanism 2 includes a supporting circular plate 201, which is used to support multiple storage tubes 202 so that the storage tubes 202 will not fall off, and has the function of driving the storage tubes 202 to rotate, thereby driving the rotation of the semiconductor wafer, achieving the effect of assembly line cleaning, and improving cleaning efficiency.

[0046] refer to Figures 1-10 As shown, a plurality of storage tubes 202 are installed on the support circular plate 201 for storing semiconductor wafers to facilitate the rotation of the semiconductor wafers. A plurality of evenly distributed holes 203 are drilled on the storage tubes 202 so that when the storage tubes 202 are inserted into the liquid storage cylinder 302, the cleaning liquid in the liquid storage cylinder 302 can flow over the semiconductor wafers, achieving an immersion cleaning effect.

[0047] Among them, a widening plate 204 is installed on the storage tube 202, which is used to fit on the inner wall of the lifting cylinder 301, so as to prevent the semiconductor wafers from falling during the cleaning process, and can also play a role in blocking gas leakage, so that the gas used to dry the semiconductor wafers can pass into the exhaust groove 307. The side of the widening plate 204 away from the storage tube 202 fits on the inner wall of the lifting cylinder 301.

[0048] refer to Figures 1-11 As shown, the cleaning mechanism 3 is arranged above the supporting base 1. The cleaning mechanism 3 includes a lifting cylinder 301 for supporting multiple liquid storage cylinders 302 so that the liquid storage cylinders 302 will not rotate. The upper end of the lifting cylinder 301 is half-open, which is convenient for workers to put uncleaned semiconductor chips into the storage tube 202 and to take out the cleaned semiconductor chips.

[0049] Specifically, a plurality of liquid storage cylinders 302 matching the storage tubes 202 are provided in the lifting cylinder 301 for storing cleaning liquid, and the liquid storage cylinders 302 between two adjacent cleaning liquid storage cylinders are empty, so as to facilitate the use of gas to blow the semiconductor wafers to achieve a drying effect, and the liquid storage cylinders 302 without cleaning liquid are connected to the delivery tube 306 to facilitate the entry of gas.

[0050] refer to Figures 1-8As shown, an air pump 303 is installed under the lifting cylinder 301 for filling gas into the supporting air pipe 304 to provide a gas source for drying semiconductor wafers. The air pump 303 is connected to the supporting air pipe 304 for conveying gas so that the gas can enter the dispersion pipe 305 and has the function of supporting the dispersion pipe 305 to prevent the dispersion pipe 305 from moving or falling off.

[0051] The other end of the supporting gas pipe 304 is connected to a dispersion pipe 305 for dispersing and delivering the gas into a plurality of delivery pipes 306 , thereby delivering the gas into a plurality of liquid storage cylinders 302 .

[0052] Specifically, the dispersion pipe 305 is connected to a plurality of delivery pipes 306 for delivering gas to the liquid storage cylinder 302. The other end of the delivery pipe 306 passes through the lifting cylinder 301 and is connected to the liquid storage cylinder 302 to facilitate the delivery of gas. The lifting cylinder 301 is provided with a plurality of exhaust grooves 307. The gas used to dry the semiconductor wafers can be delivered to the adjacent liquid storage cylinder 302 through the exhaust grooves 307 after use, thereby stirring the cleaning liquid in the liquid storage cylinder 302 and improving the cleaning effect of the semiconductor wafers.

[0053] refer to Figure 1-Figure 3 As shown, a plurality of fixed shrinkage sleeves 308 are provided on the support base 1, which provide space for the shrinkage of the limiting connecting column 310, and have the function of fixing the limiting connecting column 310 to prevent the limiting connecting column 310 from rotating. A lifting support slide 309 is provided in the fixed shrinkage sleeve 308, which is used to limit the limiting connecting column 310 so that the limiting connecting column 310 will not fall off.

[0054] Among them, a limiting connecting column 310 is connected to the lifting support slide 309, and the other end of the limiting connecting column 310 is fixedly connected to the lifting cylinder 301, so that the lifting cylinder 301 will not rotate, thereby preventing the positions of multiple liquid storage cylinders 302 from changing, and then the cleaning liquid in which the semiconductor chip is immersed can be changed by rotating the storage tube 202.

[0055] In addition, a tightening spring 311 is connected between the lifting support slide 309 and the fixed shrinkage sleeve 308, which is used to tighten the lifting support slide 309, thereby pulling the limiting connecting column 310 through the lifting support slide 309, thereby achieving a certain pulling force on the lifting cylinder 301, avoiding the lifting cylinder 301 from shaking, and improving the stability of the lifting cylinder 301.

[0056] refer to Figures 1-4As shown, the lifting and adjusting mechanism 4 is arranged between the supporting circular plate 201 and the lifting cylinder 301, and is used to drive the lifting cylinder 301 to rise and fall. The lifting and adjusting mechanism 4 includes an adjusting cylinder 401, which is used to control the extension and retraction of the piston support rod 402. The adjusting cylinder 401 is electrically connected to the control box 105, so that the staff can control the start-up of the adjusting cylinder 401 through the control box 105, and then control the extension and retraction movement of the piston support rod 402.

[0057] refer to Figure 4 As shown, the regulating cylinder 401 is connected to a piston support rod 402 for supporting the limit block 403 and driving the limit block 403 to rotate. The other end of the piston support rod 402 is connected to the limit block 403 for being stuck in the limit groove on the fixed connection block 404, so that the piston support rod 402 can drive the fixed connection block 404 to rise and fall when it moves telescopically, thereby pulling the lifting cylinder 301 and multiple liquid storage cylinders 302 to rise and fall.

[0058] refer to Figure 4 As shown, a fixed connection block 404 is provided in the lifting cylinder 301, and the fixed connection block 404 is fixedly connected to the lifting cylinder 301, so that the piston support rod 402 can drive the lifting cylinder 301 to move up and down. A limiting groove is drilled in the fixed connection block 404, and the limiting block 403 is arranged in the limiting groove to prevent the limiting block 403 from falling off.

[0059] Among them, a first connecting bearing 405 is connected between the piston support rod 402 and the fixed connecting block 404, and a second connecting bearing 406 is connected between the limit block 403 and the fixed connecting block 404, so that the rotation of the piston support rod 402 and the limit block 403 will not drive the fixed connecting block 404 to rotate, thereby preventing the lifting cylinder 301 from rotating.

[0060] In specific use, during the semiconductor wafer cleaning process, the regulating cylinder 401 can drive the piston support rod 402 to move up and down, and the piston support rod 402 will pull the fixed connection block 404 through the limit block 403, and the fixed connection block 404 will drive the lifting cylinder 301 and the multiple liquid storage cylinders 302 to move up and down. When the lifting cylinder 301 and the multiple liquid storage cylinders 302 rise, the semiconductor wafers in the storage tube 202 can be immersed in the liquid in the liquid storage cylinders 302, thereby achieving the effect of immersion cleaning;

[0061] After the lifting cylinder 301 and the plurality of liquid storage cylinders 302 are lowered, the storage tubes 202 are no longer inserted into the liquid storage cylinders 302. At this time, the motor 102 is started to drive the transmission support shaft 103 and the support circular plate 201 to rotate a certain angle, and the support circular plate 201 drives the plurality of storage tubes 202 to rotate. Then, by adjusting the cylinder 401, the plurality of storage tubes 202 are inserted into the liquid storage cylinders 302 again, so that the semiconductor wafers can enter the next cleaning liquid, thereby achieving the effect of multi-pass cleaning.

[0062] An empty storage tube 202 is left between adjacent cleaning solutions, allowing the semiconductor wafer to be dried before entering the next cleaning solution, thereby preventing the cleaning solutions from mixing and affecting the cleaning effect. Drying is performed by supplying gas through an air pump 303, which is dispersed into multiple delivery tubes 306 through a dispersion tube 305, and then enters the corresponding liquid storage cylinder 302 and is blown toward the semiconductor wafer, thereby improving drying efficiency.

[0063] The staff can put the uncleaned semiconductor wafers and take out the cleaned semiconductor wafers at the opening of the lifting cylinder 301, and use multiple storage tubes 202 to realize the cleaning of the assembly line, improve the cleaning efficiency, and add a drying process between two adjacent cleaning liquids to prevent the cleaning liquids from mixing.

[0064] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0065] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An energy-saving and environmentally friendly semiconductor wafer cleaning device, characterized in that: include: A support base (1), wherein a fixing frame (101) is provided on the support base (1), and a rotation drive device is installed on the fixing frame (101); A rotating storage mechanism (2) is provided between the fixing frame (101) and the supporting base (1), the rotating storage mechanism (2) comprising a supporting circular plate (201), a plurality of storage tubes (202) being mounted on the supporting circular plate (201), and a plurality of evenly distributed holes (203) being bored on the storage tubes (202); A cleaning mechanism (3) is provided above the support base (1), the cleaning mechanism (3) comprising a lifting cylinder (301), a plurality of liquid storage cylinders (302) matching the storage tubes (202) being provided in the lifting cylinder (301), an air pump (303) being installed below the lifting cylinder (301), the air pump (303) being connected to a supporting air pipe (304), the other end of the supporting air pipe (304) being connected to a dispersion pipe (305), the dispersion pipe (305) being connected to a plurality of delivery pipes (306), the other end of the delivery pipe (306) passing through the lifting cylinder (301) and being connected to the liquid storage cylinders (302), and a plurality of exhaust grooves (307) being excavated on the lifting cylinder (301); A lifting and lowering adjustment mechanism (4) is provided between the supporting circular plate (201) and the lifting cylinder (301) and is used to drive the lifting cylinder (301) to rise and fall. The lifting and lowering adjustment mechanism (4) includes an adjusting cylinder (401). The adjusting cylinder (401) is connected to a piston support rod (402). The other end of the piston support rod (402) is connected to a limiting block (403). A fixed connection block (404) is provided in the lifting cylinder (301). The fixed connection block (404) is fixedly connected to the lifting cylinder (301). A limiting groove is bored in the fixed connection block (404), and the limiting block (403) is provided in the limiting groove.

2. The energy-saving and environmentally friendly semiconductor wafer cleaning device according to claim 1, characterized in that: The rotary starting device comprises an electric motor (102), a transmission support shaft (103) is connected to the electric motor (102), the other end of the transmission support shaft (103) is fixedly connected to the supporting circular plate (201), and a fixed bearing (104) is connected between the transmission support shaft (103) and the fixed frame (101).

3. The energy-saving and environmentally friendly semiconductor wafer cleaning device according to claim 2, characterized in that: A control box (105) is provided on one side of the motor (102), the control box (105) is fixed on the fixing frame (101), and the control box (105) is electrically connected to the motor (102).

4. The energy-saving and environmentally friendly semiconductor wafer cleaning device according to claim 1, characterized in that: A widening plate (204) is installed on the storage tube (202), and a side of the widening plate (204) away from the storage tube (202) is attached to the inner wall of the lifting cylinder (301).

5. The energy-saving and environment-friendly semiconductor wafer cleaning device according to claim 1, characterized in that: The support base (1) is provided with a plurality of fixed shrink sleeves (308), a lifting support slide (309) is provided in the fixed shrink sleeve (308), a limited connection column (310) is connected to the lifting support slide (309), the other end of the limited connection column (310) is fixedly connected to the lifting cylinder (301), and a tightening spring (311) is connected between the lifting support slide (309) and the fixed shrink sleeve (308).

6. The energy-saving and environment-friendly semiconductor wafer cleaning device according to claim 1, characterized in that: A first connecting bearing (405) is connected between the piston support rod (402) and the fixed connecting block (404), and a second connecting bearing (406) is connected between the limiting block (403) and the fixed connecting block (404).

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