Multi-transport carrier docking device

Abstract

Embodiments of the present invention relate to multi-transport carrier docking devices. Multi-transport carrier docking devices can store and / or arrange multiple transport carriers in a chamber of the multi-transport carrier docking device, and can form a hermetic seal around the transport carriers within the chamber. Wafer handling tools can retrieve semiconductor wafers from the transport carriers while the hermetic seal around the transport carriers prevents and / or reduces the likelihood of contaminants reaching the semiconductor wafers in a semiconductor manufacturing facility. The hermetic seal around the transport carriers can reduce defects in the semiconductor wafers caused by contaminants, can improve manufacturing yields and quality in a semiconductor manufacturing plant, and / or can allow for continued scaling of features and / or components of integrated circuits and / or semiconductor devices formed on the semiconductor wafers.

Description

Technical Field

[0001] This invention relates to a multi-transport carrier docking device. Background Technology

[0002] Semiconductor wafers can be processed in various semiconductor processing tools within a semiconductor manufacturing facility to produce various integrated circuits and / or semiconductor devices. Semiconductor wafers can be transported throughout the semiconductor manufacturing facility and / or between semiconductor processing tools within the facility. Summary of the Invention

[0003] According to an embodiment of the present invention, a multi-transport vehicle docking device includes: a first chamber arranged to store a plurality of transport vehicles; a second chamber; a partition wall located between the first chamber and the second chamber; wherein the partition wall includes an opening between the first chamber and the second chamber; a chamber door included in the second chamber, the chamber door being arranged to form a first airtight seal against the partition wall and surrounding the opening; and a sealing assembly included in the first chamber, the sealing assembly being arranged to form a second airtight seal between the first chamber and the transport vehicles in the first chamber.

[0004] According to an embodiment of the present invention, a method relating to a docking device includes: positioning a transport carrier on a movable platform among a plurality of movable platforms included in a first chamber of a multi-transport carrier docking device; contracting the sealing assembly of the multi-transport carrier docking device around the transport carrier to form an airtight seal around the transport carrier; after forming the airtight seal around the transport carrier: removing a carrier door of the transport carrier tool, and opening a chamber door of the multi-transport carrier docking device to allow entry into the transport carrier through an opening in a spacer wall between the first and second chambers of the multi-transport carrier docking device; and, with the airtight seal surrounding the transport carrier, using a wafer transport tool associated with the multi-transport carrier docking device to enter the transport carrier.

[0005] According to an embodiment of the present invention, a method relating to a docking apparatus includes: retrieving a wafer from a semiconductor processing tool using a wafer transport tool; providing the wafer to a transport carrier using the wafer transport tool, the transport carrier being located on a movable platform of a plurality of movable platforms, the movable platforms including a first chamber of a multi-transport carrier docking apparatus, while a first hermetically sealed seal is formed around the transport carrier by a sealing assembly of the multi-transport carrier docking apparatus; placing a carrier door on the transport carrier while the first hermetically sealed seal surrounds a front portion of the transport carrier; abutting the chamber door against a spacer wall between the first and second chambers of the multi-transport carrier docking apparatus to close an opening on the spacer wall and forming a second hermetically sealed seal between the chamber door and the spacer wall; and retracting the sealing assembly after forming the second hermetically sealed seal to eliminate the first hermetically sealed seal around the transport carrier. Attached Figure Description

[0006] The following detailed description, read in conjunction with the accompanying drawings, provides the best understanding of aspects of this disclosure. It should be noted that, in accordance with industry standard practice, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion.

[0007] Figure 1 This is a diagram of the example semiconductor processing environment described in this article.

[0008] Figures 2A-2F A figure relating to an example embodiment of a sealing assembly that forms an airtight seal around a transport vehicle as described herein.

[0009] Figure 3 This is what is described in this article Figure 1 A diagram of a portion of an example semiconductor processing environment.

[0010] Figure 4A-4K This is a diagram of one or more example implementations described in this article.

[0011] Figure 5 yes Figures 2A-2F A diagram of example components of one or more devices.

[0012] Figure 6 and 7 This is a flowchart of an example process related to entering a transport vehicle. Detailed Implementation

[0013] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first member on or above a second member may include embodiments in which the first and second members are in direct contact, and may also include embodiments in which an additional member may be formed between the first and second members such that the first and second members are not in direct contact. Additionally, reference numerals and / or letters may be repeated in various instances of this disclosure. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0014] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” “up,” and the like are used herein to describe the relationship of one element or component to another element or component(s), as illustrated in the figures. In addition to the orientations depicted in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or otherwise) and this also explains the spatial relative descriptive terms used herein.

[0015] Multiple semiconductor wafers and / or other types of substrates can be transported throughout a semiconductor manufacturing facility using transport carriers. Transport carriers may include wafer cassettes, front-opening unified pods (FOUPs), boxes, containers, or similar types of devices. To transport semiconductor wafers from the transport carrier to a semiconductor processing tool, the transport carrier can be placed within and / or on top of a loading port associated with the semiconductor processing tool. A transport vehicle included in an interface tool (e.g., a device front-end module (EFEM) or a similar type of interface tool) located between the semiconductor processing tool and the loading port can remove the semiconductor wafer from the transport carrier. The transport vehicle can transport the semiconductor wafer from the transport carrier to the semiconductor processing tool through the chambers of the interface tool. The transport vehicle can reverse the above process to transport the semiconductor wafer from the semiconductor processing tool to the transport carrier after processing.

[0016] During transport of semiconductor wafers between loading ports and associated semiconductor processing tools, the wafers may be exposed to contaminants (e.g., volatile organic compounds (VOCs), dust, debris, and other types of contaminants) within the semiconductor manufacturing facility. In other examples, these contaminants can cause semiconductor device failure, defects in integrated circuits and / or semiconductor devices formed in the semiconductor manufacturing facility, and can reduce manufacturing yield and quality. Furthermore, as the component and / or building blocks of integrated circuits and / or semiconductor devices formed on semiconductor wafers in semiconductor manufacturing facilities continue to shrink in size, their tolerance to contaminants decreases, and the impact of contaminants in semiconductor manufacturing facilities may continue to become increasingly significant.

[0017] Some embodiments described herein provide a multi-carrier docking device positioned between a loading port and an interface tool to reduce and / or minimize cross-contamination of semiconductor wafers transported between the loading port and associated semiconductor processing tools. When the transport carrier is within the chamber of the multi-carrier docking device, the device can form a hermetically sealed area around the transport carrier. In this way, the semiconductor wafer in the transport carrier can be retrieved by the transport tool, while the hermetically sealed area around the transport carrier prevents and / or reduces the likelihood of contaminants in the semiconductor manufacturing equipment coming into contact with the semiconductor wafer. Therefore, the hermetically sealed area around the transport carrier can reduce semiconductor wafer defects caused by contaminants, improve manufacturing yield and quality in semiconductor manufacturing plants, and / or allow for continuous reduction in the size of components and / or parts of integrated circuits and / or semiconductor devices formed on semiconductor wafers.

[0018] Furthermore, the multi-carrier docking device can simultaneously store and / or arrange multiple transport carriers within a chamber. When the associated semiconductor processing tool processes a semiconductor wafer contained in multiple transport carriers, this allows the transport carriers to cycle through more quickly, which can increase the capacity and productivity of the associated semiconductor processing tool.

[0019] Figure 1 This is a diagram of the example semiconductor processing environment 100 described herein. The example semiconductor processing environment 100 may include, or may be included in, semiconductor manufacturing facilities, semiconductor foundries, semiconductor processing facilities, semiconductor cleanrooms, and / or other environments where semiconductor wafers and / or components are processed. Figure 1 As shown, the example semiconductor processing environment 100 may include a semiconductor processing tool 102, a loading port 104, an interface tool 106, a docking device 108, and other tools and / or devices.

[0020] Semiconductor processing tool 102 may include one or more tools arranged to perform one or more semiconductor processing steps on one or more semiconductor wafers and / or components. For example, semiconductor processing tool 102 may include deposition tools (e.g., as semiconductor processing tools for depositing one or more layers onto a semiconductor wafer), electroplating tools (e.g., as electroplating tools for depositing one or more metal layers onto a semiconductor wafer), exposure tools (e.g., extreme ultraviolet (EUV) tools, electron beam (e-beam) tools), etching tools (e.g., wet etching tools, dry etching tools), or other types of semiconductor processing tools.

[0021] Loading port 104 may include a shuttle platform 110 arranged to receive and support transport carrier 112. Transport carrier 112 may include wafer cassettes, front-opening wafer transfer boxes (FOUPs), boxes, containers, or similar devices for securing and / or storing multiple semiconductor wafers. Loading port 104 and shuttle platform 110 may receive transport carrier 112 from transport robots, transport vehicles, overhead hoist transport (OHT) systems, or other devices used to move transport carriers to and from various locations within the example semiconductor processing environment 100.

[0022] The transport carrier 112 may include a wafer cassette, a front-opening wafer transfer box (FOUP), a box, a container, or a similar type of device for securing and / or storing multiple semiconductor wafers. The transport carrier 112 may include a body 114 that can be placed on a shuttle platform 110. The body 114 may be further arranged to store multiple semiconductor wafers, semiconductor devices, and / or substrates to be used in semiconductor processing. The transport carrier 112 may further include a carrier door 116. The carrier door 116 may be attached to the body 114, and a hermetic seal (e.g., a tight seal) may be formed between the carrier door 116 and the body 114 to reduce, minimize, and / or prevent contamination of the semiconductor wafers stored in the body 114.

[0023] Interface tool 106 may include an EFEM or other tool including chamber 118. Air may be supplied to chamber 118 through filter 120, which (e.g., a high-efficiency particulate air (HEPA) filter or other type of air filter) is arranged to filter out particles and other contaminants from the incoming air. Chamber 118 may further exhaust air via exhaust port 122.

[0024] Interface tool 106 may also include a wafer transport tool 124 within chamber 118. Wafer transport tool 124 may include a robotic arm or other type of tool arranged to transport semiconductor wafers between transport carrier 112 and semiconductor processing tool 102. Wafer transport tool 124 can receive and / or retrieve semiconductor wafers from transport carrier 112 through opening 126 between docking device 108 and interface tool 106, and can provide semiconductor wafers to semiconductor processing tool 102 through opening 128 between interface tool 106 and semiconductor processing tool 102. Furthermore, wafer transport tool 124 can receive and / or retrieve semiconductor wafers from semiconductor processing tool 102 through opening 128, and can provide semiconductor wafers to transport carrier 112 through opening 126. In some embodiments, wafer transport tool 124 transports semiconductor wafers between transport carrier 112 and stage area of ​​semiconductor processing tool 102. In some embodiments, wafer transport tool 124 transports semiconductor wafers between transport carrier 112 and processing chamber of semiconductor processing tool 102.

[0025] The docking device 108 is a device arranged in a manner that reduces the likelihood of a semiconductor wafer being exposed to contaminants that may be present in the example semiconductor processing environment 100, allowing the semiconductor wafer to be transported between the transport carrier 112 and the semiconductor processing tool 102. Figure 1 As shown, the docking device 108 can be referred to as a multi-carrier docking device because the docking device 108 is arranged to (and / or to) store and / or arrange multiple carriers 112 in the first chamber 130. The wafer transport tool 124 can enter the carrier 112 (e.g., the body 114 of the carrier 112) through the opening 126 and through the second chamber 132 of the docking device 108.

[0026] The first chamber 130 and the second chamber 132 may be separated by a partition wall 134. The partition wall 134 may include a rigid or semi-rigid structure extending from the top of the first chamber 130 and the second chamber 132 to the bottom of the first chamber 130 and the second chamber 132. The partition wall 134 may further extend from one side of the first chamber 130 and the second chamber 132 to the other (opposite) side of the first chamber 130 and the second chamber 132.

[0027] Opening 136 may be provided through partition wall 134, and said opening may be sealed by chamber door 138. Specifically, chamber door 138 may be pressed against partition wall 134 to form an airtight seal (e.g., a tight seal) between partition wall 134 and chamber door 138. The airtight seal between partition wall 134 and chamber door 138 serves as an airtight seal between first chamber 130 and second chamber 132. Figure 1As shown, when the chamber door 138 is in the closed position, the spacer wall 134 and the chamber door 138 can form an hermetically tight seal. The hermetically tight seal can reduce, minimize, and / or eliminate the possibility that contaminants in the example semiconductor processing environment 100 might otherwise travel from the first chamber 130 to the second chamber 132 through the opening 136 in the spacer wall 134.

[0028] In some embodiments, the partition wall 134 and / or chamber door 138 may include gaskets, strips, or other components to form an airtight seal. A gasket for the partition wall 134 (if included) may be formed around an opening 136 in the partition wall 134. A gasket for the chamber door 138 (if included) may be formed to generally conform to the shape around the opening 136 in the partition wall 134. The gaskets for the partition wall 134 and / or the chamber door 138 may be formed of soft and / or malleable materials to allow for an airtight seal. For example, the gaskets for the partition wall 134 and / or the chamber door 138 may be formed of plastic, rubber, silicone, or similar materials. In some embodiments, the gasket material for the partition wall 134 and / or the chamber door 138 includes an airtight material.

[0029] The first chamber 130 of the docking device 108 may include a door 140 that seals around an opening on a first side (e.g., a first sidewall) of the docking device 108. In some embodiments, the door 140 (and associated opening) is on a side face opposite to an opening 126 of the docking device 108, which may be on a second side (e.g., a second sidewall) of the docking device 108. In some embodiments, the door 140 (and associated opening) and the opening 126 are on adjacent sides (e.g., adjacent sidewalls) of the docking device 108.

[0030] Door 140 (and associated opening) may face loading port 104 to allow transport vehicle 112 to move between shuttle platform 110 and first chamber 130. Door 140 may be opened (e.g., removed from the opening) to provide access to first chamber 130 for inserting transport vehicle 112 into first chamber 130 and for removing transport vehicle 112 from first chamber 130. Opening 126 may provide access for wafer transport vehicle 124 to second chamber 132.

[0031] Air can be supplied to the first chamber 130 through a filter 142, which (e.g., a HEPA filter or other type of air filter) is arranged to filter or remove particles and other contaminants from the air entering the first chamber 130. The first chamber 130 can be further vented through an exhaust port 144.

[0032] As described above, the docking device 108 can be arranged to store and / or arrange a plurality of transport vehicles 112 in the first chamber 130. The first chamber 130 may include a plurality of movable platforms 146 on which the transport vehicles 112 can be placed and / or supported. Each movable platform 146 can be arranged to support a corresponding transport vehicle 112. Each movable platform 146 may be larger in size relative to the transport vehicle 112 (e.g., a larger length and / or a larger width) to reduce, minimize, and / or prevent vibration of the transport vehicle. The movable platforms 146 may be arranged to slide and / or otherwise move within the first chamber 130 in one or more directions to allow access to each movable platform 146 through an opening toward the loading port 104. For example, the movable platforms 146 may be arranged to slide and / or otherwise move within the first chamber 130 in a vertical direction (e.g., up and down). As another example, the movable platform 146 may be arranged to slide horizontally (e.g., from side to side) and / or otherwise move within the first chamber 130. As another example, the movable platform 146 may be arranged to slide vertically (e.g., up and down) and horizontally (e.g., from side to side) and / or otherwise move within the first chamber 130. In these examples, all movable platforms 146 may move simultaneously together, or each movable platform 146 may move independently of the other movable platforms 146.

[0033] The docking device 108 may include a plurality of shuttle disks 148. Each movable platform 146 may include a corresponding reciprocating shuttle disk 148 and one or more latches 150. Each shuttle disk 148 may be arranged to receive and support a corresponding transport vehicle 112. Moreover, each shuttle disk 148 may slide or otherwise move in one or more directions to move the transport vehicle 112 toward and away from the sealing assembly 152 in the first chamber 130. For example, the shuttle disk 148 may slide and / or otherwise move relative to the associated movable platform 146 to extend toward the sealing assembly 152, and may slide and / or otherwise move relative to the associated movable platform 146 to retract from the sealing assembly 152.

[0034] One or more latches 150 included in the movable platform 146 may be attached, connected, and / or otherwise supported by the movable platform 146. The latches 150 may be arranged to extend away from the movable platform 146 and toward the movable frame 154, to which the sealing assembly 152 is attached, mounted, and / or otherwise supported. Furthermore, the latches 150 may be arranged to retract toward the movable platform 146 and away from the movable frame 154. When the latches 150 extend, they may be connected to the movable platform 146. This allows the movable platform 146 to move such that the movable frame 154 moves with it. In this way, the movable frame 154 can be a non-powered movable frame (e.g., a movable frame without a dedicated motor and / or drive mechanism for movement), which reduces the complexity of the movable frame 154. In addition, one or more latches 150 allow the movable platform 146 and the movable frame 154 to move synchronously.

[0035] The sealing assembly 152, included in the first chamber 130 of the docking device 108, may be arranged to reduce, minimize, and / or eliminate the possibility of exposure to contaminants that may be present in the example semiconductor processing environment 100 when transporting semiconductor wafers between the transport carrier 112 and the semiconductor processing tool 102. The sealing assembly 152 may be pressed against the movable frame 154 on one side (or front) facing the first chamber 130. One or more gaskets may be located between the sealing assembly 152 and the movable frame 154 to reduce, minimize, and / or prevent the passage of air (and air-entrained contaminants) between the sealing assembly 152 and the movable frame 154.

[0036] The sealing assembly 152 may include one or more portions arranged to form an airtight seal (e.g., a tight seal) around the transport vehicle 112 as it extends toward the sealing assembly 152 on the shuttle disk 148. For example, the shuttle disk 148 may allow the transport vehicle 112 to slide or otherwise move toward the sealing assembly 152 in the first chamber 130. As the transport vehicle 112 extends toward the sealing assembly 152, the sealing assembly 152 may retract around the transport vehicle 112 (e.g., around the body 114 of the transport vehicle 112) to form an airtight seal between the sealing assembly 152 and the transport vehicle 112.

[0037] One or more portions of the sealing assembly 152 may be positioned around an opening in the movable frame 154. As the transport carrier 112 extends toward the sealing assembly 152, a carrier door 116 of the transport carrier 112 may extend into and / or through the opening in the movable frame 154. This allows one or more portions of the sealing assembly 152 to retract around the body 114 of the transport carrier 112 (e.g., to form an airtight seal around the body 114 of the transport carrier 112), opposite the carrier door 116 of the transport carrier 112, which allows the carrier door 116 to be unloaded from the body 114 of the transport carrier 112.

[0038] In some embodiments, the sealing assembly 152 (or a portion thereof) is formed of a relatively soft material (e.g., softer than the material of the body 114 of the transport carrier 112) to allow an hermetic seal to be formed around the transport carrier 112. For example, the sealing assembly 152 (or a portion thereof) may be formed of a plastic material, a rubber material, a silicone material, or a similar material. In some embodiments, the sealing assembly 152 (or a portion thereof) includes a gasket, strip, or similar component formed of a relatively soft material, which is pressed against the body 114 of the transport carrier 112 to form an hermetic seal.

[0039] When an airtight seal is formed between the sealing assembly 152 and the transport carrier 112, the chamber door 138 can remove the carrier door 116 from the body 114 of the transport carrier 112. After the carrier door 116 is removed, the chamber door 138 can be opened from the main body 114 of the transport carrier 112. Figure 1 The transition from the closed position to the open position releases the hermetic seal between the spacer wall 134 and the chamber door 138. Here, the chamber door 138 (along with the removed carrier door 116) can be moved rearward from the spacer wall 134 toward the opening 126 and downward into the second chamber 132 (e.g., after moving rearward away from the spacer wall 134). In this way, the opening 136 in the spacer wall 134 is cleared, allowing the wafer transport tool 124 to enter the transport vehicle 112 (e.g., the body 114 of the transport vehicle 112) through the openings 136 and 126 in the spacer wall 134 while forming a hermetic seal around the transport vehicle 112 via the sealing assembly 152.

[0040] Before unloading the carrier door 116 from the body 114 of the transport carrier 112, the transport carrier 112 can be moved on the movable platform 146 to adjust its position. In this way, the movable platform 146 is movable to align the carrier door 116, the opening in the movable frame 154, and the opening 136 in the partition wall 134, so that the chamber door 138 can access the carrier door 116, thereby allowing the carrier door 116 to pass through the opening in the movable frame 154 and the opening 136 in the partition wall 134.

[0041] The movable frame 154 may be allowed to slide and / or otherwise move along the track assembly 156. The track assembly 156 may be mounted, connected, attached, and / or supported by the spacer 134. The track assembly 156 may include one or more tracks, one or more slide rails, one or more tubes, roller bearings, or similar structures that allow the movable frame 154 to slide and / or otherwise move in accordance with the movement of the movable platform 146. The track assembly 156 may include one or more elongated members extending parallel to the direction of travel of the movable frame 154. The length of the elongated members may be greater than the length of the movable frame 154 to allow the movable frame to move along the track assembly 156.

[0042] In some embodiments, the docking device 108 includes one or more sensors (e.g., proximity sensors, Hall effect sensors, or other types of sensors) arranged to detect and / or indicate whether the openings 116 and 136 in the carrier door 116 and movable frame 154 are aligned. In some embodiments, if the movable platform 146 is manually operated by an operator, one or more sensors display instructions to the operator (e.g., visual instructions, auditory instructions, or other types of instructions). In some embodiments, one or more sensors cause the movable platform 146 to automatically stop moving based on detecting or confirming the alignment between the openings 116 and 136 in the carrier door 116 and movable frame 154. In some embodiments, one or more sensors automatically provide signals, messages, or other types of instructions to the processor or controller of the docking device 108 based on detecting or confirming the alignment between the openings 116 and 136 in the carrier door 116 and movable frame 154, and the processor or controller causes the movable platform 146 to automatically stop moving based on the instructions.

[0043] After a hermetically sealed environment is formed around the transport carrier 112 via the sealing assembly 152, and after the chamber door 138 is opened, the wafer transport tool 124 can transport a semiconductor wafer between the transport carrier 112 and the semiconductor processing tool 102. For example, the wafer transport tool 124 can retrieve and / or take back a semiconductor wafer from the transport carrier 112 through opening 136 in the spacer wall 134, and can supply a semiconductor wafer to the semiconductor processing tool 102 through opening 128. As another example, the wafer transport tool 124 can retrieve a semiconductor wafer from the semiconductor processing tool 102 through opening 128, and can supply a semiconductor wafer to the transport carrier 112 through openings 126 in the spacer wall 134.

[0044] In this manner, with the transport carrier door 116 removed and the chamber door 138 in the open position, an hermetically sealed seal is formed between the body 114 of the transport carrier 112 and the sidewall where the opening 126 is located. Specifically, an hermetically sealed seal can be formed between the body 114 of the transport carrier 112 and the sealing assembly 152, between the sealing assembly 152 and the movable frame 154, between the movable frame 154 and the sidewall of the spacer wall 134, and between the spacer wall 134 and the top, bottom, and sidewalls of the first chamber 130 and the second chamber 132. This provides a hermetically sealed passage from the transport carrier 112 through the second chamber 132 to the opening 128. This hermetically sealed passage from the transport carrier 112 through the second chamber 132 to the opening 128 allows access to the transport carrier 112 without exposing the semiconductor wafer between the transport carrier 112 and the semiconductor processing tool 102 to contaminants in the example semiconductor processing environment 100.

[0045] As described above, it provides Figure 1 As an example. Other examples may be related to... Figure 1 The descriptions are different.

[0046] Figures 2A to 2F This is a diagram of an exemplary embodiment of a sealing assembly 152 used to form an airtight seal around a transport carrier 112 as described herein. Figure 2A Perspective views of example embodiments 210 and 220 of the sealing assembly 152 are illustrated, wherein the sealing assembly 152 comprises four parts: part 152a, part 152b, part 152c, and part 152d. Example embodiment 210 illustrates an example of the unfolded arrangement of the sealing assembly 152, wherein parts 152a, 152b, 152c, and 152d are not contracted around the body 114 of the transport carrier 112. In this arrangement, parts 152a, 152b, 152c, and 152d may be spaced apart from the body 114 of the transport carrier 112 by a distance that allows the door 140 and the body 114 of the transport carrier 112 to pass through an opening 212 formed by parts 152a, 152b, 152c, and 152d. The opening 212 may be referred to as an airflow / vacuum orifice.

[0047] like Figure 2A As further shown in example embodiment 220, the sealing assembly 152 can be transferred to a shrink arrangement, wherein portions 152a, 152b, 152c and 152d shrink around the body 114 of the transport carrier 112 to form an airtight seal around the transport carrier 112.

[0048] Figure 2BA front view of example embodiment 230 is shown, illustrating first positions 240 of portions 152a, 152b, 152c, and 152d, and second positions 250 of portions 152a, 152b, 152c, and 152d. The first positions 240 may correspond to... Figure 2A The unfolded arrangement illustrated in example implementation 210, the second position 250 can correspond to Figure 2A The shrinkage arrangement is illustrated in example implementation 220.

[0049] like Figure 2B As shown, in some embodiments, portions 152a, 152b, 152c, and 152d may each transfer between a first position 240 and a second position 250. For example, portion 152a may move downward from the first position 240 to the second position 250 and upward from the second position 250 to the first position 240. As another example, portion 152b may move upward from the first position 240 to the second position 250 and downward from the second position 250 to the first position 240. As another example, portions 152c and 152d may each move inward from the first position 240 to the second position 250 and outward from the second position 250 to the first position 240. In some embodiments, one or more of portions 152a, 152b, 152c, or 152d transfer between the first position 240 and the second position 250 in a non-linear travel path. In some implementations, one or more of portions 152a, 152b, 152c, or 152d are transferred between a first position 240 and a second position 250 in a nonlinear travel path.

[0050] like Figure 2B As further shown, in example embodiment 230, portion 152a may cover a first portion of the top of the transport carrier 112, a first portion of the first side of the transport carrier 112, and a first portion of the second side of the transport carrier 112 opposite to the first side. Portion 152b may cover a first portion of the bottom of the transport carrier 112, a second portion of the first side of the transport carrier 112, and a second portion of the second side of the transport carrier 112. Portion 152c may cover a second portion of the top of the transport carrier 112, a third portion of the first side of the transport carrier 112, and a second portion of the bottom of the transport carrier 112. Portion 152d may cover a third portion of the top of the transport carrier 112, a third portion of the first side of the transport carrier 112, and a third portion of the bottom of the transport carrier 112.

[0051] A first portion of the top covered by portion 152a, a second portion of the top covered by portion 152c, and a third portion of the top covered by portion 152d can surround substantially the entire top of the transport vehicle 112. A first portion of the bottom covered by portion 152b, a second portion of the bottom covered by portion 152c, and a third portion of the top covered by portion 152d can surround substantially the entire bottom of the transport vehicle 112. A first portion of the first side covered by portion 152a, a second portion of the first side covered by portion 152b, and a third portion of the first side covered by portion 152c can substantially surround the entire first side 112 of the transport vehicle. A first portion of the second side covered by portion 152a, a second portion of the second side covered by portion 152b, and a third portion of the second side covered by portion 152d can surround substantially the entire second side of the transport vehicle 112. Other example embodiments of the sealing assembly 152 with four portions can be used with the docking device 108.

[0052] Figure 2C A front view of example embodiment 260 is shown. In example embodiment 260, the sealing assembly 152 includes multiple portions: portion 152a and a second portion 152b. Portion 152a may cover substantially the entire top of transport carrier 112, a first portion of a first side of transport carrier 112, and a first portion of a second side of transport carrier 112 opposite to the first side. Portion 152b may cover substantially the entire bottom of transport carrier 112, a second portion of the first side of transport carrier 112, and a second portion of the second side of transport carrier 112. The first portion of the first side covered by portion 152a and the second portion of the first side covered by portion 152b may substantially surround the entire first side of transport carrier 112. The first portion of the second side covered by portion 152a and the second portion of the second side covered by portion 152b may surround substantially the entire second side of transport carrier 112.

[0053] Figure 2DA front view of example embodiment 270 is shown. In example embodiment 270, the sealing assembly 152 includes multiple portions: portion 152a and a second portion 152b. Portion 152a may cover substantially the entire first side of the transport carrier 112, a first portion of the top of the transport carrier 112, and a first portion of the bottom of the transport carrier 112. Portion 152b may cover substantially the entire second side of the transport carrier 112 opposite the first side, a second portion of the top of the transport carrier 112, and a second portion of the bottom of the transport carrier 112. The first portion of the top covered by portion 152a and the second portion of the top covered by portion 152b may surround substantially the entire top of the transport carrier 112. The first portion of the bottom covered by portion 152a and the second portion of the bottom covered by portion 152b may surround substantially the entire bottom of the transport carrier 112.

[0054] Figure 2E A front view of example embodiment 280 is shown. In example embodiment 280, the sealing assembly 152 includes multiple parts: part 152a and part 152b. Figure 2E As shown, in example embodiment 280, portion 152a may cover substantially the entire top of transport carrier 112 and substantially the entire first side of transport carrier 112. Portion 152b may cover substantially the entire bottom of transport carrier 112 and substantially the entire second side of transport carrier 112 opposite the first side. Other example embodiments of the sealing assembly 152 having four portions may be used with docking device 108.

[0055] Figure 2F A front view of example embodiment 290 is shown. In example embodiment 290, the sealing assembly 152 includes multiple portions: portion 152a, portion 152b, and portion 152c. Portion 152a may cover a first portion of the top of the transport carrier 112 and substantially the entire first side of the transport carrier 112. Portion 152b may cover a second portion of the top side of the transport carrier 112 and substantially the entire second side of the transport carrier 112 opposite the first side. Portion 152c may cover the entire bottom of the transport carrier 112. Other example embodiments of the sealing assembly 152 having three portions may be used with the docking device 108.

[0056] As described above, it provides Figures 2A-2F As an example. Other examples may be related to... Figures 2A-2F The descriptions differ. In some embodiments, the sealing assembly 152 may include five or more parts with various arrangements that differ from those described herein.

[0057] Figure 3 This is what this article describes Figure 1 A diagram of part 300 of an example semiconductor processing environment 100. (See diagram 300.) Figure 3 As shown, part 300 may include a partition wall 134, a chamber door 138, a movable platform 146, a shuttle disk 148, one or more latches 150, a sealing assembly 152, a movable frame 154, and a track assembly 156.

[0058] The partition wall 134 may include an elongated body having an opening 136 therein. The track assembly 156 may be attached, connected, and / or otherwise mounted to one side of the elongated body of the partition wall 134. A movable frame 154 may be mounted to and / or connected to the track assembly 156. The movable frame 154 may include a generally planar body that allows the movable frame 154 to move along the track assembly 156, which is generally parallel to the elongated body of the partition wall 134.

[0059] The sealing assembly 152 may include multiple portions, such as portions 152a, 152b, 152c, and 152d. The sealing assembly 152 (or portions thereof) may be attached, connected, and / or otherwise mounted to one side of the elongated body of the movable frame 154, for example, one side of the elongated body of the movable frame 154 opposite the other side facing and / or towards the spacer wall 134. The sealing assembly 152 may be attached, connected, and / or otherwise mounted to the movable frame 154 in a manner that allows its portions to expand and contract between a first position 240 and a second position 250 to form or release an airtight seal around the transport carrier 112.

[0060] The main body 114 of the transport carrier 112 can be positioned on a shuttle disk 148 above the movable platform 146. One or more latches 150 of the movable platform 146 can extend away from the movable platform 146 and toward the movable frame 154. The one or more latches 150 include one or more plates, hooks, pins, or other structures connected to one or more connectors 302 on the movable frame 154. With one or more latches 150 connected to one or more connectors 302, movement of the movable platform 146 can cause the movable frame 154 to move along the track assembly 156.

[0061] like Figure 3As further shown, portion 300 may include a chamber door 138. Chamber door 138 may include an elongated body generally parallel to the elongated body of the partition wall 134. Furthermore, chamber door 138 may include a mounting plate 304 attached, connected, and / or otherwise mounted to a support structure 306. Support structure 306 may be attached, connected, and / or otherwise mounted to the elongated body of chamber door 138. Mounting plate 304 and support structure 306 may be attached, connected, and / or otherwise mounted to a side of the elongated body of chamber door 138 facing the partition wall 134. In this way, mounting plate 304 faces the opening 136 in the partition wall 134. Specifically, mounting plate 304 and support structure 306 may be mounted to a side of chamber door 138 facing the partition wall 134, which is opposite to a side of the track assembly 156, movable frame 154, and sealing assembly 152 mounted on the partition wall 134.

[0062] Mounting plate 304 may be arranged to detach carrier door 116 from the body 114 of transport carrier 112. Mounting plate 304 may be arranged to secure and / or support carrier door 116 when chamber door 138 is transferred between a closed position and an open position. Mounting plate 304 may be arranged to place carrier door 116 on the body 114 of transport carrier 112. Mounting plate 304 may include one or more vacuum holes 308 and one or more latching keys 310. Vacuum holes 308 may be connected to pipes, piping fixtures, and / or one or more other components that allow air to pass through vacuum holes 308 to create a negative pressure on the surface of mounting plate 304 adjacent to vacuum holes 308. The negative pressure may create a suction or vacuum seal between mounting plate 304 and carrier door 116. Mounting plate 304 may secure and / or support carrier door 116 based on the negative pressure generated through vacuum holes 308.

[0063] A latch key 310 may be arranged to unlock the carrier door 116 from the body 114 of the transport carrier 112. For example, the latch key 310 may include a key, an elongated member, or other components arranged to open a latch and / or lock on the carrier door 116. In some embodiments, the mounting plate 304 includes a single latch key 310 (e.g., on one side of the mounting plate 304 or generally near the center of the mounting plate 304). In some embodiments, the mounting plate 304 includes a plurality of latch keys 310 generally near one or more edges of the mounting plate 304.

[0064] The support structure 306 may include a crane (e.g., a scissor crane, hydraulic crane, pneumatic crane, or other type of crane), a screw mechanism, a track system, or other type of structure arranged such that the mounting plate 304 extends away from the elongated body of the chamber door 138 and retracts toward the elongated body of the chamber door 138. In this way, the support structure 306 can extend the mounting plate 304 toward the carrier door 116 to unload the carrier door 116 from the transport carrier 112, retract the mounting plate 304 after unloading the carrier door 116 so that the chamber door 138 can be moved to an open position, and extend the mounting plate 304 toward the transport carrier 112 to place the carrier door 116 onto the transport carrier 112.

[0065] As described above, with Figure 3 For example. Other examples may be related to... Figure 3 The descriptions are different.

[0066] Figure 4A-4K This is a diagram of one or more example embodiments 400 described herein. Example embodiments 400 may include one or more example embodiments illustrating various steps of the docking device 108 and other tools included in the example semiconductor processing environment 100. Figure 4A As shown, the transport vehicle 112 can be placed on the shuttle platform 110 of the loading port 104. For example, a transport robot, OHT, or other transport vehicle can place the transport vehicle 112 on the shuttle platform 110.

[0067] like Figure 4B As shown, a door 140 on one side of the first chamber 130 can be opened to provide access to the docking device 108 through an opening 402 in the first chamber 130. Figure 4B As further shown, the movable platform 146 can be moved (e.g., moved downward in the first chamber 130) to align the empty movable platform 146 with the opening 402 in preparation for placing the transport vehicle 112 on the shuttle platform 110 onto the empty movable platform 146.

[0068] like Figure 4C As shown, the shuttle platform 110 is slidable or movable toward the opening 402 in the first chamber 130, such that the transport vehicle 112 is fully embedded in the first chamber 130 through the opening 402 and placed on the empty movable platform 146. Specifically, the transport vehicle 112 can be placed on the shuttle disc 148 of the empty movable platform 146. In some embodiments, after the transport vehicle 112 is placed on the empty movable platform 146, the door 140 can be moved to close the opening 402. In some embodiments, the door 140 can be held in place such that the opening 402 remains clear after the transport vehicle 112 is placed on the empty movable platform 146.

[0069] like Figure 4D As shown, the movable platform 146 is movable (e.g., upward in the first chamber 130) to align the transport carrier 112 with the openings in the sealing assembly 152 and / or the movable frame 154, in preparation for the wafer transport tool 124 to enter the transport carrier 112.

[0070] like Figure 4E As shown, the transport carrier 112 is aligned with the opening in the sealing assembly 152 and / or the movable frame 154, the shuttle disk 148 is slidable toward the sealing assembly 152 or otherwise extended so that the carrier door 116 is placed at least partially through the opening in the movable frame 154, and a portion of the sealing assembly 152 surrounds the body 114 of the transport carrier 112.

[0071] Furthermore, one or more latches 150 of the movable platform 146 on which the transport carrier 112 is positioned may extend away from the movable platform 146 and toward the movable frame 154. One or more latches 150 may be connected to one or more connectors 302 of the movable frame 154 to allow movement of the movable platform 146 such that the movable frame 154 moves synchronously with the movable platform 146.

[0072] With portions of the sealing assembly 152 surrounding portions of the body 114, the sealing assembly 152 can retract around the transport carrier 112 to form an hermetically tight seal around the body 114 of the transport carrier 112. Specifically, the hermetically tight seal can be formed between the sealing assembly 152 and the transport carrier 112. In this way, the area surrounding the transport carrier 112 is sealed to reduce, minimize, and / or eliminate contaminants entering the second chamber 132 from the example semiconductor processing environment 100 through openings in the movable frame 154 and openings 136 in the spacer wall 134. Portions of the sealing assembly 152 can be moved from a first position 240 (e.g., corresponding to an expanded arrangement) to a second position 250 (e.g., corresponding to a retracted arrangement) to form an hermetically tight seal around the body 114 of the transport carrier 112.

[0073] like Figure 4FAs shown, a hermetically sealed seal is formed around the transport carrier 112 via the sealing assembly 152, and the chamber door 138 allows the carrier door 116 to be removed from the transport carrier 112. For example, the support structure 306 allows the mounting plate 304 to extend toward the carrier door 116 through an opening 136 in the partition wall 134. One or more latch keys 310 on the mounting plate 304 can unlock the carrier door 116 from the body 114 of the transport carrier 112. A vacuum hole 308 on the mounting plate 304 can form a vacuum seal between the carrier door 116 and the mounting plate 304. With the vacuum seal formed, the support structure 306 allows the mounting plate 304 (on which supports and / or secures the carrier door 116) to retract toward the chamber door 138.

[0074] like Figure 4F As further shown, the chamber door 138 can slide and / or otherwise move rearward away from the partition wall 134 and toward the opening 126, which eliminates the airtight seal between the partition wall 134 and the chamber door 138. Specifically, after the carrier door 116 is unloaded from the transport carrier 112 and the mounting plate 304 is retracted toward the chamber door 138, the chamber door 138 can slide and / or otherwise move rearward away from the partition wall 134 and toward the opening 126. The chamber door 138 can slide and / or otherwise move rearward away from the partition wall 134 a sufficient distance to allow the carrier door 116 to cross the partition wall 134 when the chamber door 138 slides and / or otherwise moves downward into the second chamber 132.

[0075] like Figure 4G As shown, the chamber door 138 is slidable and / or otherwise clears the path of the opening 136 in the spacer wall 134, thereby allowing the wafer transport tool 124 to enter the transport carrier 112 through the opening 136 in the spacer wall 134. In some embodiments, the chamber door 138 slides and / or otherwise moves downward within the second chamber 132. In some embodiments, the chamber door 138 slides and / or otherwise moves upward within the second chamber 132. In some embodiments, the chamber door 138 slides and / or otherwise moves to one side within the second chamber 132. In some embodiments, the chamber door 138 slides and / or otherwise moves within the second chamber 132 in a combination of directions.

[0076] like Figure 4H As shown, the wafer transport tool 124 of the interface tool 106 can retrieve and / or obtain the wafer 404 from the transport carrier 112 through openings 136 and 126 in the spacer wall 134. In this way, the wafer transport tool 124 retrieves and / or obtains the wafer 404 from the transport carrier 112 while forming an hermetically sealed environment around the transport carrier 112 via the sealing assembly 152. Figure 4IAs shown, the wafer transport tool 124 can allow the wafer 404 to pass through the opening 136 in the spacer wall 134 and retract into the chamber 118 of the interface tool 106 through the opening 126. Figure 4J As shown, the wafer transport vehicle 124 can provide the wafer 404 to the semiconductor processing tool 102 through the opening 128. The wafer 404 can be processed by the semiconductor processing tool 102 through one or more semiconductor processing steps. The above steps can be performed in reverse order to place the wafer 404 back into the transport carrier 112.

[0077] like Figure 4K As shown, the movable platform 146 can move within the first chamber 130 while simultaneously removing the carrier door 116 of the transport carrier 112. This allows other transport carriers 112 to be removed from the first chamber 130 and / or added to the first chamber 130 while the semiconductor processing tool 102 is processing the semiconductor wafer on the transport carrier 112. This can further improve the efficiency and throughput of the semiconductor processing tool 102 and / or the efficiency and throughput of the docking device 108, because the docking device 108 can continue loading and unloading without stopping the production output of the semiconductor processing tool 102.

[0078] As described above, it provides Figure 4A-4K As an example. Other examples may be related to... Figure 4A-4K The descriptions are different.

[0079] Figure 5 This is a diagram of example components of device 500. In some embodiments, one or more devices and / or tools of the example semiconductor processing environment 100 (e.g., semiconductor processing tool 102, loading port 104, interface tool 106, and / or multi-carrier docking device 108) may include one or more devices 500 and / or one or more components of device 500. Figure 5 As shown, device 500 may include bus 510, processor 520, memory 530, storage component 540, input component 550, output component 560 and communication component 570.

[0080] Bus 510 includes components enabling wired and / or wireless communication between components of device 500. Processor 520 includes a central processing unit, graphics processor, microprocessor, controller, microcontroller, digital signal processor, field-programmable gate array, application-specific integrated circuit, and / or other types of processing components. Processor 520 is implemented in hardware, firmware, or a combination of hardware and software. In some embodiments, processor 520 includes one or more processors that can be programmed to perform functions. Memory 530 includes random access memory, read-only memory, and / or other types of memory (e.g., flash memory, magnetic memory, and / or optical memory).

[0081] Storage component 540 stores information and / or software related to the operation of device 500. For example, storage component 540 may include hard disk drives, disk drives, optical disk drives, solid-state drives, optical disks, digital versatile optical disks, and / or other types of non-transitory computer-readable media. Input component 550 enables device 500 to receive input, such as user input and / or sensory input. For example, input component 550 may include touchscreens, keyboards, keypads, mice, buttons, microphones, switches, sensors, GPS components, accelerometers, gyroscopes, and / or actuators. Output component 560 enables device 500 to provide output, for example, via a display, speakers, and / or one or more light-emitting diodes. Communication component 570 enables device 500 to communicate with other devices, for example, via wired and / or wireless connections. For example, communication component 570 may include receivers, transmitters, transceivers, modems, network interface cards, and / or antennas.

[0082] Device 500 may perform one or more of the processing procedures described herein. For example, non-transitory computer-readable media (e.g., memory 530 and / or storage component 540) may store a set of instructions (e.g., one or more instructions, code, software code, and / or program code) for execution by processor 520. Processor 520 may execute a set of instructions to perform one or more of the processing procedures described herein. In some embodiments, the set of instructions executed by one or more processors 520 causes one or more processors 520 and / or device 500 to perform one or more of the processing procedures described herein. In some embodiments, wired circuitry may be used instead of or in combination with instructions to perform one or more of the processing procedures described herein. Therefore, the embodiments described herein are not limited to any particular combination of hardware circuitry and software.

[0083] Figure 5 The number and settings of the components shown are provided as an example. Figure 5 Compared to the device shown, device 500 may include additional components, fewer components, different components, or components with different configurations. Alternatively, a group of components of device 500 (e.g., one or more components) may perform one or more functions described as being performed by other groups of components of device 500.

[0084] Figure 6 A flowchart relating to an example processing procedure 600 related to entry into a transport vehicle. In some implementations, Figure 6 One or more processing frames may be performed by a multi-carrier docking device (e.g., multi-carrier docking device 108). In some embodiments, Figure 6One or more processing frames may be performed by other devices or a group of devices that are separate from or include the multi-carrier docking device, such as semiconductor processing tool 102, loading port 104, interface tool 106, and / or other devices. Alternatively or alternatively, Figure 6 One or more processing blocks may be executed by one or more components of device 500, such as processor 520, memory 530, storage component 540, input component 550, output component 560 and / or communication component 570.

[0085] like Figure 6 As shown, the process 600 may include placing the transport vehicle on a movable platform of a plurality of movable platforms included in a first chamber of a multi-transport vehicle docking device (block 610). For example, as described above, loading port 104 (e.g., using shuttle platform 110) can position the transport vehicle 112 on a movable platform 146 of a plurality of movable platforms 146 included in a first chamber 130 of a multi-transport vehicle docking device 108.

[0086] like Figure 6 As further shown, the process 600 may include contracting the sealing assembly of the multi-carrier docking device around the carrier to form an airtight seal around the carrier (box 620). For example, as described above, the multi-carrier docking device 108 may contract the sealing assembly 152 of the multi-carrier docking device 108 around the carrier 112 to form an airtight seal around the carrier 112.

[0087] like Figure 6 As further shown, the process 600 may include: after forming an airtight seal around the transport vehicle, removing the carrier door of the transport vehicle and opening the chamber door of the multi-carrier docking device, thereby allowing entry into the transport vehicle through the opening in the partition wall between the first and second chambers of the multi-carrier docking device (box 630). For example, as described above, after the multi-carrier docking device 108 forms an airtight seal around the transport vehicle 112, the carrier door 116 of the transport vehicle 112 can be removed, and the chamber door 138 of the multi-carrier docking device 108 can be opened to allow entry into the transport vehicle 112 through the opening 136 in the partition wall 134 between the first chamber 130 and the second chamber 132 of the multi-carrier docking device 108.

[0088] like Figure 6As further shown, the process 600 may include using a wafer transport tool with a multi-carrier docking device to enter the transport carrier, while an hermetically sealed surrounds the transport carrier (box 640). For example, as described above, when the hermetically sealed surrounds the transport carrier 112, the interface tool 106 may use a wafer transport tool 124 associated with the multi-carrier docking device 108 to enter the transport carrier 112.

[0089] Process 600 may include additional implementations, such as any single implementation or any combination of implementations of one or more other processes described below and / or in conjunction with those described elsewhere in this document.

[0090] In a first embodiment, entering the transport carrier 112 includes: retrieving the wafer 404 from the transport carrier 112 through the opening 136 and the second chamber 132 while an hermetically sealed environment surrounds the transport carrier 112, and providing the wafer 404 to the semiconductor processing tool 102. In a second embodiment, alone or in combination with the first embodiment, the processing 600 includes sliding the transport carrier 112 toward the sealing assembly 152 using a shuttle disk 148 on a movable platform 146, and contracting the sealing assembly 152 around the transport carrier 112 to form a hermetically sealed environment surrounding the transport carrier 112, including contracting the sealing assembly 152 around the transport carrier 112 to form a hermetically sealed environment surrounding the transport carrier 112 after sliding the transport carrier 112 toward the sealing assembly 152.

[0091] In a third embodiment, alone or in combination with one or more of the first and second embodiments, process 600 includes extending the latch 150 of the movable platform 146 toward the movable frame 154 on which the sealing assembly 152 is mounted, inserting the latch 150 into a connector 302 on the movable frame 154, and moving the movable platform 146 while inserting the latch 150 into the connector 302. In a fourth embodiment, alone or in combination with one or more of the first to third embodiments, moving the movable platform 146 while inserting the latch 150 into the connector 302 causes the movable frame 154 to move together with the movable platform 146.

[0092] In a fifth embodiment, either alone or in combination with one or more of the first to fourth embodiments, moving the movable platform 146 while inserting the latch 150 into the connector 302 includes moving the movable platform 146 while inserting the latch 150 into the connector 302 to orient the transport carrier 112 in front of the opening 136 in the spacer wall 134. In a sixth embodiment, either alone or in combination with one or more of the first to fifth embodiments, removing the carrier door 116 of the transport carrier 112 includes: pressing the mounting plate 304, attaching it to the chamber door 138, resting it against the carrier door 116, unlocking the carrier door 116 from the body 114 of the transport carrier 112 using a latch key 310 included on the mounting plate 304, forming a vacuum seal between the mounting plate 304 and the carrier door 116, and retracting the mounting plate 304 toward the chamber door 138 when the vacuum seal is formed between the mounting plate 304 and the carrier door 116.

[0093] although Figure 6 The example block for process 600 is shown, but in some implementations, it differs from... Figure 6 Compared to those described herein, process 600 may include additional boxes, fewer boxes, different boxes, or boxes arranged differently. Alternatively, two or more boxes of process 600 may be executed in parallel.

[0094] Figure 7 This is a flowchart of an example processing procedure 700 related to entry into the transport vehicle. In some embodiments, Figure 7 One or more processing frames may be performed by a multi-carrier docking device (e.g., multi-carrier docking device 108). In some embodiments, Figure 7 One or more processing frames may be performed by other devices or a group of devices that are separate from or include the multi-carrier docking device, such as semiconductor processing tool 102, loading port 104, interface tool 106, and / or other devices. Alternatively or alternatively, Figure 7 One or more processing blocks may be executed by one or more components of device 500, such as processor 520, memory 530, storage component 540, input component 550, output component 560 and / or communication component 570.

[0095] like Figure 7 As shown, process 700 may include retrieving a wafer from a semiconductor processing tool using a wafer transport vehicle (box 710). For example, as described above, an interface tool may use wafer transport vehicle 124 to retrieve wafer 404 from semiconductor processing tool 102.

[0096] like Figure 7As further shown, the process 700 may include: using a wafer transport tool to provide a wafer to a transport carrier on one of a plurality of movable platforms located in the first chamber of the multi-transport carrier docking apparatus, while forming a first hermetic seal around the transport carrier via a sealing assembly of the multi-transport carrier docking apparatus (box 720). For example, as described above, the interface tool 106 may use a wafer transport tool 124 to provide a wafer 404 to a transport carrier 112 positioned on one of a plurality of movable platforms 146 included in the first chamber 130 of the multi-transport carrier docking apparatus 108, while forming a first hermetic seal around the transport carrier 112 via a sealing assembly 152 of the multi-transport carrier docking apparatus 108.

[0097] like Figure 7 As further shown, the process 700 may include placing a carrier door on the transport vehicle (box 730) when the first hermetic seal surrounds the front portion of the transport vehicle. For example, as described above, when the first hermetic seal surrounds the front portion of the transport vehicle, the multi-transport vehicle docking device 108 may place a carrier door 116 (e.g., using a chamber door 138) on the transport vehicle 112.

[0098] like Figure 7 As further shown, the process 700 may include abutting a chamber door against a partition wall between the first and second chambers of the multi-carrier docking device to close an opening in the partition wall and form a second airtight seal between the chamber door and the partition wall (frame 740). For example, as described above, the multi-carrier docking device 108 may abut a chamber door 138 against a partition wall 134 between the first chamber 130 and the second chamber 132 of the multi-carrier docking device 108 to close an opening 136 in the partition wall 134 and form a second airtight seal between the chamber door 138 and the partition wall 134.

[0099] like Figure 7 As further shown, the process 700 may include retracting the sealing assembly to eliminate the first hermetic seal surrounding the transport vehicle after the formation of the second hermetic seal (box 750). For example, as described above, after the formation of the second hermetic seal, the multi-transport vehicle docking device 108 may retract the sealing assembly 152 to eliminate the first hermetic seal surrounding the transport vehicle 112.

[0100] Process 700 may include additional implementations, such as any single implementation or any combination of implementations of one or more other processes described below and / or in conjunction with those described elsewhere in this document.

[0101] In a first embodiment, process 700 includes moving a plurality of movable platforms 146 within a first chamber 130 such that another transport carrier 112 on another movable platform 146 of the plurality of movable platforms 146 is positioned in front of an opening 136 in a spacer wall 134, causing a sealing assembly 152 to contract around the other transport carrier 112 to form a third hermetic seal around the other transport carrier 112, after the third hermetic seal is formed around the other transport carrier 112, removing another carrier door 116 of the other transport carrier 112 and opening a chamber door 138 to eliminate a second hermetic seal to allow entry into the other transport carrier 112 through the opening 136 in the spacer wall 134, and using a wafer transport tool 124 to enter the other transport carrier 112 when the third hermetic seal is around the other transport carrier 112.

[0102] although Figure 7 The example box showing process 700 is shown, but in some implementations, it is different from... Figure 7 Compared to those described herein, process 700 may include additional frames, fewer frames, different frames, or frames arranged differently. Alternatively, two or more frames of process 700 may be executed in parallel.

[0103] In this manner, a multi-carrier docking device can be positioned between the loading port and the interface tool to reduce and / or minimize cross-contamination of semiconductor wafers transported between the loading port and the associated semiconductor processing tool. The multi-carrier docking device can store and / or arrange multiple transport carriers within its chamber, and a hermetically sealed environment can be formed around the transport carriers within the chamber. The transport tool can retrieve the semiconductor wafers from the transport carriers, while the hermetically sealed environment around the transport carriers prevents and / or reduces the likelihood of contaminants from the semiconductor manufacturing equipment coming into contact with the semiconductor wafers. This hermetically sealed environment around the transport carriers can reduce semiconductor wafer defects caused by contaminants, improve manufacturing yield and quality in semiconductor manufacturing plants, and / or allow for continuous reduction in the size of integrated circuits and / or semiconductor components and / or parts formed on semiconductor wafers.

[0104] As described in more detail above, some embodiments described herein provide a multi-carrier docking device. The multi-carrier docking device includes a first chamber configured to store a plurality of carriers. The multi-carrier docking device includes a second chamber. The multi-carrier docking device includes a partition wall between the first and second chambers, wherein the partition wall includes an opening between the first and second chambers. The multi-carrier docking device includes a chamber door arranged to abut against the partition wall and form an airtight seal around the opening.

[0105] As described in more detail above, some embodiments described herein provide a method for a multi-carrier docking apparatus. The method includes placing a transport carrier on a movable platform of a plurality of movable platforms included in a first chamber of the multi-carrier docking apparatus. The method includes contracting a sealing assembly of the multi-carrier docking apparatus around the transport carrier to form an hermetically sealed area around the transport carrier. The method includes, after forming the hermetically sealed area around the transport carrier, removing a carrier door of the transport carrier and opening a chamber door of the multi-carrier docking apparatus to allow entry of the transport carrier through an opening in a spacer wall between the first and second chambers of the multi-carrier docking apparatus. The method includes using a wafer transport tool associated with the multi-carrier docking apparatus to enter the transport carrier while the hermetically sealed area is around the transport carrier.

[0106] As described in more detail above, some embodiments described herein provide a multi-carrier docking device. The multi-carrier docking device includes a first chamber arranged to hold a plurality of transport vehicles. The multi-carrier docking device includes a second chamber adjacent to the first chamber. The multi-carrier docking device includes a partition wall between the first and second chambers, wherein the partition wall includes an opening between the first and second chambers. The multi-carrier docking device includes a chamber door in the second chamber, the chamber door being arranged to abut against the partition wall and form a first hermetic seal around the opening. The multi-carrier docking device includes a sealing assembly included in the first chamber, the sealing assembly being arranged to form a second hermetic seal between the first chamber and the transport vehicles in the first chamber.

[0107] As described in more detail above, some embodiments described herein provide a method for a multi-carrier docking apparatus. The method includes retrieving a wafer from a semiconductor processing tool using a wafer transport tool. The method includes providing the wafer to a transport carrier using the wafer transport tool, the transport carrier being positioned on a movable platform of a plurality of movable platforms included in a first chamber of the multi-carrier docking apparatus, while a first hermetic seal is formed around the transport carrier via a sealing assembly of the multi-carrier docking apparatus. The method includes placing a carrier door on the transport carrier while the first hermetic seal surrounds a front portion of the transport carrier. The method includes abutting the chamber door against a spacer wall between the first and second chambers of the multi-carrier docking apparatus to close an opening in the spacer wall and forming a second hermetic seal between the chamber door and the spacer wall. The method includes retracting the sealing assembly after forming the second hermetic seal to eliminate the first hermetic seal around the transport carrier.

[0108] The features of several embodiments have been summarized above to enable those skilled in the art to better understand aspects of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to implement the same purposes as the embodiments introduced herein and / or to achieve the same advantages as the embodiments introduced herein. Those skilled in the art should also recognize that these equivalent constructions should not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made to this document without departing from the spirit and scope of this disclosure.

[0109] Symbol Explanation

[0110] 100: Example Semiconductor Processing Environment

[0111] 102: Semiconductor Processing Tools

[0112] 104: Loading Port

[0113] 106: Interface Tools

[0114] 108: Docking device

[0115] 110: Shuttle Platform

[0116] 112: Transport vehicle

[0117] 114: Main Body

[0118] 116: Carrier Gate

[0119] 118: Chamber

[0120] 120: Filter

[0121] 122: Exhaust port

[0122] 124: Chip Transport Vehicle

[0123] 126: Opening

[0124] 128: Opening

[0125] 130: First Chamber

[0126] 132: Second Chamber

[0127] 134: partition wall

[0128] 136: Opening

[0129] 138: Chamber door

[0130] 140: Door

[0131] 142: Filter

[0132] 144: Exhaust port

[0133] 146: Mobile Platform

[0134] 148: Shuttle Disc

[0135] 150: Latch

[0136] 152: Sealing assembly

[0137] 152a: Sealing assembly section

[0138] 152b: Sealing assembly section

[0139] 152c: Sealing assembly section

[0140] 152d: Sealing assembly section

[0141] 154: Movable Frame

[0142] 156: Orbital Group

[0143] 210: Example Implementation Plan

[0144] 220: Example Implementation Plan

[0145] 230: Example Implementation Plan

[0146] 240: First position

[0147] 250: Second position

[0148] 260: Example Implementation Plan

[0149] 270: Example Implementation Plan

[0150] 280: Example Implementation Plan

[0151] 290: Example Implementation Plan

[0152] 300: Example Semiconductor Processing Environment (Part 1)

[0153] 302: Connector

[0154] 304: Mounting plate

[0155] 306: Supporting structure

[0156] 308: Vacuum port

[0157] 310: Latch key

[0158] 400: Sample Implementation Plan

[0159] 500: Equipment

[0160] 510: Bus

[0161] 520: Processor

[0162] 530: Memory

[0163] 540: Storage Component

[0164] 550: Input component

[0165] 560: Output Component

[0166] 570: Communication Components

[0167] 600: Processing Procedure

[0168] 610: Step Box

[0169] 620: Step Box

[0170] 630: Step Box

[0171] 640: Step Box

[0172] 700: Processing Procedure

[0173] 710: Step Box

[0174] 720: Step Box

[0175] 730: Step Box

[0176] 740: Step box.

Claims

1. A multi-transport carrier docking device, comprising: The first chamber was arranged to store multiple transport vehicles; Second chamber; A partition wall located between the first chamber and the second chamber; The partition wall includes an opening between the first chamber and the second chamber; A chamber door, included in the second chamber, the chamber door being arranged to form a first airtight seal against the partition wall and surrounding the opening; A sealing assembly included in the first chamber, the sealing assembly being arranged to form a second hermetically tight seal between the first chamber and the transport carrier within the first chamber; The track assembly, which is included in the first chamber and mounted on the partition wall; and A movable frame, which is included in the first chamber and mounted on the track assembly, The movable frame is arranged to slide along the track assembly, and The sealing assembly is mounted on the movable frame. The sealing assembly includes multiple portions arranged to move from a first position to a second position to form a second airtight seal around the transport vehicle, wherein the multiple portions of the sealing assembly are separated from each other in the first position and connected to each other in the second position.

2. The multi-carrier docking device according to claim 1, wherein the opening is a first opening; in, The first chamber includes a second opening located in a side wall of the first chamber, the second opening being arranged to face the loading port; and The second chamber includes a third opening that is arranged toward the wafer transport vehicle.

3. The multi-carrier docking device according to claim 1, wherein the chamber door is arranged to unload the carrier door from the first chamber, while forming a second airtight seal around the carrier between the carrier and the first chamber.

4. The multi-carrier docking apparatus of claim 3, wherein the chamber door is arranged to move after the carrier door is removed from the carrier to allow a wafer transport tool to enter the carrier through the opening and the second chamber.

5. The multi-carrier docking apparatus of claim 3, wherein the chamber door is arranged to move toward another opening in the second chamber between the second chamber and the wafer transporter after the carrier door is unloaded from the transport carrier, and to move downward in the second chamber.

6. The multi-transport vehicle docking device according to claim 1, wherein the first chamber includes a plurality of movable platforms, each of the plurality of movable platforms being arranged to support a corresponding transport vehicle.

7. The multi-carrier docking device according to claim 6, wherein the first chamber comprises a plurality of shuttle disks; in, Each of the plurality of shuttle disks is included on a corresponding movable platform among the plurality of movable platforms; and Each of the plurality of shuttle discs is arranged to support a corresponding transport vehicle.

8. The multi-carrier docking device according to claim 1, wherein when the plurality of portions of the sealing assembly are moved to the second position, the carrier door of the transport carrier is located between the sealing assembly and the chamber door.

9. The multi-carrier docking apparatus of claim 1, wherein the sealing assembly is arranged to form a second airtight seal between the first chamber and the transport vehicle during a period when the carrier door of the transport vehicle is removed and the chamber door is allowed to enter the transport vehicle through the opening, and to maintain the second airtight seal during the period to isolate communication between the first chamber and the second chamber.

10. The multi-carrier docking device according to claim 1, wherein the movable frame comprises a non-powered movable frame; and in, The multi-transport carrier docking device also includes: Multiple movable platforms are located within the first chamber, each of which is arranged to support a corresponding transport carrier. The movable platform of the plurality of movable platforms includes one or more latches arranged to be connected to the movable frame.

11. The multi-carrier docking device of claim 10, wherein when one or more latches are connected to the movable frame, movement of the movable platform causes the movable platform to slide along the track assembly.

12. A method of using a semiconductor device, comprising: The transport vehicle is positioned on one of a plurality of movable platforms within a first chamber comprising a multi-transport vehicle docking device; The sealing assembly of the multi-carrier docking device contracts around the carrier to form an airtight seal around the carrier; After the airtight seal is formed around the transport vehicle: Remove the carrier door of the transport vehicle, and Open the chamber door of the multi-carrier docking device to allow entry of the transport vehicle through the opening in the partition wall between the first and second chambers of the multi-carrier docking device; and When an airtight seal surrounds the transport carrier, a wafer transport tool associated with the multi-transport carrier docking device is used to enter the transport carrier. The sealing assembly includes multiple portions arranged to move from a first position to a second position to form the hermetic seal around the transport vehicle, wherein the multiple portions of the sealing assembly are separated from each other in the first position and connected to each other in the second position. The multi-carrier docking device further includes; A track assembly, which is included in the first chamber and mounted to the partition wall; and A movable frame, which is included in the first chamber and mounted on the track assembly, The movable frame is arranged to slide along the track assembly, and The sealing assembly is mounted on the movable frame.

13. The method of claim 12, wherein entering the transport carrier comprises: When an airtight seal surrounds the transport carrier, the wafer is retrieved from the transport carrier through the opening and the second chamber; and The wafer is then provided to a semiconductor processing tool.

14. The method of claim 12, further comprising: The transport vehicle is slid toward the sealing assembly using a shuttle disc on the movable platform; and The method of causing the sealing assembly to contract around the transport vehicle to form an airtight seal around the transport vehicle includes: After the transport vehicle is slid toward the sealing assembly, the sealing assembly contracts around the transport vehicle to form the airtight seal around the transport vehicle.

15. The method of claim 12, further comprising: The latch of the movable platform extends toward the movable frame on which the sealing assembly is mounted; and Insert the latch into the connector on the movable frame; and The movable platform is moved while the latch is inserted into the connector.

16. The method of claim 15, wherein the movable platform is moved such that the movable frame moves together with the movable platform while the latch is inserted into the connector.

17. The method of claim 15, wherein moving the movable platform while inserting the latch into the connector comprises: While inserting the latch into the connector, the movable platform is moved to orient the transport vehicle in front of the opening on the spacer wall.

18. The method of claim 12, wherein unloading the carrier door of the transport vehicle comprises: Press the mounting plate installed on the chamber door onto the carrier door; The carrier door is unlocked from the body of the transport carrier using a latch key included in the mounting plate; A vacuum seal is formed between the mounting plate and the carrier door; and While the vacuum seal is positioned between the mounting plate and the carrier door, the mounting plate is retracted toward the chamber door.

19. A method of using a semiconductor device, comprising: Use wafer transport vehicles to retrieve wafers from semiconductor processing equipment; The wafer is provided to a transport carrier using the wafer transport tool. The transport carrier is located on a movable platform of a plurality of movable platforms, the movable platforms being included in a first chamber of a multi-transport carrier docking device. A first hermetically sealed seal is formed around the transport carrier by a sealing assembly of the multi-transport carrier docking device. The sealing assembly includes a plurality of portions arranged to move from a first position to a second position to form the first hermetically sealed seal around the transport carrier. The plurality of portions of the sealing assembly are separated from each other in the first position and connected to each other in the second position. When the first airtight seal surrounds a front portion of the transport vehicle, the carrier door is placed on the transport vehicle; The chamber door is placed against the partition wall between the first and second chambers of the multi-carrier docking device to close the opening on the partition wall and form a second airtight seal between the chamber door and the partition wall; and After the second hermetic seal is formed, the plurality of portions of the sealing assembly are moved to the first position to eliminate the first hermetic seal around the transport vehicle. The multi-carrier docking device further includes; A track assembly, which is included in the first chamber and mounted to the partition wall; and A movable frame, which is included in the first chamber and mounted on the track assembly, The movable frame is arranged to slide along the track assembly, and The sealing assembly is mounted on the movable frame.

20. The method of claim 19, further comprising: The plurality of movable platforms are moved within the first chamber such that another movable platform among the plurality of movable platforms is positioned in front of the opening in the partition wall; The sealing assembly contracts around the other transport vehicle to form a third airtight seal around the other transport vehicle; After the third airtight seal is formed around the other transport carriers: The other carrier door of the other transport carrier was removed, and Opening the chamber door to eliminate the second airtight seal, allowing access to the other transport vehicle through the opening in the partition wall; and When the third hermetic seal surrounds the other transport carrier, the wafer transport tool is used to enter the other transport carrier.

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