An apparatus and method for batch ultrasonic scanning inspection of plastic-encapsulated integrated circuits

Abstract

The present invention relates to a device and method for batch ultrasonic scanning inspection of plastic encapsulated integrated circuits. The device for batch ultrasonic scanning inspection of plastic encapsulated integrated circuits includes a first tray and a second tray, and both the first tray and the second tray are in a flat plate structure; a plurality of first through grooves penetrating through opposite sides of the first tray are formed on the first tray, and a first air inlet semi-tube is provided at one end opening of the first through groove; a plurality of second through grooves penetrating through opposite sides of the second tray are formed on the second tray, and a second air inlet semi-tube is provided at one end opening of the second through groove; the second tray can be buckled on the first tray, and the first through groove and the second through groove are enclosed to form a receiving cavity for accommodating the plastic encapsulated integrated circuits, and the first air inlet semi-tube and the second air inlet semi-tube are enclosed to form an air inlet pipe. The present invention can solve the problems of low efficiency in placing and turning over in water and difficult removal of attached bubbles in the ultrasonic scanning inspection item of plastic encapsulated integrated circuits, and can effectively improve the working efficiency and accuracy of this inspection work.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic scanning and detection, and particularly relates to an ultrasonic scanning inspection device and method for plastic-encapsulated integrated circuits in batches. Background Art

[0002] The ultrasonic scanning microscope inspection of plastic-encapsulated integrated circuits can effectively detect defects such as delamination, voids, and cracks in plastic-encapsulated integrated circuits, and is an effective means to detect the packaging process of plastic-encapsulated integrated circuits and improve the reliability of plastic-encapsulated integrated circuits in use. Currently, when detecting plastic-encapsulated integrated circuits in batches in industry testing laboratories, generally, the plastic-encapsulated integrated circuits in tape or tray form are disassembled and placed on the platform in the water tank of the ultrasonic scanning microscope equipment. During the process of placing the plastic-encapsulated integrated circuits in the water on the platform in the water tank, they are prone to drift and generate tiny bubbles adhering to the surface of the plastic-encapsulated integrated circuits. The adhering tiny bubbles will affect the scanning imaging and scanning conclusions, and it is necessary to move the plastic-encapsulated integrated circuits and remove the adhering bubbles, resulting in extremely difficult and inefficient process of arranging the plastic-encapsulated integrated circuits neatly. In the industry, either small trays are used to arrange the plastic-encapsulated integrated circuits neatly outside the water tank and then put them into the water tank, which is also prone to make the plastic-encapsulated integrated circuits move and scatter and generate bubbles during the process, or adhesive materials similar to double-sided tape are used on the small trays to fix the plastic-encapsulated integrated circuits. The fixed integrated circuits will not drift during the water entry process but will cause adhesive residues on the surface of the plastic-encapsulated integrated circuits. The above various ways of placing the plastic-encapsulated integrated circuits in water are time-consuming and laborious and cannot solve the problem of adhering bubbles. At the same time, the plastic-encapsulated integrated circuits need to be scanned and detected for two views, the front and the back. The process of turning over and arranging the plastic-encapsulated integrated circuits in water is time-consuming and not easy to operate. The above placement problems and bubble problems lead to relatively low efficiency of ultrasonic scanning of plastic-encapsulated integrated circuits. Summary of the Invention

[0003] The present invention provides an ultrasonic scanning inspection device and method for plastic-encapsulated integrated circuits in batches to solve one or several of the technical problems existing in the prior art.

[0004] The technical solution of the present invention to solve the above technical problems is as follows: An ultrasonic scanning inspection device for plastic-encapsulated integrated circuits in batches includes a first tray and a second tray, both the first tray and the second tray are in a flat plate structure; a plurality of first through grooves penetrating opposite sides of the first tray are formed on the first tray, and a first intake half pipe is provided at one end of the groove opening of the first through groove; a plurality of second through grooves penetrating opposite sides of the second tray are formed on the second tray, and a second intake half pipe is provided at one end of the groove opening of the second through groove; the second tray can be buckled on the first tray, and the first through groove and the second through groove are enclosed to form a receiving cavity for accommodating the plastic-encapsulated integrated circuits. The receiving cavity matches the packaging size of the plastic-encapsulated integrated circuits so that the plastic-encapsulated integrated circuits are stably clamped, and the first intake half pipe and the second intake half pipe are enclosed to form an intake pipe.

[0005] The beneficial effects of the present invention are as follows: The device of the present invention can sequentially place multiple plastic-encapsulated integrated circuits in the first through grooves of the first tray, and then press the second tray against the first tray. The air pump can blow air into the accommodating cavity containing the plastic-encapsulated integrated circuits through the air inlet pipe, so that the water flow around the plastic-encapsulated integrated circuits can carry away the bubbles attached to the surface, which can solve the problems of low efficiency in placing and turning over the plastic-encapsulated integrated circuits in water and difficult removal of the bubbles attached to the plastic-encapsulated integrated circuits in the ultrasonic scanning detection project, and can effectively improve the working efficiency and accuracy of this inspection work.

[0006] Based on the above technical solutions, the present invention can be further improved as follows.

[0007] Further, two recessed lead placement through grooves are also provided on the bottom wall of the first through groove, and the two lead placement through grooves respectively penetrate through both ends of the bottom wall of the first through groove.

[0008] The beneficial effect of adopting the above further solution is that since the leads on both sides of the plastic-encapsulated integrated circuit will protrude from one side of the plastic-encapsulated integrated circuit, the leads can be placed in the corresponding lead placement through grooves, which is beneficial to the stable fitting placement of the plastic-encapsulated integrated circuit in the first through groove.

[0009] Further, the two lead placement through grooves are respectively located at the two side walls of the first through groove, and the bottom wall of the first through groove between the two lead placement through grooves forms a convex platform for placing one side of the plastic-encapsulated integrated circuit.

[0010] The beneficial effect of adopting the above further solution is that the two lead placement through grooves are arranged corresponding to the leads on both sides of the plastic-encapsulated integrated circuit.

[0011] Further, two convex edges are also provided on the bottom wall of the second through groove, and the two convex edges respectively extend to both ends of the bottom wall of the second through groove.

[0012] The beneficial effect of adopting the above further solution is that by setting the two convex edges, the movement of the plastic-encapsulated integrated circuit can be restricted, and the other side of the plastic-encapsulated integrated circuit can be limited.

[0013] Further, the two convex edges are respectively located at the two side walls of the second through groove, and the bottom wall of the second through groove between the two convex edges forms a groove for placing the other side of the plastic-encapsulated integrated circuit.

[0014] Further, a first air outlet half pipe is provided at the other end slot opening of the first through groove, and a second air outlet half pipe is provided at the other end slot opening of the second through groove. The second tray can be buckled on the first tray, and the first air outlet half pipe and the second air outlet half pipe can be surrounded to form an air outlet pipe.

[0015] The beneficial effect of adopting the above further solution is that by providing the first air outlet half pipe and the second air outlet half pipe, it is helpful to blow the water flow to make the water flow circulate.

[0016] Further, the size of the first air outlet half pipe is the same as the size of the slot opening of the first through slot, and the size of the second air outlet half pipe is the same as the size of the slot opening of the second through slot.

[0017] The beneficial effect of adopting the above further solution is that the outlet half pipe has the same size as the notch of the first through groove and the notch of the second through groove, thereby increasing the fluidity of the water flow.

[0018] Furthermore, two opposite sides of the first tray are respectively provided with limiting flanges, and the other two opposite sides of the first tray are open structures. The second tray can be buckled on the first tray and the peripheral edge of the second tray abuts against the limiting flanges.

[0019] The beneficial effect of adopting the above further solution is that the second tray can be limited by providing a limiting flange, which is conducive to the close fit between the first tray and the second tray.

[0020] Furthermore, at least two rows of first protrusions extending along the length direction of the first through-slot are formed on the bottom wall of the first through-slot and used to abut against the plastic-encapsulated integrated circuit, and at least two rows of second protrusions extending along the length direction of the second through-slot are formed on the bottom wall of the second through-slot and used to abut against the plastic-encapsulated integrated circuit, and the first protrusions and the second protrusions are arranged correspondingly or staggered; the first protrusions and the second protrusions are respectively in a dot-shaped structure or a line-shaped structure.

[0021] The beneficial effect of adopting the above further solution is: by providing the first protrusion and the second protrusion, they can contact the front or back part of the plastic-encapsulated integrated circuit, effectively reducing the contact area, thereby further increasing the fluidity of the water flow and significantly improving the bubble removal effect.

[0022] Furthermore, it also includes an air filling pipe and an air filling pump. One end of the air filling pipe is sleeved on the air filling pipe formed by the first air filling half pipe and the second air filling half pipe, and the other end of the air filling pipe is connected to the air filling pump.

[0023] The beneficial effect of adopting the above further solution is that the air intake pipe can be blown by using the air pump and the air pipe in cooperation.

[0024] A method for batch ultrasonic scanning inspection of plastic-encapsulated integrated circuits is implemented by using the above-mentioned batch ultrasonic scanning inspection device for plastic-encapsulated integrated circuits, and comprises the following steps:

[0025] S1. Continuously place the front side of the plastic-encapsulated integrated circuit upward into the first through groove of the first tray, then buckle the second tray on the first tray and closely fit it with the first tray. Put the first tray and the second tray together into the water tank, with the second tray above the first tray, and arrange the front side of the plastic-encapsulated integrated circuit facing upward.

[0026] S2. Use an air pump and an air supply pipe to purge the accommodation cavity formed by enclosing the first through groove and the second through groove to accommodate the plastic-encapsulated integrated circuit. After purging is completed, remove the second tray and start ultrasonic scanning of the front side of the plastic-encapsulated integrated circuit.

[0027] S3. Flip the first tray and the second tray in the water so that the first tray is above the second tray and arrange the back side of the plastic-encapsulated integrated circuit facing upward.

[0028] S4. Use an air pump and an air supply pipe to purge the accommodation cavity formed by enclosing the first through groove and the second through groove to accommodate the plastic-encapsulated integrated circuit again. After purging is completed, remove the first tray and start ultrasonic scanning of the back side of the plastic-encapsulated integrated circuit.

[0029] The beneficial effects of the present invention are as follows: In the inspection method of the present invention, an air pump can be used to blow air into the accommodation cavity containing the plastic-encapsulated integrated circuit through an air inlet pipe, so that the water flow around the plastic-encapsulated integrated circuit can flow to take away the bubbles attached to the surface. It can solve the problems of low efficiency in placing and turning over the plastic-encapsulated integrated circuit in water and difficult removal of bubbles attached to the plastic-encapsulated integrated circuit in the ultrasonic scanning detection item of the plastic-encapsulated integrated circuit, and can effectively improve the working efficiency and accuracy of this inspection work. Description of the Drawings

[0030] Figure 1 It is a schematic side view structure diagram of an embodiment of the batch ultrasonic scanning inspection device for plastic-encapsulated integrated circuits of the present invention;

[0031] Figure 2 It is a schematic structure diagram of the first tray in the batch ultrasonic scanning inspection device for plastic-encapsulated integrated circuits of the present invention;

[0032] Figure 3 It is a schematic structure diagram of the second tray in the batch ultrasonic scanning inspection device for plastic-encapsulated integrated circuits of the present invention;

[0033] Figure 4 It is a schematic side view structure diagram of another embodiment of the batch ultrasonic scanning inspection device for plastic-encapsulated integrated circuits of the present invention;

[0034] Figure 5 It is a schematic front view structure diagram of the plastic-encapsulated integrated circuit of the present invention.

[0035] In the drawings, the list of components represented by each reference numeral is as follows:

[0036] 1. First tray; 11. First through groove; 12. First intake half pipe; 13. First exhaust half pipe; 14. Pin placement through groove; 15. Boss; 16. Limiting flange; 17. First protrusion;

[0037] 2. Second tray; 21. Second through groove; 22. Second intake half pipe; 23. Second exhaust half pipe; 24. Convex edge; 25. Second protrusion;

[0038] 3. Plastic - encapsulated integrated circuit; 31. Pins; 32. Front side; 33. Back side. Detailed implementation mode

[0039] The principles and features of the present invention will be described below in conjunction with the accompanying drawings. The examples given are only for explaining the present invention and are not used to limit the scope of the present invention.

[0040] Embodiment 1

[0041] As Figures 1 to 5 shown, a batch ultrasonic scanning inspection device for plastic - encapsulated integrated circuits in this embodiment includes a first tray 1 and a second tray 2. Both the first tray 1 and the second tray 2 are in a flat - plate structure. A plurality of first through grooves 11 penetrating opposite sides of the first tray 1 are provided on the first tray 1. One end of the first through groove 11 is provided with a first intake half pipe 12. A plurality of second through grooves 21 penetrating opposite sides of the second tray 2 are provided on the second tray 2. One end of the second through groove 21 is provided with a second intake half pipe 22. The second tray 2 can be buckled on the first tray 1, and the first through groove 11 and the second through groove 21 are enclosed to form a receiving cavity for the plastic - encapsulated integrated circuit. The receiving cavity matches the packaging size of the plastic - encapsulated integrated circuit so that the plastic - encapsulated integrated circuit is stably clamped. The first intake half pipe 12 and the second intake half pipe 22 are enclosed to form an intake pipe.

[0042] The batch ultrasonic scanning inspection device for plastic - encapsulated integrated circuits in this embodiment can be applicable to plastic - encapsulated integrated circuits of any model and structure as long as they can be placed in the receiving cavity formed by the first through groove and the second through groove.

[0043] Specifically, as Figure 2 and Figure 3 shown, plastic - encapsulated integrated circuits 3 can be continuously placed in the first through groove 11 and the second through groove 21 of this embodiment. A plurality of spaced - apart first through grooves 11 can be provided on the first tray 1, and the distance between adjacent two first through grooves 11 can be set as required. A plurality of spaced - apart second through grooves 21 can be provided on the second tray 2, and the distance between adjacent two second through grooves 21 can be set as required. Specifically, it is only necessary to make the plurality of second through grooves 21 correspond to the plurality of first through grooves 11 one by one.

[0044] A specific solution of this embodiment is that, as Figure 2 and Figure 3 shown, the shapes and dimensions of the first intake half pipe 12 and the second intake half pipe 22 of this embodiment do not need to be consistent with the notch dimensions of the first through groove 11 and the second through groove 21, and only need to be able to communicate with the first through groove 11 and the second through groove 21. For example, the first intake half pipe 12 and the second intake half pipe 22 can be semi-circular pipes, or other shaped half pipes, as long as the first intake half pipe 12 and the second intake half pipe 22 form a closed intake pipe after combination.

[0045] The first through groove 11 and the second through groove 21 provided in this embodiment adopt a continuous grooving structure, which can directly and continuously pour the plastic-encapsulated integrated circuit 3 of the whole pipe incoming material into the through groove, eliminating the work of placing and manually turning over each one. For the plastic-encapsulated integrated circuit 3 of the tape incoming material, the work of manually turning over can be avoided after one placement.

[0046] As Figure 1 shown, two recessed pin placement through grooves 14 are further provided on the bottom wall of the first through groove 11 of this embodiment, and the two pin placement through grooves 14 respectively penetrate through both ends of the bottom wall of the first through groove 11. As Figure 5 shown, since the pins 31 on both sides of the plastic-encapsulated integrated circuit will protrude from one side of the plastic-encapsulated integrated circuit 3, the pins 31 can be placed in the corresponding pin placement through grooves 14, which is beneficial to the stable fitting placement of the plastic-encapsulated integrated circuit in the first through groove.

[0047] As Figure 1 and Figure 2 shown, the two pin placement through grooves 14 of this embodiment are respectively located at the two side walls of the first through groove 11, and the bottom wall of the first through groove 11 between the two pin placement through grooves 14 forms a convex platform 15 for placing one side of the plastic-encapsulated integrated circuit 3. The two pin placement through grooves are arranged corresponding to the pins on both sides of the plastic-encapsulated integrated circuit.

[0048] A preferred solution of this embodiment is that, as Figure 1 and Figure 5 shown, the pin placement through groove 14 of this embodiment can be adapted to the shape of the pin 31, so that the pin 31 can just be placed into the pin placement through groove 14.

[0049] As Figure 1 and Figure 2As shown, two convex edges 24 are further provided on the bottom wall of the second through groove 21 of this embodiment, and the two convex edges 24 respectively extend to both ends of the bottom wall of the second through groove 21. By providing the two convex edges, the movement of the plastic-encapsulated integrated circuit can be restricted, and the other side of the plastic-encapsulated integrated circuit is limited. Among them, the two convex edges 24 do not need to press the pins 31 of the plastic-encapsulated integrated circuit 3, and only need to be able to limit the plastic-encapsulated integrated circuit 3.

[0050] As Figure 1 and Figure 2 shown, the two convex edges 24 of this embodiment are respectively located at the two side walls of the second through groove 21, and the bottom wall of the second through groove 21 between the two convex edges 24 forms a groove for placing the other side of the plastic-encapsulated integrated circuit 3.

[0051] In this embodiment, the first air outlet half pipe 13 may not be provided at the other end slot of the first through groove 11, and the second air outlet half pipe 23 may not be provided at the other end slot of the second through groove 21, and the first through groove 11 and the second through groove 21 are directly connected to the internal environment of the water tank.

[0052] As Figure 2 and Figure 3 shown, the first air outlet half pipe 13 is provided at the other end slot of the first through groove 11 of this embodiment, the second air outlet half pipe 23 is provided at the other end slot of the second through groove 21, and the second tray 2 can be buckled on the first tray 1, and the first air outlet half pipe 13 and the second air outlet half pipe 23 are surrounded to form an air outlet pipe. By providing the first air outlet half pipe and the second air outlet half pipe, it is beneficial to blow the water flow to make the water flow circulate.

[0053] As Figure 2 and Figure 3 shown, the size of the first air outlet half pipe 13 of this embodiment is the same as the slot size of the first through groove 11, and the size of the second air outlet half pipe 23 is the same as the slot size of the second through groove 21. The air outlet half pipe has the same size as the slot of the first through groove and the slot of the second through groove, which increases the fluidity of the water flow.

[0054] An alternative solution of this embodiment, as Figure 2 and Figure 3 shown, the shapes of the first air outlet half pipe 13 and the second air outlet half pipe 23 of this embodiment can be the same as the shapes of the first through groove 11 and the second through groove 21 respectively, forming a wider drainage port, which is beneficial to the smoothness of air outlet. For example, if the first through groove 11 and the second through groove 21 are square structures, the first air outlet half pipe 13 and the second air outlet half pipe 23 can also adopt the same-shaped structures.

[0055] As Figure 1 and Figure 2As shown, in this embodiment, two opposite sides of the first tray 1 are respectively provided with limiting flanges 16, and the other two opposite sides of the first tray 1 are open structures, and the second tray 2 can be buckled on the first tray 1 and the peripheral side edges of the second tray 2 abut against the limiting flanges 16. By providing the limiting flanges, the second tray can be limited, which is conducive to the close fit between the first tray and the second tray.

[0056] Specifically, Figure 1 As shown, in this embodiment, a limiting notch may be provided on the peripheral edge of the second tray 2 so that the limiting flange 16 on the first tray 1 can be adapted to fit on the limiting notch on the peripheral edge of the second tray 2 .

[0057] An optional solution of this embodiment is that the plastic packaged integrated circuit batch ultrasonic scanning inspection device further includes an air filling tube and an air filling pump, one end of the air filling tube is sleeved on the air filling tube formed by the first air filling half tube 12 and the second air filling half tube 22, and the other end of the air filling tube is connected to the air filling pump. The air filling pump and the air filling tube can be used to blow air into the air filling tube.

[0058] like Figure 4 As shown, a preferred solution of this embodiment is that at least two rows of first protrusions 17 extending along the length direction of the first through groove 11 are formed on the bottom wall of the first through groove 11 for abutting the plastic-encapsulated integrated circuit 3, and at least two rows of second protrusions 25 extending along the length direction of the second through groove 21 are formed on the bottom wall of the second through groove 21 for abutting the plastic-encapsulated integrated circuit 3. The first protrusion 17 and the second protrusion 25 are arranged correspondingly or staggered; the first protrusion 17 and the second protrusion 25 are respectively in a dot-shaped structure or a line-shaped structure. By providing the first protrusion and the second protrusion, it can be in contact with the front or back part of the plastic-encapsulated integrated circuit, effectively reducing the contact area, thereby further increasing the fluidity of the water flow and significantly improving the bubble removal effect.

[0059] A preferred solution of this embodiment is as follows: Figures 1 to 4 As shown, the first tray 1 and the second tray 2 of this embodiment can adopt a rectangular structure, so that the first through groove 11 extends along the length direction of the first tray 1, and the second through groove 21 extends along the length direction of the second tray 2, and the limiting flanges 16 are respectively provided on the two long sides of the first tray 1.

[0060] The first tray 1 and the second tray 2 of the plastic-encapsulated integrated circuit batch ultrasonic scanning inspection device in this embodiment can be injection-molded from MPPO (also known as PPO plastic, alias: polyphenylene ether) anti-static material, and anti-static metal stainless steel iron sheets can be attached to the back of the first tray 1 and the second tray 2, so that the first tray 1 and the second tray 2 can sink steadily to the bottom of the water. The first tray 1 and the second tray 2 in this embodiment can also be made of metal materials, such as using other machined metal templates, such as metal templates made of metal aluminum. The designed dimensions of the first through groove 11 on the first tray 1 and the second through groove 21 on the second tray 2 in this embodiment can be applicable to plastic-encapsulated integrated circuits 3 of any size.

[0061] The working principle of the plastic-encapsulated integrated circuit batch ultrasonic scanning inspection device in this embodiment is as follows: on the anti-static workbench, a plurality of plastic-encapsulated integrated circuits 3 are continuously placed face up on the first tray 1, and then the second tray 2 is buckled on the first tray 1, so that the bottom of the first through groove 11 and the bottom of the second through groove 21 are respectively in close contact with the back and the front of the plastic-encapsulated integrated circuit 3. The first tray 1 and the second tray 2 can also be tightly buckled. When it is necessary to scan the front of the plastic-encapsulated integrated circuit 3, the whole device is put into the water tank, and then the air pump and the air inlet pipe are respectively connected to the air inlet pipe and purged for a certain period of time to remove the attached bubbles. Generally, purging for a few minutes is enough. The air pump is externally connected through the air inlet pipe to blow the water flow around the plastic-encapsulated integrated circuit 3 between the first tray 1 and the second tray 2 to take away the attached bubbles, solving the technical problem that it is difficult to remove the attached bubbles in the static water tank. After stopping purging, the second tray 2 is taken away, and then the front of the plastic-encapsulated integrated circuit can be scanned. When it is necessary to scan the back of the plastic-encapsulated integrated circuit 3, in the water tank, the second tray 2 is covered on the first tray 1 to make it in close contact, and then the whole device is directly turned over in the water in the water tank so that the second tray 2 is at the bottom and the first tray 1 is on the top, and then put into the water tank, so that the plastic-encapsulated integrated circuit 3 is transferred from the first tray 1 to the second tray 2. Then, the air pump is used to purge for a certain period of time to remove the attached bubbles, and the first tray 1 is taken out, and then the back of the plastic-encapsulated integrated circuit 3 on the second tray 2 can be scanned.

[0062] The device in this embodiment can sequentially place a plurality of plastic-encapsulated integrated circuits in the first through groove of the first tray, and then press the second tray on the first tray. The air pump can be used to blow air into the accommodation cavity containing the plastic-encapsulated integrated circuit through the air inlet pipe, so that the water flow around the plastic-encapsulated integrated circuit can flow to take away the bubbles attached to the surface, which can solve the problems of low efficiency of placing and turning over the plastic-encapsulated integrated circuit in the water and difficult removal of the bubbles attached to the plastic-encapsulated integrated circuit in the ultrasonic scanning detection item of the plastic-encapsulated integrated circuit, and can effectively improve the working efficiency and accuracy of this inspection work.

[0063] Embodiment 2

[0064] A method for batch ultrasonic scanning inspection of plastic-encapsulated integrated circuits in this embodiment is implemented by using the plastic-encapsulated integrated circuit batch ultrasonic scanning inspection device described in Embodiment 1, and includes the following steps:

[0065] S1. Continuously place the front side 32 of the plastic-encapsulated integrated circuit 3 upward into the first through groove 11 of the first tray 1, then buckle the second tray 2 on the first tray 1 and closely fit it with the first tray 1. Put the first tray 1 and the second tray 2 together into the water tank, so that the second tray 2 is located above the first tray 1, and arrange the front side 32 of the plastic-encapsulated integrated circuit 3 upward.

[0066] S2. Use an air pump and an air pipe to purge the accommodation cavity formed by the enclosure of the first through groove 11 and the second through groove 21 to accommodate the plastic-encapsulated integrated circuit 3. After the purging is completed, remove the second tray 2, and start ultrasonic scanning the front side 32 of the plastic-encapsulated integrated circuit 3.

[0067] S3. Flip the first tray 1 and the second tray 2 in the water so that the first tray 1 is located above the second tray 2, and arrange the back side 33 of the plastic-encapsulated integrated circuit 3 upward.

[0068] S4. Use an air pump and an air pipe to purge the accommodation cavity formed by the enclosure of the first through groove 11 and the second through groove 21 to accommodate the plastic-encapsulated integrated circuit 3 again. After the purging is completed, remove the first tray 1, and start ultrasonic scanning the back side 33 of the plastic-encapsulated integrated circuit 3.

[0069] The inspection method of this embodiment can use an air pump to blow air into the accommodation cavity containing the plastic-encapsulated integrated circuit through an air inlet pipe, so that the water flow around the plastic-encapsulated integrated circuit can take away the bubbles attached to the surface, which can solve the problems of low efficiency in placing and turning over the plastic-encapsulated integrated circuit in water and difficult removal of bubbles attached to the plastic-encapsulated integrated circuit in the ultrasonic scanning inspection item of the plastic-encapsulated integrated circuit, and can effectively improve the working efficiency and accuracy of this inspection work.

[0070] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0071] Furthermore, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0072] In the present invention, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0073] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0074] In the description of this specification, the descriptions with reference to terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0075] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. An apparatus for batch ultrasonic scanning inspection of plastic encapsulated integrated circuits, characterized in that, It includes a first tray and a second tray, both the first tray and the second tray are flat structures; a plurality of first through grooves penetrating through opposite sides of the first tray are formed on the first tray, and a first intake half pipe is provided at one end opening of the first through groove; a plurality of second through grooves penetrating through opposite sides of the second tray are formed on the second tray, and a second intake half pipe is provided at one end opening of the second through groove; the second tray can be buckled on the first tray, and the first through groove and the second through groove are enclosed to form a receiving cavity for accommodating a plastic encapsulated integrated circuit, and the receiving cavity is matched with the packaging size of the plastic encapsulated integrated circuit so that the plastic encapsulated integrated circuit is stably clamped, and the first intake half pipe and the second intake half pipe are enclosed to form an intake pipe; On the bottom wall of the first through groove, there are also two recessed lead placement through grooves, and the two lead placement through grooves respectively penetrate through both ends of the bottom wall of the first through groove; the two lead placement through grooves are respectively located at the two side walls of the first through groove, and the bottom wall of the first through groove between the two lead placement through grooves forms a convex platform for placing one side of the plastic encapsulated integrated circuit.

2. The batch ultrasonic scanning inspection device for plastic encapsulated integrated circuits according to claim 1, wherein On the bottom wall of the second through groove, there are also two convex edges, and the two convex edges respectively extend to both ends of the bottom wall of the second through groove; the two convex edges are respectively located at the two side walls of the second through groove, and the bottom wall of the second through groove between the two convex edges forms a groove for placing the other side of the plastic encapsulated integrated circuit.

3. The plastic-encapsulated integrated circuit batch ultrasonic scanning inspection device according to claim 1, wherein A first exhaust half pipe is provided at the other end opening of the first through groove, and a second exhaust half pipe is provided at the other end opening of the second through groove. The second tray can be buckled on the first tray, and the first exhaust half pipe and the second exhaust half pipe are enclosed to form an exhaust pipe.

4. The batch ultrasonic scanning inspection device for plastic encapsulated integrated circuits according to claim 3, wherein, The size of the first exhaust half pipe is the same as the size of the opening of the first through groove, and the size of the second exhaust half pipe is the same as the size of the opening of the second through groove.

5. The batch ultrasonic scanning inspection device for plastic encapsulated integrated circuits according to claim 1, wherein Limit flanges are respectively provided on two opposite sides of the first tray, and the other two opposite sides of the first tray are open structures. The second tray can be buckled on the first tray and the peripheral edge of the second tray abuts against the limit flanges.

6. The batch ultrasonic scanning inspection device for plastic-encapsulated integrated circuits according to claim 1, characterized in that, On the bottom wall of the first through groove, there are at least two rows of first protrusions extending along the length direction of the first through groove for abutting against the plastic encapsulated integrated circuit. On the bottom wall of the second through groove, there are at least two rows of second protrusions extending along the length direction of the second through groove for abutting against the plastic encapsulated integrated circuit. The first protrusions and the second protrusions are arranged correspondingly or staggeredly; the first protrusions and the second protrusions are respectively in a dot structure or a linear structure.

7. A plastic encapsulated integrated circuit batch ultrasonic scanning inspection device according to any one of claims 1 to 6, characterized in that, It also includes an inflation pipe and an air pump. One end of the inflation pipe is sleeved on the intake pipe formed by enclosing the first intake half pipe and the second intake half pipe, and the other end of the inflation pipe is connected to the air pump.

8. A method for batch ultrasonic scanning inspection of plastic encapsulated integrated circuits, characterized in that, It is realized by using the plastic encapsulated integrated circuit batch ultrasonic scanning inspection device described in claim 7, and includes the following steps: S1. Continuously place the front side of the plastic-encapsulated integrated circuit face up into the first through groove of the first tray, then fasten the second tray onto the first tray and closely fit it with the first tray. Place the first tray and the second tray together into a water tank, with the second tray above the first tray, and arrange the front side of the plastic-encapsulated integrated circuit facing up. S2. Use an air pump and an air pipe to purge the accommodation cavity formed by the enclosure of the first through groove and the second through groove for accommodating the plastic-encapsulated integrated circuit. After the purging is completed, remove the second tray and start ultrasonic scanning the front side of the plastic-encapsulated integrated circuit. S3. In the water, flip the first tray and the second tray so that the first tray is above the second tray and the back side of the plastic-encapsulated integrated circuit is facing up. S4. Use the air pump and the air pipe to purge the accommodation cavity formed by the enclosure of the first through groove and the second through groove for accommodating the plastic-encapsulated integrated circuit again. After the purging is completed, remove the first tray and start ultrasonic scanning the back side of the plastic-encapsulated integrated circuit.

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