Wafer carrier apparatus and conditioning method, semiconductor process equipment

Abstract

The application discloses a wafer bearing device and adjusting method, and a semiconductor process equipment. The wafer bearing device comprises a frame, a plurality of bearing members, a plurality of trays and a plurality of tensioning mechanisms. The frame surrounds a containing space. The plurality of bearing members are arranged in the containing space, and two ends of the bearing members are respectively connected to two sides of the frame. At least one end of at least part of the bearing members is a movable end. The plurality of trays are supported on the plurality of bearing members at intervals. Each tray is commonly supported by the plurality of bearing members, and the tray is used for supporting a wafer. The tensioning mechanism is arranged on the frame, the movable end of the bearing member is connected to the tensioning mechanism, and the tensioning mechanism is used for tensioning the bearing member connected thereto. The above scheme can solve the problem of poor safety of the wafer in the transmission process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip technology, and in particular to a wafer carrier device and adjustment method, and semiconductor process equipment. Background Technology

[0002] In semiconductor manufacturing, wafers are mounted on wafer carriers and then transferred to a process chamber for processing.

[0003] In related technologies, wafer carriers are typically manufactured from a single piece of substrate. The wafer carriers are usually designed to be large in size, enabling them to carry more wafers, thereby increasing the production capacity of semiconductor processes and reducing production costs.

[0004] However, due to the increased size of the wafer carrier, it is more prone to deformation during transport, and the deformation is also greater. For example, the central area of ​​the wafer carrier is susceptible to sagging deformation due to its own weight, and the deformation is also significant. This greater deformation increases the risk of wafer breakage, thus compromising the safety of the wafer during transport. Summary of the Invention

[0005] This invention discloses a wafer carrier device and adjustment method, as well as semiconductor process equipment, to solve the problem of poor wafer security during transmission.

[0006] To solve the above problems, the present invention adopts the following technical solution:

[0007] A wafer carrier device, comprising:

[0008] A frame, the frame enclosing a receiving space;

[0009] Multiple support members are arranged within the accommodating space, with both ends of each support member connected to both sides of the frame, and at least one end of at least some of the support members being a movable end;

[0010] Multiple trays are spaced apart and supported on multiple carriers, each tray being supported by multiple carriers, and the trays are used to support wafers;

[0011] Multiple tensioning mechanisms are provided on the frame, and the movable end of the carrier is connected to the tensioning mechanism. The tensioning mechanism is used to tension the carrier connected to it.

[0012] A semiconductor process apparatus, including the aforementioned wafer carrier device.

[0013] An adjustment method for a wafer carrier device, applied to the aforementioned wafer carrier device, the adjustment method comprising:

[0014] Loosen the movable end of the bearing member fixed to the tensioning mechanism, and connect the movable end of the bearing member to the force measuring device;

[0015] A tensile force is applied to the movable end of the bearing member. When the tensile force causes the deformation of the bearing member to be less than or equal to a preset deformation, the tensile force value is recorded.

[0016] Adjust the tensioning mechanism so that the tension force of the tensioning mechanism is equal to the tensile force value, and then fix the movable end of the bearing member to the tensioning mechanism.

[0017] The technical solution adopted in this invention can achieve the following beneficial effects:

[0018] This invention discloses a wafer carrier device in which multiple trays are spaced apart and supported on multiple carrier members. Multiple tensioning mechanisms are disposed on a frame, and at least one end of at least some carrier members is a movable end connected to a tensioning mechanism. The tensioning mechanism is used to tension the carrier member connected to it. In this design, the wafer carrier device has multiple trays, so the size of a single tray can be set smaller without changing the production capacity, and a single tray is less prone to deformation. Simultaneously, the tensioning mechanisms can tension the carrier members to increase the supporting force of the carrier members on the trays, thereby reducing the deformation of the wafer carrier device. Therefore, the wafer is less likely to be damaged, improving the safety of the wafer during transport. Furthermore, the wafer carrier device 100 in this application is not limited by the board material specifications, thus allowing for further expansion of the size of the wafer carrier device 100, enabling it to support more wafers, thereby further achieving efficiency improvement and cost reduction. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0020] Figure 1 This is a schematic diagram of the structure of the wafer carrier device disclosed in an embodiment of the present invention;

[0021] Figures 2 to 13 This is a schematic diagram of the structure of some components of the wafer carrier device disclosed in an embodiment of the present invention;

[0022] Figure 14 This is a flowchart of an adjustment method for a wafer carrier device disclosed in an embodiment of the present invention.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100 - Wafer carrier, 110 - Frame, 111 - Receiving groove, 1111 - First receiving groove segment, 1112 - Second receiving groove segment, 1113 - Third receiving groove segment, 112 - Connecting groove, 120 - Carrier, 130 - Tray, 131 - First limiting groove, 1311 - Third limiting groove segment, 1312 - Fourth limiting groove segment, 132 - Second limiting groove, 133 - Third limiting groove, 134 - Fourth limiting groove, 135 - First limiting groove segment, 136 - Second limiting groove 140-Tensioning mechanism, 141-Fixing part, 142-Sliding part, 1421-First guide post, 1422-Connecting part, 1422a-Main body, 1422b-Protrusion, 1422b1-Positioning groove, 1422c-Pressure plate, 1423-Second guide post, 143-Elastic part, 1431-First elastic element, 1432-Second elastic element, 144-Adjusting element, 150-Fixing plate, 161-First guide sleeve, 162-Second guide sleeve, 170-Limiting block. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0026] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] like Figures 1 to 13 As shown, an embodiment of the present invention discloses a wafer carrier device 100, which includes a frame 110, a carrier 120, a tray 130 and a tensioning mechanism 140.

[0028] The frame 110 provides a mounting base for other components of the wafer carrier device 100. The frame 110 encloses an accommodating space. Specifically, the frame 110 can be a hollow structure, and the frame 110 can include multiple side frames connected end to end to form the frame 110. The frame 110 can be made of metal or non-metal materials, which are not limited herein.

[0029] There are multiple support members 120 arranged within the accommodating space, which together form a support surface. Each support member 120 has two ends connected to both sides of the frame 110. Optionally, each support member 120 can have its two ends connected to opposite sides of the frame 110, or to adjacent sides of the frame 110.

[0030] Optionally, the support member 120 can be a filamentous or strip-shaped structure, such as a metal wire or metal strip. Multiple support members 120 can be arranged at intervals extending in the same direction, or they can be arranged in a crisscross pattern in multiple directions to form a mesh structure. The fixed ends of the support members 120 can be fixed to the frame 110 by welding, riveting, or other methods.

[0031] Multiple trays 130 are provided, and these trays 130 are spaced apart and supported on multiple support members 120. Each tray 130 is supported by multiple support members 120, and the tray 130 is used to support wafers. Specifically, multiple trays 130 are supported on a support surface formed by multiple support members 120, and are arranged at intervals on the support surface. Optionally, each tray 130 can support multiple wafers. The tray 130 can be a hollow structure or a solid structure. The tray 130 can be made of aluminum plate, titanium alloy plate, stainless steel, etc. Of course, other materials can also be used to make the tray 130, which is not limited in this document.

[0032] There are multiple tensioning mechanisms 140, which are disposed on the frame 110. At least one end of at least a portion of the bearing member 120 is a movable end, which is connected to the tensioning mechanism 140. The tensioning mechanism 140 is used to tension the bearing member 120 connected to it.

[0033] Optionally, the support member 120 may have one movable end and the other fixed end. The movable end is connected to the tensioning mechanism 140, and the fixed end can be directly fixed to the frame 110. Alternatively, both ends of the support member 120 may be movable, and both ends may be connected to the tensioning mechanism 140. Or, at least one end of some support members 120 may be movable, while both ends of other support members 120 may be fixed; that is, some support members 120 may be directly fixed to the frame 110.

[0034] During wafer processing, each tray 130 holds a wafer. Due to the weight of the tray 130 itself and the wafer, the tray 130 is prone to deformation, causing the wafer carrier 100 to sag, i.e., the aforementioned carrier surface sags. At this time, the tensioning mechanism 140 can tension the carrier component 120 corresponding to the sagging deformation area to overcome the gravity of the tray 130, reduce the deformation of the wafer carrier 100, and keep the deformation of the wafer carrier 100 within the error range. Then, the wafer carrier 100 carrying the wafer is transferred to the process chamber by a robotic arm for processing.

[0035] In the embodiments disclosed in this application, the wafer carrier 100 is provided with multiple trays 130. Therefore, without changing the production capacity, the size of a single tray 130 can be set to be smaller, making it less prone to deformation. Simultaneously, the tensioning mechanism 140 can tension the carrier member 120, thereby tensioning the bearing surface used to support the tray 130, reducing the amount of deformation of the wafer carrier 100. This makes the wafer less prone to damage, improving wafer safety.

[0036] Furthermore, the wafer carrier devices in related technologies are manufactured from a single piece of substrate, thus their size is limited by the substrate specifications, and the number of wafers they can support is limited. In contrast, the wafer carrier device 100 in this application is not limited by substrate specifications, therefore its size can be further increased, enabling it to support more wafers, thereby further improving efficiency and reducing costs.

[0037] Furthermore, deformation of the wafer carrier device in related technologies can easily cause changes in the position of the wafer it supports, such as wafer tilting or unevenness between multiple wafers. This results in uneven film thickness deposited on the wafer surface during processing, which can easily affect the wafer's performance.

[0038] In the embodiments disclosed in this application, the tensioning mechanism 140 can tension the carrier member 120, thereby tensioning the carrier surface used for the carrier tray 130 to reduce the deformation of the wafer carrier device 100. Therefore, the tensioning mechanism 140 can control the deformation of the wafer carrier device 100 within the error range, thus making it less likely to cause wafer tilting or unevenness between multiple wafers. As a result, the film thickness deposited on the wafer surface is relatively uniform, thus making it less likely to affect the performance of the wafer.

[0039] Furthermore, since the thickness of the wafer and the size of the tray 130 are different, the supporting force of the carrier 120 is different, and therefore the bearing capacity of the carrier 120 is different. The wafer carrier device 100 in this application can tension the carrier 120 according to the weight of the tray 130, thereby enabling it to support trays 130 of different weights, thereby improving the compatibility of the wafer carrier device 100.

[0040] In the above embodiments, the tensioning mechanism 140 may include a rotating shaft and a ratchet. One end of the carrier member 120 is wound around the rotating shaft. When the rotating shaft rotates, the carrier member 120 is wound around the rotating shaft, thereby tensioning the carrier member 120. After the tension adjustment is completed, the ratchet is locked on the rotating shaft, thereby preventing the rotating shaft from rotating again. Of course, the tensioning mechanism 140 is not limited to the above structure and may be other structures, which are not limited herein.

[0041] In another optional embodiment, the tensioning mechanism 140 may include a fixing part 141, a sliding part 142, an elastic part 143, and an adjusting member 144. The fixing part 141 may be fixedly connected to the outer wall of the frame 110. The fixing part 141 may have a groove, and a portion of the sliding part 142 may be located within the groove. The sliding part 142 and the groove may slide in cooperation along the extension and retraction direction of the elastic part 143. One end of the elastic part 143 abuts against the sliding part 142, and the other end of the elastic part 143 abuts against the frame 110. The movable end of the bearing member 120 is connected to the sliding part 142, and one end of the adjusting member 144 abuts against the side of the sliding part 142 opposite to the elastic part 143, for pushing the sliding part 142 to slide.

[0042] In the specific working process, the movable end of the bearing member 120 fixed to the tensioning mechanism 140 is loosened, and the movable end of the bearing member 120 is connected to the force gauge. A tension force is applied to the movable end of the bearing member 120. When the tension force causes the deformation of the bearing member 120 to be less than or equal to a preset deformation amount, the tension force value is recorded. The adjusting member 144 is pushed in the extension and retraction direction of the elastic part 143 to compress the elastic part 143 so that the elastic force of the elastic part 143 is equal to the tension force. Then the movable end is fixed to the tensioning mechanism 140. Finally, the adjusting member 144 is removed, and the rebound force of the elastic part 143 causes the bearing member 120 to be tensioned. At this time, the force exerted by the bearing member 120 on the elastic part 143 and the tension force exerted by the elastic part 143 on the bearing member 120 are a pair of balanced forces with opposite directions and equal magnitudes.

[0043] In the above embodiments, according to the elastic force calculation formula, the greater the compression of the elastic part 143, the greater its elastic force, the greater the tension of the support member 120, the greater the supporting force of the support member 120 on the tray 130, and the smaller the deformation of the support member 120, thereby making the wafer support device 100 less prone to deformation. The deformation of the support member 120 is obtained by measuring the tensile force value of the support member 120. Therefore, when the tension of the support member 120 is within a certain range, its deformation is also within a preset deformation range.

[0044] In this design, the elastic part 143 extends and retracts linearly, thereby enabling linear adjustment of the bearing member 120 and making it less likely for the bearing member 120 to be over-tensioned or break.

[0045] In another alternative embodiment, the fixing part 141 may have a threaded hole communicating with the slide groove. The threaded hole may be disposed opposite to the sliding part 142. One end of the adjusting member 144 may pass through the threaded hole and abut against the side of the sliding part 142 away from the elastic part 143. The adjusting member 144 may be threadedly engaged with the threaded hole.

[0046] In this scheme, when it is necessary to tension the bearing member 120, the movable end of the bearing member 120 fixed to the tensioning mechanism 140 is loosened, and the adjusting member 144 is turned so that the adjusting member 144 abuts against the sliding part and moves toward the receiving space side. The elastic part 143 is compressed. When the elastic force of the elastic part 143 is greater than or equal to the tension force, the movable end of the bearing member 120 (at this time, the fixing point of the movable end of the bearing member 120 has changed) is fixed to the tensioning mechanism 140. The force applied to the sliding part 142 by the adjusting member 144 is removed. Therefore, under the action of the elastic force of the elastic part 143, the sliding part 142 tensions the bearing member 120. After the bearing member 120 is tensioned, the adjusting member 144 is turned in the opposite direction so that the adjusting member 144 removes the force on the sliding part 142, thereby completing the tensioning operation.

[0047] Therefore, the tensioning operation can be achieved by turning the adjusting member 144. After adjustment, turn the adjusting member 144 in the opposite direction to move it to a position where it does not contact the sliding part 142. This makes the tensioning adjustment method of the bearing member 120 simple and reliable. In addition, the adjusting member 144 is threadedly connected to the threaded hole. The threaded connection has a self-locking function, thereby preventing the adjusting member 144 from being lost.

[0048] Optionally, the elastic part 143 can be a spring, a sheet, or other structure. Of course, the elastic part 143 can also be other structures, which are not limited in this article.

[0049] Furthermore, the sliding part 142 may include a first guide post 1421, a connecting part 1422, and a second guide post 1423. The first guide post 1421 and the second guide post 1423 may be disposed on opposite sides of the connecting part 1422, and the movable end of the carrier 120 may be connected to the connecting part 1422.

[0050] The tensioning mechanism 140 may further include a first guide sleeve 161 and a second guide sleeve 162, both of which can be connected to the fixing part 141. The sidewalls of the first guide sleeve 161 and the second guide sleeve 162 facing the connecting part 1422 may respectively have a first opening and a second opening. The first guide sleeve 161 can be fitted onto the outside of the first guide post 1421 through the first opening. The second guide sleeve 162 can be fitted onto the outside of the second guide post 1423 through the second opening, with part of the connecting part 1422 located within a groove. The first guide sleeve 161, the second guide sleeve 162, and the groove are used to guide the sliding part 142 in the extension / retraction direction of the elastic part 143.

[0051] The elastic part 143 may include a first elastic member 1431 and a second elastic member 1432. One end of the first elastic member 1431 may abut against the first guide post 1421, and the other end of the first elastic member 1431 may abut against the frame 110. One end of the second elastic member 1432 may abut against the second guide post 1423, and the other end of the second elastic member 1432 may abut against the frame 110.

[0052] In this design, both the first guide post 1421 and the second guide post 1423 can be located within their respective guide sleeves, thus improving the fit between the sliding part 142 and the groove. Furthermore, the first elastic element 1431 and the second elastic element 1432 are respectively provided on both sides of the sliding part 142, ensuring relative balance on both sides and preventing unilateral tilting.

[0053] In the above embodiments, the movable end of the carrier 120 can be welded to the connecting part 1422. At this time, the assembly of the carrier 120 and the connecting part 1422 is difficult, and disassembly and installation are also inconvenient.

[0054] In another alternative embodiment, the connecting portion 1422 may include a main body portion 1422a, a protrusion portion 1422b, and a pressure plate 1422c. A first guide post 1421 and a second guide post 1423 are disposed on opposite sides of the main body portion 1422a, with the main body portion 1422a and the protrusion portion 1422b overlapping each other. A portion of the protrusion portion 1422b may be located within a groove and slide in cooperation with the groove in the extension / retraction direction of the elastic portion 143.

[0055] The pressure plate 1422c presses against the end face of the protrusion 1422b that is away from the main body 1422a, and the pressure plate 1422c and the protrusion 1422b press against the movable end of the fixed bearing member 120.

[0056] In this design, the movable end of the carrier 120 is located between the pressure plate 1422c and the protrusion 1422b, with the pressure plate 1422c pressing against the connecting portion 1422, thereby achieving a fixed assembly of the carrier 120. When disassembling or installing the carrier 120, only the pressure plate 1422c and the protrusion 1422b need to be separated, without damaging the carrier. This makes the disassembly and installation of the tensioning mechanism 140 and the carrier 120 more convenient and safer.

[0057] Optionally, the pressure plate 1422c and the protrusion 1422b can be connected by bolts or by snap-fit ​​or other means.

[0058] In addition, the connecting part 1422 has a large thickness in the middle and a small thickness on both sides, which reduces its weight while ensuring strength.

[0059] In the above embodiments, the support member 120 is prone to displacement between the pressure plate 1422c and the protrusion 1422b, which causes changes in the distance between two adjacent support members 120, resulting in uneven support force of the support member 120 on the pallet 130. Alternatively, the displacement of the support member 120 between the pressure plate 1422c and the protrusion 1422b may cause the support member 120 to rub against the edge of the frame 110, leading to breakage of the support member 120.

[0060] Therefore, in another alternative embodiment, a positioning groove 1422b1 may be provided on the side of the protrusion 1422b facing the pressure plate 1422c. The positioning groove 1422b1 can penetrate the protrusion 1422b along the extending direction of the protrusion 1422b and is used to position the carrier 120.

[0061] In this design, the movable end of the support member 120 can be located within the positioning groove 1422b1, thereby preventing displacement of the support member 120. This makes it less likely for the distance between two adjacent support members 120 to change, resulting in a relatively uniform supporting force of the support member 120 on the pallet 130. Simultaneously, the support member 120 is less prone to movement, and the edges of the support member 120 and the frame 110 are less likely to rub against each other, thus reducing the likelihood of breakage.

[0062] Optionally, the positioning groove 1422b1 can be a groove with a "V" shaped cross-section, or it can be a groove of other shapes, which is not limited in this article.

[0063] In the above embodiment, the tensioning mechanism 140 is located on the outer wall of the frame 110. Therefore, the movable end of the bearing member 120 needs to be routed from the top or bottom surface of the frame 110 to the connecting part 1422. When the connecting part 1422 is at a higher position, this causes the movable end of the bearing member 120 to tilt.

[0064] Based on this, in another optional embodiment, the frame 110 may have multiple connecting slots 112, which correspond to multiple tensioning mechanisms 140. The connecting slots 112 penetrate the frame 110 along the sliding direction of the sliding portion 142. The movable end of the support member 120 can pass through the connecting slot 112 and connect with the connecting portion 1422. In this solution, the support member 120 passes through the connecting slot 112, so the support member 120 will not experience assembly tilting.

[0065] In the above embodiments, a portion of the sliding part 142 and the elastic part 143 are exposed outside the groove, which can easily cause damage to the sliding part 142 and the elastic part 143.

[0066] Based on this, in another optional embodiment, the frame 110 may have multiple receiving grooves 111, each corresponding to a multiple tensioning mechanism 140, and multiple communicating grooves 112 communicating with each of the receiving grooves 111. The communicating grooves 112 may be located on the side of the receiving groove 111 facing the receiving space. The receiving groove 111 has an opening facing the outer wall of the frame 110. The opening of the sliding groove is opposite to the opening of the receiving groove 111 facing the outer wall of the frame 110. A portion of the sliding part 142 is located in the sliding groove, and another portion is located in the receiving groove 111. An elastic part 143 is located in the receiving groove 111, and one end of the elastic part 143 abuts against the bottom wall of the receiving groove 111 facing the receiving space.

[0067] In this design, the sliding part 142 and the elastic element can be located in the receiving groove 111, thereby making the volume of the exposed parts of the elastic part 143 and the sliding part 142 smaller. Therefore, the elastic part 143 and the sliding part 142 are not easily damaged. Furthermore, by being located in the receiving groove, the tensioning mechanism 140 can be more stably fixed on the frame 110.

[0068] In another alternative embodiment, the opening of the connecting groove 112 faces the top of the frame 110, and the receiving groove 111 is provided with an opening facing the top of the frame 110. In this arrangement, both the connecting groove 112 and the receiving groove 111 are open structures in the direction facing the top surface of the frame 110, thus facilitating the disassembly and installation of the carrier 120.

[0069] Further, the receiving groove 111 may include a first receiving groove segment 1111, a second receiving groove segment 1112, and a third receiving groove segment 1113 connected in sequence. The first receiving groove segment 1111 and the third receiving groove segment 1113 may be located on opposite sides of the second receiving groove segment 1112. Both the first receiving groove segment 1111 and the third receiving groove segment 1113 are provided with slots facing the outer wall of the frame 110. The second receiving groove segment 1112 is provided with slots facing the outer wall of the frame 110 and slots facing the top of the frame 110. A portion of the connecting part 1422 is located in the second receiving groove segment 1112. The first guide sleeve 161 is located in the first receiving groove segment 1111, and the second guide sleeve 162 is located in the third receiving groove segment 1113.

[0070] In this design, the openings of the first receiving groove 1111 and the second receiving groove 1112 face outwards from the frame 110, and are used to install the corresponding first guide post 1421 and second guide post 1423. Therefore, the first guide post 1421 and the second guide post 1423 are located within their respective receiving grooves and are not exposed outside the frame 110. The connecting part 1422 is located within the second receiving groove 1112, and the connecting part 1422 is exposed outside the frame 110 through the opening of the second receiving groove 1112, thereby facilitating the installation and removal of the carrier 120 by the operator.

[0071] Furthermore, the first receiving groove section 1111, the second receiving groove section 1112, and the third receiving groove section 1113 can guide the corresponding parts of the sliding part 142 within them, thereby improving the sliding accuracy of the sliding part 142 and preventing the sliding part 142 from deviating during the sliding process.

[0072] In the above embodiments, during the transfer process, the tray 130 of the wafer carrier device 100 is prone to relative sliding on the carrier surface, which causes the position of the tray 130 to change, thereby affecting the wafer processing technology.

[0073] Based on this, in another optional embodiment, the tray 130 may include a support surface for carrying the wafer and a support surface supported on the carrier 120. The support surface is disposed opposite to the support surface, and the support surface may have multiple limiting grooves. The limiting grooves extend through the tray 130 along the extending direction of the carrier 120, and the carrier 120 may pass through the limiting grooves. In this solution, the carrier 120 can be engaged in the limiting grooves, thereby making it less likely for the tray 130 to slide relative to the support surface, thus making it less likely for the position of the tray 130 on the support surface to change, and thus less likely to affect the wafer processing technology.

[0074] In the above embodiments, the number and direction of the limiting grooves on each tray 130 can be set according to the arrangement direction and number of the carrier 120, and this document does not impose any restrictions.

[0075] In one specific embodiment, the number of limiting grooves opened on each tray 130 can be at least four, namely a first limiting groove 131, a second limiting groove 132, a third limiting groove 133 and a fourth limiting groove 134. The penetrating directions of the first limiting groove 131, the second limiting groove 132 and the third limiting groove 133 are parallel, and the second limiting groove 132 is located between the first limiting groove 131 and the third limiting groove 133.

[0076] The penetrating direction of the fourth limiting groove 134 intersects the penetrating directions of the first limiting groove 131, the second limiting groove 132 and the third limiting groove 133.

[0077] In this design, the first limiting groove 131, the second limiting groove 132, and the third limiting groove 133 can limit the pallet 130 in one direction, while the fourth limiting groove 134 can limit the pallet 130 in another direction. These four limiting grooves enable the pallet 130 to achieve limiting engagement in two intersecting directions, making it difficult for the pallet 130 to shift on the bearing surface, thus further improving the limiting performance of the pallet 130. Furthermore, since the pallet 130 has three limiting grooves in one direction, three corresponding bearing members 120 are provided in that direction to support the pallet 130. Therefore, the supporting force on the pallet 130 is relatively uniform, and the pallet 130 is less prone to tilting.

[0078] Specifically, the penetrating direction of the first limiting groove 131, the second limiting groove 132, and the third limiting groove 133 can be the length direction of the pallet 130, that is, each pallet 130 is supported by three bearing members 120 in this direction. The penetrating direction of the fourth limiting groove 134 can be the width direction of the pallet 130, that is, each pallet 130 is supported by one bearing member 120 in this direction.

[0079] To prevent the support member 120 from falling out of the limiting groove, in another optional embodiment, the limiting groove may include a first limiting groove segment 135 and a second limiting groove segment 136 that are connected. The width of the opening of the first limiting groove segment 135 may be smaller than the width of the support member 120, and the width of the opening of the second limiting groove segment 136 may be larger than the width of the support member 120. In this solution, the width of the opening of the first limiting groove segment 135 is smaller than the width of the support member 120, making it less likely for the support member 120 to fall out of the first limiting groove segment 135. The width of the opening of the second limiting groove segment 136 is larger than the width of the support member 120 to facilitate the assembly of the support member 120 with the limiting groove.

[0080] Specifically, the first limiting groove segment 135 can be formed on the opposite edges of the pallet 130, and the first limiting groove segments 135 on both sides can be connected through the second limiting groove segment 136. The length of the first limiting groove segment 135 can be flexibly set according to the size of the pallet 130.

[0081] In the above embodiment, the limiting groove on the edge of the tray 130 can be formed as a stepped structure, that is, the side of the limiting groove facing the edge is a through structure, and the limiting groove is provided with a slot facing the outer side and a slot facing the bearing surface. In this case, the bearing member 120 can easily detach from the limiting groove on the edge of the tray 130.

[0082] Therefore, in another optional embodiment, the first limiting groove 131 and the third limiting groove 133 can be located on the two side edges of the tray 130, respectively. The first limiting groove 131 and / or the third limiting groove 133 can include a third limiting groove segment 1311 and a fourth limiting groove segment 1312 that are connected. The opening of the third limiting groove segment 1311 faces the outer side of the tray 130. The fourth limiting groove segment 1312 can be provided with a groove facing the outer side of the frame 110 and a groove facing the bearing surface. A limiting block 170 can be provided at a portion of the groove of the fourth limiting groove segment 1312 facing the outer side of the frame 110.

[0083] In this design, the opening of the third limiting groove segment 1311 faces outward, so the third limiting groove segment 1311 can limit the carrier 120 along the thickness direction of the pallet 130. The fourth limiting groove segment 1312 is provided with a limiting block 170 at a part of the opening facing the bearing surface, so that the position of the limiting block 170 of the fourth limiting groove segment 1312 can limit the carrier 120 in a direction parallel to the pallet 130. At this time, the third limiting groove segment 1311 and the fourth limiting groove segment 1312 can limit the carrier 120 in two perpendicular directions, thereby preventing the carrier 120 from falling out of the limiting groove.

[0084] In the above embodiment, among two adjacent trays 130, the first limiting groove 131 of one tray 130 is close to the third limiting groove 133 of the other tray 130. At this time, the carrier 120 in the first limiting groove 131 of one tray 130 and the carrier 120 in the third limiting groove 133 of the other tray 130 can be connected to two tensioning mechanisms 140 respectively. A certain distance needs to be reserved between the two tensioning mechanisms 140 to prevent interference. Therefore, the distance between the two adjacent trays 130 is large, resulting in a large size of the wafer carrier device 100.

[0085] Based on this, in another optional embodiment, the carrier 120 in the first limiting groove 131 of one adjacent tray 130 and the carrier 120 in the third limiting groove 133 of the other tray 130 can be connected to the same tensioning mechanism 140. In this solution, the carriers 120 in adjacent limiting grooves of two adjacent trays 130 are connected by the same tensioning mechanism 140, thereby shortening the distance between the two adjacent trays 130 and thus making the wafer carrier device 100 smaller in size.

[0086] The multiple carriers 120 in this application can adopt various arrangement structures. This document discloses a specific arrangement structure. Specifically, the wafer carrier device 100 may include a first carrier group and a second carrier group. Both the first and second carrier groups may include multiple carriers 120. The extension direction of the multiple carriers 120 in the first carrier group is a first direction, and their arrangement direction is a second direction. The extension direction of the multiple carriers 120 in the second carrier group is the second direction, and their arrangement direction is the first direction. The first direction and the second direction are perpendicular.

[0087] In this design, the bearing surface is composed of two sets of 120 bearing members arranged in a crisscross pattern, resulting in better bearing performance.

[0088] Specifically, the first direction can be the length direction of the frame 110, and the second direction can be the width direction of the frame 110.

[0089] One end of the support member 120 connected to the frame 110 can be welded to the frame 110. In this solution, it is inconvenient to disassemble and install the support member 120 and the frame 110.

[0090] Based on this, in another optional embodiment, the wafer carrier 100 may further include a fixing plate 150, and the fixing end of the carrier 120 may be pressed onto the frame 110 by the fixing plate 150, which is then fixed to the frame 110 by threaded fasteners. In this solution, the carrier 120 and the frame 110 can be disassembled and installed by the fixing plate 150 and the frame 110, thereby making the disassembly and installation of the carrier 120 and the frame 110 more convenient.

[0091] The tensioning mechanism 140 in this application can be flexibly configured according to the deformation requirements of the wafer carrier 100. The tensioning mechanism 140 can be set at a position on the wafer carrier 100 that is prone to deformation. For example, the central region of the wafer carrier 100 is prone to sagging deformation, so the tensioning mechanism 140 can be set at one end of the carrier member 120 corresponding to the central region. Alternatively, a tensioning mechanism 140 can be set at one end of each carrier member 120, or both ends of each carrier member 120 can be provided with a tensioning mechanism 140.

[0092] In an optional embodiment, multiple tensioning mechanisms 140 can be disposed on the same side of the frame 110. In this approach, by providing tensioning mechanisms 140 on one side of the frame 110, the carrier members 120 in the same direction can be tensioned, thereby ensuring that the deformation of the wafer carrier device 100 is within the tolerance range. Furthermore, the number of tensioning mechanisms 140 is relatively small, resulting in lower cost. Therefore, the above solution can both ensure that the deformation of the wafer carrier device 100 is within the tolerance range and reduce the cost of the wafer carrier device 100.

[0093] Based on the wafer carrier device 100 of any of the above embodiments of this application, this application also discloses a semiconductor process apparatus having the wafer carrier device 100 of any of the above embodiments.

[0094] The semiconductor process equipment disclosed in this application also includes a process chamber. When the semiconductor process equipment is in operation, the wafer carrier device 100 carrying the wafer is transferred to the process chamber by a robot arm.

[0095] Based on the wafer carrier device of the above embodiments of the present invention, the present invention also discloses an adjustment method for the wafer carrier device, which is applied to the wafer carrier device described above, such as... Figure 14 As shown, the adjustment method includes:

[0096] S100: Loosen the movable end of the bearing member 120 fixed on the tensioning mechanism 140, and connect the movable end of the bearing member 120 to the force measuring device.

[0097] The force gauge is used to measure the tensile force of the bearing 120.

[0098] S200. Apply a tensile force to the movable end of the bearing member 120. When the tensile force causes the deformation of the bearing member 120 to be less than or equal to the preset deformation, record the tensile force value.

[0099] When the tensile force on the bearing member 120 increases, the supporting force of the bearing member 120 on the pallet 130 increases, thereby reducing the deformation of the bearing member 120 and keeping it within the deformation range. The deformation can be measured using measuring tools, such as laser measuring instruments.

[0100] S300. Adjust the tensioning mechanism 140 so that the tension force of the tensioning mechanism 140 is equal to the tensile force value, and then fix the movable end of the bearing member 120 onto the tensioning mechanism 140.

[0101] By adjusting the tension of the tensioning mechanism 140, the tension of the tensioning mechanism 140 on the bearing member 120 is made equal to the tensile force, so as to control the deformation of the bearing member 120 within the deformation range.

[0102] In the embodiments disclosed in this application, the tensioning mechanism 140 can tension the carrier 120 to increase the supporting force of the carrier 120 on the tray 130, thereby reducing the deformation of the wafer carrier device 100. This makes the wafer less prone to damage, improving the safety of the wafer during transport.

[0103] Specifically, when adjusting the tension of the tensioning mechanism 140, the elastic part 143 is compressed by turning the adjusting member 144, thereby adjusting the position of the sliding part 142. Different positions of the sliding part 142 result in different tensions in the tensioning mechanism 140. When the sliding part 142 moves toward the receiving space, the compression of the elastic part 143 increases, its elastic force increases, and the tension force on the bearing member 120 is greater. When the sliding part 142 moves away from the receiving space, the elastic part 143 moves along the side that recovers its elastic deformation, so the compression of the elastic part 143 decreases, its elastic force is smaller, and the tension force on the bearing member 120 is smaller.

[0104] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0105] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A wafer carrier device, characterized in that, include: A frame (110) encloses an accommodating space; Multiple support members (120) are arranged in the accommodating space, and the two ends of the support members (120) are respectively connected to the two sides of the frame (110). At least one end of at least some of the support members (120) is a movable end. Multiple trays (130) are spaced apart and supported on multiple carriers (120), each of the trays (130) is supported by multiple carriers (120), and the trays (130) are used to support wafers; Multiple tensioning mechanisms (140) are provided on the frame (110), and the movable end of the bearing member (120) is connected to the tensioning mechanism (140). The tensioning mechanism (140) is used to tension the bearing member (120) connected to it. The tensioning mechanism (140) includes a fixed part (141), a sliding part (142), an elastic part (143), and an adjusting member (144). The fixed part (141) is fixedly connected to the outer wall of the frame (110). The fixed part (141) has a groove. Part of the sliding part (142) is located in the groove. The sliding part (142) and the groove slide in a sliding engagement along the extension and retraction direction of the elastic part (143). One end of the elastic part (143) abuts against the sliding part (142), and the other end of the elastic part (143) abuts against the frame (110). The movable end of the bearing member (120) is connected to the sliding part (142). One end of the adjusting member (144) abuts against the side of the sliding part (142) away from the elastic part (143) to push the sliding part (142) to slide.

2. The wafer carrier device according to claim 1, characterized in that, The fixing part (141) has a threaded hole that communicates with the slide groove. The threaded hole is disposed opposite to the sliding part (142). One end of the adjusting member (144) passes through the threaded hole and abuts against the side of the sliding part (142) away from the elastic part (143). The adjusting member (144) is threadedly engaged with the threaded hole.

3. The wafer carrier device according to claim 1, characterized in that, The sliding part (142) includes a first guide post (1421), a connecting part (1422), and a second guide post (1423). The first guide post (1421) and the second guide post (1423) are disposed on opposite sides of the connecting part (1422), and the movable end of the carrier (120) is connected to the connecting part (1422). The tensioning mechanism (140) further includes a first guide sleeve (161) and a second guide sleeve (162). Both the first guide sleeve (161) and the second guide sleeve (162) are connected to the fixing part (141). The first guide sleeve (161) and the second guide sleeve (162) have a first opening and a second opening respectively on their sidewalls facing the connecting part (1422). The first guide sleeve (161) is fitted onto the outside of the first guide post (1421) through the first opening, and the second guide sleeve (162) is fitted onto the outside of the second guide post (1423) through the second opening. Part of the connecting part (1422) is located in the sliding groove. The first guide sleeve (161), the second guide sleeve (162), and the sliding groove are used to guide the sliding part (142) in the extension and retraction direction of the elastic part (143). The elastic part (143) includes a first elastic element (1431) and a second elastic element (1432). One end of the first elastic element (1431) abuts against the first guide post (1421), and the other end of the first elastic element (1431) abuts against the frame (110). One end of the second elastic element (1432) abuts against the second guide post (1423), and the other end of the second elastic element (1432) abuts against the frame (110).

4. The wafer carrier device according to claim 3, characterized in that, The connecting part (1422) includes a main body (1422a), a protrusion (1422b) and a pressure plate (1422c). The first guide post (1421) and the second guide post (1423) are disposed on opposite sides of the main body (1422a). The main body (1422a) and the protrusion (1422b) are stacked together. A portion of the protrusion (1422b) is located in the groove and slides with the groove in the extension and retraction direction of the elastic part (143). The pressure plate (1422c) presses against the end face of the protrusion (1422b) away from the main body (1422a), and the pressure plate (1422c) and the protrusion (1422b) press and fix the movable end of the carrier (120).

5. The wafer carrier device according to claim 4, characterized in that, The protrusion (1422b) has a positioning groove (1422b1) on the side facing the pressure plate (1422c). The positioning groove (1422b1) extends through the protrusion (1422b) along the extension direction of the protrusion (1422b) and is used to position the carrier (120).

6. The wafer carrier device according to claim 3, characterized in that, The frame (110) is provided with a plurality of receiving grooves (111), and the plurality of receiving grooves (111) are provided in a one-to-one correspondence with the plurality of tensioning mechanisms (140). The receiving groove (111) is provided with a slot facing the outer wall of the frame (110) and a slot facing the top of the frame (110). The slot of the sliding groove is provided opposite to the slot of the receiving groove (111) facing the outer wall of the frame (110). A part of the sliding part (142) is located in the sliding groove and another part is located in the receiving groove (111). The elastic part (143) is located in the receiving groove (111), and one end of the elastic part (143) abuts against the bottom wall of the receiving groove (111) facing the receiving space. The frame (110) has a plurality of connecting slots (112), which are connected to the plurality of receiving slots (111) one by one. The connecting slots (112) are located on the side of the receiving slots (111) facing the receiving space. The opening of the connecting slots (112) faces the top of the frame (110). The connecting slots (112) pass through the frame (110) along the sliding direction of the sliding part (142). The movable end of the bearing member (120) passes through the connecting slots (112) and is connected to the connecting part (1422).

7. The wafer carrier device according to claim 6, characterized in that, The receiving groove (111) includes a first receiving groove section (1111), a second receiving groove section (1112), and a third receiving groove section (1113) connected in sequence. The first receiving groove section (1111) and the third receiving groove section (1113) are located on opposite sides of the second receiving groove section (1112). The first receiving groove section (1111) and the third receiving groove section (1113) are both provided with a slot facing the outer wall of the frame (110). The second receiving groove section (1112) is provided with a slot facing the outer wall of the frame (110) and a slot facing the top of the frame (110). A portion of the connecting part (1422) is located in the second receiving groove section (1112). The first guide sleeve (161) is located in the first receiving groove section (1111), and the second guide sleeve (162) is located in the third receiving groove section (1113).

8. The wafer carrier device according to claim 1, characterized in that, The tray (130) includes a support surface for supporting the wafer and a support surface supported on the carrier (120). The support surface has a plurality of limiting grooves, which extend through the tray (130) along the extension direction of the carrier (120), and the carrier (120) passes through the limiting grooves.

9. The wafer carrier device according to claim 8, characterized in that, The number of limiting grooves opened on each of the trays (130) is at least four, namely a first limiting groove (131), a second limiting groove (132), a third limiting groove (133) and a fourth limiting groove (134). The penetrating directions of the first limiting groove (131), the second limiting groove (132) and the third limiting groove (133) are parallel. The second limiting groove (132) is located between the first limiting groove (131) and the third limiting groove (133). The penetrating direction of the fourth limiting groove (134) intersects the penetrating directions of the first limiting groove (131), the second limiting groove (132) and the third limiting groove (133).

10. The wafer carrier device according to claim 9, characterized in that, The limiting groove includes a first limiting groove segment (135) and a second limiting groove segment (136) that are connected to each other. The width of the opening of the first limiting groove segment (135) is smaller than the width of the support member (120), and the width of the opening of the second limiting groove segment (136) is larger than the width of the support member (120).

11. The wafer carrier device according to claim 9, characterized in that, The first limiting groove (131) and the third limiting groove (133) are located on the two sides of the tray (130), respectively. The first limiting groove (131) and / or the third limiting groove (133) include a third limiting groove segment (1311) and a fourth limiting groove segment (1312) that are connected. The opening of the third limiting groove segment (1311) faces the outer side of the tray (130). The fourth limiting groove segment (1312) is provided with a groove facing the outer side of the frame (110) and a groove facing the support surface. A limiting block (170) is provided at a part of the groove of the fourth limiting groove segment (1312) facing the outer side of the frame (110).

12. The wafer carrier device according to claim 11, characterized in that, In two adjacent trays (130), the carrier (120) in the first limiting groove (131) of one tray (130) and the carrier (120) in the third limiting groove (133) of the other tray (130) are connected to the same tensioning mechanism (140).

13. The wafer carrier device according to claim 1, characterized in that, The wafer carrier device (100) includes a first carrier group and a second carrier group. Both the first carrier group and the second carrier group include the plurality of carriers (120). The extension direction of the plurality of carriers (120) in the first carrier group is a first direction, and their arrangement direction is a second direction. The extension direction of the plurality of carriers (120) in the second carrier group is a second direction, and their arrangement direction is a first direction. Wherein, the first direction is perpendicular to the second direction.

14. The wafer carrier device according to claim 1, characterized in that, The wafer carrier device (100) further includes a fixing plate (150), the fixing end of the carrier (120) is pressed onto the frame (110) by the fixing plate (150), and the fixing plate (150) is fixed onto the frame (110) by a threaded component.

15. The wafer carrier device according to claim 1, characterized in that, Multiple tensioning mechanisms (140) are disposed on the same side of the frame (110).

16. A semiconductor process apparatus, characterized in that, Includes the wafer carrier device (100) according to any one of claims 1 to 15.

17. A method for adjusting a wafer carrier, applied to a wafer carrier (100) as described in any one of claims 1-15, characterized in that, The adjustment method includes: Loosen the movable end of the carrier (120) fixed on the tensioning mechanism (140), and connect the movable end of the carrier (120) to the force measuring device; A tensile force is applied to the movable end of the bearing member (120), and when the tensile force causes the deformation of the bearing member (120) to be less than or equal to a preset deformation, the tensile force value is recorded. Adjust the tensioning mechanism (140) so that the tension force of the tensioning mechanism (140) is equal to the tensile force value, and then fix the movable end of the bearing member (120) on the tensioning mechanism (140).

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