Substrate cleaning system and substrate cleaning method

Abstract

This invention relates to a substrate cleaning system and a substrate cleaning method. The substrate cleaning system (50) includes a heater (51), a chemical dilution module (52), and a cleaning module. The temperature of the diluted chemical solution mixed by the chemical dilution module (52) is determined to be higher than room temperature and lower than the glass transition temperature of the cleaning component. While the diluted chemical solution at the determined temperature is supplied to the substrate (W), the cleaning component scrubs the substrate (W).

Description

Technical Field

[0001] This invention relates to a substrate cleaning system and a substrate cleaning method. Background Technology

[0002] In the manufacture of semiconductor devices, the following processes are performed in the CMP apparatus for planarizing the substrate surface: a cleaning process in which the substrate surface is polished using a suspension (slurry) containing abrasive particles and polishing aids, and then the slurry adhering to the substrate surface and back surface is removed using a cleaning solution; and a drying process in which droplets adhering to the substrate surface and back surface due to the cleaning process are removed.

[0003] Improper cleaning can lead to structural defects in components, resulting in poor component performance. Therefore, it is essential to select a cleaning method that can reliably remove the slurry in a short time without causing damage or corrosion to the components. In this context, scrubbing is mainly applied to roller-shaped or pen-shaped sponge components, with cleaning solutions composed of various chemicals used as auxiliary agents (see, for example, Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 5866227

[0007] Patent Document 2: Japanese Patent Application Publication No. 2002-43267

[0008] Patent Document 3: Japanese Patent Application Publication No. 2010-74191

[0009] The problem that the invention aims to solve

[0010] The scrubbing described in Patent Document 1 is mainly used in wiring processes (back-end processes, BEOL) to form multilayer wiring consisting of copper (Cu) wiring and low-k dielectric films. In recent years, due to the necessity of high-speed logic devices and low-cost memory devices, chemical mechanical polishing (CMP) has also been widely used in transistor processes (front-end processes, FEOL) to form electrodes and plugs.

[0011] Compared to BEOL, the film thickness, linewidth, and line spacing formed in FEOL are finer. Therefore, it is necessary to improve the cleaning performance for small particles or molecular contaminants. Cleaning methods that use heated solutions to promote chemical reactions are promising as a means of achieving this.

[0012] However, in the scrubbing method described in Patent Document 1, if the heated liquid is supplied from the nozzle and the liquid temperature is too high, the mechanical properties of the sponge component will deteriorate due to the heat, raising concerns that the cleaning effect will be lower than when using only room temperature liquid.

[0013] Furthermore, according to the inventors' research, the following problem is known: due to the cooling effect of the substrate rotation during cleaning, the liquid temperature near the periphery of the substrate decreases, resulting in a situation where cleaning cannot be performed at the expected liquid temperature, and thus a stable cleaning effect cannot be obtained. Summary of the Invention

[0014] Therefore, the first objective of this invention is to provide a substrate cleaning system and method, which includes a heated liquid supply unit that improves the cleaning effect. Furthermore, the second objective of this invention is to provide a substrate cleaning apparatus and method that achieves high uniformity of liquid temperature across the entire surface of the substrate being cleaned during the cleaning process.

[0015] [Methods for solving the problem]

[0016] One approach provides a substrate cleaning system comprising: a heater for heating pure water; a chemical dilution module for mixing a chemical solution with the pure water heated by the heater at a predetermined volume ratio; and a cleaning module for cleaning a substrate, the cleaning module comprising: a substrate holding device for holding the substrate; a cleaning member for contacting and wiping the substrate; a chemical supply nozzle for supplying a chemical solution at a predetermined temperature toward the substrate; and a pure water supply nozzle for supplying heated pure water toward the substrate, wherein the temperature of the diluted chemical solution after mixing by the chemical dilution module is determined to be higher than room temperature and lower than the glass transition temperature of the cleaning member; and the cleaning member wiping the substrate while the diluted chemical solution at the determined temperature is supplied to the substrate.

[0017] In one embodiment, the substrate cleaning system includes: a chemical supply line connected to a chemical supply nozzle; and a pure water supply line connected to the pure water supply nozzle. A heater is connected to the pure water supply line and is disposed upstream of a connecting member that connects the chemical supply line and the pure water supply line in the direction of pure water flow.

[0018] In one embodiment, the temperature of the pure water supplied from the pure water supply nozzle is higher than the temperature of the diluted medicine supplied from the medicine supply nozzle.

[0019] In one embodiment, the cleaning module includes: a first filter, which is disposed adjacent to the liquid supply nozzle and captures foreign matter flowing through the liquid supply line; and a second filter, which is disposed adjacent to the pure water supply nozzle and captures foreign matter flowing through the pure water supply line.

[0020] In one embodiment, the liquid supply nozzle is a radiation nozzle that supplies diluted liquid from the center of the substrate held in the substrate holding device to the periphery of the substrate.

[0021] In one embodiment, the liquid supply nozzle comprises: a first liquid supply nozzle that supplies diluted liquid towards the center of the substrate held in the substrate holding device; and a second liquid supply nozzle that supplies diluted liquid towards the periphery of the substrate held in the substrate holding device.

[0022] In one embodiment, the liquid supply nozzle comprises: a surface-side liquid supply nozzle that supplies diluted liquid to the surface of the substrate held in the substrate holding device; and a back-side liquid supply nozzle that supplies diluted liquid to the back side of the substrate held in the substrate holding device.

[0023] In one embodiment, the cleaning module includes a heating device disposed adjacent to the periphery of the substrate held in the substrate holding device, the heating device heating the diluted medicine present in the periphery of the substrate.

[0024] One approach provides a substrate cleaning system comprising: a chemical dilution module for mixing a chemical solution with pure water at a predetermined volume ratio; a cleaning module for cleaning the substrate using a cleaning component in contact with the substrate and the diluted chemical solution supplied by the chemical dilution module; a flow rate adjustment device for adjusting the flow rate of the diluted chemical solution; a heater for heating at least one of the chemical solution, the pure water, and the diluted chemical solution; and a control device for controlling the heater and the flow rate adjustment device such that, when the diluted chemical solution is supplied to the cleaning module, the temperature of the diluted chemical solution is higher than room temperature and lower than the glass transition temperature of the cleaning component.

[0025] One method provides a substrate cleaning method in which pure water is heated by a heater, and a chemical solution is mixed with the heated pure water at a predetermined volume ratio. The temperature of the mixed diluted chemical solution is determined to be higher than room temperature and lower than the glass transition temperature of a cleaning component that cleans the substrate. The diluted chemical solution at the predetermined temperature is supplied to the substrate held in a substrate holding device through a chemical solution supply nozzle. Pure water heated by the heater is supplied to the substrate held in the substrate holding device through a pure water supply nozzle. While the diluted chemical solution at the determined temperature is supplied to the substrate, the substrate is cleaned by the cleaning component.

[0026] In one method, the pure water flowing through the pure water supply line connected to the pure water supply nozzle is heated by the heater. In the direction of pure water flow, downstream of the heater, the medicine solution is mixed with the pure water flowing through the medicine solution supply line, which is connected to the pure water supply line.

[0027] In one embodiment, the temperature of the pure water supplied from the pure water supply nozzle is higher than the temperature of the diluted medicine supplied from the medicine supply nozzle.

[0028] In one embodiment, a first filter, arranged adjacent to the drug supply nozzle, captures foreign matter flowing through the drug supply line, and a second filter, arranged adjacent to the pure water supply nozzle, captures foreign matter flowing through the pure water supply line.

[0029] In one embodiment, a drug supply nozzle, which serves as a radiation nozzle that supplies diluted drug solution from the center of the substrate held in the substrate holding device to the periphery of the substrate, is used to supply diluted drug solution to the substrate held in the substrate holding device.

[0030] In one embodiment, a diluent is supplied to the substrate held in the substrate holding device using a liquid supply nozzle having a first liquid supply nozzle and a second liquid supply nozzle. The first liquid supply nozzle supplies the diluent toward the center of the substrate held in the substrate holding device, and the second liquid supply nozzle supplies the diluent toward the periphery of the substrate held in the substrate holding device.

[0031] In one embodiment, a liquid supply nozzle having a surface-side liquid supply nozzle and a back-side liquid supply nozzle is used to supply a diluted liquid to the substrate held in the substrate holding device. The surface-side liquid supply nozzle supplies the diluted liquid toward the surface of the substrate held in the substrate holding device, and the back-side liquid supply nozzle supplies the diluted liquid toward the back side of the substrate held in the substrate holding device.

[0032] In one embodiment, a heating device disposed adjacent to the periphery of the substrate held in the substrate holding device is used to heat the diluted pharmaceutical solution present in the periphery of the substrate.

[0033] One approach provides a substrate cleaning system comprising: a heater that heats pure water to generate heated pure water; a chemical dilution module that mixes a chemical solution with the heated pure water to generate a heated chemical solution; and a cleaning module that cleans a substrate, the cleaning module comprising: a substrate holding device that holds the substrate; a cleaning component that contacts the substrate and scrubs the substrate; a chemical supply nozzle that supplies the heated chemical solution to the substrate; a pure water supply nozzle that supplies pure water to the substrate; and an internal piping connected to the cleaning component, supplying a heating fluid, which is either the heated pure water or the heated chemical solution, to the cleaning component, the internal piping being connected to at least one of the heater and the chemical dilution module.

[0034] In one embodiment, the internal piping is disposed within the cleaning component and extends along the long side of the cleaning component.

[0035] In one embodiment, the internal piping has at least one opening opposite the cleaning component.

[0036] In one embodiment, the substrate cleaning system further comprises: a chemical supply line connected to the chemical supply nozzle; a pure water supply line connected to the pure water supply nozzle; and a heated fluid delivery line connected to the internal piping, the heater being connected to the pure water supply line, and the heated fluid delivery line being connected to at least one of the pure water supply line and the chemical supply line.

[0037] In one embodiment, the cleaning component is a roller cleaning component with a cylindrical shape, and the length of the long side of the cleaning component is longer than the diameter of the substrate.

[0038] In one embodiment, the cleaning component is a pen-shaped cleaning component, and the internal piping is connected to the upper part of the pen-shaped cleaning component.

[0039] One approach provides a substrate cleaning system comprising: a heater for heating a chemical solution to generate a heated chemical solution; and a cleaning module for cleaning a substrate, the cleaning module comprising: a substrate holding device for holding the substrate; a cleaning component for contacting the substrate and wiping the substrate; a chemical solution supply nozzle for supplying the heated chemical solution to the substrate; a pure water supply nozzle for supplying pure water to the substrate; and an internal piping connected to the cleaning component and supplying the heated chemical solution to the cleaning component, the internal piping being connected to the heater.

[0040] In one embodiment, the internal piping is disposed within the cleaning component and extends along the long side of the cleaning component.

[0041] In one embodiment, the internal piping has at least one opening opposite the cleaning component.

[0042] In one embodiment, the substrate cleaning system further comprises: a chemical supply line connected to the chemical supply nozzle; a pure water supply line connected to the pure water supply nozzle; and a heating fluid delivery line connected to the internal piping, wherein the heater is connected to the chemical supply line and the heating fluid delivery line is connected to the chemical supply line.

[0043] In one embodiment, the cleaning component is a roller cleaning component with a cylindrical shape, and the length of the long side of the cleaning component is longer than the diameter of the substrate.

[0044] In one embodiment, the cleaning component is a pen-shaped cleaning component, and the internal piping is connected to the upper part of the pen-shaped cleaning component.

[0045] One method provides a substrate cleaning method in which pure water is heated by a heater to generate heated pure water, a chemical solution is mixed with the heated pure water to generate a heated chemical solution, and a heated fluid, which is either the heated pure water or the heated chemical solution, is supplied to the cleaning component through an internal pipe connected to the cleaning component. While the heated chemical solution is supplied to the substrate from a chemical solution supply nozzle, the heated fluid is supplied to the cleaning component through the internal pipe, and the substrate is scrubbed by the cleaning component.

[0046] In one embodiment, the substrate cleaning method involves, during the wiping process of the substrate, bringing the cleaning component, which has been soaked in the heated fluid, into contact with the central and peripheral portions of the substrate, and supplying the heated fluid to the central and peripheral portions of the substrate through the cleaning component.

[0047] In one embodiment, the substrate cleaning method further includes the following step: after wiping the substrate, supplying pure water to the substrate from a pure water supply nozzle.

[0048] One method provides a substrate cleaning method in which a chemical solution is heated by a heater to generate a heated chemical solution, the heated chemical solution is supplied to the cleaning component through an internal pipe connected to the cleaning component, and the substrate is wiped by the cleaning component while the heated chemical solution is supplied to the substrate from a chemical solution supply nozzle and to the cleaning component through the internal pipe.

[0049] In one embodiment, the substrate cleaning method involves, during the wiping process of the substrate, bringing the cleaning component, which has been soaked in the heated solution, into contact with the central and peripheral portions of the substrate, and supplying the heated solution to the central and peripheral portions of the substrate through the cleaning component.

[0050] In one embodiment, the substrate cleaning method further includes the following step: after wiping the substrate, supplying pure water to the substrate from a pure water supply nozzle.

[0051] [The effects of the invention]

[0052] The substrate cleaning system supplies the diluted cleaning solution to the substrate at a temperature higher than room temperature but lower than the glass transition temperature of the cleaning components. While the diluted solution is being supplied, the cleaning components scrub the substrate. Therefore, the substrate cleaning system achieves optimal cleaning results.

[0053] Furthermore, the substrate cleaning system supplies heated fluid (heated pure water or heated chemical solution) to the surface of the substrate to be cleaned via internal piping and cleaning components. At this time, the cleaning components contact not only the center of the substrate but also its periphery, thus the heated fluid is not cooled by the rotational motion of the substrate and is supplied throughout the entire substrate. Therefore, the substrate cleaning apparatus and method can achieve highly uniform liquid temperature across the entire surface of the substrate during the cleaning process, resulting in a stable removal of particulate contaminants, molecular contaminants, and metallic elemental contaminants. Attached Figure Description

[0054] Figure 1 This is a top view showing the overall configuration of the substrate processing apparatus.

[0055] Figure 2 This is a diagram showing a substrate cleaning system.

[0056] Figure 3 This is a diagram representing the first cleaning module.

[0057] Figure 4 This is a diagram representing the second cleaning module.

[0058] Figure 5 This is a diagram illustrating another embodiment of the substrate cleaning system.

[0059] Figure 6 This diagram shows a heater arranged adjacent to the periphery of the substrate W.

[0060] Figure 7 This diagram shows a cup-shaped object designed to prevent liquid splashing, positioned adjacent to the periphery of the substrate.

[0061] Figure 8 This is a diagram illustrating another embodiment of the liquid medicine supply nozzle.

[0062] Figure 9 This diagram illustrates another embodiment of the liquid medicine supply nozzle.

[0063] Figure 10 This is a diagram illustrating one embodiment of a series of cleaning / drying sequences performed by a substrate cleaning system and a drying module.

[0064] Figure 11 This diagram illustrates the cleaning process performed by the first cleaning module on the surface and back of the substrate.

[0065] Figure 12 This is a diagram illustrating the cleaning effect produced by the composition of the cleaning module.

[0066] Figure 13 This is a diagram illustrating another embodiment of the substrate cleaning system.

[0067] Figure 14 This is a diagram illustrating another embodiment of the substrate cleaning system.

[0068] Figure 15 This is a diagram illustrating another embodiment of the substrate cleaning system.

[0069] Figure 16 This is a diagram illustrating another embodiment of the substrate cleaning system.

[0070] Figure 17 It means Figures 13 to 16 A perspective view of one embodiment of the cleaning module shown.

[0071] Figure 18 It means Figure 17 A cross-sectional view of a portion of the first cleaning module shown.

[0072] Figure 19 This is a perspective view showing another embodiment of the second cleaning module.

[0073] Figure 20 It means Figure 19A cross-sectional view of a portion of the second cleaning module shown.

[0074] Figure 21 It means to indicate Figure 13 The flowchart shows the sequence of cleaning the substrate by the first cleaning module.

[0075] Figure 22 This is a diagram illustrating the effect of liquid temperature uniformity on the surface of the substrate in one embodiment of the substrate cleaning system. Detailed Implementation

[0076] Embodiments of the present invention will be described below with reference to the figures. Furthermore, in the figures described below, the same symbols are used to denote the same or equivalent components, and repeated descriptions are omitted.

[0077] The embodiments described below relate to a substrate cleaning method (and substrate cleaning system) for cleaning the surface (and back side) of a substrate (particularly a semiconductor wafer), and particularly to a substrate cleaning method performed in a substrate cleaning process after substrate polishing such as CMP, where the surface of the substrate is cleaned. This substrate cleaning method is also applied to cleaning processes in applications such as flat panel manufacturing, image sensor manufacturing (e.g., complementary metal-oxide-semiconductor, charge-coupled device (CCD) devices), and magnetic film manufacturing for MRAM (magnetic random access memory).

[0078] Furthermore, unless otherwise specified, "upper" indicates the direction in which the cleaning tool is located, starting from the substrate, and "lower" indicates the opposite direction. Also, regarding the cleaning tool and its components, "top surface" or "surface" refers to the side of the cleaning tool that contacts the substrate. Furthermore, the central portion of the substrate refers to the area including the center of the substrate, and the peripheral portion of the substrate refers to the annular area excluding the center of the substrate; that is, the area surrounding the central portion of the substrate and located further away from the center of the substrate when viewed from the center of the substrate. It is a fixed-width area on the surface of the substrate W along the outer periphery of the substrate W.

[0079] Figure 1 This is a top view showing the overall configuration of the substrate processing apparatus 1 (more specifically, a polishing apparatus) using the above-described substrate cleaning method. Figure 1 As shown, the substrate processing apparatus 1 includes: a housing 10; and a loading port 12, which holds a substrate cassette for storing a large number of semiconductor wafers and other substrates. The loading port 12 is arranged adjacent to the housing 10.

[0080] The substrate processing apparatus 1 includes a polishing section 2 and a cleaning section 4 disposed inside the housing 10. The polishing section 2 includes a plurality of polishing modules 14A to 14D (four in this embodiment). The cleaning section 4 includes a first cleaning module 16 and a second cleaning module 18 for cleaning the polished substrate, and a drying module 20 for drying the cleaned substrate. The polishing modules 14A to 14D are arranged along the long side of the substrate processing apparatus 1. Similarly, the first cleaning module 16, the second cleaning module 18, and the drying module 20 are arranged along the long side of the substrate processing apparatus 1.

[0081] The substrate processing apparatus 1 includes: a first transport robot 22, disposed adjacent to a loading port 12; and a transport module 24, disposed adjacent to polishing modules 14A to 14D. The first transport robot 22 receives substrates before polishing from the loading port 12 and transfers them to the transport module 24, while simultaneously receiving dried substrates from a drying module 20 and returning them to the loading port 12. The transport module 24 transports the substrates received from the first transport robot 22, transferring the substrates between the polishing modules 14A to 14D.

[0082] The substrate processing apparatus 1 includes: a second transport robot 26 disposed between the first cleaning module 16 and the second cleaning module 18; and a third transport robot 28 disposed between the second cleaning module 18 and the drying module 20. The second transport robot 26 transfers substrates between the transport module 24 and each of the cleaning modules 16 and 18. The third transport robot 28 transfers substrates between each of the modules 18 and 20.

[0083] The substrate processing apparatus 1 includes a control device 30 disposed inside the housing 10. The control device 30 is configured to control the operation of each device in the substrate processing apparatus 1. In this embodiment, the control device 30 is specifically configured to control the operation of the substrate cleaning system 50 described below.

[0084] Figure 2 This diagram illustrates a substrate cleaning system 50. The substrate processing apparatus 1 includes the substrate cleaning system 50. The substrate cleaning system 50 includes: a heater 51 for heating pure water; a solution dilution module (in other words, a solution supply module) 52 for mixing the solution with the pure water heated by the heater 51 at a predetermined volume ratio; and cleaning modules 16 and 18 for cleaning the substrate. In this embodiment, the substrate cleaning system 50 includes a first cleaning module 16 and a second cleaning module 18; however, in one embodiment, the substrate cleaning system 50 may also include either the first cleaning module 16 or the second cleaning module 18.

[0085] Figure 3 This is a diagram representing the first cleaning module 16. (See diagram below.) Figure 3As shown, the first cleaning module 16 includes: a substrate holding device 60 that holds the substrate W while rotating it; cleaning components 61 and 62 that contact the substrate W to clean it; liquid supply nozzles 65 and 66 that supply liquid at a predetermined temperature to the surface W1 and back surface W2 of the substrate W; and pure water supply nozzles 67 and 68 that supply heated pure water to the surface W1 and back surface W2 of the substrate W.

[0086] The drug supply nozzle 65 is a surface-side drug supply nozzle that supplies diluted drug solution to the surface W1 of the substrate W. The drug supply nozzle 66 is a back-side drug supply nozzle that supplies diluted drug solution to the back side W2 of the substrate W. Similarly, the pure water supply nozzle 67 is a surface-side pure water supply nozzle that supplies pure water to the surface W1 of the substrate W. The pure water supply nozzle 68 is a back-side pure water supply nozzle that supplies pure water to the back side W2 of the substrate W. The drug supply nozzle 66 and the pure water supply nozzle 68 not only clean the back side W2 of the substrate W, but also prevent the temperature of the drug solution and pure water on the surface W1 of the substrate W from dropping through their heat transfer function.

[0087] Each cleaning component 61 and 62 is a sponge component with a cylindrical shape and a length in the long direction that is longer than the diameter of the substrate W. The sponge component is preferably made of a highly hydrophilic material, such as PU (polyurethane) or PVA (polyvinyl alcohol). The central axis of each cleaning component 61 and 62 is arranged parallel to the surfaces of the substrate W (i.e., surface W1 and back surface W2). Hereinafter, cleaning component 61 is sometimes referred to as the upper side roller cleaning component 61, and cleaning component 62 is sometimes referred to as the lower side roller cleaning component 62.

[0088] like Figure 3 As shown, the substrate holding device 60 includes four rollers 60a to 60d, which hold the substrate W horizontally with its surface W1 facing upwards and rotate it. The rollers 60a to 60d are configured to move in directions of approaching and separating from each other via a drive mechanism (e.g., a cylinder) not shown in the figure.

[0089] In this embodiment, the substrate holding device 60 includes rollers 60a to 60d as its constituent elements. However, the substrate holding device 60 is not limited to rollers as long as it can hold the side of the substrate W. Multiple clamps (not shown in the figure) may also be used instead of rollers. The clamps are configured to move between a position holding the periphery of the substrate W and a position away from the substrate W.

[0090] In one embodiment, the substrate holding device 60 may also be configured to hold the substrate W in a vertical direction. In this case, the rollers 60a to 60d (or clamps) are arranged longitudinally.

[0091] The first cleaning module 16 includes a rotation mechanism 69 that rotates the upper side roller cleaning component 61 and the lower side roller cleaning component 62. The upper side roller cleaning component 61 and the lower side roller cleaning component 62 are respectively supported by a lifting mechanism (not shown in the figure) and can be moved in the vertical direction by the lifting mechanism. As an example of the lifting mechanism, a motor drive mechanism or a cylinder using a ball screw can be listed.

[0092] When the substrate W is loaded and unloaded, the upper roller cleaning component 61 and the lower roller cleaning component 62 separate from each other. During the cleaning of the substrate W, the upper roller cleaning component 61 and the lower roller cleaning component 62 move towards each other, contacting the surface and back of the substrate W. Then, the upper roller cleaning component 61 and the lower roller cleaning component 62 are rotated by the rotating mechanism 69 to wipe (clean) the substrate W.

[0093] Figure 4 This is a diagram representing the second cleaning module 18. (See diagram for example.) Figure 4 As shown, the second cleaning module 18 includes: a substrate holding device 60 that holds the substrate W while rotating it; a cleaning member 71 that contacts the substrate W to clean the substrate W; liquid supply nozzles 75 and 76 that supply liquid at a predetermined temperature to the surface W1 and back surface W2 of the substrate W; and pure water supply nozzles 77 and 78 that supply heated pure water to the surface W1 and back surface W2 of the substrate W.

[0094] The drug supply nozzle 75 is a surface-side drug supply nozzle that supplies diluted drug solution to the surface W1 of the substrate W. The drug supply nozzle 76 is a back-side drug supply nozzle that supplies diluted drug solution to the back surface W2 of the substrate W. Similarly, the pure water supply nozzle 77 is a surface-side pure water supply nozzle that supplies pure water to the surface W1 of the substrate W. The pure water supply nozzle 78 is a back-side pure water supply nozzle that supplies pure water to the back surface W2 of the substrate W.

[0095] The cleaning member 71 is a sponge member with a pen shape that rotates around its central axis while contacting the surface W1 of the substrate W to clean the substrate W. Hereinafter, the cleaning member 71 is sometimes referred to as the pen-shaped cleaning member 71. The substrate holding device 60 has four rollers 60a to 60d (or clamps) that hold the substrate W horizontally with the surface W1 facing upwards and rotate it.

[0096] The second cleaning module 18 includes a swing mechanism 79 that swings the pen-shaped cleaning component 71. The pen-shaped cleaning component 71 is supported by a lifting mechanism (not shown) and can move vertically via the lifting mechanism. As an example of the lifting mechanism, a motor drive mechanism or a cylinder using a ball screw can be cited.

[0097] The oscillation mechanism 79 is configured to oscillate the pen-shaped cleaning member 71 in the radial direction of the substrate W. When the pen-shaped cleaning member 71 oscillates, the central axis direction of the pen-shaped cleaning member 71 is perpendicular to the surface W1 (or back surface W2) of the substrate W.

[0098] In one embodiment, the oscillating mechanism 79 contacts the bottom surface of the rotating pen-shaped cleaning member 71 with the surface W1 of the rotating substrate W with a predetermined pressing force, while oscillating the pen-shaped cleaning member 71 from the center of the substrate W toward the periphery of the substrate W (unidirectional oscillation). In another embodiment, the oscillating mechanism 79 contacts the bottom surface of the rotating pen-shaped cleaning member 71 with the surface W1 of the rotating substrate W with a predetermined pressing force, while oscillating the pen-shaped cleaning member 71 from the periphery of the substrate W, passing through the center of the substrate W, and then toward the periphery of the substrate W (back-and-forth oscillation). In this way, the pen-shaped cleaning member 71 cleans the substrate W (cleaning).

[0099] As described above, while the first cleaning module 16 is cleaning the substrate W using the roller cleaning member 61 and the lower roller cleaning member 62, it supplies a cleaning solution to the surface W1 and back surface W2 of the substrate W through the cleaning solution supply nozzles 65 and 66. The cleaning solution is, for example, an alkaline cleaning solution. Specifically, it is preferably an aqueous solution containing any one of ammonia, primary amine, secondary amine, tertiary amine, or quaternary ammonium compounds as components. Similarly, while the pen-shaped cleaning member 71 is cleaning the substrate W, the second cleaning module 18 supplies a cleaning solution (e.g., an alkaline cleaning solution) to the surface W1 and back surface W2 of the substrate W through the cleaning solution supply nozzles 75 and 76. (Refer to the following...) Figure 2 This describes the drug supply unit that supplies the drug solution to the substrate W.

[0100] like Figure 2 As shown, the substrate cleaning system 50 includes: a chemical supply line 80 connected to chemical supply nozzles 65, 66 and 75, 76; a pure water supply line 81 connected to pure water supply nozzles 67, 68 and 77, 78; and a pure water return line 83, which circulates pure water from the pure water supply line 81 to the heater 51.

[0101] Heater 51 is connected to pure water supply line 81. Drug supply line 80 is connected to pure water supply line 81 and is positioned downstream of heater 51 in the flow direction of pure water flowing through pure water supply line 81. Drug supply line 80 is connected to pure water supply line 81 via connecting member 82. Therefore, heater 51 is positioned upstream of connecting member 82 in the flow direction of pure water.

[0102] Heater 51 heats the pure water flowing through pure water supply line 81 to a predetermined temperature. More specifically, downstream of heater 51, adjacent to heater 51, a flow sensor 84 and a temperature sensor 85 are disposed. Control device 30 (see reference) Figure 1 It is electrically connected to the flow sensor 84 and the temperature sensor 85. Based on the temperature data transmitted from the temperature sensor 85, it controls the operation of the heater 51 in such a way that the temperature of the pure water flowing through the pure water supply line 81 is a predetermined temperature and the flow rate of the pure water is a predetermined flow rate.

[0103] Figure 1 In the illustrated embodiment, the heater 51 internally includes: a heater element 54 for heating pure water flowing through the pure water supply line 81; and a flow rate adjustment device 55 for adjusting the flow rate of pure water flowing through the pure water supply line 81. The heater element 54 can be, for example, an infrared irradiation type heater. Specifically, halogen heaters, carbon heaters, ceramic heaters, quartz tube heaters, etc., can also be used as heaters. As long as the heater is a known heating unit such as an electric heater (resistance, arc, inductive, dielectric (microwave), infrared, laser, heat pump), light, hot air, or burner, and meets the required installation environment, start-up time, and temperature conditions, and can maintain its temperature, it is acceptable. Furthermore, if warm water can be supplied from the installed plant, the device can also be used.

[0104] Figure 1 In the illustrated embodiment, heater 51 heats the pure water flowing through the pure water supply line 81 and adjusts the flow rate of the pure water. In one embodiment, heater 51 may also be disposed downstream of the drug dilution module 52. In this case, heater 51 heats the diluted drug solution and adjusts the flow rate of the diluted drug solution. In another embodiment, heater 51 may also be disposed on the drug connection line 52b (described below). In this case, heater 51 heats the drug stock solution and adjusts the flow rate of the drug stock solution. Thus, heater 51 is configured to heat at least one of pure water, diluted drug solution, and drug stock solution, and adjust the flow rate of at least one of pure water, diluted drug solution, and drug stock solution. Furthermore, Figure 1 The illustrated embodiment includes a single heater 51, but the number of heaters 51 is not limited to this embodiment. Multiple heaters 51 may also be provided.

[0105] In one embodiment, the flow rate adjustment device 55 may also be provided as a separate component from the heater 51. In this case, the flow rate adjustment device 55 may be disposed in any one of the drug supply line 80, the pure water supply line 81, and the drug connection line 52b. Furthermore, the number of flow rate adjustment devices 55 is not limited to this embodiment. Multiple flow rate adjustment devices 55 may also be provided.

[0106] In one embodiment, the heater 51 may also be a heating device with a built-in flow sensor 84 and a temperature sensor 85. In another embodiment, the substrate cleaning system 50 may further include flow sensors (not shown) and temperature sensors (not shown) arranged adjacent to the chemical supply nozzles 65, 66, 75, 76 and the pure water supply nozzles 67, 68, 77, 78. The number of temperature sensors may also correspond to the number of pure water supply nozzles and the number of chemical supply nozzles.

[0107] Pure water heated to a predetermined temperature by heater 51 flows through pure water supply line 81. Then, the heated pure water is split midway through pure water supply line 81 and flows through pure water supply line 81 and medicine supply line 80.

[0108] The drug dilution module 52 is connected to the drug supply line 80. More specifically, the drug dilution module 52 includes: a drug supply source 52a; and a drug connection line 52b that connects the drug supply source 52a and the drug supply line 80.

[0109] The drug dilution module 52 adds the room-temperature drug concentrate supplied from the drug supply source 52a to the heated pure water flowing in the drug supply line 80 via the drug supply connection line 52b. In this way, the drug dilution module 52 mixes and dilutes the room-temperature drug concentrate with the heated pure water at a predetermined volume ratio. Therefore, the temperature of the pure water supplied from the pure water supply nozzles 67, 68, 77, and 78 is higher than the temperature of the diluted drug concentrate supplied from the drug supply nozzles 65, 66, 75, and 76.

[0110] The temperature of the diluted solution mixed by the solution dilution module 52 is determined to be higher than room temperature and lower than the glass transition temperature of the cleaning components 61, 62 (and / or cleaning component 71). The reason is as follows. In order to improve the cleaning effect of the substrate W, in other words, from the point of view of promoting chemical reaction, it is desirable that the temperature of the diluted solution is higher than room temperature and lower than the boiling point of water by 100°C.

[0111] However, when cleaning the substrate W while supplying a heated cleaning solution, the heat resistance of the cleaning component (notation omitted) must be considered. As mentioned above, the cleaning component is composed of a sponge component. The sponge component is generally made of thermoplastic resin, and therefore has a glass transition temperature in the temperature range below its melting point.

[0112] The glass transition temperature is the temperature at which a resin exists between a rigid glassy state and a soft rubbery state; temperatures higher than this range result in a significant decrease in the elastic modulus. In other words, the rigidity of the sponge component decreases, consequently weakening its scrubbing effect. Therefore, it is desirable for the temperature of the cleaning solution to be above room temperature but below the glass transition temperature of the sponge component during scrubbing. For example, in the case of a sponge component made of polyvinyl alcohol (PVA) resin, its glass transition temperature is approximately 60°C.

[0113] In this embodiment, the cleaning components 61 and 62 (and / or 71) wipe the substrate W while the heating solution with a temperature determined to be higher than room temperature and lower than the glass transition temperature of the cleaning components 61, 62 (and / or 71) is supplied to the substrate W.

[0114] Depending on the type of cleaning component used, the glass transition temperature varies. Therefore, the control device 30 pre-stores the glass transition temperature corresponding to each cleaning component in the storage device 30a. The control device 30 includes a processing device 30b, which performs calculations based on the data stored in the storage device 30a. The storage device 30a is a component of the control device 30. The control device 30 controls the temperature of the heating solution based on the cleaning component used and the glass transition temperature stored in the storage device 30a.

[0115] According to the above embodiment, the scrubbing effect will not decrease due to the reduction in the mechanical properties of the sponge component, and the chemical reaction (e.g., reduction in surface tension, reduction in kinematic viscosity, and dissolution of organic matter) will be promoted by heating the chemical solution. As a result, the substrate cleaning system 50 can achieve a high cleaning effect on the substrate W. Furthermore, when rinsing is performed instead of scrubbing the substrate W, the temperature of the heated chemical solution can also be higher than the glass transition temperature.

[0116] like Figure 2 As shown, a filter 86 is disposed upstream of the connecting member 82. This filter 86 captures foreign matter mixed in with the pure water flowing through the pure water supply line 81. If pure water heated by the heater 51 flows through the pure water supply line 81, there is a concern that foreign matter adhering to the inner wall of the pure water supply line 81 may be detached due to the heating of the pure water. In this case, the detached foreign matter will flow through the pure water supply line 81 (and the chemical supply line 80) and be supplied to the substrate W. In this embodiment, the substrate cleaning system 50 has a filter 86 disposed adjacent to the heater 51, thus preventing foreign matter from being supplied to the substrate W.

[0117] To more reliably prevent foreign matter from being supplied to the substrate W, the substrate cleaning system 50 may also include a filter 87 disposed adjacent to the pure water supply nozzle 67 and a filter 88 disposed adjacent to the pure water supply nozzle 77. Although not shown in the figure, the substrate cleaning system 50 may also include filters disposed adjacent to the pure water supply nozzles 68 and 78.

[0118] Similarly, the substrate cleaning system 50 may also include a filter 90 disposed adjacent to the liquid supply nozzle 65 and a filter 91 disposed adjacent to the liquid supply nozzle 75. Although not shown in the figure, the substrate cleaning system 50 may also include filters disposed adjacent to the liquid supply nozzles 66 and 76.

[0119] An on / off valve 120 is disposed upstream of filter 87, an on / off valve 121 is disposed upstream of filter 88, an on / off valve 122 is disposed upstream of filter 90, and an on / off valve 123 is disposed upstream of filter 91. These on / off valves 120, 121, 122, and 123 are electrically connected to the control device 30. Therefore, the control device 30 operates the on / off valves 120, 121, 122, and 123 respectively, thereby supplying pure water and / or pharmaceutical solution to the substrate W.

[0120] More specifically, the pharmaceutical solution supply line 80 includes: a first pharmaceutical solution diversion line 80A, equipped with a filter 87 and an on / off valve 120; and a second pharmaceutical solution diversion line 80B, equipped with a filter 91 and an on / off valve 123. Similarly, the pure water supply line 81 includes: a first pure water diversion line 81A, equipped with a filter 90 and an on / off valve 122; and a second pure water diversion line 81B, equipped with a filter 88 and an on / off valve 121.

[0121] like Figure 2 As shown, a pure water return line 83 is connected to the pure water supply line 81 and the heater 51. The pure water return line 83 is provided as a heat preservation unit to prevent the temperature of the pure water present in the pure water supply line 81 from dropping when the cleaning unit 4 is in standby mode. By providing the pure water return line 83, the temperature of the pure water present in the pure water supply line 81 can be maintained at a fixed level. Therefore, during processing in the polishing unit 2 of the substrate W, when the cleaning unit 4 is in standby mode, pure water returns to the heater 51 through the pure water supply line 81 and the pure water return line 83. As a result, the pure water flowing through the pure water supply line 81 can be maintained at a fixed temperature.

[0122] The pure water return line 83 includes: a first return branch line 83A, connected to the first pure water branch line 81A and equipped with an on / off valve 124; and a second return branch line 83B, connected to the second pure water branch line 81B and equipped with an on / off valve 125.

[0123] On / off valves 124 and 125 are electrically connected to control device 30. When cleaning unit 4 is in standby mode, control device 30 opens on / off valves 124 and 125 and closes on / off valves 120, 121, 122, and 123. Through this operation, pure water circulates between the pure water supply line 81, the pure water return line 83, and the heater 51. As a result, the circulating pure water is maintained at a constant temperature. When cleaning unit 4 is in operation, control device 30 closes on / off valves 124 and 125 and opens on / off valves 120, 121, 122, and 123.

[0124] Figure 5 This is a diagram illustrating another embodiment of the substrate cleaning system 50. In this embodiment, components that are the same or equivalent to those in the above embodiment are labeled with the same symbols, and repeated descriptions are omitted.

[0125] like Figure 5 As shown, the substrate cleaning system 50 may also include a heat insulation component 100 covering the chemical supply line 80 and the pure water supply line 81. The heat insulation component 100 can minimize the temperature drop of the heated chemical solution flowing through the chemical supply line 80 and the heated pure water flowing through the pure water supply line 81. As a result, the heated pure water and heated chemical solution reach the first cleaning module 16 and the second cleaning module 18 respectively while maintaining their respective temperatures. Thus, by providing the heat insulation component 100, the thermal efficiency of the heater 51 can be improved.

[0126] As described above, by supplying the heated chemical solution to the substrate W, the chemical action of the solution is promoted, thereby improving the cleaning effect of the substrate W. To uniformly supply the heated chemical solution to the entire substrate W, the solution is supplied to the center of the rotating substrate W. The centrifugal force generated by the rotating substrate W acts on the heated chemical solution supplied to the center of the substrate W, causing the solution to diffuse from the center of the substrate W towards its periphery and outwards in the radial direction.

[0127] In this embodiment, the supply position of the heated medicine is fixed. However, in one embodiment, the heated medicine can be supplied to the substrate W while the medicine supply nozzle 65 (and / or medicine supply nozzle 66) swings between the center of the substrate W and the periphery of the substrate W.

[0128] Therefore, the temperature of the heating solution on the periphery of the substrate W may be lower than the temperature of the heating solution at the center of the substrate W. As a result, there is a concern that the cleaning effect at the periphery of the substrate W is lower than that at the center of the substrate W. Therefore, the first cleaning module 16 (and the second cleaning module 18) may also have a structure that maintains the temperature of the heating solution on the periphery of the substrate W and the temperature of the heating solution at the center of the substrate W at the same temperature.

[0129] Figure 6This is a diagram showing a heater 101 disposed adjacent to the periphery of the substrate W. Figure 6 In the illustrated embodiment, the description focuses on the heater 101 located in the first cleaning module 16, but the heater 101 can also be located in the second cleaning module 18. Figure 6 As shown, the cleaning module 16 may also include a heater 101 disposed adjacent to the periphery of the substrate W.

[0130] Heater 101 is a heating device used to heat the heating solution (and heated pure water) present on the periphery of the substrate W. Heater 101 can maintain the temperature of the heating solution (and heated pure water) on the periphery of the substrate W at the same temperature as the temperature of the heating solution (and heated pure water) at the center of the substrate W. Therefore, the cleaning effect on the periphery of the substrate W can be improved.

[0131] Figure 7 This diagram shows a liquid splash-proof cup-shaped member 102 disposed adjacent to the periphery of the substrate W. (See diagram) Figure 7 As shown, the first cleaning module 16 may also include a heater 105 disposed inside the anti-splash cup 102. The anti-splash cup 102 is a component that blocks liquid splashing from the substrate W to prevent liquid from splashing.

[0132] A heater 105 is mounted on the inner circumferential surface of the anti-splash cup 102 and surrounds the substrate W. The heater 105, located on the anti-splash cup 102, can maintain the temperature of the heating solution (and heated pure water) on the periphery of the substrate W at the same temperature as the temperature of the heating solution (and heated pure water) at the center of the substrate W. Therefore, the cleaning effect on the periphery of the substrate W can be improved.

[0133] Figure 8 This is a diagram illustrating another embodiment of the liquid medicine supply nozzle 65 (and the pure water supply nozzle 67). (See diagram below.) Figure 8 As shown, the liquid medicine supply nozzle 65 (and the pure water supply nozzle 67) can also be a radiation nozzle that supplies heated, diluted liquid medicine from the center of the substrate W held in the substrate holding device 60 to the periphery of the substrate W. Preferably, the radiation nozzle has a generally circular, elliptical, or flat area in the cross-section of the spray pattern on the surface of the substrate W. For example, fan-shaped nozzles or conical nozzles can be cited as examples of radiation nozzles.

[0134] The liquid supply nozzle 65, which serves as a radiation nozzle, can uniformly supply liquid from the center of the substrate W to its periphery. Therefore, the liquid supply nozzle 65 can maintain the temperature of the heated liquid (and heated pure water) on the periphery of the substrate W at the same temperature as the temperature of the heated liquid (and heated pure water) on the center of the substrate W. This allows the temperature of the surface of the substrate W to be cleaned to be maintained at the same level.

[0135] In one embodiment, the liquid medicine supply nozzle 66 (and the pure water supply nozzle 68) can also be a radiation nozzle. Furthermore, the liquid medicine supply nozzles 75 and 76 and the pure water supply nozzles 77 and 78 provided in the second cleaning module 18 can also be radiation nozzles.

[0136] Figure 9 This is a diagram illustrating another embodiment of the liquid medicine supply nozzle 65 (and the pure water supply nozzle 67). (See diagram) Figure 9 As shown, the liquid supply nozzle 65 (and the pure water supply nozzle 67) may also include: a first liquid supply nozzle 65A (and a first pure water supply nozzle 67A) for supplying diluted liquid towards the center of the substrate W held in the substrate holding device 60; and a second liquid supply nozzle 65B (and a second pure water supply nozzle 67B) for supplying diluted liquid towards the periphery of the substrate W held in the substrate holding device 60.

[0137] In one implementation method, it is also possible to Figure 8 The implementation methods shown are the same as Figure 9 The embodiment shown is a combination of these components. In this case, the first liquid supply nozzle 65A (and the first pure water supply nozzle 67A) and the second liquid supply nozzle 65B (and the second pure water supply nozzle 67B) are respectively radiation nozzles.

[0138] Figure 10 This is a diagram illustrating one embodiment of a series of cleaning / drying sequences performed by the substrate cleaning system 50 and the drying module 20. Figure 10 In the illustrated embodiment, the cleaning / drying sequence performed using the first cleaning module 16 and the drying module 20 is described. In one embodiment, the cleaning sequence can also be performed using the second cleaning module 18 and the drying module 20.

[0139] In one embodiment, the cleaning / drying sequence can also be performed using a single module (i.e., a cleaning / drying module) consisting of cleaning module 16 or cleaning module 18. With this configuration, the transport robot 28 (see reference 1) can be omitted. Figure 1 Therefore, the processing capacity of the substrate processing device 1 can be increased.

[0140] In one embodiment, the cleaning / drying module may also have an exhaust port located below the substrate W transported into it. With this configuration, the cleaning / drying module can create a downdraft within its cleaning / drying chamber, rapidly expelling the vapors (mist) of the heated pure water and pharmaceutical solution. As a result, the cleaning / drying module can prevent vapors from re-adhering to the substrate W.

[0141] like Figure 10As shown in step S101, firstly, a heated chemical solution is supplied to the substrate W to perform rinsing of the substrate W. Then, the supply of heated chemical solution continues so that the cleaning components 61 and 62 can scrub the substrate W (refer to step S102). After that, the cleaning components 61 and 62 are removed from the substrate W, and the substrate W is rinsed again (refer to step S103). After step S103 is completed, the supply of heated chemical solution is stopped, and heated pure water is started to perform rinsing of the substrate W (refer to step S104).

[0142] In this embodiment, heated pure water is supplied to perform rinsing of the substrate W, thereby quickly removing the heated chemical solution adhering to the substrate W and shortening the rinsing time. The temperature of the heated pure water supplied in step S104 is higher than the temperature of the heated chemical solution supplied in step S101. After rinsing the substrate W with heated pure water, the substrate W is transported to the drying module 20 to dry the substrate W (see step S105).

[0143] Figure 11 This diagram illustrates the cleaning process performed by the first cleaning module 16 on the surface W1 and back surface W2 of the substrate W. Figure 11 As shown, the cleaning of substrate W is performed in the following manner. First, using transport module 24 (refer to...) Figure 1 The standby substrate W is transported to the first cleaning module 16. In one embodiment, heated pure water can also be supplied to the standby substrate W using the transport module 24. In this case, the transport module 24 is equipped with a heated pure water supply nozzle (not shown) for supplying heated pure water to the standby substrate W.

[0144] The substrate holding device 60 holds the substrate W transported to the first cleaning module 16, and in this state, the substrate W begins to rotate (see step S201). Then, heated cleaning solution is supplied to both sides of the substrate W (i.e., surface W1 and back surface W2) through the cleaning solution supply nozzles 65 and 66 (see step S202). After cleaning begins, in order to clean the entire substrate W evenly, it is desirable to preheat it to prevent temperature differences between the central and peripheral areas of the substrate W. From this perspective, it is desirable that the supply of cleaning solution to the surface W1 and the back surface W2 of the substrate W be performed simultaneously.

[0145] After the heating solution is supplied, the cleaning components 61 and 62 are moved from the predetermined standby position to the predetermined processing position, and the cleaning components 61 and 62 are brought into contact with both sides of the substrate W (refer to step S203). Then, the cleaning components 61 and 62 begin to clean the substrate W (refer to step S204), and the cleaning of the substrate W is performed.

[0146] After the substrate W is cleaned, the cleaning components 61 and 62 are removed from the substrate W (refer to step S205) and moved to the standby position (refer to step S206). Then, the supply of heating solution is stopped (refer to step S207). Next, heated pure water is supplied (refer to step S208) to rinse the substrate W. Steps S206, S207, and S208 can be performed sequentially or simultaneously. When these steps are performed simultaneously, the substrate cleaning system 50 can shorten the time for a series of cleaning sequences.

[0147] After rinsing of substrate W is completed, the supply of heated pure water is stopped (refer to step S209), and substrate W stops rotating (refer to step S210). Then, substrate W is transported to drying module 20. In drying module 20, for example, nozzles for spraying IPA vapor and nozzles for spraying inactive gas are arranged adjacent to the front end of an arm that swings on substrate W. While supplying IPA vapor to the rotating substrate W, and simultaneously supplying inactive gas to substrate W, the arm swings on substrate W to dry the substrate W. Drying is performed in this way by drying module 20. Afterward, the dried substrate W is returned to loading port 12.

[0148] Figure 12 This is a diagram illustrating the cleaning effect produced by the configuration of the cleaning module in the above embodiment. Figure 12 The image shows the process performed on a substrate W with a silicon oxide film formed thereon. Figure 10 The comparison results of the number of defects (number of contaminant particles) on the surface of the silicon oxide film during the cleaning sequence shown are shown. The silicon oxide film contains particles of slurry, etc., that were just polished.

[0149] The heating solution temperature in Comparative Example 1 was 22°C. A room-temperature solution was used in Comparative Example 1. The heating solution temperature in this embodiment was 55°C. In this embodiment, a solution with a temperature higher than room temperature but lower than the glass transition temperature of the cleaning component (symbol omitted) was used. The heating solution temperature in Comparative Example 2 was 63°C. A solution with a temperature higher than the glass transition temperature of the cleaning component was used in Comparative Example 2.

[0150] Depend on Figure 12 It is evident that, when using the heated cleaning solution in this embodiment, the number of contaminant particles present on the substrate W is significantly lower than the number of contaminant particles in Comparative Example 1 and Comparative Example 2. According to this embodiment, the substrate cleaning system 50 achieves optimal cleaning results.

[0151] In the above embodiments, roller cleaning components and pen-shaped cleaning components are used as examples for description as cleaning components, but the cleaning component may also be a component other than roller cleaning components and pen-shaped cleaning components. In one embodiment, the cleaning component may also be a polishing pad.

[0152] Figure 13 This diagram illustrates another embodiment of the substrate cleaning system 50. Operation and references to this embodiment are not specifically described. Figure 2 The above-described embodiments are the same, so repeated descriptions are omitted.

[0153] The substrate cleaning system 50 includes: a heater 51 for heating pure water to generate heated pure water; a chemical dilution module 52 for mixing chemical solution with heated pure water to generate heated chemical solution; and a cleaning module 16 for cleaning the substrate. In one embodiment, the substrate cleaning system 50 may include a second cleaning module 18 (see reference). Figure 4 Alternatively, it can replace the first cleaning module 16, or it can have both the first cleaning module 16 and the second cleaning module 18.

[0154] The substrate cleaning system 50 further includes: a chemical supply line 80 connected to chemical supply nozzles 65 and 66; a pure water supply line 81 and a room temperature pure water supply line 81-2 connected to pure water supply nozzles 67 and 68; and a pure water return line 83, which circulates pure water from the pure water supply line 81 to the heater 51. The pure water supply line 81 is connected to the heater 51. In the pure water supply line 81, downstream of the heater 51 in the pure water flow direction, the chemical supply line 80 is connected to the pure water supply line 80 via a connecting member 82. In one embodiment, compared with the reference... Figure 2 The implementation method described is the same, and the substrate cleaning system 50 may also omit the room temperature pure water supply line 81-2. Also, refer to... Figure 2 The described implementation can also be achieved using a configuration with a room temperature pure water supply line 81-2.

[0155] The first cleaning module 16 has internal pipes 63a and 64a that are respectively connected to the cleaning components 61 and 62. The internal pipes 63a and 64a are respectively disposed inside the cleaning components 61 and 62 and extend along the long side (axial direction) of the cleaning components 61 and 62.

[0156] The substrate cleaning system 50 further includes heated fluid delivery lines 111A and 111B connected to the pure water supply line 81 and internal piping 63a and 64a. One end of the heated fluid delivery lines 111A and 111B is connected to the pure water supply line 81, and the other end is connected to the internal piping 63a and 64a respectively via rotary connectors (not shown in the figure). Heated pure water flowing through the pure water supply line 81 flows into the internal piping 63a and 64a through the heated fluid delivery lines 111A and 111B, and is then directly supplied to the interior of the cleaning components 61 and 62 from multiple openings in the internal piping 63a and 64a. The heated pure water permeates the entire cleaning components 61 and 62, and is supplied to the surface W1 and back surface W2 of the substrate W that are in contact with the cleaning components 61 and 62. The configuration of the first cleaning module 16 of this embodiment is described in detail below.

[0157] The heater 51 internally includes: a heater element 54 for heating pure water flowing through the pure water supply line 81; and a flow regulating device 55 for regulating the flow rate of the pure water flowing through the pure water supply line 81. An example of the heater element 54 is an infrared lamp heater. An example of the flow regulating device 55 is a diaphragm pump. The heater 51 heats the pure water flowing through the pure water supply line 81 to a predetermined temperature. The pure water, heated to the predetermined temperature by the heater 51, flows through the pure water supply line 81. Subsequently, the heated pure water is diverted from the pure water supply line 81 and flows through the pharmaceutical solution supply line 80 and the heated fluid transport lines 111A and 111B.

[0158] The drug dilution module 52 is connected to the drug supply line 80. The drug dilution module 52 includes: a drug supply source 52a; and a drug connection line 52b connecting the drug supply source 52a and the drug supply line 80. The drug dilution module 52 mixes and dilutes the room temperature drug stock solution with heated pure water at a predetermined volume ratio, thereby generating a heated drug solution.

[0159] The liquid supply line 80 is connected to the liquid supply nozzles 65 and 66 downstream of the liquid supply module 52 in the direction of liquid flow of the heated liquid. The liquid supply line 80 is equipped with on / off valves 120A and 120B. On / off valve 120A is located between the liquid supply module 52 and the liquid supply nozzle 65, and on / off valve 120B is located between the liquid supply module 52 and the liquid supply nozzle 66.

[0160] Heating fluid delivery lines 111A and 111B are connected to the pure water supply line 81 downstream of the heater 51 in the direction of pure water flow. A room temperature pure water supply line 81-2 is connected to the pure water supply line 81 upstream of the heater 51 in the direction of pure water flow. On-off valves 122A and 122B are respectively installed on the pure water supply line 81. On-off valve 122A is located between the heater 51 and the pure water supply nozzle 67, and on-off valve 122B is located between the heater 51 and the pure water supply nozzle 68. On-off valves 122C and 122D are respectively installed on the room temperature pure water supply line 81-2. On-off valves 126A and 126B are respectively installed on the heating fluid delivery lines 111A and 111B. On-off valves 126A and 126B are located between the cleaning components 61 and 62 and the pure water supply line 81. An on-off valve 124 is installed on the pure water return line 83. In the pure water supply line 81, an on / off valve 127 is provided on the upstream side of the heater 51 in the direction of pure water flow.

[0161] On / off valves 120A, 120B, 122A, 122B, 122C, 122D, 124, 126A, 126B, and 127 are respectively connected to control device 30 (refer to...). Figure 1 The electrical connection allows the control device 30 to control the opening and closing of valves 120A, 120B, 122A, 122B, 122C, 122D, 124, 126A, 126B, and 127. During standby cleaning, the control device 30 opens valves 124 and 127 and closes valves 120A, 120B, 122A, 122B, 122C, 122D, 126A, and 126B. Through this operation, pure water circulates through the pure water supply line 81, the pure water return line 83, and the heater 51. As a result, the heated pure water is maintained at a constant temperature.

[0162] The control device 30 operates the on / off valves 120A, 120B, 122A, 122B, 122C, and 122D respectively, thereby supplying pure water and / or heated pharmaceutical solution to the substrate W. If on / off valves 122A and 122B are opened and on / off valves 122C and 122D are closed, heated pure water is supplied to the pure water supply nozzles 67 and 68. If on / off valves 122C and 122D are opened and on / off valves 122A and 122B are closed, room temperature pure water is supplied to the pure water supply nozzles 67 and 68. Thus, heated pure water or room temperature pure water can be selectively supplied to the substrate W from the pure water supply nozzles 67 and 68. If the control device 30 opens the on / off valves 126A and 126B, the heated pure water flows through the heated fluid delivery lines 111A and 111B and into the internal piping 63a and 64a. The heated pure water is then supplied to the surface W1 and back surface W2 of the substrate W through the cleaning components 61 and 62.

[0163] Figure 14 This diagram illustrates another embodiment of the substrate cleaning system 50. Operation and references to this embodiment are not specifically described. Figure 2 and Figure 13 The embodiments described above are the same, so repeated descriptions are omitted. See also... Figure 13 In the described embodiment, heated pure water, used as a heating fluid, is supplied to the cleaning components 61 and 62, but... Figure 14 In the illustrated embodiment, a heating solution, which serves as a heating fluid, is supplied to the cleaning components 61 and 62.

[0164] like Figure 14 As shown, heating fluid delivery lines 111A and 111B, connected to internal piping 63a and 64a, are connected to the liquid supply line 80. If the control device 30 opens the on / off valves 126A and 126B, the heated liquid flows through the heating fluid delivery lines 111A and 111B and into the internal piping 63a and 64a. The heated liquid is further supplied directly to the interior of the cleaning components 61 and 62 from multiple openings in the internal piping 63a and 64a. The heated liquid permeates the entire cleaning components 61 and 62, supplying the surface W1 and back surface W2 of the substrate W in contact with the cleaning components 61 and 62.

[0165] Figure 15 This diagram illustrates another embodiment of the substrate cleaning system 50. Operation and references to this embodiment are not specifically described. Figure 14 The above-described embodiments are the same, so repeated descriptions are omitted. Figure 15 In the illustrated embodiment, the medicinal liquid is directly heated by heater 51, thereby generating a heated medicinal liquid. The medicinal liquid is supplied from medicinal liquid supply source 52a to medicinal liquid supply line 80, which is connected to medicinal liquid supply nozzles 65 and 66. Heater 51 is connected to medicinal liquid supply line 80, and heater 51 heats the medicinal liquid flowing through medicinal liquid supply line 80 to a predetermined temperature. The heated medicinal liquid, heated to the predetermined temperature by heater 51, flows through medicinal liquid supply line 80. Afterward, the heated medicinal liquid is diverted from medicinal liquid supply line 80 and flows through heated fluid transport lines 111A and 111B.

[0166] Pure water flows on the pure water supply line 81 and is connected to pure water supply nozzles 67 and 68. In this embodiment, room temperature pure water is supplied from the pure water supply nozzles 67 and 68. However, a heater can also be provided on the pure water supply line 81 to generate heated pure water, which is then supplied from the pure water supply nozzles 67 and 68. (Alternatively, refer to the reference...) Figure 13 The described implementation method is the same, and it can also be configured to selectively supply heated pure water or room temperature pure water from pure water supply nozzles 67 and 68. Also, refer to... Figure 2 The above-described configuration, in which the heated medicinal liquid is generated by directly heating the medicinal liquid through the heater 51, can also be applied in the described embodiments.

[0167] Figure 16 This diagram illustrates another embodiment of the substrate cleaning system 50. Operation and references to this embodiment are not specifically described. Figure 2 and Figure 14 The above-described embodiments are the same, so repeated descriptions are omitted. Figure 16 In the illustrated embodiment, internal piping 63a and 64a are connected to both the pure water supply line 81 and the medicine supply line 80 via heated fluid transport lines 111A and 111B. A first switching valve 129 is disposed between the heated fluid transport lines 111A and 111B and the pure water supply line 81, and a second switching valve 130 is disposed between the heated fluid transport lines 111A and 111B and the medicine supply line 80. The first switching valve 129 and the second switching valve 130 are connected to the control device 30 (see reference). Figure 1 The electrical connection allows the control device 30 to control the opening and closing of the first switching valve 129 and the second switching valve 130.

[0168] If the first switching valve 129 is opened and the second switching valve 130 is closed, the pure water supply line 81 is connected to the internal piping 63a and 64a via the first switching valve 129 and the heating fluid delivery lines 111A and 111B. Therefore, heated pure water flows from the pure water supply line 81 into the internal piping 63a and 64a through the first switching valve 129 and the heating fluid delivery lines 111A and 111B. If the second switching valve 130 is opened and the first switching valve 129 is closed, the medicine supply line 80 is connected to the internal piping 63a and 64a via the second switching valve 130 and the heating fluid delivery lines 111A and 111B. Therefore, heated medicine flows from the medicine supply line 80 into the internal piping 63a and 64a through the second switching valve 130 and the heating fluid delivery lines 111A and 111B. Thus, the internal piping 63a and 64a connected to the heating fluid delivery lines 111A and 111B are selectively connected to the pure water supply line 81 or the medicine supply line 80.

[0169] Figure 17 It means Figures 13 to 16 A perspective view of one embodiment of the first cleaning module 16 shown. Figure 18 It means Figure 17 A cross-sectional view of a portion of the first cleaning module 16 shown. Operation and reference of this embodiment unless otherwise specified. Figure 3 The embodiments described above are the same, so repeated descriptions are omitted. Figure 17As shown, the first cleaning module 16 includes: rollers 60a to 60d for holding and rotating the substrate W; cleaning components 61 and 62 for wiping the substrate W; a rotating mechanism 69 for rotating the cleaning components 61 and 62; liquid supply nozzles 65 and 66 for supplying heated liquid to the surface W1 and back surface W2 of the substrate W; and pure water supply nozzles 67 and 68 for supplying heated pure water to the surface W1 and back surface W2 of the substrate W.

[0170] Rollers 60a to 60d can move in directions of approaching and separating via a drive mechanism (e.g., a cylinder) not shown in the figure. Rollers 60a to 60d form a two-section structure consisting of retaining portions 60a-1 to 60d-1 and shoulders (support portions) 60a-2 to 60d-2. The diameter of shoulders 60a-2 to 60d-2 is larger than the diameter of retaining portions 60a-1 to 60d-1, and retaining portions 60a-1 to 60d-1 are respectively located on shoulders 60a-2 to 60d-2.

[0171] When holding the substrate W, the substrate W is first placed on the shoulders 60a-2 to 60d-2. Then, the rollers 60a to 60d move in a direction closer to each other, thereby holding the periphery of the substrate W by the holding portions 60a-1 to 60d-1. At least one of the rollers 60a to 60d is configured to rotate via a rotating mechanism (e.g., a spindle) not shown in the figure, thereby rotating the substrate W while it is held by the rollers 60a to 60d.

[0172] like Figure 18 As shown, the top surface of the shoulders 60a-2 to 60d-2 has a cone shape that slopes downward toward the outside. During the holding period of the holding parts 60a-1 to 60d-1, the substrate W remains in a non-contact state with the shoulders 60a-2 to 60d-2.

[0173] Back Figure 17 The drug supply nozzle 65 is a surface-side drug supply nozzle that supplies diluted drug solution to the surface W1 of the substrate W. The drug supply nozzle 66 is a back-side drug supply nozzle that supplies diluted drug solution to the back surface W2 of the substrate W. Similarly, the pure water supply nozzle 67 is a surface-side pure water supply nozzle that supplies pure water to the surface W1 of the substrate W. The pure water supply nozzle 68 is a back-side pure water supply nozzle that supplies pure water to the back surface W2 of the substrate W.

[0174] Each cleaning component 61 and 62 is a sponge component with a cylindrical shape and a length in the long side direction that is longer than the diameter of the substrate W. The direction of the central axis of each cleaning component 61 and 62 is arranged parallel to the surface of the substrate W (i.e., the surface W1 and the back surface W2). Hereinafter, cleaning component 61 is sometimes referred to as the upper side roller cleaning component 61, and cleaning component 62 is sometimes referred to as the lower side roller cleaning component 62.

[0175] When the substrate W is loaded and unloaded, the upper roller cleaning component 61 and the lower roller cleaning component 62 separate from each other. During the cleaning of the substrate W, the upper roller cleaning component 61 and the lower roller cleaning component 62 move towards each other and come into contact with the surface W1 and back surface W2 of the substrate W. The upper roller cleaning component 61 and the lower roller cleaning component 62 are rotated by the rotating mechanism 69, thus wiping (cleaning) the entire surface of the rotating substrate W.

[0176] The rotating mechanism 69 includes an upper cleaning component rotating mechanism 69A, a lower cleaning component rotating mechanism 69B, a guide rail 69C, and a lifting mechanism 69D. The upper cleaning component rotating mechanism 69A is mounted on the guide rail 69C, which determines its vertical movement, and is also supported by the lifting mechanism 69D. The upper roller cleaning component 61 can move vertically via the lifting mechanism 69D. An example of the lifting mechanism 69D is a motor-driven mechanism or cylinder using a ball screw. The lower cleaning component rotating mechanism 69B is also supported by a guide rail (not shown) and a lifting mechanism, and the lower roller cleaning component 62 can move vertically.

[0177] like Figure 18 As shown, the first cleaning module 16 includes shafts 63 and 64 disposed inside the cleaning components 61 and 62. Shaft 63 is the rotation axis of the cleaning component 61, and shaft 64 is the rotation axis of the cleaning component 62. Shaft 63 includes an internal pipe 63a with multiple openings 63b, and shaft 64 includes an internal pipe 64a with multiple openings 64b. A heating fluid consisting of heated pure water or heated medicinal solution is supplied from heating fluid delivery lines 111A and 111B to the internal pipes 63a and 64a (see reference). Figures 13 to 16 ).

[0178] Multiple openings 63b and 64b are arranged on the entire outer periphery of the internal pipes 63a and 64a, respectively, and communicate with the interior of the internal pipes 63a and 64a. The internal pipes 63a and 64a are longer than the diameter of the substrate W, and the multiple openings 63b and 64b are arranged transversely to the substrate W. The openings 63b and 64b are opposite to the cleaning components 61 and 62. More specifically, the openings 63b and 64b are opposite to the inner surfaces of the cleaning components 61 and 62. Therefore, the heating fluid, consisting of heated pure water or heated medicinal solution, supplied through the heating fluid delivery lines 111A and 111B, flows into the internal pipes 63a and 64a and is directly supplied to the interior of the cleaning components 61 and 62 through the openings 63b and 64b. The heating fluid permeates the entire cleaning components 61 and 62, further seeps out to the outside of the cleaning components 61 and 62, and is supplied to the entire surface W1 and back surface W2 of the substrate W.

[0179] According to this embodiment, the cleaning components 61 and 62, which are directly supplied with heated fluid, contact not only the central portion of the substrate W but also its peripheral portion. Therefore, the liquid temperature on the peripheral portion of the substrate W does not decrease due to the cooling effect accompanying the rotation of the substrate W, and the first cleaning module 16 can clean the substrate W at the expected temperature. Thus, the uniformity of the liquid temperature across the entire surface of the substrate W can be improved during the cleaning process, thereby achieving a stable removal of particulate contaminants, molecular contaminants, and metallic element contaminants.

[0180] Figure 19 This is a perspective view showing another embodiment of the second cleaning module 18. Figure 20 It means Figure 19 A cross-sectional view of a portion of the second cleaning module 18 shown. Operation and reference of this embodiment unless otherwise specified. Figure 4 and Figure 13 The embodiments described above are the same, so repeated descriptions are omitted. Furthermore, for the sake of simplicity, the figures are omitted... Figure 13 The diagrams of the valves shown are provided.

[0181] like Figure 19 As shown, the second cleaning module 18 includes: a substrate holding device 74 for holding and rotating the substrate W; a cleaning member 71 for wiping the substrate W; an arm 73 connected to the cleaning member 71; a moving mechanism 79 for moving the cleaning member 71; a liquid supply nozzle 75 for supplying heated liquid to the surface W1 of the substrate W; and a pure water supply nozzle 77 for supplying heated pure water to the surface W1 of the substrate W. Although not shown in the figure, Figure 19 It may also have a nozzle that supplies heating liquid and heating pure water to the back side W2 of the substrate W.

[0182] The substrate holding device 74 includes: clamps 95a to 95d for holding the periphery of the substrate W; and a motor 96 connected to the clamps 95a to 95d. As an example of the clamps 95a to 95d, a spring-loaded clamping mechanism can be cited. The clamps 95a to 95d hold the substrate W, and the substrate W rotates about its axis as a center by driving the motor 96.

[0183] The cleaning component 71 is a pen-shaped sponge component that rotates around its central axis while contacting the surface W1 of the substrate W to clean the substrate W. Hereinafter, the cleaning component 71 is sometimes referred to as the pen-shaped cleaning component 71. The pen-shaped cleaning component 71 is connected at its upper part to an internal piping 72, which is connected to a heating fluid delivery line 111. The heating fluid delivery line 111 is connected to a pure water supply line 81. In one embodiment, the heating fluid delivery line 111 may also be as follows... Figure 14 and Figure 15 As illustrated in the embodiments, it is connected to the drug supply line 80, or as... Figure 16As illustrated in the embodiments shown, the heating fluid delivery line 111 can also be connected to both the pure water supply line 81 and the medicine supply line 80.

[0184] An arm 73 is positioned above the substrate W and connected to a moving mechanism 79. The moving mechanism 79 includes a rotating shaft 79A and a cleaning component moving mechanism 79B. One end of the arm 73 is connected to the rotating shaft 79A, and the other end of the arm 73 is connected to a pen-shaped cleaning component 71. The direction of the central axis of the pen-shaped cleaning component 71 is perpendicular to the surface W1 (or back surface W2) of the substrate W.

[0185] A cleaning component moving mechanism 79B is connected to a rotating shaft 79A, which rotates the arm 73. The cleaning component moving mechanism 79B is configured to rotate the arm 73 in a plane parallel to the substrate W by rotating the rotating shaft 79A at a predetermined angle. The cleaning component 71 moves in the radial direction of the substrate W by rotating the arm 73. The rotating shaft 79A can move vertically via a lifting mechanism (not shown) to press the cleaning component 71 against the surface W1 of the substrate W with a predetermined pressing force to clean the substrate W. As an example of the lifting mechanism, a motor drive mechanism using a ball screw or a cylinder can be cited. In one embodiment, the moving mechanism 79B can also be connected to... Figure 4 The operation is the same as that of the swing mechanism described above.

[0186] like Figure 20 As shown, a pen-shaped cleaning component 71 is fixed to the lower end of a support shaft 73A, which extends vertically relative to the substrate W. The support shaft 73A has a hollow structure and is connected to a cleaning component rotation mechanism 73B located inside the arm 73. The pen-shaped cleaning component 71 rotates about the support shaft 73A via the cleaning component rotation mechanism 73B and moves in the radial direction of the substrate W by rotating around the arm 73, thereby cleaning the surface W1 of the rotating substrate W.

[0187] The pen-shaped cleaning component 71 is connected to an internal conduit 72 that extends through the interior of the support shaft 73A. One end of the internal conduit 72 is connected to the heating fluid delivery line 111, and the other end is connected to the upper part of the pen-shaped cleaning component 71. The internal conduit 72 has an opening 72a opposite to the upper part of the pen-shaped cleaning component 71. Heated pure water, which serves as the heating fluid, is directly supplied to the pen-shaped cleaning component 71 through the opening 72a of the internal conduit 72.

[0188] Heated pure water is used to soak the entire pen-shaped cleaning component 71, and then seeps out to the outside of the pen-shaped cleaning component 71 to supply the surface W1 of the substrate W. In one embodiment, the heated fluid delivery line 111 can also be connected to the liquid supply line 80 (see reference). Figure 19The heating solution is supplied directly to the pen-shaped cleaning component 71 through the internal piping 72.

[0189] According to this embodiment, the pen-shaped cleaning component 71, which is directly supplied with heated pure water or heated medicinal solution, contacts not only the central portion of the substrate W but also its peripheral portion. Therefore, the liquid temperature near the peripheral portion of the substrate W will not decrease due to the cooling effect accompanying the rotation of the substrate W, and cleaning can be performed while maintaining the expected temperature. Thus, the second cleaning module 18 can improve the uniformity of the liquid temperature across the entire surface of the substrate W during the cleaning process, thereby achieving a stable removal of particulate contaminants, molecular contaminants, and metallic element contaminants.

[0190] Figure 21 It means to indicate Figure 13 The flowchart illustrates one embodiment of the cleaning sequence of the first cleaning module 16 for cleaning the substrate W. In a standby state where no substrate W processing is performed, the first cleaning module 16 pre-operates the heater 51 to maintain the temperature of the heated pure water in the pure water supply line 81 at 60°C. In the drug supply line 80, the temperature of the heated drug solution, prepared by the drug dilution module 52 through mixing and diluting room-temperature drug stock solution with heated pure water at a predetermined volume ratio, is maintained at 54°C.

[0191] First, the on / off valves 120A and 120B connected to the liquid supply nozzles 65 and 66, and the on / off valves 122A and 122B connected to the pure water supply nozzles 67 and 68 are closed, while the on / off valves 126A and 126B connected to the internal pipes 63a and 64a are opened (refer to step S301). Heated pure water is supplied to the cleaning components 61 and 62 through the internal pipes 63a and 64a and seeps out to the outside, so the cleaning components 61 and 62 become clean and heated. During the cleaning process of the substrate, the on / off valves 126A and 126B remain open (that is, heated pure water is continuously supplied to the cleaning components 61 and 62).

[0192] The substrate W is transported to the first cleaning module 16, and the peripheral portion of the substrate W is placed on the shoulders 60a-2 to 60d-2. The holding portions 60a-1 to 60d-1 hold the substrate W by moving the rollers 60a to 60d towards the center of the substrate W. If the rollers 60a to 60d rotate, the substrate W begins to rotate (see step S302).

[0193] Open valves 122A and 122B to begin supplying heated pure water from pure water supply nozzles 67 and 68 to both sides of the substrate W (i.e., surface W1 and back W2) (refer to step S303). Close valve 122A to stop supplying heated pure water from pure water supply nozzle 67 to surface W1 of the substrate W (refer to step S304). Open valves 120A and 120B and begin supplying heated medicine to both sides of the substrate W from medicine supply nozzles 65 and 66 (refer to step S305). The substrate W transported to the first cleaning module 16 is at room temperature, so in step S303, heated pure water is supplied to pre-raise the surface temperature of the substrate W, thereby preventing the medicine temperature from dropping when the heated medicine is supplied in step S305.

[0194] The cleaning components 61 and 62 are moved from a predetermined standby position to a predetermined processing position via the lifting mechanism 69D and a lifting mechanism not shown in the figure. While the cleaning components 61 and 62 are rotated via the rotating mechanisms 69A and 69B, they are pressed against both sides of the substrate W to begin cleaning the substrate W (refer to step S306). At this time, heated pure water is supplied to the surface W1 and back surface W2 of the substrate W that are in contact with the cleaning components 61 and 62 via the cleaning components 61 and 62. Therefore, the first cleaning module 16 can perform cleaning while maintaining the liquid temperature on the periphery of the substrate W.

[0195] After a predetermined time, the cleaning components 61 and 62 are moved away from the surface W1 and back surface W2 of the substrate W by the lifting mechanism 69D and a lifting mechanism not shown in the figure, and the wiping ends (see step S307). Then, the on / off valves 120A and 120B are closed to stop the supply of heated liquid from the liquid supply nozzles 65 and 66 to both sides of the substrate W (see step S308). The on / off valve 122A is opened, and heated pure water is supplied from the pure water supply nozzle 67 to the surface W1 of the substrate W again (see step S309). Then, the on / off valves 122A and 122B are closed to stop the supply of heated pure water from the pure water supply nozzles 67 and 68 to both sides of the substrate W (see step S310). Alternatively, in step 309, 122C can be opened instead of the on / off valve 122A to supply room temperature pure water from the pure water supply nozzle 67 to the surface W1 of the substrate W.

[0196] Stop the rotation of rollers 60a-60d to halt the rotation of substrate W (refer to step S311). Move rollers 60a-60d away from the center of substrate W, disengaging holding parts 60a-1-60d-1 from substrate W, and resting the periphery of substrate W on shoulders 60a-2-60d-2. Then, a transport robot (not shown) removes the cleaned substrate W from the first cleaning module 16. Keep valves 126A and 126B open to maintain the cleaning components 61 and 62 in a clean and heated state.

[0197] In the above embodiment, heated pure water, used as the heating fluid, is supplied to the cleaning components 61 and 62. However, in one embodiment, it may also be as described above. Figure 14 and Figure 15 In the described embodiment, a heating solution, serving as a heating fluid, is supplied to the cleaning components 61 and 62. In another embodiment, the heating solution, serving as a heating fluid, may be supplied to the cleaning components 61 and 62 during the cleaning of the substrate W, and heated pure water, serving as a heating fluid, may be supplied to the cleaning components 61 and 62 after cleaning the substrate W. For example, the heating solution may be supplied to the cleaning components 61 and 62 during the step where the solution is being supplied to both sides of the substrate W from the solution supply nozzles 65 and 66 (see steps S305-S308), while heated pure water may be supplied to the cleaning components 61 and 62 in other steps.

[0198] Although the explanation is omitted, please refer to Figure 19 The second cleaning module 18 described herein also conforms to... Figure 21 The cleaning sequence shown is basically the same as that used for cleaning substrate W.

[0199] Figure 22 This is a diagram illustrating the effect of liquid temperature uniformity on the surface W1 of substrate W in one embodiment of the substrate cleaning system. Specifically, it shows the effect of liquid temperature uniformity on the surface W1 of substrate W during the execution of... Figure 21 The diagram shows the liquid temperature measurements at the center and periphery of the surface W1 of the substrate W during the cleaning sequence. The measurement method, for example, is the measurement of radiant heat using a thermal imaging camera.

[0200] Comparative Example 1 illustrates the measurement results under the following conditions: valves 120A and 120B are open to supply heated medicinal solution from nozzles 65 and 66, valve 122B is open to supply heated pure water from nozzle 68, and valves 122A, 126A, and 126B are closed. That is, no heated fluid is supplied to cleaning components 61 and 62.

[0201] Comparative Example 2 illustrates the measurement results under the following conditions: valves 120A and 120B are open to supply heated medicine from nozzles 65 and 66, valve 122B is open to supply heated pure water from nozzle 68, and valve 122A is closed, with unheated pure water supplied from internal pipes 63a and 64a. That is, room temperature pure water is supplied to cleaning components 61 and 62.

[0202] The embodiment illustrates the measurement results in the following state: valves 120A and 120B are open to supply heated medicinal solution from nozzles 65 and 66, valve 122B is open to supply heated pure water from nozzle 68, and valve 122A is closed, with heated pure water supplied from internal pipes 63a and 64a. That is, heated pure water is supplied to cleaning components 61 and 62.

[0203] Depend on Figure 22 It is evident that, in this embodiment, supplying heated pure water from the cleaning units 61 and 62 can prevent the liquid temperature on the surface W1 of the substrate W from decreasing from the temperature of the heated pure water (60°C). Furthermore, it can also reduce the temperature difference between the center and the periphery of the substrate W. Therefore, according to this embodiment, the first cleaning module 16 can not only increase the temperature of the substrate W, but also improve the uniformity of the liquid temperature across the entire surface of the substrate W, thereby achieving a stable effect in removing contaminants from the substrate W.

[0204] The above-described embodiments are intended to enable those skilled in the art to implement the present invention. Those skilled in the art can, of course, make various modifications to the above-described embodiments and apply the technical concept of the present invention to other embodiments. Therefore, the present invention is not limited to the described embodiments, but should be considered as encompassing the broadest scope of the technical concept defined by the claims.

[0205] Industrial availability

[0206] This invention can be applied to substrate cleaning systems and methods for cleaning substrates.

[0207] Symbol Explanation

[0208] 1: Substrate processing device

[0209] 2: Grinding section

[0210] 4: Cleaning Department

[0211] 10: Shell

[0212] 12: Loading Port

[0213] 14A~14D: Grinding Module

[0214] 16: First Cleaning Module

[0215] 18: Second Cleaning Module

[0216] 20: Drying Module

[0217] 22: First Delivery Robot

[0218] 24: Delivery Module

[0219] 26: Second Delivery Robot

[0220] 28: The 3rd Delivery Robot

[0221] 30: Control device

[0222] 30a: Storage device

[0223] 30b: Processing device

[0224] 50: Substrate Cleaning System

[0225] 51: Heater

[0226] 52: Drug dilution module

[0227] 52a: Drug supply source

[0228] 52b: Medicine liquid connection line

[0229] 54: Heater Components

[0230] 55: Flow adjustment device

[0231] 60: Substrate holding device

[0232] 60a~60d: Rollers

[0233] 60a-1~60d-1: Retention section

[0234] 60a-2~60d-2: Shoulder (Supporting Part)

[0235] 61, 62: Cleaning components (roller cleaning components)

[0236] 63, 64: Axles

[0237] 63a,64a: Internal piping

[0238] 63b, 64b: Opening

[0239] 65, 66: Liquid supply nozzles

[0240] 65A: First liquid supply nozzle

[0241] 65B: Second liquid supply nozzle

[0242] 67, 68: Pure water supply nozzles

[0243] 67A: First Pure Water Supply Nozzle

[0244] 67B: Second pure water supply nozzle

[0245] 69: Rotating mechanism

[0246] 69A: Upper cleaning component rotation mechanism

[0247] 69B: Rotating mechanism for lower cleaning components

[0248] 69C: Guide rail

[0249] 69D: Lifting mechanism

[0250] 71: Cleaning component (pen-shaped cleaning component)

[0251] 72: Internal piping

[0252] 73: Arm

[0253] 73A: Support Shaft

[0254] 73B: Rotating mechanism for cleaning components

[0255] 74: Substrate Holding Device

[0256] 75, 76: Liquid supply nozzles

[0257] 77, 78: Pure water supply nozzles

[0258] 79: Swinging mechanism (moving mechanism)

[0259] 79A: Rotation axis

[0260] 79B: Cleaning component moving mechanism

[0261] 80: Medicine Supply Line

[0262] 80A: First drug solution splitter line

[0263] 80B: Second drug solution splitter line

[0264] 81: Pure Water Supply Line

[0265] 81A: First Pure Water Streamline

[0266] 81B: Second Pure Water Streamline

[0267] 81-2: Ambient Temperature Pure Water Supply Line

[0268] 82: Connecting components

[0269] 83: Pure Water Return Line

[0270] 83A: First return feeder line

[0271] 83B: Second feeder line

[0272] 84: Flow sensor

[0273] 85: Temperature sensor

[0274] 86,87,88,90,91: Filters

[0275] 95a~95d: Chuck

[0276] 96: Motor

[0277] 100: Thermal insulation components

[0278] 101: Heater

[0279] 102: Anti-splash cup

[0280] 105: Heater

[0281] 111, 111A, 111B: Heated fluid transport lines

[0282] 120, 120A, 120B, 121, 122, 122A, 122B, 122C, 122D, 123, 124, 125, 126A, 126B, 127: On / off valve

[0283] 129: First switching valve

[0284] 130: Second switching valve

[0285] W: substrate

[0286] W1: Surface

[0287] W2: Back

Claims

1. A substrate cleaning system, characterized in that, have: A heater that heats pure water; A drug dilution module that mixes the drug solution with pure water heated by the heater at a predetermined volume ratio; and The cleaning module cleans the substrate. The cleaning module includes: A substrate holding device that holds the substrate; A cleaning component that contacts the substrate and cleans the substrate; A liquid supply nozzle supplies liquid medicine at a predetermined temperature toward the substrate; and A pure water supply nozzle supplies heated pure water toward the substrate. The temperature of the diluted drug solution after mixing by the drug solution dilution module is determined to be higher than room temperature and lower than the glass transition temperature of the cleaning component; While the substrate is being supplied with a diluted solution of medicine at the determined temperature, the cleaning unit scrubs the substrate.

2. The substrate cleaning system as described in claim 1, characterized in that, The substrate cleaning system includes: A liquid medicine supply line, wherein the liquid medicine supply line is connected to the liquid medicine supply nozzle; and A pure water supply line, which is connected to the pure water supply nozzle. The heater is connected to the pure water supply line and is positioned upstream of the connecting component that connects the medicine supply line and the pure water supply line in the direction of pure water flow.

3. The substrate cleaning system as described in claim 1 or 2, characterized in that, The temperature of the pure water supplied from the pure water supply nozzle is higher than the temperature of the diluted medicine supplied from the medicine supply nozzle.

4. The substrate cleaning system as described in claim 2, characterized in that, The cleaning module includes: A first filter, disposed adjacent to the medicine supply nozzle, captures foreign matter flowing through the medicine supply line; and The second filter is disposed adjacent to the pure water supply nozzle and captures foreign objects flowing through the pure water supply line.

5. The substrate cleaning system as described in claim 1 or 2, characterized in that, The liquid supply nozzle is a radiation nozzle that supplies diluted liquid from the center of the substrate held in the substrate holding device to the periphery of the substrate.

6. The substrate cleaning system as described in claim 1 or 2, characterized in that, The liquid medicine supply nozzle has the following features: A first liquid supply nozzle supplies diluted liquid toward the center of the substrate held in the substrate holding device; and The second liquid supply nozzle supplies diluted liquid to the periphery of the substrate held in the substrate holding device.

7. The substrate cleaning system as described in claim 1 or 2, characterized in that, The liquid medicine supply nozzle has the following features: A surface-side liquid supply nozzle supplies diluted liquid towards the surface of the substrate held in the substrate holding device; and A back-side liquid supply nozzle supplies diluted liquid to the back side of the substrate held in the substrate holding device.

8. The substrate cleaning system as described in claim 1 or 2, characterized in that, The cleaning module includes a heating device disposed adjacent to the periphery of the substrate held in the substrate holding device. The heating device heats the diluted medicine solution present at the periphery of the substrate.

9. A substrate cleaning method, characterized in that, Pure water is heated by a heater. The medicine solution is mixed with pure water heated by the heater at a predetermined volume ratio. The temperature of the mixed diluted solution is determined to be higher than room temperature but lower than the glass transition temperature of the cleaning component used to wipe the substrate. A diluted drug solution, pre-determined to a predetermined temperature, is supplied to the substrate held in the substrate holding device via a drug supply nozzle. Pure water, heated by the heater, is supplied to the substrate held in the substrate holding device through a pure water supply nozzle. While the substrate is supplied with a diluted solution at the determined temperature, the substrate is wiped clean by the cleaning unit.

10. The substrate cleaning method as described in claim 9, characterized in that, The heater heats the pure water flowing through the pure water supply line connected to the pure water supply nozzle. In the direction of pure water flow, downstream of the heater, the medicine solution is mixed with pure water flowing through the medicine solution supply line, which is connected to the pure water supply line.

11. The substrate cleaning method as described in claim 9 or 10, characterized in that, The temperature of the pure water supplied from the pure water supply nozzle is higher than the temperature of the diluted medicine supplied from the medicine supply nozzle.

12. The substrate cleaning method as described in claim 10, characterized in that, Foreign matter flowing through the medicine supply line is captured by a first filter arranged adjacent to the medicine supply nozzle. Foreign matter flowing through the pure water supply line is captured by a second filter arranged adjacent to the pure water supply nozzle.

13. The substrate cleaning method as described in claim 9 or 10, characterized in that, The diluted drug solution is supplied to the substrate held in the substrate holding device using the drug solution supply nozzle, which is a radiation nozzle that supplies diluted drug solution from the center of the substrate held in the substrate holding device to the periphery of the substrate.

14. The substrate cleaning method as described in claim 9 or 10, characterized in that, The diluted drug solution is supplied to the substrate held in the substrate holding device using the drug supply nozzle having a first drug supply nozzle and a second drug supply nozzle. The first drug supply nozzle supplies the diluted drug solution toward the center of the substrate held in the substrate holding device, and the second drug supply nozzle supplies the diluted drug solution toward the periphery of the substrate held in the substrate holding device.

15. The substrate cleaning method as described in claim 9 or 10, characterized in that, The diluted drug solution is supplied to the substrate held in the substrate holding device using the drug supply nozzle having a surface-side drug supply nozzle and a back-side drug supply nozzle. The surface-side drug supply nozzle supplies the diluted drug solution toward the surface of the substrate held in the substrate holding device, and the back-side drug supply nozzle supplies the diluted drug solution toward the back side of the substrate held in the substrate holding device.

16. The substrate cleaning method as described in claim 9 or 10, characterized in that, A heating device disposed adjacent to the periphery of the substrate held in the substrate holding device is used to heat the diluted pharmaceutical solution present in the periphery of the substrate.

17. A substrate cleaning system, characterized in that, have: A heater that heats pure water to produce heated pure water; A drug dilution module that mixes the drug solution with the heated pure water to generate a heated drug solution; and The cleaning module cleans the substrate. The cleaning module includes: A substrate holding device that holds the substrate; A cleaning component that contacts the substrate and cleans the substrate; A liquid supply nozzle supplies the heated liquid to the substrate; A pure water supply nozzle supplies pure water to the substrate; and An internal piping system, connected to the cleaning unit, supplies a heating fluid, either the heated pure water or the heated medicinal solution, to the cleaning unit. The internal piping is connected to at least one of the heater and the drug dilution module.

18. The substrate cleaning system as described in claim 17, characterized in that, The internal piping is disposed within the cleaning component and extends along the long side of the cleaning component.

19. The substrate cleaning system as described in claim 17 or 18, characterized in that, The internal piping has at least one opening opposite the cleaning component.

20. The substrate cleaning system as described in claim 17 or 18, characterized in that, The substrate cleaning system further comprises: A liquid medicine supply line, which is connected to the liquid medicine supply nozzle; A pure water supply line, wherein the pure water supply line is connected to the pure water supply nozzle; and A heated fluid delivery line, which is connected to the internal piping. The heater is connected to the pure water supply line. The heating fluid delivery line is connected to at least one of the pure water supply line and the medicine supply line.

21. The substrate cleaning system as described in claim 17 or 18, characterized in that, The cleaning component is a cylindrical roller cleaning component, and the length of the long side of the cleaning component is longer than the diameter of the substrate.

22. The substrate cleaning system as described in claim 17 or 18, characterized in that, The cleaning component is a pen-shaped cleaning component. The internal piping is connected to the upper part of the pen-shaped cleaning component.

23. A substrate cleaning method, characterized in that, Pure water is heated by a heater to produce heated pure water. The medicinal solution is mixed with the heated pure water to generate a heated medicinal solution. A heating fluid, either the heated pure water or the heated medicinal solution, is supplied to the cleaning unit via internal piping connected to it. While the heated medicine is supplied to the substrate from the medicine supply nozzle, the heated fluid is supplied to the cleaning component through the internal piping, and the substrate is wiped by the cleaning component.

24. The substrate cleaning method as described in claim 23, characterized in that, In the cleaning process of the substrate, the cleaning component, which has been soaked in the heated fluid, is brought into contact with the central and peripheral portions of the substrate, and the heated fluid is supplied to the central and peripheral portions of the substrate through the cleaning component.

25. The substrate cleaning method as described in claim 23 or 24, characterized in that, The process further includes the following steps: after wiping the substrate, pure water is supplied to the substrate from a pure water supply nozzle.

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