Single-phase Immersion Cooling System and Method

Abstract

Provided is a single-phase immersion cooling system, including a fluid-sealed container, a dielectric heat-conducting fluid, at least one heat-generating electronic device, and a heat exchange system. The heat exchange system includes a pump, a heat exchanger, at least one first conduit, and at least one second conduit. The first and second conduits respectively have first and second modifiable portions. The first and second modifiable portions respectively include first and second openings immersed in the dielectric heat-conducting fluid. One of the first and second conduits circulates the dielectric heat-conducting fluid from the heat exchanger outlet into the fluid-sealed container, and the other circulates the dielectric heat-conducting fluid out of the fluid-sealed container through the pump and flows to the heat exchanger inlet. The first and second openings are adjacent to the two most opposite ends of the dielectric heat-conducting fluid accommodated in the fluid-sealed container.

Description

Technical Field

[0001] The embodiments described herein generally relate to the field of heat conduction, and more particularly to a single-phase immersion cooling system and method for cooling electronic devices by circulating a fluid in a fluid-tight containment vessel. Background Art

[0002] During the operation of electrical and electronic components, devices, and systems, heat generated, for example, by a central processing unit, a processing unit, or a graphics card needs to be dissipated quickly and efficiently to maintain the operating temperature within the range recommended by the manufacturer, and this requirement sometimes needs to be met under harsh operating conditions. As the functions and application scopes of these components, devices, and systems progress, the power requirements of these components, devices, and systems also increase, thereby increasing the heat dissipation requirements.

[0003] Several techniques have been developed for removing heat from electrical and electronic components, devices, and systems. One such technique is a liquid cooling system, in which a heat exchanger is in thermal contact with the component, device, and / or system and removes heat from the component, device, and / or system, and then the cooling fluid circulating in the cooling loop system cooperating with the heat exchanger flows through the heat exchanger via a pump unit to remove heat from the heat exchanger. Heat is transferred from the heat source to the heat exchanger, from the heat exchanger to the cooling fluid, and then from the cooling fluid to the outside through a radiator.

[0004] Generally, the maximum operating temperature of electrical and electronic components, devices, and systems is defined, and a suitable liquid cooling system related to the efficiency of the heat exchanger, radiator, and pump is provided. However, as the operating temperature rises, the cost, total installation time, risk of leakage, component wear, and total area requirement of the liquid cooling system all increase. When the disposition of the operating temperature of the electrical and electronic system changes, the increase in cost, total installation time, risk of leakage, component wear, and total area requirement of the liquid cooling system will be more severe. Summary of the Invention

[0005] In one embodiment, a single-phase immersion cooling system is provided that includes a fluid-sealed container, a dielectric heat-conducting fluid, at least one heat-generating electronic device, and a heat exchanger system. The dielectric heat-conducting fluid is contained in the fluid-sealed container, and at least one heat-generating electronic device is immersed in the dielectric heat-conducting fluid. The heat exchanger system includes a pump, a heat exchanger, at least one first conduit, and at least one second conduit. The heat exchanger has a heat exchanger inlet and a heat exchanger outlet. At least one first conduit has a first modifiable portion. The first modifiable portion includes a first opening immersed in the dielectric heat-conducting fluid. At least one second conduit has a second modifiable portion. The second modifiable portion includes a second opening immersed in the dielectric heat-conducting fluid.

[0006] At least one of the at least one first conduit and the at least one second conduit circulates the dielectric heat-conducting fluid from the heat exchanger outlet into the fluid-sealed container, and the other of the at least one first conduit and the at least one second conduit circulates the dielectric heat-conducting fluid through the pump so that the dielectric heat-conducting fluid flows out of the fluid-sealed container and into the heat exchanger inlet. The first opening and the second opening are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container.

[0007] In certain embodiments, the arrangement of the first opening and the second opening creates at least one first flow path to direct a first flow pattern of the dielectric heat-conducting fluid contained in the fluid-sealed container.

[0008] The single-phase immersion cooling system effectively cools at least one heat-generating electronic device (such as a thermoelectric and / or electronic component, device, and / or system), thereby reducing the number of cooling components required for cooling it and reducing costs, total installation time, and total area requirements, where the cooling components are, for example, interface materials, heat sinks, heat dissipation fins, and fans.

[0009] In some embodiments, the fluid-sealed container includes a container having a container opening and a container lid for fluid-sealingly mounting to the container opening. The dielectric heat-conducting fluid, at least one heat-generating electronic device, the first opening, and the second opening are contained in the fluid-sealed container through the container opening.

[0010] The fluid-sealed container includes a container having a container opening and a container lid for fluid-sealingly mounting to the container opening, allowing the user to easily and simply fill the dielectric heat-conducting fluid, thereby reducing the total installation time.

[0011] Since leakage occurring in any of the conduits, mounting parts, and heat exchangers of the liquid cooling system can damage electrical and / or electronic components, devices, and / or systems that cannot be immersed, a liquid cooling system with a heat exchanger that is in thermal contact with electrical and / or electronic components, devices, and / or systems and dissipates heat from them has a relatively high leakage risk, while a single-phase immersion cooling system reduces the leakage risk. The fluid-sealed container also prevents contact between the thermoelectric electrical and / or electronic components, devices, and / or systems and the surrounding environment during operation, thereby slowing down damage caused by high temperature, high humidity, air containing oil or dust, and / or the coastal area environment containing salt.

[0012] In some embodiments, the single-phase immersion cooling system further includes at least one fluid-sealed first conduit inlet and at least one fluid-sealed second conduit inlet. The at least one fluid-sealed first conduit inlet penetrates the fluid-sealed container and is used to provide at least one first conduit from the outside of the fluid-sealed container to the inside of the fluid-sealed container to access the dielectric heat-conducting fluid contained in the fluid-sealed container. The at least one fluid-sealed second conduit inlet penetrates the fluid-sealed container and is used to provide at least one second conduit from the outside of the fluid-sealed container to the inside of the fluid-sealed container to access the dielectric heat-conducting fluid contained in the fluid-sealed container.

[0013] In some embodiments, the at least one heat-generating electronic device includes a main board, a printed circuit board, a central processing unit, a graphics processing unit, a memory, a storage device, a lamp, and any combination of the above, at least one of which.

[0014] In some embodiments, the single-phase immersion cooling system further includes at least one fluid-sealed cable inlet. The at least one fluid-sealed cable inlet penetrates the fluid-sealed container and is used to provide at least one of a control cable, a data cable, a communication cable, a signal cable, and any combination of the above from the outside of the fluid-sealed container to the inside of the fluid-sealed container to further access at least one heat-generating electronic device.

[0015] In some embodiments, the single-phase immersion cooling system further includes a power supply unit. The power supply unit is immersed in the dielectric heat-conducting fluid and is used to supply power to at least one heat-generating electronic device, wherein the at least one fluid-sealed cable inlet passing through the fluid-sealed container is also used to provide at least one power cable from the outside of the fluid-sealed container to the inside of the fluid-sealed container to further access the power supply unit.

[0016] The fluid-sealed cable and conduit inlets also allow users to easily and simply install and access control cables, data cables, communication cables, signal cables, and / or power cables from the outside of the fluid-sealed container to the inside of the fluid-sealed container to access at least one heat-generating electronic device and / or the power supply unit, respectively.

[0017] In some embodiments, the single-phase immersion cooling system further includes a removable bracket structure. The removable bracket structure is disposed and installed in the fluid-sealed container for installing the power supply unit and at least one heat-generating electronic device.

[0018] The removable bracket structure disposed and installed in the fluid-sealed container for installing the thermoelectric and / or electronic components, devices and / or systems enables the user to easily and simply install the thermoelectric and / or electronic components, devices and / or systems, thereby reducing the total installation time.

[0019] In certain embodiments, the single-phase immersion cooling system further includes at least one first conduit having a third modifiable portion and at least one second conduit having a fourth modifiable portion. The third modifiable portion includes a third opening immersed in the dielectric heat-conducting fluid, and the fourth modifiable portion includes a fourth opening immersed in the dielectric heat-conducting fluid. The first modifiable portion is removed from the at least one first conduit and the third modifiable portion is installed on the at least one first conduit, and the second modifiable portion is removed from the at least one second conduit and the fourth modifiable portion is installed on the at least one second conduit. At least one of the at least one first conduit and the at least one second conduit circulates the dielectric heat-conducting fluid from the heat exchanger outlet to the fluid-sealed container, and the other of the at least one first conduit and the at least one second conduit circulates the dielectric heat-conducting fluid through a pump so that the dielectric heat-conducting fluid flows out of the fluid-sealed container and flows to the heat exchanger inlet. The third opening and the fourth opening are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container, and their installation positions are different from those of the first opening and the second opening. The lengths and shapes of the first modifiable portion and the third modifiable portion are different from the lengths and shapes of the second modifiable portion and the fourth modifiable portion respectively, and the arrangement of the third opening and the fourth opening generates at least one third flow path different from the first flow path, guiding a third flow mode of the dielectric heat-conducting fluid contained in the fluid-sealed container.

[0020] In certain embodiments, the pump of the single-phase immersion cooling system is immersed in the dielectric heat-conducting fluid contained in the fluid-sealed container. In certain embodiments, the pump of the single-phase immersion cooling system is installed outside the fluid-sealed container.

[0021] In certain embodiments, the heat exchanger of the single-phase immersion cooling system includes a heat exchange radiator installed outside the fluid-sealed container. In certain embodiments, the heat exchanger of the single-phase immersion cooling system further includes at least one fan unit. The at least one fan unit is installed on the heat exchange radiator and is relative to the outside of the fluid-sealed container. In certain embodiments, the heat exchange radiator of the single-phase immersion cooling system includes at least one built-in fluid storage tank having a tank opening, so that the dielectric heat-conducting fluid is added to the built-in fluid storage tank.

[0022] In some embodiments, the dielectric heat-conducting fluid of the single-phase immersion cooling system comprises a single-phase fluid. In some embodiments, the fluid-sealed container of the single-phase immersion cooling system comprises at least one of metal, plastic, transparent plastic material, and any combination of the foregoing.

[0023] In one embodiment, there is provided a single-phase immersion cooling method, which comprises providing a single-phase immersion cooling system and circulating a dielectric heat-conducting fluid therein. The single-phase immersion cooling method comprises providing a single-phase immersion cooling system, including providing a fluid-sealed container, providing a dielectric heat-conducting fluid contained in the fluid-sealed container, providing at least one heat-generating electronic device immersed in the dielectric heat-conducting fluid, and providing a heat exchanger system. The heat exchanger system of the above method comprises a pump, a heat exchanger having a heat exchanger inlet and a heat exchanger outlet, at least one first conduit having a first modifiable portion, and at least one second conduit having a second modifiable portion, wherein the first modifiable portion comprises a first opening immersed in the dielectric heat-conducting fluid, and the second modifiable portion comprises a second opening immersed in the dielectric heat-conducting fluid. The method further comprises circulating the dielectric heat-conducting fluid from the heat exchanger outlet to the fluid-sealed container through the pump and at least one of the at least one first conduit and the at least one second conduit, and circulating the dielectric heat-conducting fluid through the other of the pump and the at least one first conduit and the at least one second conduit so that the dielectric heat-conducting fluid flows out of the fluid-sealed container and flows to the heat exchanger inlet. The first opening and the second opening of the method are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container.

[0024] In a specific embodiment of the method, the method further comprises generating at least one first flow channel through the arrangement of the first opening and the second opening to guide a first flow pattern of the dielectric heat-conducting fluid contained in the fluid-sealed container.

[0025] In a particular embodiment of the method, the method further includes providing at least one first conduit having a third modifiable portion including a third opening immersed in a dielectric heat conducting fluid, and providing at least one second conduit having a fourth modifiable portion including a fourth opening immersed in the dielectric heat conducting fluid. The method further includes removing the first modifiable portion from the at least one first conduit and installing the third modifiable portion to the at least one first conduit, and removing the second modifiable portion from the at least one second conduit and installing the fourth modifiable portion to the at least one second conduit. Further, the method includes circulating the dielectric heat conducting fluid from the heat exchanger outlet to the fluid sealed container through a pump and at least one of the at least one first conduit and the at least one second conduit, and circulating the dielectric heat conducting fluid through the other of the pump and the at least one first conduit and the at least one second conduit to cause the dielectric heat conducting fluid to flow out of the fluid sealed container and to the heat exchanger inlet. The single-phase immersion cooling method further includes generating at least one third flow path through the arrangement of the third opening and the fourth opening to direct a third flow pattern of the dielectric heat conducting fluid contained in the fluid sealed container. The third opening and the fourth opening of the single-phase immersion cooling method are adjacent to the two most opposite ends of the dielectric heat conducting fluid contained in the fluid sealed container, which is different from the arrangement positions of the first opening and the second opening, such that the lengths and shapes of the first modifiable portion and the third modifiable portion are respectively different from the lengths and shapes of the second modifiable portion and the fourth modifiable portion.

[0026] The modifiable portions of the at least one first conduit and the at least one second conduit have different and / or the same lengths and different and / or the same shapes, and in any combination, enable the user to easily and conveniently replace an insurmountable number of modifiable portions with openings in the heat exchanger system to form an insurmountable number of different flow paths, and to direct the flow of the dielectric heat conducting fluid contained in the fluid sealed container through the arrangement of the openings. Because the flow of the dielectric heat conducting fluid contained in the fluid sealed container can be easily and simply adjusted through the arrangement of the openings by easily and simply removing and installing the appropriate modifiable portions to optimize heat conduction, when the operating temperature configuration of the electrical and / or electronic components, devices and / or systems changes, the cost, total installation time, leakage risk, wear of components and the total area requirement of the single-phase immersion cooling system do not increase. Brief Description of the Drawings

[0027] Unless otherwise specified, the drawings illustrate aspects of the innovative concept disclosed herein. Referring to the drawings, like reference numerals in several drawings refer to like components, and several examples of the heat exchanger system incorporating aspects of the principles disclosed herein are for illustrative purposes only and are not intended to be limiting.

[0028] Figure 1ARepresentatively illustrates an embodiment of a single-phase immersion cooling system;

[0029] Figure 1B Representatively illustrates Figure 1A the single-phase immersion cooling system of the embodiment in;

[0030] Figure 2A Representatively illustrates an embodiment of a single-phase immersion cooling system without a container lid;

[0031] Figure 2B Is Figure 2A the schematic cross-sectional view of the single-phase immersion cooling system of the embodiment in along the cutting plane line A-A;

[0032] Figure 3A Representatively illustrates an embodiment of a single-phase immersion cooling system without a container lid;

[0033] Figure 3B Is Figure 3A the schematic cross-sectional view of the single-phase immersion cooling system of the embodiment in along the cutting plane line B-B;

[0034] Figure 4 Is Figure 1A the partial three-dimensional cross-sectional schematic view of the single-phase immersion cooling system of the embodiment in;

[0035] Figure 5 Presents Figure 4 some components in;

[0036] Figure 6 Presents Figure 5 some components in;

[0037] Figure 7 Presents Figure 6 some components in;

[0038] Figure 8A Representatively illustrates an embodiment of a pump;

[0039] Figure 8B Is Figure 8A the schematic cross-sectional view of the pump of the embodiment in along the cutting plane line C-C;

[0040] Figure 9 Representatively illustrates an embodiment of a single-phase immersion cooling system without a heat exchanger and at least one fan unit;

[0041] Figure 10 The schematic cross-sectional view illustrating an embodiment of multiple conduits of the single-phase immersion cooling system;

[0042] Figure 11 The schematic cross-sectional view illustrating an alternative embodiment of the single-phase immersion cooling system;

[0043] Figure 12 Illustrate Figure 11 A schematic cross-sectional view of an alternative embodiment in

[0044] Figure 13 is Figure 10 A partial three-dimensional cross-sectional view of a single-phase immersion cooling system of an alternative embodiment in

[0045] Figure 14 Present Figure 13 Some components in

[0046] Figure 15 Present Figure 14 Some components in

[0047] Figure 16 Present Figure 15 Some components in

[0048] Figure 17 Representatively illustrate another alternative embodiment of a single-phase immersion cooling system

[0049] Figure 18A Representatively illustrate Figure 17 The inner plate of another alternative embodiment of the single-phase immersion cooling system in

[0050] Figure 18B Illustrate Figure 18A A plan view of the inner plate of another alternative embodiment of the single-phase immersion cooling system in

[0051]

Symbol description

[0052] 100…Single-phase immersion cooling system

[0053] 110, 120…Duct

[0054] 115…First modifiable part

[0055] 119, 129…Opening

[0056] 125…Second modifiable part

[0057] 130…Pump

[0058] 140…Power supply unit

[0059] 143…Power cable

[0060] 150, 155…Heat-generating electronic device

[0061] 160…Removable bracket structure

[0062] 170…Heat exchanger

[0063] 170…Heat exchange radiator

[0064] 180…Fan unit

[0065] 190…Container

[0066] 199…Container lid

[0067] 210, 220…Duct

[0068] 215…Third modifiable part

[0069] 219, 229…Opening

[0070] 225…Fourth modifiable part

[0071] 300…Single-phase immersion cooling system

[0072] 319, 329…Outlet

[0073] 370…Fin chamber heat exchanger

[0074] 372…Fluid cavity

[0075] 378…Heat dissipating fin

[0076] 390…Container

[0077] 399…Container lid Detailed implementation mode

[0078] The following describes various principles related to a single-phase immersion cooling system and method, which are embodied in the innovative concept of this case through specific embodiments of a fluid-sealed container, a dielectric heat-conducting fluid, a heat-generating electronic device, and a heat exchanger system. The embodiments also include specific configurations and examples of a container, a fluid, a pump, a radiator, and a duct with modifiable parts and including multiple openings. Specifically, but not limited thereto, this innovative principle is described in the manner of selected examples related to a container, a fluid, a pump, a radiator, and a duct with modifiable parts and each including an opening, and for the sake of brevity, known functions or structures will not be described in detail. In addition, one or more of the disclosed principles can be incorporated into various other embodiments of a container, a fluid, a pump, a radiator, and a duct with modifiable parts and each including an opening to achieve any desired results, characteristics, and / or performance criteria.

[0079] Accordingly, containers, fluids, pumps, radiators, and ducts having modifiable portions and each including an opening, which are of a different nature from the specific embodiments disclosed herein, can implement one or more inventive principles and can be used in applications not described in detail herein. Thus, as will be appreciated by those of ordinary skill in the art after reading this disclosure, containers, fluids, pumps, radiators, and ducts of a different nature not described in detail herein also fall within the scope of the present invention.

[0080] The exemplary embodiments disclosed herein relate to a single-phase immersion cooling system and method, wherein a heat exchanger system circulates an unheated dielectric thermally conductive fluid from a heat exchanger outlet to a fluid-sealed container through a pump and respectively through a plurality of ducts, and circulates the heated dielectric thermally conductive fluid so that it flows out of the fluid-sealed container and flows to a heat exchanger inlet, thereby effectively cooling the thermoelectric and / or electronic components, devices, and / or systems immersed in the dielectric thermally conductive fluid. The dielectric thermally conductive fluid is in direct thermal contact with the electrical and / or electronic components, devices, and / or systems, and creates flow paths for heat conduction to guide the flow of the unheated and heated dielectric thermally conductive fluid contained in the fluid-sealed container. Through the different and / or same lengths and different and / or same shapes of the modifiable portions of the ducts, the flow paths are modified by the user according to the settings of the electrical and / or electronic components, devices, and / or systems and the amount of heat generated, in an efficient manner.

[0081] In one embodiment, a single-phase immersion cooling system is provided that includes a fluid-sealed container, a dielectric thermally conductive fluid, at least one heat-generating electronic device, and a heat exchanger system. The heat exchanger system includes a pump, a heat exchanger, at least one first duct, and at least one second duct. The at least one first duct has a first modifiable portion. The first modifiable portion includes a first opening immersed in the dielectric thermally conductive fluid. The at least one second duct has a second modifiable portion. The second modifiable portion includes a second opening immersed in the dielectric thermally conductive fluid. At least one of the at least one first duct and the at least one second duct circulates the dielectric thermally conductive fluid from the heat exchanger outlet to the fluid-sealed container, and the other of the at least one first duct and the at least one second duct circulates the dielectric thermally conductive fluid through the pump so that the dielectric thermally conductive fluid flows out of the fluid-sealed container and flows to the heat exchanger inlet. The first opening and the second opening are adjacent to the two most opposite ends of the dielectric thermally conductive fluid contained in the fluid-sealed container.

[0082] In one embodiment, a single-phase immersion cooling system 100 is provided that includes a fluid-sealed container (including container 190 and container lid 199), a dielectric thermally conductive fluid (not shown), at least one heat-generating electronic device 150, 155, and a heat exchanger system. Figure 1ARepresentatively illustrate an embodiment of a single-phase immersion cooling system. Figure 1B Representatively illustrate Figure 1A the single-phase immersion cooling system of the embodiment in

[0083] Figure 2A Representatively illustrate an embodiment of a single-phase immersion cooling system without a container lid. Figure 2B is Figure 2A a schematic cross-sectional view of the single-phase immersion cooling system of the embodiment in Figure 3A Representatively illustrate an embodiment of a single-phase immersion cooling system without a container lid. Figure 3B is Figure 3A a schematic cross-sectional view of the single-phase immersion cooling system of the embodiment in Figure 4 is Figure 1A a partial three-dimensional cross-sectional schematic view of the single-phase immersion cooling system of the embodiment in Figure 5 Present Figure 4 some elements in Figure 6 Present Figure 5 some elements in Figure 7 Present Figure 6 some elements in. Please refer to Figures 1A to 7 , a dielectric heat-conducting fluid (not shown) is accommodated in a fluid-sealed container (including container 190 and container lid 199), and at least one heat-generating electronic device 150, 155 is submerged in the dielectric heat-conducting fluid. Specifically, the dielectric heat-conducting fluid and the heat-generating electronic devices 150, 155 are accommodated in the internal space 191 of container 190. The heat exchanger system includes a pump 130, a heat exchanger 170, at least one first conduit 110, and at least one second conduit 120. The heat exchanger 170 has a heat exchanger inlet and a heat exchanger outlet, and is, for example, a water-cooled radiator. At least one first conduit 110 has a first modifiable portion 115, and the first modifiable portion 115 includes a first opening 119 submerged in the dielectric heat-conducting fluid. At least one second conduit 120 has a second modifiable portion 125, and the second modifiable portion 125 includes a second opening 129 submerged in the dielectric heat-conducting fluid.

[0084] At least one of the first conduit 110 and the second conduit 120 circulates the dielectric heat-conducting fluid to enter the fluid-sealed container (including container 190 and container lid 199) from the heat exchanger outlet, and the other of the first conduit 110 and the second conduit 120 circulates the dielectric heat-conducting fluid through the pump 130 to flow out of the fluid-sealed container (including container 190 and container lid 199) and enter the heat exchanger inlet. The first opening 119 and the second opening 129 are adjacent to the two most opposite ends of the dielectric heat-conducting fluid accommodated in the fluid-sealed container (including container 190 and container lid 199).

[0085] For example, in the present embodiment, as Figure 4 shown, one end of the first conduit 110 communicates with the heat exchanger outlet of the heat exchanger 170, and the other end of the first conduit 110 is suspended in the internal space 191 of the container 190 such that the first opening 119 of the first modifiable portion 115 of the first conduit 110 communicates with the internal space 191 of the container 190; opposite ends of the second conduit 120 communicate with the heat exchanger inlet of the heat exchanger 170 and the pump 130, respectively.

[0086] Figure 8A An embodiment of a pump is representatively illustrated. Figure 8B is Figure 8A a schematic cross-sectional view of the pump of the embodiment in Figure 8A along the cutting plane line C-C. Please refer to Figure 8B and Figures 1A to 7 , and referring to

[0087] In a specific embodiment, the arrangement of the first opening 119 and the second opening 129 at least creates a first flow path for guiding a first flow pattern of the dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 190 and the container lid 199).

[0088] The single-phase immersion cooling system 100 at least effectively cools the heat-generating electronic devices 150, 155 (such as thermoelectric and / or electronic components, devices, and / or systems), thereby reducing the number of cooling elements (such as interface materials, heat sinks, heat dissipation fins, and fans, etc.) required for cooling the heat-generating electronic devices 150, 155, and thus reducing costs, total installation time, and total area requirements.

[0089] Those of ordinary skill in the art can surely realize that various suitable types, aspects, sizes, lengths, materials, and quantities of conduits 110 and 120 can be implemented in the single-phase immersion cooling system 100, and the embodiments are not limited thereto. Examples of conduit materials include galvanized steel, polyvinyl chloride (PVC), and polyethylene, etc., which are fixed in shape. As long as the first opening 119 and the second opening 129 at least generate a stable flow path to guide the dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 190 and the container lid 199) to generate a stable flow pattern.

[0090] Figure 9 An embodiment of a single-phase immersion cooling system without a heat exchanger and at least one fan unit is representatively illustrated. Please refer to Figure 9 And refer to Figures 1A to 8B , in some embodiments, the fluid-sealed container (including the container 190 and the container lid 199) includes a container 190 and a container lid 199. The container 190 has a container opening. The container lid 199 is used to be installed on the container opening in a fluid-sealed manner. The dielectric heat-conducting fluid, at least one heat-generating electronic device 150, 155, the first opening 119, and the second opening 129 are accommodated in the fluid-sealed container (including the container 190 and the container lid 199) through the container opening.

[0091] The fluid-sealed container (including the container 190 and the container lid 199) includes a container 190 having a container opening and a container lid 199 for being installed on the container opening in a fluid-sealed manner, enabling the user to easily fill the dielectric heat-conducting fluid and thus reducing the total installation time.

[0092] Since leakage occurring in any of the conduits, mounting parts, and heat exchangers of the liquid cooling system can damage the electrical and / or electronic components, devices, and / or systems that cannot be immersed, the liquid cooling system having a heat exchanger that is in thermal contact with the electrical and / or electronic components, devices, and / or systems and dissipates heat therefrom has a greater leakage risk, while the single-phase immersion cooling system 100 can reduce the leakage risk. The fluid-sealed container (including the container 190 and the container lid 199) also prevents the thermoelectric electrical and / or electronic components, devices, and / or systems from coming into contact with the surrounding environment during operation, and slows down the damage caused by high temperature, high humidity, air containing oil or dust, and / or the coastal area environment containing salt.

[0093] In some embodiments, the single-phase immersion cooling system 100 further includes at least one fluid-sealed first conduit inlet and at least one fluid-sealed second conduit inlet. The at least one fluid-sealed first conduit inlet passes through the fluid-sealed container (including container 190 and container lid 199) and is used to provide at least the first conduit 110 from the outside of the fluid-sealed container (including container 190 and container lid 199) to the inside of the fluid-sealed container (including container 190 and container lid 199) to access the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199). The at least one fluid-sealed second conduit inlet passes through the fluid-sealed container (including container 190 and container lid 199) and is used to provide at least the second conduit 120 from the outside of the fluid-sealed container (including container 190 and container lid 199) to the inside of the fluid-sealed container (including container 190 and container lid 199) to access the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199).

[0094] In some embodiments, the at least one heat-generating electronic device 150, 155 includes a motherboard, a printed circuit board, a central processing unit, a central processing unit chip, a graphics processing unit, a physics processing unit (PPU), a memory, a storage device, a lighting device, or any combination of the foregoing, at least one of which. Examples of motherboards include MicroATX, full-size ATX, and / or larger motherboards, etc. Examples of storage devices and components include solid state drives, hard drives compliant with the non-volatile memory express, and traditional hard disk drives, etc.

[0095] In some embodiments, the single-phase immersion cooling system 100 further includes at least one fluid-sealed cable inlet (not shown) passing through the fluid-sealed container (including container 190 and container lid 199). The at least one fluid-sealed cable inlet is used to provide at least one of a control cable, a data cable, a communication cable, a signal cable, and any combination of the foregoing from the outside of the fluid-sealed container (including container 190 and container lid 199) to the inside of the fluid-sealed container (including container 190 and container lid 199) to further access the at least one heat-generating electronic device 150, 155.

[0096] In some embodiments, the single-phase immersion cooling system 100 further includes a power supply unit 140 immersed in a dielectric heat-conducting fluid. The power supply unit 140 is configured to supply power to at least one heat-generating electronic device 150, 155, wherein at least one fluid-sealed cable inlet through the fluid-sealed container (including container 190 and container lid 199) is further configured to provide at least one power cable 143 from the outside of the fluid-sealed container (including container 190 and container lid 199) to the inside of the fluid-sealed container (including container 190 and container lid 199), and then connect to the power supply unit 140.

[0097] The fluid-sealed cable inlet and the fluid-sealed conduit inlet enable a user to easily install and connect a control cable, a data cable, a communication cable, a signal cable, and / or a power cable from the outside of the fluid-sealed container (including container 190 and container lid 199) to the inside of the fluid-sealed container (including container 190 and container lid 199) to connect to at least one heat-generating electronic device 150, 155 and / or the power supply unit 140, respectively. For example, an audio port, an ethernet port, a display port, a Video Graphics Array (VGA) port, a digital visual interface (DVI), and / or a high-definition multimedia interface (HDMI) can be installed on the outside of the fluid-sealed container (including container 190 and container lid 199), and cables 153, 157 can be used to connect these ports and interfaces from the outside of the fluid-sealed container (including container 190 and container lid 199) to the inside of the fluid-sealed container (including container 190 and container lid 199) to connect to at least one heat-generating electronic device 150, 155.

[0098] Those of ordinary skill in the art can surely realize that any suitable type, aspect, size, material, and quantity of fluid-sealed attachment means can be implemented in the single-phase immersion cooling system 100, and the embodiments are not limited thereto. Examples of the fluid-sealed attachment means include gluing, welding, gasketing, or any combination of the above. As long as the first opening 119 and the second opening 129 at least generate a stable flow path to guide the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199) to generate a stable flow pattern.

[0099] In some embodiments, the single-phase immersion cooling system 100 further includes a removable bracket structure 160 that is disposed and mounted in a fluid-tight container (including container 190 and container lid 199) for mounting the power supply unit 140 and at least one heat-generating electronic device 150, 155.

[0100] The removable bracket structure 160, which is disposed and mounted in a fluid-tight container (including container 190 and container lid 199) for mounting the thermoelectric and / or electronic components, devices, and / or systems, enables a user to easily install the thermoelectric and / or electronic components, devices, and / or systems, thereby reducing the total installation time.

[0101] Figure 10 A cross-sectional schematic diagram showing an embodiment of multiple conduits of a single-phase immersion cooling system. Please refer to Figure 10 And refer to Figures 1A to 9 , in certain embodiments, the single-phase immersion cooling system 100 further includes at least one first conduit 210 having a third modifiable portion 215 and at least one second conduit 220 having a fourth modifiable portion 225.

[0102] Figure 11 A cross-sectional schematic diagram showing an alternative embodiment of a single-phase immersion cooling system. Figure 12 Showing Figure 11 A cross-sectional schematic diagram of an alternative embodiment in from the perspective of the opposite side. Figure 13 For Figure 10 A partial three-dimensional cross-sectional schematic diagram of the single-phase immersion cooling system of the alternative embodiment in . Figure 14 Representatively showing alternative embodiments of multiple conduits, a pump, a power supply unit, a motherboard, and a printed circuit board. Figure 15 Representatively showing alternative embodiments of multiple conduits, a pump, a power supply unit, and a printed circuit board. Figure 16 Representatively showing alternative embodiments of multiple conduits, a pump, and a power supply unit. Please refer to Figures 11 to 16 And refer to Figure 1A , Figure 1B , Figure 8A , Figure 8B And Figure 9, the third modifiable part 215 includes a third opening 219 immersed in the dielectric heat-conducting fluid and the fourth modifiable part 225 includes a fourth opening 229 immersed in the dielectric heat-conducting fluid. The first modifiable part 115 is removed from at least one first conduit 210 and the third modifiable part 215 is installed on at least one first conduit 210, the second modifiable part 125 is removed from at least one second conduit 220 and the fourth modifiable part 225 is installed on at least one second conduit 220. At least one of the first conduit 210 and the second conduit 220 circulates the dielectric heat-conducting fluid from the heat exchanger outlet into a fluid-sealed container (including the container 190 and the container cover 199), and the other of the first conduit 210 and the second conduit 220 circulates the dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 190 and the container cover 199) through the pump 130 to flow out of the fluid-sealed container (including the container 190 and the container cover 199) and flow to the heat exchanger inlet. The third opening 219 and the fourth opening 229 are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 190 and the container cover 199), which is different from the arrangement of the first opening 119 and the second opening 129. The lengths and shapes of the first modifiable part 115 and the third modifiable part 215 are different from the lengths and shapes of the second modifiable part 125 and the fourth modifiable part 225 respectively, and the arrangement of the third opening 219 and the fourth opening 229 at least generates a third flow path different from the first flow path, so as to guide the dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 190 and the container cover 199) to generate a third flow mode.

[0103] For example, in this embodiment, as Figure 13 shown, the two opposite ends of the first conduit 210 are respectively connected to the heat exchanger inlet of the heat exchanger 170 and the pump 130; one end of the second conduit 220 is connected to the heat exchanger outlet of the heat exchanger 170, and the other end of the second conduit 220 is suspended in the internal space 191 of the container 190 so that the fourth opening 229 of the fourth modifiable part 225 communicates with the internal space 191 of the container 190.

[0104] In a specific embodiment, the pump 130 of the single-phase immersion cooling system 100 is immersed in the dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 190 and the container cover 199). In a specific embodiment, the pump 130 of the single-phase immersion cooling system 100 is installed outside the fluid-sealed container (including the container 190 and the container cover 199) (not shown).

[0105] In a particular embodiment, the heat exchanger 170 of the single-phase immersion cooling system 100 includes a heat exchange radiator 170, and the heat exchange radiator 170 is installed on the outer side of a fluid-sealed container (including container 190 and container lid 199). In a particular embodiment, the heat exchanger 170 of the single-phase immersion cooling system 100 further includes at least one fan unit 180 installed on the heat exchange radiator 170, relative to the outer side of the fluid-sealed container (including container 190 and container lid 199). In a particular embodiment, the heat exchange radiator 170 of the single-phase immersion cooling system 100 includes at least one built-in fluid storage tank (not shown), and at least one built-in fluid storage tank is located on multiple sides of the heat exchange radiator 170 and has a tank opening (not shown), so that a dielectric heat-conducting fluid can be added to the built-in fluid storage tank. During the operation of the single-phase immersion cooling system 100, a certain volume of the dielectric heat-conducting fluid can be retained in the fluid tank. In some embodiments, the part of the dielectric heat-conducting fluid in the fluid tank that can be seen through a transparent material allows the user to view the amount of the dielectric heat-conducting fluid in the cooling loop and determine when additional dielectric heat-conducting fluid (not shown) may need to be added. Through the fluid tank, the loss of the dielectric heat-conducting fluid due to permeation over time can be slowed down, and air bubbles can be gradually replaced during the fluid circulation process, thereby increasing the cooling cycle efficiency of the single-phase immersion cooling system 100.

[0106] Those of ordinary skill in the art can surely realize that any suitable type, aspect, and size of the heat exchange radiator 170 can be implemented in the single-phase immersion cooling system 100, and the embodiments are not limited thereto. As long as the dielectric heat-conducting fluid circulates from the outlet of the heat exchange radiator 170 to the fluid-sealed container (including container 190 and container lid 199) through a conduit, and the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199) circulates through the pump 130, flows out of the fluid-sealed container (including container 190 and container lid 199), and enters the inlet of the heat exchange radiator 170 through other conduits, it can effectively cool the thermoelectric and / or electronic components, devices, and / or systems immersed in the dielectric heat-conducting fluid.

[0107] At least one fan unit 180 can be coupled to the back end of the heat exchange radiator 170 through fasteners (such as bolts, screws, adhesive materials, etc.) on the structural part of the heat exchange radiator 170, and air is transmitted to the air plenum or the outside of the fluid-sealed container (including container 190 and container lid 199) through the heat exchange radiator 170. Those of ordinary skill in the art can surely realize that the type and size of the fan can be modified as long as the dielectric heat-conducting fluid can circulate through the heat exchange radiator 170 and air can be transmitted to the air plenum or the outside of the fluid-sealed container (including container 190 and container lid 199) through the heat exchange radiator 170.

[0108] At least one fan unit 180 may be a high-pressure (e.g., high airflow) fan. At least one fan unit 180 may have reinforced fan blades. The fan blades and / or other components (such as bearings, etc.) may be designed with the principle of minimizing the noise during operation. At least one fan unit 180 may be constructed using fasteners (such as anti-vibration rivets, gaskets, etc.) that can be used to minimize the vibration during operation.

[0109] Please refer to Figure 17 、 Figure 18A and Figure 18B and additionally refer to Figures 4 to 7 as well as Figures 13 to 16 . Figure 17 Another alternative embodiment of a single-phase immersion cooling system is representatively illustrated. Figure 18A Representatively illustrated Figure 17 the inner plate of another alternative embodiment of the single-phase immersion cooling system in Figure 18B Illustrated Figure 18A a plan view of the inner plate of another alternative embodiment of the single-phase immersion cooling system in Figure 18A and Figure 18B only presents the wall body on one side of the container 390. That is, for the convenience of illustration, Figure 18A and Figure 18BThe container lid 399 is omitted. In a particular embodiment, the heat exchanger of the single-phase immersion cooling system 300 includes a fin chamber heat exchanger 370. The fin chamber heat exchanger 370 can be mounted on the outside of a fluid-sealed container (including the container 390 and the container lid 399) or integrally formed with its paneling. The fin chamber heat exchanger 370 includes a fluid cavity 372 and a plurality of heat dissipation fins 378. The fluid cavity 372 has a first outlet 319 and a second outlet 329, such that at least one first conduit 110, 210 and at least one second conduit 120, 220 can be fluid-sealedly mounted to the fluid cavity 372, wherein at least one first conduit 110, 210 has a first modifiable portion 115, 215 including a first opening 119, 219 immersed in the dielectric heat-conducting fluid, and at least one second conduit 120, 220 has a second modifiable portion 125, 225 including a second opening 129, 229 immersed in the dielectric heat-conducting fluid. The dielectric heat-conducting fluid circulates from one of the first outlet 319 and the second outlet 329 into the fluid-sealed container (including the container 390 and the container lid 399) and passes through one of at least one first conduit 110, 210 and at least one second conduit 120, 220. The dielectric heat-conducting fluid contained in the fluid-sealed container (including the container 390 and the container lid 399) is circulated by a pump 130, flows out of the fluid-sealed container (including the container 390 and the container lid 399), and flows to the other of the first outlet 319 and the second outlet 329 through the other of at least one first conduit 110, 210 and at least one second conduit 120, 220, thereby effectively cooling the thermoelectric and / or electronic components, devices and / or systems immersed in the dielectric heat-conducting fluid.

[0110] In a particular embodiment, the fluid cavity 372 includes an outer shell and an inner shell; the inner shell directly contacts the dielectric heat-conducting fluid circulating in the single-phase immersion cooling system 300, and the outer shell is correspondingly, fluid-sealedly mounted and relative to the inner shell. The outer shell and the inner shell form a chamber therebetween for generating a chamber flow related thereto. The chamber flow circulates the dielectric heat-conducting fluid through the chamber via flow and / or mesh channels. For example, the fluid cavity 372 can include at least three flow channels connected by two turning points; however, the embodiments are not limited thereto. Those of ordinary skill in the art can surely realize that the fluid cavity 372 can include more than three flow channels connected by more than two turning points, and these flow channels can have various flow profiles and can be combined with any number of mesh channels defined by island-like structures in the fluid cavity 372, or the mesh channels defined by island-like structures. As long as the chamber flow circulates the dielectric heat-conducting fluid through the chamber.

[0111] In certain embodiments, the outermost portion of the top side of these heat dissipation fins 378 does not exceed the plane of the plate body on the outside of the fluid-sealed container (including container 390 and container lid 399); however, the embodiments are not limited thereto. Those of ordinary skill in the art can surely realize that these heat dissipation fins 378 can exceed the plane of the plate body on the outside of the fluid-sealed container (including container 390 and container lid 399).

[0112] In certain embodiments, these heat dissipation fins 378 are indirectly in contact with the dielectric heat-conducting fluid flowing through the flow and / or reticular channels; however, the embodiments are not limited thereto. In certain embodiments, at least one of these heat dissipation fins 378 can be directly in contact with the dielectric heat-conducting fluid flowing through the flow and / or reticular channels through its fin input, fin channel, and fin output. The fin input and output are directly connected to the dielectric heat-conducting fluid flowing through the flow and / or reticular channels, and the fin channel is directly connected to the fin input and output.

[0113] It can be surely realized that those of ordinary skill in the art can implement any suitable type, aspect, size, and quantity of fin chamber heat exchangers 370 in the single-phase immersion cooling system 300, and the embodiments are not limited thereto. As long as the dielectric heat-conducting fluid flows out through the conduit and circulates into the fluid-sealed container (including container 390 and container lid 399), and the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 390 and container lid 399) circulates through the pump 130 and through other conduits and flows into it, thereby effectively cooling the thermoelectric and / or electronic components, devices, and / or systems immersed in the dielectric heat-conducting fluid.

[0114] In some embodiments, the dielectric heat-conducting fluid of the single-phase immersion cooling system 100 includes a single-phase fluid. Examples of the dielectric heat-conducting fluid include hydrocarbons, such as mineral oils, synthetic oils, and natural oils and / or engineered dielectric heat-conducting fluids, etc.

[0115] In some embodiments, the fluid-sealed container (including container 190 and container lid 199) of the single-phase immersion cooling system 100 includes at least one of metal, plastic, transparent plastic material, and any combination of the above. Examples of metal materials include magnesium and aluminum, etc., and examples of plastic materials include Acrylonitrile Butadiene Styrene (ABS), polycarbonate, and acrylic, etc.

[0116] In one embodiment, a single-phase immersion cooling method is provided. The single-phase immersion cooling method includes providing a single-phase immersion cooling system 100 and circulating a dielectric heat-conducting fluid therein. The single-phase immersion cooling method includes providing a single-phase immersion cooling system 100. Providing the single-phase immersion cooling system 100 includes providing a fluid-sealed container (including container 190 and container lid 199), providing a dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199), providing at least one heat-generating electronic device 150, 155 immersed in the dielectric heat-conducting fluid, and providing a heat exchanger system. The heat exchanger system of the method includes a pump 130, a heat exchanger 170 having a heat exchanger inlet and a heat exchanger outlet, at least one first conduit 110 having a first modifiable portion 115, and at least one second conduit 120 having a second modifiable portion 125, wherein the first modifiable portion 115 includes a first opening 119 immersed in the dielectric heat-conducting fluid, and the second modifiable portion 125 includes a second opening 129 immersed in the dielectric heat-conducting fluid. The method further includes: circulating the dielectric heat-conducting fluid from the heat exchanger outlet into the fluid-sealed container (including container 190 and container lid 199) through the pump and at least one of the first conduit 110 and the second conduit 120, and circulating the dielectric heat-conducting fluid through the other of the pump 130, the first conduit 110, and the second conduit 120 to cause the dielectric heat-conducting fluid to flow out of the fluid-sealed container (including container 190 and container lid 199) and flow to the heat exchanger inlet. The first opening 119 and the second opening 129 of the method are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199).

[0117] In a specific embodiment of the method, the method further includes generating at least one first flow path, and guiding a first flow pattern of the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199) through the arrangement of the first opening 119 and the second opening 129.

[0118] In a particular embodiment of the method, the method further comprises providing at least one first conduit 210 having a third modifiable portion 215 and providing at least one second conduit 220 having a fourth modifiable portion 225, wherein the third modifiable portion 215 includes a third opening 219 immersed in a dielectric heat-conducting fluid, and the fourth modifiable portion 225 includes a fourth opening 229 immersed in the dielectric heat-conducting fluid. The method further comprises removing the first modifiable portion 115 from the at least one first conduit 210 and installing the third modifiable portion 215 onto the at least one first conduit 210, and removing the second modifiable portion 125 from the at least one second conduit 120 and installing the fourth modifiable portion 225 onto the at least one second conduit 220. And, the method further comprises: circulating the dielectric heat-conducting fluid from the heat exchanger outlet into a fluid-sealed container (including container 190 and container lid 199) through the pump 130 and at least one of the first conduit 210 and the second conduit 220, and circulating the dielectric heat-conducting fluid through the other of the pump 130 and the first conduit 210 and the second conduit 220 such that the dielectric heat-conducting fluid flows out of the fluid-sealed container (including container 190 and container lid 199) and flows to the heat exchanger inlet. The single-phase immersion cooling method further comprises generating at least one third flow path, and guiding a third flow pattern of the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199) through the arrangement of the third opening 219 and the fourth opening 229. The third opening 219 and the fourth opening 229 of the single-phase immersion cooling method are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199), and their arrangement positions are different from those of the first opening 119 and the second opening 129, such that the lengths and outer shapes of the first modifiable portion 115 and the third modifiable portion 215 are respectively different from the lengths and outer shapes of the second modifiable portion 125 and the fourth modifiable portion 225.

[0119] Other features and principles of the method for circulating a dielectric heat-conducting fluid in the single-phase immersion cooling system 100 are substantially the same as the content of the embodiments of the single-phase immersion cooling system 100 detailed above, and thus will not be elaborated further.

[0120] The modifiable portions of at least one first conduit 110, 210 and at least one second conduit 120, 220 have different and / or the same lengths and different and / or the same outer shapes, and in any combination, enable a user to easily and conveniently replace an insurmountable number of modifiable portions with openings in a heat exchanger system to form an insurmountable number of different flow channels, and guide the flow of a dielectric heat-conducting fluid contained in a fluid-sealed container (including container 190 and container lid 199) through the provisions of openings 119, 129, 219, 229. Since the appropriate modifiable portions can be easily and simply removed and installed, and the flow of the dielectric heat-conducting fluid contained in the fluid-sealed container (including container 190 and container lid 199) can be easily and simply adjusted through the provisions of openings 119, 129, 219, 229 to optimize heat conduction, when the configuration of the operating temperature of electrical and / or electronic components, devices and / or systems changes, the increase in the cost, total installation time, leakage risk, wear and tear of components and total area requirements of the single-phase immersion cooling system 100 will not be exacerbated.

[0121] The control of a pump driven by a DC or AC electric motor is preferably generated by means of an operating system or a similar means or by the electrical and / or electronic system itself, wherein the electrical and / or electronic system includes means for measuring the load and / or temperature of one or more processors or regions. Using measurements performed by the operating system or a similar system eliminates the need for special means for operating the single-phase immersion cooling system and its method.

[0122] A further control strategy using the operating system or a similar system may involve balancing the rotational speed of the pump as a function of the required cooling capacity. If a lower cooling capacity is required, the rotational speed of the pump can be adjusted or limited, thus limiting the noise generated by the motor driving the pump of the single-phase immersion cooling system and its wear and tear.

[0123] The functions and application aspects of electrical and electronic components are constantly increasing, resulting in an increase in their power demand, and thus an increase in the heat dissipation demand. Liquid cooling systems are a developed technology for removing heat from electrical or electronic components, devices, and systems. In a liquid cooling system, a heat exchanger is in thermal contact with the components, devices, and / or systems and takes away the heat from them. Then, the cooling fluid circulating in the cooling circuit system cooperating with the heat exchanger will flow through the pump unit and over the heat exchanger to take away the heat from the heat exchanger. However, as the operating temperature increases, the cost, total installation time, leakage risk, wear of components, and total area requirement of the liquid cooling system also increase. When the configuration of the operating temperature in the electrical and electronic systems changes, the increase in cost, total installation time, leakage risk, wear of components, and total area requirement will be exacerbated.

[0124] In an embodiment, there are provided a fluid cooling system, a single-phase immersion cooling system, and a method thereof for cooling a heat-generating electronic device by circulating a fluid in a fluid-sealed container, which includes a fluid-sealed container, a dielectric heat-conducting fluid, at least one heat-generating electronic device, and a heat exchanger system. The heat exchanger system includes a pump, a heat exchanger, at least one first conduit, and at least one second conduit. At least one of the first and second conduits respectively has a first and a second modifiable portion, and the first and second modifiable portions respectively have first and second openings immersed in the dielectric heat-conducting fluid. At least one of the first conduit and the second conduit circulates the dielectric heat-conducting fluid from the heat exchanger outlet into the fluid-sealed container, and the other of the first conduit and the second conduit circulates the dielectric heat-conducting fluid from the fluid-sealed container to the heat exchanger inlet through the pump. The first and second openings are adjacent to the two most opposite ends of the dielectric heat-conducting fluid accommodated in the fluid-sealed container.

[0125] In an embodiment, the heat exchanger system circulates the dielectric heat-conducting fluid from the heat exchanger outlet into the fluid-sealed container through at least one of the first conduit and the second conduit, and circulates the dielectric heat-conducting fluid through the other of the first conduit and the second conduit to make the dielectric heat-conducting fluid flow out of the fluid-sealed container and flow to the heat exchanger inlet, thereby effectively cooling the thermoelectric and / or electronic components, devices, and / or systems, and thus reducing the number of cooling components required for cooling them, and reducing the cost, total installation time, and total area requirement, where the cooling components are, for example, interface materials, heat sinks, heat dissipation fins, and fans, etc.

[0126] A removable bracket structure is provided and installed in a fluid-sealed container for installing thermoelectric and / or electronic components, devices and / or systems, and includes a fluid-sealed container having a container opening and a container lid for fluid-sealingly installing on the container opening, enabling a user to easily and simply install and access thermoelectric and / or electronic components, devices and / or systems and fill a dielectric heat-conducting fluid, thereby reducing the total installation time. The fluid-sealed cable and conduit inlets also enable the user to easily and simply install and access control cables, data cables, communication cables, signal cables and / or power cables from the outside of the fluid-sealed container to the inside of the fluid-sealed container to access at least one heating electronic device and / or a power supply unit respectively. Since a leak occurring in any one of the conduits, mounting parts and heat exchangers along the liquid cooling system will damage the non-immersion-capable electrical and / or electronic components, devices and / or systems, a liquid cooling system having a heat exchanger that is in thermal contact with the electrical and / or electronic components, devices and / or systems and dissipates heat therefrom has a relatively high risk of leakage, and thus the leakage risk will also be reduced. The fluid-sealed container also prevents the thermoelectric and / or electronic components, devices and / or systems from coming into contact with the surrounding environment during operation, and slows down the damage caused by high temperature, high humidity, air containing oil or dust and / or the coastal area environment containing salt.

[0127] The modifiable portions of at least one first conduit and at least one second conduit have different and / or the same lengths and different and / or the same shapes, enabling a user to easily and conveniently replace an insurmountable number of modifiable portions having openings in the heat exchanger system in any combination to form an insurmountable number of different flow channels, and guiding the flow of the dielectric heat-conducting fluid contained in the fluid-sealed container through the arrangement of the openings. Since the flow of the dielectric heat-conducting fluid contained in the fluid-sealed container can be easily and simply adjusted through the arrangement of the openings by easily and simply removing and installing suitable modifiable portions to optimize heat conduction, when the operating temperature configuration of the electrical and / or electronic components, devices and / or systems changes, the increase in the cost, total installation time, leakage risk, wear of components and total area requirement of the single-phase immersion cooling system will not be aggravated.

[0128] The inventive concept disclosed herein is not limited to the embodiments presented herein, but rather must be construed in its full scope consistent with the principles underlying the concepts disclosed herein. Directions and element numbers such as "upper", "lower", "top", "bottom", "horizontal", "vertical", "left", "right", etc. are not used to denote absolute relationships, positions, and / or orientations. The terms for elements such as "first", "second" are not meant literally but are only used to distinguish the terms. Herein, the term "comprising" or "including" encompasses the meanings of "containing" and "having" and indicates the presence of elements, steps, and / or the above-mentioned groups or combinations and does not exclude the presence or addition of one or more other elements, steps, and / or the above-mentioned groups or combinations. Unless otherwise stated, the order of steps is not an absolute order. Unless otherwise stated, the singular form of an element, such as "a" used herein, does not mean "only one" but means "one or more". Herein, "and / or" represents "and" or "or", as well as "and" and "or". Herein, ranges and sub-ranges represent all ranges that include the entire and / or partial magnitudes therein, and the terms that define or modify the ranges and sub-ranges, such as "at least", "greater than", "less than", "not exceeding", etc., represent the sub-ranges and / or upper or lower limits. Structural and functional equivalents of the elements of the various embodiments described in this specification that are known or will be learned by all those of ordinary skill in the art should be included in the features and claims described herein. In addition, regardless of whether all the content disclosed will ultimately be explicitly cited in the claims, all the content disclosed should not be construed as a contribution to the public.

[0129] Assuming that the principles disclosed can be applied to many possible embodiments, we reserve the right to claim any and all combinations of the features and methods described herein, including all features derived from the scope and spirit described above, as well as those literally and equivalently recited in the appended claims, the claims in any prosecution of this application, and the claims of any application claiming priority or benefit of this application.

Claims

1. A single-phase immersion cooling system, characterized in that, Comprising: A fluid-sealed container; A dielectric heat-conducting fluid accommodated in the fluid-sealed container; At least one heat-generating electronic device immersed in the dielectric heat-conducting fluid; and A heat exchanger system, comprising: A pump; A heat exchanger having a heat exchanger inlet and a heat exchanger outlet; At least one first conduit having a first modifiable portion that includes a first opening immersed in the dielectric heat-conducting fluid; and At least one second conduit having a second modifiable portion that includes a second opening immersed in the dielectric heat-conducting fluid, wherein the at least one second conduit circulates the dielectric heat-conducting fluid from the heat exchanger outlet to the fluid-sealed container, and the at least one first conduit circulates the dielectric heat-conducting fluid such that the dielectric heat-conducting fluid flows out of the fluid-sealed container and into the heat exchanger inlet, and wherein the first opening and the second opening are adjacent to the two most opposite ends of the dielectric heat-conducting fluid accommodated in the fluid-sealed container, and the arrangement of the first opening and the second opening generates at least one first flow path to guide a first flow pattern of the dielectric heat-conducting fluid accommodated in the fluid-sealed container, The at least one first conduit further has a third modifiable portion that includes a third opening immersed in the dielectric heat-conducting fluid; and The at least one second conduit further has a fourth modifiable portion that includes a fourth opening immersed in the dielectric heat-conducting fluid, wherein the first modifiable portion is removed from the at least one first conduit and the third modifiable portion is installed to the at least one first conduit, and the second modifiable portion is removed from the at least one second conduit and the fourth modifiable portion is installed to the at least one second conduit, wherein the at least one first conduit circulates the dielectric heat-conducting fluid from the heat exchanger outlet to the fluid-sealed container, and the at least one second conduit circulates the dielectric heat-conducting fluid such that the dielectric heat-conducting fluid flows out of the fluid-sealed container and into the heat exchanger inlet, wherein the third opening and the fourth opening are adjacent to the two most opposite ends of the dielectric heat-conducting fluid accommodated in the fluid-sealed container, which is different from the setting positions of the first opening and the second opening, such that the lengths and shapes of the first modifiable portion and the third modifiable portion are respectively different from the lengths and shapes of the second modifiable portion and the fourth modifiable portion, and wherein the arrangement of the third opening and the fourth opening generates at least one third flow path different from the first flow path to guide a third flow pattern of the dielectric heat-conducting fluid accommodated in the fluid-sealed container.

2. The single-phase immersion cooling system according to claim 1, characterized in that, The fluid-sealed container includes a container having a container opening and a container cover for fluid-sealingly mounting to the container opening, such that the dielectric heat-conducting fluid, the at least one heat-generating electronic device, the first opening, and the second opening are accommodated in the fluid-sealed container through the container opening.

3. The single-phase immersion cooling system according to claim 1, characterized in that, The dielectric heat-conducting fluid includes a single-phase fluid.

4. The single-phase immersion cooling system according to claim 1, wherein The at least one heat-generating electronic device includes a main board, a printed circuit board, a central processing unit, a graphics processing unit, a memory, a storage device, a lamp, and any combination of the above.

5. The single-phase immersion cooling system according to claim 1, wherein The pump is immersed in the dielectric heat-conducting fluid contained in the fluid-sealed container.

6. The single-phase immersion cooling system according to claim 1, wherein The pump is installed outside the fluid-sealed container.

7. The single-phase immersion cooling system according to claim 1, wherein The heat exchanger includes a heat exchange radiator installed outside the fluid-sealed container.

8. The single-phase immersion cooling system according to claim 7, wherein The heat exchanger further includes at least one fan unit, and the at least one fan unit is installed on the heat exchange radiator and relative to the outside of the fluid-sealed container.

9. The single-phase immersion cooling system according to claim 7, wherein, The heat exchange radiator includes at least one built-in fluid storage tank having a slot opening, such that the dielectric heat-conducting fluid is added to the built-in fluid storage tank.

10. The single-phase immersion cooling system according to claim 1, characterized in that, Further included are: At least one fluid-sealed first conduit inlet, passing through the fluid-sealed container and used to provide the at least one first conduit from the outside of the fluid-sealed container to the inside of the fluid-sealed container to access the dielectric heat-conducting fluid contained in the fluid-sealed container; And At least one fluid-sealed second conduit inlet, passing through the fluid-sealed container and used to provide the at least one second conduit from the outside of the fluid-sealed container to the inside of the fluid-sealed container to access the dielectric heat-conducting fluid contained in the fluid-sealed container.

11. The single-phase immersion cooling system according to claim 1, wherein, Further included are: At least one fluid-sealed cable inlet, passing through the fluid-sealed container and used to provide at least one of a control cable, a data cable, a communication cable, a signal cable, and any combination of the above from the outside of the fluid-sealed container to the inside of the fluid-sealed container to further access the at least one heat-generating electronic device.

12. The single-phase immersion cooling system according to claim 11, wherein Further included are: A power supply unit, immersed in the dielectric heat-conducting fluid and used to supply power to the at least one heat-generating electronic device, wherein the at least one fluid-sealed cable inlet passing through the fluid-sealed container is further used to provide at least one power cable from the outside of the fluid-sealed container to the inside of the fluid-sealed container to further access the power supply unit.

13. The single-phase immersion cooling system according to claim 1, characterized in that, The fluid-sealed container includes at least one of metal, plastic, transparent plastic material, and any combination of the above.

14. The single-phase immersion cooling system according to claim 1, wherein Further included is a removable bracket structure, which is arranged and installed in the fluid-sealed container and used for installing the at least one heat-generating electronic device.

15. The single-phase immersion cooling system according to claim 12, wherein Further included is a removable bracket structure, which is arranged and installed in the fluid-sealed container and used for installing the power supply unit and the at least one heat-generating electronic device.

16. A single-phase immersion cooling method, characterized in that, Included are: Providing a fluid-sealed container; Providing a dielectric heat-conducting fluid, which is contained in the fluid-sealed container; Providing at least one heat-generating electronic device, which is immersed in the dielectric heat-conducting fluid; Providing a heat exchanger system, which includes: A pump; A heat exchanger, having a heat exchanger inlet and a heat exchanger outlet; At least one first conduit, having a first modifiable portion, and the first modifiable portion includes a first opening immersed in the dielectric heat-conducting fluid; and At least one second conduit, having a second modifiable portion, and the second modifiable portion includes a second opening immersed in the dielectric heat-conducting fluid, Circulating the dielectric heat-conducting fluid from the heat exchanger outlet to the fluid-sealed container through the pump and the at least one second conduit; and Circulate the dielectric heat-conducting fluid through the pump and the at least one first conduit, causing the dielectric heat-conducting fluid to flow out of the fluid-sealed container and to the inlet of the heat exchanger. Wherein the first opening and the second opening are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container, and at least one first flow path is generated through the arrangement of the first opening and the second opening to guide a first flow mode of the dielectric heat-conducting fluid contained in the fluid-sealed container. The at least one first conduit has a third modifiable portion, and the third modifiable portion includes a third opening immersed in the dielectric heat-conducting fluid. The at least one second conduit has a fourth modifiable portion, and the fourth modifiable portion includes a fourth opening immersed in the dielectric heat-conducting fluid. Remove the first modifiable portion from the at least one first conduit and install the third modifiable portion to the at least one first conduit. Remove the second modifiable portion from the at least one second conduit and install the fourth modifiable portion to the at least one second conduit. Circulate the dielectric heat-conducting fluid from the outlet of the heat exchanger to the fluid-sealed container through the pump and the at least one first conduit. Circulate the dielectric heat-conducting fluid through the pump and the at least one second conduit, causing the dielectric heat-conducting fluid to flow out of the fluid-sealed container and to the inlet of the heat exchanger; and Generate at least one third flow path through the arrangement of the third opening and the fourth opening to guide a third flow mode of the dielectric heat-conducting fluid contained in the fluid-sealed container. Wherein the third opening and the fourth opening are adjacent to the two most opposite ends of the dielectric heat-conducting fluid contained in the fluid-sealed container, and their set positions are different from those of the first opening and the second opening, such that the lengths and shapes of the first modifiable portion and the third modifiable portion are respectively different from the lengths and shapes of the second modifiable portion and the fourth modifiable portion.

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