Laser welding device, welding system and laser welding method

Abstract

The application provides a laser welding device, a welding system and a laser welding method, and relates to the technical field of chip mounting. The laser welding device comprises a main control module, a laser assembly and an ultrasonic assembly. The laser assembly comprises a first mounting block and a laser element arranged on the first mounting block. The ultrasonic assembly comprises a second mounting block and an ultrasonic element arranged on the second mounting block. The first mounting block and the second mounting block are connected to the main control module, and the laser assembly and the ultrasonic assembly are in communication connection with the main control module. The ultrasonic element and the laser element are used for emitting ultrasonic energy and laser energy to separate a chip and a blue film. Damage to the chip caused by a thimble when separating the chip can be avoided, and the quality of the chip is improved.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology, and more specifically, to a laser welding apparatus, a welding system, and a laser welding method. Background Technology

[0002] With the rapid development of the semiconductor industry, it is often necessary to separate the chip and the blue film in surface mount packaging processes. Current processes mostly use a push-pin structure to lift the chip, and then separate the blue film from the chip using vacuum adsorption or other methods. In this separation method, because the push-pin lifts the chip, the chip experiences localized stress, which can easily lead to uneven stress on the chip, resulting in cracks or other damage, seriously affecting the chip quality. Summary of the Invention

[0003] The present invention aims to provide, for example, a laser welding apparatus, a welding system, and a laser welding method that can avoid damage to the chip caused by the use of ejector pins in conventional processes, thereby improving chip quality.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a laser welding apparatus, comprising a main control module, a laser component, and an ultrasonic component. The laser component includes a first mounting block and a laser element disposed on the first mounting block. The ultrasonic component includes a second mounting block and an ultrasonic element disposed on the second mounting block. The first mounting block and the second mounting block are connected to the main control module, and the laser component and the ultrasonic component are respectively communicatively connected to the main control module. The ultrasonic element and the laser element are used to emit ultrasonic energy and laser energy to separate the chip and the blue film.

[0006] In an optional embodiment, the first mounting block is provided with a first mounting groove, and the laser element is disposed in the first mounting groove; the second mounting block is provided with a second mounting groove, and the ultrasonic element is disposed in the second mounting groove.

[0007] In an optional embodiment, the laser element is detachably disposed in the first mounting groove, and the ultrasonic element is detachably disposed in the second mounting groove.

[0008] In an optional embodiment, the first mounting block is provided with a mounting through hole, and the second mounting block is disposed within the mounting through hole.

[0009] In an optional embodiment, a cover is also included, which is connected to the main control module, and the laser component and the ultrasonic component are disposed within the cover.

[0010] In an optional embodiment, the cover is provided with a first emission hole and a second emission hole, the first emission hole being configured corresponding to the laser element and the second emission hole being configured corresponding to the ultrasonic element.

[0011] In an optional embodiment, the number of first emission holes includes multiple ones, and a first connecting groove is provided between two adjacent first emission holes for connecting multiple first emission holes; the number of second emission holes includes multiple ones, and a second connecting groove is provided between two adjacent second emission holes for connecting multiple second emission holes.

[0012] In an optional embodiment, the plurality of first emission holes are evenly distributed in a ring, the second emission holes are evenly distributed in a ring, and the first connecting groove and the second connecting groove are respectively arc-shaped grooves.

[0013] In an optional implementation, the main control module is provided with a first plug-in hole and a second plug-in hole, the first plug-in hole being used for electrical connection with the laser element, and the second plug-in hole being used for electrical connection with the ultrasonic element.

[0014] In a second aspect, the present invention provides a welding system comprising a chip, a blue film, and a laser welding apparatus as described in any of the foregoing embodiments, wherein the chip is disposed on the blue film, and the laser welding apparatus is disposed on the side of the blue film away from the chip.

[0015] In an optional embodiment, a substrate is also included, the substrate being disposed on the side of the chip away from the blue film, and the laser welding device is used to emit laser energy and ultrasonic energy between the chip and the blue film to separate the blue film and the chip, so that the chip falls onto the substrate; the laser welding device is also used to weld the fallen chip to the substrate.

[0016] In an optional embodiment, the device further includes a substrate and a suction nozzle. The laser welding apparatus is used to emit laser energy and ultrasonic energy between the chip and the blue film to separate the blue film and the chip. The suction nozzle is used to pick up and transfer the separated chip onto the substrate.

[0017] Thirdly, the present invention provides a laser welding method applied to a welding system as described in any of the foregoing embodiments, the method comprising:

[0018] It emits laser energy and ultrasonic energy to separate the blue film and the chip;

[0019] The separated chip is then transferred onto a substrate.

[0020] The chip is soldered to the substrate.

[0021] The beneficial effects of the embodiments of the present invention include, for example:

[0022] The laser welding apparatus provided in this invention uses an ultrasonic element to emit ultrasonic energy and a laser element to emit laser energy. The laser energy and ultrasonic energy are used to strike the connection surface of the vibrating chip and the blue film, thereby separating the chip and the blue film. This separation method is a non-contact separation, which can effectively avoid the damage to the chip caused by the pin in the traditional separation process, which is beneficial to improving chip quality. Furthermore, the use of laser energy and ultrasonic energy can improve the separation efficiency.

[0023] The welding system provided in this embodiment of the invention includes the laser welding device described above, which can quickly and effectively separate the chip and the blue film, while avoiding damage to the chip during the separation process. This helps to improve separation efficiency and quality and protect the chip from damage.

[0024] The laser welding method provided in this invention uses laser energy and ultrasonic energy to separate the chip and the blue film, which has high separation efficiency and helps to avoid damage to the chip during the separation process, thereby improving chip quality. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the overall structure of the laser welding device provided in an embodiment of the present invention;

[0027] Figure 2 This is an exploded structural diagram of the laser welding apparatus provided in an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the first state of the welding system provided in an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the second state of the welding system provided in an embodiment of the present invention;

[0030] Figure 5 This is a structural schematic diagram of another application scenario of the welding system provided in an embodiment of the present invention.

[0031] Icons: 100-Laser welding device; 110-Main control module; 111-First insertion hole; 113-Second insertion hole; 120-Laser assembly; 121-First mounting block; 123-Laser element; 125-First mounting groove; 127-Mounting through hole; 129-First protrusion; 130-Ultrasonic assembly; 131-Second mounting block; 133-Ultrasonic element; 135-Second mounting groove; 137-Second protrusion; 140-Cover; 141-Bottom wall; 143-Side wall; 151-First emission hole; 153-Second emission hole; 155-First connecting groove; 157-Second connecting groove; 210-Chip; 220-Blue film; 221-Bubble; 230-Substrate; 240-Nose. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0036] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0037] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0038] Please refer to Figures 1 to 3 This embodiment provides a laser welding apparatus 100, including a main control module 110, a laser component 120, and an ultrasonic component 130. The laser component 120 includes a first mounting block 121 and a laser element 123 disposed on the first mounting block 121. The ultrasonic component 130 includes a second mounting block 131 and an ultrasonic element 133 disposed on the second mounting block 131. The first mounting block 121 and the second mounting block 131 are connected to the main control module 110, and the laser component 120 and the ultrasonic component 130 are respectively communicatively connected to the main control module 110. The ultrasonic element 133 and the laser element 123 are used to emit ultrasonic energy and laser energy to separate the chip 210 and the blue film 220. It can be understood that the main control module 110 is used to control the laser element 123 to emit laser energy and also to control the ultrasonic element 133 to emit ultrasonic energy. By using laser energy and ultrasonic energy, the chip 210 and the blue film 220 can be separated, improving separation efficiency and quality, and avoiding damage such as cracks caused by uneven stress on the chip 210.

[0039] The first mounting block 121 has a first mounting groove 125, in which the laser element 123 is disposed. The first mounting groove 125 is used to accommodate the laser element 123, facilitating its installation and fixation, and resulting in a more stable and compact structure. The second mounting block 131 has a second mounting groove 135, in which the ultrasonic element 133 is disposed. The second mounting groove 135 is used to accommodate the ultrasonic element 133, facilitating its installation and fixation, and resulting in a more stable and compact structure. Optionally, the laser element 123 can be detachably disposed in the first mounting groove 125, and the ultrasonic element 133 can be detachably disposed in the second mounting groove 135. This detachable connection method facilitates the maintenance and replacement of the laser element 123 and the ultrasonic element 133. It should be noted that the number of laser elements 123 and the number of ultrasonic elements 133 can be one or more each. The number of laser elements 123 and the number of ultrasonic elements 133 can be flexibly set according to actual needs. Multiple laser elements 123 and multiple ultrasonic elements 133 can be evenly spaced. No specific limitation is made here.

[0040] The first mounting block 121 has a mounting through hole 127, and the second mounting block 131 is disposed within the mounting through hole 127. In this embodiment, the size of the second mounting block 131 is smaller than the size of the first mounting block 121. The first mounting block 121 and the second mounting block 131 are respectively designed as discs, and the outer diameter of the second mounting block 131 is adapted to the diameter of the mounting through hole 127 so that the second mounting block 131 is just installed inside the first mounting block 121. This arrangement makes the structure more compact, facilitates the reduction of the overall volume of the laser welding device 100, and makes it lighter, which is beneficial for installation and movement. It should be noted that the shape of the first mounting block 121 and the shape of the second mounting block 131 are not limited to circles, but can also be square, elliptical, triangular, rhomboid, polygonal or other arbitrary shapes, which are not specifically limited here. Similarly, the connection method of the first mounting block 121 and the second mounting block 131 is not limited to the above-listed scenarios. In other optional embodiments, the size of the first mounting block 121 can be designed to be smaller, and a mounting through hole 127 can be provided on the second mounting block 131 so that the first mounting block 121 is disposed within the mounting through hole 127 of the second mounting block 131; or, the first mounting block 121 and the second mounting block 131 can be arranged side by side, for example, the first mounting block 121 is semi-circular, the second mounting block 131 is semi-circular, and the first mounting block 121 and the second mounting block 131 are connected to form a complete disk. Of course, the semi-circular dimensions of the first mounting block 121 and the second mounting block 131 can also be unequal, which is not specifically limited here.

[0041] Optionally, the laser welding device 100 further includes a cover 140, which is connected to the main control module 110. The laser component 120 and the ultrasonic component 130 are disposed within the cover 140. It is understood that the cover 140 has a hollow shell structure, including a bottom wall 141 and a side wall 143 connected to each other. The bottom wall 141 and the side wall 143 form a receiving groove for accommodating the laser component 120 and the ultrasonic component 130. A first emission hole 151 and a second emission hole 153 are provided on the cover 140. The first emission hole 151 corresponds to the laser component 123, and the second emission hole 153 corresponds to the ultrasonic component 133. In this embodiment, the first emission hole 151 and the second emission hole 153 are located on the bottom wall 141 of the cover 140, and the side wall 143 of the cover 140 is used to connect to the main control module 110, including but not limited to snap-fit, threaded connection, bolt connection, adhesive bonding, riveting, or other connection methods.

[0042] The number of first emission holes 151 includes multiple holes, and a first connecting groove 155 is provided between two adjacent first emission holes 151. The first connecting groove 155 is used to connect multiple first emission holes 151 and can be used to transmit laser energy to achieve uniform distribution of laser energy, thereby improving separation quality and efficiency. The number of second emission holes 153 includes multiple holes, and a second connecting groove 157 is provided between two adjacent second emission holes 153. The second connecting groove 157 is used to connect multiple second emission holes 153 and can be used to transmit ultrasonic energy to achieve uniform distribution of ultrasonic energy, thereby improving separation quality and efficiency. Optionally, the multiple first emission holes 151 are evenly distributed in a ring, the second emission holes 153 are evenly distributed in a ring, and the first connecting groove 155 and the second connecting groove 157 are respectively arc-shaped grooves. It is easy to understand that after the cover 140 and the main control module 110 are assembled, the laser element 123 protrudes from the first emission hole 151 to emit laser energy towards the target location through the first emission hole 151; the ultrasonic element 133 protrudes from the second emission hole 153 to emit ultrasonic energy towards the target location through the second emission hole 153. In this embodiment, the target location includes the adhesive layer between the chip 210 and the blue film 220. After the laser energy reaches the adhesive layer, the adhesive layer is heated and melted, generating voids and bubbles 221. After the ultrasonic energy reaches the adhesive layer, it accelerates the expansion of the bubbles 221 in the adhesive layer, so as to separate the chip 210 and the blue film 220. In other optional embodiments, the first connecting groove 155 and the second connecting groove 157 can also be connected, for example, through a third connecting groove (not shown). The third connecting groove is located between the first connecting groove 155 and the second connecting groove 157, and is connected to the first connecting groove 155 and the second connecting groove 157 respectively, so that the energy distribution is more uniform.

[0043] The main control module 110 is provided with a first insertion hole 111 and a second insertion hole 113. The first insertion hole 111 is used for electrical connection with the laser element 123, and the second insertion hole 113 is used for electrical connection with the ultrasonic element 133. Correspondingly, the first mounting block 121 is provided with a first protrusion 129 that matches the first insertion hole 111, and the second mounting block 131 is provided with a second protrusion 137 that matches the second insertion hole 113. The first protrusion 129 and the second protrusion 137 can realize both assembly positioning and wire connection. It can be understood that in this embodiment, the communication connection between the laser element 123 and the main control module 110 can be an electrical connection, such as a direct connection by plugging in, or an indirect connection through a cable, or a connection through a wireless network or other frequency bands, as long as the main control module 110 can control the laser element 123 and the ultrasonic element 133. Here, the main control module 110 is mainly used to control the magnitude and speed of laser emission energy, the magnitude and frequency of ultrasonic energy, etc., which are not specifically limited here.

[0044] Optionally, the ultrasonic component 130 also has a flaw detection function, which can be used to detect flaws in the chip 210. After the chip 210 is separated from the blue film 220 and before the chip 210 is soldered to the substrate 230, the chip 210 is inspected, including but not limited to detecting flaws in the metal layer and metal passivation layer on the chip 210, as well as detecting whether there are cracks on the surface and inside of the chip 210. If a damaged chip 210 is found, it can be rejected in time to ensure that all chips 210 mounted on the substrate 230 are qualified products, which helps to improve the quality of surface mount packaging. Alternatively, after the chip 210 is soldered to the substrate 230, flaw detection can be performed on the solder joint of the chip 210 to ensure the pass rate of chip 210 mounting. For example, after the chip 210 is soldered to the substrate 230, an IMC layer is formed between the solder on the chip 210 and the substrate 230. The ultrasonic component 130 can be used to detect the growth of the IMC layer to determine the bonding strength after soldering. IMC is an abbreviation for "Intermetallic Compound," which can be translated as interfacial metal compound or intermetallic compound. IMC is a chemical molecular composition, and its formation requires energy. During the soldering process, the bumps on chip 210 and the solder on substrate 230 undergo a diffusion reaction under intense heat, thereby generating a robust interfacial IMC layer. It should be noted that the ultrasonic element 133 can both separate chip 210 and blue film 220 and perform flaw detection on chip 210, offering multiple functions and fast, efficient operation. The principle of using ultrasound for flaw detection is existing technology and will not be elaborated here. Depending on actual needs, the ultrasonic vibration frequency emitted by the ultrasonic element 133 may differ when performing different functions. If the ultrasonic vibration frequency required for the separation process is different from that required for flaw detection, multiple functions can be achieved by controlling the ultrasonic element 133 to alternately emit ultrasonic waves of different frequencies. Alternatively, some ultrasonic components 133 can be controlled to emit ultrasonic waves of a first frequency to achieve the function of the separation chip 210, while other ultrasonic components 133 can be controlled to emit ultrasonic waves of a second frequency to achieve the flaw detection function. Of course, in optional embodiments, the functions of the separation chip 210 and the flaw detection function can both utilize ultrasonic waves of the same vibration frequency.

[0045] Combination Figure 4This invention also provides a welding system, including a chip 210, a blue film 220, and a laser welding device 100 as described in any of the foregoing embodiments. The chip 210 is disposed on the blue film 220, and the laser welding device 100 is disposed on the side of the blue film 220 away from the chip 210. The laser welding device 100 enables the separation of the chip 210 and the blue film 220 with high efficiency and avoids damage to the chip 210 during the separation process. Optionally, the welding system further includes a substrate 230, disposed on the side of the chip 210 away from the blue film 220. The laser welding device 100 emits laser energy and ultrasonic energy between the chip 210 and the blue film 220 to melt the adhesive layer between the blue film 220 and the chip 210, thereby separating the blue film 220 and the chip 210, and causing the separated chip 210 to fall onto the substrate 230. The laser welding device 100 is also used to weld the fallen chip 210 to the substrate 230. It is understood that the laser welding device 100 is used to emit laser energy and ultrasonic energy between the chip 210 and the substrate 230 to weld the chip 210 to the substrate 230. This eliminates the need for the process of transferring the chip 210 using an adsorption component, simplifying the process steps and avoiding damage to the chip 210 during the transfer process. Furthermore, this mounting method avoids the step in existing processes where reflow is required after mounting to melt and fix the bumps of the flip chip 210 onto the substrate 230, making the process simpler and improving the efficiency of surface mount packaging.

[0046] It should be noted that when the laser component 120 heats and melts the adhesive layer between the blue film 220 and the chip 210 by emitting laser energy, the adhesive layer on the surface of the blue film 220 is melted, generating voids and bubbles 221. The ultrasonic component 130 can simultaneously emit ultrasonic vibration frequencies, causing the bubbles 221 to rapidly diffuse and expand, thereby accelerating separation and improving the separation quality and efficiency of the chip 210 and the blue film 220. The laser welding device 100 can simultaneously knock off one or more chips 210. To further improve the separation efficiency of the chips 210, multiple laser welding devices 100 can be set up, or multiple laser components 120 and ultrasonic components 130 can be set up on the same main control module 110, so that the energy emitted by the laser welding device 100 covers a larger area and knocks off more chips 210 at once. Of course, during the separation process, multiple chips 210 can be knocked off simultaneously, or a portion of the blue film 220 adhesive layer can be in a molten state while another portion is in a preheated state, achieving batch separation of the chips 210. No specific limitation is made here.

[0047] Combination Figure 5Of course, in other optional embodiments, a substrate 230 and a suction nozzle 240 are also included. The laser welding device 100 is used to emit laser energy and ultrasonic energy between the chip 210 and the blue film 220 to separate the blue film 220 and the chip 210. After the chip 210 is separated, the suction nozzle 240 is used to pick up and transfer the separated chip 210 to the substrate 230, and then weld the chip 210 and the substrate 230. A traditional welding method can be used, or the laser and ultrasonic welding provided in this embodiment can be used. Optionally, the laser welding device 100 is located on the side of the blue film 220 away from the chip 210, and the suction nozzle 240 is located on the side of the chip 210 away from the blue film 220. For example, the blue film 220 and the chip 210 are arranged as a whole in the middle, with the chip 210 facing upward and the blue film 220 facing downward. The laser welding device 100 is located below the blue film 220, and the suction nozzle 240 is located above the chip 210. The laser welding device 100 emits laser energy and ultrasonic energy between the chip 210 and the blue film 220 to separate the blue film 220 and the chip 210. After the chip 210 is separated, the suction nozzle 240 adsorbs the chip 210 and transfers it to the nearby substrate 230.

[0048] This invention also provides a laser welding method applicable to the welding system described in any of the foregoing embodiments. The method includes: emitting laser energy and ultrasonic energy to separate the blue film 220 and the chip 210; transferring the separated chip 210 onto a substrate 230; and welding the chip 210 to the substrate 230. In this embodiment, the specific process is as follows:

[0049] In this embodiment, a preset distance is provided between the laser welding device 100 and the blue film 220, meaning that the laser welding device 100 is non-contact with the blue film 220, chip 210, etc. This preset distance can be set according to the energy generated by the laser and ultrasound. Controlled by the main control module 110, laser energy and ultrasonic vibration frequency are generated simultaneously to bombard the adhesive layer of the blue film 220 on the back of the chip 210, that is, the adhesive layer connecting the chip 210 and the blue film 220. This causes the adhesive layer on the surface of the blue film 220 to generate voids and bubbles 221 when heated. The ultrasonic vibration frequency can cause the voids and bubbles 221 generated on the surface of the blue film 220 to spread and expand rapidly, accelerating the separation of the chip 210 and the blue film 220. Due to the influence of its own gravity and the bombardment effect of laser energy and ultrasonic vibration frequency, the chip 210 will fall onto the surface of the substrate 230 below. After the chip 210 falls onto the substrate 230, the laser energy and ultrasonic vibration frequency continue to reach the contact surface between the substrate 230 and the chip 210, melting the solder on the substrate 230 and achieving the purpose of welding the chip 210 to the substrate 230.

[0050] In this welding process, the laser welding device 100 is positioned above the blue film 220. The distance H between the substrate 230 and the blue film 220 can be set according to the energy generated by the laser and ultrasound. Optionally, the distance H between the substrate 230 and the blue film 220 is equal to the sum of the distance H1 between the substrate 230 and the chip 210, the thickness H2 of the chip 210, and the thickness H3 of the blue film 220, i.e., H = H1 + H2 + H3. During the welding process, the laser energy generated by the laser welding device 100 heats the blue film 220 around the chip 210, causing the blue film 220 to soften rapidly, producing voids and bubbles 221. At the same time, the ultrasound emitted by the laser welding device 100 generates high-frequency vibrations on the back of the chip 210 (the side of the chip 210 closest to the blue film 220), causing the voids and bubbles 221 on the surface of the blue film 220 to increase, expand, and diffuse rapidly, achieving the separation of the chip 210 and the blue film 220. After separation, chip 210 falls onto substrate 230. The ultrasonic energy generated by the laser welding device 100 is used to detect whether chip 210 is qualified. Then, the laser welding device 100 emits laser energy and ultrasonic energy to continue bombarding the contact surface between chip 210 and substrate 230, directly welding chip 210 to the surface of substrate 230. Under the action of the laser energy and ultrasonic vibration frequency generated by the laser welding device 100, chip 210 and substrate 230 are rapidly heated by the laser and ultrasonic energy. The bumps on chip 210 and the welding material on substrate 230 reach their melting points and are then welded. For example, the bumps on chip 210 melt and are welded to the pads on substrate 230, or the welding material on substrate 230 melts and is welded to the bumps on chip 210. This avoids the problem of chip 210 being prone to cracking due to the bump solder joints on the pressure-mounted chip 210 in traditional processes. It also avoids the problem of cracking of the bump passivation layer on the chip 210 caused by warping of the substrate 230 after reflow soldering of the entire substrate 230. In this embodiment, the chip 210 can be a flip-chip 210 or a standard-mount chip 210. If a flip-chip 210 is used, flux needs to be pre-coated on the substrate 230; if a standard-mount chip 210 is used, soldering material needs to be coated on the substrate 230 to facilitate soldering between the substrate 230 and the chip 210. Using the soldering process in this embodiment simplifies the material curing process, such as reflow and baking processes.

[0051] Optionally, the preset distance between the laser welding device 100 and the blue film 220 is H4. H4 can be set according to the energy of the laser and the ultrasonic waves. In this embodiment, H4 can be set to 5um to 100um, the laser energy is 50J to 5000J, and the ultrasonic vibration frequency is 20HZ to 500HZ.

[0052] After the chip 210 and substrate 230 are soldered, ultrasonic testing can be performed using ultrasonic element 133. The solder joint of chip 210 is scanned using ultrasonic testing to detect the soldering effect. Optionally, ultrasonic tomography is used, with ultrasonic element 133 emitting waveforms of different frequencies for tomographic scanning, such as A-scan (Amplitude), C-scan (Constant Depth), and B-scan (Birightness), to detect the soldering effect of chip 210, including but not limited to detecting the metal layer, metal passivation layer, or IMC formation at the solder joint between chip 210 and substrate 230, achieving real-time monitoring of individual products and improving product yield.

[0053] It should be noted that, in the preferred embodiment, the substrate 230 is disposed below the chip 210, and the laser welding device 100 is disposed above the blue film 220, as shown below. Figure 4 As shown, when the laser welding device 100 emits laser energy and ultrasonic vibration frequency, the laser energy first reaches the adhesive layer on the surface of the blue film 220 to complete the separation process, and then penetrates to the space between the substrate 230 and the chip 210 to complete the welding process. Simultaneously, the ultrasonic vibration frequency first reaches the adhesive layer on the surface of the blue film 220 to complete the separation process and performs flaw detection on the chip 210 before separation. Then, it continues to be transmitted to the space between the substrate 230 and the chip 210 to perform flaw detection on the separated chip 210, as well as to detect the welding bond strength between the chip 210 and the substrate 230, thus assessing the welding effect. In this way, the separation process, welding process, and flaw detection can be completed simultaneously at the same station, resulting in higher production efficiency and higher energy utilization.

[0054] In summary, the embodiments of the present invention provide a laser welding apparatus 100, a welding system, and a laser welding method, which have the following beneficial effects:

[0055] The laser welding apparatus 100 provided in this embodiment of the invention uses an ultrasonic element 133 to emit ultrasonic energy and a laser element 123 to emit laser energy. The laser energy and ultrasonic energy are used to strike the adhesive layer between the vibrating chip 210 and the blue film 220, causing the chip 210 and the blue film 220 to separate. This separation method is a non-contact separation, which can effectively avoid the damage to the chip 210 caused by the pin in traditional separation processes, thus improving the quality of the chip 210. Furthermore, the use of both laser energy and ultrasonic energy can improve separation efficiency. It also has a flaw detection function, which helps improve product yield. Moreover, along the same energy transmission path, laser energy can achieve both chip 210 separation and welding, while ultrasonic energy can complete both separation and flaw detection, resulting in high production efficiency and high energy utilization.

[0056] The welding system provided in this embodiment of the invention includes the laser welding device 100 described above, which can quickly and effectively separate the chip 210 and the blue film 220, while avoiding damage to the chip 210 during the separation process. This is beneficial to improving separation efficiency and quality, and protecting the chip 210 from damage.

[0057] The laser welding method provided in this embodiment of the invention uses laser energy and ultrasonic energy to separate the chip 210 and the blue film 220, which has high separation efficiency and helps to avoid damage to the chip 210 during the separation process, thereby improving the quality of the chip 210.

[0058] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A laser welding apparatus, characterized in that, The device includes a main control module, a laser component, an ultrasonic component, and a cover. The laser component and the ultrasonic component are disposed within the cover. The laser component includes a first mounting block and a laser element disposed on the first mounting block. The ultrasonic component includes a second mounting block and an ultrasonic element disposed on the second mounting block. The first mounting block and the second mounting block are connected to the main control module, and the laser component and the ultrasonic component are respectively communicatively connected to the main control module. The ultrasonic element and the laser element are used to emit ultrasonic energy and laser energy to separate the chip and the blue film. The cover is provided with a first emission hole and a second emission hole, the first emission hole being configured corresponding to the laser element and the second emission hole being configured corresponding to the ultrasonic element; The number of the first emission holes includes multiple ones, and a first connecting groove is provided between two adjacent first emission holes. The first connecting groove is used to connect multiple first emission holes. The number of the second emission holes includes multiple second emission holes, and a second connecting groove is provided between two adjacent second emission holes. The second connecting groove is used to connect multiple second emission holes.

2. The laser welding apparatus according to claim 1, characterized in that, The first mounting block is provided with a first mounting groove, and the laser element is disposed in the first mounting groove; the second mounting block is provided with a second mounting groove, and the ultrasonic element is disposed in the second mounting groove.

3. The laser welding apparatus according to claim 2, characterized in that, The laser element is detachably disposed in the first mounting slot, and the ultrasonic element is detachably disposed in the second mounting slot.

4. The laser welding apparatus according to claim 1, characterized in that, The first mounting block has a mounting through hole, and the second mounting block is disposed in the mounting through hole.

5. The laser welding apparatus according to claim 1, characterized in that, The cover is connected to the main control module.

6. The laser welding apparatus according to claim 1, characterized in that, The first emission holes are evenly distributed in a ring, the second emission holes are evenly distributed in a ring, and the first and second connecting slots are respectively arc-shaped slots.

7. The laser welding apparatus according to any one of claims 1 to 6, characterized in that, The main control module is provided with a first plug-in hole and a second plug-in hole. The first plug-in hole is used for electrical connection with the laser element, and the second plug-in hole is used for electrical connection with the ultrasonic element.

8. A welding system, characterized in that, The device includes a chip, a blue film, and a laser welding apparatus as described in any one of claims 1 to 7, wherein the chip is disposed on the blue film, and the laser welding apparatus is disposed on the side of the blue film away from the chip.

9. The welding system according to claim 8, characterized in that, It also includes a substrate, which is disposed on the side of the chip away from the blue film. The laser welding device is used to emit laser energy and ultrasonic energy between the chip and the blue film to separate the blue film and the chip, so that the chip falls onto the substrate. The laser welding device is also used to weld the fallen chip to the substrate.

10. The welding system according to claim 8, characterized in that, It also includes a substrate and a suction nozzle. The laser welding device is used to emit laser energy and ultrasonic energy between the chip and the blue film to separate the blue film and the chip. The suction nozzle is used to pick up and transfer the separated chip onto the substrate.

11. A laser welding method, characterized in that, The method, applied to the welding system as described in any one of claims 9 to 10, comprises: It emits laser energy and ultrasonic energy to separate the blue film and the chip; The separated chip is then transferred onto a substrate. The chip is soldered to the substrate.

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