A silicon wafer carrier

Abstract

The application discloses a silicon wafer bearing device, which comprises a bearing frame formed by a cross beam and a vertical beam, wherein the cross beam and the vertical beam are connected through flanges; the flange comprises a flange body, the flange body is welded with a cross beam fixing member on the inner side, an adjusting screw is threadedly connected with a hole in the cross beam, the end of the cross beam penetrates into the hole of the cross beam fixing member, a rotation-stopping screw is tightly pressed on the cross beam to rotationally fix the cross beam, a notch is arranged on the cross beam, the notch is coincident with the position of a fixing device, and the cross beam is fixed with the fixing device through welding; two holes are arranged on the fixing device, the first hole is used for mounting a tension bar and placing a tray on the bearing frame, the second hole is perpendicular to the first hole, and a screw is arranged in the second hole to tightly fix the tension bar and the tray; and a silicon wafer clamping point is arranged on the silicon wafer placing frame. The application is convenient to use, can effectively improve the film coating efficiency and reduce the production cost.

Description

Technical Field

[0001] This invention relates to a silicon wafer carrier device. Background Technology

[0002] Heterojunction solar cells require cleaning and texturing, chemical vapor deposition (CVD), physical vapor deposition (PVD), and screen printing. PVD, in particular, deposits a transparent conductive film on the silicon wafer surface to create good ohmic contact, reduce carrier recombination efficiency, and passivate the surface. Magnetron sputtering is typically used for film deposition. Ions generated by an ion source are accelerated and focused in a high vacuum to form a high-speed ion beam that bombards the target surface. The ions exchange kinetic energy with the atoms on the solid surface, causing the atoms on the target to leave the target and deposit onto the silicon wafer to form a thin film. The silicon wafer is then placed into the vacuum chamber via a support device for film deposition.

[0003] Existing silicon wafer carrier devices suffer from limitations in performance and effectiveness due to structural and other factors. Summary of the Invention

[0004] The purpose of the invention of benzene is to provide a silicon wafer carrier device that is easy to use and improves work efficiency.

[0005] The technical solution of this invention is:

[0006] A silicon wafer support device includes a support frame composed of a crossbeam and a vertical beam, characterized in that: the crossbeam and the vertical beam are connected by a flange; the flange includes a flange body, which is welded to an inner crossbeam fixing member; an adjusting screw passes through a screw hole on the vertical beam and a screw hole on the flange body and is threaded into the inner hole of the crossbeam to adjust the distance between the crossbeam and the vertical beam; the end of the crossbeam is inserted into the inner hole of the crossbeam fixing member, and an anti-rotation screw passes through a screw hole on the crossbeam fixing member and is pressed against the crossbeam to prevent rotation and fix the crossbeam;

[0007] The crossbeam has a slot that coincides with the position of the fixing device, and the crossbeam and the fixing device are fixed together by welding. The fixing device has two holes. The first hole is used to install the tie rod and the tray placed on the support frame. The second hole is perpendicular to the first hole, and a screw is installed in the second hole to tighten and fix the tie rod and the tray. The silicon wafer placement frame is provided with silicon wafer locking points.

[0008] The vertical beam includes an outer beam and an inner beam, which are connected by welding. The screw holes on the vertical beam are located on the inner beam.

[0009] The crossbeam includes upper and lower crossbeams located at the upper and lower ends of the load-bearing frame, and a middle crossbeam located in the middle of the load-bearing frame.

[0010] Multiple silicon wafer placement frames are placed on the tray.

[0011] The application is convenient to use, can effectively improve the coating efficiency and reduce the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0012] The application will be further described below in combination with the drawings and examples.

[0013] Figure 1 is a structural schematic diagram of one embodiment of the application.

[0014] Figure 2 is a structural schematic diagram of the vertical beam.

[0015] Figure 3 is a left view of Figure 2 .

[0016] Figure 4 is a structural schematic diagram of the horizontal beam.

[0017] Figure 5 is a partial sectional view of the connection between the side horizontal beam and the vertical beam, i.e. Figure 1 is an enlarged view of A part of .

[0018] Figure 6 is a schematic diagram of the connection between the middle horizontal beam and the vertical beam, i.e. Figure 1 is an enlarged view of C part of .

[0019] Figure 7 is a D-D sectional view of Figure 1 .

[0020] Figure 8 is a partial enlarged view of the silicon wafer placing frame. DETAILED DESCRIPTION

[0021] A silicon wafer carrying device comprises a carrying frame composed of horizontal beams and vertical beams, the horizontal beams 5 and the vertical beams are connected through flanges 3; the flange comprises a flange body 14, the flange body is welded with the horizontal beam fixing member 12 on the inner side, the adjusting screw 15 is screwed through the screw hole on the vertical beam, the screw hole on the flange body and the inner hole of the horizontal beam, and is screwed with the horizontal beam, so that the distance between the horizontal beam and the vertical beam can be adjusted; the end of the horizontal beam is inserted into the inner hole of the horizontal beam fixing member, the rotation stopping screw 13 is screwed through the screw hole on the horizontal beam fixing member and is tightly pressed on the horizontal beam to rotationally fix the horizontal beam; the flange connection is adopted, the horizontal beam and the vertical beam are guaranteed to be perpendicular, and the assembly is simple, only the horizontal beam needs to be inserted and the screw is tightened.

[0022] The horizontal beam is provided with a notch 21 which is coincided with the position of the fixing device 6, and the horizontal beam is fixed with the fixing device by welding; the fixing device is provided with two holes, the first hole is used for installing the pull bar 17 and placing the tray 9 on the bearing frame, and the second hole is perpendicular to the first hole, and the screw 7 is installed in the second hole to tightly fix the pull bar and the tray. The pull bar is clamped by the screw 7 and will not fall off due to vibration in the later operation process, and the tray is not easy to deform through the pull bar. The contact area of the bearing frame and the tray is reduced, and deformation caused by uneven heating due to contact is avoided. The flatness of the tray can be adjusted by fine-tuning the position of the fixing device on the frame.

[0023] The vertical beam comprises an outer beam body 1 and an inner beam body 2, and the outer beam body and the inner beam body are connected by welding. The screw hole on the vertical beam is arranged on the inner beam body. The strength of the structure is increased by 3 times compared with the original main and auxiliary beams, the manufacturing cost is low, the outer beam body can be directly machined by a machine tool without bending, the process is saved, the efficiency is improved, and the cost is reduced.

[0024] The horizontal beam comprises upper and lower horizontal beams 5 located at the upper and lower ends of the bearing frame and a middle horizontal beam 16 located at the middle part of the bearing frame.

[0025] A plurality of silicon wafer placing frames are placed on the tray, the production efficiency is improved by increasing the number of placing frames, the effective area of coating is increased, the coating efficiency is improved, and the production cost is reduced. The silicon wafer placing frame is provided with a silicon wafer clamping point 8, two clamping points are arranged on each edge of the wafer placing table, a total of 8 clamping points are arranged on the wafer placing table, and the clamping points have a guiding effect when the mechanical hand places the wafer, so that the wafer can be smoothly placed.

[0026] The figure also shows: a middle flange 10, a screw 4 for fixing the flange to the vertical beam, a screw 11 for fixing the middle flange, an assembly position 18 of the fixing block on the vertical beam, and a u-shaped groove 20 on the side horizontal beam, so that the horizontal beam avoids the screw 13 and can be smoothly inserted.

Claims

1. A silicon wafer support device, comprising a support frame composed of horizontal beams and vertical beams connected together, characterized in that: The crossbeam and vertical beam are connected by a flange; the flange includes a flange body, which is welded to the inner crossbeam fixing component. The adjusting screw passes through the screw hole on the vertical beam and the screw hole on the flange body and is threaded into the inner hole of the crossbeam to adjust the distance between the crossbeam and the vertical beam; the end of the crossbeam is inserted into the inner hole of the crossbeam fixing component, and the anti-rotation screw passes through the screw hole on the crossbeam fixing component and is pressed against the crossbeam to prevent rotation and fix the crossbeam. The crossbeam has a slot that coincides with the position of the fixing device. The crossbeam and the fixing device are fixed by welding. The fixing device has two holes. The first hole is used to install the tie rod and the tray placed on the support frame. The second hole is perpendicular to the first hole. Screws are installed in the second hole to tighten and fix the tie rod and the tray. The silicon wafer placement frame is equipped with silicon wafer locking points.

2. The silicon wafer support device according to claim 1, characterized in that: The vertical beam includes an outer beam and an inner beam, which are connected by welding. The screw holes on the vertical beam are located on the inner beam.

3. A silicon wafer support device according to claim 1 or 2, characterized in that: The crossbeam includes upper and lower crossbeams located at the upper and lower ends of the load-bearing frame, and a middle crossbeam located in the middle of the load-bearing frame.

4. A silicon wafer support device according to claim 1 or 2, characterized in that: Multiple silicon wafer placement frames are placed on the tray.

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