A substrate carrier for film flip chip packaging

Abstract

The present invention discloses a substrate carrier for film flip chip packaging, comprising: a base having a cooling channel and a connection channel communicating with the cooling channel; a coolant transmission mechanism including: a delivery needle disposed in the connection channel, and the size of the delivery needle is smaller than that of the connection channel to form a gap between the delivery needle and the connection channel; a main delivery member communicating with the delivery needle; and a plugging member for plugging the gap. Compared with the prior art, in this embodiment, the coolant is delivered into the cooling channel through the delivery needle, and a gap is formed between the delivery needle and the side wall of the connection channel. Due to the existence of the gap, an insulating layer is actually formed, so that when the coolant is transmitted in the delivery needle, the influence on the area of the base flowing through can be minimized as much as possible, and the cold quantity of the coolant is concentrated and released in the cooling channel, and more uniform and effective cooling of the base can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of film flip chip packaging, and particularly to a substrate carrier for film flip chip packaging. Background Art

[0002] With the improvement of semiconductor technology, liquid crystal displays have the advantages of low power consumption, thinness, light weight, high resolution, high color saturation, and long lifespan, and are thus widely used in electronic products closely related to daily life, such as liquid crystal screens of mobile phones, notebook computers, or desktop computers, and liquid crystal televisions. Among them, the driver chip (driver IC) of the display is an essential component of the liquid crystal display. In the prior art, the driver chips of liquid crystal display devices generally use tape automatic bonding (TAB) packaging technology for wafer packaging, and the chip-on-film (COF) packaging structure is one of the packaging structures that apply the tape automatic bonding technology. [[ID=*10]]

[0003] The manufacturing process of chip packaging with a chip-on-film (COF) packaging structure is as follows: After completing the circuit on the flexible substrate and the bump process on the chip, inner lead bonding (ILB) is performed by thermal compression, so that the bumps on the chip and the inner leads on the flexible substrate are eutectically bonded and electrically connected. Then, the chip and the circuits of the inner leads on the flexible substrate are sealed with encapsulation resin. After electrical inspection, outer lead bonding (OLB) is performed. Among them, the outer leads are formed by extending the inner leads on the flexible substrate outward, and the flexible substrate is also electrically connected to a circuit board or other components by using the outer leads in the same thermal compression manner.

[0004] During the thermal compression process, a hot press head is generally used to adsorb the chip, and the chip is adsorbed above the flexible substrate to be carried and electrically connected to the flexible substrate adsorbed on the carrier. In the process of bonding the bumps on the chip and the pins on the flexible substrate, in order to ensure the bonding strength between the two, there are certain requirements for the flatness of the top surface of the carrier that adsorbs and supports the flexible substrate.

[0005] When connecting the flexible substrate and the bumps by thermal compression, the temperature of the hot press head is relatively high, and the heat on the hot press head is easily conducted to the carrier, thereby affecting the carrier, causing the carrier to bend and deform, and thus reducing the flatness of the upper surface of the carrier, which affects the product quality. Summary of the Invention

[0006] The object of the present invention is to provide a substrate carrier for film flip-chip packaging to solve the deficiencies in the prior art. It can minimize the influence on the area of the base flowing through when the coolant is transmitted in the delivery needle tube, concentrate the cooling capacity of the coolant in the cooling channel for release, and can achieve more uniform and effective cooling of the base.

[0007] The substrate carrier for film flip-chip packaging provided by the present invention includes:

[0008] A base, having a cooling channel and a connection channel communicating with the cooling channel;

[0009] A coolant transmission mechanism, including:

[0010] A delivery needle tube, arranged in the connection channel, and the size of the delivery needle tube is smaller than that of the connection channel to form a gap portion between the delivery needle tube and the connection channel;

[0011] A main delivery member, communicating with the delivery needle tube;

[0012] A plugging member, used for plugging the gap portion.

[0013] As a further improvement of the present invention, the base has a length direction and a width direction, the cooling channel has a main channel extending along the length direction and an outlet hole communicating with the main channel; the connection channel extends along the width direction and communicates with the main channel.

[0014] As a further improvement of the present invention, there are two outlet holes, and the connection channel is arranged between the two outlet holes and at the middle position of the two outlet holes.

[0015] As a further improvement of the present invention, the connection channel has a connection outlet arranged on the side wall of the main channel, and the connection outlet is arranged on the side wall of the main channel and close to the bottom.

[0016] As a further improvement of the present invention, the delivery needle tube has a free end extending in the cooling channel and a fixed end opposite to the free end; the fixed end communicates with the main delivery member.

[0017] As a further improvement of the present invention, the free end of the delivery needle tube extends to the central position of the cooling channel in the width direction.

[0018] As a further improvement of the present invention, the base also has a blind hole communicating with the main channel, the blind hole is opposite to the connection channel in position, and the blind hole and the connection channel are arranged on opposite sides of the main channel.

[0019] As a further improvement of the present invention, the volume of the blind hole is consistent with the volume of the gap portion.

[0020] As a further improvement of the present invention, a plurality of connecting channels are provided, and the plurality of connecting channels are arranged in parallel along the length direction, and the conveying needle tube is arranged in each connecting channel.

[0021] As a further improvement of the present invention, the plugging member is arranged outside the base and has a mounting hole adapted to the conveying needle tube, the main conveying member is communicated with the mounting hole, the plugging member abuts against the side wall of the base and has a sealing portion opposite to the position of the gap portion, and the sealing portion is arranged at the edge of the mounting hole.

[0022] Compared with the prior art, in this embodiment, the coolant is conveyed into the cooling channel through the conveying needle tube, and a gap portion is formed between the conveying needle tube and the side wall of the connecting channel. Due to the existence of the gap portion, an insulating layer is actually formed, so that when the coolant is transmitted in the conveying needle tube, the influence on the area of the base flowing through can be reduced as much as possible, and the cold quantity of the coolant is concentrated in the cooling channel to be released, and more uniform and effective cooling of the base can be achieved. It is avoided that the coolant cools the area of the base flowing through before flowing into the cooling channel, resulting in a lower temperature in the area where the coolant flows through, thereby causing uneven cooling of the base and affecting the flatness of the upper surface of the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic structural diagram of a substrate carrier for film flip chip packaging disclosed in an embodiment of the present invention;

[0024] Figure 2 is Figure 1 a top view;

[0025] Figure 3 is Figure 2 a sectional view taken along the AA direction in

[0026] Figure 4 is Figure 1 a front view;

[0027] Figure 5 is Figure 4 a sectional view taken along the BB direction in

[0028] Figure 6 is Figure 4 a sectional view taken along the CC direction in

[0029] Figure 7 is Figure 4 a sectional view taken along the DD direction in

[0030] [[ID=5,4]] Figure 8It is a schematic structural diagram of a coolant transmission mechanism in a substrate carrier for film flip chip packaging according to an embodiment of the present invention;

[0031] Figure 9 It is Figure 8 a top view of;

[0032] Figure 10 It is a schematic installation structure diagram of a conveying needle tube and a plugging member in a substrate carrier for film flip chip packaging according to an embodiment of the present invention;

[0033] Figure 11 It is a schematic first installation structure diagram of a conveying needle tube on a base in a substrate carrier for film flip chip packaging according to an embodiment of the present invention;

[0034] Figure 12 It is a schematic second installation structure diagram of a conveying needle tube on a base in a substrate carrier for film flip chip packaging according to an embodiment of the present invention;

[0035] Figure 13 It is a schematic structural diagram of a main conveying member in a substrate carrier for film flip chip packaging according to an embodiment of the present invention;

[0036] Description of reference numerals: 1 - base, 11 - cooling channel, 111 - main channel, 112 - outlet hole, 12 - connecting channel, 121 - connecting outlet, 13 - gap part, 14 - blind hole,

[0037] 2 - coolant transmission mechanism, 21 - conveying needle tube, 211 - free end, 212 - fixed end, 22 - main conveying member, 220 - buffer tank, 221 - body part, 222 - connecting pipe,

[0038] 23 - plugging member, 231 - installation hole. Detailed implementation manners

[0039] The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0040] Embodiments of the present invention: A substrate carrier for film flip chip packaging is disclosed. The substrate carrier adsorbs and positions a flexible substrate during film flip chip packaging and combines with a chip adsorbed by a pressing head. The pressing head moves the chip to the upper side of the carrier, aligns the bumps on the chip with the pin positions on the flexible substrate, and connects the two by means of thermal pressing, thereby realizing the electrical connection between the chip and the substrate.

[0041] When connecting the flexible substrate and the bumps by means of thermal pressing, the heat on the thermal pressing head is relatively high. The relatively high heat is likely to affect the carrier, causing the carrier to bend and deform, ultimately reducing the flatness of the upper surface of the carrier and affecting the product quality.

[0042] In the substrate carrier for film flip chip packaging disclosed in this embodiment, a coolant transmission mechanism 2 is provided. The coolant transmission mechanism 2 can rapidly cool down the substrate carrier, thereby effectively avoiding the deformation of the substrate carrier caused by excessive temperature.

[0043] As Figures 1-13 shown, in this embodiment, the substrate carrier for film flip chip packaging includes: a base 1 and a coolant transmission mechanism 2; the base 1 has a cooling channel 11 and a connection channel 12 communicating with the cooling channel 11, and the connection channel 12 communicates with the cooling channel 11. A coolant such as cooling water or cooling air flows into the cooling channel 11 from the outside through the coolant transmission mechanism 2, and cools down the base 1 during the process of flowing through the cooling channel 11.

[0044] In order to better achieve the inflow of the coolant, in this embodiment, the coolant transmission mechanism 2 includes a delivery needle tube 21, a main delivery member 22, and a plugging member 23;

[0045] The delivery needle tube 21 is disposed in the connection channel 12, and the size of the delivery needle tube 21 is smaller than that of the connection channel 12 to form a gap portion 13 between the delivery needle tube 21 and the connection channel 12;

[0046] The main delivery member 22 communicates with the delivery needle tube 21. The coolant is delivered into the delivery needle tube 21 through the main delivery member 22, and is delivered into the cooling channel 11 under the action of the delivery needle tube 21;

[0047] The plugging member 23 is used to plug the gap portion 13 to prevent the gap portion 13 from communicating with the outside, thereby avoiding the leakage of the coolant from the gap portion 13, so that the coolant entering the cooling channel 11 through the delivery needle tube 21 only flows along the cooling channel 11 to achieve the cooling and temperature reduction of the base 1.

[0048] As Figure 3 shown, in this embodiment, the coolant is delivered into the cooling channel 11 through the delivery needle tube 21, and a gap portion 13 is formed between the delivery needle tube 21 and the side wall of the connection channel 12. Due to the existence of the gap portion 13, an insulating layer is actually formed, so that when the coolant is transmitted in the delivery needle tube 21, the influence on the area of the base 1 flowing through can be reduced as much as possible, and the cold quantity of the coolant is concentrated in the cooling channel 11 for release, which can achieve more uniform and effective temperature reduction of the base 1. It is avoided that the coolant cools down the area of the base 1 flowing through before flowing into the cooling channel 11, resulting in a lower temperature in the area where the coolant flows through, thereby causing uneven temperature reduction of the base 1 and affecting the flatness of the upper surface of the base 1.

[0049] In this embodiment, the coolant is transported by the delivery needle tube 21. The diameter of the delivery needle tube 21 is relatively small, and the flow rate of the coolant in the delivery needle tube 21 is relatively high. The high flow rate also reduces the heat exchange with the base 1 in the flowing-through area, thus better realizing the transmission of the coolant.

[0050] In this embodiment, the base 1 has a length direction and a width direction, the length direction is perpendicular to the width direction, the cooling channel 11 has a main channel 111 extending along the length direction and an outlet hole 112 communicating with the main channel 111; the connecting channel 12 extends along the width direction and communicates with the main channel 111.

[0051] The coolant is transported from the delivery needle tube 21 into the main channel 111 and then flows out through the outlet hole 112 after flowing through the main channel 111. The main channel 111 is arranged at the central position of the base 1. The upper surface of the base 1 corresponding to the main channel 111 is the area where the hot press head acts on the base 1, that is, the main area where the hot press head affects the temperature of the base 1. In this embodiment, concentrating the release of the coolant temperature in the main channel 111 can avoid affecting other areas of the base 1.

[0052] It can be understood that, as Figure 5 shown, in order to more evenly release the cooling capacity of the coolant in the main channel 111, two outlet holes 112 are provided. The two outlet holes 112 are arranged on opposite sides of the main channel 111, and the connecting channel 12 is arranged between the two outlet holes 112 and at the middle position between the two outlet holes 112, so that the coolant can flow towards the outlet holes 112 on both sides along equal distances after entering the main channel 111, thereby making the cooling effect of the coolant more uniform.

[0053] If only one outlet hole 112 is provided, it will cause the coolant to enter from the inlet and flow out from one side of the outlet hole 112, and the flowing path will be relatively long. The longer the travel, the less the cooling capacity will be when the coolant flows further back, which is not conducive to uniform cooling.

[0054] As a preferred solution, as Figures 6-11 shown, a plurality of connecting channels 12 are provided, and the plurality of connecting channels 12 are arranged along the length direction and arranged in parallel. Correspondingly, a plurality of delivery needle tubes 21 are also provided accordingly, and each connecting channel 12 is provided with a corresponding delivery needle tube 21. It can be understood that all the connecting channels 12 are arranged between the two outlet holes 112, and the connecting channels 12 are evenly arranged between the two outlet holes 112.

[0055] The cross-section of the delivery syringe 21 is circular, the cross-section of the connection channel 12 is also circular, the delivery syringe 21 and the connection channel 12 are concentrically arranged, and the main delivery member 22 communicates with a plurality of the delivery syringes 21 at the same time.

[0056] As Figure 3 shown, the connection channel 12 has a connection outlet 121 provided on the side wall of the main channel 11, and the connection outlet 12 is provided on the side wall of the main channel 11 and close to the bottom.

[0057] Since the main channel 11 extends in the length direction, the axial direction of the main channel 11 also extends in the length direction. The main channel 11 has a top and a bottom oppositely arranged in the vertical direction, and two side walls oppositely arranged in the width direction.

[0058] In this embodiment, the connection channel 12 penetrates through the side wall of the main channel 11 and is arranged at a position close to the bottom, so as to make the connection channel 12 as far away from the upper surface of the base 1 as possible, thereby reducing the influence of the coolant flowing through the connection channel 12 on the temperature of the upper surface of the base 1 as much as possible.

[0059] In a specific embodiment, as Figure 3 shown, the height of the horizontal plane where the connection channel 12 is located is lower than the height of the horizontal plane where the main channel 11 is located. It should be noted that since the cross-section of the connection channel 12 is circular, the horizontal plane where the connection channel 12 is located refers to the horizontal plane where the axis of the connection channel 12 is located. Correspondingly, the horizontal plane where the main channel 11 is located is also the horizontal plane where the axis of the main channel 11 is located.

[0060] It can be understood that since the delivery syringe 21 is positioned in the connection channel 12, correspondingly, the height of the horizontal plane where the delivery syringe 21 is located is also slightly lower than the height of the horizontal plane where the main channel 11 is located.

[0061] The purpose of the above embodiments is to require that the penetration direction of the connection channel 12 deviates from the central position of the main channel 11 and deviates downward from the central position of the main channel 11 in the vertical direction, so as to be as far away from the upper surface of the base 1 as possible to reduce the influence on the upper surface of the base 1.

[0062] As Figure 6 shown, the delivery syringe 21 has a free end 211 extending in the cooling channel 11 and a fixed end 212 extending outward outside the connection channel 12; the fixed end 212 communicates with the main delivery member 22. In this embodiment, the delivery syringe 21 directly extends in the cooling channel 11, which can enable the coolant to directly enter the cooling channel 11 and better release the coolant in the cooling channel 11.

[0063] Further, in order to better achieve the uniform flow of the coolant in the cooling channel 11 after entering the cooling channel 11, the free end 211 of the delivery syringe 21 extends to the central position of the cooling channel 11 in the width direction. Such a structural setting enables the coolant to exactly enter the central position of the cooling channel 11 after flowing into the cooling channel 11, making the coolant flow more uniformly in the cooling channel 11.

[0064] It can be understood that due to the blocking of the gap portion 13 by the blocking member 23, one end of the gap portion 13 away from the blocking member 23 is exposed to the cooling channel 11. Since the gap portion 13 is exposed to the cooling channel, the gap portion 13 actually forms a blind hole opening to the cooling channel 11, and the existence of this blind hole will affect the uneven temperature on the relative two sides of the cooling channel 11 on the base.

[0065] Therefore, as Figure 3 and Figure 6 shown, in order to balance the influence of the above-mentioned blind hole, in this embodiment, the base 1 further has a blind hole 14 communicating with the main channel 111. The blind hole 14 is opposite to the connection channel 12 in position, and the blind hole 14 and the connection channel 12 are arranged on the relative two sides of the main channel 111.

[0066] The volume of the blind hole 14 is consistent with the volume of the gap portion 13. Setting the volume of the blind hole 14 to be consistent with that of the gap portion 13 can make the volume of the coolant accumulated in both the same, so as to better balance the influence of the accumulated coolant on the temperature of the base 1.

[0067] The blocking member 23 can be arranged in the gap portion 13. The blocking member 23 is arranged in a ring shape and is only arranged at a position close to the edge in the gap portion 13 to ensure that the gap portion 13 forms a heat insulation layer between the delivery syringe 21 and the base 1. In this embodiment, the blocking member 23 is arranged outside the gap portion 13, and the blocking member 23 covers the opening of the gap portion 13 exposed outward to form a block for the gap portion 13.

[0068] In this embodiment, as Figures 8-12 shown, the blocking member 23 is arranged outside the base 1 and has a mounting hole 231 adapted to the delivery syringe 21. The main delivery member 22 communicates with the mounting hole 231. The blocking member 23 abuts against the side wall of the base 1 and has a sealing portion opposite to the gap portion 13. The sealing portion is arranged at the edge of the mounting hole 231 and is arranged in a ring shape.

[0069] In this embodiment, since there are multiple delivery needles 21, a plurality of mounting holes 231 are correspondingly provided on the plugging member 23. The delivery needles 21 are positioned within the mounting holes 231, and the plugging member 23 is pressed and fixed onto the base 1 by the main delivery member 22.

[0070] As Figure 13 shown, in order to facilitate the synchronous delivery of the multiple delivery needles 21, the main delivery member 22 includes a body portion 221 having a buffer groove 220 and a connecting pipe 222 provided on the body portion 221 and communicating with the buffer groove 220. The buffer groove 220 extends along the length direction and communicates with a plurality of the delivery needles 21 at the same time; the buffer groove 220 faces the plugging member 23 and is opposite to the position of the plugging member 23, and the plugging member 23 covers and seals the opening of the buffer groove 220.

[0071] After the coolant enters the buffer groove 220 from the connecting pipe 222 and is buffered in the buffer groove 220, the coolant can enter different delivery needles 21 more uniformly to be transmitted into the cooling channel 11.

[0072] The connecting pipe 222 has a connection outlet provided at the bottom of the buffer groove 220, and the connection outlet is provided at the central position of the buffer groove 220. Setting the connection outlet of the connecting pipe 222 at the central position of the buffer groove 220 enables the coolant to flow in from the center of the buffer groove 220, and after flowing in, it can affect the buffer groove 220 more uniformly.

[0073] To facilitate installation and fixation, the body portion 221 is fixed to the base 1. The size of the plugging member 23 is adapted to the size of the body portion 221. The body portion 221 is fixedly connected to the base 1 by bolts, and the body portion 221 presses the plugging member 23 against the base 1.

[0074] Furthermore, since the body portion 221 is provided on the side of the base 1, in order to avoid the body portion 221 affecting one side of the base 1 when transmitting the coolant, resulting in a difference in temperature between the two sides of the base 1, in this embodiment, the plugging member 23 is made of a heat-insulating material, and the heat conduction performance of the plugging member 23 is poor. Specifically, the plugging member 23 can be a rubber part or a plastic part. The plugging member 23 being set as a heat-insulating material can effectively reduce the difference in temperature between the two sides of the base 1 caused by the lateral setting of the main delivery member 22 on the base 1.

[0075] The structure, features and effects of the present invention have been described in detail based on the embodiments shown in the drawings. The above is only the preferred embodiment of the present invention, but the present invention is not limited to the scope of implementation shown in the drawings. Any changes made in accordance with the concept of the present invention, or equivalent embodiments modified into equivalent changes, which still do not exceed the spirit covered by the specification and the drawings, shall fall within the protection scope of the present invention.

Claims

1. A substrate carrier for film flip chip packaging, characterized in that Comprising: A base having a cooling channel and a connection channel communicating with the cooling channel; A coolant transfer mechanism, comprising: A delivery syringe disposed within the connection channel, and the size of the delivery syringe is smaller than the size of the connection channel to form a gap portion between the delivery syringe and the connection channel; A main delivery member communicating with the delivery syringe; A plugging member for plugging the gap portion; The plugging member is disposed outside the gap portion and covers an opening of the gap portion exposed outward.

2. The substrate carrier for film flip chip packaging according to claim 1, wherein: The base has a length direction and a width direction, the cooling channel has a main channel extending along the length direction and an outlet hole communicating with the main channel; the connection channel extends along the width direction and communicates with the main channel.

3. The substrate carrier for film flip chip packaging according to claim 2, wherein: There are two outlet holes, and the connection channel is disposed between the two outlet holes and at the middle position between the two outlet holes.

4. The substrate carrier for film flip chip packaging according to claim 2, wherein: The connection channel has a connection outlet disposed on the side wall of the main channel, and the connection outlet is disposed on the side wall of the main channel and near the bottom.

5. The substrate carrier for film flip chip packaging according to claim 2, wherein: The delivery syringe has a free end extending within the cooling channel and a fixed end disposed opposite to the free end; the fixed end communicates with the main delivery member.

6. The substrate carrier for film flip chip packaging according to claim 5, wherein: The free end of the delivery syringe extends to the central position of the cooling channel in the width direction.

7. The substrate carrier for film flip chip packaging according to claim 2, characterized in that: The base further has a blind hole communicating with the main channel, the blind hole is opposite to the connection channel in position, and the blind hole and the connection channel are disposed on opposite sides of the main channel.

8. The substrate carrier for film flip chip packaging according to claim 7, wherein: The volume of the blind hole is consistent with the volume of the gap portion.

9. The substrate carrier for film flip chip packaging according to claim 2, characterized in that: There are multiple connection channels, and the multiple connection channels are arranged side by side along the length direction, and each connection channel is provided with the delivery syringe.

10. The substrate carrier for film flip chip packaging according to claim 9, wherein: The plugging member is disposed outside the base and has a mounting hole adapted to the delivery syringe, the main delivery member communicates with the mounting hole, the plugging member abuts against the side wall of the base and has a sealing portion opposite to the gap portion, and the sealing portion is disposed at the edge of the mounting hole.

Images