Display panel and manufacturing method thereof

Abstract

The application discloses a display panel and a manufacturing method thereof. The display panel comprises a substrate, an inorganic layer, a photoresist layer, an encapsulation layer and a groove. The inorganic layer is arranged on the substrate. The photoresist layer is arranged on the side of the inorganic layer away from the substrate. The encapsulation layer is arranged on the side of the photoresist layer away from the substrate. The groove comprises a first groove part penetrating through the photoresist layer and a second groove part penetrating through the inorganic layer. The second groove part covers the first groove part on the substrate in orthographic projection. The encapsulation layer is broken at the groove. The display panel can solve the encapsulation layer failure caused by cutting and realize a narrow frame design.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method. Background Technology

[0002] Organic light-emitting diode (OLED) devices have become a highly competitive and promising next-generation display technology due to their advantages such as all-solid-state structure, high brightness, wide viewing angle, fast response speed, wide operating temperature range, and ability to achieve flexible displays.

[0003] Organic light-emitting diode (OLED) devices are installed on display panels. The organic light-emitting materials and cathode materials in these OLEDs are particularly sensitive to water and oxygen. Excessive humidity or high oxygen content will affect the lifespan of the OLEDs. Therefore, when using OLEDs in display panels, an encapsulation layer is required to prevent water and oxygen from penetrating the OLEDs and affecting their lifespan.

[0004] However, cracks easily form in the encapsulation layer during display panel cutting, and these cracks can easily propagate to the display area of ​​the panel. Existing technologies typically employ methods such as adding anti-crack zones or designing longer effective encapsulation areas to extend the crack propagation path and prevent cracks from reaching the display area. However, the encapsulation effect of this method is limited, and the longer effective encapsulation area increases the size of the display panel bezel, affecting the narrow bezel design of the display panel. Summary of the Invention

[0005] This application provides a display panel and its manufacturing method, which can solve the problem of encapsulation layer failure caused by cutting and realize a narrow bezel design.

[0006] In a first aspect, embodiments of this application provide a display panel, comprising: a substrate, an inorganic layer, a photoresist layer, an encapsulation layer, and a trench; the inorganic layer is disposed on the substrate; the photoresist layer is disposed on the side of the inorganic layer away from the substrate; the encapsulation layer is disposed on the side of the photoresist layer away from the substrate; the trench includes a first trench portion penetrating the photoresist layer and a second trench portion penetrating the inorganic layer, wherein the orthographic projection of the second trench portion on the substrate covers the orthographic projection of the first trench portion on the substrate, and the encapsulation layer is interrupted at the trench.

[0007] Optionally, in some embodiments of this application, the diameter of the second trench portion away from the substrate is at least 200 nanometers larger than the diameter of the first trench portion near the second trench portion.

[0008] Optionally, in some embodiments of this application, the thickness of the inorganic layer is greater than 100 nanometers.

[0009] Optionally, in some embodiments of this application, the display panel further includes a metal layer disposed on the side of the inorganic layer near the substrate, and the metal layer is provided with a third trench portion corresponding to the second trench portion, the orthographic projection of the third trench portion on the substrate covering the orthographic projection of the second trench portion on the substrate.

[0010] Optionally, in some embodiments of this application, the cross-sectional shape of the first groove portion along the first direction, the cross-sectional shape of the second groove portion along the first direction, and the cross-sectional shape of the third groove portion along the first direction are all inverted trapezoids.

[0011] Optionally, in some embodiments of this application, the trench includes at least two.

[0012] Optionally, in some embodiments of this application, one of the at least two grooves is located on the cutting line.

[0013] Optionally, in some embodiments of this application, the display panel includes a display area and a border area. The border area includes a wiring area, an effective encapsulation area, and a cutting area. The effective encapsulation area is located on the side of the wiring area away from the display area, and the cutting area is located on the side of the effective encapsulation area away from the wiring area. The groove is disposed in the cutting area.

[0014] On the other hand, this application provides a method for manufacturing a display panel, including the following steps: forming an inorganic layer on a substrate; forming a photoresist layer on the inorganic layer, and forming a first trench portion of a trench on the photoresist layer; forming a second trench portion on the inorganic layer corresponding to the first trench portion, wherein the orthographic projection of the second trench portion on the substrate covers the orthographic projection of the first trench portion on the substrate; and forming an encapsulation layer on the photoresist layer.

[0015] Optionally, in some embodiments of this application, the step of forming a second trench portion corresponding to the first trench portion on the inorganic layer, wherein the orthographic projection of the second trench portion on the substrate covers the orthographic projection of the first trench portion on the substrate, specifically includes:

[0016] A metal layer is formed on the side of the inorganic layer near the substrate, and a third trench portion corresponding to the second trench portion is formed on the metal layer. The orthographic projection of the third trench portion on the substrate covers the orthographic projection of the second trench portion on the substrate.

[0017] This application provides a display panel and a method for manufacturing the same. The display panel includes: a substrate, an inorganic layer, a photoresist layer, an encapsulation layer, and trenches. The inorganic layer is disposed on the substrate. The photoresist layer is disposed on the side of the inorganic layer away from the substrate. The encapsulation layer is disposed on the side of the photoresist layer away from the substrate. The trenches include a first trench portion penetrating the photoresist layer and a second trench portion penetrating the inorganic layer, wherein the orthographic projection of the second trench portion on the substrate overlaps the orthographic projection of the first trench portion on the substrate, and the encapsulation layer is interrupted at the trenches. By forming the first trench portion and the second trench portion into a "roof-like" incised structure, when the display panel is cut, the cutting cracks generated by the encapsulation layer are difficult to extend out of the trench area, avoiding the problem of the encapsulation layer failing due to the cutting cracks extending into the display area of ​​the display panel, while also achieving a narrow bezel design. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. The accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a top view of the display panel provided in the embodiment of this application;

[0020] Figure 2 The first embodiment of this application provides the following... Figure 1 Cross-sectional view along the A-A' direction;

[0021] Figure 3 The second embodiment of this application provides the following... Figure 1 Cross-sectional view along the A-A' direction;

[0022] Figure 4 The third embodiment of this application provides the following... Figure 1 Cross-sectional view along the A-A' direction;

[0023] Figure 5 The fourth embodiment of this application provides the following... Figure 1 Cross-sectional view along the A-A' direction;

[0024] Figure 6 The fifth embodiment of this application provides the following... Figure 1 Cross-sectional view along the A-A' direction;

[0025] Figure 7 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0026] in,

[0027] 100 / 200 / 300 / 400 / 500: Display panel;

[0028] 10: Substrate;

[0029] 101: Wiring area;

[0030] 102: Effective encapsulation area;

[0031] 103: Cutting area;

[0032] 20: Inorganic layer;

[0033] 30: Photoresist layer;

[0034] 31: First photoresist layer;

[0035] 32: Second photoresist layer;

[0036] 40: Encapsulation layer;

[0037] 50: trench;

[0038] 51: First groove section;

[0039] 52: Second groove section;

[0040] 53: Third groove section;

[0041] 60: Metal layer;

[0042] AA: Display area;

[0043] NA: Border area;

[0044] C: Cutting line. Detailed Implementation

[0045] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0046] This application provides a display panel and its manufacturing method, which can solve the problem of encapsulation layer failure caused by cutting and achieve a narrow bezel design. Detailed descriptions are provided below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of embodiments. Furthermore, in the description of this application, the term "comprising" means "including but not limited to". The terms "first", "second", "third", etc., are used merely as identifiers to distinguish different objects, not to describe a specific order.

[0047] Please see Figure 1 and Figure 2 , Figure 1 This is a top view of the display panel provided in the embodiment of this application; Figure 2 The first embodiment of this application provides the following... Figure 1 A cross-sectional view along the A-A' direction. (See diagram below.) Figure 1 and Figure 2 As shown, this application embodiment provides a display panel 100, including: a substrate 10, an inorganic layer 20, a photoresist layer 30, an encapsulation layer 40, and a trench 50; the inorganic layer 20 is disposed on the substrate 10; the photoresist layer 30 is disposed on the side of the inorganic layer 20 away from the substrate 10; the encapsulation layer 40 is disposed on the side of the photoresist layer 30 away from the substrate 10; the trench 50 includes a first trench portion 51 penetrating the photoresist layer 30 and a second trench portion 52 penetrating the inorganic layer 20, wherein the orthographic projection of the second trench portion 52 on the substrate 10 covers the orthographic projection of the first trench portion 51 on the substrate 10, and the encapsulation layer 40 is interrupted at the trench 50.

[0048] In this embodiment, the display panel 100 includes a display area AA and a bezel area NA. Specifically, the bezel area NA includes a wiring area 101, an effective encapsulation area 102, and a cutting area 103. The effective encapsulation area 102 is located on the side of the wiring area 101 away from the display area AA, and the cutting area 103 is located on the side of the effective encapsulation area 102 away from the wiring area 101. A groove 50 is provided within the cutting area 103. The cutting area 103 is a reserved area in the display panel for cutting, including a standard line for alignment cutting, i.e., the cutting line C, to ensure cutting accuracy and minimize heat-affected zones. The width of the cutting area 103 can be adjusted according to actual needs, and this application does not limit it.

[0049] In this embodiment, the encapsulation layer 40 inside the trench 50 and the encapsulation layer 40 outside the trench 50 are disconnected. When the display panel is cut along the cutting line C, the encapsulation layer 40 inside the trench 50 will generate a cutting crack at the cutting position, which will stop when it extends to the wall of the trench 50. That is, there will be no cutting crack in the encapsulation layer 40 outside the trench 50. This avoids the problem of the encapsulation layer 40 failing due to the cutting crack extending to the display area AA of the display panel. At the same time, a narrow bezel design is achieved, which further ensures the quality of the display panel.

[0050] In this embodiment, the substrate 10 can be a flexible substrate, such as a polyimide substrate. The photoresist layer 30 includes a first photoresist layer 31 and a second photoresist layer 32 stacked together. The first trench portion 51 includes a first sub-trench 50 portion (not shown in the figure) disposed on the first photoresist layer 31 and a second sub-trench 50 portion (not shown in the figure) disposed on the second photoresist layer 32. The orthographic projection of the second sub-trench 50 portion on the substrate 10 covers the orthographic projection of the first sub-trench 50 portion on the substrate 10. The first photoresist layer 31 is a planarization layer; the second photoresist layer 32 is a pixel defining layer. This structural design is the same as the film layer configuration in the prior art.

[0051] It should be noted that the edge of the second photoresist layer 32 may not extend to the cutting area 103. Specifically, the second photoresist layer 32 may only extend to the effective encapsulation area 102, thereby reducing the number of film layers stacked in the cutting area 103 and improving the stability of the display panel.

[0052] In this embodiment of the application, the first direction is Figure 1 As shown in the A-A' direction, the cross-sectional shape of the first trench portion 51 along the A-A' direction and the cross-sectional shape of the second trench portion 52 along the A-A' direction are both inverted trapezoids, that is, the diameter of the side closer to the substrate 10 is smaller than the diameter of the side farther from the substrate 10. This structural design is more conducive to the break of the encapsulation layer 40 at the trench 50.

[0053] In this embodiment, the diameter of the second trench portion 52 away from the substrate 10 is at least 200 nanometers larger than the diameter of the first trench portion 51 near the second trench portion 52. Further, the aperture of the first trench portion 51 away from the second trench portion 52 is at least 200 nanometers smaller than the aperture of the second trench portion 52 near the substrate 10. This top-wide, bottom-narrow structural design of the first trench portion 51 and the second trench portion 52 is less conducive to the deposition of the encapsulation layer 40 material on the sidewalls of the second trench portion 52, and more conducive to blocking the connection between the encapsulation layer 40 located at the bottom of the second trench portion 52 and the encapsulation layer 40 located on the first trench portion 51, thus disconnecting the encapsulation layer 40 in the second trench portion 52.

[0054] In this embodiment, the thickness of the inorganic layer 20 is greater than 100 nanometers. The inorganic layer 20 may include inorganic materials such as silicon nitride, silicon oxide, a laminate of silicon nitride and silicon oxide, or a laminate of aluminum oxide and silicon oxide. Silicon nitride has strong ion barrier properties and excellent water and oxygen barrier properties, effectively preventing impurities from diffusing into the display panel during the thermal process, while silicon oxide has excellent interface properties.

[0055] In this embodiment, the encapsulation layer 40 may be an inorganic encapsulation layer 40, an organic encapsulation layer 40, or alternating layers of inorganic and organic encapsulation layers 40. The inorganic encapsulation layer 40 may include inorganic materials such as alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, and zinc oxide. The organic encapsulation layer 40 may include organic materials such as epoxy resin, polyimide, polyethylene terephthalate, polycarbonate, polyethylene, and polyacrylate.

[0056] This application provides a display panel that forms a "roof-like" inward-cut structure by forming a first groove portion 51 and a second groove portion 52. When the display panel is cut, the cutting cracks are difficult to extend out of the groove 50 area, thus avoiding the problem of the cutting cracks of the encapsulation layer 40 extending to the display area AA of the display panel and causing the encapsulation layer 40 to fail. At the same time, a narrow bezel design is achieved.

[0057] As a specific embodiment of this application, please refer to Figure 3 , Figure 3 The second embodiment of this application provides the following... Figure 1 A cross-sectional view along the A-A' direction. (See diagram below.) Figure 3 As shown, the difference between display panel 200 and display panel 100 is that display panel 200 further includes a metal layer 60. The metal layer 60 is disposed on the side of inorganic layer 20 close to substrate 10. The metal layer 60 is provided with a third trench portion 53 corresponding to the second trench portion 52. The orthographic projection of the third trench portion 53 on substrate 10 covers the orthographic projection of the second trench portion 52 on substrate 10.

[0058] In this embodiment, the display panel 200 includes a display area AA and a bezel area NA. Specifically, the bezel area NA includes a wiring area 101, an effective encapsulation area 102, and a cutting area 103. The effective encapsulation area 102 is located on the side of the wiring area 101 away from the display area AA, and the cutting area 103 is located on the side of the effective encapsulation area 102 away from the wiring area 101. A groove 50 is provided within the cutting area 103. The cutting area 103 is a reserved area in the display panel for cutting, including a standard line for alignment cutting, i.e., the cutting line C, to ensure cutting accuracy and minimize heat-affected zones. The width of the cutting area 103 can be adjusted according to actual needs, and this application does not limit it.

[0059] In this embodiment, to simplify the manufacturing process and improve cutting accuracy, preferably, the photoresist layer 30 is only disposed in the wiring area 101 and the effective encapsulation area 102, and the trench 50 includes a third trench portion 53 penetrating the metal layer 60 and a second trench portion 52 penetrating the inorganic layer 20. The photoresist layer 30 can also be extended to the cutting area 103 as needed; those skilled in the art can choose according to their needs, and this application does not impose any limitations.

[0060] In this embodiment of the application, the first direction is Figure 1 As shown in the A-A' direction, the cross-sectional shape of the third trench portion 53 along the A-A' direction and the cross-sectional shape of the second trench portion 52 along the A-A' direction are both inverted trapezoids, that is, the diameter of the side closer to the substrate 10 is smaller than the diameter of the side farther from the substrate 10. This structural design is more conducive to the break of the encapsulation layer 40 at the trench 50.

[0061] In this embodiment, the diameter of the third trench portion 53 away from the substrate 10 is at least 200 nanometers larger than the diameter of the second trench portion 52 near the third trench portion 53. Further, the aperture of the second trench portion 52 away from the third trench portion 53 is at least 200 nanometers smaller than the aperture of the third trench portion 53 near the substrate 10. This top-wide, bottom-narrow structural design of the third trench portion 53 and the second trench portion 52 is less conducive to the deposition of the encapsulation layer 40 material on the sidewalls of the second trench portion 52, and more conducive to blocking the connection between the encapsulation layer 40 located at the bottom of the third trench portion 53 and the encapsulation layer 40 located on the second trench portion 52, thus disconnecting the encapsulation layer 40 at the third trench portion 53.

[0062] In this embodiment, the thickness of the metal layer 60 is greater than 100 nanometers. The metal layer 60 may include at least one of the following metals: molybdenum, aluminum, copper, titanium, chromium, silver, or mixtures thereof; the metal layer 60 may be a single-layer structure or a multi-layer structure.

[0063] In this embodiment, the encapsulation layer 40 is disconnected at the trench 50. That is, the encapsulation layer 40 inside the trench 50 and the encapsulation layer 40 outside the trench 50 are disconnected. When the display panel is cut along the cutting line C, the encapsulation layer 40 inside the trench 50 will develop a cutting crack at the cutting position, which will stop when it reaches the wall of the trench 50. In other words, the encapsulation layer 40 outside the trench 50 will not have a cutting crack. This avoids the problem of the encapsulation layer 40 failing due to the cutting crack extending to the display area AA of the display panel. At the same time, it achieves a narrow bezel design, further ensuring the quality of the display panel.

[0064] In this embodiment, the encapsulation layer 40 may be an inorganic encapsulation layer 40, an organic encapsulation layer 40, or alternating layers of inorganic and organic encapsulation layers 40. The inorganic encapsulation layer 40 may include inorganic materials such as alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, and zinc oxide. The organic encapsulation layer 40 may include organic materials such as epoxy resin, polyimide, polyethylene terephthalate, polycarbonate, polyethylene, and polyacrylate.

[0065] As a specific embodiment of this application, please refer to Figure 4 and Figure 2 , Figure 4The third embodiment of this application provides the following... Figure 1 A cross-sectional view along the A-A' direction. (See diagram below.) Figure 4 and Figure 1 As shown, the difference between display panel 300 and display panel 100 is that the grooves 50 in display panel 300 include at least two.

[0066] In this embodiment, the display panel 300 includes a display area AA and a bezel area NA. Specifically, the bezel area NA includes a wiring area 101, an effective encapsulation area 102, and a cutting area 103. The effective encapsulation area 102 is located on the side of the wiring area 101 away from the display area AA, and the cutting area 103 is located on the side of the effective encapsulation area 102 away from the wiring area 101. A groove 50 is provided within the cutting area 103. The cutting area 103 is a reserved area in the display panel for cutting, including a standard line for alignment cutting, i.e., the cutting line C, to ensure cutting accuracy and minimize heat-affected zones. The width of the cutting area 103 can be adjusted according to actual needs, and this application does not limit it.

[0067] In this embodiment of the application, the first direction is Figure 1 As shown in the A-A' direction, the cross-sectional shape of the first trench portion 51 along the A-A' direction and the cross-sectional shape of the second trench portion 52 along the A-A' direction are both inverted trapezoids, that is, the diameter of the side closer to the substrate 10 is smaller than the diameter of the side farther from the substrate 10. This structural design is more conducive to the break of the encapsulation layer 40 at the trench 50.

[0068] In this embodiment, the diameter of the second trench portion 52 away from the substrate 10 is at least 200 nanometers larger than the diameter of the first trench portion 51 near the second trench portion 52. Further, the aperture of the first trench portion 51 away from the second trench portion 52 is at least 200 nanometers smaller than the aperture of the second trench portion 52 near the substrate 10. This top-wide, bottom-narrow structural design of the second trench portion 52 is less conducive to the deposition of the encapsulation layer 40 material on the sidewalls of the second trench portion 52, and more conducive to blocking the connection between the encapsulation layer 40 located at the bottom of the second trench portion 52 and the encapsulation layer 40 located on the first trench portion 51, thus disconnecting the encapsulation layer 40 in the second trench portion 52.

[0069] In this embodiment, both grooves 50 can be located at the non-cutting line C within the cutting area 103, or one of the grooves 50 can be located at the cutting line C. This design of multiple grooves 50 further considers the impact of cutting errors. When one groove 50 of the display panel loses its blocking effect on the cutting crack, other grooves 50 near the display area AA of the display panel can still block the cutting crack, further ensuring the quality of the display panel.

[0070] As a specific embodiment of this application, please refer to Figure 5 and Figure 3 , Figure 5 The fourth embodiment of this application provides the following... Figure 1 A cross-sectional view along the A-A' direction. (See diagram below.) Figure 5 and Figure 3 As shown, the difference between display panel 400 and display panel 200 is that the grooves 50 in display panel 400 include at least two.

[0071] In this embodiment, the display panel 400 includes a display area AA and a bezel area NA. Specifically, the bezel area NA includes a wiring area 101, an effective encapsulation area 102, and a cutting area 103. The effective encapsulation area 102 is located on the side of the wiring area 101 away from the display area AA, and the cutting area 103 is located on the side of the effective encapsulation area 102 away from the wiring area 101. A groove 50 is provided within the cutting area 103. The cutting area 103 is a reserved area for cutting within the display panel, including a standard line for alignment cutting, i.e., the cutting line C. To ensure cutting accuracy and minimize heat-affected zones, the width of the cutting area 103 can be adjusted according to actual needs in this embodiment, and is not limited herein.

[0072] In this embodiment, to simplify the manufacturing process and improve cutting accuracy, preferably, the photoresist layer 30 is only disposed in the wiring area 101 and the effective encapsulation area 102, and the trench 50 includes a third trench portion 53 penetrating the metal layer 60 and a second trench portion 52 penetrating the inorganic layer 20. The photoresist layer 30 can also be extended to the cutting area 103 as needed; those skilled in the art can choose according to their needs, and this application does not impose any limitations.

[0073] In this embodiment of the application, the first direction is Figure 1 As shown in the A-A' direction, the cross-sectional shape of the third trench portion 53 along the A-A' direction and the cross-sectional shape of the second trench portion 52 along the A-A' direction are both inverted trapezoids, that is, the diameter of the side closer to the substrate 10 is smaller than the diameter of the side farther from the substrate 10. This structural design is more conducive to the break of the encapsulation layer 40 at the trench 50.

[0074] In this embodiment, the diameter of the third trench portion 53 away from the substrate 10 is at least 200 nanometers larger than the diameter of the second trench portion 52 near the third trench portion 53. Further, the aperture of the second trench portion 52 away from the second trench portion 52 is at least 200 nanometers smaller than the aperture of the third trench portion 53 near the substrate 10. This top-wide, bottom-narrow structural design of the third trench portion 53 and the second trench portion 52 is less conducive to the deposition of the encapsulation layer 40 material on the sidewalls of the second trench portion 52, and more conducive to blocking the connection between the encapsulation layer 40 located at the bottom of the third trench portion 53 and the encapsulation layer 40 located on the second trench portion 52, thus disconnecting the encapsulation layer 40 at the third trench portion 53.

[0075] In this embodiment, both grooves 50 can be located at the non-cutting line C within the cutting area 103, or one of the grooves 50 can be located at the cutting line C. This design of multiple grooves 50 further considers the impact of cutting errors. When one groove 50 of the display panel loses its blocking effect on the cutting crack, other grooves 50 near the display area AA of the display panel can still block the cutting crack, further ensuring the quality of the display panel.

[0076] As a specific embodiment of this application, please refer to Figure 6 , Figure 6 The fifth embodiment of this application provides the following... Figure 1 A cross-sectional view along the A-A' direction. (See diagram below.) Figure 6 and Figure 5 As shown, the display panel 500 includes at least two grooves 50, one of which is located on a cutting line. Figure 6 Taking two grooves of 50 as an example, there can be multiple grooves.

[0077] In this embodiment, by providing multiple grooves 50 in the display panel, it is more difficult for the cutting cracks generated by the encapsulation layer to extend to the display area of ​​the display panel, thereby further improving the encapsulation effect of the display panel and enhancing its service life and competitiveness.

[0078] On the other hand, please see Figure 7 , Figure 7 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application. Figure 7 As shown, this application provides a method for manufacturing a display panel, including the following steps:

[0079] S10. An inorganic layer 20 is formed on the substrate 10.

[0080] In this embodiment, an inorganic film layer is formed by physical vapor deposition, and the inorganic film layer is patterned by photolithography or dry etching to form inorganic layer 20.

[0081] S20. A photoresist layer 30 is formed on the inorganic layer 20, and a first trench portion 51 of a trench 50 is formed on the photoresist layer 30.

[0082] In this embodiment, a photoresist film layer is formed by coating, the photoresist film layer is patterned by photolithography, and a first groove portion 51 is formed in the cutting area 103 to form a photoresist layer 30.

[0083] S30. A second trench portion 52 corresponding to the first trench portion 51 is formed on the inorganic layer 20, and the orthogonal projection of the second trench portion 52 on the substrate 10 covers the orthogonal projection of the first trench portion 51 on the substrate 10.

[0084] In this embodiment, the inorganic layer 20 is dry-etched at the position corresponding to the first trench portion 51 in the cutting area 103 to form the second trench portion 52, and the dry etching time is extended to over-etch the second trench portion 52 so that the edge of the inorganic layer 20 at the second trench portion 52 is recessed into the edge of the photoresist layer 30. That is, the trench diameter of the second trench portion 52 away from the substrate 10 is larger than the trench diameter of the first trench portion 51 near the second trench portion 52.

[0085] S40, An encapsulation layer 40 is formed on the photoresist layer 30.

[0086] In this embodiment, the encapsulation layer 40 can be an inorganic encapsulation layer 40, an organic encapsulation layer 40, or an alternating layer of inorganic and organic encapsulation layers 40. Specifically, the encapsulation layer 40 is disconnected at the trench 50. That is, the encapsulation layer 40 inside the trench 50 is disconnected from the encapsulation layer 40 outside the trench 50. When the display panel is cut along the cutting line C, the encapsulation layer 40 inside the trench 50 will develop a cutting crack at the cutting position, which will stop when it reaches the wall of the trench 50. In other words, the encapsulation layer 40 outside the trench 50 will not have a cutting crack. This avoids the problem of the encapsulation layer 40 failing due to the cutting crack extending to the display area AA of the display panel. At the same time, it achieves a narrow bezel design, further ensuring the quality of the display panel.

[0087] In one specific embodiment of this application, the step of forming a second trench portion 52 corresponding to the first trench portion 51 on the inorganic layer 20, wherein the orthographic projection of the second trench portion 52 on the substrate 10 covers the orthographic projection of the first trench portion 51 on the substrate 10, specifically includes: forming a metal layer 60 on the side of the inorganic layer 20 close to the substrate 10, forming a third trench portion 53 corresponding to the second trench portion 52 on the metal layer 60, wherein the orthographic projection of the third trench portion 53 on the substrate 10 covers the orthographic projection of the second trench portion 52 on the substrate 10. The preparation method is the same as the above-described fabrication method and will not be repeated here.

[0088] This application provides a display panel and its manufacturing method. By forming a "roof-like" inward-cut structure with the first groove portion 51 and the second groove portion 52, when the display panel is cut, the cutting cracks are difficult to extend out of the groove 50 area, thus avoiding the problem of the cutting cracks of the encapsulation layer 40 extending to the display area AA of the display panel and causing the encapsulation layer 40 to fail. At the same time, a narrow bezel design is achieved.

[0089] The above provides a detailed description of a display panel and its manufacturing method according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, include: substrate; An inorganic layer is disposed on the substrate; A photoresist layer is disposed on the side of the inorganic layer away from the substrate; An encapsulation layer is disposed on the side of the photoresist layer away from the substrate; as well as, The trench includes a first trench portion penetrating the photoresist layer and a second trench portion penetrating the inorganic layer, wherein the orthographic projection of the second trench portion on the substrate covers the orthographic projection of the first trench portion on the substrate, and the encapsulation layer is broken at the trench. Wherein, the cross-sectional shape of the first trench portion along the first direction and the cross-sectional shape of the second trench portion along the first direction are both inverted trapezoidal. The diameter of the first trench portion near the substrate is smaller than the diameter of the first trench portion away from the substrate, and the diameter of the second trench portion near the substrate is smaller than the diameter of the second trench portion away from the substrate. The diameter of the second trench portion away from the substrate is at least 200 nanometers larger than the diameter of the first trench portion near the second trench portion. The display panel further includes a metal layer disposed on the side of the inorganic layer near the substrate. The metal layer has a third groove portion corresponding to the second groove portion. The orthographic projection of the third groove portion on the substrate covers the orthographic projection of the second groove portion on the substrate, and the cross-sectional shape of the third groove portion along the first direction is an inverted trapezoid.

2. The display panel according to claim 1, characterized in that, The thickness of the inorganic layer is greater than 100 nanometers.

3. The display panel according to claim 1, characterized in that, The trench includes at least two.

4. The display panel according to claim 3, characterized in that, One of the at least two grooves is located on the cutting line.

5. The display panel according to claim 1, characterized in that, The display panel includes a display area and a bezel area. The bezel area includes a wiring area, an effective encapsulation area, and a cutting area. The effective encapsulation area is located on the side of the wiring area away from the display area. The cutting area is located on the side of the effective encapsulation area away from the wiring area. The groove is located in the cutting area.

6. A method for manufacturing a display panel, characterized in that, Includes the following steps: An inorganic layer is formed on the substrate; A photoresist layer is formed on the inorganic layer, and a first trench portion of a trench is formed on the photoresist layer; A second trench corresponding to the first trench is formed on the inorganic layer, wherein the orthographic projection of the second trench on the substrate overlaps the orthographic projection of the first trench on the substrate. The cross-sectional shape of both the first trench and the second trench along the first direction is an inverted trapezoid. The diameter of the first trench near the substrate is smaller than the diameter of the first trench away from the substrate, and the diameter of the second trench near the substrate is smaller than the diameter of the second trench away from the substrate. The diameter of the second trench away from the substrate is at least 200 nanometers larger than the diameter of the first trench near the second trench. The display panel further includes a metal layer disposed on the inorganic layer near the substrate. A third trench corresponding to the second trench is provided on the metal layer, the orthographic projection of the third trench on the substrate overlaps the orthographic projection of the second trench on the substrate, and the cross-sectional shape of the third trench along the first direction is an inverted trapezoid. An encapsulation layer is formed on the photoresist layer.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The step of forming a second trench portion corresponding to the first trench portion on the inorganic layer, wherein the orthographic projection of the second trench portion on the substrate covers the orthographic projection of the first trench portion on the substrate, specifically includes: A metal layer is formed on the side of the inorganic layer near the substrate, and a third trench portion corresponding to the second trench portion is formed on the metal layer. The orthographic projection of the third trench portion on the substrate covers the orthographic projection of the second trench portion on the substrate.

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