Millimeter wave RF modules and electronic equipment

Abstract

The present invention discloses a millimeter-wave radio frequency module and electronic device, comprising an antenna dielectric layer, a first radiating unit, a second radiating unit, and an antenna cover. The first and second radiating units are disposed on the antenna dielectric layer, and the antenna cover is disposed over the first and second radiating units. A first and second dielectric resonators are disposed on the inner side of the antenna cover. The first dielectric resonator is located within the antenna near-field region of the first radiating unit, and the second dielectric resonator is located within the antenna near-field region of the second radiating unit. The radiation fields of the first and second dielectric resonators are different. The antenna cover, the first and second dielectric resonators are made of plastic. The present invention improves the isolation between the transmitting and receiving antennas, thereby enhancing the isolation between the transmitting and receiving channels.

Description

Technical Field

[0001] The present invention relates to the field of wireless communication technology, and in particular to a millimeter wave radio frequency module and electronic equipment. Background Art

[0002] With the increasing demand for millimeter-wave front-end modules in new application scenarios such as autonomous driving millimeter-wave radar, Internet of Things millimeter-wave sensors, and 5G millimeter-wave active modules, and because the reduction of RF transceiver channel isolation will affect the quality of the received signal, it will reduce the detection range of the millimeter-wave radar, increase the white noise intensity of the RF front-end, and reduce the quality of millimeter-wave communication. Therefore, improving the transceiver channel isolation of the RF module is an urgent problem to be solved.

[0003] Currently, there are two common approaches to improving RF transmit and receive channel isolation. One approach involves increasing the isolation of the millimeter-wave active circuit channel. This approach typically involves improving the isolation between the power amplifier (PA) and low-noise amplifier (LNA) within the millimeter-wave chip. However, this approach is prohibitively expensive due to the design and processing requirements of semiconductor circuits. The other approach involves improving the isolation of the millimeter-wave passive RF transmit and receive channels. This can be achieved by adding components such as circulators and duplexers, but this increases the cost of the RF module. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a millimeter wave radio frequency module and an electronic device, which improves the isolation between the transmitting and receiving antennas and thus the isolation between the transmitting and receiving channels.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a millimeter wave radio frequency module, including an antenna dielectric layer, a first radiating unit, a second radiating unit and an antenna cover, the first radiating unit and the second radiating unit are arranged on the antenna dielectric layer, the antenna cover is arranged on the first radiating unit and the second radiating unit, the inner side of the antenna cover is provided with a first dielectric resonator and a second dielectric resonator, the first dielectric resonator is located in the antenna near-field area of ​​the first radiating unit, the second dielectric resonator is located in the antenna near-field area of ​​the second radiating unit, and the radiation fields of the first dielectric resonator and the second dielectric resonator are different; the material of the antenna cover, the first dielectric resonator and the second dielectric resonator is plastic.

[0006] The present invention also provides an electronic device, comprising the millimeter wave radio frequency module as described above.

[0007] The beneficial effects of the present invention are as follows: by providing two dielectric resonators on the antenna cover and positioning the two dielectric resonators within the antenna near-field regions of the two radiating units, respectively, the two dielectric resonators can be fed through the near-field regions of the two radiating units, thereby realizing a transmitting antenna and a receiving antenna; by using two dielectric resonators with different radiation fields, the mutual influence between the two dielectric resonators can be reduced, thereby improving the isolation between the transmitting and receiving antennas, and further improving the isolation of the transmitting and receiving channels; by using plastic antenna covers and dielectric resonators, costs can be reduced. The present invention has a simple structure and is less expensive than existing solutions that improve isolation through semiconductor circuit design or antenna design. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a structural diagram of the millimeter wave radio frequency module according to the first embodiment of the present invention (with the antenna cover hidden);

[0009] Figure 2 This is a side view of a millimeter wave radio frequency module according to the first embodiment of the present invention;

[0010] Figure 3 This is a schematic diagram of the internal structure of the antenna cover according to the first embodiment of the present invention;

[0011] Figure 4 Schematic top view of the millimeter wave radio frequency module according to the first embodiment of the present invention;

[0012] Figure 5 Schematic diagram of the isolation between the transmitting and receiving antennas of the first embodiment of the present invention and the existing solution;

[0013] Figure 6 Schematic diagram of the module structure for loading metal columns;

[0014] Figure 7 Schematic diagram of the module structure for loading EBG.

[0015] Description of labels:

[0016] 1. Antenna dielectric layer; 2. Antenna ground; 3. First radiating unit; 4. Second radiating unit; 5. RF chip; 6. Microstrip line; 7. Antenna cover; 8. First dielectric resonator; 9. Second dielectric resonator; 10. Metal column; 11. Electromagnetic field band gap. DETAILED DESCRIPTION

[0017] To illustrate the technical content, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the embodiments and accompanying drawings.

[0018] See also Figure 2A millimeter wave radio frequency module includes an antenna dielectric layer, a first radiating unit, a second radiating unit and an antenna cover, wherein the first radiating unit and the second radiating unit are arranged on the antenna dielectric layer, and the antenna cover is arranged on the first radiating unit and the second radiating unit. A first dielectric resonator and a second dielectric resonator are provided on the inner side of the antenna cover, the first dielectric resonator is located in the antenna near-field area of ​​the first radiating unit, and the second dielectric resonator is located in the antenna near-field area of ​​the second radiating unit. The radiation fields of the first dielectric resonator and the second dielectric resonator are different; the material of the antenna cover, the first dielectric resonator and the second dielectric resonator is plastic.

[0019] From the above description, it can be seen that the beneficial effects of the present invention are: it can improve the isolation between the transmitting and receiving antennas, thereby improving the isolation of the transmitting and receiving channels, and the cost is low.

[0020] Furthermore, the radiation fields of the first dielectric resonator and the second dielectric resonator are perpendicular.

[0021] As can be seen from the above description, the vertical radiation field can minimize the mutual influence between the two dielectric resonator antennas, thereby maximizing the transmit-receive isolation.

[0022] Furthermore, the first dielectric resonator is in the shape of a cuboid, and the second dielectric resonator is in the shape of a cylinder; or the first dielectric resonator is in the shape of a cylinder, and the second dielectric resonator is in the shape of a cuboid.

[0023] It can be seen from the above description that by designing the shapes of the two dielectric resonators to be a cuboid and a hemisphere respectively, the radiation fields of the two dielectric resonators can be perpendicular to each other.

[0024] Furthermore, the projection of the first dielectric resonator on the antenna dielectric layer covers the first radiation unit, and the projection of the second dielectric resonator on the antenna dielectric layer covers the second radiation unit.

[0025] It can be seen from the above description that the sizes of the two dielectric resonators need to be larger than the sizes of the two radiating units respectively.

[0026] Furthermore, the dielectric constants of the first dielectric resonator and the second dielectric resonator are less than 6.

[0027] Furthermore, the first dielectric resonator, the second dielectric resonator and the radome are integrally formed.

[0028] As can be seen from the above description, by integrating the radome and the dielectric resonator, the connection stability between the radome and the dielectric resonator can be ensured, and the manufacturing process can be simplified and the installation steps can be reduced.

[0029] Furthermore, the distance between the first radiation unit and the second radiation unit is greater than 2λ, the distance between the first dielectric resonator and the first radiation unit is 0.1λ~0.5λ, and the distance between the second dielectric resonator and the second radiation unit is 0.1λ~0.5λ, where λ is the wavelength length.

[0030] Furthermore, it also includes an antenna ground and a radio frequency chip, the antenna dielectric layer and the antenna ground are stacked, the first radiation unit and the second radiation unit are arranged on the side of the antenna dielectric layer away from the antenna ground; the radio frequency chip is arranged on the antenna dielectric layer, and the radio frequency chip is connected to the first radiation unit and the second radiation unit through microstrip lines respectively.

[0031] Furthermore, the first radiation unit, the second radiation unit and the radio frequency chip are arranged on the same surface of the antenna dielectric layer; the radio frequency chip is located in the antenna cover and between the first radiation unit and the second radiation unit.

[0032] As can be seen from the above description, the overall size of the module can be reduced.

[0033] The present invention also provides an electronic device, comprising the millimeter wave radio frequency module as described above.

[0034] Example 1

[0035] Please refer to Figure 1-7 , embodiment 1 of the present invention is: a millimeter wave radio frequency module, which can be applied to millimeter wave radar, Internet of Things millimeter sensor, 5G millimeter wave active module, etc., and can achieve high transmit and receive isolation.

[0036] like Figure 1 As shown, it includes a stacked antenna dielectric layer 1 and an antenna ground 2. A first radiation unit 3, a second radiation unit 4 and a radio frequency chip 5 are provided on the side of the antenna dielectric layer 1 away from the antenna ground 2. The radio frequency chip 5 is connected to the first radiation unit 3 and the second radiation unit 4 through a microstrip line 6 respectively.

[0037] The distance between the first radiating element 3 and the second radiating element 4 is greater than 2λ, where λ is the wavelength corresponding to the operating frequency of the millimeter-wave RF module. In this embodiment, the operating frequency of the module is 27 GHz. Furthermore, the RF chip 5 is located between the first radiating element 3 and the second radiating element 4, preferably in the middle, to fully utilize the space between the first radiating element 3 and the second radiating element 4, thereby reducing the overall size of the module.

[0038] like Figure 2 As shown, the RF chip 5 is arranged on the antenna dielectric layer 1 through the BGA solder balls, and is connected to the first radiation unit 3 and the second radiation unit 4 through the BGA solder balls and the microstrip line 6 in sequence.

[0039] like Figure 2 As shown, the antenna further includes an antenna cover 7, which is provided on the first radiating element 3 and the second radiating element 4. In this embodiment, the antenna cover 7 is provided on the antenna dielectric layer 1, and the first radiating element 3, the second radiating element 4 and the radio frequency chip 5 are all located in the antenna cover 7, which can play a dust-proof role.

[0040] Furthermore, a first dielectric resonator 8 and a second dielectric resonator 9 are provided on the inner side of the radome 7 at positions corresponding to the first radiating element 3 and the second radiating element 4, respectively. Specifically, the first dielectric resonator 8 and the second dielectric resonator 9 are provided on the inner top (or inner wall) of the radome 7. The first dielectric resonator 8 is located within the antenna near-field of the first radiating element 3, and the second dielectric resonator 9 is located within the antenna near-field of the second radiating element 4. In this embodiment, since both radiating elements radiate upward (i.e., away from the antenna dielectric layer), the first dielectric resonator 8 is located above the first radiating element 3, and the second dielectric resonator 9 is located above the second radiating element 4. The distance between the first dielectric resonator 8 and the first radiating element 3 is 0.1λ to 0.5λ, and the distance between the second dielectric resonator 9 and the second radiating element 4 is 0.1λ to 0.5λ. In other words, the two dielectric resonators are fed by the near-fields of the two radiating elements, respectively.

[0041] The radiation fields of the first dielectric resonator 8 and the second dielectric resonator 9 are different, that is, the radiation energy distribution surfaces are different, that is, the radiation modes are different.

[0042] like Figure 3 As shown, in this embodiment, the first dielectric resonator 8 is in the shape of a cuboid, and the second dielectric resonator 9 is in the shape of a hemisphere. In another optional embodiment, the first dielectric resonator 8 is in the shape of a hemisphere, and the second dielectric resonator 9 is in the shape of a cuboid.

[0043] Assuming that a rectangular parallelepiped dielectric resonator antenna and a hemispherical dielectric resonator antenna are placed in the same coordinate system, with the bottom surface of the rectangular parallelepiped dielectric resonator parallel to the XOY plane and the bottom surface (i.e., the circular surface) of the hemispherical dielectric resonator parallel to the XOY plane, the radiation pattern of the rectangular parallelepiped dielectric resonator antenna is the TE113 mode, with its radiation energy primarily distributed on the ZOX plane, while the radiation pattern of the hemispherical dielectric resonator antenna is the TE111 mode, with its radiation energy primarily distributed on the ZOY plane. In other words, the energy distribution planes of the rectangular parallelepiped dielectric resonator antenna and the hemispherical dielectric resonator antenna are perpendicular, and therefore their radiation fields are perpendicular.

[0044] In this embodiment, the shapes of the two dielectric resonators are designed to be a cuboid and a hemisphere respectively, so that the radiation fields of the two dielectric resonators are perpendicular to each other, thereby minimizing the mutual influence between the two dielectric resonator antennas.

[0045] Furthermore, the size of the first dielectric resonator 8 is larger than that of the first radiation unit 3, and the size of the second dielectric resonator 9 is larger than that of the second radiation unit 4, that is, Figure 4 As shown, the projection of the first dielectric resonator 8 on the antenna dielectric layer 1 covers the first radiating element 3, and the projection of the second dielectric resonator 9 on the antenna dielectric layer 1 covers the second radiating element 4. Since the size of the two dielectric resonators is larger than the two radiating elements, the dielectric constants of the first dielectric resonator 8 and the second dielectric resonator 9 are preferably less than 6.

[0046] Furthermore, the radome 7, the first dielectric resonator 8 and the second dielectric resonator 9 are made of plastic, such as ABS plastic, PC (polycarbonate) or other engineering plastics. By using plastic radomes and dielectric resonators, costs can be reduced.

[0047] Furthermore, the first dielectric resonator 8, the second dielectric resonator 9 and the radome 7 are integrally formed. By integrating the radome and the dielectric resonator, the connection stability between the radome and the dielectric resonator can be ensured, and the manufacturing process can be simplified, reducing the number of installation steps.

[0048] Since the radome 7 and the two dielectric resonators are made of the same material and are integrally formed, preferably, the dielectric constant of the radome 7 is also less than 6.

[0049] Without the first and second dielectric resonators, the first and second radiating elements can serve as the radiating portions of the transmitting and receiving antennas, respectively. However, with the first and second dielectric resonators, the first and second radiating elements, along with the microstrip lines, serve as the feed portions of the transmitting and receiving antennas, respectively. The first and second dielectric resonators serve as the radiating portions of the transmitting and receiving antennas, respectively. By using dielectric resonator antennas with orthogonal radiation fields as the transmitting and receiving antennas, respectively, the isolation between the transmitting and receiving antennas can be improved, thereby enhancing the isolation between the transmit and receive channels.

[0050] Figure 5 Schematic diagram of the isolation between the transmitting and receiving antennas of this embodiment and the existing solution. The “original” solution refers to the structure when the two dielectric resonators are not provided in this embodiment. Figure 6 As shown in FIG, the scheme of “adding metal pillars” is based on the “original” scheme, in which metal pillars 10 are arranged around the two radiating units, wherein one end of the metal pillars 10 is embedded in the antenna dielectric layer. Figure 7As shown, the "EBG-added" solution is based on the "original" solution, and an electromagnetic band gap 11 (EBG, Electromagnetic Band Gap) is set around the two radiation units.

[0051] from Figure 5 It can be seen that the transmit and receive antenna isolation of the millimeter-wave RF module of this embodiment reaches about -50 dB, which is much better than the conventional solution and the solution loaded with metal pillars or EBG.

[0052] In summary, the present invention provides a millimeter wave radio frequency module and electronic equipment, which realizes a transmitting antenna and a receiving antenna by arranging two dielectric resonators on the antenna cover and making the two dielectric resonators respectively located in the antenna near field area of ​​the two radiating units, so that the two dielectric resonators can be fed respectively through the near field of the two radiating units; by adopting two dielectric resonators with different radiation fields, the mutual influence between the two dielectric resonators can be reduced, thereby improving the isolation between the transmitting and receiving antennas, and further improving the isolation of the transmitting and receiving channels; by designing the shapes of the two dielectric resonators as a cuboid and a hemisphere respectively, so that the radiation fields of the two dielectric resonators can be perpendicular to each other, the mutual influence between the two dielectric resonator antennas can be reduced to the greatest extent, thereby maximizing the transmitting and receiving isolation; by adopting a plastic material for the antenna cover and the dielectric resonator, the cost can be reduced; by integrating the antenna cover and the dielectric resonator, the connection stability between the antenna cover and the dielectric resonator can be guaranteed, and the manufacturing process can be simplified, and the installation steps can be reduced. The present invention has a simple structure, does not require circuit design, and can improve the transmitting and receiving channel isolation of the radio frequency module, and has low cost.

[0053] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's description and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A millimeter wave radio frequency module, characterized in that: The antenna comprises an antenna dielectric layer, a first radiating element, a second radiating element, and an antenna cover, wherein the first radiating element and the second radiating element are arranged on the antenna dielectric layer, the antenna cover is arranged on the first radiating element and the second radiating element, and a first dielectric resonator and a second dielectric resonator are provided on the inner side of the antenna cover, the first dielectric resonator is located in the antenna near-field region of the first radiating element, and the second dielectric resonator is located in the antenna near-field region of the second radiating element, and the radiation fields of the first dielectric resonator and the second dielectric resonator are different; The antenna cover, the first dielectric resonator and the second dielectric resonator are made of plastic; The first dielectric resonator is in the shape of a cuboid, and the second dielectric resonator is in the shape of a cylinder; Or the first dielectric resonator is in the shape of a cylinder, and the second dielectric resonator is in the shape of a cuboid.

2. The millimeter wave radio frequency module according to claim 1, characterized in that: The radiation fields of the first dielectric resonator and the second dielectric resonator are perpendicular.

3. The millimeter wave radio frequency module according to claim 1, wherein: The projection of the first dielectric resonator on the antenna dielectric layer covers the first radiation unit, and the projection of the second dielectric resonator on the antenna dielectric layer covers the second radiation unit.

4. The millimeter wave radio frequency module according to claim 1, wherein: The dielectric constants of the first dielectric resonator and the second dielectric resonator are less than 6.

5. The millimeter wave radio frequency module according to claim 1, wherein: The first dielectric resonator, the second dielectric resonator and the radome are integrally formed.

6. The millimeter wave radio frequency module according to claim 1, characterized in that: The distance between the first radiation unit and the second radiation unit is greater than 2λ, the distance between the first dielectric resonator and the first radiation unit is 0.1λ~0.5λ, and the distance between the second dielectric resonator and the second radiation unit is 0.1λ~0.5λ, where λ is the wavelength length.

7. The millimeter wave radio frequency module according to claim 1, characterized in that: It also includes an antenna ground and a radio frequency chip. The antenna dielectric layer and the antenna ground are stacked, and the first radiation unit and the second radiation unit are arranged on a side of the antenna dielectric layer away from the antenna ground; the radio frequency chip is arranged on the antenna dielectric layer, and the radio frequency chip is connected to the first radiation unit and the second radiation unit respectively through microstrip lines.

8. The millimeter wave radio frequency module according to claim 7, characterized in that: The first radiation unit, the second radiation unit and the radio frequency chip are arranged on the same surface of the antenna dielectric layer; the radio frequency chip is located in the antenna cover and between the first radiation unit and the second radiation unit.

9. An electronic device, characterized in that: Comprising the millimeter wave radio frequency module as described in any one of claims 1-8.

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