A heat pipe with high material utilization rate and its processing method

By adopting a new structural design of degassing fluid injection holes and convex rib cavity in the temperature homogenization plate, the problem of waste and incomplete degassing of traditional temperature homogenization plates is solved, and a high material utilization rate and low cost processing method is achieved.

CN114812244BActive Publication Date: 2025-07-25LIANDE ELECTRONIC TECH (CHANGSHU) CO LTD
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Patent Information

Application Number
CN202210269689.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-03-18
Publication Date
2025-07-25
Estimated Expiration
2042-03-18

AI Technical Summary

Technical Problem

The degassing and liquid injection structure design of traditional temperature equalization boards involves waste of materials and additional solder or glue sealing processes, which affects performance and is difficult to completely remove residual air, and requires secondary heating and degassing.

Method used

The degassing fluid injection hole and convex rib cavity are used to form a complete degassing structure, and the seal is extruded through the pressure bonding area, which eliminates the traditional degassing pipes, simplifies the process and improves the material utilization rate.

Benefits of technology

It improves material utilization, simplifies processing processes, reduces costs, and ensures good degassing effect, without secondary heating and degassing, and maintains the performance of the temperature uniform plate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a heat pipe with high material utilization rate and its processing method. The heat pipe includes an upper cover plate, a lower cover plate, a capillary structure and an independent capillary support structure. An air removal and liquid injection hole is formed on the upper cover plate; the lower cover plate is welded to the upper cover plate to form a boss cavity and a rib cavity, the boss cavity is communicated with the rib cavity, the air removal and liquid injection hole is communicated with the rib cavity, and the rib cavity is sealed by extrusion at the pressure bonding area, and the pressure bonding area is located between the air removal and liquid injection hole and the boss cavity; the capillary structure is attached to the lower surface of the upper cover plate and the upper surface of the lower cover plate; the independent capillary support structure is arranged in the boss cavity and connected to the capillary structure; the phase change medium exists in the boss cavity. The present application forms a complete air removal structure through the air removal and liquid injection hole and the rib cavity, without the air removal pipe of the traditional heat pipe air removal structure, thus eliminating the need for high-frequency sealing or dispensing at the root of the extraction pipe, and also eliminating the need for cutting, improving the material utilization rate and reducing the processing cost.
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Description

Technical Field

[0001] The present invention relates to heat dissipation technology, and particularly to a heat pipe with high material utilization rate and a processing method thereof. Background Art

[0002] As the most powerful heat transfer element in the current heat dissipation industry, the heat pipe can have a heat conduction capacity hundreds of times that of pure copper, and transfers heat through the vapor-liquid phase change of the circulating medium in a fully enclosed vacuum cavity. It is widely used in industries such as electronics, communication, automotive, and lighting.

[0003] The main structure of the heat pipe consists of an upper cover plate, a lower cover plate, a capillary structure, a support structure, and a phase change medium. The upper cover plate, the lower cover plate, and the support structure are combined into a sealed cavity that can withstand atmospheric pressure without deformation. Inside the cavity is a relatively vacuum environment of gaseous phase change medium and liquid phase change medium under negative pressure. The liquid phase change medium at the heat source absorbs heat and vaporizes into a gaseous phase change medium, moves to the distal negative pressure condensation area, gradually releases latent heat, and becomes a liquid phase change medium, and then returns to the heat source through the capillary structure, repeating the cycle to achieve the purpose of heat transfer. From the above working principle of the heat pipe, it can be seen that a better vacuum degree can reduce the working temperature of the phase change medium vaporization, thereby reducing impedance and improving performance. The degassing and liquid injection process of the heat pipe is the key, and the heat pipe structure design related to the quality of degassing and liquid injection is particularly important.

[0004] The traditional degassing and liquid injection structure design of the heat pipe is an open opening on the edge side of the lower cover plate, wrapping the degassing pipe. The gap between the open opening on the side of the lower cover plate and the degassing pipe is sealed by solder or glue. First, liquid is injected through the degassing pipe, and then the pipe is sealed. This kind of liquid injection and degassing structure follows the liquid injection and degassing method of linear heat pipes. It has the disadvantages of wasting the sheet metal materials of the upper and lower cover plates, wasting the degassing pipe materials, requiring an additional secondary solder or glue sealing process, and the residual air in the capillary structure of the heat pipe affecting the performance is not easily removed by surface tension and must be subjected to secondary heating degassing.

[0005] As the heat pipe gradually becomes the mainstream functional component in the heat dissipation industry, a new structure design for heat pipe liquid injection and degassing is urgently needed to solve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a heat pipe with high material utilization rate and a processing method thereof. By changing the degassing and liquid injection structure and process, the material utilization rate is improved, and the primary normal temperature degassing effect is improved, and secondary heating degassing is basically not required.

[0007] A brief overview of one or more aspects is given below to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or critical elements of all aspects nor to attempt to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to a more detailed description to follow.

[0008] According to one aspect of the present invention, there is provided a heat pipe with high material utilization rate, comprising:

[0009] An upper cover plate, on which degassing and liquid injection holes are provided;

[0010] A lower cover plate, which is welded to the upper cover plate to form a boss cavity and a rib cavity. The boss cavity is communicated with the rib cavity. The degassing and liquid injection holes are communicated with the rib cavity. The rib cavity is sealed by extrusion at the pressure bonding area, and the pressure bonding area is located between the degassing and liquid injection holes and the boss cavity;

[0011] A capillary structure, which is attached to the lower surface of the upper cover plate and the upper surface of the lower cover plate;

[0012] An independent capillary support structure, which is arranged in the boss cavity and is connected with the capillary structure; and

[0013] A phase change medium, which exists in the boss cavity.

[0014] In one embodiment, the pressure bonding area is located at the end of the rib cavity close to the boss cavity.

[0015] In one embodiment, the cross-sectional width of the rib cavity is 1 mm to 3 mm, and the height of the rib cavity is 0.2 mm to 1.2 mm.

[0016] In one embodiment, the aperture of the degassing and liquid injection holes is 1 mm to 3 mm.

[0017] In one embodiment, the degassing and liquid injection holes and the rib cavity are arranged at the corners or sides of the heat pipe with high material utilization rate.

[0018] In one embodiment, positioning holes are further provided on the upper cover plate and the lower cover plate, and the positioning holes are arranged on both sides of the rib cavity.

[0019] According to another aspect of the present invention, there is provided a method for manufacturing a heat pipe, comprising the following steps:

[0020] Sintering the upper cover plate and the upper capillary structure into a component;

[0021] Sintering the lower cover plate with the lower capillary structure and the independent capillary support structure into a component;

[0022] Combine the upper cover plate and the lower cover plate to form a boss cavity and a rib cavity;

[0023] Use the degassing and liquid injection equipment to evacuate the boss cavity to a negative pressure through the degassing and liquid injection hole, and the negative pressure value ≤ 1 Pa;

[0024] Use the negative pressure of the cavity to suck the phase change medium in the degassing and liquid injection equipment into the heat pipe cavity, and control the injection amount through a flow meter;

[0025] Extrude and seal the pressure bonding area of the rib cavity.

[0026] In one embodiment, when extruding and sealing the pressure bonding area of the rib cavity, the pressure bonding area is extruded and deformed to 90% - 95% of the total thickness of the upper cover plate and the lower cover plate.

[0027] In one embodiment, after extruding and sealing the pressure bonding area of the rib cavity, it further includes: performing secondary sealing by pressure resistance welding, ultrasonic welding or laser welding.

[0028] In one embodiment, before using the degassing and liquid injection equipment to evacuate the boss cavity to a negative pressure, the upper cover plate is matched with the degassing and liquid injection equipment through the positioning holes on the upper cover plate.

[0029] The beneficial effect of the embodiment of the present invention is that: a complete degassing structure is formed through the degassing and liquid injection hole and the rib cavity, eliminating the need for the degassing pipe of the traditional heat pipe degassing structure. Therefore, there is no need for high-frequency sealing or dispensing at the root of the extraction pipe, nor for cutting, improving the material utilization rate, simplifying the operation process, and reducing the processing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0031] After reading the detailed description of the embodiments of the present disclosure in combination with the following drawings, the above features and advantages of the present invention can be better understood. In the drawings, the components are not necessarily drawn to scale, and components with similar related characteristics or features may have the same or similar reference numerals.

[0032] Figure 1 is the bottom view schematic diagram of the first embodiment of the present application;

[0033] Figure 2 is Figure 1 the schematic diagram of the A-A cross-section in

[0034] Figure 3 is the top view schematic diagram of Embodiment 1 of the present application;

[0035] Figure 4 is the bottom view schematic diagram of Embodiment 2 of the present application;

[0036] Figure 5 is Figure 4 the schematic diagram of the B-B cross-section in

[0037] Figure 6 is the top view schematic diagram of Embodiment 2 of the present application;

[0038] Wherein: 1 - upper cover plate; 11 - degassing and liquid injection hole; 2 - lower cover plate; 3 - capillary structure; 4 - independent capillary support structure; 5 - boss cavity; 6 - ribbed cavity; 7 - pressure bonding area; 8 - positioning hole. Detailed implementation manners

[0039] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the aspects described below in conjunction with the accompanying drawings and specific embodiments are merely exemplary and should not be construed as imposing any limitation on the protection scope of the present invention.

[0040] As Figures 1 to 3 shown, Embodiment 1 of the present application provides a heat pipe with high material utilization rate, including: an upper cover plate 1, a lower cover plate 2, a capillary structure 3, an independent capillary support structure 4, and a phase change medium.

[0041] Among them, a degassing and liquid injection hole is opened on the upper cover plate 1. The lower cover plate 2 is welded to the periphery of the upper cover plate 1 to form a boss cavity 5 and a ribbed cavity 6, and the boss cavity 5 communicates with the ribbed cavity 6. The degassing and liquid injection hole 11 communicates with the ribbed cavity 6. The ribbed cavity 6 is squeezed and sealed at the pressure bonding area 7, and the pressure bonding area 7 is located between the degassing and liquid injection hole 11 and the boss cavity 5. Before the ribbed cavity 6 in the pressure bonding area 7 is squeezed and sealed, the boss cavity 5 communicates with the atmosphere through the ribbed cavity 6. After the pressure bonding area 7 is squeezed and sealed, the boss cavity 5 is sealed.

[0042] The capillary structure 3 is attached to the lower surface of the upper cover plate 1 and the upper surface of the lower cover plate 2. The independent capillary support structure 4 is arranged in the boss cavity 5 and is connected to the capillary structure 3. The phase change medium (not shown in the figure) exists in the boss cavity 5.

[0043] Compared with the traditional heat pipe, this heat pipe with high material utilization rate does not require a degassing and liquid injection tube. Instead, the ribbed cavity 6 and the degassing and liquid injection hole 11 form a complete degassing and liquid injection structure, so that high-frequency welding or dispensing at the root of the extraction pipe is not required, and cutting is not required either, improving the material utilization rate, simplifying the operation process, and reducing the processing cost.

[0044] As shown Figure 1 in the figure, the pressure bonding area 7 is located between the degassing injection hole 11 and the boss cavity 5. Preferably, the pressure bonding area 7 is located at the end of the rib cavity 6 close to the boss cavity 5, so as to reduce the part of the rib cavity 6 communicating with the boss cavity 5, thereby reducing the phase change medium flowing into the rib cavity 6.

[0045] In terms of dimensions, the cross-sectional width of the rib cavity 6 can be 1 mm to 3 mm, and the height of the rib cavity 6 is 0.2 mm to 1.2 mm. Correspondingly, the aperture of the degassing injection hole 11 is 1 mm to 3 mm. The aperture of the degassing injection hole 11 should not be greater than the cross-sectional width of the rib cavity 6, and the projection of the degassing injection hole 11 should completely fall within the rib cavity 6.

[0046] In terms of materials, this heat pipe is applicable to more metal materials than traditional heat pipes, such as copper, copper alloy, aluminum alloy, magnesium alloy, iron, stainless steel, titanium, titanium alloy, and composite metal materials with metal coatings.

[0047] Figures 1 to 3 In the shown embodiment, the degassing injection hole 11 and the rib cavity 6 are arranged at the corners of the heat pipe with high material utilization rate. Therefore, the boss cavity 5 has a certain inward contraction at the corners. In the second embodiment, as Figures 4 to 6 shown in the figure, the degassing injection hole 11 and the rib cavity 6 are arranged on the side of the heat pipe with high material utilization rate. Correspondingly, the boss cavity 5 has an inward contraction structure on this side to provide enough space for the rib cavity 6 to flow out.

[0048] Preferably, positioning holes 8 are also opened on the upper cover plate 1 and the lower cover plate 2 to facilitate the positioning of the degassing injection equipment. After the upper cover plate 1 and the lower cover plate 2 are combined, the positioning holes 8 form a through hole, and the positioning holes 8 are located on both sides of the degassing injection hole 11.

[0049] Based on the above heat pipe structure, the embodiment of the present application also provides a heat pipe processing method, including the following steps:

[0050] Sinter the upper cover plate and the upper capillary structure into a component;

[0051] Sinter the lower cover plate, the lower capillary structure and the independent capillary support structure into a component;

[0052] Combine the upper cover plate and the lower cover plate by brazing, diffusion welding, resistance welding, laser welding and other methods to form a boss cavity and a rib cavity;

[0053] Use the degassing injection equipment to evacuate the boss cavity to a negative pressure from the degassing injection hole, and the negative pressure value ≤ 1 Pa;

[0054] Use the cavity negative pressure to suck the phase change medium in the degassing injection equipment into the heat pipe cavity, and control the injection amount through a flow meter;

[0055] Extrude and seal the pressure bonding area of the rib cavity.

[0056] Among them, when extruding and sealing the pressure bonding area of the rib cavity, it should be ensured that the pressure bonding area is extruded and deformed to 90% - 95% of the total thickness of the upper cover plate and the lower cover plate to achieve better airtightness. If necessary, after extruding and sealing the pressure bonding area of the rib cavity, secondary sealing can also be performed by resistance spot welding, ultrasonic welding or laser welding.

[0057] In a possible embodiment, before evacuating the boss cavity to a negative pressure by using the degassing and liquid injection equipment, the upper cover plate can also be coordinated with the degassing and liquid injection equipment through the positioning holes on the upper cover plate.

[0058] Different from the existing heat pipe manufacturing methods, this method first degasses and then injects liquid through a single degassing and liquid injection port, and there are no bubble-shaped waste gases hidden in the capillary structure due to surface tension. The degassing effect at normal temperature is better once, and basically no secondary heating degassing is required. The heat pipe performance is guaranteed and the operation process is greatly simplified, reducing the equipment cost.

[0059] In summary, for the heat pipe with high material utilization rate provided by the embodiments of the present application, since the channels for degassing discharge and liquid injection inflow of the lower cover plate are the inner rib cavity bodies within the maximum length and width dimensions of the upper cover plate and the lower cover plate, there is no additional waste during sheet metal processing. When the heat pipe is mainly based on copper and aluminum, the raw material cost is maximally saved. The degassing and liquid injection holes and the inner rib cavity form a complete degassing structure, eliminating the need for the degassing pipe of the traditional heat pipe degassing structure, and thus eliminating the high-frequency sealing or dispensing at the root of the extraction pipe, greatly simplifying the raw materials, operation process and equipment cost. After processing the new degassing and liquid injection structure, extrusion sealing is performed on the pressure bonding area, and if necessary, secondary sealing is performed by one of resistance spot welding, ultrasonic welding, and laser welding to ensure airtightness. The integrity of the heat pipe is retained, no cutting is required, and the structure is complete and beautiful.

[0060] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0061] The previous description of the present disclosure is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to the present disclosure will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations without departing from the spirit or scope of the present disclosure. Thus, the present disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0062] The above are only the preferred examples of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present application shall be included within the scope of protection of the present application.

Claims

1. A heat pipe with high material utilization rate and uniform temperature, characterized in that, Comprising: An upper cover plate, on which a degassing and liquid injection hole is provided; A lower cover plate, which is welded to the upper cover plate to form a boss cavity and a rib cavity. The boss cavity is communicated with the rib cavity. The degassing and liquid injection hole is communicated with the rib cavity. The rib cavity is sealed by extrusion at the pressure bonding area, and the pressure bonding area is located between the degassing and liquid injection hole and the boss cavity; A capillary structure, attached to the lower surface of the upper cover plate and the upper surface of the lower cover plate; An independent capillary support structure, arranged in the boss cavity and connected to the capillary structure; And A phase change medium, existing in the boss cavity.

2. The high material utilization rate heat pipe according to claim 1, wherein: The pressure bonding area is located at the end of the rib cavity near the boss cavity.

3. The high material utilization rate heat pipe according to claim 1, characterized in that: The cross-sectional width of the rib cavity is 1 mm to 3 mm, and the height of the rib cavity is 0.2 mm to 1.2 mm.

4. The high material utilization rate heat pipe according to claim 3, characterized in that: The aperture of the degassing and liquid injection hole is 1 mm to 3 mm.

5. The high material utilization rate heat pipe according to claim 1, characterized in that: The degassing and liquid injection hole and the rib cavity are arranged at the corner or side of the heat pipe with high material utilization rate.

6. The high material utilization rate heat pipe according to claim 1, wherein: Positioning holes are also provided on the upper cover plate and the lower cover plate, and the positioning holes are arranged on both sides of the rib cavity.

7. The method for processing a heat pipe according to any one of claims 1-6, characterized in that, Including the following steps: Sintering the upper cover plate and the upper capillary structure into a component; Sintering the lower cover plate, the lower capillary structure and the independent capillary support structure into a component; Combining the upper cover plate and the lower cover plate to form a boss cavity and a rib cavity; Using a degassing and liquid injection device to evacuate the boss cavity into a negative pressure through the degassing and liquid injection hole, and the negative pressure value ≤ 1 Pa; Using the negative pressure of the cavity to suck the phase change medium in the degassing and liquid injection device into the heat pipe cavity, and controlling the injection amount through a flow meter; Extruding and sealing the pressure bonding area of the rib cavity.

8. The method for processing a heat pipe according to claim 7, wherein: When extruding and sealing the pressure bonding area of the rib cavity, the pressure bonding area is extruded and deformed to 90% - 95% of the total thickness of the upper cover plate and the lower cover plate.

9. The method for manufacturing a heat pipe according to claim 7, wherein After extruding and sealing the pressure bonding area of the rib cavity, it further includes: performing secondary sealing by pressure resistance welding, ultrasonic welding or laser welding.

10. The method for manufacturing a heat pipe according to claim 7, wherein Before evacuating the boss cavity into a negative pressure by using the degassing and liquid injection device, the upper cover plate and the degassing and liquid injection device are matched through the positioning hole on the upper cover plate.

Citation Information

Patent Citations

  • Vapor chamber with high material utilization rate

    CN217083435U