A method for accurately identifying the quality of PCB copper backlight

By drilling holes on the edge of the PCB and making simple backlight slices, combined with microscope observation and light blocking by the copper-clad flat plate, the problem of light interference in copper sinking backlight inspection is solved, achieving accurate and efficient quality judgment.

CN114813658BActive Publication Date: 2025-09-26AOSHIKANG TECH CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
CN202210371398.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-04-11
Publication Date
2025-09-26
Estimated Expiration
2042-04-11

AI Technical Summary

Technical Problem

During the backlight inspection of copper plating on PCB boards, the strong light environment causes weak light transmission in the poor copper plating areas, making it difficult to observe accurately. Especially for thin boards or when the operator is unskilled, it is easy to damage the board, affecting the accuracy and quality of the inspection.

Method used

A detection hole is drilled on the edge of the PCB board, and after chemical copper plating, it is ground thin to make a simple backlight slice. It is observed under a microscope, and the surrounding light is blocked by a copper-clad flat plate. The copper plating effect is confirmed by comparing it with a standard slice.

Benefits of technology

It improves the accuracy and efficiency of detection, reduces the risk of plate damage, and ensures reliable judgment of copper deposition quality.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN114813658B_ABST
    Figure CN114813658B_ABST
Patent Text Reader

Abstract

The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight, comprising the following steps: drilling: drilling a row of detection holes on the edge of the PCB board, subjecting the PCB in S1 to chemical copper plating, removing the area where the observation holes are located after the copper plating is completed, grinding the holes to halfway, and polishing away excess substrate, leaving a substrate thickness of less than 1 mm, making simple backlight slices, testing the backlight slices obtained in S3, and comparing the observed backlight effect with a standard slice to confirm the actual effect of a batch of chemical copper plating. The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight, drilling multiple detection holes on the edge of the PCB board can facilitate simultaneous detection of the PCB board during detection, thereby improving detection efficiency. During the copper plating and slicing operations of the PCB board, the remaining experimental operations can be performed on the drilled PCB board. This design method can prevent the PCB board from being damaged due to improper operation.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the field of PCB board detection, and in particular to a detection method for accurately identifying the quality of PCB copper plating backlight. Background Art

[0002] PCB board, also known as printed circuit board, is the provider of electrical connections for electronic components.

[0003] When performing backlight testing on PCB copper deposits, copper deposits on the non-metallized hole walls can cause areas with good copper deposits to be opaque or only transmit light in spots, while areas with poor copper deposits show as flake-like transmittance. To achieve intuitive and accurate visual results during testing, the microscope's bottom light must be turned on for observation.

[0004] There is an obvious disadvantage in the actual operation process: when the bottom light of the microscope is turned on for observation, the light around the sample used for copper plating backlight inspection is too strong, making the light transmitted through the poor copper plating area of ​​the hole wall weak and difficult to observe, and the copper plating effect is difficult to confirm. If the PCB itself is very thin or the observer is not skilled, it is impossible to make an accurate judgment, which will cause irreparable damage to the progress and quality of the product.

[0005] Therefore, it is necessary to provide a detection method for accurately identifying the quality of PCB copper backlight to solve the above technical problems. Summary of the Invention

[0006] The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight, which solves the problem that the existing PCB board is easily damaged when the operator is not skilled during the detection.

[0007] To solve the above technical problems, the present invention provides a method for accurately identifying the quality of PCB copper backlight, comprising the following steps:

[0008] S1. Drilling: Drill a row of test holes on the edge of the PCB;

[0009] S2, copper plating: subject the PCB in S1 to chemical copper plating;

[0010] S3. Slice preparation: After copper deposition, remove the area where the observation hole is located, grind the hole to halfway, and grind away the excess substrate. The remaining substrate thickness is less than 1mm to make a simple backlight slice;

[0011] S4. Testing: Testing the backlight slices obtained in S3, and comparing the observed backlight effect with the standard slice to confirm the actual effect of a batch of chemical copper deposition.

[0012] Preferably, a drilling device is required when drilling holes in the PCB board in S1, and the drilling device includes a base, a lifting rod is fixedly installed on one side of the base surface, the top of the lifting rod is fixedly connected to a fixed head, and a drilling device is provided at the bottom of the fixed head. The drilling device includes a driving member, one end of the output shaft of the driving member is fixedly connected to a rotating block through a coupling, the bottom of the rotating block is connected to a drilling head, and the surface of the lifting rod is fixedly connected to a placement seat.

[0013] Preferably, an adjustment component is provided at the bottom of the fixed head and on the side opposite to the driving member, and the adjustment component includes a groove, a sliding rod is fixedly connected between the two sides of the inner wall of the groove, and a rotating seat is provided on the surface of the sliding rod.

[0014] Preferably, a U-shaped limiting member is connected to one side of the rotating seat, and a movable member is provided on the surface of the U-shaped limiting member.

[0015] Preferably, the bottom of the movable part is connected to a connecting part, the bottom of the connecting part is provided with a grinding assembly, the grinding assembly includes a grinding cylinder, and the surface of the grinding cylinder is provided with a fixing part.

[0016] Preferably, a plurality of fixing holes adapted to the fixing members are provided on the surface of the rotating block.

[0017] Preferably, a cutting device is provided on the surface of the placement seat, and the cutting device includes a fixed rod, a sliding seat is sleeved on the surface of the fixed rod, and a movable seat is provided on the surface of the sliding seat.

[0018] Preferably, one side of the movable seat is connected to an adjusting seat, and a cutting piece is provided inside the adjusting seat.

[0019] Preferably, protective components are symmetrically arranged on both sides of the base surface, and the protective components include a placement groove, and a protective plate is arranged inside the placement groove.

[0020] Preferably, a bolt is provided on the surface of the base on a side opposite to the placement groove.

[0021] Compared with related technologies, the present invention provides a method for accurately identifying the quality of PCB copper backlighting, which has the following beneficial effects:

[0022] The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight. Drilling multiple detection holes on the edge of a PCB facilitates simultaneous detection of the PCBs during detection, thereby improving detection efficiency. During copper plating and slicing operations on the PCBs, the remaining experimental operations can be performed on the drilled PCBs, reducing the need to use other PCBs for other experiments. This design method can prevent damage to the PCBs due to improper operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic structural diagram of a first embodiment of a method for accurately identifying the quality of PCB copper backlight provided by the present invention;

[0024] Figure 2 A schematic structural diagram of a second embodiment of a method for accurately identifying the quality of PCB copper backlighting provided by the present invention;

[0025] Figure 3 for Figure 2 An enlarged schematic diagram of part A is shown;

[0026] Figure 4 for Figure 3 An enlarged schematic diagram of part B is shown;

[0027] Figure 5 for Figure 2 The isometric structural diagram of the entire device shown;

[0028] Figure 6 for Figure 2 A front view of the device as a whole is shown;

[0029] Figure 7 for Figure 6 An enlarged schematic diagram of section C is shown;

[0030] Figure 8 for Figure 6 An enlarged schematic diagram of portion D is shown;

[0031] Figure 9 This is a structural schematic diagram of a third embodiment of a detection method for accurately identifying the quality of PCB copper plating backlight provided by the present invention.

[0032] Numbers in the figure: 1, base, 2, lifting rod, 3, fixed head,

[0033] 4. Drilling device, 41. Driving member, 42. Rotating block, 43. Drilling head,

[0034] 5. Adjustment assembly, 51. Groove, 52. Slide rod, 53. Rotating seat, 54. U-shaped limiter, 55. Movable part,

[0035] 6. Grinding assembly, 61. Grinding cylinder, 62. Fixing parts,

[0036] 7. Fixing hole, 8. Placement seat, 9. Connector,

[0037] 10. Cutting device, 101. Fixed rod, 102. Sliding seat, 103. Moving seat, 104. Adjusting seat, 105. Cutting piece,

[0038] 11. Protective assembly, 111. Placement slot, 112. Protective plate,

[0039] 12. Collection assembly, 121. Moving slot, 122. Limiting member, 123. Collection box. DETAILED DESCRIPTION

[0040] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0041] First embodiment

[0042] Please refer to Figure 1 ,in, Figure 1 This is a schematic diagram of the structure of the first embodiment of a detection method for accurately identifying the quality of PCB copper backlight provided by the present invention. A detection method for accurately identifying the quality of PCB copper backlight includes the following steps:

[0043] S1. Drilling: Drill a row of test holes on the edge of the PCB;

[0044] S2, copper plating: subject the PCB in S1 to chemical copper plating;

[0045] S3. Slice preparation: After copper deposition, remove the area where the observation hole is located, grind the hole to halfway, and grind away the excess substrate. The remaining substrate thickness is less than 1mm to make a simple backlight slice;

[0046] S4. Testing: Testing the backlight slices obtained in S3, and comparing the observed backlight effect with the standard slice to confirm the actual effect of a batch of chemical copper deposition.

[0047] In view of the problems in the existing PCB copper plating backlight inspection process, the 1.6mm thick copper clad board scraps used by PCB manufacturers are used, with a size designed to be 100mm*100mm (approximately the same size as the microscope stage). Then, a CNC gong machine is used to gong out different types of gong grooves with a length of 16mm and widths of 0.4mm / 0.5mm / 0.6mm / 0.7mm in the copper clad board. The gong grooves of different widths are spaced at least 10mm apart to avoid light leaking from the side interfering with the field of view during observation.

[0048] After the copper backlight slice is made, the slice is stuck into the groove that matches the sample thickness, and then placed under a microscope with the bottom light turned on to observe the copper backlight. Because the surrounding light is blocked by the copper-clad plate, the light transmitted from the poor copper area on the hole wall can be observed more clearly.

[0049] In order to prevent the copper-clad backlight slices from leaking out of the gong groove, a layer of 3M transparent tape can be attached to the bottom of the copper-clad flat panel. After the backlight is tested, the sliced ​​samples will be taken out. The copper-clad flat panel can be reused. A laboratory only needs to make it once and it can be used for several years.

[0050] The working principle of the detection method for accurately identifying the quality of PCB copper backlight provided by the present invention is as follows:

[0051] During use, when the PCB board needs to be inspected, the operator first opens multiple inspection holes on the edge of the PCB board. After the inspection holes are drilled on the PCB board, the chemical copper deposition operation is performed. After the copper deposition operation is performed on the PCB board, the area where the holes are located is observed, the holes are ground to halfway, and the excess substrate is polished away. The thickness of the retained substrate is less than 1mm, and a simple backlight slice is made. After the PCB board is sliced, it is inspected and the observed backlight effect is compared with the standard slice to confirm the actual effect of a batch of chemical copper deposition.

[0052] Compared with related technologies, the present invention provides a method for accurately identifying the quality of PCB copper backlighting, which has the following beneficial effects:

[0053] The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight. Drilling multiple detection holes on the edge of a PCB facilitates simultaneous detection of the PCBs during detection, thereby improving detection efficiency. During copper plating and slicing operations on the PCBs, the remaining experimental operations can be performed on the drilled PCBs, reducing the need to use other PCBs for other experiments. This design method can prevent damage to the PCBs due to improper operation.

[0054] Second embodiment

[0055] Please refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 Based on the first embodiment of this application, which provides a method for accurately identifying the quality of PCB copper backlighting, the second embodiment of this application proposes another method for accurately identifying the quality of PCB copper backlighting. The second embodiment is merely a preferred embodiment of the first embodiment, and its implementation will not affect the independent implementation of the first embodiment.

[0056] Specifically, the difference of the second embodiment of the present application in providing a detection method for accurately identifying the quality of PCB copper plating backlight is that, in a detection method for accurately identifying the quality of PCB copper plating backlight, a drilling device is required when drilling holes in the PCB board in S1, and the drilling device includes a base 1, a lifting rod 2 is fixedly installed on one side of the surface of the base 1, the top of the lifting rod 2 is fixedly connected to a fixed head 3, and a drilling device 4 is provided at the bottom of the fixed head 3, and the drilling device 4 includes a driving member 41, one end of the output shaft of the driving member 41 is fixedly connected to a rotating block 42 through a coupling, the bottom of the rotating block 42 is connected to a drilling head 43, and the surface of the lifting rod 2 is fixedly connected to a placement seat 8.

[0057] The driving member 41 is arranged inside the fixing head 3 .

[0058] An adjustment assembly 5 is provided at the bottom of the fixed head 3 and on the side opposite to the driving member 41. The adjustment assembly 5 includes a groove 51. A sliding rod 52 is fixedly connected between the two sides of the inner wall of the groove 51. A rotating seat 53 is provided on the surface of the sliding rod 52.

[0059] The groove 51 is opened at the bottom of the fixed head 3, and the rotating seat 53 includes a sliding sleeve, and a U-shaped block is connected to the surface of the sliding sleeve. A rotating rod is rotatably connected between the two sides of the inner wall of the U-shaped block through a rotating shaft. One side of the U-shaped limiter 54 is connected to one side of the surface of the rotating rod, and connecting holes compatible with the U-shaped limiter 54 are opened on both sides of the inside of the movable part 55. A stopper is connected to the bottom of the U-shaped limiter 54 to prevent the movable part 55 from falling off. A bolt is provided on the surface of the connecting part 9, and a threaded hole compatible with the bolt is opened on one side of the surface of the movable part 55. A bolt is provided on one side of the rotating seat 53 to fix the U-shaped limiter 54.

[0060] A U-shaped limiting member 54 is connected to one side of the rotating seat 53 , and a movable member 55 is provided on the surface of the U-shaped limiting member 54 .

[0061] The bottom of the movable member 55 is connected to a connecting member 9 , and a grinding assembly 6 is provided at the bottom of the connecting member 9 . The grinding assembly 6 includes a grinding cylinder 61 , and a fixing member 62 is provided on the surface of the grinding cylinder 61 .

[0062] A connecting groove is provided on one side of the grinding cylinder 61 to facilitate sleeve installation on the surface of the drilling head 43 .

[0063] A plurality of fixing holes 7 adapted to the fixing members 62 are formed on the surface of the rotating block 42 .

[0064] A cutting device 10 is provided on the surface of the placement seat 8 . The cutting device 10 includes a fixed rod 101 . A sliding seat 102 is sleeved on the surface of the fixed rod 101 . A moving seat 103 is provided on the surface of the sliding seat 102 .

[0065] Positioning blocks are connected to both ends of the fixed rod 101, one side of the two positioning blocks is fixed to the bottom of the placement seat 8, the sliding seat 102 and the movable seat 103 both include movable sleeves, a connecting rod is connected to one side of the surface of the movable sleeve, and a bolt is provided on the surface of the movable sleeve. The adjustment seat 104 includes a sliding sleeve, a fixing ring is connected to one side of the surface of the sliding sleeve, and a threaded bolt is provided on the surface of the sliding sleeve.

[0066] One side of the movable seat 103 is connected to an adjustment seat 104 , and a cutting piece 105 is provided inside the adjustment seat 104 .

[0067] Protection components 11 are symmetrically provided on both sides of the surface of the base 1 . The protection components 11 include a placement groove 111 , and a protection plate 112 is provided inside the placement groove 111 .

[0068] The protective plate 112 includes a concave plate, a sliding groove is opened on one side of the inner wall of the concave plate, a slider is slidably connected inside the sliding groove, a telescopic plate is connected to one side of the slider, a latch is provided on the surface of the concave plate, a slot adapted to the latch is opened on the surface of the telescopic plate, a placement block adapted to the placement groove 111 is connected to the bottom of the protective plate 112, and a fixing groove adapted to the fixing bolt is opened inside the placement block.

[0069] Bolts are provided on the surface of the base 1 at a side opposite to the placement groove 111 .

[0070] The working principle of the detection method for accurately identifying the quality of PCB copper backlight provided by the present invention is as follows:

[0071] During use, when drilling a hole on a PCB board, the operator first places the PCB board on the surface of the placement seat 8. After the PCB board is placed, the operator starts the driving member 41 to drive the drilling head 43 to rotate through the rotating block 42. When the drilling head 43 rotates, the lifting rod 2 on one side of the base 1 is started to drive the fixed head 3 to move downward. When the fixed head 3 moves downward, the rotating drilling head 43 is driven to move downward. When the drilling head 43 moves toward one side of the placement seat 8, the surface of the PCB board can be drilled.

[0072] When the PCB board needs to be polished, the operator first drives the polishing assembly 6 to move toward one side of the drilling head 43 by rotating the U-shaped limit piece 54 on one side of the rotating seat 53. When the polishing assembly 6 moves to a state parallel to the drilling head 43, the operator pushes the rotating seat 53 to move on the surface of the slide bar 52. When the rotating seat 53 moves on the surface of the slide bar 52, it drives the polishing cylinder 61 to move toward one side of the drilling head 43. When the polishing cylinder 61 is sleeved on the surface of the drilling head 43, the operator separates the bolt on one side of the connecting member 9 from the movable member 55. When the bolt on one side of the connecting member 9 is separated from the movable member 55, the operator pushes the movable member 55 to move upward on the surface of the U-shaped limit piece 54. When the movable member 55 is separated from the connecting member 9, the operator again connects the fixing member 62 on one side of the polishing cylinder 61 to the fixing hole 7 on the surface of the rotating block 42, and the driving member 41 can be started to drive the polishing cylinder 61 to work.

[0073] When it is necessary to cut the PCB board, the operator first adjusts the left and right position of the cutting piece 105 by pulling the sliding seat 102 to move on the surface of the fixed rod 101. After adjusting the position of the sliding seat 102, the sliding seat 102 is threadedly connected to the fixed rod 101 using a bolt. After fixing the sliding seat 102, the operator then pulls the movable seat 103 to drive the cutting piece 105 to fine-tune the left and right position. After adjusting the position of the movable seat 103, a bolt is used to pass through the surface of the movable seat 103 and be threadedly connected to the sliding seat 102. After fixing the position of the movable seat 103, the height of the cutting piece 105 is adjusted up and down by adjusting the adjusting seat 104. After adjusting the height of the cutting piece 105, the PCB board can be cut.

[0074] When the PCB board is being polished, the operator first places the protective plate 112 inside the placement groove 111 opened on the surface of the base 1 and uses a fixing bolt to pass through the surface of the base 1 and fix it to the protective plate 112 inside the placement groove 111.

[0075] Compared with related technologies, the present invention provides a method for accurately identifying the quality of PCB copper backlighting, which has the following beneficial effects:

[0076] The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight. A driving member 41 is provided at the bottom of the fixed head 3 to cooperate with the drilling head 43, which is convenient for drilling a hole at a specified position of the PCB board. A groove 51 is provided on the surface of the fixed head 3 to facilitate fixing the slide bar 52. A rotating seat 53 is provided on the surface of the slide bar 52 to facilitate driving the polishing assembly 6 to adjust the position. A U-shaped limiter 54 is provided on one side of the rotating seat 53 to cooperate with the movable member 55, which is convenient for the operator to push the polishing cylinder 61 to move to the specified position and then separate the connecting member 9 from the movable member 55. A rotating block 42 is provided on one side of the driving member 41 to cooperate with the fixing member 62 on the surface of the polishing cylinder 61 to facilitate the polishing cylinder 61. The fixing is convenient for the driving member 41 to drive the grinding cylinder 61 to grind the PCB board. The rotating seat 53 can be used to adjust the angle when the grinding cylinder 61 is not in use to prevent the drilling head 43 from being blocked by the grinding cylinder 61 when in use. A fixing rod 101 is provided on the surface of the placement seat 8 to cooperate with the sliding seat 102, the movable seat 103 and the adjustment seat 104 to facilitate driving the cutting member 105 to adjust various positions, which can adapt to the cutting of various designated positions of the PCB board. The placement groove 111 is provided on the surface of the base 1 to play a role in positioning and stabilizing when the protective plate 112 is installed. The use of the protective plate 112 can prevent the PCB board from splashing residue when grinding, which can be convenient for cleaning in the later stage.

[0077] Third embodiment

[0078] Please refer to Figure 9 Based on the first embodiment of this application, which provides a method for accurately identifying the quality of PCB copper backlighting, the third embodiment of this application provides another method for accurately identifying the quality of PCB copper backlighting. The third embodiment is merely a preferred embodiment of the first embodiment, and implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0079] Specifically, the difference of the third embodiment of the present application in providing a detection method for accurately identifying the quality of PCB copper plating backlight is that, in a detection method for accurately identifying the quality of PCB copper plating backlight, a collection component 12 is provided at the bottom of the base 1, and the collection component 12 includes two movable grooves 121, and a limiting member 122 is provided inside the two movable grooves 121, and a collection box 123 is fixedly connected between the two limiting members 122.

[0080] Two movable slots 121 are formed at the bottom of the base 1 , and the limiting member 122 is in the shape of a letter T.

[0081] The working principle of the detection method for accurately identifying the quality of PCB copper backlight provided by the present invention is as follows:

[0082] During use, when the collection box 123 is full of waste chips, the operator pulls the collection box 123 at the bottom of the base 1 toward the outside of the base 1. When the collection box 123 is pulled toward the outside of the base 1, it drives the limiting members 122 on both sides to move inside the two movable grooves 121. When the collection box 123 drives the limiting members 122 to separate from the movable grooves 121, the waste chips inside the collection box 123 can be cleared.

[0083] Compared with related technologies, the present invention provides a method for accurately identifying the quality of PCB copper backlighting, which has the following beneficial effects:

[0084] The present invention provides a detection method for accurately identifying the quality of PCB copper plating backlight. A collection box 123 is provided at the bottom of the base 1 to collect waste chips generated during the polishing of the PCB board, thereby reducing the need to clean the device in the later stage. Limiting members 122 are provided on both sides of the collection box 123 to limit the movement of the collection box 123 when the collection box 123 moves inside the movable groove 121, and also facilitate the positioning of the collection box 123 when it is installed.

[0085] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for accurately identifying the quality of PCB copper backlight, characterized in that: The following steps are involved: S1. Drilling: Drill a row of test holes on the edge of the PCB; S2, copper plating: subject the PCB in S1 to chemical copper plating; S3. Slice preparation: After copper deposition, remove the area where the observation hole is located, grind the hole to halfway, and grind away the excess substrate. The remaining substrate thickness is less than 1mm to make a simple backlight slice; S4, testing: testing the backlight slices obtained in S3, and comparing the observed backlight effect with the standard slice to confirm the actual effect of a batch of chemical copper deposition; When drilling holes in the PCB board in S1, a drilling device is required. The drilling device includes a base, a lifting rod is fixedly installed on one side of the base surface, the top of the lifting rod is fixedly connected to a fixed head, and a drilling device is provided at the bottom of the fixed head. The drilling device includes a driving member, one end of the output shaft of the driving member is fixedly connected to a rotating block through a coupling, the bottom of the rotating block is connected to a drilling head, and the surface of the lifting rod is fixedly connected to a placement seat; The driving member is arranged inside the fixed head; An adjustment assembly is provided at the bottom of the fixed head and on a side opposite to the driving member. The adjustment assembly includes a groove. A sliding rod is fixedly connected between two sides of the inner wall of the groove. A rotating seat is provided on the surface of the sliding rod. A U-shaped limiting piece is connected to one side of the rotating seat, and a movable piece is provided on the surface of the U-shaped limiting piece; The groove is provided at the bottom of the fixed head, and the rotating seat includes a sliding sleeve, a U-shaped block is connected to the surface of the sliding sleeve, a rotating rod is rotatably connected between the two sides of the inner wall of the U-shaped block through a rotating shaft, one side of the U-shaped limiter is connected to one side of the surface of the rotating rod, and connecting holes adapted to the U-shaped limiter are provided on both sides of the interior of the movable part, a stopper is connected to the bottom of the U-shaped limiter to prevent the movable part from falling off, a bolt is provided on the surface of the connecting part, a threaded hole adapted to the bolt is provided on one side of the surface of the movable part, and a bolt is provided on one side of the rotating seat to fix the U-shaped limiter; The bottom of the movable part is connected to a connecting part, and the bottom of the connecting part is provided with a grinding assembly, and the grinding assembly includes a grinding cylinder, and the surface of the grinding cylinder is provided with a fixing part; A connecting groove is provided on one side of the grinding cylinder to facilitate its installation on the surface of the drilling head; The surface of the rotating block is provided with a plurality of fixing holes adapted to the fixing members; When it is necessary to grind the PCB board, first, the grinding assembly is driven to move toward one side of the drilling head by rotating the U-shaped limit piece on one side of the rotating seat. When the grinding assembly moves to a state parallel to the drilling head, the rotating seat is pushed to move on the surface of the sliding rod. When the rotating seat moves on the surface of the sliding rod, it drives the grinding cylinder to move toward one side of the drilling head. After the grinding cylinder is sleeved on the surface of the drilling head, the bolt on one side of the connecting part is separated from the movable part. When the bolt on one side of the connecting part is separated from the movable part, the movable part is pushed to move upward on the surface of the U-shaped limit piece. When the movable part is separated from the connecting part, the fixing part on one side of the grinding cylinder is overlapped and connected with the fixing hole on the surface of the rotating block, and the driving part can be started to drive the grinding cylinder to work.

2. The detection method for accurately identifying the quality of PCB copper backlight according to claim 1 is characterized in that: A cutting device is provided on the surface of the placement seat. The cutting device comprises a fixing rod. A sliding seat is sleeved on the surface of the fixing rod. A moving seat is provided on the surface of the sliding seat.

3. The detection method for accurately identifying the quality of PCB copper backlight according to claim 2 is characterized in that: One side of the movable seat is connected with an adjusting seat, and a cutting piece is arranged inside the adjusting seat.

4. The method for accurately identifying the quality of PCB copper backlight according to claim 1, characterized in that: Protection components are symmetrically arranged on both sides of the base surface. The protection components include a placement groove, and a protection plate is arranged inside the placement groove.

5. The method for accurately identifying the quality of PCB copper backlight according to claim 4, characterized in that: Bolts are provided on the surface of the base at a side opposite to the placement groove.

Citation Information

Patent Citations

  • Polishing and punching integrated machine for architectural decorative panel

    CN107127649A

  • Novel PCB and mobile terminal with PCB

    CN109227728A

  • Mechanical accessory grinding and drilling integrated equipment

    CN112518339A

  • Plated through hole backlight slice preparation method and detection method

    CN113686557A

  • Metal machine case fixing device's machining platform

    CN208528523U