Electronic modulation device

Abstract

Some embodiments of the present invention provide an electronic device. The above-mentioned electronic device includes a first substrate having a first part and a second part. The above-mentioned electronic device also includes a second substrate facing the first substrate. The above-mentioned electronic device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps with the first part and does not overlap with the second part. In addition, the above-mentioned electronic device includes a first spacer disposed between the first part of the first substrate and the second substrate. The first spacer has a first thickness. The above-mentioned electronic device also includes a second spacer disposed between the second part of the first substrate and the second substrate. The second spacer has a second thickness. The above-mentioned electronic device also includes a plurality of third spacers disposed between the first substrate and the second substrate. At least one of the third spacers has a third thickness. The first spacer is disposed between two of the third spacers. Among them, the first thickness is different from the second thickness and the third thickness, and the second thickness is different from the third thickness.

Description

[0001] This application is a divisional application of a Chinese patent application for invention, with the application number "201811465528.0" and the invention title "Electronic Modulation Device", which was filed on December 3, 2018. Technical Field

[0002] The present invention relates to an electronic modulation device, and particularly to an electronic modulation device including an adjustment unit. Background Art

[0003] Electronic products, such as smart phones, tablet computers, notebook computers, monitors, and televisions, have become indispensable necessities in modern society. With the booming development of such portable electronic products, consumers have high expectations for the quality, functions, and prices of these products. These electronic products can generally be used as electronic modulation devices at the same time, for example, modulating electromagnetic waves.

[0004] However, developing an electronic modulation device applicable to various environments is still a research topic that the current industry is committed to. Summary of the Invention

[0005] Some embodiments of the present invention provide an electronic device. The above electronic device includes a first substrate having a first part and a second part. The above electronic device also includes a second substrate facing the first substrate. The above electronic device further includes at least one working device disposed between the first substrate and the second substrate, wherein the working device overlaps with the first part and does not overlap with the second part. In addition, the above electronic device includes a first spacer disposed between the first part of the first substrate and the second substrate. The first spacer has a first thickness. The above electronic device also includes a second spacer disposed between the second part of the first substrate and the second substrate. The second spacer has a second thickness. The above electronic device also includes a plurality of third spacers disposed between the first substrate and the second substrate. At least one of the third spacers has a third thickness. The first spacer is disposed between two of the third spacers. Wherein, the first thickness is different from the second thickness and the third thickness, and the second thickness is different from the third thickness. Brief Description of the Drawings

[0006] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention is provided in conjunction with the accompanying drawings, wherein:

[0007] Figure 1 A top view schematic diagram of an electronic modulation device according to some embodiments of the present invention;

[0008] Figure 2 As shown in Figure 1 An enlarged schematic diagram of region A of the electronic modulation device;

[0009] Figure 3A 、 3B is the process flow chart of an electronic modulation device as shown in Figure 1 accordance with some embodiments of the present invention;

[0010] Figure 4 is the cross-sectional schematic view of an electronic modulation device according to some embodiments of the present invention;

[0011] Figure 5A 、 5B is the process flow chart of an electronic modulation device according to some embodiments of the present invention;

[0012] Figure 6 is the cross-sectional schematic view of an electronic modulation device according to some embodiments of the present invention;

[0013] Figure 7 is the cross-sectional schematic view of an electronic modulation device according to some embodiments of the present invention;

[0014] Figure 8A 、 8B is the cross-sectional schematic view of the first part and the second part of an electronic modulation device according to some embodiments of the present invention.

[0015] Reference numerals

[0016] 10 First part

[0017] 20 Second part

[0018] 100 Electronic modulation device

[0019] 100A Working area

[0020] 100B Non-working area

[0021] 102 First substrate

[0022] 104, 104a, 104b Adjustment unit

[0023] 106, 106a, 106b Adjustment unit

[0024] 108 Adjustment unit

[0025] 110 Modulation material layer

[0026] 112 Second substrate

[0027] 200 Electronic modulation device

[0028] 204, 204a, 204b Adjustment unit

[0029] 206, 206a, 206b adjustment units

[0030] 300 Electronic modulation device

[0031] 304 Adjustment unit

[0032] 306 Adjustment unit

[0033] 308 Spacer

[0034] 310 Spacer

[0035] 500 Electronic modulation device

[0036] 502 Substrate

[0037] 504 Insulating layer

[0038] 506 Protective layer

[0039] 508 Driving component

[0040] 510 Source electrode

[0041] 512 Drain electrode

[0042] 514 Gate electrode

[0043] 516 Active layer

[0044] 518 Channel region

[0045] 520 Conductive wire

[0046] 522 First electrode

[0047] 524 Second electrode

[0048] 526 Modulation material layer

[0049] 528 Display component layer

[0050] 530 Substrate

[0051] 532 Adjustment unit

[0052] 534 Adjustment unit

[0053] 536 Adjustment unit

[0054] 540 Working device Detailed implementation mode

[0055] The following provides a detailed description of a component substrate, an electronic modulation device, and a manufacturing method of the electronic modulation device according to some embodiments of the present invention. It should be understood that the following description provides many different embodiments or examples for implementing different aspects of some embodiments of the present invention. The specific components and arrangements described below are only for simply and clearly describing some embodiments of the present invention. Of course, these are only for illustration and not limitations of the present invention. In addition, repeated reference numerals or labels may be used in different embodiments. These repetitions are only for simply and clearly describing some embodiments of the present invention and do not represent any relevance between the different embodiments and / or structures discussed. Furthermore, when it is stated that a first material layer is on or above a second material layer, it includes the case where the first material layer is in direct contact with the second material layer. Or, there may also be a case where one or more other material layers are interposed, in which case the first material layer and the second material layer may not be in direct contact.

[0056] In addition, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one component of the drawing to another component. It can be understood that if the device in the drawing is flipped upside down, the component described on the "lower" side will become the component on the "higher" side. Here, the terms "about", "approximately", "substantially" generally mean within 20% of a given value or range, such as within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The given quantity is an approximate quantity, that is, the meaning of "about", "approximately", "substantially" can still be implied without specifically stating "about", "approximately", "substantially".

[0057] It should be noted that in the following text, the term "substrate" may include components formed on a transparent substrate and various film layers covering the substrate, and any required number of active components (transistor components) may be formed above it. However, for simplicity of the drawings here, only a flat substrate is shown.

[0058] Refer to Figure 1 , Figure 1 is a top view of an electronic modulation device 100 according to some embodiments of the present invention. As Figure 1 shown, the electronic modulation device 100 includes a working area 100A and a non-working area 100B. The working area 100A may include a working device 540 (shown in Figure 8A) The non-working area 100B can be adjacent to the working area 100A. The electronic modulation device 100 can include an integrated circuit, such as a microprocessor, a storage element, and / or other components. The electronic modulation device 100 can also include different passive and active components, and wires. The passive and active components can be, for example, thin film transistors, thin-film resistors, other types of capacitors such as metal-insulator-metal capacitors (MIMCAPs), inductors, diodes, Metal-Oxide-Semiconductor field-effect transistors (MOSFETs), complementary MOS transistors (CMOSFETs), bipolar junction transistors (BJTs), laterally diffused MOS transistors (LDMOSFETs), high-power MOS transistors, or other types of transistors.

[0059] Refer to Figure 2 , Figure 2 is Figure 1 an enlarged view of area A of the electronic modulation device 100. As Figure 2 shown, the working area 100A can include a plurality of first parts 10 and a plurality of second parts 20. In some embodiments, at least one working device 540 can be included in the first part 10. The first part 10 can be an M×N array, where M and N are both positive integers, but the present invention is not limited thereto. The second part 20 can be disposed adjacent to the first part 10, such as the area between two adjacent first parts 10, and can have any size and can be arranged in any manner. In some embodiments, the second part 20 may not have a working device 540. In some embodiments, an adjustment unit with a smaller restoring force per unit area (shown in Figure 3B ) is formed on the first part 10, and an adjustment unit with a larger restoring force per unit area (shown in Figure 3B ) is formed on the second part 20.

[0060] Returning to Figure 1 , the non-working area 100B can include a plurality of second parts 20, and the second parts 20 can have any size and can be arranged in any manner, and the present invention is not limited thereto.

[0061] Refer to Figure 3A , 3B , Figure 3A , 3B is a process flow chart of the electronic modulation device 100 according to some embodiments of the present invention.Figure 3A The cross-sectional view shown corresponds to Figure 2 a portion of the line R-R' of the working area 100A in Figure 3A As shown, a first substrate 102 is first provided. It should be noted that the first substrate 102 may include multiple layers and various components disposed within and / or on the multiple layers. For the sake of simplicity, only one layer is shown herein. The area of the first substrate 102 corresponding to the first portion 10 may have at least one working device 540 disposed on the first substrate 102. The area of the first substrate 102 corresponding to the second portion 20 may have no working device 540 disposed within the first substrate 102.

[0062] As Figure 3A shown, at least one adjustment unit 104 is disposed on the first portion 10 of the first substrate 102, and at least one adjustment unit 106 is disposed on the second portion 20 of the first substrate 102. In some embodiments, the materials of the adjustment unit 104 and the adjustment unit 106 include photoresist or other suitable materials, and the present invention is not limited thereto. In certain embodiments, in a top view direction, the adjustment unit 104 and / or the adjustment unit 106 may be elongated. The adjustment unit 104 and / or the adjustment unit 106 may be arranged along one or more directions, and there may be a gap between two adjacent adjustment units 104 and / or adjustment unit 106 to allow the material of the modulation material layer 110 (shown in Figure 3B ) to flow. In this embodiment, the adjustment unit 104 and the adjustment unit 106 may each be a spacer formed of photoresist. The adjustment unit 104 and the adjustment unit 106 may have a thickness H1. In the present invention, the thickness and / or height may be measured in the normal direction of the substrate 102 in the central region and may be a value at a single point or an average value of multiple points. In certain embodiments, the thickness and / or height may be measured as the maximum thickness or the maximum height. In some embodiments, the adjustment unit 104 has a first elastic coefficient K1, and the adjustment unit 106 has a second elastic coefficient K2, where the second elastic coefficient K2 is greater than the first elastic coefficient K1. Here, the elastic coefficient may be a spring constant, and its unit is Newton per meter (N / m). The elastic coefficient may also be Young's modulus, and its unit is Newton per square meter (N / m 2)。In this embodiment, the material of the adjustment unit 104 may be the same as that of the adjustment unit 106, but their densities may be different. In some embodiments, the density of the adjustment unit 106 may be greater than that of the adjustment unit 104, such that the elastic coefficient of the adjustment unit 106 is greater than that of the adjustment unit 104, but this is not limited thereto. In other embodiments, the materials of the adjustment unit 104 and the adjustment unit 106 may be different. For example, the adjustment unit 104 and the adjustment unit 106 may be formed of different types of photoresist, such that the adjustment unit 104 and the adjustment unit 106 may have different elastic coefficients, but this is not limited thereto. Other methods that can make the elastic coefficient of the adjustment unit 104 different from that of the adjustment unit 106 can also be used.

[0063] In some embodiments, a plurality of adjustment units 108 may be disposed on the first portion 10 and / or the second portion 20 of the first substrate 102. The material of the adjustment unit 108 includes photoresist or other suitable materials, and the present invention is not limited thereto. As Figure 3A shown, the adjustment unit 108 may have a thickness H2. In some embodiments, the adjustment unit 108 has a third elastic coefficient K3. The third elastic coefficient K3 may be greater than the second elastic coefficient K2. In some embodiments, at least one adjustment unit 108 may be disposed between the adjustment unit 104 and the adjustment unit 106. The adjustment unit 104 may be disposed between two adjacent adjustment units 108. The adjustment unit 106 may also be disposed between two adjacent adjustment units 108. As Figure 3A shown, there may be a thickness difference X1 between the adjustment unit 104 and the adjustment unit 108, and there may be a thickness difference X1 between the adjustment unit 106 and the adjustment unit 108.

[0064] In some embodiments, the adjustment unit 104, the adjustment unit 106, and the adjustment unit 108 have different sizes, such as having different areas or shapes of the upper surface, or different areas or shapes of the side surfaces.

[0065] Next, as Figure 3B shown, the second substrate 112 is disposed on the first substrate 102 such that the adjustment unit 104 and the adjustment unit 106 are compressed to form the electronic modulation device 100. As Figure 3B shown, the adjustment unit 104a, the adjustment unit 106a, and the adjustment unit 108 are disposed between the first substrate 102 and the second substrate 112. Moreover, the adjustment unit 104a, the adjustment unit 106a, and the adjustment unit 108 may generally have a thickness H2’, where the thickness H2’ may be less than or equal to H2. In certain embodiments, the electronic modulation device 100 may include a modulation material layer 110, and the modulation material layer 110 is disposed between the first substrate 102 and the second substrate 112. The material of the modulation material layer 110 may include liquid crystal or other suitable modulation materials.

[0066] It should be noted that the second substrate 112 may include multiple layers and various components disposed within and / or on the multiple layers, and for the sake of simplicity, it is only represented by one layer herein. In some embodiments, the second substrate 112 may include at least one flexible layer film, such that the second substrate 112 may have a concave-convex or inclined surface.

[0067] In some embodiments, the distance between the first substrate 102 and the second substrate 112 is substantially the same in different regions. For example, the distance between the first portion 10 of the first substrate 102 and the second substrate 112 is distance D1, and the distance between the second portion 20 of the first substrate 102 and the second substrate 112 is also distance D1. As Figure 3A 、 3B shown, there is a thickness difference X1 between the compressed adjustment unit 104a and the adjustment unit 104 before compression, and there is a thickness difference X1 between the compressed adjustment unit 106a and the adjustment unit 106 before compression. In this embodiment, the adjustment unit 108 is substantially not compressed. The compressed adjustment unit 104a and the adjustment unit 106a may individually have a first restoring force F1 and a second restoring force F2 (the restoring force may be, for example, an elastic force). The first restoring force F1 and the second restoring force F2 may satisfy Hooke's law, as represented by the following formula (1):

[0068] F = -KΔX Formula (1)

[0069] In Formula (1), K is the spring constant, ΔX is the compressed length or thickness, and the negative sign is because the restoring force may be opposite to the direction in which the adjustment unit is compressed or stretched.

[0070] In this embodiment, F1 = -K1X1, F2 = -K2X1. That is, the magnitude of the restoring force of the adjustment unit 104a may be substantially equal to K1X1, and the magnitude of the restoring force of the adjustment unit 106a may be substantially equal to K2X1. Since the compressed lengths of the adjustment unit 104a and the adjustment unit 106a are substantially equal, therefore, the magnitudes of the restoring forces of the adjustment unit 104a and the adjustment unit 106a may depend on the spring constants of the adjustment unit 104a and the adjustment unit 106a. Because the second elastic coefficient K2 of the adjustment unit 106a may be greater than the first elastic coefficient K1 of the adjustment unit 104a, the second restoring force F2 may be greater than the first restoring force F1. It should be noted that Figure 3B the illustrated second restoring force F2 and the first restoring force F1 are only schematic, and actually the directions of the restoring forces generated by the adjustment unit 104a and the adjustment unit 106a may not be limited to one direction only. In certain embodiments, the directions of the first restoring force F1 and the second restoring force F2 may be along the normal direction of the substrate 102. Additionally, since the compressed length of the adjustment unit 108 is substantially 0, the restoring force generated by the adjustment unit 108 is substantially 0.

[0071] Refer to Figure 4 , Figure 4 which is a cross-sectional schematic diagram of an electronic modulation device 100' according to some embodiments of the present invention. When the volume of the electronic modulation device 100 changes, it can become the electronic modulation device 100' as shown in Figure 4 . According to the above, the second restoring force F2 can be greater than the first restoring force F1. Therefore, the restoring force received by the second substrate 112 in the area corresponding to the second part 20 is greater than the restoring force received by the second substrate 112 in the area corresponding to the first part 10. As a result, the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the first part 10 can be the distance Z1 plus the thickness H2, and the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the second part 20 can be the distance Z2 plus the thickness H2. The distance Z1 plus the thickness H2 can be less than the distance Z2 plus the thickness H2. The distance Z1 can be less than the distance Z2. In other embodiments, at this time, the adjusting unit 104b has a thickness H3, and the adjusting unit 106b has a thickness H4. As shown in Figure 4 , the thickness H4 can be greater than the thickness H3. In this embodiment, the distance between the first part 10 of the first substrate 102 and the second substrate 112 is approximately the same as the thickness H3, and the distance between the second part 20 of the first substrate 102 and the second substrate 112 is approximately the same as the thickness H4.

[0072] In some cases, for example, when the electronic modulation device changes in volume due to heat, the second substrate 112 may be deformed, causing the distance between the first substrate 102 and the second substrate 112 to increase. As a result, it may cause the capacitance value in the electronic modulation device to change, affecting the performance of the electronic modulation device. In this embodiment, an adjusting unit 104 with a smaller elastic coefficient is provided in the first part 10 where the working device 540 is provided, and an adjusting unit 106 with a larger elastic coefficient is provided in the second part 20 where the working device 540 is not provided. As shown in Figure 4 , when the electronic modulation device changes in volume, for example, due to heat, the change in the distance between the first part 10 of the first substrate 102 and the second substrate 112 is smaller than the change in the distance between the second part 20 of the first substrate 102 and the second substrate 112. That is, the change in the spacing where the working device 540 is provided is smaller, which can make the working device 540 more stable under temperature change conditions, thereby improving the reliability of the electronic modulation device 100.

[0073] Various changes and adjustments can be made in the embodiments of the present invention. Refer to Figure 5A , 5B , Figure 5A , 5B which is a process flow chart of an electronic modulation device 200 according to some other embodiments of the present invention. Figure 5AThe structure shown can be the same as or similar to Figure 3A the structure shown, with one of the differences being that adjustment unit 104 is replaced by adjustment unit 204, and adjustment unit 106 is replaced by adjustment unit 206. In some embodiments, the materials of adjustment unit 204 and adjustment unit 206 can be substantially the same and can have substantially the same density. Thus, adjustment unit 204 and adjustment unit 206 can have substantially the same elastic coefficient. In some embodiments, adjustment unit 204 and adjustment unit 206 have a fourth elastic coefficient K4. As Figure 5A shown, adjustment unit 204 has a thickness H5, and adjustment unit 206 has a thickness H6, where thickness H6 can be greater than thickness H5. Additionally, adjustment unit 108 has a thickness X7 and can have a third elastic coefficient K3 greater than the fourth elastic coefficient K4. As Figure 5A shown, there is a thickness difference X3 between adjustment unit 204 and adjustment unit 108, and a thickness difference X4 between adjustment unit 206 and adjustment unit 108, and thickness difference X4 can be greater than thickness difference X3. In some embodiments, adjustment unit 204, adjustment unit 206, and adjustment unit 108 can have different sizes, such as having different areas or shapes of the upper surface, or different areas or shapes of the side surfaces.

[0074] Next, as Figure 5B shown, a modulation material layer 110 is filled on the first substrate 102, and a second substrate 112 is disposed on the first substrate 102 such that adjustment unit 204 and adjustment unit 206 are compressed to form an electronic modulation device 200. As Figure 5B shown, adjustment unit 204a, adjustment unit 206a, adjustment unit 108, and the modulation material layer 110 are disposed between the first substrate 102 and the second substrate 112. And adjustment unit 204a, adjustment unit 206a, adjustment unit 108 can generally have a thickness H7', where thickness H7' can be less than or equal to thickness H7.

[0075] In some embodiments, in the electronic modulation device 200, the distance between the first substrate 102 and the second substrate 112 is substantially the same in different regions. For example, the distance between the first part 10 of the first substrate 102 and the second substrate 112 is distance D2, and the distance between the second part 20 of the first substrate 102 and the second substrate 112 is also distance D2. As Figure 5A 、 5BAs shown, there is a thickness difference X3 between the compressed adjustment unit 204a and the adjustment unit 204 before compression, and there is a thickness difference X4 between the compressed adjustment unit 206a and the adjustment unit 206 before compression. The adjustment unit 108 may be substantially uncompressed. The compressed adjustment unit 204a and the adjustment unit 206a may individually have a third restoring force F3 and a fourth restoring force F4. The third restoring force F3 and the fourth restoring force F4 may satisfy Hooke's law. In this embodiment, F3 = -K4X3, F4 = -K4X4. That is, the magnitude of the restoring force of the adjustment unit 204a may be substantially equal to K4X3, and the magnitude of the restoring force of the adjustment unit 206a may be substantially equal to K4X4. Since the elastic coefficients of the adjustment unit 204a and the adjustment unit 206a may be substantially equal, the magnitudes of the restoring forces of the adjustment unit 204a and the adjustment unit 206a may depend on the compressed lengths of the adjustment unit 204a and the adjustment unit 206a. Since the thickness difference X4 may be greater than the thickness difference X3, the fourth restoring force F4 may be greater than the third restoring force F3. It should be noted that Figure 5B The illustrated fourth restoring force F4 and third restoring force F3 are only schematic. In fact, the directions of the restoring forces generated by the adjustment unit 204a and the adjustment unit 206a may not be limited to only one direction. In some embodiments, the directions of the third restoring force F3 and the fourth restoring force F4 may be along the normal direction of the substrate 102.

[0076] Refer to Figure 6 , Figure 6 is a cross-sectional schematic view of an electronic modulation device 200' according to some embodiments of the present invention. When the electronic modulation device 200 expands, it can become like Figure 6 shown in the electronic modulation device 200'. According to the above, the fourth restoring force F4 may be greater than the third restoring force F3. Therefore, the restoring force received by the second substrate 112 in the area corresponding to the second part 20 may be greater than the restoring force received by the second substrate 112 in the area corresponding to the first part 10. As a result, the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the first part 10 may be the distance Z3 plus the thickness H7, and the distance between the first substrate 102 and the second substrate 112 in the area corresponding to the second part 20 may be the distance Z4 plus the thickness H7. The sum of the distance Z3 plus the thickness H7 may be less than the sum of the distance Z4 plus the thickness H7. The distance Z3 may be less than the distance Z4. At this time, the adjustment unit 204b may have a thickness H8, and the adjustment unit 206b may have a thickness H9. As Figure 6 shown, the thickness H9 may be greater than the thickness H8. In this embodiment, the distance between the first part 10 of the first substrate 102 and the second substrate 112 may be substantially the same as the thickness H8, and the distance between the second part 20 of the first substrate 102 and the second substrate 112 may be substantially the same as the thickness H9, where the thickness H9 may be greater than the thickness H8.

[0077] The adjustment unit 204 and the adjustment unit 206 can be variously changed and adjusted in the embodiments of the present invention. Refer to Figure 7 , Figure 7 FIG. 5 is a cross-sectional schematic view of an electronic modulation device 300 according to some embodiments of the present invention. The electronic modulation device 300 is the same as or similar to the electronic modulation device 100. One of the differences is that the adjustment unit 104 is replaced by an adjustment unit 304, and the adjustment unit 106 is replaced by an adjustment unit 306. As Figure 7 shown, the adjustment unit 304 includes a plurality of spacers 308. The adjustment unit 306 includes a plurality of spacers 310. The materials of the spacer 308 and the spacer 310 can be individually the same as or similar to those of the adjustment unit 104 and the adjustment unit 106, and will not be elaborated here. In other embodiments, the material of the spacer 308 can be different from the material of the spacer 310. Figure 7 FIG. 9 shows that the adjustment unit 304 includes two spacers 308, and the adjustment unit 306 includes two spacers 310. In other embodiments, the adjustment unit 304 can include at least one spacer 308, and the adjustment unit 306 can include at least one spacer 310. The number of spacers 308 per unit area can also be different from the number of spacers 310 per unit area in the above. For example, the number of spacers 308 per unit area can also be greater than or less than the number of spacers 310 per unit area in the above. The unit area can be, for example, a rectangular area of 5 cm by 5 cm, a rectangular area of 3 cm by 3 cm, a rectangular area of 1 cm by 1 cm, or other appropriate areas, but not limited thereto. In this embodiment, the second substrate 112 is subjected to two first restoring forces F1 corresponding to the first part 10, and two second restoring forces F2 corresponding to the second part 20. Since the second restoring force F2 is greater than the first restoring force F1, when the volume of the electronic modulation device 300 changes due to heat, the distance change between the first part 10 of the first substrate 102 and the second substrate 112 will be less than the distance change between the second part 20 of the first substrate 102 and the second substrate 112.

[0078] In other embodiments, the adjustment unit 304 can include a plurality of spacers 308, and the elastic coefficients of the plurality of spacers 308 are respectively K n1 , K n2 , K n3 ……, and the compression amounts of the plurality of spacers 308 are respectively X n1 , X n2 , X n3 ……. The adjustment unit 306 includes a plurality of spacers 310, and the elastic coefficients of the plurality of spacers 310 are respectively K m1 , K m2 , K m3……, the compression amounts of the plurality of spacers 310 are X m1 , X m2 , X m3 ……. At least a part of the above compression amounts and elastic coefficients may be different. The number of spacers 308 may also be different from the number of spacers 310. The magnitude of the restoring force of the adjustment unit 304 may be approximately equal to K n1 X n1 +K n2 X n2 +K n3 X n3 +…, the magnitude of the restoring force of the adjustment unit 306 may be approximately equal to K m1 X m1 +K m2 X m2 +K m3 X m3 +… The magnitude of the restoring force of the adjustment unit 304 may be less than the magnitude of the restoring force of the adjustment unit 306.

[0079] Refer to Figure 8A and Figure 8B , Figure 8A is a schematic cross-sectional view of the first part 10 of the electronic modulation device 500 according to some embodiments of the present invention, Figure 8B is a schematic cross-sectional view of the second part 20 of the electronic modulation device 500 according to some embodiments of the present invention. Figure 8A , 8B The electronic modulation device 500 shown is only an example, and the present invention is not limited thereto. For the sake of simplicity of representation, Figure 8A , 8B some components are omitted. In some embodiments, Figure 8A , 8B some of the components shown may be omitted. The first part 10 shown in the electronic modulation device 500 may correspond to the first part 10 shown in the electronic modulation devices 100, 200, 300, and the second part 20 shown in the electronic modulation device 500 may correspond to the second part 20 shown in the electronic modulation devices 100, 200, 300.

[0080] Such as Figure 8A and Figure 8BAs shown, the electronic modulation device 500 may include a substrate 502. The substrate 502 is used to dispose the working device 540 or other components. The substrate 502 may be, for example, a glass substrate, a ceramic substrate, a polymer substrate, or any other suitable substrate. The electronic modulation device 500 may include an insulating layer 504 and a protective layer 506. The insulating layer 504 may be disposed on the substrate 502, and the protective layer 506 may be disposed on the insulating layer 504. The material of the insulating layer 504 may include silicon oxide, silicon nitride, or other suitable insulating materials, and is not limited thereto. The material of the protective layer 506 may include phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), low-k dielectric materials, or other suitable dielectric materials. The low-k dielectric materials may include fluorinated silica glass (FSG), carbon doped silicon oxide, amorphous fluorinated carbon, parylene, bis-benzocyclobutenes (BCB), polyimide, and is not limited thereto.

[0081] As Figure 8AAs shown, within the first portion 10, at least one working device 540 is formed on a substrate 502. The working device 540 may include a driving component 508, a first electrode 522, a second electrode 524, and a modulation material layer 526. In some embodiments, the driving component 508 may include a source electrode 510, a drain electrode 512, a gate electrode 514, and an active layer 516. The gate electrode 514 may include polysilicon, metal, or other conductive materials, and is not limited thereto. The above metals include copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), or titanium (Ti), and are not limited thereto. The active layer 516 may be disposed on an insulating layer 504. The material of the active layer 516 may include amorphous semiconductors, polycrystalline semiconductors, and / or metal oxides. The semiconductors may include germanium (Ge), silicon (Si), tin (Sn), antimony (Sb), selenium (Se), and / or tellurium (Te). The metal oxides may be, for example, indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium zinc tin oxide (IGZTO), and are not limited thereto. The source electrode 510 and the drain electrode 512 are disposed on the insulating layer 504 and are located on both sides of the gate electrode 514. In addition, portions of the source electrode 510 and the drain electrode 512 are disposed on the active layer 516. The materials of the source electrode 510 and the drain electrode 512 may include metals, such as copper (Cu), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), or titanium (Ti), and are not limited thereto. In addition, the active layer 516 may include a channel region 518, and the channel region 518 may be located between the source electrode 510 and the drain electrode 512. As Figure 8B shown, the working device 540 may not be disposed within the second portion 20.

[0082] Although Figure 8A it is shown that the gate electrode 514 is disposed under the insulating layer 504, various changes and adjustments can be made in the embodiments of the present invention. In some embodiments, the gate electrode 514 may be disposed on the active layer 516. The gate electrode 514 may also have two parts, where the first part is formed on the substrate 502 and the second part is formed on the protective layer 506, and the present invention is not limited thereto.

[0083] As Figure 8A shown, within the first portion 10, the electronic modulation device 500 may include a wire 520, a first electrode 522, a second electrode 524, and a modulation material layer 526. The materials of the wire 520, the first electrode 522, and the second electrode 524 may include metals, metal oxides, or other suitable conductive materials.

[0084] AsFigure 8A As shown, a modulation material layer 526 is disposed between a first electrode 522 and a second electrode 524. In some embodiments, the first electrode 522 and / or the second electrode 524 may be patterned to have a plurality of openings. The electric field between the first electrode 522 and the second electrode 524 can regulate the properties of the modulation material layer 526. In some embodiments, the first electrode 522 and / or the second electrode 524 do not extend to the second portion 20. In other embodiments, the first electrode 522 and / or the second electrode 524 may extend to the second portion 20.

[0085] In addition, the electronic modulation device 500 may include a display component layer 528 and / or a substrate 530. The display component layer 528 may be disposed on the second electrode 524. The display component layer 528 may include a light filtering layer, a light shielding layer, a protective layer, and / or other components, and is not limited thereto. The substrate 530 may be, for example, a glass substrate, a ceramic substrate, a plastic substrate, or any other suitable substrate. In some embodiments, the electronic modulation device 10 may include an electromagnetic component (not shown) for transmitting and / or receiving electromagnetic signals.

[0086] In some embodiments, in the first portion 10 of the electronic modulation device 500, the electronic modulation device 500 may include an adjustment unit 532 and an adjustment unit 534. As Figure 8A shown, the adjustment unit 532 and the adjustment unit 534 are disposed between the substrate 502 and the substrate 530. In the second portion 20 of the electronic modulation device 500, the electronic modulation device 500 may include an adjustment unit 534 and an adjustment unit 536. As Figure 8B shown, the adjustment unit 534 and the adjustment unit 536 are disposed between the substrate 502 and the substrate 530. In some embodiments, the adjustment unit 532, the adjustment unit 534, and the adjustment unit 536 may respectively correspond to, for example, Figure 3B the adjustment unit 104a, the adjustment unit 108, and the adjustment unit 106a. However, the present invention is not limited thereto.

[0087] According to certain embodiments of the present invention, an electronic modulation device may include a first adjustment unit having a first restoring force per unit area and a second adjustment unit having a second restoring force per unit area, wherein the first restoring force is greater than the second restoring force. The unit area may be, for example, a rectangular area of 5 cm by 5 cm, a rectangular area of 3 cm by 3 cm, a rectangular area of 1 cm by 1 cm, or other suitable areas, but not limited thereto. The first adjustment unit may be disposed on an area having a working device 540, and the second adjustment unit may be disposed on an area without the working device 540. When the volume of the electronic modulation device changes, the distance between the two substrates in the area with the larger restoring force changes more and / or faster. In this embodiment, the distance between the two substrates on the area having the working device 540 changes less and / or slower. Therefore, the stability of the electronic modulation device can be improved. In some embodiments, the restoring force of the adjustment unit may be adjusted by changing the elastic coefficient, material, number of spacers, compression length (thickness difference), density, other suitable parameters, or a combination thereof. Additionally, adjusting the elastic coefficient includes adjusting the spring coefficient or Young's modulus, and the present invention is not limited thereto. In the present invention, the above various properties may be measured before the electronic modulation device is assembled or after disassembling the electronic modulation device after assembly, but not limited thereto. The electronic modulation device of the present invention may include a display device, an antenna device, a vehicle-mounted electronic device, a touch device, a sensing device, other suitable devices, or a combination thereof.

[0088] Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that any person skilled in the art can make changes, substitutions, and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosure of some embodiments of the present invention. As long as they can perform substantially the same functions or achieve substantially the same results as those in the embodiments described herein, they can be used according to some embodiments of the present invention. Therefore, the protection scope of the present invention includes the above processes, machines, manufactures, compositions of matter, devices, methods, and steps. Additionally, each claim constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each claim and embodiment.

Claims

1. An electronic device, characterized in that, Comprising: A first substrate having a first portion and a second portion; A second substrate disposed opposite to the first substrate; At least one working device disposed between the first substrate and the second substrate, wherein the at least one working device overlaps with the first portion and does not overlap with the second portion, and wherein the at least one working device includes a driving component, a first electrode, a second electrode, and a modulation material layer, wherein the first electrode and / or the second electrode does not extend to the second portion; A first spacer disposed between the first portion of the first substrate and the second substrate and at least partially overlapping with the driving component, wherein the first spacer has a first thickness; A second spacer disposed between the second portion of the first substrate and the second substrate, wherein the second spacer has a second thickness; And A plurality of third spacers disposed between the first substrate and the second substrate, wherein at least one of the third spacers has a third thickness, wherein the first spacer is disposed between two of the third spacers, and at least one of the third spacers at least partially overlaps with the driving component in the at least one working device, wherein the first thickness is less than the second thickness, and the third thickness is less than the first thickness.

2. The electronic device according to claim 1, characterized in that, The driving component includes: A source electrode; A drain electrode; A gate electrode; and An active layer.

3. The electronic device according to claim 1, characterized in that, The modulation material layer includes liquid crystal.

4. The electronic device according to claim 1, characterized in that, The materials of the first electrode and the second electrode include metal oxides.

5. The electronic device according to claim 4, characterized in that, One of the first electrode and the second electrode has a plurality of openings.

6. The electronic device according to claim 1, characterized in that, Further comprising: A display component layer disposed on the at least one working device.

7. The electronic device according to claim 6, characterized in that, The display component layer includes at least one of a light filtering layer, a light shielding layer, and a protective layer.

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