Pressure-sensitive touch panel and its manufacturing method

Abstract

The present invention discloses a pressure-sensitive touch panel and its manufacturing method. The pressure-sensitive touch panel includes a protective component with a receiving cavity, a functional layer disposed within the receiving cavity and having an access area, a circuit layer disposed on the functional layer, a sensing layer disposed within the receiving cavity, a graphene conductive element disposed on the sensing layer, and conductive lines connecting the conductive circuit layer. The ends of the conductive lines extend out of the protective component. The circuit layer has a first conductive group and a second conductive group extending from both sides into the access area respectively and not in contact with each other. The graphene conductive element corresponds to the access area. At least a portion of the first conductive group and at least a portion of the second conductive group can be connected through the graphene conductive element. The graphene conductive element can deform when the pressure-sensitive touch panel is subjected to force to change the resistance, thereby adjusting the voltage of the portion of the first conductive group and the second conductive group that is connected to each other. This improves the impact resistance, touch sensitivity, and durability of the touch panel and avoids accidental touches.

Description

Technical Field

[0001] This invention relates to the field of touch panel technology, and more specifically, to a pressure touch panel and its manufacturing method. Background Technology

[0002] Touch panels have seen significant improvements in various aspects, including application areas, thinness, and touch sensitivity, due to the increasingly refined processing in the manufacturing industry and the increasingly diversified demands of electronic products. They occupy a very important position in the modernization of traditional products and the upgrading of modern products. For example, pressure touch panels are a product of various usage needs and improvements in processing technology.

[0003] Specifically, one type of pressure touch panel uses a method of attaching the touch film that generates the trigger response to other supporting elements. This method is prone to accidental touches when liquid is dripping on it, and it is also prone to wear and tear when exposed to the elements for a long time, which can even cause the buttons to malfunction.

[0004] Furthermore, the lack of protection makes the touch screen film less impact-resistant and easily damaged, resulting in poor product durability and poor sealing, allowing moisture to easily seep in, which is very troublesome. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a pressure touch panel that prevents accidental touch, is not easily worn, has high impact resistance and excellent sealing performance, and a method for manufacturing the same.

[0006] The technical solution adopted by this invention to solve its technical problem is:

[0007] On one hand, this application provides a pressure touch panel, which includes a protective component with a storage cavity, a functional layer disposed in the storage cavity and having an access area, a circuit layer disposed on the functional layer, a sensing layer disposed in the storage cavity, a graphene conductive element disposed on the sensing layer, and a conductive line connecting and conducting the circuit layer.

[0008] The end of the conductive line extends out of the protective component. The circuit layer has a first conductive group and a second conductive group that extend from both sides into the access area and do not contact each other. The graphene conductive element corresponds to the access area.

[0009] Wherein, at least a portion of the first conductive group and at least a portion of the second conductive group can be connected through the graphene conductive element, which can deform when the pressure touch panel is subjected to force to change the resistance, thereby adjusting the voltage of the portion of the first conductive group and the second conductive group that are connected to each other.

[0010] In some embodiments, the protective component includes an arc-shaped first plastic layer and an arc-shaped second plastic layer that overlaps the first plastic layer;

[0011] The first plastic layer and the second plastic layer together form the storage cavity;

[0012] The edge of the first plastic layer is bent to one side to form a first folded portion, and the edge of the second plastic layer is bent to one side to form a second folded portion, with the first folded portion and the second folded portion overlapping each other.

[0013] In some embodiments, the edge of the functional layer is bent to one side to form a fixed skirt, which is clamped between the first folded portion and the second folded portion.

[0014] In some embodiments, the first conductive group includes a plurality of first conductive stripes, the second conductive group includes a plurality of second conductive stripes, and the first conductive stripes and the second conductive stripes are sequentially and spaced apart within the access area;

[0015] The circuit layer further includes a first conductive trunk connected to each of the first conductive stripes and a second conductive trunk connected to each of the second conductive stripes; the first conductive trunk and the second conductive trunk are respectively connected to the conductive line.

[0016] At least one of the first conductive stripes and at least one of the second conductive stripes can be connected through the graphene conductive element.

[0017] In some embodiments, the thickness of the functional layer is 0.125 mm to 0.5 mm.

[0018] On the other hand, this application also provides a method for manufacturing a pressure-sensitive touch panel, which includes:

[0019] S1, Obtain the functional layer;

[0020] S2. According to the circuit layout of the circuit layer, a circuit layer is set on the functional layer to obtain a functional layer with a circuit layer.

[0021] S3, Obtain the sensing layer;

[0022] S4. A graphene conductive element is disposed at a predetermined position on the sensing layer to obtain a sensing layer with a graphene conductive element disposed thereon.

[0023] S5. The sensing layer with the graphene conductive element is bonded to the functional layer with the circuit layer so that the graphene conductive element is aligned with a predetermined part on the circuit layer, thereby obtaining the bonded functional layer and sensing layer.

[0024] S6. A protective component is provided on the outside of the bonded functional layer and sensing layer;

[0025] S7, obtain the pressure touch panel.

[0026] In some embodiments, step S5 includes:

[0027] S51. The sensing layer with the graphene conductive element is bonded to the functional layer with the circuit layer so that the graphene conductive element is aligned with a predetermined part on the circuit layer, thereby obtaining the bonded functional layer and sensing layer.

[0028] S52. Place the bonded functional layer and sensing layer on the molding mold in the molding equipment, so that the bonded functional layer and sensing layer are formed into a predetermined shape along the contour of the molding mold, thereby obtaining the molded functional layer and sensing layer.

[0029] In some embodiments, step S6 includes:

[0030] S61. Place the molded functional layer and sensing layer in an injection molding machine, and injection mold a first plastic layer on one side of the molded functional layer and sensing layer, and mold a second plastic layer on the other side of the molded functional layer and sensing layer.

[0031] S62. The first plastic layer and the second plastic layer are connected to form the protective component.

[0032] In some embodiments, step S5 further includes:

[0033] S53. Cut off and remove the excess parts on the formed functional layer and sensing layer.

[0034] In some embodiments, step S2 includes,

[0035] S21. Create a circuit screen printing stencil based on the circuit layer layout;

[0036] S22. The circuit screen printing stencil is placed on the functional layer, and conductive paste is coated on the circuit screen printing stencil. The conductive paste passes through the mesh of the circuit screen printing stencil and adheres to the functional layer, thereby obtaining a functional layer coated with conductive paste.

[0037] S23. The functional layer coated with conductive paste is dried to solidify the conductive paste into the circuit layer, thereby obtaining a functional layer with a circuit layer.

[0038] The pressure-sensitive touch panel and its manufacturing method of the present invention have at least the following beneficial effects:

[0039] The pressure touch panel and its manufacturing method of the present invention, through the setting of protective components, achieve all-round protection for the functional layer, circuit layer, sensing layer and graphene conductive component, improve the sealing performance of the pressure touch panel, avoid failure due to impact force, and improve the impact resistance of the touch panel; at the same time, liquid dripping onto the panel surface cannot cause bending of the protective components and cannot directly contact the circuit layer, avoiding accidental touch; secondly, by deforming and changing the resistance of the graphene conductive component, thereby changing the voltage on the conductive line, it is possible to respond sensitively to touch operation even if the functional layer, circuit layer, sensing layer and graphene conductive component are not exposed, improving touch sensitivity, and also avoiding wear and tear on the functional layer or circuit layer due to exposure, thus preventing wear failure. Attached Figure Description

[0040] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0041] Figure 1 This is a schematic diagram of the structure of a pressure-sensitive touch panel in a preferred embodiment of the present invention;

[0042] Figure 2 yes Figure 1 An exploded view of the pressure-sensitive touch panel shown.

[0043] Figure 3 This is a schematic diagram of the functional layer and circuit layer in a preferred embodiment of the present invention;

[0044] Figure 4 This is a flowchart of the manufacturing method of a pressure-sensitive touch panel in a preferred embodiment of the present invention;

[0045] Figure 5 yes Figure 4 Flowchart of step S2 in the manufacturing method of medium pressure touch panel;

[0046] Figure 6 yes Figure 4 The flowchart of step S5 in the manufacturing method of medium pressure touch panel. Detailed Implementation

[0047] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0048] Figure 1 and Figure 2 A pressure-sensitive touch panel 1 is shown in some embodiments of the present invention. This pressure-sensitive touch panel 1 can be connected to a controller, and during touch operation, it outputs different electrical signals. For example... Figures 1 to 3As shown, the pressure touch panel 1 includes a protective component 10, a functional layer 20, a circuit layer 30, a sensing layer 40, a graphene conductive element 50, and a conductive line 60. The protective component 10 has a receiving cavity 11, the functional layer 20 and the sensing layer 40 are respectively disposed in the receiving cavity 11, the circuit layer 30 is disposed on the functional layer 20, the graphene conductive element 50 is disposed on the sensing layer 40, and the conductive line 60 is connected to the circuit layer 30.

[0049] Understandably, the protective component 10 serves to seal and resist impact; the functional layer 20 serves to fix and support the circuit layer 30; the circuit layer 30 serves to transmit current; the sensing layer 40 serves to support and fix the graphene conductive element 50, and it can drive the graphene conductive element 50 to deform together; the graphene conductive element 50 is used to change its own resistance during the deformation process, thereby adjusting the voltage magnitude of the current conducted through the graphene conductive element 50; the conductive line 60 is used to connect the circuit layer 30 to the external controller.

[0050] like Figures 1 to 3 As shown, the functional layer 20 is provided with an access area 21, the end of the conductive line 60 extends out of the protective component 10, the circuit layer 30 has a first conductive group 31 and a second conductive group 32 that extend from both sides into the access area 21 and do not contact each other, and the graphene conductive element 50 corresponds to the access area 21.

[0051] At least a portion of the first conductive group 31 and at least a portion of the second conductive group 32 can be connected by a graphene conductive element 50. The graphene conductive element 50 can deform when the pressure touch panel 1 is subjected to force to change the resistance, thereby adjusting the voltage of the portion of the first conductive group 31 and the second conductive group 32 that are connected to each other.

[0052] Understandably, when the pressure touch panel 1 is operated, the protective component 10 is subjected to force, causing the sensing layer 40 to deform. The graphene conductive element 50 changes its resistance after being deformed by the sensing layer 40, thereby changing the voltage on the first conductive group 31 and the second conductive group 32 connected through the graphene conductive element 50. This, in turn, changes the electrical signal output by the circuit layer 30 through the conductive line 60. The external controller controls the corresponding components to work according to the change in the electrical signal.

[0053] It can also be understood that a single access area 21 can correspond to a single operation position on the touch panel, and multiple operation positions require multiple access areas 21. Therefore, the number of access areas 21 can be multiple, and the number of graphene conductive elements 50 can also be set to multiple. Each graphene conductive element 50 corresponds one-to-one with each access area 21, which also means that the circuit layer 30 extends into each access area 21 from opposite sides. Of course, each access area 21 is provided with a first conductive group 31 and a second conductive group 32 that are not connected to each other. Each first conductive group 31 can be connected in a centralized manner as a ground, or each second conductive group 32 can be connected in a centralized manner as a ground terminal. When the user operates one of the touch positions, the first conductive group 31 and the second conductive group 32 in the corresponding access area 21 are turned on and generate a corresponding electrical signal change. The external controller can respond according to the electrical signal change.

[0054] It should be noted that the graphene conductive element 50 and the first conductive group 31 and the second conductive group 32 located in the access area 21 can be in contact, not in contact, or partially in contact. After the pressure touch panel is manufactured, the current state of the pressure touch panel 1 needs to be calibrated at the origin. The parameters exhibited by the pressure touch panel 1 after being connected to a current of a predetermined voltage are taken as the initial values. After the touch panel is assembled onto the corresponding components, the origin can be taken as the initial value. Subsequent changes in electrical signals caused by touch only need to eliminate the influence of the initial value.

[0055] It should also be noted that the first conductive group 31 and the second conductive group 32 are not in contact with each other, meaning they cannot be directly energized. They require other intermediate components to simultaneously contact each other to establish electrical conductivity. The graphene conductive element 50 can be in the form of a thin sheet to make it lighter and facilitate better adhesion to the sensing layer 40. The functional layer 20 can be a film material made from at least one of PC, ABS, PET, and PMMA, or a composite film material made from both PMMA and PC, as is currently available. Graphite pressure-sensitive film material, as is currently available, can be used as the sensing layer 40. The outline of the graphene conductive element 50 can be similar to that of the access area 21, and the central axis of the graphene conductive element 50 can be aligned with the central axis of the access area 21 to ensure that each touch position affects the resistance change of the graphene conductive element 50, generating a corresponding electrical signal change.

[0056] like Figures 1 to 3As shown, in some embodiments, the protective component 10 may include an arc-shaped first plastic layer 12 and an arc-shaped second plastic layer 13 that overlaps the first plastic layer 12; the first plastic layer 12 and the second plastic layer 13 together form a receiving cavity 11. The edge of the first plastic layer 12 is bent to one side to form a first folded portion, and the edge of the second plastic layer 13 is bent to one side to form a second folded portion, with the first folded portion and the second folded portion overlapping each other.

[0057] Understandably, the curved shape has a larger deformation range compared to a flat shape, thus increasing the deformation limit range; the curved shape also has better self-resetting performance, improving durability. The first plastic layer 12 and the second plastic layer 13 are used to cover the functional layer 20, circuit layer 30, sensing layer 40 and graphene conductive element 50 from opposite sides, respectively, providing comprehensive protection and preventing the penetration of contaminants.

[0058] It is also understandable that the connection between the first folding portion and the first plastic layer 12 can be set as a rounded corner structure, and the connection between the second folding portion and the second plastic layer 13 can also be set as a rounded corner structure, thereby avoiding stress concentration at the corners. The first folding portion and the second folding portion overlap each other, eliminating the gap between them, further preventing contaminants from penetrating between them, and improving protection.

[0059] like Figures 1 to 3 As shown, in some embodiments of the pressure touch panel 1, the edge of the functional layer 20 is bent to one side to form a fixed skirt 22, which is clamped between the first folded portion and the second folded portion.

[0060] Understandably, the fixing skirt 22 is used to fix the functional layer 20. Specifically, the fixing skirt 22 is fixed by the first folding part and the second folding part clamping it together. With the fixing skirt 22 fixed, the position of the functional layer 20 is further determined. In this way, misalignment between the functional layer 20 and the sensing layer 40 is avoided, and the predetermined position on the circuit layer 30 is aligned with the corresponding graphene conductive element 50. This prevents the pressure touch panel 1 from failing and avoids misalignment between the two when they collide with the touch panel, thus improving the durability of the product.

[0061] It is also understandable that the fixed skirt 22 can be part of the base film material of the functional layer 20. The fixed skirt 22 is formed by bending a part of the base film material through subsequent vacuum forming or high pressure forming.

[0062] like Figure 3As shown, in some embodiments of the pressure touch panel 1, the first conductive group 31 includes a plurality of first conductive stripes 311, and the second conductive group 32 includes a plurality of second conductive stripes 321. The first conductive stripes 311 and the second conductive stripes 321 are sequentially and spaced apart in the access area 21.

[0063] The circuit layer 30 also has a first conductive trunk 312 that is connected to each of the first conductive stripes 311 and a second conductive trunk 322 that is connected to each of the second conductive stripes 321; the first conductive trunk 312 and the second conductive trunk 322 are connected to the conductive line 60.

[0064] At least one first conductive stripe 311 and at least one second conductive stripe 321 can be conductive through the graphene conductive element 50.

[0065] Understandably, there is a gap between the first conductive stripe 311 and the second conductive stripe 321. Each first conductive stripe 311 is connected to the first conductive trunk 312 and each second conductive stripe 321 is connected to the second conductive trunk 322. One of the first conductive trunk 312 and the second conductive trunk 322 is grounded, and the other is connected to a rated voltage.

[0066] It is also understandable that when there are multiple access areas 21, the one of the first conducting trunk 312 and the second conducting trunk 322 used for grounding can be connected to the grounding conducting part in each access area 21 respectively; the one of the first conducting trunk 312 and the second conducting trunk 322 used for current access can be set to be connected to the current access part in each access area 21 simultaneously, or it can be set to multiple, so as to be connected to the current access part in each access area 21 in a one-to-one correspondence.

[0067] Specifically, one of the first conducting trunk and the second conducting trunk is connected to ground via a conductive line, and the other of the first conducting trunk and the second conducting trunk is connected to voltage via a conductive line.

[0068] like Figure 1 and Figure 2 As shown, in some embodiments of the pressure touch panel 1, the thickness of the functional layer 20 is 0.125 mm to 0.5 mm.

[0069] Understandably, setting the thickness of the functional layer 20 to 0.125 mm to 0.5 mm can maximize the strength of the functional layer 20 while ensuring thinness.

[0070] like Figure 4 As shown, the manufacturing method of the pressure touch panel 1 includes:

[0071] S1, Obtain functional layer 20;

[0072] Understandably, it can be made from one of the following materials: PC, ABS, PET, PMMA, etc., or it can be made from a composite of PMMA and PC materials. Specifically, the raw materials are fed into the membrane manufacturing equipment to make a membrane of a predetermined thickness, thereby obtaining the base membrane of the functional layer 20.

[0073] S2. According to the circuit layout of the circuit layer 30, the circuit layer 30 is set on the functional layer 20 to obtain the functional layer 20 with the circuit layer 30 set.

[0074] Understandably, different circuit structures, different product types, and different standard specifications may have different circuit layouts, and different circuit layouts correspond to different line layouts. The corresponding circuit layer 30 is set according to the line layout so that the circuit layer 30 can form a predetermined circuit structure and realize the corresponding function.

[0075] S3, Obtain the sensing layer 40;

[0076] Understandably, the sensing layer 40 can also be a membrane material made by membrane manufacturing equipment, which serves as the base membrane material of the sensing layer 40 to support and fix the predetermined components.

[0077] S4. A graphene conductive element 50 is disposed at a predetermined position on the sensing layer 40 to obtain a sensing layer 40 with the graphene conductive element 50 disposed thereon.

[0078] Understandably, the graphene conductive element 50 can be sheet-like, capable of conducting electricity, and its resistance can change when deformed. The graphene conductive element 50 can be disposed on the substrate film of the sensing layer 40 by means of adhesion or other methods in the prior art, thereby obtaining a sensing layer 40 with the graphene conductive element 50 disposed thereon.

[0079] S5. The sensing layer 40 with graphene conductive element 50 is bonded to the functional layer 20 with circuit layer 30 so that the graphene conductive element 50 is aligned with a predetermined part on the circuit layer 30, and the bonded functional layer 20 and sensing layer 40 are obtained.

[0080] Understandably, before bonding the sensing layer 40 with the graphene conductive element 50 to the functional layer 20 with the circuit layer 30, alignment marks or alignment holes can be pre-set on the sensing layer 40 and the functional layer 20 to ensure accurate alignment of the sensing layer 40 and the functional layer 20. This allows the graphene conductive element 50 to be aligned with a predetermined position on the circuit layer 30, that is, the graphene conductive element 50 is conductively connected to the predetermined position of the circuit structure. This ensures that each position in the access area 21 corresponds to the graphene conductive element 50, avoiding the situation where some positions in the access area 21 cannot abut against the graphene conductive element 50 and thus cannot be triggered, thereby improving assembly accuracy.

[0081] S6. A protective component 10 is provided on the outside of the bonded functional layer 20 and sensing layer 40;

[0082] Understandably, the protective component 10 is used to fully cover the functional layer 20 and the sensing layer 40 to provide comprehensive protection for the product; the shape and contour of the protective component 10 can be flexibly set, for example, it can be set as a flat plate, a curved surface, or an irregular shape.

[0083] S7. Obtain pressure touch panel 1.

[0084] Understandably, the pressure touch panel 1 can be obtained after the above steps. Before leaving the factory, the pressure touch panel 1 can also be functionally tested to ensure that the touch function can work properly. It can also be visually inspected to ensure that the product's appearance is intact and undamaged, and to ensure the product's protection and surface flatness.

[0085] like Figure 5 As shown, step S2 may include, in some embodiments,

[0086] S21. Create a circuit screen printing stencil based on the circuit layout of circuit layer 30;

[0087] Understandably, a circuit screen printing stencil can be configured to be mounted on a screen printing device to print paste onto a predetermined surface by screen printing; the screen of the screen printing stencil has a number of screen printing holes for the paste to pass through, and the opening position of the screen printing holes corresponds to the arrangement position of the circuit in the circuit layout.

[0088] It should be noted that the paste used to form the circuit in step S21 is a conductive paste, or other pastes in the prior art that can be solidified into conductive lines.

[0089] S22. The circuit screen printing stencil is placed on the functional layer 20, and the conductive paste is coated on the circuit screen printing stencil. The conductive paste passes through the mesh on the circuit screen printing stencil and adheres to the functional layer 20, thus obtaining the functional layer 20 coated with conductive paste.

[0090] Understandably, after the circuit screen printing stencil is attached to the substrate film of the functional layer 20, the screen printing squeegee scrapes across one side of the screen printing stencil, allowing the paste on that side to pass through the through holes on the screen printing stencil and adhere to the substrate film of the functional layer 20. The paste forms a layout pattern on the substrate film of the functional layer 20 that is the same as the circuit layout.

[0091] S23. The functional layer 20 coated with conductive paste is dried so that the conductive paste is cured into a circuit layer 30, thereby obtaining a functional layer 20 with circuit layer 30.

[0092] Understandably, the conductive paste will be dried and then solidified, forming a circuit layer 30 that corresponds to the circuit layout.

[0093] Furthermore, in some embodiments, step S2 may also include:

[0094] S24. Inspect the functional layer 20 with the circuit layer 30, check whether the conductivity of the cured circuit layer 30 can work normally, and check whether the circuit layer 30 has any processing defects such as cracks.

[0095] like Figure 6 As shown, step S5 may include in some embodiments:

[0096] S51. The sensing layer 40 with graphene conductive element 50 is bonded to the functional layer 20 with circuit layer 30 so that the graphene conductive element 50 is aligned with a predetermined part on the circuit layer 30, and the bonded functional layer 20 and sensing layer 40 are obtained.

[0097] Understandably, after the sensing layer 40 with graphene conductive element 50 and the functional layer 20 with circuit layer 30 are aligned and bonded, the graphene conductive element 50 will be aligned with a predetermined position on the circuit layer 30; the touch area corresponding to the circuit layer 30 corresponds to the graphene conductive element 50.

[0098] It is also understandable that after bonding, the circuit layer 30 can be connected to the test equipment, and then the touch operation can be tested to see if it can be performed normally. Specifically, it is to see if the circuit layer 30 can be made conductive through the graphene conductor 50 under touch operation, and whether the graphene conductor 50 can be deformed by force to change the resistance.

[0099] S52. Place the bonded functional layer 20 and sensing layer 40 on the molding die in the molding equipment, so that the bonded functional layer 20 and sensing layer 40 are formed into a predetermined shape along the contour of the molding die, and the molded functional layer 20 and sensing layer 40 are obtained.

[0100] Understandably, before placing them on the molding die, a positioning structure corresponding to the molding die can be set on the bonded functional layer 20 and sensing layer 40. The positioning structure is used to align the bonded functional layer 20 and sensing layer 40 with the predetermined position on the molding die, thereby improving molding accuracy and preventing bending of positions that should not be bent, which could lead to product failure.

[0101] It should be noted that the positioning structure on the bonded functional layer 20 and sensing layer 40 can be positioning holes, which correspond to positioning protrusions on the molding die. The molding die can be a vacuum forming die. During processing, the bonded functional layer 20 and sensing layer 40 will gradually conform to the surface contour of the molding die, deforming into a predetermined shape. Of course, the molding die can also be installed on other equipment in the prior art capable of deforming the film material, as long as the bonded functional layer 20 and sensing layer 40 can deform and conform to the molding die.

[0102] like Figure 6 As shown, step S5 may further include in some embodiments:

[0103] S53. Cut off and remove the excess parts on the formed functional layer 20 and sensing layer 40.

[0104] Understandably, excess scraps on the formed functional layer 20 and sensing layer 40 can be cut off to ensure that the size and specifications of the product meet the predetermined standards and can be sent to subsequent processing and production steps.

[0105] like Figure 4 As shown, step S6 may include in some embodiments:

[0106] S61. Place the molded functional layer 20 and sensing layer 40 in an injection molding machine, and mold the first plastic layer 12 on one side of the molded functional layer 20 and sensing layer 40, and mold the second plastic layer 13 on the other side of the molded functional layer 20 and sensing layer 40.

[0107] Understandably, the molded functional layer 20 and sensing layer 40 are placed in the injection mold of the injection molding equipment. After the injection molding equipment closes the mold and injects, the rubber material comes into contact with the functional layer 20 and sensing layer 40. After the rubber material cools down, the first plastic layer 12 and the second plastic layer 13 are formed.

[0108] It should be noted that the first plastic layer 12 and the second plastic layer 13 can be formed using only one injection mold. During the injection process, the plastic material flows to both sides of the functional layer 20 and the sensing layer 40, forming the first plastic layer 12 and the second plastic layer 13 in sequence.

[0109] Alternatively, the first plastic layer 12 and the second plastic layer 13 can be formed using two sets of injection molds respectively. After the functional layer 20 and the sensing layer 40 are placed in the first mold to complete the injection molding of the first plastic layer 12, they are removed and placed in the second mold to complete the injection molding of the second plastic layer 13.

[0110] S62, the first plastic layer 12 and the second plastic layer 13 are connected to form the protective component 10.

[0111] Understandably, the second injection molding compound will come into contact with the first plastic layer 12 formed in the first injection molding. In this way, the first plastic layer 12 and the second plastic layer 13 are connected to each other to form the protective component 10. The second injection molding compound, while covering the functional layer 20 and the sensing layer 40, also comes into contact with the first plastic layer 12, which can effectively eliminate the gap between the first plastic layer 12 and the second plastic layer 13, and improve the sealing and protective properties of the product.

[0112] In addition to the above, the conductive line 60 is connected to the circuit layer 30 by means of welding or other methods. Specifically, the conductive line 60 can be welded before the functional layer 20 and the sensing layer 40 are combined. After the functional layer 20 and the sensing layer 40 are combined, they can be connected to external testing equipment through the conductive line 60 for functional testing. During the injection molding process, corresponding receiving grooves can be opened on the mold to prevent the adhesive from completely covering the conductive line 60. The partial coverage of the conductive line 60 by the adhesive can, on the one hand, fix the connection between the conductive line 60 and the circuit layer 30, preventing them from breaking; on the other hand, it can also ensure the freedom of the conductive line 60, making it convenient to connect the pressure touch panel 1 to external electronic control components.

[0113] The pressure-sensitive touch panel and its manufacturing method of the present invention have at least the following beneficial effects:

[0114] The pressure touch panel and its manufacturing method of the present invention, through the setting of protective components, achieve all-round protection for the functional layer, circuit layer, sensing layer and graphene conductive component, improve the sealing performance of the pressure touch panel, avoid failure due to impact force, and improve the impact resistance of the touch panel; at the same time, liquid dripping onto the panel surface cannot cause bending of the protective components and cannot directly contact the circuit layer, avoiding accidental touch; secondly, by deforming and changing the resistance of the graphene conductive component, thereby changing the voltage on the conductive line, it is possible to respond sensitively to touch operation even if the functional layer, circuit layer, sensing layer and graphene conductive component are not exposed, improving touch sensitivity, and also avoiding wear and tear on the functional layer or circuit layer due to exposure, thus preventing wear failure.

[0115] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They do not limit the scope of protection of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A pressure-sensitive touch panel, characterized in that, It includes a protective component with a storage cavity, a functional layer disposed in the storage cavity and having an access area, a circuit layer disposed on the functional layer, a sensing layer disposed in the storage cavity, a graphene conductive element disposed on the sensing layer, and a conductive line connecting and conducting the circuit layer. The end of the conductive line extends out of the protective component. The circuit layer has a first conductive group and a second conductive group that extend from both sides into the access area and do not contact each other. The graphene conductive element corresponds to the access area. Wherein, at least a portion of the first conductive group and at least a portion of the second conductive group can be connected through the graphene conductive element, which can deform when the pressure touch panel is subjected to force to change the resistance, thereby adjusting the voltage of the portion of the first conductive group and the second conductive group that are connected to each other; The first conductive group includes a plurality of first conductive stripes, and the second conductive group includes a plurality of second conductive stripes, wherein the first conductive stripes and the second conductive stripes are sequentially and spaced apart within the access area; The circuit layer further includes a first conductive trunk connected to each of the first conductive stripes and a second conductive trunk connected to each of the second conductive stripes; the first conductive trunk and the second conductive trunk are respectively connected to the conductive line. At least one of the first conductive stripes and at least one of the second conductive stripes can be connected through the graphene conductive element; The outline of the graphene conductive element is similar to that of the access area, and the central axis of the graphene conductive element coincides with the central axis of the access area.

2. The pressure-sensitive touch panel according to claim 1, characterized in that, The protective component includes an arc-shaped first plastic layer and an arc-shaped second plastic layer that overlaps the first plastic layer. The first plastic layer and the second plastic layer together form the storage cavity; The edge of the first plastic layer is bent to one side to form a first folded portion, and the edge of the second plastic layer is bent to one side to form a second folded portion, with the first folded portion and the second folded portion overlapping each other.

3. The pressure-sensitive touch panel according to claim 2, characterized in that, The edge of the functional layer bends to one side to form a fixed skirt, which is clamped between the first folded portion and the second folded portion.

4. The pressure-sensitive touch panel according to claim 1, characterized in that, The thickness of the functional layer is 0.125 mm to 0.5 mm.

5. A method for manufacturing a pressure-sensitive touch panel, the method being applied to the pressure-sensitive touch panel as described in any one of claims 1 to 4, characterized in that, include: S1, Obtain the functional layer; S2. According to the circuit layout of the circuit layer, a circuit layer is set on the functional layer to obtain a functional layer with a circuit layer. S3, Obtain the sensing layer; S4. A graphene conductive element is disposed at a predetermined position on the sensing layer to obtain a sensing layer with a graphene conductive element disposed thereon. S5. The sensing layer with the graphene conductive element is bonded to the functional layer with the circuit layer so that the graphene conductive element is aligned with a predetermined part on the circuit layer, thereby obtaining the bonded functional layer and sensing layer. S6. A protective component is provided on the outside of the bonded functional layer and sensing layer; S7, obtain the pressure touch panel.

6. The method for manufacturing a pressure-sensitive touch panel according to claim 5, characterized in that, Step S5 includes: S51. The sensing layer with the graphene conductive element is bonded to the functional layer with the circuit layer so that the graphene conductive element is aligned with a predetermined part on the circuit layer, thereby obtaining the bonded functional layer and sensing layer. S52. Place the bonded functional layer and sensing layer on the molding mold in the molding equipment, so that the bonded functional layer and sensing layer are formed into a predetermined shape along the contour of the molding mold, thereby obtaining the molded functional layer and sensing layer.

7. The method for manufacturing a pressure-sensitive touch panel according to claim 6, characterized in that, Step S6 includes: S61. Place the molded functional layer and sensing layer in an injection molding machine, and injection mold a first plastic layer on one side of the molded functional layer and sensing layer, and mold a second plastic layer on the other side of the molded functional layer and sensing layer. S62. The first plastic layer and the second plastic layer are connected to form the protective component.

8. The method for manufacturing a pressure-sensitive touch panel according to claim 6, characterized in that, Step S5 further includes: S53. Cut off and remove the excess parts on the formed functional layer and sensing layer.

9. The method for manufacturing a pressure-sensitive touch panel according to claim 5, characterized in that, Step S2 includes, S21. Create a circuit screen printing stencil based on the circuit layer layout; S22. The circuit screen printing stencil is placed on the functional layer, and conductive paste is coated on the circuit screen printing stencil. The conductive paste passes through the mesh of the circuit screen printing stencil and adheres to the functional layer, thereby obtaining a functional layer coated with conductive paste. S23. The functional layer coated with conductive paste is dried to solidify the conductive paste into the circuit layer, thereby obtaining a functional layer with a circuit layer.

Images