Upper electrode assembly and semiconductor process chamber

Abstract

The present invention discloses an upper electrode assembly and a semiconductor process chamber, wherein the upper electrode assembly includes a cover plate, a nozzle, a position detection mechanism, and an adjustment mechanism; the cover plate is provided with a mounting hole, and the nozzle is disposed in the mounting hole; the position detection mechanism is disposed on the cover plate, and is used to detect the radial position of the nozzle in the mounting hole; the adjustment mechanism is disposed on the cover plate, and is used to adjust the radial position of the nozzle in the mounting hole; when the position detection mechanism detects that the radial position of the nozzle in the mounting hole is offset, the adjustment mechanism can adjust the radial position of the nozzle in the mounting hole to correct the radial position of the nozzle in the mounting hole. The above solution can solve the problem of poor process performance of semiconductor process chambers.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chips, and in particular to an upper electrode assembly and a semiconductor process chamber. Background Art

[0002] In dry etching, after photoresist etching, reactive polymers will be left on the sidewalls of the pattern. Reactive polymers are prone to corroding the wafer, thereby reducing wafer performance. Therefore, it is necessary to remove the photoresist remaining on the wafer.

[0003] In the related art, a semiconductor process chamber for removing photoresist remaining on a wafer includes a chamber body and an upper electrode assembly. The upper electrode assembly is arranged on the top of the chamber body. The upper electrode assembly and the chamber body together form a reaction chamber. A mounting hole is provided on the upper electrode assembly. The nozzle is arranged in the mounting hole. The nozzle is connected to the reaction chamber, and the process gas is injected into the reaction chamber through the nozzle.

[0004] In the related art, the semiconductor process chamber needs to be opened for maintenance after working for a period of time. Figure 1 As shown, when the semiconductor process chamber is opened, the upper electrode assembly needs to be flipped 90 degrees relative to the chamber body to expose the components in the reaction chamber, thereby facilitating maintenance operations for operators.

[0005] However, during the flipping process of the upper electrode assembly, the radial mounting position of the nozzle is easily offset. This nozzle offset causes the nozzle to tilt toward one side of the reaction chamber, which can easily affect the process uniformity of the wafer and thus lead to poor process performance of the semiconductor process chamber. Summary of the Invention

[0006] The invention discloses an upper electrode assembly and a semiconductor process chamber, which are used to solve the problem of poor process performance of the semiconductor process chamber.

[0007] In order to solve the above problems, the present invention adopts the following technical solutions:

[0008] An upper electrode assembly, used in a semiconductor process chamber, comprising:

[0009] A cover plate and a nozzle, wherein the cover plate is provided with a mounting hole, and the nozzle is arranged in the mounting hole;

[0010] a position detection mechanism, the position detection mechanism being disposed on the cover plate and being used to detect the radial position of the nozzle in the mounting hole;

[0011] an adjusting mechanism, the adjusting mechanism being provided on the cover plate and being used for adjusting the radial position of the nozzle in the mounting hole;

[0012] When the position detection mechanism detects that the radial position of the nozzle in the mounting hole is offset, the adjustment mechanism may adjust the radial position of the nozzle in the mounting hole to correct the radial position of the nozzle in the mounting hole.

[0013] A semiconductor process chamber comprises a chamber body and the above-mentioned upper electrode assembly, wherein the chamber body and the upper electrode assembly form a reaction chamber, the cover plate is arranged on the top of the chamber body, the cover plate is hinged to the chamber body, and the nozzle is connected to the reaction chamber.

[0014] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0015] In the upper electrode assembly disclosed herein, the position detection mechanism detects the radial position within the nozzle mounting hole, allowing the operator to promptly detect nozzle deflection. Simultaneously, the operator can adjust the radial position of the nozzle within the mounting hole using the adjustment mechanism. This allows the operator to promptly detect nozzle deviation and make timely corrections, thereby improving the process performance of the semiconductor process chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 A schematic diagram of the structure of a semiconductor process chamber when opening a cavity in the related art;

[0018] Figure 2 A schematic diagram of a portion of the structure of an upper electrode assembly of a semiconductor process chamber in the related art;

[0019] Figure 3 A schematic structural diagram of a semiconductor process chamber disclosed in an embodiment of the present invention;

[0020] Figures 4 to 11 A schematic structural diagram of some components of the upper electrode assembly disclosed in an embodiment of the present invention;

[0021] Figure 12 A circuit diagram of a position detection mechanism for an upper electrode assembly disclosed in an embodiment of the present invention;

[0022] Figure 13 This is a schematic diagram of a position detection mechanism for an upper electrode assembly disclosed in an embodiment of the present invention.

[0023] Description of reference numerals:

[0024] 100-upper electrode assembly, 110-cover plate, 111-plate body, 112-mounting bracket, 112a-first mounting portion, 112a1-avoidance notch, 112a2-assembly process hole, 112b-second mounting portion, 113-threading channel, 1131-first channel, 1132-second channel, 1121-slide groove, 1121a-first limit portion, 120-nozzle, 130-position detection mechanism, 131-alarm, 132-detection component, 1321-fixing portion, 1322- Detection body, 1323-wire, 140-adjustment mechanism, 141-adjustment slider, 1411-guide slope, 1412-second limit part, 142-drive member, 1421-threaded connection, 1422-guide block, 150-protective cover, 160-upper electrode housing, 170-microwave source device, 200-chamber body, 210-support base, 310-first position, 320-second position, 330-third position, 340-fourth position, lower computer-400, X-offset data. DETAILED DESCRIPTION

[0025] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] In related technologies, such as Figure 1 As shown, a semiconductor process chamber may need to be opened for maintenance after a period of operation. For example, the semiconductor process chamber may be used for a stripper. When opening the semiconductor process chamber, the upper electrode assembly must be flipped 90° relative to the chamber body to expose the components within the reaction chamber, making it easier for operators to perform maintenance operations.

[0027] However, each cavity opening maintenance easily causes the position of the nozzle 11 in the mounting hole to change, so each cavity opening operation has the risk of causing the nozzle 11 to deviate. Figure 2As shown, the seal 12 presses the nozzle 11. During the maintenance process of the chamber, the nozzle 11 will be squeezed by the seal 12 due to its gravity. Due to the aging of the seal 12, the elasticity of the seal 12 decreases, so it cannot rebound to correct the nozzle 11, causing the nozzle 11 to tilt toward one side of the reaction chamber. The inventor analyzed the degumming rate of each area of ​​the wafer and found that the degumming rate of the wafer area corresponding to the hinge position of the cover and the chamber (located at 12 o'clock) is significantly higher than that of the opposite side area. This phenomenon can be explained by the nozzle being tilted toward the 12 o'clock direction due to gravity during the process of opening and flipping the cover and after resetting, that is, the nozzle position will affect the uniformity of the wafer process. In addition, after the existing semiconductor process chamber is closed, it is difficult for operators to detect nozzle deviation in time, resulting in poor process performance of the semiconductor process chamber.

[0028] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] like Figures 3 to 13 As shown, an embodiment of the present invention discloses an upper electrode assembly 100. The disclosed upper electrode assembly 100 is used in a semiconductor process chamber. The upper electrode assembly 100 and a chamber body 200 of the semiconductor process chamber form a reaction chamber. The disclosed upper electrode assembly 100 may include a cover plate 110, a nozzle 120, a position detection mechanism 130, and an adjustment mechanism 140.

[0030] The cover plate 110 is located on top of the chamber body 200. Together, the cover plate 110 and the chamber body 200 form the aforementioned reaction chamber. The cover plate 110 has a mounting hole, into which the nozzle 120 is positioned. The nozzle 120 communicates with the reaction chamber. The process gas is ionized within the microwave source device 170 of the upper electrode assembly and then enters the reaction chamber through the nozzle 120. The microwave source device 170 is well known and will not be described in detail herein.

[0031] The position detection mechanism 130 and the adjustment mechanism 140 are both disposed on the cover plate 110. The position detection mechanism 130 is used to detect the radial position of the nozzle 120 in the mounting hole. The adjustment mechanism 140 is used to adjust the radial position of the nozzle 120 in the mounting hole.

[0032] When the radial position of nozzle 120 within the mounting hole is not offset, the center axis of the mounting hole and the center axis of nozzle 120 may coincide, or the center axis of the mounting hole and the center axis of nozzle 120 may be within a certain angle range. In this position, nozzle 120 is not deflected, and therefore the nozzle is in the preset position. When the radial position of nozzle 120 within the mounting hole is offset, the center axis of the mounting hole and the center axis of nozzle 120 may not coincide, or the angle between the center axis of the mounting hole and the center axis of nozzle 120 may exceed the deviation range. In this position, nozzle 120 is offset, and therefore, nozzle 120 is not in the preset position.

[0033] During the specific working process, when the position detection mechanism 130 detects that the radial position of the nozzle 120 in the mounting hole is offset, the adjustment mechanism 140 can adjust the radial position of the nozzle 120 in the mounting hole to correct the radial position of the nozzle 120 in the mounting hole. Optionally, the position detection mechanism 130 can be a pressure sensor. When the nozzle 120 is offset, the nozzle 120 contacts the position detection mechanism 130, thereby generating pressure on the position detection mechanism 130, and the position detection mechanism 130 can output an offset signal. Alternatively, the position detection mechanism 130 can be a photoelectric sensor. When the nozzle 120 is offset, the nozzle 120 blocks the light signal of the photoelectric sensor, thereby causing the photoelectric sensor to generate a photoelectric signal, and the position detection mechanism 130 can output an offset signal. Of course, the position detection mechanism 130 can also be other structures, which are not limited in this article.

[0034] In the embodiments disclosed herein, the position detection mechanism 130 can detect the radial position of the nozzle 120 within the mounting hole, allowing the operator to promptly detect nozzle deviation. Simultaneously, the operator can adjust the radial position of the nozzle 120 within the mounting hole using the adjustment mechanism 140. In this manner, the operator can promptly detect nozzle 120 deviation and make timely corrections, thereby improving the process performance of the semiconductor process chamber.

[0035] In the prior art, because operators cannot promptly detect nozzle 120 deviation, the yield rate of wafers is low when using a semiconductor process chamber with a deviated nozzle 120. In the embodiments disclosed in this application, operators can promptly detect nozzle 120 deviation and thus promptly correct the nozzle 120, thereby improving the yield rate of wafers.

[0036] The upper electrode assembly 100 may also include a microwave source device 170. After the process gas is ionized by the microwave source device 170, it is injected into the reaction chamber through the nozzle 120. The microwave source device 170 is provided with a fixed flange, which presses and fixes the nozzle 120. In the related art, when the nozzle 120 is corrected, the microwave source device 170 needs to be removed in whole or in part, which makes the correction of the nozzle 120 more difficult. However, the present application adjusts the nozzle 120 through the adjustment mechanism 140 provided on the cover plate 110, without removing the microwave source device 170, making the correction of the nozzle 120 less difficult and more convenient.

[0037] In the above embodiment, when the nozzle 120 returns to the preset position, the input of the position detection mechanism 130 does not deviate from the signal. For example, if the position detection mechanism 130 is a pressure sensor, the pressure signal from the position detection mechanism 130 disappears, indicating that the nozzle 120 has returned to the preset position. Alternatively, if the position detection mechanism 130 is a photoelectric sensor, the photoelectric signal from the position detection mechanism 130 disappears, indicating that the nozzle 120 has returned to the preset position.

[0038] The present application discloses a specific structure of an adjustment mechanism 140. Of course, the adjustment mechanism 140 can also be other structures, which is not limited in this article. Specifically, the cover plate 110 can be provided with a slide groove 1121, the notch of the slide groove 1121 can face the mounting hole, and the slide groove 1121 is connected to the mounting hole through its notch. The adjustment mechanism 140 can include an adjustment slider 141 and a driving member 142. The adjustment slider 141 is located in the slide groove 1121, and the adjustment slider 141 can slide with the slide groove 1121 in a direction toward or away from the nozzle 120. A portion of the driving member 142 can extend into the slide groove 1121, and the driving member 142 can drive the adjustment slider 141 to slide in the slide groove 1121. The driving member 142 can adjust the position of the nozzle 120 through the adjustment slider 141.

[0039] During the specific operation, when the nozzle 120 is offset, the operator can drive the adjustment slider 141 to move in the slide groove 1121 through the driving member 142, and the adjustment slider 141 presses against the nozzle 120, thereby pushing the nozzle 120 to move to achieve adjustment of the nozzle 120.

[0040] In this solution, the operator drives the adjustment slider 141 to move through the driving member 142, thereby achieving the adjustment operation of the nozzle 120, thereby making the position adjustment operation of the nozzle 120 simple.

[0041] Alternatively, the adjustment slider 141 may be an annular slider disposed around the nozzle 120. In this case, the chute 1121 may also be an annular structure, thereby matching the structure of the annular slider. When the position detection mechanism 130 issues an offset signal, the driving member 142 can drive the annular slider to slide in different directions, thereby adjusting the nozzle 120.

[0042] In the above embodiment, the annular slider is relatively large, which is not conducive to the assembly of the adjustment mechanism 140. Therefore, in another optional embodiment, there can be multiple chute grooves 1121, and the multiple chute grooves 1121 can be distributed at intervals along the circumference of the nozzle 120. There can also be multiple adjustment sliders 141 and multiple driving members 142, with multiple driving members 142 provided in a one-to-one correspondence with multiple adjustment sliders 141, and each adjustment slider 141 is disposed in one of the chute grooves 1121.

[0043] In this solution, the multiple adjustment sliders 141 can adjust the nozzle 120 in multiple directions. Compared with the annular slider, the multiple adjustment sliders 141 are smaller in size and are more convenient for installation of the adjustment mechanism 140.

[0044] In another optional embodiment, a guide slope 1411 may be provided on the side of the adjustment slider 141 facing away from the nozzle 120. A threaded hole may be provided on the top surface of the mounting bracket 112, which may communicate with the chute 1121. The driving member 142 may be threadedly engaged with the threaded hole. One end of the driving member 142 may extend into the chute 1121 and rest against the guide slope 1411.

[0045] During the specific working process, by screwing the driving member 142, the driving member 142 moves in the direction toward the inside of the slide groove 1121, and the driving member 142 drives the adjustment slider 141 to move toward one side of the nozzle 120 through the guide slope 1411 to drive the nozzle 120 to move, thereby realizing the adjustment of the position of the nozzle 120.

[0046] In this solution, the nozzle 120 can be adjusted by screwing the driving member 142, so the adjustment method is simple. In addition, after the driving member 142 stops screwing, the driving member 142 and the threaded hole are self-locked, thereby preventing the driving member 142 from being separated from the cover plate 110.

[0047] Of course, the driving member 142 is not limited to the above-mentioned driving method. The driving member 142 can also move relative to the cover 110. A movable hole connected to the slide groove 1121 is provided on the cover 110. By moving the driving member 142 in the movable hole, the movement of the adjustment slider 141 in the slide groove 1121 is realized.

[0048] In another optional embodiment, there are multiple position detection mechanisms 130, and each position detection mechanism 130 may correspond to one of the adjustment sliders 141. In this case, each adjustment slider 141 is used to adjust the position detected by the corresponding position detection mechanism 130. In other words, when the nozzle 120 deviates toward one of the position detection mechanisms 130, the position detection mechanism 130 is triggered, and the adjustment slider 141 corresponding to the position detection mechanism 130 can be used to push the nozzle 120 away from the detection member 132, thereby correcting the nozzle 120.

[0049] In this solution, a position detection mechanism 130 is used to detect the offset of the nozzle 120 in one position, and the corresponding adjustment slider 141 is used to correct the offset corresponding to that position. Multiple position detection mechanisms 130 and multiple adjustment sliders 141 can correct multiple positions, thereby further improving the correction accuracy of the nozzle 120.

[0050] Furthermore, in another optional embodiment, as Figure 11 As shown, the cover plate 110 may have a first position 310, a second position 320, a third position 330, and a fourth position 340 sequentially distributed along the circumference of the cover plate 110. The first position 310 and the third position 330 may be distributed along a first radial axis of the cover plate 110. The second position 320 and the fourth position 340 are distributed along a second radial axis of the cover plate 110, where the first radial axis is perpendicular to the second radial axis. The first position 310, the second position 320, the third position 330, and the fourth position 340 are each correspondingly provided with a position detection mechanism 130 and an adjustment slider 141.

[0051] This solution provides position detection mechanisms 130 and adjustment sliders 141 at four 90° positions distributed around the cover plate, thereby further improving the detection and correction accuracy of the nozzle.

[0052] Specifically, if Figure 11 As shown, the first position 310 is located above the cover plate 110, the second position 320 is located to the right of the cover plate 110, the third position 330 is located below the cover plate, and the fourth position 340 is located to the left of the cover plate. At this time, the first position 310, the second position 320, the third position 330 and the fourth position 340 are arranged in a clockwise direction. The first position is the 12 o'clock position, the second position is the 3 o'clock position, the third position is the 6 o'clock position, and the fourth position is the 9 o'clock position. The film transfer port of the semiconductor process chamber can be located at the 6 o'clock position, and the hinge position of the upper electrode assembly 100 and the chamber body 200 can be located at the 12 o'clock position. The 6 o'clock position and the 12 o'clock position are the positions where the nozzle 120 is most likely to deflect.

[0053] In the above embodiment, the cover plate 110 needs to be processed with the mounting structures of the detection member 132 and the adjustment mechanism 140 . Since the cover plate 110 is relatively large in size, the cover plate 110 is difficult to manufacture and install.

[0054] Based on this, in another optional embodiment, the cover plate 110 may include a plate body 111 and a mounting bracket 112, the plate body 111 and the mounting bracket 112 are detachably connected, the plate body 111 may be provided with a through hole, at least part of the mounting bracket 112 may be located in the through hole, the mounting bracket 112 may be provided with a mounting hole, the detection member 132 and the adjustment mechanism 140 may both be arranged on the mounting bracket 112, specifically, the above-mentioned slide groove 1121 and threaded hole may both be provided on the mounting bracket 112.

[0055] This solution divides the cover plate 110 into a plate body 111 and a mounting bracket 112. The plate body 111 and the mounting bracket 112 are processed separately. The mounting bracket 112 is smaller in size, and the structures of the detection part 132 and the adjustment mechanism 140 can be processed and installed thereon. The plate body 111 is larger in size and thus forms a reaction chamber with the chamber body 200. Compared with the cover plate 110 processed in an integral manner, the cover plate 110 in this application is more convenient to manufacture and install.

[0056] Optionally, a first sealing ring may be provided between the plate body 111 and the mounting bracket 112 , and the first sealing ring is used to seal the gap between the mounting bracket 112 and the plate body 111 .

[0057] In the above embodiment, when the driving member 142 does not rest against the guide bevel 1411 of the adjusting slider 141, the adjusting slider 141 moves toward the side away from the nozzle 120, and the moving distance of the guide slider is large, which easily causes the adjusting slider 141 to move to a position where the guide bevel 1411 is not opposite to the threaded hole, making it difficult for the driving member 142 to rest against the guide bevel 1411, resulting in the inability to drive the adjusting slider 141 to move, thereby reducing the reliability of the adjusting mechanism 140.

[0058] Based on this, in another optional embodiment, a first limiting portion 1121a may be provided in the chute 1121, and a second limiting portion 1412 may be provided in the adjustment slider 141. The first limiting portion 1121a and the second limiting portion 1412 may cooperate to limit the adjustment slider 141 in a direction away from the nozzle 120. In this solution, the first limiting portion 1121a and the second limiting portion 1412 can limit the movement distance of the adjustment slider 141, thereby preventing the adjustment slider 141 from sliding too far, preventing the guide inclined surface 1411 from being misaligned with the threaded hole, and thereby improving the reliability of the adjustment mechanism 140.

[0059] Optionally, one of the first limiting portion 1121a and the second limiting portion 1412 can be a limiting protrusion, and the other can be a limiting groove. The limiting protrusion is located in the limiting groove. When the limiting protrusion touches the side wall of the limiting groove, the limiting protrusion can no longer move, thereby achieving limitation.

[0060] To prevent the driver 142 from disengaging from the threaded hole, in another optional embodiment, the driver 142 may include a threaded connector 1421 and a guide block 1422. One end of the threaded connector 1421 may be connected to the guide block 1422. The threaded connector 1421 may be threadedly connected to the threaded hole. The guide block 1422 may be located within the slide 1121. The area of ​​the threaded hole may be smaller than the cross-sectional area of ​​the guide block 1422. The mounting bracket 112 may be provided with an assembly process hole 112a2, which may be connected to the slide 1121. The assembly process hole 112a2 may be arranged opposite the threaded hole. The area of ​​the assembly process hole 112a2 may be larger than the cross-sectional area of ​​the guide block 1422.

[0061] During the specific installation process, the threaded connector 1421 is screwed into the threaded hole, the guide block 1422 is installed into the slide groove 1121 through the assembly process hole 112a2, and then one end of the threaded connector 1421 is extended into the slide groove 1121 and connected to the guide block 1422.

[0062] In this embodiment, the cross-sectional area of ​​guide block 1422 is larger than that of the threaded hole. Therefore, guide block 1422 is not easily dislodged from the threaded hole, thereby preventing driver 142 from being easily dislodged from the threaded hole. This improves the assembly and reliability of driver 142. Furthermore, assembly process holes 112a2 are provided in mounting bracket 112 to facilitate the installation of guide block 1422 into slide slot 1121, making assembly of driver 142 even simpler and more convenient.

[0063] This application discloses a specific structure of a position detection mechanism 130. Of course, position detection mechanism 130 may also have other structures, which are not limited herein. Specifically, position detection mechanism 130 may include a detection member 132 and an alarm 131. Detection member 132 may be disposed on mounting bracket 112 and electrically connected to alarm 131. When detection member 132 detects radial positional deviation of nozzle 120 within the mounting hole, alarm 131 is triggered.

[0064] When the detection member 132 detects that the nozzle 120 is offset, the detection member 132 can send a trigger signal to trigger the alarm 131 to alarm. Optionally, the detection member 132 can be a pressure sensor. When the nozzle 120 is offset, the nozzle 120 contacts the detection member 132, thereby generating pressure on the detection member 132. When the detection member 132 receives the pressure, the detection member 132 is triggered to generate a pressure signal. The pressure signal is sent to the alarm 131 in the form of current or voltage to trigger the alarm 131 to send an alarm signal. Alternatively, the detection member 132 can be a photoelectric sensor. When the nozzle 120 is offset, the nozzle 120 blocks the light signal of the photoelectric sensor, thereby causing the photoelectric sensor to generate a photoelectric signal. The photoelectric signal is sent to the alarm 131 in the form of current or voltage to trigger the alarm 131 to send an alarm signal. Alternatively, the detection member 132 can be a distance sensor. The distance sensor detects the distance between the nozzle 120 and sends an alarm signal by changing the distance. Of course, the detection member 132 can also be other structures, which are not limited herein.

[0065] During operation, when alarm 131 sounds an alarm, adjustment mechanism 140 adjusts the position of nozzle 120 within the mounting hole to return nozzle 120 to the preset position. When adjustment mechanism 140 returns nozzle 120 to the preset position, alarm 131 deactivates the alarm. When nozzle 120 returns to the preset position, the trigger signal from detection element 132 disappears, preventing alarm 131 from being triggered. Consequently, alarm 131 deactivates the alarm.

[0066] Optionally, the alarm 131 may be a buzzer or an alarm light. Of course, the alarm 131 may also be other structures, which is not limited herein.

[0067] In this solution, the position detection mechanism 130 has a simple structure and is easy to connect. At the same time, the alarm 131 emits an alarm, which is equivalent to transmitting the detection signal to the lower computer. This is more intuitive and easier for on-site operators to detect, so that the nozzle 120 can be corrected more promptly.

[0068] In the above embodiment, the detection member 132 can be directly installed in the mounting hole, but due to the limited space of the mounting hole, the detection member 132 installed in the mounting hole is likely to interfere with the nozzle 120. To this end, in another optional embodiment, the mounting bracket 112 can be provided with a detection hole, and the detection hole can be extended from the outer wall of the mounting bracket 112 to the inner wall of the mounting hole, and the axis of the detection hole intersects with the axis of the mounting hole. The detection member 132 is installed in the detection hole, and one end of the detection member 132 extends into the mounting hole. When the nozzle 120 presses the end of the detection member 132 extending into the mounting hole, the detection member 132 detects the radial position offset of the nozzle 120 in the mounting hole. At this time, the detection member is subjected to the pressure of the nozzle and generates a detection signal. Therefore, the detection member is a pressure detection device.

[0069] The distance that the detection member 132 extends into the mounting hole can be a first distance, where the distance that the detection member 132 extends into the mounting hole refers to the distance between the end of the detection member extending into the mounting hole and the inner wall of the mounting hole. The distance between the outer wall of the nozzle 120 and the inner wall of the mounting hole is a second distance, and the first distance is less than or equal to the second distance. When the first distance is less than the second distance, there is a certain gap between the end of the detection member 132 extending into the mounting hole and the nozzle. When the nozzle is offset in the radial direction, the nozzle will apply pressure to the detection member. When the first distance is equal to the second distance, at this time, the end of the detection member 132 extending into the mounting hole just contacts the nozzle 120, and the nozzle 120 has no pressure on the detection member 132. When the nozzle 120 is offset in the radial direction, the nozzle 120 will apply pressure to the detection member 132.

[0070] In this solution, the detection member 132 can be installed in the detection hole, and the end of the detection member 132 used for detection can extend into the installation hole. Therefore, the volume of the part of the detection member 132 extending into the installation hole is small, so that the detection member 132 is not easy to interfere with the nozzle 120.

[0071] In another optional embodiment, the detection member 132 may include a fixing portion 1321, a detection body 1322, and a wire 1323. The fixing portion 1321 may be connected to the detection body 1322, and the fixing portion 1321 may be threadedly engaged with the detection hole. The detection body 1322 may partially extend into the mounting hole, and the detection body 1322 may be electrically connected to the alarm 131 via the wire 1323.

[0072] In this solution, the detection member 132 is threadedly matched with the detection hole, thereby making the assembly method of the detection member 132 and the mounting bracket 112 simpler and reducing the difficulty of assembly.

[0073] In the above embodiment, the first distance may be 1.5 mm, and the second distance may be 2 mm. In this case, the single-direction correction range may be 0.5 mm.

[0074] In another solution, a second sealing ring is sleeved on the outer side of the fixing portion 1321 , and the second sealing ring is used to seal the gap between the fixing portion and the detection hole, thereby improving the vacuum degree of the semiconductor process chamber.

[0075] To facilitate assembly of the mounting bracket 112 with the plate body 111, in another optional embodiment, the mounting bracket 112 may include a first mounting portion 112a and a second mounting portion 112b, the first mounting portion 112a and the second mounting portion 112b being connected, and a mounting hole extending through the first and second mounting portions 112a and 112b. In the projection direction along the axis of the mounting hole, the projection of the second mounting portion 112b lies within the projection of the first mounting portion 112a. The adjustment mechanism 140 is disposed on the first mounting portion 112a, and the detection hole is provided in the second mounting portion 112b. In this embodiment, the mounting bracket 112 has a boss structure.

[0076] The through hole may include a first hole segment and a second hole segment, at least a portion of the first mounting portion 112a is located in the first hole segment, at least a portion of the second mounting portion 112b may be located in the second hole segment, and in the projection direction along the axis of the mounting hole, the projection outline of the second hole segment may be located within the projection outline of the first hole segment. In this case, the through hole is a stepped hole.

[0077] In this solution, the mounting bracket 112 is a boss structure and the through hole is a stepped hole, so the mounting bracket 112 matches the through hole. The first mounting portion 112a can be supported on the stepped surface of the through hole, thereby making it easier to assemble the mounting bracket 112 with the board body 111.

[0078] In another optional embodiment, the cover plate 110 may be provided with a wire channel 113, and the wire 1323 may be located in the wire channel 113. In this case, the wire channel 113 facilitates the wire 1323 to extend from the inside of the cover plate 110 to the outside of the cover plate 110, thereby facilitating the wiring of the cover plate 110.

[0079] Optionally, the threading channels 113 may all be provided on the plate body 111 .

[0080] In the above embodiment, when the threading channels 113 are all opened on the plate body 111 , the threading channels 113 need to bypass the installation position of the mounting bracket 112 , so the length of the threading channels 113 is long, which is not conducive to processing.

[0081] In another optional embodiment, the threading channel 113 may include a first channel 1131 and a second channel 1132 that are connected to each other. The first channel 1131 may be opened in the plate body 111, one end of the first channel 1131 is connected to the detection hole, and the other end of the first channel 1131 may be connected to the first hole section, and the side wall of the first hole section may be surrounded by the side wall of the first mounting portion 112a to form the second channel 1132.

[0082] In this solution, the first channel 1131 is opened on the plate body 111, and the second channel 1132 is surrounded by the side wall of the first hole section and the first mounting portion 112a. Therefore, the processing length of the threading channel 113 is shorter, which is more conducive to the processing of the threading channel 113.

[0083] To prevent the sidewalls of the first mounting portion 112a and the sidewalls of the first hole segment from exerting excessive pressure on the wire 1323 and thereby damaging the wire 1323, in another optional embodiment, the outer wall of the first mounting portion 112a may be provided with an escape notch 112a1. The escape notch 112a1 and the inner wall of the first hole segment form a second channel 1132. This solution can increase the cross-sectional area of ​​the second channel 1132, thereby making the wire 1323 less likely to be squeezed and thus less likely to be damaged.

[0084] Liquid usually leaks from the upper electrode assembly 100. In order to prevent the leaked liquid from the upper electrode assembly 100 from entering the threading channel 113, in another optional embodiment, the upper electrode assembly 100 disclosed in the present application may further include a protective cover 150. The protective cover 150 may cover the side of the second channel 1132 away from the first channel 1131 of the plate body 111. The protective cover 150 may be arranged around the first mounting portion 112a, and the protective cover 150 may be connected to the plate body 111. In this solution, the protective cover 150 can prevent the liquid leaked from the upper electrode assembly 100 from entering the threading channel 113, thereby preventing the detection member 132 from being damaged, thereby improving the safety and reliability of the upper electrode assembly 100.

[0085] In another optional embodiment, as Figure 13 As shown, the alarm 131 can be mounted on the protective cover 150, and the detection element 132 can be electrically connected to the slave computer 400. The slave computer 400 can then be used to display the offset data X of the nozzle 120. In this embodiment, the alarm 131 is mounted on the protective cover 150, which is mounted on the plate body 111 and is relatively close to the adjustment mechanism 140. This facilitates observation by the operator during nozzle 120 correction. Furthermore, the offset data X of the nozzle 120 can be output to the slave computer, making it easier for the operator to observe and promptly detect any offset of the nozzle 120.

[0086] Optionally, the offset data X of the nozzle 120 displayed by the slave computer 400 may be a pressure value on the nozzle 120 or a distance between the nozzle 120 and the detection member 132 . The specific type of the offset data X is not limited herein.

[0087] In another optional embodiment, multiple alarms 131 and detection elements 132 are provided. This allows detection of the nozzle 120 position in multiple directions. In this case, the alarm 131 corresponds to the installation location of the detection element 132 electrically connected thereto. In this embodiment, the alarm 131 corresponds to the installation location of the detection element 132 electrically connected thereto, making it easier for the operator to distinguish the alarm location, thereby improving the operator's correction efficiency.

[0088] Here, the installation positions of the alarm 131 and the detection component 132 electrically connected thereto correspond to each other, which means that the alarm 131 and the detection component 132 electrically connected thereto are arranged in the same position.

[0089] Figure 12 The following is a circuit diagram of a detection element 132 and an alarm 131. In a specific embodiment, a supply voltage Vs is applied to bridge points 3 and 4. The supply voltage is divided into two half-bridges by R1 (a piezoresistive pressure sensor) and R2, R3, and R4. Since R1 / R2 = R3 / R4, the bridge is balanced, and the bridge output voltage UA (bridge points 1 and 2) is zero, and the alarm 131 does not sound an alarm. If the resistance of R1 changes, the nozzle 120 will shift, and the bridge will become unbalanced, the output voltage UA will not be zero, and the alarm 131 will sound an alarm. In addition, UA is processed through amplification and voltage-to-current conversion, and the current nozzle 120 pressure value is output to the lower computer.

[0090] like Figure 12 As shown, R1 is a piezoresistive pressure sensor, and the resistance value of R1 changes with the pressure exerted by the nozzle on R1. R2, R3 and R4 are fixed resistors used to balance the bridge.

[0091] In the above embodiment, the upper electrode assembly 100 may further include an upper electrode housing 160 , which is disposed on the plate body 111 to entirely house the mounting bracket 112 . The upper electrode housing 160 is used to protect components within the upper electrode assembly 100 .

[0092] Based on the upper electrode assembly 100 of any of the above embodiments of the present application, an embodiment of the present application further discloses a semiconductor process chamber, and the disclosed semiconductor process chamber has the upper electrode assembly 100 of any of the above embodiments.

[0093] The semiconductor process chamber disclosed in the present application may further include a chamber body 200, and the chamber body 200 and the upper electrode assembly 100 may enclose a reaction chamber. Specifically, a cover plate 110 is disposed on top of the chamber body 200, and the cover plate 110 and the chamber body 200 enclose a reaction chamber. The cover plate 110 may be hinged to the chamber body 200, and the nozzle 120 is connected to the reaction chamber. The above-mentioned reaction chamber is used to process the workpiece to be processed, and a supporting base 210 is provided in the reaction chamber, and the workpiece to be processed can be carried on the supporting base 210.

[0094] The semiconductor process chamber in the above embodiment can be a stripping chamber for removing residual photoresist from the wafer after etching. Of course, the semiconductor process chamber can also be other process chambers, which is not limited herein.

[0095] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0096] The foregoing is merely an embodiment of the present invention and is not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention are intended to be included within the scope of the claims of the present invention.

Claims

1. An upper electrode assembly, used in a semiconductor process chamber, characterized in that: include: A cover plate (110) and a nozzle (120), wherein the cover plate (110) is provided with a mounting hole, and the nozzle (120) is arranged in the mounting hole; a position detection mechanism (130), the position detection mechanism (130) being arranged on the cover plate (110), and the position detection mechanism (130) being used to detect whether the radial position of the nozzle (120) in the mounting hole is offset; an adjusting mechanism (140), the adjusting mechanism (140) being arranged on the cover plate (110), the adjusting mechanism (140) being used to adjust the radial position of the nozzle (120) in the mounting hole; When the position detection mechanism (130) detects that the radial position of the nozzle (120) in the mounting hole is offset, the adjustment mechanism (140) can adjust the radial position of the nozzle (120) in the mounting hole to correct the radial position of the nozzle (120) in the mounting hole.

2. The upper electrode assembly according to claim 1, wherein: The cover plate (110) comprises a plate body (111) and a mounting bracket (112); the plate body (111) and the mounting bracket (112) are detachably connected; the plate body (111) is provided with a through hole; at least a portion of the mounting bracket (112) is located in the through hole; the mounting bracket (112) is provided with the mounting hole; and the position detection mechanism (130) and the adjustment mechanism (140) are both provided on the mounting bracket (112).

3. The upper electrode assembly according to claim 2, wherein: The mounting bracket (112) is provided with a slide groove (1121), the notch of the slide groove (1121) faces the mounting hole, and the slide groove (1121) is connected to the mounting hole through its notch; The adjusting mechanism (140) includes an adjusting slider (141) and a driving member (142), wherein the adjusting slider (141) is located in the slide groove (1121), and the adjusting slider (141) and the slide groove (1121) slide together in a direction toward or away from the nozzle (120), and a portion of the driving member (142) can extend into the slide groove (1121), and the driving member (142) can drive the adjusting slider (141) to slide in the slide groove (1121), and the driving member (142) adjusts the position of the nozzle (120) through the adjusting slider (141).

4. The upper electrode assembly according to claim 3, wherein: There are multiple slide grooves (1121), and the multiple slide grooves (1121) are distributed at intervals along the circumference of the nozzle (120); There are multiple adjusting sliders (141) and multiple driving members (142), and multiple driving members (142) are arranged in a one-to-one correspondence with multiple adjusting sliders (141). Each adjusting slider (141) is arranged in one of the sliding grooves (1121).

5. The upper electrode assembly according to claim 4, characterized in that There are multiple position detection mechanisms (130), and each position detection mechanism (130) corresponds to one of the adjustment sliders (141).

6. The upper electrode assembly according to claim 5, characterized in that The cover plate (110) has a first position (310), a second position (320), a third position (330) and a fourth position (340) distributed in sequence along the circumference of the cover plate (110); the first position (310) and the third position (330) are distributed along the first radial axis of the cover plate (110); the second position (320) and the fourth position (340) are distributed along the second radial axis of the cover plate; the first radial axis is perpendicular to the second radial axis; the first position (310), the second position (320), the third position (320) and the fourth position (330) are each correspondingly provided with the position detection mechanism (130) and the adjustment slider (141).

7. The upper electrode assembly according to claim 4, characterized in that A guide slope (1411) is provided on the side of the adjusting slider (141) facing away from the nozzle (120), a threaded hole is provided on the top surface of the mounting bracket (112), the threaded hole is connected to the slide groove (1121), the driving member (142) is threadedly engaged with the threaded hole, and one end of the driving member (142) extends into the slide groove (1121) and rests on the guide slope (1411).

8. The upper electrode assembly according to claim 7, wherein: A first limiting portion (1121a) is provided in the sliding groove (1121), and a second limiting portion (1412) is provided on the adjusting slider (141). The first limiting portion (1121a) and the second limiting portion (1412) cooperate to limit the direction in which the adjusting slider (141) moves away from the nozzle (120).

9. The upper electrode assembly according to claim 7, wherein: The driving member (142) includes a threaded connector (1421) and a guide block (1422), one end of the threaded connector (1421) is connected to the guide block (1422), the threaded connector (1421) is threadedly connected to the threaded hole, the guide block (1422) is located in the slide groove (1121), the cross-sectional area of ​​the threaded hole is smaller than the cross-sectional area of ​​the guide block (1422), an assembly process hole (112a2) is opened on the mounting bracket (112), the assembly process hole (112a2) is connected to the slide groove (1121), the assembly process hole (112a2) is arranged opposite to the threaded hole, and the cross-sectional area of ​​the assembly process hole (112a2) is larger than the cross-sectional area of ​​the guide block (1422).

10. The upper electrode assembly according to claim 2, wherein: The position detection mechanism (130) comprises a detection member (132) and an alarm (131); the detection member (132) is arranged on the mounting bracket (112); the detection member (132) is electrically connected to the alarm (131); when the detection member (132) detects that the radial position of the nozzle (120) in the mounting hole is offset, the alarm (131) is triggered to sound an alarm.

11. The upper electrode assembly according to claim 10, wherein: The mounting bracket (112) is provided with a detection hole, the detection hole extends from the outer wall of the mounting bracket (112) to the inner wall of the mounting hole, the axis of the detection hole intersects with the axis of the mounting hole, the detection member (132) is mounted in the detection hole, one end of the detection member (132) extends into the mounting hole, and when the nozzle (120) presses the end of the detection member (132) extending into the mounting hole, the detection member (132) detects a radial positional deviation of the nozzle (120) in the mounting hole; The distance that the detection member (132) extends into the mounting hole is a first distance, the distance between the outer side wall of the nozzle (120) and the inner side wall of the mounting hole is a second distance, and the first distance is less than or equal to the second distance.

12. The upper electrode assembly according to claim 11, wherein: The detection member (132) comprises a fixing portion (1321), a detection body (1322) and a wire (1323); the fixing portion (1321) is connected to the detection body (1322); the fixing portion (1321) is threadedly engaged with the detection hole; a portion of the detection body (1322) extends into the mounting hole; and the detection body (1322) is electrically connected to the alarm (131) via the wire (1323).

13. The upper electrode assembly according to claim 12, wherein: The mounting bracket (112) comprises a first mounting portion (112a) and a second mounting portion (112b), the first mounting portion (112a) and the second mounting portion (112b) being connected, the mounting hole passing through the first mounting portion (112a) and the second mounting portion (112b), and in the orthographic projection direction along the axis of the mounting hole, the projection outline of the second mounting portion (112b) is located within the projection outline of the first mounting portion (112a), the adjustment mechanism (140) is provided on the first mounting portion (112a), and the detection hole is opened on the second mounting portion (112b); The through hole comprises a first hole segment and a second hole segment, at least a portion of the first mounting portion (112a) is located in the first hole segment, at least a portion of the second mounting portion (112b) is located in the second hole segment, and in the orthographic projection direction along the axis of the mounting hole, the projection outline of the second hole segment is located within the projection outline of the first hole segment.

14. The upper electrode assembly according to claim 13, wherein: The cover plate (110) is provided with a threading channel (113), the wire (1323) is located in the threading channel (113), the threading channel (113) comprises a first channel (1131) and a second channel (1132) which are connected to each other, the first channel (1131) being provided in the plate body (111), one end of the first channel (1131) being connected to the detection hole, the other end of the first channel (1131) being connected to the first hole section, and the side wall of the first hole section and the side wall of the first mounting portion (112a) forming the second channel (1132).

15. The upper electrode assembly according to claim 14, wherein: The upper electrode assembly (100) further includes a protective cover (150), the protective cover (150) covering the side of the second channel (1132) facing away from the first channel (1131), the protective cover (150) being arranged around the first mounting portion (112a), and the protective cover (150) being connected to the plate body (111); the alarm (131) being arranged on the protective cover (150), the alarm (131) corresponding to the installation position of the detection member (132) electrically connected thereto, the detection member (132) being electrically connected to a lower computer, and the lower computer being used to display the offset data of the nozzle (120).

16. A semiconductor process chamber, characterized in that: The invention comprises a chamber body and an upper electrode assembly (100) according to any one of claims 1 to 15, wherein the chamber body (200) and the upper electrode assembly (100) form a reaction chamber, the cover plate (110) is arranged on the top of the chamber body (200), the cover plate (110) is hinged to the chamber body (200), and the nozzle (120) is connected to the reaction chamber.

Images