Microphone packaging structure and electronic equipment

Abstract

The present invention discloses a microphone packaging structure and an electronic device. The microphone packaging structure comprises: a packaging substrate, the packaging substrate has a first surface and a second surface opposite to the first surface, the packaging substrate is provided with a sound hole, and the openings at both ends of the sound hole are respectively located on the first surface and the second surface, the packaging substrate is also provided with a first signal pin, one end of the first signal pin is located on the first surface, and the other end is located on the second surface; a shell, the shell is connected to the packaging substrate, and the shell and one side of the first surface of the packaging substrate are enclosed to form a first cavity; a MEMS chip, the MEMS chip is arranged on the side where the first surface is located and covers the sound hole; an ASIC chip, the ASIC chip is arranged on the side where the first surface is located, and the ASIC chip is electrically connected to the MEMS chip; a signal processor chip, the signal processor chip is buried in the packaging substrate, the signal processor chip is led out to the second surface through the second signal pin, and the signal processor chip is electrically connected to the ASIC chip through the first signal pin.

Description

Technical Field

[0001] The present invention relates to the technical field of microphone packaging, and more specifically, to a microphone packaging structure and electronic equipment. Background Art

[0002] As voice interaction technology matures, the demand for voice detection, voice wake-up, voice commands, etc. is becoming more and more widespread. The microphone packaging structure in the related technology occupies a large size and has unsatisfactory acoustic performance, which affects the size applicability and acoustic performance of the microphone. Summary of the invention

[0003] An object of the present invention is to provide a new technical solution for a microphone packaging structure and an electronic device.

[0004] According to a first aspect of the present invention, a microphone packaging structure is provided, the microphone packaging structure comprising:

[0005] A packaging substrate, the packaging substrate having a first surface and a second surface opposite to the first surface, the packaging substrate being provided with an acoustic hole, the openings at both ends of the acoustic hole being respectively located on the first surface and the second surface, the packaging substrate being further provided with a first signal pin, one end of the first signal pin being located on the first surface, and the other end being located on the second surface;

[0006] A shell, wherein the shell is connected to the packaging substrate, and the shell and one side of the first surface of the packaging substrate are enclosed to form a first cavity;

[0007] A MEMS chip, wherein the MEMS chip is disposed on the side where the first surface is located and covers the acoustic hole;

[0008] An ASIC chip, wherein the ASIC chip is disposed on the side where the first surface is located, and the ASIC chip is electrically connected to the MEMS chip;

[0009] A signal processor chip is embedded in the packaging substrate, the signal processor chip is led out to the second surface through a second signal pin, and the signal processor chip is electrically connected to the ASIC chip through the first signal pin.

[0010] Optionally, the packaging substrate has a plurality of the second signal pins, and the first signal pin is electrically connected to the signal processor chip through the second signal pins.

[0011] Optionally, a groove structure is provided on the packaging substrate, the opening of the groove structure faces one side of the first surface, the signal processor chip is exposed to the groove structure, and the ASIC chip is arranged on the structure where the signal processor chip is exposed to the groove structure.

[0012] Optionally, a second cavity is provided on the packaging substrate, and a through hole is provided on the packaging substrate, the through hole is connected to the second cavity, the signal processor chip is arranged in the second cavity, and the signal processor chip and the inner wall of the through hole form the groove structure.

[0013] Optionally, a shielding layer is provided between the signal processor chip and the ASIC chip.

[0014] Optionally, the shielding layer is provided on the first surface, or is embedded in the packaging substrate.

[0015] Optionally, a lead-out surface of the ASIC chip is located on a side away from the second surface.

[0016] Optionally, projections of the ASIC chip and the signal processor chip on the first surface at least partially overlap.

[0017] Optionally, projections of the MEMS chip and the signal processor chip on the first surface at least partially overlap.

[0018] According to a second aspect of the present invention, an electronic device is provided, the electronic device comprising the microphone packaging structure as described in any one of the first aspects.

[0019] According to one embodiment of the present disclosure, the signal processor chip is buried in the packaging substrate to avoid the signal processor chip occupying the space of the first cavity, thereby increasing the space of the first cavity, and the signal processor chip is led out to the second surface through the second signal pin, thereby simplifying the lead-out structure of the signal processor chip.

[0020] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0022] Figure 1 This is one of the structural schematic diagrams of the microphone packaging structure of this application.

[0023] Figure 2 This is the second structural schematic diagram of the microphone packaging structure of the present application.

[0024] Description of reference numerals:

[0025] 1. Packaging substrate; 2. Housing; 3. MEMS chip; 4. ASIC chip; 5. Signal processor chip.

[0026] 10. First cavity; 11. First surface; 12. Second surface; 13. Sound hole; 14. First signal pin; 15. Second signal pin; 16. Groove structure. DETAILED DESCRIPTION

[0027] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0028] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0029] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0030] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0031] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0032] According to an embodiment of the present application, a microphone packaging structure is provided, such as Figure 1 , Figure 2 As shown, the microphone packaging structure includes:

[0033] A packaging substrate 1, wherein the packaging substrate 1 has a first surface 11 and a second surface 12 opposite to the first surface 11, the packaging substrate 1 is provided with an acoustic hole 13, and the openings at both ends of the acoustic hole 13 are respectively located on the first surface 11 and the second surface 12, and the packaging substrate 1 is further provided with a first signal pin 14, and one end of the first signal pin 14 is located on the first surface 11, and the other end is located on the second surface 12;

[0034] A housing 2, wherein the housing 2 is connected to the packaging substrate 1, and the housing 2 and one side of the first surface 11 of the packaging substrate 1 enclose a first cavity 10;

[0035] A MEMS chip 3, wherein the MEMS chip 3 is disposed on the side where the first surface 11 is located and covers the acoustic hole 13;

[0036] An ASIC chip 4, wherein the ASIC chip 4 is disposed on the side where the first surface 11 is located, and the ASIC chip 4 is electrically connected to the MEMS chip 3;

[0037] A signal processor chip 5 is embedded in the packaging substrate 1 . The signal processor chip 5 is led out to the second surface 12 via a second signal pin 15 . The signal processor chip 5 is electrically connected to the ASIC chip 4 via the first signal pin 14 .

[0038] In the embodiment of the present application, the signal processor chip 5 is buried in the package substrate 1 to avoid the signal processor chip 5 occupying the space of the first cavity 10, thereby increasing the space of the first cavity 10, and the signal processor chip 5 is led out to the second surface 12 through the second signal pin 15, thereby simplifying the lead-out structure of the signal processor chip 5.

[0039] The first cavity 10 forms the acoustic back cavity of the microphone packaging structure, and the signal processor chip 5 is buried in the packaging substrate 1, which avoids the signal processor chip 5 occupying the space of the first cavity 10, thereby increasing the volume of the first cavity 10 to effectively improve the acoustic performance of the microphone in the microphone packaging structure.

[0040] The signal processor chip 5 embedded in the package substrate 1 is led out to the second surface 12 through the second signal pin 15. For example, the second signal pin 15 is embedded in the package substrate 1, one end of the second signal pin 15 is connected to the signal processor chip 5, and the other end is led out to the second surface 12. A plurality of second signal pins 15 are provided on the package substrate 1. A pad is provided at one end of the second signal pin 15 located on the second surface 12 for electrical connection.

[0041] The second signal pin 15 is led out to the second surface 12, so that the external end of the second signal pin 15 is located outside the microphone packaging structure, which is easier to connect. The signal pins led out from the first surface 11 are reduced, and the influence of the second signal pin 15 on the device set on the first surface 11 is avoided. The structure of the second signal pin 15 does not need to be set in conjunction with the device on the first surface 11, so that the second signal pin 15 can be set in the simplest way.

[0042] In one embodiment, Figure 1 , Figure 2 As shown, the packaging substrate 1 has a plurality of the second signal pins 15 , and the first signal pin 14 is electrically connected to the signal processor chip 5 through the second signal pins 15 .

[0043] In the embodiment of the present application, a plurality of second signal pins 15 are led out to the second surface 12 for electrical connection with different devices. The ASIC chip 4 is electrically connected to the end of the first signal pin 14 located on the first surface 11, and one end of the first signal pin 14 located on the second surface 12 is electrically connected to the second signal pin 15, so that the ASIC chip 4 is electrically connected to the signal processor chip 5.

[0044] In one embodiment, Figure 2 As shown, a groove structure 16 is provided on the packaging substrate, the opening of the groove structure 16 faces the first surface 11, the signal processor chip 5 is exposed to the groove structure 16, and the ASIC chip 4 is arranged on the structure where the signal processor chip 5 is exposed to the groove structure 16.

[0045] In an embodiment of the present application, a groove structure 16 is provided so that the structure of the ASIC chip 4 is located in the groove structure 16. The groove structure 16 reduces the stacking thickness at the position of the ASIC chip 4, increases the volume of the first cavity 10, and increases the acoustic back cavity volume of the microphone packaging structure, thereby improving the acoustic performance.

[0046] In one embodiment, Figure 2 As shown, a second cavity is provided on the packaging substrate 1, and a through hole is provided on the packaging substrate 1. The through hole is connected to the second cavity, and the signal processor chip 5 is provided in the second cavity. The signal processor chip 5 and the inner wall of the through hole form the groove structure 16.

[0047] In the embodiment of the present application, a second cavity is provided in the package substrate 1 for accommodating the signal processor chip 5. A through hole is provided in the package substrate 1 to communicate with the second cavity. The signal processor chip 5 is embedded in the second cavity, so that a part of the structure of the signal processor chip 5 is located at one end of the through hole, thereby forming a groove structure 16 with the inner wall of the through hole. The ASIC chip 4 is disposed in the groove structure 16, and the ASIC chip 4 may be disposed on the surface of the signal processor chip 5, or may be disposed on the inner wall of the through hole.

[0048] In one embodiment, a shielding layer is provided between the signal processor chip 5 and the ASIC chip 4 .

[0049] In this embodiment, the shielding layer is provided to form a shielding effect between the signal processor chip 5 and the ASIC chip 4, thereby reducing the mutual interference of signals between the signal processor chip 5 and the ASIC chip 4 and reducing the noise of the device itself.

[0050] In one embodiment, the shielding layer is disposed on the first surface 11 , or is embedded in the packaging substrate 1 .

[0051] In the embodiment of the present application, in the embodiment where the ASIC chip 4 is disposed on the first surface 11, the shielding layer is disposed on the first surface 11 or embedded in the package substrate 1. For example, the shielding layer is disposed on the first surface 11, and the ASIC chip 4 is disposed on the shielding layer. The projection area of ​​the shielding layer on the first surface 11 is larger than the projection area of ​​the ASIC chip 4 on the first surface 11, and the projection area of ​​the shielding layer on the first surface 11 is larger than the projection area of ​​the signal processor chip 5 on the first surface 11.

[0052] In the embodiment where the ASIC chip 4 is disposed in the groove structure 16, the shielding layer is embedded in the package substrate 1. For example, the signal processor chip 5 is disposed in the second cavity, the shielding layer is embedded in the package substrate 1 and a portion of the structure covers the through hole, and the ASIC chip 4 is disposed on the side of the shielding layer away from the signal processor chip 5. For example, the signal processor chip 5 is disposed in the second cavity. The shielding layer is embedded in the package substrate 1 so that the shielding layer covers the surface of the signal processor chip 5, and the ASIC chip 4 is disposed on the side of the shielding layer away from the signal processor chip 5.

[0053] In one embodiment, Figure 1 , Figure 2 As shown, the lead-out surface of the ASIC chip 4 is located at a side away from the second surface 12 .

[0054] In the embodiment of the present application, the connection is made by leading out the line on the surface of the ASIC chip 4 away from the second surface 12, so that the assembly process is simpler. For example, the ASIC chip 4 is arranged on the side where the first surface 11 of the package substrate 1 is located, and a pad is arranged on the side of the ASIC chip 4 away from the second surface 12 to lead out the line of the ASIC chip. The side of the ASIC chip 4 away from the second surface 12 has a larger space, which is convenient for welding.

[0055] In one embodiment, Figure 1 , Figure 2 As shown, the projections of the ASIC chip 4 and the signal processor chip 5 on the first surface 11 at least partially overlap.

[0056] In the embodiment of the present application, the projections of the ASIC chip 4 and the signal processor chip 5 at least partially overlap, reducing the stacking of the chips in the lateral direction of the package substrate 1, thereby reducing the lateral size of the microphone package structure. For example, the lateral direction is the direction of the package substrate 1 extending along the first surface 11 or the second surface 12.

[0057] In one embodiment, Figure 1 , Figure 2 As shown, the projections of the MEMS chip 3 and the signal processor chip 5 on the first surface 11 at least partially overlap.

[0058] In the embodiment of the present application, the projections of the MEMS chip 3 and the signal processor chip 5 at least partially overlap, which reduces the lateral stacking of the chips on the packaging substrate 1, thereby reducing the lateral size of the microphone packaging structure.

[0059] According to one embodiment of the present application, an electronic device is provided, which includes a microphone packaging structure as described in any one of the embodiments of the present application.

[0060] The electronic device has the technical effects brought by the microphone packaging structure.

[0061] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0062] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A microphone packaging structure, characterized in that: include: A packaging substrate, the packaging substrate having a first surface and a second surface opposite to the first surface, the packaging substrate being provided with an acoustic hole, the openings at both ends of the acoustic hole being respectively located on the first surface and the second surface, the packaging substrate being further provided with a first signal pin, one end of the first signal pin being located on the first surface, and the other end being located on the second surface; A shell, the shell is connected to the packaging substrate, and the shell and one side of the first surface of the packaging substrate are enclosed to form a first cavity; A MEMS chip, wherein the MEMS chip is disposed on the side where the first surface is located and covers the acoustic hole; An ASIC chip, wherein the ASIC chip is disposed on the side where the first surface is located, and the ASIC chip is electrically connected to the MEMS chip; A signal processor chip, wherein the signal processor chip is embedded in the packaging substrate, the signal processor chip is led out to the second surface through a second signal pin, and the signal processor chip is electrically connected to the ASIC chip through the first signal pin; The packaging substrate is provided with a groove structure, the opening of the groove structure faces the first surface, the signal processor chip is exposed to the groove structure, and the ASIC chip is arranged on the surface of the signal processor chip and exposed on the structure of the groove structure.

2. The microphone packaging structure according to claim 1, characterized in that: The packaging substrate has a plurality of the second signal pins, and the first signal pin is electrically connected to the signal processor chip through the second signal pins.

3. The microphone packaging structure according to claim 1, characterized in that: A second cavity is provided on the packaging substrate. A through hole is provided on the packaging substrate. The through hole is communicated with the second cavity. The signal processor chip is provided in the second cavity. The signal processor chip and the inner wall of the through hole form the groove structure.

4. The microphone packaging structure according to claim 1, characterized in that: A shielding layer is provided between the signal processor chip and the ASIC chip.

5. The microphone packaging structure according to claim 4, characterized in that: The shielding layer is disposed on the first surface, or embedded in the packaging substrate.

6. The microphone packaging structure according to claim 1, characterized in that: The lead-out surface of the ASIC chip is located at a side away from the second surface.

7. The microphone packaging structure according to claim 1, characterized in that: The projections of the ASIC chip and the signal processor chip on the first surface at least partially overlap.

8. The microphone packaging structure according to claim 1, characterized in that: Projections of the MEMS chip and the signal processor chip on the first surface at least partially overlap.

9. An electronic device, characterized in that: Comprising the microphone packaging structure as described in any one of claims 1-8.

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