Systems and methods for cleaning joint assemblies and supporting hardware or wirebonders using functionalized surface microfeatures

Abstract

Cleaning materials, apparatus and methods for predictably cleaning contact assemblies and supporting hardware or wirebonders and capillaries of tester interfaces such as probe cards and test sockets, wherein a cleaning pad has a predetermined configuration suitable for the specific pin contact assembly or capillary, and a substrate having a defined functionalized surface topology and geometry that can be introduced into the test equipment during normal test operation. The cleaning material has a predetermined topology with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics not possible with a non-functionalized and flat surface.

Description

[0001] Priority claim

[0002] This application is a continuation application and claims priority to U.S. patent application No. 16 / 855,841 filed on April 22, 2020, and also claims priority to U.S. patent application No. 16 / 684,453 filed on November 14, 2019, the entire contents of all of which are incorporated herein by reference. Technical Field

[0003] The present disclosure generally relates to materials, apparatus and methods for predictably and consistently cleaning tester interface contact elements and support hardware (such as probe-cards and test sockets) or wire bonding machines and capillaries. Background Art

[0004] Individual semiconductor (integrated circuit) devices are typically produced by creating multiple devices on a semiconductor wafer using well-known semiconductor processing techniques, which may include photolithography, deposition, and sputtering. Typically, these processes are intended to produce fully-functional integrated circuit devices (ICs) at the wafer level. Ultimately, the individual IC devices are singulated or diced from the semiconductor wafer into separate and individual dies. The singulated IC devices are assembled for final completion in a package or incorporation into an electronic device using well-known assembly techniques, which may include attaching the die to a lead-frame, wire bonding or solder ball attachment, and encapsulation (usually by various molding techniques to provide a body to the package with external electrical connectivity).

[0005] However, in practice, physical defects in the wafer itself and / or defects in wafer processing may inevitably result in some of the dies on the wafer being fully functional, some of the dies being non-functional, and some of the dies having lower performance or requiring repair. Preferably, it is often desirable to identify which of the dies on the wafer are fully functional before singulation from the wafer and assembly into consumer devices. Non-functional, lower performance, and repairable devices due to certain physical defects in the wafer, defects in the IC circuit layer, and / or defects associated with semiconductor processing technology may be identified prior to singulation by a process called wafer-level testing (often referred to in the art as "wafer sorting"). Sorting or binning IC devices at the wafer level according to product capabilities (where product performance is determined by electrical testing) can save manufacturers considerable costs later in the manufacturing process, as well as provide increased revenue from sales of the highest performance devices.

[0006] Once the devices have been singulated, certain process steps during handling and assembly may inevitably result in dicing defects, handling defects, assembly and packaging related defects (which may only be electrically identified to bin the devices as fully functional, non-functional, or potentially "repairable"). In practice, assembled and packaged semiconductor devices are subjected to a series of electrical test processes before they are finally completed or incorporated into electronic devices. Processing at the package level or final testing prior to shipment includes, but is not limited to, testing of singulated devices, whether bare die, packaged IC (temporary or permanent), or variations therebetween.

[0007] Typically, electrical testing of IC devices at the wafer level or package level is accomplished with automatic test equipment (ATE) that is mechanically and electrically configured to stimulate semiconductor devices, exercise the devices according to adaptive test techniques and functional routines, and verify the outputs to evaluate proper functionality.

[0008] In wafer-level testing, conventional interface hardware is a "probe card" to which multiple probe assemblies matching the layout of the input / output (I / O) pads, power, GND, and process monitoring pins of the device under test (DUT) are connected. More specifically, in a typical wafer test process, the probe card is mounted to a prober and the probe contact assemblies (simply referred to as "probes") are brought into contact with the bonding pads, solder balls, bumps, pillars, or pillar bumps formed on the die of the wafer. Electrical connection is achieved by applying controlled displacement of the probe tip against the bonding pads, solder balls, bumps, pillars, or pillar bumps, thereby allowing the transmission of power, ground, and test signals. Repeated friction, deformation, and penetration of the probe tip against the bonding pads, solder balls, bumps, pillars, or pillar bumps creates debris and contaminants that adhere to and accumulate on the probe contact surface.

[0009] In package-level testing, the tester load board provides an interface between automated test equipment (ATE) or manual test equipment and the DUT. The tester load board conventionally includes one or more contactor assemblies, sometimes referred to as "test sockets" (into which the DUT is inserted). During the test process, the DUT is inserted or placed into the socket by the handler and held in place during the test. After being inserted into the socket, the DUT is electrically connected to the ATE via a pin assembly through the tester load board, its subassembly, and other interfacing apparatus. The contact pin assembly associated with the ATE is physically and electrically in contact with the metallized contact surface of the DUT. Such surfaces may include test pads, leads, pin connectors, bonding pads, solder balls, and / or other conductive media. Functional, static, and dynamic performance testing of the DUT is evaluated by various electrical inputs and responses measured to the outputs. Through repeated testing, contact element tips may become contaminated with materials such as aluminum, copper, lead, tin, gold, byproducts, organic films or oxides resulting from wafer and semiconductor device manufacturing and testing processes.

[0010] One of the major challenges encountered with both types of IC testing (wafer level and package level) is ensuring optimal electrical contact between the contact pins associated with the contactor assemblies and the contact surfaces of the DUT. During each test procedure, through repeated contact to the pin contact assemblies on the bond pads, solder balls, bumps, pillars, or pillar bumps, debris and other residues will accumulate and contaminate the contact areas of the pin assemblies. This debris may originate from the test and handling processes themselves, or may include manufacturing residues from the device manufacturing and / or assembly processes or from other sources.

[0011] In addition to the presence of contaminants, repeatedly forcing current through small intermetallic "a-spots" of contact pins can degrade the conductivity characteristics of the contact surface, thus affecting the intermetallic quality for proper electrical testing. As contaminants accumulate (coupled with degradation of the contact surface), contact resistance (CRES) increases and reduces the reliability of testing. Increased and unstable CRES can affect yield, and / or test time as yield recovery testing increases. These erroneous readings can lead to false rejection of otherwise good DUTs, resulting in often significant yield losses. Yield recovery may be possible through multiple passes of testing; however, repeatedly testing a device multiple times to verify the device or achieve yield recovery increases overall production costs, reduces production volume, affects assembly, and creates the possibility of long-term reliability degradation.

[0012] The high performance demands for wafer-level and package-level test contactor technologies have promoted the development of uniquely shaped and customized contact components with predetermined and engineered mechanical and electrical performance properties. Many new advanced contact technologies have unique contact component geometries and mechanical behaviors to facilitate consistent, repeatable, and stable electrical contacts. Some of these technologies are constructed using lithographic assembly techniques, some are constructed using MEMS-based processes; and others are manufactured using high-precision micromachining techniques. Improved electrical characteristics of the contactor are also achieved using various materials with improved electrical properties and oxidation resistance. The contact components are engineered to facilitate consistent oxide penetration while reducing the applied bearing forces on the bonding pads, solder balls, bumps, pillars, or pillar bumps. However, it is still necessary to make physical contact with the bonding pads, solder balls, bumps, pillars, or pillar bumps; thereby, generating debris and contamination that can affect the results from the electrical performance test procedures.

[0013] Typically, the resulting debris needs to be periodically removed from the contact assembly to prevent accumulation leading to increased contact resistance, continuity failures, and false test indications, which in turn lead to artificially low yields and subsequent increased product costs and reduced production throughput.

[0014] As a response to the problem of particles sticking to the contact components and supporting hardware, some techniques have been developed. For example, one technique uses a cleaning material composed of silicone rubber, which provides a matrix for the abrasive particles. In addition, a cleaning wafer can be used, or a cleaning medium mounted on an abrasive ceramic cleaning block rubbed against the probe, or a rubber matrix with abrasive particles and a cleaning brush made of glass fiber can be used. In one technique, the probe can be sprayed or dipped in the cleaning solution. In another technique, a cleaning device based on open-cell foam with a random surface topography of voids and variable height can be used.

[0015] In a conventional contact assembly cleaning process, some combination of brushing, blowing, and rinsing of the contact pins and / or contactor body is used. This process requires stopping the test operation, manual intervention to perform the cleaning, and possible removal of the test interface (probe card, socket, etc.) from the test environment. This method provides inconsistent debris removal and may not provide adequate cleaning action within the geometric features of the formed contact assembly. After cleaning, the test interface must be reinstalled and the test environment reestablished so that testing can resume. In some cases, the contact assembly is removed, cleaned, and replaced, resulting in increased costs (due to unscheduled equipment downtime).

[0016] In another conventional method, a cleaning pad having an abrasive surface coating or an abrasive coated polyurethane foam layer is used to remove foreign material adhering to the contact components. By repeatedly rubbing the contact components against the cleaning pad (and possibly into the cleaning pad), the adhering foreign material is abraded away from the contact components and supporting hardware. The cleaning process using an abrasive pad polishes the contact components, but it does not necessarily remove debris. In fact, polishing causes wear to the contact components, thereby changing the shape of the contact geometry, changing the contact performance, and shortening the useful life of the contactor.

[0017] Maximum cleaning efficiency is achieved when debris removal from contact components and supporting hardware is performed consistently and predictably during the cleaning process, without affecting the performance of the contact components. Cleaning processes using abrasive pads constructed with self-opening foams do not provide consistent cleaning. In fact, the buffing action performed by the randomly oriented and uncontrolled foam structure causes uneven wear and preferential grinding of the contact components, thereby unpredictably changing the shape of the contact geometry and the mechanical properties of the contact components and supporting hardware; thereby, unpredictably shortening the useful life of the contactor.

[0018] In the industry, it has been seen that tester interface hardware consisting of multiple contact assemblies (up to 150,000 test probe assemblies) and supporting hardware can cost more than $1M per ATE test cell. Premature wear and damage due to improper or non-optimal cleaning practices can translate into millions of dollars per ATE test cell per year. Therefore, with tens of thousands of ATE test cells operating worldwide, the impact on repair, maintenance, and replacement costs can be very large.

[0019] Another attempt to improve upon conventional probe cleaning processes involves the use of viscous abrasive filled or unfilled polymer-based cleaning materials to remove foreign material. More specifically, a polymer pad is physically contacted with the contact assembly. Adherent debris is loosened by the viscous polymer and adheres to the polymer surface; thereby being removed from the contact assembly and other test hardware. The polymer material is designed to maintain the overall shape of the contact assembly; however, interaction with the polymer layer may not provide adequate cleaning action within the geometric features of the shaped contact assembly.

[0020] When a film (having a continuous uniform surface or a surface with randomly oriented and randomly spaced surface features) is cleaned by an abrasive filled or abrasive coated material, preferential grinding manifests itself as follows: through the "edge pin" effect (e.g., the peripheral contact components of the test probe array are abrasively worn at a different rate than the contact components within the array); or through the "adjacent pin spacing" effect (e.g., closely spaced contact components wear at a different rate than widely spaced contact components); or through the "adjacent pin orientation" effect (e.g., the spatial proximity of contact components can cause preferential and asymmetric wear of contact components). Non-uniform wear of contact components and supporting hardware will affect performance consistency during IC semiconductor device testing and can result in unexpected yield loss, equipment downtime and repair costs.

[0021] Typical contact component cleaning processes at the wafer level and package level can be expensive for the end user because contacts can be uncontrollably worn at different rates by abrasive-based contact cleaning processes. When abrasive particles with reduced wear rate or size are used for critical contact components, the geometry can be drastically affected by relatively small changes (roughly 2% to 3%) to the abrasive material layer, surface features, and the flexibility of the underlying layer. With thousands of IC device test units (probers and handlers) operating throughout the world, the impact on the industry from maintaining clean contact components without premature wear during testing can be very large.

[0022] None of these methods adequately cleans these test machines, nor do they adequately clean the contact assemblies of these test machines having critical contact assembly geometries, nor do they adequately clean wire bonding machines and their capillaries. Therefore, there is a need for improved methods and apparatus for cleaning and maintaining contact assemblies and wire bonding machine capillaries.

[0023] Modulus Figure Description

[0024] Figure 1A A conventional example of a device under test or DUT at wafer level or at package level with probe pads; electrical contact assembly and ATE interface (probe card or test socket);

[0025] Figure 1B Schematic diagrams of examples of a device under test or DUT, solder bumps, pillars or raised pillars, electrical contact components, and an ATE interface (probe card or test socket) at the wafer level or at the package level;

[0026] Figure 1C A conventional wire bonding assembly machine 100 is shown having a capillary 102 for wire bonding operations;

[0027] Figure 1D A known wire bonding assembly machine with a capillary is shown during a cleaning operation 200 using a cleaning material 202;

[0028] Figure 2A is a top view of a typical cleaning apparatus having a cleaning pad that can be applied to a wafer surface;

[0029] Figure 2B is a cross-sectional view of a typical cleaning apparatus having a cleaning pad applied to a substrate surface;

[0030] Figure 2C is a cross-sectional view of a typical cleaning apparatus having a cleaning pad applied to a substrate proximate an IC package;

[0031] Figure 3A is a cross-sectional view of a known cleaning medium having one or more intermediate layers of flexible material beneath a cleaning pad layer having predetermined properties and a protective liner;

[0032] Figure 3B is a cross-sectional view of a known cleaning medium having one or more intermediate layers of rigid material beneath a cleaning pad layer having predetermined properties and a protective liner;

[0033] Figure 4A is an isometric view of a cleaning pad having a plurality of evenly spaced and predefined "positive" micro-pyramids having predetermined properties;

[0034] Figure 4B is an isometric view of a cleaning pad having a plurality of evenly spaced and predefined "positive" micro-pillars having predetermined properties;

[0035] Figure 4C is an isometric view of a cleaning pad having a plurality of evenly spaced and predefined "male" curved pyramidal microfeatures having predetermined properties;

[0036] Figure 5is a cross-sectional view of a cleaning medium having one or more intermediate layers of flexible material beneath a cleaning pad layer and a removable protective liner, the cleaning pad layer having a plurality of evenly spaced and predefined "positive" microfeatures above a surface reference plane;

[0037] Fig. 6A is an isometric view of a cleaning pad having a plurality of evenly spaced and predefined "female" micro-pyramids having predetermined properties;

[0038] Figure 6B is an isometric view of a cleaning pad having a plurality of evenly spaced and predefined "female" micro-pillars having predetermined properties;

[0039] Figure 6C is an isometric view of a cleaning pad having a plurality of evenly spaced and predefined "female" inverted curved pyramidal microfeatures having predetermined properties;

[0040] Figure 7 is a cross-sectional view of a cleaning medium having one or more intermediate layers of flexible material beneath a cleaning pad layer and a removable protective liner, the cleaning pad layer having a plurality of evenly spaced and predefined "negative" microfeatures;

[0041] Fig. 8A is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "male" micro-cones having predetermined properties;

[0042] Figure 8B is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "positive" micro-pillars having predetermined properties;

[0043] Figure 8C is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "male" curved pyramidal microfeatures having predetermined properties;

[0044] Fig.8D is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "male" [straight] micro-cones having predetermined properties, wherein one or more intermediate layers of flexible or rigid material are beneath the cleaning pad layer having predetermined properties and a protective liner;

[0045] Fig. 8Eis a cross-sectional view of a cleaning medium layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "positive" micro-pillars having predetermined properties, wherein one or more intermediate layers of flexible or rigid material are beneath the cleaning pad layer having predetermined properties and a protective liner;

[0046] Figure 8F is a cross-sectional view of a cleaning medium layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "male" curved pyramidal microfeatures having predetermined properties, wherein one or more intermediate layers of flexible or rigid material are beneath the cleaning pad layer having predetermined properties and a protective liner;

[0047] Fig. 9A is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "female" micro-pyramids having predetermined properties;

[0048] Fig. 9B is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "female" micro-pillars having predetermined properties;

[0049] Fig. 9C is a cross-sectional view of a cleaning medium layer having predetermined properties (such as viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "negative or inverted" curved pyramidal microfeatures having predetermined properties;

[0050] Fig.9D is a cross-sectional view of a cleaning medium layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "female" micro-cones having predetermined properties, with one or more intermediate layers of flexible or rigid material beneath the cleaning pad layer having predetermined properties and a protective liner;

[0051] Fig.9E is a cross-sectional view of a cleaning medium layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "female" micro-pillars having predetermined properties, with one or more intermediate layers of flexible or rigid material beneath the cleaning pad layer having predetermined properties and a protective liner;

[0052] Fig.9Fis a cross-sectional view of a cleaning medium layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) applied to a plurality of evenly spaced and predefined "negative or inverted" curved pyramidal microfeatures having predetermined properties, wherein one or more intermediate flexible or rigid material layers are beneath the cleaning pad layer having predetermined properties and a protective liner;

[0053] Fig. 10A is an example of a representative package having an array of solder bumps or solder balls contacted during package testing;

[0054] Fig. 10B An example of a cleaning device built for use within a test socket having a cleaning material layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) having an array of cleaning material bumps or balls, features, and solder ball interconnects that mimic the geometry of a device under test of an IC package;

[0055] Fig.11A is a cross-sectional view of a cleaning medium built with a plurality of cleaning balls that can be applied to a predetermined substrate so that the device approximates the geometry of a packaged IC device and can be handled by test equipment during package level testing;

[0056] Fig. 11B is a cross-sectional view of a cleaning medium layer having predetermined properties (e.g., viscosity, hardness, abrasiveness, etc.) that has been applied across a plurality of spherical microfeatures to improve cleaning performance of the spherical microfeatures and cleaning surfaces during socket cleaning under package level testing;

[0057] Fig.12 A flow chart showing a method for cleaning a semiconductor device using various embodiments of the disclosed cleaning material;

[0058] Fig.13A and Fig. 13B Illustration of cleaning of the probe tip using typical cleaning materials;

[0059] Fig.14A and Fig. 14B Drawing and Fig. 13B the same probe tip, the probe tip cleaned using a functionalized microfeature cleaning material; and

[0060] Fig.15 A flow chart showing a method for cleaning a wire bonding machine and capillaries using various embodiments of the disclosed cleaning materials. DETAILED DESCRIPTION

[0061] The present disclosure is particularly applicable to cleaning pads for electrical test probes of contact components or capillaries with wire bonding machines, wherein the cleaning pad has a predetermined geometry and mechanical properties. The contact components being cleaned may be any type of test probe, such as cantilever lead pins, vertical probes, cobra probes, MEMS-type vertical and MEMS-type micro-cantilever probes, plunger probes, spring probes, sliding contacts, contact bump probes formed on thin films, etc., and associated support structures (i.e., probe cards, test sockets, and other similar interface devices) for tester interface devices utilized for wafer-level and package-level testing. The present disclosure will be described in this context; however, it will be appreciated that the cleaning materials, devices, and methods have greater utility, such as cleaning test interfaces utilized by other types of IC semiconductor device evaluation equipment, such as spring pin ring interfaces, ZIFF male / female connectors, etc. In addition, the cleaning materials, devices and methods have greater utility because they can be used to clean any device with capillaries that become clogged over time through various materials, they can also be used to clean or refurbish other assembly machines, and the devices, mechanisms and methods can be implemented using variations of the embodiments disclosed below that are still within the scope of the present disclosure.

[0062] In one embodiment, a cleaning apparatus and method incorporating a cleaning pad configuration with surface functionalization or surface tunability is disclosed. Surface functionalization with predetermined microfeatures of customized geometry effectively facilitates adjustable behavior to modify the mechanical properties of the cleaning surface in order to achieve specific performance goals, such as contact surface cleaning, tip shaping, debris removal and collection, and surface texturing. Materials with structurally functionalized well-tuned structured surfaces contain microscale features that are produced in a controlled manner at the microscale level via embossing, molding, casting, coating, film deposition, spray deposition, or other surface modification for the purpose of improving material cleaning efficiency and mechanical properties. In addition, the equipment and labor to repair and replace contactors that have been worn by abrasive contact cleaning processes add additional costs to the tasks performed.

[0063] In one embodiment, the cleaning material may be a flexible, semi-rigid or rigid medium having a surface functionalized with 3-dimensional (3D) microfeatures that provide performance characteristics not possible with flat, non-functionalized surfaces to have specific abrasive and debris removal efficacy for cleaning electrical contact components and structures of tester interface devices (i.e., probe cards, test sockets and other similar interface devices) utilized for wafer-level and package-level testing or capillaries for wire bonding machines. Surface functionalization or surface tunability with adjustable behavior is an effective way to modify the mechanical properties of the cleaning surface to achieve specific performance goals such as: contact surface cleaning, tip shaping, debris removal and collection, and surface texturing or cleaning the inner and outer surfaces of capillaries. Materials with structurally functionalized surfaces contain microscale features that are produced in a controlled manner at the microscale level via imprinting, molding, casting, coating, film deposition, spray deposition or other surface modification for the purpose of improving material cleaning efficiency and mechanical properties.

[0064] In one embodiment, a functionalized surface with predetermined properties (such as thickness, hardness, stickiness, etc.) can be applied to the surface of a cleaning pad across existing structural features and across microfeatures to provide a new class of cleaning materials that can be tailored and optimized for electrical contact components and structural applications or capillaries, and with a well-defined set of functions. High levels of cleaning efficacy can be obtained by functionalizing the cleaning surface to mimic: pads, bumps or pillars of semiconductor devices in combination with sticky or abrasive surface coatings, exposed abrasive particles for variable abrasive efficiency, and depending on the type and shape of the contact component being cleaned, the composition and amount of debris to be removed, and the affinity of the debris to the contact surface. High levels of cleaning efficacy can also be obtained by functionalizing the cleaning surface to be able to clean the inner and outer surfaces of capillaries used in wire bonding machines.

[0065] More specifically, the functionalized cleaning material may be constructed with a predetermined pad, bump or pillar surface topography or a functionalized surface coating (each having predetermined mechanical, material and dimensional properties, such as abrasiveness, density, elasticity, viscosity, planarity, thickness, porosity, etc.) on one or more support layers. The cleaning device may have a sacrificial top protective layer of a material that may be applied before, during or after the manufacturing process to protect and isolate the cleaning material surface from contamination during the manufacturing process and manual handling operations. After installation into semiconductor or other test equipment, the sacrificial layer is removed and used to ensure that the working surface of the cleaning material is free of any contamination that would compromise the cleaning performance of the contact components or capillaries by the cleaning material.

[0066] The cleaning layer and the functionalized 3D surface features can be made of solid elastomeric materials or porous, open-cell or closed-cell foam materials, which can include rubber and both synthetic and natural polymers, as well as polyurethanes, acrylics, etc., or other known elastomeric materials. The functionalized surface features can have predetermined abrasiveness, elasticity, density and surface energy parameters, which can allow the contact component to deform and penetrate the elastomeric material to remove debris from the contact area without damaging the geometry of the contact component while retaining the integrity of the elastomeric matrix. For capillaries, the functionalized surface features can have predetermined abrasiveness, elasticity, density and surface energy parameters, which can allow the inner and outer surfaces of the capillaries to be effectively cleaned while retaining the integrity of the elastomeric matrix.

[0067] The cleaning material may also have a multi-layer structure in which one or more compliant layers are arranged or stacked to achieve a predetermined overall performance so that when the pins or contact components touch and deform the functionalized features and pad surfaces, a defined reciprocal force is imparted by the material to the contact area and 3D structure to increase the efficiency of removing debris and contaminants. The cleaning material with a multi-layer structure also cleans the inner and outer surfaces of the capillaries.

[0068] In one embodiment (an example of which is shown in FIG. 4A to FIG. 4C and Figure 5 In another embodiment (an example of which is shown in FIG. 1 ), the cleaning material may have a surface layer filled with a plurality of predefined "positive" geometric microfeatures (such as pillars, cones, or other such structural microfeatures) having a predetermined aspect ratio (diameter or length and width to height), cross-section (square, circular, triangular, etc.). FIG. 6A to FIG. 6C and Figure 7 In the present invention, the cleaning material may have a surface layer filled with a plurality of predefined "yin" or "inverted" geometric microfeatures. The "yang" or "yin" microfeatures may be made of solid elastomeric materials or closed foam materials, which may include rubber and both synthetic and natural polymers, as well as polyurethanes, acrylic resins, polymers, etc., or other known elastomeric materials. The surface layer may have abrasive particle loading or exposed abrasive to improve debris removal and collection efficiency.

[0069] In other embodiments, "positive" or "negative" microfeatures may have abrasive particles applied to the top surface, along the length of the microfeature, within the body of the microfeature, or at the base of the microfeature. In particular, typical microfeatures (whether positive or negative) may have varying cross-sectional widths of 15 μm or less, have heights of 400 μm or less, have a pitch of 250 μm or less, and an average abrasive particle size of less than 30 μm. Typical abrasives that may be incorporated into and across material layers and features may include aluminum oxide, silicon carbide, tantalum oxide, and diamond, but the abrasive particles may also be other well-known abrasive materials having a Mohs hardness of 7 or greater.

[0070] In other embodiments, the microfeatures are built, molded or formed in a predetermined geometry to achieve a predetermined flexibility and movement so that when the pin or contact element touches the pad surface, a reaction force is imparted by the material to the contact area within the contact element tip geometry and the support structure to increase the efficiency of removing debris and contaminants. The functional microfeatures have a predetermined size to provide a predictable and uniform reaction force to each test probe and support hardware within the contact element array. The functional features can have different predetermined sizes to provide predictable cleaning of the inner and outer surfaces of the capillary.

[0071] In another aspect of the cleaning device, the microfeatures may have a specific matte or patterned textile or finish that enables a detector / tester device to detect the surface of the cleaning pad. The surface texture and roughness of the cleaning material may also have an effect on the cleaning efficiency of the working surface polymer material.

[0072] In one aspect of the method, a cleaning medium may be manually placed in a predetermined position within automated test equipment, such as a wafer prober or packaged device handler, so that the pin assembly and surface will periodically interact with the cleaning medium to remove debris and / or clean the contact surface of the pin or contact assembly without excessively wearing the test probe. In another aspect of the method, a method for cleaning a probe assembly on a wafer prober or packaged device handler is provided, wherein the method includes loading a cleaning medium into a wafer prober or packaged device handler in a form similar to a semiconductor wafer, singulated IC device, or packaged IC device being tested, and the cleaning medium has a top surface having functionalized microfeatures, the functionalized microfeatures having predetermined properties for cleaning the contact assembly and support structure, such as abrasiveness, viscosity, hardness. The method further includes contacting the contact assembly with the cleaning medium during normal test operation in the wafer prober or packaged device handler, so that any debris is removed from the probe assembly during normal operation of the wafer prober or packaged device handler. Similar methods may be performed for wire bonding machines and capillaries.

[0073] When the probe / tester can detect the surface of the cleaning pad, the probe can be set to automatic cleaning mode. In automatic cleaning mode, the probe / tester will automatically determine when to clean the test probe contact assembly, position the cleaning device, clean the probe tip, and then return to the test operation. After repeated touchdowns on the device under test (DUT), pad material and other surface contaminants will accumulate on the test probe contact assembly and the length of the test probe. Such loose debris can significantly increase the contact resistance, resulting in reduced wafer and package yield. High contact resistance or continuous fault devices (binouts) can trigger the tester to send a command to the semiconductor device handling machine so that the cleaning operation is performed through the "on demand" functionality. Alternatively, the semiconductor device handling machine can be scheduled to perform a cleaning operation at the beginning of LOT, the end of LOT, or after a predetermined number of device touchdowns. As a result, a scheduled and efficient cleaning process is very critical in controlling contact resistance.

[0074] In another embodiment of the cleaning device, the layer of cleaning medium may be formed of a continuous, insulating or resistive material so that a tester / probe or wire bonder that detects the surface using conductive or capacitive methods can detect the surface of the cleaning medium.

[0075] Typical IC semiconductor test system (in Figure 1A and Figure 1B 1) typically includes some type of tester 10, a test head 11, a tester interface 12 (e.g., a probe card or test socket), a contact assembly 13, and a wafer or device handler 16. Electrical contact assemblies 13 or test probes within the tester interface extend from the tester interface to allow direct contact with the DUT 15. The DUT (wafer, singulated device, or packaged IC) is moved to the appropriate physical position using automated, semi-automatic, or manual equipment so that the probe pads 14 and / or solder balls 16 are aligned with the contact assemblies 13 of the tester interface 12. Once in the proper position, the DUT 15 is moved against the contact assembly 13, or the contact assembly 13 is moved against the DUT 15 for electrical testing. With repeated touchdowns, the contact assemblies become contaminated. Instead of removing the test interface for cleaning, a cleaning medium having a predetermined configuration will remove contamination during normal test operations.

[0076] Figure 1C A conventional wire bonding assembly machine 100 is shown having a capillary 102 for wire bonding operations. The wire bonding assembly machine has various conventional components of a wire bonding machine ( Figure 1CWirebond assembly machine can be used to produce wire bonds for any device, component, die, etc. that is desired to be able to produce wire bonds. Figure 1C A portion of the machine 100 is shown, and in particular a capillary 102 having an outlet and a wire 104 (such as copper or gold) that passes through the capillary. The capillary 102 is typically removably attached to the wire bonding machine so that the capillary can be removed and periodically cleaned and refinished during a conventional cleaning process. The wire bonding machine may have a mechanism for heating the end of the wire extending from the capillary to form a free air ball of molten wire 106. Figure 1C 102 is a semiconductor device 108 on a substrate 110, and the capillary 102 is compressed between the end of the capillary and the heated metal pad or other metal frame to create a mechanical connection that is intended to form a eutectic bond between the lead ball and the bond pad or frame. The capillary can then be raised while feeding the lead through the capillary, leaving the lead ball attached to the die bond pad or frame.

[0077] Figure 1D A known wire bonding assembly machine with a capillary is depicted during a cleaning operation 200 using a cleaning material 202. In particular, while the capillary 102 remains connected to the wire bonding machine (unlike a typical cleaning process as described above), the end of the capillary 102 can be inserted into the cleaning material 202 so that debris inside the capillary and / or adjacent to the outlet of the capillary 102 can be dislodged from the capillary and trapped / retained in the cleaning material 202.

[0078] Figure 2A , Figure 2B and Figure 2C Three typical different types of cleaning devices are shown that are manufactured by applying cleaning media to various substrate materials, substrates of different sizes, substrates of different shapes, or for some applications no substrate. Figure 2A and Figure 2B , cleaning devices 20 and 21 may each include a substrate 23, and a cleaning medium or pad 24, respectively, secured, adhered or applied to a wafer surface or to a substrate of known geometry. Substrate 23 may be a polymer, plastic, metal, glass, silicon wafer, ceramic or any other similar (rigid, semi-rigid or flexible) material. In addition, substrate 25 may have a form factor or structure that approximates the geometry of packaged IC device or DUT 22, whereby cleaning medium 24 is attached to the surface of contact components and supporting hardware that support test probes.

[0079] Figure 3A and Figure 3B A conventional cleaning medium 220 is shown, which comprises a cleaning pad layer 202 having predetermined properties (such as hardness, elastic modulus, viscosity, etc.) and a flexible bottom layer 203 ( Figure 3A ) or rigid bottom layer 206 ( Figure 3B ). The cleaning medium 220 may also have a removable protective layer 201, which is installed before the contact component is intended to be used for cleaning, so as to isolate the surface cleaning pad from non-test related contaminants. The cleaning medium 220 may have one or more intermediate layers 203 and 206 attached to the cleaning pad and attached below the cleaning pad. The combination of layers produces material properties that cannot be obtained from the individual constituent materials, and the combination of matrix, abrasive particles and geometric shapes can maximize the cleaning performance. The installation of the cleaning device on the predetermined substrate material is carried out by removing the second release liner layer 205 (made of the same material as the first release liner layer) to expose the adhesive layer 204, and then applying the adhesive layer 204 to the substrate surface. The adhesive layer 204 can then be placed against the substrate to adhere the cleaning device 220 to the substrate. The substrate can be a variety of different materials as described in the prior art, which have different uses.

[0080] Now, the cleaning media with functional micro features will be described in more detail with reference to the accompanying drawings and embodiments. Figure 5 As shown in , the cleaning medium 221 may have abrasive properties that loosen and shear debris from the contact assembly or capillary. Using abrasive particles of predetermined volume and mass density, the abrasiveness of the pad can be systematically affected so as to round or sharpen the probe tip. Typical abrasive material and particle weight percentage loading in the cleaning material layer can range from 0% (unloaded) to 500% weight percentage. Typical abrasives that can be incorporated into the material may include aluminum oxide, silicon carbide and diamond, but the abrasive material may also be other well-known abrasive materials. The abrasive may include spatially or preferentially distributed particles of aluminum oxide, silicon carbide or diamond, but the abrasive particles may also be other well-known abrasive materials with a Mohs hardness of 7 or greater. The controlled surface viscosity of the cleaning layer will cause the debris on the contact assembly to preferentially stick to the pad during the cleaning operation and thus be removed from the contact assembly. The abrasive particles may be distributed in the body of each micro-feature, as described below.

[0081] In the cleaning medium 221 ( Figure 5 In one embodiment (shown in FIG. 1 ), the maximum cleaning efficiency of the cleaning medium 221 can be improved using a plurality of uniformly shaped and regularly spaced "positive" geometric microfeatures in a microfeature layer 250. Examples of different embodiments of positive microfeatures are shown in FIG. FIG. 4A to FIG. 4C, the figure shows a plurality of micro-cones 401, a plurality of micro-pillars 403, or a plurality of curved micro-cones 405 having a predetermined geometric shape. Figure 5 In the embodiment, the cleaning medium 221 is constructed of a single cleaning pad layer having "positive" microfeatures 250 onto a combination of an intermediate flexible or rigid layer 207 having predetermined properties. In other embodiments, the microfeatures may be variably spaced across the cleaning medium 221. The cleaning pad layers 202 and 203 described above the cleaning material reference plane 255, and the cleaning pad layers described below the cleaning material reference plane 255 may provide predetermined mechanical, material, and dimensional properties for the cleaning material. For example, the cleaning pad layer may provide abrasiveness (described in more detail below), specific gravity (e.g., in the range of 0.75 to 2.27) (where specific gravity is the ratio of density to water density at a specific temperature), elasticity (e.g., in the range of 40 MPa to 600 MPa), viscosity (e.g., in the range of 20 to 800 grams), flatness, and thickness (e.g., in the range of 25 μm and 300 μm). The selection of materials and layers is determined based on the desired reaction forces necessary to facilitate effective cleaning action. For example, a highly rigid material will have a greater reaction force required in the removal of a strongly adhesive material. When cleaning fragile or small diameter contact components, a highly flexible material will be selected.

[0082] As an example of a type of functional "yang" micro-feature construction, Figure 4A , Figure 4B , Figure 4C The microfeatures shown in can be produced using a combination of precision manufacturing methods such as casting or molding, whereby the cleaning pad is built so that the plateau of each microfeature (the top portion 406 of each microfeature) has a size of less than 40 μm, a height of each microfeature from the substrate reference plane 408 of less than 500 μm, and a plateau to plateau spacing (the distance between each microfeature) of less than 250 μm. Figure 4A In the example 401 shown in , each pyramidal microfeature 402 has a 25 μm square plateau with a height of 40 μm and a plateau to plateau spacing of 100 μm. For this construction, the 3D features are obtained through a precision manufacturing process so that the cleaning pad and the functionalized microfeatures have a uniform composition. The size and geometry of the "yang" microfeatures can vary depending on the configuration and material of the contact assembly to achieve a pad that will remove debris but will not damage the probe assembly. Typically, the "yang" microfeatures can have several types of geometries, including cones 401, round or square columns 404 with uniform plateaus, or various curved shapes 403 with square or round plateaus less than 40 μm, etc. The microfeature type and "yang" geometry can be adjusted during the manufacture of the cleaning layer so that the material can be used to reshape, sharpen or refinish the probe assembly tip and probe assembly structure. Alternatively, the microfeature type and geometry can be used to clean the inner and outer surfaces of the capillary.

[0083] The dimensions of the "positive" features may have a base to top of each feature above base reference plane 408 of 25 μm to 500 μm, a top surface area geometry that may be flat or shaped and have dimensions ranging from an XY dimension of 20 μm up to the XY dimension of the microfeature base (the sides of the positive features may be straight or curved), and a mesa to mesa spacing (the distance between each microfeature) of 50 μm to 250 μm.

[0084] In the cleaning medium 221 ( Figure 7 In another embodiment (shown in FIG. 1 ), the FIG. 6A to FIG. 6C The maximum cleaning efficiency of the cleaning material can be improved by using a plurality of "negative" uniformly shaped and regularly spaced geometric micro features (such as a plurality of inverted micro pyramids 601, a plurality of micro pillars 603, or a plurality of curved inverted micro pyramids 605) of a predetermined geometric shape as shown in FIG. In other embodiments, the micro features can be variably spaced across the cleaning medium 221. Figure 7 In FIG. 2 , the cleaning medium 221 is constructed from a combination of a single cleaning pad layer having “negative” microfeatures 251 onto an intermediate flexible or rigid layer 207 having predetermined properties.

[0085] As an example of a type of functional "yin" micro-feature construction, Fig. 6A , Figure 6B , Figure 6C The microfeatures shown in can be produced using a combination of precision manufacturing methods such as casting or molding, thereby building a cleaning pad so that the plateau has a size less than 40 μm, a height less than 100 μm, and a base-to-base spacing less than 250 μm. In these examples, each microfeature is recessed into a substrate reference plane 608. Fig. 6A In the example microfeature 601 shown in , each pyramidal microfeature 602 has a 25 μm square base, has a 40 μm height, and a base-to-base spacing of 100 μm. For this construction, the 3D features are achieved through a precision manufacturing process so that the cleaning pad and microfeatures have a uniform composition. The size and geometry of the "female" microfeatures can vary depending on the configuration and material of the contact assembly to achieve a pad that will remove debris but will not damage the probe assembly. Typically, the "female" microfeatures can have several types of geometries, including inverted cones 602, round or square columns 604 with uniform bottoms, or various curved inverted shapes 406 with bases less than 40 μm square or round, etc. The microfeature type and "female" geometry can be adjusted during the manufacture of the cleaning layer so that the material can be used to reshape, sharpen, or refinish the probe assembly tips and probe assembly structures. As an example, as in Fig. 6A or Figure 6CThe female microfeatures shown in FIG. 4 can be used to clean advanced microcantilever contact components because their physical shape and size clean all critical surfaces of the microcantilever contact component, or the inner and outer surfaces of the capillary.

[0086] The dimensions of the "female" features may have a base to top of each feature below base reference plane 608 of 25 μm to 500 μm, a bottom surface area geometry that may be flat or shaped and have dimensions ranging from an XY dimension of 20 μm up to the XY dimension of the microfeature opening (the sides of the female features may be straight or curved), and a bottom to bottom spacing (the distance between each microfeature) of 50 μm to 250 μm.

[0087] Another embodiment of a cleaning pad / media / device having functionalized microfeatures is shown in FIG. 8A to FIG. 8C , which shows an example of an enlarged cross-sectional view of a cleaning material 800 having a "positive" microfeature layer (having microcones 802, micropillars 804, curved microcones 806) beneath a 10 μm to 100 μm thick polymer layer having predetermined properties, which has been applied across the surface of the "positive" features (801, 803, and 805, respectively). The polymer layer is applied to a predetermined thickness of less than 100 μm across the top surface and within the spacing between the microfeatures. The polymer can be viscous and abrasive-free, or loaded with an abrasive. Typical abrasives that can be incorporated into the polymer can include aluminum oxide, silicon carbide, and diamond, but the abrasive particles can also be other well-known abrasive materials with a Mohs hardness of 7 or greater. The amount and size of the abrasive material can vary depending on the configuration of the microfeatures of the cleaning pad or based on the material and geometry of the contact component in order to achieve a pad that will remove and collect debris but will not damage the contact component or the supporting hardware or the end of the capillary.

[0088] FIG. 8D to FIG. 8F An example of an enlarged cross-sectional view of a cleaning material 800 is shown having a "positive" microfeature layer (having micropyramids 802, micropillars 804, curved micropyramids 806) beneath a 10 μm to 100 μm thick polymer layer having predetermined properties that has been applied across the surface of the "positive" features (801, 803, and 805, respectively). The microfeatured cleaning pad layer may then be built up onto one or more intermediate flexible or rigid material layers beneath the cleaning pad layer having predetermined properties and the protective liner.

[0089] Another embodiment of a cleaning pad / media / device having functionalized microfeatures is shown in 9A to 9C, which shows an example of an enlarged cross-sectional view of a cleaning material having "female" microfeatures (inverted microcones 901, inverted micropillars 903, curved inverted microcones 905) of a 10 μm to 100 μm thick polymer layer having predetermined properties, which has been applied across the surface of the "female" features (901, 903, and 905, respectively). The polymer layer is applied across the top surface and into the recesses (cavities) of the "female" microfeatures, thereby coating the interior surface of each female microfeature. The polymer can be viscous and abrasive-free, or loaded with abrasive particles. Typical abrasives that can be incorporated into the polymer can include aluminum oxide, silicon carbide, and diamond, but the abrasive particles can also be other well-known abrasive materials with a Mohs hardness of 7 or greater. The amount and size of the abrasive material can vary depending on the configuration of the microfeatures of the cleaning pad or based on the material and geometry of the contact component in order to achieve a pad that will remove and collect debris but will not damage the contact component or supporting hardware or capillaries. The micro-topographic cleaning pad layer may then be constructed onto one or more intermediate flexible or rigid material layers beneath a cleaning pad layer and protective liner having predetermined properties. The above embodiments will typically be used in a system for testing a wafer or one or more dies on a semiconductor wafer prior to being singulated and / or encapsulated into an assembled package.

[0090] Now, another embodiment of a cleaning apparatus will be described, wherein the cleaning apparatus can be used to clean contact components for electrically testing a DUT, wherein individual semiconductor devices from a wafer have been encapsulated in a material 501 (such as plastic), such as Fig. 10A In this illustrative example, the cleaning apparatus can also be used by ATE and testers to handle and test packaged integrated circuits (ICs). The IC package may have one or more electrical leads or solder balls extending from the package that conduct electrical signals (including power signals, ground, and I / O signals, etc.) ( Figure 1B ) where one or more dies are inside the package 15. The tester interface, in this case called a test socket 12, will have a plurality of contact assemblies 13 (similar to the probe card tester described above) that contact the leads of the package and test the electrical characteristics of the packaged DUT. Typically, the contact assemblies are mounted to various spring loaded probes or flexible contact assemblies and may have a geometric configuration with a single spear, crown or other multi-tip contactor. The flexible contact assemblies may be held in an elastomer, a silicone rubber layer held in a memory socket, a logic socket, a burn-in socket, or an interposer.

[0091] Similar to the probe card cleaner embodiment, a cleaning device for an encapsulated device may use a substrate (to which the cleaning pad material 503 has been applied) to approximate the DUT shape, such as in Fig. 10B, so that the contact assembly of the test socket can periodically contact the cleaning pad surface to remove debris from the tip of the probe assembly. The size of the cleaning device can be modified to fit the size and shape of a specific socket, or to approximate the size of a specific device. Fig. 10B In the microtopographic embodiment shown in , the cleaning material 503 is configured to mimic the size, geometry, spacing, and exact placement of solder balls from the DUT.

[0092] exist Fig.11A In the embodiment of the present invention, a cleaning device 600 may have the layers described above, and a cleaning pad layer 601 having a plurality of cleaning balls 603 made of a cleaning material that matches the geometry of the DUT solder balls, will have abrasive properties such that the back pressure on the contact components imparts efficient cleaning to remove and collect debris from the contact components. The height, diameter, and position of the cleaning balls are predetermined based on the configuration of the DUT and the material of the contact components. The spacing, geometry, and abrasive properties of the cleaning balls are such that the back pressure on the contact components imparts efficient cleaning to remove and collect debris from the contact components.

[0093] In another embodiment, Fig. 11B A cross-sectional view of a cleaning device 600 is shown with a cleaning pad layer 602 having a plurality of cleaning balls 603 matching the DUT solder ball geometry as described above, the cleaning balls further having a 10 μm to 100 μm thick uniform cleaning polymer layer 605 with predetermined properties applied across the surface. Thus, the pad / polymer / substrate layer and the number of functionalized micro-features of the cleaning surface are controlled to provide control of the overall thickness of the cleaning device and consistency of the thickness of the cleaning. This multi-layer embodiment with cleaning balls will also provide accurate cleaning within the guide holes of the floating bed socket and the interior of the sockets and contacts of the probe.

[0094] Now, refer to Fig.12A method for cleaning multiple probe assemblies and supporting hardware or solder balls using a disclosed cleaning device having functionalized microfeatures is described. Insertion of a contact assembly for a tester interface or solder balls of an encapsulated integrated circuit into the cleaning device removes adherent debris from the contact assembly and supporting hardware or DUT without leaving any organic residue that must subsequently be removed by additional in-line or de-internal processes. In addition, the overall electrical characteristics and geometry of the contact assembly are not affected; however, the overall electrical performance required for high yield and low contact resistance is restored. The method achieves the goal of removing debris from the contact assembly without removing the tester interface from the ATE, thereby increasing the productivity of the tester. The cleaning device can have the same size and shape as a typical DUT being tested by the tester and can be inserted into a predetermined cleaning tray. Alternatively, the cleaning material having functionalized microfeatures can be placed into a substrate (such as a wafer), which can be placed into a wafer carrier for cleaning. The cleaning material layer of the device has predetermined physical, mechanical and geometric properties depending on the configuration and materials of the contact components and supporting hardware of the tester interface.

[0095] As described above, this cleaning step can occur when the cleaning device is periodically installed from a cleaning tray positioned under the contact assembly of the tester interface, or whenever a cleaning operation of the contact assembly is performed from a wafer cassette, or ATE, by a cleaning material installed on a polishing plate. The use of the cleaning device does not interrupt the operation of the ATE in any way, since the cleaning of the contact assembly is achieved during normal operation of the test machine. In this way, the cleaning device is inexpensive and permits the cleaning and / or shaping of the contact assembly without removing the contact assembly or the tester interface from the ATE.

[0096] The method and apparatus provide one or more advantages, including but not limited to maintaining contactors and contact pins clean. Although the present disclosure has been described with reference to certain illustrative embodiments, the content described herein is not intended to be interpreted in a restrictive sense. For example, without departing from the present disclosure, variations or combinations of the steps in the illustrated and described embodiments may be used in specific situations. Various modifications and combinations of the illustrative embodiments and other advantages and embodiments of the present disclosure will be clear to those skilled in the art after reference to the drawings, the specification and the claims. It is intended that the scope of the present disclosure is defined by the appended claims and their equivalents. Although the foregoing has been referred to specific embodiments of the present invention, those skilled in the art will understand that this embodiment may be changed without departing from the principles and spirit of the present disclosure, and the scope of the principles and spirit of the present disclosure is defined by the appended claims.

[0097] Fig.12A flow chart is shown showing a method 1200 for cleaning a semiconductor device or a tester or a probe assembly using various embodiments of the disclosed cleaning material having functionalized microfeatures. Fig.12 The method in is for cleaning a tester interface, but it should be understood that similar methods will be used to clean a DUT, etc. In this method, the tester performs its test 1202. The tester (with a control system) or a separate computer system can determine whether the tester should be cleaned based on time intervals or characteristic measurements during the test process 1204. If cleaning is not required, the tester continues testing 1202. If it is determined that the tester should be cleaned, a cleaning device with functionalized microfeatures can be moved to a cleaning position (1206) by various means, without taking the tester offline so that cleaning can be performed using cleaning materials during the normal test program of the test machine (1208). Once the cleaning is completed, the tester resumes its test function (1210).

[0098] Test Results

[0099] Fig.13A and Fig. 13B The cleaning of the probe tip using typical cleaning materials is shown. Specifically, Fig.13A Typical cleaning materials showing non-functionalized microfeatures come into contact with the probe tip, resulting in not all critical surfaces of the probe being effectively cleaned. An example of a probe after cleaning using a typical cleaning material is shown in Fig. 13B In some embodiments, various debris still adheres to or sticks to the probe, causing the problems described above.

[0100] In contrast, Fig.14A and Fig. 14B Draws the Fig. 13B The same probe tip was cleaned using a functionalized microfeature cleaning material. Fig.14A As shown in , each probe (including the ramp and the tip, collectively referred to as the total probe area) is contacted by the side of the functionalized microfeature. An example of a probe after cleaning with a cleaning material having functionalized microfeatures is shown in Fig. 14B In the example above, each probe is much cleaner because all critical surfaces of each probe are cleaned.

[0101] Fig.15A flow chart showing a method 1500 for cleaning a wire bonding machine and capillary using various embodiments of the disclosed cleaning material with functionalized micro features. In the method, a wire bonding machine performs its wire bonding operation 1502. The wire bonding machine (having a control system) or a separate computer system can determine whether it is time to clean the wire bonding machine based on a time interval or characteristic measurement of the wire bonding process (1504). If cleaning is not required, wire bonding continues (1502). If it is determined that the capillary is cleaned, the cleaning device with functionalized micro features described above can be moved to a cleaning position (1506) by various known means, without taking the wire bonding machine offline, thereby performing cleaning using the cleaning material during the normal operating procedures of the wire bonding machine (1508). Once cleaning is completed (1510), the wire bonding resumes its wire bonding operation (1512).

[0102] For purposes of explanation, the foregoing description has been described with reference to specific embodiments. However, the above illustrative discussion is not intended to be exhaustive or to limit the present disclosure to the precise form disclosed. In view of the above teachings, many modifications and variations are possible. Embodiments are selected and described in order to best explain the principles of the present disclosure and its practical application, so as to enable others skilled in the art to best utilize the present disclosure, and various embodiments with various modifications suitable for the specific purpose contemplated.

[0103] The systems and methods disclosed herein may be implemented via one or more components, systems, servers, appliances, other subcomponents, or distributed among such components. When implemented as a system, such systems may include and / or contain components present in a general-purpose computer, such as software modules, a general-purpose CPU, RAM, etc. In an implementation where the innovation is a server, such a server may include or contain components such as components present in a general-purpose computer, such as a CPU, RAM, etc.

[0104] In addition, the systems and methods herein may be implemented with completely different or disparate software, hardware, and / or firmware components other than those described above. For example, with respect to such other components (e.g., software, processing components, etc.) and / or computer-readable media associated with or embodying the present invention, the innovative aspects herein may be implemented consistently with numerous general or special computing systems or configurations. Various exemplary computing systems, environments, and / or configurations that may be suitable for use with the innovations herein may include, but are not limited to, software or other components embodied within or on a personal computer, server, or server computing device, such as a navigation / connectivity component, a handheld or laptop device, a multiprocessor system, a microprocessor-based system, a set-top box, a consumer electronic device, a network PC, other existing computer platforms, a distributed computing environment including one or more of the above systems or devices, and the like.

[0105] In some examples, aspects of the systems and methods may be achieved or performed by logic and / or logic instructions including program modules, for example, in conjunction with such components or circuit systems. In general, program modules may include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific instructions herein. The present invention may also be practiced in the context of a distributed software, computer or circuit configuration, wherein the circuit systems are connected via a communication bus, circuit system or link. In a distributed configuration, control / instructions may occur from local and remote computer storage media including memory storage devices.

[0106] The software, circuit systems and components herein may also include and / or utilize one or more types of computer-readable media. Computer-readable media may be any available media that resides on, is associated with or can be accessed by such circuits and / or computing components. By way of example, and not limitation, computer-readable media may include computer storage media and communication media. Computer storage media include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disc (DVD), or other optical storage, tape, disk storage, or other magnetic storage device, or any other media that can be used to store the desired information and can be accessed by a computing component. Communication media may include computer-readable instructions, data structures, program modules and / or other components. In addition, communication media may include wired media, such as a wired network or a direct-connection, however, any such type of media herein does not include transitory media. Combinations of any of the above are also included within the scope of computer-readable media.

[0107] In this description, the terms component, module, device, etc. may refer to any type of logical or functional software component, circuit, block and / or process that can be implemented in a variety of ways. For example, the functions of various circuits and / or blocks can be combined with each other into any other number of modules. Each module can even be implemented as a software program stored on a tangible memory (e.g., random access memory, read-only memory, CD-ROM memory, hard drive, etc.) to be read by a central processing unit to implement the innovative functions herein. Alternatively, the module may include programming instructions transmitted to a general-purpose computer or to processing / graphics hardware via a transmission carrier wave. Again, the module may be implemented as a hardware logic circuit system that implements the functions covered by the innovation herein. Finally, the module may be implemented using dedicated instructions (SIMD instructions), field programmable logic arrays, or any mixture thereof that provides the desired level of performance and cost.

[0108] As disclosed herein, features consistent with the present disclosure may be implemented via computer hardware, software, and / or firmware. For example, the systems and methods disclosed herein may be embodied in various forms, including, for example, data processors (such as, computers that also include databases), digital electronic circuit systems, firmware, software, or combinations thereof. In addition, although some of the disclosed implementations describe specific hardware components, systems, and methods consistent with the innovations herein, they may be implemented by any combination of hardware, software, and / or firmware. In addition, in various embodiments, the above-noted features and other aspects and principles of the innovations herein may be implemented. Such environments and related applications may be specially constructed for performing various routines, processes, and / or operations according to the present invention, or they may include general-purpose computers or computing platforms that are selectively activated (activated) or reconfigured by program code to provide the necessary functionality. The processes disclosed herein are not inherently related to any particular computer, network, architecture, environment, or other device, and may be implemented by a suitable combination of hardware, software, and / or firmware. For example, various general-purpose machines may be used by programs written in accordance with the teachings of the present invention, or they may be more convenient for constructing special-purpose devices or systems to perform the desired methods and techniques.

[0109] Aspects of the methods and systems described herein (such as logic) may also be implemented as functionality programmed into any of a variety of circuit systems, including programmable logic devices ("PLDs"), such as field programmable gate arrays ("FPGAs"), programmable array logic ("PAL") devices, electrically programmable logic and memory devices, and standard cell-based devices and application specific integrated circuits. Some other possibilities for implementing aspects include: memory devices, microcontrollers with memory (such as EEPROM), embedded microprocessors, firmware, software, etc. In addition, aspects may be embodied in microprocessors with software-based circuit simulation, discrete logic (sequential and combinatorial), custom devices, fuzzy (neutral) logic, quantum devices, and hybrids of any of the above device types. The underlying device technology can be provided in a variety of component types, for example, metal oxide semiconductor field effect transistor ("MOSFET") (such as complementary metal oxide semiconductor ("CMOS")) technology, bipolar technology such as emitter coupled logic ("ECL"), polymer technology (such as silicon conjugated polymer and metal conjugated polymer-metal structures), mixed analog and digital, etc.

[0110] It should also be noted that the various logics and / or functions disclosed herein may be implemented using any number of combinations of hardware, firmware, and / or as data and / or instructions embodied (in terms of its behavior, register transfers, logical components, and / or other characteristics) in various machine-readable or computer-readable media. Computer-readable media that may embody such formatted data and / or instructions include, but are not limited to, non-volatile storage media in various forms (e.g., optical, magnetic, or semiconductor storage media), but again, do not include transient media. Unless the context clearly indicates otherwise, throughout this specification, the words "comprise," "comprising," and the like are to be interpreted in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, in the sense of "including, but not limited to." Words using the singular or plural number also include the plural or singular number, respectively. In addition, the words "herein," "hereunder," "above," "below," and similarly introduced words refer to this application as a whole and not to any particular portion of this application. When the word "or" is used in reference to a list of two or more items, that word includes all of the following interpretations of the word: any of the items in the list, all of the items in the list, and any combination of the items in the list.

[0111] Although certain currently preferred implementations of the present invention have been specifically described herein, it will be apparent to those skilled in the art to which the present invention relates that changes and modifications may be made to the various implementations shown and described herein without departing from the spirit and scope of the present invention. It is therefore intended that the present invention be limited only to the extent required by applicable legal rules.

[0112] Although the foregoing has been described with reference to a particular embodiment of the present disclosure, it will be appreciated by those skilled in the art that changes may be made to this embodiment without departing from the principles and spirit of the present disclosure, the scope of which is defined by the appended claims.

Claims

1. A cleaning material having a functionalized surface for cleaning contact components and supporting structures of a test interface for wafer-level or package-level IC semiconductor device testing, the cleaning material comprising: A cleaning media having a cleaning media base reference plane and a plurality of functionalized microfeatures arranged in an array having a plurality of rows and a plurality of columns of functionalized microfeatures, and each functionalized microfeature having a body having width, height, spacing between bodies, and dimensional properties that optimize the cleaning media to clean a contact area and surrounding supporting hardware without modification or damage, each functionalized microfeature extending above the cleaning media base reference plane, and the cleaning media having a plurality of abrasive particles having a Mohs hardness of 7 or greater uniformly distributed within the body of each functionalized microfeature; a cleaning layer applied across the top surface of the cleaning media having predetermined properties for cleaning contaminants from pin contact components and supporting hardware, the cleaning layer being applied on top of all functionalized microfeatures and within the spacing between functionalized microfeatures down to the cleaning media base reference plane; as well as One or more intermediate rigid or flexible bottom layers beneath the cleaning medium, wherein each bottom layer has an elastic modulus ranging between greater than 40 MPa and 600 MPa, each layer has a thickness between 25 μm and 300 μm, and each layer has a hardness between 30 Shore A and 90 Shore A.

2. The cleaning material of claim 1, wherein the plurality of functionalized microfeatures are microfeatures that are uniformly shaped across the cleaning medium and variably spaced across the cleaning medium. 3 . The cleaning material of claim 1 , wherein the plurality of abrasive particles further comprises one or more particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

4. The cleaning material of claim 1, wherein the cleaning layer further comprises a polymer layer that is 10 μm to 100 μm thick and has a predetermined specific gravity, elasticity, viscosity, flatness, thickness, and porosity.

5. The cleaning material of claim 1, wherein the cleaning layer further comprises: an abrasive polymer layer across the top surface of the cleaning medium, 10 to 100 μm thick, having a plurality of abrasive particles, the plurality of abrasive particles having a Mohs hardness of 7 or greater.

6. The cleaning material of claim 1, wherein each microfeature further comprises: a positive microfeature extending upwardly away from a top surface of the cleaning medium.

7. The cleaning material of claim 6, wherein each positive micro-feature is one of a micro-pyramid, a micro-column, and a curved micro-pyramid.

8. The cleaning material of claim 6, wherein the cleaning layer is applied to a body of each positive microfeature, wherein the body of each positive microfeature has a surface, and the cleaning layer is applied to the surface of each positive microfeature.

9. The cleaning material of claim 6, wherein the cleaning layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or greater, having a thickness of less than 10 μm, applied across a top surface of each positive microfeature and along a body of each positive microfeature.

10. The cleaning material of claim 9, wherein the plurality of abrasive particles are a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

11. The cleaning material of claim 1, wherein each microfeature further comprises a negative microfeature extending downwardly away from a top surface of the cleaning medium.

12. The cleaning material of claim 11, wherein each negative microfeature is one of a micro-pyramid, a micro-column, and a curved micro-pyramid.

13. The cleaning material of claim 11, wherein the cleaning layer is applied across a top surface of the cleaning medium, and into cavities of each negative microfeature, and along interior surfaces of each negative microfeature.

14. A cleaning material as described in claim 11, wherein the cleaning layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or greater, having a thickness of less than 10 μm, applied across the top surface of the cleaning medium, and applied to the cavities of each negative microfeature, and applied along the interior surface of each negative microfeature.

15. The cleaning material of claim 14, wherein the plurality of abrasive particles are a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

16. A method for cleaning contact components and supporting structures of a test interface for wafer-level or package-level IC semiconductor device testing, the method comprising: Performing a test operation of the wafer-level or package-level IC semiconductor device; as well as A cleaning operation is performed using a cleaning apparatus having: a cleaning medium having a cleaning medium base reference plane and a plurality of functionalized microfeatures arranged in an array having a plurality of rows and a plurality of columns of functionalized microfeatures, and each functionalized microfeature having a body having width, height, spacing between bodies, and dimensional properties that optimize the cleaning medium to clean a contact area and surrounding supporting hardware without modification or damage, each functionalized microfeature extending above the cleaning medium base reference plane, and the cleaning medium having a plurality of abrasive particles having a Mohs hardness of 7 or greater uniformly distributed within the body of each functionalized microfeature; A cleaning layer applied across the top surface of the cleaning medium having predetermined properties for cleaning contaminants from pin contact components and supporting hardware, the cleaning layer being applied on top of all functionalized microfeatures and within the spacing between each functionalized microfeature, down to the cleaning medium base reference plane; and one or more intermediate rigid or flexible underlayers beneath the cleaning medium, wherein each underlayer has an elastic modulus ranging from greater than 40 MPa to 600 MPa, each underlayer has a thickness between 25 μm and 300 μm, and each underlayer has a hardness between 30 Shore A and 90 Shore A.

17. The method of claim 16, wherein performing the cleaning operation using a cleaning device further comprises: using a polymer layer having a thickness of 10 μm to 100 μm and having a predetermined specific gravity, elasticity, viscosity, flatness, thickness, and porosity.

18. The method of claim 16, wherein performing a cleaning operation using a cleaning device further comprises: using a plurality of positive microfeatures extending upwardly away from a top surface of the cleaning medium.

19. The method of claim 16, wherein performing a cleaning operation using a cleaning device further comprises: using a plurality of negative microfeatures extending downwardly away from a top surface of the cleaning medium.

20. A cleaning device for cleaning pin contact components and supporting hardware in semiconductor testing equipment, the cleaning device comprising: A cleaning medium having a plurality of geometric surface features simulating solder balls, pillars, copper pillar bumps and / or gold bumps of a semiconductor device under test, wherein the cleaning balls and cleaning pillars further comprise a plurality of abrasive particles distributed within the features and having a Mohs hardness of 7 or greater, for cleaning contact components and support structures of a test interface; a cleaning layer applied across a top surface of each geometric surface feature and along sides of each geometric surface feature having predetermined properties for cleaning contaminants from the pin contact assembly and supporting hardware; as well as A substrate, to which the cleaning medium is attached, has a configuration suitable for introduction into the test equipment during normal testing operations of the test equipment, wherein the substrate contains a surrogate semiconductor wafer or a packaged IC device.

21. The cleaning apparatus of claim 20, further comprising: a plurality of abrasive particles applied across a top surface of each geometric surface feature and along sides of each geometric surface feature.

22. The cleaning device of claim 20, wherein the cleaning layer further comprises: a polymer layer having a thickness between 10 μm and 100 μm, having a determined specific gravity, elasticity, viscosity, flatness, thickness, and porosity.

23. The cleaning device of claim 20, wherein the cleaning layer further comprises: an abrasive polymer layer having a thickness between 10 μm and 100 μm, having a plurality of abrasive particles, the plurality of abrasive particles having a Mohs hardness of 7 or greater.

24. The cleaning device of claim 20, wherein the cleaning layer further comprises: an abrasive polymer layer having a thickness of less than 10 μm and having a plurality of abrasive particles, the plurality of abrasive particles having a Mohs hardness of 7 or greater.

25. The cleaning apparatus of claim 24, wherein the plurality of abrasive particles further comprises: a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

26. A method for cleaning pin contact components and supporting hardware in semiconductor test equipment, the method comprising: performing a test of a device under test having a predetermined configuration of one of solder balls, pillars, copper pillar bumps, and gold bumps; and The pin contact assembly and supporting hardware are cleaned using a cleaning device, the cleaning device having: a cleaning medium having a plurality of geometric surface features that simulate a predetermined configuration of one of a solder ball, a pillar, a copper pillar bump, and a gold bump of a device under test, wherein the cleaning balls and cleaning pillars further comprise a plurality of abrasive particles distributed within the features and having a Mohs hardness of 7 or greater, for cleaning the contact assembly and supporting structure of the test interface; a cleaning layer applied across a top surface of each geometric surface feature and along sides of each geometric surface feature, having predetermined properties for cleaning contaminants from the pin contact assembly and supporting hardware; and a substrate to which the cleaning medium is attached, having a configuration suitable for introduction into the test equipment during normal testing operations of the test equipment, wherein the substrate contains a surrogate semiconductor wafer or a packaged IC device.

27. A cleaning material having a functionalized surface for cleaning a capillary of a wire bonding machine, the cleaning material comprising: A cleaning media having a cleaning media base reference plane and a plurality of functionalized microfeatures arranged in an array having a plurality of rows and a plurality of columns of functionalized microfeatures, and each functionalized microfeature having a body having width, height, spacing between bodies, and dimensional properties that optimize the cleaning media to clean a contact area and surrounding supporting hardware without modification or damage, each functionalized microfeature extending above the cleaning media base reference plane, and the cleaning media having a plurality of abrasive particles having a Mohs hardness of 7 or greater uniformly distributed within the body of each functionalized microfeature; a cleaning layer applied across the top surface of the cleaning media, having predetermined properties for cleaning contaminants from one or more surfaces of the capillaries, the cleaning layer being applied on top of all functionalized microfeatures and within the spacing between the functionalized microfeatures, down to the cleaning media base reference plane; as well as One or more intermediate rigid or flexible bottom layers beneath the cleaning medium, wherein each bottom layer has an elastic modulus ranging between greater than 40 MPa and 600 MPa, each layer has a thickness between 25 μm and 300 μm, and each layer has a hardness between 30 Shore A and 90 Shore A.

28. The cleaning material of claim 27, wherein the plurality of functionalized microfeatures are microfeatures that are uniformly shaped across the cleaning medium and variably spaced across the cleaning medium.

29. The cleaning material of claim 27, wherein the plurality of abrasive particles further comprises: one or more particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

30. The cleaning material of claim 27, wherein the cleaning layer further comprises: a 10 μm to 100 μm thick polymer layer having a predetermined specific gravity, elasticity, viscosity, flatness, thickness, and porosity.

31. The cleaning material of claim 27, wherein the cleaning layer further comprises: a 10 to 100 μm thick abrasive polymer layer having a plurality of abrasive particles having a Mohs hardness of 7 or greater across a top surface of the cleaning medium.

32. The cleaning material of claim 27, wherein each microfeature further comprises: a positive microfeature extending upwardly away from a top surface of the cleaning medium.

33. The cleaning material of claim 32, wherein each positive micro-feature is one of a micro-pyramid, a micro-column, and a curved micro-pyramid.

34. The cleaning material of claim 32, wherein the cleaning layer is applied to the body of each positive microfeature, wherein the body of each positive microfeature has a face, and the cleaning layer is applied to the face of each positive microfeature.

35. The cleaning material of claim 32, wherein the cleaning layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or greater, having a thickness of less than 10 μm, applied across a top surface of each positive microfeature and along a body of each positive microfeature.

36. The cleaning material of claim 35, wherein the plurality of abrasive particles are a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

37. The cleaning material of claim 27, wherein each microfeature further comprises: a negative microfeature extending downwardly away from a top surface of the cleaning medium.

38. The cleaning material of claim 37, wherein each negative microfeature is one of a micro-pyramid, a micro-column, and a curved micro-pyramid.

39. The cleaning material of claim 37, wherein the cleaning layer is applied across the top surface of the cleaning medium, and into the cavities of each negative microfeature, and along the interior surfaces of each negative microfeature.

40. A cleaning material as described in claim 37, wherein the cleaning layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or greater, having a thickness of less than 10 μm, applied across the top surface of the cleaning medium, and applied to the cavities of each negative microfeature, and applied along the interior surface of each negative microfeature.

41. The cleaning material of claim 40, wherein the plurality of abrasive particles are a blend of one or more types of particles selected from the group consisting of aluminum oxide, silicon carbide, and diamond.

42. A method for cleaning a capillary of a wire bonding machine, the method comprising: performing a wire bonding operation using a capillary of the wire bonding machine; and A cleaning operation is performed using a cleaning device having a cleaning medium having a cleaning medium base reference plane and a plurality of functionalized microfeatures arranged in an array having a plurality of rows and a plurality of columns of functionalized microfeatures, and each functionalized microfeature having a body having a width, a height, a spacing between each body, and a dimensional property that optimizes the cleaning medium so that one or more surfaces of the capillary are cleaned without modification or damage, each functionalized microfeature extending above the cleaning medium base reference plane, and the cleaning medium having a functionalized microfeature uniformly distributed within the body of each functionalized microfeature. A plurality of abrasive particles having a Mohs hardness of 7 or greater; a cleaning layer applied across the top surface of the cleaning medium having predetermined properties for cleaning contaminants from one or more surfaces of the capillaries, the cleaning layer being applied on top of all functionalized microfeatures and within the spacing between each functionalized microfeature, down to the cleaning medium base reference plane; and one or more intermediate rigid or flexible underlayers beneath the cleaning medium, wherein each underlayer has an elastic modulus ranging from greater than 40 MPa to 600 MPa, each layer having a thickness between 25 μm and 300 μm, and each layer having a hardness between 30 Shore A and 90 Shore A.

43. The method of claim 42, wherein performing the cleaning operation using a cleaning device further comprises: using a 10 μm to 100 μm thick polymer layer having a predetermined specific gravity, elasticity, viscosity, flatness, thickness, and porosity.

44. The method of claim 42, wherein performing a cleaning operation using a cleaning device further comprises using a plurality of positive microfeatures extending upwardly away from a top surface of the cleaning medium.

45. The method of claim 42, wherein performing a cleaning operation using a cleaning device further comprises using a plurality of negative microfeatures extending downwardly away from a top surface of the cleaning medium.

46. ​​The method of claim 42, wherein performing the cleaning operation further comprises performing the capillary cleaning operation without removing the capillary from the wire bonding machine.

47. The method of claim 46, further comprising resuming the wire bonding operation once the cleaning operation is completed.

48. The method of claim 42, wherein performing the cleaning operation further comprises: performing a cleaning operation of the capillary after a predetermined period of time.

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