A remanufacturing method for a processing box and a regenerated processing box

By machining the processing and installing new chips on the processing box chip fixtures, the problem of the inability to recycle and reuse of the processing box chip components is solved, and the recycling of resources and environmental protection is achieved.

CN114839851BActive Publication Date: 2025-03-04NINESTAR CORP
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Patent Information

Application Number
CN202110138156.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-02-01
Publication Date
2025-03-04
Estimated Expiration
2041-02-01

AI Technical Summary

Technical Problem

The existing processing box chip assembly structure can only be adapted to its own chip structure, resulting in the processing box being unable to be recycled and reused after replacement, resulting in waste of resources and environmental pollution.

Method used

By machining the process box chip fixture, a through hole is formed and a new chip is installed to achieve the regeneration and utilization of the chip assembly.

Benefits of technology

The recycling and reuse of processing box and chip component resources is realized, the universality of regenerated processing box is improved, resources are saved, and waste is reduced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a remanufacturing method of a process box and a regenerated process box, wherein the process box is detachably mounted on an electronic imaging device to provide a developer for electronic imaging. A chip assembly electrically connected to the electronic imaging device is provided at one end of the process box in the length direction. The remanufacturing method includes removing a chip fixture on the chip assembly and machining the chip fixture. By processing the chip fixture, rational utilization of resources is achieved. Multiple chips can be used compatibly, thereby improving the versatility of the regenerated process box.
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Description

[Technical field]

[0001] The present invention relates to the field of electronic imaging technology, and in particular to a method for remanufacturing a processing box and a regenerated processing box obtained by using the method. [Background technology]

[0002] The process cartridge is a detachable part widely used in electronic imaging devices. The electronic imaging device is provided with a driving member for providing power to the process cartridge; a detection component is also provided on the process cartridge. When a new process cartridge is installed on the electronic imaging device, the electronic imaging device recognizes it as a specific process cartridge through the action of the detection component and the electronic imaging device, and recognizes the process cartridge according to the information preset in the electronic imaging device, thereby reminding the user to replace the new process cartridge in time.

[0003] In addition, in order to make the electronic imaging device use only its own processing box, the device manufacturer also sets a chip on the processing box that is connected to the electronic imaging device's electrical signal. Now, taking a specific processing box as an example, Figure 1 The figure shows a processing box in the prior art. A detection component 11 is provided at one end of the two ends of the processing box in the length direction. The processing box also includes a chip assembly 12 for installing and fixing the chip, so as to achieve electrical signal connection with the electronic imaging device.

[0004] Usually, when the developer in the processing box is used up, the life of the chip and the processing box also ends. Since the chip component structure can only adapt to its own chip structure, simply discarding the processing box at this time will cause great waste and environmental pollution. In order to protect the environment and save resources, it is necessary to recycle and remanufacture the processing box chip component and the processing box. [Summary of the invention]

[0005] According to one aspect of the present invention, a method for remanufacturing a process cartridge is provided, wherein the process cartridge comprises a process cartridge body, a detection component and a chip assembly disposed on the process cartridge body; the process cartridge body extends in a first direction, the detection component is used for an electronic imaging device to identify the process cartridge, and the chip assembly comprises a chip fixing member for mounting a chip;

[0006] The chip assembly can be moved relative to the process box body in the first direction and the second direction intersecting the first direction, and in a third direction intersecting the first direction and the second direction respectively; the process box remanufacturing method comprises the following steps:

[0007] A disassembly step, comprising removing the chip assembly;

[0008] A machining step, comprising machining the chip fixture;

[0009] The assembly step includes assembling the chip onto the processed chip fixture.

[0010] Further, the chip assembly and the detection component are respectively located at two ends of the processing box body in the first direction; and the chip fixing component is located on a side away from the processing box body in the second direction.

[0011] Further, the chip fixing member has a chip fixing surface and a first groove, the chip fixing surface is located at one end of the chip fixing member in the second direction, and the first groove is located at a side surface of the chip fixing surface relative to the chip in the second direction; a rib is provided on a side surface of the first groove away from the chip fixing surface;

[0012] The step of machining the chip fixing member includes penetrating the first groove and cutting off the rib to form a through hole extending in the second direction.

[0013] Furthermore, in the step of assembling the chip onto the processed chip fixing component, the chip is mounted at the chip fixing surface, and / or a part of the chip is embedded in the through hole.

[0014] Furthermore, the chip assembly further comprises an elastic support member and an elastic member, and the chip fixing member is connected to the elastic support member via the elastic member.

[0015] Furthermore, the chip fixing member is provided with a second groove, and the elastic supporting member is provided with a clamping portion matched with the second groove, and the clamping portion is clamped with the second groove so that the elastic member is in a pressed state in the second direction.

[0016] Further, in the step of assembling the chip onto the processed chip holder, the chip is a new chip or a recycled chip.

[0017] Furthermore, the detection component includes a rotating part and a detected part.

[0018] Furthermore, the method further comprises a process cartridge body remanufacturing step, comprising refilling a powder bin in the process cartridge body with developer; and,

[0019] The assembling step includes assembling the chip assembly onto the processing box body.

[0020] According to another aspect of the present invention, there is provided a regenerated processing box, comprising at least a powder bin, a power receiving component, a detection component and a chip assembly, wherein the processing box is obtained by using any of the above-mentioned processing box remanufacturing methods.

[0021] The present invention provides a method for remanufacturing a process box, which realizes the recycling and reuse of the process box and chip component resources by machining the chip fixing parts. The regenerated process box after machining is compatible with multiple chips, thereby improving the versatility of the regenerated process box. The regenerated process box obtained by the method for remanufacturing the process box of the present invention has high versatility, realizes reuse, and saves resources.

Brief Description of the Drawings

[0022] Figure 1 It is a structural schematic diagram of an existing processing box;

[0023] Figure 2 It is a schematic diagram of a partial explosion structure of an existing processing box;

[0024] Figure 3 It is a schematic diagram of the exploded structure of the existing processing box chip assembly;

[0025] Figure 4 It is a schematic diagram of the structure of an existing chip component;

[0026] Figure 5 This is a schematic diagram of the chip components after being disassembled;

[0027] Figure 6 It is a partial schematic diagram of the separation of the existing chip fixing part and the chip;

[0028] Figure 7 It is a cross-sectional view of an existing chip fixing part;

[0029] Figure 8 A flow chart for chip component remanufacturing;

[0030] Fig. 9 It is a schematic diagram of the chip component structure after machining;

[0031] Fig.10 is a cross-sectional view of a chip fixture after machining;

[0032] Fig.11 A partial schematic diagram of the separation of the machined chip fixture and the new chip;

[0033] Fig.12 This is a schematic diagram of the machined chip assembly and the new chip after assembly;

[0034] Fig.13 A flow chart for the recycling and remanufacturing of processing cartridges; [Specific implementation method]

[0035] Figure 1 As shown above, the processing box 1 includes a processing box body 17, a detection component 11, a chip assembly 12, a support frame 13, a developing roller 14, a power receiving component 19 and a gear assembly 16.

[0036] The processing box body 17 is a shell capable of containing developer. The length direction of the processing box body 17 extends along the first direction. The processing box 1 is provided with a detection component 11 at the first end in the first direction, and the processing box body 17 is provided with a chip assembly 12 at the second end in the first direction. A powder bin is provided inside the processing box body 17, and the developer is contained in the powder bin. The developer can be toner. Protective covers 15 are provided at both ends of the processing box body 17 in the first direction.

[0037] like Figure 2 and Figure 3 As shown, the power receiving component 19 is used for the processing box to receive the rotational driving force from the electronic imaging device, and transmit the power to the stirring frame (not shown) through the receiving end gear assembly 16. The stirring frame is located inside the powder bin of the processing box body 17. The stirring frame rotates and stirs the developer in the powder bin under the drive of the rotational driving force to prevent the developer from agglomerating. The rotational driving force is then transmitted to the detection component 11 located at the first end of the processing box body 17 through the internal transmission mechanism. The power receiving component 19 is located at the second end of the processing box body in the first direction, and the power receiving component is exposed to the protective cover 15 in the first direction. The power receiving component 19 can be a coupling. When the processing box is installed and matched with the electronic imaging device, the drive shaft of the electronic imaging device is connected to the coupling. Furthermore, the drive shaft rotates through the coupling to provide the rotational driving force to the gear assembly 16 and the detection component 11 of the processing box.

[0038] The gear assembly 16 is arranged at the second end of the process box body 17 in the first direction. The gear assembly 16 includes a plurality of gears including a main gear, an agitator gear and a developer roller gear. At least a portion of the plurality of gears is exposed from the protective cover 15. The main gear is connected to the power receiving component 19, and the agitator gear and the developer roller gear are connected to the main gear. The main gear is preferably used as a rotating element that receives the driving force of the power receiving component 19. The rotation of the power receiving component 19 can drive the main gear, the agitator gear and the developer roller gear to rotate. The agitator gear is connected to the stirring frame, and the rotation of the agitator gear can drive the stirring frame to rotate; the developer roller gear is connected to the developer roller 14, and the rotation of the developer roller gear can drive the development roller 14 to rotate. The rotation axes of the plurality of gears of the gear assembly 16, the rotation axis of the drive shaft of the electronic imaging device and the rotation axis of the power receiving component 19 are mutually coincident or parallel. Preferably, the rotation axes of the above components all extend along the first direction.

[0039] The developing roller 14 is a roller that can rotate around a rotating axis extending along a first direction. The developing roller 14 is arranged on one side of a third direction of the processing box body, and the third direction is a direction intersecting with the first direction. The material of the developing roller 14 can be, for example, elastic rubber and a metal shaft core or a conductive resin.

[0040] A handle 171 is provided on the other side of the process cartridge body 17 relative to the developing roller 14 in the third direction.

[0041] The detection component 11 includes a rotating member 111 and a detected member 112, and is used for the imaging device to identify the processing box and to receive the rotational driving force from the power receiving component 19 to work.

[0042] A support frame 13 is provided at the second end of the processing box body 17 in the first direction, and the support frame 13 is used to install the chip assembly 12. Specifically, the support frame 13 is located on the opposite side of the processing box body 17 relative to the protective cover 15 in the first direction, and the support frame 13 is detachably fixed to the protective cover 15, and specifically, it can be connected with the protective cover 15 by snapping.

[0043] like Figures 4 to 7 As shown, the chip assembly 12 is installed between the support frame 13 and the protective cover 15 , and the chip assembly 12 includes a chip fixing member 121 , a chip 20 , an elastic supporting member 123 , and an elastic member 122 .

[0044] The chip 20 has an electrical contact surface 201 and another surface arranged opposite to the electrical contact surface. In a second direction intersecting both the first direction and the third direction, the chip 20 is fixed on a chip fixing member 121 , and the chip fixing member 121 is connected to an elastic support member 123 via an elastic member 122 .

[0045] The chip fixing member 121 is located on a side away from the processing box body 17 in the second direction, and has a chip fixing surface 1211, a first groove 1213, and a second groove 1215. The chip fixing surface 1211 is provided at one end of the chip fixing member 121 in the second direction, and the other end of the chip fixing member 121 in the second direction is provided with an opening and a cavity inside, and a first protrusion is provided in the cavity to cooperate with the elastic member 122 to fix one end of the elastic member 122. When one end of the elastic member 122 is fixed to the first protrusion, at least a part of the elastic member 122 is located in the cavity of the chip fixing member 121. The first groove 1213 is located on a side of the chip fixing surface 1211 in the second direction opposite to the chip 20, and a rib 1212 is provided on a side of the first groove 1213 away from the chip fixing surface 1211. Two second grooves 1215 are provided, which are symmetrically arranged on both sides of the chip fixing member 121 in the first direction. The chip fixing part 121 is also provided with three limiting posts 1217a, 1217b, and 1217c, wherein the limiting posts 1217a and 1217b are arranged at one end of the chip fixing part 121 close to the processing box body 17 in the first direction, and the limiting post 1217c is arranged at one end of the chip fixing part 121 far away from the processing box body 17 in the first direction. 131 cooperates to realize the connection between the chip assembly 12 and the processing box body 17; in addition, the inner diameter of the first through hole 151 is larger than the outer diameter of the limiting pillars 1217a and 1217b, and the inner diameter of the second through hole 131 is larger than the outer diameter of the limiting pillar 1217c. The limiting pillars 1217a and 1217b are inserted into the first through hole 151, and the limiting pillar 1217c is inserted into the second through hole 131, so that the chip assembly can be moved in the first direction, the second direction, and the third direction respectively (move within the size range of the first through hole 151 and the second through hole 131).

[0046] The elastic support member 123 is provided with an opening at one end close to the chip fixing member 121 in the second direction and has a cavity inside. A second protrusion 1232 is provided in the cavity to cooperate with the elastic member 122 to fix the other end of the elastic member 122. Two clamping parts 1231 are provided on the elastic support member 123. The two clamping parts 1231 are symmetrically arranged on both sides of the elastic support member 123 in the first direction. The two clamping parts 1231 are respectively clamped and connected with the second grooves 1215 symmetrically arranged on the chip fixing member 121, so that the elastic member 122 is always in a pressed state in the second direction. Specifically, the clamping part 1231 can be an elastic buckle.

[0047] The elastic member 122 may be a compression spring, or a tension spring, a spring sheet, an elastic rubber, an elastic sponge, etc. The elastic expansion and contraction direction of the elastic member 122 may be set along the second direction.

[0048] The steps of the remanufacturing method of the recycled processing box are described below. A remanufacturing method of a processing box specifically includes the step of remanufacturing the chip assembly of the processing box. After the support frame 13 of the chip assembly is removed from the processing box 1, the chip assembly 12 can be easily removed. Then the remanufacturing step of the chip assembly is described.

[0049] Figure 8 is a flow chart showing the remanufacturing method of the chip assembly. In addition, the manufacturer can perform the following processing by manual operation or automated device. When recycling and remanufacturing the chip assembly, first, remove the chip fixing part 121, the elastic part 122, the elastic support part 123, and the chip 20 of the chip assembly 12 (step S1). Secondly, the first groove 1213 of the chip fixing surface 1211 on the chip fixing part 121 in the second direction relative to a side surface of the chip 20 is machined. The machining method can be drilling or milling to penetrate the first groove 1213 and cut off the rib 1212 together to form a through hole 1216 extending in the second direction (step S2). The structure of the chip fixing part 121 after machining is as shown in FIG. Fig. 9 and Fig.10 Finally, a new chip 30 is installed at the same position of the chip fixing surface 1211 of the chip fixing member 121 having the through hole 1216 after machining, as shown in FIG. Fig.11 Then, one end of the elastic member 122 is fixed to the first protrusion 1214 of the chip fixing member 121, and the other end is connected to the second protrusion 1232 of the elastic support member 123. The two symmetrically arranged snap-fitting portions 1231 on the elastic support member 123 are respectively snap-fitted into the two symmetrically arranged second grooves 1215 of the chip fixing member. (Step S3), as shown in FIG. Fig.12 shown.

[0050] In addition, the chip 20 of the chip assembly 12 may be removed (step S1). The first groove 1213 of the chip fixing surface of the chip fixing part 121 is machined, and the machining method may be drilling or milling, so that the first groove 1213 is penetrated, and the rib 1212 is cut off together to form a through hole 1216 extending in the second direction (step S2). A new chip 30 is installed at the same position of the chip fixing surface 1211 on the chip fixing part 121 having the through hole 1216 (step S3). The thickness of the new chip 30 in the second direction may be greater than that of the original chip 20, and a part of the new chip 30 will be embedded in the through hole 1216.

[0051] Furthermore, the manufacturer rewrites the information or data of the removed chip 20, so that the chip 20 can be reconnected or recognized by the electronic imaging device when it is working. Afterwards, the rewritten or rewritten chip 20 that is checked to be normal is installed on the machined chip fixture 121 (step S3).

[0052] In addition, if Fig.13 As shown, the remanufacturing method of the processing box also includes a process box body remanufacturing step, when the processing box body 17 is recycled, after remanufacturing, such as replacing new parts, filling the developer, resetting the detection component 11, etc., (step S4). It also includes an assembly step, after the processing box body and the chip assembly are remanufactured, the remanufactured chip assembly 12 together with the chip assembly fixing support frame 13 are assembled to the remanufactured processing box body, (step S5). In this way, the recycling and remanufacturing of the entire processing box is completed.

[0053] Preferably, in order to save resources, a reusable chip partial structure can also be designed, and the chip fixing part 121 is machined to penetrate the first groove 1213. After the rib 1212 is cut off, a through hole 1216 is formed to reserve space for the new chip 30. Whether a new chip or a rewritten chip, or even other types of chips are used, they can be installed in the machined chip fixing part 121, so that the regenerated processing box can be compatible with the use of multiple chips, thereby improving the versatility of the regenerated processing box, realizing the recycling and reuse of processing box and chip component resources, saving resources and reducing waste.

[0054] Finally, it should be noted that the above are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the present invention.

Claims

1. A method for remanufacturing a process cartridge, the process cartridge comprising a process cartridge body, a detection component disposed on the process cartridge body, and a chip assembly; the process cartridge body extends in a first direction, the detection component is used for an electronic imaging device to identify the process cartridge, the chip assembly comprises a chip fixing member for mounting a chip, the chip fixing member having a chip fixing surface; The chip assembly can move relative to the processing box body in the first direction and the second direction intersecting the first direction, and in a third direction intersecting the first direction and the second direction respectively; characterized in that: The remanufacturing method of the process cartridge comprises the following steps: A disassembly step, comprising removing the chip assembly; A machining step includes machining the chip fixing member to form a through hole extending in the second direction on one side of the chip fixing surface of the chip fixing member; The assembly step includes assembling the chip onto the processed chip fixing part with the through hole.

2. The process cartridge remanufacturing method according to claim 1, wherein: The chip assembly and the detection component are respectively located at two ends of the processing box body in the first direction.

3. The process cartridge remanufacturing method according to claim 1, wherein: The chip fixing part is located at a side away from the processing box body in the second direction; the chip fixing part has a first groove, the chip fixing surface is located at one end of the chip fixing part in the second direction, and the first groove is located at a side of the chip fixing surface opposite to the chip in the second direction; a rib is provided on a side of the first groove away from the chip fixing surface; The step of machining the chip fixing member includes penetrating the first groove and cutting off the rib to form the through hole.

4. The process cartridge remanufacturing method according to claim 3, wherein: In the step of assembling the chip onto the processed chip fixing member, the chip is mounted at the chip fixing surface, and / or a portion of the chip is embedded in the through hole.

5. The process cartridge remanufacturing method according to any one of claims 1 to 4, characterized in that: The chip assembly further comprises an elastic support member and an elastic member, and the chip fixing member is connected to the elastic support member via the elastic member.

6. The process cartridge remanufacturing method according to claim 5, wherein: The chip fixing member is provided with a second groove, and the elastic supporting member is provided with a clamping portion matched with the second groove. The clamping portion is clamped with the second groove to make the elastic member in a pressed state in the second direction.

7. The remanufacturing method of a process cartridge according to claim 1 or 4, characterized in that: In the step of mounting the chip on the processed chip mount, the chip is a new chip or a regenerated chip.

8. The process cartridge remanufacturing method according to claim 1, wherein: The detection component comprises a rotating part and a detected part.

9. The process cartridge remanufacturing method according to claim 1, wherein: The process box body remanufacturing step also includes refilling the powder bin in the process box body with developer; and The assembling step includes assembling the chip assembly onto the processing box body.

10. A regeneration processing box, comprising at least a powder bin, a power receiving component, a detection component and a chip assembly, characterized in that: The process box is obtained by using the process box remanufacturing method according to any one of claims 1 to 9.

Citation Information

Patent Citations

  • Regeneration processing box

    CN214042022U