Display panel and mobile terminal

Abstract

The embodiment of the present application discloses a display panel and a mobile terminal, wherein the display panel includes a substrate, a display function layer and a binding component, wherein the substrate includes a display segment, a binding segment and a bending segment, the display function layer is arranged on the display segment, the binding component is arranged on the binding segment, and the display function layer and the binding component are electrically connected through a metal wiring layer; a protective layer is arranged on the outer arc surface of the bending segment of the substrate, the protective layer includes a plurality of buffer structures, and the plurality of buffer structures are arranged on the bending segment at intervals; the technical solution of the present application can effectively improve the impact resistance of the bending segment of the display panel without affecting the neutral layer position of the display panel of the bending segment, thereby ensuring that the metal wiring layer is located on the neutral layer, reducing the bending stress it is subjected to, ensuring the display effect of the display panel, and further improving the performance of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a mobile terminal. Background Art

[0002] With the development of display panel technology, high screen-to-body ratio has gradually become a research hotspot. In order to further increase the screen-to-body ratio of display panels, display panels currently generally adopt a bending and binding method. However, bending and binding can easily lead to increased bending stress on the metal traces in the display panel.

[0003] Currently, there is a technology that sets the metal routing layer on the neutral layer and then bends and binds it to reduce the bending stress on the metal routing layer. However, under this structure, in order to ensure that the position of the metal routing layer on the neutral layer does not deviate, there are great restrictions on the material and thickness of the film layers on both sides of the metal routing layer. Therefore, the bent section of the display panel is easily deformed after an impact collision, which reduces the impact resistance of the display panel. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a mobile terminal, which can effectively improve the impact resistance of the bending section of the display panel without affecting the neutral layer position of the display panel in the bending section, thereby ensuring that the metal routing layer is located on the neutral layer and minimizing the bending stress during bending and binding, thereby effectively improving the performance of the display panel.

[0005] An embodiment of the present application provides a display panel, including:

[0006] A substrate, comprising at least two base layers and a metal wiring layer arranged between the two base layers, wherein the substrate comprises a display segment, a binding segment arranged opposite to the display segment, and a bending segment connecting the display segment and the binding segment;

[0007] A display function layer is disposed on a side of the display segment away from the binding segment, and the display function layer is electrically connected to the metal wiring layer;

[0008] A binding component is disposed on a side surface of the binding segment away from the display segment, and the binding component is electrically connected to the metal wiring layer;

[0009] Wherein, a protective layer is arranged on the outer arc surface of the bending section, and the protective layer includes a plurality of buffer structures, and the plurality of buffer structures are arranged on the substrate at intervals.

[0010] Optionally, the display panel includes at least one organic film layer, the display function layer includes an organic insulating layer, and the organic film layer includes the protective layer located on the bending segment and the organic insulating layer located on the display segment.

[0011] Optionally, the buffer structure includes at least two layers of the organic film layers stacked together, and among any two of the organic film layers, the area of ​​one of the organic film layers close to the substrate is larger than the area of ​​the other organic film layer far away from the substrate, and the projection of the organic film layer close to the substrate on the substrate covers the projection of the organic film layer far away from the substrate on the substrate.

[0012] Optionally, the buffer structure includes at least one of a support column, a buffer bar or a buffer block.

[0013] Optionally, the bending section includes at least one stress concentration area, the stress concentration area is located at the center of the bending section, and / or the stress concentration area is arranged close to the display section, and / or the stress concentration area is close to the binding section;

[0014] Wherein, the buffer structure includes a first buffer structure, and the first buffer structure is located on the substrate in the stress concentration area.

[0015] Optionally, the display panel includes a bending axis, the bending segment is bent along the bending axis, and the first buffer structure includes a buffer block or a first buffer strip.

[0016] Optionally, the buffer block covers the substrate in the stress concentration area.

[0017] Optionally, the first buffer strip is perpendicular to the bending axis.

[0018] Optionally, the buffer structure further includes a plurality of second buffer structures, the second buffer structures include second buffer strips, the plurality of second buffer strips are arranged on the bending section outside the stress concentration area, and the second buffer strips are parallel to the bending axis.

[0019] The present application also provides a mobile terminal, comprising the display panel and a terminal body as described in any one of the above embodiments, wherein the terminal body and the display panel are combined into one.

[0020] The beneficial effects of the present invention include at least:

[0021] The present application sets the substrate layer to be a structure in which a metal wiring layer is sandwiched between two base layers, and sets a protective layer on the outer arc surface of the substrate bending section. The protective layer includes a plurality of buffer structures, and the plurality of buffer structures are arranged at intervals on the substrate. The technical solution sets a plurality of buffer structures arranged at intervals, so that when the display panel is impacted by external force, the impact force can be dispersed in time, thereby improving the impact resistance of the bending section of the display panel. At the same time, the buffer structure does not affect the neutral layer position of the bending section of the display panel, so that the bending stress on the metal wiring layer is minimized, thereby effectively improving the performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a schematic diagram of the structure of the bending and binding of the display panel in the prior art;

[0024] Figure 2 It is a structural schematic diagram of a display panel in the prior art;

[0025] Figure 3 is a structural schematic diagram of a display panel provided in an embodiment of the present application;

[0026] Figure 4 is a schematic structural diagram of a bending section of a display panel substrate provided in an embodiment of the present application;

[0027] Figure 5 is a schematic structural diagram of a bending section of another display panel substrate provided in an embodiment of the present application;

[0028] Figure 6 It is a structural schematic diagram of a support column provided in an embodiment of the present application;

[0029] Figure 7 is a schematic structural diagram of a bending section of another display panel substrate provided in an embodiment of the present application;

[0030] Figure 8 is a schematic structural diagram of a bending section of another display panel substrate provided in an embodiment of the present application;

[0031] Fig. 9 is a schematic structural diagram of a bending section of another display panel substrate provided in an embodiment of the present application;

[0032] Fig.10 is a schematic structural diagram of a bending section of another display panel substrate provided in an embodiment of the present application;

[0033] Fig.11 is a structural schematic diagram of a buffer block provided in an embodiment of the present application;

[0034] Fig.12 is a histogram of the stress on the metal wiring layer when the embodiment of the present application and the comparative example are bent and bound;

[0035] Fig.13 It is a schematic diagram of proportional forces;

[0036] Fig.14This is a schematic diagram of the force of an embodiment of the present application;

[0037] Fig.15 It is a bar graph of arc top displacement after pressure is applied in the embodiments of the present application and the comparative example. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0039] The present application provides a display panel and a mobile terminal. The following is a detailed description. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms first, second, third, etc. are used only as labels, and no numerical requirements or order are imposed. Various embodiments of the present invention may exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and simplicity, and should not be understood as a rigid limitation on the scope of the present invention; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single values ​​within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which are applicable regardless of the range. In addition, whenever a numerical range is indicated in this article, it is meant to include any quoted numbers (fractions or integers) within the indicated range.

[0040] In order to solve the above technical problems, the present application provides the following embodiments, specifically referring to Figure 1-15 .

[0041] The present application embodiment provides a display panel, such as Figure 1 and Figure 3 As shown, including:

[0042] A substrate 10, comprising at least two base layers (an upper base layer 101 and a lower base layer 103) and a metal wiring layer 102 arranged between the two base layers, the substrate 10 comprising a display segment a, a binding segment b arranged opposite to the display segment a, and a bending segment c connecting the display segment a and the binding segment b;

[0043] A display function layer 20 is disposed on a side of the display segment a away from the binding segment b, and the display function layer 20 is electrically connected to the metal wiring layer 102;

[0044] A binding component 30 is disposed on a side of the binding segment b away from the display segment a, and the binding component 30 is electrically connected to the metal wiring layer 102;

[0045] A protective layer 104 is disposed on the outer arc surface of the bending section c. The protective layer 104 includes a plurality of buffer structures. The plurality of buffer structures are disposed on the substrate 10 at intervals.

[0046] Specifically, the display panel of the present application includes a flexible LED display panel or a flexible OLED display panel, which can be selected according to actual conditions. The present application takes a flexible OLED display panel as an example.

[0047] Specifically, Figure 1 As shown, the display panel includes a bending axis BA, and the bending section c of the substrate 10 of the display panel is bent along the bending axis BA, so that the binding component 30 is located on the backlight side of the display function layer 20, so as to achieve the effect of improving the screen-to-body ratio of the display panel.

[0048] Specifically, the substrate 10 includes a display segment a, a binding segment b arranged opposite to the display segment a, and a bending segment c connecting the display segment a and the binding segment b. The display segment a, the binding end and the bending segment c can be integrally formed. The substrate 10 includes at least two base layers and a metal wiring layer 102 arranged between the base layers. The material of the base layer includes polyimide or other flexible and bend-resistant materials, all of which are within the protection scope of the present application. The material of the metal wiring layer 102 includes one of Ag, Mo, Al, Cu, Ti or their alloys.

[0049] Specifically, Figure 2 , Figure 3As shown, a display function layer 20 is arranged on the display segment a of the substrate 10, and the display function layer 20 includes a buffer layer Buff, a control device layer arranged on the buffer layer Buff, and a light-emitting layer arranged on the control device layer. The light-emitting layer is connected to the control device of the control device layer, and the control device is used to drive and control the light-emitting layer to emit light, wherein the control device layer at least includes a gate layer, a gate insulating layer GI, an active layer, and a source and a drain electrode layer, and an insulating layer is arranged between the gate layer, the active layer, and the source and the drain electrodes. The insulating layer can be an organic film layer or an inorganic film layer, and the organic film layer includes a first insulating layer OL1, a second insulating layer OL2, and a passivation layer OL3. The light-emitting layer includes an anode, a pixel definition layer OL4 (the material is an organic photoresist), an organic light-emitting material arranged on the pixel definition layer OL4, and a cathode layer arranged on the organic light-emitting material. The anode of the light-emitting layer is connected to the drain of the control device, and an encapsulation layer is arranged on the light-emitting layer, and the encapsulation layer includes multiple inorganic encapsulation layers and organic encapsulation layers stacked, and a photoresist layer OL5 is arranged on the encapsulation layer.

[0050] Specifically, the material of the inorganic encapsulation layer includes silicon nitride or silicon oxide, and the material of the organic encapsulation layer includes photoresist, epoxy resin, polyimide, polyvinyl alcohol, polymethyl methacrylate, polystyrene, etc.

[0051] Specifically, a binding component 30 is arranged on the binding section b of the substrate 10 , and the binding component 30 includes a plurality of groups of fan-out traces ( 301 and 302 ), a test trace and a driver chip ( 303 ) and a chip-on-film packaging terminal 304 .

[0052] Specifically, a protective layer 104 is provided on the outer arc surface of the bending section c of the substrate 10, and the protective layer 104 includes a plurality of buffer structures, and the plurality of buffer structures are arranged at intervals on the substrate 10. The thickness of the protective layer 104 is in the range of 0um to 20um, and can specifically be one of 0.1um, 3um, 5um, 8um, 10um, 12um, 15um, 17um, and 20um, and can be adjusted according to actual production conditions.

[0053] Specifically, a plurality of buffer structures may be evenly spaced, for example, Figure 3 and Figure 4 As shown, the multiple buffer structures are arranged in an array, and the multiple buffer structures can also be patterned according to actual needs, for example, Figure 8 As shown, the arrangement of the buffer structure can be set according to the force magnitude of different areas of the bending section c.

[0054] Specifically, the buffer structure includes one or more of a support column 1041, a buffer bar 1042, and a buffer block 1043. All structures capable of dispersing the external force exerted on the bending segment c are within the protection scope of the present application.

[0055] It should be noted that the bending section c of a conventional display panel can also achieve a protective effect by coating a layer of UV glue on the outer arc surface of the bending section c, but the thickness of the UV glue is generally 60 to 100 um, which will cause the border distance of the display panel to increase, which is not conducive to achieving an extremely narrow border. Secondly, the elastic modulus of the UV glue is different from that of the base layer, which can easily cause the neutral layer of the bending section c of the substrate 10 to deviate from the physical center, causing the metal routing layer 102 to deviate from the neutral layer. A comparison between this implementation and the embodiment of the present application is shown in the experimental example.

[0056] It can be understood that the present application arranges the substrate 10 layer into a structure in which two base layers (upper base layer 101 and lower base layer 103) sandwich a metal wiring layer 102, and arranges a protective layer 104 on the outer arc surface of the bending section c of the substrate 10. The protective layer 104 includes a plurality of buffer structures, and the plurality of buffer structures are arranged at intervals on the substrate 10. This technical solution arranges a plurality of buffer structures arranged at intervals, so that when the display panel is impacted by external force, the impact force can be dispersed in time, thereby improving the impact resistance of the bending section c of the display panel. At the same time, after the buffer structure is arranged, the neutral layer position of the bending section c of the display panel is not affected, so that the bending stress on the metal wiring layer 102 is minimized, thereby effectively improving the performance of the display panel.

[0057] In one embodiment, the display panel includes at least one organic film layer, the display function layer 20 includes an organic insulating layer, and the organic film layer includes the protective layer 104 located on the bending segment c and the organic insulating layer located on the display segment a.

[0058] Specifically, the material of the organic film layer can be transparent photoresist, epoxy resin, polyimide, polyvinyl alcohol, polymethyl methacrylate, polystyrene, etc.

[0059] Specifically, the organic insulating layer may be an insulating layer, a planarization layer, a pixel definition layer, an organic encapsulation layer, and a photoresist layer used to separate the gate layer and the active layer in the display function layer 20 .

[0060] Specifically, the protective layer 104 is manufactured in the same layer as the organic insulating layer in the display function layer 20 . Therefore, the protective layer 104 may also be a structure in which a single layer or multiple layers of organic films are stacked.

[0061] Specifically, the protective layer 104 includes a plurality of buffer structures, which can be obtained by patterning after the organic film layer is deposited. The patterning methods include but are not limited to photolithography, X-ray etching, electron beam etching, ion beam etching, wet etching and dry etching.

[0062] It can be understood that by setting the protective layer 104 and the organic insulating layer in the display function layer 20 in the same layer, that is, using the same material and the same process, the production steps of the display panel of the embodiment of the present application can be greatly simplified, while saving raw materials. The impact resistance of the display panel can be effectively improved without increasing excessive production costs.

[0063] In one embodiment, the buffer structure includes at least two layers of the organic film layers stacked together, and among any two of the organic film layers, the area of ​​one of the organic film layers close to the substrate 10 is larger than the area of ​​the other organic film layer far away from the substrate 10, and the projection of the organic film layer close to the substrate 10 on the substrate 10 covers the projection of the organic film layer far away from the substrate 10 on the substrate 10.

[0064] Specifically, the buffer structure includes one or more of a support column 1041, a buffer bar 1042, and a buffer block 1043. The buffer structure includes at least two layers of the organic film layers stacked together. Among any two organic film layers, the area of ​​one organic film layer close to the substrate 10 is larger than the area of ​​the other organic film layer far away from the substrate 10, and the projection of the organic film layer close to the substrate 10 on the substrate 10 covers the projection of the organic film layer far away from the substrate 10 on the substrate 10. Taking the support column 1041 as an example, Figure 6 As shown, the support column 1041 includes 5 layers of organic film layers, the organic film layers include a first insulating layer OL1, a second insulating layer OL2, a passivation layer OL3, a pixel definition layer OL4 and a photoresist layer OL5, and the area of ​​the multi-layer organic film layers gradually decreases from bottom to top, and the support column 1041 forms a stepped structure (similar to a pyramid); similarly, the buffer bar 1042 and the buffer block 1043 can be as follows Fig.11 As shown, five organic film layers are stacked, and a stepped structure is formed on at least one side of the multi-layer organic film stacking structure.

[0065] It can be understood that in the buffer structure, by setting the lower organic film layer to have a larger area and the upper organic film layer to have a smaller area, on the one hand, the problem of positioning accuracy caused by the film layer production is alleviated when the buffer structure is produced, so that the organic film layers can be effectively stacked. On the other hand, setting the buffer structure to a stepped structure can better disperse and buffer the impact force.

[0066] In one embodiment, the buffer structure includes at least one of a support column 1041 , a buffer bar 1042 or a buffer block 1043 .

[0067] Specifically, the structure of the support column 1041 can be a long column, a prism, or a multi-step structure that is narrow at the top and wide at the bottom (similar to a pyramid structure), or a multi-step structure that is wide at the top and narrow at the bottom. Preferably, the support column 1041 is a multi-step structure that is narrow at the top and wide at the bottom. Figure 6 As shown, this structure can better disperse the impact force on the bending section c, and the support column 1041 is not limited to Figure 4 and Figure 6 The prism shown may also be a cylinder, a frustum or other structures with a supporting effect, without specific limitation.

[0068] Specifically, Figure 5 As shown, the buffer bar 1042 can be straight or curved, preferably straight. The extension direction of the buffer bar 1042 is not specifically limited. Preferably, the buffer bar 1042 is arranged perpendicular to or parallel to the bending axis BA.

[0069] Specifically, the shape of the buffer block 1043 is not limited, and can be a square. The buffer block 1043 covers the stress concentration area CA of the substrate 10 .

[0070] Specifically, the buffer structure may be a stack of multiple organic film layers, which has a certain elasticity and can play a role in collision buffering, while not affecting the position of the neutral layer of the substrate 10 of the bending section c.

[0071] It can be understood that by setting the buffer structure as a support column 1041, a buffer bar 1042 or a buffer block 1043, the display panel can disperse the impact force in time when it is impacted by external force, thereby improving the impact resistance of the bending section c of the display panel. At the same time, setting the buffer structure does not affect the position of the neutral layer of the bending section c of the display panel. The neutral layer is located at the physical center of the bending section c, so that the bending stress of the metal wiring layer 102 at the corresponding position is minimized, thereby effectively improving the performance of the display panel.

[0072] In one embodiment, the bending segment c includes at least one stress concentration area CA, the stress concentration area CA is located at the center of the bending segment c, and / or the stress concentration area CA is arranged close to the display segment a, and / or the stress concentration area CA is close to the binding segment b;

[0073] The buffer structure includes a first buffer structure, and the first buffer structure is located on the substrate 10 in the stress concentration area CA.

[0074] It should be noted that when the bending segment c is bent, the bending stress is concentrated in three areas (easy to break after being stressed), one is the position where the bending segment c connects to the display segment a, one is the position where the bending segment c connects to the binding segment b, and the other is the bending center of the bending segment c.

[0075] Specifically, the first buffer structure includes but is not limited to a support column 1041 , a buffer bar 1042 or a buffer block 1043 .

[0076] It can be understood that the three positions of the bending segment c are set as stress concentration areas CA, and a first buffer structure is set at least within the stress concentration area CA, so that after the bending segment c of the display panel substrate 10 is impacted, the first buffer structure can promptly disperse the impact force on the substrate 10 in the stress concentration area CA, thereby reducing the probability of the bending segment c of the display panel being broken and improving the service life of the display panel.

[0077] In one embodiment, the display panel includes a bending axis BA, the bending segment c is bent along the bending axis BA, and the first buffer structure includes a buffer block 1043 or a first buffer bar 1045 .

[0078] Specifically, the first buffer structure includes a buffer block 1043 or a first buffer strip 1045. The buffer block 1043 and the first buffer strip 1045 increase the protection area relative to the support column 1041, and are only arranged in the stress concentration area CA to reduce the impact on the neutral layer position.

[0079] It can be understood that by setting the buffer block 1043 or the first buffer strip 1045 in the stress concentration area CA, the protection area of ​​the protective layer 104 is effectively increased, and setting it only in the stress concentration area CA can reduce the influence of the protective layer 104 on the position of the neutral layer, so that after the bending section c of the display panel substrate 10 is impacted, the first buffer structure can promptly disperse the impact force on the substrate 10 of the stress concentration area CA, reduce the probability of the bending section c of the display panel being broken, and improve the service life of the display panel.

[0080] In one embodiment, if Figure 7 and Fig. 9 As shown, the buffer block 1043 covers the substrate 10 in the stress concentration area CA.

[0081] Specifically, the thickness of the buffer block 1043 is in the range of 0um to 20um, and can be one of 0.1um, 3um, 5um, 8um, 10um, 12um, 15um, 17um, and 20um, and can be selected according to actual production needs.

[0082] It can be understood that the buffer block 1043 is set to cover the substrate 10 in the stress concentration area CA, so that after the bending section c of the display panel substrate 10 is impacted, the first buffer structure can promptly disperse the impact force on the substrate 10 in the stress concentration area CA, thereby reducing the probability of the bending section c of the display panel being broken and improving the service life of the display panel.

[0083] In one embodiment, the first buffer strip 1045 is perpendicular to the bending axis BA.

[0084] Specifically, the first buffer bar 1045 is arranged perpendicular to the bending axis BA, relative to the first buffer bar 1045 being arranged parallel to the bending axis BA, so that the first buffer bar 1045 can relieve the bending stress of the substrate 10 when it is bent (that is, the display panel requires a greater bending force when it is bent), and can also relieve the impact force when the display panel is impacted, thereby effectively protecting the bending section c of the substrate 10.

[0085] In one embodiment, if Fig. 9 and Fig.10 As shown, the buffer structure also includes a plurality of second buffer structures, the second buffer structures include second buffer strips 1044, the plurality of second buffer strips 1044 are arranged on the bending section c outside the stress concentration area CA, and the second buffer strips 1044 are parallel to the bending axis BA.

[0086] Specifically, the second buffer structure is provided as a second buffer bar 1044 , and the second buffer bar 1044 is parallel to the bending axis BA, thereby effectively increasing the protection area of ​​the protection layer 104 .

[0087] Specifically, the structure and material of the second buffer bar 1044 may be the same as those of the first buffer bar 1045 , and the difference between the second buffer bar 1044 and the first buffer bar 1045 is that the second buffer bar 1044 extends in a different direction.

[0088] It can be understood that by setting a buffer block 1043 or a first buffer strip 1045 in the stress concentration area CA, setting a second buffer strip 1044 outside the stress area, and setting different buffer structures in different areas, the protection area of ​​the protective layer 104 is effectively increased, so that after the bending section c of the display panel substrate 10 is impacted, the buffer structure can promptly disperse the impact force on the bending section c, reduce the probability of the bending section c of the display panel being broken, and improve the service life of the display panel.

[0089] The present application also provides a mobile terminal, comprising the display panel and a terminal body as described in any one of the above embodiments, wherein the terminal body and the display panel are combined into one.

[0090] Specifically, mobile terminals include but are not limited to the following types: rollable or foldable mobile phones, watches, bracelets, televisions or other wearable display or touch electronic devices, as well as flexible smartphones, tablet computers, laptops, desktop displays, televisions, smart glasses, smart watches, ATMs, digital cameras, car displays, medical displays, industrial control displays, e-readers, electrophoretic display devices, game consoles, transparent displays, double-sided displays, naked-eye 3D displays, mirror display devices, semi-reflective and semi-transparent display devices, etc.

[0091] Experimental example

[0092] 1. Bending stress simulation test

[0093] Comparative Example 1

[0094] Take a display panel sample, the bending section c of the display panel is not coated with UV glue, and no protective layer 104 is set. Figure 2 As shown;

[0095] Comparative Example 2

[0096] Take a display panel sample, and evenly apply UV glue on the bending section c of the display panel;

[0097] Example

[0098] Take a display panel sample, the bending section c of the display panel is provided with a protective layer 104, and the protective layer 104 includes a plurality of support pillars 1041 structure evenly spaced, such as Figure 4 As shown;

[0099] The above samples are bent and bound, and the arc top stress (i.e., the center position of the bending section c of the substrate 10) and the bending point stress (i.e., the point on the bending section c connecting the display section a and the binding section b) of the metal wiring layer 102 are tested, and the unit is MPa;

[0100] For specific results, see Fig.12 and Table 1.

[0101] Table 1

[0102] Comparative Example 1 Comparative Example 2 Example Arc top stress (MPa) 90 3300 112 Bending point stress (MPa) 115 1389 120

[0103] It can be seen from Table 1 that the solution of the embodiment, i.e., the technical solution of setting the buffer structure (protective layer 104) at intervals, basically does not affect the neutral layer position of the substrate 10, the stress of the metal wiring layer 102 in the substrate 10 basically does not increase, and the bending stress of the metal wiring layer 102 can be effectively dispersed.

[0104] 2. Pressure deformation simulation

[0105] Comparative Example

[0106] Take a display panel sample, the bending section c of the display panel is not coated with UV glue, and no protective layer 104 is set. Fig.13 As shown;

[0107] Example

[0108] Take a display panel sample, the bending section c of the display panel is provided with a protective layer 104, and the protective layer 104 includes a plurality of support pillars 1041 structure evenly spaced, such as Fig.14 As shown;

[0109] When a force of 0.15 N is applied to Experimental Example 1 and Experimental Example 2, the displacement of the arc top is detected. The specific results are shown in Table 2 and the specific embodiment is shown in Fig.15 .

[0110] Table 2

[0111] Comparative Example Example Arc top displacement (um) 112 84

[0112] It can be seen from Table 2 that under a fixed pressure, the protective layer 104 also has a certain displacement, but compared with not providing the protective layer 104, the anti-deformation capability is significantly enhanced, and the deformation is relatively alleviated by 25%.

[0113] In summary, the present application sets the substrate 10 to be a structure in which a metal wiring layer 102 is sandwiched between two base layers (an upper base layer 101 and a lower base layer 103), and sets a protective layer 104 on the outer arc surface of the bending section c of the substrate 10. The protective layer 104 includes a plurality of buffer structures, and the plurality of buffer structures are arranged at intervals on the substrate 10. This technical solution sets a plurality of buffer structures arranged at intervals, so that when the display panel is impacted by external force, the impact force can be dispersed in time, thereby improving the impact resistance of the bending section c of the display panel. At the same time, the buffer structure does not affect the neutral layer position of the bending section c of the display panel, so that the bending stress on the metal wiring layer 102 is minimized.

[0114] The above is a detailed introduction to a display panel and a mobile terminal provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: A substrate, comprising at least two base layers and a metal wiring layer arranged between the two base layers, wherein the substrate comprises a display segment, a binding segment arranged opposite to the display segment, and a bending segment connecting the display segment and the binding segment; A display function layer is disposed on a side of the display segment away from the binding segment, and the display function layer is electrically connected to the metal wiring layer; A binding component is disposed on a side surface of the binding segment away from the display segment, and the binding component is electrically connected to the metal wiring layer; Among them, a protective layer is arranged on the outer arc surface of the bending section, and the protective layer includes a plurality of buffer structures, and the plurality of buffer structures are arranged on the substrate at intervals, and a gap is arranged between two adjacent buffer structures; the display panel includes at least one organic film layer, and the display function layer includes an organic insulating layer, and at least one of the organic film layers includes the protective layer located on the bending section and the organic insulating layer located on the display section; the buffer structure includes at least two stacked organic film layers, and among any two organic film layers, the area of ​​one of the organic film layers close to the substrate is larger than the area of ​​the other organic film layer far from the substrate, and the projection of the organic film layer close to the substrate on the substrate covers the projection of the organic film layer far from the substrate on the substrate.

2. The display panel according to claim 1, wherein: The buffer structure includes at least one of a support column, a buffer strip or a buffer block.

3. The display panel according to claim 1, wherein: The bending section includes at least one stress concentration area, the stress concentration area is located at the center of the bending section, and / or the stress concentration area is arranged close to the display section, and / or the stress concentration area is close to the binding section; Wherein, the buffer structure includes a first buffer structure, and the first buffer structure is located on the substrate in the stress concentration area.

4. The display panel according to claim 3, wherein: The display panel includes a bending axis, the bending section is bent along the bending axis, and the first buffer structure includes a buffer block or a first buffer strip.

5. The display panel according to claim 4, wherein: The buffer block covers the substrate of the stress concentration area.

6. The display panel according to claim 4, wherein: The first buffer strip is perpendicular to the bending axis.

7. The display panel according to any one of claims 5 to 6, characterized in that: The buffer structure further includes a plurality of second buffer structures, the second buffer structures include second buffer strips, the plurality of second buffer strips are arranged on the bending section outside the stress concentration area, and the second buffer strips are parallel to the bending axis.

8. A mobile terminal, characterized in that: It comprises a display panel and a terminal body as described in any one of claims 1 to 7, wherein the terminal body and the display panel are combined into one body.

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