Core sheet for evaporation chamber, evaporation chamber, and electronic device

Abstract

The core sheet for the evaporation chamber of the present invention comprises: a sheet body having a first body surface and a second body surface; a first vapor flow path for through which vapor of a working fluid passes; a liquid flow path disposed on the second body surface and communicating with the first vapor flow path for through which liquid of the working fluid passes; and a second vapor flow path disposed on the first body surface and communicating with the first vapor flow path for through which vapor of the working fluid passes. The sheet body has an island portion having a length direction in a first direction and around which the first vapor flow path is disposed. The second vapor flow path has a vapor flow groove extending from one side edge of the island portion to the other side edge in a second direction perpendicular to the first direction.

Description

Technical Field

[0001] This invention relates to a core plate for an evaporation chamber, an evaporation chamber, and electronic equipment. Background Technology

[0002] Electronic devices such as mobile terminals use electronic components that generate heat. Examples of such components include central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors. Examples of mobile terminals include portable terminals and tablet computers.

[0003] Such electronic devices are cooled by heat dissipation devices such as heat pipes (see, for example, Patent Document 1). In recent years, due to the trend towards thinner electronic devices, heat dissipation devices have been required to be thinner as well. The development of evaporation chambers, which can be made even thinner than heat pipes, is underway as a heat dissipation device. Regarding the evaporation chamber, the working fluid sealed within it absorbs and diffuses the heat from the electronic device, thereby cooling the device.

[0004] More specifically, the working fluid in the evaporator chamber is heated by the electronic device through a section close to it (evaporation section). As a result, the working fluid evaporates and transforms into working vapor. This working vapor diffuses away from the evaporator section within a vapor flow path formed in the evaporator chamber and is cooled. Then, the working vapor condenses and transforms into working liquid. A liquid flow path section, which functions as a capillary structure (also called a core), is provided in the evaporator chamber. The working liquid enters the liquid flow path section from the vapor flow path section. Then, the working liquid flows in the liquid flow path section and is transported towards the evaporator section. Furthermore, the working liquid transported to the evaporator section is heated and evaporates again in the evaporator section. In this way, the working fluid repeatedly undergoes phase change (i.e., evaporation and condensation) while flowing back within the evaporator chamber. This facilitates heat dissipation from the electronic device. As a result, the heat dissipation efficiency of the evaporator chamber is improved.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2008-82698 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] The purpose of this invention is to provide a core plate for an evaporation chamber, an evaporation chamber, and an electronic device that can improve heat dissipation efficiency.

[0010] Methods for solving problems

[0011] As a first solution, the present invention provides a core sheet for an evaporation chamber, which is located between a first sheet and a second sheet of an evaporation chamber containing a working fluid. The core sheet for the evaporation chamber comprises: a sheet body having a first body surface and a second body surface disposed on the side opposite to the first body surface; a first vapor flow path for the vapor of the working fluid to pass through, extending from the first body surface of the sheet body to the second body surface; a liquid flow path disposed on the second body surface, communicating with the first vapor flow path for the liquid of the working fluid to pass through; and a second vapor flow path disposed on the first body surface, communicating with the first vapor flow path for the vapor of the working fluid to pass through. The sheet body has an island portion having a length direction in a first direction, and the first vapor flow path is disposed around the island portion. The second vapor flow path has a vapor flow groove extending from one side edge of the island portion to another side edge in a second direction perpendicular to the first direction.

[0012] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0013] The second steam flow path has a plurality of steam flow path grooves, and a steam flow path protrusion that abuts against the first piece is provided between a pair of adjacent steam flow path grooves.

[0014] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0015] The second steam flow path has a steam flow path connecting groove provided on the steam flow path protrusion, and the steam flow path connecting groove connects a pair of adjacent steam flow path grooves.

[0016] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0017] The vapor flow path connecting grooves located on one side of the adjacent vapor flow path protrusions and the vapor flow path connecting grooves located on the other side are configured at positions different from the positions that overlap when viewed along the first direction.

[0018] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0019] The vapor flow path connecting grooves located on one side of the adjacent vapor flow path protrusions and the vapor flow path connecting grooves located on the other side are configured to overlap when viewed along the first direction.

[0020] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0021] The sheet body has a plurality of islands, and the second vapor flow path is disposed on each of the islands. The vapor flow path groove of one island and the vapor flow path groove of the other island in a pair of adjacent islands in the second direction are configured to overlap when viewed along the second direction.

[0022] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0023] The second steam flow path is disposed on one side of the island in the first direction.

[0024] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0025] Between the steam flow channel groove of the second steam flow channel and the end edge of the island on the side where the second steam flow channel is disposed in one of a pair of end edges in the first direction, an end edge protrusion that abuts against the first piece is provided.

[0026] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0027] It also has a connecting part, which is disposed on the plate body and communicates with the liquid flow path and the second vapor flow path.

[0028] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0029] The connecting portion includes a through hole that passes through the sheet body and extends from the liquid flow path portion to the vapor flow path groove.

[0030] In the core sheet for the evaporation chamber of the first solution described above, it can be that,

[0031] The liquid flow path section has: a plurality of main liquid flow path channels extending in a first direction for the liquid of the working fluid to pass through; and a liquid flow path connecting channel extending in a direction different from the first direction and communicating with the main liquid flow path channels, the main liquid flow path channels further including a liquid flow path intersection communicating with the liquid flow path connecting channel, and the through hole extending to the liquid flow path intersection and the vapor flow path channel.

[0032] As a second solution, the present invention provides a core sheet for an evaporation chamber, which is located between a first sheet and a second sheet of an evaporation chamber containing a working fluid. The core sheet for the evaporation chamber comprises: a sheet body having a first main surface and a second main surface disposed on the side opposite to the first main surface; a through space extending from the first main surface of the sheet body to the second main surface; a first main surface groove disposed on the first main surface and communicating with the through space; and a second main surface groove disposed on the second main surface and communicating with the through space. The sheet body has an island portion having a length direction in a first direction, and the through space is disposed around the island portion. The first main surface groove has a first groove extending from one side edge of the island portion to another side edge in a second direction perpendicular to the first direction. The second main surface groove has a second groove extending in the first direction, and the dimension of the first groove in the first direction is larger than the dimension of the second groove in the second direction.

[0033] As a third solution, the present invention provides an evaporation chamber.

[0034] The evaporation chamber includes: a first sheet; a second sheet; and a core sheet for the evaporation chamber of the first solution or the second solution described above, which is located between the first sheet and the second sheet.

[0035] As a fourth solution, the present invention provides an evaporation chamber.

[0036] The evaporation chamber includes: a first piece; a second piece; a core piece for the evaporation chamber of the first solution described above, which is located between the first piece and the second piece; and an evaporation region, in which the working fluid evaporates, and the second vapor flow path is disposed in the evaporation region.

[0037] As a fifth solution, the present invention provides an electronic device.

[0038] The electronic device includes: a housing; a device housed within the housing; and an evaporation chamber of the third or fourth solution described above, which is in thermal contact with the device.

[0039] Invention Effects

[0040] According to the present invention, heat dissipation efficiency can be improved. Attached Figure Description

[0041] Figure 1 This is a schematic perspective view illustrating an electronic device according to an embodiment of the present invention.

[0042] Figure 2 This is a top view showing an embodiment of the evaporation chamber of the present invention.

[0043] Figure 3 It is shown Figure 2 A cross-sectional view of the evaporation chamber along line AA.

[0044] Figure 4 yes Figure 3 Top view of the lower side panel.

[0045] Figure 5 yes Figure 3 The bottom view of the upper side panel.

[0046] Figure 6 yes Figure 3 A top view of the core wafer.

[0047] Figure 7 yes Figure 3 A bottom view of the core sheet.

[0048] Figure 8 yes Figure 3 A partially enlarged sectional view.

[0049] Figure 9 Is Figure 6 The image shows a partially enlarged top view of the liquid flow path.

[0050] Figure 10 Is Figure 7 A partially enlarged top view of the second steam flow path shown in the figure.

[0051] Figure 11A It will be along Figure 7 The figure shows a partial cross-section of the BB line together with the lower side plate.

[0052] Figure 11B It is shown Figure 11A A partial sectional view of a modified example.

[0053] Figure 11C It is shown Figure 11A Partial sectional views of other variations.

[0054] Figure 12 This is a diagram illustrating the preparation process of the core sheet in the manufacturing method of the evaporation chamber in the embodiment.

[0055] Figure 13 This is a diagram illustrating the etching process in the manufacturing method of the evaporation chamber in the embodiment.

[0056] Figure 14 This is a diagram used to illustrate the joining process in the manufacturing method of the evaporation chamber in the embodiment.

[0057] Figure 15This is a partially enlarged bottom view of the second steam flow path as a first variation.

[0058] Figure 16A This is a partially enlarged bottom view of the second steam flow path section, shown as a second variation.

[0059] Figure 16B yes Figure 16A A magnified bottom view of a portion of the view.

[0060] Figure 16C It is along Figure 16B A cross-sectional view of the CC line.

[0061] Figure 17 This is a partially enlarged bottom view of the second steam flow path section, shown as a third variation.

[0062] Figure 18 This is a partially enlarged bottom view of the second steam flow path, shown as the fourth variation.

[0063] Figure 19 This is a partially enlarged top view of the liquid flow path as the fifth variation.

[0064] Figure 20 This is a partially enlarged bottom view of the second steam flow path section, shown as the sixth variation.

[0065] Figure 21 This is a partially enlarged bottom view of the second steam flow path section, shown as the seventh variation. Detailed Implementation

[0066] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, for ease of illustration and understanding, the proportions and aspect ratios of the actual objects have been appropriately altered.

[0067] The geometric conditions, physical characteristics, terms indicating the degree of specified geometric conditions or physical characteristics, and numerical values ​​representing geometric conditions or physical characteristics used in this specification can be interpreted without being strictly bound by their meanings. Furthermore, these geometric conditions, physical characteristics, terms, and numerical values ​​can be interpreted to encompass a range of degrees to which the same function can be expected. Examples of terms specifying geometric conditions include "length," "angle," "shape," or "configuration." Examples of terms specifying geometric conditions include "parallel," "perpendicular," or "identical." Additionally, for clarity in the drawings, the shapes of multiple parts that can be expected to have the same function are shown regularly. However, without being strictly bound by their meanings, the shapes of these parts may differ within the range to which the function can be expected. Furthermore, in the drawings, for convenience, only straight lines are shown to represent the boundary lines of the mating surfaces of components, etc., but these are not limited to strictly straight lines; the shape of these boundary lines is arbitrary within the range to which the desired mating performance can be expected.

[0068] use Figures 1 to 21 The core sheet for the evaporation chamber, the evaporation chamber, and the electronic device in the embodiments of the present invention will be described. In this embodiment, the evaporation chamber 1, together with the electronic device D that generates heat, is housed in the casing H of the electronic device E, and is a device for cooling the electronic device D. Examples of the electronic device E include mobile terminals such as portable terminals or tablet computers. Examples of the electronic device D include central processing units (CPUs), light-emitting diodes (LEDs), or power semiconductors. Sometimes the electronic device D is also referred to as the cooling device.

[0069] Here, we will first describe the electronic device E equipped with the evaporation chamber 1 of this embodiment using a tablet computer as an example. Figure 1 As shown, the electronic device E includes: a housing H; electronic components D housed within the housing H; and an evaporation chamber 1. Figure 1 In the illustrated electronic device E, a touch panel display TD is provided on the front surface of the housing H. An evaporation chamber 1 is housed within the housing H and configured to be in thermal contact with the electronic device D. Thus, the evaporation chamber 1 can receive heat generated by the electronic device D when using the electronic device E. The heat received by the evaporation chamber 1 is released to the outside of the evaporation chamber 1 via working fluids 2a and 2b, described later. In this way, the electronic device D is effectively cooled. In the case where the electronic device E is a tablet computer terminal, the electronic device D is equivalent to a central processing unit, etc.

[0070] Next, the evaporation chamber 1 of this embodiment will be described. Figure 2 and Figure 3As shown, the evaporation chamber 1 has a sealed space 3 containing working fluids 2a and 2b. The working fluids 2a and 2b within the sealed space 3 repeatedly undergo phase changes, thereby cooling the electronic device D of the aforementioned electronic device E. Examples of working fluids 2a and 2b include pure water, ethanol, methanol, or acetone, as well as mixtures thereof. Working fluids 2a and 2b may exhibit freeze-expansion properties. That is, working fluids 2a and 2b may be fluids that expand upon freezing. Examples of working fluids 2a and 2b exhibiting freeze-expansion properties include pure water, or aqueous solutions of pure water with additives such as alcohol.

[0071] like Figure 2 and Figure 3 As shown, the evaporation chamber 1 includes a lower side plate 10, an upper side plate 20, and a core plate 30 for the evaporation chamber. The lower side plate 10 is an example of the first plate. The upper side plate 20 is an example of the second plate. The core plate 30 for the evaporation chamber is located between the lower side plate 10 and the upper side plate 20. Hereinafter, the core plate 30 for the evaporation chamber will only be referred to as the core plate 30. In this embodiment, the lower side plate 10, the core plate 30, and the upper side plate 20 are stacked in this order.

[0072] The evaporation chamber 1 is formed into a generally thin flat plate. The planar shape of the evaporation chamber 1 is arbitrary and can be... Figure 2 The evaporation chamber 1 is rectangular as shown. Its planar shape can be, for example, a rectangle with one side of 1 cm and another side of 3 cm, or a square with each side of 15 cm; the planar dimensions of the evaporation chamber 1 are arbitrary. In this embodiment, as an example, we will describe an example where the planar shape of the evaporation chamber 1 is rectangular with the X direction as its length, as described later. In this case, as... Figures 4-7 As shown, the lower side plate 10, the upper side plate 20, and the core plate 30 can have the same planar shape as the evaporation chamber 1. In addition, the planar shape of the evaporation chamber 1 is not limited to a rectangular shape, but can also be any shape such as a circle, an ellipse, an L-shape, or a T-shape.

[0073] like Figure 2 As shown, the evaporation chamber 1 has an evaporation zone SR for evaporating working fluids 2a and 2b, and a condensation zone CR for condensing working fluids 2a and 2b.

[0074] The evaporation region SR is the area that coincides with the electronic device D when viewed from above, and it is the area where the electronic device D is mounted. The evaporation region SR can be configured at any position in the evaporation chamber 1. In this embodiment, the evaporation region SR is formed on one side of the evaporation chamber 1 in the X direction ( Figure 2(Left side of the image). Heat from the electronic device D is transferred to the evaporation region SR, where the working fluid evaporates due to this heat. The heat from the electronic device D can be transferred not only to the area overlapping with the electronic device D in a top view, but also to the periphery of that area. Therefore, the evaporation region SR includes the area overlapping with the electronic device D in a top view and its surrounding area. Here, "top view" refers to the view from a direction perpendicular to the surface of the evaporation chamber 1 that receives heat from the electronic device D and the surface that releases the received heat. The heated surface corresponds to the second upper side panel 20b, described later in the description of the upper side panel 20. The surface that releases heat corresponds to the first lower side panel 10a, described later in the description of the lower side panel 10. For example, as... Figure 2 As shown, the state of the evaporation chamber 1 as viewed from above, or the state as viewed from below, is equivalent to a top-down view. The gaseous working fluid is designated as working vapor 2a, and the liquid working fluid is designated as working liquid 2b.

[0075] The condensation region CR is the area that does not coincide with the electronic device D when viewed from above, and it is the main area where the working vapor 2a releases heat and condenses. The condensation region CR can also be described as the area surrounding the evaporation region SR. In the condensation region CR, the heat from the working vapor 2a is released to the lower side plate 10, and the working vapor 2a is cooled and condensed in the condensation region CR.

[0076] When the evaporation chamber 1 is installed inside a tablet computer terminal, the vertical relationship may not be valid depending on the orientation of the tablet computer terminal. However, in this embodiment, for convenience, the plate that receives heat from the electronic device D is referred to as the upper plate 20, and the plate that releases the received heat is referred to as the lower plate 10. Therefore, the structure of the evaporation chamber 1 will be described with the lower plate 10 positioned on the lower side and the upper plate 20 positioned on the upper side.

[0077] like Figure 3 As shown, the lower side sheet 10 has: a first lower side sheet surface 10a provided on the side opposite to the core sheet 30; and a second lower side sheet surface 10b provided on the side opposite to the first lower side sheet surface 10a. The second lower side sheet surface 10b is provided on one side of the core sheet 30. The lower side sheet 10 can be formed generally as a flat surface. The lower side sheet 10 can have a fixed thickness generally. The housing component Ha, which constitutes part of the aforementioned housing H, is mounted on the first lower side sheet surface 10a. The entire first lower side sheet surface 10a can be covered by the housing component Ha. Figure 4 As shown, calibration holes 12 can be provided at the four corners of the lower side plate 10.

[0078] like Figure 3As shown, the upper side sheet 20 has: a first upper side sheet surface 20a provided on one side of the core sheet 30; and a second upper side sheet surface 20b provided on the side opposite to the first upper side sheet surface 20a. The second upper side sheet surface 20b is provided on the side opposite to the core sheet 30. The upper side sheet 20 can be formed as a whole into a flat shape. The upper side sheet 20 can have a fixed thickness as a whole. The aforementioned electronic device D is mounted on the second upper side sheet surface 20b. Figure 5 As shown, calibration holes 22 can be provided at the four corners of the upper side plate 20.

[0079] like Figure 3 As shown, the core sheet 30 includes: a sheet body 31; and a first vapor flow path 50, a liquid flow path 60, and a second vapor flow path 70 disposed on the sheet body 31. The sheet body 31 has: a first body surface 31a; and a second body surface 31b disposed on the side opposite to the first body surface 31a. The first body surface 31a is disposed on one side of the lower sheet 10. The second body surface 31b is disposed on one side of the upper sheet 20. The first vapor flow path 50, the liquid flow path 60, and the second vapor flow path 70 constitute the aforementioned sealed space 3.

[0080] The second lower side surface 10b of the lower side sheet 10 and the first main body surface 31a of the sheet body 31 can be diffusely bonded together. The second lower side surface 10b and the first main body surface 31a can also be permanently bonded together. Similarly, the first upper side surface 20a of the upper side sheet 20 and the second main body surface 31b of the sheet body 31 can be diffusely bonded together. The first upper side surface 20a and the second main body surface 31b can also be permanently bonded together. If the lower side sheet 10, the upper side sheet 20, and the core sheet 30 can be permanently bonded together instead of diffusely bonded together, they can also be bonded by other means such as brazing. The term "permanently bonded" is not limited to a strict meaning, but is used as a term indicating the degree to which the bond is maintained: the sealing of the sealed space 3 can be maintained when the evaporation chamber 1 is operating. It is sufficient that the lower side sheet 10 and the core sheet 30 can be permanently bonded together so that the bond between the lower side sheet 10 and the core sheet 30 can be maintained when the evaporation chamber 1 is operating. As long as the upper side plate 20 and the core plate 30 are permanently joined, the connection between the upper side plate 20 and the core plate 30 can be maintained when the evaporation chamber 1 is in operation.

[0081] In this embodiment, the core sheet 30 has a main body 31 with a frame portion 32 and multiple island portions 33. For example... Figure 2 , Figure 6 and Figure 7As shown, the frame portion 32 is formed into a rectangular frame shape when viewed from above. Island portions 33 are provided within the frame portion 32. The frame portion 32 and island portions 33 are the portions where material from the core sheet 30 remains due to the lack of etching during the etching process described later. A first vapor flow path 50 is defined inside the frame portion 32. That is, the first vapor flow path 50 is disposed inside the frame portion 32 and around each island portion 33. Working vapor 2a flows around each island portion 33.

[0082] In this embodiment, the island portion 33 can extend in an elongated shape with the X direction as its length when viewed from above. The planar shape of the island portion 33 can be an elongated rectangle. The X direction is an example of the first direction. The X direction is equivalent to... Figure 6 The left and right directions. Furthermore, each island 33 is separated at equal intervals in the Y direction. The Y direction is an example of the second direction. The Y direction is equivalent to... Figure 6 The islands 33 are arranged parallel to each other in the vertical direction. The working steam 2a flows around each island 33 and is transported towards the condensation region CR. This prevents obstruction of the flow of the working steam 2a. The width w1 of the island 33 (refer to...) Figure 8 For example, it can be 100μm to 1500μm. Here, the width w1 of the island portion 33 is the dimension of the island portion 33 in the Y direction. The width w1 refers to the dimension at the position where the through portion 34, which will be described later, exists in the thickness direction of the core sheet 30.

[0083] The frame portion 32 and each island portion 33 are diffusely joined to the lower side plate 10 and diffusely joined to the upper side plate 20. This improves the mechanical strength of the evaporation chamber 1. The wall surface 53a of the lower vapor flow path recess 53 and the wall surface 54a of the upper vapor flow path recess 54 (described later) constitute the sidewalls of the island portion 33. The first main body surface 31a and the second main body surface 31b of the plate body 31 can be formed flat throughout the frame portion 32 and each island portion 33.

[0084] The first steam flow path 50 is an example of a through space that passes through the sheet body 31. The first steam flow path 50 is a flow path through which the working steam 2a mainly passes. The first steam flow path 50 extends from the first main body surface 31a to the second main body surface 31b and passes through the sheet body 31 of the core sheet 30. That is, the first steam flow path 50 is configured as a through space that extends from the first main body surface 31a to the second main body surface 31b.

[0085] like Figure 6 and Figure 7As shown, the first vapor flow path 50 in this embodiment has a first vapor passage 51 and a plurality of second vapor passages 52. The first vapor passage 51 is formed between the frame portion 32 and the island portion 33. The first vapor passage 51 is continuously formed inside the frame portion 32 and outside the island portion 33. The planar shape of the first vapor passage 51 is rectangular. The second vapor passages 52 are formed between adjacent island portions 33. The planar shape of the second vapor passages 52 is elongated rectangular. The first vapor flow path 50 is divided into the first vapor passage 51 and the plurality of second vapor passages 52 by the plurality of island portions 33.

[0086] like Figure 3 As shown, the first vapor passage 51 and the second vapor passage 52 extend from the first main body surface 31a of the sheet body 31 to the second main body surface 31b. The first vapor passage 51 and the second vapor passage 52 are each composed of the following parts: a lower vapor flow path recess 53 provided on the first lower side sheet surface 10a; and an upper vapor flow path recess 54 provided on the upper side sheet surface 20b. The lower vapor flow path recess 53 and the upper vapor flow path recess 54 are connected, thereby extending the first vapor passage 51 and the second vapor passage 52 of the first vapor flow path portion 50 from the first main body surface 31a to the second main body surface 31b.

[0087] The lower vapor flow path recess 53 is formed by etching from the first main body surface 31a of the core sheet 30 in an etching process described later. The lower vapor flow path recess 53 is formed in a concave shape on the first main body surface 31a. Thus, as... Figure 8 As shown, the lower vapor flow path recess 53 has a curved wall surface 53a. This wall surface 53a defines the lower vapor flow path recess 53. The wall surface 53a is positioned to... Figure 8 The cross-section shown bends as it approaches the opposing wall 53a near the second main body surface 31b. This lower vapor flow path recess 53 forms part (lower half) of the first vapor passage 51 and part (lower half) of the second vapor passage 52.

[0088] The upper vapor flow path recess 54 is formed by etching from the second main body surface 31b of the core sheet 30 in an etching process described later. The upper vapor flow path recess 54 is formed in a concave shape on the second main body surface 31b. Thus, as... Figure 8 As shown, the upper vapor flow path recess 54 has a curved wall surface 54a. This wall surface 54a defines the upper vapor flow path recess 54. The wall surface 54a is positioned to... Figure 8 The cross-section shown bends as it approaches the opposing wall surface 54a as it approaches the first main body surface 31a. This upper vapor flow path recess 54 forms part (upper half) of the first vapor passage 51 and part (upper half) of the second vapor passage 52.

[0089] like Figure 8 As shown, the wall surface 53a of the lower vapor flow path recess 53 and the wall surface 54a of the upper vapor flow path recess 54 are connected to form a through portion 34. The wall surfaces 53a and 54a are curved toward the through portion 34. Thus, the lower vapor flow path recess 53 and the upper vapor flow path recess 54 are interconnected. In this embodiment, the through portion 34 has a rectangular frame shape in the first vapor passage 51, similar to the first vapor passage 51. The through portion 34 has an elongated rectangular shape in the second vapor passage 52, similar to the second vapor passage 52. Alternatively, the wall surface 53a of the lower vapor flow path recess 53 and the wall surface 54a of the upper vapor flow path recess 54 may merge to form a ridge, through which the through portion 34 is defined. Figure 8 As shown, the ridge can be formed to extend inwards into the steam passages 51 and 52. At the through-section 34, the planar area of ​​the first steam passage 51 becomes minimal, and the planar area of ​​the second steam passage 52 also becomes minimal. The width w2 of the through-section 34 in the second steam passage 52 (refer to...) Figure 8 For example, it can be 400μm to 1600μm. The width of the through portion 34 in the first vapor passage 51 is also the same. Here, the width w2 of the through portion 34 is equivalent to the gap between the island portions 33 that are adjacent to each other in the Y direction.

[0090] The position of the through portion 34 in the Z direction can be the midpoint between the first lower side surface 10a and the upper side surface 20b. Alternatively, the position of the through portion 34 can be a position offset downwards from the midpoint, or it can be a position offset upwards. As long as the lower vapor flow path recess 53 and the upper vapor flow path recess 54 are connected, the position of the through portion 34 in the Z direction is arbitrary. The Z direction is equivalent to... Figure 8 The up and down directions in the middle.

[0091] In this embodiment, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 are formed in such a way as to include a through portion 34, wherein the through portion 34 is defined by a ridge line formed to extend inward, but is not limited thereto. For example, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 may be trapezoidal or rectangular, or may be barrel-shaped.

[0092] The first vapor flow path 50, comprising the first vapor passage 51 and the second vapor passage 52 configured in this way, constitutes a part of the aforementioned sealed space 3. For example... Figure 3 As shown, the first steam flow path 50 of this embodiment is mainly defined by the lower side plate 10, the upper side plate 20, and the frame portion 32 and island portion 33 of the aforementioned plate body 31. Each steam passage 51, 52 has a relatively large flow path cross-sectional area to allow the working steam 2a to pass through.

[0093] To make the accompanying drawings clear, Figure 3 The first steam passage 51 and the second steam passage 52 are shown in an enlarged format. The number or arrangement of these steam passages 51 and 52 is related to... Figure 2 , Figure 6 as well as Figure 7 different.

[0094] Additionally, although not shown, multiple support portions supporting the island portions 33 to the frame portion 32 may be provided within the first vapor flow path portion 50. Furthermore, support portions supporting adjacent island portions 33 to each other may also be provided. These support portions may be provided on both sides of the island portions 33 in the X direction or on both sides of the island portions 33 in the Y direction. Preferably, the support portions are formed in a way that does not obstruct the flow of working vapor 2a diffused in the first vapor flow path portion 50. For example, they may be disposed on one side of the first body surface 31a and the second body surface 31b of the core sheet 30's sheet body 31, with a space forming a vapor flow path recess on the other side. This allows the thickness of the support portion to be thinner than the thickness of the sheet body 31, and prevents the first vapor passage 51 and the second vapor passage 52 from being interrupted in the X and Y directions.

[0095] like Figure 6 and Figure 7 As shown, calibration holes 35 can be provided at the four corners of the core body 31 of the core chip 30.

[0096] like Figure 2 As shown, the evaporation chamber 1 may also have an injection section 4 on one end edge in the X direction for injecting the working fluid 2b into the sealed space 3. Figure 2 In the configuration shown, the injection section 4 is disposed on one side of the evaporation region SR. The injection section 4 protrudes outward from the end edge of the evaporation region SR side.

[0097] More specifically, the injection section 4 may have: a lower injection protrusion 11; an upper injection protrusion 21; and a core sheet injection protrusion 36. For example... Figure 4 As shown, the lower injection protrusion 11 is a part constituting the lower side plate 10. Figure 5 As shown, the upper injection protrusion 21 is a part that constitutes the upper side plate 20. Figure 6 and Figure 7As shown, the core injection protrusion 36 is a part constituting the core body 31. An injection flow path 37 is formed in the core injection protrusion 36. This injection flow path 37 extends from the first body surface 31a to the second body surface 31b of the core body 31, thus penetrating the core body 31 (more specifically, the core injection protrusion 36) in the Z direction. Furthermore, the injection flow path 37 communicates with the first vapor flow path 50. The working fluid 2b is injected into the sealed space 3 through this injection flow path 37. Alternatively, the injection flow path 37 may communicate with the liquid flow path 60 through the arrangement of the liquid flow path 60. The upper and lower surfaces of the core injection protrusion 36 are flat. The upper surface of the lower injection protrusion 11 and the lower surface of the upper injection protrusion 21 are also flat. The planar shapes of each injection protrusion 11, 21, and 38 may be identical.

[0098] In this embodiment, an example is shown where the injection section 4 is provided on one of the two end edges of the evaporation chamber 1 in the X direction. However, it is not limited to this, and the injection section 4 can be provided at any position. In addition, for the injection flow path 37 provided in the core sheet injection protrusion 36, it may not penetrate the sheet body 31 as long as the working fluid 2b can be injected. In this case, the injection flow path 37 communicating with the first vapor flow path section 50 can be formed by a recess formed in one of the first body surface 31a and the second body surface 31b of the sheet body 31.

[0099] like Figure 3 , Figure 6 and Figure 8 As shown, a liquid flow path 60 is provided on the second main body surface 31b of the core sheet 30's main body 31. The liquid flow path 60 can be a flow path mainly for the working fluid 2b to pass through. This liquid flow path 60 constitutes part of the aforementioned sealed space 3. The liquid flow path 60 communicates with the first vapor flow path 50. The liquid flow path 60 is configured as a capillary structure for conveying the working fluid 2b to the evaporation zone SR. Sometimes, the liquid flow path 60 is also referred to as the core. In this embodiment, the liquid flow path 60 is provided on the second main body surface 31b of each island portion 33 of the core sheet 30. The liquid flow path 60 can be formed throughout the entire second main body surface 31b of each island portion 33. The liquid flow path 60 may not be provided on the first main body surface 31a of each island portion 33.

[0100] like Figure 9 As shown, the liquid flow path section 60 is an example of the second main body surface groove section. More specifically, the liquid flow path section 60 has a plurality of main liquid flow path grooves 61 and a plurality of liquid flow path connecting grooves 65. The main liquid flow path grooves 61 are an example of the second groove. The main liquid flow path grooves 61 and the liquid flow path connecting grooves 65 are grooves through which the working fluid 2b passes. The liquid flow path connecting grooves 65 are connected to the main liquid flow path grooves 61.

[0101] like Figure 9 As shown, each liquid flow path main channel 61 extends in the X direction. The liquid flow path main channel 61 has a flow path cross-sectional area that primarily allows the working liquid 2b to flow via capillary action. The flow path cross-sectional area of ​​the liquid flow path main channel 61 is smaller than that of the vapor passages 51 and 52. Therefore, the liquid flow path main channel 61 is configured to transport the working liquid 2b condensed from the working vapor 2a to the evaporation zone SR. Alternatively, each liquid flow path main channel 61 can be arranged at equal intervals along the Y direction, which is perpendicular to the X direction.

[0102] The main flow channel 61 is formed by etching the second body surface 31b of the core sheet 30 body 31 in an etching process described later. Thus, as... Figure 8 As shown, the main flow channel 61 of the liquid flow path has a curved wall 62. The wall 62 defines the main flow channel 61 of the liquid flow path and is curved in a shape that bulges toward the first body surface 31a.

[0103] like Figure 8 and Figure 9 As shown, the width w3 of the main flow channel 61 can be, for example, 5 μm to 150 μm. The width w3 of the main flow channel 61 refers to the dimension on the second main body surface 31b. The width w3 corresponds to the dimension in the Y direction. Furthermore, as... Figure 8 As shown, the depth h1 of the main flow channel 61 can be, for example, 3 μm to 150 μm. The depth h1 corresponds to the dimension in the Z direction.

[0104] like Figure 9 As shown, each liquid flow path connecting groove 65 extends in a direction different from the X direction. In this embodiment, each liquid flow path connecting groove 65 extends in the Y direction. The liquid flow path connecting groove 65 is formed perpendicular to the main liquid flow path groove 61. Several liquid flow path connecting grooves 65 connect adjacent main liquid flow path grooves 61 to each other. Other liquid flow path connecting grooves 65 connect the first vapor passage 51 or the second vapor passage 52 to the main liquid flow path groove 61. That is, the liquid flow path connecting groove 65 extends from the side edge 33a of the island 33 in the Y direction to the main liquid flow path groove 61 adjacent to the side edge 33a. In this way, the first vapor passage 51 and the main liquid flow path groove 61 are connected, and the second vapor passage 52 and the main liquid flow path groove 61 are connected.

[0105] The liquid flow path connection 65 has a flow path cross-sectional area that primarily allows the working fluid 2b to flow via capillary action. The flow path cross-sectional area of ​​the liquid flow path connection 65 is smaller than that of the vapor passages 51 and 52. The liquid flow path connection 65 can be arranged in a manner that is equally spaced along the X direction.

[0106] The liquid flow path connecting groove 65 is formed by etching in the same manner as the main liquid flow path groove 61. The liquid flow path connecting groove 65 has the same curved wall surface (not shown) as the main liquid flow path groove 61. Figure 9 As shown, the width w4 of the liquid flow path connecting groove 65 can be equal to the width w3 of the liquid flow path main flow path groove 61. However, the width w4 can also be larger or smaller than the width w3. The width w4 corresponds to the dimension in the X direction. The depth of the liquid flow path connecting groove 65 can be equal to the depth h1 of the liquid flow path main flow path groove 61. However, the depth of the liquid flow path connecting groove 65 can also be deeper or shallower than the depth h1.

[0107] like Figure 9 As shown, the liquid flow path section 60 has a row of protrusions 63 provided on the second main body surface 31b of the sheet body 31. The row of protrusions 63 is provided between adjacent liquid flow path main channel 61s. Each row of protrusions 63 includes a plurality of protrusions 64 arranged in the X direction. The protrusions 64 are examples of liquid flow path protrusions. The protrusions 64 are provided within the liquid flow path section 60. The protrusions 64 protrude from the sheet body 31 and abut against the upper side sheet 20. Each protrusion 64 is formed in a rectangular shape such that the X direction is the length direction when viewed from above. The liquid flow path main channel 61 is located between adjacent protrusions 64 in the Y direction. The liquid flow path connecting groove 65 is located between adjacent protrusions 64 in the X direction. The liquid flow path connecting groove 65 extends in the Y direction and communicates with adjacent liquid flow path main channels 61 in the Y direction. Thus, the working fluid 2b can flow between these liquid flow path main channels 61.

[0108] The protrusion 64 is the portion of the core sheet 30 that remains unetched during the etching process described later. In this embodiment, as... Figure 9 As shown, the planar shape of the protrusion 64 is rectangular. The planar shape of the protrusion 64 corresponds to the planar shape at the position of the second main surface 31b of the sheet body 31.

[0109] In this embodiment, the protrusions 64 are arranged in a staggered configuration. More specifically, the protrusions 64 of adjacent rows of protrusions 63 in the Y direction are arranged in a manner that they are staggered in the X direction. This staggering amount can be half of the spacing between the protrusions 64 in the X direction. The width w5 of the protrusions 64 can be, for example, 5 μm to 500 μm. The width w5 of the protrusions 64 refers to the dimension on the second body surface 31b. The width w5 corresponds to the dimension in the Y direction. The arrangement of the protrusions 64 is not limited to a staggered configuration; they can also be arranged side by side. In this case, the protrusions 64 of adjacent rows of protrusions 63 in the Y direction are also aligned in the X direction (see reference). Figure 19 ).

[0110] The main flow channel 61 includes a flow channel intersection 66. The flow channel intersection 66 is the portion of the main flow channel 61 that communicates with the flow channel connecting channel 65. At the flow channel intersection 66, the main flow channel 61 and the flow channel connecting channel 65 are connected in a T-shape. This avoids the situation where, at a flow channel intersection 66 where one flow channel 61 is connected to one flow channel connecting channel 65, the other flow channel connecting channel 65 is connected to the main flow channel 61. For example, it avoids the situation where, at a flow channel intersection 66, Figure 9 The upper liquid flow path connecting groove 65 and the lower liquid flow path connecting groove 65 are connected. That is, when the liquid flow path connecting grooves 65 on both sides of a main liquid flow path groove 61 in the Y direction are arranged at the same position in the X direction, the main liquid flow path groove 61 and the liquid flow path connecting groove 65 intersect in a cross shape. In this case, the wall surface 62 of the main liquid flow path groove 61 (refer to...) Figure 8 The main flow channel 61 is cut off on both sides at the same position in the X direction by the liquid flow path connecting groove 65. At the cut position, a continuous cross-shaped space is formed, thereby potentially reducing the capillary effect of the main flow channel 61. In contrast, according to this embodiment, the liquid flow path connecting grooves 65 existing on both sides of a main flow channel 61 in the Y direction are arranged at different positions in the X direction. As a result, the position where the wall surface 62 of the main flow channel 61 is cut off by the liquid flow path connecting groove 65 on one side in the Y direction and the position where it is cut off by the liquid flow path connecting groove 65 on the other side in the Y direction are different in the X direction. In this case, since the main flow channel 61 is connected to the liquid flow path connecting groove 65 on one side in the Y direction, the wall surface 62 of the main flow channel 61 can be preserved on the other side in the Y direction. Therefore, at the location where the wall 62 of the main liquid flow channel 61 is cut by the liquid flow channel connecting channel 65, the continuous space is formed in a T-shape, which can suppress the reduction of capillary action of the main liquid flow channel 61. Therefore, it is possible to suppress the following situation: the propulsion force of the working fluid 2b toward the evaporation region SR decreases at the liquid flow channel intersection 66.

[0111] like Figure 3 , Figure 7 as well as Figure 8As shown, the second vapor flow path 70 is provided on the first main body surface 31a of the island portion 33 of the core sheet 30. The second vapor flow path 70 may be the portion through which the working vapor 2a mainly passes. This second vapor flow path 70 constitutes a part of the aforementioned sealed space 3. The second vapor flow path 70 communicates with the first vapor flow path 50 and is also connected to the liquid flow path 60 via the first vapor flow path 50. In this embodiment, the second vapor flow path 70 is provided on the first main body surface 31a of each island portion 33 of the core sheet 30.

[0112] like Figure 7 As shown, the second vapor flow path 70 of this embodiment can be disposed on one side of the island 33 in the X direction. The second vapor flow path 70 can also be formed in the X direction at a location closer to the center of the island 33. The second vapor flow path 70 of this embodiment can be disposed in the evaporation zone SR. However, it is not limited to this; a portion of the second vapor flow path 70 can extend beyond the outside of the evaporation zone SR. When at least a portion of the second vapor flow path 70 is disposed in the evaporation zone SR, the working vapor 2a, which is evaporated from the working liquid 2b in the evaporation zone SR by the heat from the electronic device D, easily diffuses in the Y direction.

[0113] like Figure 10 As shown, the second vapor flow path 70 is an example of the first main body surface groove. More specifically, the second vapor flow path 70 includes a vapor flow path groove 71. The vapor flow path groove 71 is an example of the first groove. The vapor flow path groove 71 extends from one side edge 33a of the island portion 33 to the other side edge 33a in the Y direction, which is perpendicular to the X direction. In this embodiment, one vapor flow path groove 71 is formed in each island portion 33. The vapor flow path groove 71 extends in the Y direction, which is perpendicular to the second vapor passage 52. Figure 10 The diagram shows an example where the Y-direction dimension of the vapor flow path groove 71 is smaller than its X-direction dimension, but it is not limited to this. The side edge 33a of the island 33 refers to the edge of the island 33 in the Y direction, and is used as a term to indicate the position of the wall surface 53a of the lower vapor flow path recess 53 on the first main body surface 31a.

[0114] The island 33 includes a pair of end edges 33b. End edges 33b are the end edges of the island 33 in the X direction. For example... Figure 10As shown, an edge protrusion 73 that abuts against the lower side plate 10 is provided between the vapor flow channel 71 and one side edge 33b. More specifically, the edge protrusion 73 is formed in the X direction between the edge 33b disposed in the evaporation region SR and the vapor flow channel 71. This edge protrusion 73 is formed on one side of the second vapor flow channel 70 in the X direction and constitutes the first main body surface 31a. Therefore, the edge protrusion 73 abuts against and engages with the lower side plate 10. The first main body surface 31a remains on the other side of the vapor flow channel 71. The edge 33b of the island 33 refers to the edge of the island 33 in the X direction, and is used as a term to indicate the position of the wall surface 53a of the lower vapor flow channel recess 53 on the first main body surface 31a.

[0115] The cross-sectional area of ​​the steam flow channel 71 in the second steam flow channel 70 is smaller than that of the steam passages 51 and 52. However, the cross-sectional area of ​​the steam flow channel 71 can also be larger than that of the main liquid flow channel 61 in the liquid flow channel 60. As a result, the capillary force acting on the working fluid 2b in the steam flow channel 71 can be smaller than the capillary force acting on the working fluid 2b in the main liquid flow channel 61.

[0116] The vapor flow channel 71 is formed by etching the first body surface 31a of the core sheet 30 body 31 in an etching process described later. Thus, as... Figure 11A As shown, the vapor flow channel 71 has a curved wall 71a. This wall 71a defines the vapor flow channel 71 and is curved in a shape that bulges towards the second body surface 31b. Figure 11A In the cross-section shown, as described above, an example is shown where the wall 71a is curved in a shape that forms part of an ellipse. With the wall 71a formed in this way, for example, the force applied from above can be dispersed in the X direction, thereby preventing the steam flow channel 71 from being crushed. Furthermore, the space in the central portion of the steam flow channel 71 in the X direction can be relatively increased. As a result, the flow resistance of the working steam 2a can be reduced, thereby reducing the pressure loss of the working steam 2a flowing in the steam flow channel 71.

[0117] However, the shape of the wall 71a of the steam flow channel 71 is not limited to Figure 11A The shape shown.

[0118] For example, such as Figure 11B As shown, the vapor flow channel 71 can also have two curved walls 77 and a straight wall 78. The curved walls 77 are curved. The straight walls 78 are disposed between the curved walls 77, forming a straight line. Figure 11BIn this configuration, the curved wall 77 is curved in a shape that forms part of an arc, but is not limited to this. With the steam flow channel 71 formed in this way, capillary action on the straight wall 78 can be suppressed, and the inflow of the working fluid 2b into the steam flow channel 71 can be prevented. Furthermore, the portion of the steam flow channel 71 defined by the straight wall 78 reduces the flow resistance of the working steam 2a, thereby reducing the pressure loss of the working steam 2a flowing in the steam flow channel 71.

[0119] For example, such as Figure 11C As shown, the steam flow channel 71 may also have two curved walls 77 and an uneven wall 79. The curved walls 77 are curved. The uneven wall 79 is disposed between the curved walls 77 and is formed in an uneven shape. The uneven shape of the uneven wall 79 can guide the flow of the working steam 2a. In this case, the flow resistance of the working steam 2a can be reduced, thereby reducing the pressure loss of the working steam 2a flowing in the steam flow channel 71. The height of the unevenness formed on the uneven wall 79 can be smaller than the depth h2 of the steam flow channel 71 described later. In addition, the planar shape of the unevenness is arbitrary. It is also possible to form an uneven wall 79 on a portion of the uneven wall 79. Figure 11B The straight wall 78 shown.

[0120] like Figure 7 and Figure 10 As shown, the aforementioned second vapor flow path 70 is provided on the first main body surface 31a of each island portion 33. The vapor flow path channels 71 of one island portion 33 and the other island portion 33, which are adjacent to each other in the Y direction, are arranged at a position where they overlap when viewed along the Y direction. That is, the vapor flow path channels 71 of adjacent island portions 33 are formed continuously via the second vapor passage 52 and are formed on their respective extension lines. The vapor flow path channels 71 of adjacent island portions 33 may also be arranged at the same position in the X direction. However, the arrangement of the vapor flow path channels 71 is not limited to this. For example, the vapor flow path channels 71 of one island portion 33 and the other island portion 33, which are adjacent to each other in the Y direction, may also be arranged at a position different from the position where they overlap when viewed along the Y direction. In this case, these vapor flow path channels 71 do not overlap when viewed along the Y direction and are arranged at different positions in the X direction.

[0121] like Figure 10 As shown, the width w6 of the vapor flow path channel 71 can be greater than the width w3 of the liquid flow path main flow path channel 61 described above (refer to...). Figure 9 Large. The width w6 can be, for example, 500 μm to 30000 μm. The width w6 of the vapor flow channel 71 refers to the dimension on the first main body surface 31a. The width w6 corresponds to the dimension in the X direction. Additionally, as... Figure 8As shown, the depth h2 of the vapor flow channel 71 can be larger than the depth h1 of the liquid flow channel 61 described above. For example, the depth h2 can be 25 μm to 200 μm. The depth h2 corresponds to the dimension in the Z direction.

[0122] The edge protrusion 73 is the portion of the core sheet 30 that remains unetched during the etching process described later. In this embodiment, as... Figure 10 As shown, the planar shape of the end edge protrusion 73 is rectangular. The planar shape of the end edge protrusion 73 corresponds to the planar shape at the position of the first main body surface 31a of the sheet body 31.

[0123] Furthermore, the materials constituting the lower side plate 10, upper side plate 20, and core plate 30 are not particularly limited as long as they are materials with good thermal conductivity. The lower side plate 10, upper side plate 20, and core plate 30 may contain, for example, copper or copper alloys. In this case, the thermal conductivity of each plate 10, 20, and 30 can be improved, thereby increasing the heat dissipation efficiency of the evaporation chamber 1. Additionally, when using pure water as the working fluid 2a and 2b, corrosion can be prevented. As long as the desired heat dissipation efficiency can be obtained and corrosion can be prevented, other metal materials such as aluminum or titanium, or other metal alloy materials such as stainless steel, can also be used for these plates 10, 20, and 30.

[0124] Figure 3 The thickness t1 of the evaporation chamber 1 shown can be, for example, 100 μm to 1000 μm. By setting the thickness t1 of the evaporation chamber 1 to 100 μm or more, the first vapor flow path 50 can be properly ensured. Therefore, the function of the evaporation chamber 1 can be properly performed. On the other hand, by setting the thickness t1 to 1000 μm or less, the thickness t1 of the evaporation chamber 1 can be prevented from becoming too thick.

[0125] The thickness t2 of the lower side sheet 10 can be, for example, 6 μm to 100 μm. By setting the thickness t2 of the lower side sheet 10 to 6 μm or more, the mechanical strength of the lower side sheet 10 can be ensured. On the other hand, by setting the thickness t2 of the lower side sheet 10 to 100 μm or less, the thickness t1 of the evaporation chamber 1 can be suppressed from becoming thicker. Similarly, the thickness t3 of the upper side sheet 20 can be set in the same way as the thickness t2 of the lower side sheet 10. The thickness t3 of the upper side sheet 20 and the thickness t2 of the lower side sheet 10 can also be different.

[0126] The thickness t4 of the core sheet 30 can be, for example, 50 μm to 400 μm. By setting the thickness t4 of the core sheet 30 to 50 μm or more, the first vapor flow path 50 can be properly secured. Therefore, the function of the evaporation chamber 1 can be properly performed. On the other hand, by setting it to 400 μm or less, the thickness t1 of the evaporation chamber 1 can be prevented from becoming too thick.

[0127] Next, regarding the manufacturing method of the evaporation chamber 1 of this embodiment, which has such a structure, using... Figures 12-14 Explanation will be provided. In Figures 12-14 In the middle, it is shown that... Figure 3 The same cross-section as the sectional view.

[0128] Here, we will first explain the manufacturing process of the core chip 30.

[0129] First, such as Figure 12 As shown, as a preparation step, a flat metal sheet M is prepared. The metal sheet M includes a first material surface Ma and a second material surface Mb. The metal sheet M can be formed from a rolled piece having a desired thickness.

[0130] Following the preparation process, as part of the etching process, such as Figure 13 As shown, a metal material sheet M is etched from the first material surface Ma and the second material surface Mb. As a result, a first vapor flow path 50, a liquid flow path 60, and a second vapor flow path 70 are formed on the metal material sheet M.

[0131] More specifically, a patterned resist film (not shown) is formed on the first material surface Ma and the second material surface Mb of the metal material sheet M using photolithography. Then, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched through openings in the patterned resist film. Thus, the first material surface Ma and the second material surface Mb of the metal material sheet M are etched into a pattern, thereby forming... Figure 13 The first vapor flow path 50, the liquid flow path 60, and the second vapor flow path 70 are shown as described. For the etching solution, ferric chloride-based etching solutions such as ferric chloride aqueous solution or copper chloride-based etching solutions such as copper chloride aqueous solution can be used.

[0132] Regarding etching, the first material surface Ma and the second material surface Mb of the metal material sheet M can be etched simultaneously. However, this is not the only possibility; the etching of the first material surface Ma and the second material surface Mb can also be performed as separate processes. Furthermore, the first vapor flow path 50, the liquid flow path 60, and the second vapor flow path 70 can be formed simultaneously by etching, or they can be formed through different processes.

[0133] In the etching process, by etching the first material surface Ma and the second material surface Mb of the metal material sheet M, it is possible to obtain... Figure 6 and Figure 7 The specified external shape as shown.

[0134] In this way, the core sheet 30 of this embodiment can be obtained.

[0135] Following the fabrication process of the core wafer 30, as a bonding process, such as... Figure 14As shown, the lower side sheet 10, the upper side sheet 20, and the core sheet 30 are joined together. The lower side sheet 10 and the upper side sheet 20 can be formed from rolled parts having a desired planar shape and a desired thickness.

[0136] More specifically, firstly, the lower side sheet 10, the core sheet 30, and the upper side sheet 20 are stacked in this order. In this case, the first main body surface 31a of the core sheet 30 coincides with the second lower side surface 10b of the lower side sheet 10, and the first upper side surface 20a of the upper side sheet 20 coincides with the second main body surface 31b of the core sheet 30. At this time, the sheets 10, 20, and 30 are aligned using the calibration holes 12 of the lower side sheet 10, the calibration holes 35 of the core sheet 30, and the calibration holes 22 of the upper side sheet 20.

[0137] Next, the lower side sheet 10, the core sheet 30, and the upper side sheet 20 are temporarily fastened together. For example, these sheets 10, 20, and 30 can be temporarily fastened together by resistance welding in a dotted pattern, or by laser welding.

[0138] Next, the lower side sheet 10, core sheet 30, and upper side sheet 20 are permanently bonded together by diffusion bonding. Diffusion bonding is performed by applying pressure and heating the lower side sheet 10, core sheet 30, and upper side sheet 20 in a controlled atmosphere such as a vacuum or inert gas along the stacking direction, bonding through atomic diffusion at the bonding surfaces. During pressure application, the lower side sheet 10 and core sheet 30 are tightly bonded, and the core sheet 30 and upper side sheet 20 are also tightly bonded. In diffusion bonding, although the materials of each sheet 10, 20, and 30 are heated to temperatures close to their melting points, the temperatures are lower than their melting points, thus preventing the sheets 10, 20, and 30 from melting and deforming. More specifically, the first main body surface 31a of the core sheet 30 in the frame portion 32 and each island portion 33 is diffusion bonded to the second lower side sheet surface 10b of the lower side sheet 10. Furthermore, the core sheet 30 diffusely bonds to the first upper side surface 20a of the upper side sheet 20 on the second main body surface 31b of the frame portion 32 and each island portion 33. Thus, the sheets 10, 20, and 30 are diffusely bonded together, forming a sealed space 3 with a first vapor flow path 50, a liquid flow path 60, and a second vapor flow path 70 between the lower side sheet 10 and the upper side sheet 20. At this stage, the aforementioned injection flow path 37 may not be sealed. In the aforementioned injection portion 4, the lower injection protrusion 11 of the lower side sheet 10 and the core sheet injection protrusion 36 of the core sheet 30 diffusely bond together. Additionally, the core sheet injection protrusion 36 and the upper injection protrusion 21 of the upper side sheet 20 diffusely bond together.

[0139] After the joining process, the working fluid 2b is injected from the injection section 4 into the sealing space 3. At this time, the working fluid 2b can be injected in a volume greater than the total volume of the space formed by the main liquid flow channel 61 and the connecting liquid flow channel 65 of the liquid flow channel section 60.

[0140] Then, the injection flow path 37 is sealed. For example, the injection section 4 can be irradiated with a laser to partially melt it, thereby sealing the injection flow path 37. This blocks the communication between the sealed space 3 and the outside, resulting in a sealed space 3 containing the working fluid 2b. Therefore, leakage of the working fluid 2b from the sealed space 3 to the outside is prevented. To seal the injection flow path 37, the injection section 4 can be hewn (or plastically deformed by compression), or it can be brazed.

[0141] Through the above steps, the evaporation chamber 1 of this embodiment is obtained.

[0142] Next, the working method of evaporation chamber 1, namely the cooling method of electronic device D, will be explained.

[0143] The evaporation chamber 1, as described above, is installed inside the casing H of a mobile terminal or similar device. Electronic components D, such as a CPU, which are cooled, are mounted on the second upper surface 20b of the upper plate 20. The working fluid 2b within the sealed space 3 adheres to the wall surface of the sealed space 3 due to its surface tension. More specifically, the working fluid 2b adheres to the wall surface 53a of the lower vapor flow path recess 53, the wall surface 54a of the upper vapor flow path recess 54, the wall surface 62 of the main liquid flow path groove 61 of the liquid flow path section 60, the wall surface of the liquid flow path connecting groove 65, and the wall surface 71a of the vapor flow path groove 71 of the second vapor flow path section 70. Additionally, the working fluid 2b also adheres to the portions of the lower lower surface 10b of the lower plate 10 that are exposed in the lower vapor flow path recess 53 and the vapor flow path groove 71. In addition, the working fluid 2b will also adhere to the portion of the first upper side surface 20a of the upper side plate 20 that is exposed in the upper vapor flow path recess 54, the liquid flow path main channel 61, and the liquid flow path connecting channel 65.

[0144] If electronic device D generates heat in this state, it exists in the evaporation region SR (refer to...). Figure 6 and Figure 7 The working fluid 2b in the electronic device D is heated. The heat received is absorbed as latent heat, causing the working fluid 2b to evaporate, thereby generating working vapor 2a. Most of the generated working vapor 2a diffuses within the lower vapor flow path recess 53 and the upper vapor flow path recess 54 that constitute the sealed space 3 (see reference). Figure 6 (Solid arrow).

[0145] More specifically, in the portion of the first steam passage 51 extending in the X direction and in the second steam passage 52 of the first steam flow path 50, the working steam 2a diffuses primarily in the X direction. On the other hand, in the portion of the first steam passage 51 extending in the Y direction, the working steam 2a diffuses primarily in the Y direction. Furthermore, in this embodiment, a second steam flow path 70 is provided on the first main body surface 31a of the island 33. This second steam flow path 70 has a steam flow channel 71 extending from one side edge 33a of the island 33 in the Y direction to the other side edge 33a. Therefore, within the steam flow channel 71 of the second steam flow path 70, the working steam 2a also diffuses primarily in the Y direction.

[0146] Furthermore, the working vapor 2a within the recesses 53 and 54 of each vapor flow path leaves the evaporation zone SR, with most of the working vapor 2a being transported to the lower-temperature condensation zone CR. Figure 6 and Figure 7 In the middle section, most of the working steam 2a is transported to the right side portion of the steam flow path 50. In the condensation zone CR, the working steam 2a is cooled primarily by heat dissipation in the lower side plate 10. The heat received by the lower side plate 10 from the working steam 2a is transmitted through the outer casing component Ha (see reference). Figure 3 It is transmitted into the outside air.

[0147] Working vapor 2a dissipates heat into the lower side plate 10 in the condensation zone CR. As a result, working vapor 2a loses the latent heat absorbed in the evaporation zone SR and condenses, thereby generating working liquid 2b. The generated working liquid 2b adheres to the wall surfaces 53a, 54a of each vapor flow path recess 53, 54, the second lower side plate 10b of the lower side plate 10, and the first upper side plate 20a of the upper side plate 20. Here, in the evaporation zone SR, the working liquid 2b continues to evaporate; therefore, the working liquid 2b in the liquid flow path section 60, excluding the evaporation zone SR (i.e., the condensation zone CR), is transported towards the evaporation zone SR by the capillary action of the main flow channel 61 of each liquid flow path (see reference). Figure 6 (The dashed arrows indicate this). Thus, the working fluid 2b, adhering to each of the wall surfaces 53a, 54a, the second lower side surface 10b, and the first upper side surface 20a, moves within the liquid flow path section 60. At this time, the working fluid 2b enters the main liquid flow path channel 61 through the liquid flow path connecting groove 65. In this way, the working fluid 2b is filled into each main liquid flow path channel 61 and each liquid flow path connecting groove 65. Therefore, the filled working fluid 2b gains propulsion towards the evaporation region SR through the capillary action of each main liquid flow path channel 61. Thus, the working fluid 2b is smoothly transported towards the evaporation region SR.

[0148] In the liquid flow path section 60, each main flow path channel 61 is connected to adjacent main flow path channels 61 via a corresponding liquid flow path connecting channel 65. As a result, the working fluid 2b flows back and forth in adjacent main flow path channels 61, suppressing the possibility of it drying out within the main flow path channels 61. Therefore, a capillary effect is provided to the working fluid 2b within each main flow path channel 61, allowing the working fluid 2b to be smoothly transported towards the evaporation zone SR.

[0149] The working fluid 2b, reaching the evaporation zone SR via the liquid flow path 60, is heated and evaporated again from the electronic device D. The working vapor 2a evaporated from the working fluid 2b moves through the liquid flow path connecting groove 65 within the evaporation zone SR to the lower vapor flow path recess 53 and the upper vapor flow path recess 54, which have larger cross-sectional areas. The working vapor 2a then diffuses within each vapor flow path recess 53, 54. A portion of the working vapor 2a within each vapor flow path recess 53, 54 diffuses in the Y direction via the second vapor flow path 70 as described above. Thus, the working fluids 2a, 2b repeatedly undergo phase change (i.e., evaporation and condensation) while flowing back within the sealed space 3. Consequently, heat from the electronic device D is transferred and released. As a result, the electronic device D is cooled.

[0150] Thus, according to this embodiment, a second vapor flow path 70 for the passage of working vapor 2a is provided on the first main body surface 31a of the island portion 33. The second vapor flow path 70 has a vapor flow channel 71 extending in the Y direction from one side edge 33a of the island portion 33 to the other side edge 33a. Therefore, the working vapor 2a evaporated in the evaporation zone SR can diffuse not only in the first vapor passage 51 and the second vapor passage 52 of the first vapor flow path 50 in the X direction, but also in the Y direction through the vapor flow channel 71. Therefore, the heat from the electronic device D can be further diffused, thereby improving the heat dissipation efficiency of the evaporation chamber 1. In this case, the cooling efficiency of the electronic device D can be improved.

[0151] According to this embodiment, the vapor flow channel 71 of one island 33 and the vapor flow channel 71 of the other island 33, which are adjacent to each other in the Y direction, are arranged in a position where they overlap when viewed along the Y direction. This allows the vapor flow channel 71 provided on the island 33 to be aligned in the Y direction with the vapor flow channels 71 provided on other islands 33 adjacent to it. Therefore, the working vapor 2a can diffuse in the Y direction through the vapor flow channels 71 provided on each island 33 in a manner that traverses each island 33. As a result, the heat dissipation efficiency of the evaporation chamber 1 can be further improved.

[0152] According to this embodiment, the second vapor flow path 70 is disposed on one side of the island portion 33 in the X direction. Therefore, when the portion where the second vapor flow path 70 is disposed is designated as the evaporation zone SR, it is possible to suppress the obstruction of the flow of the working vapor 2a evaporating in the evaporation zone SR in the Y direction. Thus, the diffusion of the working vapor 2a in the Y direction can be promoted, thereby further improving the heat dissipation efficiency of the evaporation chamber 1.

[0153] According to this embodiment, an edge protrusion 73 is provided between the edge 33b of the second vapor flow passage 70 and one of the pair of edge 33b in the X direction of the vapor flow channel 71 and the island portion 33, on the side where the second vapor flow passage 70 is disposed. This allows the edge protrusion 73 to abut and engage with the lower side plate 10. Therefore, the mechanical strength of the evaporation chamber 1 can be improved.

[0154] (First variation)

[0155] In the above embodiment, an example has been described where the second steam flow path section 70 provided in each island section 33 has one steam flow path groove 71. However, it is not limited to this; for example, as Figure 15 As shown, the second steam flow path 70 provided on each island 33 may also have multiple steam flow path grooves 71. In this case, the multiple steam flow path grooves 71 are arranged along the X direction on each island 33. Furthermore, a steam flow path protrusion 74 that abuts against the lower side plate 10 may be provided between adjacent pairs of steam flow path grooves 71. Figure 15 The image shows an example where the X-direction dimension of the vapor flow channel 71 is smaller than its Y-direction dimension, but it is not limited to this. Figure 15 In the example shown, the planar shape of each vapor flow path protrusion 74 is rectangular. The planar shape of the vapor flow path protrusion 74 corresponds to the planar shape at the position of the first main body surface 31a of the sheet body 31.

[0156] In the first variation, the width w7 of the vapor flow path channel 71 can be greater than the width w3 of the liquid flow path main flow path channel 61 (see reference). Figure 9 The width w7 corresponds to the dimension in the X direction. The width w7 can be, for example, 30 μm to 2000 μm. The width w7 can also be 30 μm to 500 μm, or 30 μm to 200 μm. The depth h3 of the vapor flow channel 71 (refer to...) Figure 16C It can also be compared to the depth h1 of the main flow channel 61 of the liquid flow path (refer to...). Figure 8 Large. Depth h3 is equivalent to the dimension in the Z direction, which is equivalent to... Figure 8 h2. The depth h3 can be, for example, 25 μm to 200 μm. The width w8 of the vapor flow path protrusion 74 can be, for example, 30 μm to 500 μm.

[0157] Thus, according to the first modification, a vapor flow path protrusion 74 is provided between the vapor flow path grooves 71. As a result, the working vapor 2a evaporated in the evaporation zone SR can diffuse in the Y direction, and the mechanical strength of the evaporation chamber 1 can be improved.

[0158] exist Figure 15 In the example shown, the vapor flow channels 71 of one island 33 and the corresponding vapor flow channels 71 of the other island 33, which are adjacent to each other in the Y direction, are arranged in a position where they overlap when viewed along the Y direction. This allows the vapor flow channels 71 provided on the island 33 to be aligned with the corresponding vapor flow channels 71 provided on other islands 33 adjacent to that island 33. Therefore, the working vapor 2a can diffuse in the Y direction through the vapor flow channels 71 provided on each island 33, thereby further improving the heat dissipation efficiency of the evaporation chamber 1.

[0159] (Second variation)

[0160] In the first variation described above, an example was given where the second vapor flow path 70 has a plurality of vapor flow path grooves 71, and a vapor flow path protrusion 74 is provided between a pair of adjacent vapor flow path grooves 71. However, this is not the only variation; for example, such as... Figure 16A and Figure 16B As shown, the second vapor flow path 70 may also have a vapor flow path connecting groove 72a provided on the vapor flow path protrusion 74. The vapor flow path connecting groove 72a connects a pair of adjacent vapor flow path grooves 71.

[0161] The steam flow path connection groove 72a extends in a direction different from the Y direction. For example... Figure 16A and Figure 16B As shown, the steam flow path connection groove 72a extends along the X direction. The steam flow path connection groove 72a is formed perpendicular to the steam flow path groove 71.

[0162] The cross-sectional area of ​​the steam flow path connecting groove 72a can be equal to the cross-sectional area of ​​the steam flow path groove 71. Alternatively, the cross-sectional area of ​​the steam flow path connecting groove 72a can be greater than or less than the cross-sectional area of ​​the steam flow path groove 71.

[0163] The vapor flow path connection groove 72a can be formed by etching in the same way as the vapor flow path groove 71. One or more vapor flow path connection grooves 72a can also be formed on each vapor flow path protrusion 74.

[0164] like Figure 16A and Figure 16BAs shown, the vapor flow path connecting grooves 72a can also be configured in a staggered pattern. More specifically, the vapor flow path connecting grooves 72a provided on one side of the adjacent vapor flow path protrusions 74 and the vapor flow path connecting grooves 72a provided on the other side can be configured at positions different from the positions that overlap when viewed along the X direction. In this case, these vapor flow path connecting grooves 72a do not overlap when viewed along the X direction.

[0165] like Figure 16B As shown, the width w10 of the vapor flow path connection groove 72a can be equal to the width w7 of the vapor flow path groove 71. However, the width w10 can also be greater than or less than the width w7. The width w10 corresponds to the dimension in the Y direction. The width w10 can be, for example, 30 μm to 2000 μm. The width w10 can be 30 μm to 500 μm, or 30 μm to 200 μm. Figure 16C As shown, the depth h4 of the vapor flow path connecting groove 72a can be equal to the depth h3 of the vapor flow path groove 71. However, the depth h4 can also be greater than or less than the depth h3. The depth h4 corresponds to the dimension in the Z direction. The depth h4 can be, for example, 25 μm to 200 μm.

[0166] like Figure 16A As shown, the second vapor flow path 70 may also have a vapor flow path connecting groove 72b provided on the end edge protrusion 73. The vapor flow path connecting groove 72b connects the vapor flow path groove 71 to the first vapor passage 51. The vapor flow path connecting groove 72b may be formed in the same manner as the vapor flow path connecting groove 72a described above. One or more vapor flow path connecting grooves 72b may also be formed on the end edge protrusion 73. The vapor flow path connecting grooves 72b may also be arranged in an alternating pattern together with the vapor flow path connecting grooves 72a.

[0167] Thus, according to the second modification, a vapor flow path connecting groove 72a is provided in the vapor flow path protrusion 74 to connect a pair of adjacent vapor flow path grooves 71. As a result, the working vapor 2a, when passing through the vapor flow path grooves 71, can diffuse in the X direction through the vapor flow path connecting groove 72a. Therefore, the working vapor 2a in the second vapor flow path section 70 can diffuse not only in the Y direction but also in the X direction, thereby enabling further heat dissipation from the electronic device D.

[0168] According to the second modification, the vapor flow path connecting groove 72a provided on one side of the adjacent vapor flow path protrusions 74 and the vapor flow path connecting groove 72a provided on the other side are arranged at positions different from their overlapping positions when viewed along the X direction. Therefore, a pair of vapor flow path protrusions 74 adjacent to each other in the X direction can be arranged at different positions in the Y direction. Thus, the mechanical strength of the evaporation chamber 1 can be further improved.

[0169] (3rd variation)

[0170] In the second variation described above, an example was given in which the vapor flow path connecting groove 72a provided on one side of the adjacent vapor flow path protrusions 74 and the vapor flow path connecting groove 72a provided on the other side are positioned at a different location than when viewed along the X direction. However, this is not a limitation; for example, as... Figure 17 As shown, the vapor flow path connecting groove 72a provided on one side of the adjacent vapor flow path protrusions 74 and the vapor flow path connecting groove 72a provided on the other side can also be arranged in a position where they overlap when viewed along the X direction. In this case, the vapor flow path connecting groove 72a is arranged in a grid pattern. When the aforementioned vapor flow path connecting groove 72b is formed on the end edge protrusion 73, the vapor flow path connecting groove 72b can also be arranged in a grid pattern together with the vapor flow path connecting groove 72a.

[0171] Thus, according to the third modification, the vapor flow path connecting groove 72a provided on one side of the adjacent vapor flow path protrusions 74 and the vapor flow path connecting groove 72a provided on the other side are arranged in a position that overlaps when viewed along the X direction. This allows the vapor flow path connecting groove 72a provided on the vapor flow path protrusion 74 to be aligned with the vapor flow path connecting grooves 72a provided on other vapor flow path protrusions 74 adjacent to it. Therefore, the working vapor 2a can diffuse in the X direction through the vapor flow path connecting grooves 72a provided on each vapor flow path protrusion 74. Therefore, the working vapor 2a within the second vapor flow path section 70 can be further diffused in the X direction, thereby enabling further heat dissipation from the electronic device D.

[0172] (4th variation)

[0173] In the first variation described above, an example was given where the planar shape of each steam flow path protrusion 74 was rectangular. However, this is not a limitation; for example, as... Figure 18 As shown, the planar shape of each vapor flow path protrusion 74 can also be formed as a rectangle with rounded arcs. More specifically, as... Figure 18 As shown, when viewed from above, curved portions 75 with rounded arcs can be provided at the corners of the steam flow path protrusion 74. The curved portions 75 provided at the two corners at both ends of the steam flow path protrusion 74 in the Y direction can also be formed as a single continuous unit.

[0174] Thus, according to the fourth modification, by providing a bend 75 at the corner of the steam flow path protrusion 74, the flow resistance of the steam flow path groove 71 of the second steam flow path section 70 can be reduced. This allows the working steam 2a to flow smoothly in the Y direction. Furthermore, the capillary force at the corner of the steam flow path protrusion 74 can be reduced, preventing the working fluid 2b from accumulating at that corner.

[0175] like Figure 18 As shown, the same bend 75 can also be provided at the corner of the steam flow channel 71 side in the corner of the end edge protrusion 73. This can further reduce the flow resistance of the steam flow channel 71 adjacent to the end edge protrusion 73.

[0176] (5th variation)

[0177] In the above embodiment, an example was described in which the second vapor flow path 70 is connected to the liquid flow path 60 via the first vapor flow path 50. However, it is not limited to this, for example, Figure 19 and Figure 20 As shown, multiple connecting portions 80 that connect the liquid flow path 60 and the second vapor flow path 70 can also be provided on the main body 31. The connecting portions 80 can be located within the evaporation zone SR.

[0178] More specifically, such as Figure 19 and Figure 20 As shown, the connecting portion 80 may include a through-hole 82 extending from the liquid flow path portion 60 to the second vapor flow path portion 70, along with a through-plate body 31. Figure 19 and Figure 20 In the fifth modified example shown, the through hole 82 is not located on the wall surface 53a of the lower vapor flow path recess 53 or the wall surface 54a of the upper vapor flow path recess 54, but is located inside the island portion 33 when viewed from above. Figure 19 and Figure 20 The image shows an example where the through hole 82 is formed in a rectangular shape. However, the planar shape of the through hole 82 can also be a curved shape such as a circle or an ellipse, and is arbitrary.

[0179] The through hole 82 can also extend to the liquid flow path intersection 66 of the liquid flow path section 60 and the vapor flow path groove 71 of the second vapor flow path section 70. Figure 19 and Figure 20 In the fifth modified example shown, one end of the through hole 82 is located at the liquid flow path intersection 66. The other end of the through hole 82 is located at the vapor flow path groove 71. The through hole 82 may not be connected to the liquid flow path intersection 66 as long as it is connected to the main liquid flow path groove 61 or the liquid flow path connecting groove 65.

[0180] like Figure 19 As shown, the width w9 of the through hole 82 can be greater than the width w4 of the liquid flow path connecting groove 65 (refer to...). Figure 9The width w9 corresponds to the dimension in the X direction. Therefore, the capillary force acting on the working fluid 2b within the through-hole 82 is less than the capillary force acting on the working fluid 2b within the liquid flow path connecting groove 65. In this case, the retention of the working fluid 2b within the through-hole 82 can be suppressed. Furthermore, in this case, the through-hole 82 is formed by cutting off the protrusion 64. Additionally, the width w9 of the through-hole 82 can be greater than the width w6 of the vapor flow path groove 71 (see reference). Figure 10 Small. The width w9 of the through hole 82 can be, for example, 10μm to 100μm. The width w9 of the through hole 82 refers to the dimension on the second main body surface 31b of the core sheet 30.

[0181] Thus, according to the fifth modification, a portion of the working vapor 2a evaporated from the working liquid 2b due to heat received from the electronic device D within the liquid flow path 60 can reach the vapor flow path groove 71 of the second vapor flow path 70 through the connecting portion 80. Consequently, the working vapor 2a can diffuse in the Y direction within the vapor flow path groove 71. That is, the working vapor 2a evaporated within the liquid flow path 60 can reach the second vapor flow path 70 without passing through the first vapor flow path 50. Therefore, the working vapor 2a evaporated from the working liquid 2b can diffuse smoothly in the Y direction. Thus, the heat from the electronic device D can be further diffused, thereby further improving the heat dissipation efficiency of the evaporation chamber 1.

[0182] According to the fifth modification, the connecting portion 80 includes a through-hole 82 extending from the liquid flow path portion 60 to the second vapor flow path portion 70 through a through-hole 31. This further reduces the flow resistance of the working fluid 2b from the liquid flow path portion 60 to the second vapor flow path portion 70. Therefore, the working vapor 2a evaporated in the liquid flow path portion 60 can smoothly reach the second vapor flow path portion 70. Furthermore, according to the fifth modification, since the through-hole 82 extends to the liquid flow path intersection 66 and the vapor flow path groove 71, the flow resistance of the working vapor 2a from the liquid flow path portion 60 to the vapor flow path groove 71 can be further reduced.

[0183] (Sixth variation)

[0184] In this embodiment described above, an example has been given where the second steam flow path 70 provided in each island 33 has one steam flow path groove 71. In this case, multiple protrusions 76 protruding from the island 33 and abutting against the lower side plate 10 can be provided in the steam flow path groove 71. Multiple protrusions 76 can also be provided in the steam flow path groove 71. The protrusions 76 can be arranged in a manner that does not obstruct the flow of working steam 2a through the steam flow path groove 71. For example, as... Figure 21As shown, such a protrusion 76 can be formed into a circular shape when viewed from above, or, although not shown, into an elliptical shape. Additionally, although not shown, the protrusion 76 can also be formed into a rectangular shape when viewed from above. In this case, unlike the vapor flow path protrusion 74 described above, it may not extend to one side edge 33a of the island portion 33, or it may not extend to the other side edge 33a. Furthermore, in Figure 21 The example shown illustrates a side-by-side arrangement of the protrusions 76. However, the protrusions 76 can also be arranged in a staggered pattern when viewed from above.

[0185] (Seventh variation)

[0186] In the above embodiment, the following example was described: the second vapor flow path 70 is provided on the first main body surface 31a of each island portion 33 of the core sheet 30. However, it is not limited to this; the second vapor flow path 70 may not be provided on all island portions 33. For example, the second vapor flow path 70 may be provided on only one island portion 33, or it may be provided on several island portions 33. For example, when the planar shape of the electronic device D is small, the second vapor flow path 70 can be selectively provided on any island portion 33 depending on the area covered by the electronic device D. The same applies when the evaporation chamber 1 is not a simple rectangle.

[0187] This invention is not limited to the above-described embodiments and modifications. During implementation, the constituent elements can be modified and embodied without departing from its spirit. Furthermore, various inventions can be formed through appropriate combinations of the multiple constituent elements disclosed in the above-described embodiments and modifications. Some constituent elements may also be removed from all the constituent elements shown in the embodiments and modifications.

Claims

1. A core plate for an evaporation chamber, positioned between a first plate and a second plate of an evaporation chamber containing a working fluid, wherein, The core sheet for the evaporation chamber includes: The main body has a first main body surface and a second main body surface disposed on the side opposite to the first main body surface; A first vapor flow path through which the working fluid vapor passes extends from the first body surface of the sheet body to the second body surface; A liquid flow path section, disposed on the second main body surface, communicating with the first vapor flow path section to allow the liquid of the working fluid to pass through; and The second steam flow path is disposed on the first main body surface and communicates with the first steam flow path to allow steam of the working fluid to pass through. The sheet body has multiple islands, each island having a length direction in a first direction, and a first vapor flow path is arranged around each island. The second vapor flow path has a vapor flow groove that extends from one side edge of the island to the other side edge in a second direction perpendicular to the first direction. The second steam flow path is provided in each of the island sections. In the second direction, the vapor flow channels of one island and the vapor flow channels of the other island, which are adjacent to each other, are configured to overlap when viewed along the second direction.

2. The core sheet for the evaporation chamber according to claim 1, wherein, The second steam flow path section has a plurality of steam flow path slots. A steam flow path protrusion that abuts against the first piece is provided between a pair of adjacent steam flow path slots.

3. The core sheet for the evaporation chamber according to claim 2, wherein, The second steam flow path has a steam flow path connecting groove provided on the steam flow path protrusion, and the steam flow path connecting groove connects a pair of adjacent steam flow path grooves.

4. The core sheet for the evaporation chamber according to claim 3, wherein, The vapor flow path connecting grooves located on one side of the adjacent vapor flow path protrusions and the vapor flow path connecting grooves located on the other side are configured at positions different from those overlapping when viewed along the first direction.

5. The core sheet for an evaporation chamber according to claim 3, wherein, The vapor flow path connecting grooves located on one side of the adjacent vapor flow path protrusions and the vapor flow path connecting grooves located on the other side are configured to overlap when viewed along the first direction.

6. The core sheet for an evaporation chamber according to any one of claims 1 to 5, wherein, The second steam flow path is disposed on one side of the island in the first direction.

7. The core sheet for an evaporation chamber according to claim 6, wherein, Between the steam flow channel groove of the second steam flow channel and the end edge of the island on one side of the pair of end edges in the first direction where the second steam flow channel is disposed, an end edge protrusion that abuts against the first piece is provided.

8. The core sheet for an evaporation chamber according to claim 1, wherein, The core plate for the evaporation chamber has a connecting portion, which is disposed on the plate body and communicates with the liquid flow path and the second vapor flow path.

9. The core sheet for an evaporation chamber according to claim 8, wherein, The connecting portion includes a through hole that passes through the sheet body and extends from the liquid flow path portion to the vapor flow path groove.

10. The core sheet for an evaporation chamber according to claim 9, wherein, The liquid flow path section has: a plurality of liquid flow path main channels, which extend in a first direction for the liquid of the working fluid to pass through; A liquid flow path connection groove extends in a direction different from the first direction and communicates with the main flow path groove. The main flow channel of the liquid flow path also includes a liquid flow path intersection that communicates with the liquid flow path connecting channel. The through hole extends to the liquid flow path intersection and the vapor flow path groove.

11. A core plate for an evaporation chamber, positioned between a first plate and a second plate of an evaporation chamber containing a working fluid, wherein, The core sheet for the evaporation chamber includes: The main body has a first main body surface and a second main body surface disposed on the side opposite to the first main body surface; A through space that extends from the first main surface of the sheet body to the second main surface; A first main body surface groove, which is disposed on the first main body surface and communicates with the through space; and The second main surface groove is disposed on the second main surface and communicates with the through space. The main body of the sheet has multiple islands, each island having a length direction in a first direction, and a through space is arranged around each island. The first main body surface groove has a first groove, which extends from one side edge of the island portion to the other side edge in a second direction perpendicular to the first direction. The second main body surface groove has a second groove extending in the first direction. The dimension of the first groove in the first direction is larger than the dimension of the second groove in the second direction. The first main surface groove is disposed on each of the island portions. The first slot of one of the islands and the first slot of the other of the two islands, which are adjacent to each other in the second direction, are configured to overlap when viewed along the second direction.

12. An evaporation chamber, wherein, The evaporation chamber includes: The first piece; The second piece; and The core sheet for the evaporation chamber according to any one of claims 1 to 11, wherein it is located between the first sheet and the second sheet.

13. An evaporation chamber, wherein, The evaporation chamber includes: The first piece; The second piece; The core sheet for the evaporation chamber according to any one of claims 1 to 10, wherein it is located between the first sheet and the second sheet; and Evaporation zone, in which the working fluid evaporates. The second vapor flow path is disposed in the evaporation zone.

14. An electronic device, wherein, The electronic device includes: shell; Devices housed within the housing; and The evaporation chamber of claim 12 or 13 is in thermal contact with the device.

Images