Multilayer planar semiconductor component automatic buckle welding equipment and welding process

Abstract

The present invention discloses an automated fastening welding device for multi-layer planar semiconductor components and its welding process, comprising an inlet and outlet conveyor line, a visual system, a manipulator, an automatic welding module, and a flipping and picking mechanism arranged on a frame. The inlet and outlet conveyor line comprises two inlet lines a and e for conveying lower plates or upper plates containing crystals, two outlet lines b and d for conveying empty carriers and welded products, and a shared unqualified product outlet line c. The side ends of the inlet and outlet lines a and e are both provided with a visual system and a manipulator along the conveying direction. The side ends of the manipulators are docked with several groups of automatic welding modules. The conveying end of the inlet and outlet conveyor line is provided with a flipping and picking mechanism perpendicular to the conveying direction. Through the above-mentioned method, the present invention can meet the needs of automated welding of multi-layer planar semiconductor components of different products and specifications, and has the advantages of improving welding accuracy, stabilizing welding quality, and improving productivity in an unmanned state.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration components, in particular to automatic buckling welding equipment for multi-layer planar semiconductor components and a welding process thereof. Background Art

[0002] Multilayer planar semiconductor components such as Figure 1 and Figure 2 As shown, the multi-layer planar semiconductor component includes a lower plate 01, a crystal 02 and an upper plate 03. The welding of the multi-layer planar semiconductor component requires first welding the lower plate 01 and the crystal 02, and then welding the lower plate 01 and the upper plate 03 with the crystal welded together. The current production form is mainly carried out manually or semi-automatically, with low welding efficiency and unstable welding quality control.

[0003] The Chinese patent with patent number CN11076409.3 discloses a method for manufacturing a thermoelectric cooling component. First, the thermoelectric material (equivalent to crystal 02) is welded to a ceramic plate with a welding tool. Welding requires high technical and operational proficiency of the operator. The ceramic plate with the thermoelectric material welded on one side is aligned and overlapped. It is difficult to ensure the accuracy of the placement. It is clamped with a fixture and placed in a reflow oven for welding. The control of welding pressure, welding time, and holding time are all related to the welding operator's proficiency and operating techniques for the product. Different welding methods are used for the previous and subsequent welding. Subsequently, the welded components are naturally cooled and then transferred to the cleaning process for cleaning and drying. In this process, the product needs to be repeatedly transported, and multiple devices need to be used in conjunction. The transportation coordination makes the welding rhythm difficult to control, the efficiency is low, and the welding effect is difficult to ensure. Transportation wastes time and may destroy the alignment accuracy of the parts to be welded or even damage the product.

[0004] Based on the above defects and deficiencies, it is necessary to improve the existing technology and design an automated fastening welding device and welding process for multi-layer planar semiconductor components. Summary of the Invention

[0005] The main technical problem solved by the present invention is to provide an automated fastening welding device for multi-layer planar semiconductor components and a welding process thereof, which can meet the needs of the automated welding of multi-layer planar semiconductor components of different products and specifications, including material picking, material placement, alignment, clamping, pressurization, welding, heat preservation, cooling and material collection in sequence, and has the advantages of improving welding accuracy, stabilizing welding quality and increasing productivity in an unmanned state.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an automated snap-fit welding equipment for multi-layer planar semiconductor components, including an inlet and outlet conveyor line, a visual system, a robot, an automatic welding module and a flipping and picking mechanism arranged on a frame, the inlet and outlet conveyor line including two feed lines a and a feed line e for conveying the lower plate or upper plate containing crystals, two discharge lines b for conveying empty carriers and a discharge line d for conveying welded products and a common discharge line c for unqualified products, the side ends of the feed line a and the feed line e are provided with a visual system and a robot along the conveying direction, the side ends of the robot are docked with several groups of automatic welding modules, and the conveying ends of the inlet and outlet conveyor line are provided with a flipping and picking mechanism perpendicular to the conveying direction.

[0007] Preferably, the inlet and outlet conveyor line adopts a conveyor line, which conveys carriers carrying products. The conveyor line is provided with detection stations, reserved stations and material picking stations at intervals along the conveying direction. A lifting cylinder that can exceed the conveying surface is installed on the conveying bracket under each station, and a baffle for supporting the carrier is installed on the conveying bracket above the detection station and the reserved station.

[0008] Preferably, the manipulator includes a material picking manipulator, a transfer gripper driven by the material picking manipulator, several groups of carrier clamps installed on one side of the transfer gripper for grabbing carriers, and an adsorption component installed on the other side of the transfer gripper for adsorbing products.

[0009] Preferably, the automatic welding module includes a welding frame, a lower fine-tuning mechanism installed on the welding frame, an upper fine-tuning mechanism and a visual mechanism, the lower fine-tuning mechanism is equipped with a positioning clamping fixture for placing and positioning products, a heating and heat preservation mechanism for welding products, a lower adsorption mechanism capable of lifting and adsorbing products, and a cooling mechanism capable of lifting and cooling, the lower adsorption mechanism and the cooling mechanism are located below the carrier on the positioning clamping fixture, the welding heating part of the heating and heat preservation mechanism is located below the carrier on the positioning clamping fixture, the cooling mechanism adopts a cooling head for passing cooling water, and the upper fine-tuning mechanism is equipped with an upper adsorption and pressing mechanism for pressurizing, the upper adsorption and pressing mechanism includes an upper adsorption pressure head driven downward and rotated by a screw module and a rotating motor, and a pressure control unit for detecting and applying a certain welding guarantee pressure, the adjustment directions of the lower fine-tuning mechanism and the upper fine-tuning mechanism are perpendicular to the horizontal direction, the visual mechanism is located between the upper adsorption and pressing mechanism and the lower adsorption mechanism, and the visual mechanism adopts a double-sided detection camera.

[0010] Preferably, the flipping and picking mechanism includes a single-axis drive module, a mobile frame driven by the single-axis drive module, an extension cylinder vertically installed on the mobile frame, a turntable cylinder driven to rise and fall by the extension cylinder, a flipping frame driven to flip by the turntable cylinder, and material picking suction cups installed at the upper and lower ends of the flipping frame, and two sets of transition plates installed on the side of the single-axis drive module.

[0011] A welding process for a multi-layer planar semiconductor component automated buckle welding device, characterized by comprising the following steps:

[0012] S1, synchronous feeding, manually place the lower electrode plate containing crystals with a carrier on the feeding line a in sequence, and manually place the upper electrode plate with a carrier on the feeding line e in sequence;

[0013] S2, detection, two visual systems respectively identify the lower plate containing crystals on the feed line a and the upper plate on the feed line e, and the unqualified products are grabbed by the robot and flowed out to the unqualified product discharge line c;

[0014] S3, welding of the lower electrode plate, the manipulator on the left grabs the lower electrode plate containing crystals with the carrier on the feeding line a and puts it into the positioning clamping fixture on the left automatic welding module, uses the visual mechanism to confirm the position of the lower electrode plate, and the upper fine-tuning mechanism and the lower fine-tuning mechanism adjust the position of the upper adsorption and pressing mechanism and the lower electrode plate. The positioning clamping fixture presses the carrier, and the pressure control unit of the upper adsorption and pressing mechanism descends to apply welding guarantee pressure to the lower electrode plate containing crystals in the carrier. The heating and heat preservation mechanism heats the lower electrode plate containing crystals and keeps it warm after reaching the welding temperature. After the heat preservation is completed, the cooling mechanism lifts up to cool the carrier and the product in the carrier. When the temperature cools to the temperature at which the material can be taken out, the cooling work is completed, the lower adsorption mechanism lifts up to prevent the lower electrode plate from falling off, the pressure control unit depressurizes and leaves, and the positioning clamping fixture is released;

[0015] S4, transfer and flip, the left manipulator grabs the finished lower electrode plate with the carrier on the left automatic welding module and puts it into the transition tray of the flipping and picking mechanism. The flipping and picking mechanism flips the lower electrode plate 180 degrees. The left manipulator grabs the empty carrier after flipping and puts it on the discharge line b for outflow. The right manipulator grabs the finished lower electrode plate and puts it on the right automatic welding module;

[0016] S5, cold lower plate buckle welding, the upper adsorption and pressing mechanism on the right side of the automatic welding module adsorbs the flipped lower plate onto the upper adsorption and pressing mechanism, the right side manipulator grabs the upper plate on the feed line e into the positioning clamping fixture on the automatic welding module, uses the visual mechanism to confirm the position of the lower plate and the upper plate, the upper fine-tuning mechanism and the lower fine-tuning mechanism adjust the cold lower plate, adjust the buckle position of the lower plate containing the crystal and the upper plate to meet the requirements of the drawing, the positioning clamping fixture presses the upper plate carrier, and the upper adsorption and pressing machine The pressure control unit of the structure carries the lower plate containing the crystal and descends to buckle the crystal on the lower plate with the upper plate and apply a certain welding guarantee pressure. The heating and heat preservation mechanism heats the carrier and the buckled product in the carrier. After reaching the welding temperature, it is kept warm. After the heat preservation is completed, the cooling mechanism lifts up to cool the carrier and the product in the carrier. When the temperature is cooled to a temperature at which the material can be taken out, the cooling work is completed, the lower adsorption mechanism lifts up to adsorb the upper plate to prevent it from falling off, the pressure control unit releases pressure and leaves, and the positioning clamping fixture is released;

[0017] S6, discharging. The right manipulator grabs the finished product on the right automatic welding module and puts it on the discharging line d. The finished product flows out through the discharging line d, and a complete lower plate / upper plate automatic welding work cycle is completed.

[0018] Compared with the prior art, the beneficial effects of the present invention are: a robot is used to realize the taking and placing of the lower electrode plate and the upper electrode plate containing the crystal of the multi-layer planar semiconductor component, the inlet and outlet conveyor lines are used for storage and transportation, the visual system scans the product, and the position of the product is adjusted by fine-tuning the components up and down. The positioning clamping fixture positions and clamps the product, the pressure control unit applies pre-pressure, and the heating and insulation mechanism heats and welds the product. After the insulation time is completed, the adsorption system assists the welding process and before and after welding to realize automatic welding of multi-layer planar semiconductor components. Compared with the traditional welding method, it realizes the advantages of improving welding accuracy, stabilizing welding quality, and improving productivity in an unmanned state. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the structure of a multi-layer planar semiconductor component.

[0020] Figure 2 Schematic diagram of the structure of a partially multi-layer planar semiconductor device with a carrier.

[0021] Figure 3 This is a schematic diagram of the structure of the automated buckle welding equipment for multi-layer planar semiconductor components.

[0022] Figure 4 A top view of automated soldering equipment for multi-layer planar semiconductor components.

[0023] Figure 5 This is a schematic diagram of the feed and discharge conveyor line structure of the automated fastening and welding equipment for multi-layer planar semiconductor components.

[0024] Figure 6 Schematic diagram of the robot structure of the automated fastening and welding equipment for multi-layer planar semiconductor components.

[0025] Figure 7 This is a schematic diagram of the partial structure of the robot arm of the automated fastening and welding equipment for multi-layer planar semiconductor components.

[0026] Figure 8 This is a schematic diagram of the automatic welding module structure of the automatic buckle welding equipment for multi-layer planar semiconductor components.

[0027] Figure 9 This is a schematic diagram of the flipping and picking mechanism structure of the automated fastening and welding equipment for multi-layer planar semiconductor components.

[0028] Among them, 01-lower plate; 02-crystal; 03-upper plate; 04-carrier; 1-frame; 2-feeding and discharging conveyor line; 2a, 2e-feeding line; 2c-defective product discharging line; 2b, 2d-discharging line; 21-conveying line; 22-lifting cylinder; 23-baffle; 3-visual system; 4-manipulator; 41-retrieving manipulator; 42-transfer gripper; 43-carrier fixture; 431-grip cylinder; 432-grip; 44-adsorption component; 441-lifting cylinder; 44 2-lifting plate; 443-suction cup; 5-automatic welding module; 51-welding frame; 52-lower fine-tuning mechanism; 53-upper fine-tuning mechanism; 54-positioning clamping fixture; 55-heating and heat preservation mechanism; 56-lower adsorption mechanism; 57-cooling mechanism; 58-upper adsorption and pressing mechanism; 59-visual mechanism; 6-flipping and picking mechanism; 61-single-axis drive module; 62-moving frame; 63-extension cylinder; 64-turntable cylinder; 65-flipping frame; 66-picking suction cup, 67-transition plate. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the advantages and features of the invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0030] See also Figures 3 to 9 , embodiments of the present invention include:

[0031] like Figure 1As shown, a multi-layer planar semiconductor component automatic buckle welding equipment includes an inlet and outlet conveyor line 2, a visual system 3, a robot 4, an automatic welding module 5 and a flipping and picking mechanism 6 arranged on a frame 1. The inlet and outlet conveyor line 2 includes two inlet lines 2a and 2e for conveying lower plates or upper plates containing crystals, two outlet lines 2b for conveying empty carriers, and an outlet line 2d for conveying welded products, and a shared unqualified product outlet line 2c. The robot 4 includes a robot 4a and a robot 4b arranged on both sides of the inlet and outlet conveyor line 2. The visual system 3 includes a visual system 3a and a visual system 3b arranged on both sides of the inlet and outlet conveyor line 2. The automatic welding module 5 includes an automatic welding module 5a, an automatic welding module 5b, an automatic welding module 5c and an automatic welding module 5d arranged on both sides of the feeding and unloading conveying line 2. The side end of the feeding line 2a is sequentially provided with a visual system 3a and a robot 4a for detecting and identifying products along the conveying direction. The automatic welding module 5a and the automatic welding module 5b are docked on both sides of the robot 4a. The side end of the feeding line 2e is sequentially provided with a visual system 3b and a robot 4b for detecting and identifying products along the conveying direction. The automatic welding module 5c and the automatic welding module 5d are docked on both sides of the robot 4b. The conveying end of the feeding and unloading conveying line 2 is provided with a flipping and picking mechanism 6 perpendicular to the conveying direction.

[0032] The inlet and outlet conveyor line 2 adopts a conveyor line 21, which conveys a carrier 04 carrying products. The conveyor line 21 is provided with detection stations, reserved stations and material-taking stations at intervals along the conveying direction. A lifting cylinder 22 that can exceed the conveying surface is installed on the conveying bracket under each station, and a baffle 23 for supporting the carrier is installed on the conveying bracket above the detection station and the reserved station.

[0033] The manipulator 4 includes a material-picking manipulator 41, a transfer gripper 42 driven by the material-picking manipulator 41, several groups of carrier clamps 43 installed on one side of the transfer gripper 42 for grabbing the carrier 04, and an adsorption component 44 installed on the other side of the transfer gripper 42 for adsorbing the product. The carrier clamp 43 includes a clamping cylinder 431 and clamping claws 432 installed on the two clamping arms of the clamping cylinder 431 for grabbing the carrier; the adsorption component 44 includes a lifting cylinder 441, a lifting plate 442 driven by the lifting cylinder 441 to move in the vertical direction, and a suction cup 443 installed on the lifting plate 442.

[0034] The automatic welding module 5 includes a welding frame 51, a lower fine-tuning mechanism 52, an upper fine-tuning mechanism 53 and a visual mechanism 59 installed on the welding frame 51, the lower fine-tuning mechanism 52 is equipped with a positioning clamping fixture 54 for placing and positioning products, a heating and heat preservation mechanism 55 for welding products, a lower adsorption mechanism 56 capable of lifting and adsorbing products, and a cooling mechanism 57 capable of lifting and cooling. The lower adsorption mechanism 56 and the cooling mechanism 57 are located below the carrier on the positioning clamping fixture 54, and the welding heating part of the heating and heat preservation mechanism 55 is located on the positioning clamping fixture 54. Below the upper carrier, the cooling mechanism 57 uses a cooling head that passes cooling water. The upper fine-tuning mechanism 53 is equipped with an upper adsorption and pressing mechanism 58 for applying pressure. The upper adsorption and pressing mechanism 58 includes an upper adsorption pressure head driven downward and rotated by a screw module and a rotary motor, and a pressure control unit for detecting and applying a certain welding guarantee pressure. The adjustment directions of the lower fine-tuning mechanism 52 and the upper fine-tuning mechanism 53 are perpendicular to the horizontal direction. The visual mechanism 59 is located between the upper adsorption and pressing mechanism 58 and the lower adsorption mechanism 56 and uses a double-sided detection camera.

[0035] The flipping and picking mechanism 6 includes a single-axis drive module 61, a movable frame 62 driven by the single-axis drive module 61, an extension cylinder 63 vertically installed on the movable frame 62, a turntable cylinder 64 driven to rise and fall by the extension cylinder 63, a flipping frame 65 driven to flip by the turntable cylinder 64, and a picking suction cup 66 installed at the upper and lower ends of the flipping frame 65, and two sets of transition plates 67 installed on the side of the single-axis drive module 61.

[0036] A welding process for a multi-layer planar semiconductor component automated buckle welding device, characterized by comprising the following steps:

[0037] S1, synchronous feeding, manually place the lower electrode plate 01 containing crystal 02 with carrier 04 on the feeding line 2a in sequence, and manually place the upper electrode plate 03 with carrier on the feeding line 2e in sequence;

[0038] S2, inspection, the visual system 3a identifies the lower electrode plate 01 containing crystal 02 on the feed line 2a, and the unqualified products are grabbed by the robot 4a and flowed out to the unqualified product discharge line 2c. The visual system 3b identifies the upper electrode plate 03 on the feed line 2e, and the unqualified products are grabbed by the robot 4b and flowed out to the unqualified product discharge line 2c;

[0039] S3, welding of the lower electrode plate. The left manipulator 4a grabs the lower electrode plate 01 containing the crystal 02 with the carrier on the feeding line 2a and puts it into the positioning clamping fixture 54 on the left automatic welding module 5a and the automatic welding module 5b. The visual mechanism 59 is used to confirm the position of the lower electrode plate 01. The upper fine-tuning mechanism 53 adjusts the Y-direction position of the upper adsorption and pressing mechanism 58. The lower fine-tuning mechanism 52 adjusts the X-direction position of the positioning clamping fixture 54. The rotary motor of the upper adsorption and pressing mechanism 58 adjusts the rotation angle of the Z-direction position. The positioning clamping fixture 54 moves the carrier The pressure control unit of the upper adsorption and pressing mechanism 58 is lowered, and welding pressure is applied to the lower electrode plate 01 containing the crystal 02 in the carrier. The heating and heat preservation mechanism 55 heats the lower electrode plate 01 containing the crystal 02. After reaching the welding temperature, it is kept warm. After the heat preservation is completed, the cooling mechanism 57 is lifted up to cool the carrier and the product in the carrier. When the temperature is cooled to a temperature at which the material can be taken out, the cooling work is completed, and the lower adsorption mechanism 56 is lifted up to prevent the lower electrode plate 01 from falling off. The pressure control unit is depressurized and leaves, and the positioning clamping fixture 54 is released.

[0040] S4, transfer and flipping. The left manipulator 4a grabs the finished lower electrode plate 01 with the carrier on the left automatic welding module 5a and the automatic welding module 5b and puts it into the transition plate 67 of the flipping and picking mechanism 6. The flipping and picking mechanism 6 flips the lower electrode plate 01 180 degrees. The manipulator 4a grabs the flipped empty carrier and places it on the discharge line 2b for outflow. The right manipulator 4b grabs the finished lower electrode plate 01 and puts it on the right automatic welding module 5c and the automatic welding module 5d.

[0041] S5, the cold lower electrode plate is buckled and welded, the upper adsorption and pressing mechanism 58 on the right automatic welding module 5c and the automatic welding module 5d adsorbs the flipped lower electrode plate onto the upper adsorption and pressing mechanism 58, the right manipulator 4b grabs the upper electrode plate 03 on the feeding line 2e into the positioning clamping fixture 54 on the automatic welding module 5, and uses the visual mechanism 59 to confirm the position of the lower electrode plate 01 and the upper electrode plate 03. The upper fine-tuning mechanism 53 adjusts the Y-direction position of the upper adsorption and pressing mechanism 58, the lower fine-tuning mechanism 52 adjusts the X-direction position of the positioning clamping fixture 54, and the rotating motor of the upper adsorption and pressing mechanism 58 adjusts the rotation angle of the Z-direction position, and adjusts the cold lower electrode plate to align the lower electrode plate 01 containing the crystal 02 with the upper electrode. The fastening position of the plate 03 is adjusted to meet the requirements of the drawing, the positioning clamping fixture 54 presses the upper plate carrier, the pressure control unit of the upper adsorption and pressing mechanism 58 carries the lower plate 01 containing the crystal 02 downward to fasten the crystal 02 on the lower plate 01 and the upper plate 03 and apply a certain welding guarantee pressure, the heating and heat preservation mechanism 55 heats the carrier and the fastened product in the carrier, and after reaching the welding temperature, it is kept warm. After the heat preservation is completed, the cooling mechanism 57 lifts up to cool the carrier and the product in the carrier. When the temperature is cooled to a temperature at which the material can be taken out, the cooling work is completed, the lower adsorption mechanism 56 lifts up to adsorb the upper plate 03 to prevent it from falling off, the pressure control unit releases pressure and leaves, and the positioning clamping fixture 54 is released;

[0042] S6, discharging. The right manipulator 4b grabs the finished products on the right automatic welding module 5c and the automatic welding module 5d and puts them on the discharging line 2d. The finished products flow out through the discharging line 2d, and a complete lower plate / upper plate automatic welding work cycle is completed.

[0043] The automated fastening welding equipment and welding process for multi-layer planar semiconductor components of the present invention can meet the needs of automated welding of multi-layer planar semiconductor components of different products and specifications, including material picking, material discharge, alignment, clamping, pressurization, welding, heat preservation, cooling and material collection in sequence, and has the advantages of improving welding accuracy, stabilizing welding quality and increasing productivity in an unmanned state.

[0044] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention's description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An automated soldering device for multi-layer planar semiconductor components, characterized by: It includes a feed and discharge conveyor line, a visual system, a manipulator, an automatic welding module and a flipping and retrieving mechanism arranged on a frame. The feed and discharge conveyor line includes two feed lines a and e for conveying lower plates or upper plates containing crystals, two discharge lines b for conveying empty carriers, a discharge line d for conveying welded products, and a common discharge line c for unqualified products. The side ends of the feed lines a and e are both provided with a visual system and a manipulator along the conveying direction. The side ends of the manipulators are docked with several groups of automatic welding modules. The conveying ends of the feed and discharge conveyor lines are provided with a flipping and retrieving mechanism perpendicular to the conveying direction. The inlet and outlet conveyor line adopts a conveyor line, which conveys carriers with products. The conveyor line is provided with detection stations, reserved stations and material-taking stations at intervals along the conveying direction. A lifting cylinder that can exceed the conveying surface is installed on the conveying bracket under each station, and a baffle for supporting the carrier is installed on the conveying bracket above the detection station and the reserved station. The manipulator includes a material-retrieving manipulator, a transfer gripper driven by the material-retrieving manipulator, a plurality of carrier clamps installed on one side of the transfer gripper for grabbing the carrier, and an adsorption component installed on the other side of the transfer gripper for adsorbing the product; The automatic welding module includes a welding frame, a lower fine-adjustment mechanism, an upper fine-adjustment mechanism and a visual mechanism installed on the welding frame, the lower fine-adjustment mechanism is equipped with a positioning clamping fixture for placing and positioning products, a heating and heat preservation mechanism for welding products, a lower adsorption mechanism capable of lifting and adsorbing products, and a cooling mechanism capable of lifting and cooling, the lower adsorption mechanism and the cooling mechanism are located below the carrier on the positioning clamping fixture, the welding heating part of the heating and heat preservation mechanism is located below the carrier on the positioning clamping fixture, the cooling mechanism adopts a cooling head for cooling water, and the upper adsorption and pressing mechanism for pressurizing is installed on the upper fine-adjustment mechanism, the upper adsorption and pressing mechanism includes an upper adsorption pressure head driven to move downward and rotate by a screw module and a rotating motor, and a pressure control unit for detecting and applying a certain welding guarantee pressure, the adjustment directions of the lower fine-adjustment mechanism and the upper fine-adjustment mechanism are perpendicular to the horizontal direction, the visual mechanism is located between the upper adsorption and pressing mechanism and the lower adsorption mechanism, and the visual mechanism adopts a double-sided detection camera; The flipping and picking mechanism includes a single-axis drive module, a mobile frame driven by the single-axis drive module, an extension cylinder vertically installed on the mobile frame, a turntable cylinder driven to rise and fall by the extension cylinder, a flipping frame driven to flip by the turntable cylinder, and material picking suction cups installed at the upper and lower ends of the flipping frame, and two sets of transition plates installed on the side of the single-axis drive module.

2. A welding process using the multi-layer planar semiconductor assembly automated fastening welding equipment according to claim 1, characterized in that: The following steps are involved: S1, synchronous feeding, manually place the lower electrode plate containing crystals with a carrier on the feeding line a in sequence, and manually place the upper electrode plate with a carrier on the feeding line e in sequence; S2, detection, two visual systems respectively identify the lower plate containing crystals on the feed line a and the upper plate on the feed line e, and the unqualified products are grabbed by the robot and flowed out to the unqualified product discharge line c; S3, welding of the lower electrode plate, the manipulator on the left grabs the lower electrode plate containing crystals with the carrier on the feeding line a and puts it into the positioning clamping fixture on the left automatic welding module, uses the visual mechanism to confirm the position of the lower electrode plate, and the upper fine-tuning mechanism and the lower fine-tuning mechanism adjust the position of the upper adsorption and pressing mechanism and the lower electrode plate. The positioning clamping fixture presses the carrier, and the pressure control unit of the upper adsorption and pressing mechanism descends to apply welding guarantee pressure to the lower electrode plate containing crystals in the carrier. The heating and heat preservation mechanism heats the lower electrode plate containing crystals and keeps it warm after reaching the welding temperature. After the heat preservation is completed, the cooling mechanism lifts up to cool the carrier and the product in the carrier. When the temperature cools to the temperature at which the material can be taken out, the cooling work is completed, the lower adsorption mechanism lifts up to prevent the lower electrode plate from falling off, the pressure control unit depressurizes and leaves, and the positioning clamping fixture is released; S4, transfer and flip, the left manipulator grabs the finished lower electrode plate with the carrier on the left automatic welding module and puts it into the transition tray of the flipping and picking mechanism. The flipping and picking mechanism flips the lower electrode plate 180 degrees. The left manipulator grabs the empty carrier after flipping and puts it on the discharge line b for outflow. The right manipulator grabs the finished lower electrode plate and puts it on the right automatic welding module; S5, cold lower plate buckle welding, the upper adsorption and pressing mechanism on the right side of the automatic welding module adsorbs the flipped lower plate onto the upper adsorption and pressing mechanism, the right side manipulator grabs the upper plate on the feed line e into the positioning clamping fixture on the automatic welding module, uses the visual mechanism to confirm the position of the lower plate and the upper plate, the upper fine-tuning mechanism and the lower fine-tuning mechanism adjust the cold lower plate, adjust the buckle position of the lower plate containing the crystal and the upper plate to meet the requirements of the drawing, the positioning clamping fixture presses the upper plate carrier, and the upper adsorption and pressing machine The pressure control unit of the structure carries the lower plate containing the crystal and descends to buckle the crystal on the lower plate with the upper plate and apply a certain welding guarantee pressure. The heating and heat preservation mechanism heats the carrier and the buckled product in the carrier. After reaching the welding temperature, it is kept warm. After the heat preservation is completed, the cooling mechanism lifts up to cool the carrier and the product in the carrier. When the temperature is cooled to a temperature at which the material can be taken out, the cooling work is completed, the lower adsorption mechanism lifts up to adsorb the upper plate to prevent it from falling off, the pressure control unit releases pressure and leaves, and the positioning clamping fixture is released; S6, discharging. The right manipulator grabs the finished product on the right automatic welding module and puts it on the discharging line d. The finished product flows out through the discharging line d, and a complete lower plate / upper plate automatic welding work cycle is completed.

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