Power conversion device

Abstract

A power conversion device (100) capable of suppressing a reduction in electrical connection reliability due to infiltration of an insulating resin material in a contact and current-carrying portion where the surfaces of multiple terminals are in contact with each other and current is carried out comprises a terminal-to-terminal contact surface (10A), a first resin material (13), and a second resin material (15). The terminal-to-terminal contact surface (10A) is a surface formed by the contact between the surfaces of the multiple terminals in the contact and current-carrying portion (10) where the surfaces of the multiple terminals are in contact with each other and current is carried out. The first resin material (13) seals the terminal-to-terminal contact surface (10A) by covering the terminal-to-terminal contact surface (10A). The second resin material (15) is arranged on the outside of the surface of the first resin material (13).

Description

Technical Field

[0001] The present disclosure relates to a power conversion device. Background Art

[0002] In recent years, there has been an increasing demand for miniaturization of power conversion devices. In response to this, an increasing number of power conversion devices have been constructed in which a printed circuit board is divided into multiple pieces and stacked to form a three-dimensional structure.

[0003] On the other hand, the electronic components that constitute the power conversion device include high-heat-generating components such as switching elements, rectifier elements, and magnetic components that generate heat as the power conversion device operates. Control is required so that the temperature of the electronic components is kept below the maximum allowable temperature by dissipating the heat generated by the high-heat-generating components. Therefore, for example, there is known a structure in which a heat-generating circuit substrate and circuit components are arranged in a housing and the housing is sealed with an insulating resin. The thermal conductivity of the insulating resin is higher than the thermal conductivity of the atmosphere. Therefore, compared with a case in which the housing is not sealed with resin and the high-heat-generating components are surrounded by the atmosphere, the heat dissipation performance of the power conversion device relative to the heat generated by the circuit substrate and circuit components can be improved.

[0004] For example, Japanese Patent Application Publication No. 2008-147432 (Patent Document 1) discloses a power conversion device. This power conversion device comprises a stacked metal circuit board and a control circuit board, with insulating resin sealed within a housing. The power conversion device includes a printed circuit board, a connector secured to the printed circuit board, a cover having connection terminals electrically connected to the connector, and insulating resin. By abutting the top surface of the connector against the cover, the insulating resin is prevented from seeping into the contact surface between the connector and the contact terminals of the cover.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2008-147432 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] In the power conversion device disclosed in Japanese Patent Application Laid-Open No. 2008-147432, as described above, the top surface of the connector abuts the cover. A contact spring is provided within the connector. A metal circuit pattern is embedded in the cover, and the metal circuit pattern and signal terminals are mounted and fixed thereto. The contact spring and signal terminals within the connector are electrically connected via a so-called contact energization method.

[0010] However, Japanese Patent Application Publication No. 2008-147432 makes it difficult to configure the connector so that its upper surface abuts the cover without a gap. Consequently, insulating resin seeps into the connector from the area between the two, where they should abut. This causes insulating resin to enter the contact surface between the contact spring and the signal terminal, potentially reducing the reliability of the electrical connection between the contact spring and the signal terminal.

[0011] The present disclosure has been made in view of the above-mentioned problems and aims to provide a power conversion device capable of suppressing a reduction in electrical connection reliability due to penetration of an insulating resin material in a contact current conducting portion where surfaces of a plurality of terminals are in contact with each other to conduct electricity.

[0012] Means for solving problems

[0013] According to one aspect of the present disclosure, a power conversion device includes an inter-terminal contact surface, a first resin material, and a second resin material. The inter-terminal contact surface is a surface formed by the contact between the surfaces of multiple terminals, in a contacting and conducting portion where current is conducted by contact between the surfaces of the multiple terminals. The first resin material seals the inter-terminal contact surface by covering it. The second resin material is disposed outside the surface of the first resin material.

[0014] According to another aspect of the present disclosure, a power conversion device includes an inter-terminal contact surface, a first resin material, and a second resin material. The inter-terminal contact surface is a surface formed by the contact between the surfaces of multiple terminals, in a contacting and conducting portion where current is conducted by contact between the surfaces of the multiple terminals. The first resin material surrounds the inter-terminal contact surface at a distance therefrom. The second resin material is disposed outside the surface of the first resin material.

[0015] Effects of the Invention

[0016] According to the present disclosure, it is possible to provide a power conversion device capable of suppressing a decrease in reliability of electrical connection due to penetration of an insulating resin material in a contact current conducting portion where surfaces of a plurality of terminals are in contact with each other and current is conducted. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic cross-sectional view showing a first example of the structure of the power conversion device according to the first embodiment.

[0018] Figure 2 This is a schematic enlarged cross-sectional view showing the structure of a contact current-carrying portion constituting the power conversion device according to the first embodiment.

[0019] Figure 3 This is a schematic cross-sectional view showing a second example of the structure of the power conversion device according to the first embodiment.

[0020] Figure 4 This is a flowchart showing the method for manufacturing the power conversion device according to the first embodiment.

[0021] Figure 5 This is a schematic cross-sectional view showing a first example of the structure of the power conversion device according to the second embodiment.

[0022] Figure 6 This is a flowchart showing a method for manufacturing a power conversion device according to the second embodiment.

[0023] Figure 7 This is a schematic perspective view showing a modified example of the contact current-carrying portion included in the second example of the structure of the power conversion device according to the second embodiment.

[0024] Figure 8 This is a schematic cross-sectional view showing the structure of a power conversion device according to a third embodiment.

[0025] Figure 9 This is a schematic perspective view showing an example of a contact current-carrying portion included in the structure of the power conversion device according to the third embodiment.

[0026] Figure 10 This is a circuit diagram showing an example of electrical connection between a first printed circuit board and a second printed circuit board included in the power conversion device according to the third embodiment.

[0027] Figure 11 This is the case where the first resin material enters so as to cover the terminal contact surface 10A in the third embodiment. Figure 10 The circuit diagram is equivalent to the circuit diagram. DETAILED DESCRIPTION

[0028] Hereinafter, each embodiment will be described with reference to the drawings. It should be noted that for the convenience of description, the X direction, the Y direction, and the Z direction are introduced.

[0029] Implementation method 1.

[0030] Figure 1 1 is a schematic cross-sectional view showing a first example of the structure of the power conversion device of the first embodiment. First, the characteristic parts of the power conversion device of the first example of the first embodiment will be briefly described. Figure 1The power conversion device 100 of the first example of the present embodiment has the following features. The power conversion device 100 includes a first terminal 11 and a second terminal 12 as two terminals. Electricity is conducted by the surfaces of the first terminal 11 and the second terminal 12 being in contact with each other, thereby forming a contact current conducting portion 10. The contact current conducting portion 10 is configured to have a terminal contact surface 10A, which is a surface formed by connecting the surfaces of the first terminal 11 and the second terminal 12 in contact with each other. A first resin material 13 is provided to seal the terminal contact surface 10A in a manner covering the terminal contact surface 10A. A second resin material 15 is provided to the outside of the surface of the first resin material 13. The power conversion device 100 will be described in detail below.

[0031] The power conversion device 100 includes a first printed circuit board 21 and a second printed circuit board 22. The first printed circuit board 21 has a main surface 21a and a main surface 21b opposite to the main surface 21a. Figure 1 In the embodiment, the main surface 21a is arranged on the upper side and the main surface 21b is arranged on the lower side. The main surface 21a and the main surface 21b have, for example, a rectangular planar shape. The first printed substrate 21 is arranged such that the main surfaces 21a and 21b are arranged, for example, along the XY plane. Therefore, the first printed substrate 21 is arranged such that the thickness is along the Z direction. The second printed substrate 22 has a main surface 22a and a main surface 22b facing the opposite side of the main surface 22a. Figure 1 In the figure, main surface 22a is arranged on the right side, and main surface 22b is arranged on the left side. Main surfaces 22a and 22b have, for example, rectangular planar shapes. The second printed substrate 22 is arranged such that main surfaces 22a and 22b lie along the YZ plane. Therefore, the second printed substrate 22 is arranged such that its thickness lies along the X direction. Therefore, the first printed substrate 21 and the second printed substrate 22 intersect with their main surfaces being substantially perpendicular to each other. It should be noted that the term "substantially perpendicular" is not limited to a completely perpendicular intersection; it also includes an intersection at an angle slightly different from a completely perpendicular intersection.

[0032] First terminals 11 are connected to first printed circuit board 21. Second terminals 12 are connected to second printed circuit board 22. First terminals 11 are fixed to, for example, the upper main surface 21a of first printed circuit board 21. Second terminals 12 are fixed to, for example, the right main surface 22a of second printed circuit board 22. However, this is not limiting. First terminals 11 may also be fixed to main surface 21b. Second terminals 12 may also be fixed to main surface 22b.

[0033] Figure 2 This is a schematic enlarged cross-sectional view showing the structure of the contact current conducting portion constituting the power conversion device of the first embodiment. Figure 2 , Figure 1The contact portion 10 shown is composed of two terminals, a first terminal 11 and a second terminal 12. However, the contact portion 10 may be composed of any number of terminals, three or more. The contact portion 10 has a terminal-to-terminal contact surface 10A, which is a portion that connects the first terminal 11 and the second terminal 12 in a contact manner.

[0034] First terminal 11 includes a first contact portion and a first receiving portion shaped to surround and accommodate the first contact portion. Second terminal 12 includes a second contact portion and a second receiving portion shaped to surround and accommodate the second contact portion. The contact between the first and second contact portions forms inter-terminal contact surface 10A. The first receiving portion engages with the second receiving portion by virtue of the inner wall of the second receiving portion contacting the outer wall of the first receiving portion.

[0035] Specifically, the first terminal 11 is, for example, a so-called terminal receiving portion. That is, the terminal receiving portion, serving as the first terminal 11, is a member capable of electrically connecting to a terminal, serving as the second terminal 12, through so-called contact conduction. The first terminal 11 includes a contact 11A, serving as a first contact portion, and a first housing 11B, serving as a first receiving portion. The first housing 11B surrounds and receives the contact 11A.

[0036] The first housing 11B is composed, for example, of a bottom surface and side surfaces extending from the edge of the bottom surface. The bottom surface preferably has a rectangular planar shape, for example. However, this is not limiting and the bottom surface may also have a circular planar shape, for example. Furthermore, if the bottom surface is rectangular, the side surfaces are formed into four rectangular flat plates. If the bottom surface is circular, the side surfaces are formed into a curved surface similar to the side surface of a cylinder.

[0037] The bottom surface of the first housing 11B is fixed to the main surface 21a of the first printed circuit board 21. The first housing 11B is formed into a container shape by the bottom surface and the side surfaces. The contact 11A is arranged inside the container-shaped first housing 11B, that is, inside the space surrounded by the bottom surface and the side surfaces. The contact 11A can also be, for example, Figure 2 Alternatively, the contact 11A may be a plate-like member arranged in a plurality at intervals in at least one of the X and Y directions and extending in the Z direction. Specifically, the contact 11A is preferably configured such that a space is formed inside the contact.

[0038] The second terminal 12 includes a pin 12A as a second contact portion and a second housing 12B as a second receiving portion. The second housing 12B receives the pin 12A so as to surround the pin 12A.

[0039] The second housing 12B is composed, for example, of a bottom surface and side surfaces extending from the edge of the bottom surface. The bottom surface preferably has a rectangular planar shape, for example. However, this is not limiting and the bottom surface may also have a circular planar shape, for example. Furthermore, if the bottom surface is rectangular, the side surfaces are formed into four rectangular flat plates. If the bottom surface is circular, the side surfaces are formed into a curved surface similar to the side surface of a cylinder.

[0040] like Figure 2 As shown, the bottom surface of the second housing 12B is preferably slightly larger than the bottom surface of the first housing 11B. Specifically, for example, it is preferable that the first housing 11B and the second housing 12B are fitted together by bringing the inner wall of the side surface of the second housing 12B, which faces inward, into contact with the outer wall of the side surface of the first housing 11B, which faces outward. In other words, the second housing 12B covers the first housing 11B from above, like a lid, thereby fitting the two together. Therefore, it is preferable that the outer wall of the first housing 11B and the inner wall of the second housing 12B are approximately the same size when viewed from above.

[0041] However, a gap may be provided between the outer wall of the first housing 11B and the inner wall of the second housing 12B to the extent that the aforementioned interlocking is achieved, with the inner wall of the second housing 12B being slightly larger than the outer wall of the first housing 11B. In this case, the inner wall of the second housing 12B need not contact the outer wall of the first housing 11B. It should be noted that in this case, it is preferred that the first housing 11B be interlocked with the second housing 12B so that the uppermost portion of the side surface of the first housing 11B contacts the inner wall of the bottom surface of the second housing 12B.

[0042] The pin 12A is a rod-shaped member extending in one direction. The pin 12A is fixed, for example, on the main surface 22a of the second printed circuit board 22. The pin 12A is fixed, for example, in a manner extending in a direction substantially perpendicular to the main surface 22a. It should be noted that, here, substantially perpendicular is not limited to the case of being completely perpendicular, and includes the case of crossing at an angle slightly different from the completely perpendicular. That is, in the area close to the main surface 22a, the pin 12A extends, for example, along the X direction. The pin 12A may also be in a state of being inclined relative to the direction in which the main surface 22a extends. The pin 12A may also be as follows: Figure 2 That is a shape that bends at a certain angle at one or more places and extends downward in the Z direction from there. Figure 2 The angle is approximately 90°, but is not limited thereto. For example, it may be approximately 80° or less, approximately 60° or less, or approximately 45° or less, or may be an obtuse angle. Furthermore, the pin 12A may have no curved portion and may extend entirely to the right in the X direction, or may extend downward in the Z direction.

[0043] The portion of pin 12A extending downward in the Z direction away from main surface 22a is inserted into a hollow portion within the cylindrical interior of contact 11A, for example, or into a space between the plate-like members of multiple contacts 11A. This allows the inward-facing surface of contact 11A to contact the outward-facing surface of pin 12A. The contacting portion of contact 11A and pin 12A in contact with current-carrying portion 10 forms inter-terminal contact surface 10A. At this inter-terminal contact surface 10A, the surfaces of first terminal 11 and second terminal 12 come into contact, forming a current path.

[0044] As described above, the first terminal 11, which is a plurality of terminals, includes: the contact 11A, which is a contact portion whose surfaces contact each other on the inter-terminal contact surface 10A; and the first housing 11B, which is a receiving portion that surrounds and accommodates at least one of the contact portions. Furthermore, the second terminal 12, which is a plurality of terminals, includes: the pin 12A, which is a contact portion whose surfaces contact each other on the inter-terminal contact surface 10A; and the second housing 12B, which is a receiving portion that surrounds and accommodates at least one of the contact portions.

[0045] The first resin material 13 is arranged in an area adjacent to the outside of the contact surface 10A between the terminals. The first resin material 13 is arranged in a manner that covers the surfaces of the contact piece 11A and the pin 12A in the area adjacent to the outside of the contact surface 10A between the terminals. In this way, the first resin material 13 covers the contact surface 10A between the terminals. Here, covering the contact surface 10A between the terminals is not limited to covering the contact surface 10A between the terminals itself, but also includes contact with the surface of the portion closest to the surrounding area of ​​the contact surface 10A between the terminals that is adjacent to the same contact surface 10A between the terminals. Thus, the first resin material 13 becomes a form that covers and seals the contact surface 10A between the terminals from the outside in a manner that the contact surface 10A between the terminals is not exposed. Therefore, the first resin material 13 is preferably sealed in a manner that covers, in other words, wraps around the entire contact surface 10A between the terminals.

[0046] The second resin material 15 is disposed outside the surface of the first resin material 13. The second resin material 15 is disposed outside the first and second terminals 11 and 12 so as to seal the contact and conducting portion 10, the first resin material 13, the first and second printed circuit boards 21 and 22, particularly the lower region in the Z direction, and the electronic components 30 and 31.

[0047] Reference Figure 1 and Figure 2 , electronic components 30 and electronic components 31 are mounted on the first printed circuit board 21. Figure 1In the embodiment, electronic components 30 and electronic components 31 are mounted on the main surface 21a. However, the present invention is not limited thereto, and at least one of the electronic components 30 and 31 may be mounted on the main surface 21b. The electronic component 32 is mounted on the second printed circuit board 22. Figure 1 In FIG. 2 , electronic component 32 is mounted on main surface 22 b . However, the present invention is not limited thereto, and electronic component 32 may be mounted on main surface 22 a . Furthermore, electronic component 30 generates heat at a higher temperature than electronic components 31 and 32 .

[0048] More specifically, the electronic component 30 that generates heat at a higher temperature is joined to an unillustrated circuit pattern formed on the main surface 21a by an unillustrated joining member. Thus, the electronic component 30 is electrically connected to the circuit pattern. In addition, similarly, the first terminal 11 is joined to an unillustrated circuit pattern formed on the main surface 21a by an unillustrated joining member. Thus, the first terminal 11 is electrically connected to the circuit pattern. The second terminal 12 is joined to an unillustrated circuit pattern formed on the main surface 22a by an unillustrated joining member. Thus, the second terminal 12, in particular the pin 12A, is electrically connected to the circuit pattern on the main surface 22a. The number of second terminals 12 mounted on the main surface 22a can be any number more than one. The number of electronic components 30 and first terminals 11 mounted on the main surface 21a, and the number of second terminals 12 mounted on the main surface 22a can be any number more than one.

[0049] The first printed circuit board 21, the contact power supply portion 10, the first resin material 13, and the second resin material 15 are entirely housed in a cooling body 40 that accommodates the above-mentioned components. However, only the area on the lower side in the Z direction of the second printed circuit board 22, that is, a part of the area, is housed in the cooling body 40. However, regarding the second printed circuit board 22, the entirety thereof may also be housed in the cooling body 40. The bottom surface of the lowest part in the Z direction of the cooling body 40 is, for example, rectangular. However, this is not limited to the above, and the shape of the bottom surface of the cooling body 40 is arbitrary, for example, it may also be circular. In addition, the side surface of the cooling body 40 extends from the bottom surface toward the upper side in the Z direction. When the bottom surface is rectangular, the side surface is in the shape of four rectangular flat plates. When the bottom surface is circular, the side surface is in the shape of a curved surface as the side surface of a cylinder.

[0050] The cooling body 40 also functions as a housing because it houses the various components. The cooling body 40 is filled with a second resin material 15. That is, within the cooling body 40, the various components are sealed by the second resin material 15. In particular, the first printed circuit board 21, the electronic component 30 mounted on the main surface 21a and generating heat at a high temperature, and the first resin material 13 that contacts the conductive portion 10 are sealed in such a way that substantially the entirety of their surfaces is covered by the second resin material 15. In other words, for example, the inner wall surface of the cooling body 40 is in contact with the second resin material 15. In further words, the cooling body 40 is thermally bonded to the second resin material 15. In addition, at least one of the first printed circuit board 21 and the second printed circuit board 22 is in contact with the second resin material 15. In other words, at least one of the first printed circuit board 21 and the second printed circuit board 22 is thermally bonded to the second resin material 15. In addition, the electronic component 31 is sealed in such a way that it is covered by the second resin material 15.

[0051] An insulating member 50 is disposed between the first printed circuit board 21 and the inner wall of the bottom portion of the cooling body 40 located at the lowest part in the Z direction. The insulating member 50 is a flat plate member having a substantially the same shape as the first printed circuit board 21 and having a rectangular planar shape, for example. Figure 1 The main surface 50a on the lower side of the insulating member 50 contacts the main surface 40a of the bottom surface on the lower side in the Z direction of the inner wall of the cooling body 40. Figure 1 The upper main surface of is in contact with main surface 21b.

[0052] Next, the materials and the like of the components constituting the above-described power conversion device 100 will be described.

[0053] The contact 11A of the first terminal 11 and the pin 12A of the second terminal 12 are made of a conductive material. Therefore, the contact 11A and the pin 12A have a 1.0×10 -6 Ω·m or less, more preferably 1.0×10 -7 Volume resistivity of Ω·m or less. Alternatively, contact 11A may be provided with a spring mechanism to impart elasticity. Thus, when pin 12A is inserted into a cavity inside contact 11A, for example, contact 11A presses against pin 12A. This pressing action utilizes the elasticity of contact 11A to clamp pin 12A. Consequently, the surfaces of contact 11A and pin 12A contact each other, forming inter-terminal contact surface 10A. This electrically connects contact 11A and pin 12A via contact conduction.

[0054] The first housing 11B of the first terminal 11 and the second housing 12B of the second terminal 12 can have any shape, but preferably have container-like shapes that can fit together as described above. For example, the second housing 12B can fit into the first housing 11B just as the contact 11A presses against the pin 12A, and the elasticity of the contact 11A causes the contact 11A to grip the pin 12A. It should be noted that the first housing 11B and the second housing 12B are preferably made of a cured insulating resin material, for example.

[0055] In the power conversion device 100 of the present embodiment, the first resin material 13 is composed of a resin having conductivity. That is, the first resin material 13 is a paste-like resin containing a conductive filler. The conductive filler of the first resin material 13 has conductivity. Therefore, the conductive filler is formed by any one selected from the group consisting of silver, nickel, gold and copper. Alternatively, the conductive filler may be an alloy of two or more selected from the group consisting of the silver, nickel, gold and copper. Alternatively, the conductive filler may be carbon. The paste-like resin contained in the first resin material 13 is composed of, for example, epoxy resin. In addition, the paste-like resin may also be a one-component resin pre-mixed with a curing agent. Alternatively, the paste-like resin may also be a two-component resin obtained by mixing a resin and a curing agent immediately before use.

[0056] The volume resistivity of the conductive resin as the first resin material 13 is 1.0×10 -3 Ω·m or less, more preferably 1.0×10 -4 Ω·m or less, more preferably 1.0×10 -5 Ω·m or less.

[0057] The conductive resin of the first resin material 13 has thermosetting properties. Here, a resin material having thermosetting properties refers to, for example, a resin material whose hardness is measured by a type A durometer according to JIS K 6253 and becomes 10 or more when placed in an environment of 25°C as the first curing condition for 120 minutes. Alternatively, a resin material having thermosetting properties refers to, for example, a resin material whose hardness is measured by a type A durometer according to JIS K 6253 and becomes 10 or more when placed in an environment of 50°C as the second curing condition for 20 minutes. Furthermore, a resin material having thermosetting properties refers to, for example, a resin material whose hardness is measured by a type A durometer according to JIS K 6253 and becomes 10 or more when placed in an environment of 80°C as the third curing condition for 10 minutes. Which of the above-mentioned first, second, or third curing conditions is used is different for each resin material. It should be noted that, depending on the type of resin material, curing conditions other than the above-mentioned first, second, or third curing conditions may also be used.

[0058] The second resin material 15 is an insulating resin. That is, the second resin material 15 has electrical insulation. The volume resistivity of the insulating resin as the second resin material 15 is 1.0×10 9 Ω·m or greater. The insulating resin may also be made of a material having a thermal conductivity of 0.1 W / (m·K) or greater, more preferably 1.0 W / (m·K) or greater. The second resin material 15 may have a Young's modulus of 1 MPa or greater. The second resin material 15 may also be formed of a resin material such as polyphenylene sulfide (PPS) or polyetheretherketone (PEEK) containing a thermally conductive filler. The second resin material 15 may also be made of a rubber material such as silicone or polyurethane.

[0059] In the power conversion device 100 , the second resin material 15 preferably has a relatively low viscosity. For example, when the second resin material 15 is filled into the cooling body 40 , the viscosity of the supplied second resin material 15 is preferably 1 Pa·s or less, more preferably 100 mPa·s or less, and even more preferably 10 mPa·s or less.

[0060] The plate-shaped main bodies of the first and second printed circuit boards 21, 22 are preferably made of the following resin materials. Specifically, the main bodies can be formed from any resin material selected from the group consisting of glass fiber-reinforced epoxy resin, phenolic resin, polyphenylene sulfide (PPS), and polyetheretherketone (PEEK). In other words, the first and second printed circuit boards 21, 22 can be made of a material generally having low thermal conductivity. In other words, the first and second printed circuit boards 21, 22 can be general-purpose printed circuit boards. Furthermore, the main bodies of the first and second printed circuit boards 21, 22 can be made from any ceramic material selected from the group consisting of alumina, aluminum nitride, and silicon carbide.

[0061] The thickness of the circuit pattern (not shown) formed on the first printed circuit board 21 and the second printed circuit board 22 is not less than 1 μm and not more than 2000 μm. This circuit pattern is formed from any conductive material. For example, this circuit pattern is formed from any material selected from the group consisting of copper, nickel, gold, aluminum, silver, and tin. Alternatively, this circuit pattern may be an alloy of two or more materials selected from the group consisting of copper, nickel, gold, aluminum, silver, and tin. The circuit pattern is not limited to being formed on the main surfaces 21a, 21b, 22a, and 22b; it may also be formed within the plate-shaped main body of the first printed circuit board 21 and the second printed circuit board 22.

[0062] Furthermore, a bonding member (not shown) for bonding the electronic component 30 and the like to the circuit pattern has conductivity. Specifically, the bonding member is made of solder or a conductive adhesive.

[0063] The electronic component 30 that generates relatively high heat is a power semiconductor element. Specifically, the electronic component 30 is preferably selected from the group consisting of a transistor, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), a diode, and a thyristor. Alternatively, the electronic component 30 may be an integrated circuit (IC) or a magnetic component that generates heat as the power conversion device 100 operates.

[0064] Electronic components 31 and 32, which generate less heat than electronic component 30, are preferably selected from surface-mount chip resistors, chip capacitors, and integrated circuits. Electronic components 31 and 32 may also be power semiconductor devices. When electronic components 31 and 32 are power semiconductor devices, they are characterized in that they generate less heat than electronic component 30.

[0065] The cooling body 40 has a thermal conductivity of 1.0 W / (m·K) or more, more preferably 10.0 W / (m·K) or more, and even more preferably 100.0 W / (m·K) or more. The cooling body 40 is formed by any one selected from the group consisting of copper, iron, aluminum, iron alloy and aluminum alloy. The cooling body 40 can also be formed of a resin material with high thermal conductivity. The cooling body 40 can also be electrically connected to other components in such a way that the potential of the cooling body 40 becomes the same potential as the ground. The main surface 40a of the inner wall side of the bottom of the cooling body 40 located at the lowest part in the Z direction faces the main surface 21b on the lower side of the first printed circuit board 21.

[0066] The insulating member 50 has electrical insulation properties. The insulating member 50 may also have elasticity. The insulating member 50 may also have a Young's modulus of 1 MPa or more and 100 MPa or less. The insulating member 50 may also have a thermal conductivity of 0.1 W / (m·K) or more, more preferably 1.0 W / (m·K) or more. The insulating member 50 may also be made of a rubber material such as silicon or polyurethane. The insulating member 50 may also be formed by any resin material selected from the group consisting of acrylonitrile butadiene styrene (ABS), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS) and phenol. The insulating member 50 may also be made of a polymer material such as polyimide. The insulating member 50 may also be made of a ceramic material such as aluminum oxide or aluminum nitride. The insulating member 50 may also be formed of a phase change material with silicon as the main raw material. The insulating member 50 may also be made of a material in which particles of any one of aluminum oxide, aluminum nitride and boron nitride are mixed into a silicone resin. The insulating member 50 is disposed between the first printed circuit board 21 and the cooling body 40. The insulating member 50 is disposed so that the lower main surface 50a thereof is pressed against the main surface 40a of the cooling body 40 by the main surface 21b of the first printed circuit board 21.

[0067] Figure 3 2 is a schematic cross-sectional view showing a second example of the structure of the power conversion device according to the first embodiment. Figure 3 The power conversion device 100 of the second example of this embodiment has Figure 1 The structure of the power conversion device 100 of the first example is substantially the same. Figure 3 In, with Figure 1 Identical components are denoted by the same reference numerals, and their descriptions will not be repeated unless their functions and materials are the same. However, in the power conversion device 100 of the second example, the first printed circuit board 21 is secured to the cooling element 40 via a securing member 60 . This configuration is possible. It should be noted that the securing member 60 is, for example, a commonly known screw. The screw is made of, for example, metal or resin.

[0068] Next, use Figure 4 , the manufacturing method of the power conversion device 100 of the embodiment 1 is described. It should be noted that the components and Figures 1 to 3 The components described correspond to each other. Figure 4 Flowchart showing the method for manufacturing the power conversion device according to the first embodiment. Figure 4 The power conversion device 100 of this embodiment includes a preparation step ( S100 ), an assembly step ( S200 ), a connection step ( S300 ), and a sealing step ( S400 ).

[0069] In the preparation step (S100), a flat-plate first printed circuit board 21, a flat-plate second printed circuit board 22, a cooling element 40 that also functions as a housing, and a flat-plate insulating member 50 are prepared. Electronic components 30 that generate heat at high temperatures and first terminals 11 that serve as terminal receiving portions are secured to the first printed circuit board 21. Second terminals 12 serving as terminals are secured to the second printed circuit board 22. Alternatively, the electronic components 31 may be secured to the first printed circuit board 21, while the electronic components 32 may be secured to the second printed circuit board 22.

[0070] In the assembly process (S200), the first printed circuit board 21 is placed on the main surface 40a of the inner wall of the bottom portion of the cooling body 40 located at the lowest part in the Z direction, via the insulating member 50. The main surface 40a and the main surface 50a are placed in contact with each other. The main surface 21b is placed in contact with the upper surface of the insulating member 50. In this state, for example, the fixing member 60 (see Figure 3 ) The bottom of the cooling element 40, the insulating member 50, and the first printed circuit board 21 are fixed. Furthermore, the second printed circuit board 22 is arranged on the first printed circuit board 21 so that at least a portion, that is, the lower region in the Z direction, is housed within the cooling element 40. It is preferred that the main surfaces 22a and 22b of the second printed circuit board 22 are arranged substantially perpendicular to the main surfaces 21a and 21b of the first printed circuit board 21.

[0071] In the connection process (S300), Figures 1 to 3 As shown, the first terminal 11 fixed to the first printed circuit board 21 is connected to the second terminal 12 fixed to the second printed circuit board 22 to form a contact energizing portion 10. The portion of the pin 12A that leaves the main surface 22a and extends downward in the Z direction is inserted into a hollow portion of the contact 11A, such as a cylindrical portion, or a spaced portion sandwiched by a plurality of plate-like members of the contact 11A. As a result, the surface portion of the contact 11A facing inward contacts the surface portion of the pin 12A facing outward. The portion of the contact 11A in the contact energizing portion 10 where the surface of the pin 12A contacts the surface forms a terminal-to-terminal contact surface 10A, where the surface of the first terminal 11 contacts the surface of the second terminal 12 and conducts electricity. In addition, as a result, at least a portion of the second printed circuit board 22 is arranged inside the container-shaped portion of the cooling body 40.

[0072] Then, the first resin material 13 is arranged in a manner that contacts and covers the surfaces of the contact piece 11A and the pin 12A in the area adjacent to the outside of the formed inter-terminal contact surface 10A. That is, within the cooling body 40, the first resin material 13 is supplied into the cooling body 40 in a manner that impregnates the inter-terminal contact surface 10A, which is formed as the contact portion between the contact piece 11A of the first terminal 11 and the pin 12A of the second terminal 12. As a result, the first resin material 13 is sealed so that the inter-terminal contact surface 10A is not exposed to the outside. In addition, the first resin material 13 is preferably supplied so that the entire inter-terminal contact surface 10A is sealed. Thereafter, the first resin material 13 is cured using curing conditions corresponding to the characteristics of the first resin material 13. In this way, a cured portion of the first resin material 13 is formed within the cooling body 40. The curing conditions corresponding to the characteristics of the first resin material 13 are preferably, for example, any of the first curing conditions, the second curing conditions, or the third curing conditions described above. It should be noted that, depending on the type of resin material, curing conditions other than the first, second, or third curing conditions described above may also be used.

[0073] In the sealing process (S400), the second resin material 15 is supplied to and filled in the area within the cooling body 40 that can accommodate various components. Afterwards, the second resin material 15 is cured by a curing condition corresponding to the characteristics of the second resin material 15. Thus, a cured portion of the second resin material 15 is formed within the cooling body 40. The above-mentioned curing condition corresponding to the characteristics of the second resin material 15 is preferably, for example, any one of the above-mentioned first curing condition, second curing condition or third curing condition. It should be noted that, depending on the type of resin material, curing conditions other than the above-mentioned first, second or third curing conditions may also be used. In the above manner, the power conversion device 100 of this embodiment is formed.

[0074] Next, problems in the conventional technology will be supplementally described, and then the effects of the power conversion device 100 according to the present embodiment will be described.

[0075] In the power conversion device described in the aforementioned Japanese Patent Publication No. 2008-147432, the contact spring inside the connector is electrically connected to the signal terminal inside the cover covering the contact spring by means of contact conduction. As a result, the contact conduction portion is arranged in a substantially enclosed space. Therefore, a gap is easily generated between the contact spring inside the connector and the abutment portion of the signal terminal. In particular, the connector arranged on the printed circuit board is arranged on the printed circuit board by a dedicated mounting device or by manual insertion. Therefore, it is difficult to arrange the connector in such a manner that the upper surface portion of the connector abuts against the cover facing the upper surface portion of the connector without a gap. As a result, when the abutment portion between the upper surface portion of the connector and the cover is sealed with insulating resin, the insulating resin may penetrate through the gap into the contact surface between the terminals of the contact conduction portion arranged in the substantially enclosed space. As a result, there is a problem of reduced reliability of the electrical connection.

[0076] In order to solve the above-mentioned problems, there is a method of soldering one end of a metal conductor and the other end to each of the two printed circuit boards. Alternatively, there is a method of soldering one end of a metal conductor to each of the two printed circuit boards and welding the two metal conductors to each other. It is conceivable to electrically connect the two printed circuit boards by using any of the above-mentioned methods, without using a contact conductive part. However, when using these methods, it is necessary to set up a space around the area where soldering or welding is to be performed so that a dedicated processing fixture can be arranged. As a result, there is a problem of large-scale power conversion device. In addition, in the state of three-dimensionally arranging the printed circuit boards, in order to perform soldering and welding, a dedicated processing fixture is required, and there is also a problem of complicating the manufacturing process.

[0077] In view of the above-mentioned issues, the power conversion device 100 according to the present disclosure has the following structure. The power conversion device 100 includes a terminal contact surface 10A, a first resin material 13, and a second resin material 15. The terminal contact surface 10A is a surface formed by the contact between the surfaces of multiple terminals in a contact current-carrying portion 10 (an electrical connection portion using a contact current-carrying method), in which the surfaces of multiple terminals contact each other to conduct electricity. The first resin material 13 seals the terminal contact surface 10A by covering it. The second resin material 15 is arranged outside the surface of the first resin material 13.

[0078] The power conversion device 100 described above uses a contact-type electrical connection 10 as a contact-type electrical connection. Therefore, the specialized processing jig required to connect multiple printed circuit boards by soldering or welding metal conductors is eliminated. This reduces the size of the device that would otherwise require space to accommodate such a processing jig. Furthermore, the complexity of the manufacturing process caused by the use of specialized processing jigs can be minimized.

[0079] In addition, the first resin material 13 seals the contact surface 10A between the terminals in a manner that covers the contact surface 10A between the terminals. Therefore, for example, when the second resin material 15 is supplied to the cooling body 40 serving as the outer shell to seal the contact surface 10A between the terminals, it is possible to prevent the second resin material 15, which is an insulating resin, from penetrating into the contact surface 10A between the terminals of the contact conductive portion 10. This is because the first resin material 13 blocks the second resin material 15 by preventing it from entering a position closer to the contact surface 10A between the terminals than the first resin material 13. Therefore, it is possible to ensure that the surfaces of the multiple terminals in the contact conductive portion 10 are in contact with each other and are in a state of being energized, and to ensure high reliability of the electrical connection between these multiple terminals.

[0080] In the power conversion device 100, the first resin material 13 is preferably sealed so as to cover the entire inter-terminal contact surface 10A. This can more reliably prevent the second resin material 15, an insulating resin, from penetrating the inter-terminal contact surface 10A. Consequently, the surfaces of the multiple terminals in the contact conducting portion 10 are in contact with each other and the current flow is maintained, ensuring high reliability of the electrical connection between these multiple terminals.

[0081] In the power conversion device 100, the first resin material 13 is preferably a conductive resin, and the second resin material 15 is preferably an insulating resin. Since the first resin material 13 is a conductive resin, the inter-terminal contact surface 10A is sealed by the first resin material 13. This allows, for example, even if the first resin material 13 adheres to the inter-terminal contact surface 10A, to suppress a decrease in the reliability of the electrical connection between the multiple terminals at the inter-terminal contact surface 10A. Furthermore, since the second resin material 15 is an insulating resin, electrical short circuits between components of the power conversion device 100, such as those within the housing, can be suppressed.

[0082] In the power conversion device 100, it is preferred that the first resin material 13 has thermosetting properties. For example, when the curing condition of the second resin material 15 is a condition in which a high temperature state is maintained for a certain period of time, in order to cure the second resin material 15 in the sealing process (S400), the first resin material 13 and the second resin material 15 are raised to approximately the same temperature. However, the first resin material 13 has already been cured in the connection process (S300) performed before the sealing process (S400). Therefore, in the sealing process (S400), the first resin material having thermosetting properties will not be deformed. Therefore, the second resin material 15 will not penetrate from the outside into the contact surface 10A between the terminals sealed by the first resin material 13. Therefore, the high reliability of the electrical connection of the contact conduction part 10 of the power conversion device 100 can be ensured.

[0083] The power conversion device further includes a first printed circuit board 21 and a second printed circuit board 22. The first printed circuit board 21 is connected to a first terminal 11, at least one of the plurality of terminals. The second printed circuit board 22 is connected to a second terminal 12, another of the plurality of terminals other than the at least one terminal. The contact portion 10 is formed by the first terminal 11, which is connected to the first printed circuit board 21, and the second terminal 12, which is connected to the second printed circuit board 22. The contact portion 10 includes the inter-terminal contact surface 10A, which is a portion that connects the first terminal 11 and the second terminal 12 in contact with each other. The following structure is possible.

[0084] In other words, the printed circuit board is divided into two, a first printed circuit board 21 and a second printed circuit board 22. These two printed circuit boards are electrically connected to the first terminal 11 and the second terminal 12 via contact conduction. This eliminates the need for dedicated machining jigs, which would be required when electrically connecting multiple printed circuit boards via soldering or welding, adjacent to the areas where such soldering or welding is performed. This allows for a more compact power conversion device 100.

[0085] The power conversion device 100 further includes a cooling body 40 that accommodates at least a portion of the second printed circuit board 22, the first printed circuit board 21, the contact conducting portion 10, the first resin material 13, and the second resin material 15. The cooling body 40 is in contact with the second resin material 15. At least one of the first printed circuit board 21 and the second printed circuit board 22 is in contact with the second resin material 15. It should be noted that the contact between the cooling body 40 and the second resin material 15, and the contact between at least one of the first printed circuit board 21 and the second printed circuit board 22 and the second resin material 15, refer to, for example, thermal bonding. Such a structure is preferred.

[0086] The second resin material 15 has a higher thermal conductivity than the atmosphere. Therefore, compared to a case where the cooling element 40 is not sealed with the second resin material 15, heat generated by, for example, the electronic components 30 and the circuit pattern of the first printed circuit board 21, which generate high temperatures within the device, can be dissipated to the cooling element 40 via the second resin material 15. As a result, the heat dissipation performance of the heat generated by the electronic components 30 and the circuit pattern of the first printed circuit board 21, which generate high temperatures, can be improved. Consequently, the power conversion device 100 can be miniaturized by an amount that eliminates the need for a heat sink within the power conversion device 100.

[0087] Furthermore, at least one of the first printed circuit board 21 and the second printed circuit board 22 is in contact with the second resin material 15. Therefore, within the cooling element 40, the cured second resin material 15 secures the mechanical fixation of at least one of the first and second printed circuit boards 21, 22, and the contact conductive portion 10 to the cooling element 40. Specifically, the cured second resin material 15 filling the cooling element 40 secures the first printed circuit board 21 and the other components to the cooling element 40, preventing them from moving. This improves the vibration resistance of the power conversion device 100.

[0088] In the power conversion device 100, electronic components 30, 31, 32 are mounted on at least one of the first printed circuit board 21 and the second printed circuit board 22. At least a portion of the electronic components 30, 31, 32 is sealed with the second resin material 15. This structure may be employed.

[0089] The effects of this structure are essentially the same as those achieved by contact between at least one of the first printed circuit board 21 and the second printed circuit board 22 and the second resin material 15. Specifically, the thermal conductivity of the second resin material 15 is higher than that of the atmosphere. Therefore, compared to a case where the interior of the cooling element 40 is not sealed with the second resin material 15, heat generated by, for example, the electronic components 30 and 31, 32 generating high temperatures within the device and the circuit pattern of the first printed circuit board 21 can be dissipated to the cooling element 40 via the second resin material 15.

[0090] Furthermore, in this embodiment, the viscosity of the second resin material 15 is preferably as low as, for example, 1 Pa·s or less. Lowering the viscosity of the second resin material 15 allows the second resin material 15 to more easily penetrate into narrow spaces. Therefore, compared to a case where the viscosity of the second resin material 15 is high, the voids generated within the cooling element 40 sealed by the second resin material 15 during the sealing step ( S400 ) can be reduced. As a result, the power conversion device 100 no longer needs to be designed with consideration given to partial discharges caused by voids and the reduction in heat dissipation caused by the voids.

[0091] The manufacturing method of the power conversion device 100 of this embodiment proceeds as follows. In the connection step (S300), the contact 11A of the first terminal 11 fixed to the first printed circuit board 21 and the pin 12A of the second terminal 12 fixed to the second printed circuit board 22 are electrically connected through contact conduction. The first housing 11B of the first terminal 11 covers the second housing 12B of the second terminal 12 from above, like a lid. As a result, the first housing 11B is fitted onto the second housing 12B in a manner that contacts the second housing 12B. For example, the second housing 12B is fitted so that the outer side surface of the second housing 11B contacts the inner side surface of the first housing 11B. This structure is possible.

[0092] Thus, the first printed circuit board 21 and the second printed circuit board 22 are electrically connected by contact conduction. This eliminates the need for specialized processing jigs, such as those required when electrically connecting the first and second printed circuit boards 21, 22 by soldering or welding, with their main surfaces arranged substantially perpendicular to each other. This makes it possible to manufacture the power conversion device 100 relatively easily.

[0093] Implementation method 2.

[0094] Figure 5 1 is a schematic cross-sectional view showing a first example of the structure of the power conversion device according to the second embodiment. Figure 5 The power conversion device 101 of this embodiment has Figure 1 The power conversion device 100 of the first example of the embodiment 1 shown in FIG. Figure 5 In, with Figure 1 The same components are marked with the same reference numerals, and their description will not be repeated as long as the functions and materials are the same. Figure 5 In the power conversion device 101, the first resin material 13 is not provided. Figure 5 In the power conversion device 101 of the embodiment, the first resin material 14 is arranged to surround the inter-terminal contact surface 10A at a distance therefrom. In this respect, the present embodiment differs structurally from the power conversion device 100 of the embodiment 1, which includes the first resin material 13 that seals the inter-terminal contact surface 10A by covering, i.e., enveloping, the inter-terminal contact surface 10A.

[0095] The first resin material 14 is configured in such a manner as to surround the contact surface 10A between the terminals at a distance from the entire outer side of the contact surface 10A between the terminals. Therefore, the first resin material 14 is different from the first resin material 13 and is preferably not in contact with the contact surface 10A between the terminals at all. In addition, the first resin material 14 is different from the first resin material 13 and is preferably configured in such a manner as not to cover the surface of the contact piece 11A and the pin 12A in the area adjacent to the outer side of the contact surface 10A between the terminals at all. That is, the first resin material 14 is configured on the outer side of the first shell 11B and the second shell 12B embedded from the upper side of the first shell 11B. The first resin material 14 may also be configured in such a manner as to cover the outer wall surface of the first shell 11B and the second shell 12B. Even if configured in this way, at least the main body portion of the first shell 11B and the second shell 12B is clamped. Therefore, Figure 5 The first resin material 14 does not come into contact with the contact 11A, the pin 12A, and the inter-terminal contact surface 10A.

[0096] In this embodiment, both the first resin material 14 and the second resin material 15 are insulating resins. The first resin material 14 has a higher viscosity than the second resin material 15. Specifically, the viscosity of the first resin material 14 exceeds 1 Pa·s. However, the viscosity of the first resin material 14 is more preferably 10 Pa·s or greater, and even more preferably 100 Pa·s or greater. Furthermore, the viscosity of the second resin material 15 is 1 Pa·s or less.

[0097] The first resin material 14 may also be formed from a resin material such as polyphenylene sulfide (PPS) or polyetheretherketone (PEEK) containing a thermally conductive filler. Alternatively, the first resin material 14 may be formed from a rubber material such as silicone or polyurethane. The first resin material 14, which has a higher viscosity than the second resin material 15, is thermosetting. The first resin material 14 is housed within the cooling body 40 in the same manner as the first resin material 13 in the first embodiment.

[0098] Next, use Figure 6 , a method for manufacturing the power conversion device 101 according to the second embodiment will be described. Figure 6 Flowchart showing a method for manufacturing a power conversion device according to Embodiment 2. Figure 6 The power conversion device 101 of this embodiment includes a preparation step (S101), an assembly step (S201), a connection step (S301) and a sealing step (S401). The preparation step (S101) corresponds to Figure 4 The preparation process (S100) corresponds to the assembly process (S201). Figure 4 The connection process (S301) corresponds to Figure 4 The sealing step (S401) corresponds to the connection step (S300). Figure 4 Since each step is substantially the same as the corresponding step in the first embodiment, the description of the parts in which the same processing as in the first embodiment is performed in the following steps will not be repeated.

[0099] The preparation step ( S101 ) is basically the same as the preparation step ( S100 ) of Embodiment 1. The assembly step ( S201 ) is basically the same as the assembly step ( S200 ) of Embodiment 1.

[0100] The connection step (S301) is also substantially the same as the connection step (S300) of Embodiment 1. Specifically, at the inter-terminal contact surface 10A, the surface of the contact piece 11A of the first terminal 11 fixed to the first printed circuit board 21 contacts and energizes the surface of the pin 12A of the second terminal 12 fixed to the second printed circuit board 22. Furthermore, as a result, at least a portion of the second printed circuit board 22 is disposed within the container-shaped portion of the cooling element 40.

[0101] Then, the first resin material 14 is supplied from the outside of the terminal contact surface 10A, spaced apart from the formed terminal contact surface 10A, to surround the terminal contact surface 10A. The first resin material 14 is supplied to the interior of the container-shaped portion of the cooling element 40 in a manner that covers the outer surfaces of the first shell 11B and the second shell 12B that are fitted together in contact with each other. Therefore, the first resin material 14 does not penetrate into the interior of the container-shaped portions of the first shell 11B and the second shell 12B. In addition, the first resin material 14 is supplied in a manner that does not come into contact with the surfaces of the contact piece 11A of the first terminal 11 and the pin 12A of the second terminal 12.

[0102] The supplied first resin material 14 is solidified using a solidification condition corresponding to its characteristics. Thus, a solidified portion of the first resin material 14 is formed within the cooling body 40. The solidification condition corresponding to the characteristics of the first resin material 14 is preferably, for example, any one of the first, second, or third solidification conditions described above. It should be noted that, depending on the type of resin material, solidification conditions other than the first, second, or third solidification conditions described above may also be used.

[0103] The sealing step ( S401 ) is basically the same as the sealing step ( S400 ) of the first embodiment.

[0104] Next, the effects of this embodiment will be described.

[0105] The power conversion device 101 according to this embodiment includes a terminal contact surface 10A, a first resin material 14, and a second resin material 15. The terminal contact surface 10A is a surface formed by the contact between the surfaces of multiple terminals in a contact-current-carrying portion 10 (an electrical connection portion employing a contact-current-carrying method), where the surfaces of multiple terminals contact each other to conduct electricity. The first resin material 14 surrounds the terminal contact surface 10A with a gap therebetween. The second resin material 15 is disposed outside the surface of the first resin material 14.

[0106] The power conversion device 101 of this embodiment also uses a contact-type electrical connection 10. Therefore, the specialized processing jig required to connect multiple printed circuit boards by soldering or welding metal conductors is eliminated. This reduces the size of the device, which would otherwise require space to accommodate such a processing jig. Furthermore, the complication of the manufacturing process caused by the use of specialized processing jigs can be minimized.

[0107] In addition, the first resin material 14 surrounds the contact surface 10A between the terminals at a distance therefrom. Therefore, for example, when the second resin material 15 is supplied to the cooling body 40 serving as the outer shell to seal the contact surface 10A between the terminals, it is possible to prevent the second resin material 15, which is an insulating resin, from penetrating into the contact surface 10A between the terminals of the contact conductive portion 10. This is because the first resin material 14 blocks the second resin material 15 by preventing it from entering a position closer to the contact surface 10A between the terminals than the first resin material 14. Therefore, it is possible to ensure that the surfaces of the multiple terminals in the contact conductive portion 10 are in contact with each other and are in a state of being energized, and to ensure high reliability of the electrical connection between these multiple terminals.

[0108] In the power conversion device 101, the first resin material 14 is preferably arranged so as to surround the inter-terminal contact surface 10A at a distance from the entire outer surface. This can more reliably prevent the second resin material 15, an insulating resin, from penetrating the inter-terminal contact surface 10A. Consequently, the surfaces of the multiple terminals in the contact conducting portion 10 are in contact with each other and the current is maintained, ensuring a high degree of reliability in the electrical connection between these multiple terminals.

[0109] In the power conversion device 101, the first resin material 14 and the second resin material 15 are insulating resins. The viscosity of the first resin material 14 is higher than that of the second resin material 15. Such a structure is preferred. For example, in the connection process (S301), the viscosity of the first resin material 14 is made higher than that of the second resin material 15, and the first resin material 14 is arranged in a manner that surrounds the contact surface 10A between the terminals and is spaced apart from the contact surface 10A between the terminals of the contact conducting portion 10. In addition, the first resin material 14 is arranged in a manner that surrounds the contact 11A and the pin 12A and is spaced apart from the contact 11A and the pin 12A. Therefore, when the first resin material 14 is cured, due to its high viscosity, it is difficult for the first resin material 14 to penetrate into a narrow space. Therefore, the first resin material 14 with high viscosity is cured in a state where it does not penetrate into the contact surface 10A side between the terminals and is spaced apart from the contact surface 10A between the terminals in the connection process (S301). Furthermore, during the sealing step ( S401 ), when the second resin material 15 is used to seal the interior of the cooling element 40, the contact and conduction portion 10, consisting of the first terminal 11 and the second terminal 12, is surrounded by the solidified, highly viscous first resin material 14. Consequently, the second resin material 15 does not enter the contact surface 10A between the terminals. This ensures high reliability of the electrical connection at the contact surface 10A between the terminals of the contact and conduction portion 10 of the power conversion device 101.

[0110] Figure 71 is a schematic perspective view showing a modified example of the contact current-carrying portion included in the second example of the structure of the power conversion device according to the second embodiment. Figure 7 In this figure, the second terminal 12 includes two pins 12A. Thus, even when a single second terminal 12 includes multiple pins 12A, even if the first resin material 14 is arranged to surround the inter-terminal contact surface 10A of the first terminal 11 and the second terminal 12, the possibility of electrical short circuiting between the multiple pins 12A is eliminated. As a result, even if there are two or more electrical connection paths between the first printed circuit board 21 and the second printed circuit board 22, and the potentials of these electrical connection paths differ, the electrical connection between the two printed circuit boards can be consolidated at the inter-terminal contact surface 10A of the contact 11A and the pins 12A. Consequently, the power conversion device 101 of this embodiment can be miniaturized.

[0111] Furthermore, the first resin material 14 having high viscosity in this embodiment is thermosetting, and thus, the same effects as those of the first resin material 13 having thermosetting properties in the first embodiment are achieved.

[0112] The power conversion device 101 of the present embodiment further includes a cooling body 40 that accommodates at least a portion of the second printed circuit board 22, the first printed circuit board 21, the contact conducting portion 10, the first resin material 14, and the second resin material 15. The cooling body 40 is in contact with the second resin material 15. At least one of the first printed circuit board 21 and the second printed circuit board 22 is in contact with the second resin material 15. It should be noted that the contact between the cooling body 40 and the second resin material 15, and the contact between at least one of the first printed circuit board 21 and the second printed circuit board 22 and the second resin material 15, refer to, for example, thermal bonding. Such a structure is preferred. This achieves the same effects as those achieved by the aforementioned structure of the first embodiment.

[0113] Implementation method 3.

[0114] Figure 8 : is a schematic cross-sectional view showing the structure of the power conversion device according to the third embodiment. Figure 8 The power conversion device 102 of this embodiment has Figure 1 The power conversion device 100 of the first example of the embodiment 1 shown in FIG. Figure 8 In, with Figure 1 The same components are marked with the same reference numerals, and their description will not be repeated as long as the functions and materials are the same. Figure 8 In the power conversion device 102, the first resin material 13 is not provided. Figure 8In the power conversion device 102, a first resin material 16 is arranged in an area adjacent to the outside of the terminal contact surface 10A. The first resin material 16 is a conductive resin. The first resin material 16 is arranged in a manner that covers the surfaces of the contact piece 11A and the pin 12A in the area adjacent to the outside of the terminal contact surface 10A. In this way, the first resin material 16 covers the terminal contact surface 10A. Here, covering the terminal contact surface 10A is not limited to covering the terminal contact surface 10A itself, but also includes contact with the surface of the portion closest to the terminal contact surface 10A adjacent to the same terminal contact surface 10A. As a result, the first resin material 16 becomes a form that covers and seals the terminal contact surface 10A from the outside in a manner that the terminal contact surface 10A is not exposed. Therefore, the first resin material 16 is preferably sealed in a manner that covers, in other words, wraps around the terminal contact surface 10A as a whole. It should be noted that the second resin material 15 is an insulating resin.

[0115] Figure 9 This is a schematic perspective view showing an example of a contact current-carrying portion included in the structure of the power conversion device according to the third embodiment. Figure 9 In the power conversion device 102 of this embodiment (see Figure 8 ), the pin 12A of the second terminal 12 includes two pins 12Aa and a pin 12Ab.

[0116] The pins 12Aa and 12Ab form a path for supplying power between the first printed circuit board 21 and the second printed circuit board 22. In addition, the pins 12Aa and 12Ab may also form a part of a path for transmitting an electric signal between the first printed circuit board 21 and the second printed circuit board 22. In addition, another part of the path for transmitting the electric signal is, for example, the contact 11A (see Figure 2 ) etc. The transmitted electrical signal is a digital signal transmitted with two values: High (High) and Low (Low). Specifically, this electrical signal is, for example, a signal to switch the operation of power conversion device 102 on / off, or a drive signal for a switching semiconductor. Switching semiconductors include transistors, MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), thyristors, etc.

[0117] Figure 10 : is a circuit diagram showing an example of electrical connection between a first printed circuit board and a second printed circuit board included in the power conversion device according to the third embodiment. Figure 10 On the main surfaces 22a and 22b of the second printed circuit board 22 (see Figure 8) are configured on a first signal source S1 and a second signal source S2. It should be noted that the first signal source S1 is sometimes referred to as signal source S1, and the second signal source S2 is sometimes referred to as signal source S2. The output signals of each of the signal sources S1 and S2 take on either a high state or a low state, indicating no output.

[0118] The first terminals 11 are connected to the first printed circuit board 21. Figure 8 ) is provided with a receiving circuit 70. The output signal of signal source S1 is input to port 70a of receiving circuit 70 via pin 12Aa. The output signal of signal source S2 is input to port 70b of receiving circuit 70 via pin 12Ab. In other words, receiving circuit 70 is connected to pins 12Aa and 12Ab of second terminal 12, at least one of the plurality of terminals. The first signal source S1 outputs a first output signal that can be input to receiving circuit 70 via pin 12Aa, which is part of the plurality of terminals. The second signal source S2 outputs a second output signal that can be input to receiving circuit 70 via pin 12Ab, which is another part of the plurality of terminals.

[0119] The potential of the port 70 a is set to the first potential Pa. The electrical wiring connected to the port 70 a is pulled down to the signal ground 71 via the ground resistor Ra.

[0120] The potential of the port 70 b is set to the second potential Pb. The electrical wiring connected to the port 70 b is pulled down to the signal ground 71 through the ground resistor Rb.

[0121] In the following description, Figure 10 The potential of the signal ground 71 is set to 0V, which serves as a reference value. For example, when the output signal of signal source S1 is 5V, i.e., in a high state, the first potential Pa is 5V, i.e., in a high state. When the output signal of signal source S1 is in a low state, i.e., no output, the first potential Pa is pulled down by ground resistor Ra to 0V. Furthermore, for example, when the output signal of signal source S2 is 5V, i.e., in a high state, the second potential Pb is 5V, i.e., in a high state. When the output signal of signal source S2 is in a low state, i.e., no output, the second potential Pb is pulled down by ground resistor Rb to 0V.

[0122] The receiving circuit 70 determines the states of the output signals of the signal sources S1 and S2 using the potentials Pa and Pb at the ports 70a and 70b. For example, the receiving circuit 70 determines that the output signal of the signal source S1 is in a high state when the first potential Pa is higher than the high-potential threshold voltage VthH, and determines that the output signal of the signal source S2 is in a low state when the second potential Pb is lower than the low-potential threshold voltage VthL.

[0123] Here, it is assumed that the first resin material 16 is the same as the first resin material 13 and is a conductive resin with a volume resistivity of 1.0×10 -3 In the case of conductive resin with a resistance of Ω·m or less. Figure 11 This is the case where the first resin material enters so as to cover the terminal contact surface 10A in the third embodiment. Figure 10 The circuit diagram is equivalent to the circuit diagram. Figure 11 In this case, first resin material 16 forms short-circuit resistance Rs that electrically connects pin 12Aa and pin 12Ab. Furthermore, when first resin material 16 covers terminal contact surfaces 10A and enters the region sandwiched between terminal contact surfaces 10A, first resin material 16 forms resistance Rc that is inserted in series with the electrical wiring connecting pin 12Aa and port 70a. Furthermore, first resin material 16 forms resistance Rd that is inserted in series with the electrical wiring connecting pin 12Ab and port 70b.

[0124] As an example, consider a case where the first output signal of signal source S1 is 5V, i.e., high, and the second output signal of signal source S2 is no output, i.e., low. In this case, the first potential Pa is calculated using the following equation (1), and the second potential Pb is calculated using the following equation (2).

[0125] [Mathematical formula 1]

[0126]

[0127] [Mathematical formula 2]

[0128]

[0129] For example, the first output logic threshold voltage VthH of the receiving circuit 70 is set to 3V. The second output logic threshold voltage VthL of the receiving circuit 70 is set to 2V. The resistance values ​​of the grounding resistors Ra and Rb are set to 10kΩ. In addition, the short-circuit resistor Rs is composed of a 2mm long and 10mm cross-sectional area. 2 , volume resistivity is 1.0×10 -3 When the first resin material 13 is formed with a resistance of 100 mΩ·m, the resistance value of the short-circuit resistor Rs becomes 200 mΩ. In addition, when the resistor Rc and the resistor Rd are formed with a length of 1 μm and a cross-sectional area of ​​1 mm 2 , volume resistivity is 1.0×10 -3 When first resin material 13 with a resistance of 1 mΩ·m is formed, the resistance values ​​of resistors Rc and Rd become 1 mΩ. At this point, according to equations (1) and (2), first potential Pa becomes 5.0 V, and second potential Pb becomes 5.0 V. Second potential Pb is higher than second output logic threshold voltage VthL. Therefore, receiving circuit 70 cannot accurately determine the state of the output signal of signal source S2.

[0130] In order to solve the above problem, the first resin material 16 included in the power conversion device 102 of this embodiment is a conductive resin having a higher volume resistivity than the first resin material 13 of the first embodiment. The volume resistivity of the conductive resin as the first resin material 16 exceeds 1.0×10 -3 Ω·m and less than 1.0×10 9 Ω·m.

[0131] The conductive resin of the first resin material 16 has thermosetting properties. The thermosetting resin material here can be defined in the same way as the thermosetting resin material in the first embodiment.

[0132] In the power conversion device 102, the volume resistivity of the first resin material 16 is greater than 1.0×10 -3 Ω·m and less than 1.0×10 9 The value is adjusted so as to satisfy both the following conditions 1 and 2 simultaneously within the range of Ω·m.

[0133] Condition 1: When the first output signal of the signal source S1 is high and the second output signal of the signal source S2 is low, the second potential Pb calculated by equation (2) is lower than the second output logic threshold voltage VthL on the low potential side of the receiving circuit 70 .

[0134] Condition 2: When the first output signal of the signal source S1 is high and the second output signal of the signal source S2 is low, the first potential Pa calculated by equation (1) is higher than the first output logic threshold voltage VthH on the high potential side of the receiving circuit 70 .

[0135] By simultaneously satisfying the above-mentioned conditions 1 and 2, the potential difference between the first potential Pa and the second potential Pb becomes sufficiently large, so that it can be confirmed that the first output signal of the signal source S1 is in the high state and the second output signal of the signal source S2 is in the low state.

[0136] The following is a design example of the volume ratio of the first resin material 16 using the above-mentioned conditions 1 and 2. For example, the resistance values ​​of the ground resistors Ra and Rb are set to 10 kΩ. The first output signal of the signal source S1 is set to 5V, i.e., the high state, and the second output signal of the signal source S2 is set to the low state, i.e., the no output state. The first output logic threshold voltage VthH of the receiving circuit 70 is set to 3V. The second output logic threshold voltage VthL of the receiving circuit 70 is set to 2V. The volume resistivity of the first resin material 16 is set to 1.0×10 2 Ω·m.

[0137] When the short-circuit resistor Rs is composed of a length of 2mm and a cross-sectional area of ​​10mm 2, volume resistivity is 1.0×10 2 When the first resin material 16 is formed of Ω·m, the resistance value of the short-circuit resistor Rs becomes 20kΩ. In addition, when the resistors Rc and Rd are formed of a length of 1μm and a cross-sectional area of ​​1mm 2 , volume resistivity is 1.0×10 2 When the first resin material 16 of Ω·m is formed, the resistance value of the resistor Rc and the resistor Rd becomes 100Ω. At this time, according to formula (1), the first potential Pa becomes 4.9V, which is higher than the first output logic threshold voltage VthH of the receiving circuit 70, so it can be confirmed that condition 2 is satisfied. In addition, according to formula (2), the second potential Pb becomes 1.6V, which is lower than the second output logic threshold voltage VthL of the receiving circuit 70. Therefore, it can be confirmed that condition 1 is satisfied. Therefore, it can be said that it is possible to achieve a value greater than 1.0×10 -3 Ω·m and less than 1.0×10 9 The value of Ω·m satisfies both conditions 1 and 2, for example, 1.0×10 2 Ω·m, that is, the volume resistivity of the first resin material 16 is adjusted or selected. If the volume resistivity of the first resin material 16 is adjusted from more than 1.0×10 -3 Ω·m and less than 1.0×10 9 By selecting the volume resistivity of the first resin material 16 within the numerical range of Ω·m, it is possible to confirm that the first output signal of the signal source S1 is in a high state and the second output signal of the signal source S2 is in a low state.

[0138] Next, the effects of this embodiment will be described.

[0139] The power conversion device 102 according to this embodiment includes a terminal contact surface 10A, a first resin material 16, and a second resin material 15. The terminal contact surface 10A is a surface formed by the contact between the surfaces of the plurality of terminals in the contact current conducting portion 10 (an electrical connection portion of the contact current conducting method) in which the surfaces of the plurality of terminals are in contact with each other and current is conducted. The first resin material 16 seals the terminal contact surface 10A by covering the terminal contact surface 10A. The second resin material 15 is arranged on the outside of the surface of the first resin material 16. The volume resistivity of the first resin material 16 exceeds 1.0×10 -3 Ω·m and less than 1.0×10 9 Ω·m.

[0140] The power converter 102 of this embodiment achieves the same effects as the power converter 100 of the first embodiment. However, the first resin material 16 is made of a conductive resin having a higher volume resistivity than the first resin material 13. Therefore, the resistance of the first resin material 16 penetrating the inter-terminal contact surface 10A is higher than the resistance of the first resin material 13 penetrating the inter-terminal contact surface 10A in the power converter 100 of the first embodiment. As a result, when current flows through the inter-terminal contact surface 10A, the heat generated at the inter-terminal contact surface 10A of the power converter 102 of the third embodiment increases compared to the power converter 100 of the first embodiment.

[0141] The volume resistivity of the first resin material 16 in the power conversion device 102 is increased from more than 1.0×10 -3 Ω·m and less than 1.0×10 9 Select within the numerical range of Ω·m.

[0142] Condition 1: When the first output signal of the signal source S1 is high and the second output signal of the signal source S2 is low, the second potential Pb calculated by equation (2) is lower than the second output logic threshold voltage VthL on the low potential side of the receiving circuit 70 .

[0143] Condition 2: When the first output signal of the signal source S1 is high and the second output signal of the signal source S2 is low, the first potential Pa calculated by equation (1) is higher than the first output logic threshold voltage VthH on the high potential side of the receiving circuit 70 .

[0144] Furthermore, the volume resistivity of the first resin material 16 exceeds 1.0×10 -3 Ω·m and less than 1.0×10 9 The Ω·m power conversion device 102 includes a receiving circuit 70, a first signal source S1, and a second signal source S2. The receiving circuit 70 is connected to at least one of a plurality of terminals (e.g., the second terminal 12 including pins 12Aa and 12Ab). The first signal source S1 outputs a first output signal that can be input to the receiving circuit 70 via a portion of the plurality of terminals (pin 12Aa). The second signal source S2 outputs a second output signal that can be input to the receiving circuit 70 via a portion of the plurality of terminals (pin 12Ab).

[0145] The volume resistivity of the first resin material 16 is selected to satisfy Condition 1. As a result, even when there are two or more paths electrically connecting the first printed circuit board 21 and the second printed circuit board 22, and the potentials Pa and Pb of these electrical connection paths differ, the electrical connections between the two printed circuit boards 21 and 22 can be consolidated at the terminal contact surface 10A of the contact 11A and the pin 12A. As a result, the power conversion device 102 of this embodiment can be made more compact compared to a case where the electrical connections between the two printed circuit boards, the first printed circuit board 21 and the second printed circuit board 22, are not consolidated at the terminal contact surface 10A of the contact 11A and the pin 12A.

[0146] The volume resistivity of first resin material 16 is selected so as to satisfy condition 2. As a result, even when first resin material 16 enters inter-terminal contact surface 10A, receiving circuit 70 disposed on first printed circuit board 21 can accurately determine the output states of signal sources S1 and S2 disposed on second printed circuit board 22 using electrical signals transmitted via pins 12Aa and 12Ab. Consequently, the reliability of control of power conversion device 102 according to this embodiment can be improved.

[0147] Furthermore, the first resin material 16 in this embodiment has thermosetting properties. Therefore, the same effects as those of the first resin material 13 in the first embodiment having thermosetting properties are achieved.

[0148] The power conversion device 102 of the present embodiment further includes a cooling body 40 that accommodates at least a portion of the second printed circuit board 22, the first printed circuit board 21, the contact conducting portion 10, the first resin material 16, and the second resin material 15. The cooling body 40 is in contact with the second resin material 15. At least one of the first printed circuit board 21 and the second printed circuit board 22 is in contact with the second resin material 15. It should be noted that the contact between the cooling body 40 and the second resin material 15, and the contact between at least one of the first printed circuit board 21 and the second printed circuit board 22 and the second resin material 15, refer to, for example, thermal bonding. Such a structure is preferred. This achieves the same effects as those achieved by the aforementioned structure of the first embodiment.

[0149] The features described in the above-described embodiments (including the examples) may be applied in appropriate combinations within the scope of technical inconsistency.

[0150] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The present disclosure is defined by the claims rather than the above description, and is intended to include all modifications within the meaning and scope of the claims, which are equivalent thereto.

[0151] Description of Reference Numerals

[0152] 10 contact power supply portion, 10A contact surface between terminals, 11 first terminal, 11A contact piece, 11B first shell, 12 second terminal, 12A, 12Aa, 12Ab pin, 12B second shell, 13, 14 first resin material, 15 second resin material, 21 first printed circuit board, 21a, 21b, 22a, 22b, 40a, 50a main surface, 22 second printed circuit board, 30, 31, 32 electronic components, 40 cooling body, 50 insulating component, 60 fixing component, 70 receiving circuit, 70a, 70b ports, 71 signal ground, 100, 101, 102 power conversion device, S1 first signal source, S2 second signal source.

Claims

1. A power conversion device, wherein: The power conversion device comprises: an inter-terminal contact surface, the inter-terminal contact surface being a surface formed by the surfaces of the plurality of terminals contacting each other in a contact current-carrying portion where the surfaces of the plurality of terminals are in contact with each other and current is carried; a first resin material that seals the inter-terminal contact surface in a manner covering the inter-terminal contact surface; and a second resin material, the second resin material being arranged outside the surface of the first resin material, The first resin material is a conductive resin, The second resin material is an insulating resin.

2. The power conversion device according to claim 1, wherein: The first resin material seals the terminal-to-terminal contact surface so as to entirely cover the contact surface.

3. The power conversion device according to claim 1 or 2, wherein: The volume resistivity of the conductive resin constituting the first resin material is 1.0×10 -3 Ω·m or less.

4. The power conversion device according to claim 1 or 2, wherein: The plurality of terminals include: at least one contact portion, surfaces of at least one of the contact portions being in contact with each other at the inter-terminal contact surface; and The receiving portion surrounds and receives at least one of the contact portions.

5. A power conversion device, wherein: The power conversion device comprises: an inter-terminal contact surface, the inter-terminal contact surface being a surface formed by the surfaces of the plurality of terminals contacting each other in a contact current-carrying portion where the surfaces of the plurality of terminals are in contact with each other and current is carried; a first resin material surrounding the inter-terminal contact surface with a gap therebetween; and A second resin material is disposed outside a surface of the first resin material.

6. The power conversion device according to claim 5, wherein: The first resin material is disposed on the entire outer side of the inter-terminal contact surface so as to surround the inter-terminal contact surface with a gap therebetween.

7. The power conversion device according to claim 5 or 6, wherein: The first resin material and the second resin material are insulating resins, The viscosity of the first resin material is higher than that of the second resin material.

8. The power conversion device according to claim 5 or 6, wherein: The plurality of terminals include: at least one contact portion, surfaces of at least one of the contact portions being in contact with each other at the inter-terminal contact surface; and The receiving portion surrounds and receives at least one of the contact portions.

9. A power conversion device, wherein: The power conversion device comprises: an inter-terminal contact surface, the inter-terminal contact surface being a surface formed by the surfaces of the plurality of terminals contacting each other in a contact current-carrying portion where the surfaces of the plurality of terminals are in contact with each other and current is carried; a first resin material, the first resin material sealing the inter-terminal contact surface in a manner covering the inter-terminal contact surface; as well as a second resin material, the second resin material being arranged outside the surface of the first resin material, The volume resistivity of the first resin material exceeds 1.0×10 -3 Ω·m and less than 1.0×10 9 The numerical range of Ω·m is selected so as to satisfy both conditions 1 and 2. Condition 1: When the first output signal of a first signal source that outputs a first output signal that can be input to a receiving circuit via a portion of the plurality of terminals is in a high state and the second output signal of a second signal source that outputs a second output signal that can be input to the receiving circuit via another portion of the plurality of terminals is in a low state, the second potential calculated by the following formula (2) is lower than the output logic threshold voltage on the low potential side of the receiving circuit. Condition 2: When the first output signal of the first signal source is in a high state and the second output signal of the second signal source is in a low state, the first potential calculated by the following formula (1) is higher than the output logic threshold voltage on the high potential side of the receiving circuit. [Mathematical formula 1] [Mathematical formula 2] 10. The power conversion device according to claim 9, wherein: The first resin material seals the terminal-to-terminal contact surface so as to entirely cover the contact surface.

11. The power conversion device according to claim 9 or 10, wherein: The first resin material is a conductive resin, The second resin material is an insulating resin.

12. The power conversion device according to claim 9 or 10, wherein: The plurality of terminals include: at least one contact portion, surfaces of at least one of the contact portions being in contact with each other at the inter-terminal contact surface; and The receiving portion surrounds and receives at least one of the contact portions.

13. The power conversion device according to any one of claims 1 to 2, 5 to 6, and 9 to 10, wherein: The first resin material has thermosetting properties.

14. The power conversion device according to any one of claims 1 to 2, 5 to 6, and 9 to 10, wherein: The power conversion device further comprises: a first printed circuit board connected to at least one of the plurality of terminals; and a second printed circuit board connected to at least another terminal other than the one terminal among the plurality of terminals; The contact conducting portion is formed by a first terminal serving as the terminal connected to the first printed circuit board and a second terminal serving as the terminal connected to the second printed circuit board. The inter-terminal contact surface is formed in the contact and conduction portion as a portion for connecting the first terminal and the second terminal so as to contact each other.

15. The power conversion device according to claim 14, wherein: The power conversion device further includes a cooling body, the cooling body accommodating at least a portion of the second printed circuit board, the first printed circuit board, the contact conducting portion, the first resin material, and the second resin material. The cooling body is in contact with the second resin material, At least one of the first printed circuit board and the second printed circuit board is in contact with the second resin material.

16. The power conversion device according to claim 14, wherein: An electronic component is mounted on at least one of the first printed circuit board and the second printed circuit board. At least a portion of the electronic component is sealed with the second resin material.

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