Multi-specification wafer box conversion device

Abstract

The application discloses a multi-specification wafer box conversion device, which is arranged on a loading platform and is provided with a sensing mechanism for sensing whether a wafer box is loaded in place. The conversion device comprises a bottom plate arranged on the loading platform, wherein a wafer box positioning mechanism is arranged on the side of the bottom plate away from the loading platform, and a sensing trigger mechanism is arranged on the side of the bottom plate facing the loading platform; when the wafer box is placed on the bottom plate, the sensing trigger mechanism can trigger the sensing mechanism under the self-weight of the wafer box. The conversion device realizes the purpose of meeting the loading requirements of multi-specification wafer boxes, improves the utilization rate of the equipment and reduces the production cost.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a multi-specification wafer cell conversion device. Background Technology

[0002] The semiconductor industry has evolved from early 4-inch, 6-inch, and 8-inch small silicon wafer processes to 12-inch large silicon wafer processes. Correspondingly, wafer loading equipment has also evolved from small silicon wafer loading stations for 4-inch and 6-inch wafers and SMIF ports for 8-inch wafers to wafer loaders for 12-inch wafers. However, due to the requirements of related processes, some semiconductor manufacturers still retain 8-inch or smaller wafer production processes. To improve equipment utilization, it is necessary to research a conversion device that allows 12-inch wafer loaders to load 8-inch or smaller wafers. Summary of the Invention

[0003] To overcome the above-mentioned shortcomings, the present invention aims to provide a multi-specification wafer cassette conversion device that is compatible with the loading requirements of multi-specification wafer cassettes, improves equipment utilization, and reduces production costs.

[0004] To achieve the above objectives, the technical solution adopted by this invention is: a multi-specification wafer cassette conversion device, mounted on a loading platform, wherein the loading platform is equipped with a sensing mechanism for sensing whether the wafer cassette is loaded in place. The conversion device includes a base plate placed on the loading platform, a wafer cassette positioning mechanism on the side of the base plate away from the loading platform, and a sensing triggering mechanism on the side of the base plate facing the loading platform; when the wafer cassette is placed on the base plate, the sensing triggering mechanism can be activated by the weight of the wafer cassette.

[0005] In use, the base plate is placed on the loading platform, and then the wafer cassette of 8 inches or smaller is positioned on the base plate by the wafer cassette positioning mechanism. Then, the sensing mechanism is triggered by the induction triggering mechanism so that the sensing mechanism can collect the signal of the wafer cassette loading.

[0006] The beneficial effects of this invention are as follows:

[0007] When small-sized wafer cassettes (4-inch, 6-inch, or 8-inch) are placed on a loading platform designed for 12-inch wafer cassettes, their size prevents them from contacting the sensing mechanism, thus preventing the mechanism from detecting the presence of a wafer cassette. However, by adding a conversion device to the loading platform, existing platforms designed for 12-inch wafer cassettes can now also accommodate smaller wafer cassettes, meeting the needs of loading multiple wafer cassette sizes. This improves the utilization rate of the loading platform and reduces production costs.

[0008] Furthermore, the sensing trigger mechanism includes a lifting bar and a linkage trigger unit. The lifting bar is installed through the base plate and can move up and down along the base plate. The upper end of the lifting bar extends beyond the upper surface of the base plate and forms a receiving surface for supporting the wafer cassette. The linkage trigger unit is installed on the base plate and can trigger the sensing mechanism under the action of the lifting bar.

[0009] When the wafer cassette is placed on the base plate, it presses against the receiving surface and moves the lifting bar downwards, which in turn triggers the sensing mechanism. The lifting bar, extending from the upper surface of the base plate, can promptly detect the presence of a wafer cassette on the base plate. If a wafer cassette is present, the lifting bar moves downwards under its own weight, triggering the sensing mechanism. If no wafer cassette is present, the lifting bar remains at its highest point, and the sensing mechanism is not triggered. The coordination of the lifting bar and the trigger ensures that the signal from the wafer cassette is promptly transmitted to the sensing mechanism, thus avoiding the problem of the sensing mechanism failing to trigger due to the wafer cassette being too small.

[0010] Furthermore, the linkage triggering unit includes a linkage rod and a trigger rod used in conjunction. Both the linkage rod and the trigger rod are pivotally connected to the base plate, and the opposite ends of the linkage rod and the trigger rod abut against each other in the vertical direction. The ends of the linkage rod and the trigger rod that are far apart from each other abut against the lifting bar and the sensing mechanism, respectively.

[0011] Furthermore, the linkage rod includes a linkage rod body, one end of which is provided with a support extending toward the trigger rod, and the other end is provided with a linkage protrusion that can extend into the lower end face of the lifting bar.

[0012] Furthermore, the trigger lever includes a trigger lever body, one end of which is provided with a pressure plate that can press against the support platform, and the other end is provided with a trigger protrusion that can press against the sensing mechanism.

[0013] When the wafer cassette is placed on the base plate, the bottom of the wafer cassette presses against the receiving surface and causes the lifting bar to move down along the through hole. The lifting bar then presses against the linkage protrusion and causes the linkage protrusion to move down, which in turn causes the linkage rod body to rotate and causes the support platform to move up. The support platform then lifts the pressure platform, and the trigger rod body rotates and causes the trigger protrusion to move down and press against the sensing mechanism, thereby triggering the sensing mechanism.

[0014] Furthermore, the lower end face of the base plate is provided with a mounting groove for installing the linkage trigger and a through hole for moving the lifting bar, and the mounting groove and the through hole are interconnected.

[0015] Furthermore, the induction triggering mechanism also includes a lifting limit plate and a linkage limit plate. The lifting limit plate is mounted on the through hole along the lower end face of the base plate. The linkage limit plate is mounted on the mounting groove along the lower end face of the base plate, and a clearance slot is also provided on the linkage limit plate. The lifting limit plate limits the downward movement of the lifting bar, the linkage limit plate limits the rotation range of the trigger rod and the linkage rod, and the clearance slot allows for the travel of the trigger rod and the linkage rod.

[0016] Furthermore, an annular flange is integrally formed on the lower end sidewall of the lifting bar, and a stop ring plate is integrally formed on the upper end inner wall of the through hole, allowing the annular flange to abut against it. The annular flange and the stop ring plate limit the upward movement of the lifting bar.

[0017] Furthermore, the lower end of the lifting bar is also provided with a limiting groove for the linkage triggering part to abut against. The limiting groove can limit the linkage protrusion and ensure the stability of the linkage protrusion during movement.

[0018] Furthermore, the sensing triggering mechanism includes a rear position triggering plate fixed to the base plate. When the base plate is placed on the loading platform, the rear position triggering plate can directly press against the sensing mechanism.

[0019] Existing sensing mechanisms typically have three sensing points. Only when all three points are triggered simultaneously can the sensing mechanism collect the signal indicating wafer cassette loading is complete. However, because these three sensing points are relatively dispersed, using only a lifting bar and a linkage triggering unit to trigger all three points results in a complex overall structure for the conversion device. Therefore, in the design, two sensing points located on the same straight line are simultaneously triggered using a lifting bar and a linkage triggering unit, while the third sensing point is triggered directly using a rear-point triggering plate. That is, when the conversion device is placed on the loading platform, the rear-point triggering plate can directly trigger one sensing point, while the other two sensing points need to be triggered after the wafer cassette is loaded, through the cooperation of the lifting bar and the linkage triggering unit. It should be noted that in practical applications, the number of sensing points is not limited to three. When there are more than three sensing points, the conversion device can still use a lifting bar and linkage triggering unit to simultaneously trigger two sensing points located on the same straight line, while the remaining points are triggered separately using rear-point triggering plates.

[0020] Furthermore, the wafer cassette positioning mechanism includes a front positioning block, a side positioning block, and a rear positioning block mounted on the base plate. These three blocks together form a placement area for the wafer cassette. In actual installation, the position and number of the front, side, and rear positioning blocks can be adjusted according to the dimensions of the wafer cassette to ensure that when the wafer cassette is placed in the placement area, all three blocks can abut against the wafer cassette for positioning.

[0021] Furthermore, the base plate is also symmetrically equipped with handles for easy gripping. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the loading platform according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the front structure of the base plate according to an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the back side of the base plate according to an embodiment of the present invention;

[0025] Figure 4 for Figure 3 A magnified view of part A in the middle;

[0026] Figure 5 This is a schematic diagram of the induction triggering mechanism according to an embodiment of the present invention;

[0027] Figure 6 This is a top view of the conversion device according to an embodiment of the present invention when no wafer cassette is loaded;

[0028] Figure 7 This is a cross-sectional view along direction AA in the diagram;

[0029] Figure 8 for Figure 7 A magnified view of part B in the middle;

[0030] Figure 9 This is a cross-sectional schematic diagram of the conversion device of this invention when a wafer cassette is loaded;

[0031] Figure 10 for Figure 9 A magnified view of part C in the middle.

[0032] In the picture:

[0033] 1-Loading platform; 2-Wafer box;

[0034] 3-Sensing mechanism; 31-Rear sensing point; 32-Side sensing point;

[0035] 4-Base plate; 41-Through hole; 411-Stop ring plate; 42-Mounting groove;

[0036] 5-Wafer cell positioning mechanism; 51-Front positioning block; 52-Side positioning block; 53-Rear positioning block;

[0037] 61-Rear position trigger plate; 62-Linkage trigger part; 621-Linkage rod; 6211-Linkage rod body; 6212-Support; 6213-Linkage protrusion; 622-Trigger rod; 6221-Trigger rod body; 6222-Pressure table; 6223-Trigger protrusion; 63-Lifting bar; 631-Annular flange; 632-Limiting groove; 64-Lifting limiting plate; 65-Linkage limiting plate; 651-Avoidance slot;

[0038] 7- Grip. Detailed Implementation

[0039] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0040] Example

[0041] See appendix Figure 1-10 As shown, a multi-specification wafer cassette conversion device of the present invention is mounted on a loading platform 1. The loading platform 1 is equipped with a sensing mechanism 3 for sensing whether the wafer cassette 2 is loaded in place. The conversion device includes a base plate 4 placed on the loading platform 1. A wafer cassette positioning mechanism 5 is provided at the upper end of the base plate 4 (i.e., the side of the base plate 4 away from the loading platform 1), and a sensing triggering mechanism is provided at the lower end of the base plate 4 (i.e., the side of the base plate 4 facing the loading platform 1). When the wafer cassette 2 is placed on the base plate 4, the sensing triggering mechanism can trigger the sensing mechanism 3 under the weight of the wafer cassette 2.

[0042] It should be noted that the loading platform 1 and the sensing mechanism 3 are existing technologies, suitable for loading 12-inch wafer cassettes. (See attached diagram.) Figure 1As shown, the sensing mechanism 3 includes a rear sensing point 31 and two side sensing points 32 disposed on the loading platform 1. When a 12-inch wafer cassette is placed on the loading platform 1, the bottom of the 12-inch wafer cassette can simultaneously trigger the rear sensing point 31 and the side sensing points 32, thereby enabling the sensing mechanism 3 to collect a signal indicating that the wafer cassette loading is complete. However, due to size limitations, when an 8-inch or smaller wafer cassette is placed directly on the loading platform 1, the rear sensing point 31 and the side sensing points 32 cannot be triggered, thus preventing the sensing mechanism 3 from detecting whether a wafer cassette is being loaded. Therefore, in this embodiment, the conversion device first positions an 8-inch or smaller wafer cassette on the base plate 4 using the wafer cassette positioning mechanism 5, and then uses a sensing triggering mechanism to trigger the rear sensing point 31 and the side sensing points 32 of the sensing mechanism 3, so that the sensing mechanism 3 collects a signal indicating that the wafer cassette is being loaded. This allows the existing loading platform suitable for 12-inch wafer cassettes to be used for loading 8-inch or smaller wafer cassettes.

[0043] See Appendix for one example. Figure 3 As shown, the sensing triggering mechanism includes a rear position trigger plate 61, a linkage triggering part 62, and a lifting bar 63. The rear position trigger plate 61 is fixed to the base plate 4 and presses against the rear sensing point 31. The linkage triggering part 62 is correspondingly arranged with the side sensing points 32 and presses against the corresponding side sensing point 32 under the action of the lifting bar 63. The lifting bar 63 is disposed through the base plate 4 and can move up and down along the base plate 4. The upper end of the lifting bar 63 extends beyond the upper surface of the base plate 4 and forms a receiving surface for supporting the wafer cassette 2. When the wafer cassette 2 is placed on the base plate 4, the wafer cassette 2 presses against the receiving surface and moves the lifting bar 64 downward, thereby causing the linkage triggering part 62 to press against the corresponding side sensing point 32, thus triggering the side sensing point 32.

[0044] To facilitate the installation of the sensing trigger mechanism, a through hole 41 is provided on the base plate 4, penetrating both the upper and lower surfaces of the base plate 4. A mounting groove 42, corresponding to the linkage trigger part 62, is also provided at the lower end of the base plate 4, and both mounting grooves 42 are interconnected with the through hole 41. During installation, the lifting bar 63 is placed within the through hole 41 and can move up and down along it. The linkage trigger part 62 is installed in the corresponding mounting groove 42, with one end extending to the corresponding side sensing point 32 and the other end extending into the through hole 41 and abutting against the lower surface of the lifting bar 63. The connection between the mounting groove 42 and the through hole 41 allows one lifting bar 63 to drive two linkage trigger parts 62 simultaneously.

[0045] See Appendix for one example. Figure 5 , 8As shown, the linkage triggering unit 62 includes a linkage rod 621 and a trigger rod 622 for cooperative use. The linkage rod 621 includes a linkage rod body 6211 pivotally connected in the mounting groove 42. One end of the linkage rod body 6211 is integrally provided with a support platform 6212 extending towards the trigger rod 622, and the other end is integrally provided with a linkage protrusion 6213 that can extend into the through hole 41. The trigger rod 622 includes a trigger rod body 6221 pivotally connected in the mounting groove 42. One end of the trigger rod body 6221 is integrally provided with a pressing platform 6222 that presses against the support platform 6212, and the other end is integrally provided with a trigger protrusion 6223 that can abut against the side sensing point 32.

[0046] See appendix Figure 7-8 As shown, in the initial state, the wafer cassette 2 is not placed on the base plate 4, and the lifting bar 63 is at its highest point. When the base plate 4 is placed on the loading platform 1, the rear point trigger plate 61 can press against the rear sensing point 31 and directly trigger the rear sensing point 31. Although the trigger bump 6223 abuts against the side sensing point 32, its pressure on the side sensing point 32 is insufficient to trigger the side sensing point 32. See Appendix Figure 9-10 As shown, when the wafer cassette 2 is placed on the base plate 4, the bottom of the wafer cassette 2 can press against the receiving surface and drive the lifting bar 63 to move down along the through hole 41. The lifting bar 63 then presses against the linkage protrusion 6213 and drives the linkage protrusion 6213 to move down, thereby causing the linkage rod body 6211 to rotate and drive the support platform 6212 to move up. The support platform 6212 then lifts the pressure platform 6222. The trigger rod body 6221 rotates and drives the trigger protrusion 6223 to move down and press against the corresponding side sensing point 32, thereby triggering the side sensing point 32.

[0047] See Appendix for one example. Figure 3-4 As shown, the sensing trigger mechanism 6 also includes a lifting limit plate 64 and a linkage limit plate 65. The lifting limit plate 64 covers the through hole 41 along the lower end face of the base plate 4 to limit the movement range of the lifting bar 63. The linkage limit plate 65 is provided one-to-one with the mounting groove 42 and covers the corresponding mounting groove 42 along the lower end face of the base plate 4 to limit the corresponding linkage trigger part 62. In addition, in order to avoid the linkage limit plate 65 affecting the movement stroke of the linkage trigger part 62, an avoidance slot 651 is also provided on the linkage limit plate 65. When the lifting bar 63 is at the highest point of movement, the support platform 6212 and the pressure platform 6222 are partially located in the avoidance slot 651. In this embodiment, the lifting limit plate 64 and the linkage limit plate 65 are both fixed to the lower end face of the base plate by screws.

[0048] In one example, to prevent the lifting bar 63 from slipping out of the through hole 41, an annular flange 631 is integrally provided on the lower end side wall of the lifting bar 63, and a stop ring plate 411 that can abut against the annular flange 631 is integrally provided on the upper end inner wall of the through hole 41. In addition, in order to limit the linkage protrusion 6213, a limiting groove 632 for the linkage protrusion 6213 to abut is also provided at the lower end of the lifting bar 63.

[0049] See Appendix for one example. Figure 2 As shown, the wafer cassette positioning mechanism 5 includes a front positioning block 51, a side positioning block 52, and a rear positioning block 53 disposed on the base plate 4. The front positioning block 51, side positioning block 52, and rear positioning block 53 together form a placement area for placing the wafer cassette 2. In actual installation, the position and number of the front positioning block 51, side positioning block 52, and rear positioning block 53 can be adjusted according to the size specifications of the wafer cassette to ensure that when the wafer cassette is placed in the placement area, the front positioning block 51, rear positioning block 52, and side positioning block 53 can all abut against the wafer cassette 2 to position it. In this embodiment, the rear positioning block 53 is arranged in a strip shape, and only one is provided. Four side positioning blocks 52 are provided, and two front positioning blocks 51 are provided. It should be noted that the lifting bar 63 is arranged within the placement area to ensure that when the wafer cassette 2 is placed in the placement area, the lifting bar 63 can be moved.

[0050] In one example, the front positioning block 51, the side positioning block 52, and the rear positioning block 53 can all be connected to the base plate via a fine-tuning part. Taking the front positioning block 51 as an example, the fine-tuning part includes an oblong hole formed on the front positioning block 51, and a fine-tuning screw that can be threaded into the base plate 4 passes through the oblong hole. The oblong hole and the fine-tuning screw allow for fine-tuning of the installation position of the front positioning block 51 on the base plate 4, thereby improving installation accuracy.

[0051] In one example, to facilitate the loading and unloading of the base plate 4 from the loading platform 1, handles 7 are symmetrically provided on the upper end of the base plate 4.

[0052] The specific working process of this embodiment is as follows:

[0053] See appendix Figure 7-8As shown, when the base plate 4 without wafer cassette 2 is placed on the loading platform 1, the rear trigger plate 61 can directly press against the rear sensing point 31 and trigger the rear sensing point 31. The trigger bump 6223 abuts against the corresponding side sensing point 32. Since the trigger rod body 6221 is pivotally connected in the mounting groove 42, the trigger bump 6223 can be pushed upward with the support of the side sensing point 32. The pressure table 6222 then presses downward against the support table 6212, thereby causing the linkage bump 6213 to push the lifting bar 63 upward, so that the lifting bar 63 moves to the highest position. At this time, only the rear sensing point 31 is triggered, while the side sensing points 32 are not triggered. Therefore, the sensing mechanism 3 will not collect the wafer cassette loading signal. See Appendix Figure 9-10 As shown, when the wafer cassette 2 is placed in the placement area under the limiting of the wafer cassette positioning mechanism 5, the bottom of the wafer cassette 2 can abut against the receiving surface. Due to the weight of the wafer cassette 2, the lifting bar 63 moves down along the through hole 41 and drives the linkage protrusion 6213 to move down. The support platform 6212 then pushes the pressure platform 6222 upward and drives the trigger protrusion 6223 to move down and press against the side sensing point 32. The side sensing point 32 is then triggered. At this time, both the rear sensing point 31 and the side sensing point 32 are triggered, and the sensing mechanism 3 then collects the signal that the wafer cassette loading is complete.

[0054] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A multi-specification wafer cassette conversion device, disposed on a loading platform, wherein the loading platform is provided with a sensing mechanism for sensing whether the wafer cassette is loaded into position; characterized in that: The system includes a base plate placed on the loading platform. A wafer cassette positioning mechanism is located on the side of the base plate away from the loading platform, and a sensor triggering mechanism is located on the side of the base plate facing the loading platform. When the wafer cassette is placed on the base plate, the sensor triggering mechanism is activated by the weight of the wafer cassette. The sensing triggering mechanism includes a lifting bar and a linkage triggering part; the lifting bar is disposed through the base plate and can move up and down along the base plate; and the upper end of the lifting bar extends out of the upper end surface of the base plate and forms a receiving surface for supporting the wafer cassette; the linkage triggering part is installed on the base plate and can trigger the sensing mechanism under the action of the lifting bar.

2. The multi-specification wafer cell conversion device according to claim 1, characterized in that: The linkage triggering unit includes a linkage rod and a trigger rod used in conjunction. The linkage rod and the trigger rod are both pivotally connected to the base plate, and the opposite ends of the linkage rod and the trigger rod abut against each other in the vertical direction. The ends of the linkage rod and the trigger rod that are far apart from each other abut against the lifting bar and the sensing mechanism, respectively.

3. The multi-specification wafer cell conversion device according to claim 2, characterized in that: The linkage rod includes a linkage rod body, one end of which is provided with a support extending toward the trigger rod, and the other end is provided with a linkage protrusion that can extend into the lower end face of the lifting bar.

4. The multi-specification wafer cell conversion device according to claim 3, characterized in that: The trigger rod includes a trigger rod body, one end of which is provided with a pressure plate that can press against the support platform, and the other end is provided with a trigger protrusion that can press against the sensing mechanism.

5. The multi-specification wafer cell conversion device according to any one of claims 1-4, characterized in that: The lower end surface of the base plate is provided with a mounting groove for mounting the linkage trigger and a through hole for moving the lifting bar, and the mounting groove and the through hole are interconnected.

6. The multi-specification wafer cell conversion device according to claim 5, characterized in that: The sensing triggering mechanism also includes a lifting limit plate and a linkage limit plate. The lifting limit plate covers the through hole along the lower end face of the base plate. The linkage limit plate covers the mounting groove along the lower end face of the base plate, and the linkage limit plate is also provided with an avoidance groove.

7. The multi-specification wafer cell conversion device according to claim 5, characterized in that: An annular flange is integrally provided on the lower end side wall of the lifting bar, and a stop ring plate is integrally provided on the upper end inner wall of the through hole, which can be abutted against by the annular flange.

8. The multi-specification wafer cell conversion device according to claim 7, characterized in that: The lower end of the lifting bar is also provided with a limiting groove for the linkage triggering part to abut against.

9. The multi-specification wafer cell conversion device according to claim 1, characterized in that: The sensing triggering mechanism includes a rear position triggering plate fixed to the base plate. When the base plate is placed on the loading platform, the rear position triggering plate can directly press against the sensing mechanism.

10. The multi-specification wafer cell conversion device according to claim 1, characterized in that: The wafer cassette positioning mechanism includes a front positioning block, a side positioning block, and a rear positioning block disposed on the base plate. The front positioning block, the side positioning block, and the rear positioning block together form a placement area for placing the wafer cassette.

11. The multi-specification wafer cell conversion device according to claim 1, characterized in that: The base plate is also symmetrically equipped with handles for easy gripping.

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