Component carrier and method for manufacturing the same

Abstract

A component carrier (100) and a method for manufacturing the component carrier are provided. The component carrier comprises: a stack (102) comprising a plurality of conductive layer structures (104) and / or electrically insulating layer structures (106); and a component (108) embedded in the stack (102), wherein at least a portion of a side wall (110) of the component (108) is exposed so that the side wall (110) of the component (108) can be used to establish a connection or coupling.

Description

[0001] This application is a divisional application of an invention patent application with an application date of August 3, 2018, an application number of 201810878356.3, and an invention name of “Component embedded in a component carrier and having exposed side walls”. Technical Field

[0002] The invention relates to a method for producing a component carrier and to a component carrier. Background Art

[0003] In the context of the growth of product functionality of component carriers equipped with one or more electronic components and the increasing miniaturization of such electronic components as well as the increasing number of electronic components to be mounted on component carriers such as printed circuit boards, increasingly more powerful array components or packages with several electronic components are being used, which have a plurality of contacts or connections, wherein the spacing between these contacts is increasingly smaller. Removing the heat generated by such electronic components and the component carriers themselves during operation is becoming an increasingly prominent problem. At the same time, the component carriers should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions. In addition, users demand an extended functionality of component carriers with embedded components. Summary of the invention

[0004] The object of the present invention is to integrate components in a component carrier in such a way that efficient and reliable operation is permitted while enabling a high degree of functionality.

[0005] In order to achieve the objects defined above, a method for producing a component carrier and a component carrier according to embodiments of the invention are provided.

[0006] According to an exemplary embodiment of the present invention, a component carrier is provided, comprising a stack including a plurality of electrically conductive layer structures and / or electrically insulating layer structures, and a component embedded in the stack; wherein at least a portion of a side wall of the component is exposed (e.g., exposed to the environment of the component carrier).

[0007] According to another exemplary embodiment of the present invention, a method for manufacturing a component carrier is provided, wherein the method comprises: forming a stack of a plurality of electrically conductive layer structures and / or electrically insulating layer structures, embedding a component in the stack, and subsequently removing material of the stack to thereby expose at least a portion of a side wall of the component.

[0008] In the context of the present application, the term "component carrier" may particularly denote any supporting structure on which and / or in which one or more components can be accommodated for providing mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical and / or electronic carrier for the components. In particular, the component carrier may be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different component carriers of the above-mentioned types of component carriers.

[0009] In the context of the present application, the term "embedded component" may particularly denote any body or component which does not have the shape of the layer structure of the layer stack and has smaller dimensions than the layer structure of the layer stack, which is accommodated in the interior of the component carrier material, i.e. the stack material, for example, a resin with reinforcing particles such as a dielectric material and copper as the conductive material. Accommodating the component in the component carrier material may be achieved by lamination, i.e. applying pressure and / or heat for integrally connecting the constituent parts of the component carrier.

[0010] In the context of the present application, the term "exposed side wall" may particularly denote a lateral side wall portion of a component embedded in a component carrier material, which lateral side wall portion is not covered by the component carrier material, in particular is not completely covered by the solid material. Thereby, the exposed side wall of the component may integrally form a part of the exposed surface of the component carrier. When the component carrier is formed as a plate with two opposite main surfaces and a periphery, the side wall may form a part of the periphery or may be substantially parallel to the periphery and may be perpendicular to the main surfaces of the component carrier.

[0011] According to an exemplary embodiment of the invention, a component carrier is provided with an embedded component, which is exposed laterally, i.e. at its side walls. This can be achieved in a very accurate manner by removing the material of the stack of connected layer structures in which the component is embedded after completion of the embedding procedure, so as to expose the lateral side surfaces. By taking this measure, it becomes possible to functionally use the side walls of the component to establish a connection or coupling to the environment, for example for sensor or optoelectronic applications. The upper main surface and the lower main surface of the stack and therefore of the component carrier can thus remain available for mounting further components, etc. The described architecture thus makes it possible to keep the component carrier compact without jeopardizing its functionality. On the contrary, the lateral side surfaces of the component carrier can be used as functional parts of the component.

[0012] In the following, further exemplary embodiments of a method and a component carrier will be explained.

[0013] In one embodiment, the exposed sidewalls are aligned with the sidewalls of the stack to form a substantially continuous (e.g. substantially vertical) sidewall of the component carrier. In other words, the exposed sidewalls of the component and the sidewalls of the stack can be aligned or flush with each other. This prevents undercuts at the sidewalls of the component carrier where contaminants such as dust may collect.

[0014] In another embodiment, the approach recess that exposes the sidewall extends laterally from the lateral sidewall of the stack until the lateral sidewall of the component. In this embodiment, the exposed sidewall of the component can be spaced apart from the sidewall of the component carrier. This architecture can be advantageous, for example, when establishing a mechanical, optical, electrical or electro-optical coupling of the exposed component with a peripheral edge via an electrical cable or optical cable. For example, an electrical conductor or optical fiber can be inserted into the approach recess to establish electrical, optical and / or electro-optical coupling.

[0015] In another embodiment, the near recess that makes sidewall exposed extends from one main surface of stack or two opposite main surfaces until parts. In other words, near recess can be formed as (blind or through) hole, this hole can extend from one main surface of two opposite main surfaces at least to embedded parts or even until another main surface. In this embodiment, embedded parts keep being safely mechanically protected in stack inside, and simultaneously be functionally coupled to the external environment of component carrier. For example, this embodiment can be used for gas sensor, chemical sensor or humidity sensor with its sensitive surface at the exposed sidewall of parts.

[0016] In one embodiment, the approach recess is a slit extending into the central part of the stack. Preferably, the slit has a length greater than the width. For example, the length can be at least twice the width. Such a slit can have a length significantly greater than the width (in particular, at least five times). The longer extension direction of the slit can correspond to the horizontal extension direction of the side wall of the component, although the short extension direction can extend perpendicular to the side wall of the component. Such a slit can be formed simply by drilling, milling or laser cutting perpendicular to the main surface of the component carrier.

[0017] In an embodiment, the access recess is configured as one of the group consisting of: a through hole extending through the entire stack, and a blind hole.

[0018] In one embodiment, only one main surface of the component, and in particular of the substantially cuboid component, is exposed. In other words, the five main surfaces of the substantially cuboid component can remain covered by the component carrier material of the component carrier and can therefore be suitably mechanically protected. The only exposed side wall in this case can then allow the interface properties between the component and the environment to be precisely defined.

[0019] In one embodiment, the components are arranged in a transversely asymmetrical manner in the receiving cavity of the stack, in particular at different distances with respect to the opposite receiving cavity-delimiting side walls of the stack. This has the advantage that the side of the cavity at a smaller distance from the component serves to safely define the position of the component in the component carrier (for example by forming a lateral abutment surface for the component), wherein the other side wall of the cavity at a greater distance from the component allows the side wall of the component to be exposed even by processing with relatively low spatial accuracy. In other words, the greater distance value corresponds to the tolerance allowed when exposing the side wall of the component by cutting through the greater distance.

[0020] In one embodiment, the component includes a sensor configured to sense sensor information via an exposed surface. In other words, the exposed surface may include at least a sensitive portion for detecting a medium to be sensed. Such a medium may be electrical, electromagnetic radiation (particularly visible light), or a substance (such as a gas, liquid, or any other chemical). Thus, exposing the lateral sidewalls or surfaces of the component allows for manufacturing a component carrier with integrated sensor functionality in a compact manner.

[0021] In one embodiment, the component includes an electromagnetic radiation source configured to emit electromagnetic radiation via an exposed surface. In such an embodiment, the component carrier is capable of generating electromagnetic radiation that is emitted toward the environment or a communication partner device (e.g., a receiver) via an exposed surface. For example, the component can be a laser diode or any other light source.

[0022] In one embodiment, the component carrier comprises a further component embedded in the stack, wherein the component and the further component are communicatively coupled, in particular at least partially coupled via the access recess. For example, the further component can be coupled to the aforementioned component via the access recess. For example, one of the component and the further component can be a transmitter (e.g. an optical transmitter) and the other of the component and the further component can be a receiver (e.g. an optical receiver).

[0023] In one embodiment, the component and the additional component are configured as a pair of electromagnetic radiation emitters (e.g., capable of generating electromagnetic radiation in the visible, infrared and / or UV ranges) and an electromagnetic radiation detector (e.g., capable of sensing electromagnetic radiation in the visible, infrared and / or UV ranges), a pair of light guides (such as optical fibers) and light emitters (such as laser diodes), or a pair of light guides (such as optical fibers) and light detectors (such as photodiodes).

[0024] In one embodiment, at least one of the electrical insulating layer structures that are in direct contact with or adjacent to the embedded component (particularly directly arranged on and / or below the component) is made of low-flow prepreg or non-flow prepreg. However, FR4 material can also be used. Advantageously, non-flow prepreg or low-flow prepreg will not or substantially not remelt (re-melt, remelt) / do not become flowable during lamination, so that the hole near the component will not be closed by liquefied resin, etc. during lamination, and the side wall to be exposed can remain without resin material. When the stack corresponding to the mechanical pressure and / or thermal lamination is applied, the material of the low-flow prepreg or non-flow prepreg is advantageously prevented from flowing into the hollow space between the component and the layer stack. The side wall of the component is exposed by subsequently removing (e.g., cutting) the adjacent hollow space of the stack to expose the side wall of the component, and the formation of the component carrier with the embedded component can be completed, and the embedded component has the exposed side wall. This procedure simplifies the exposure of the side wall of the component, for example, by milling.

[0025] In one embodiment, embedding the component into the stack includes arranging the component in direct contact with the plurality of conductive layer structures and / or electrically isolating layer structures, so that at least five surfaces of the component are covered by the stack. Thus, the orientation of the component relative to the stack can be made more precise and / or the sensitivity of the component to external impact can be reduced.

[0026] In one embodiment, the component is embedded in the stacking body and comprises: forming a housing cavity (i.e., a hollow space for installing the component) in at least one layer structure of the stacking body, and placing the component in the housing cavity. The placement mentioned later can be carried out asymmetrically in the lateral direction so that the two relative gaps between the corresponding side walls of the component and the stacking body have different sizes. The housing cavity can be formed, for example, by using a pre-cut core, by mechanical drilling or laser drilling, or by applying the concept of a release (release, demoulding) layer. This release layer can be a layer (e.g., made of waxy (waxy) material) to which other stacking body component carrier materials cannot be properly adhered. Cutting a hole closed by the periphery above this release layer can therefore allow a piece of stacking body to be taken out above the release layer, so as to complete the formation of the cavity.

[0027] In one embodiment, the component is placed in the accommodating cavity so that the size of the gap between the side wall of the component and the accommodating cavity-defining side wall of the stack is different from the other size of the other gap between the opposite other side wall of the component and the opposite other accommodating cavity-defining side wall of the stack. At the side wall of the component that will not be exposed after embedding, the size of the gap should be as small as possible to accurately define the position of the component in the component carrier. In contrast, at the opposite other side wall of the component that will be exposed later, the size of the gap can be advantageously larger, so that the accuracy of removing material to expose the component on its corresponding side does not need to be very high. This eases the requirements for spatial accuracy in exposing the side wall during the removal of stacked material.

[0028] In one embodiment, the method further comprises: filling at least a portion of the gap between the sidewalls defined by the accommodating cavity of the component and the stack with a removable sacrificial material, and at least partially removing the sacrificial material after the embedding is completed, in particular to expose the sidewalls thereby. In this context, the term "sacrificial material" may particularly refer to an auxiliary material that is provided only for temporary use and is intentionally removed later so that it does not form part of the final product, i.e., the component carrier. In the present embodiment, the sacrificial material is provided to prevent the component from migrating in the cavity because the free gap of the cavity can be filled with the sacrificial material. The sacrificial material may temporarily cover the sidewalls to be exposed later, but may be easily removed from the sidewalls. The sacrificial material may therefore have the property that it can be easily removed with respect to the component material, so that the sacrificial material may be removed later to expose the sidewalls of the component without damaging the component and without applying a complex removal procedure.

[0029] In one embodiment, the method further comprises inserting the component into the first portion of the receiving cavity, and subsequently filling the sacrificial material into at least a portion of the remaining second portion (e.g., gap) of the receiving cavity that is laterally juxtaposed to the first portion. Thus, the component can first be placed in the receiving cavity, and the remaining gap can be partially or entirely filled with the sacrificial material, for example, using a wiper. This embodiment has the advantage that a single cavity formation process is sufficient to provide a receiving volume for both the sacrificial material and the component.

[0030] In an alternative embodiment, the method further comprises: forming a first cavity (which may later constitute a gap) in the stack, and filling the first cavity at least partially with a sacrificial material. Subsequently, the second cavity may be formed separately in the stack and overlap with the first cavity. In other words, the second cavity may be composed of a portion of the first cavity and a portion of the removed adjacent portion of the stack. Then, the component may be inserted into the second cavity so that the first cavity at least partially filled with the sacrificial material and the second cavity for accommodating the component together constitute the accommodating cavity. Therefore, the first cavity may be formed in the stack and filled with sacrificial material, for example, using a stripping pliers. Optionally, then, the sacrificial material may be cured. Then, a second cavity (or a second cavity of the accommodating cavity) partially overlapping with the first cavity may be formed and formed separately thereafter. In this scenario, a portion of the sacrificial material in the overlapping volume may also be removed. Then, the component may be placed in the second cavity. The advantage of this embodiment is that the process of applying the sacrificial material is simplified and rendered more accurate because it may be applied to the first cavity of relatively large size, and is not limited to the small gap between the component and the side wall of the stack close to the cavity. Another advantage of this approach is that a possible curing process for curing the sacrificial material can be carried out prior to inserting the component so that the component is not damaged by the curing conditions (eg elevated temperatures).

[0031] In one embodiment, the sacrificial material comprises one of the following groups: a release structure with non-adhesive properties about the materials of the stack and the components, a volatile liquid, a liquid that can be washed away, and a substance that can be dissolved (e.g., water or an aqueous solution). Such a release structure can be, for example, made of a waxy material or can be made based on Teflon. Suitable volatile liquids are water or alcohol. The liquid that can be washed away can basically be any liquid that can be removed from the gap later by applying pressurized gas, etc. to expose the sidewalls.

[0032] In one embodiment, the method further comprises: providing the component with a removable sacrificial material, in particular a release structure, before embedding; subsequently embedding the component with the removable sacrificial material thereon into the stack; and at least partially removing the sacrificial material after embedding is completed, in particular to thereby expose the sidewalls. Thus, the release layer or the further sacrificial material can be applied directly to the component before starting the embedding procedure. This renders the application of the sacrificial material in the tiny gaps unnecessary.

[0033] In one embodiment, removing material of the stack includes at least one of the group consisting of milling and laser cutting.For example, edge sections of the component carrier may be removed by milling or laser cutting to thereby expose the sidewalls of the component.

[0034] In one embodiment, the size of the lateral gap between the component and the side wall defining the receiving cavity of the stack is at least 50 μm, in particular at least 300 μm, more particularly at least 500 μm. For example, the size of the lateral gap may be in the range between 5 μm and 500 μm. This allows the implementation of a material removal procedure with low accuracy requirements.

[0035] In one embodiment, the embedding of the component comprises laminating the component with the stack so that at least part of the uncured material of the layer structure is cured. Curing can be established, for example, by pressurizing or heating a curable resin, which begins to crosslink. During curing, the resin temporarily melts, flows into a tiny gap, solidifies again and is thus interconnected with the various components of the component carrier. Thus, a common integrated connection between the stack and the component can be ensured, and therefore the high mechanical integrity of the component carrier as a whole can be ensured.

[0036] In one embodiment, forming the stack includes attaching a temporary carrier to the layer structure when the layer structure is still under conditions including at least partially uncured material. In one embodiment, the temporary carrier includes a sticky surface facing the component carrier material and the recess or cavity. Providing a sticky surface for the temporary carrier simplifies the connection of the temporary carrier on the component carrier material, in particular a core with a through hole closed by the temporary carrier. In one embodiment, the temporary carrier includes a rigid board. Advantageously, the temporary carrier has a rigid board that provides a semi-finished product, which still includes a temporary carrier with additional stability during a lamination procedure, by which additional layers are established. However, as an alternative to a rigid board (preferably with a sticky upper surface), it is also possible that the temporary carrier is a flexible sticky foil or tape.

[0037] In one embodiment, the temporary carrier is removed from the stack after curing the at least partially uncured material of the layer structure. After curing, the previously uncured material has cured and hardened, and the mechanical support provided by the temporary carrier after the lamination and curing process is completed may be unnecessary. For example, after lamination, the temporary carrier can simply be peeled off the semi-finished product.

[0038] In an embodiment, the component comprises an electromagnetic radiation emitting member (such as a light emitting diode) which is configured to emit electromagnetic radiation (such as visible light), more particularly via its side surface, and which is at least partially covered by an optically transparent (particularly transparent in the visible range) material which at least partially forms an exposed side wall and is transparent to the electromagnetic radiation emitted by the electromagnetic radiation emitting member. The transparent material may, for example, encapsulate the electromagnetic radiation emitting member and may thus simultaneously protect the electromagnetic radiation emitting member while enabling electromagnetic radiation to propagate out of the component carrier through the transparent material via the side wall of the component carrier. Preferably, the transparent material may be a resin (suitably compatible with other component carrier materials of the stack) free of fibers (which may deteriorate the undisturbed propagation of electromagnetic radiation) or the like.

[0039] In one embodiment, at least a portion of the transparent material at least partially forming the exposed sidewall is polished. Polishing the exposed sidewall of the transparent material to reduce its roughness has the particular advantage that undesirable diffraction processes at the transition region between the transparent material and the surroundings of the component carrier can be strongly suppressed. Such scattering can unintentionally and undesirably increase the cross-sectional area of ​​the propagating beam of electromagnetic radiation, which may involve losses. However, when the flat exposed sidewall is polished, diffraction can be suppressed and a substantially parallel beam can propagate out of the component carrier, so that losses can be reduced.

[0040] The mentioned components to be mounted on the component carrier surface or embedded in the component carrier and optionally at least one further component can be selected from the group consisting of: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), a light-conducting element (such as an optical waveguide or optical conductor connection), an electronic component, or a combination thereof. For example, the components can be active electronic components, passive electronic components, electronic chips, storage devices (such as DRAM or another data storage), filters, integrated circuits, signal processing components, power management components, optoelectronic interface elements, voltage converters (such as DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, micro-electromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antenna structures, logic chips, light guides, and energy harvesting units. Further components can then be embedded in the component carrier. For example, magnetic elements can be used as components. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element or a ferrimagnetic element, for example a ferrite coupling structure) or may be a paramagnetic element. The component may then also be another component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and / or may be embedded in the interior of the component carrier. Furthermore, other components may also be used as components.

[0041] In one embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned electrically insulating layer structure and the electrically conductive layer structure, which laminate is formed in particular by applying mechanical pressure, if desired supported by thermal energy. The mentioned stack can provide a plate-like component carrier that can provide a large mounting surface for further components and is still very thin and compact. The term "layer structure" can in particular denote a continuous layer, a patterned layer or a plurality of discontinuous islands in a common plane.

[0042] In one embodiment, the component carrier is formed as a plate. This contributes to a compact design, wherein the component carrier provides a large base for mounting components thereon. In addition, in particular, bare wafers as an example of embedded electronic components can be easily embedded in thin boards such as printed circuit boards due to their small thickness.

[0043] In an embodiment, the component carrier is configured as one of the group consisting of a printed circuit board and a substrate, in particular an IC substrate.

[0044] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a component carrier (which may be plate-shaped (i.e., planar), three-dimensionally curved (e.g. when manufactured using 3D printing) or which may have any other shape) formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, the lamination being performed, for example, by applying pressure, if desired accompanied by the supply of thermal energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fibers, so-called prepregs or FR4 materials. The electrically conductive layer structures may be connected to each other in a desired manner by forming through holes through the laminate, for example by laser drilling or mechanical drilling, and by filling the through holes with an electrically conductive material, in particular copper, thereby forming vias as through-hole connections. In addition to one or more components that may be embedded in the printed circuit board, the printed circuit board is typically configured to accommodate one or more components on one surface or on two opposite surfaces of the plate-shaped printed circuit board. They may be connected to the respective main surfaces by soldering. The dielectric part of the PCB may consist of a resin with reinforcing fibers, such as glass fibers.

[0045] In the context of the present application, the term "substrate" may particularly denote a small component carrier having substantially the same size as the components to be mounted thereon (particularly electronic components). More specifically, a substrate may be understood as a carrier for electrical connectors or electrical networks and a carrier for connectors arranged laterally and / or vertically that is comparable to a printed circuit board (PCB) but has a relatively high density. The lateral connectors are, for example, conductive paths, while the vertical connectors may be, for example, drill holes. These lateral and / or vertical connectors are arranged in the substrate and may be used to provide electrical and / or mechanical connections between accommodated components or non-accommodated components (such as bare wafers), in particular IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes an "IC substrate". The dielectric portion of the substrate may be composed of a resin having reinforcing spheres (such as glass spheres).

[0046] In one embodiment, the at least one electrically insulating layer structure comprises at least one of the group consisting of: resins (such as reinforced resins or non-reinforced resins, for example epoxy resins or bismaleimide-triazine resins, more specifically FR-4 or FR-5), cyanates, polyphenylene derivatives, glass (especially glass fibers, multilayer glass, glass-like materials), prepreg materials, polyimides, polyamides, liquid crystal polymers (LCPs), epoxy-based laminated films, polytetrafluoroethylene (Teflon), ceramics, and metal oxides. Reinforcing materials such as meshes, fibers, or spheres made of, for example, glass (multilayer glass) may also be used. Although prepregs or FR4 are generally preferred, other materials may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate resins may be implemented as electrically insulating layer structures in component carriers.

[0047] In one embodiment, the at least one conductive layer structure comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium and tungsten. Although copper is generally preferred, other materials or coated variations thereof are also possible, in particular coated with superconducting materials such as graphene.

[0048] In one embodiment, the component carrier is a laminate. In this embodiment, the component carrier is a composite of multilayer structures that are stacked and connected together by applying a pressing force, if desired accompanied by heat.

[0049] The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figures 1 to 3 A cross-sectional view of a preform of a component carrier produced according to an exemplary embodiment of the present invention is shown.

[0051] Figures 4 to 8 FIG. 1 shows a method for manufacturing a Figure 8 A cross-sectional view of the structure obtained during the component loading is shown in FIG.

[0052] Figures 9 to 12 A cross-sectional view of a structure obtained during the production of a component carrier according to a further exemplary embodiment of the invention is shown.

[0053] Fig.13 and Fig.14 A component carrier according to a further exemplary embodiment of the invention is shown in cross-section and in plan view.

[0054] Fig.15A cross-sectional view of a component carrier according to a further exemplary embodiment of the invention is shown.

[0055] Fig.16 A cross-sectional view of a component carrier according to a further exemplary embodiment of the invention is shown.

[0056] Figures 17 to 20 A cross-sectional view of a structure obtained during the production of a component carrier according to a further exemplary embodiment of the invention is shown.

[0057] Fig.21 A cross-sectional view of three component carriers arranged side by side according to a further exemplary embodiment of the invention is shown.

[0058] Fig. 22 An embodiment showing a light emitting diode emitting light through a transparent material is shown.

[0059] Figure 23 to Figure 25 shows different structures obtained during the production of a component carrier according to an exemplary embodiment of the invention, in Fig.26 The component carrier is shown in operation.

[0060] Fig. 27 An exemplary embodiment of the present invention includes Fig.26 The components shown are carriers for glasses. DETAILED DESCRIPTION

[0061] The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference numerals.

[0062] Before describing the exemplary embodiments in further detail with reference to the accompanying drawings, some basic considerations upon which the exemplary embodiments of the present invention were developed will be outlined.

[0063] According to an exemplary embodiment, a component carrier with an embedded component having a lateral opening is provided. Exposing the component on one side has the advantage that new embedding opportunities become possible. For example, plug-in connections and optical connections can be realized in this way. As a result, it becomes possible to expose the embedded component from the component carrier at the side wall of the component with high spatial accuracy.

[0064] The main point of an exemplary embodiment is that the embedded component can be exposed at its flange surface with high position accuracy. Advantageously, the manufacturing method can be configured so that the component to be exposed at its side surface is preferably not covered by resin at the side surface. In one embodiment, it can be ensured that the side wall surface of the embedded component remains without any material. This can be achieved, for example, by using a channel or hollow space of a non-flowable prepreg or a low-flowable prepreg for lamination around the embedded component. In another embodiment, the side wall can be temporarily covered with the following kinds of sacrificial materials, which can be selectively and simply removed by implementing a simple technical method later. For example, a release material patch that fixes the component in place at the desired position can be arranged near the component. Then, after the material of the stack of the conductive layer structure and / or the electrical insulation layer structure has been removed to expose the side wall, the material of the release material patch can be simply removed. What all these concepts have in common is that they allow the side wall of the component embedded in the component carrier material to be exposed with high accuracy. This manufacturing configuration increases the flexibility of designing component carrier type modules with improved functionality.

[0065] Figure 1 A cross-sectional view of a preform of a component carrier 100 , here embodied as a printed circuit board (PCB), produced according to an exemplary embodiment of the invention is shown.

[0066] Can be used with Figure 1 The structurally separated plate-like laminated component carrier 100 comprises a laminate stack 102 of component carrier material, which includes a plurality of electrically conductive layer structures 104 (embodied here as patterned metal foils and metal vias, both preferably made of copper) and a plurality of electrically insulating layer structures 106 (embodied here as resin layers, in particular epoxy resin layers with reinforcing fibers, in particular glass fibers, such as prepreg).

[0067] Furthermore, the component carrier 100 comprises an electronic component 108, which can be, for example, a semiconductor chip. The electronic component 108 can be electrically coupled to an electronic environment via the electrically conductive layer structure 104. The component 108 is embedded in the component carrier material of the stack 102. Figure 1 , the sidewalls 110 of the component 108 are still surrounded by the material of the stack 102. However, in Figure 11 shows a milling tool 121 which is currently in the process of removing material of the stack 102 located on the right-hand side of the milling tool 121 from the remaining material of the stack 102 located on the left-hand side of the milling tool 121. As a result of this milling procedure, a component carrier 100 with an embedded component 108 with an exposed side wall 110 is obtained. More specifically, after separation by milling, the side wall 110 of the component 108 is exposed to the environment of the component carrier 100, so that the side wall 110 subsequently forms a part of the outer lateral side wall of the component carrier 100.

[0068] By first cutting a cavity in the core 123 (ie the fully cured resin material of the electrically insulating layer structure 106) (see Figure 4 The reference numeral 122 in FIG. 122) as the accommodation volume for the component 108 can be obtained according to Figure 1 The manufactured component carrier 100. Figure 1 As can be seen from the detailed diagram 131 in FIG. 1 , the size of the cavity can be selected so that after the component 108 is placed in the cavity, Figure 1 On the right-hand side of the component 108, a gap 126 of dimension D having a thickness of, for example, 500 μm is maintained (between the side wall 110 of the component 108 and the side wall 112 defining the receiving cavity of the stack 102). On the other hand, the gap 126 located on the opposite side of the component 108, i.e., located according to Figure 1 The additional gap 129 on the left hand side can have a significantly smaller size of, for example, 75 μm. This increases the accuracy of the positional placement of the component 108 in the component carrier 100. Thereafter, a temporary carrier (e.g., tape) can be placed on the bottom surface of the core 123 to close the cavity on the bottom side. Thereafter, the component 108 is fixed in the cavity and on the temporary carrier. Then, a dielectric layer can be laminated on top of the component 108 and the top of the core 123 from the upper side. The dielectric layer can preferably be made of a non-flowable prepreg or a low-flowable prepreg so as to prevent the prepreg material that melts during lamination and flows into the corresponding gaps 126, 129 from filling the mentioned gaps 126, 129 during lamination. When a non-flowable prepreg or a low-flowable prepreg is used above or below the gaps 126, 129, this flow of the resin can be prohibited or at least strongly suppressed. This prevention of the flow of resin material, particularly into gaps 126, greatly simplifies the subsequent exposure of sidewalls 110 of component 108 by milling. Because gaps 126 remain free of resin, sidewalls 110 of component 108 are free of resin after the exposure procedure.

[0069] Figure 2 A cross-sectional view of a preform of a component carrier 100 produced according to another exemplary embodiment of the present invention is shown.

[0070] Figure 2Implementation plan and Figure 1 The embodiment of is different in that the removal of material of the stack 102 for exposing the side walls 110 of the embedded components 108 of the component carrier 100 is performed by laser cutting instead of by milling. Figure 2 Implementation plan and Figure 1 The embodiment differs in that the gap 126 mentioned is filled with a patch of release material, such as according to Figure 2 The sacrificial material 128 of the release material patch can be made of a wax material or formed on the basis of Teflon. After the component carrier 100 is separated from the conductive layer structure 104 and the electrically insulating layer structure 106 located on the right side of the schematically shown laser cutting tool 125, the sacrificial material 128 embodied as a release material patch can be easily removed due to its poor adhesion to the component carrier material and the component 108. Thereafter, the side wall 110 of the component 108 is exposed from the sacrificial material 128 and then forms part of the lateral side surface of the component carrier 100.

[0071] More specifically, the core 123 may be provided with a cavity as a receiving volume for the component 108 by first cutting a cavity in the core 123. Figure 2 The dimensions of the cavity can be selected so that after the component 108 is placed in the cavity, the component carrier 100 is manufactured according to Figure 2 The right hand side of the core 123 maintains a gap 126 of a size of, for example, 100 μm thickness. Thereafter, a temporary carrier (e.g., tape) may be placed on the bottom surface of the core 123 for closing the cavity from the bottom side. Thereafter, the component 108 is fixed in the cavity and on the temporary carrier. Then, a sacrificial material 128 in the form of a release material patch may be inserted into the gap 126 of the cavity, for example, by a demolding pliers, and cured. The release material patch prevents the resin material from adhering to the side wall 110 of the component 108 to be exposed. A dielectric layer may be laminated on the top of the component 108 and the top of the core 123 from the upper side. The dielectric layer may be made of a common prepreg, a non-flowable prepreg, or a low-flowable prepreg. Here, regardless of the type of prepreg used, the presence of the sacrificial material 128 prevents the filling of the mentioned gap 126 during lamination. Then, the temporary carrier may be removed and additional lamination procedures (e.g., using additional prepreg foils and additional copper foils) may be implemented on the bottom side.

[0072] Then, the gap 126 filled with the sacrificial material 128 can be opened by laser cutting using the laser cutting tool 125, and the material of the release material patch can be peeled off. By peeling off the release material patch, the side wall 110 is exposed. Because the sacrificial material 128 can be easily moved out of the gap 126 after laser cutting, the side wall 110 of the component 108 is exposed and is particularly free of resin after the exposure process.

[0073] Figure 3 A cross-sectional view of a preform of a component carrier 100 produced according to another exemplary embodiment of the present invention is shown.

[0074] according to Figure 3 Implementation plan and basis Figure 2 The embodiment is particularly different in that two different cavities are formed, namely, a cavity only for sacrificial material 128 (such as a release layer material) can be formed first, and after supplying and curing the sacrificial material 128, a second cavity overlapping the first cavity and configured to install the component 108 therein can be formed.

[0075] More specifically, the first cavity can be cut into the core 123 as a receiving volume for the sacrificial material 128. Figure 3 The manufactured component carrier 100. Thereafter, a first temporary carrier (e.g., tape) may be placed on the bottom surface of the core 123 for closing the first cavity from the bottom side. Thereafter, a sacrificial material 128 may be supplied to the first cavity and to the temporary carrier, such as by a demoulding pliers. Then, the sacrificial material 128 may be cured. Then, the temporary carrier may be removed. Then, a second cavity overlapping the first cavity may be cut in the core 123 as a holding volume for the component 108. Another temporary carrier (e.g., another tape) may be placed on the bottom surface of the core 123 with the sacrificial material 128 to close the second cavity from the bottom side. Thereafter, the component 108 may be placed in the second cavity juxtaposed with the cured sacrificial material 128. A lamination procedure (e.g., using prepreg foil and copper foil) may be implemented at the surface of the structure away from the second temporary carrier. Then, the second temporary carrier may be removed. Another lamination procedure (e.g., using another prepreg foil and another copper foil) may be implemented.

[0076] Then, the gap 126 filled with the sacrificial material 128 can be opened by laser cutting using the laser cutting tool 125, and the material of the release material patch can be peeled off. By peeling off the release material patch, according to Figure 3 A hollow space is formed on the left hand side of the component 108, thereby exposing the sidewall 110. Because the sacrificial material 128 can be easily moved out of the gap 126 after laser cutting, the sidewall 110 of the component 108 is free of resin after the exposure process.

[0077] Although not shown in the drawings, the components are Figure 2 and Figure 3The releasable material patch of sacrificial material 128 may be replaced by another sacrificial material 128 that is selectively removable with respect to the material of component 108. For example, a water-soluble material such as a salt or a suitable polymer (e.g., polyvinyl alcohol) may be used as sacrificial material 128. The sacrificial material 128 may be removed by supplying water to thereby expose the sidewall 110 of component 108.

[0078] Figures 4 to 8 The present invention is shown in an exemplary embodiment of the present invention. Figure 8 100 is a cross-sectional view of the structure obtained during the component carrier 100 shown in FIG. Figure 1 The embodiment of the component carrier 100 is similar.

[0079] refer to Figure 4 , shows a stack 102 having a core 123 of a fully cured resin (e.g. FR4) with reinforcing particles as an electrical insulating layer structure 106, which is covered on its two opposite main surfaces with a corresponding one of two conductive layer structures 104 (here embodied as copper foil). The receiving cavity 122 is formed as a through hole passing through the stack 102. The stack 102 is arranged on a temporary carrier 130 such as a tape, so that the open bottom of the receiving cavity 122 is closed by a part of the temporary carrier 130. Thereafter, a component 108 (such as a laser diode for emitting electromagnetic radiation, a photodiode for detecting electromagnetic radiation, or a sensor such as a chemical sensor) can be inserted into the receiving cavity 122 of the stack 102 and can be attached to the surface of the temporary carrier 130. As can be seen from Figure 4 As obtained in FIG. 1 , the component 108 is asymmetrically placed in the accommodating cavity 122 in the lateral direction, so that the gap 126 between the side wall 110 of the component 108 and the accommodating cavity defining side wall 112 of the stack 102 located on the right hand side has a width D greater than the width d (d<D) of the gap 129 between the other side wall 110 of the component 108 and the other accommodating cavity defining side wall 112 of the stack 102 located on the left hand side. For example, the dimension D may be 500 μm, and the dimension d may be 75 μm.

[0080] refer to Figure 5 , an additional electrically insulating layer structure 106 (embodied here as a prepreg sheet made of a low-flow material or a non-flow material) and an additional conductive layer structure 104 (embodied here as an additional copper foil) are attached to the Figure 4104, i.e., attached to the surface facing away from the temporary carrier 130. The low-flow prepreg or no-flow prepreg from which the electrically insulating layer structure 106 is made ensures that substantially no resin remelts and flows into the gap 126 during the lamination process. Thus, the two additionally applied layer structures 106, 104 can be laminated together by lamination, i.e., by applying pressure and heat. Figure 4 108 without the risk of resin flowing into the gap 126 and covering the side wall 110 of the component 108 there. Thus, in particular due to the use of low-flow prepreg or no-flow prepreg, the gap 126 remains open even during lamination, which significantly simplifies the subsequent exposure of the side wall 110 of the component 108 (see Figure 8 ).

[0081] refer to Figure 6 , shows a structure obtained by first removing the Figure 5 The temporary carrier 130 is removed and a further lamination process is then performed on the bottom side. More specifically, after the first lamination process described, the temporary carrier 130 is no longer needed to provide mechanical support, during which the low-flow or no-flow resin material of the further electrically insulating layer structure 106 has hardened. Therefore, the temporary carrier 130 can be removed, for example from Figure 5 Thereafter, after removal of the temporary carrier 130, a further electrically insulating layer structure 106 (preferably also made of low-flow prepreg or no-flow prepreg) and a further electrically conductive layer structure 104 (e.g. a further copper foil) can be laminated to the temporary carrier 130. Figure 5 Since the electrical insulating layer structure 106 above and below the component 108 and the gap 126 uses a low-flow prepreg or a non-flow prepreg, the hollow space 183 remains in the Figure 6 , and allows the side walls 110 of the component 108 to remain free of resin material.

[0082] refer to Figure 7 The milling tool 121 schematically shown can be used in Figure 6 The structure shown in FIG. 1 is run on and by milling through the gap 126 or the hollow space 183, the layer stack can be removed. Figure 7 The right-hand part of the milling tool 121.

[0083] refer to Figure 8 , the stack 102 located at Figure 7 The milling tool 121 in FIG. 1 is used to remove material on the right-hand side of the component 108 , thereby exposing the side wall 110 of the component 108 to the environment of the component carrier 100 .

[0084] When component 108 is embodied as a laser diode, for example, light may be emitted to the environment via exposed sidewall 110. When component 108 is embodied as a photodiode, for example, light impinging from the environment onto exposed sidewall 110 may be detected by component 108. When component 108 is a chemical sensor, for example, chemicals in the environment of exposed sidewall 110 may be detected by component 108.

[0085] As a result of the described manufacturing procedure, a Figure 8 A PCB-type laminated component carrier 100 includes a stack 102 and a component 108 embedded in the stack 102, the stack including a plurality of electrically conductive layer structures 104 and a plurality of electrically insulating layer structures 106. The sidewall 110 of the component 108 is exposed to the environment of the component carrier 100 so as to be functionally coupled to the environment of the component carrier 100. Figure 8 , the exposed sidewall 110 of the component 108 and the sidewall 133 of the stack 102 are aligned to form a substantially vertically extending substantially continuous sidewall 110 of the component carrier 100. When one major surface 120 of the cubic component 108 is exposed at the sidewall 110, the other five major surfaces of the component 108 are covered by the component carrier material of the stack 102 so as to be properly mechanically and electrically protected and shielded.

[0086] Figures 9 to 12 1 shows a cross-sectional view of a structure obtained during the manufacture of a component carrier 100 according to another exemplary embodiment of the present invention. Figure 2 and Figure 3 The embodiment of the component carrier 100 is similar.

[0087] refer to Fig. 9 , forming a Figure 4 A structure similar to the structure shown in .

[0088] In order to obtain Fig.10 The structure shown in Fig. 9The gap 126 on the right-hand side that separates the component 108 from the side wall 112 defining the receiving cavity of the stack 102 is filled with a removable sacrificial material 128. For example, the sacrificial material 128 can be embodied as a release structure with non-stick properties with respect to the material of the component 108. Such a release structure can be, for example, a wax component (which can be based on calcium stearate) or a Teflon-based material that can be applied in the form of a patch using a demoulding pliers (not shown). The release structure can have non-stick properties for the component material and the component carrier material, in particular copper, epoxy resin, reinforced glass fiber and silicon. If desired or required, the sacrificial material 128 can be cured after being inserted into the gap 126, for example by heat treatment, by chemical treatment and / or by applying mechanical pressure.

[0089] After filling the cavity 126 with the sacrificial material 128, dielectric sheets such as a further electrically insulating layer structure 106 (here embodied as an at least partially uncured material, such as a prepreg sheet) and a further electrically conductive layer structure 104 (here embodied as a further copper foil) are attached to the cavity 126. Fig. 9 , i.e. attached to the surface facing away from the temporary carrier 130. In particular, the "at least partially uncured material" may include or consist of a B-stage material and / or an A-stage material. By providing a layer stack with prepreg or any other B-stage material, at least a portion of the layer stack may be remelted during lamination so that the resin (etc.) may flow to interconnect the individual elements and close gaps or voids, and may thereby contribute to a stable intrinsic interconnection within the component carrier 100 being manufactured. Subsequently, the two additionally applied layer structures 106, 104 may be bonded to the component carrier 100 by lamination, i.e. by applying pressure and heat. Fig. 9 Although resin of the at least partially uncured material of the electrically insulating layer structure 106 can flow in the gap 129 and can at least partially fill the gap during lamination, such flowable resin material does not move into the gap 126 because the gap 126 is already filled with the sacrificial material 128. This also advantageously leaves the sidewalls 110 of the component 108 covered by the sacrificial material 128 free of resin material.

[0090] refer to Fig.11 , shows a structure obtained by first removing the Fig. 9 The temporary carrier 130 is then laminated onto the further electrically conductive layer structure 104 from the bottom side. More specifically, the temporary carrier 130 is no longer required to provide mechanical support after the first lamination process described, during which the previously at least partially uncured material of the further electrically insulating layer structure 106 has already hardened. Fig.10 , so as to obtain a configuration that is symmetrical in the vertical direction.

[0091] refer to Fig.12 , a portion of the obtained structure on the right-hand side of the component 108 is then removed by laser cutting as schematically indicated by reference numeral 125. The laser cutting line is oriented to extend vertically through the sacrificial material 128. Advantageously, the laser process has relatively high tolerances or does not need to be implemented with high spatial accuracy, because the relatively large width D of the gap 126 filled with the sacrificial material 128 defines the allowed tolerances.

[0092] The result of the laser cutting process will be basically Figure 8 . To obtain such a component carrier 100, the sacrificial material 128 exposed after laser cutting is removed (e.g. by stripping) to thereby expose the sidewalls 110. This removal process is very simple due to the intentionally poor adhesion between the sacrificial material 128 on the one hand and the component 108 and the component carrier material of the stack 102 on the other hand.

[0093] In another embodiment, reference can be implemented in a corresponding manner Figures 9 to 12 The procedure described above is repeated, but the releasable patch material is replaced by another material of the sacrificial structure 128, preferably a water-soluble material such as a salt. Fig.12 When the structure is formed, the water-soluble material can be removed by supplying water to thereby expose the side wall 110 of the component 108.

[0094] Fig.13 and Fig.14 A cross-sectional view and a plan view of a component carrier 100 according to an exemplary embodiment of the present invention are shown. Fig.14 A cutting line 141 is shown, Fig.14 The diagram of is cut along this cutting line to obtain Fig.13 According to Fig.13 and Fig.14 The slit-shaped access recess 114 which helps to expose the side wall 110 extends from the upper main surface 116 of the component carrier 100 to be manufactured to its lower main surface 118. Fig.14 As a result, the slit has a length L that is greater than its width W. The direction of the length L corresponds to a direction extending parallel to the sidewall 110 of the component 108, while the direction of the width W corresponds to a direction extending perpendicular to the sidewall 110 of the component 108. In the illustrated embodiment, the access recess 114 is configured as a through hole extending through the entire stack 102. Fig.13 and Fig.14, again the sacrificial material 128 is foreseen as a selectively removable spacer between the sidewalls 110 of the component 108 and the cavity-defining sidewalls 112 of the stack 102. However, in other embodiments in which the sidewalls 110 of the component 108 are selectively exposed by the slit cuts, the sacrificial material 128 may also be omitted (e.g., in Figure 1 , Figures 4 to 8 However, when a sacrificial material 128 is foreseen, the sacrificial material 128 can be selectively removed after the slit-shaped access recess 114 has been formed (e.g. by directing water through the slit-shaped access recess 114 to remove the water-soluble sacrificial material 128). It is also possible that at least a portion of the sacrificial material 128 has been removed during the slit formation. In order to relax the accuracy requirements for forming the slit-shaped access recess 114 (e.g. by milling or laser cutting), according to Fig.13 and Fig.14 Component 108 may also be arranged asymmetrically in accommodating cavity 122 of stack 102 in a manner that the distances d<D are different with respect to opposite accommodating cavity-defining side walls 112 of stack 102. Distance D at the side where formation of slit-shaped approach recess 114 occurs is preferably greater than distance d at the other side.

[0095] Fig.15 1 shows a cross-sectional view of a component carrier 100 according to another exemplary embodiment of the present invention. Fig.15 In the embodiment of the present invention, the lateral access recess 114 extending into the stack 102 and exposing the side wall 110 of the component 108 extends from the lateral side wall 133 of the stack 102 to the side wall 110 of the component 108. Fig.15 In the embodiment, the access recess 114 is configured as a blind hole.

[0096] according to Fig.15 , a further component 124, here configured as a light guide or optical fiber, is inserted into the blind hole type access recess 114. When the component 108 is, for example, embodied as a light detecting element (e.g., a photodiode), electromagnetic radiation 143 propagating along the component 124 up to the exposed side wall 110 of the component 108 can be detected by the component 108. However, when the component 108 is embodied as a light emitting element (e.g., a laser diode), electromagnetic radiation 145 can be injected into the optical fiber via the exposed side wall 110 of the component 108 to propagate along the component 124. Therefore, Fig.15 The component carrier 100 can be used, for example, for optoelectronic data transmission.

[0097] Fig.16 1 shows a cross-sectional view of a component carrier 100 according to a further exemplary embodiment of the present invention. Fig.16, the slit-shaped access recess 114 is embodied as a blind hole that exposes two opposing side walls 110 of the component 108 and the further component 124, both embedded in the same component carrier 100. The recess 114 separates the components 108, 124 and simultaneously enables wireless data communication by transmitting electromagnetic radiation 147 (such as infrared radiation, visible light, radio frequency (RF) radiation, etc.) between the exposed side walls 110 of the components 108, 124 via the air gap provided by the access recess 114. Therefore, the component 108 and the further component 124, both embedded in the stack 102, are communicatively coupled for wireless data communication via the access recess 114. For example, the component 108 may be an electromagnetic radiation transmitter and the further component 124 may be an electromagnetic radiation detector.

[0098] and Figures 1 to 3 Instead, the side walls 110 of the components 108 , 124 are mutually exposed in the interior of the component carrier 100 , so that the side walls 110 form part of the inner (rather than outer) lateral side walls of the component carrier 100 .

[0099] Figures 17 to 20 A cross-sectional view of a structure obtained during the production of a component carrier according to a further exemplary embodiment of the invention is shown.

[0100] By forming the first cavity 151 in the stack 102, for example as a through hole in the fully cured core, the Fig.17 The structure shown in FIG. A temporary carrier 130 such as a tape is attached to the lower main surface of the stack 102 and closes the through hole at the bottom side. Subsequently, the first cavity 151 is filled with a sacrificial material 128 such as a release material. Then, if desired or required, the sacrificial material 128 can be cured. Thereafter, the temporary carrier 130 can be removed.

[0101] Subsequently, by removing the temporary carrier 130 from the Fig.17 The second cavity 153 is formed in the structure as another through hole to obtain Fig.18 The second cavity portion 153 is formed so as to laterally overlap with the first cavity portion 151. Therefore, a portion of the sacrificial material 128 is removed when the second cavity portion 153 is formed.

[0102] The second cavity 153 is obtained by connecting the additional temporary carrier 130' to the lower main surface of the stack 102, to the lower main surface of the remaining sacrificial material 128 and closing the bottom of the through hole forming the second cavity 153. Fig.19Thereafter, the component 108 is inserted into the second cavity 153 , so that the first cavity 151 filled with the sacrificial material 128 and the second cavity 153 accommodating the component 108 together form a common accommodating cavity 122 for accommodating the component 108 and the sacrificial material 128 .

[0103] By laminating additional portions of the stack 102 to the Fig.19 The upper main surface of the structure shown in FIG. Fig. 20 . Thereafter, the further temporary carrier 130' can be removed from the bottom surface of the obtained structure. After this, a further portion of the stack 102 can be laminated onto the lower main surface of the obtained structure. Then, as indicated by the separation line 155, the obtained structure can be separated by vertical cutting, which can be achieved, for example, by laser processing or mechanically. After removing the remaining part of the sacrificial material 128, the side wall 110 of the component 108 is exposed and the component carrier 100 according to the exemplary embodiment of the present invention is obtained.

[0104] Figures 17 to 20 The embodiment of has the advantage that there is substantially no restriction on the horizontal width of the first cavity portion 151 , which simplifies the supply of the sacrificial material 128 into the first cavity portion 151 .

[0105] Fig.21 A cross-sectional view of three component carriers 100 spaced apart side by side is shown according to another exemplary embodiment of the present invention.

[0106] exist Fig.21 In the embodiment of the present invention, the juxtaposed component carriers 100 are spaced apart from each other by respective gaps 197. The lateral surface portions of the plurality of embedded components 108 of the component carriers 100 are exposed. Fig.21 It can be seen that each of the component carriers 100 shown comprises at least one transmitter 108 a and at least one receiver 108 b , like the corresponding component 108 .

[0107] The component carriers 100 are arranged one behind the other in such a way that a transmitter 108 a of one component carrier 100 emitting electromagnetic radiation 199 and a receiver 100 b of another component carrier 100 receiving electromagnetic radiation 199 are aligned with one another. Fig.21 The arrangement structure is suitable for applications such as near field communication (NFC). Communication according to another communication protocol is possible. For example, communication can be achieved through infrared communication, Bluetooth, etc. Fig.21The component carrier 100 disposed in the middle between the other two component carriers 100 has a corresponding pair of transmitters 108a and receivers 108b on each of its two opposite main surfaces. Therefore, the component carrier 100 located in the middle and clamped by the other two component carriers 100 can communicate with the two other component carriers 100.

[0108] Fig. 22 An embodiment showing a light emitting diode 200 emitting light 202 passing through an optically transparent material 204 is shown.

[0109] according to Fig. 22 , a light emitting diode 200 is encapsulated in an encapsulant 206 and emits light 202 having a cross-sectional area A into a transparent material 204. Due to the rough surface of the transparent material 204, light diffraction occurs at the air interface, which increases the cross-sectional area A' of the light leaving the transparent material 204. The significant surface roughness of the transparent material 204 promotes this undesirable phenomenon.

[0110] Figure 23 to Figure 25 shows different structures obtained during the manufacture of a component carrier 100 according to an exemplary embodiment of the invention, Fig.26 The component carrier is shown in operation.

[0111] refer to Fig.23 , a component 108 is embedded in a stack 102 consisting of an electrically conductive layer structure 104 and an electrically insulating layer structure 106. In the illustrated embodiment, the component 108 comprises an electromagnetic radiation emitting member 108' (such as a light emitting diode, for example embodied as a laser chip) configured to emit light, such as electromagnetic radiation 145. The electromagnetic radiation emitting member 108' is electrically coupled to the electrically conductive layer structure 104. The electromagnetic radiation emitting member 108' is peripherally covered by a transparent material 108". The transparent material 108" preferably does not interfere with the propagation of the electromagnetic radiation 145 through the transparent material 108" (compare Fig.26 ) of fiber-free resin. Therefore, Fig.23 An embedded component 108 in the panel is shown.

[0112] refer to Fig.24As described above, material of the stack 102 is removed by a cutting procedure to thereby expose the side walls 110 of the component 108, more precisely, the side walls 110 of the transparent material 108 ″ of the component 108. During operation of the component carrier 100 being manufactured, the electromagnetic radiation 145 emitted by the electromagnetic radiation emitting member 108 ′ propagates through the transparent material 108 ″ and leaves the component carrier 100 via the exposed side walls 110. However, as a result of the cutting procedure, the exposed side walls 110 have a significant surface roughness, as schematically indicated by reference numeral 210. Thus, Fig.24 The result of a card cutting procedure is shown, after which the side surface of the transparent material 108" remains rough.

[0113] refer to Fig.25 The exposed rough sidewalls 110 of the transparent material 108" are polished, for example mechanically or chemically. Fig.24 The structure shown in FIG. 1 is the subject of a lateral polishing procedure which smoothes the sidewall surface of the transparent material 108″ after the polishing process. Therefore, the emitted electromagnetic radiation 145 propagates through the transparent material 108″ and the sidewall 110 as a parallel narrow beam without being substantially spatially broadened, see Fig.26 .

[0114] according to Fig.26 The embodiment of has the advantage that a laser diode can be embedded as an electromagnetic radiation emitting component 108' in a PCB-type component carrier 100 and at the same time a transparent window can be used in the stack 102 for propagating a laser beam as electromagnetic radiation 145. Fig.26 It can be seen that the portion of the transparent material 108″ between the sidewalls of the electromagnetic radiation emitting member 108′ and the lateral sidewalls of the component carrier 100 forms an optical path along which the electromagnetic radiation 145 propagates. Fig.26 The component carrier 100 can be used for optical communication or projection, for example, of visible light or infrared radiation, in particular embodied as a laser beam. Electromagnetic radiation 145 is emitted by the component 108 or can be received and detected by the component 108. Preferably, the transparent material 108" is free of bubbles, fibers, fabrics, etc., and has absorption properties that allow light to pass through without significant losses. For example, Fig.26 It can be seen that the transparent material 108 "remains in the lateral opening of the component carrier 100. Although not shown in the drawings, the photodiode can be mounted behind the laser diode. A person skilled in the art of laser technology will understand the installation of the photodiode established by the method mentioned in the above description. As according to Fig.26 An alternative to the implementation of Fig.15Similarly, the lateral opening of the component carrier 100 can also be maintained (according to Fig.26 Filled with transparent material 108 ″) is empty or the transparent material 108 ″ can be moved out of such lateral opening.

[0115] Fig. 27 An exemplary embodiment of the present invention includes Fig.26 Spectacles 220 of the component carrier 100 are shown in FIG.

[0116] Descriptively speaking, Fig. 27 The left half of the eyeglasses 220 is schematically shown (see axis of symmetry 212). Fig. 27 It can be concluded that according to Fig.26 The component carrier 100 is assembled in a housing 216, which can be connected to the arm or frame of the eyeglasses 220 (see reference numeral 218). Fig. 27 As shown in , the glasses 200 additionally include a screen 230 on which a user wearing the glasses 220 observes with his eyes 240. Light emitted from the electromagnetic radiation emitting member 108' of the component 108 embedded in the component carrier 100, such as electromagnetic radiation 145, is displayed on the screen 230 and can be seen by the user when the user wears the glasses 220 and observes through the glasses. The screen 230 can have optical microactuators and micromirrors for light deflection and for imaging. Colors can be formed using three lasers of red, green and blue to form a colored RGB system.

[0117] In the following, some other aspects of the present invention are described.

[0118] Aspect 1: A component carrier, wherein the component carrier comprises:

[0119] A stacked body, the stacked body comprising a plurality of conductive layer structures and / or electrically insulating layer structures;

[0120] A component, wherein the component is embedded in the stack;

[0121] Wherein, at least a portion of a side wall of the component is exposed.

[0122] Aspect 2: The component carrier according to aspect 1, comprising at least one of the following features:

[0123] wherein the sidewall of the component is exposed to the environment of the component carrier;

[0124] Wherein the exposed sidewall is aligned with an adjacent sidewall of the stack to form a substantially continuous sidewall of the component carrier.

[0125] Aspect 3: The component carrier according to aspect 1 or 2, comprising one of the following features:

[0126] wherein the approach recess in the stacking body that exposes the side wall of the component extends from the lateral side wall of the stacking body to the side wall of the component;

[0127] The access recess in the stacked body that exposes the side wall of the component extends from one of two opposite main surfaces of the stacked body at least to the component.

[0128] Aspect 4: The component carrier according to aspect 3, comprising at least one of the following features:

[0129] wherein the access recess is a slit, wherein, in particular, the slit has a length, in particular in a direction extending parallel to a side wall of the component, which is greater than a width, in particular in a direction extending perpendicular to the side wall of the component;

[0130] Wherein, the access recess is configured as one of the group consisting of: a through hole extending through the entire stack, and a blind hole extending at least to the component.

[0131] Aspect 5: The component carrier according to any one of aspects 1 to 4, comprising at least one of the following features:

[0132] wherein only one main surface of the component, in particular the substantially cuboid component, is exposed, whereas all other main surfaces of the component, in particular the substantially cuboid component, are covered by the material of the stack;

[0133] wherein the components are arranged in the accommodating cavity of the stack in a laterally asymmetrical manner, in particular at different distances with respect to opposite accommodating cavity-bounding side walls of the stack;

[0134] wherein the component includes a sensor configured to sense sensor information via the exposed sidewall;

[0135] wherein the component comprises an electromagnetic radiation source configured to emit electromagnetic radiation via the exposed sidewall;

[0136] comprising a further component embedded in the stack and leaving at least a portion of the sidewall exposed to the sidewall of the component, such that the component and the further component are communicatively coupled to each other, in particular at least partially via a common access recess between the sidewalls, wherein, in particular, the component and the further component are configured as at least one pair of the group consisting of: an electromagnetic radiation emitter and an electromagnetic radiation detector, a light guide and a light emitter, and a light guide and a light detector;

[0137] wherein at least one of the electrically insulating layer structures closest to the embedded component is made of a low-flow prepreg or a no-flow prepreg;

[0138] wherein the component is selected from the group consisting of: electronic components, non-conductive inlays and / or conductive inlays, heat transfer units, photoconductive elements, energy harvesting units, active electronic components, passive electronic components, electronic chips, storage devices, filters, integrated circuits, signal processing components, power management components, optoelectronic interface components, voltage converters, cryptographic components, transmitters and / or receivers, electromechanical transducers, actuators, micro-electromechanical systems, microprocessors, capacitors, resistors, inductors, accumulators, switches, cameras, antennas, magnetic elements, further component carriers, and logic chips;

[0139] wherein at least one of the conductive layer structures comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium and tungsten, any of the mentioned materials being optionally coated with a superconducting material such as graphene;

[0140] Wherein, at least one of the electrical insulating layer structures comprises at least one of the group consisting of: resin, in particular reinforced resin or non-reinforced resin, such as epoxy resin or bismaleimide-triazine resin, FR-4, FR-5; cyanate ester; polyphenylene derivative; glass; prepreg material; polyimide; polyamide; liquid crystal polymer; epoxy-based laminate film; polytetrafluoroethylene; ceramic; and metal oxide;

[0141] wherein the component carrier is formed as a plate;

[0142] wherein the component carrier is configured as one of the group consisting of a printed circuit board and a substrate;

[0143] configured as a laminated component carrier;

[0144] wherein the exposed sidewall forms part of one of: an outer lateral sidewall of the component carrier, and an inner lateral sidewall of the component carrier;

[0145] wherein the component comprises an electromagnetic radiation emitting member, which is configured to emit electromagnetic radiation and is at least partially covered by a transparent material, which at least partially forms the exposed side wall and is transparent to the electromagnetic radiation emitted by the electromagnetic radiation emitting member, wherein, in particular, at least a portion of the transparent material at least partially forming the exposed side wall is polished.

[0146] Aspect 6: A method for manufacturing a component carrier, wherein the method comprises:

[0147] forming a stack of a plurality of electrically conductive layer structures and / or electrically insulating layer structures;

[0148] embedding a component into the stack;

[0149] Material of the stack is subsequently removed, thereby exposing at least a portion of the side wall of the component, in particular to the environment of the component carrier.

[0150] Aspect 7: A method according to Aspect 6, wherein embedding the component into the stack includes: forming a receiving cavity in at least one layer structure of the stack, and placing the component in the receiving cavity, particularly in an asymmetric manner in the lateral direction, wherein, in particular, the component is placed in the receiving cavity so that the size of the gap between the side wall of the component and the side wall defining the receiving cavity of the stack is different from the other size of the other gap between the opposite other side wall of the component and the opposite other side wall defining the receiving cavity of the stack.

[0151] Aspect 8: The method according to aspect 6 or 7, wherein the method further comprises:

[0152] filling at least a portion of a gap between the component and a sidewall defining the receiving cavity of the stack with a removable sacrificial material;

[0153] After completion of the embedding, the sacrificial material is at least partially removed, in particular to thereby expose the sidewalls.

[0154] Aspect 9: The method according to aspect 8, comprising at least one of the following features:

[0155] Wherein, the method further comprises inserting the component into a first portion of the receiving cavity, and subsequently filling the sacrificial material into at least a portion of a remaining second portion of the receiving cavity that is laterally juxtaposed with the first portion and serves as the gap;

[0156] The method further comprises forming a first cavity in the stack and at least partially filling the first cavity with the sacrificial material, and then forming a second cavity in the stack overlapping the first cavity and inserting the component into the second cavity, so that the first cavity at least partially filled with the sacrificial material and the second cavity accommodating the component together constitute the accommodating cavity;

[0157] The sacrificial material comprises one of the group consisting of: a releasing structure having non-adhesive properties with respect to the materials of the stack and the component, a volatile liquid, a liquid that can be flushed away, and a substance that can be dissolved, in particular dissolved by water.

[0158] Aspect 10: The method according to any one of aspects 6 to 9, wherein the method further comprises:

[0159] Prior to said embedding, providing said component with a removable sacrificial material, in particular a release structure;

[0160] subsequently embedding the component having the removable sacrificial material thereon into the stack;

[0161] After completion of the embedding, the sacrificial material is at least partially removed, in particular to thereby expose the sidewalls.

[0162] Aspect 11: The method according to any one of aspects 6 to 10, comprising at least one of the following features:

[0163] wherein removing material of the stack comprises at least one of the group consisting of milling and laser cutting;

[0164] Wherein, the size of the lateral gap between the component and the side wall defining the accommodating cavity of the stacked body is in the range of 5 μm to 500 μm;

[0165] wherein embedding the component comprises laminating the component and the stack such that at least a portion of uncured material of the layer structure is cured;

[0166] Therein, forming the stack comprises attaching a temporary carrier to a portion of the layer structure comprising at least partially uncured material, and removing the temporary carrier from the stack after curing the at least partially uncured material of the layer structure.

[0167] Aspect 12: A method according to any one of Aspects 6 to 11, wherein the method includes: embedding a component into the stack, the component including an electromagnetic radiation emitting component, the electromagnetic radiation emitting component being configured to emit electromagnetic radiation and being at least partially covered by a transparent material, the transparent material at least partially forming the exposed side wall and being transparent to the electromagnetic radiation emitted by the electromagnetic radiation emitting component.

[0168] Aspect 13: The method of aspect 12, wherein the method comprises, after the removing, polishing at least a portion of the transparent material that at least partially forms the exposed sidewall.

[0169] Aspect 14: A method according to Aspect 12 or 13, wherein the method comprises: assembling the component carrier with a screen to form glasses wearable by a user, wherein the electromagnetic radiation emitted by the electromagnetic radiation emitting member is projected onto the screen for display to the user.

[0170] Aspect 15: The method according to aspect 14, wherein the screen comprises micro-actuators and micro-mirrors for deflecting electromagnetic radiation and for imaging.

[0171] It should be noted that the term "comprising" does not exclude other elements or steps and "a" or "an" does not exclude a plurality. Also, elements described in connection with different embodiments may be combined.

[0172] It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims.

[0173] The implementation of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, various modifications using the embodiments shown and according to the principle of the invention are possible, even in fundamentally different embodiments.

Claims

1. A component carrier (100), wherein: The component carrier (100) comprises: A stack (102), comprising a plurality of electrically conductive layer structures (104) and / or electrically insulating layer structures (106); A component (108) embedded in the stack (102); wherein at least a portion of a side wall (110) of the component (108) is exposed so that the side wall (110) of the component (108) can be used to establish a connection or a coupling, At least five surfaces of the component (108) other than the exposed side wall (110) are covered by the stack (102), and the component (108) is arranged in a transversely asymmetrical manner in the accommodating cavity (122) of the stack (102).

2. The component carrier (100) according to claim 1, wherein: The component (108) includes a sensor configured to sense sensor information via the exposed side wall (110).

3. The component carrier (100) according to claim 2, wherein: The exposed sidewall (110) includes at least a sensitive portion for detecting a medium to be sensed, wherein the medium is electricity, electromagnetic radiation or matter.

4. The component carrier (100) according to any one of claims 1 to 3, wherein: The component (108) includes an electromagnetic radiation source configured to emit electromagnetic radiation (145) through the exposed sidewall (110).

5. The component carrier (100) according to claim 1 comprises an additional component (124), wherein the additional component (124) is embedded in the stack (102) and at least a portion of a side wall (110) of the additional component (124) is exposed to the side wall (110) of the component (108), so that the component (108) and the additional component (124) are communicatively coupled to each other.

6. The component carrier (100) according to claim 5, wherein: The component (108) and the further component (124) are communicatively coupled to each other at least in part via a common access recess (114) between the side walls (110).

7. The component carrier (100) according to claim 5 or 6, wherein: The component (108) and the further component (124) are configured as at least one of the following pairs: an electromagnetic radiation emitter and an electromagnetic radiation detector; a light guide and a light emitter; and, a light guide and a light detector.

8. The component carrier (100) according to claim 1, wherein: The component (108) comprises an electromagnetic radiation emitting member (108') configured for emitting electromagnetic radiation (145) and at least partially covered by a transparent material (108"), the transparent material at least partially forming the exposed side wall (110) and being transparent to the electromagnetic radiation (145) emitted by the electromagnetic radiation emitting member (108').

9. The component carrier (100) according to claim 8, wherein: At least a portion of the transparent material (108") at least partially forming the exposed sidewall (110) is polished.

10. The component carrier (100) according to claim 1, wherein: An access recess (114) in the stack (102) that exposes the side wall (110) of the component (108) extends from a lateral side wall (133) of the stack (102) to the side wall (110) of the component (108).

11. The component carrier (100) according to claim 10, wherein: The access recess (114) is configured such that an electrical conductor or optical fiber can be inserted into the access recess (114) to establish the coupling.

12. The component carrier (100) according to claim 1, comprising at least one of the following features: in, A side wall (110) of the component (108) is exposed to the environment of the component carrier (100); The exposed side wall (110) is aligned with an adjacent side wall (133) of the stack (102) to form a continuous side wall (110, 133) of the component carrier (100).

13. The component carrier (100) according to claim 1, comprising one of the following features: in, An access recess (114) in the stack (102) that exposes the side wall (110) of the component (108) extends from a lateral side wall (133) of the stack (102) to the side wall (110) of the component (108); The access recess (114) in the stack (102) that exposes the side wall (110) of the component (108) extends from one of the two opposite main surfaces (116, 118) of the stack (102) at least to the component (108).

14. The component carrier (100) according to claim 13, comprising at least one of the following features: in, The approach recess (114) is a slit; The access recess (114) is configured as one of the group consisting of: a through hole extending through the entire stack (102), and a blind hole extending at least to the component (108).

15. The component carrier (100) according to claim 14, wherein: The slit has a length (L) in a direction extending parallel to the side wall (110) of the component (108), which is greater than a width (W) in a direction extending perpendicular to the side wall (110) of the component (108).

16. The component carrier (100) according to claim 1, comprising at least one of the following features: in, The component (108) is in the form of a cube, only one main surface (120) of the component is exposed, and all other main surfaces of the component in the form of a cube are covered by the material of the stack (102); wherein at least one of the electrical insulation layer structures (106) closest to the embedded component (108) is made of a low-flow prepreg or a no-flow prepreg; wherein at least one of the conductive layer structures (104) comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium and tungsten; wherein at least one of the electrical insulating layer structures (106) comprises at least one of the group consisting of: resin; glass; prepreg material; ceramic; and metal oxide; wherein the component carrier (100) is formed as a plate; wherein the component carrier (100) is configured as a laminated component carrier (100); The exposed side wall (110) forms part of one of: an outer lateral side wall of the component carrier (100), and an inner lateral side wall of the component carrier (100).

17. The component carrier (100) according to claim 1, wherein: The component (108) is arranged in the accommodating cavity (122) of the stack (102) in a laterally asymmetrical manner, and the component (108) is at different distances (d, D) from the opposite accommodating cavity-defining side wall (112) of the stack (102).

18. The component carrier (100) according to claim 1, wherein: The component is an electronic component.

19. The component carrier (100) according to claim 1, wherein: The components are active electronic components or passive electronic components.

20. The component carrier (100) according to claim 1, wherein The component is a non-conductive inlay or a conductive inlay.

21. The component carrier (100) according to claim 1, wherein The component is an energy harvesting unit, a signal processing component or an electromechanical transducer.

22. The component carrier (100) according to claim 1, wherein The component is a storage device, a power management component, a cryptographic component or a magnetic element.

23. The component carrier (100) according to claim 1, wherein The component is a filter, an optoelectronic interface element, a voltage converter or an actuator.

24. The component carrier (100) according to claim 1, wherein The component is an integrated circuit.

25. The component carrier (100) according to claim 1, wherein The component is an electronic chip.

26. The component carrier (100) according to claim 1, wherein The component is a logic chip.

27. The component carrier (100) according to claim 1, wherein The component is a micro-electromechanical system.

28. The component carrier (100) according to claim 1, wherein The component is a microprocessor.

29. The component carrier (100) according to claim 1, wherein The component is a capacitor, a resistor, an inductor, an accumulator, a switch, a camera or an antenna.

30. The component carrier (100) according to claim 1, wherein The component is a heat transfer unit, a light-guiding element, a transmitter or a receiver.

31. The component carrier (100) according to claim 16, wherein: Any of the mentioned copper, aluminum, nickel, silver, gold, palladium and tungsten is coated with a superconducting material.

32. The component carrier (100) according to claim 31, wherein The superconducting material is graphene.

33. The component carrier (100) according to claim 1, wherein At least one of the electrical insulating layer structures (106) comprises at least one of the group consisting of: cyanate ester; polyphenylene derivative; polyimide; polyamide; liquid crystal polymer; epoxy-based laminated film; polytetrafluoroethylene.

34. The component carrier (100) according to claim 16, wherein: The resin is a reinforced resin or a non-reinforced resin.

35. The component carrier (100) according to claim 16, wherein: The resin is an epoxy resin or a bismaleimide-triazine resin.

36. The component carrier (100) according to claim 1, wherein At least one of the electrically insulating layer structures (106) comprises FR-4 or FR-5.

37. The component carrier (100) according to claim 1, wherein The component carrier (100) is configured as a printed circuit board.

38. The component carrier (100) according to claim 1, wherein The component carrier (100) is configured as a substrate.

39. A method of manufacturing a component carrier (100), wherein: The method comprises: forming a stack (102) of a plurality of electrically conductive layer structures (104) and / or electrically insulating layer structures (106); The component (108) is embedded in the stack (102) in the following manner: the component (108) is arranged in a transversely asymmetrical manner in a receiving cavity (122) of the stack (102); subsequently removing material of the stack (102) to thereby expose at least a portion of a side wall (110) of the component (108) so that the side wall (110) of the component (108) can be used to establish a connection or coupling, At least five surfaces of the component (108) other than the exposed side wall (110) are covered by the stack (102).

40. The method of claim 39, wherein: Embedding the component (108) in the stacked body (102) includes: forming the accommodating cavity (122) in at least one layer structure of the plurality of conductive layer structures (104) and / or the electrically insulating layer structure (106) of the stacked body (102), and placing the component (108) in the accommodating cavity (122).

41. The method of claim 39, wherein: Embedding the component (108) into the stack (102) includes: forming the accommodating cavity (122) in at least one layer structure of the multiple conductive layer structures (104) and / or the electrically insulating layer structure (106) of the stack (102), wherein the component (108) is placed in the accommodating cavity (122) so that the size of the gap (126) between the side wall (110) of the component (108) and the side wall (112) defining the accommodating cavity of the stack (102) is different from the size of another gap (129) between another opposite side wall (110) of the component (108) and another opposite accommodating cavity-defining side wall (112) of the stack (102).

42. The method according to any one of claims 39 to 41, wherein: The method further comprises: Filling at least a portion of a gap (126) between the component (108) and a cavity-defining sidewall (112) of the stack (102) with a removable sacrificial material (128); After embedding is complete, the sacrificial material (128) is at least partially removed.

43. The method according to any one of claims 39 to 41, wherein: The method further comprises: Filling at least a portion of a gap (126) between the component (108) and a cavity-defining sidewall (112) of the stack (102) with a removable sacrificial material (128); After embedding is complete, the sacrificial material (128) is at least partially removed, thereby exposing the sidewalls (110).

44. The method of claim 42, comprising at least one of the following features: in, The method further includes inserting the component (108) into a first portion of the receiving cavity (122), and subsequently filling the sacrificial material (128) into at least a portion of a remaining second portion of the receiving cavity (122) that is laterally juxtaposed with the first portion as the gap (126); The method further comprises forming a first cavity (151) in the stack (102) and at least partially filling the first cavity (151) with the sacrificial material (128), and then forming a second cavity (153) overlapping the first cavity (151) in the stack (102) and inserting the component (108) into the second cavity (153), so that the first cavity (151) at least partially filled with the sacrificial material (128) and the second cavity (153) accommodating the component (108) together constitute the accommodating cavity (122); The sacrificial material (128) comprises one of the group consisting of: a release structure having non-adhesive properties with respect to the materials of the stack (102) and the component (108), a volatile liquid, a liquid that can be flushed away, and a substance that can be dissolved.

45. The method according to any one of claims 39 to 41, wherein: The method further comprises: providing said component (108) with a removable sacrificial material (128) on said component (108) prior to said embedding; then embedding the component (108) having the removable sacrificial material (128) thereon into the stack (102); After the embedding is completed, the sacrificial material (128) is at least partially removed, thereby exposing the sidewall (110).

46. ​​The method of claim 45, wherein: The removable sacrificial material (128) is a releasable structure.

47. The method according to any one of claims 39 to 41, comprising at least one of the following features: in, Removing material from the stack (102) includes at least one of the group consisting of milling and laser cutting; The size of the transverse gap between the component (108) and the side wall (112) defining the accommodating cavity of the stack (102) is in the range of 5 μm to 500 μm; wherein embedding the component (108) comprises laminating the component (108) and the stack (102) so that at least part of the uncured material of the layer structures in the plurality of conductive layer structures (104) and / or the electrically insulating layer structure (106) is cured; Wherein, forming the stack (102) includes attaching a temporary carrier (130) to a portion of a layer structure in the conductive layer structure (104) and / or the electrically insulating layer structure (106) comprising at least partially uncured material, and removing the temporary carrier (130) from the stack (102) after curing the at least partially uncured material of the layer structure in the conductive layer structure (104) and / or the electrically insulating layer structure (106).

48. The method according to any one of claims 39 to 41, wherein: The method comprises embedding a component (108) in the stack (102), the component (108) comprising an electromagnetic radiation emitting member (108') configured to emit electromagnetic radiation (145) and at least partially covered by a transparent material (108"), the transparent material at least partially forming an exposed sidewall (110) and being transparent to the electromagnetic radiation (145) emitted by the electromagnetic radiation emitting member (108').

49. The method of claim 48, wherein: The method includes, after the removing, polishing at least a portion of the transparent material (108") that at least partially forms the exposed sidewall.

50. The method of claim 48, wherein: The method comprises assembling the component carrier (100) with a screen (230) to form spectacles (220) wearable by a user, wherein the electromagnetic radiation (145) emitted by the electromagnetic radiation emitting member (108') is projected on the screen (230) for presentation to the user.

51. The method of claim 50, wherein: The screen (230) includes microactuators and micromirrors for deflecting electromagnetic radiation (145) and for imaging.

Images