A thermocouple heat dissipation index sensor

Abstract

The present invention discloses a thermocouple heat dissipation index sensor, comprising: a hollow sphere, on the outer surface of which a second metal layer and a first metal layer are sequentially arranged, and a circular hole is provided at the bottom of the hollow sphere; a hollow insulating tube, which is connected to the hollow sphere through the circular hole; a first wire, arranged inside the insulating tube, one end of the first wire is electrically connected to the first metal layer, and the other end passes through the hollow insulating tube and is connected to a measuring device; a second wire, arranged inside the insulating tube, one end of the second wire is electrically connected to the second metal layer, and the other end passes through the hollow insulating tube and is connected to the measuring device; a heating wire, which is arranged inside the hollow sphere, and the heating wire passes through the insulating tube through a lead wire and is connected to the measuring device. The embodiment of the present invention can effectively improve the accuracy of simulating and measuring the heat dissipation index of a wire.

Description

Technical Field

[0001] The present invention relates to the technical field of electric power, and more particularly to a thermocouple heat dissipation index sensor. Background Art

[0002] At present, monitoring the dynamic capacity increase of a wire through heat dissipation index measurement is a new and efficient dynamic capacity increase technology. By monitoring the cooling rate of a heat dissipation index sensor under certain environmental conditions and combining the measurement and calculation of relevant environmental data at that time, the heat dissipation index at that time can be obtained, and then the capacity increase margin of the wire can be calculated to achieve the capacity increase of wire power transmission.

[0003] Existing heat dissipation index sensors generally have the shape of a solid metal ball, with a heating rod and a temperature measuring element buried inside. By monitoring the cooling rate of the metal ball after heating and substituting it into the corresponding mathematical model, the heat dissipation index under the current environment is measured. Due to the unevenness of wind direction and sunlight, the temperature difference between the temperature measured by the temperature measuring element buried inside the sphere and the temperature on the surface of the sphere is large, making it difficult for existing heat dissipation index sensors to accurately measure the heat dissipation index under the current environment. Summary of the Invention

[0004] The present invention provides a thermocouple heat dissipation index sensor to solve the technical problem that existing heat dissipation index sensors are difficult to accurately measure the heat dissipation index under the current environment.

[0005] An embodiment of the present invention provides a thermocouple heat dissipation index sensor, including:

[0006] A hollow sphere, on the outer surface of which a second metal layer and a first metal layer are sequentially arranged, and a round hole is provided at the bottom of the hollow sphere;

[0007] A hollow insulating tube, which is connected to the hollow sphere through the round hole;

[0008] A first wire, arranged inside the hollow insulating tube, one end of the first wire is electrically connected to the first metal layer, and the other end passes through the hollow insulating tube and is connected to a measuring device;

[0009] A second wire, arranged inside the hollow insulating tube, one end of the second wire is electrically connected to the second metal layer, and the other end passes through the hollow insulating tube and is connected to a measuring device;

[0010] An electric heating wire, which is arranged inside the hollow sphere, and the electric heating wire is connected to the measuring device through a lead wire passing through the hollow insulating tube.

[0011] Further, the first metal layer fits and covers the second metal layer.

[0012] Further, the first metal layer and the second metal layer are different metal layers.

[0013] Further, the diameter of the hollow sphere is 20 mm - 40 mm.

[0014] Further, the first metal layer and the second metal layer have the same thickness.

[0015] Further, the first metal layer is a nickel-chromium layer, and the second metal layer is a nickel-silicon layer.

[0016] Further, the first metal layer is a copper-nickel alloy layer, and the second metal layer is an iron layer.

[0017] Further, the first metal layer is a copper-nickel alloy layer, and the second metal layer is a copper layer.

[0018] Further, the power of the heating wire is 10 - 100 W.

[0019] In the embodiment of the present invention, heating is performed by arranging a heating wire in the hollow sphere. Since the metal volume of the hollow sphere is small, it can be quickly heated to the temperature required for measurement, thereby effectively reducing the power consumption, significantly reducing the battery weight and the area of the photovoltaic panel, and further reducing the impact on the tower load; the heat dissipation and cooling speed of the hollow sphere is faster than that of the solid sphere in the prior art, which can effectively shorten the measurement cycle. Moreover, the hollow sphere serves as both a thermal electrode and a heat storage test body for wire heat dissipation, and the temperature difference between the inner temperature and the outer surface temperature of the hollow sphere is small, thereby effectively reducing the temperature data error and effectively improving the accuracy of simulating and measuring the heat dissipation index of the capacitive wire. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of a thermocouple heat dissipation index sensor provided by an embodiment of the present invention;

[0021] Figure 2 is a schematic connection diagram of the thermocouple heat dissipation index sensor and the measuring device provided by an embodiment of the present invention. Detailed Embodiments

[0022] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0023] In the description of the present application, it should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0024] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0025] Please refer to Figure 1 , an embodiment of the present invention provides a thermocouple heat dissipation index sensor, including:

[0026] A hollow sphere 1, a second metal layer 2 and a first metal layer 3 are sequentially arranged on the outer surface of the hollow sphere 1, and a circular hole 5 is provided at the bottom of the hollow sphere 1;

[0027] In the embodiment of the present invention, the first metal layer 3 and the second metal layer 2 form a bimetallic structure. The second metal layer 2 is disposed in contact with the outer surface of the hollow sphere 1, the first metal layer 3 is disposed in contact with and covers the second metal layer 2, and the first metal layer 3 is in contact with the external air environment. The first metal layer 3 and the second metal layer 2 are used to obtain a heat dissipation surface with the same material as the on-site wire.

[0028] A hollow insulating tube 4, and the hollow insulating tube 4 is connected to the hollow sphere 1 through the circular hole 5;

[0029] In the embodiment of the present invention, the material of the hollow insulating tube 4 is an insulator, which is used to connect and support the hollow sphere 1.

[0030] A first wire 6, which is disposed inside the insulating tube. One end of the first wire 6 is electrically connected to the first metal layer 3, and the other end passes through the hollow insulating tube 4 and is connected to the measuring device 10;

[0031] A second wire 7, which is disposed inside the insulating tube. One end of the second wire 7 is electrically connected to the second metal layer 2, and the other end passes through the hollow insulating tube 4 and is connected to the measuring device 10;

[0032] A heating wire 8, which is disposed inside the hollow sphere 1. The heating wire 8 is connected to the measuring device 10 through a lead 9 passing through the insulating tube.

[0033] Optionally, the radius of the hollow sphere 1 is 20 mm - 40 mm. Since the cross-sectional area of the conductors of the overhead transmission lines in on-site operation is usually 300 - 700 square millimeters, in a preferred embodiment, the diameter of the hollow sphere 1 is set to 30 mm.

[0034] In one embodiment, the first metal layer 3 and the second metal layer 2 are different metal layers.

[0035] In the embodiment of the present invention, in order to achieve heat dissipation surface characteristics close to those of aluminum metal, the first metal layer 3 is a nickel-chromium layer and the second metal layer 2 is a nickel-silicon layer; in order to achieve heat dissipation surface characteristics close to those of copper metal, the first metal layer 3 is a copper-nickel alloy layer and the second metal layer 2 is an iron layer. As a specific implementation manner of the embodiment of the present invention, the first metal layer 3 can also be set as a copper-nickel alloy layer and the second metal layer 2 is a copper layer.

[0036] The thicknesses of both the first metal layer 3 and the second metal layer 2 are 0.1 mm - 1 mm. In a specific embodiment, the thicknesses of the first metal layer 3 and the second metal layer 2 are the same and are both 0.5 mm.

[0037] The working principle of the embodiment of the present invention is as follows: The measuring device 10 is electrically connected to the thermocouple heat dissipation index sensor provided in this embodiment. At the beginning of each measurement cycle, the measuring device 10 energizes the heating wire 8 to generate heat. The heating wire 8 generates heat inside the hollow sphere 1, and the heat is transferred to the second metal layer 2 through radiation, air conduction, and convection. The temperature of the second metal layer 2 rises sharply, and the heat is further transferred to the first metal layer 3. Since the first metal layer 3 and the second metal layer 2 are in a bonded state, the thermal resistance between the two metal layers is extremely small, and the temperatures of the first metal layer 3 and the second metal layer 2 tend to be close. The first metal layer 3 is in contact with the external environment and is affected by wind, solar radiation, and ambient temperature. The heat of the first metal layer 3 is dissipated to the outside. Since the power of the heat dissipated to the outside is much smaller than the power of the heating wire 8, during the heating of the heating wire 8, the temperatures of the first metal layer 3 and the second metal layer 2 increase.

[0038] In one embodiment, the power of the heating wire 8 is 10 - 100 W. In the embodiment of the present invention, the power of the heating wire 8 is set to 50 W.

[0039] In an embodiment of the present invention, the first metal layer 3 and the second metal layer 2 are metal layers made of different materials. When the temperature rises, a thermoelectromotive force (Seebeck effect) is generated between the two metal layers, and an electric current is formed on the first wire 6 and the second wire 7. The measuring device 10 includes a voltage and current measuring module and a CPU, which measures the thermoelectromotive force between the first metal layer 3 and the second metal layer 2 in real time. By comparing the relationship between the thermoelectromotive force of the first metal layer 3 and the second metal layer 2 and temperature, the real-time temperatures of the first metal layer 3 and the second metal layer 2 are obtained. When the real-time temperature reaches a set temperature value (such as 70 °C), the working current of the heating wire 8 is cut off.

[0040] After the working current of the heating wire 8 is stopped and heating ceases, the heat capacity value C of the first metal layer 3 and the second metal layer 2 is measured. The heat stored in the heat capacity value C is dissipated to the external environment through the surface of the hollow sphere, and the amount of heat dissipated per degree Celsius drop is Q. When the measuring device 10 measures each temperature value T, the time t experienced for the temperature to change by one degree Celsius is measured, and thus the heat dissipation index K is calculated. Specifically:

[0041] K = Q / S / t

[0042] Where S is the surface area of the hollow sphere 1, and K is the amount of heat released per unit area and per unit time of the heat dissipation test body.

[0043] Furthermore, the thermocouple heat dissipation index measurement sensor of the embodiment of the present invention is installed on a tower (not shown) of a dynamic capacity increase line, which has a micro-meteorological environment the same as or close to that of the wire. For the same heat dissipation index K obtained for the wire and the thermocouple heat dissipation index measurement sensor, for the wire of the transmission line that needs dynamic capacity increase, when the transmitted power flows through the current value I, the wire resistance value is R, and the power dissipated by heat is I^2 * R. For the total wire area S', taking the same heat dissipation index K for the wire and the thermocouple heat dissipation index measurement sensor, then I^2 * R = K * S'. The current I is the maximum current-carrying capacity that the wire of the measured line can withstand in this environment. The dispatching center can transmit electricity based on this maximum current-carrying capacity I, thereby achieving dynamic capacity increase.

[0044] Implementing the embodiment of the present invention has the following beneficial effects:

[0045] In the embodiment of the present invention, heating is carried out by arranging a heating wire 8 in the hollow sphere 1. Since the metal volume of the hollow sphere 1 is small, it can be quickly heated to the temperature required for measurement, thereby effectively reducing the power demand, greatly reducing the battery weight and the area of the photovoltaic panel, and further reducing the impact on the tower load. The heat dissipation and cooling speed of the hollow sphere 1 is faster than that of the solid sphere in the prior art, which can effectively shorten the measurement cycle. Moreover, the hollow sphere 1 serves as a heat storage test body for heat dissipation of both the thermal electrode and the wire at the same time, and the temperature difference between the internal temperature and the outer surface temperature of the hollow sphere 1 is small, thereby effectively reducing the temperature data error and effectively improving the accuracy of simulating and measuring the heat dissipation index of the capacitive increase wire.

[0046] The above is the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. A thermocouple heat dissipation index sensor, characterized in that, Comprising: A hollow sphere, on the outer surface of which a second metal layer and a first metal layer are sequentially arranged, the first metal layer fittingly covering the second metal layer, and a circular hole being provided at the bottom of the hollow sphere; A hollow insulating tube, which is connected to the hollow sphere through the circular hole; A first wire, arranged inside the hollow insulating tube, one end of the first wire being electrically connected to the first metal layer and the other end passing through the hollow insulating tube to be connected to a measuring device; A second wire, arranged inside the hollow insulating tube, one end of the second wire being electrically connected to the second metal layer and the other end passing through the hollow insulating tube to be connected to a measuring device; And a heating wire, which is arranged inside the hollow sphere, and the heating wire is connected to the measuring device through a lead wire passing through the hollow insulating tube; The first metal layer and the second metal layer are different metal layers; The first metal layer is a nickel-chromium layer and the second metal layer is a nickel-silicon layer; Or, the first metal layer is a copper-nickel alloy layer and the second metal layer is an iron layer; Or, the first metal layer is a copper-nickel alloy layer and the second metal layer is a copper layer.

2. The thermocouple heat dissipation index sensor according to claim 1, wherein The diameter of the hollow sphere is 20 mm - 40 mm.

3. The thermocouple heat dissipation index sensor according to claim 1, wherein The first metal layer and the second metal layer have the same thickness.

4. The thermocouple heat dissipation index sensor according to claim 1, characterized in that The power of the heating wire is 10 - 100 W.

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