Printed Circuit Board

Abstract

The present invention discloses a printed circuit board, wherein the printed circuit board comprises: a first conductive layer; a second conductive layer, the second conductive layer and the first conductive layer are stacked; a first connector, the first connector electrically connects the first conductive layer and the second conductive layer; a shielding sleeve, the shielding sleeve is sleeved with the first connector, and is spaced and coaxially arranged with the first connector. Through the above structure, the present invention can shield the interference of external signals on the first connector, facilitate the signal transmission of the first connector, reduce the crosstalk between different signals, and improve the stability and integrity of signal transmission.

Description

Technical Field

[0001] The invention is applied to the technical field of printed circuit boards. Background Art

[0002] PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board, is an important electronic component with wide applications. It is the support body of electronic components and also the carrier of electrical connection of electronic components.

[0003] A large number of tests have shown that impedance fluctuations in circuit board connectors can cause serious signal reflections, restrict the improvement of signal transmission bandwidth, and thus affect the quality of the entire signal transmission. The structure of traditional circuit board connectors is generally that the connectors are connected, and copper foil and multiple grounding holes are laid around the connectors as a reference to ensure the continuity of the signal return path.

[0004] This conventional connector structure is simple in design and easy in PCB processing, but it is difficult to optimize impedance. Generally, the impedance fluctuation is large, the matching is poor, and the transmitted signal bandwidth is not high. In severe cases, it will cause the signal bit error rate at the signal receiving end to increase, resulting in signal restoration errors. Summary of the invention

[0005] The present invention provides a printed circuit board to solve the problem of large impedance fluctuation of signal connecting parts of the printed circuit board in the prior art.

[0006] To solve the above technical problems, the present invention provides a printed circuit board, comprising: a first conductive layer; a second conductive layer, the second conductive layer and the first conductive layer are stacked; a first connecting member, the first connecting member electrically connects the first conductive layer and the second conductive layer; a shielding sleeve, the shielding sleeve is sleeved with the first connecting member, and is spaced apart and coaxially arranged with the first connecting member.

[0007] The first conductive layer and the second conductive layer are respectively arranged on two opposite sides of the printed circuit board; the first connecting member penetrates the printed circuit board to electrically connect the first conductive layer and the second conductive layer.

[0008] The printed circuit board further includes: a third conductive layer, which is adjacent to and electrically connected to the first conductive layer; a fourth conductive layer, which is adjacent to and electrically connected to the second conductive layer; and a shielding sleeve electrically connecting the third conductive layer and the fourth conductive layer.

[0009] The printed circuit board further includes at least two second connectors; a portion of the second connectors are electrically connected to the first conductive layer and the third conductive layer; and another portion of the second connectors are electrically connected to the second conductive layer and the fourth conductive layer.

[0010] Wherein, on the projection of the preset plane, part of the second connecting members and another part of the second connecting members are respectively and evenly arranged around the shielding sleeve.

[0011] Among them, a first circuit is arranged on the first conductive layer; the first circuit includes a first surround, a first intermediate connector and a first routing component, the first surround surrounds the first connector and is electrically connected to the first connector; one end of the first intermediate connector is electrically connected to the first surround, and the other end of the first intermediate connector is electrically connected to the first routing component; and a second circuit is arranged on the second conductive layer; the second circuit includes a second surround, a second intermediate connector and a second routing component, the second surround surrounds the first connector and is electrically connected to the first connector; one end of the second intermediate connector is electrically connected to the second surround, and the other end of the second intermediate connector is electrically connected to the second routing component.

[0012] In which, on the projection of the preset plane, the first intermediate connector does not overlap with each conductive layer, and the first routing component overlaps with each conductive layer; and in the projection of the preset plane, the second intermediate connector does not overlap with each conductive layer, and the second routing component overlaps with each conductive layer; wherein the width of the first intermediate connector is greater than the width of the first routing component; and the width of the second intermediate connector is greater than the width of the second routing component.

[0013] Wherein, the difference between the width of the first intermediate connecting member and the width of the first wiring member and the difference between the width of the second intermediate connecting member and the width of the second wiring member are at least 0.05 mm.

[0014] Wherein, the inner diameter of the shielding sleeve is at least 0.3 mm.

[0015] The outer diameter of the first connecting member is at least 0.1 mm, and the distance between the shielding sleeve and the first connecting member is at least 0.2 mm.

[0016] The beneficial effects of the present invention are as follows: different from the prior art, the printed circuit board of the present invention is provided with a first connector through a shielding sleeve, and is spaced and coaxially arranged with the first connector, which can shield the interference of external signals on the first connector, is beneficial to the signal transmission of the first connector, reduces the crosstalk between different signals, improves the stability and integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector, and is beneficial to the impedance matching optimization of the first connector, increases the impedance matching of the first connector, reduces the impedance fluctuation of the first connector, and finally reduces signal reflection and improves the transmission bandwidth of the signal, which is beneficial to the interconnection of signals between layers of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of an embodiment of a printed circuit board of the present invention;

[0018] Figure 2 yes Figure 1 A schematic diagram of the top view of the printed circuit board in the embodiment;

[0019] Figure 3 yes Figure 1 A schematic diagram of a front cross-sectional structure of a printed circuit board in an embodiment;

[0020] Figure 4 It is a schematic diagram of impedance comparison between a comparative example and an embodiment. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0024] See also Figure 1-3 , Figure 1 It is a schematic structural diagram of an embodiment of a printed circuit board of the present invention. Figure 2 yes Figure 1 A schematic diagram of the top view of the printed circuit board in the embodiment, Figure 3 yes Figure 1 A schematic diagram of the front cross-sectional structure of a printed circuit board in an embodiment.

[0025] The printed circuit board 100 of this embodiment includes a first connecting member 107 , a first conductive layer 101 , a second conductive layer 102 , and a shielding sleeve 106 .

[0026] The second conductive layer 102 is stacked with the first conductive layer 101. The printed circuit board 100 of this embodiment may further include multiple conductive layers on the basis of the first conductive layer 101 and the second conductive layer 102, and each conductive layer may be sequentially stacked and bonded with the insulating layer to form the printed circuit board 100. The insulating layer may include one or more of epoxy resin, polyimide, bismaleimide triazine (BT), and ceramic base.

[0027] The first connecting member 107 conducts electricity between the first conductive layer 101 and the second conductive layer 102 . The first connecting member 107 may be made of metal or other conductive materials, so as to electrically connect the first conductive layer 101 and the second conductive layer 102 .

[0028] The first conductive layer 101 and the second conductive layer 102 may be disposed on opposite sides of the printed circuit board 100, or one may be disposed on the surface of the printed circuit board 100 and the other may be disposed inside the printed circuit board 100, or both may be disposed inside the printed circuit board 100, which is not limited here. That is, the first connector 107 may be disposed based on the positions of the first conductive layer 101 and the second conductive layer 102, penetrate the printed circuit board 100 or partially penetrate the printed circuit board 100, so as to electrically connect the first conductive layer 101 and the second conductive layer 102.

[0029] In a specific application scenario, when at least one of the first conductive layer 101 and the second conductive layer 102 is disposed on the surface of the printed circuit board 100, the first connector 107 may include a hollow connecting column, so that while electrically connecting the first conductive layer 101 and the second conductive layer 102, the hollow structure is used to match the plug connector, thereby achieving conduction between the printed circuit board 100 and the plug connector. In another specific application scenario, the first connector 107 may include a solid connecting column to electrically connect the first conductive layer 101 and the second conductive layer 102.

[0030] The shielding sleeve 106 of this embodiment is sleeved on the first connector 107, and is spaced and coaxially arranged with the first connector 107. The shielding sleeve 106 may include a metal shielding sleeve or a shielding sleeve made of other materials, so as to shield the interference of external signals on the first connector 107, facilitate the signal transmission of the first connector 107, reduce the crosstalk between different signals, improve the integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector 107, and further facilitate the impedance matching optimization of the first connector 107, increase the impedance matching of the first connector 107, reduce the impedance fluctuation of the first connector 107, and finally reduce signal reflection and improve the transmission bandwidth of the signal, which is beneficial to the signal interconnection between the layers of the printed circuit board 100.

[0031] An insulating layer may be filled between the shielding sleeve 106 and the first connector 107 for support, so as to improve the structural stability of the printed circuit board.

[0032] Through the above structure, the printed circuit board of this embodiment is sleeved with the first connector through the shielding sleeve, and is spaced and coaxially arranged with the first connector, which can shield the interference of external signals on the first connector, is beneficial to the signal transmission of the first connector, reduces the crosstalk between different signals, and improves the stability and integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector, which is beneficial to the impedance matching optimization of the first connector, increases the impedance matching of the first connector, reduces the impedance fluctuation of the first connector, and finally reduces signal reflection and improves the transmission bandwidth of the signal, which is beneficial to the interconnection of signals between layers of the printed circuit board.

[0033] In other embodiments, the first conductive layer 101 and the second conductive layer 102 are respectively disposed on opposite side surfaces of the printed circuit board 100, and the first connecting member 107 penetrates the printed circuit board 100 to conduct the first conductive layer 101 and the second conductive layer 102 on opposite side surfaces of the printed circuit board 100 along the penetration direction.

[0034] The first connector 107 may include a hollow connecting column, so that while conducting the first conductive layer 101 and the second conductive layer 102 , the hollow structure is used to match the plug connector, thereby achieving conduction between the printed circuit board 100 and the plug connector.

[0035] In other embodiments, the printed circuit board 100 further includes: a third conductive layer 103 and a fourth conductive layer 104. The third conductive layer 103 is adjacent to the first conductive layer 101 and electrically connected to each other, and the fourth conductive layer 104 is adjacent to the second conductive layer 102 and electrically connected to each other.

[0036] The third conductive layer 103 and the first conductive layer 101 , and the fourth conductive layer 104 and the second conductive layer 102 may be connected via conductive holes, metal substrates, conductive pastes or conductive adhesives, etc., which are not limited here.

[0037] The shielding sleeve 106 is connected to and conducts the third conductive layer 103 and the fourth conductive layer 104 .

[0038] Therefore, the printed circuit board 100 of this embodiment can realize signal transmission through the first connector 107 that runs through the printed circuit board 100, and can also realize signal return through the second conductive layer 102, the fourth conductive layer 104, the shielding sleeve 106, the third conductive layer 103 and the first conductive layer 101 that are mutually conductive. The second conductive layer 102, the fourth conductive layer 104, the shielding sleeve 106, the third conductive layer 103 and the first conductive layer 101 that are mutually conductive provide a complete reference path for the first connector 107 to ensure signal integrity and avoid incomplete signal return path or signal return due to the increase of the return path length across layers, thereby affecting the integrity of the signal return. Among them, the above-mentioned settings can enable the printed circuit board 100 of this embodiment to be applied to high-frequency signals or other application scenarios that require signal return.

[0039] The printed circuit board 100 of this embodiment can also be applied to the application scenario of DC signal transmission, and the signal transmission is directly realized through the first connecting member 107.

[0040] Among them, since the printed circuit board 100 is usually prepared by a build-up printed circuit board process, but under this preparation process, it is difficult for the shielding sleeve 106 to achieve the connection between the first conductive layer 101 and the second conductive layer 102, therefore, in this embodiment, the shielding sleeve 106 is used to connect and conduct the fourth conductive layer 104 of the third conductive layer 103 adjacent to the first conductive layer 101 and the second conductive layer 102 respectively, so as to maximize the shielding area of ​​the shielding sleeve 106 on the first connector 107 under the preparation conditions of the build-up printed circuit board process, thereby ensuring the signal shielding effect of the shielding sleeve 106, and then reducing the impedance fluctuation of the first connector 107, which is beneficial to the impedance matching optimization of the first connector 107 and is adapted to the preparation of the build-up printed circuit board process.

[0041] In other embodiments, when the preparation process of the printed circuit board 100 does not limit the connection between the shielding sleeve 106 and the first conductive layer 101 and the second conductive layer 102 respectively, the shielding sleeve 106 can directly connect the first conductive layer 101 and the second conductive layer 102 on the two opposite surfaces of the printed circuit board 100, thereby completely surrounding the first connector 107, increasing the shielding area of ​​the shielding sleeve 106 on the first connector 107, thereby ensuring the signal shielding effect of the shielding sleeve 106, and further reducing the impedance fluctuation of the first connector 107, which is beneficial to the impedance matching optimization of the first connector 107.

[0042] In other embodiments, the printed circuit board 100 may further include a plurality of intermediate conductive layers 105, which are stacked between the third conductive layer 103 and the fourth conductive layer 104 to achieve the functions of the printed circuit board 100. The specific number of the intermediate conductive layers 105 may be set based on the thickness requirement or functional requirement of the printed circuit board 100, for example, 5 layers, 10 layers, 20 layers, etc., which is not limited here.

[0043] When there is a grounding layer in the multi-layer intermediate conductive layer 105 , the shielding sleeve 106 can be connected to the grounding layer. When the intermediate conductive layer 105 is not a grounding layer, the shielding sleeve 106 is not connected thereto to ensure the shielding effect.

[0044] In other embodiments, the printed circuit board 100 further includes at least two second connectors 108, and some of the second connectors 108 are electrically connected to the first conductive layer 101 and the third conductive layer 103, thereby realizing electrical connection between the first conductive layer 101 and the third conductive layer 103. Another part of the second connectors 108 are connected to the second conductive layer 102 and the fourth conductive layer 104, thereby realizing electrical connection between the second conductive layer 102 and the fourth conductive layer 104.

[0045] Among them, the second connecting member 108 of this embodiment can be a metallized blind hole, thereby electrically connecting the first conductive layer 101 on the surface of the printed circuit board 100 and the third conductive layer 103 inside, and electrically connecting the second conductive layer 102 on the surface of the printed circuit board 100 and the fourth conductive layer 104 inside.

[0046] There is at least one second connector 108 between the first conductive layer 101 and the third conductive layer 103, and there is also at least one second connector 108 between the second conductive layer 102 and the fourth conductive layer 104, which may be 1, 4, 6, 8, 9, etc. The numbers of the two types of second connectors 108 may be the same or different, and their positions may be the same or different. The specific number and position are set based on actual needs and are not limited here.

[0047] The more the second connectors 108 between the adjacent conductive layers, the better the electrical connection effect, and the stronger the envelopment of the first connector 107 , and the better the signal shielding effect of the first connector 107 in combination with the shielding sleeve 106 .

[0048] Among them, part of the second connecting member 108 is electrically connected to the first conductive layer 101 and the third conductive layer 103, another part of the second connecting member 108 is electrically connected to the second conductive layer 102 and the fourth conductive layer 104, and the shielding sleeve 106 is electrically connected to the third conductive layer 103 and the fourth conductive layer 104, thereby providing a complete reference path for the first connecting member 107 to ensure signal integrity, so that the signal can be returned through another part of the second connecting member 108, the shielding sleeve 106 and part of the second connecting member 108, avoiding incomplete signal return path or long signal return path, thereby improving signal return integrity.

[0049] In other embodiments, on the projection of the preset plane x, part of the second connector 108 and another part of the second connector 108 are respectively arranged uniformly around the shielding sleeve 106, thereby improving the uniformity of electrical connection between the first conductive layer 101 and the third conductive layer 103 and between the second conductive layer 102 and the fourth conductive layer 104, and achieving the encirclement of the first connector 107, and then combining with the shielding sleeve 106 to achieve a better signal shielding effect on the first connector 107. The preset plane x refers to the plane where the conductive layers of the printed circuit board 100 are located.

[0050] In other embodiments, conductive circuits electrically connected to the first connecting member 107 are respectively disposed on the first conductive layer 101 and the second conductive layer 102 .

[0051] Specifically, a first circuit 109 is provided on the first conductive layer 101. The first circuit 109 includes a first surrounding piece 1093, a first intermediate connector 1092 and a first routing piece 1091. The first surrounding piece 1093 is provided around the first connector 107 and is electrically connected to the first connector 107. One end of the first intermediate connector 1092 is connected to the first surrounding piece 107, and the other end of the first intermediate connector 1092 is connected to the first routing piece 1091, thereby realizing electrical connection among the first routing piece 1091, the first intermediate connector 1092, the first surrounding piece 1093 and the first connector 107 in sequence.

[0052] The first wiring member 1091 may also be connected to an external device, an external circuit and / or other conductive lines of the first conductive layer 101 , which is not limited here.

[0053] The materials of the first routing member 1091 , the first intermediate connecting member 1092 , and the first surrounding member 1093 may include metal or other conductive materials.

[0054] A second circuit 110 is arranged on the second conductive layer 102; the structure of the second circuit 110 is similar to that of the first circuit 109, specifically, the second circuit includes a second surround, a second intermediate connector and a second routing member, the second surround is arranged around the first connector and is electrically connected to the first connector; one end of the second intermediate connector is connected to the second surround, and the other end of the second intermediate connector is connected to the second routing member; thereby realizing electrical connection among the second routing member, the second intermediate connector, the second surround and the first connector 107 in sequence.

[0055] The second wiring member may also be connected to an external device, an external circuit and / or other conductive lines of the second conductive layer 102 , which is not limited here.

[0056] Through the above structure, the printed circuit board 100 of this embodiment can realize signal transmission through the first routing member 1091, the first intermediate connector 1092, the first surrounding member 1093 and the first connector 107, the second surrounding member, the second intermediate connector, and the second routing member in sequence.

[0057] In other embodiments, the first routing member 1091 is also electrically connected to the first conductive layer 101, and the second routing member is also electrically connected to the second conductive layer 102. Then, the printed circuit board 100 of this embodiment can also realize signal return through the second routing member, the second conductive layer, another part of the second connector 108, the shielding sleeve 106, part of the second connector 108, the first conductive layer, and the first routing member 1091, thereby providing a complete reference path for the signal, ensuring signal integrity, and avoiding incomplete signal return path or signal return due to the increase of the return path length across layers, thereby affecting the integrity of the signal return. Among them, the above settings can enable the printed circuit board 100 of this embodiment to be applied to high-frequency signals or other application scenarios requiring signal return.

[0058] In other embodiments, on the projection of the preset plane x, the first intermediate connector 1092 does not overlap with each conductive layer, and the first routing component 1091 overlaps with each conductive layer; and on the projection of the preset plane x, the second intermediate connector does not overlap with each conductive layer, and the second routing component overlaps with each conductive layer.

[0059] The width of the first intermediate connection member 1092 is greater than the width of the first routing member 1091 ; and the width of the second intermediate connection member is greater than the width of the second routing member. Since, on the projection of the preset plane x, the first intermediate connector 1092 does not overlap with each conductive layer, while the first routing component 1091 overlaps with each conductive layer; and the second intermediate connector does not overlap with each conductive layer, while the second routing component overlaps with each conductive layer, the conductive layers of the printed circuit board 100 will affect the impedance of the first routing component 1091 and the second routing component. Therefore, by making the width of the first intermediate connector 1092 greater than the width of the first routing component 1091; and the width of the second intermediate connector greater than the width of the second routing component, the impedance between the first intermediate connector 1092 and the first routing component 1091 and between the second intermediate connector and the second routing component can be balanced, thereby making the impedance between the first intermediate connector 1092 and the first routing component 1091 and between the second intermediate connector and the second routing component the same, thereby improving the signal transmission quality of the entire first line 109 and the second line 110.

[0060] In other embodiments, the difference between the width of the first intermediate connector 1092 and the width of the first routing member 1091 and the difference between the width of the second intermediate connector and the width of the second routing member are at least 0.05 mm, and can be specifically 0.05 mm, 0.08 mm, 0.10 mm, 0.15 mm, 0.30 mm, 0.41 mm, etc., and can be specifically set based on the specific widths of the first intermediate connector 1092 and the first routing member 1091, and is not limited here.

[0061] That is, the width W1 of the first line 109 and the second line 110 directly facing the shielding sleeve 106 is greater than the width W2 of the first line 109 and the second line 110 directly facing each conductive layer, and W1-W2≧0.05mm.

[0062] Within this difference range, the impedance between the intermediate connecting component and the routing component can be balanced.

[0063] In other embodiments, the inner diameter R of the shielding sleeve 106 is at least 0.3 mm, and may be 0.3 mm, 0.5 mm, 0.8 mm, 1.0 mm, 2.0 mm, or 5.0 mm, etc., which is not limited here.

[0064] In other embodiments, the outer diameter r of the first connecting member 107 is at least 0.1 mm, and may specifically be 0.1 mm, 0.3 mm, 0.5 mm, 0.9 mm, 1.2 mm, 2.6 mm, etc., and is not limited here. The spacing between the shielding sleeve 106 and the first connecting member 107 is at least 0.2 mm, and may specifically be 0.2 mm, 0.4 mm, 0.5 mm, 0.9 mm, 1.5 mm, 2.3 mm, 3.5 mm, etc.

[0065] In other embodiments, the distance between the second connecting member 108 and the first connecting member 107 is ≧(Rr) / 2, that is, the distance between the second connecting member 108 and the first connecting member 107 is at least greater than half of the difference between the inner diameter R of the shielding sleeve 106 and the outer diameter r of the first connecting member 107. Therefore, within this distance, the first connecting member 107 can be surrounded to achieve a certain degree of shielding function, and the distance between the structures can be prevented from being too short, making it difficult to achieve accurate positioning, and easily causing short circuits and the like.

[0066] The impedance of the connection structure of the printed circuit board 100 of the present embodiment is easy to calculate. Once the outer diameter r of the first connector 107, the inner diameter R of the shielding sleeve 106 and the dielectric constant DK of the insulating medium filled between the first connector 107 and the shielding sleeve 106 are known, the impedance can be directly calculated using the above parameters. Unlike conventional via structures, it is not necessary to know the complex physical structure and then use simulation software to model and simulate in order to calculate the impedance.

[0067] Through the above structure, the first connector of this embodiment is sleeved by the shielding sleeve, and is spaced and coaxially arranged with the first connector, which can shield the interference of external signals on the first connector, facilitate the signal transmission of the first connector, reduce the crosstalk between different signals, and improve the stability and integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector, which is beneficial to the impedance matching optimization of the first connector, increasing the impedance matching of the first connector, reducing the impedance fluctuation of the first connector, and finally reducing signal reflection and improving the transmission bandwidth of the signal, which is beneficial to the interconnection of signals between layers of the printed circuit board. This embodiment provides a complete reference path for the first connector through the connection between the second circuit, the second conductive layer, the second connector, the shielding sleeve, the first conductive layer, and the first circuit, ensuring signal integrity, avoiding incomplete signal return path or signal return due to the increase of the return path length across layers, thereby affecting the integrity of the signal return, so that the printed circuit board is applied to high-frequency signals or other application scenarios requiring signal return. In addition, this embodiment utilizes the connection between the second connector and the shielding sleeve to realize signal return between the first conductive layer and the second conductive layer, and can be applied to the build-up printed circuit board process, giving full play to the advantages of the build-up circuit board process, so that the printed circuit board can be implemented on a large scale on the HDI (High Density Interconnector) circuit board.

[0068] The impedance of the printed circuit board of the present invention with the above structure will be tested through comparative simulation.

[0069] Comparative example structure: the first connecting member penetrates the printed circuit board, and 6 metallized holes penetrating the printed circuit board are arranged around the first connecting member.

[0070] Embodiment structure: The first connector penetrates the printed circuit board, and the shielding sleeve is sleeved with the first connector, and is spaced and coaxially arranged with the first connector. One end of the shielding sleeve is connected to 6 second connectors at the conductive layer adjacent to the surface, and the other end is connected to another 6 second connectors at the conductive layer adjacent to the surface, so as to connect the opposite sides of the printed circuit board.

[0071] The impedance of the above structure is determined using simulation software under the same environment.

[0072] See also Figure 4 , Figure 4 It is a schematic diagram of impedance comparison between a comparative example and an embodiment.

[0073] It can be seen from the figure that under the same conditions, the matching impedance is 50ohm, the impedance of the comparative structure (upper curve) is 60.26ohm, and the impedance of the embodiment structure (lower curve) is 50.11ohm. It can be seen that the impedance matching of the embodiment structure of the present invention is very high.

[0074] Therefore, the printed circuit board of this embodiment can shield the interference of external signals on the first connector, which is beneficial to the signal transmission of the first connector, reduces the crosstalk between different signals, and improves the stability and integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector, which is beneficial to the impedance matching optimization of the first connector, increases the impedance matching of the first connector, reduces the impedance fluctuation of the first connector, and ultimately reduces signal reflection and improves the transmission bandwidth of the signal, which is beneficial to the interconnection of signals between layers of the printed circuit board.

[0075] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A printed circuit board, characterized in that: The printed circuit board comprises: a first conductive layer; a second conductive layer, the second conductive layer being stacked with the first conductive layer; a first connecting member, the first connecting member electrically connecting the first conductive layer and the second conductive layer; a shielding sleeve, wherein the shielding sleeve is sleeved on the first connecting member and is spaced apart from and coaxially arranged with the first connecting member; a third conductive layer, the third conductive layer being adjacent to the first conductive layer and electrically connected to each other; a fourth conductive layer, the fourth conductive layer being adjacent to the second conductive layer and electrically connected to each other; the shielding sleeve being electrically connected to the third conductive layer and the fourth conductive layer; at least two second connecting members, part of the second connecting members electrically connecting the first conductive layer and the third conductive layer; another part of the second connecting members electrically connecting the second conductive layer and the fourth conductive layer; A first circuit is disposed on the first conductive layer; the first circuit includes a first surrounding member, a first intermediate connecting member, and a first routing member, the first surrounding member surrounds the first connecting member and is electrically connected to the first connecting member; one end of the first intermediate connecting member is electrically connected to the first surrounding member, and the other end of the first intermediate connecting member is electrically connected to the first routing member; and A second circuit is arranged on the second conductive layer; The second circuit includes a second surrounding member, a second intermediate connecting member and a second routing member, wherein the second surrounding member surrounds the first connecting member and is electrically connected to the first connecting member; one end of the second intermediate connecting member is electrically connected to the second surrounding member, and the other end of the second intermediate connecting member is electrically connected to the second routing member; On the projection of the preset plane, the first intermediate connecting member does not overlap with each conductive layer, and the first routing member overlaps with each conductive layer; and On the projection of the preset plane, the second intermediate connector does not overlap with each conductive layer, and the second routing member overlaps with each conductive layer; wherein the first intermediate connector and the second intermediate connector are directly opposite to the shielding sleeve; the preset plane is the plane where the printed circuit board is located; Wherein, the width of the first intermediate connection member is greater than the width of the first routing member; and the width of the second intermediate connection member is greater than the width of the second routing member; The difference between the width of the first intermediate connection member and the width of the first wiring member and the difference between the width of the second intermediate connection member and the width of the second wiring member are at least 0.05 mm; The distance between the second connecting member and the first connecting member is ≧(Rr) / 2, R is the inner diameter of the shielding sleeve, and r is the outer diameter of the first connecting member; at least two of the second connecting members are evenly arranged around the shielding sleeve.

2. The printed circuit board according to claim 1, characterized in that: The first conductive layer and the second conductive layer are respectively arranged on two opposite side surfaces of the printed circuit board; The first connecting member passes through the printed circuit board to electrically connect the first conductive layer and the second conductive layer.

3. The printed circuit board according to claim 1, characterized in that: The inner diameter of the shielding sleeve is at least 0.3 mm.

4. The printed circuit board according to claim 1, characterized in that: The outer diameter of the first connecting member is at least 0.1 mm, and the distance between the shielding sleeve and the first connecting member is at least 0.2 mm.

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